JP5620558B2 - Light bulb type lighting device - Google Patents

Description

  The present invention relates to a light bulb-type lighting device that uses a light emitting diode (hereinafter referred to as LED), electroluminescence (hereinafter referred to as EL), or the like as a light source and includes a drive circuit that drives the light source.

  In recent years, lighting devices using LEDs as light sources have been developed in various applications and shapes. Its features include advantages of long life and low power consumption. However, as the amount of light required for the lighting device increases, an LED in which a plurality of chip LEDs are integrated at a high density or a high output type LED may be used as a light source in order to increase the light output.

  In such a case, the amount of heat generated from a heat generating component that generates heat when a drive current such as an IC, a resistor, or a diode is mounted on a light source or a drive circuit unit that drives the light source as the light output or power consumption increases. Will grow. In particular, due to the heat generated from the heat generating components, there is a problem that the thermal load on the drive circuit portion including the heat generating components mounted on the drive circuit portion is increased, leading to deterioration and failure of the drive circuit portion. For this reason, in the illuminating device which uses LED, EL, etc. as a light source, it was necessary to radiate | emit the heat from the heat-emitting components mounted in a drive circuit part efficiently.

  Conventionally, as a structure for heat dissipation of LED lighting, for example, a structure in which a metal base on which a substrate on which an LED as a light source is arranged is attached and a light source mounting surface formed integrally with a metal heat dissipation portion are in surface contact with each other. It is known (see Patent Document 1).

JP 2007-73478 A

  Patent Document 1 describes a structure that improves the heat dissipation efficiency of heat from an LED that is a light source.

Bulb-type lighting device of the present invention includes a light source, a drive circuit section for driving the light source, and a heat radiation section cavity formed therein, a pre-SL driver circuit portion spaced from the inner surface of the heat radiating portion fixed An electrically insulating fixing part, and the heat dissipating part has a boss part protruding in the cavity direction, and the fixing part is inserted on the inner surface side of the heat dissipating part, and the fixing part Has a positioning portion that is positioned to face the boss portion.

  The bulb-type lighting device according to the present invention is characterized in that a plurality of the boss portions are provided on the periphery of the cavity.

  The bulb-type illumination device of the present invention is characterized in that the boss portion is provided at three locations on the periphery of the cavity.

It is an external view of the illuminating device which concerns on Embodiment 1 of this invention. It is a disassembled perspective view of the illuminating device of FIG. It is a principal part cross-sectional view of FIG. It is a principal part longitudinal cross-sectional view of FIG. It is a principal part expanded longitudinal cross-sectional view of the translucent part in FIG. FIG. 3 is an enlarged perspective view of a main part of a drive circuit unit in FIG. 2. It is a principal part cross-sectional view of the illuminating device which concerns on Embodiment 2 of this invention. It is a principal part cross-sectional view of the illuminating device which concerns on Embodiment 3 of this invention. It is a principal part longitudinal cross-sectional view of the thermal radiation part of FIG. It is a principal part longitudinal cross-sectional view of the illuminating device of patent document 1. FIG.

(Embodiment 1)
Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. 1 is an external view of a lighting device 100 according to Embodiment 1 of the present invention, FIG. 2 is an exploded perspective view of the lighting device 100 of FIG. 1, and FIG. 3 is a cross-sectional view of the main part of the lighting device 100 of FIG. 4 is a longitudinal sectional view of a main part of the illuminating device 100 of FIG. 1, FIG. 5 is an enlarged longitudinal sectional view of a main part of the light transmitting part in FIG. 4, and FIG. 6 is a drive circuit in FIG. It is a principal part expansion perspective view of a part.

  A lighting apparatus 100 according to Embodiment 1 includes a light source module 1 on which a plurality of LED modules 11 that are light sources are mounted, a dome-shaped translucent portion 2 that covers the light source module 1, and a light source module as shown in FIG. Radiates heat generated by the drive circuit unit 3 having a plurality of drive circuit components 31, 31, 31,... For driving 1, and the heat generating components 31 a, 31 a, 31 a, which are mounted by the light source module 1 and the drive circuit unit 3. A heat dissipating part 4, a cylindrical base part 5 electrically connected to the drive circuit part 3 and connected to an external power source, a coupling body 6 connecting the base part 5 and the heat dissipating part 4, and a light source module 1 to which the heat radiating plate 7 is attached and fixed to the heat radiating portion 4, the fixing portion 8 for fixing and housing the drive circuit portion 3 inside the heat radiating portion 4, and the heat conduction from the driving circuit portion 3 to the heat radiating portion 4. Heat conduction member 9 for To have.

  As shown in FIGS. 2 and 4, the light source module 1 has an LED module 11 that is a light source of the illumination device 100 mounted on a disk-shaped light source substrate 12, and the surface on which the LED module 11 is not mounted. It is installed on the heat sink 7 and attached with screws (not shown). The LED module 11 is, for example, a surface-mounted LED that includes an LED element, a sealing resin that seals the LED element, and phosphors are dispersed, and an input terminal and an output terminal. The heat generated in the light source module 1 can be radiated from the periphery of the heat radiating plate 7 to the outside air, or can be conducted from the heat radiating plate 7 to the heat radiating portion 4 and radiated to the outside air through the heat radiating portion 4. it can.

  As shown in FIGS. 2 and 4, the heat radiating plate 7 is provided with a groove-like mounting groove 72 at the periphery of the surface 71 on the side of the light transmitting portion 2, and three screws for the periphery of the surface 71. Holes 71a, 71a, 71a are provided. The translucent part 2 is attached to the heat sink 7 by bonding with an adhesive in a state where the outer edge 2 a is fitted in the attachment groove 72. Further, an uneven engaging portion 74 for engaging with an engaging groove 42 of the heat radiating portion 4 described later is provided on the periphery of the surface 73 on the heat radiating portion 4 side of the heat radiating plate 7.

  The heat radiating part 4 is made of a metal material having high thermal conductivity such as aluminum, and the diameter of the cross section of the heat radiating part 4 increases from the direction connecting the base part 5 to the light transmitting part 2 (vertical direction). It has a cylindrical shape like this.

  A flange 41 is provided on the periphery of the end of the heat radiating part 4 on the side close to the translucent part 2, and the engaging part 74 described above is provided on the peripheral surface of the flange 41 facing the heat radiating plate 7. Is provided with a groove-like engagement groove 42 for fixing to the heat radiating plate 7. Further, on the inner peripheral edge of the collar portion 41, boss portions 43 having screw holes 43a, 43a, 43a provided in three vertical directions are provided. With the heat radiating portion 4 and the heat radiating plate 7 engaged with the engaging groove 42 and the engaging portion 74, the screw holes 71a, 71a, 71a and the screw holes 43a, 43a, 43a are aligned with each other. Secure to the heat dissipation part 4 with screws.

  A plurality of heat radiation grooves 44, 44, 44,... That are long in the vertical direction are formed on the outer peripheral surface of the heat radiation part 4, and the heat transmitted to the heat radiation part 4 passes through the surface of the heat radiation grooves 44, 44, 44,. Heat can be dissipated into the outside air.

  As shown in FIGS. 3 and 4, the heat radiating unit 4 has a cavity formed therein as a housing unit 45 and houses the drive circuit unit 3 for supplying required power to the LED module 11. In addition, the accommodating portion 45 is provided with a fixing portion 8 for isolating and fixing the drive circuit portion 3 to the inner wall surface of the heat radiating portion 4 in the accommodating portion 45. The fixing portion 8 is made of a material such as an electrically insulating resin, and has a substantially cylindrical shape that expands from the base portion 5 side that can be inserted into the housing portion 45 to the translucent portion 2 side.

  The drive circuit unit 3 is fixed to the fixed unit 8 and inserted into the housing unit 45 by fitting the edge 32 a of the drive circuit unit 3 to the fitting units 81, 81 inside the fixed unit 8. At that time, the positioning portions 82, 82, 82 provided on the periphery of the fixing portion 8 and the boss portions 43, 43, 43 provided on the periphery of the heat radiating portion abut on each other, thereby Positioning is done. Further, the fixing portion 8 is positioned in the longitudinal direction of the heat radiating portion 4 by the support convex portion 46 formed on the bottom surface inside the heat radiating portion 4 and the projections 83 and 84 provided on the frame on the heat radiating plate 7 side of the fixing portion 8. Is made.

  Further, the fixing portion 8 includes the heat generating components 31a, 31a, 31a,... Constituting the drive circuit components 31, 31, 31,... And the circuit components 31b, 31b, 31b,. The surface facing the heat generating components 31a, 31a, 31a... And the circuit components 31b, 31b, 31b,. . Thereby, the heat from the drive circuit components 31, 31, 31,... Can be conducted to the heat radiating unit 4 without being blocked by the fixing unit 8.

  Inside the heat radiating section 4, there is a convex heat transfer section 47 having a surface 47a that faces the heat generating components 31a, 31a, 31a... Of the drive circuit section 3 and is close to the heat generating components 31a, 31a, 31a. It is formed on the inner wall surface of the heat radiation part 4. The gap G between the heat generating components 31a, 31a, 31a,... And the surface 47a of the heat transfer section 47 is 3 mm to 5 mm to the extent that a heat conduction member 9 described later can be inserted. The heat transfer section 47 is made of a metallic material having excellent thermal conductivity, such as aluminum, and may be of the same material as the heat dissipation section 4 or may be integrated with the heat dissipation section 4 using an adhesive or the like as a separate body. It may be connected to the inner wall surface.

  When the heat transfer part 47 is formed separately, the heat transfer part 47 is formed in a part of the housing part 45 by using a material that is lighter than the heat dissipation part 4 for the heat transfer part 47. The weight of the lighting device 100 can be suppressed.

  The heat generating components 31a, 31a, 31a,... Are generated from the heat generating components 31a, 31a, 31a, etc. by housing the drive circuit unit 3 in the housing portion 45 so that the heat generating components 31a, 31a, 31a,. Heat is quickly conducted to the heat transfer section 47, and the heat residence time in the housing section 45 is shorter than in the prior art. Therefore, the temperature rise in the accommodating part 45 can be reduced, and this can reduce the thermal load on each drive circuit component 31, 31, 31,..., The LED module 11, and other components.

  As shown in FIGS. 2 and 4, a connecting body 6 is provided between the heat dissipating part 4 and the base part 5 on the base part 5 side of the heat dissipating part 4, and the connecting body 6 includes the heat dissipating part 4 and the base part. The parts 5 are connected. The connection body 6 is made of a material having electrical insulation properties such as resin, and has a substantially cylindrical shape for passing a power line (not shown) for supplying required power from the base portion 5 to the drive circuit portion 3. There is no.

  The coupling body 6 includes a heat radiation part connection part 61 for connecting to the heat radiation part 4 and a base connection part 62 that is formed integrally with the heat radiation part connection part 61 and holds the base part 5. There are screw holes 48, 48, 48 for connecting the heat dissipating part 4 and the connecting body 6 at three positions inside the periphery of the surface of the heat dissipating part 4 on the side of the connecting body 6. The heat radiation part 4 and the heat radiation part connection part 61 are connected to each other by screw holes 61a, 61a, 61a and screws (not shown) provided on the periphery of the heat radiation part. The base connection portion 62 is threaded on the outer peripheral surface, and is screwed with the inner peripheral surface of the base portion 5 to be connected to the base portion 5.

  The base part 5 has a cavity 51 on the inner side, one end side is open, and the other end side has a bottom. The base part is screwed on the outer peripheral surface with a light bulb socket and is threaded to be electrically connected to an external power source, and the other electrode terminal 53 provided on the bottom surface of the base part 5. It consists of. The one-pole terminal 52 and the other-pole terminal 53 are insulated.

  Further, as shown in FIGS. 3 and 4, between the surface 47a of the heat transfer section 47 and the heat generating components 31a, 31a, 31a..., A flexible sheet shape having high thermal conductivity and electrical insulation. The heat conducting member 9 (for example, silicone gel sheet) is installed so as to be in contact with the heat transfer portion 43 and the heat generating component 31a.

  Since the heat conducting member 9 has electrical insulation, the drive circuit unit 3 and the heat transfer unit 47 can be prevented from being short-circuited. Further, since the heat conducting member 9 is flexible, it does not let heat escape to the peripheral part by contacting the heat generating parts 31a, 31a, 31a... And the surface 47a of the heat conducting part 47, and has a higher thermal conductivity. The heat generated from the heat generating components 31 a, 31 a, 31 a... Is more efficiently conducted to the heat radiating portion 4 than the heat radiating portion 4 through the air in the housing portion 45 and efficiently radiated from the heat radiating portion 4. be able to.

The translucent part 2 is made of milky white glass as shown in FIGS. 4 and 5, and has a dome shape that covers the light emission direction side from the light source module 1. The inner surface 2b of the light transmitting part 2 is coated with a scattering prevention film 21 for preventing the light transmitting part from scattering when a load such as an impact is applied to the light transmitting part. The scattering prevention film 21 is applied by mixing a film base material 21 a made of silicone rubber-based synthetic resin or the like and a diffusion material 21 b that diffuses light from the light source module 1.
The diffusing agent 21b may be, for example, a material having a crystal structure, optical properties, a large refractive index, a small light absorption ability, and a high light scattering ability. As the diffusing agent, for example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, calcium carbonate, silicon dioxide or the like is used.

  Further, a phosphor may be added to the film substrate 21a in addition to the diffusing agent 21b or in place of the diffusing agent 21b. For example, yttrium is used as the phosphor. In the present embodiment, the film thickness of the scattering prevention film 21 is about 30 (μm). In the present embodiment, silicone rubber is used as the membrane base material 21a. However, the present invention is not limited to this, and the membrane base material 21a extends without breaking so that the fragments are not scattered when the cover 4 is damaged by impact. It is only necessary that the material is made of a material having elasticity or ductility.

  The anti-scattering film 21 is sprayed on the inner surface 2b of the light transmitting portion and sprayed over the entire surface, and then preliminarily dried at 100 ° C., and then baked and fixed at 150 ° C. In addition, the film | membrane base material 21a and the diffusion material 21b can also be apply | coated separately, respectively, without mixing. It is preferable that the scattering prevention film 21 has such a property that the amount of light from the LED module 11 does not decrease when it is applied. The application surface of the anti-scattering film 21 is not limited to the inner surface 2b of the translucent part 2, and may be the outer surface or both surfaces. Furthermore, a synthetic resin such as polycarbonate can be used for the light transmitting portion 2.

  The scattering prevention film 21 causes the fragments of the light transmission part 2 to be scattered due to the ductility of the film substrate 21a constituting the scattering prevention film 21 when a load due to a drop impact or the like is applied to the light transmission part 2. Can be prevented. Further, the light from the LED module 11 that is a light source is incident on the scattering prevention film 21 applied to the inner surface of the translucent portion 2, and the incident light is diffused by the diffusion agent 21 b that constitutes the scattering prevention film 21. The light is transmitted and emitted from the light transmitting portion 2. By diffusing and irradiating light in this way, it is possible to reduce glare that occurs when using a light source with strong light directivity, such as an LED.

  The drive circuit section has drive circuit components 31, 31, 31,... Mounted on both surfaces of a substrate 32 made of paper phenol or glass epoxy. A plurality of heat generating components 31a, 31a, 31a (for example, bridge diodes, ICs, resistors, diodes, etc.) constituting the drive circuit component 31 are provided on the surface of the substrate 32 on the side close to the surface 47a of the heat transfer section 47. The circuit components 31b, 31b, 31b,... Other than the heat generating components constituting the drive circuit component 31 are mounted on the opposite surface.

  As shown in FIG. 6, the heat generating components 31a, 31a, 31a,... Are arranged in a line in the vertical direction so that the sheet-like heat conducting member 9 that is long in the vertical direction can be easily covered. .

  It is not necessary to arrange all of the heat generating components 31a, 31a, 31a... On the surface close to the surface 47a of the heat transfer section 47 of the substrate 32, and may be a part of them. At that time, the amount of heat generated from the heat-generating component mounted on at least the surface close to the surface 47a of the heat transfer section 47 of the substrate 32 is larger than the amount of heat generated from the heat-generating component mounted on the other surface. The heat generating components 31a, 31a, 31a,.

  The heat generating components 31a, 31a, 31a,... Are gathered on a surface close to the surface 47a of the heat transfer section 47 of the substrate 32 so that the heat generating components 31a, 31a, 31a,. The heat generated from 31a ... is directly transmitted to the heat conducting member 9, the heat from the heat generating components 31a, 31a, 31a ... is suppressed from being conducted to the air in the housing portion 45 and staying in the housing portion 45, and the heat Conduction can be more efficiently conducted from the conductive member 9 to the heat transfer section 47.

  Further, by adopting a configuration in which circuit components can be mounted on both surfaces of the substrate 32, the area of the substrate 32 can be effectively utilized, and the drive circuit components 31, 31, 31,... Can be mounted without increasing the size of the substrate 32. Therefore, the drive circuit unit 3 can be reduced in size.

In addition, the substrate 32 constituting the drive circuit unit 3 has a horizontal width of the mounting surface of the drive circuit components 31, 31, 31,... Narrowed toward the base unit 5 in accordance with the shape of the housing unit 45. The shape is wide toward the translucent part 2. Since the width of the end portion 32 b on the base portion 5 side of the substrate 32 is narrower than the horizontal width of the cavity 51 inside the base portion 5, the end portion 32 b of the substrate 32 can be accommodated inside the base portion 5. Thus, it is possible to effectively use the space of the housing portion 45, which contributes to downsizing of the entire lighting device 100.
Further, the drive circuit unit 3 and the base unit 5 are connected by a power line (not shown) in order to supply power to the drive circuit unit 3.

(Embodiment 2)
FIG. 7 is a cross-sectional view of the main part of the illumination device 110 according to Embodiment 2 of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The illuminating device 110 according to Embodiment 2 has an accommodating portion 45 that can accommodate the drive circuit portion 3 inside the radiating portion 4, similarly to the radiating portion 4 of Embodiment 1. In the housing part 45, a substantially semi-cylindrical heat transfer part 49 is formed so as to fill a part of the housing part 45 from the inner peripheral surface of the heat radiating part 4.

  Further, the drive circuit portion 3 is accommodated in the accommodation portion 45 while being fixed to the fixing portion 8 so that the heat generating components 31a, 31a, 31a... Are opposed to and close to the surface 49a of the heat transfer portion 49. A distance G between the heat generating components 31a, 31a, 31a, and the surface 49a of the heat transfer section 49 is 3 mm to 5 mm.

  Further, as in the first embodiment, between the drive circuit unit 3 and the surface 49 a of the heat transfer unit 49, the heat conducting member 9 is in contact with the heat generating components 31 a, 31 a, 31 a. Has been inserted.

  The heat transfer section 49 is made of a metal material having excellent thermal conductivity, such as aluminum, and may be the same material as the heat radiating section 4 or a different material. For example, it may be connected to the heat radiating part 4. Further, in order to reduce the weight of the heat transfer section 49, a cavity, a hole, or the like may be provided inside the heat transfer section 49.

  By forming the heat transfer portion 49 into a substantially semi-cylindrical shape that fills a part of the housing portion 45 from the inner peripheral surface of the heat radiating portion 4, the convex heat transfer portion 47 as in the first embodiment is formed. The step between the heat transfer portion 47 and the inner peripheral surface of the heat radiating portion 4 generated during the filling is filled, and the area of the surface 49a adjacent to the heat generating components 31a, 31a, 31a. Thereby, it is not necessary to arrange | position the heat-emitting components 31a, 31a, 31a ... according to the width | variety of the surface which adjoins heat-emitting components 31a, 31a, 31a .... Therefore, even if the positions of the heat generating components 31a, 31a, 31a,... Are shifted in the direction parallel to the surface 49a, the heat generating components 31a, 31a, 31a, etc. can be brought close to the surface 49a of the heat transfer section 49. Moreover, since the volume of the heat transfer part 49 can be made larger than the volume of the heat transfer part 47, thermal resistance can be reduced rather than the heat transfer part 47, and the temperature rise of the illuminating device 110 can be reduced.

(Embodiment 3)
FIG. 8 is a cross-sectional view of the main part of the illumination device 120 according to Embodiment 3 of the present invention, and FIG. 9 is a vertical cross-sectional view of the main part of the heat dissipation part in FIG. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The illuminating device 120 which concerns on Embodiment 3 is a substantially semi-cylindrical shape as shown in FIG. Inside the heat radiating portion 4, a heat absorbing groove 410 is formed in the vertical direction. The heat absorbing groove 410 is formed by a plurality of groove-shaped irregularities having a depth of 0.5 mm to 2 mm and a width of 0.5 mm to 2 mm. In addition, the heat absorption groove 410 inside the heat radiating part 4 is not applied to the part in contact with the heat conducting member 9 on the surface 49 a of the heat transfer part 49. The shape of the heat absorbing groove 410 inside the heat radiating portion 4 is intended to increase the surface area of the inner wall surface of the heat radiating portion 4, and thus is not limited to the vertical concave and convex grooves. It may be a groove, a concave portion, a convex portion, a lattice-like groove, or the like, and the dimensions are not limited to the above.

  The heat absorbing groove 410 on the inner wall surface of the heat radiating portion 4 can increase the surface area inside the heat radiating portion 4, increasing the contact area with the air in the housing portion 45, and from the heat generating components 31 a, 31 a, 31 a. By increasing the area that absorbs the generated heat, the efficiency of conduction to the heat radiating part 4 can be improved, and the temperature rise in the housing part 45 can be reduced. The heat absorbing groove 410 on the inner wall surface of the heat radiating portion 4 can be used not only in the third embodiment but also in the first and second embodiments, and the same effect can be obtained.

  A black paint (not shown) is applied to the entire inner wall surface of the heat radiating portion 4. As the black paint, a paint having a high infrared absorption efficiency (for example, a paint containing carbon) is used. This increases the efficiency with which the heat radiating part 4 absorbs the radiant heat generated from the heat generating components 31a, 31a, 31a, and reduces the temperature rise in the housing part 45 by quickly radiating heat from the heat radiating part to the outside air. Can do. The black paint is not limited to a paint containing carbon, but may be a lacquer or the like, and is not limited to black, and may be a dark color (for example, deep gray) paint. The black paint can also be used in the first and second embodiments, and the same effect can be obtained.

(Embodiment 4)
Hereinafter, a lighting apparatus according to Embodiment 4 of the present invention will be described. In addition, description is abbreviate | omitted about the structure similar to the illuminating device based on Embodiment 1 to 3 mentioned above, and only the characteristic part which the illuminating device of Embodiment 4 has is demonstrated.

  The illuminating device according to the fourth embodiment does not have a heat transfer unit that brings heat generating components close to each other and conducts heat from the heat generating components to the heat radiating unit, unlike the lighting devices of the first to third embodiments. Heat generated from the heat-generating component can be quickly conducted to the heat-dissipating part by accommodating the drive circuit part in the accommodating part so that the heat-generating component mounted on the circuit part is directly close to the inner wall surface of the heat-dissipating part. It is possible to efficiently dissipate heat from the heat radiating part.

  In addition, it is preferable that a heat conductive member having high heat conductivity is interposed between the heat generating component and the inner wall surface of the heat radiating portion. As described in the above embodiment, by interposing the heat conducting member, it is possible to more efficiently conduct heat generated from the heat generating component to the heat radiating portion.

  As described above, by bringing the heat generating component close to the inner wall surface of the heat radiating portion, heat generated from the heat generating component is quickly conducted from the inner wall surface of the heat radiating portion to the heat radiating portion, compared with the conventional technology. The residence time of heat in the housing part is shortened. Therefore, the temperature rise in the accommodating portion can be reduced, and the thermal load on the drive circuit component, the light source, and other components can be reduced.

  As described above, in Embodiments 1, 2, 3, and 4, the embodiment in which the LED is used as the light source has been described as an example. However, the present invention is not limited to this, and EL (Electroluminescence) or the like may be used. Moreover, although the form of the light bulb type lighting apparatus has been exemplified as the form of the lighting apparatus, the present invention is not limited to the existing light bulb type lighting apparatus, and the lighting apparatus of another shape such as a downlight or a ceiling light is used. Can also be applied.

DESCRIPTION OF SYMBOLS 1 Light source module 3 Drive circuit part 4 Heat radiating part 9 Heat conduction member 31a Heat generating component 45 Housing part 47 Heat transfer part 49 Heat transfer part 410 Heat absorption groove

Claims (4)

A light source;
A drive circuit unit for driving the light source;
A heat dissipating part in which a cavity is formed ;
The pre-SL driver circuit portion and an electrically insulating fixing portion for fixing spaced apart from the inner surface of the heat radiating portion,
The heat dissipation part has a boss part protruding in the cavity direction,
The fixed portion is inserted into the inner surface side of the heat radiating portion,
The light bulb-type lighting device, wherein the fixing portion includes a positioning portion that is positioned to face the boss portion.   The bulb-type lighting device according to claim 1, wherein a plurality of the boss portions are provided on a peripheral edge of the cavity.   The bulb-type lighting device according to claim 2, wherein the boss portions are provided at three locations on the periphery of the cavity. The bulb type according to any one of claims 1 to 3, wherein the boss portion and the positioning portion are in contact with each other, thereby positioning the fixing portion with respect to a circumferential direction of the heat radiating portion. Lighting equipment.