JP5320627B2 - Lamp with lamp and lighting equipment - Google Patents

Description

The present invention relates to a lamp with a base and a lighting fixture having a light emitting module using a semiconductor light emitting element such as a light emitting diode as a light source.

  In recent years, instead of filament light bulbs, lamps with caps such as light bulb shaped LED bulbs that use light-emitting diodes, which are semiconductor light-emitting elements with long life and low power consumption, have come to be adopted as light sources for various lighting fixtures. ing. For example, Patent Document 1 discloses a light-emitting diode mounted on a substrate, a lighting device that lights the light-emitting diode, a cover in which the lighting device is accommodated, a base attached to one side, and a substrate attached to the other side; Shown are an LED bulb and a luminaire consisting of a translucent globe provided to cover the diode.

JP 2008-91140 A

  When a lamp with a cap using this type of light-emitting diode as a light source is configured, light emission performance corresponding to an incandescent lamp is required. Incandescent light bulbs have the ability to emit light over an angle of approximately 360 ° excluding the base from a filament close to a point light source. However, since the LED bulb shown in Patent Document 1 emits light only from the surface side of the substrate on which the light-emitting diode is mounted, even if the external shape is approximated to an incandescent bulb, the light distribution characteristic is that of an incandescent bulb. Will be different.

  In particular, in lighting fixtures such as downlights that use incandescent bulbs as the light source, illuminance directly below is important in the case of bare lighting, but when the above LED bulbs are attached to downlights designed for incandescent bulbs The amount of light on the back side, that is, the amount of light radiated to the reflector near the socket is insufficient, resulting in a problem that the light distribution characteristics of the instrument are greatly different and the desired illuminance cannot be obtained.

The present invention has been made in view of the above problems, and provides a lamp with a base having a light emitting module capable of obtaining light emission performance corresponding to an incandescent bulb, and obtains a light distribution characteristic corresponding to the incandescent bulb. It is intended to provide a luminaire capable of this.

The invention of the lamp with a cap according to claim 1 is characterized in that the semiconductor light emitting device , the semiconductor light emitting device is disposed on the front surface side, radiates light on the front surface side, transmits light of the semiconductor light emitting device, and transmits light on the back surface side. A light-emitting module having a light-transmitting substrate that emits light; a substrate support at one end, and the light emitted from the back side of the light-emitting module so that the front side of the light-emitting module faces the direction of one end A main body in which the back side of the substrate is supported by the substrate support portion so as to radiate to the end side; a translucent cover member provided so as to cover the light emitting module; a lighting device for lighting the light emitting module; And a cap member provided at the other end of the base and connected to the lighting device . According to the present invention, a light-transmitting substrate that transmits light from a semiconductor light-emitting element and emits light also on the back surface side can emit light from both the front and back surfaces of the substrate. A light emitting module capable of obtaining the above can be configured. Furthermore, by using the light emitting module as a light source, it is possible to configure a lamp with a base that can emit light also to the back side of the lamp and can obtain light emission performance equivalent to an incandescent bulb.

  In the present invention, as the semiconductor light emitting device, a light emitting device using a semiconductor as a light emitting source such as a light emitting diode, a semiconductor laser, or an organic EL is allowed. It is preferable that a plurality of semiconductor light-emitting elements are formed. However, a necessary number is selected according to the use of illumination. For example, a plurality of element groups are formed, and one or more groups are formed. You may comprise. Furthermore, it may be composed of one semiconductor light emitting element.

  The substrate is a member for disposing a semiconductor light emitting element as a light source on the front surface side, and a member having translucency for transmitting the light of the semiconductor light emitting element and emitting it to the back surface side, for example, A thin ceramic is preferably used, but may be a synthetic resin such as glass or epoxy resin. Further, in order to dissipate heat generated from the semiconductor light emitting element, a part of the above-described translucent member may be made of a metal having good thermal conductivity such as aluminum, copper, and stainless steel.

  In addition, a semiconductor light emitting element is mounted on a substrate in a partly or entirely arranged in a regular order such as a matrix, a staggered pattern or a radial pattern using, for example, COB (Chip on board) technology. However, SMD type (Surface Mount Device) may be used, and the configuration and mounting means of the substrate are not limited to specific ones. Further, the shape of the substrate may be a polygonal shape such as a quadrangle or a hexagon, or a circle or an ellipse to form a point or surface module. All shapes that can be arranged and obtain the desired light distribution are acceptable.

  The semiconductor light emitting device disposed on the substrate is composed of, for example, a blue light emitting diode chip to emit white light, the blue light emitting diode chip is mounted on the surface side of the substrate, and the yellow phosphor is disposed on the surface side of the substrate. It is preferable to provide white light from both sides of the substrate, provided on the back side, and means for obtaining white light include, for example, a red light emitting diode chip (R), a green light emitting diode chip (G), and a blue light emitting diode. A chip group that emits white light may be configured by a combination of three light emitting diode chips of the chip (B). Here, the phosphor is provided on the front side and the back side of the substrate. It is not an indispensable means for constructing. In addition, the semiconductor light emitting element is preferably configured to emit white light such as daylight color, day white color, and light bulb color, but depending on the use of the lighting fixture, red, blue, green, etc. You may comprise combining. A separate light control means such as a lens body for controlling the optical path may be added to the front surface of the semiconductor light emitting element.

  The light emitting module according to the present invention is composed of a semiconductor light emitting element and a translucent substrate. For example, when used as a light source of a lamp with a cap, it is configured as a module component manufactured in advance in a module form. Or the light emitting module which consists of the light emitting unit comprised in a lamp main body by assembling | assembling each component mentioned above individually to a lamp | ramp with a nozzle | cap | die may be sufficient.

  Further, the light emitting module is preferably applied to a lamp with a base for obtaining light emission performance corresponding to an incandescent bulb that emits light over an angle of about 360 ° excluding the base, but the appearance shape is generally Not only lamps with caps approximated to incandescent bulbs, but also applied to lighting devices and display devices for general lighting such as residential and commercial use that require lighting on both the front and back sides that make various external shapes and applications Good.

  In the present invention, the lamp with a cap is a lamp with a cap (A type or PS type) approximated to the external shape of a general incandescent bulb, a ball-shaped lamp with a cap (G type), a cylindrical lamp with a cap (T type ), A lamp with a reflex base (R type) or the like. Furthermore, it may constitute a globeless lamp with a base.

  The main body is formed of a metal having good thermal conductivity, for example, a metal including at least one of aluminum (Al), copper (Cu), iron (Fe), and nickel (Ni) in order to enhance heat dissipation of the semiconductor light emitting device. In addition to this, other industrial materials such as aluminum nitride (AlN) and silicon carbide (SiC) may be used. Furthermore, you may comprise with synthetic resins, such as high heat conductive resin.

  The light transmitting function of the main body, that is, the main body configured to be able to radiate the light emitted from the back side of the light emitting module to the other end side is a cylindrical body made of a metal that does not transmit light, for example, aluminum. In addition, it is preferable to transmit light by forming a large number of holes and slits penetrating the inside and outside of the cylinder, but the main body itself is made of a transparent synthetic resin or glass such as transparent or translucent. It may be configured to transmit light.

  The appearance shape of the main body can be formed in a shape that approximates the silhouette of the neck portion of a general incandescent bulb so that the diameter gradually decreases from one end to the other. Although it is preferable to improve, it is not a necessary condition that the appearance shape approximates that of a general incandescent lamp, and the shape is not limited to a limited specific appearance shape.

  As the lighting device, for example, one that constitutes a lighting circuit that converts an AC voltage of 100 V into a DC voltage of 24 V and supplies the converted voltage to the semiconductor light emitting element is allowed. Moreover, the lighting device may have a dimming circuit for dimming the semiconductor light emitting element. The lighting device may be housed in the main body, or may be housed in a base provided at the other end of the main body. In short, all configurations provided in the main body are allowed.

  As the base member, all bases that can be attached to a socket to which a general incandescent light bulb is attached are allowed, but generally, the most widely used bases such as Edison type E26 type and E17 type are suitable. In addition, even if the material is a metal base as a whole, the electrical connection part is made of a metal such as a copper plate, and the other part is a plastic base made of a synthetic resin. It may be a base having a pin-shaped terminal used for a fluorescent lamp or a base having an L-shaped terminal used for hook sealing, and is not limited to a specific base.

The lamp with a cap according to claim 2 is the lamp with a cap according to claim 1, wherein an opening is formed in the other end of the main body, and the opening accommodates the lighting device. It is characterized in that at least a part of the case is fitted . The lamp with a cap according to claim 3 is the lamp with a cap according to claim 1 or 2, wherein a phosphor is provided on the surface side of the substrate so as to cover the semiconductor light emitting element, and A phosphor is also provided on the back side.

The invention of the lighting fixture according to claim 4 comprises: a fixture main body provided with a socket; and the lamp with cap according to any one of claims 1 to 3 attached to the socket of the fixture main body. It is characterized by being. According to the present invention, by using the lamp with a cap according to any one of claims 1 to 3, light can be emitted also to the back side of the bulb, and light distribution characteristics corresponding to an incandescent bulb can be obtained. It is possible to configure a lighting fixture capable of In the present invention, the lighting fixture may be a ceiling-embedded type, a direct-attached type, a suspended type, or a wall-mounted type. Alternatively, a lamp with a cap serving as a light source may be exposed. Moreover, not only what attached the lamp | ramp with one nozzle | cap | die to the instrument main body, A plurality may be arrange | positioned. Furthermore, it is not limited to a general house, and a large luminaire for facilities and business such as an office may be configured.

According to the first aspect of the present invention, the translucent substrate that transmits the light of the semiconductor light emitting element and emits the light to the back side can also emit light from both the front and back surfaces of the substrate, which corresponds to an incandescent light bulb. It is possible to provide a light emitting module capable of obtaining the light emission performance. Furthermore, by using the light emitting module as a light source, it is possible to provide a lamp with a base that can emit light also to the back side of the lamp and can obtain light emission performance equivalent to an incandescent bulb.

According to the second aspect of the present invention, it is possible to provide a lamp with a cap that can radiate light to the back side of the lamp and can obtain light emission performance equivalent to an incandescent lamp. According to the third aspect of the present invention, it is possible to provide a lamp with a cap that can radiate light to the back side of the lamp and can obtain light emission performance equivalent to an incandescent lamp.

According to the invention described in claim 4, by using the lamp with cap according to any one of claims 1 to 3 , light can be emitted also to the back side of the bulb, and the light distribution corresponding to the incandescent bulb It is possible to provide a lighting fixture capable of obtaining characteristics.

The light emitting module which is embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing which follows the bb line of (a), (c) is a bottom view. Sectional drawing which similarly shows a light emitting module and is expanded along the aa line of FIG. Similarly, the state where the light emitting module is incorporated in the main body of the lamp with cap is shown, (a) is a top view, (b) is a sectional view taken along line bb in (c), and (c) is a bottom view. Sectional drawing which similarly shows the lamp | ramp with a cap incorporating the light emitting module along the central axis yy. Sectional drawing which shows schematically the state which installed the lighting fixture which similarly equipped with the lamp | cap | die with a nozzle | cap | die on the ceiling. The modification of the light emitting module in embodiment of this invention is shown, (a) is sectional drawing equivalent to FIG. 2 which shows a 1st modification, (b) is a longitudinal cross-sectional view which shows a 2nd modification, (c) ) Is a longitudinal sectional view showing a third modification. The modification of the lamp | ramp with a cap in embodiment of this invention is shown, (a) is a top view equivalent to Fig.3 (a) which shows a 1st modification, (b) is a figure which similarly shows a 1st modification. Sectional drawing equivalent to 3 (b). Sectional drawing equivalent to FIG. 4 which similarly shows the 2nd modification of a lamp | ramp with a nozzle | cap | die .

Hereinafter, an embodiment of a lamp with a cap and a lighting fixture having a light emitting module according to the present invention will be described.

  First, the configuration of the light emitting module will be described. As shown in FIGS. 1-2, the light emitting module 10 of a present Example is comprised as a light source for the lamp | ramp 20 with a cap mentioned later, and the light emitting diode chip | tip 11 (henceforth the following) which comprises the semiconductor light emitting element in this invention. The LED chip 11 is referred to as an “LED chip”) and the substrate 12 on which the LED chip 11 is disposed. The LED chip 11 serves as a light source of the light emitting module 10, and a plurality of LED chips having the same performance are prepared. In this embodiment, each LED chip is composed of a blue LED chip with high brightness and high output. .

  The substrate 12 is a member for disposing the LED chip 11, is made of a translucent ceramic material, and has a thickness of about 0.4 to 1.2 mm, which forms a substantially square shape with four corners cut off, preferably , 0.5 to 1.0 mm thin flat plate. On the front side F of the substrate 12, a bank portion 12a whose inner peripheral surface forms a substantially circular shape is integrally formed, and a shallow circular accommodation recess 12b is formed. A wiring pattern 12c made of copper foil is formed on the bottom surface of the housing recess 12b.

  The LED chip 11 and the substrate 12 configured as described above mount the plurality of LED chips 11 in a substantially matrix shape adjacent to the wiring pattern 12c in the housing recess 12b of the substrate 12 using COB technology. At this time, the plurality of LED chips 11 are directly supported on the surface of the substrate 12 by an adhesive made of translucent silicone resin, epoxy resin, or the like, and light emitted from the back side of each LED chip 11 is the substrate. 12 is supported so as to be transmissive. The LED chips 11 regularly arranged in a substantially matrix form are connected in series by the adjacent wiring pattern 12c and bonding wires w (FIG. 2). In FIG. 1, reference numeral 12 d denotes a support unit that is integrally formed at both ends of the substrate 12, and is a member that supports the light emitting module 10 on a main body 21 of a lamp 20 with a cap that will be described later. Reference numeral 12e denotes a pair of input terminals in the LED chip 11 connected in series.

  The surface side F of the light emitting module 10 configured as described above is coated or filled with a sealing member 13 as shown in FIGS. That is, the sealing member 13 transmits blue light emitted from the blue LED chip described above, and excites the phosphor with blue light to convert it into yellow light. The yellow phosphor 14 is applied to a transparent silicone resin. The mixed and dispersed material is applied or filled over the entire surface of the housing recess 12b of the substrate 12 so as to be embedded including the LED chip 11 and the wiring pattern 12c. As a result, the space formed around the embedded LED chip 11 and between adjacent LED chips is covered with a layer in which a yellow phosphor is mixed and dispersed in a transparent silicone resin. The chip 11 (blue LED chip) is sealed and mounted on the surface side F of the substrate 12.

  Further, on the back surface B of the substrate 12, a circular bank portion 12f is integrally formed at a position corresponding to the housing recess 12b on the front surface F to form a housing recess 12g. A sealing member 13 'in which a yellow phosphor 14' is mixed and dispersed in the same transparent silicone resin is applied or filled.

  Accordingly, in this embodiment, each LED chip 11 is configured by a blue LED chip, and therefore, as shown by a solid line arrow in FIG. The phosphor 14 is excited to be converted into yellow light, and blue light and yellow light are mixed and emitted from the surface side F of the substrate 12 as white light. At the same time, as indicated by a dotted arrow, blue light emitted from the back side of the blue LED chip passes through the translucent substrate 12 and excites the phosphor 14 ′ of the sealing member 13 ′ on the back side B. It is converted into yellow light, and blue light and yellow light are mixed and emitted from the back surface side B of the substrate 12 as white light. Thereby, while emitting white light to the surface side of the board | substrate 12, the optical axis which radiates | emits white light also to a back side is set to xx (FIG. 2), and the light emitting module 10 which makes the external shape the substantially square which cut four corners. Is configured.

  The lamp 20 with the cap is configured using the light emitting module 10 configured as described above. That is, as shown in FIG. 4, the lamp with cap 20 includes the light emitting module 10 configured as described above, a main body 21 that supports the light emitting module at one end, a lighting device 22 that is provided in the main body and lights the light emitting module, The cap member 24 is provided at the other end and connected to the lighting device.

  As shown in FIG. 3, the main body 21 is made of a metal having good thermal conductivity, which is aluminum in this embodiment, and is formed in a substantially cylindrical shape as a whole. That is, an end plate 21a having a substantially circular shape is provided at one end of the cylinder, and a large number of radiation fins 21b are integrally formed radially on the back side of the end plate. The outer peripheral surface of this large number of heat dissipating fins is formed so as to form a substantially conical tapered surface whose diameter is gradually reduced from one end to the other end, and the overall appearance approximates the silhouette of the neck of an incandescent lamp. Configure the shape. The main body 21 having these configurations is processed by, for example, casting, forging, cutting, or the like, and has a space portion 21c inside, and a large number of slit-shaped gaps 21d communicate between the outside and the space portion 21c between the respective radiation fins. In this way, a large number are formed in the radial direction with the central axis yy of the main body 21 as the center line, and the entire body 21 is formed in a substantially cylindrical shape.

  The end plate 21a at one end of the main body 21 is integrally formed with a substrate support portion 21e having a flat surface so that a circular recess is formed, and a ring shape is formed around the substrate support portion 21e. The protruding ridges 21f are formed integrally. Furthermore, a circular through hole 21g centering on the central axis yy of the main body 21 is formed in the central portion of the substrate support portion 21e. This through hole is a circle having a size corresponding to the housing recess 12g on the back surface side B so as to transmit white light emitted from the back surface side B of the substrate 12 in the light emitting module 10, and is a hole penetrating the space portion 21c. Form. Thereby, the main body 21 is configured such that the light emitted from the back surface side B of the light emitting module 10 can be emitted to the other end side.

  The light emitting module 10 having the above-described configuration is mounted on the substrate support portion 21e of the main body 21 configured as described above so as to achieve electrical insulation and be in close contact with the substrate 21a. That is, as shown in FIG. 3, the light emitting module 10 is mounted in close contact with the back surface B with the front surface F facing upward using a fixing means such as a screw to the substrate support portion 21 e that forms a flat surface. If necessary, attach it in close contact with an electrical insulating sheet such as silicone resin. Accordingly, the housing 12g on the back surface side B of the substrate 12, that is, the light emitting portion on the back surface side matches the circular through hole 21g of the substrate support portion 21e, and the white light emitted from the back surface side is shown in FIG. As indicated by a dotted arrow, the light is transmitted through the through hole 21g and radiated toward the space portion 21c. As a result, the light emitting module is supported at one end of the main body 21 such that the surface side F of the light emitting module 10 faces in the direction of the one end, and the optical axis xx of the light emitting module 10 is the central axis y− of the main body 21. A light source unit that substantially matches y and has a light emitting surface that is substantially circular as viewed from above is formed.

  As shown in FIG. 4, an opening 21 h is formed at the other end of the main body 21 by the inner peripheral surface of the lower end of each radiating fin 21 b, and an insulating case 23 that accommodates the lighting device 22 in this opening. Is inserted, and the lighting device 22 is provided in the main body 21. The insulating case 23 is made of a heat-resistant and electrically insulating synthetic resin such as PBT (polybutylene terephthalate) for the purpose of electrical insulation between the main body 21 made of aluminum and the lighting device 22, and has an opening 23 a at one end. The other end portion is closed and is formed into a bottomed cylindrical shape that substantially matches the inner surface shape of the space portion 21c and the opening portion 21h of the main body, and the space portion is formed with screws or an adhesive such as silicone resin or epoxy resin. It is fixed in 21c. The insulating case 23 is positioned at a substantially middle portion of the outer peripheral surface and protrudes so as to form a ring-shaped ridge to integrally form a locking portion 23b. The insulating portion 23 is formed at a portion protruding forward (downward) from the locking portion. Has a stepped outer periphery and integrally forms the base attachment portion 23c.

  The lighting device 22 for lighting each LED chip 11 includes a flat circuit board 22a on which circuit components constituting a lighting circuit for each LED chip are mounted. The lighting circuit is configured to convert the AC voltage 100V to the DC voltage 24V and supply the converted voltage to each LED chip 11. The circuit board 22a is formed in a strip-like vertically long shape, and a circuit pattern is formed on one or both sides, and the mounting surface forms a lighting circuit such as a lead component such as a small electrolytic capacitor or a chip component such as a transistor. For this purpose, a plurality of small electronic components 22b are mounted and accommodated in an insulating case 23 provided at the other end of the main body 21 with the circuit board 22a in the vertical direction. Further, an output line (not shown) for supplying power to each LED chip 11 is connected to the output terminal of the circuit board 22a, and an input line (not shown) is connected to the input terminal.

 The base member 24 is a base constituting an Edison type E26 type, and is provided with a cylindrical shell portion 24a made of a copper plate provided with a thread and an apex at the lower end of the shell portion via an electric insulating portion 24b. A conductive eyelet portion 24c is provided. The opening portion of the shell portion 24a is fitted into the base mounting portion 23c of the insulating case 23, and is fixed to the other end portion side of the main body 21 by means such as adhesion or caulking with an adhesive such as silicone resin or epoxy resin. The main body 21 made of aluminum and the base member 24 are electrically insulated. An input line derived from an input terminal of the circuit board 22a in the lighting device 22 is connected to the shell portion 24a and the eyelet portion 24c.

  The cover member 25 constitutes a globe and has translucency, for example, is composed of a synthetic resin such as thin glass or polycarbonate, and is milky white, here milky white polycarbonate having transparency or light diffusibility. And is formed into a smooth curved surface approximated to the silhouette of an incandescent bulb having an opening 25a at one end. The cover member 25 fits the opening end portion of the opening 25a into the convex strip portion 21f of the substrate support portion 21e so as to cover the light emitting surface on the front surface side F of the substrate 12, for example, with an adhesive such as silicone resin or epoxy resin. Fix it. Thereby, the inclined outer peripheral surface formed by the heat radiating fins 21b of the main body 21 has an external shape that is substantially continuous with the curved outer peripheral surface of the globe 25, and is configured to approximate the silhouette of the incandescent bulb. The

  Next, a procedure for assembling the lamp with cap 20 configured as described above will be described. First, the insulating case 23 is fitted into the opening 21h of the main body 21, and an adhesive is applied and fixed to a contact portion between the outer peripheral surface of the insulating case 23 and the inner peripheral surface of the space portion 21c. Next, the circuit board 22a of the lighting device 22 is inserted vertically into the insulating case 23, fitted into the guide groove, and supported and accommodated. Fix with adhesive if necessary.

  Next, the substrate 12 of the light emitting module 10 is placed on the flat surface of the substrate support portion 21e with the front surface side F facing up, and the surrounding four locations from the upper surface side (front surface side F) are screws s. (Fig. 3 (a)). As a result, the back surface side B of the substrate 12 and the flat surface of the substrate support portion 21e are in close contact with each other, and at the same time, the accommodating recess 12g on the back surface side B of the substrate 12, that is, the light emitting portion on the back surface side penetrates the circular shape of the substrate support portion 21e It is fixed in conformity with the hole 21g. The output line of the lighting device 22 is connected to the input terminal 12e of the substrate 12 through a through hole 21g formed in the end plate 21a of the main body 21.

  Next, the input line led out from the input terminal of the circuit board 22a is connected to the shell portion 24a and the eyelet portion 24c of the base member 24, and the opening of the shell portion 24a is connected to the base mounting portion of the insulating case 23 in the connected state. Fit into 23c and fix with adhesive.

  Next, the cover member 25 is covered so as to cover the substrate support portion 21e of the main body 21, the opening end portion of the opening 25a is fitted into the convex portion 21f of the main body 21, and an adhesive is applied to the contact portion with the convex portion. Apply and fix. Thus, the lamp-attached lamp 20 having a milky white glove as the cover member 25 at one end and an E26-type cap member 24 at the other end is approximated to the incandescent bulb silhouette. (FIG. 4).

  Next, the structure of the lighting fixture which used the lamp | ramp 20 with a nozzle | tip comprised as mentioned above as a light source is demonstrated. As shown in FIG. 5, reference numeral 30 denotes an existing downlight type lighting fixture that is embedded in a ceiling surface X of a store or the like and uses an incandescent bulb having an E26-type base as a light source, and has a metal having an opening 31a on the lower surface. It comprises a box-shaped instrument body 31, a metal reflector 32 fitted into the opening 31a, and a socket 33 into which an E26-type cap of an incandescent lamp can be screwed. The reflector 32 is made of, for example, a metal plate such as stainless steel, and a socket 33 is installed at the center of the upper surface plate of the reflector 32.

  In the existing lighting fixture 30 for an incandescent lamp configured as described above, a lamp with cap 20 using the light emitting module 10 as a light source is used in place of the incandescent lamp for energy saving and long life. That is, since the cap-equipped lamp 20 has the cap member 24 in the shape of E26, it can be directly inserted into the incandescent lamp socket 33 of the lighting fixture. At this time, the outer peripheral surface of the cap-attached lamp 20 forms a substantially conical tapered surface, and the appearance is configured to approximate the silhouette of the neck portion of the incandescent lamp. Can be smoothly inserted without hitting the reflector 32 or the like, and the application rate of the lamp with cap 20 to the existing lighting fixture is improved. Thereby, an energy-saving downlight using the LED chip 11 as a light source is configured.

 When power is applied to the downlight configured as described above, power is supplied from the socket 33 via the base member 24 of the lamp 20 with base, and the lighting device 22 operates to output a DC voltage of 24V. This DC voltage is applied to each LED chip 11 connected in series via the lighting device 22. Thereby, all the LED chips 11 are turned on simultaneously, and white light is emitted.

  At this time, in this embodiment, each LED chip 11 is formed of a blue LED chip, and thus the blue light emitted from the surface side of the blue LED chip is phosphor 14 of the sealing member 13 on the surface side F of the substrate 12. Is converted into yellow light, and blue light and yellow light are mixed and emitted from the surface side F of the substrate 12 as white light (solid arrow in FIG. 2). The white light emitted from the surface side F is emitted over the entire inner peripheral surface of the globe as the cover member 25 as shown by the solid line arrow in FIG. First, illumination is performed to directly illuminate the direction directly below the instrument (solid arrow in FIG. 5).

  At the same time, the blue light emitted from the back side of the blue LED chip is transmitted through the translucent substrate 12 to excite the phosphor 14 ′ of the sealing member 13 ′ on the back side B to be converted into yellow light. And yellow light are mixed and white light is also emitted from the back side B of the substrate 12 (dotted line arrow in FIG. 2). The white light radiated from the back surface side B is radiated toward the space portion 21c through the through hole 21g formed in the end plate 21a of the main body 21, as indicated by the dotted arrow in FIG. Furthermore, it radiates | emits toward the back surface direction of the main body 21 through the clearance gap 21d provided radially between the radiation fins 21b. The white light radiated in the rear direction of the main body 21 is radiated toward the reflector 32 in the vicinity of the socket 33 arranged in the lighting fixture 30 as shown by a dotted arrow in FIG. Is increased to be equivalent to that of an incandescent bulb.

  Each LED chip 11 is supported on the front surface F of the substrate 12 with an adhesive made of translucent silicone resin, epoxy resin, or the like, so that the light is prevented from being blocked by the adhesive, and the light is effective. In particular, it can be transmitted through the substrate 12 made of ceramics. Further, the heat generated from each LED chip 11 is transmitted from the substrate 12 made of ceramics to a substrate support portion 21e to which the substrate is closely attached and fixed, and is externally transmitted from the main body 12 made of aluminum through a large number of heat radiation fins 21b. Heat is effectively dissipated. In particular, since a slit-shaped gap 21d is formed between the heat radiating fins 21b, heat does not flow into the space portion 21c of the main body 12, and the temperature rise and temperature unevenness of each LED chip 11 are more effectively achieved. Can be prevented.

  As described above, according to the light emitting module 10 of the present embodiment, light can be emitted to the front surface side of the substrate 12 and light can also be emitted to the back surface side. Therefore, by configuring the lamp 20 with the base using the light emitting module of this embodiment as a light source, except for the part of the base member 24, it is equivalent to an incandescent lamp corresponding to an incandescent lamp that emits light over an angle of about 360 °, or Approximate light emission performance can be obtained.

  In addition, by configuring the lighting fixture 30 using the lamp 20 with the cap, it is possible to provide a lighting fixture capable of obtaining a light distribution characteristic equivalent to or close to that of an incandescent bulb corresponding to an incandescent bulb. In particular, white light radiated in the back direction of the main body 21 is radiated toward the reflector 32 in the vicinity of the socket 33 disposed in the lighting fixture 30, and the amount of light irradiated to the reflector is equivalent to that of an incandescent bulb. Thus, the light distribution characteristic according to the optical design of the reflector 32 configured for an incandescent lamp can be obtained. In addition, in chandeliers and the like, it is difficult to form a dark portion on the back side (upper side) of the glass globe, and illumination with a production effect equivalent to that of an incandescent bulb can be performed.

  Further, since the light emitting module 10 of this embodiment is configured by applying or filling the sealing member 13 ′ mixed and dispersed with the yellow phosphor 14 ′ on the back surface B of the substrate 12, it is emitted from the front surface side F. White light similar to white light can also be emitted from the back side B. Therefore, when the lamp with cap 20 is configured, if the light emitted from the front side F, that is, the lamp globe, and the light emitted from the back side B, that is, the back side of the lamp, have different light colors. Accordingly, it is possible to provide the light bulb shaped illumination lamp 20 that can emit the same white light and has excellent color rendering. Incidentally, in the case where the sealing member in which the yellow phosphor is mixed and dispersed is not provided on the back side B, blue light is emitted directly from the blue LED chip through the substrate 12, and the light on the back side is bluish light. It becomes a lamp with a sense of incongruity that is different in color on the globe side and the back side, causing a problem in merchandise.

  In addition, the heat generated from each LED chip 11 is effectively radiated using each radiation fin 21b and a slit-shaped gap 21d that transmits light to the back side, thereby further suppressing the decrease in luminous efficiency. It is possible to prevent a decrease in illuminance due to a decrease in luminous flux, and a sufficient luminous flux equivalent to a predetermined incandescent bulb can be obtained. At the same time, the life of the LED can be extended.

  Further, the main body 21 can be easily formed by cutting aluminum or the like, and a large number of slit-shaped gaps 21d are formed between the large number of radiating fins 21b. Therefore, the use of aluminum for constituting the main body 21 is used. The amount can be reduced, and the cap-equipped lamp 20 that is light in weight and advantageous in cost can be provided.

  As described above, in the light emitting module 10 of this embodiment, the wiring pattern 12c is formed adjacent to the LED chip 11 on the front surface side F of the substrate 12, and the LED chip 11 and the wiring pattern 12c are connected by the bonding wire w. However, as shown in FIG. 6A, the LED chips 11 may be directly connected by bonding wires w without forming a wiring pattern on the substrate 12. According to this configuration, light is prevented from being blocked by the wiring pattern, light can be effectively transmitted to the substrate 12 made of ceramics, and the amount of light traveling toward the back surface side B is further increased. Can do.

  Further, the LED chip 11 is configured to be mounted on the substrate 12 using the COB technology, but may be configured in an SMD type as shown in FIG. In this case, the board | substrate 12 is comprised with a transparent epoxy resin, the accommodation recessed part 12b is formed in the surface side F of a board | substrate, and the LED chip 11 is mounted in the bottom face. Further, the inner surface of the housing recess 12b is coated with aluminum or the like to form a reflecting surface, and the sealing member 13 in which the yellow phosphor 14 is mixed and dispersed is filled. In addition, a sealing member 13 ′ mixed and dispersed with a yellow phosphor 14 ′ is applied to the back surface B of the substrate 12 corresponding to the housing recess 12 b.

  Further, as shown in FIG. 6C, the three LED chips, the red LED chip (R), the green LED chip (G), and the blue LED chip (B), are mounted in the recess 12b that is a reflecting surface. Then, the sealing member 13 made of a transparent silicone resin not containing a phosphor may be filled to obtain white light by a combination of R, G, and B. In this case, it is possible to obtain desired white light without providing the sealing member 13 ′ in which the yellow phosphor 14 ′ is mixed and dispersed on the back surface side B of the substrate, so that a light emitting module that is advantageous in terms of cost is configured. It is also possible.

  Further, each LED chip 11 is regularly arranged in a substantially matrix shape with respect to the circular recess 12b of the substrate 12, but as shown in FIG. Or you may make it the mounting density of the LED chip 11 in an outer peripheral part become high. Furthermore, you may combine the structure which arrange | positioned the LED chip 11 in the substantially matrix form shown in FIG. 1, and the structure of FIG. According to these configurations, as shown by a dotted arrow in FIG. 7B, more light can be emitted to the upper part of the side surface on the back side of the main body 21, and the amount of light on the back side can be further increased. It becomes possible to make it more approximate to the light emission performance of the incandescent bulb.

  In addition, the light emitting module 10 of this example is configured to emit light to the front surface side F of the substrate 12 and also emit light to the back surface side B by using the translucent substrate 12. It is also possible to apply or fill a sealing member in which different phosphors are mixed / dispersed on the front surface side F and the back surface side B, so that a lamp having a rendering effect with different emission colors depending on the direction is configured. Also good.

  In addition, the sealing member 13 'in which the yellow phosphor 14' is mixed and dispersed corresponding to the housing recess 12b is applied or filled on the back surface B of the substrate 12, but the sealing member is formed into a sheet shape and attached. You may do it. Further, the outer surface portion exposed to the outside of the heat radiating fins 21b of the main body 21 is formed, for example, in an uneven or satin shape to increase the surface area, or by applying white coating or white alumite treatment to increase the heat emissivity of the outer surface portion. You may make it raise. In addition, when white coating or white alumite treatment is applied, when the lamp with cap 20 is mounted on the lighting fixture 30 and turned on, the reflectance of the outer surface of the aluminum main body 21 exposed to the outer surface is increased, and the appliance efficiency is increased. In addition, the appearance and design can be improved, and the product quality can be improved. Moreover, you may comprise the cover member 25 with the transparent or translucent protective cover for protecting the charging part etc. of the LED chip 11 from the outside.

  In addition, the main body 21 of the lamp with cap 20 is made of aluminum to form a slit-shaped gap 21d, and the light on the back surface side B of the substrate 12 is transmitted through the gap and radiated to the back side. As shown in FIG. 8, the main body 21 itself is made of transparent, translucent synthetic resin such as milky white or glass, etc., and the light on the back side B is directed to the back side as indicated by the dotted arrows. It may be transmitted and radiated. According to this, in addition to the globe, the entire back side of the lamp shines, and it is possible to configure a lamp with a cap that exhibits a light distribution and a light emission state equivalent to or close to those of an incandescent bulb equivalent to an incandescent bulb.

  6 to 8 showing the modified examples, the same parts as those in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted. Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Light emitting module 11 Semiconductor light emitting element 12 Board | substrate
14 14 'phosphor F front side B back side 20 lamp with cap 21 body
21e Substrate support
21h opening 22 lighting device
23 Insulating case 24 Base member 25 Cover member 30 Lighting fixture 31 Appliance body 33 Socket

Claims (4)

A light emitting module including a semiconductor light emitting element , a semiconductor light emitting element disposed on the front surface side to emit light to the front surface side, and a light transmissive substrate that transmits light from the semiconductor light emitting element and emits light to the back surface side ; ;
Provided with a substrate support at one end, so that the surface side of the light emitting module faces the direction of one end, and
A main body whose back side is supported by a substrate support so that light emitted from the back side of the light emitting module can be emitted to the other end;
A translucent cover member provided to cover the light emitting module;
A lighting device for lighting the light emitting module;
A base member provided at the other end of the main body and connected to the lighting device;
A lamp with a base, characterized by comprising: The lamp with cap according to claim 1, wherein an opening is formed in the other end of the main body, and at least a part of an insulating case for housing the lighting device is fitted into the opening. . The base according to claim 1, wherein a phosphor is provided on the front side of the substrate so as to cover the semiconductor light emitting element, and a phosphor is also provided on the back side of the substrate. lamp. An instrument body provided with a socket;
A lamp with a base according to any one of claims 1 to 3, which is mounted on a socket of the instrument body;
The lighting fixture characterized by comprising.

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