KR101017349B1 - Bulb type led lamp - Google Patents

Bulb type led lamp Download PDF

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Publication number
KR101017349B1
KR101017349B1 KR1020090119060A KR20090119060A KR101017349B1 KR 101017349 B1 KR101017349 B1 KR 101017349B1 KR 1020090119060 A KR1020090119060 A KR 1020090119060A KR 20090119060 A KR20090119060 A KR 20090119060A KR 101017349 B1 KR101017349 B1 KR 101017349B1
Authority
KR
South Korea
Prior art keywords
heat sink
circuit board
portion
formed
led lamp
Prior art date
Application number
KR1020090119060A
Other languages
Korean (ko)
Inventor
남기호
Original Assignee
테크룩스 주식회사
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Application filed by 테크룩스 주식회사 filed Critical 테크룩스 주식회사
Priority to KR1020090119060A priority Critical patent/KR101017349B1/en
Application granted granted Critical
Publication of KR101017349B1 publication Critical patent/KR101017349B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The bulb type LED lamp 1000 according to an embodiment of the present invention has a heat sink 500 in which a through space 580 is formed along its length direction. The bulb type LED lamp 1000 provides a driving circuit board coupling body 700 to receive and arrange the driving circuit board 100 in the through space 580 of the heat sink 500. LED board 600 is firmly coupled to the front surface of the heat sink (500).

Description

Bulb type LED lamp {Bulb type LED lamp}

The present invention relates to a bulb-type LED lamp, and more particularly to a bulb-type LED lamp that can be firmly assembled and reduced in volume with a simple configuration, and can efficiently achieve waterproofing and heat dissipation.

Currently, LED lamps are in the spotlight as a new lighting means. In this regard, it would be desirable if LED lamps had a shape similar to that of a conventional incandescent lamp and could be used as it is mounted in a conventional incandescent lamp socket. This is because in this case, the infrastructure having a conventional incandescent light bulb socket can be used as it is. For example, in the case of a living room lamp (현재) currently used incandescent light bulbs simply replace the incandescent light bulbs, such as to mount the LED lamp.

Such bulb type LED lamps require a driving circuit to convert the AC power input when mounted in the incandescent lamp socket into a direct current. The structure of the sieve is necessary.

In this connection, it would be desirable if the drive circuit and the heat sink could be placed in one integrated space to reduce the volume as a whole. It would also be desirable if the assembly structure could be combined simply and securely.

On the other hand, the bulb type LED lamp needs to be waterproof. In other words, when used in places such as bathrooms, freezing or refrigeration cases, it is necessary to make waterproofing so that external moisture or moisture does not penetrate into the interior. At this time, it would be desirable if the waterproof structure can achieve heat dissipation at the same time.

The present invention satisfies various requests for such bulb type LED lamps.

It is an object of the present invention to provide a bulb-type LED lamp that can be firmly assembled with a simple structure and that the heat sink and the driving circuit are present in an integrated space, thereby greatly reducing the volume as a whole. Another object of the present invention is to provide a bulb-type LED lamp that can achieve a waterproof and at the same time efficient heat dissipation.

In accordance with the object of the present invention, the present invention is a heat sink and a through space formed along the longitudinal direction; In order to accommodate and couple a drive circuit board formed with a drive circuit for driving the LED in the through space of the heat sink, a cover portion covering the rear of the through space of the heat sink, the coupling portion of the heat sink; A driving circuit board coupling body including a driving circuit board receiving body for receiving the driving circuit board; Here, the driving circuit board receptor is coupled to the cover portion, is arranged to be led through the space of the heat sink; An LED board installed at the front of the heat sink and mounted with a plurality of LED elements; It provides a bulb-type LED lamp comprising a light transmitting body covering the LED board in front of the heat sink.

According to the present invention, it is preferable that the driving circuit board is coupled to the driving circuit board receptor along its longitudinal direction.

In this case, the driving circuit board receptor may have a defect groove formed along the longitudinal direction of the driving circuit board receptor, and the driving circuit board may be coupled to the coupling groove.

According to the present invention, a screw coupling hole is formed on the front surface of the drive circuit board receptor, and a corresponding screw coupling hole is formed on the LED board corresponding to the screw coupling hole formed on the front surface of the drive circuit board receptor. The LED board may be coupled to a driving circuit board receiver accommodated in a through space of the heat sink by coupling a screw member through a corresponding screw coupling hole.

According to the present invention, the bulb-type LED lamp further comprises a socket coupling portion coupled to the socket coupler coupled to the incandescent bulb socket as disposed behind the radiator.

According to an exemplary embodiment of the present invention, the driving circuit board receptors are formed to face each other and include two guide rails each having a groove portion into which the driving circuit board is inserted along its length direction.

According to an embodiment of the present invention, the screw coupling hole is formed at each end of the two guide rails.

According to an embodiment of the present invention, the coupling portion with the heat dissipating member of the driving circuit board coupling body portion extends forward from the side of the cover portion and is a screw coupling portion having a screw portion formed around its outer circumference, and the screw coupling portion Corresponding screw portions are formed on the inner surface of the through space of the heat sink.

According to the present invention, it is preferable that the socket coupling portion is formed with a wiring fitting groove into which the power wiring drawn out from the driving circuit board is inserted and fitted.

According to the embodiment of the present invention, the socket coupling portion is integrally formed at the rear of the cover portion.

According to an exemplary embodiment of the present invention, the cover part and the socket coupling part penetrate through each other to form a through part, and a power terminal of the driving circuit board is led through the through part.

According to the exemplary embodiment of the present invention, a protrusion is formed in the groove of the guide rail, and the driving circuit board is formed with a receiving groove for receiving the protrusion at its side.

According to the present invention, the LED board is disposed on the front surface of the heat sink in contact with the front surface, covering the through space of the heat sink and is installed to contact the front surface of the heat sink and the light transmitting body and It is preferable that the heat sink member to be coupled is installed.

According to the present invention, it is preferable that a heat dissipation sheet is installed between the heat sink member and the LED board and between the heat sink member and the front surface of the heat sink.

According to the present invention, it is preferable that the heat sink member is screwed with the through space of the heat sink and the periphery of the light transmitting body, respectively.

According to an embodiment of the present invention, a lower protrusion part which is led into the through space of the heat sink is formed under the heat sink member so that the inner surface of the through space of the heat sink and the lower protrusion part are screwed together.

According to an embodiment of the present invention, an upper projection is formed around the periphery of the heat dissipation on the front surface of the heat sink, and an inlet space portion through which the upper protrusion of the heat sink is formed is formed at the lower portion of the heat sink. The inner surface of the inlet space portion and the upper protrusion of the heat sink are screwed together.

According to an embodiment of the present invention, an upper protrusion protruding upward is formed at an upper portion of the heat sink member, and a lower protrusion protruding downward is formed at a lower portion of the light-transmitting member such that the upper protrusion and the lower protrusion are screwed together. It is.

According to the present invention, it is preferable that the heat dissipation member is screwed with the through space of the heat dissipation member and the heat dissipation member is screwed with the periphery of the light transmitting body.

According to an embodiment of the present invention, the waterproofing is an O-ring is installed may be injecting a sealant to the other part is screwed.

According to the exemplary embodiment of the present invention, the heat sink member and the heat radiation sheet have a through hole through which the terminal of the LED board and the terminal of the driving circuit board pass.

According to the present invention, a through space is formed in the heat sink, and the driving circuit board coupling body is provided to accommodate the driving circuit board in the through space of the heat sink. In addition, the LED board in contact with the front surface of the heat sink is coupled. Accordingly, a simple structure enables a robust assembly, and the driving circuit board is accommodated inside the heat sink without taking up a separate space, thereby greatly reducing the total volume.

In addition, according to the present invention, by providing a heat sink member on the front surface of the heat sink and screwed it with the through space and the light-transmitting body of the heat sink, and each of the screw coupling portion is waterproofed, accordingly, the LED board Its heat dissipation efficiency is increased and waterproof can be achieved. That is, according to the provision of the heat sink member to increase the heat transfer efficiency and to achieve a waterproof treatment at the same time.

Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

1 is a view showing the appearance of the bulb-type LED lamp 1000 according to the first embodiment of the present invention.

First, the radiator 500 is provided, and the light transmitting body 800 is coupled to the radiator 500 by the coupling ring 200 in front of the radiator 500. The light transmitting body 800 has a hemispherical shape, but is not limited thereto.

It is seen that the LED board 600 is disposed inside the light emitting body 800. The LED board 600 is a plurality of LED elements (not shown) is mounted on the front (front surface). That is, the LED element emits light to form an illumination. In this regard, the light transmitting body 800 is transparent or translucent and preferably made of a light diffusion resin made by adding a light diffusing agent to a synthetic resin. As a result, the light emitted from the LED element is diffusely reflected while passing through the light-transmitting member 800 to enable illumination of uniform brightness.

The LED board 600 is formed with screw coupling holes 680 and 680, which are formed on the front surface of the driving circuit board receptor formed in front of the cover portion 710 of the driving circuit board coupling body 700 to be described later. Corresponding screw coupling holes corresponding to the screw coupling holes 748 and 748 '.

The heat dissipation member 500 is for dissipating heat from the LED element and dissipating it to the outside. In this embodiment, a plurality of heat dissipating ribs 507 are formed around the outer circumference thereof. As will be described later, the LED board 600 is placed in contact with the front surface 501 of the heat sink 500, the heat of the LED board 600 is transferred to the heat sink 500 is discharged to the outside. (See Fig. 5)

The socket coupler 300 is coupled to the rear side of the radiator 500. The socket coupler 300 is fitted into the incandescent lamp socket.

2 and 3 are exploded perspective view showing the internal structure of the bulb type LED lamp 1000 according to an embodiment of the present invention, Figure 5 is a bulb type LED lamp 1000 according to an embodiment of the present invention. Is a cross-sectional view of.

Referring to these drawings, first, the heat dissipation member 500 has a through space 580 formed along a longitudinal direction thereof.

According to the present invention, a driving circuit board coupling body 700 is provided to couple the driving circuit board 100 to the inside of the through space 580 of the heat dissipation member 500 and to heat the LED board 600 to the heat dissipation. In contact with the front of the sieve 500 is coupled. The driving circuit board 100 is formed with a driving circuit for driving the LED.

First, according to the present invention, the driving circuit board coupling body 700 has a cover portion 710 covering the rear of the through space 580 of the heat sink 500.

In addition, a driving circuit board receptor is formed in front of the cover part 710. The driving circuit board receiver accommodates the driving circuit board 100 and is inserted into the through space 580 of the heat sink 500. A screw coupling hole is formed on the front surface of the driving circuit board receptor. These screw coupling holes correspond to the corresponding screw coupling holes 680 and 680 of the LED board 600 described above.

In this embodiment, the driving circuit board receptor has two guide rails 740, 740 ′ extending forward from the cover part 710. These guide rails 740 and 740 'face each other, and grooves 747 and 747' are formed along the longitudinal direction thereof. The driving circuit board 100 is coupled by pushing the driving circuit board 100 into the grooves 747 and 747 '.

Referring to FIG. 4, protrusions 749 and 749 ′ are formed in grooves 747 and 747 ′ of the guide rails 740 and 740 ′, and the driving circuit board 100 protrudes from the sides thereof. It is preferable that accommodation grooves 109 and 109 'are formed to accommodate the portions 749 and 749'.

Accordingly, when the driving circuit board 100 is pushed into the grooves 747 and 747 'of the guide rails 740 and 740', the protrusions 749 and 749 'and the receiving groove 109 are pushed. As the 109 'is coupled, the driving circuit board 100 is firmly coupled to the grooves 747 and 747' of the guide rails 740 and 740 '.

Bundles 74 and 74 'are formed at respective ends of the grooves 740 and 740' of the guide rails 740 and 740 ', and the screws are attached to the bundles 74 and 74'. Coupling holes 748 and 748 'are formed.

The drive circuit board coupling body 700 also has a coupling portion with the radiator to be coupled to the radiator 500. In the present embodiment, the coupling portion with the heat dissipating member is a screw coupling portion 750 extending forward from the side of the cover portion 710. The screw coupling portion 750 has a screw portion 758 formed around the outer circumference thereof, and a corresponding screw portion 558 is formed on an inner surface of the through space 580 of the heat dissipator 500 corresponding to the screw coupling portion 750. ) Is formed.

Accordingly, the screw portion 758 of the screw coupling portion 750 of the cover portion 710 and the corresponding screw portion 558 of the inner surface of the through space 580 of the heat sink 500 are coupled to each other to couple the driving circuit board. Body 700 is coupled to the radiator 500.

According to the above-described structure, the driving circuit board 100 is accommodated between the guide rails 740 and 740 'formed at the front of the cover portion 710, and screwing holes 748 at the end of each guide rail. A driving circuit board receiver having a 748 'formed therein is introduced into the through space 580 of the heat dissipation member 500, and the screw portion 758 of the screwing portion 750 of the cover portion 710 and the heat dissipation. Corresponding screw portions 558 on the inner surface of the through space 580 of the sieve 500 are coupled to each other. Then, the driving circuit board coupling body 700 is coupled to the heat dissipation member 500 so that the driving circuit board 100 is accommodated in the through space 580. In this case, the screw coupling holes 748 and 748 ′ of the ends of the guide rails 740 and 740 ′ correspond to the corresponding screw coupling holes 680 and 680 of the LED board 600.

The LED board 600 is disposed in contact with the front surface 501 of the heat sink 500. According to the present embodiment, the heat dissipation lip 507 of the heat sink 501 is the heat sink 500 The protrusion 560 is formed to protrude beyond the front surface 501 of the front surface 501 to form a seating surface from the inside of the protrusion 560.

In this way, the LED board 600 is placed in contact with the front surface 501 of the heat dissipation member 500 constituting the mounting surface, at this time, the screw coupling hole 748 of the drive circuit board coupling body 700 ( 748 ′ and the corresponding screw coupling holes 680 and 680 of the LED board 600 correspond to each other.

A screw member (not shown) is coupled through the through holes 748, 680, 748 ′ and 680, so that the LED board 600 contacts the front surface of the heat sink 500. It is coupled to the heat sink 500.

The above-described light transmitting body 800 is coupled to the front of the heat sink 500. Referring to FIG. 5, a side protrusion part 810 is formed at the side of the light emitting body 800, and the Grooves 510 are formed on the side surfaces thereof, and coupling rings 500 are inserted therebetween so that the radiator 500 and the light transmitting body 800 are coupled to each other. At this time, the coupling groove 820 is formed on the inner surface of the light-transmitting member 800 is fitted with a rubber ring 20 for waterproof or moisture proof.

According to the present invention, the socket coupling portion is disposed at the rear of the heat sink 500. The socket coupling portion is coupled to the socket coupler 300 coupled to the incandescent bulb socket.

In this embodiment, the socket coupling portion 730 is integrally formed at the rear of the cover portion 710.

In addition, the cover part 710 and the socket coupling part 730 penetrate each other, and a through part 708 is formed, and the power terminal part 105 of the driving circuit board 100 is the through part 708. Is being imported through). (See FIG. 4) Power wirings are drawn from the power terminal 105 of the driving circuit board 100 and connected to the socket coupling part 730.

As described above, according to the present invention, the through space 580 is formed in the heat dissipator 500, and the driving circuit board coupling body 700 is provided to thereby drive the driving circuit board 100 to the heat dissipation body 500. It is placed in the through space 580 of the). In addition, the LED board 600 is in contact with and coupled to the front surface 501 of the heat sink 500.

Accordingly, a simple structure enables a robust assembly, and the driving circuit board is accommodated inside the heat sink without taking up a separate space, thereby greatly reducing the total volume.

A second embodiment of the present invention will now be described.

5 and 6 show an LED lamp 2000 of the bulb type according to the second embodiment of the present invention.

As in the first embodiment, a heat sink 500 having a through space 580 is provided, and the driving circuit board coupling body 700 ′ inserted into the through space 580 of the heat sink 500 is disposed. Is provided.

According to the present embodiment, the driving circuit board coupling body 700 ′ has a cylindrical shape as a whole, and a front portion thereof is cut to form a space portion 7488, and a driving groove having a shape in which an incision groove 7480 is formed on an opposite surface thereof. It has a low substrate receptor 7400.

The driving circuit board receiving member 7400 has grooves 7401 and 7402 formed on its inner surface to face each other along the longitudinal direction, and the driving circuit board 100 'is fitted into and coupled thereto.

A cover portion 710 is formed below the driving circuit board receiving member 7400 to cover the rear of the through space 580 of the heat dissipator 500. The screw coupling unit includes a screw 758 formed around the outer circumference thereof. A portion 750 is formed. The screw coupling portion 750 forms a coupling portion with the radiator 500, and is coupled with a corresponding screw portion 558 formed on an inner surface of a lower portion of the through space 580 of the radiator 500. (See Figures 9 and 10)

A socket coupling part 730 is integrally formed at the rear of the cover part 710, and the socket coupling part 730 is coupled to the socket coupler 300 which is fitted into the incandescent lamp socket.

The cover part 710 and the socket coupling part 730 penetrate through each other, and a through part 708 is formed so that power wiring of the driving circuit board 100 ′ is drawn out therethrough.

According to the present invention, the power wiring is inserted into the wiring fitting groove 739 formed in the socket coupling portion 730 is coupled. In this state, when the socket coupling part 730 is coupled to the socket coupler 300, the power wiring is compressed by the socket coupler 300 and thus may be energized thereto.

An LED board 600 'on which a plurality of LED elements 601 are mounted is installed on the front surface of the heat sink 500, and a light transmitting body 800' is installed.

According to the present invention, the heat sink member 400 is installed on the front surface of the heat sink 500 is folded, the LED board 600 'is disposed in contact with the front surface of the heat sink member 400. In this case, the heat sink member 400 covers the through space 580 of the heat sink 500. In addition, the heat sink member 400 is coupled to the light transmitting body (800 ').

Accordingly, the heat generated from the LED board 600 'can be efficiently released. According to the first embodiment, the above-described LED board 600 is disposed on the front surface of the heat sink 500, wherein the portion corresponding to the through space 580 does not come into contact with the heat conduction efficiency is reduced by that much. . However, in the second embodiment, the heat sink member 400 is installed on the front surface of the heat sink 500 so as to cover the through space 580, so that heat transfer occurs through this portion so that heat dissipation can be made more efficiently. Doing.

According to this embodiment, the heat dissipation sheet 81 is placed between the heat sink member 400 and the LED board 600 '. In addition, the heat dissipation sheet 83 is placed between the heat sink member 400 and the front surface of the heat sink 500. This further doubles the heat transfer efficiency.

Passing holes 408, 818, and 838 through which the terminal 610 of the LED board and the terminal 106 of the driving circuit board pass are formed in the heat sink member 400 and the heat sink sheets 81 and 83. It is.

According to the present invention, the heat sink member 400 is screwed into the periphery of the through space 580 and the light emitting body 800 'of the heat sink 500, respectively, these heat sinks 500 and the light transmitting body Combined with 800 '.

First, a lower protrusion 420 is formed in the lower portion of the heat sink member 400 to be introduced into the through space 580 of the heat sink, and the inner surface and the lower protrusion 420 of the through space 580 of the heat sink. Are screwed together.

In the present exemplary embodiment, the lower protrusion 420 has a circular shape, and a threaded portion 428 is formed around the outer circumference thereof, and correspondingly, the corresponding screw portion 528 is formed on the inner surface of the through space 580 of the heat sink. Formed and they are joined to each other.

The heat dissipation member 400 and the through space 580 of the heat dissipator 500 may be screwed to each other in various ways in addition to the above-described method. For example, although not shown, an upper protrusion is formed around the through space 580 on the front surface of the heat sink 500, and an upper part of the heat sink 500 is disposed below the heat sink member 400. An inlet space portion into which the protrusion is drawn may be formed, and an inner surface of the inlet space portion of the bottom surface of the heat sink member 400 and an upper protrusion of the heat sink 500 may be screwed together.

In addition, an upper protrusion 410 protruding upward is formed on an upper portion of the heat sink member 400, and a lower protrusion 810 protruding downward is formed on a lower portion of the light-transmitting member 800 ′, so that these upper protrusions 410 are formed. ) And the lower protrusion 810 are screwed together and the heat sink member 400 is coupled to the light transmitting body (800 '). That is, a screw portion 418 is formed on the upper protrusion 410 of the heat sink member 400, and corresponding screw portions 818 are formed on the lower protrusion 810 of the light projector 800 ′ correspondingly. Are being combined.

The heat sink member 400 and the light transmitting body 800 ′ may be coupled to each other in various ways in addition to each other.

In the present embodiment, the upper protrusion 410 of the heat sink member protrudes in a circular shape around the heat sink member 400 so that the heat dissipation sheet 81 and the LED board 600 ′ on the flat plate portion 440 therein. ) Is settling.

In addition, the upper protrusion 410 of the heat sink member 400 also extends to the lower portion of the plate member 44 to form a lower periphery portion 450 to contact the upper side surface 509 of the heat sink 500. (See FIG. 9)

According to the present invention, the heat dissipation member 400 is screwed with the through-space 580 of the heat dissipation member 500 and the heat dissipation member 400 is screwed around the periphery of the light emitting member 800 ' The parts to be joined are each waterproof.

That is, the screw portion 428 of the lower protrusion 420 of the heat sink member 400 and the corresponding screw portion 528 formed on the inner surface of the through space 580 of the heat sink 500 are in contact with each other. O-ring (53) is installed to ensure waterproofing.

In addition, the O-ring in contact with the threaded portion 418 of the upper protrusion 410 of the heat sink member 400 and the corresponding screw portion 818 formed on the lower protrusion 810 of the light emitting body 800 ′ corresponding thereto are in contact with each other. (O-ring) 51 is provided to ensure waterproofing.

Such waterproofing can be accomplished in various ways, for example, by injecting a sealant into the screwed portion. Examples of such sealants may be the trade name Loctite products.

9 is a cross-sectional view of a bulb type LED lamp 2000 according to a second embodiment of the present invention, Figure 10 is a light emitting body of the bulb type LED lamp 2000 according to a second embodiment of the present invention ( 800 '), the heat sink member 400, and the heat sink 500 and the O-ring 51, 53 is a cross-sectional view showing the structure.

As described above, according to the second embodiment of the present invention, the heat dissipation member 400 is provided on the front surface of the heat dissipator 500, and the through space 580 of the heat dissipator 500 and the light transmitting body 800 ′ are provided. Screwed) and water-resistant to each screwed portion, thereby increasing the heat dissipation efficiency of the LED board 600 'and achieving waterproofing. That is, according to the provision of the heat sink member to increase the heat transfer efficiency and to achieve a waterproof treatment at the same time. The heat sink member 400 is preferably made of aluminum material having high thermal conductivity.

It will be appreciated that this has been achieved the object of the present invention. Although the invention has been described with reference to the examples, the scope of rights is not limited thereto and is defined by the following claims.

1 is a view showing the appearance of a bulb-type LED lamp according to a first embodiment of the present invention;

2 and 3 are exploded perspective view showing the internal structure of the bulb-type LED lamp according to the first embodiment of the present invention;

4 is a view showing in detail the structure of the drive circuit board receptor formed in front of the cover in the bulb type LED lamp according to the first embodiment of the present invention;

5 is a cross-sectional view of the bulb type LED lamp according to the first embodiment of the present invention;

6 and 7 are exploded perspective view of the LED lamp of the bulb type according to the second embodiment of the present invention;

8 is a view showing a wiring fitting groove of the socket coupling portion in the LED lamp of the bulb type according to the second embodiment of the present invention;

9 is a cross-sectional view of the bulb type LED lamp according to the second embodiment of the present invention;

10 is a cross-sectional view showing the structure of the components of the LED lamp of the bulb type according to the second embodiment.

Claims (22)

  1. (a) a heat sink having a through space formed along the longitudinal direction thereof;
    (b) receiving and coupling a driving circuit board having a driving circuit for driving an LED in a through space of the heat sink;
    (b1) a cover part covering a rear side of the through space of the heat sink;
    (b2) a coupling portion with the heat sink,
    (b3) a driving circuit board coupling body formed in front of the cover part and including a driving circuit board receiving body for receiving the driving circuit board;
    (c) an LED board installed at the front of the heat sink and mounted with a plurality of LED elements; Here, the driving circuit board receiving member is arranged to be led through the space of the heat sink; A screw coupling hole is formed on the front surface of the drive circuit board receptor, and a corresponding screw coupling hole corresponding to a screw coupling hole formed on the front surface of the drive circuit board receptor is formed on the LED board to penetrate the screw coupling hole and the corresponding screw coupling hole. By coupling the screw member so that the LED board is coupled to the drive circuit board receptor accommodated in the through space of the heat sink; The coupling portion of the driving circuit board coupling body with the heat dissipation body extends forward from the side of the cover portion, and is a screw coupling portion having a threaded portion surrounding the outer circumference thereof, and a through space of the heat sink corresponding to the screw coupling portion. A corresponding threaded portion is formed on the inner surface of the end portion;
    (d) a bulb type LED lamp comprising a light transmitting body covering the LED board in front of the heat sink.
  2. The method of claim 1,
    The LED lamp of the bulb type, characterized in that the drive circuit board is coupled to the drive circuit board receptor along its length direction.
  3. The method of claim 2,
    The LED lamp of the bulb type, characterized in that the drive circuit board receptor is formed with a coupling groove in the longitudinal direction is coupled to the drive circuit board to the coupling groove.
  4. delete
  5. The method according to any one of claims 1 to 3,
    The driving circuit board coupling body is disposed in the rear of the radiator bulb type LED lamp characterized in that it further comprises a socket coupling portion coupled with the socket coupler coupled to the incandescent bulb socket.
  6. The method according to any one of claims 1 to 3,
    The LED lamp of the bulb type, characterized in that the drive circuit board receptors are facing each other and formed with two guide rails in which the driving circuit board is drawn along the longitudinal direction thereof.
  7. The method of claim 6,
    Bulb type LED lamp, characterized in that the screw coupling hole is formed at each end of the two guide rails.
  8. delete
  9. The method of claim 5,
    Bulb type LED lamp, characterized in that the socket coupling portion is formed with a wiring fitting groove is inserted into the power wiring drawn out from the driving circuit board is coupled.
  10. 10. The method of claim 9,
    Bulb-type LED lamp, characterized in that the socket coupling portion is formed integrally with the cover unit.
  11. The method of claim 10,
    Bulb type LED lamp, characterized in that the through and the socket coupling portion penetrates through each other so that the power terminal of the driving circuit board is led through the through portion.
  12. The method of claim 6,
    Bulb type LED lamp, characterized in that the projection portion is formed in the groove portion of the guide rail and the driving circuit board is provided with a receiving groove for receiving the projection portion on its side.
  13. The method according to any one of claims 1 to 3,
    The bottom surface of the heat sink is disposed so as to be in contact with the front surface of the heat sink, and the top surface is arranged to be in contact with the bottom surface of the LED board, the through space of the heat sink and the periphery of the light transmitting body. Bulb type LED lamp characterized in that it further has a heat sink member screwed to each part.
  14. The method of claim 13,
    Bulb type LED lamp, characterized in that the heat radiation sheet is installed between the heat sink member and the LED board, and between the heat sink member and the front surface of the heat sink.
  15. delete
  16. The method of claim 13,
    A bulb-type LED lamp, characterized in that the lower protrusion portion is formed in the lower portion of the heat sink member to be penetrated into the through space of the heat sink, the inner surface of the through space of the heat sink and the lower protrusion is screwed to each other.
  17. The method of claim 13,
    An upper protrusion is formed on the front surface of the heat sink to surround the periphery of the through space, and a lower lead space portion is formed at a lower portion of the heat sink member to allow the upper protrusion of the heat sink to enter. Bulb type LED lamp, characterized in that the upper projection is screwed together.
  18. The method of claim 13,
    Bulb type LED lamps, characterized in that the upper protrusions protruding upwardly formed on the upper portion of the heat sink member, and the lower protrusions protruding downwardly formed on the lower portion of the light transmitting body, and the upper protrusions and the lower protrusions are screwed together. .
  19. The method of claim 13,
    Bulb-type LED lamp, characterized in that the heat sink member is screwed into the through space of the heat sink and the heat sink member is screwed with the circumferential portion of the light emitting body, respectively.
  20. The method of claim 19,
    The waterproofing bulb type LED lamp, characterized in that the O-ring is installed.
  21. The method of claim 19,
    The waterproof treatment is a bulb type LED lamp, characterized in that the sealing agent is injected into the portion to be screwed.
  22. The method of claim 14,
    Bulb type LED lamp, characterized in that the heat sink member and the heat dissipation sheet has a through hole through which the terminal of the LED board and the terminal of the driving circuit board passes.
KR1020090119060A 2009-12-03 2009-12-03 Bulb type led lamp KR101017349B1 (en)

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US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
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US8227961B2 (en) 2010-06-04 2012-07-24 Cree, Inc. Lighting device with reverse tapered heatsink
KR101238862B1 (en) * 2011-06-09 2013-03-11 (주)씨티엘네트웍스 Illuminating apparatus using led and method for manufacturing the same
EP2554893A1 (en) * 2011-08-04 2013-02-06 Ledpower LED lamp device and automated method for manufacturing said device
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KR101136975B1 (en) 2011-08-16 2012-04-19 이화진 Led lamp radiation structure of heat with hole
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WO2013042008A3 (en) * 2011-09-23 2013-06-06 Koninklijke Philips Electronics N.V. Lighting device with a circuit board mounting
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KR101264213B1 (en) 2011-12-12 2013-05-14 주식회사모스토 An assembling led light bulb
EP2814677B1 (en) * 2012-02-15 2017-01-11 Floor Master System for reducing roll and pitch in a utility vehicle
KR101198398B1 (en) * 2012-03-26 2012-11-08 대원루스터 주식회사 LED lighting lamp that improve object sensing and illumination sensing reaction
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CN103968278A (en) * 2013-01-29 2014-08-06 吴铭远 Modular LED lamp structure
CN104235797A (en) * 2013-06-24 2014-12-24 欧司朗有限公司 Lighting device
KR101472463B1 (en) * 2014-05-13 2014-12-15 장영환 LED lighting apparatus

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