JP2012256602A - Lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp that can restrain temperature rise of a circuit unit without enlarging the lamp.SOLUTION: The lamp 7 includes a light-emitting module 24 wherein LEDs 74 are mounted on a board 72, a cylindrical heat sink 46 for radiating heat in light-emitting the LEDs 74, a base 20 arranged at one end side of the heat sink 46, a mounting member 44 for mounting the light-emitting module 24 on the surface, and a circuit unit 26 stored in the heat sink 46 and receiving power through the base 20 and light-emitting the LEDs 74. Heat at light-emission is transmitted to the heat sink 46 by making the mounting member 44 and the heat sink 46 come in touch with each other. The circuit unit 26 is made of a circuit board 110, a plurality of electronic components 112, 114, and 116 mounted on the circuit board 110. At least one electronic component 116 among the plurality of electronic components is thermally jointed with the mounting member 44 via thermally conductive members 154, 156.

Description

  The present invention relates to a lamp having a light emitting element as a light source and incorporating a circuit unit.

  As a substitute for incandescent light bulbs, mini-krypton light bulbs, light bulb-type fluorescent lamps and the like (collectively referred to as “conventional lamps”) that have been used as light sources for lighting fixtures in recent years, one of the semiconductor light emitting devices There has been proposed a lamp using an LED (Light Emitting Diode) having a high luminous efficiency and a long lifetime. In addition, in order to distinguish the lamp using this LED from the conventional lamp, let it be an LED lamp.

  The LED lamp includes, for example, an LED module in which an LED is mounted on a substrate, a cylindrical heat sink that dissipates heat when the LED emits light, a base provided on one end of the heat sink, and an LED module on the surface. A heat conduction member that mounts and closes the other end opening of the heat sink to transmit heat at the time of light emission to the heat sink, a circuit unit that receives power from the base and emits the LED, and is arranged in the heat sink and stores the circuit unit inside Some have a circuit storage member (for example, Patent Document 1).

  In this LED lamp, the heat at the time of LED light emission is transmitted from the heat conduction member to the heat sink, and the heat transmitted to the heat sink is partly radiated from the heat sink by convection and radiation, and partly through the socket from the base by conduction. It is transmitted to the lighting device, ceiling, wall, etc. Thereby, it is suppressed that LED in an LED module becomes high temperature.

International Publication No. 2010/090012 JP 2006-313718 A

In the LED lamp having the above-described configuration, it is possible to release the heat of the LED at the time of light emission and suppress the LED from being excessively heated, but it is possible to suppress the electronic component constituting the circuit unit from being excessively heated. Can not.
That is, the circuit unit includes a circuit board and an electronic component, and the circuit board is mounted in the circuit case. Some electronic components have a high temperature when the LED is lit (for example, an integrated circuit component), and a portion of the circuit board on which the high-temperature electronic component is mounted is carbonized, resulting in deterioration of insulation. Problem arises.

In particular, there has been a strong demand for downsizing of LED lamps in recent years, and the circuit unit storage temperature and the temperature of the circuit unit around the circuit unit can be increased along with downsizing of the heat sink. As the temperature increases, the temperature of the circuit unit and its surrounding temperature tend to increase.
An object of this invention is to provide the lamp | ramp which can suppress the temperature rise of a circuit unit, without enlarging.

  In order to achieve the above object, a light emitting module in which a light emitting element is mounted on a substrate, a mounting member on which the light emitting module is mounted, a cylindrical body whose opening is closed by the mounting member, A lamp comprising: a circuit unit for causing a light emitting element to emit light; and a circuit case disposed in the cylindrical body in a state in which the circuit unit is stored, the circuit unit being mounted on the circuit board and the circuit board A plurality of electronic components, and at least one of the plurality of electronic components or the circuit board is thermally bonded to the inner surface of the circuit case by a first heat conductive member, and the outer surface of the circuit case. The back surface of the mounting member is thermally bonded via a second heat conductive member.

  The lamp described in the present specification is provided on a light emitting module in which a light emitting element is mounted on a substrate, a cylindrical heat sink that dissipates heat when the light emitting element emits light, and one end of the heat sink. A lamp comprising: a base; a mounting member for mounting the light emitting module on a surface; and a circuit unit that is stored in the heat sink and receives power through the base and causes the light emitting element to emit light. And the heat sink are in contact with each other to transmit heat at the time of light emission to the heat sink, and the circuit unit includes a circuit board and a plurality of electronic components mounted on the circuit board. At least one of the plurality of electronic components is thermally bonded to the mounting member via a heat conducting member.

In the lamp according to the present invention, since at least one of the circuit board or the plurality of electronic components is thermally bonded to the mounting member via the heat conducting member, the heat of the circuit board or the electronic component is transmitted to the mounting member, It is possible to prevent heat from being accumulated on the circuit board or the electronic component. Thereby, it can suppress that a circuit board or an electronic component rises in temperature too much.
Further, the circuit unit is stored in the heat sink in a state of being stored in a circuit case,
At least one of the circuit board or the plurality of electronic components is thermally coupled to the inner surface of the circuit case by a first heat conducting member, and the outer surface of the circuit case and the rear surface of the mounting member are second heat. It is characterized by being thermally bonded through a conductive member. The term “storage” as used herein is a concept including both the case where the entire circuit unit is stored and the case where a part of the circuit unit is stored. Thereby, the heat generated and accumulated in at least one of the circuit board or the plurality of electronic components can be efficiently conducted to the mounting member via the circuit case.

  Furthermore, the plurality of electronic components include an integrated circuit component mounted on a main surface located on the mounting member side of the circuit board, and at least one of the plurality of electronic components is the integrated circuit component. In addition, the first heat conducting member is a silicone sheet. Thereby, the heat generated and accumulated in the integrated circuit component which is at least one of the plurality of electronic components can be efficiently conducted to the circuit case.

Moreover, the part which mounts the said light emitting module in the said mounting member is inclined with respect to the central axis of the said heat sink. Thereby, even if it is the lighting fixture for downlights and the socket is mounted | worn with the lighting fixture provided inclining with respect to the center axis | shaft of an instrument main body, the lower part of an instrument main body can be illuminated brightly.
Furthermore, the circuit case includes a first case including a main body portion stored in the heat sink, a base mounting portion that protrudes from one end of the heat sink to the outside, and the base is mounted. A second case that closes an end, the second case has higher thermal conductivity than the first case, the first case has higher strength than the second case, and the inner surface of the circuit case is It is an inner surface of the second case. As a result, the heat generated and accumulated in at least one of the circuit board or the plurality of electronic components can be efficiently conducted from the circuit case to the mounting member side, and the base is attached to the first case. It functions as a structural member.

  The thermal conductivity of the second case is in a range of 1 W / mK to 15 W / mK. Thereby, the heat generated and stored in at least one of the circuit board or the plurality of electronic components can be efficiently conducted from the circuit case to the mounting member side.

It is sectional drawing of the illuminating device which concerns on 1st Embodiment. It is a general-view perspective view of the LED lamp which concerns on 1st Embodiment. It is sectional drawing which shows the LED lamp which concerns on 1st Embodiment. It is a disassembled perspective view of an LED lamp. It is a disassembled perspective view of the LED lamp upper part. It is sectional drawing which shows the LED lamp which concerns on 2nd Embodiment.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments that are examples of an LED lamp and an illumination device according to the present invention will be described with reference to the drawings.
It should be noted that the materials and numerical values used in the embodiments of the present invention only exemplify preferred examples, and are not limited to this form. In addition, modifications can be made as appropriate without departing from the scope of the technical idea of the present invention. Further, combinations with other embodiments are possible as long as no contradiction occurs.
<First Embodiment>
1. Illumination Device FIG. 1 is a cross-sectional view of the illumination device 1 according to the first embodiment.

The lighting device 1 includes a lighting fixture 5 embedded in the ceiling 3 using the opening 3 a of the ceiling 3, and an LED lamp 7 attached to the lighting fixture 5. The LED lamp 7 will be described later.
The lighting fixture 5 is a so-called downlight, and has a bowl-like fixture body 9, a socket 11 for mounting a lamp, and the socket 11 inclined at a predetermined angle with respect to the fixture body 9. It has the connection member 13 connected and the connection part 15 connected with a commercial power source. The socket can be mounted with a conventional lamp such as the LED lamp 7 according to the present embodiment, an incandescent bulb, a mini-krypton bulb, and a bulb-type fluorescent lamp.

In the socket 11, the central axis Y of the socket 11 (which is also the central axis of the LED lamp 7) is inclined at a predetermined inclination angle A, for example, 70 degrees, with respect to the central axis X of the instrument body 9. The inclination angle of the socket starts from the central axis X extending above the intersection O with the intersection O of the central axes X and Y as the center.
2. LED Lamp FIG. 2 is a schematic perspective view of the LED lamp 7 according to the first embodiment, and FIG. 3 is a cross-sectional view showing the LED lamp 7 according to the first embodiment. FIG. 4 is an exploded perspective view of the LED lamp 7, and FIG. 5 is an exploded perspective view of the upper portion of the LED lamp 7.

The imaginary line Z in FIG. 3 is also the central axis of the base 20 and the lamp axis that is the central axis of the LED lamp 7. 3 becomes the virtual line Y shown in FIG. 1 when the LED lamp 7 is mounted on the lighting fixture 5. The virtual line Z in FIG.
The LED lamp 7 is connected to a base 20 that is detachably attached to the socket 11 of the lighting fixture 5, and is connected to the base 20 so as to be rotatable about an axis around the central axis Z of the base 20. 7) a main body 22 having a flat surface inclined at a predetermined angle B with respect to the central axis Z, an LED module 24 mounted on the flat surface of the main body 22, a circuit unit 26 for lighting the LED module 24, and a main body 22, and a circuit case 28 that covers the circuit unit 26, and a globe 30 that covers the LED module 24.

That is, the LED lamp 1 that is a lamp includes a LED module 24 that is a light emitting module in which an LED 74 that is a light emitting element is mounted on a mounting substrate 72 that is a substrate, and a cylinder that radiates heat when the LED 74 that is a light emitting element emits light. A cylindrical body 42 that is a heat sink, a base 20 provided on one end of the cylindrical body 42 that is a heat sink, a lid 44 that is a mounting member on which the LED module 24 that is a light emitting module is mounted, and a heat sink And a circuit unit 26 which is stored in a cylindrical body 42 and receives power via the base 20 and causes the LED 74 which is the light emitting element to emit light.
(1) Base 20
As shown in FIGS. 2 to 4, the base 20 is the same as the base of a conventional lamp so that it can be adapted to a lighting fixture 5 to which a light bulb of a conventional lamp is attached. For example, JIS (Japanese Industrial Standard) E type and G type specified in (1) are used.

The base 20 here is E17, and as shown in FIG. 3, an eyelet 36 is connected to a cylindrical shell 34 via an insulating connector 38. The shell 34 and the eyelet 36 are connected to the circuit unit 26 via wirings 40a and 40b. The base 20 is screwed to the base mounting portion 126 of the circuit case 28 using the female screw portion of the shell 34.
(2) Body 22
As shown in FIGS. 3 and 4, the main body 22 includes a cylindrical body 42 having openings at both ends, and a lid body 44 attached to one end so as to close the opening on one end side of the cylindrical body 42. Here, one end of the cylindrical body 42 refers to an end opposite to the side where the base 20 exists, that is, an end on the side where the globe 30 exists, and the other end corresponds to an end opposite to the side where the globe 30 exists, ie, the end of the base 20. It points to the end of the existing side.

The cylinder body 42 and the lid body 44 are, for example, press-fit the lid body 44 into the cylinder body 42 or fixed by an adhesive, and the main body 22 is rotatable with respect to the base 20 by a mechanism described later (however, As will be described later, the rotation angle is less than 360 [°]. The cylinder body 42 and the lid body 44 may be integrally joined by other known techniques, for example, screws, caulking, welding, or the like.
(2-1) Cylindrical body 42
As shown in FIGS. 2 to 4, the cylindrical body 42 has an annular cylindrical cross-sectional shape, and has a cone shape whose diameter decreases as it moves from one end to the other end on the central axis Z. Specifically, an inclined portion 46 that inclines so as to approach the central axis Z of the cylindrical body 42 as it moves from one end to the other end on the central axis Z of the cylindrical body 42, and bends at the other end toward the central axis Z. And an extended portion 48 that extends in the direction parallel to the central axis Z and protrudes outward from the extended portion 48. The cylinder 42 is made of a material having high thermal conductivity, such as aluminum, and has a heat dissipation function.

The extending portion 48 does not reach the central axis Z of the cylindrical body 42, and an opening 49 is formed by the inner peripheral edge of the extending portion 48. Moreover, since the one end side of the cylinder 42 is larger in diameter than the other end side, one end is also referred to as a large diameter side end and the other end is also referred to as a small diameter side end.
(2-2) Lid 44
As shown in FIGS. 3 and 5, the lid 44 has a shape obtained by cutting a sphere along two planes. The two planes are a first plane orthogonal to a virtual line passing through the center of the sphere, and a second plane inclined with respect to the virtual line at a position away from the first plane. They do not cross each other on the perimeter that constitutes the appearance.

Here, the bottom part 52 cut | disconnected by the 1st plane block | closes the one end side of the cylinder 42, and the globe 30 is mounted | worn with the attaching part 54 cut | disconnected by the 2nd plane.
In addition to the bottom portion 52 and the attachment portion 54, the lid body 44 is recessed from the attachment portion 54 (second plane) inwardly into the inward portion, and from the center of the bottom portion 52 inwardly. And a stepped portion 60 formed on the outer peripheral edge of the bottom portion 52 (first plane). The lid 44 is made of a material having high thermal conductivity, such as aluminum.

  As shown in FIG. 3, the first recessed portion 56 is recessed such that the bottom surface 62 is inclined at an angle B with respect to the central axis Z. That is, when viewed from the direction of arrow C in FIG. 3 (when the LED lamp 7 is viewed from the direction orthogonal to the lamp axis Z), the bottom surface 62 is the lower side and the upper side is the back side. It is inclined to become. The LED module 24 is mounted (mounted) at the center position of the inclined bottom surface 62.

As shown in FIG. 3, the bottom surface 62 is depressed on the lower side with respect to a plane including the periphery of the attachment portion 54 (that is, the second plane) when viewed from the direction of the arrow C. The upper side is raised.
The first recessed portion 56 is inclined so that the portion on which the LED module 24 is mounted (the central portion of the bottom surface 62) is gradually raised with respect to the second plane. A mounting groove 65 for mounting the opening side end portion 64 of the globe 30 is formed on the outer periphery).

  As shown in FIG. 3, the second recessed portion 58 is recessed corresponding to the shape and size of the part so that a part of the circuit case 28 is inserted. Specifically, the recessed shape is a shape in which a pillar is obliquely cut in a plane parallel to the bottom surface 62 of the first recessed portion 56, and when viewed from the C direction, the bottom surface of the bottom portion 52 (first It is recessed so that it becomes deeper as it moves from the near side to the far side.

For this reason, the thickness of the bottom plate 66 positioned between the first recessed portion 56 and the second recessed portion 58 is substantially constant at the portion where the LED module 24 is mounted (placed). Through holes 68 and 70 for wirings 82 and 84 for electrically connecting the LED module 24 and the circuit unit 26 are formed in the bottom plate 66 between the first recessed portion 56 and the second recessed portion 58. (See FIG. 5).
(3) LED module 24
As shown in FIG. 3, the LED module 24 encloses a mounting board 72 having a wiring pattern (not shown) on the surface, a plurality of LED elements 74 mounted on the surface of the mounting board 72, and a plurality of LED elements 74. And a sealing body 76 to be stopped.

In FIG. 3, six LED elements 74 mounted on the LED module 24 appear, but a total of 36 LED elements 74 including the other LED elements (74) covered by the sealing body 76 are mounted. . The number of LED elements 74 to be mounted is not limited to this, and is appropriately determined according to lamp specifications, LED element specifications, and the like.
The mounting substrate 72 is made of an insulating material (for example, ceramic), and has a square shape in plan view here. The wiring pattern includes a connection portion for connecting a plurality of LED elements 74 mounted on the mounting substrate 72 in series and / or in parallel, and terminal portions 78 and 80 for receiving power from the circuit unit 26 (FIG. 5).

As shown in FIG. 5, the terminal portions 78 and 80 pass through the through holes 68 and 70 penetrating the lid body 44, and a pair of wirings 82 and 84 led out from the inside of the lid body 44 (see FIG. 5). 4) and connection terminal members 86 and 88 (see FIGS. 3 and 5).
The sealing body 76 is made of, for example, a translucent resin (for example, a silicone resin) or the like. When the wavelength of light emitted from the LED element 74 needs to be converted, the sealing body 76 is made of phosphor powder or the like. A material having a wavelength conversion function is mixed in the translucent resin.

For example, when white light is emitted from the LED module 24, if a GaN-based element that emits blue light is used as the LED element 74, (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ or YAG: Ce ³ is used as the phosphor powder. ^It can be carried out by using a yellow-green phosphor powder such as ⁺ and a red phosphor powder such as Sr ₂ Si ₅ N ₈ : Eu ²⁺ or (Sr, Ca) AlSiN ₃ : Eu ²⁺ .
In addition, when it is necessary to convert the wavelength of the light emitted from the LED element 74, for example, a phosphor film containing phosphor powder can be formed on the inner peripheral surface of the globe 30.

  The LED module 24 is pressed and fixed to the bottom surface 62 of the first recessed portion 56 of the lid body 44 by a pressing plate 90. As shown in FIG. 5, the holding plate 90 is larger than the LED module 24 and has an opening 92 at a portion corresponding to the sealing body 76 of the LED module 24. In addition, the holding plate 90 is a pair of sides facing each other in the rectangular LED module 24 and the portions 94 and 96 corresponding to the sides where the terminal portions 78 and 80 are not formed are another pair of facing each other. The connection terminal members 86 and 88 are arranged between the raised portions 94 and 96 and the mounting substrate 72 of the LED module 24 (FIG. 3). reference).

  Thus, when the pressing plate 90 is put on the LED module 24, the lower portions 98 and 100 of the pressing plate 90 abut against the surface of the mounting substrate 72, and the high portions 94 and 96 are on the upper surfaces of the connection terminal members 86 and 88. Abut. In this state, the lower portion 98, 100 of the pressing plate 90 is screwed to the lid body 44 by screws 102, 104, so that the LED module 24 is attached to the lid body 44.

The connection terminal members 86 and 88 have metal leaf springs connected to the wirings 82 and 84, and the leaf springs contact the terminal portions 78 and 80 on the mounting substrate 72 of the LED module 24. It is elastically deformed when the pressing plate 90 is attached to the lid 44.
The LED module 24 may be fixed to the bottom surface 62 of the first recessed portion 56 of the lid body 44 with an adhesive. In this case, the LED module 24 and the bottom surface 62 are completely in contact with each other via the adhesive, so that the heat of the LED module 24 can be efficiently transmitted to the lid 44. The LED module 24 may be thermally bonded to the bottom surface 62 via thermal grease.
(4) Circuit unit 26
The circuit unit 26 lights the LED element 74 using the power received through the base 20. As shown in FIGS. 3 and 4, the circuit unit 26 includes a plurality of electronic components mounted on the circuit board 110, and includes, for example, a rectifying / smoothing circuit, a DC / DC converter, a control circuit, and the like. ing.

Examples of the plurality of electronic components include an electrolytic capacitor 112 for a smooth circuit, a choke coil 114 for a DC / DC converter, and an IC component 116 for a control circuit.
The circuit board 110 has an electronic component such as a choke coil 114 mounted on one main surface and an IC component 116 mounted on the other main surface. As will be described later, the electrolytic capacitor 112 has lead wires 112 a and 112 b connected to the circuit board 110 so as to be disposed in the base 20.

As described above, the circuit unit 26 is disposed in the main body 22 in a state where all or part of the circuit unit 26 is stored in the circuit case 28. The mounting of the circuit unit 26 to the circuit case 28 will be described later.
(5) Circuit case 28
As shown in FIGS. 3 and 4, the circuit case 28 is mainly disposed in the first case 120 stored in the cylindrical body 42 and the base 20 of the main body 22 and mainly in the lid body 44 of the main body 22. And a second case 122 stored therein. The first case 120 is rotatable with respect to the second case 122.
(5-1) First case 120
The first case 120 includes a main body portion 124 stored in the cylindrical body 42 and a base mounting portion 126 to which the base 20 is mounted. The base mounting portion 126 is a cylinder from the end of the cylindrical body 42 on the base 20 side. Projects to the outside of the body 42. As will be described later, the first case 120 has a function as a structural member because the cylindrical body 42 of the main body 22 is rotatably sandwiched between the base 20 and the base 20.

  Corresponding to the shape of the inner peripheral surface of the cylindrical body 42, the main body 124 extends from the end of the base 20 of the cone portion 128 toward the central axis. Part 130. As shown in FIG. 3, the outer surface of the extended portion 130 is in contact with the inner surface of the extended portion 48 of the cylindrical body 42. Note that the upper end of the main body 124, that is, the end opposite to the base 20 is closed by the second case 122.

  The base mounting portion 126 extends in a cylindrical shape, in this case, a cylindrical shape, from the extending portion 130 of the main body portion 124 toward the base 20. The base mounting portion 126 has a first outer diameter portion 132 having an outer diameter smaller than the outermost outer diameter of the extending portion 130 of the main body portion 124 and an outer diameter of the first outer diameter portion 132 from the main body portion 124 side. It has the 2nd outer diameter part 134 of a small outer diameter, and the screw part 136 by which the outer peripheral surface became the screw.

The first outer diameter portion 132 is smaller than the diameter of the opening 49 formed in the extending portion 48 of the cylindrical body 42, and the screw portion 136 has an outer diameter smaller than that of the second outer diameter portion 134. As a result, the base mounting portion 126 can protrude from the opening 49 on the small diameter side of the cylindrical body 42 to the outside.
Since the first case 120 is used as a structural member, the first case 120 has desired mechanical properties (strength and rigidity). For example, resin (polybutylene terephthalate (PBT), thermal conductivity is 0.2 [W / mK]. ˜0.3 [W / mK]).
(5-2) Second case 122
The second case 122 includes a plate-like base portion 140 and a unit storage portion 142 that holds the circuit board 110 of the circuit unit 26 and stores a part of the circuit unit 26, and is rotatable with respect to the base 20. Is provided.

The unit storage part 142 has an external shape such that a cylinder is cut in an oblique direction leaving a little upper surface. A portion cut in an oblique direction, that is, an inclined portion is defined as an inclined portion 142a.
The unit storage part 142 has a predetermined substantially constant thickness, and the inner surface has a shape along the outer surface that constitutes the external shape, and a storage space for storing a part of the circuit unit 26 is formed by the inner surface. .

Fixing means for fixing the circuit board 110 of the circuit unit 26 is formed on the inner surface of the unit storage portion 142. Specifically, a support protrusion for supporting the back surface of the circuit board 110 (the surface on which the IC component 116 is mounted) and the surface of the circuit board 110 (the surface on which the choke coil 114 is mounted). It is comprised from the latching claw which latches to the periphery.
As shown in FIG. 4, extended tube portions 144, 146 extending outward are formed in the inclined portion 142 a. The extension tube portions 144 and 146 are inserted into the through holes 68 and 70 of the lid body 44 when assembled as a lamp, and the wirings 82 and 84 that electrically connect the interior to the LED module 24 pass therethrough.

As shown in FIG. 3, the inclined portion 142 a has a back surface thermally bonded to the IC component 116 of the circuit unit 26 via the silicone sheet 154, and the front surface is formed by connecting the lid body 44 of the main body 22 and the silicone sheet 156. It is thermally joined via. For this reason, the second case 122 has a function of conducting heat of the IC component 116 to the main body 22.
Since the second case 122 has a function of transferring the heat on the circuit unit 26 side to the lid body 44, the second case 122 is made of a material having a thermal conductivity higher than that of at least the first case 120 or air. For example, a resin (polybutylene terephthalate ( PBT) is a material in which a highly heat-conductive filler (for example, alumina filler or the like) is mixed, and its thermal conductivity is 1 [W / mK] to 15 [W / mK]. The

Note that when the first case 120 and the second case 122 are made of resin as the main material, the thermal conductivity can be adjusted by the amount of filler mixed in the resin, and the thermal conductivity increases as the amount of filler increases. If it is less, the mechanical properties are higher.
(6) Globe 30
The globe 30 has a hemispherical shape, for example, and is similar in appearance to a part of a bulb (glass portion) shape of a mini-krypton bulb. That is, when the globe 30 is attached to the lid 44, the globe 30 and the lid 44 have a shape similar to the bulb shape of the incandescent bulb. The globe 30 is attached to the main body 22 so as to cover the LED module 24.

As shown in FIGS. 1 and 2, the globe 30 is attached to the main body 22 in a state where a virtual surface including the opening periphery is inclined with respect to the central axis of the LED lamp 7.
Here, the opening-side end portion 64 of the globe 30 is inserted into the first recessed portion 56 or the mounting groove 65 of the lid body 44, and the adhesive 150 disposed in the first recessed portion 56 or the mounting groove 65 is used. The lid 44 is fixed.
(7) Fitting ring 152
The fitting ring 152 is for holding the cylindrical body 42 of the main body 22 rotatably with respect to the base 20 mounted on the base mounting portion 126 with the circuit case 28 (the first case 120). . The fitting ring 152 includes an inner peripheral surface having a shape corresponding to the shape on the other end side of the cylindrical body 42. Specifically, the other end of the cylindrical body 42 has a step shape, and the inner peripheral surface of the fitting ring 152 also has a step shape.

  Here, the inner peripheral surface of the fitting ring 152 has a two-step shape, and the first step on the cylindrical body 42 side of the fitting ring 152 abuts on the step on the other end of the cylindrical member 42, and the third step is It contacts the step between the first outer diameter portion 132 and the second outer diameter portion 134 of the base mounting portion 126. The innermost circumferential surface of the fitting ring 152 is substantially abutted (positioned by this) to the extent that there is no hindrance to mutual rotation with the outer circumferential surface of the first outer diameter portion 132.

Thereby, the cylinder 42 can be hold | maintained with the circuit case 28 without backlash.
The fitting ring 152 is attached to the circuit case 28 by fixing the base 20 to the base mounting part 126 in a state where the end face on one end side of the base 20 is in contact with the fitting ring 152.
3. Rotation Restriction Mechanism In the present embodiment, a rotation restriction mechanism is provided that restricts the main body 22 from rotating with respect to the base 20 by 360 [°] or more. This is because the circuit unit 26 rotates with the rotation of the main body 22 and is further connected to the base 20 and the wirings 40a and 40b. This is to prevent it from coming off from 20. Further, when the LED lamp 7 is attached to the socket 11, the globe 30 and the lid 44 are gripped, and when the LED lamp 7 is screwed into the socket 11, the globe 30 and the lid 44 are idle with respect to the base 20. This is to prevent this.

  In the rotation restricting mechanism, the locking means provided on the circuit case 28 side and the locked means provided on the cylinder body 42 side have a cylindrical body 42 (main body 22) with respect to the base 20 (circuit case 28). This is done by engaging at a predetermined rotational position when rotating. The locking means may be provided on the cylindrical body side, and the locked means may be provided on the circuit case side. In addition, the circuit case is attached to the base by attaching the circuit case to the base with screws located on the center axis of the circuit case and the base, and making the circuit case rotatable with respect to the screws. And can be freely rotatable.

  Specifically, in the first outer diameter portion 132 of the first case 120 of the circuit case 28, the portion facing the inner peripheral surface of the opening 49 of the cylindrical body 42 is directed to the opening 49 of the cylindrical body 42. And a projecting portion 162 that protrudes and contacts the inner peripheral surface of the opening 49 of the cylindrical body 42. On the other hand, a protrusion that protrudes toward the central axis Z of the cylindrical body 42 at one location on the inner peripheral surface constituting the opening 49 of the cylindrical body 42 and facing the first outer diameter portion 132 of the first case 120. Part 164.

With the above configuration, the cylindrical body 42 is rotated in a state where the convex portion 164 of the cylindrical body 42 is in contact with the outer peripheral surface of the first large-diameter portion 132 of the first case 120 of the circuit case 28. The convex portion 162 of the first large diameter portion 132 comes into contact (engagement) with the convex portion 164 of the cylindrical body 42 and its rotation is restricted.
In the above description, the main body 22 is structured to be rotatable with respect to the base 20. For example, the lid (44) constituting the main body 22 is rotatably attached to the cylinder (42). You may do it.
4). Assembly An example of the assembly of the LED lamp will be described below. Needless to say, the order of the following steps is an example, and LED lamps can be assembled in other orders.
(1) Assembling the second case 122 into the lid 44 (see FIG. 4)
The second case 122 is assembled into the lid body 44. At this time, the silicone sheet 156 is provided on the inclined portion 142 a of the second case 122. Incorporation into the lid 44 is performed by press-fitting the extended cylindrical portions 144 and 146 of the second case 122 into the through holes 68 and 70 of the lid 44.

It should be noted that when the second case 122 is incorporated in the lid 44, the inclined portion 142 a and the bottom plate 66 of the lid 44 are arranged so that the silicone sheet 156 contacts the inclined portion 142 a of the second case 122 and the bottom plate 66 of the lid 44. And the distance is designed.
(2) Incorporation of the circuit unit 26 into the second case 122 (see FIG. 4)
The circuit unit 26 is inserted into the second case 122. Specifically, the circuit unit 26 is inserted into the second case 122 from the side opposite to the side where the electrolytic capacitor 112 is mounted. At this time, the surface of the circuit board 110 facing the inclined portion 122a is the surface on which the IC component 116 is mounted, and the circuit board 110 is inserted in a state parallel to the inclined portion 122a. Note that, when inserted, the wires 82 and 84 that connect the circuit unit 26 and the LED module 24 are led out from the through holes 68 and 70 of the lid body 4 through the extended cylindrical portions 144 and 146 of the second case 122. Keep it.

When the leading end of the circuit board 110 in the insertion direction comes into contact with the second case 122, the circuit board 110 is pressed against the inclined portion 122a, and the circuit unit 26 is fixed to the second case 122 by the fixing means.
At this time, the silicone sheet 156 is attached to the upper surface of the IC component 116 (the surface on the inclined portion 142a side). Thus, when the circuit unit 26 is mounted on the second case 122, the inclined portion 122a and the IC component 116 are thermally coupled.

In a state where the circuit board 110 is mounted on the second case 122, a part of the circuit board 110, the choke coil 114 and the electrolytic capacitor 112 protrude from the second case 122 as shown in FIG. 3.
(3) Assembling the first case 120 and the cylindrical body 42 into the second case 122 (see FIG. 4)
A part of the circuit board 110 protruding from the second case 122, a part of the electrolytic capacitor 112, and a part of the choke coil 114 are inserted into the first case 120, and the opening of the first case 120 is formed as a base part of the second case 122. Cover with 140. Thereby, the circuit case 28 for storing the circuit unit 26 therein is completed.

Next, the first case 120 is inserted into the cylindrical body 42 so that the base mounting portion 126 of the first case 120 in the circuit case 28 protrudes from the opening on the small diameter side of the cylindrical body 42.
(4) Mounting the lid 44 on the cylinder 42 (see FIG. 4)
The lid body 44 and the cylinder body 42 are attached. Specifically, the bottom 52 of the lid 44 is press-fitted into the large-diameter opening of the cylinder 42. That is, the stepped portion 60 of the lid body 44 is aligned with the large-diameter side opening of the cylinder body 42, and in this state, the lid body 44 is pushed into the cylinder body 42 side.

Thereby, the main body 22 having the circuit case 28 for storing the circuit unit 26 therein is completed.
(5) Mounting the LED module 24 and the globe 30 on the main body 22 (see FIG. 5)
After the wires 82 and 84 extending from the through holes 68 and 70 of the main body 22 are connected to the connection terminal members 86 and 88, the LED module 24 is mounted at the center of the bottom surface 62 of the lid body 44 of the main body 22.

Then, in a state where the leaf springs of the connection terminal members 86 and 88 are in contact with the connection portions 78 and 80 of the LED module 24, the holding plate 90 is fitted so that the opening 92 of the holding plate 90 fits into the sealing body 76 of the LED module 24. 90, and the holding plate 90 is fixed to the lid 44 with screws 102 and 104.
Next, after the adhesive 150 is applied to the glove mounting groove 65 and a part of the first recessed portion 56 of the lid 44, the opening side end portion 64 of the globe 30 is attached to the mounting groove 65 and the first recessed portion 56. Insert the glove 30 and fix it to the main body 22.
(6) Mounting of the base 20 to the circuit case 28 (see FIG. 4)
After the fitting ring 152 is fitted to the base mounting part 126 of the circuit case 28, the wiring 40 a that connects the circuit unit 26 and the shell 34 is bent along the outer periphery of the base mounting part 126, and the wiring 40 b passes through the eyelet 36. Derived from the hole to the outside.

Then, the screw portion of the shell 34 of the base 20 is screwed into the screw portion 136 on the outer periphery of the base mounting portion 126, and the base body 42 is rotatably held between the fitting ring 152 and the circuit case 28. The root part of 20 shells 34 (the part near the fitting ring 152) is caulked.
Finally, the LED lamp 7 is completed by connecting the wiring 40b to the eyelet 36 by soldering.
5. Heat conduction Heat conduction from the circuit unit 26 when the LED lamp 7 is turned on will be described.

When the circuit unit 26 receives power through the base 20, the circuit unit 26 supplies power to the LED module 24 by a circuit constituting the circuit unit 26.
At this time, for example, the temperature of the IC component 116 among the electronic components rises. The temperature of the IC component 116 may be higher than the temperature of the LED module 24. In such a case, the heat of the IC component 116 is transferred to the circuit case 28 (second case 122) via the silicone sheet 154, and the circuit. The heat transferred to the case 28 is transferred to the lid body 44 of the main body 22 through the silicone sheet 156.

A part of the heat transmitted to the lid body 44 is radiated from the cylindrical body 42 having a heat radiation function to the outside air, and the rest is transmitted to the lighting fixture 5 through the base 20.
As described above, the heat of the IC component 116 is not easily accumulated in the IC component 116, and an excessive temperature rise can be suppressed.
<Second Embodiment>
In the first embodiment, the LED module 24 is mounted on the main body 22 in an inclined state with respect to the lamp central axis Z. In the second embodiment, a mode in which the LED module is mounted in a state orthogonal to the lamp central axis Z will be described.

FIG. 6 is a cross-sectional view showing an LED lamp 201 according to the second embodiment.
The LED lamp 201 includes an LED module 203 including the LED 218 as a light source, a mounting member 205 on which the LED module 203 is mounted, a case 207 to which the mounting member 205 is attached at one end, a globe 209 that covers the LED module 203, A circuit unit 211 that turns on the LED 218, a circuit case 213 that houses the circuit unit 211 and is disposed in the case 207, and a base member 215 that is provided at the other end of the case 207.

A combination of the case 207 and the mounting member 205 corresponds to the main body 22 in the first embodiment.
As in the first embodiment, the LED module 203 includes a mounting substrate 217, a plurality of LEDs 218, and a sealing body 219. The sealing body 219 is formed by mixing a wavelength conversion material into a light-transmitting material.

The mounting member 205 is made of a plate-like member, and the LED module 203 is mounted on the surface of the mounting member 205 and closes one end of a case 207 described later. The mounting member 205 also has a function of transmitting heat generated in the LED 218 to the case 207 when turned on, and a material having high thermal conductivity (for example, aluminum) is used.
In the second embodiment, it is configured by a disk-shaped member, press-fitted into one end of the case 207, and connected to the circuit case 213 by a screw 221. The outer peripheral surface of the mounting member 205 has a stepped shape, and the end portion on the opening side of the globe 209 is inserted into a groove portion formed between the stepped portion and one end of the case 207 and fixed with an adhesive 223. .

The case 207 has a cylindrical shape, and the mounting member 205 is attached to one end thereof, and the base member 215 is attached to the other end thereof. The case 207 has a function of receiving heat from the LED 218 during lighting from the placement member 205 and radiating this heat, and a material having high heat radiation (for example, aluminum) is used.
The body of the circuit case 213 is accommodated inside the case 207, a part extends from the other end side of the case 207 to the outside, and a base member 215 is attached to the extended portion.

The globe 209 is fitted into the groove formed when the mounting member 205 and the case 207 are combined, and is fixed (adhered) to the mounting member 205 and the case 207 by filling the groove with the adhesive 223. Has been.
The circuit unit 211 has a plurality of electronic components mounted on a circuit board 225 and is stored in a circuit case 213. The circuit unit 211 and the LED module 203 are electrically connected by wires 227 and 227. An IC component 226 which is one of the electronic components is mounted on the main surface of the circuit board 225 on the side close to the mounting member 205.

The circuit case 213 has a case main body 213a and a lid 213b, and each is made of an insulating material. As the insulating material, for example, a synthetic resin (specifically, polybutylene terephthalate (PBT)) can be used. The IC component 226 is thermally bonded to the lid 213b by the silicone sheet 230.
Since the lid body 213b has a function of conducting heat on the circuit unit 211 side to the placement member 205, the lid body 213b is made of a material having high thermal conductivity. Note that the case main body 213a may be made of the same material as the lid 203b, or may be made of a material having excellent mechanical properties, like the first case 120 in the first embodiment.

Further, a portion corresponding to the back surface of the outer surface of the lid 213 b and thermally bonded to the IC component 226 via the silicone sheet 230 is heated to the back surface of the mounting member 205 via the silicone sheet 232. Are joined together.
The base member 215 is again an Edison type, and includes a base 228 and an insulating member 229 for ensuring insulation between the base 228 and the case 207.
<Modification>
1. Circuit Case In the above embodiment, the circuit units 26 and 211 are stored in the circuit cases 28 and 213. However, the circuit units 26 and 211 may be stored in the case or the main body without being stored in the circuit case. In this case, for example, the circuit unit can be mounted on the lid using a locking structure, a screw structure, an adhesive, or the like.

Further, in the circuit case 28 according to the first embodiment, the first case 120 and the second case 122 are each made of a material having different thermal conductivity and mechanical characteristics. On the other hand, the material of the case main body 213a constituting the circuit case 213 according to the second embodiment is not particularly limited.
This is because, in the first embodiment, the main body 22 is rotatable with respect to the base 20 within 360 [°], and a load generated when the LED lamp 7 is attached to the socket 11 or the like. Since it is borne by the first case 120, the material of the second case 122 (a material mixed with filler) is not suitable because it is brittle, and the first case 120 has desired mechanical properties (strength, elasticity). , Ductility, etc.) is required. On the other hand, the case main body 213a according to the second embodiment is not configured to rotate the case 207 relative to the base member 215, so that the mechanical characteristics are as good as those of the first case 120 according to the first embodiment. Because is not required.

  In the first embodiment, the first case does not require much mechanical characteristics (for example, a structure in which the cap and the cylinder are rotatable and the base is attached to the cylinder). As described above, the first case is made of a general-purpose material (for example, a resin material that does not contain a filler, or a resin material with a small amount of filler). In the second embodiment, the case main body 213a is made of a general-purpose material. If it is made of a material, an effect that it can be implemented at low cost can be obtained.

Furthermore, the circuit case may not include the first case 120 or the case main body 213a when the base case is not attached to the first case 120 or the case main body 213a.
In addition, the circuit cases 28 and 213 are thermally coupled to the mounting members 44 and 205 by the heat conducting members 156 and 232, but in a state of directly contacting the mounting member or a state of contacting via the thermal grease, It may be attached to the mounting member.
2. Electronic component In the above-described embodiment, the IC component 116 and the like are thermally bonded to the lid 44 and the like via the silicone sheets 154 and 156 and the like. However, the electronic component is not limited to the electronic component having the highest temperature, and may be another electronic component. As other electronic components, the temperature of the electronic component at the time of light emission is close to the temperature at which the electronic component is thermally destroyed, and the temperature of the electronic component at the time of light emission heats another electronic component adjacent to the electronic component. There are parts that affect other electronic parts when there is a risk of destruction.

The thermal coupling may be a substrate instead of an electronic component. For example, a portion on which an electronic component that is high in temperature when mounted or a portion on which an electronic component having a low heat-resistant temperature is mounted may be thermally bonded.
In the embodiment, the electronic component that is at a high temperature is a member (lid 44) on which the LED module is mounted (placed) with a material having a higher thermal conductivity than air (in the embodiment, a silicone sheet). Although it is thermally bonded to the mounting member 205), it may be thermally bonded to another member, for example, a heat radiating member (cylinder 42, case 207, circuit case 28). For example, when thermally bonded to a circuit case, the heat capacity of the circuit case is larger than that of the circuit board or electronic component, so that the heat of the circuit board or electronic component can be conducted to the circuit case side. Etc. can be prevented from becoming high temperature.
3. Thermal Conductive Member In the embodiment, silicone sheets 154, 156, 230, and 232 are used as the thermal conductive member. As described above, this silicone sheet is obtained by mixing an alumina filler or a highly conductive filler other than alumina into a silicone resin, and the thermal conductivity of the silicone sheet is defined by the filler content.

Considering the conduction of the heat of the circuit unit to the electronic component and the circuit board to the mounting member, it is preferable that the heat conductivity is approximately the same as that of the circuit case (second case 122 or lid 213b).
That is, since the thermal conductivity of the second case 122 is 1 [W / mK] to 15 [W / mK], the thermal conductivity of the heat conducting member is also 1 [W / mK] to 15 [W / mK]. Is preferred. However, depending on the filler material and amount, the thermal conductivity may not be 1 [W / mK] to 15 [W / mK]. For example, in the case of a silicone sheet, considering the operability, adhesiveness, and deformability as a sheet material, the thermal conductivity is 1 [W / mK] to 10 [W / mK].

In the embodiment, the silicone sheets 154, 156, 230, and 232 are used as the heat conducting members, but other forms of members may be used.
As another form, you may thermally couple | bond with a some member using a silicone resin. For example, the electronic component and the circuit case may be thermally coupled. In this case, after combining both members, it can implement by inject | pouring and hardening a silicone resin to a junction part (gap between both members).

Furthermore, materials other than silicone materials can be used as the heat conducting member. However, it goes without saying that a material having a higher thermal conductivity is preferable.
4). Mounting member The lid 44 in the first embodiment and the mounting member 205 in the second embodiment are not particularly described in terms of the surface thereof, but may be subjected to various processing. For example, an insulating film by anodizing or painting may be formed on the mounting surface of the LED module. Thereby, the withstand voltage as a lamp | ramp can be improved. A reflective coating may be formed. Thereby, the light emitted from LED can be reflected to the glove side, and the light extraction efficiency can be improved.

  The same coating film may be formed on the pressing plate 90.

  The present invention is a technique useful as an alternative to existing light bulbs such as general incandescent light bulbs, mini-krypton light bulbs, and light bulb shaped fluorescent lamps.

7, 201 LED lamp (lamp)
20, 228 Base 24, 203 LED module 28, 211 Circuit unit 30 Globe 44 Lid (mounting member)
46 Tube (heat sink)
72, 217 Mounting board 110, 225 Circuit board 116, 226 Electronic component 205 Mounting member 207 Case (heat sink)

Claims (3)

A light emitting module in which a light emitting element is mounted on a substrate;
A mounting member for mounting the light emitting module on the surface;
A cylinder whose opening is closed by the mounting member,
A circuit unit for causing the light emitting element to emit light;
A lamp provided with a circuit case disposed in the cylindrical body in a state of storing the circuit unit,
The circuit unit includes a circuit board and a plurality of electronic components mounted on the circuit board.
At least one of the plurality of electronic components or the circuit board is thermally bonded to the inner surface of the circuit case by a first heat conducting member, and the outer surface of the circuit case and the rear surface of the mounting member are second. A lamp characterized by being thermally bonded via a heat conducting member. The lamp according to claim 1, wherein the first heat conducting member is a silicone sheet. The plurality of electronic components include an integrated circuit component mounted on a main surface located on the mounting member side of the circuit board,
The lamp according to claim 1, wherein at least one of the plurality of electronic components is the integrated circuit component.

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