JP2009004130A - Illuminating device - Google Patents

Illuminating device Download PDF

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Publication number
JP2009004130A
JP2009004130A JP2007161815A JP2007161815A JP2009004130A JP 2009004130 A JP2009004130 A JP 2009004130A JP 2007161815 A JP2007161815 A JP 2007161815A JP 2007161815 A JP2007161815 A JP 2007161815A JP 2009004130 A JP2009004130 A JP 2009004130A
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Prior art keywords
heat
drive circuit
led
heat radiating
cavity
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JP2007161815A
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JP2009004130A5 (en
JP4980152B2 (en
Inventor
Masashi Yamamoto
昌史 山本
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Sharp Corp
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Sharp Corp
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Priority to JP2007161815A priority Critical patent/JP4980152B2/en
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to PCT/JP2008/059418 priority patent/WO2008146694A1/en
Priority to US12/451,596 priority patent/US8226270B2/en
Priority to EP08764491.0A priority patent/EP2163808B1/en
Priority to CN2008800167905A priority patent/CN101680613B/en
Publication of JP2009004130A publication Critical patent/JP2009004130A/en
Publication of JP2009004130A5 publication Critical patent/JP2009004130A5/ja
Priority to US13/530,910 priority patent/US20120268954A1/en
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Publication of JP4980152B2 publication Critical patent/JP4980152B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminating device solving the problem of LEDs radiating heat during use and achieving downsizing of products. <P>SOLUTION: The illuminating device is provided with a heat-radiating part 2 having a cavity in which a part of a plurality of drive circuit components 31, 31, 31, ... driving an LED module 1 is housed, and a base part 5 having a cavity 51 in which another part of the plurality of drive circuit components 31, 31, 31, ... (for instance, a transistor T) is housed. The drive circuit components 31, 31, 31, ... are contained in the cavity of the heat-radiating part 2 and the cavity 51 of the base part 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発光ダイオード（以下、ＬＥＤと記す）と、該ＬＥＤを駆動する複数の駆動回路部とを備える照明装置に関する。   The present invention relates to an illuminating device including a light emitting diode (hereinafter referred to as LED) and a plurality of drive circuit units for driving the LED.

最近、小型、省電力、長寿命という特徴を有するＬＥＤを照明に使用した商品の開発が多くなされている。このようなＬＥＤの照明への使用に伴い、照明分野において様々な技術が提案されている。   Recently, there have been many developments of products using LEDs having characteristics of small size, power saving and long life for illumination. With the use of such LEDs for illumination, various techniques have been proposed in the illumination field.

例えば、特許文献１では、従来の白熱電球の外見をそのまま維持しつつ、いわゆるグローブの中にＬＥＤを設けることにより、従来の白熱電球との互換性を高めたＬＥＤ電球が提案されている。   For example, Patent Document 1 proposes an LED bulb that has improved compatibility with a conventional incandescent bulb by providing an LED in a so-called globe while maintaining the appearance of the conventional incandescent bulb.

特許文献２では、ＬＥＤと、入力電圧をＬＥＤ用電圧に変換する電源回路とを、夫々隔てて設けられたケースに収容することにより、電源回路の発熱によって前記ＬＥＤの光出力が低下することを防止できる口金付ＬＥＤユニットが提案されている。   In Patent Document 2, the LED and the power supply circuit that converts the input voltage into the LED voltage are housed in separate cases, so that the light output of the LED decreases due to heat generation of the power supply circuit. An LED unit with a cap that can be prevented has been proposed.

一方、ＬＥＤを用いる照明において輝度を高めるためには、ＬＥＤを高密度に集積する必要があり、このようにＬＥＤが高密度に集積された場合は、ＬＥＤ自身からの発熱によってＬＥＤ自体及び、該ＬＥＤを実装した基板が破壊されると共に、劣化が進むという問題がある。しかし、特許文献１のＬＥＤ電球及び特許文献２の口金付ＬＥＤユニットは、このようなＬＥＤの発熱に伴う問題に対する工夫が十分に考慮されていない。   On the other hand, in order to increase the luminance in the illumination using the LEDs, it is necessary to integrate the LEDs with high density. When the LEDs are integrated with high density in this way, the LEDs themselves and the There is a problem that the substrate on which the LED is mounted is destroyed and the deterioration progresses. However, the LED bulb of Patent Document 1 and the LED unit with cap of Patent Document 2 do not sufficiently take into account the problems associated with the heat generated by such LEDs.

また、特許文献３には、ＬＥＤとヒートシンクを備え、該ヒートシンクに電源回路を収容する凹部を外部と連通するように設けた発光ダイオードランプについての意匠が開示されている。
特開２００１−２４３８０７号公報 特開２００５−２１６４９５号公報 意匠登録第１２８４１１６号公報 Patent Document 3 discloses a design of a light-emitting diode lamp that includes an LED and a heat sink, and is provided with a recess that accommodates a power circuit in the heat sink so as to communicate with the outside.
JP 2001-243807 A JP 2005-216495 A Design Registration No. 1284116

しかし、上記特許文献１及び２に記載のＬＥＤ電球または口金付きＬＥＤユニットは、ＬＥＤを光源にした照明装置についての先行技術であるが、ＬＥＤの発熱による問題を解決するものではない。ＬＥＤを照明装置の光源として用いる場合には、十分な輝度を確保するために多数のＬＥＤを必要となるため、ＬＥＤからの熱を放熱する構造が必要となるが、上記特許文献に記載の先行技術は、このようなＬＥＤの発熱に伴う問題に対する工夫が十分に考慮されていない。   However, the LED bulb or the LED unit with a cap described in Patent Documents 1 and 2 is a prior art for an illumination device using an LED as a light source, but does not solve the problem caused by the heat generated by the LED. When an LED is used as a light source of an illumination device, a large number of LEDs are required to ensure sufficient luminance, and thus a structure for radiating heat from the LEDs is required. The technology does not fully take into account such problems associated with the heat generation of LEDs.

また、特許文献３の発光ダイオードランプは、ヒートシンクにＬＥＤが設けられ、ＬＥＤからの熱を放熱する構造が開示されているが、前記ヒートシンクにより占められる体積の割合が非常に大きいので、商品の大きさを大きくする原因となり、商品の外観を損なう虞がある。また、ヒートシンクに電源回路を収容する凹部を設け、前記凹部が外部と連通しているので、長期間使用した場合は、外部から埃、塵等が凹部に入り込み、電源回路に接触して引火、故障を起こす虞がある。さらに、前記凹部はヒートシンクの内部の僅かな範囲にのみ設けられているのみであり、照明装置の消費電力の増加に伴う回路部品の点数及び大きさの増加に備える空間が十分に確保されていないといった問題がある。   Moreover, although the light emitting diode lamp of patent document 3 is provided with LED in a heat sink and the structure which thermally radiates the heat from LED is disclosed, since the ratio of the volume occupied by the said heat sink is very large, the size of goods is large. There is a risk that the appearance of the product may be impaired. In addition, the heat sink is provided with a recess for accommodating the power circuit, and the recess communicates with the outside, so that when used for a long period of time, dust, dust, etc. enter the recess from the outside and come into contact with the power circuit to ignite, There is a risk of failure. Furthermore, the concave portion is provided only in a small area inside the heat sink, and there is not enough space for the increase in the number and size of circuit components accompanying the increase in power consumption of the lighting device. There is a problem.

本発明は斯かる事情に鑑みてなされたものであり、その目的とするところは、ＬＥＤを駆動する駆動回路部の配置を工夫することにより照明装置の大型化を抑えながら、ＬＥＤからの熱を放熱する構造を有する照明装置を提供することである。また、さらに別の目的は、駆動回路部に埃や塵等が接触することによる引火・故障が生じることを防ぐことが可能な照明装置を提供することである。   This invention is made | formed in view of such a situation, The place made into the objective is suppressing the enlargement of an illuminating device by devising arrangement | positioning of the drive circuit part which drives LED, and the heat | fever from LED. It is providing the illuminating device which has a structure which thermally radiates. Yet another object is to provide an illumination device that can prevent the occurrence of ignition or failure due to dust or dust coming into contact with the drive circuit section.

本発明に係る照明装置は、ＬＥＤと、ＬＥＤを駆動する駆動回路部と、駆動回路部を収容する収容部とを有する照明装置において、ＬＥＤおよび／または駆動回路部からの熱を放熱する放熱部を備え、少なくとも放熱部を一部分として前記収容部が密閉してなることを特徴とする。   A lighting device according to the present invention includes an LED, a drive circuit unit that drives the LED, and a housing unit that houses the drive circuit unit, and a heat dissipation unit that radiates heat from the LED and / or the drive circuit unit. The housing portion is hermetically sealed with at least the heat radiating portion as a part.

本発明にあっては、照明装置の大型化を抑えながら、ＬＥＤからの熱を効果的に放熱することが可能である。また、ＬＥＤを駆動する駆動回路部に埃や塵等が接触することによる引火・故障が生じることを防ぐことが可能である。   In the present invention, it is possible to effectively dissipate heat from the LED while suppressing an increase in the size of the lighting device. Further, it is possible to prevent the occurrence of ignition / failure due to the contact of dust or the like with the drive circuit unit for driving the LED.

本発明に係る照明装置は、ＬＥＤと、ＬＥＤを駆動する駆動回路部と、駆動回路部を収容する収容部とを有する照明装置において、ＬＥＤおよび／または駆動回路部からの熱を放熱する放熱部を備え、収容部は、放熱部の内部に、前記ＬＥＤが設けられた面に近接するように形成されてなることを特徴とする。   A lighting device according to the present invention includes an LED, a drive circuit unit that drives the LED, and a housing unit that houses the drive circuit unit, and a heat dissipation unit that radiates heat from the LED and / or the drive circuit unit. The housing part is formed inside the heat radiating part so as to be close to the surface on which the LED is provided.

本発明にあっては、照明装置の大型化を抑えながら、ＬＥＤからの熱を効果的に放熱することが可能である。特に、収容部をＬＥＤが設けられた面に近接する位置まで形成することにより、十分な広さの収容部が確保でき、照明装置の小型化が可能となる。また、消費電力が大きくなることによる駆動回路部の大型化にも対応して照明装置の大型化を抑制し、駆動回路部からの熱の放熱に寄与することが可能である。   In the present invention, it is possible to effectively dissipate heat from the LED while suppressing an increase in the size of the lighting device. In particular, by forming the housing portion to a position close to the surface where the LEDs are provided, a sufficiently wide housing portion can be secured, and the lighting device can be downsized. In addition, it is possible to suppress the increase in size of the lighting device in response to the increase in size of the drive circuit unit due to the increase in power consumption, and to contribute to the heat dissipation from the drive circuit unit.

本発明に係る照明装置は、さらに、電源部と接続する口金部と、放熱部と前記口金部を絶縁する絶縁部をさらに有し、収容部は、放熱部及び絶縁部により形成されてなることを特徴とする。   The illuminating device according to the present invention further includes a base part connected to the power supply part, a heat radiating part and an insulating part for insulating the base part, and the housing part is formed by the heat radiating part and the insulating part. It is characterized by.

本発明にあっては、収容部を放熱部及び絶縁部の別体の組合せにより構成することで、容易に駆動回路部を収容部に収容することが可能となる。   In the present invention, it is possible to easily accommodate the drive circuit portion in the accommodating portion by configuring the accommodating portion by a separate combination of the heat radiating portion and the insulating portion.

本発明に係る照明装置は、前記放熱部は、一面に前記ＬＥＤが取り付けられる放熱板と、該放熱板の他面に取り付けられ、内側に前記空洞を有する固定筒と、該固定筒の外側に固定される複数の放熱フィンとを備えることを特徴とする。   In the lighting device according to the present invention, the heat dissipating part includes a heat dissipating plate on which the LED is mounted on one surface, a fixed tube that is mounted on the other surface of the heat dissipating plate and has the cavity inside, and an outer side of the fixed tube. And a plurality of fixed heat dissipating fins.

本発明にあっては、前記放熱板の一面側には前記ＬＥＤを取り付け、他面には前記固定筒を取り付け、該固定筒の内側の空洞に前記駆動回路部品の一部を収容する。前記固定筒の外側には前記複数の放熱フィンを固定し、前記ＬＥＤが発する熱を、前記放熱板を介して前記放熱フィンに伝導させ、放熱フィンの表面を介して外気中に放出させる。   In the present invention, the LED is attached to one surface side of the heat radiating plate, the fixed cylinder is attached to the other surface, and a part of the drive circuit component is accommodated in a cavity inside the fixed cylinder. The plurality of heat radiating fins are fixed to the outside of the fixed cylinder, and heat generated by the LEDs is conducted to the heat radiating fins through the heat radiating plate and is released into the outside air through the surface of the heat radiating fins.

本発明に係る照明装置は、前記放熱部の空洞及び前記口金部の空洞は連通され、外部からの塵埃の侵入が遮断された閉空間を形成していることを特徴とする。   The illuminating device according to the present invention is characterized in that the cavity of the heat dissipating part and the cavity of the base part are communicated to form a closed space in which intrusion of dust from the outside is blocked.

本発明にあっては、前記放熱部の空洞及び前記口金部の空洞が連通され、閉空間を形成するように構成する。従って、前記空洞の中に埃、塵埃等が溜まることが防止される。
In the present invention, the cavity of the heat radiating part and the cavity of the base part are communicated to form a closed space. Therefore, it is possible to prevent dust, dust and the like from accumulating in the cavity.

本発明によれば、照明装置の大型化を抑えながら、ＬＥＤからの熱を効果的に放熱することが可能である。また、ＬＥＤを駆動する駆動回路部に埃や塵等が接触することによる引火・故障が生じることを防ぐことが可能である。   ADVANTAGE OF THE INVENTION According to this invention, it is possible to thermally radiate the heat | fever from LED effectively, suppressing the enlargement of an illuminating device. Further, it is possible to prevent the occurrence of ignition / failure due to the contact of dust or the like with the drive circuit unit for driving the LED.

（実施の形態１）
以下、本発明の実施の形態１を、図面を参照して説明する。図１は実施の形態１に係る照明装置の構成を示す斜視図、図２は要部分解斜視図、図３は、図１のIII‐III線による概略要部横断面図、図４は概略要部縦断面図である。 (Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings. 1 is a perspective view showing a configuration of a lighting device according to Embodiment 1, FIG. 2 is an exploded perspective view of main parts, FIG. 3 is a schematic cross-sectional view of main parts taken along line III-III in FIG. 1, and FIG. It is a principal part longitudinal cross-sectional view.

実施の形態１に係る照明装置は複数の白色ＬＥＤ（図示せず）が実装された光源モジュール１と、光源モジュール１を覆うドーム状の透光部４と、光源モジュール１が発する熱を放熱するための放熱部２と、光源モジュール１を駆動するための複数の駆動回路部品３１，３１，３１…を有する駆動回路部３と、駆動回路部３に電気的に接続されると共に、外部電源に接続される円筒状の口金部５と、口金部５及び放熱部２の間に介在する絶縁部６とを備えている。   The lighting device according to Embodiment 1 dissipates heat generated by the light source module 1 on which a plurality of white LEDs (not shown) are mounted, a dome-shaped light-transmitting portion 4 that covers the light source module 1, and the light source module 1. For driving the light source module 1, a drive circuit unit 3 having a plurality of drive circuit components 31, 31, 31... For driving the light source module 1. A cylindrical base part 5 to be connected and an insulating part 6 interposed between the base part 5 and the heat radiation part 2 are provided.

光源モジュール１は、矩形のセラミック基板上の中央部に複数の０．１ＷのＬＥＤ（スモールチップ）が密集して実装されている。光源モジュール１の対向する何れか２つの頂点には、光源モジュール１を放熱部２にネジ止めするための貫通孔１１，１１が設けられている。光源モジュール１は熱伝導シート（図示せず）を挟んで後述する放熱部２の放熱板２１にネジ止めされる。   In the light source module 1, a plurality of 0.1 W LEDs (small chips) are densely mounted on a central portion on a rectangular ceramic substrate. Through holes 11 and 11 for screwing the light source module 1 to the heat radiating portion 2 are provided at any two apexes of the light source module 1 facing each other. The light source module 1 is screwed to a heat radiating plate 21 of the heat radiating portion 2 described later with a heat conductive sheet (not shown) interposed therebetween.

放熱部２は、一面の中央部に光源モジュール１がネジ止めされる円板状の放熱板２１を備え、放熱板２１の縁には周方向に延設され、透光部４の縁と当接する鍔部２４を設けている。放熱板２１の他面の中央部には、後述の放熱フィン２２を固定する固定筒２３が突設されている。固定筒２３の内側は、駆動回路部３の駆動回路部品３１，３１，３１…の一部を収容する収容部として空洞２５が形成されている。   The heat dissipating part 2 includes a disk-like heat dissipating plate 21 to which the light source module 1 is screwed at the center of one surface. The heat dissipating part 2 extends in the circumferential direction on the edge of the heat dissipating plate 21 and contacts the edge of the light transmitting part 4. The collar part 24 which touches is provided. At the center of the other surface of the heat radiating plate 21, a fixed cylinder 23 for fixing a heat radiating fin 22 described later is projected. Inside the fixed cylinder 23, a cavity 25 is formed as an accommodating portion that accommodates a part of the drive circuit components 31, 31, 31... Of the drive circuit portion 3.

駆動回路部３の収容部である空洞２５は、駆動回路部３をできるだけ内部に収容できるように、光源モジュール１が設けられる面に近接する位置まで形成されていることが照明装置の小型化がなされるので好ましい。また、十分に広さを確保することにより、照明装置の消費電力が大きくなることによる駆動回路部３の大型化にも対応することができ、照明装置の大型化を抑えることが可能である。さらに、駆動回路部３からの熱が空洞２５にこもるが、その場合においても空洞が広いほど高温化を抑えることが可能となる。   The cavity 25 that is the housing portion of the drive circuit unit 3 is formed up to a position close to the surface on which the light source module 1 is provided so that the drive circuit unit 3 can be housed inside as much as possible. Since it is made, it is preferable. In addition, by ensuring a sufficient area, it is possible to cope with an increase in size of the drive circuit unit 3 due to an increase in power consumption of the illumination device, and it is possible to suppress an increase in the size of the illumination device. Furthermore, the heat from the drive circuit unit 3 is trapped in the cavity 25. Even in this case, the temperature rise can be suppressed as the cavity is wider.

また、放熱部２は、複数のＬＥＤを有する光源モジュール１からの熱だけでなく、駆動回路部３からの熱も放熱することが可能である。   Further, the heat radiating unit 2 can radiate not only the heat from the light source module 1 having a plurality of LEDs but also the heat from the drive circuit unit 3.

放熱板２１の中央部には貫通孔２６，２６，２６，２６を設け、空洞２５に収容される駆動回路部３及び光源モジュール１を接続するリード線２７，２７が、貫通孔２６，２６，２６，２６を挿通している。固定筒２３の外周面には、固定筒２３の軸長方向に長い複数の放熱フィン２２，２２，２２，…が、固定筒２３の周方向に並設されている。各放熱フィン２２，２２，２２，…は、固定筒２３の外周面に固定されると共に、一端２２Ａが放熱板２１の前記他面に固定されている。固定筒２３の外周面から放熱フィン２２の縁までの寸法は、放熱板２１側の一端２２Ａから他端２２Ｂに向けて減少している。放熱板２１、固定筒２３及び放熱フィン２２，２２，２２，…はアルミニウム製であり、一対形成されている。放熱フィン２２，２２，２２，…の他端２２Ｂ側には、絶縁部６が取り付けられている。   Through holes 26, 26, 26, 26 are provided in the central portion of the heat radiating plate 21, and lead wires 27, 27 connecting the drive circuit unit 3 and the light source module 1 accommodated in the cavity 25 are connected to the through holes 26, 26, 26 and 26 are inserted. A plurality of heat radiation fins 22, 22, 22,... That are long in the axial length direction of the fixed cylinder 23 are arranged in parallel in the circumferential direction of the fixed cylinder 23. Each of the radiating fins 22, 22, 22,... Is fixed to the outer peripheral surface of the fixed cylinder 23, and one end 22 </ b> A is fixed to the other surface of the radiating plate 21. The dimension from the outer peripheral surface of the fixed cylinder 23 to the edge of the heat radiating fin 22 decreases from one end 22A on the heat radiating plate 21 side toward the other end 22B. The heat radiating plate 21, the fixed cylinder 23, and the heat radiating fins 22, 22, 22,... Are made of aluminum and are formed as a pair. The insulating part 6 is attached to the other end 22B side of the radiation fins 22, 22, 22,.

放熱部２は以上のような構成を有しているので、光源モジュール１が発する熱は、放熱板２１を介して放熱フィン２２，２２，２２，…に伝導され、放熱フィン２２，２２，２２，…の表面を介して外気中に放出される。   Since the heat radiating section 2 has the above-described configuration, the heat generated by the light source module 1 is conducted to the heat radiating fins 22, 22, 22,. , ... are released into the outside air through the surface.

また、放熱フィン２２，２２，２２，…の一端２２Ａ側には、放熱板２１を介して光源モジュール１が設けられ、他端２２Ｂ側には絶縁部６が設けられており、更に絶縁部６には口金部５が固定されているので、実施の形態１に係る照明装置を天井等に設置して使用する際、高温の光源モジュール１が低温の口金部５の下方向にあるので、光源モジュール１から口金部５へ外気の流れを誘導することが可能である。   Further, the light source module 1 is provided on the one end 22A side of the radiating fins 22, 22, 22,... Via the heat radiating plate 21, the insulating portion 6 is provided on the other end 22B side, and the insulating portion 6 is further provided. Since the base part 5 is fixed to the light source module 1 when the lighting device according to the first embodiment is installed on the ceiling or the like, the high-temperature light source module 1 is located below the low-temperature base part 5. It is possible to guide the flow of outside air from the module 1 to the base part 5.

透光部４は光源モジュール１を覆って保護すると共に、光源モジュール１からの光を透光させる。透光部４は耐衝撃性及び耐熱性に優れた乳白色のポリカーボネート樹脂製であり、縁が放熱板２１の鍔部２４と当接した状態で、放熱板２に固着されている。   The light transmitting unit 4 covers and protects the light source module 1 and transmits light from the light source module 1. The translucent part 4 is made of milky white polycarbonate resin excellent in impact resistance and heat resistance, and is fixed to the heat radiating plate 2 with the edge in contact with the flange 24 of the heat radiating plate 21.

絶縁部６は、放熱部２を保持する放熱部保持筒６１と、放熱部保持筒６１の一端に連設され、放熱部保持筒６１及び後述の口金保持筒６４を連結する連結部６３と、口金部５を保持する口金保持筒６４とを備えている。絶縁部６は、放熱部保持筒６１が放熱部２の固定筒２３の内側に挿入された状態で、放熱部２に固定されている。   The insulating part 6 is connected to the heat radiating part holding cylinder 61 that holds the heat radiating part 2, and one end of the heat radiating part holding cylinder 61, and the connecting part 63 that connects the heat radiating part holding cylinder 61 and the base holding cylinder 64 described below, A base holding cylinder 64 that holds the base portion 5 is provided. The insulating part 6 is fixed to the heat radiating part 2 in a state where the heat radiating part holding cylinder 61 is inserted inside the fixed cylinder 23 of the heat radiating part 2.

よって、放熱部２と絶縁部６により、駆動回路部３を収容するための密閉された空洞（収容部）が形成される。従って、外部から埃、塵等が空洞に入り込み、駆動回路部３に接触して引火・故障が生じることを防ぐことができ、照明装置の安全性・メンテナンスの容易さという点で好ましい。   Therefore, a sealed cavity (accommodating part) for accommodating the drive circuit part 3 is formed by the heat radiating part 2 and the insulating part 6. Therefore, it is possible to prevent dust, dust, and the like from entering the cavity from the outside and coming into contact with the drive circuit unit 3 to cause ignition and failure, which is preferable in terms of safety of the lighting device and ease of maintenance.

放熱部保持筒６１は、固定筒２３と略等しい軸方向長さ、及び固定筒２３の内径より少し小さい外径を有し、固定筒２３の内側に挿入され、外嵌固定される。また、放熱部保持筒６１は連結部６３側の一端部に、絶縁部６を放熱部２に係止するための凸部６２，６２を設けている。固定筒２３の内側には凸部６２，６２に対応する凹部（図示せず）が設けられており、該凹部及び凸部６２，６２の作用によって絶縁部６が放熱部２に係止固定される。   The heat radiating part holding cylinder 61 has an axial length substantially equal to that of the fixed cylinder 23 and an outer diameter that is slightly smaller than the inner diameter of the fixed cylinder 23, and is inserted into the fixed cylinder 23 and is fitted and fixed. Further, the heat radiating portion holding cylinder 61 is provided with convex portions 62 and 62 for locking the insulating portion 6 to the heat radiating portion 2 at one end portion on the connecting portion 63 side. A concave portion (not shown) corresponding to the convex portions 62 and 62 is provided inside the fixed cylinder 23, and the insulating portion 6 is locked and fixed to the heat radiating portion 2 by the action of the concave portion and the convex portions 62 and 62. The

連結部６３は漏斗状をなしており、放熱部保持筒６１側の一端部の縁にて、内周面が放熱部保持筒６１の内周面と面一になるように連設されている。連結部６３の他端部には、口金部保持筒６４が連設されており、前記一端部から前記他端部に向けて縮径している。連結部６３は前記一端部の縁に、放熱部２の一端と当接する扁平の保持面６５を有している。一方、連結部６３は前記他端部の縁に、口金部５の縁と当接する扁平の保持面６６を有している。   The connecting portion 63 has a funnel shape, and is continuously provided at the edge of one end portion on the side of the heat radiating portion holding cylinder 61 so that the inner peripheral surface is flush with the inner peripheral surface of the heat radiating portion holding cylinder 61. . A base portion holding cylinder 64 is connected to the other end portion of the connecting portion 63 and has a diameter reduced from the one end portion toward the other end portion. The connecting part 63 has a flat holding surface 65 that abuts one end of the heat radiating part 2 at the edge of the one end part. On the other hand, the connecting part 63 has a flat holding surface 66 at the edge of the other end part that comes into contact with the edge of the base part 5.

口金部保持筒６４は、連結部６３の前記他部の縁にて連設さられており、口金部５より短い軸方向長さ、及び口金部５の内径より少し小さい外径を有している。口金部保持筒６４は口金部５の内側に挿入され、外嵌固定される。   The base part holding cylinder 64 is continuously connected at the edge of the other part of the connecting part 63, has an axial length shorter than the base part 5, and an outer diameter slightly smaller than the inner diameter of the base part 5. Yes. The base part holding cylinder 64 is inserted inside the base part 5 and is fitted and fixed.

放熱部保持筒６１、連結部６３及び口金部保持筒６４は、プラスチック製であり、一対成形されている。また、放熱部保持筒６１、連結部６３及び口金部保持筒６４は同心的に設けられている。   The heat radiating part holding cylinder 61, the connecting part 63, and the base part holding cylinder 64 are made of plastic and are formed as a pair. Further, the heat radiating part holding cylinder 61, the connecting part 63, and the base part holding cylinder 64 are provided concentrically.

口金部５は、内側に空洞５１を有しており、一端側が開口し、他端側には底を有している。また、口金部５は、一端側の縁部が絶縁部６の連結部６３の保持面６６と当接された状態に、絶縁部６に固定されており、外周面には電球ソケットと螺合するためのネジ加工が施されている。口金部５の前記外周面は一極端子５２の役割をなしており、前記底面には外周面の一極端子５２と絶縁して他極端子５３が突設されている。他極端子５３及び一極端子５２は、リード線５４，５４を介して駆動回路部３に電気的に接続している。   The base part 5 has a cavity 51 on the inner side, one end side is open, and the other end side has a bottom. In addition, the base portion 5 is fixed to the insulating portion 6 so that the edge portion on one end side is in contact with the holding surface 66 of the connecting portion 63 of the insulating portion 6, and is screwed to the bulb socket on the outer peripheral surface. Screw processing is performed to do. The outer peripheral surface of the cap 5 serves as a one-pole terminal 52, and an other-electrode terminal 53 projects from the bottom surface so as to be insulated from the one-pole terminal 52 of the outer peripheral surface. The other electrode terminal 53 and the one electrode terminal 52 are electrically connected to the drive circuit unit 3 through lead wires 54 and 54.

駆動回路部３は、長方形の回路基板３２の上に複数の駆動回路部品３１，３１，３１…が実装されている。回路基板３２は、口金部保持筒６４の内径より大きく、放熱部保持筒６１の内径より小さい寸法の幅と、絶縁部６内に収容可能な適宜の長さとを有している。一部の駆動回路部品、例えばトランジスタＴは長いリード線によって回路基板３２と接続されており、回路基板３２から隔てて配設することが可能である。   In the drive circuit unit 3, a plurality of drive circuit components 31, 31, 31... Are mounted on a rectangular circuit board 32. The circuit board 32 has a width that is larger than the inner diameter of the base part holding cylinder 64 and smaller than the inner diameter of the heat radiation part holding cylinder 61 and an appropriate length that can be accommodated in the insulating part 6. Some drive circuit components, such as the transistor T, are connected to the circuit board 32 by long lead wires, and can be arranged separately from the circuit board 32.

上述のように、放熱部２の固定筒２３の空洞２５には絶縁部６の放熱部保持筒６１が挿入されており、口金部５の空洞５１には絶縁部６の口金部保持筒６４が挿入されている。また、放熱部２の固定筒２３の空洞２５及び口金部５の空洞５１は、絶縁部６を介して連通されている。従って、駆動回路部３は放熱部２の空洞２５内であって放熱部保持筒６１の内側に収容され、トランジスタＴは口金部５の空洞５１内であって口金部保持筒６４の内側に収容されることが出来る。   As described above, the heat radiating part holding cylinder 61 of the insulating part 6 is inserted into the cavity 25 of the fixed cylinder 23 of the heat radiating part 2, and the base part holding cylinder 64 of the insulating part 6 is inserted into the cavity 51 of the base part 5. Has been inserted. Further, the cavity 25 of the fixed cylinder 23 and the cavity 51 of the base part 5 of the heat radiating part 2 are communicated with each other via the insulating part 6. Therefore, the drive circuit unit 3 is accommodated in the cavity 25 of the heat dissipation part 2 and inside the heat dissipation part holding cylinder 61, and the transistor T is accommodated in the cavity 51 of the base part 5 and inside the base part holding cylinder 64. Can be done.

上述の実施の形態１においては、駆動回路部品３１，３１，３１…の内、一部は放熱部２の空洞２５に収容され、他の一部（トランジスタＴ）は口金部５の空洞５１に収容される場合について説明したが、これに限るものでなく、可能であれば、放熱部２の空洞２５に全部収容しても良い。つまり、少なくとも放熱部２を一部分として、駆動回路部３の収容部である空洞２５が密閉されていれば、放熱部２内部に駆動回路部３を収容することができ、かつ、駆動回路部３からの熱も放熱することが可能となる。   In the first embodiment described above, some of the drive circuit components 31, 31, 31... Are accommodated in the cavity 25 of the heat radiating part 2, and the other part (transistor T) is contained in the cavity 51 of the base part 5. Although the case where it accommodated was demonstrated, it is not restricted to this, You may accommodate all in the cavity 25 of the thermal radiation part 2, if possible. That is, if at least the heat radiating part 2 is a part and the cavity 25 which is the accommodating part of the drive circuit part 3 is sealed, the drive circuit part 3 can be accommodated in the heat radiating part 2 and the drive circuit part 3 can be accommodated. It is possible to dissipate heat from the heat.

（実施の形態２）
図５は実施の形態２に係る照明装置の構成を示す概略要部縦断面図である。なお、実施の形態１と同一の部分については同一の符号を付してその詳細な説明を省略する。 (Embodiment 2)
FIG. 5 is a schematic vertical sectional view showing a main part of the configuration of the illumination apparatus according to the second embodiment. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

実施の形態２に係る照明装置は、駆動回路部３の駆動回路部品３１，３１，３１…が発する熱を、放熱部２に伝導する熱伝導シート７を備えている。熱伝導シート７は、輪になるように巻かれており、駆動回路部品３１，３１，３１…及び放熱部２の固定筒２３の内周面により挟持されている。つまり、熱伝導シート７は、駆動回路部品３１，３１，３１…及び放熱部２の固定筒２３の内周面と接しているので、駆動回路部品３１，３１，３１…が発する熱は、熱伝導シート７を介して放熱部２の固定筒２３及び放熱フィン２２，２２，２２，…に伝導され、放熱フィン２２，２２，２２，…の表面を介して外気中に放出される。   The illuminating device according to Embodiment 2 includes a heat conductive sheet 7 that conducts heat generated by the drive circuit components 31, 31, 31. The heat conductive sheet 7 is wound so as to form a ring, and is sandwiched between the drive circuit components 31, 31, 31... And the inner peripheral surface of the fixed cylinder 23 of the heat radiating unit 2. That is, since the heat conductive sheet 7 is in contact with the drive circuit components 31, 31, 31... And the inner peripheral surface of the fixed cylinder 23 of the heat radiating portion 2, the heat generated by the drive circuit components 31, 31, 31. It is conducted to the fixed cylinder 23 and the radiation fins 22, 22, 22,... Of the heat radiation part 2 through the conductive sheet 7, and is released into the outside air through the surfaces of the radiation fins 22, 22, 22,.

一方、実施の形態１及び実施の形態２において、光源モジュール１が発する熱を、放熱部２が外気中に放熱するために必要とされる面積（以下、放熱面積と言う）は照明装置の輝度によって異なり、輝度の増加と共に発熱量も増加するので、要求される放熱面積も増加する。従って、上述した実施の形態の照明装置は、放熱部が下記の条件を満たすように、放熱フィンの形状及び枚数が設計されていることが好ましい。より適切な放熱を行う上、照明装置の小型化を図るために、シミュレーションによる必要放熱面積の求めを行った。シミュレーションは「ANSYS Simulation ９．０」を用いて行い、周囲温度を４０℃とし、４０℃以上の温度上昇を抑制することを目的としており、その詳しい条件は以下のとおりである。   On the other hand, in the first and second embodiments, the area required for the heat radiating unit 2 to radiate the heat generated by the light source module 1 into the outside air (hereinafter referred to as the heat radiating area) is the luminance of the lighting device. The amount of heat generation increases as the luminance increases, so that the required heat dissipation area also increases. Therefore, in the lighting device of the above-described embodiment, it is preferable that the shape and the number of the radiating fins are designed so that the radiating unit satisfies the following conditions. In order to perform more appropriate heat dissipation and to reduce the size of the lighting device, the required heat dissipation area was determined by simulation. The simulation is performed using “ANSYS Simulation 9.0”, and the purpose is to suppress the temperature rise above 40 ° C. by setting the ambient temperature to 40 ° C. The detailed conditions are as follows.

複数のＬＥＤが実装され、発熱量が８．６５×１０6 Ｗ／ｍ3 である、厚み１ｍｍのＬＥＤチップが、厚み１ｍｍの熱伝導シート（熱伝導率５．０Ｗ／ｍ・Ｋ）を挟んで、矩形のアルミニウム基板の表側に固定されている場合を条件とした。前記アルミニウム基板は、熱伝導率が２３７Ｗ／ｍ・Ｋであり、１ｍｍの厚み及び１１２ｍｍ×１１２ｍｍの面積を有し、外気（熱伝導率５．８Ｗ／ｍ2 ・Ｋ）による空冷のみが行われることとした。なお、前記空冷は前記アルミニウム基板の裏側からのみ行われることとした。 A 1 mm thick LED chip with multiple LEDs mounted and a calorific value of 8.65 × 10 6 W / m 3 sandwiches a 1 mm thick thermal conductive sheet (thermal conductivity 5.0 W / m · K) Thus, the condition is that the rectangular aluminum substrate is fixed to the front side. The aluminum substrate has a thermal conductivity of 237 W / m · K, has a thickness of 1 mm and an area of 112 mm × 112 mm, and is only air-cooled by outside air (thermal conductivity 5.8 W / m 2 · K). It was decided. The air cooling is performed only from the back side of the aluminum substrate.

上述した条件でシミュレーションを行った結果、照明装置が２０形の場合は１２５００ｍｍ2 、４０形の場合は２５０００ｍｍ2 、６０形の場合は３７５００ｍｍ2 の放熱面積つまり、前記アルミニウム基板の裏側面積が必要とされていた。換言すれば、放熱部２が外気による空冷を行い、４０℃以上の温度上昇を抑制するためには、放熱フィン２２，２２，２２，…及び固定筒２３が外気と接して空冷を行う面積が、２０形の場合は１２５００ｍｍ2 、４０形の場合は２５０００ｍｍ2 、６０形の場合は３７５００ｍｍ2 である必要がある。しかし、実際の使用においては、扁平な面にて空冷が行われることでなく放射状に並設された放熱フィン２２，２２，２２，…の表面にて空冷が行われること、照明装置の見栄えを悪くしないように、所定のケース、カバー等の収容部材内に装着されること等を考慮すべきである。例えば、２０形の場合は、１２５００ｍｍ2 より６０％広い２００００ｍｍ2 程度の放熱面積が望ましい。 As a result of the simulation under the conditions described above, a heat dissipation area of 12500 mm 2 for the 20 type illumination device, 25000 mm 2 for the 40 type, and 37500 mm 2 for the 60 type, that is, the back side area of the aluminum substrate is required. It had been. In other words, in order for the heat dissipating unit 2 to perform air cooling with outside air and to suppress a temperature rise of 40 ° C. or higher, the area where the heat dissipating fins 22, 22, 22,. , in the case of type 20 in the case of 12500mm 2, 40 form in the case of 25000 mm 2, 60 form should be 37500mm 2. However, in actual use, air cooling is not performed on a flat surface, but air cooling is performed on the surfaces of the radiation fins 22, 22, 22,.. In order not to make it worse, consideration should be given to mounting in a housing member such as a predetermined case or cover. For example, in the case of type 20, it is preferred radiating area 60% wider 20000mm about 2 than 12500Mm 2.

以上、実施の形態１及び２において、光源としてＬＥＤを採用した実施形態を例示して説明したが、これに限られるものではなく、ＥＬ（Ｅｌｅｃｔｒｏｌｕｍｉｎｅｓｃｅｎｃｅ）でもよい。放熱部は、内部に駆動回路部を収容して小型化を可能とし、光源及び駆動回路部からの熱を放熱できることから、広く他の光源についても適用可能である。   As described above, in the first and second embodiments, the embodiment in which the LED is used as the light source has been described as an example. However, the present invention is not limited to this and may be an EL (Electroluminescence). Since the heat radiating portion accommodates the drive circuit portion therein and can be reduced in size and can radiate heat from the light source and the drive circuit portion, the heat radiating portion can be widely applied to other light sources.

本発明の実施の形態１に係る照明装置の構成を示す斜視図である。It is a perspective view which shows the structure of the illuminating device which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る照明装置の構成を示す要部分解斜視図である。It is a principal part disassembled perspective view which shows the structure of the illuminating device which concerns on Embodiment 1 of this invention. 図１のIII‐III線による概略要部横断面図である。It is a general | schematic principal part cross-sectional view by the III-III line of FIG. 本発明の実施の形態１に係る照明装置の構成を示す概略要部縦断面図である。It is a schematic principal part longitudinal cross-sectional view which shows the structure of the illuminating device which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係る照明装置の構成を示す概略要部縦断面図である。It is a general | schematic principal part longitudinal cross-sectional view which shows the structure of the illuminating device which concerns on Embodiment 2 of this invention.

符号の説明Explanation of symbols

１ 光源モジュール
２ 放熱部
５ 口金部
７ 熱伝導シート
２１ 放熱板
２２ 放熱フィン
２３ 固定筒
２５ 空洞
３１ 駆動回路部品
５１ 空洞 DESCRIPTION OF SYMBOLS 1 Light source module 2 Heat radiation part 5 Base part 7 Thermal conductive sheet 21 Heat radiation plate 22 Heat radiation fin 23 Fixed cylinder 25 Cavity 31 Drive circuit component 51 Cavity

Claims (5)

ＬＥＤと、該ＬＥＤを駆動する駆動回路部と、該駆動回路部を収容する収容部とを有する照明装置において、
前記ＬＥＤおよび／または前記駆動回路部からの熱を放熱する放熱部を備え、
少なくとも前記放熱部を一部分として前記収容部が密閉してなることを特徴とする照明装置。 In an illumination device having an LED, a drive circuit unit that drives the LED, and a housing unit that houses the drive circuit unit,
A heat dissipating part for dissipating heat from the LED and / or the drive circuit part;
The lighting device, wherein the housing portion is hermetically sealed with at least the heat radiating portion as a part. ＬＥＤと、該ＬＥＤを駆動する駆動回路部と、該駆動回路部を収容する収容部とを有する照明装置において、
前記ＬＥＤおよび／または前記駆動回路部からの熱を放熱する放熱部を備え、
前記収容部は、前記放熱部の内部に、前記ＬＥＤが設けられた面に近接するように形成されてなることを特徴とする照明装置。 In an illumination device having an LED, a drive circuit unit that drives the LED, and a housing unit that houses the drive circuit unit,
A heat dissipating part for dissipating heat from the LED and / or the drive circuit part;
The said accommodating part is formed in the said thermal radiation part so that it may adjoin to the surface in which the said LED was provided, The illuminating device characterized by the above-mentioned. 電源部と接続する口金部と、
前記放熱部と前記口金部を絶縁する絶縁部をさらに有し、
前記収容部は、前記放熱部及び前記絶縁部により形成されてなることを特徴とする請求項１または２に記載の照明装置。 A base part connected to the power source part,
An insulating part that insulates the heat dissipating part and the base part;
The lighting device according to claim 1, wherein the housing portion is formed by the heat radiating portion and the insulating portion. 前記放熱部は、
一面に前記ＬＥＤが取り付けられる放熱板と、
該放熱板の他面に取り付けられ、内側に前記収容部を有する固定筒と、
該固定筒の外側に固定される放熱フィンとを備えることを特徴とする請求項１から３の何れか一つに記載の照明装置。 The heat dissipation part is
A heat sink to which the LED is mounted on one surface;
A fixed cylinder attached to the other surface of the heat sink and having the accommodating portion inside;
The illuminating device according to any one of claims 1 to 3, further comprising a heat radiating fin fixed to the outside of the fixed cylinder. 前記収容部は、外部からの塵埃の侵入が遮断された閉空間を形成していることを特徴とする請求項１から４の何れか一つに記載の照明装置。   The lighting device according to any one of claims 1 to 4, wherein the housing portion forms a closed space in which intrusion of dust from the outside is blocked.
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