JP6277014B2 - Light bulb type lighting device - Google Patents

Light bulb type lighting device Download PDF

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Publication number
JP6277014B2
JP6277014B2 JP2014037687A JP2014037687A JP6277014B2 JP 6277014 B2 JP6277014 B2 JP 6277014B2 JP 2014037687 A JP2014037687 A JP 2014037687A JP 2014037687 A JP2014037687 A JP 2014037687A JP 6277014 B2 JP6277014 B2 JP 6277014B2
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light
heat
flow path
storage case
cover member
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JP2015162395A (en
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中里 典生
典生 中里
岡田 隆
隆 岡田
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Hitachi Appliances Inc
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Hitachi Appliances Inc
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

本発明は、電球型照明装置に関する。   The present invention relates to a light bulb type lighting device.

LED(Light Emitting Diode)などの半導体素子を有する発光体を備えた電球型照明装置は、白熱電球と比較して長寿命化・省エネルギー化を図ることができるため、近年注目が集まっている。LEDを用いた電球型照明装置では、高輝度化及び高信頼性のために、放熱性の高い構造が望まれている。   2. Description of the Related Art A light bulb-type lighting device including a light emitter having a semiconductor element such as an LED (Light Emitting Diode) has attracted attention in recent years because it can achieve a longer life and energy saving than an incandescent light bulb. In a bulb-type lighting device using an LED, a structure with high heat dissipation is desired for high brightness and high reliability.

例えば特許文献1、あるいは、特許文献2には、筐体と、電源部と、発光部と、透光性カバーを備え、筐体に設けられた通気孔と透光性カバーに設けられた通気孔を連通する空間を有する電球型照明装置が記載されている。   For example, Patent Literature 1 or Patent Literature 2 includes a housing, a power supply unit, a light emitting unit, and a translucent cover, and a ventilation hole provided in the housing and a communication provided in the translucent cover. A light bulb type illumination device having a space communicating with pores is described.

また特許文献3、あるいは、特許文献4には、筐体と、電源部と、発光部と、透光性カバーを備え、筐体を貫通する空間を有し、発光部の気密性を有する電球型照明装置が記載されている。   Patent Document 3 or Patent Document 4 includes a housing, a power supply unit, a light emitting unit, and a light-transmitting cover, has a space that penetrates the housing, and has an airtightness of the light emitting unit. A mold illumination device is described.

特表2013−501343号公報Special table 2013-501343 gazette 特開2012−195127号公報JP 2012-195127 A 特開2004−296245号公報JP 2004-296245 A WO2009−044716号公報WO2009-044716

より一層、放熱性の高い構造が望まれている。本発明は、放熱性の高い構造を有した電球型照明装置を提供することを目的とする。   A structure with higher heat dissipation is desired. An object of this invention is to provide the lightbulb-type illuminating device which has a structure with high heat dissipation.

前記課題を解決するために、本発明は、一つ又は複数の半導体素子を有する発光体と、前記発光体を覆うカバー部材と、前記発光体で発生する熱を放出する放熱体と、前記半導体素子を発光させる電源回路基板と、一端面から他端面まで連通する筒状であり、かつ前記電源回路基板を前記一端面から収納する収納ケースと、前記収納ケースの一端側に取り付けられる口金と、前記発光体と前記放熱体の間に配置し前記発光体で発生する熱を放熱体に伝えるヒートシンクを備え、前記カバー部材に漏斗状の通気口を有し、前記ヒートシンクは前記発光体の中心部を貫通する円筒部を有し前記カバー部材の漏斗状の通気口に連通する空気流路を有し、前記円筒部の他端は前記ヒートシンクと前記収容ケースとの間に設けられた空気流路に接続し、円筒内の流路に直交し放射状の流路を形成し、前記放射状の流路の端部において、前記収納ケースの側面と前記の放熱体の内壁面との間に設けられ前記放射状の流路と直交する空気流路を接続し、他端を口金近傍に設けた通気口となるように空気流路を連通させ、前記カバー部材は前記円筒部の外側を覆うことを特徴とする。

In order to solve the above problems, the present invention provides a light emitter having one or a plurality of semiconductor elements, a cover member covering the light emitter, a heat radiator that releases heat generated in the light emitter, and the semiconductor. A power circuit board that emits light from the element, a cylindrical shape that communicates from one end surface to the other end surface, and a storage case that stores the power circuit board from the one end surface; a base that is attached to one end side of the storage case; A heat sink disposed between the light emitter and the heat dissipator for transmitting heat generated by the light emitter to the heat dissipator; the cover member having a funnel-shaped vent; and the heat sink is a central portion of the light emitter An air passage that communicates with the funnel-shaped vent of the cover member, and the other end of the cylindrical portion is provided between the heat sink and the housing case. Connected to A radial flow path is formed orthogonal to the flow path in the cylinder, and the radial flow path is provided between the side surface of the storage case and the inner wall surface of the heat radiating body at the end of the radial flow path. The air flow path is connected so that the air flow path is orthogonal to the other end, and the other end becomes a vent provided in the vicinity of the base , and the cover member covers the outside of the cylindrical portion .

本発明により、放熱性の高い構造を有した電球型照明装置を提供することができる。   According to the present invention, it is possible to provide a bulb-type lighting device having a structure with high heat dissipation.

電球型照明装置の外観正面図である。It is an external appearance front view of a light bulb type illuminating device. 図1に示される電球型照明装置の縦断面図である。It is a longitudinal cross-sectional view of the light bulb type illuminating device shown in FIG. 図2に示される電球型照明装置の分解縦断面図である。It is a decomposition | disassembly longitudinal cross-sectional view of the lightbulb type illuminating device shown by FIG. 図3に示される電源回路基板と収容ケースの分解縦断面図である。FIG. 4 is an exploded longitudinal sectional view of a power circuit board and a housing case shown in FIG. 図1に示される電球型照明装置の別の部分における縦断面図である。It is a longitudinal cross-sectional view in another part of the lightbulb-type illuminating device shown by FIG. 図5に示される電球型照明装置の別の部分における分解縦断面図である。FIG. 6 is an exploded longitudinal sectional view of another part of the light bulb type illumination device shown in FIG. 5. 図1に示される電球型照明装置のネジ固定部における縦断面図である。It is a longitudinal cross-sectional view in the screw fixing | fixed part of the lightbulb type illuminating device shown by FIG. 図1に示される電球型照明装置の熱放射の経路を示す縦断面図である。It is a longitudinal cross-sectional view which shows the path | route of the thermal radiation of the lightbulb type illuminating device shown by FIG. 図1に示される電球型照明装置の発光部における光線の経路を示す縦断面図である。It is a longitudinal cross-sectional view which shows the path | route of the light ray in the light emission part of the lightbulb-type illuminating device shown by FIG.

本発明の実施形態について、適宜図面を参照しながら詳細に説明する。なお、各図において、共通する部分には同一の符号を付し、重複した説明を省略する。また、本実施形態では図1に示すような電球型照明装置100の向きを上下方向とする。   Embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In each figure, common portions are denoted by the same reference numerals, and redundant description is omitted. In the present embodiment, the direction of the light bulb-type lighting device 100 as shown in FIG.

図1は、電球型照明装置の外観斜視図である。図2は、電球型照明装置の縦断面図である。図3は、電球型照明装置の分解縦断面図である。
<電球型照明装置100>
電球型照明装置100は、半導体発光素子としてのLED9を有する発光体8と、発光体8を覆うカバー部材1と、発光体8で発生する熱を放出する放熱筐体2と、発光体8と放熱筐体2の間に配置され発光体8の熱を受け、その一部を放熱筐体2に伝えるヒートシンク7と、口金3と、を備えている。カバー部材1は下部にカバー通気口11を有している。放熱筐体2と収納ケース5との間に通気口23を有している。後述するが、カバー通気口11と通気口23は連通している。
<放熱筐体2>
放熱筐体2は、上方に向けて縮径する外形を有する中空かつ筒状の部材であり、下面に溝部21を備えている。溝部21については後記する。
FIG. 1 is an external perspective view of a bulb-type lighting device. FIG. 2 is a longitudinal sectional view of the light bulb type lighting device. FIG. 3 is an exploded vertical sectional view of the light bulb type lighting device.
<Light bulb type lighting device 100>
The light bulb-type lighting device 100 includes a light emitter 8 having an LED 9 as a semiconductor light emitting element, a cover member 1 that covers the light emitter 8, a heat radiating housing 2 that releases heat generated by the light emitter 8, and a light emitter 8. A heat sink 7 that is disposed between the heat radiating housing 2 and receives heat from the light emitter 8 and transmits part of the heat to the heat radiating housing 2 and a base 3 are provided. The cover member 1 has a cover vent 11 at the bottom. A vent 23 is provided between the heat radiating housing 2 and the storage case 5. As will be described later, the cover vent 11 and the vent 23 communicate with each other.
<Heat dissipation housing 2>
The heat radiating housing 2 is a hollow and cylindrical member having an outer shape whose diameter is reduced upward, and includes a groove portion 21 on the lower surface. The groove 21 will be described later.

なお、放熱筐体2は、筒状の胴部と、胴部と一体成形され、軸線を中心として放射状に配置された複数のフィンと、を備えていてもよい。それぞれのフィンが胴部の外周面から径方向外向きに突出し、かつ、軸線方向に延在するように配置することによって、放熱筺体2の放熱性能を向上させることができる。
<カバー部材1>
カバー部材1は、ドーム形状の外形を有する部材である。カバー部材1における下部にはカバー通気口11が設けられており、カバー通気口11から上方に向けて縮径する漏斗状の傾斜面12も設けられている。カバー部材1における上部は開口しており、その開口を形成するように略円形の開口端部14が形成されている。
The heat radiating housing 2 may include a cylindrical body portion and a plurality of fins integrally formed with the body portion and arranged radially about the axis. By disposing the fins so as to protrude radially outward from the outer peripheral surface of the body portion and extend in the axial direction, the heat dissipation performance of the heat dissipation housing 2 can be improved.
<Cover member 1>
The cover member 1 is a member having a dome-shaped outer shape. A cover vent 11 is provided at the lower part of the cover member 1, and a funnel-shaped inclined surface 12 having a diameter decreasing upward from the cover vent 11 is also provided. The upper part of the cover member 1 is open, and a substantially circular opening end 14 is formed so as to form the opening.

カバー部材1は、ドーム部19の一端である上方向の開口端部14と、開口端部14から下方向に行くにつれなだらかに径が広がった後に径が小さくなるドーム部19と、ドーム部19の他端である下方向のカバー通気口11と、カバー通気口11からカバー部材1の内部でかつ上方向に向かって縮径し漏斗状となる傾斜面12と、傾斜面12の端部で略円形の管接続部13と、を備えている。本実施形態において、管接続部13はカバー部材1の内部に位置しており、開口端部14からは突出しない構造である。これは、後述するヒートシンク7の管状接続部71との接続を容易とするためである。なお、図中の上下を反転させると、カバー部材1はドーム形状をしており、その場合、カバー通気口11はカバー部材1の天頂部に設けられているといえる。カバー部材1は、PC(ポリカーボネート)などの樹脂製又はガラス製であり、発光体8に向けて開口している。ちなみに、カバー部材1には、発光体8からの光を拡散させる光拡散材が含有されていてもよい。カバー部材1と放熱筺体2とは、カバー部材1の開口端部14を放熱筐体2の溝部21に差し込み接着材などにより固定される。カバー通気口11から管接続部13までの空間をカバー空気流路とする。冷たい外気を直接ヒートシンク7に導くことができるので放熱効果が高い。   The cover member 1 includes an upward opening end 14 that is one end of the dome 19, a dome 19 that gradually decreases in diameter as it goes downward from the opening 14, and a dome 19 that decreases in diameter. A lower cover vent 11 which is the other end of the cover, an inclined surface 12 having a diameter reduced from the cover vent 11 to the inside of the cover member 1 and upward, and having a funnel shape, and an end of the inclined surface 12. A substantially circular pipe connecting portion 13. In the present embodiment, the pipe connecting portion 13 is located inside the cover member 1 and has a structure that does not protrude from the open end portion 14. This is for facilitating connection with a tubular connection portion 71 of the heat sink 7 described later. In addition, when the upper and lower sides in the figure are reversed, it can be said that the cover member 1 has a dome shape, and in that case, the cover vent 11 is provided at the top of the cover member 1. The cover member 1 is made of resin such as PC (polycarbonate) or glass, and opens toward the light emitter 8. Incidentally, the cover member 1 may contain a light diffusing material that diffuses light from the light emitter 8. The cover member 1 and the heat radiating housing 2 are fixed by inserting the opening end portion 14 of the cover member 1 into the groove portion 21 of the heat radiating housing 2 with an adhesive or the like. A space from the cover vent 11 to the pipe connecting portion 13 is defined as a cover air flow path. Since the cold outside air can be directly guided to the heat sink 7, the heat radiation effect is high.

図2に示すように、カバー部材1と放熱筐体2との間には、発光体8、ヒートシンク7などが位置している。発光体8は、LED9(半導体素子)と、基板80と、を備えている。発光体8は中心部に穴が設けられた略円形である。基板80の中心部に貫通穴81が設けられている。
<ヒートシンク7>
ヒートシンク7は、中央に開口7a1を有する略円板状の平面部7aと、平面部7aの開口7a1の縁から平面部7aに対して略垂直に立ち上がる中空の略管形状の管状接続部71と、からなる部品である。管状接続部71内の空間を管内空気流路72とする。発光体8からの熱が管状接続部71まで伝搬し、管内空気流路72内の空気に熱伝達する。加熱された空気は膨張し外気よりも密度が小さくなることにより浮力を生じ、管内空気流路72内の空気の流れの駆動力となっている。
<光源8>
光源8は、中央に貫通穴81を有する略円板状の基板80と、基板80に設けられるLED9と、から構成されている。
As shown in FIG. 2, a light emitter 8, a heat sink 7, and the like are located between the cover member 1 and the heat radiating housing 2. The light emitter 8 includes an LED 9 (semiconductor element) and a substrate 80. The light emitter 8 is substantially circular with a hole in the center. A through hole 81 is provided at the center of the substrate 80.
<Heatsink 7>
The heat sink 7 includes a substantially disc-shaped flat surface portion 7a having an opening 7a1 in the center, and a hollow substantially tubular tubular connection portion 71 that rises substantially perpendicularly to the flat surface portion 7a from the edge of the opening 7a1 of the flat surface portion 7a. This is a part consisting of A space in the tubular connection portion 71 is defined as an in-tube air flow path 72. Heat from the light emitter 8 propagates to the tubular connection portion 71 and transfers heat to the air in the pipe air flow path 72. The heated air expands and has a density lower than that of the outside air, thereby generating buoyancy, and serves as a driving force for the air flow in the pipe air flow path 72.
<Light source 8>
The light source 8 includes a substantially disc-shaped substrate 80 having a through hole 81 in the center, and an LED 9 provided on the substrate 80.

基板80の表面には、LED9に接続される所定のパターンが形成されている。   A predetermined pattern connected to the LEDs 9 is formed on the surface of the substrate 80.

LED9に用いられる発光素子としては、例えば青色光を発するものが使用される。それぞれのLED9は、例えばシリコーン樹脂などの透明の封止樹脂により被覆されている。この封止樹脂内には、LED9から放出される光を色変換する蛍光体が混入されている。蛍光体としては、例えば黄色発光のものが用いられ、当該蛍光体によってLED9からの青色光が色変換されて、白色光となる。なお、LED9は、光の取り出し効率を向上させるために、半球状のレンズで覆われていてもよい。なお、LED9の代わりに発光素子をパッケージに搭載し蛍光体が混入された封止樹脂で表面実装タイプの白色発光のLED部品に置き換えて基板80にはんだ実装してもよい。
<接続>
ヒートシンク7と光源8とは、ヒートシンク7の管状接続部71が光源8の貫通穴81を貫き、ヒートシンク7の平面部7aの一方の面に光源8の基板80がネジ止め等されることにより取り付けられる。
As a light emitting element used for LED9, what emits blue light, for example is used. Each LED 9 is covered with a transparent sealing resin such as a silicone resin. In this sealing resin, a phosphor for color-converting light emitted from the LED 9 is mixed. As the phosphor, for example, a material emitting yellow light is used, and the blue light from the LED 9 is color-converted by the phosphor and becomes white light. The LED 9 may be covered with a hemispherical lens in order to improve the light extraction efficiency. Instead of the LED 9, a light emitting element may be mounted on a package and replaced with a surface mount type white light emitting LED component with a sealing resin mixed with a phosphor and solder mounted on the substrate 80.
<Connection>
The heat sink 7 and the light source 8 are attached by the tubular connection portion 71 of the heat sink 7 passing through the through hole 81 of the light source 8 and the substrate 80 of the light source 8 is screwed to one surface of the flat surface portion 7a of the heat sink 7. It is done.

ヒートシンク7の管状接続部71は、カバー部材1の漏斗状の傾斜面12の管接続部13とつながって、カバー部材1のカバー通気口11とヒートシンク7の管内空気流路72を連通する。
<電源回路基板4>
電源回路基板4は、複数の電子部品(図示せず)が基板に実装されたものである。電源回路基板4は、近傍にコンデンサ(図示せず)が設置されている。また、電源回路基板4は、商用電源からの交流電力を直流電力に整流する回路、整流後の直流電力の電圧を調整する回路などを備えている。
<収納ケース5>
図4は電源回路基板と収容ケース5の分解縦断面図である。図5は図2とは異なる電球型照明装置100の縦断面図である。図6は図5の分解縦断面図である。収納ケース5は、例えば、PBT(ポリブチレンテレフタレート)やPC(ポリカーボネート)などの樹脂製である。収納ケース5は一端面(下方向側の面)から他端面(上方向側の面)まで連通する筒状である。電源回路基板4は収納ケース5の一端面側(下方向側)から収納される。収納ケース5は、横断面が略楕円形状である(図示せず)。収納ケース5の内壁には、電源回路基板4をそれぞれ保持する保持部(図示せず)が形成される。保持部は、収納ケース5の内周における向かい合う箇所に設けられている。保持部は収納ケース5に設けられており、電源回路基板4を保持できる形状、構造であれば、溝状の構造でも突起状の構造でもよい。保持部は収納ケース5における下方から上方に亘って設けられていても良いし、一部のみに設けられていても良い。収納ケースにおける下方に保持部が設けられている場合は、電源回路基板4を保持するという効果に加え、収納ケース5に収納する際に入れ易くなるという効果を奏する。収納ケースにおける下方から上方に亘って保持部が設けられている場合は、一部のみに保持部が設けられている場合に比べて、より強く保持することが可能となる。これと、電源回路基板4の形状と、により電源回路基板4を収納ケース5に下方向から入れた際に収納ケース5の上方向から抜け出してしまうことがないという効果を奏する。細身部分の断面積は縮径部分の最小断面積と略同じとするまた、収納ケース5の細身部分の上方の外周面には、口金3の内周面に対応するねじ山が形成されている。
The tubular connection portion 71 of the heat sink 7 is connected to the tube connection portion 13 of the funnel-shaped inclined surface 12 of the cover member 1 and communicates the cover vent 11 of the cover member 1 and the in-tube air flow path 72 of the heat sink 7.
<Power circuit board 4>
The power supply circuit board 4 is obtained by mounting a plurality of electronic components (not shown) on the board. The power circuit board 4 is provided with a capacitor (not shown) in the vicinity thereof. The power supply circuit board 4 includes a circuit that rectifies AC power from a commercial power source into DC power, a circuit that adjusts the voltage of the DC power after rectification, and the like.
<Storage case 5>
FIG. 4 is an exploded vertical sectional view of the power circuit board and the housing case 5. FIG. 5 is a longitudinal sectional view of a light bulb type illumination device 100 different from that in FIG. 6 is an exploded longitudinal sectional view of FIG. The storage case 5 is made of a resin such as PBT (polybutylene terephthalate) or PC (polycarbonate). The storage case 5 has a cylindrical shape that communicates from one end surface (downward-side surface) to the other end surface (upward-side surface). The power circuit board 4 is stored from one end surface side (downward side) of the storage case 5. The storage case 5 has a substantially elliptical cross section (not shown). On the inner wall of the storage case 5, holding portions (not shown) for holding the power circuit board 4 are formed. The holding portions are provided at opposite locations on the inner periphery of the storage case 5. The holding portion is provided in the storage case 5 and may have a groove-like structure or a protruding structure as long as the shape and structure can hold the power circuit board 4. The holding part may be provided from the lower side to the upper side in the storage case 5 or may be provided only in a part. When the holding portion is provided below the storage case, in addition to the effect of holding the power circuit board 4, there is an effect that it is easy to put in the storage case 5. In the case where the holding portion is provided from the lower side to the upper side in the storage case, it is possible to hold more strongly than in the case where the holding portion is provided only in a part. Due to this and the shape of the power supply circuit board 4, there is an effect that the power supply circuit board 4 is not pulled out from the upper side of the storage case 5 when the power supply circuit board 4 is inserted into the storage case 5 from below. The cross-sectional area of the thin portion is substantially the same as the minimum cross-sectional area of the reduced diameter portion, and a thread corresponding to the inner peripheral surface of the base 3 is formed on the outer peripheral surface above the thin portion of the storage case 5. .

収納ケース5は、外側面に複数の保持部51が設けられている。また、収納ケース5は放熱筐体2に取り付けられるが、その際に、保持部51により放熱筐体2の内側面と収納ケース5の外側面との間に間隔を有するように取り付けられる。保持部51による放熱筺体2と収納ケース5との間の空間を筺体空気流路22とする。筐体空気流路22においても管内空気流路72と同様に発光体8からの熱が放熱筐体2の内側面まで伝搬し、筐体空気流路22内の空気に熱伝達する。加熱された空気は膨張し外気よりも密度が小さくなることにより浮力を生じ、筐体空気流路22内の空気の流れの駆動力となる。   The storage case 5 is provided with a plurality of holding portions 51 on the outer surface. The storage case 5 is attached to the heat radiating housing 2, and at that time, the holding portion 51 is attached so as to have a gap between the inner surface of the heat radiating housing 2 and the outer surface of the storage case 5. A space between the heat dissipation housing 2 and the storage case 5 by the holding portion 51 is referred to as a housing air flow path 22. Also in the case air flow path 22, the heat from the light emitter 8 propagates to the inner surface of the heat radiating case 2 and transfers heat to the air in the case air flow path 22 in the same manner as in the pipe air flow path 72. The heated air expands and has a lower density than the outside air, thereby generating buoyancy and serving as a driving force for the air flow in the housing air flow path 22.

更に、収納ケース5は、下部にガイド部52が設けられている。ガイド部52は、筒状の本体部の下端部から突出して設けられた部分であり、筒状の本体部の下端部から筒状の本体部の軸と垂直となるよう突出して設けられたガイド部平坦部52aと、ガイド部平坦部52aから略垂直となるように設けられたガイド部直交部52bと、からなる。
<隔壁板6>
隔壁板6は、略板状の部材である。隔壁板6は収納ケース5の下方の開口部に取り付けられ、収納ケース5の下方から電源回路基板4の飛び出しを抑制している。
<接続>
収納ケース5は、収納ケース5のガイド部52のガイド部平坦部52aをヒートシンク7と放熱筐体2との間に挟みこみ、ヒートシンク7と放熱筐体2とを接続することで保持される。
Furthermore, the storage case 5 is provided with a guide portion 52 at the bottom. The guide portion 52 is a portion provided to protrude from the lower end portion of the cylindrical main body portion, and a guide provided to protrude from the lower end portion of the cylindrical main body portion so as to be perpendicular to the axis of the cylindrical main body portion. The flat part 52a and the guide part orthogonal part 52b provided so as to be substantially perpendicular to the guide flat part 52a.
<Partition plate 6>
The partition plate 6 is a substantially plate-shaped member. The partition plate 6 is attached to the opening below the storage case 5 and suppresses the power supply circuit board 4 from popping out from below the storage case 5.
<Connection>
The storage case 5 is held by sandwiching the guide portion flat portion 52 a of the guide portion 52 of the storage case 5 between the heat sink 7 and the heat radiating housing 2 and connecting the heat sink 7 and the heat radiating housing 2.

隔壁板6の下面とヒートシンク7の上面(平面部7aにおける光源が取り付けられる面とは反対の面)との間の空間を放射状空気流路73とする。管内空気流路72と放射状空気流路73はほぼ直交し、放射状空気流路73と空気流路22もほぼ直交し、放熱筐体2の上部の通気口23に連通している。   A space between the lower surface of the partition plate 6 and the upper surface of the heat sink 7 (the surface opposite to the surface on which the light source is attached in the flat portion 7 a) is defined as a radial air flow path 73. The in-pipe air flow path 72 and the radial air flow path 73 are substantially orthogonal to each other, and the radial air flow path 73 and the air flow path 22 are also substantially orthogonal to each other and communicate with the vent 23 at the top of the heat radiating housing 2.

電源回路基板4から発光体8への複数本の出力リード線43は隔壁板6に設けた貫通孔(図示せず)を通り、収納ケース5に設けたガイド部52を経由して発光体8の基板80の所定のパターンに接続し給電する。   A plurality of output lead wires 43 from the power supply circuit board 4 to the light emitter 8 pass through a through hole (not shown) provided in the partition plate 6 and pass through a guide portion 52 provided in the storage case 5. The power is connected to a predetermined pattern of the substrate 80.

ガイド部52はヒートシンク7および基板80の切り欠き部(図示せず)を設けて出力リード線43を通している。   The guide portion 52 is provided with a notch portion (not shown) of the heat sink 7 and the substrate 80 and passes through the output lead wire 43.

図7は電球型照明装置100のネジ固定部における縦断面図である。放熱筐体2は、その内側面のうち複数箇所(図7では、2箇所)が内側に突出し、かつ、軸線方向に延在し、それぞれねじ穴24が設けられている。基板80およびヒートシンク7にそれぞれ貫通孔を形成し、ねじ穴24に合わせてねじ25によって放熱筐体2に固定している。   FIG. 7 is a longitudinal sectional view of the screw fixing portion of the light bulb type illumination device 100. A plurality of locations (two locations in FIG. 7) of the heat radiating housing 2 project inwardly, extend in the axial direction, and are each provided with a screw hole 24. Through holes are respectively formed in the substrate 80 and the heat sink 7, and are fixed to the heat radiating housing 2 with screws 25 in accordance with the screw holes 24.

なお、放熱筐体2およびヒートシンク7は、それぞれ、例えばアルミニウム(合金を含む)など、熱伝導率の高い材料から形成されているほうが望ましい。熱伝導率の高い材料から形成されていると、発光体8で発生する熱は、ヒートシンク7を介して放熱筐体2に効率的に伝導され、管内空気流路72の壁面や放射状空気流路73の壁面や空気流路22の壁面や放熱筐体2の外周面から外部の空気に放出されるようになっている。管内空気流路72、放射状空気流路73、空気流路22を連通した流路では煙突効果が大きくなり、流れが屈曲する部分において空気分子の慣性による壁面への衝突作用で温度境界層が薄くなり局所的に熱伝達特性が向上するので、発光体80が効率よく放熱される。また、電源回路基板への熱の侵入を抑制し信頼性寿命に大きく影響を受ける電源回路の温度上昇を抑える効果がある。隔壁板6の出力リード線43の貫通孔は樹脂などで封孔してもよい。隔壁板6のかわりに電源回路基板4を収納ケース5内に樹脂埋めしてもよい。なお、放熱筺体2は樹脂であれば安価、軽量であるという効果を奏する。   It is desirable that each of the heat radiating housing 2 and the heat sink 7 be formed of a material having high thermal conductivity such as aluminum (including an alloy). When formed from a material having high thermal conductivity, the heat generated in the light emitter 8 is efficiently conducted to the heat radiating housing 2 via the heat sink 7, and the wall surface of the in-pipe air flow path 72 or the radial air flow path. 73 is discharged to the outside air from the wall surface 73, the wall surface of the air flow path 22, and the outer peripheral surface of the heat dissipating housing 2. The chimney effect is increased in the flow path connecting the in-pipe air flow path 72, the radial air flow path 73, and the air flow path 22, and the temperature boundary layer is thinned by the collision action on the wall surface due to the inertia of air molecules in the flow bending portion. Therefore, since the heat transfer characteristics are locally improved, the light emitter 80 is efficiently dissipated. In addition, there is an effect of suppressing the heat intrusion to the power circuit board and suppressing the temperature rise of the power circuit that is greatly affected by the reliability life. The through hole of the output lead wire 43 of the partition plate 6 may be sealed with resin or the like. Instead of the partition plate 6, the power circuit board 4 may be embedded in the storage case 5 with resin. In addition, if the thermal radiation housing | casing 2 is resin, there exists an effect that it is cheap and lightweight.

電球型照明装置100の向きを上下反転させた姿勢においても同様の放熱改善効果が得られる。電球型照明装置100の向きを横向きにした姿勢においても放射状空気流路73内において空気の流れの駆動力を発揮するので同様の放熱改善効果が得られる。   The same heat radiation improvement effect can be obtained even in a posture in which the direction of the bulb-type lighting device 100 is turned upside down. Even in a posture in which the direction of the bulb-type lighting device 100 is horizontal, the driving force of the air flow is exhibited in the radial air flow path 73, so that the same heat radiation improvement effect can be obtained.

口金3は、収納ケース5の上端側に取り付けられ、外部に設置された一般照明電球用のソケット(図示せず)にねじ込むことにより商用電源に電気的に接続するためのものである。
電源回路基板4と口金3の間を入力リード線41、42で電気的に接続している。
The base 3 is attached to the upper end side of the storage case 5 and is electrically connected to a commercial power source by screwing into a socket (not shown) for a general lighting bulb installed outside.
The power supply circuit board 4 and the base 3 are electrically connected by input lead wires 41 and 42.

図8は電球型照明装置100の熱放射の経路を示す縦断面図である。放熱筐体2の表面に放熱塗料(たとえば、アクリル樹脂やシリコン樹脂にシリカやチタニアなどを混合した塗料)を塗装することで熱放射性を向上できる。ヒートシンク7についても同様の放熱塗装により熱放射性を向上できる。発光体80からの直接的な熱放射91とともに放熱筐体2からの熱放射26、ヒートシンク7からの熱放射74が期待でき、全体の放熱性能を向上することが可能となる。   FIG. 8 is a longitudinal sectional view showing a path of thermal radiation of the bulb-type lighting device 100. Thermal radiation can be improved by coating the surface of the heat dissipating housing 2 with a heat dissipating paint (for example, a paint in which silica, titania or the like is mixed with acrylic resin or silicon resin). The heat radiation of the heat sink 7 can be improved by the same heat radiation coating. The heat radiation 26 from the heat radiating housing 2 and the heat radiation 74 from the heat sink 7 can be expected together with the direct heat radiation 91 from the light emitter 80, and the overall heat radiation performance can be improved.

図9は電球型照明装置100の発光部における光線の経路を示す縦断面図である。ヒートシンク7の表面を反射塗装することにより表面反射率を改善し、カバー部材1の漏斗状の傾斜面12における散乱効果により、水平方向の出射光181や上方向の出射光182の配光割合が増え、電球型照明装置100の配光角が上側(口金3側)まで広がる。   FIG. 9 is a longitudinal cross-sectional view showing the path of light rays in the light emitting unit of the bulb-type lighting device 100. The surface reflectance is improved by reflecting the surface of the heat sink 7, and the light distribution ratio of the outgoing light 181 in the horizontal direction and the outgoing light 182 in the upper direction is improved by the scattering effect on the funnel-shaped inclined surface 12 of the cover member 1. As a result, the light distribution angle of the bulb-type lighting device 100 extends to the upper side (the base 3 side).

また、カバー通気口11近傍において散乱光15、16に以来する出射光151により、カバー通気口11近傍の暗部が目立たなくなる。   Further, the dark portion near the cover vent 11 becomes inconspicuous due to the emitted light 151 generated after the scattered lights 15 and 16 in the vicinity of the cover vent 11.

以上、本発明に係る電球型照明装置について実施形態により説明したが、本発明の実施態様はこれらの記載に限定されるものではなく、種々の変更などを行うことができる。   As described above, the light bulb type illumination device according to the present invention has been described with the embodiment. However, the embodiment of the present invention is not limited to these descriptions, and various modifications can be made.

また、発光体8からの光は白色に限定されるものではなく、発光色の異なるLEDや蛍光体を用いて所望の色に設定可能である。   Moreover, the light from the light emitter 8 is not limited to white, and can be set to a desired color using LEDs or phosphors having different emission colors.

また、本実施形態では、発光体8がLEDを備える場合について説明したが、発光体8としてEL(Electro-Luminescence)など他の半導体発光素子を用いてもよい。   Moreover, although this embodiment demonstrated the case where the light-emitting body 8 was equipped with LED, you may use other semiconductor light-emitting elements, such as EL (Electro-Luminescence), as the light-emitting body 8. FIG.

100 電球型照明装置
1 カバー部材
11 通気口
12 漏斗状傾斜面
13 管接続部
14 開口端部
15 散乱光
151 出射光
16 散乱光
17 散乱光
171 出射光
18 散乱光
181 出射光
182 出射光
2 放熱筐体
21 溝部
22 空気流路
23 通気口
24 ねじ固定部
25 ねじ
26 熱放射
3 口金
4 電源回路基板
41 入力リード線
42 入力リード線
43 出力リード線
5 収納ケース
51 保持部
52 ガイド部
6 隔壁板
7 ヒートシンク
71 管状接続部
72 管内空気流路
73 放射状空気流路
74 熱放射
75 散乱光
8 発光体
80 基板
81 貫通穴
9 LED(半導体素子)
91 熱放射
100 Bulb type lighting device
1 Cover member
11 Vent
12 Funnel-shaped inclined surface
13 Pipe connection
14 Open end
15 Scattered light
151 Outgoing light
16 Scattered light
17 Scattered light
171 Outgoing light
18 Scattered light
181 outgoing light
182 Outgoing light
2 Heat dissipation housing
21 Groove
22 Air flow path
23 Vent
24 Screw fixing part
25 screws
26 Heat radiation
3 base
4 Power supply circuit board
41 Input lead wire
42 Input lead wire
43 Output lead wire
5 Storage case
51 Holding part
52 Guide part
6 Bulkhead plate
7 Heat sink
71 Tubular connection
72 In-pipe air flow path
73 Radial air flow path
74 Heat radiation
75 Scattered light
8 Light emitter 80 Substrate
81 Through hole
9 LED (semiconductor element)
91 Heat radiation

Claims (2)

一つ又は複数の半導体素子を有する発光体と、前記発光体を覆うカバー部材と、前記発光体で発生する熱を放出する放熱体と、前記半導体素子を発光させる電源回路基板と、一端面から他端面まで連通する筒状であり、かつ前記電源回路基板を前記一端面から収納する収納ケースと、前記収納ケースの一端側に取り付けられる口金と、前記発光体と前記放熱体の間に配置し前記発光体で発生する熱を放熱体に伝えるヒートシンクを備え、前記カバー部材に漏斗状の通気口を有し、前記ヒートシンクは前記発光体の中心部を貫通する円筒部を有し前記カバー部材の漏斗状の通気口に連通する空気流路を有し、前記円筒部の他端は前記ヒートシンクと前記収納ケースとの間に設けられた空気流路に接続し、円筒内の流路に直交し放射状の流路を形成し、前記放射状の流路の端部において、前記収納ケースの側面と前記の放熱体の内壁面との間に設けられ前記放射状の流路と直交する空気流路を接続し、他端を口金近傍に設けた通気口となるように空気流路を連通させ、前記カバー部材は前記円筒部の外側を覆うことを特徴とする電球型照明装置。   A light emitter having one or a plurality of semiconductor elements, a cover member covering the light emitter, a heat radiating body that releases heat generated by the light emitter, a power supply circuit board that emits light from the semiconductor element, and an end face A cylindrical case that communicates with the other end surface, and a storage case that stores the power circuit board from the one end surface; a base that is attached to one end side of the storage case; and a space between the light emitter and the radiator. A heat sink for transmitting heat generated in the light emitter to the heat dissipator, the cover member having a funnel-shaped vent, and the heat sink having a cylindrical portion penetrating a central portion of the light emitter. It has an air flow path communicating with a funnel-shaped vent, and the other end of the cylindrical portion is connected to an air flow path provided between the heat sink and the storage case, and is orthogonal to the flow path in the cylinder. Shape a radial flow path And, at the end of the radial flow path, an air flow path which is provided between the side surface of the storage case and the inner wall surface of the heat radiating body and is orthogonal to the radial flow path is connected, and the other end is connected to the base An electric bulb-type lighting device, wherein an air flow path is communicated so as to be a vent provided in the vicinity, and the cover member covers the outside of the cylindrical portion. 発光体と、前記発光体を覆うカバー部材と、該カバー部材が取り付けられる放熱筺体と、前記発光体を発光させる電源回路基板と、該電源回路基板を覆い前記放熱筺体内に保持される収納ケースと、前記発光体と前記放熱筺体との間に位置するヒートシンクと、を備え、
前記カバー部材は、カバー通気口と、該カバー通気口と連通し当該カバー部材内に位置する管接続部と、を有し、
前記ヒートシンクは、前記発光体が取り付けられ、かつ前記放熱筺体と固定される平面部と、該平面部から立ち上がり前記管接続部と接続する筒状の管状接続部と、を有し、
前記カバー通気口から前記管接続部までの空間と、前記管状接続部内の空間と、前記平面部と前記収納ケースとの間の空間と、前記放熱筺体と前記収納ケースとの間の空間とが連通し、前記カバー部材は前記管状接続部の外側を覆うことを特徴とする電球型照明装置。
A light-emitting body, a cover member covering the light-emitting body, a heat dissipating housing to which the cover member is attached, a power circuit board that emits light from the light-emitting body, and a storage case that covers the power circuit board and is held in the heat dissipating housing And a heat sink positioned between the light emitter and the heat radiating housing,
The cover member has a cover vent, and a pipe connection portion that communicates with the cover vent and is located in the cover member.
The heat sink includes a flat surface portion to which the light emitter is attached and fixed to the heat radiating housing, and a tubular tubular connection portion that rises from the flat surface portion and is connected to the tube connection portion,
A space from the cover vent to the tube connection portion, a space in the tubular connection portion, a space between the flat portion and the storage case, and a space between the heat dissipation housing and the storage case. The bulb-type lighting device is characterized in that the cover member covers the outside of the tubular connecting portion.
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