JP2011090843A - Lighting apparatus and lighting fixture - Google Patents

Lighting apparatus and lighting fixture Download PDF

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Publication number
JP2011090843A
JP2011090843A JP2009242523A JP2009242523A JP2011090843A JP 2011090843 A JP2011090843 A JP 2011090843A JP 2009242523 A JP2009242523 A JP 2009242523A JP 2009242523 A JP2009242523 A JP 2009242523A JP 2011090843 A JP2011090843 A JP 2011090843A
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Japan
Prior art keywords
light emitting
lighting
emitting module
heat
light
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Pending
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JP2009242523A
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Japanese (ja)
Inventor
Shuhei Matsuda
Kiyoshi Nishimura
Kozo Ogawa
Miho Watanabe
光三 小川
周平 松田
美保 渡邊
潔 西村
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Toshiba Lighting & Technology Corp
東芝ライテック株式会社
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Application filed by Toshiba Lighting & Technology Corp, 東芝ライテック株式会社 filed Critical Toshiba Lighting & Technology Corp
Priority to JP2009242523A priority Critical patent/JP2011090843A/en
Priority claimed from CN2010102927606A external-priority patent/CN102032480B/en
Publication of JP2011090843A publication Critical patent/JP2011090843A/en
Application status is Pending legal-status Critical

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Abstract

Provided is a lighting device that can improve the reliability of a lighting circuit and can cope with an improvement in light output.
A translucent member 15 is interposed between a light emitting module 13 and a globe 14 to efficiently conduct heat generated from the LED chip 34 to the globe 14 and efficiently dissipate the heat from the surface of the globe 14. The heat insulating means 16 is interposed between the light emitting module 13 and the lighting circuit 19 to suppress the heat of the LED chip 34 from being transmitted to the lighting circuit 19.
[Selection] Figure 1

Description

  The present invention relates to a lighting device using a semiconductor light emitting element and a lighting fixture using the lighting device.

  Conventionally, as a lighting device using a semiconductor light emitting element, for example, there is a light bulb shaped lamp. In this light bulb shaped lamp, a light emitting module having an LED chip as a semiconductor light emitting element is attached to one end side of a metal base, and a globe covering the light emitting module is attached to the other end of the base. A base is attached via an insulating member, and a lighting circuit for supplying power to the LED chip and lighting it is housed inside the base and the base.

  In the light emitting module, an LED chip is generally arranged on a flat substrate, and the substrate is attached so as to be in thermal contact with the substrate in surface contact. Therefore, when the light bulb shaped lamp is turned on, heat generated by the LED chip is mainly conducted from the substrate to the base, and is radiated from the surface exposed to the outside of the base to the air.

  In addition, there is a light bulb shaped lamp that is molded with a transparent member having a light emitting module protruding from one end side of the base as a three-dimensional shape and enclosing the light emitting module. Also in the case of this light bulb shaped lamp, the lighting circuit is housed inside the base or the base. The heat generated by the LED chip is thermally conducted to the substrate side and radiated, and is also transferred to the transparent member and radiated from the surface of the transparent member to the air (see, for example, Patent Document 1). .)

JP 2009-1335026 (page 4-5, FIG. 1)

  In a light bulb shaped lamp in which a three-dimensional light emitting module is molded with a transparent member, the heat generated by the LED chip is easily radiated from the surface of the transparent member, but the heat generated by the LED chip is also directed toward the interior of the light bulb shaped lamp. It is also transmitted to the lighting circuit housed inside the substrate, and the temperature of the lighting circuit is likely to rise due to the influence of heat generated by the LED chip.

  Some lighting circuits for lighting LED chips include, for example, a rectifier circuit that rectifies alternating current into direct current, a chopper circuit that converts direct current output from the rectifier circuit to a desired voltage, and supplies the voltage to the LED chip. . In such a lighting circuit, a smoothing electrolytic capacitor may be used in the subsequent stage of the rectifier circuit or the output stage of the chopper circuit. However, this electrolytic capacitor uses an electrolytic solution and has other heat resistant components. Because it is inferior to the above, it is easily affected by the temperature rise of the lighting circuit.

  In order not to impair the reliability and life of the lighting circuit including the electrolytic capacitor, it is necessary to prevent the lighting circuit from excessively rising due to the heat generated by the LED chip. There is a problem that the input power to the LED chip must be limited and the light output of the light bulb shaped lamp must be suppressed.

  This invention is made | formed in view of such a point, and it aims at providing the illuminating device and lighting fixture which can improve the reliability of a lighting circuit and can respond also to the improvement of a light output.

  A lighting device according to claim 1; a light emitting module having a semiconductor light emitting element; a light transmissive member provided so as to cover the light emitting module, wherein the heat generated by the semiconductor light emitting element is thermally conducted to the surface side of the light emitting module; A lighting circuit for lighting the semiconductor light emitting element; and heat insulating means interposed between the light emitting module and the lighting circuit.

  Examples of the semiconductor light emitting element include an LED chip and an EL element.

  For example, when the semiconductor light emitting element is an LED chip, the light emitting module is mounted by a COB (Chip On Board) method in which the LED chip disposed on the substrate is sealed with a transparent resin mixed with a phosphor, or the LED chip is mounted. It is mounted by an SMD (Surface Mount Device) package method with a mounted connection terminal. The substrate of the light emitting module may be a flat plate shape or a three-dimensional shape.

  For the translucent member, for example, a transparent resin such as a transparent silicone resin is used. At least a part of the translucent member is in contact with the light emitting module and is capable of conducting heat to the surface side of itself. That is, the selection of the material of the translucent member and whether to cover the entire light emitting module or leave it partially can be designed according to the required heat dissipation. Moreover, the thing with a cavity in a translucent member is accept | permitted. Further, the translucent member may be integrally formed into a desired shape that constitutes the light emitting surface of the lighting device. Further, a light-transmitting and light-diffusing synthetic resin or glass globe may be provided so as to surround the light-emitting module. In this case, the light-transmitting member is provided between the light-emitting module and the globe.

  The lighting circuit has, for example, a power supply circuit that outputs a constant direct current, and is connected to the substrate of the light emitting module by wiring or the like to supply power to the semiconductor light emitting element. When the light emitting module has a three-dimensional shape, the lighting circuit may be disposed inside the light emitting module or may be disposed outside the light emitting module. In short, those arranged in a relationship that is adversely affected by the heat generated by the semiconductor light emitting element can be the subject of the present invention.

  Examples of the heat insulating means include glass wool, polypropylene resin foam heat insulating material, fumed silica, calcium silicate heat insulating material, and vacuum heat insulating panel. Further, as the heat insulating means, an air layer between the light emitting module and the lighting circuit may be used, but in the case of this air layer, for example, an aluminum foil wound in a plurality of layers is inserted into the air layer, It is preferable to use convection suppression means for suppressing air convection in which heat conduction occurs, or use heat radiation suppression means in which the surface of the light emitting module facing the lighting circuit is an aluminum mirror surface having a low thermal emissivity.

  According to a second aspect of the present invention, there is provided the lighting device according to the first aspect, further comprising: a metal base having a partition wall interposed between the heat insulating means and the lighting circuit, and a heat radiating portion exposed to the outside. Is.

  The base is made of, for example, a metal material having good thermal conductivity and heat dissipation, such as aluminum. A heat radiating fin may be formed around the heat radiating portion.

  The lighting device according to claim 3 is the lighting device according to claim 1 or 2, wherein the heat conductivity of the heat insulating means is 0.1 W / mk or less.

  If the heat conductivity of the heat insulating means is 0.1 W / mk or less, the heat conductivity of the plastic is about 0.2 to 0.3 W / mk, so that a higher heat insulating effect can be obtained.

  A more preferable thermal conductivity of the heat insulating means is in the range of 0.01 to 0.05 W / mk, which makes it possible to provide a mini krypton bulb-sized lamp having a diameter of 45 mm and a lamp power of 5 W or less. Furthermore, the more preferable thermal conductivity of the heat insulating means is 0.01 W / mk or less, which makes it possible to provide a mini krypton bulb size light bulb shaped lamp having a diameter of 45 mm and a lamp power of 5 W or more. That is, in order to make a light bulb shaped lamp of the mini krypton light bulb size, the diameter is about 45 mm and it is necessary to use an E17 type base, so the dimensions are small and the storage space for the lighting circuit is limited. With the described configuration, it is possible to obtain a large light output while suppressing adverse thermal effects on the lighting circuit.

  The illumination device according to claim 4 is the illumination device according to any one of claims 1 to 3, wherein the translucent member is formed of a silicone resin in which a light diffusing material is dispersed.

The light diffusing material is preferably an inorganic powder mainly composed of silica (SiO 2 ) having an average particle diameter of about 3 μm, for example.

  The lighting fixture according to claim 5 comprises a fixture main body; and the lighting device according to any one of claims 1 to 4 disposed in the fixture main body.

  According to the illuminating device of claim 1, the light generated from the semiconductor light emitting element is efficiently conducted to the globe and efficiently radiated from the surface of the globe by the translucent member interposed between the light emitting module and the globe. At the same time, the heat insulation means interposed between the light emitting module and the lighting circuit can suppress the heat of the semiconductor light emitting element from being transmitted to the lighting circuit, and the temperature rise of the lighting circuit due to the influence of the heat of the semiconductor light emitting element can be suppressed. The reliability of the lighting circuit can be improved, and the light output can be improved by increasing the input power to the semiconductor light emitting element.

  According to the illuminating device of claim 2, in addition to the effect of the illuminating device of claim 1, it is made of a metal having a partition portion interposed between the heat insulating means and the lighting circuit, and a heat radiating portion exposed to the outside. The base can efficiently dissipate heat generated from the lighting circuit.

  According to the illuminating device of claim 3, in addition to the effect of the illuminating device of claim 1 or 2, since the heat conductivity of the heat insulating means is 0.1 W / mk or less, the heat of the semiconductor light emitting element is turned on. Propagation to the circuit can be effectively suppressed.

  According to the lighting device according to claim 4, in addition to the effect of the lighting device according to any one of claims 1 to 3, the translucent member is formed of a silicone resin in which a light diffusing material is dispersed. Light emitted from the semiconductor light emitting element can be diffused and emitted from the surface of the globe.

  According to the lighting apparatus of the fifth aspect, since the lighting device according to any one of the first to fourth aspects is used, it is possible to provide a lighting apparatus in which the lighting circuit is highly reliable and the light output is improved.

It is sectional drawing of the lightbulb-shaped lamp as an illuminating device which shows one embodiment of this invention. It is a front view of a bulb-type lamp. It is sectional drawing of the lighting fixture using a bulb-type lamp same as the above.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  In FIG. 1 and FIG. 2, reference numeral 11 denotes a light bulb shaped lamp of the size of, for example, a mini-krypton light bulb as a lighting device. The light bulb shaped lamp 11 is composed of a base body 12, one end side of the base body 12 ( A three-dimensional light emitting module 13 projecting and attached to one end side), a globe 14 including and mounting the light emitting module 13 on one end side of the base 12, and a light-transmitting member interposed between the light emitting module 13 and the globe 14 15. Heat insulation means 16 interposed between the light emitting module 13 and the base 12 (lighting circuit 19), an insulating cover 17 attached to the other end of the base 12, and attached to the other end of the cover 17. And a lighting circuit 19 housed inside the base 12 and the base 18.

  The base 12 is integrally formed in a cylindrical shape whose diameter is enlarged toward one end side, using a metal material such as aluminum having excellent thermal conductivity. A cylindrical partition wall 22 having a closed end is projected at the center of one end surface of the base body 12, and a storage space for opening the other end of the base body 12 to store the lighting circuit 19 inside the partition wall section 22. 23 is formed. On the periphery of one end surface of the base body 12, a globe mounting portion 24 is formed to project. A heat radiating portion 25 exposed to the outside is formed on the other end side of the base 12. A heat radiating fin may be formed around the heat radiating portion 25.

  The light emitting module 13 includes, for example, a three-dimensional support portion 27, a substrate 28 disposed along the surface of the support portion 27, and a plurality of light emission portions 29 provided on the substrate 28.

  The support portion 27 is formed of an insulating material such as PBT resin, and the peripheral surface is formed in a polygon such as a hexagon, and one end is formed in a pyramid such as a hexagon. That is, the support portion 27 is formed in a polyhedral three-dimensional shape that conforms to the inner shape of the globe 14. The inside of the support portion 27 is formed to open toward the other end side. The partition wall 22 of the base 12 is inserted from the other end opening of the support 27, that is, the partition 22 of the base 12 is disposed inside the light emitting module 13.

  The substrate 28 is formed integrally with, for example, a lead frame or a flexible substrate, and is disposed along the peripheral surface of the support portion 27 and a plurality of peripheral surface substrate portions 31 and the front end surface of the support portion 27. A plurality of front end surface substrate portions 32. These substrate portions 31 and 32 may be bonded and fixed to the surface of the support 27. A plurality of light emitting portions 29 are provided on the surfaces of the substrate portions 31 and 32.

  Each light emitting unit 29 has, for example, an LED chip 34 that emits blue light as a semiconductor light emitting element, and the LED chip 34 is mounted on the substrate 28 by a COB (Chip On Board) method. That is. An LED chip 34 is mounted on a substrate 28, and a sealing resin 35 such as a silicone resin is formed to cover and seal the LED chip 34 in a dome shape. The sealing resin 35 is mixed with a yellow phosphor that emits yellow light when excited by part of the blue light from the LED chip 34. Therefore, the surface of the sealing resin 35 becomes the light emitting surface of the light emitting unit 29, and white light is emitted from this light emitting surface.

  The globe 14 is made of a material such as synthetic resin or glass having light transmittance and light diffusibility, and is formed in a dome shape so as to enclose and cover the three-dimensional light emitting module 13. The edge of the other end opening of the globe 14 is attached to the globe attachment portion 24 of the base 12 with an adhesive or the like.

The transparent member 15 is made of, for example, a transparent resin such as a transparent silicone resin and is filled, for example, so that there is almost no air layer in the gap between the surface of the light emitting module 13 and the inner surface of the globe 14. Is intervened. As the silicone resin used for the translucent member 15, for example, an inorganic powder mainly composed of silica (SiO 2 ) having an average particle diameter of about 3 μm is (silicone resin) 3: (inorganic powder) 1. Is distributed at a rate of.

  The heat insulating means 16 has a heat insulating performance with a thermal conductivity of 0.1 W / mk or less, and for example, a glass wool heat insulating material with a thermal conductivity of 0.033 to 0.050 W / mk is used.

  In order to improve the handling of the glass wool, the glass wool is put into a bag that can be sealed, and the air in the bag is exhausted to form a thin plate having flexibility. Or is disposed along the inner peripheral surface of the light emitting module 13, and by combining the base 12 and the light emitting module 13, a bag of glass wool between the base 12 and the light emitting module 13, that is, the heat insulating means 16 Can be interposed.

  Alternatively, a glass resin can be formed into a cylindrical shape by infiltrating a phenol resin with a cylindrical glass wool, that is, a heat insulating means 16 interposed between the base 12 and the light emitting module 13.

  The heat insulating means 16 is interposed between one end surface of the base 12, the partition wall portion 22 and the globe mounting portion 24, the light emitting module 13 and a part of the light transmitting member 15, and at least between the base 12 and the light emitting module 13. Thermally shut off.

  Further, the cover 17 is formed in a cylindrical shape by an insulating material such as PBT resin, for example, and one end side is fixed to the base body 12 and the other end side protrudes from the base body 12.

  The base 18 can be connected to, for example, a socket for a general lighting bulb such as an E17 type, and is a shell 38 that is fitted into the other end of the cover 17 protruding from the base body 12 and fixed by caulking. An insulating portion 39 provided on the other end side of the shell 38 and an eyelet 40 provided on the top of the insulating portion 39 are provided.

  The lighting circuit 19 is, for example, a circuit that supplies a constant current to the LED chip 34 of the light emitting module 13, and includes a circuit board 43 on which a plurality of electronic components constituting the circuit are mounted. 43 is accommodated in a state of being disposed over the accommodation space 23 inside the partition wall 22 of the base 12, the inside of the cover 17, and the inside of the base 18. The input side of the lighting circuit 19 is connected to the shell 38 and the eyelet 40 of the base 18 via connection lines, and the output side of the lighting circuit 19 is connected to the substrate 28 of the light emitting module 13 via connection lines.

  The lighting circuit 19 includes, for example, a rectifier circuit that rectifies alternating current into direct current, a chopper circuit that converts the direct current output from the rectifier circuit into a desired voltage and supplies the voltage to the LED chip. In such a lighting circuit 19, a smoothing electrolytic capacitor is used, but this electrolytic capacitor has a relatively low heat-resistant temperature compared to other electronic components and the like, and is easily affected by the temperature rise of the lighting circuit. It is preferably mounted on the other end side of the circuit board 43 on the base 18 side away from the light emitting module 13.

  The bulb-shaped lamp 11 configured in this way is a mini-krypton bulb size with a lamp length of 80 mm and a maximum diameter of 45 mm of the globe 14, a current of the light emitting module 13 of 0.54 A, a voltage of 12.5 V, and a total luminous flux of 600 lm. .

  FIG. 3 shows a lighting fixture 51 that is a downlight using the bulb-shaped lamp 11. The lighting fixture 51 has a fixture main body 52, and a socket 53 and a reflector 54 are provided in the fixture main body 52. It is arranged.

  Then, when the base 18 of the light bulb shaped lamp 11 is attached to the socket 53 of the lighting fixture 51 and energized, the lighting circuit 19 operates, and power is supplied to the LED chip 34 of each light emitting unit 29 of the light emitting module 13, The LED chips 34 emit light, and light emitted from the light emitting surfaces of the light emitting units 29 is emitted through the light transmitting member 15 and the globe 14. At this time, since the light diffusing material is dispersed in the translucent member 15, the light is diffused and emitted through the globe 14.

  At the time of lighting, heat generated from the LED chip 34 of each light emitting part 29 of the light emitting module 13 is thermally conducted from the light emitting part 29 to the translucent member 15, and from the LED chip 34 to the substrate 28 and the support part 27. Then, heat is conducted from the surface of the substrate 28 to the light transmissive member 15, heat is conducted from the light transmissive member 15 to the globe 14, and heat is radiated from the surface of the globe 14 to the air. At this time, since there is no air layer having a low thermal conductivity between the LED chip 34 and the globe 14 of each light emitting unit 29 of the light emitting module 13, the heat of the LED chip 34 can be efficiently conducted to the globe 14, High heat dissipation from the outer surface of the globe 14 can be ensured. Therefore, the temperature rise of the LED chip 34 can be suppressed, and the lifetime of the LED chip 34 can be extended.

  At this time, since the heat insulating means 16 is interposed between the light emitting module 13 and the base 12, the heat generated from the LED chip 34 of the light emitting module 13 is stored in the base 12 and the base 12. Propagation to the circuit 19 is suppressed.

  Therefore, most of the heat generated from the LED chip 34 of the light emitting module 13 is radiated from the surface of the globe 14 through the translucent member 15.

  Further, when the lighting circuit 19 operates, heat is generated from the electronic components included in the lighting circuit 19, and this heat is transmitted to the base 12. The heat transmitted to the base 12 is radiated into the air from the heat radiating portion 25 exposed to the outside of the base 12.

  At this time, since the heat insulating means 16 is interposed between the light emitting module 13 and the base 12, the heat transmitted to the base 12 is mainly the heat generated by the lighting circuit 19, and the heat generated by the lighting circuit 19. Can be efficiently dissipated from the heat dissipating portion 25 of the base 12, and the temperature rise of the lighting circuit 19 can be suppressed.

  Therefore, the heat insulating means 16 can separate the light emitting module 13 and the lighting circuit 19 that are heat generation sources, and suppress the thermal influence on each other.

  Then, in order to verify the effect of the heat insulating means 16, when the temperature distribution of the light bulb shaped lamp 11 in the lighting state was measured, the temperature TC1 at the top of the light emitting module 13 was 89 ° C., and the light emitting module in the circuit board 43 of the lighting circuit 19 The temperature TC2 of the portion located inside 13 was 58 ° C. The temperature difference ΔT was 31 ° C., and it was confirmed that heat generated from the LED chip 34 of the light emitting module 13 is suppressed from being transmitted to the lighting circuit 19 by the heat insulating means 16.

  According to the light bulb shaped lamp 11 configured in this way, the light generated from the LED chip 34 is efficiently conducted to the globe 14 by the translucent member 15 interposed between the light emitting module 13 and the globe 14 so that the globe 14 The heat of the LED chip 34 is suppressed from being transferred to the lighting circuit 19 by the heat insulating means 16 interposed between the light emitting module 13 and the lighting circuit 19, while efficiently dissipating heat from the surface of 14. Since the temperature rise of the lighting circuit 19 due to the influence can be suppressed, the reliability of the lighting circuit 19 can be improved.

  Therefore, even a mini krypton bulb type small bulb lamp 11 can secure high heat dissipation from the globe 14 and suppress the temperature rise of the LED chip 34, and can also suppress the temperature rise of the lighting circuit 19. The light output can be improved by increasing the input power to the LED chip 34.

  Further, since the thermal conductivity of the plastic is about 0.2 to 0.3 W / mk, if the thermal conductivity of the heat insulating means 16 is 0.1 W / mk or less, the heat of the LED chip 34 is transferred to the lighting circuit 19. It is possible to effectively suppress the transmission.

  A more preferable thermal conductivity of the heat insulating means 16 is in the range of 0.01 to 0.05 W / mk, which can provide a mini-krypton bulb-sized lamp 11 having a diameter of 45 mm and a lamp power of 5 W or less. Furthermore, the more preferable thermal conductivity of the heat insulating means 16 is 0.01 W / mk or less, which can provide a bulb lamp 11 of a mini-krypton bulb size having a diameter of 45 mm and a lamp power of 5 W or more.

  The heat insulating means 16 is not limited to glass wool having a thermal conductivity of 0.033 to 0.050 W / mk, but is a polypropylene resin foam heat insulating material having a thermal conductivity of 0.036 W / mk, and a silica having a thermal conductivity of 0.07 W / mk. A calcium acid heat insulating material, a vacuum heat insulating panel having a thermal conductivity of 0.002 W / mk, or the like may be used.

  Further, the heat insulating means 16 may be an air layer between the light emitting module 13 and the lighting circuit 19. In the case of this air layer, the thermal conductivity is 0.033 W / mk. However, since the thermal conductivity is increased due to the occurrence of convection, for example, an aluminum foil wound in multiple layers is placed in the air layer. What is necessary is just to use the convection suppression means which inserts and suppresses the convection of the air which heat conduction produces.

  Alternatively, when the heat insulating means 16 is formed of an air layer, heat radiation suppressing means may be used in which aluminum is vapor-deposited on the inner surface of the light emitting module 13 facing the lighting circuit 19 to form an aluminum mirror surface with a low heat emissivity. Whereas the thermal emissivity of plastic is 0.90 to 0.95, the thermal emissivity in the case of an aluminum mirror surface can be reduced to about 0.05, so even when the heat insulating means 16 is composed of an air layer. High heat insulation performance is obtained.

  Further, by making the light emitting module 13 into a three-dimensional shape and housing and arranging a part of the lighting circuit 19 in the inner space of the light emitting module 13, the light bulb shaped lamp 11 can be miniaturized. Thus, when miniaturizing the light bulb shaped lamp 11, the use of the heat insulating means 16 is an effective means for miniaturization.

  In the above embodiment, the lighting circuit 19 is disposed inside the light emitting module 13, but the present invention is not limited thereto, and the lighting circuit 19 may be disposed outside the light emitting module 13. In this case, the lighting circuit 19 may be disposed inside the base 12 and the base 18, and the heat insulating means 16 may be interposed between the lighting circuit 19 and the light emitting module 13.

  Further, the light bulb shaped lamp 11 may be one in which the globe 14 is not used and the translucent member 15 is integrally formed in a desired shape constituting the light emitting surface of the light bulb shaped lamp 11.

  Further, the lighting device is not limited to the light bulb shaped lamp 11, and may be, for example, a one-piece lamp using a pin as a base, or a thin lamp using a GX53-type base.

11 Light bulb shaped lamp as lighting device
12 substrate
13 Light emitting module
15 Translucent member
16 Insulation means
19 Lighting circuit
22 Bulkhead
25 Heat sink
34 LED chips as semiconductor light emitting devices
51 Lighting equipment
52 Instrument body

Claims (5)

  1. A light emitting module having a semiconductor light emitting element;
    A light-transmitting member provided so as to cover the light-emitting module and thermally conducting the heat generated by the semiconductor light-emitting element to the surface side of the light-emitting module;
    A lighting circuit for lighting the semiconductor light emitting element;
    Heat insulating means interposed between the light emitting module and the lighting circuit;
    An illumination device comprising:
  2. The lighting device according to claim 1, further comprising: a metal base having a partition wall interposed between the heat insulating means and the lighting circuit, and a heat radiating portion exposed to the outside.
  3. The lighting device according to claim 1, wherein the heat conductivity of the heat insulating means is 0.1 W / mk or less.
  4. The lighting device according to any one of claims 1 to 3, wherein the translucent member is formed of a silicone resin in which a light diffusing material is dispersed.
  5. An instrument body;
    An illumination device according to any one of claims 1 to 4 disposed in the appliance body;
    The lighting fixture characterized by comprising.
JP2009242523A 2009-10-21 2009-10-21 Lighting apparatus and lighting fixture Pending JP2011090843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009242523A JP2011090843A (en) 2009-10-21 2009-10-21 Lighting apparatus and lighting fixture

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009242523A JP2011090843A (en) 2009-10-21 2009-10-21 Lighting apparatus and lighting fixture
CN2010102927606A CN102032480B (en) 2009-09-25 2010-09-20 Self-ballasted lamp and lighting equipment
US12/885,849 US8678618B2 (en) 2009-09-25 2010-09-20 Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same
EP10178363.7A EP2302284A3 (en) 2009-09-25 2010-09-22 Self-ballasted lamp and lighting equipment
US14/170,130 US8998457B2 (en) 2009-09-25 2014-01-31 Self-ballasted lamp and lighting equipment having a support portion in contact with an inner circumference of a base body

Publications (1)

Publication Number Publication Date
JP2011090843A true JP2011090843A (en) 2011-05-06

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Application Number Title Priority Date Filing Date
JP2009242523A Pending JP2011090843A (en) 2009-10-21 2009-10-21 Lighting apparatus and lighting fixture

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Country Link
JP (1) JP2011090843A (en)

Cited By (7)

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JP5134164B1 (en) * 2011-08-12 2013-01-30 パナソニック株式会社 LED lamp and lighting device
WO2013024557A1 (en) * 2011-08-12 2013-02-21 パナソニック株式会社 Led lamp and lighting device
JP2013065529A (en) * 2011-09-20 2013-04-11 Toshiba Corp Illuminating device
JP2013123027A (en) * 2011-07-14 2013-06-20 Mitsubishi Electric Lighting Corp Light-emitting diode lamp, lighting apparatus, light-emitting lamp manufacturing method, light-emitting diode lamp manufacturing method, street light, and lamp replacement method
US8653734B2 (en) 2011-07-29 2014-02-18 Phoenix Electric Co., Ltd. Light emitting device
JP2014157920A (en) * 2013-02-15 2014-08-28 Toshiba Lighting & Technology Corp Light emitting module, light emitting device, and lighting device
KR101621398B1 (en) * 2014-02-27 2016-05-16 (주)경전산업 Omnidirectional light-emitting lamp

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016189346A (en) * 2011-07-14 2016-11-04 三菱電機照明株式会社 Manufacturing method of light-emitting lamp
JP2013123027A (en) * 2011-07-14 2013-06-20 Mitsubishi Electric Lighting Corp Light-emitting diode lamp, lighting apparatus, light-emitting lamp manufacturing method, light-emitting diode lamp manufacturing method, street light, and lamp replacement method
US8653734B2 (en) 2011-07-29 2014-02-18 Phoenix Electric Co., Ltd. Light emitting device
JP5134164B1 (en) * 2011-08-12 2013-01-30 パナソニック株式会社 LED lamp and lighting device
WO2013024557A1 (en) * 2011-08-12 2013-02-21 パナソニック株式会社 Led lamp and lighting device
US9175814B2 (en) 2011-08-12 2015-11-03 Panasonic Intellectual Property Management Co., Ltd. LED lamp and lighting device
JP2013065529A (en) * 2011-09-20 2013-04-11 Toshiba Corp Illuminating device
JP2014157920A (en) * 2013-02-15 2014-08-28 Toshiba Lighting & Technology Corp Light emitting module, light emitting device, and lighting device
KR101621398B1 (en) * 2014-02-27 2016-05-16 (주)경전산업 Omnidirectional light-emitting lamp

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