JP5129413B1 - Illumination light source and illumination device - Google Patents

Abstract

A light source for illumination 1 that includes a hollow globe 10 made of a translucent member and receives a radio signal from the outside to control lighting of the semiconductor light emitting device, and the semiconductor light emitting device is a support member inside the globe 10 An antenna 90 that is supported by 40 and receives the radio signal is disposed in the globe 10.
[Selection] Figure 1

Description

  The present invention relates to an illumination light source and an illumination device using a semiconductor light emitting element, and more particularly, to an illumination light source and an illumination device that perform lighting control in response to an external radio signal.

  In recent years, as an alternative to an incandescent bulb, a bulb-shaped illumination light source using a semiconductor light emitting element such as an LED (Light Emitting Diode) is becoming widespread. Further, some illumination light sources have a function of receiving lighting control by receiving a wireless signal from the outside (for example, Patent Document 1).

JP 2011-9717 A

  By the way, in such an illumination light source, an antenna for transmitting and receiving a radio signal is provided in the illumination light source. However, it is desirable that the antenna is disposed at a position where the radio signal can be transmitted and received with high sensitivity. In particular, when used as a light source for a lighting fixture embedded in an opening provided in the ceiling, so-called downlight lighting fixture, the illumination light source itself must be located in a recessed area in the opening provided in the ceiling. Therefore, transmission / reception of radio signal radio waves is hindered by the ceiling or the like, making it difficult for the radio signal to reach the illumination light source in the opening. In such a case, it is desirable to be able to more reliably execute transmission / reception of radio signals. At the same time, it is desirable that the light distribution characteristics of the illumination light source be as good as possible.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination light source and an illumination device that can transmit and receive radio signals more reliably and realize good light distribution characteristics. To do.

  In order to achieve the above object, an illumination light source according to the present invention is a light source for illumination that includes a hollow globe made of a translucent member and that controls the lighting of a semiconductor light emitting element in response to an external radio signal. The semiconductor light emitting element is supported by a support member inside the globe, and an antenna for receiving the radio signal is arranged in the globe.

  Moreover, the illuminating device which concerns on this invention is provided with the said light source for illumination.

  According to the configuration of the illumination light source according to the present invention, since the light emitting unit as the light source is supported inside the globe by the support member, the arrangement position of the light source is closer to the light source position of the incandescent light bulb, and the incandescent light bulb is arranged. A good light distribution characteristic closer to the light characteristic can be obtained, and the antenna is arranged inside the globe that is relatively exposed to the outside when the illumination light source is attached to the illumination device. Signal transmission / reception is less likely to be inhibited, and radio signal transmission / reception can be performed more reliably.

  As described above, according to the present invention, it is possible to provide a light source for illumination that can reliably perform radio signal reception and realize good light distribution characteristics.

It is an external appearance perspective view which shows the structure of the light source for illumination which concerns on 1st Embodiment. It is a disassembled perspective view of the light source for illumination which concerns on 1st Embodiment. It is arrow sectional drawing along the A-A 'line | wire shown in FIG. 1 of the light source for illumination which concerns on 1st Embodiment. It is a figure which shows schematic structure of the light emission part which concerns on 1st Embodiment, (a) is a top view, (b) is arrow sectional drawing along the BB 'line shown to (a). It is. It is sectional drawing which shows the structure by which the light emission part which concerns on 1st Embodiment is supported by the support member. It is a top view of a circuit unit, (a) is a top view seen from the surface side of a circuit board, (b) is a top view seen from the back side. It is a circuit diagram which shows the circuit structure of a circuit unit. It is sectional drawing which shows schematic structure of the light source for illumination which concerns on 2nd Embodiment. It is a figure which shows schematic structure of the light emission part of the light source for illumination which concerns on 3rd Embodiment, (a) is an external appearance perspective view of the light source for illumination, (b) is a top view of a light emission part. It is a figure which shows schematic structure of the light emission part of the light source for illumination which concerns on 4th Embodiment, (a) is an external appearance perspective view of the light source for illumination, (b) is a top view of a light emission part. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 1. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 2. FIG. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 3. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 4. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 5. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 6. FIG. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 7. FIG. 10 is a cross-sectional view illustrating a schematic configuration of an illumination light source according to Modification Example 7. FIG. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 8. It is sectional drawing which shows schematic structure of the light source for illumination which concerns on the modification 8. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 9. FIG. It is sectional drawing which shows schematic structure of the light source for illumination which concerns on the modification 13. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 14. It is a disassembled perspective view of the light source for illumination which concerns on the modification 14. It is arrow sectional drawing along the C-C 'line | wire shown in FIG. 23 of the light source for illumination which concerns on the modification 14. It is arrow sectional drawing along the D-D 'line shown in FIG. 23 of the light source for illumination which concerns on the modification 14. It is a figure for demonstrating the manufacturing method of the light source for illumination which concerns on the modification 14, Comprising: It is a figure explaining the manufacturing method of the stem before glove sealing. (A) And (b) is arrow sectional drawing along the line equivalent to the DD 'line in FIG. 23, (a) shows the state before flare formation, (b) is after flare formation. The states are shown, and (a ′) and (b ′) are cross-sectional views taken along the line EE ′ in (a) and (b), respectively. It is a figure which shows the continuation of FIG. 27, Comprising: The method of forming a joint part in a flare is shown. (A), (b), (c) is arrow sectional drawing along the line equivalent to the DD 'line in FIG. 23, (a'), (b '), (c') is, It is arrow sectional drawing along the EE 'line | wire in (a), (b), (c), respectively. It is a figure which shows the continuation of FIG. 28, Comprising: It is a figure which shows the method of forming an exhaust hole. (A), (b) is arrow sectional drawing along the line equivalent to the DD 'line in FIG. 23, (a'), (b ') is in (a), (b), respectively. It is arrow sectional drawing along the EE 'line. It is a figure which shows the continuation of FIG. 29, Comprising: (a), (b), (c) is a figure which shows the process of attaching a light emission part with respect to a flare, (d) is the glove by a drop seal system It is a figure which shows a sealing process. FIG. 31 is a diagram showing a continuation of FIG. 30, wherein (a) is a diagram showing a glove sealing step by a drop seal method, and (b) and (c) are steps in which air in the glove is discarded and helium is filled. FIG. FIG. 32 is a diagram illustrating a continuation of FIG. 31, wherein (a) is a diagram illustrating a process of sealing the exhaust pipe, and (b) and (c) are processes of attaching a circuit unit, a housing, and a base. FIG. It is a figure which shows the glove sealing process by a butt seal system. It is sectional drawing of the light source for illumination which concerns on the modification 15. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 16. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 17. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 18. FIG. 22 is a partial cross-sectional view illustrating a schematic configuration of an illumination light source according to Modification 19. FIG. 22 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 20. FIG. 22 is a partial cross-sectional view illustrating a schematic configuration of an illumination light source according to Modification 21. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 22. 22 is a cross-sectional view of an illumination light source according to Modification 23. FIG. It is sectional drawing of the light source for illumination which concerns on the modification 24. FIG. 26 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 25. FIG. 32 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 26. 42 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 28. FIG. 42 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 29. FIG. FIG. 16 is a partially broken side view showing a schematic configuration of an illumination light source according to Modification 30. FIG. 22 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 31. It is a figure which shows the main manufacturing processes about the manufacturing method of the light source for illumination which concerns on the modification 32. FIG. 38 is a partially broken perspective view showing a schematic configuration of an illumination light source according to Modification 33. FIG. 32 is a cross-sectional view showing a schematic configuration of an illumination light source according to Modification 33. It is a figure which shows the main manufacturing processes about the manufacturing method of the light source for illumination which concerns on the modification 33. FIG. It is a figure which shows the main manufacturing processes about the manufacturing method of the light source for illumination which concerns on the modification 33. FIG. FIG. 38 is a diagram illustrating a schematic configuration of a lighting device according to Modification 57.

EMBODIMENT OF THE INVENTION The form for implementing this invention is demonstrated in detail with reference to drawings below. Each figure is a schematic diagram, and the shapes, dimensions, ratios, and the like of core components such as parts shown in the drawings are not necessarily illustrated strictly.
<< First Embodiment >>
First, the overall configuration of the illumination light source according to the first embodiment of the present invention will be described with reference to FIGS.

[1. overall structure]
FIG. 1 is an external perspective view showing a schematic configuration of an illumination light source 1 according to the first embodiment. FIG. 2 is an exploded perspective view of the illumination light source 1. FIG. 3 is a cross-sectional view of the illumination light source 1 along the line AA ′ shown in FIG. In FIG. 3, the alternate long and short dash line drawn along the vertical direction of the paper indicates the lamp axis J1 of the illumination light source 1, and in FIG. This is the main emission direction of light. The main emission direction of light emitted from the illumination light source 1 is “upward”, and the direction opposite to the main emission direction is “downward”. Hereinafter, the same applies to each embodiment and each modification unless otherwise specified.

  As shown in FIGS. 1 to 3, an illumination light source 1 according to the first embodiment of the present invention is a light bulb type lamp that replaces an incandescent light bulb, and an LED is used as a semiconductor light emitting element as a light source. LED lamp. The illumination light source 1 includes, as main components thereof, a translucent globe 10, a light emitting unit 20 including a semiconductor light emitting element 22 (see FIG. 4) that is a light source, and a base 30 that receives power from the outside. And a support member 40 that supports the light emitting unit 20 in the globe 10. A case 60 is attached to an opening-side end portion 11a that is an end portion of the globe 10 on the opening 11 side. The case 60 has a cylindrical shape. A base 30 is attached to one end of the case 60 (the lower end in FIGS. 1 to 3). Further, the opening on the other end side (the upper side in FIGS. 1 to 3) of the case 60 is closed by the base 50. A circuit unit 80 is stored inside the case 60. On the base 50, a support member 40 is erected in a direction extending into the globe 10, and the light emitting unit 20 is attached to a distal end of the support member 40 in the extending direction.

[2. Configuration of each part]
Hereinafter, each component of the light source 1 for illumination which concerns on the 1st Embodiment of this invention is demonstrated in detail, referring FIGS. 1-7.
(2-1. Globe)
The globe 10 has the same shape as an incandescent bulb (also called a glass bulb). Here, the globe 10 is a so-called A type having a shape similar to a general incandescent light bulb (light bulb having a filament).

As shown in FIGS. 1 to 3, the globe 10 includes a hollow spherical portion 10 a and a tubular portion 10 b having a tubular shape. The cylindrical portion 10b has a reduced diameter as the distance from the spherical portion 10a increases. In addition, the opening 11 exists in the edge part on the opposite side to the spherical part 10a in the cylindrical part 10b, and let this edge part be the opening side edge part 11a.
The globe 10 is made of a translucent material. Examples of the translucent material include a glass material and a resin material such as acrylic. Here, the globe 10 is made of, for example, a glass material.

  In addition, the shape of the globe 10 does not necessarily need to be A-shaped. For example, the shape of the globe 10 may be a G shape or an E shape. The globe 10 does not necessarily need to be transparent to visible light, and may be subjected to a diffusion treatment, for example, by applying silica to form a milky white diffusion film. Moreover, it may be colored in colors such as red and yellow, or a pattern or a picture may be provided. Furthermore, a reflective film or the like may be provided on the base side of the light source, such as a reflex bulb. Further, by forming the thickness of the plurality of locations of the globe 10 non-uniformly, the light from the light-emitting portion 20 hits the non-uniform thickness portion, and the feeling of glittering light can be enhanced.

(2-2. Light emitting part)
4A is a plan view of the light emitting unit 20 in the illumination light source 1, and FIG. 4B is a cross-sectional view of the light emitting unit 20 along the line BB ′ in FIG. 4A. is there. The light emitting unit 20 includes a mounting substrate 21 and a plurality of semiconductor light emitting elements 22 mounted on a front surface that is a main surface on the upper side of the mounting substrate 21. In the present embodiment, the semiconductor light emitting element 22 is an LED element, and the light emitting unit 20 includes a sealing body 23 that covers the semiconductor light emitting element 22 in addition to the mounting substrate 21 and the semiconductor light emitting element 22.

In the present embodiment, the case where the semiconductor light emitting element 22 is an LED will be described as an example. However, the semiconductor light emitting element 22 may be, for example, an LD (laser diode), or an EL element (electric luminescence element). It may be.
In the present embodiment, the mounting substrate 21 is made of a translucent material. Thereby, among the light emitted from the semiconductor light emitting element 22 mounted on the surface of the mounting substrate 21, the light emitted downward passes through the mounting substrate 21 and is emitted from the globe 10 to the outside. As a translucent material used for the mounting substrate 21, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a translucent resin substrate, or the like is used.

  In the present embodiment, the mounting substrate 21 has a rectangular shape in plan view, and as the material, for example, glass or alumina is used. On the mounting substrate 21, a wiring pattern 27 for electrically connecting the semiconductor light emitting elements 22 (in series connection or / and parallel connection) or connecting to the circuit unit 80 is formed. Yes. A part of the wiring pattern 27 is shown in FIG. Considering the use of light emitted downward from the semiconductor light emitting element 22, the wiring pattern 27 is also preferably made of a light transmissive material, and ITO or the like may be used as such a light transmissive material. Good.

As shown in FIGS. 4A and 4B, a plurality of semiconductor light emitting elements 22 are mounted in a straight line along the longitudinal direction of the rectangular mounting substrate 21 at intervals (for example, equal intervals). It is mounted on the surface of the substrate 21. In the present embodiment, two rows in which ten semiconductor light emitting elements 22 are arranged at substantially equal intervals are arranged.
The number and arrangement of the semiconductor light emitting elements 22 arranged in one column are not limited to the above, and are appropriately determined depending on the luminance required for the illumination light source 1. That is, the number of the semiconductor light emitting elements 22 arranged in one row is not limited to 10 and can be appropriately changed according to the application. In addition, the number of columns in which the semiconductor light emitting elements 22 are arranged on the mounting substrate 21 is not limited to two, but may be one or may be mounted in a plurality of three or more columns.

The sealing body 23 is mainly made of a translucent material. The sealing body 23 has a function of preventing air and moisture from entering the semiconductor light emitting element 22. Here, the semiconductor light emitting elements 22 constituting the column are covered in units of columns in which a plurality of semiconductor light emitting elements 22 are arranged in a straight line.
When the sealing body 23 needs to convert the wavelength of light emitted from the semiconductor light emitting element 22 to a predetermined wavelength in addition to the above-described function of preventing intrusion of air or the like, the light from the semiconductor light emitting element 22 is used. It also has a wavelength conversion function for converting the wavelength of the light. The wavelength conversion function can be implemented by, for example, mixing a wavelength conversion material that converts the wavelength of predetermined light into the light-transmitting material.

As the translucent material, for example, a silicone resin can be used. Moreover, when providing a wavelength conversion function, as a wavelength conversion material, a phosphor particle can be utilized, for example.
In the present embodiment, the semiconductor light emitting element 22 emits blue light, and phosphor particles that convert blue light into yellow light are used as a wavelength conversion material. As a result, white light mixed by the blue light emitted from the semiconductor light emitting element 22 and the yellow light wavelength-converted by the phosphor particles is emitted from the light emitting unit 20 (illumination light source 1).

As shown in FIGS. 4A and 4B, at both ends in the longitudinal direction of the rectangular mounting substrate 21, semiconductor light emission is performed from lead wires 71 and 72, which will be described later, one end of which is electrically connected to the circuit unit 80. Feed terminals 24a and 24b for receiving supply of power for causing the element 22 to emit light are formed.
Further, a second through hole 26 penetrating the mounting substrate 21 and the power supply terminals 24a and 24b is provided in each of the portions of the mounting substrate 21 where the power supply terminals 24a and 24b are formed. Although not shown in FIGS. 4A and 4B, one end of each of the lead wires 71 and 72 is inserted into each of the second through holes 26, and a conductive joining member 73 made of solder or the like. As a result, the power supply terminal 24a and the lead wire 71 are electrically connected, and the power supply terminal 24b and the lead wire 72 are electrically connected.

  Next, the first through hole 25 will be described. The first through hole 25 is provided so as to penetrate the mounting substrate 21 and is configured to be fitted to a convex portion 43 of a support member 40 described later. This corresponds to the shape of the projection 43 viewed from above. Specifically, for example, as illustrated in FIG. 4A, the shape of the first through hole 25 in a top view is such that the longitudinal direction coincides with the longitudinal direction of the mounting substrate 21 and the short side direction of the mounting substrate 21. It is a rectangle that coincides with the short direction (width direction).

Note that the first through hole 25 is provided substantially at the center of the mounting substrate 21. That is, the first through hole 25 is provided in the center portion of the mounting substrate 21 in the longitudinal direction and the short direction, and is provided between the two sealing bodies 23 in the present embodiment.
(2-3. Case)
Returning to FIGS. 1 to 3, the case 60 has the same shape as the portion close to the cap 30 side of the bulb of the incandescent bulb. In the present embodiment, the case 60 has a large-diameter portion 61 in the half on the globe 10 side in the central axis direction and a small-diameter portion 62 in the base-side half, and between the large-diameter portion 61 and the small-diameter portion 62. A stepped portion 63 exists.

The end of the large diameter portion 61 of the case 60 is closed by the base 50 as described above. The groove 54 between the large-diameter portion 61 of the case 60 and the base 50 is filled with an adhesive 55 such as a resin, and the opening-side end portion 11a of the globe 10 is inserted therein to solidify the adhesive. 10 is fixed to the base 50 and the case 60.
The base 30 is screwed to the small diameter portion 62 of the case 60. In the present embodiment, the base 30 is an Edison type. For this reason, the outer periphery of the small diameter portion 62 is a male screw and is screwed into the base 30. Thereby, the base 30 and the case 60 are screwed together. Details will be described later.

In addition, the small diameter portion 62 of the case 60 is formed with a groove 64 extending parallel to the direction in which the central axis of the case 60 extends. The groove 64 fixes a lead wire 75 that connects a later-described base 30 and the circuit unit 80 (regulates the movement of the lead wire 75).
The case 60 is made of a resin material such as polybutylene terephthalate (PBT). In order to adjust the thermal conductivity of the case 60, a resin material mixed with, for example, glass fiber or the like may be used.

As described above, the case 60 has a large-diameter portion so that the overall shape of the case 60 is similar to that of an incandescent light bulb with the globe 10 attached to the upper end and the base 30 attached to the lower end. The shape of 61 is enlarged in a curve as it moves from the base 30 side to the globe 10 side.
The case 60 has a function of releasing heat generated when the circuit unit 80 housed therein is turned on to the outside. Heat dissipation is performed by heat conduction from the case 60 to the outside air, convection of outside air, radiation, or the like.

The case 60 has a space that is substantially hermetically sealed because the opening on the upper end side is closed by the base 50 as described above and the opening on the lower end side is closed by the base 30. A circuit unit 80 is accommodated in this space. The method for housing the circuit unit 80 will be described later in detail.
(2-4. Base)
The base 30 is for receiving electric power from the socket of the lighting fixture when the lighting light source 1 is mounted on the lighting fixture and turned on.

Although the kind of nozzle | cap | die 30 is not specifically limited, Edison type is used in this embodiment. The base 30 includes a shell portion 33 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 35 attached to the shell portion 33 via an insulating member 34.
The shell portion 33 is connected to the circuit unit 80 via the lead wire 75, and the eyelet portion 35 is connected to the circuit unit 80 via the lead wire 74. The lead wire 75 is covered with the shell portion 33 in a state where the lead wire 75 is drawn out from the inside of the small diameter portion 62 of the case 60 to the outside via the opening at the lower end and fitted into the groove 64 of the case 60. As a result, the lead wire 75 is sandwiched between the outer periphery of the case 60 and the inner periphery of the shell portion 33, the lead wire 75 is fixed to the base 30, and the lead wire 75 and the base 30 are electrically connected. Connected.

(2-5. Base)
The base 50 is inserted into the large diameter portion 61 of the case 60. Since the base 50 is inserted into the case 60, the base 50 has an outer surface (circumferential surface) corresponding to the inner surface of the large-diameter portion 61 of the case 60. Here, the inner peripheral surface of the case 60 and the outer peripheral surface of the base 50 correspond to each other, and the cross-sectional shape of the inner peripheral surface of the large-diameter portion 61 is circular. It has a disk shape with a circular shape.

The base 50 has a small diameter portion 50a and a large diameter portion 50b having a larger diameter than the small diameter portion 50a. The outer peripheral surface of the large diameter portion 50 b corresponds (contacts) with the inner peripheral surface of the large diameter portion 61 of the case 60. When the base 50 is inserted into the case 60, a groove 54 along the inner peripheral surface of the case 60 is formed between the small diameter portion 50 a and the inner peripheral surface of the case 60.
As shown in FIG. 3, the opening-side end portion 11 a of the globe 10 is inserted into the groove 54 and fixed by an adhesive 55.

Here, the base 50 is joined to the case 60 and the globe 10 by the adhesive 55 while being inserted into the large-diameter portion 61 of the case 60.
As described above, the base 50 has a function of closing the upper opening of the large diameter portion 61 of the case 60. In addition, when the semiconductor light emitting element 22 emits light, heat is generated in the semiconductor light emitting element 22. The base 50 further has a function of transmitting to the globe 10 and the case 60. For this reason, the base 50 is comprised with the material which has favorable thermal conductivity. Specifically, for example, a metal such as aluminum, a resin, a ceramic, or the like.

(2-6. Support member)
The support member 40 supports the light emitting unit 20 at a central position inside the globe 10. Here, the said center position is a position corresponding to the light source (filament) position in an incandescent lamp, for example, is the substantially same position as the position where a filament is arrange | positioned in an incandescent lamp. The support member 40 has a rod-like shape, an upper end portion is coupled to the light emitting unit 20, and a lower end portion is attached to the base 50. That is, the support member 40 is erected on the base 50 in a state of extending from the base 50 to the inside of the globe 10.

  The upper end portion of the support member 40 and the light emitting portion 20 are coupled using, for example, an engagement structure. A convex portion 43 is formed substantially at the center of the upper surface 41 of the support member 40. A first through hole 25 is formed in the approximate center of the mounting substrate 21 of the light emitting unit 20. That is, the first through hole 25 is provided in the center portion of the mounting substrate 21 in the longitudinal direction and the short direction, and is provided between the two sealing bodies 23 in the present embodiment. The shape of the convex portion 43 and the shape of the first through hole 25 correspond to each other, and the convex portion 43 of the upper surface 41 of the support member 40 is inserted (fitted) into the first through hole 25 of the mounting substrate 21 of the light emitting unit 20. The mounting substrate 21 is placed on the upper surface 41 of the support member 40.

The light emitting unit 20 is disposed with the surface on which the plurality of semiconductor light emitting elements 22 are mounted facing the top of the globe 10. In other words, the semiconductor light emitting element 22 is arranged in a plane with the main oblique direction directed upward from the illumination light source 1.
Here, a state when the light emitting unit 20 is arranged on the support member 40 will be described with reference to FIG. FIG. 5 is an enlarged cross-sectional view of the main parts of the light emitting unit 20 and the support member 40 of the illumination light source 1 according to the present embodiment. FIG. 5 shows a state before a power supply terminal 24a (24b) and a lead wire 71 (72) (not shown) are solder-connected.

  As shown in FIG. 5, the light emitting unit 20 is placed on the upper surface 41 of the support member 40 so that the first through hole 25 of the light emitting unit 20 is fitted to the convex portion 43 of the support member 40. At this time, the posture of the light emitting unit 20 is regulated by the convex portion 43, and the orientation of the light emitting unit 20 is determined according to the convex portion 43. Thus, in the present embodiment, the light emitting unit 20 and the support member 40 are coupled by fitting the first through hole 25 to the convex portion 43, and the light emitting unit 20 is fixedly supported by the support member 40. Is done. In addition, when the light emitting unit 20 is fixed to the support member 40 by fitting the first through hole 25 to the convex portion 43, the light emitting unit 20 and the support member 40 can be easily aligned. Can do.

For example, an adhesive structure is used for the connection between the lower end portion of the support member 40 and the base 50. The lower surface of the support member 40 is flat. The flat lower surface of the support member 40 is fixed (bonded) to the flat upper surface of the base 50 with an adhesive (not shown).
The support member 40 has a function of supporting the light emitting unit 20 inside the globe 10 and a function of transmitting heat generated in the semiconductor light emitting element 22 to the base 50 during light emission. This heat transfer function can be implemented by using a material having high thermal conductivity. Examples of the material having high thermal conductivity include metals and ceramics. In the present embodiment, the support member 40 is made of, for example, aluminum.

The light emitting unit 20 can emit light from the light emitting unit 20 downward by configuring the mounting substrate 21 with a translucent material. For this reason, the support member 40 has a shape as close to a rod as possible so as not to block light emitted downward from the semiconductor light emitting element 22 (light emitting unit 20).
That is, the intermediate region of the support member 40 is a cylindrical portion 47 having a circular cross section. The upper region of the support member 40 is a flat portion 48 that is flat in the short direction (thickness is thin in the short direction) of the rectangular mounting substrate 21. A lower region of the support member 40 is a conical portion 42 having a truncated conical shape whose diameter increases as the base 50 is approached. Thereby, the light emitted downward from the semiconductor light emitting element 22 and reaching the lower end portion of the support member 40 is easily reflected.

The support member 40 may be made of a translucent material (for example, a glass material) so as not to block light emitted downward from the semiconductor light emitting element 22, and light is reflected on the surface of the support member 40. You may give the process which improves property.
The support member 40 is formed with through holes 44 and 45 through which lead wires 71 and 72 that electrically connect the circuit unit 80 and the light emitting unit 20 are inserted. Through holes 51 and 52 are formed for inserting the wires 71 and 72, respectively.

  The through holes 44, 45 and 51, 52 may be formed at different positions instead of being provided at positions that are substantially symmetrical with respect to the central axis of the support member 40 as shown in FIG. Instead of forming one for each of the lead wires 71 and 72, one through hole of a size through which the two lead wires 71 and 72 can be inserted is provided in the conical portion 42 and the base 50, respectively. It may be formed.

Although not visible in the shade in FIG. 1, the support member 40 is provided with a through hole for inserting the antenna wire 91 on the back side of the conical portion 42 in FIG. 1.
The length of the support member 40 is, for example, 20 to 40 [mm], and the diameter of the columnar portion 47 of the support member 40 is, for example, 5 to 30 [mm].
The longitudinal direction and the short direction of the mounting substrate 21 are 5 to 30 [mm] diagonally, and the thickness is, for example, 1 to 1.6 [mm].

(2-7. Antenna)
The antenna 90 is for transmitting and receiving radio signals from the outside, and is connected to the circuit unit 80 via the antenna line 91. In this embodiment, as shown in FIGS. 1 to 3, the antenna 90 is a helical antenna and is wound around the support member 40 in a spiral shape. One end of the antenna wire 91 is attached to the end of the antenna 90 on the base 30 side, and the other end of the antenna wire 91 is connected to the antenna terminal 89 e of the circuit unit 80.

The antenna 90 is used, for example, in the 2.4 GHz band, but is not limited thereto, and an antenna suitable for a desired band to be used may be used. The length of the antenna 90 (vertical length when attached to the support member 40) is, for example, 20 to 31.25 [mm], but the size and design of the support member 40, the lead wire 71, and the like. , 72 and the wiring method of the antenna wire 91, as long as a desired wireless signal transmission / reception performance is satisfied, the wiring method may be changed as appropriate.
For example, when used in the 900 MHz band, it may be set to 80 to 83.3 [mm], for example.

Note that the directivity of the antenna 90 is preferably non-directional. Further, the antenna 90 and the antenna wire 91 may be integrally formed using a single metal wire.
As described above, the antenna 90 is spirally wound around the support member 40 in the globe 10. According to such a configuration, compared to the case where the antenna 90 is accommodated in the case 60, for example, when the illumination light source 1 is used as a light source of a downlight illuminator (see FIG. 55) or the like. Even if it exists, it becomes difficult to receive obstruction with respect to radio signal transmission / reception by a ceiling etc. by the antenna 90 being arrange | positioned in a globe, and transmission / reception of a radio signal can be performed more reliably.

  In this embodiment, since the support member 40 is made of conductive aluminum, the support member 40 can be used as an antenna. In this case, since the support member 40 has a larger diameter than the helical antenna 90, there is an effect that the frequency range of radio waves that can be transmitted and received becomes wider. Hereinafter, in the case where a conductive member such as aluminum is used for the support member, the support member may similarly serve as an antenna in each embodiment and each modification.

(2-8. Circuit unit)
The circuit unit 80 transmits and receives a wireless signal from the outside and controls the lighting of the semiconductor light emitting element 22 based on the wireless signal. Here, “lighting control” includes, for example, lighting, extinguishing, dimming, illumination color change, and the like.
As will be described in detail later, the circuit unit 80 includes a circuit board 81 and various electronic components mounted on the circuit board 81.

The circuit board 81 has a disk shape, and the main surface thereof is fixedly accommodated in the case 60 in a posture substantially orthogonal to the lamp axis J1.
The circuit board 81 is fixed inside the case 60 using a locking structure. Specifically, the peripheral portion of the back surface (surface on the base 30 side) of the circuit board 81 abuts on the stepped portion 63 inside the case 60, and the circuit board 81 is provided by the locking portion 65 provided on the inner surface of the large diameter portion 61. The surface (surface on the base 50 side) is locked.

A plurality of (for example, four) locking portions 65 are formed at intervals (for example, at equal intervals) in the circumferential direction. The locking portion 65 has a shape that protrudes toward the center axis side of the case 60 as it approaches the stepped portion 63, and the distance between the locking portion 65 and the stepped portion 63 corresponds to the thickness of the circuit board 81.
When the circuit board 81 is mounted, the circuit unit 80 is inserted from above the case 60 (large diameter part 61 side), and when the back surface of the circuit board 81 reaches the locking part 65, the circuit board 81 is further It pushes down and the latching | locking part 65 is passed. Thereby, the circuit board 81 is locked by the locking portion 65, and the circuit unit 80 is fixed to the case 60.

As shown in FIG. 3, the circuit unit 80 and the base 30 are electrically connected by lead wires 74 and 75.
Although not shown, a wiring pattern is formed on the circuit board 81 by patterning, for example, a copper foil, and a part of this wiring pattern is a signal transmission path to the antenna 90 described later. It has become.

Next, the circuit configuration of the circuit unit 80 will be described below with reference to FIGS. 6 (a), 6 (b), and FIG.
6A is a plan view of the circuit board 81 as viewed from the front surface 81a side, which is the upper main surface thereof. FIG. 6B is a back surface view of the circuit board 81, which is the lower main surface. It is the top view seen from the 81b side. As shown in FIGS. 6A and 6B, the circuit unit 80 includes a circuit board 81, a rectifier circuit 85, a smoothing capacitor 86, a wireless control unit 820, and a light emitting element arranged on the circuit board 81. It has a control unit 87, a radio control unit power supply 84, a radio control unit 820, an oscillator 83 that generates a clock signal for controlling the light emitting element control unit 87, and other various electronic components 88. .

  In the present embodiment, an SMD (Surface Mount Device) type electronic component is mounted on the front surface 81a side of the circuit board 81, and an electronic component mounted by a lead wire is mounted on the back surface 81b side. The lead wires 71 and 72 are respectively connected to output terminals 89c and 89d provided on the back surface 81b, and the antenna wire 91 is connected to an antenna terminal 89e provided on the back surface 81b. The lead wires 74 and 75 are connected to input terminals 89a and 89b provided on the back surface 81b, respectively. The lead wires 71 and 72 and the antenna wire 91 are wired from the output terminals 89c and 89d and the antenna terminal 89e to the surface 81a side through the notch 81c provided in the circuit board 81.

In the present embodiment, the SMD type electronic components mounted on the front surface 81a are the oscillator 83, the radio control unit power supply 84, the light emitting element control unit 87, and the like, and are mounted by lead wires mounted on the back surface 81b. Such types of electronic components are a rectifier circuit 85, a smoothing capacitor 86, a wireless control unit 820, and the like.
FIG. 7 is a circuit diagram showing a circuit configuration of the circuit unit 80 according to the first embodiment.

As shown in FIGS. 1 to 3, the illumination light source 1 includes a light emitting unit 20, a circuit unit 80 that transmits and receives a wireless signal and controls the lighting of the semiconductor light emitting element 22 (here, LED) based on the wireless signal. Have.
For example, the light emitting unit 20 includes two sets of serially connected bodies in which 10 LEDs are connected in series, connected in parallel. The light emitting unit 20 is supplied with electric power from the AC power source 19 via the switching circuit 810, and turns on the LED.

  The circuit unit 80 includes a rectifier circuit 85, a smoothing capacitor 86 (C1), a switching circuit 810, a control circuit 871, a radio control unit 820, a radio control unit power supply 84, and a lighting control signal detection unit 830 as main components. . The input side of the circuit unit 80 is connected to the AC power source 19 via input terminals 89a and 89b, and the output side is connected to the light emitting unit 20 via output terminals 89c and 89d, respectively.

  When the function of the circuit unit 80 is outlined, the AC power supplied from the AC power supply 19 by the lighting circuit including the rectifier circuit 85, the smoothing capacitor 86 (C1), the switching circuit 810, the control circuit 871, and the lighting control signal detector 830. Conversion into electric power for lighting the semiconductor light emitting element 22 and output of the converted electric power to the semiconductor light emitting element 22 are performed. A radio signal circuit including the antenna 90, the radio control unit 820, and the radio control unit power supply 84 performs transmission / reception of radio signals, conversion of radio signals into electric signals, and input / output of the electric signals.

The rectifier circuit 85 performs full-wave rectification on the AC voltage supplied from the AC power supply 19, and the smoothing capacitor 86 (C1) smoothes the AC voltage into a DC current.
The switching circuit 810 is a so-called step-down DC-DC converter that converts DC power supplied from the smoothing capacitor 86 (C1) into power for lighting the semiconductor light emitting element 22, and includes a switching element 811 and a diode D1. , Inductor L1 and capacitor C2. The light emitting unit 20 is turned on by the power supply from the switching circuit 810.

The DC-DC converter includes a single forward method, a flyback method, a push-pull method, a half bridge method, a full bridge method, a mag amplifier method, a step-down chopper method, a step-up chopper method, a step-up / step-down chopper method, and the like. In the present embodiment, the step-down chopper method is adopted, but other methods may be adopted.
The control circuit 871 is connected to the control terminal 811g of the switching element 811. The control circuit 871 performs on / off control of the switching element 811 by giving a signal to the control terminal 811g, and steps down the DC voltage supplied from the smoothing capacitor 86 (C1) to a desired voltage. In the present embodiment, a field effect transistor (FET) is used as the switching element 811. The control terminal 811g corresponds to the gate of the FET, and the signal applied to the control terminal 811g corresponds to the gate voltage.

  The antenna 90 has a standard corresponding to the radio signal to be used. The radio signal includes a command for controlling lighting of the illumination light source 1, but the frequency of the signal used as the radio signal is not particularly limited. For example, it is possible to use a radio signal in a 2.4 [GHz] frequency band that can be used in the world and is used in a communication device that conforms to the IEEE (Institut of Electrical and Electronics Engineers) 802.15.4 standard. . In addition, there are frequency bands according to regions, in Europe 433.35-434.79 [MHz], 863-870 [MHz], Japan 426-429 [MHz], 915-956 [MHz], US 260-470. Use bands such as [MHz] and 902 to 928 [MHz] are separately secured. IEEE 802.15.4 is a name of a short-range wireless network standard called PAN (Personal Area Network) or W (Wireless) PAN.

Wireless communication using wireless signals in the above frequency band has a shorter wavelength than conventional infrared communication. Therefore, good communication can be performed even when the line of sight between the transmitter side and the transmitter / receiver side (antenna unit side) of the radio signal is poor.
Furthermore, in the above-mentioned standard, illumination light sources belonging to a group having the same address and paired with a wireless signal transmitter can communicate with each other without using a transmitter. Therefore, even if the wireless signal cannot be transmitted / received from the transmitter, the transmitted / received illumination light source in the same group can transmit the same command as the wireless signal from the transmitter to the untransmitted / transmitted illumination light source. As a result, the illumination light sources in the group paired with the transmitter are completely controlled. Such a function is effective when it is desired to uniformly control lighting of the illumination light source provided over a very wide range, such as when lighting control of a bulky luminaire such as a chandelier.

  The wireless control unit 820 generates a lighting control signal for controlling power feeding to the semiconductor light emitting element 22 based on the wireless signal transmitted and received by the antenna 90, and outputs it to the control circuit 871 of the light emitting element control unit 87. As the wireless control unit 820, for example, JN5142 or JN5148 manufactured by NXP can be used. The wireless control unit 820 is supplied with power from the wireless control unit power supply 84.

  A radio signal transmitted and received by the antenna 90 is input to the first pin of the radio control unit 820. The radio signal input to the first pin of the radio control unit 820 is amplified in the radio control unit 820, converted into an electric signal, and finally output from the fourth pin as a lighting control signal. Further, the second pin of the wireless control unit 820 is the ground terminal of the antenna 90, the third pin is the ground terminal, the fifth pin is the VDD input terminal, the sixth pin is the high voltage input terminal, the seventh pin and the eighth pin are inductors. L2 input / output terminal.

The lighting control signal detection unit 830 detects the level of the lighting control signal output from the wireless control unit 820, and outputs a signal corresponding to the detected level to the third pin of the light emitting element control unit 87.
Note that an LED driver (corresponding to the light emitting element control unit 87) in which the control circuit 871 and the switching element 811 are sealed in one package can also be used. As such an LED driver, for example, MIP551 manufactured by Panasonic Corporation or SSL2108 manufactured by NXP Corporation can be used.

  The first pin of the light emitting element control unit 87 is a power input terminal. The second pin of the light emitting element control unit 87 is a VDD supply terminal, which is used for operating voltages of the wireless control unit 820 and peripheral elements. A signal corresponding to the level detected by the lighting control signal detector 830 is input to the third pin of the light emitting element controller 87. The light emitting element control part 87 is a specification which reduces the LED current of an internal oscillation circuit, so that the said level falls.

The 4th pin of the light emitting element control unit 87 is connected to the source of the switching element 811 and the ground. The 5th and 6th pins of the light emitting element control unit 87 are the source and drain of the switching element 811, respectively.
[3. Light distribution characteristics]
In the illumination light source 1 according to this embodiment, the light emitting unit 20 is provided in the globe 10 at a position (for example, substantially the same position) corresponding to the light source (filament) position of the incandescent light bulb. As a result, even when the illumination light source 1 is mounted on a conventional lighting device for incandescent bulbs, the light emitting section 20 is arranged at the filament position, and the characteristics close to the light distribution characteristics when the incandescent bulb is mounted are obtained. Can be obtained.

In addition, since the light emitting unit 20 is configured using the translucent mounting substrate 21, the light emitted downward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and is emitted from the globe 10 to the outside. .
Furthermore, the ratio of the light emitted downward from the semiconductor light emitting element 22 to be blocked by the support member 40 can be reduced by making the shape of the support member 40 supporting the semiconductor light emitting element 22 into an elongated rod shape. it can.

By configuring the support member 40 with a light-transmitting material, the light reaching the support member 40 passes as it is, and the light reaching the inner surface of the globe 10 passes through the globe 10 and is emitted to the outside. .
[4. Summary of First Embodiment]
As described above, according to the configuration of the illumination light source 1 according to the first embodiment, the light emitting unit 20 having the semiconductor light emitting element 22 as the light source is supported by the support member 40 at the center position in the globe 10. Thereby, it is possible to obtain a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb.

Further, when the antenna 90 is attached to the support member 40 and the illumination light source 1 is attached to the illumination device, the antenna 90 is positioned inside the relatively exposed globe 10. Compared with the case where the antenna is housed in the case 60, transmission / reception of radio signals is less likely to be hindered, and transmission / reception of radio signals can be performed more reliably.
In addition, since a translucent member is used for the mounting substrate 21 on which the semiconductor light emitting element 22 is mounted, the light emitted downward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and the globe 10. From there, it further passes through the globe 10 and is emitted to the outside. Thereby, the light quantity radiate | emitted below the light source 1 for illumination can be increased, and a more favorable light distribution characteristic can be acquired.

In addition, by forming the support member 40 in the shape of an elongated bar, the ratio of light emitted downward from the semiconductor light emitting element 22 to be blocked by the support member 40 can be reduced. Thereby, the light quantity radiate | emitted below the light source 1 for illumination can be increased, and a more favorable light distribution characteristic can be acquired.
<< Second Embodiment >>
In the first embodiment, the configuration in which the antenna 90 that is a helical antenna is wound around and attached to the periphery of the support member 40 has been described as an example.

  However, the aspect in which the antenna is provided in the support member 40 is not limited to this. In the second embodiment, a configuration in which the rod antenna is provided in the support member 40 will be described. In addition, in order to avoid duplication of description, the same components as those in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted. Hereinafter, the same applies to each embodiment and each modification.

FIG. 8 is a cross-sectional view taken along the line corresponding to the line AA ′ in FIG. 1 of the illumination light source 100 according to the second embodiment.
The illumination light source 100 according to the second embodiment has a hollow structure in which a support member 140 has a space 140a therein, and a rod antenna (a cylindrical shape) having a long rod shape (columnar shape) inside the space 140a ( The antenna 190 is a pole antenna), and the antenna wire 91 connected to the lower end of the antenna 190 communicates from the space 140a of the support member 140 to the lower end surface of the support member 140, and a base The illumination light source 1 according to the first embodiment is different from the illumination light source 1 according to the first embodiment in that it is inserted through a through hole 153 provided in the table 150.

  For example, the antenna 190 is used in the 2.4 GHz band, but is not limited thereto, and an antenna suitable for a desired band to be used may be used. The length of the antenna 190 is, for example, 20 to 31.25 [mm] and the diameter is 1 to 30 [mm]. However, the size and design of the support member 140, the lead wires 71 and 72, and the antenna The wiring method of the line 91 may be changed as appropriate as long as a desired wireless signal transmission / reception performance is satisfied.

Note that the directivity of the antenna 190 is preferably non-directional.
The light emitting unit 20 is attached to the upper end portion of the support member 140, and the light emitting unit 20 and the circuit board 81 are electrically connected by lead wires 71 and 72. The lead wire 71 is inserted through a through hole 144 provided in the conical portion 142 of the support member 140 and a through hole 151 provided in the base 150. The lead wire 72 is inserted through a through hole 145 provided in the conical portion 142 of the support member 140 and a through hole 152 provided in the base 150. The through holes 144, 145, 151, and 152 are for passing the lead wires 71 and 72. The through holes having a size that allows the two lead wires 71 and 72 to be inserted are formed in the conical section 142 and the base. One each may be formed on the table 150. Moreover, as shown in FIG. 8, you may form in another position which is not the position which pinched | interposed the support member 440. FIG.

As described above, also in the configuration of the illumination light source 100 according to the second embodiment, the antenna 190 is disposed inside the globe 10 in a state where the antenna 190 is accommodated inside the support member. Compared with the case where the wireless signal is housed in the wireless device, the transmission / reception of the wireless signal is less likely to be hindered and the wireless signal can be transmitted / received more reliably. Therefore, the support member 140 is composed of a non-conductive member. Examples of the non-conductive member include glass and ceramic. In the present embodiment, glass is used. Thereby, the light emitted from the semiconductor light emitting element 22 of the light emitting unit 20 to the lower side of the mounting substrate 21 passes through the support member 140 and reaches the lower side of the globe 10, and is emitted from there to the outside. Therefore, a better light distribution characteristic can be realized.

  When the support member 140 is made of a non-conductive member such as glass or ceramic, the support member 140 may be integrally formed with the antenna 190 included therein. In such a case, in the support member 140, the antenna 190 is closely accommodated in the support member 140 without providing a space 140 a as a gap between the support member 140 and the antenna 190. Also good. The same applies to modified examples 2, 4, and 6 described below.

<< Third Embodiment >>
In the first embodiment, a configuration in which the antenna 90 that is a helical antenna is wound around and attached to the periphery of the support member 40 will be described. In the second embodiment, a rod antenna is used. The configuration in which an antenna 190 is accommodated in the support member 140 has been described.

However, the aspect in which the antenna is provided inside the globe 10 is not limited to these.
FIG. 9A is an external perspective view showing a schematic configuration of an illumination light source 200 according to the third embodiment. FIG. 9B is a plan view of the light emitting unit 220 in the illumination light source 200.
In the illumination light source 200 according to the present embodiment, an antenna 290 is formed on the surface of the mounting substrate 21 of the light emitting unit 220. The antenna 290 is a PCB antenna (printed antenna), and is formed in a rectangular wave shape using an aluminum thin film or the like on a mounting substrate. As shown in FIG. 9B, in the present embodiment, the antenna 290 is one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, and the central portion of the mounting substrate 21 in the short direction, That is, it is provided between the two sealing bodies 23. An antenna terminal 292 to which one end of the antenna wire 91 is connected is formed at the end of the antenna 290 closer to the power feeding terminal 24b. The mounting substrate 21 and the antenna terminal 292 are connected to the center of the antenna terminal 292. A penetrating through hole 293 is formed. Although not shown in FIG. 9B, one end of the antenna wire 91 opposite to the side connected to the circuit unit 80 is inserted into the through-hole 293, and is connected by a conductive bonding member 73 made of solder or the like. The antenna terminal 292 and the antenna line 91 are connected. The antenna line 91 is inserted through a through hole 246 formed in the conical portion 242 of the support member 240 and an insertion hole (not shown) formed in the base 250, and is connected to the circuit unit 80 (see FIG. 3).

  The antenna 290 is used in, for example, the 2.4 GHz band, but is not limited thereto, and an antenna that is suitable for a desired band to be used may be used. The length of the antenna 290 (the length in the longitudinal direction of the mounting substrate 21) is, for example, about 20 to 31.25 [mm], but the size of the mounting substrate 21, the arrangement mode of the semiconductor light emitting elements 22, the sealing body Depending on the arrangement mode of 23 and the position on the mounting substrate 21 where the antenna 290 is formed, as long as a desired radio signal transmission / reception performance is satisfied, it may be changed as appropriate.

The directivity of the antenna 90 is preferably omnidirectional.
The support member 240 is different from the support member 40 in the illumination light source 1 according to the first embodiment in that the support member 240 is formed of a translucent member such as glass, but is the same as the support member 40. Has a shape. A through hole 246 for inserting the antenna wire 91 is drawn on the front side of the paper in the support member 240 shown in FIG. 9A, but in the support member 40 shown in FIG. It is not shown in FIG. 1 because it is formed and hidden behind the conical part 42.

Further, the through holes 244 and 245 may be formed at different positions instead of being provided at positions substantially symmetrical with respect to the central axis of the support member 240 as shown in FIG. Instead of being formed one by one for each of the 72, one through hole having a size capable of inserting the two lead wires 71 and 72 may be formed in the conical portion 242.
As described above, also in the configuration of the illumination light source 200 according to the third embodiment, the same effects as those of the first and second embodiments can be obtained. That is, the antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 as a PCB antenna and is disposed inside the globe 10. Accordingly, when the illumination light source 200 is mounted on the illumination device, the antenna 290 is positioned inside the relatively exposed globe 10, and thus the antenna is housed in the case 60. In comparison, transmission / reception of wireless signals is less likely to be hindered, and transmission / reception of wireless signals can be performed more reliably.

In addition, the light emitting unit 220 having the semiconductor light emitting element 22 as a light source is supported at the center position in the globe 10 by the support member 240, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb. be able to.
In addition, since a translucent member is used for the mounting substrate 21 on which the semiconductor light emitting element 22 is mounted, the light emitted downward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and the globe 10. From there, it further passes through the globe 10 and is emitted to the outside. Thereby, the light quantity emitted to the lower side of the illumination light source 200 can be increased, and better light distribution characteristics can be obtained.

  In addition, since the support member 240 is configured using a translucent member, light emitted downward from the semiconductor light emitting element 22 is transmitted through the support member 340 without being blocked by the support member 240. And reaches the globe 10 and is emitted from there. Thereby, the light quantity emitted to the lower side of the illumination light source 200 can be increased, and better light distribution characteristics can be obtained.

  In the present embodiment, the antenna 290 is formed on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but is not limited thereto. For example, the antenna 290 may be provided on both end sides in the longitudinal direction of the mounting substrate 21 from the first through hole 25. In this case, one pair of antennas 290 may be provided on each of the one end side and the other end side, and the antennas 290 on both end sides may be integrally formed. Further, the antenna 290 is not limited to the surface of the mounting substrate 21, but may be formed on the back surface of the mounting substrate 21, or may be formed on the side surface of the mounting substrate 21. When one antenna 290 is provided on each of the both end sides, an antenna terminal 292 may be provided at each longitudinal end, and the antenna line 91 may be connected to each. In this case, the two antenna lines 91 respectively connected to both antenna terminals 292 may be integrated into one and connected to the circuit unit 80.

<< Fourth Embodiment >>
In the illumination light source 200 according to the third embodiment, the configuration in which the PCB antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 has been described. However, the antenna provided on the mounting substrate 21 is limited to the PCB antenna. I can't.
FIG. 10A is an external perspective view showing a schematic configuration of an illumination light source 300 according to the fourth embodiment. FIG. 10B is a plan view of the light emitting unit 320 in the illumination light source 300.

The third embodiment is that the illumination light source 300 according to the present embodiment has an antenna 390 formed on the surface of the mounting substrate 21 of the light emitting unit 320, and the antenna 390 is a chip antenna that is an SMD. This is different from the illumination light source 200 according to FIG.
Further, as shown in FIG. 10B, in the present embodiment, the antenna 390 is located at one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25 and in the center of the mounting substrate 21 in the short direction. Part, that is, between the two sealing bodies 23. An antenna terminal 392 to which one end of the antenna line 91 is connected is formed on the surface of the mounting substrate 21, and the antenna 390 is connected to the antenna terminal 392 by soldering or the like. A through hole 393 that penetrates the mounting substrate 21 and the antenna terminal 392 is formed in the center of the antenna terminal 392. Although not shown in FIG. 10 (b), one end of the antenna wire 91 opposite to the side connected to the circuit unit 80 is inserted into the through hole 393, and the conductive bonding member 73 made of solder or the like is used. The antenna terminal 392 and the antenna line 91 are connected.

  The antenna 290 is used in, for example, the 2.4 GHz band, but is not limited thereto, and an antenna that is suitable for a desired band to be used may be used. As the antenna 390, for example, AN048 manufactured by Texas Instruments may be used. In this case, the size of the antenna 390 is 2 mm (corresponding to the short direction of the mounting substrate 21), horizontal (mounting substrate). 21 (corresponding to the longitudinal direction of 21) and 7 [mm] and height (corresponding to the vertical direction) 3 [mm].

Note that the chip antenna used for the antenna 390 is not limited to the above, and the size thereof is the same as the size of the mounting substrate 21, the arrangement of the semiconductor light emitting elements 22, the arrangement of the sealing body 23, and the antenna 290. Depending on the position on the mounting substrate 21 to be performed, the position may be appropriately changed as long as a desired radio signal transmission / reception performance is satisfied.
The directivity of the antenna 90 is preferably omnidirectional.

  As described above, even in the configuration of the illumination light source 300 according to the fourth embodiment, the same effects as those of the first, second, and third embodiments can be obtained. That is, the antenna 390 is mounted on the mounting substrate 21 of the light emitting unit 320 as a chip antenna and is disposed inside the globe 10. As a result, when the illumination light source 300 is mounted on the illumination device, the antenna 390 is positioned inside the relatively exposed globe 10, so that the antenna is housed inside the case 60. In comparison, transmission / reception of wireless signals is less likely to be hindered, and transmission / reception of wireless signals can be performed more reliably.

In addition, the light emitting part 320 having the semiconductor light emitting element 22 as a light source is supported by the support member 240 at the center position in the globe 10, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb. be able to.
In addition, since a translucent member is used for the mounting substrate 21 on which the semiconductor light emitting element 22 is mounted, the light emitted downward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and the globe 10. From there, it further passes through the globe 10 and is emitted to the outside. Thereby, the light quantity emitted to the lower side of the illumination light source 300 can be increased, and better light distribution characteristics can be obtained.

  In addition, since the support member 240 is configured using a translucent member, light emitted downward from the semiconductor light emitting element 22 is transmitted through the support member 240 without being blocked by the support member 240. And reaches the globe 10 and is emitted from there. Thereby, the light quantity emitted to the lower side of the illumination light source 300 can be increased, and better light distribution characteristics can be obtained.

  In the present embodiment, the antenna 390 is mounted on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but is not limited thereto. For example, the antenna 390 may be provided on both ends in the longitudinal direction of the mounting substrate 21 from the first through hole 25. In addition, the antenna 390 is mounted not only on the front surface of the mounting substrate 21 but may be mounted on the back surface of the mounting substrate 21. When one antenna 390 is provided at each of the both end sides, an antenna terminal 392 may be provided at each longitudinal end, and the antenna line 91 may be connected to each. In this case, the two antenna lines 91 respectively connected to both antenna terminals 392 may be integrated into one and connected to the circuit unit 80.

Further, the through holes 244 and 245 may be formed at different positions instead of being provided at positions substantially symmetrical with respect to the central axis of the support member 240 as shown in FIG. Instead of being formed one by one for each of the 72, one through hole having a size capable of inserting the two lead wires 71 and 72 may be formed in the conical portion 242.
≪Modification≫
As mentioned above, although the structure of this invention was demonstrated based on 1st, 2nd, 3rd, and 4th embodiment, this invention is not restricted to the said embodiment, The following modifications can be implemented. it can. In addition, in order to avoid duplication of description, the same code | symbol is attached | subjected about the same component as 1st, 2nd, 3rd, and 4th embodiment, and the description is abbreviate | omitted.

(Modification 1)
In the first embodiment, the mounting substrate 21 of the light emitting unit 20 has a rectangular shape in plan view, but is not limited thereto.
FIG. 11 is an external perspective view showing a schematic configuration of the illumination light source 400 according to the first modification. The illumination light source 400 includes a globe 10, a light emitting unit 420, a support member 440, a base 450, a case 60, a base 30, an antenna 90 that is a helical antenna, lead wires 71 and 72, and the like as main components. Although not shown in FIG. 11, a circuit unit 80 (see FIG. 3) is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by an antenna wire 91 (see FIG. 3). Yes.

  In the illumination light source 400, the mounting substrate 421 of the light emitting unit 420 has a disc shape, and a plurality of semiconductor light emitting elements 422 are mounted in an annular shape on the surface of the disc-shaped mounting substrate 421. A sealing body 423 is formed in an annular shape so as to cover all the semiconductor light emitting elements 422. The mounting substrate 421 is configured using a translucent member. As the translucent member, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a translucent resin substrate, or the like is used. Here, the plurality of semiconductor light emitting elements 422 have the same configuration as that of the semiconductor light emitting element 22 described in the first embodiment, but have different configurations, for example, different emission colors and outputs (luminance). It may be a thing.

  The sealing body 423 is made of a translucent material. Since the semiconductor light emitting element 422 emits light of the same color as the semiconductor light emitting element 22 of the first embodiment, the wavelength of light from the semiconductor light emitting element 422 is converted to desired (yellow) as in the first embodiment. A wavelength conversion material is mixed in the translucent material. In addition, although the sealing body 423 is carrying out the annular | circular shape when planarly viewed, it may be formed in a dome shape (circular shape when planarly viewed), for example.

The base 450 has a disk shape like the base 50 of the first embodiment. The base 450 has a support member 440 erected at the center of the surface in plan view, and leads that electrically connect the circuit unit (80) and the light emitting unit 420 at a position sandwiching the support member 440. Through holes 451 and 452 through which 71 and 72 are inserted are provided.
Since the lead wires 71 and 72 are inserted into the through holes 451 and 452 provided in the base 450, the support member 440 is not provided with a through hole for inserting the lead wires 71 and 72, and the antenna wire Only a through hole (not shown) for inserting (91) is formed. However, the through hole for the antenna wire may be provided in the base 450 instead of being provided in the support member 440. The support member 440 has the same basic configuration as the support member 40 of the illumination light source 1 according to the first embodiment, except that the lead wire through hole is not provided. A member similar to 40 (in this case, aluminum) is used to form a similar elongated bar shape.

The through-holes 451 and 452 are for passing the lead wires 71 and 72, and one through-hole having a size capable of inserting the two lead wires 71 and 72 may be formed or supported. It may be formed in another position other than the position where the member 440 is sandwiched.
The ends of the lead wires 71 and 72 on the light emitting unit 420 side are inserted from the bottom through the through holes provided in the mounting substrate 421, and are fixed on the upper surface of the mounting substrate 421 by a conductive bonding member 73 such as solder. And electrically connected to the wiring pattern.

  Even with the configuration of the illumination light source 400 according to the modification 1, the same effect as that of the illumination light source 1 according to the first embodiment can be obtained. In other words, the light emitting unit 420 is supported by the support member 440 at the center position in the globe 10, whereby it is possible to obtain a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb, and the antenna 90 is supported by the support member. Since it is attached to 440 and disposed inside the globe 10, compared with the case where the antenna is housed inside the case 60, transmission / reception of radio signals is less likely to be hindered, and transmission / reception of radio signals is more reliably performed. It can be carried out.

  Further, a light-transmitting member is used for the mounting substrate 421, and light emitted downward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 421 and emitted to the lower side of the globe 10, and the support member 440. Can be reduced in the proportion of light emitted downward from the semiconductor light emitting element 22 by the support member 440, thereby reducing the illumination light source 400 to the lower side. By increasing the amount of emitted light, better light distribution characteristics can be obtained.

In this modification, the mounting substrate 421 has a disk shape (the shape in plan view is circular), but is not limited thereto, and the shape in plan view is a polygon such as a hexagon or octagon, An irregular shape such as a shape may be used.
(Modification 2)
The illumination light source 400 according to the first modification is an example in which the light emitting unit 420 having the disc-shaped mounting substrate 421 is applied to the configuration in place of the light emitting unit 20 of the illumination light source 1 according to the first embodiment. It was.

However, the light emitting unit 420 of Modification 1 is not limited to the above, and can be applied to the illumination light source 100 according to the second embodiment.
FIG. 12 is a partially cutaway external perspective view showing a schematic configuration of an illumination light source 500 according to Modification 2. As shown in FIG. The illumination light source 500 includes a globe 10, a light emitting unit 420, a support member 540, a base 550, a case 60, a base 30, an antenna 190 that is a rod antenna, lead wires 71 and 72, and the like as main components. In FIG. 12, a part of the case 60 and a part other than the base 30 are shown as a cross-sectional view. Further, the circuit unit 80 is accommodated in the case 60. In FIG. 12, only a part of the circuit unit 80 can be seen from the cutout portion of the case 60.

  In the illumination light source 500 according to the modified example 2, an antenna 190 that is a rod antenna (pole antenna) having a long rod-like (columnar) shape is accommodated in a space 540a inside the support member 540. A communication hole 546 that connects the bottom surface of the space 540 a and the lower end surface of the support member 540 is formed at the lower end portion of the support member 540. A through hole 553 is formed at a position facing the communication hole 546 of the base 550. An antenna line 91 is connected to the lower end of the antenna 190, and the antenna line 91 is inserted into the communication hole 546 and the through hole 553 and connected to the circuit unit 80.

The base 550 has a disk shape like the base 150 of the second embodiment. In the plan view, the base 550 has a support member 540 standing at the center of the surface thereof, and leads 71, which electrically connect the circuit unit 80 and the light emitting unit 420 at positions sandwiching the support member 540. Through holes 551 and 552 through which 72 are inserted are provided.
Since the lead wires 71 and 72 are inserted into the through holes 551 and 552 provided in the base 550, the support member 540 is not provided with a through hole for inserting the lead wires 71 and 72, and the antenna wire Only a communication hole 546 for inserting 91 is formed. The support member 540 has the same basic configuration as the support member 140 except that the support member 540 is different from the support member 140 of the illumination light source 100 according to the second embodiment in that the through hole is not provided. Using a member similar to the member 140 (in this case, glass), it has a similar elongated rod shape.

The through-holes 551 and 552 are for passing the lead wires 71 and 72, and one through-hole having a size through which the two lead wires 71 and 72 can be inserted may be formed. 12 may be formed at a position other than the position sandwiching the support member 540 as shown in FIG.
The same effects as those of the illumination light source 100 according to the second embodiment can also be obtained by the configuration of the illumination light source 500 according to Modification 2. In other words, the light emitting unit 420 is supported by the support member 540 at the center position in the globe 10, whereby it is possible to obtain a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb, and the antenna 190 is the support member. Since the antenna is placed inside the globe 10 while being housed inside the 540, compared with the case where the antenna is housed inside the case 60, the transmission / reception of the wireless signal is less likely to be inhibited, and the transmission / reception of the wireless signal is more It can be done reliably.

  Further, similarly to Modification 1, a light-transmitting member is used for the mounting substrate 421, and light emitted downward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 421 and emitted to the lower side of the globe 10. In addition, by forming the support member 440 in the shape of an elongated bar, the ratio of light emitted downward from the semiconductor light emitting element 22 to be blocked by the support member 440 can be reduced. By increasing the amount of light emitted to the lower side of the light source 400, better light distribution characteristics can be obtained.

(Modification 3)
In each of the illumination light sources according to the first to third embodiments and the first and second modifications, the light emitting unit is formed by mounting the semiconductor light emitting element 22 as a light source on a single plate-shaped mounting substrate. The configuration provided is described. However, the structure of the light emitting unit is not limited to these, and a configuration including a light emitting unit having a more three-dimensional structure may be employed.

  FIG. 13 is an external perspective view showing a schematic configuration of an illumination light source 600 according to Modification 3. As shown in FIG. The illumination light source 600 includes a globe 10, a light emitting unit 620, a support member 440, a base 450, a case 60, a base 30, an antenna 90 that is a helical antenna, lead wires 71 and 72, and the like as main components. Although not shown in FIG. 13, a circuit unit 80 (see FIG. 3) is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by an antenna line 91 (see FIG. 3). Yes.

  In the illumination light source 600, the light emitting unit 620 is configured in a rectangular parallelepiped shape by combining six square mounting substrates 621 on which a plurality of SMD type semiconductor light emitting elements 622 are mounted. The respective mounting boards 621 are fixed to each other using an adhesive or the like, thereby maintaining a rectangular parallelepiped-like shape. The light emitting unit 620 is supported inside the globe 10 by the support member 440 such that one of the corners of the rectangular parallelepiped sticks into the support member 440. An adhesive or the like is used for a joint portion between the mounting substrate 621 and the support member 440 of the light emitting unit 620, whereby the light emitting unit 620 is fixedly supported by the support member 440. The method for fixing the light emitting unit 620 to the support member 440 is not limited to an adhesive, and an engagement structure, a stopper, or the like may be used.

The semiconductor light emitting device 622 is a device in which a light emitting device corresponding to the semiconductor light emitting device 22 and a sealing body covering the light emitting device are packaged as one chip. The light emitting color of the light emitting element, the material configuration of the sealing body, and the wavelength conversion characteristics are the same as those of the semiconductor light emitting element 22 and the sealing body 23, respectively.
In this modification, the SMD type semiconductor light emitting element 622 is used. However, the present invention is not limited to this, and the mounting substrate is not limited to this. You may use what formed the sealing body 23 on the semiconductor light emitting element of the type directly formed on top.

One end of each of the lead wires 71 and 72 is connected to a different mounting substrate 621, and the other end is connected to the circuit unit 80 accommodated in the case 60 through the through holes 451 and 452 of the base 450. Yes.
Although not shown in FIG. 13, each mounting substrate 621 is electrically connected by a lead wire inside the light emitting unit 620, and thereby each mounting substrate 621 is electrically connected to the circuit unit 80. ing.

The illumination light source 600 according to the modification 3 has the same basic configuration as the illumination light source 400 according to the modification 1 shown in FIG. 11 except that the light emitting unit 620 having a rectangular parallelepiped structure is used. is there.
Also in the illumination light source 600 according to this modification, since the antenna 90 is attached to the support member 440 and disposed inside the globe 10, compared with the case where the antenna is housed inside the case 60, the Signal transmission / reception is less likely to be inhibited, and radio signal transmission / reception can be performed more reliably.

  The light emitting unit 620 is three-dimensionally configured to have a rectangular parallelepiped shape, and each mounting substrate 621 is attached at different angles with respect to the lamp axis. Therefore, the main light emission directions of the semiconductor light emitting elements 622 mounted on the respective mounting substrates 621 are different. Furthermore, since the light emitting unit 620 is supported at the center position in the globe 10 by the support member 440, the light emitted from the semiconductor light emitting element 622 is emitted almost in all directions, and good light distribution characteristics can be obtained. .

  In the present modification, the light emitting unit 620 has a three-dimensional structure as described above, and the light emitted from the semiconductor light emitting element 622 is emitted in almost all directions. The submount substrate of the element 622 is not particularly assumed to be formed of a light transmissive member, but a light transmissive member may be used for both substrates. In that case, a light-transmitting member is preferably used for both substrates.

(Modification 4)
In the modification 3, the configuration in which the light emitting unit 620 having a three-dimensional structure is applied to the illumination light source 400 according to the modification 1 has been described.
However, the light emitting unit 620 of the third modification is not limited to the above, and can be applied to the illumination light source 500 according to the second modification.

  FIG. 14 is a partially cutaway external perspective view showing a schematic configuration of an illumination light source 700 according to Modification 4. The illumination light source 700 includes a globe 10, a light emitting unit 620, a support member 540, a base 550, a case 60, a base 30, an antenna 190 that is a rod antenna, lead wires 71 and 72, and the like as main components. In FIG. 14, a portion other than the light emitting unit 620, a part of the case 60, and the base 30 is shown as a cross-sectional view. Further, the circuit unit 80 is accommodated in the case 60. In FIG. 14, only a part of the circuit unit 80 can be seen from the cutout portion of the case 60. The antenna 190 and the circuit unit 80 are connected by an antenna line 91.

The illumination light source 700 according to the modification 4 has the same basic configuration as the illumination light source 500 according to the modification 2 shown in FIG. 12 except that the light emitting unit 620 having a rectangular parallelepiped structure is used. is there.
Moreover, the light emission part 620 of the illumination light source 700 which concerns on this modification is the same as the light emission part 620 of the illumination light source 600 which concerns on the modification 3 shown in FIG. It has a configuration.

  Also in the illumination light source 700 according to this modification, the same effect as that of the illumination light source 600 according to Modification 3 can be obtained. That is, since the antenna 190 is disposed inside the globe 10 while being accommodated in the support member 540, transmission / reception of radio signals is less likely to be hindered than when the antenna is accommodated in the case 60. The radio signal can be transmitted and received more reliably.

Moreover, since the light emitted from the light emitting unit 620 that is supported at the center position in the globe 10 and has a rectangular parallelepiped shape is emitted in almost all directions, good light distribution characteristics can be obtained.
Also in this modification, the mounting substrate 621 and the submount substrate of the semiconductor light emitting element 622 may be formed of a light-transmitting member. In this case, the mounting substrate 621 and the semiconductor light emitting element 622 are not formed. It is preferable that a translucent member is used for both of the submount substrates.

(Modification 5)
The three-dimensional shape of the light-emitting portion that can provide good light distribution characteristics is not limited to the cube-like shape as shown in the third and fourth modifications.
FIG. 15 is an external perspective view showing a schematic configuration of an illumination light source 900 according to Modification 5. The illumination light source 900 includes a globe 10, a light emitting unit 920, a support member 440, a base 450, a case 60, a base 30, an antenna 90 that is a helical antenna, lead wires 71 and 72, and the like as main components. Although not shown in FIG. 15, a circuit unit 80 (see FIG. 3) is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by an antenna wire 91 (see FIG. 3). Yes.

  In the illumination light source 900, the light emitting unit 920 is formed in a triangular pyramid shape by combining four triangular mounting substrates 921 on which a plurality of SMD type semiconductor light emitting elements 622 are mounted. The respective mounting boards 921 are fixed to each other using an adhesive or the like, thereby maintaining a triangular pyramid shape. The light emitting unit 920 is supported inside the globe 10 by the support member 440 such that one of the corners of the triangular pyramid is stuck into the support member 440. An adhesive or the like is used for a joint portion between the mounting substrate 921 and the support member 440 of the light emitting unit 920, whereby the light emitting unit 620 is fixedly supported by the support member 440. The method of fixing the light emitting unit 920 to the support member 440 is not limited to an adhesive, and an engagement structure, a stopper, or the like may be used.

In this modification, the SMD type semiconductor light emitting element 622 is used. However, the present invention is not limited to this, and the mounting substrate is not limited to this. You may use what formed the sealing body 23 on the semiconductor light emitting element of the type directly formed on top.
One end of each of the lead wires 71 and 72 is connected to a different mounting board 921, and the other end is connected to the circuit unit 80 accommodated in the case 60 through the through holes 451 and 452 of the base 450. Yes.

Although not shown in FIG. 15, each mounting substrate 921 is electrically connected by a lead wire inside the light emitting unit 920, and thereby each mounting substrate 921 is electrically connected to the circuit unit 80. ing.
An illumination light source 900 according to Modification 5 is similar to Modification 3 shown in FIG. 13 except that a light emitting unit 920 having a triangular pyramid structure is used instead of the light emitting unit 620 having a rectangular parallelepiped structure. The basic configuration of the illumination light source 600 is the same.

Also in the illumination light source 900 according to this modification, the antenna 190 is disposed inside the globe 10 in a state where the antenna 190 is housed inside the support member 540, so that the antenna is housed inside the case 60. The transmission / reception of radio signals is less likely to be hindered, and the transmission / reception of radio signals can be performed more reliably.
Further, the light emitting unit 920 is three-dimensionally configured to have a triangular pyramid shape, and as can be seen from FIG. 15, the light of the semiconductor light emitting element 622 mounted on one of the mounting substrates 921. Is supported by the support member 440 so that the main emission direction of the light of the semiconductor light emitting element 22 on the other mounting substrate 921 is obliquely below the illumination light source 900. ing. Furthermore, since the light emitting unit 620 is supported at the center position in the globe 10 by the support member 440, the light emitted from the semiconductor light emitting element 622 is emitted almost in all directions, and good light distribution characteristics can be obtained. .

  Also in this modification, the light emitting unit 920 has a three-dimensional structure as described above, and light emitted from the semiconductor light emitting element 622 is emitted in almost all directions. The submount substrate of the element 622 is not particularly assumed to be composed of a translucent member, but a translucent member may be used for both. In that case, a light-transmitting member is preferably used for both substrates.

(Modification 6)
The light emitting unit 920 in Modification 5 can also be applied to the illumination light source 700 according to Modification 4.
FIG. 16 is a partially cutaway external perspective view showing a schematic configuration of an illumination light source 1000 according to Modification 6. The illumination light source 1000 includes a globe 10, a light emitting unit 920, a support member 540, a base 550, a case 60, a base 30, an antenna 190 that is a rod antenna, lead wires 71 and 72, and the like as main components. In FIG. 16, a portion other than the light emitting unit 920, a part of the case 60, and the base 30 is shown as a cross-sectional view. Further, the circuit unit 80 is accommodated in the case 60. In FIG. 16, only a part of the circuit unit 80 can be seen from the cutout portion of the case 60. The antenna 190 and the circuit unit 80 are connected by an antenna line 91.

The basic configuration of the illumination light source 1000 according to Modification 6 is the same as that of the illumination light source 700 according to Modification 4 shown in FIG. 14 except that a light emitting unit 920 having a triangular pyramid-like structure is used. It is.
Moreover, the light emission part 920 of the illumination light source 1000 which concerns on this modification is the same as the light emission part 920 of the illumination light source 900 which concerns on the modification 5 shown in FIG. It has a configuration.

  Also in the illumination light source 1000 according to this modification, the same effect as that of the illumination light source 900 according to Modification 5 can be obtained. That is, since the antenna 190 is attached to the support member 540 and disposed inside the globe 10, transmission and reception of wireless signals are less likely to be hindered compared to the case where the antenna is housed inside the case 60, and wireless Signal transmission / reception can be performed more reliably.

In addition, light emitted from the light emitting unit 920 that is supported at the center position in the globe 10 and has a triangular pyramid-like shape is emitted in almost all directions, so that a good light distribution characteristic can be obtained.
Also in this modification, the mounting substrate 921 and the submount substrate of the semiconductor light emitting element 622 may be formed of a light-transmitting member. In that case, the mounting substrate 921 and the semiconductor light emitting element 622 It is preferable that a translucent member is used for both of the submount substrates.

(Modification 7)
The configuration in which the semiconductor light emitting element is supported in the globe is not limited to the configuration in which the light emitting unit including the semiconductor light emitting element is supported by the rod-shaped support member, as in the above embodiments and modifications. For example, the following modifications can be considered.
FIG. 17 is an external perspective view illustrating a schematic configuration of an illumination light source 1100 according to Modification 7. FIG. 18 is a cross-sectional view of the illumination light source 1100 including a lamp axis J3.

  As shown in FIGS. 17 and 18, the illumination light source 1100 includes, as main components, a globe 1110, a light emitting unit 1120, support members 1140 b and 1140 c, a base 1150, a case 1160, a base 30, and an antenna 190 that is a rod antenna. And lead wires 71, 72 and the like. A circuit unit 80 is accommodated in the case 1160. The antenna 190 and the circuit unit 80 are connected by an antenna line 91.

  In the illumination light source 1100 according to the modified example 7, a mounting substrate 1121a having an annular shape in which a plurality of SMD type semiconductor light emitting elements 1122 are mounted in an annular shape is placed on the peripheral portion of the upper surface of the base 1150, A cylindrical support member 1140b is placed inside the ring of the semiconductor light emitting device 1122 mounted on the mounting substrate 1121a. A plurality of semiconductor light emitting elements 1122 are mounted in an annular shape, and a mounting substrate 1121b having an annular shape with an outer diameter slightly smaller than the outer diameter of the support member 1140b is placed on the upper surface of the support member 1140b. Further, a cylindrical support member 1140c is placed inside the ring of the semiconductor light emitting device 1122 mounted on the mounting substrate 1121b, and the semiconductor light emitting device 1122 is mounted, which is larger than the outer diameter of the support member 1140c. A mounting substrate 1121c having a disk shape having a slightly smaller diameter is placed on the upper surface of the support member 1140c. The mounting substrate 1121a is fixed on the base 1150 with an adhesive or the like. The mounting substrate 1121b is fixed on the support member 1140b with an adhesive or the like. The mounting substrate 1121c is also fixed on the support member 1140c with an adhesive or the like. The mounting substrates are not limited to the adhesive, and may be performed by engagement or screwing.

  A recess is formed on the upper surface of the support member 1140b so that the mounting substrate 1121b fits in the upper surface, and a recess is formed on the upper surface of the support member 1140c so that the mounting substrate 1121c fits in the upper surface. Accordingly, positioning can be easily performed when mounting boards 1121b and 1121c are placed on support members 1140b and 1140c, respectively.

  The mounting board 1121a and the mounting board 1121b are electrically connected by two lead wires 76 inside the cylinder of the support member 1140b. The mounting substrate 1121b and the mounting substrate 1121c are electrically connected by two lead wires 77 inside the cylinder of the support member 1140c. One end of each of the two lead wires 78 is connected to the mounting substrate 1121a inside the cylinder of the support member 1140b. The lead wires 78 are respectively inserted into through holes 1151 and 1152 provided in the base 1150, and the other ends of the lead wires 78 are connected to the circuit unit 80. Thus, the mounting boards 1121a, 1121b, and 1121c are electrically connected to the circuit unit 80.

The SMD type semiconductor light emitting device 1122 is different in package shape from the SMD type semiconductor light emitting device 622 in the modified examples 3 to 6 (the 622 is square or rectangular when viewed in plan, whereas 1121 is The basic configuration is the same except that it is circular when viewed in plan.
A concave portion 1154 is formed in a central portion of the base 1150 and corresponding to the inside of the ring of the mounting substrate 1121a, and the lower end of the antenna 190 is fitted into the concave portion 1154 so that the antenna 190 is The support members 1140b and 1140c, the mounting boards 1121a, 1121b, and 1121c, and the space 1140a formed by the base 1150 are fixedly held. One end of an antenna line 91 is connected to the lower end of the antenna 190, and the antenna line 91 communicates with the recess 1154 and is inserted into a communication hole 1153 provided in the base 1150, and the other end of the antenna line 91 is The circuit unit 80 is connected.

Note that an adhesive or the like may be applied between the base 1150 and the antenna 190 to fix the antenna 190 to the base 1150 more stably. Further, the antenna 190 may be fixedly held with respect to the base 1150 by an engagement structure, screwing, or the like instead of the fitting or the adhesive.
The light emitting unit 1120 of the illumination light source 1100 according to Modification 7 has a so-called wedding cake-like step structure, and is emitted from the semiconductor light emitting element 1122 mounted on the lower mounting substrate. Since light is blocked by the upper support member and the mounting substrate arranged in the main emission direction, if the height of the support members 1140b and 1140c is too high, good light distribution characteristics cannot be obtained. Therefore, in the illumination light source 1100, a glove 1110 having a shorter vertical length is used instead of a glove shaped like an incandescent bulb. Accordingly, a case 1160 having a longer vertical length is used. The basic configuration of the globe 1110 and the case 1160 is the same as that of the globe 10 and the case 60 in the illumination light source 1 except that the length in the vertical direction is different (that is, the shape is different) as described above. The same.

Even with the configuration of the illumination light source 1100 according to this modification, the antenna 190 is disposed inside the globe 1110 in a state of being accommodated in the space 1140a, so that the antenna is accommodated inside the case 60. The transmission / reception of radio signals is less likely to be hindered, and the transmission / reception of radio signals can be performed more reliably.
The light distribution characteristics are also mounted on the mounting boards 1121b and 1121c by using translucent members for the support members 1140b and 1140c, the mounting boards 1121b and 1121c, and the submount board of the semiconductor light emitting device 1122. Of the light emitted from the semiconductor light emitting element 1122, the light emitted downward passes through the submount substrate, each support member, and each mounting substrate, reaches the lower side of the globe 1110, and from there to the outside Since the light is emitted, a certain degree of light distribution characteristics can be obtained.

In this modification, the antenna 190, which is a rod antenna, is disposed inside the globe 1110 in a state of being accommodated in the space 1140a. However, the present invention is not limited to this. For example, the helical antenna may be wound around and attached to the outer peripheral surfaces of the cylinders of the support members 1140b and 1140c.
(Modification 8)
FIG. 19 is an external perspective view showing a schematic configuration of an illumination light source 1200 according to Modification 8. FIG. 20 is a cross-sectional view of the illumination light source 1200 including a lamp axis J4.

  As shown in FIGS. 19 and 20, the illumination light source 1200 includes, as main components, a globe 10, a light emitting unit 1220, a base 1250, a case 60, a base 30, an antenna 190 that is a rod antenna, and lead wires 71 and 72. Etc. A circuit unit 80 is accommodated in the case 60. The antenna 190 and the circuit unit 80 are connected by an antenna line 91.

  The illumination light source 1200 according to Modification 8 includes a rectangular mounting board 1221 in which a plurality of semiconductor light emitting elements 1222 that are bullet-type LEDs are mounted in a row (eight in the case of this modification). A plurality of light emitting units 1220 configured to form a hollow polygonal column (an octagonal column in the case of this modification) are combined in a manner that matches the direction. The lower end portion of each mounting substrate 1221 constituting the polygonal column is fixed to the base 1250 by being fitted into the recess 1255 provided on the upper surface of the base 1250. The upper end of the polygonal column is covered with a lid 1243 having a disk shape.

  One end of the lead wire 71 is connected to one of the plurality of mounting boards 1221, and one end of the lead wire 72 is connected to the other one. The lead wires 71 and 72 are inserted into through holes 1251 and 1252 provided in the base 1250, respectively, and the other ends of the lead wires 71 and 72 are connected to the circuit unit 80. The mounting substrate 1221 other than the mounting substrate to which the lead wires 71 and 72 are connected is connected between adjacent mounting substrates by a lead wire (not shown), whereby each mounting substrate 1221 is electrically connected to the circuit unit 80. Connected.

  A recess 1254 is formed at the center of the upper surface of the base 1250, and the antenna 190 is fixed to the base 1250 by fitting the lower end of the antenna 190 into the recess 1254. It is held in the inner space 1221a. One end of an antenna line 91 is connected to the lower end of the antenna 190. The antenna line 91 is connected to the recess 1254 and is inserted into a communication hole 1253 provided in the base 1250, and the other end of the antenna line 91 is connected to the lower end of the antenna 190. The circuit unit 80 is connected.

Note that the antenna 190 may be more stably fixed to the base 1250 by applying an adhesive or the like between the base 1250 and the antenna 190. Further, the antenna 190 may be fixedly held with respect to the base 1250 by an engagement structure, screwing, or the like instead of the fitting or the adhesive.
In the illumination light source 1200 according to the modified example 8, the mounting substrate 1221 also serves as a support member that supports the semiconductor light emitting element 1222 as a light source inside the globe.

Even in the configuration of the illumination light source 1200 according to this modification, the antenna 190 is disposed inside the globe 10 in a state of being accommodated in the space 1221a, so that the antenna is accommodated in the case 60. The transmission / reception of radio signals is less likely to be hindered, and the transmission / reception of radio signals can be performed more reliably.
Further, since the semiconductor light emitting element 1222 mounted on the upper side of each mounting substrate 1221 is located close to the center position inside the globe 10, good light distribution characteristics can be obtained to some extent.

  In this modification, the antenna 190, which is a rod antenna, is disposed inside the globe 10 in a state of being accommodated in the space 1221a, but is not limited thereto. For example, the helical antenna may be wound around and attached to the outer peripheral surface of the polygonal column of the mounting substrate 1221 in a manner that avoids the semiconductor light emitting element 22. In this case, since the antenna is made of a conductor such as metal, it is desirable that wiring be formed on the inner surface of each mounting substrate 1221 (the side forming the inner side of the polygonal column).

(Modification 9)
In each said embodiment and each modification, although the whole rod antenna was accommodated in the inside of a supporting member, it is not restricted to this. For example, the following modifications can be considered.
FIG. 21 is an external perspective view showing a schematic configuration of an illumination light source 1300 according to Modification 9. In the illumination light source 1300, one end of each of the two rod antennas 1390 is a recess 1349 provided in the conical portion of the support member 1340 (in FIG. 21, only one located on the front side of the paper is shown). The remaining portion extends outward from the support member 1340.

Even with the configuration of the illumination light source 1300 according to this modification, the antenna 1390 is disposed inside the globe 10 in a state of being attached to the support member 1340, so that the antenna is stored in the case 60. As a result, transmission / reception of radio signals is less likely to be inhibited, and transmission / reception of radio signals can be performed more reliably.
Moreover, since the light emission part 20 is supported by the center position inside the globe 10 with the support member 1340, a favorable light distribution characteristic can be acquired.

In the illumination light source 1300 according to the present modification, the example in which the antenna 1390 is applied to the illumination light source 1 according to the first embodiment has been described, but the present invention is not limited thereto. For example, the illumination light source according to the second, third, and fourth embodiments and the above and below modifications may be configured to include the antenna 1390.
(Modification 10)
In each of the above-described embodiments and modifications, the case where a helical antenna or a rod antenna is used as an antenna has been described as an example. However, the antenna used is not limited thereto. For example, in addition to the above, an antenna of a size that can be accommodated in the globe 10 such as a single type, a dipole type, a loop type, a diversity, a film antenna, or the like may be used. When a diversity antenna is used, a plurality of diversity antennas may be provided and signals received by each may be combined and used. Furthermore, the position where the antenna is disposed is not limited to the peripheral surface and the inside of the support member, and the mounting substrate of the light emitting unit, and unless the light distribution characteristics such as the base or the inner surface of the globe are significantly affected, It may be arranged at any position inside the globe. When using a film antenna composed of a translucent member, it can be affixed to the inside of the globe, and in particular, a film on the inner surface of a region of the globe that is most exposed when mounted on a lighting device. By attaching the antenna, transmission / reception of radio signals is hardly disturbed, so that the effect of the present invention that radio signal transmission / reception can be reliably performed can be most expected.

(Modification 11)
The shape of the antenna 190 in the second embodiment and the modified examples 2, 4, 6, 7, 8, and 9 is a cylindrical shape, but is not limited thereto. For example, it may be a polygonal column such as a quadrangular column (a rectangular parallelepiped) or a hexagonal column, or may be a columnar body whose cross section is indefinite (for example, a heart shape). The diameter of the antenna 190 does not need to be constant over the entire width in the longitudinal direction, and may have a shape that is reduced in diameter from one end side to the other end side, or from one end side to the other end side. The shape may be such that the diameter is increased or decreased one or more times as it goes. Furthermore, the antenna 190 does not need to be configured by a single bar-shaped member, and may be configured to form a bar-shaped shape by combining a plurality of parts, and a metal wire or the like is coiled around the bar-shaped member. It may be wound in a shape (helical antenna wound in a spiral).

(Modification 12)
The antenna 290 (PCB antenna) in the third embodiment and the antenna 390 (chip antenna) in the fourth embodiment are the disk-shaped mounting substrate 421 in the first and second modifications, and the mounting board in the third and fourth modifications. It may be mounted on the mounting substrate 921 in the modified example 5 and 6, the mounted substrates 1121a, 1121b, and 1121c in the modified example 7, and the mounted substrate 1221 in the modified example 8.

(Modification 13)
In each of the above embodiments and modifications, a part of the heat generated in the light emitting part is transmitted to the base through the support member, and further transmitted from the base to the case and the base, and from the base to the lighting device The heat is dissipated to the ceiling. At that time, the heat transmitted to the case is conducted from there to the circuit board 81, and the thermal load of the circuit unit 80 is increased. Furthermore, since the circuit unit 80 is accommodated in a substantially sealed narrow space inside the case, the heat is easily trapped when the air inside the case is warmed by the heat transmitted to the case. Since the heat generated by the electronic components of the unit 80 is not easily radiated, the thermal load received by the circuit unit 80 is further increased.

Some electronic components that constitute the circuit unit 80 are greatly affected by the influence of heat. Therefore, in order to ensure a long life of the circuit unit, it is important to suppress the thermal load on the circuit unit 80.
FIG. 22 is a cross-sectional view illustrating a schematic configuration of an illumination light source 1400 according to Modification 13.
The illumination light source 1400 includes a globe 1410, a light emitting unit 20, a support member 40, a base 50, a case 60, a base 30, an antenna 90 that is a helical antenna, lead wires 71 and 72, and the like as main components. Further, the circuit unit 80 is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by the antenna line 91.

The globe 1410 is different from the globe 10 of the illumination light source 1 according to the first embodiment in that the length of the opening side end portion 1410c in the vertical direction is longer than the thickness of the base 1450 (length in the vertical direction). Except for the difference, the basic configuration is the same as that of the globe 10.
The base 1450 is not formed with a step at its peripheral edge, and has a substantially equal diameter across the entire width in the vertical direction, and the diameter corresponds to the inner diameter of the opening side end 1410c of the globe 1410 (ie, The basic configuration is the same as that of the base 50 except that it is different from the base 50 of the illumination light source 1 in that it is slightly smaller than the inner diameter of the opening side end portion 1410c.

The diameter of the opening side end portion 1410c of the globe 1410 is set to be slightly smaller than the diameter of the cylindrical portion 1410b, and a step 1410d is formed at both joint portions. In addition, the outer diameter of the opening side end portion 1410 c corresponds to the inner diameter of the upper end side opening of the large diameter portion 61 of the case 60.
The base 1450 is fixed to the opening side end portion 1410c by the adhesive 56 in a state where the base 1450 is inserted into the opening side end portion 1410c of the globe 1410.

The opening-side end portion 1410 c of the globe 1410 is fixed to the large-diameter portion 61 with an adhesive 57 while being inserted into the upper-end opening of the large-diameter portion 61 of the case 60. At this time, the upper end surface of the large diameter portion 61 contacts the step 1410d, and the downward movement of the globe 1410 is locked.
An adhesive having a high thermal conductivity is used as the adhesive 56, and an adhesive having a low thermal conductivity is used as the adhesive 57. As the adhesive having low thermal conductivity, for example, a silicone resin adhesive or an epoxy resin adhesive may be used. As an adhesive with high thermal conductivity, for example, high thermal conductivity fine particles such as metal powder (for example, aluminum filler) are mixed in a silicone resin adhesive or an epoxy resin adhesive to increase thermal conductivity. May be used.

  According to the configuration of the illumination light source 1400 according to this modification, the heat from the light emitting unit 20 that has been transmitted to the base 1450 through the support member 40 is transmitted to the globe 1410 via the adhesive 56 having high thermal conductivity. It is easy to be transmitted to the opening side end portion 1410c. And since the adhesive 57 interposed between the opening side end portion 1410c and the large diameter portion 61 of the case 60 is an adhesive having low thermal conductivity, the heat transferred to the opening side end portion 1410c is from there. Difficult to be transmitted to case 60. As a result, heat conduction from the case 60 to the circuit unit 80 is suppressed, and furthermore, the air inside the case 60 in which the circuit unit 80 is housed is hardly warmed, so that the thermal load received by the circuit unit 80 is suppressed. be able to.

Similarly to the illumination light source 1 according to the first embodiment, the light emitting unit 20 is supported by the support member 40 inside the globe 1410, and the antenna 90 is wound around the support member in a spiral shape. Therefore, it is possible to expect the effect that the radio signal can be transmitted and received more reliably and the effect that the good light distribution characteristic is obtained.
(Modification 14)
In an illumination light source having a function of receiving and controlling a radio signal, in addition to a circuit for lighting a semiconductor light emitting element, it has a circuit for transmitting and receiving a radio signal, and these circuits are configured. The electronic parts to be included include parts that are vulnerable to heat load. In particular, a driver (wireless control unit) that controls wireless signals is vulnerable to heat.

However, in the configuration in which the heat from the LED light emitting module is conducted to the base and dissipated from the base, the housing located between the LED light emitting module and the base when the heat from the LED light emitting module is transmitted to the base. In addition, since heat is transmitted, the temperature of the housing and the space inside the housing rises, and the heat load on the circuit unit housed in the housing increases.
Furthermore, in recent years, the development of brighter illumination light sources has been promoted, and with the increase in the brightness of the illumination light sources, the amount of heat generated from the LEDs has increased, and the problem of increased thermal load received by the circuit unit has increased. Yes. Further, LEDs have a long life, and a circuit (electronic component) that lights such LEDs is also required to have a long life.

Therefore, it is possible to implement the following modification.
The overall configuration of an illumination light source according to Modification 14 of the present invention will be described with reference to FIGS.
[1. overall structure]
FIG. 23 is an external perspective view showing a schematic configuration of an illumination light source 1500 according to Modification 14. FIG. 24 is an exploded perspective view of the illumination light source 1500. FIG. 25 is a cross-sectional view of the illumination light source 1500 taken along the line CC ′ shown in FIG. FIG. 26 is a cross-sectional view of the illumination light source 1500 taken along the line DD ′ shown in FIG. In FIG. 25 and FIG. 26, the alternate long and short dash line drawn along the vertical direction of the drawing indicates the lamp axis J5 of the illumination light source 1500.

  As shown in FIGS. 23 to 26, an illumination light source 1500 according to a modification 14 of the present invention is a light bulb type lamp that replaces an incandescent light bulb, and an LED lamp using an LED as a semiconductor light emitting element as a light source. It is. The illumination light source 1500 includes, as main components, a light-transmitting globe 1510, a light emitting unit 20 including a semiconductor light emitting element 22 (see FIG. 5) as a light source, and a base 30 that receives power from the outside. , And a support member 1540 that supports the light emitting unit 20 in the globe 1510. The end of the globe 1510 on the opening side is integrally connected to the stem 1550, and a case 1560 as a housing is attached to the end. Case 1560 has a cylindrical shape. A base 30 is attached to one end of the case 1560 (the rear end in FIGS. 23 to 27). In addition, the opening on the other end side (the front side in FIGS. 23 to 27) of the case 1560 is closed by a stem 1550. A circuit unit 80 is stored inside the case 1560. A support member 1540 is attached to the stem 1550 in a direction extending into the globe 1510. A convex portion 1553 a is formed at the upper end of the joint portion 1553 of the stem 1550, and the support member 1540 is attached to the joint portion 1553 by engaging with the concave portion 1544 formed at the lower end of the support member 1540. In other words, the stem 1550 is a base on which the support member 1540 is erected. The light emitting unit 20 is attached to the tip of the support member 1540 in the extending direction (upward). In addition, what integrated the glove | globe and the stem may be called a valve | bulb.

[2. Configuration of each part]
Hereinafter, each component of the light source 1500 for illumination which concerns on the modification 14 of this invention is demonstrated in detail, referring FIGS. 23-26.
(2-1. Globe)
The globe 1510 has a shape similar to a bulb (also referred to as a glass bulb) of an incandescent bulb (a bulb having a filament), and is a so-called A type.

  As shown in FIG. 24, the globe 1510 includes a spherical portion 1510a having a hollow spherical shape and a cylindrical portion 1510b having a cylindrical shape. The cylindrical portion 1510b is reduced in diameter as it moves away from the spherical portion 1510a in the lamp axis direction. Note that an opening exists at the end of the cylindrical portion 1510b opposite to the spherical portion 1510a, and this opening is closed by a stem 1550. In addition, let the edge part by which this opening exists be an opening side edge part.

The globe 1510 is made of a translucent material. Examples of the translucent material include a glass material and a resin material such as acrylic. Here, the globe 1510 is made of, for example, a glass material.
(2-2. Case)
The case 1560 has the same shape as the portion close to the cap 30 side of the bulb of the incandescent bulb. In this embodiment, the case 1560 has a large-diameter portion 1561 in the half on the globe 1510 side and a small-diameter portion 1562 in the half on the cap side in the central axis (lamp axis J5) direction. There is a step 63 between the two.

  A step portion 1566 is annularly provided on the inner peripheral surface of the front side (upper end side) of the large-diameter portion 1561 of the case 1560 in a circumferential direction, and a stem 1550 that is integrally connected to the globe 1510 is attached to the case 1560. , The flange lower end 1551b1 of the flange 1551b of the stem 1550 is placed on the step 1566, the cylindrical portion 1510b of the flange 1551b and the globe 1510, and the large diameter upper end of the large diameter portion 1561 of the case 1560. A gap between the inner periphery of 1561a is filled with an adhesive 1556 such as resin, and the integrated globe 1510 and stem 1550 are fixed to the case 1560. Accordingly, the upper end side opening of the case 1560 is closed by the stem 1550 as described above.

A base 30 is screwed to the small diameter portion 1562 of the case 1560. In this modification, the base 30 is an Edison type. For this reason, the outer periphery of the small diameter portion 1562 is a male screw and is screwed into the base 30. Thereby, the base 30 and the case 1560 are screwed together.
Further, the small diameter portion 1562 of the case 1560 is formed with a groove 1564 extending in parallel with the direction in which the central axis of the case 1560 extends. The groove 1564 fixes the lead wire 75 that connects the base 30 and the circuit unit 80 (regulates the movement of the lead wire 75).

Case 1560 is made of a resin material such as polybutylene terephthalate (PBT). In order to adjust the thermal conductivity of the case 1560, a resin material mixed with glass fiber or the like may be used.
As described above, the shape of the large-diameter portion 1561 of the case 1560 is similar to that of an incandescent light bulb as an overall shape with the globe 1510 attached to the upper end portion and the base 30 attached to the lower end portion. The diameter is increased in a curve as it moves from the base 30 side to the globe 1510 side.

The case 1560 has a function of releasing heat generated by the circuit unit 80 housed in the case 1560 when the illumination light source 1500 is turned on. Heat dissipation is performed by heat conduction from the case 1560 to the outside air, convection of outside air, radiation, or the like.
The case 1560 has a space that is substantially sealed inside by opening the upper end side thereof with the stem 1550 as described above and closing the lower end side opening with the base 30. A circuit unit 80 is accommodated in this space.

(2-3. Stem)
Stem 1550 is integrally connected to globe 1510 and inserted into large diameter portion 1561 of case 1560. The stem 1550 includes a dome-shaped flare 1551, an exhaust pipe 1552, and a joint portion 1553. As will be described in detail later, the exhaust pipe 1552 is a narrow pipe for exhausting the air inside the globe 1510 and filling the filling fluid 12 instead. The joint portion 1553 is provided at the top of the dome of the flare 1551, and a convex portion 1553a for attaching a support member 1540 described later is formed at the upper end thereof.

Since stem 1550 is inserted into case 1560, stem 1550 has an outer diameter corresponding to the inner surface of large-diameter portion 1561 of case 1560. Here, the inner peripheral surface of the case 1560 corresponds to the outer diameter of the stem 1550, and the cross-sectional shape of the inner peripheral surface of the large-diameter portion 1561 is circular, so that the lower end of the dome of the flare 1551 The plan view shape is also circular.
The flare 1551 includes a flare head 1551a (see FIG. 27) including the top of the dome and a flange 1551b (see FIG. 27) extending in a bowl shape below the flare head 1551a. When the stem 1550 is inserted into the large diameter portion 1561 of the case 1560, the lower end of the flange portion 1551b comes into contact with the upper surface of the step portion 1566 provided on the inner peripheral surface of the large diameter portion 1561. Thereby, the positioning of the stem 1550 can be easily performed.

Here, as described above, the stem 1550 is joined to the case 1560 by the adhesive 1556 while being inserted into the large diameter portion 1561 of the case 1560.
The stem 1550 is sealed with lead wires 71 and 72 and an antenna wire 91 to be described later.
(2-4. Support member)
The support member 1540 supports the light emitting unit 20 at the center position inside the globe 1510. Here, the said center position is a position corresponding to the light source (filament) position in an incandescent lamp, for example, is the substantially same position as the position where a filament is arrange | positioned in an incandescent lamp. The support member 1540 has a rod-like shape, the upper end portion is coupled to the light emitting unit 20, and the lower end portion is attached to the joint portion 1553 of the stem 1550. That is, the support member 1540 is provided on the stem 1550 so as to extend from the stem 1550 to the inside of the globe 1510.

  The upper end portion of the support member 1540 and the light emitting unit 20 are coupled using, for example, an engagement structure. A convex portion 1543 is formed substantially at the center of the upper surface 1541 of the support member 1540. A first through hole 25 is formed in the approximate center of the mounting substrate 21 of the light emitting unit 20. That is, the first through hole 25 is provided in the center portion of the mounting substrate 21 in the longitudinal direction and the short direction, and is provided between the two sealing bodies 23 in the present embodiment. The shape of the convex portion 1543 and the shape of the first through hole 25 correspond to each other, and the convex portion 1543 of the upper surface 1541 of the support member 1540 is inserted (fitted) into the first through hole 25 of the mounting substrate 21 of the light emitting unit 20. The mounting substrate 21 is placed on the upper surface 1541 of the support member 1540.

In addition, the coupling | bonding of the supporting member 1540 and the light emission part 20 is not restricted to an engagement structure, For example, you may use an adhesive agent.
The light emitting unit 20 is disposed with the surface on which the plurality of semiconductor light emitting elements 22 are mounted facing the top of the globe 1510. In other words, the semiconductor light emitting element 22 is arranged in a plane with its main oblique direction facing the front of the illumination light source 1500.

  A concave portion 1544 (see FIG. 25) is formed in the lower end portion of the support member 1540. By fitting the convex portion 1553a of the joint portion 1553 into the concave portion 1544, the support member 1540 is attached (coupled) to the stem 1550. ing. Note that the connection between the support member 1540 and the stem 1550 is not limited to the above fitting, and an adhesive or the like may be used. In the case of using an adhesive, the joint portion 1553 can be omitted. That is, the support member may be directly attached to the top of the flare 1551 using an adhesive.

As a material constituting the support member 1540, a material having high thermal conductivity (heat dissipation) is used. Examples of the material having high thermal conductivity include metals and ceramics. In the present embodiment, the support member 1540 is made of, for example, aluminum. Details will be described later.
The light emitting unit 20 can emit light from the light emitting unit 20 to the rear by configuring the mounting substrate 21 with a translucent material. For this reason, the support member 1540 has a shape as close to a rod as possible so as not to block light emitted backward from the semiconductor light emitting element 22 (light emitting unit 20).

That is, the rear region of the support member 1540 is a cylindrical portion 1547 having a circular cross section. The front region of the support member 1540 is a flat portion 48 that is flat in the short direction (thickness is thin in the short direction) of the rectangular mounting substrate 21.
The support member 1540 may be made of a translucent material (for example, a glass material) so as not to block light emitted backward from the semiconductor light emitting element 22, and light is reflected on the surface of the support member 1540. You may give the process which improves property.

The length of the support member 1540 is, for example, 20 to 40 [mm], and the diameter of the cylindrical portion 1547 of the support member 1540 is, for example, 5 to 30 [mm].
The longitudinal direction and the short direction of the mounting substrate 21 are 5 to 30 [mm] diagonally, and the thickness is, for example, 1 to 1.6 [mm].
[3. Heat dissipation and thermal load]
As described above, the electronic components constituting the circuit unit 80 include components that are vulnerable to heat load. In particular, the wireless control unit 820 that controls wireless signals is vulnerable to heat. When the heat generated in the semiconductor light emitting element 22 of the light emitting unit 20 is transmitted to the case 1560, the temperature inside the case 1560 is increased, and the heat load received by the wireless control unit 820 is increased. Therefore, by increasing the proportion of heat transmitted to the globe 1510 out of the heat generated in the semiconductor light emitting device 22 and dissipating it from the globe 1510, the proportion of heat transmitted from the semiconductor light emitting device 22 to the case 1560 is reduced, and wireless An increase in the thermal load received by the control unit 820 can be suppressed.

  As shown in FIGS. 23, 26 and 27, the filling fluid 12 is filled inside the globe 1510. The filling fluid 12 functions as a medium and a heat conduction path for conducting heat generated in the semiconductor light emitting element 22 of the light emitting unit 20 to the globe 1510. As the filling fluid 12, there are a gas and a liquid, and in either case, a material having higher heat conductivity and light-transmitting property than air is used. In the present embodiment, the filling fluid 12 is a gas, and specifically, for example, helium (He) gas. Advantages of using helium gas include inertness, low cost, and no fear of exhaustion.

  Further, the volume and filling ratio of helium gas sealed in the globe 1510 (the ratio of the volume of helium gas to the capacity inside the globe 1510) is not particularly limited. Even when the inside of the globe 1510 closed by the stem 1550 is not filled with helium gas, heat transfer from the light emitting unit 20 to the globe 1510 as compared with the case where no helium gas is enclosed in the globe 1510. Can be promoted.

  Note that the gas used as the filling fluid 12 is not limited to helium gas, and other gas having higher thermal conductivity than air may be neon (Ne) gas or oxygen may exist inside the globe 1510. Otherwise, hydrogen (H) gas may be used. Specific examples of the liquid used for the filling fluid 12 include water and silicone oil. When water is used, lead wires 71 and 72, antenna wires 91, power supply terminals 24a and 24b on the mounting substrate 21, wiring patterns 27, and conductivity are used in order to prevent problems caused by deterioration due to rust or occurrence of short circuits. Of the members arranged inside the globe 1510, such as the joining member 73, the antenna 90, and the support member 1540, all those that may be corroded by water and those that may cause an electrical failure are all coated with a resin or the like. It is good to keep.

  Further, the support member 1540 has a function of supporting the light emitting unit 20 inside the globe 1510, and also has a function of communicating with the filling fluid 12 when transferring heat generated in the semiconductor light emitting element 22 to the globe 1510 via the filling fluid 12. It also functions to increase the heat transfer efficiency by increasing the contact area (envelope volume). That is, part of the heat generated in the semiconductor light emitting element 22 during light emission is transferred to the support member 1540 through the mounting substrate 21, but at this time, the light is emitted from the light emitting unit 20 directly to the globe 1510 through the filling fluid. In addition to transferring heat, heat is transferred from the support member 1540 to the globe 1510 via the filling fluid 12. Therefore, when a material having high heat dissipation (high heat conductivity) is used for the support member 1540, heat generated in the semiconductor light emitting element 22 can be more efficiently conducted to the globe 1510. Examples of the material having high thermal conductivity include metals and ceramics. In the present embodiment, the support member 1540 is made of, for example, aluminum.

  As described above, the illumination light source 1500 according to the present embodiment is filled with the filling fluid 12 having higher thermal conductivity than air in the globe 1510, and thus the air is sealed in the globe. Compared to the illumination light source, heat generated in the semiconductor light emitting element 22 is easily transmitted to the globe 1510. As a result, it is possible to increase the rate of heat radiated from the globe 1510 among the heat generated in the semiconductor light emitting element 22 and reduce the rate of heat transmitted from the support member 1540 to the case 1560, and thereby the internal space of the case 1560. The thermal load received by the circuit unit 80 by suppressing the temperature rise, particularly the thermal load received by the wireless control unit 820 can be suppressed. And the lifetime of a radio | wireless control part is implement | achieved and favorable quality can be ensured stably over a long period of time.

Note that when an adhesive having low thermal conductivity is used as the adhesive 1556, heat conduction to the case 1560 can be more efficiently suppressed.
[4. Light distribution characteristics]
Also in the illumination light source 1500 according to this modification, the light emitting unit 20 is provided in the globe 1510 at a position corresponding to the light source (filament) position of the incandescent bulb (for example, substantially the same position). As a result, even if the illumination light source 1500 is mounted on a conventional lighting device for an incandescent bulb, the light emitting unit 20 is arranged at the position of the filament, and the characteristics close to the light distribution characteristics when the incandescent bulb is mounted are obtained. Can be obtained.

In addition, since the light emitting unit 20 is configured using the translucent mounting substrate 21, the light emitted backward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and is emitted from the globe 1510 to the outside. .
Further, by making the shape of the support member 1540 supporting the semiconductor light emitting element 22 into a long and narrow bar, the ratio of light emitted backward from the semiconductor light emitting element 22 to be blocked by the support member 1540 can be reduced. it can.

By configuring the support member 1540 with a light-transmitting material, the light reaching the support member 1540 passes as it is, and the light reaching the inner surface of the globe 1510 is transmitted through the globe 1510 and emitted to the outside. .
[5. Manufacturing method of illumination light source]
A method for manufacturing the illumination light source 1500 will be described with reference to FIGS.

(5-1. Flare formation process)
First, a method for forming a flare will be described below with reference to FIGS.
FIG. 27 is a diagram illustrating a process of forming the flare 1551 in the manufacturing process of the illumination light source 1500, and (a) and (a ′) are diagrams illustrating a state before the flare is formed. ), (B ′) is a diagram showing a state after flare formation. (A) and (b) are cross-sectional views taken along the line corresponding to the line DD ′ in FIG. 23, and (a ′) and (b ′) are (a) and (b), respectively. It is an arrow directional cross-sectional view along the EE 'line | wire in ().

  As shown in FIGS. 27B and 27B, the flare 1551 is made of, for example, glass in the present embodiment, and the lead wires 71 and 72 and the antenna wire 91 are sealed on the flare 1551. An exhaust pipe 1552 is fused. The flare 1551 includes a flare head 1551a to which the lead wires 71 and 72 are sealed, and a lower side from the flare head 1551a (lower side when finally assembled as the illumination light source 1500. Hereinafter, a method for manufacturing an illumination light source will be described. In the description, “upper” and “lower” indicate “upper” and “lower” when assembled as the illumination light source 1500, respectively.

  As shown in FIGS. 27A and 27A, the flare 1551 is obtained by processing the flare tube 1551 ′, and the straight portion 1551′a of the flare tube 1551 ′ is heated by the burner 9. A part thereof is melted, and as shown in FIGS. 27B and 27B, the flare head 1551a is formed together with the upper end of the glass thin tube 1552 ′. Further, the flare portion 1551'b becomes a flange portion 1551b without being melted or deformed. A part of the flange portion 1551b is melt-bonded to the lower end portion of the cylindrical portion 1510b of the globe 1510 in the globe sealing step.

  The narrow tube 1552 ′ is processed into an exhaust tube 1552. The exhaust pipe 1552 is used to exhaust air inside the globe 1510 and to fill the inside of the globe 1510 with the filling fluid 12. The upper end of the thin tube 1552 ′ is fused to the flare head 1551 a of the flare 1551. On the other hand, the lower end portion of the thin tube 1552 ′ is sealed after the globe 1510 is filled with the filling fluid 12. These will be described in detail later.

(5-2. Joint part forming step)
Next, a process of forming a joint portion for attaching (connecting) the support member 1540 to the flare 1551 will be described.
FIG. 28 is a diagram showing a process subsequent to FIG. 27, wherein (a) and (a ′) are diagrams showing a state before the joint portion is formed, and (c) and (c ′) are joint portion formation. It is a figure which shows a subsequent state, (b), (b ') is a figure which shows the state in the middle. In addition, (a), (b), (c) is arrow sectional drawing along the line corresponded to DD 'line in FIG. 23, (a'), (b '), (c') These are sectional views taken along the line EE ′ in (a), (b), and (c), respectively.

  As shown in FIGS. 28A and 28A, first, the lower end surface of the joint member 1553 'is heated by the burner 9 to be softened. Here, the joint member 1553 ′ is made of, for example, glass. Then, the lower end portion of the softened joint member 1553 ′ is placed on the top of the flare head 1551 a of the flare 1551 as shown in FIGS. Then, the periphery of the contact portion between the lower end portion of the joint member 1553 ′ and the flare head 1551a is heated and melted by the burner 9, and the lower end portion of the joint member 1553 ′ and the flare head 1551a are integrated, as shown in FIG. , (C ′), a joint portion 1553 integrated with the flare 1551 is formed.

  When the joint member 1553 ′ is placed on the flare head 1551a, the lower end portion of the joint member 1553 ′ is heated and softened by the burner 9, so that the lower end portion of the joint member 1553 ′ becomes the shape of the flare head 1551a. Since the joint member 1553 ′ is more stable when placed, the gap between the lower end surface of the joint member 1553 ′ and the flare head 1551a is less likely to be formed. There is an effect that bubbles are not easily generated inside.

  The joint member 1553 'includes a joint base 1553'b having a cylindrical shape and a convex portion 1553'a provided thereon. The convex portion 1553′a has a rectangular prism shape with a rectangular shape in plan view, and the length of the diagonal line of the rectangle is set to be smaller than the diameter of the cylinder of the joint base 1553′b. . The joint member 1553 'is formed in a predetermined shape in advance.

(5-3. Exhaust hole forming step)
Subsequently, a process of forming exhaust holes in the flare 1551 and the thin tube 1552 ′ will be described.
FIG. 29 is a diagram showing a process subsequent to FIG. 28, wherein (a) and (a ′) are diagrams showing a state before the exhaust hole is formed, and (b) and (b ′) are exhaust hole formation It is a figure which shows a back state. (A) and (b) are cross-sectional views taken along the line corresponding to the line DD ′ in FIG. 23, and (a ′) and (b ′) are (a) and (b), respectively. It is an arrow directional cross-sectional view along the EE 'line | wire in (). In FIG. 29 (b ′), the periphery of the exhaust hole 1552a is not shown in a cross section in order to show the exhaust hole 1552a in an easily understandable manner.

    As shown in FIGS. 29A and 29A, after the joint portion 1553 is formed, the periphery of the upper end portion of the thin tube 1552 ′ sealed by the flare 1551 is heated by the burner 9 from the outside of the flare 1551. . At this time, air is fed into the exhaust pipe 1552 from the lower end side of the exhaust pipe 1552, and the pressure is high. Therefore, when the periphery of the upper end portion of the thin tube 1552 ′ is heated and softened by the burner 9, the air pressure inside the thin tube 1552 ′ is sealed at the upper end portion of the thin tube 1552 ′ as shown in FIGS. 29 (b) and (b ′). The wear is broken to form an exhaust hole 1552a and an exhaust pipe 1552 is formed. Then, the stem 1550 having the flare 1551, the exhaust pipe 1552, and the joint portion 1553 and having the lead wires 71 and 72 and the antenna wire 91 sealed is formed by the process described above.

(5-4. Mount formation process)
Next, a process for forming the mount will be described. The mount integrally represents a state in which the stem 1550, the support member 1540, and the light emitting unit 20 are assembled.
FIG. 30 is a diagram showing a step subsequent to FIG. 29. As shown in FIG. 30 (a), the concave portion 1544 formed at the lower end of the support member 1540 is fitted to the convex portion 1553 a of the joint portion 1553, and the support member 1540 is joined (attached) to the joint portion 1553. At this time, as shown in FIG. 30A, the support member 1540 may be attached to the joint portion 1553 together with the antenna 90 wound around the support member 1540, or the support member 1540 may be attached to the joint portion. The antenna 90 may be wound around and attached to the periphery of the support member 1540 after being joined to 1553, or the antenna 90 previously wound in a coil shape may be attached to the support member 1540. And the lower end part of the antenna 90 and the upper end part of the antenna wire 91 are connected by the connector 92, and it will be in the state shown in FIG.30 (b).

  Note that the concave portion 1544 formed at the lower end portion of the support member 1540 has a shape corresponding to the convex portion 1553a. That is, the shape in plan view is rectangular like the convex portion 1553a, and the lengths and angles of the sides and diagonal lines are the same as the convex portion 1553a. In this way, by forming the concave portion 1544 in a shape that matches the convex portion 1553a, the concave portion 1544 and the convex portion 1553a are fitted when the support member 1540 is attached to the joint portion 1553. Does not easily detach from the joint portion 1553. Further, by making the shape of the convex portion 1553a and the concave portion 1544 in a plan view rectangular, positioning when positioning the support member 1540 (positioning in the rotational direction around the lamp axis J5) is facilitated, and the lead wire 71 , 72 and the power supply terminals 24a, 24b are easily connected.

The method of attaching the support member 1540 to the stem 1550 is not limited to the above-described fitting, and may be attached using adhesion, an engagement structure, screwing, or the like.
Further, the planar shape of the convex portion 1553a and the concave portion 1544 is not limited to a rectangle, and may be a triangle or a polygon that is a pentagon or more. In that case, if the polygon is not a regular polygon, the support member 1540 can be positioned more easily.

Further, the shape in plan view may be an indeterminate shape such as a heart shape instead of a polygon, and a protruding portion or a recessed portion is provided on a part of the circumference of the circle for easy positioning. The provided shape may be sufficient.
Next, by the same method as described above, the mounting substrate 21 of the light emitting unit 20 is placed on the upper surface 1541 of the support member 1540, and the lead wires 71 and 72 are connected to the power supply terminals 24a and 24b, respectively.

Through the steps described above, the mount 13 is formed as shown in FIG.
(5-5. Globe sealing process: drop seal method)
Next, a drop seal method will be described as a representative method for sealing the globe 1510 to the stem 1550.
As shown in FIG. 30 (d), the mount 13 is inserted into the glove member 1510 'through an opening provided at the lower end of the glove member 1510'. At this time, a cylindrical tubular portion 1510′b is provided at the lower end portion of the glove member 1510 ′, and the inner diameter of the tubular portion 1510′b is slightly larger than the outer diameter of the peripheral portion of the flange portion 1551b. It is set large. Accordingly, the mount 13 can be smoothly inserted into the globe member 1510 ′. Further, the mount 13 is inserted into the glove member 1510 ′ so that the peripheral edge portion of the flange portion 1551b is located in the vicinity of the middle in the vertical direction of the cylindrical portion 1510′b. And as shown in FIG.30 (d), the peripheral part periphery of the collar part 1551b is heated with the burner 9 over the perimeter from the outer side of cylindrical part 1510'b, and the collar part 1551b and member 1510 'for gloves are used. And fuse. At this time, as shown in FIG. 31A, the extra portion 1510′c of the cylindrical portion 1510′b is dropped and separated by its own weight, and a glove 1510 fused integrally with the stem 1550 is formed. Is done.

(5-6. Filling fluid sealing step)
Next, a process of enclosing the filling fluid 12 inside the globe 1510 will be described.
As shown in FIG. 31 (b), the air inside the globe 1510 is exhausted from the exhaust pipe 1552 through the exhaust hole 1552a and filled from the exhaust pipe 1552 through the exhaust hole 1552a as shown in FIG. 31 (c). Fill with fluid 12 (in this case helium (He)). Then, as shown in FIG. 32A, the exhaust pipe 1552 is heated and sealed by the burner 9. Thereby, the inside of the globe 1510 is a closed space. That is, the exhaust pipe 1552 communicates with the inside of the globe 1510 through the exhaust hole 1552a, but is closed to the outside by the sealing end 1552b, so that the space inside the globe 1510 is outside. It becomes a closed space. As a result, the filling fluid 12 filled in the globe 1510 does not leak to the outside, and air and moisture do not enter from the outside, so that the heat radiation effect by the filling fluid 12 is sustained for a long time. be able to.

Note that the position where the exhaust pipe 1552 is sealed, that is, the position where the sealed end 1552b is formed is lower than the exhaust hole 1552a, and the circuit board is formed inside the case 1560 when assembled as the illumination light source 1500. The position is not particularly limited as long as the position does not contact 81.
After the filling fluid 12 is sealed inside the globe 1510 by the above process, as shown in FIG. 32 (b), the circuit unit 80, the case 1560, and the base 30 are further assembled and shown in FIG. 32 (c). The illumination light source 1500 is completed.

(5-7. Globe sealing process: butt seal method)
As a typical method for sealing the glove 1510 to the stem 1550, there is a butt seal method in addition to the drop seal method. Therefore, the butt seal method will be described below.
In the state shown in FIG. 30 (c), in the butt seal system, first, as shown in FIG. 33 (a), the opening side end of the globe 1510 is heated and softened by the burner 9 so that the opening becomes narrow. Process. Then, the mount 13 is inserted into the globe 1510 from the opening of the softened and narrowed globe 1510, and the opening side end of the softened and narrowed globe 1510 is brought into contact with the flange portion 1551 b of the stem 1550. Subsequently, as shown in FIG. 33 (b), the flange portion 1551b and the nearby glove 1510 are heated by the burner 9, and the flange portion 1551b and the globe 1510 are melted as shown in FIG. 33 (c). Put on. Thereafter, similarly to FIGS. 32B and 32C, the circuit unit 80, the case 1560, and the base 30 are further assembled to complete the illumination light source.

  In general, when glass containing lead is processed, lead in the glass is precipitated as an oxide and the processed portion becomes black. Therefore, the flare formed with the glass containing lead becomes a blackish color. Therefore, when a transparent material is used for the globe 1510, the flare 1551 can be seen from the outside, which may impair the beauty. In such a case, glass containing no lead may be used for the flare 1551. Further, in order to make the flare 1551 difficult to see from the outside, a diffusion treatment may be performed by forming a milky white diffusion film on the inner surface of the cylindrical portion 1510b of the globe 1510, or a reflection film or the like may be provided.

[6. Summary of Modification 14]
As described above, according to the configuration of the illumination light source 1500 according to the modified example 14, the light emitting unit 20 including the semiconductor light emitting element 22 is supported inside the globe 1510 by the support member 1540, and the globe 1510 includes air. The filling fluid 12 having a higher thermal conductivity is sealed. Thereby, compared with the conventional LED lamp in which air is enclosed in the globe, the proportion of the heat that is conducted to the globe 1510 and is radiated from the globe 1510 out of the heat generated in the semiconductor light emitting element 22 is increased. Can do. As a result, the rate of heat transmitted to the case 1560 side, which is the housing, is reduced, the temperature rise inside the case 1560 itself and the case 1560 is suppressed, and the circuit unit 80 housed inside the case 1560, in particular, the circuit unit 80 is removed. A heat load on the wireless control unit 820 that is one of the electronic components to be configured can be suppressed. Accordingly, it is possible to ensure a long-term stable operation of the wireless control unit 820 and other electronic components, and to realize a long life of the illumination light source 1500.

In addition, the light emitting unit 20 having the semiconductor light emitting element 22 as a light source is supported at the center position in the globe 1510 by the support member 1540, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb. Can do.
Furthermore, since the antenna 90 is attached to the support member 1540 and the illumination light source 1500 is attached to the illumination device, the antenna 90 is positioned inside the relatively exposed globe 1510. Compared with the case where the antenna is housed in the case 1560, transmission / reception of radio signals is less likely to be inhibited, and transmission / reception of radio signals can be performed more reliably.

  In addition, since a light-transmitting member is used for the mounting substrate 21 on which the semiconductor light emitting element 22 is mounted, light emitted backward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 21 and the globe 1510. From there, the light further passes through the globe 1510 and is emitted to the outside. As a result, the amount of light emitted to the rear side of the illumination light source 1500 can be increased to obtain better light distribution characteristics.

In addition, by forming the support member 1540 in the shape of an elongated bar, the ratio of light emitted backward from the semiconductor light emitting element 22 to be blocked by the support member 1540 can be reduced. As a result, the amount of light emitted to the rear side of the illumination light source 1500 can be increased to obtain better light distribution characteristics.
Furthermore, in the present modification, the light emitting unit 20 is disposed in the globe 1510, and the globe 1510 has the same size as the incandescent bulb, so the overall shape of the illumination light source 1500 is similar to the incandescent bulb. ing. As a result, the fitting compatibility ratio of the illumination light source 1500 to the conventional luminaire using the incandescent bulb can be reduced to approximately 100 [%].

(Modification 15)
In the modified example 14, the configuration in which the antenna 90 which is a helical antenna is wound around and attached to the support member 1540 in a spiral manner has been described as an example.
However, the aspect in which the antenna is provided in the support member 1540 is not limited to this. In Modification 15, a configuration in which a rod antenna is provided in the support member 1540 will be described.

34 is a cross-sectional view taken along the line corresponding to the line CC ′ of FIG. 23 of the illumination light source 1500 according to Modification 15.
An illumination light source 1600 according to this modification includes an antenna 1690 which is a rod antenna (pole antenna) having a long rod shape (columnar shape) inside a support member 1640, and a lower end portion of the antenna 1690. Is a metal wire, is led out from the peripheral surface of the cylindrical portion 1647 through the support member 1640, and is connected to the antenna wire 91 via the connector 92 (see FIG. 26). The illumination light source 1500 according to the modification 14 is different. Other than that, the basic configuration is the same as that of the illumination light source 1500 according to the modified example 14, and the filling fluid 12 is sealed inside the globe 1510 also in the illumination light source 1600.

  In the present modification, the antenna 1690 is accommodated inside the support member 1640, and thus the support member 1640 is formed of a non-conductive member. Examples of the non-conductive member include glass and ceramics. In this modification, glass is used. By configuring the support member 1640 using glass, the antenna 1690 is accommodated inside the support member 1640, and the metal wire that is the lower end portion of the antenna 1690 is easily led out from the peripheral surface of the cylindrical portion 1647 to the outside. It can be formed integrally. Further, light emitted from the semiconductor light emitting element 22 of the light emitting unit 20 to the rear side of the mounting substrate 21 passes through the support member 1640 and reaches the rear side of the globe 1510, and then exits from there. Therefore, a better light distribution characteristic can be realized.

  The antenna 1690 is used, for example, in the 2.4 GHz band, but is not limited thereto, and an antenna suitable for a desired band to be used may be used. The length of the antenna 1690 is, for example, 20 to 31.25 [mm] and the diameter is 1 to 30 [mm]. The size and design of the support member 1640, the lead wires 71 and 72, and the antenna The wiring method of the line 91 may be changed as appropriate as long as a desired wireless signal transmission / reception performance is satisfied.

Note that the directivity of the antenna 1690 is preferably non-directional.
The light emitting unit 20 is attached to the upper end portion of the support member 1640, and the light emitting unit 20 and the circuit board 81 are electrically connected by lead wires 71 and 72.
As described above, also in the configuration of the illumination light source 1600 according to the modified example 15, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is transferred to the globe via the filling fluid 12. 1510 to conduct heat from the globe 1510, reduce the rate of heat transmitted to the case 1560 side, suppress the temperature rise inside the case 1560, and suppress the thermal load on the wireless control unit 820 housed inside the case 1560 can do.

In addition, since the antenna 1690 is disposed inside the globe 1510 in a state of being accommodated in the support member, transmission / reception of radio signals is less likely to be hindered than in the case where the antenna is accommodated in the case 1560. In this modification, since the support member 1640 is made of glass, the semiconductor light emitting element 22 of the light emitting unit 20 is moved to the rear side of the mounting substrate 21. Since the emitted light can pass through the support member 1640 and reach the rear side of the globe 1510 and can be emitted to the outside, better light distribution characteristics can be realized.

(Modification 16)
In the modified example 14, the configuration in which the antenna 90 that is a helical antenna is wound around and attached to the periphery of the support member 1540 will be described. In the modified example 15, the antenna 1690 that is a rod antenna is provided. The configuration housed in the support member 1640 has been described.

However, the manner in which the antenna is provided inside the globe 1510 is not limited to these.
FIG. 35 is an external perspective view showing a schematic configuration of an illumination light source 1700 according to Modification 16. FIG.
In an illumination light source 1700 according to this modification, an antenna 290 is formed on the surface of the mounting substrate 21 of the light emitting unit 220. The antenna 290 is a PCB antenna (printed antenna), and is formed in a rectangular wave shape using an aluminum thin film or the like on a mounting substrate.

Also in the illumination light source 1700 according to this modification, the filling fluid 12 is sealed inside the globe 1510.
As described above, also in the configuration of the illumination light source 1700 according to the present modification, the same effects as those of the illumination light source 1500 according to the modification 14 and the illumination light source 1600 according to the modification 15 can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 through the filling fluid 12 to dissipate the heat from the globe 1510 and the heat transmitted to the case 1560 side. By reducing the ratio, the temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

  In addition, the antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 as a PCB antenna and is disposed inside the globe 1510. As a result, when the illumination light source 1700 is attached to the illumination device, the antenna 290 is positioned inside the relatively exposed globe 1510, and thus the antenna is housed inside the case 1560. In comparison, transmission / reception of wireless signals is less likely to be hindered, and transmission / reception of wireless signals can be performed more reliably.

Further, the light emitting unit 220 having the semiconductor light emitting element 22 as a light source is supported at the center position in the globe 1510 by the support member 240, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb. Can do.
In addition, since a light-transmitting member is used for the mounting substrate 21 on which the semiconductor light emitting element 22 is mounted, light emitted backward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 21 and the globe 1510. From there, the light further passes through the globe 1510 and is emitted to the outside. As a result, the amount of light emitted toward the rear side of the illumination light source 1700 can be increased to obtain better light distribution characteristics.

  In the present modification, the support member 1540 has the same configuration as that of the support member 1540 in the illumination light source 1500 according to the modification 14, and here is made of aluminum, but the support member 1540 has a light-transmitting member. May be used. In that case, although the heat dissipation from the support member 1540 is reduced as compared with the case of aluminum, the light emitted backward from the semiconductor light emitting element 22 passes through the support member 340 without being blocked by the support member 240. Since the light reaches the globe 1510 and is emitted to the outside, the amount of light emitted to the rear side of the illumination light source 1700 can be increased to obtain better light distribution characteristics.

  In the present modification, the antenna 290 is formed on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but is not limited thereto. For example, the antenna 290 may be provided on both end sides in the longitudinal direction of the mounting substrate 21 from the first through hole 25. In this case, one pair of antennas 290 may be provided on each of the one end side and the other end side, and the antennas 290 on both end sides may be integrally formed. Further, the antenna 290 is not limited to the surface of the mounting substrate 21, but may be formed on the back surface of the mounting substrate 21, or may be formed on the side surface of the mounting substrate 21. When one antenna 290 is provided on each of the both end sides, an antenna terminal 292 may be provided at each longitudinal end, and the antenna line 91 may be connected to each. In this case, the two antenna lines 91 respectively connected to both antenna terminals 292 may be integrated into one and connected to the circuit unit 80.

(Modification 17)
In the illumination light source 1700 according to the modification 16, the configuration in which the PCB antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 has been described. However, the antenna provided on the mounting substrate 21 is not limited to the PCB antenna. .
FIG. 36 is an external perspective view showing a schematic configuration of an illumination light source 1800 according to Modification 17.

The illumination light source 1800 according to the present modification has an antenna 390 formed on the surface of the mounting substrate 21 of the light emitting unit 320, and the antenna 390 is a chip antenna that is an SMD. Different from the illumination light source 1700.
Also in the illumination light source 1800 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

  As described above, also in the configuration of the illumination light source 1800 according to the present modification, the same effects as those of the illumination light source 1500 according to the modification 14 and the illumination light source according to each of the modifications described above can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 through the filling fluid 12 to dissipate the heat from the globe 1510 and the heat transmitted to the case 1560 side. By reducing the ratio, the temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

  In addition, the antenna 390 is mounted on the mounting substrate 21 of the light emitting unit 320 as a chip antenna, and is disposed inside the globe 1510. As a result, when the illumination light source 1800 is attached to the illumination device, the antenna 390 is positioned inside the relatively exposed globe 1510. Therefore, the antenna is housed inside the case 1560. In comparison, transmission / reception of wireless signals is less likely to be hindered, and transmission / reception of wireless signals can be performed more reliably.

Furthermore, the light emitting part 320 having the semiconductor light emitting element 22 as a light source is supported at the central position in the globe 1510 by the support member 240, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent bulb. Can do.
In addition, since a light-transmitting member is used for the mounting substrate 21 on which the semiconductor light emitting element 22 is mounted, light emitted backward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 21 and the globe 1510. From there, the light further passes through the globe 1510 and is emitted to the outside. As a result, the amount of light emitted toward the rear side of the illumination light source 1800 can be increased to obtain better light distribution characteristics.

  In the present modification, the support member 1540 has the same configuration as that of the support member 1540 in the illumination light source 1500 according to the modification 14, and here is made of aluminum, but the support member 1540 has a light-transmitting member. May be used. In that case, although the heat dissipation from the support member 1540 is lower than that of aluminum, the light emitted backward from the semiconductor light emitting element 22 passes through the support member 240 without being blocked by the support member 240. It reaches the globe 1510 and is emitted from there. As a result, the amount of light emitted toward the rear side of the illumination light source 1800 can be increased to obtain better light distribution characteristics.

  In the present modification, the antenna 390 is mounted on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but is not limited thereto. For example, the antenna 390 may be provided on both ends in the longitudinal direction of the mounting substrate 21 from the first through hole 25. In addition, the antenna 390 is mounted not only on the front surface of the mounting substrate 21 but may be mounted on the back surface of the mounting substrate 21. When one antenna 390 is provided at each of the both end sides, an antenna terminal 392 may be provided at each longitudinal end, and the antenna line 91 may be connected to each. In this case, the two antenna lines 91 respectively connected to both antenna terminals 392 may be integrated into one and connected to the circuit unit 80.

(Modification 18)
In the modification 14 and each modification, the mounting substrate 21 of the light emitting unit has a rectangular shape in plan view, but is not limited thereto.
FIG. 37 is an external perspective view showing a schematic configuration of an illumination light source 1900 according to Modification 18. The illumination light source 1900 includes a globe 1510, a light emitting unit 420, a support member 1540, a stem 1550, a case 1560, a base 30, an antenna 90 that is a helical antenna, lead wires 71 and 72, and the like as main components. Although not shown in FIG. 37, a circuit unit 80 (see FIG. 25) is accommodated in the case 1560, and the antenna 90 and the circuit unit 80 are connected by an antenna wire 91 (see FIG. 25). Yes.

  In the illumination light source 1900, the mounting substrate 421 of the light emitting unit 420 has a disc shape, and a plurality of semiconductor light emitting elements 422 are mounted in an annular shape on the surface of the disc-shaped mounting substrate 421. A sealing body 423 is formed in an annular shape so as to cover all the semiconductor light emitting elements 422. The mounting substrate 421 is configured using a translucent member. As the translucent member, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a translucent resin substrate, or the like is used. Here, the plurality of semiconductor light emitting elements 422 have the same configuration as that of the semiconductor light emitting element 22 described in the first embodiment, but have different configurations, for example, different emission colors and outputs (luminance). It may be a thing.

  The sealing body 423 is made of a translucent material. Since the semiconductor light emitting device 422 emits light of the same color as that of the semiconductor light emitting device 22 of the modified example 14, a wavelength conversion material that converts the wavelength of light from the semiconductor light emitting device 422 into a desired (yellow) color as in the modified example It is mixed in the translucent material. In addition, although the sealing body 423 is carrying out the annular | circular shape when planarly viewed, it may be formed in a dome shape (circular shape when planarly viewed), for example.

The ends of the lead wires 71 and 72 on the light emitting unit 420 side are inserted from the bottom through the through holes provided in the mounting substrate 421, and are fixed on the upper surface of the mounting substrate 421 by a conductive bonding member 73 such as solder. And electrically connected to the wiring pattern.
Also in the illumination light source 1900 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

  Also with the configuration of the illumination light source 1900 according to this modification, the same effects as those of the illumination light source can be obtained in Modification 14 and each of the above modifications. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 through the filling fluid 12 to dissipate the heat from the globe 1510 and the heat transmitted to the case 1560 side. By reducing the ratio, the temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

  In addition, the light emitting unit 420 is supported by the support member 440 at the center position in the globe 1510, whereby a good light distribution characteristic close to that of the incandescent bulb can be obtained and the antenna 90 is supported. Since it is attached to the member 440 and disposed inside the globe 1510, compared to the case where the antenna is housed inside the case 1560, transmission / reception of radio signals is less likely to be hindered, and transmission / reception of radio signals is more reliably performed. Can be done.

  Further, a light-transmitting member is used for the mounting substrate 421, and light emitted backward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 421 and emitted to the rear side of the globe 1510, and the support member 440. Can be reduced in the proportion of light emitted backward from the semiconductor light emitting element 22 by the support member 440, thereby moving the illumination light source 1900 to the rear side. By increasing the amount of emitted light, better light distribution characteristics can be obtained.

  In the present modification, the support member 1540 has the same configuration as that of the support member 1540 in the illumination light source 1500 according to the modification 14, and here is made of aluminum, but the support member 1540 has a light-transmitting member. May be used. In that case, although the heat dissipation from the support member 1540 is lower than that of aluminum, the light emitted backward from the semiconductor light emitting element 22 passes through the support member 240 without being blocked by the support member 240. It reaches the globe 1510 and is emitted from there. As a result, the amount of light emitted toward the rear side of the illumination light source 1800 can be increased to obtain better light distribution characteristics.

In this modification, the mounting substrate 421 has a disk shape (the shape in plan view is circular). However, the shape is not limited to this, and the shape in plan view is a polygon such as a hexagon or an octagon, or a heart shape. An irregular shape such as a shape may be used.
(Modification 19)
The illumination light source 1900 according to the modified example 18 is an example in which the light emitting unit 420 having the disk-shaped mounting substrate 421 is applied to the configuration in place of the light emitting unit 20 of the illumination light source 1500 according to the modified example 14.

However, the light emitting unit 420 of the modification 18 is not limited to the above, and can be applied to the illumination light source 1600 according to the modification 15.
FIG. 38 is a partially cutaway external perspective view showing a schematic configuration of an illumination light source 2000 according to Modification 19. The illumination light source 2000 includes a globe 1510, a light emitting unit 420, a support member 1640, a stem 1550, a case 1560, a base 30, an antenna 1690 that is a rod antenna, lead wires 71 and 72, and the like as main components. In FIG. 38, a part of the case 1560 and a part other than the base 30 are shown as a cross-sectional view. In addition, the circuit unit 80 is accommodated inside the case 1560, and only a part of the circuit unit 80 can be seen from the notch portion of the case 1560 in the same drawing.

In the illumination light source 2000 according to the modification 19, the support member 1640 has the same configuration as can be seen from the same reference numerals as those of the illumination light source support member 1640 according to the modification 15. An antenna 1690 which is a rod antenna (pole antenna) having a long rod-like (cylindrical) shape is accommodated therein.
Also in the illumination light source 2000 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

  As described above, also in the configuration of the illumination light source 2000 according to this modification, the same effects as those of the modification 14 and the illumination light source according to each of the modifications can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 through the filling fluid 12 to dissipate the heat from the globe 1510 and the heat transmitted to the case 1560 side. By reducing the ratio, the temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

  In addition, the light emitting unit 420 is supported by the support member 1640 at the center position in the globe 1510, whereby a good light distribution characteristic close to that of the incandescent bulb can be obtained and the antenna 1690 is supported. Since the antenna is housed inside the globe 1510 while being housed inside the member 1640, compared to the case where the antenna is housed inside the case 1560, transmission / reception of wireless signals is less likely to be hindered, and transmission / reception of wireless signals is prevented. This can be done more reliably.

  Further, a light-transmitting member is used for the mounting substrate 421, and light emitted backward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 421 and emitted to the rear side of the globe 1510, and the support member 440. Can be reduced in the proportion of light emitted backward from the semiconductor light emitting element 22 by the support member 440, thereby moving the illumination light source 1900 to the rear side. By increasing the amount of emitted light, better light distribution characteristics can be obtained.

(Modification 20)
In the modification 14 and each illumination light source according to each modification, the configuration in which the semiconductor light emitting element 22 as the light source is provided with a light emitting unit that is mounted on one plate-shaped mounting substrate has been described. However, the structure of the light emitting unit is not limited to these, and a configuration including a light emitting unit having a more three-dimensional structure may be employed.

  FIG. 39 is an external perspective view showing a schematic configuration of an illumination light source 2100 according to Modification 20. The light source 2100 for illumination includes a globe 1510, a light emitting unit 620, a support member 1540, a stem 1550, a case 1560, a base 30, an antenna 90 that is a helical antenna, lead wires 71 and 72, and the like. Although not shown in the figure, a circuit unit 80 (see FIG. 25) is accommodated in the case 1560, and the antenna 90 and the circuit unit 80 are connected by an antenna wire 91 (see FIG. 25). Yes.

  In the illumination light source 2100, the light emitting unit 620 is configured in a regular dodecahedron-like shape by combining 12 regular pentagonal mounting substrates 621 on which a plurality of SMD type (surface mounting type) semiconductor light emitting elements 622 are mounted. ing. The respective mounting boards 621 are fixed to each other using an adhesive or the like, and thereby a regular dodecahedron-like shape is maintained. A through-hole is provided in the mounting substrate 621 constituting one surface of the regular dodecahedron of the light emitting unit 620, and a convex portion 1543 provided on the upper surface 1541 of the support member 1540 is fitted into the through-hole. The light emitting unit 620 is supported inside the globe 1510 by a support member 440. Note that the bonding between the light emitting unit 620 and the support member 1540 is not limited to the above-described fitting, and an adhesive, an engagement structure, screwing, other stoppers, or the like may be used.

The semiconductor light emitting device 622 is a device in which a light emitting device corresponding to the semiconductor light emitting device 22 and a sealing body covering the light emitting device are packaged as one chip. The light emitting color of the light emitting element, the material configuration of the sealing body, and the wavelength conversion characteristics are the same as those of the semiconductor light emitting element 22 and the sealing body 23, respectively.
In this modification, the SMD type semiconductor light emitting element 622 is used. However, the present invention is not limited to this, and the semiconductor light emitting element 22 of the type directly formed on the mounting substrate is not limited to this. You may use what formed the sealing body 23 on the semiconductor light-emitting device.

One end of each of the lead wires 71 and 72 is connected to a different mounting substrate 621, and the other end is connected to a circuit unit 80 housed in the case 1560.
Although not shown in FIG. 39, each mounting board 621 is electrically connected by a lead wire inside the light emitting unit 620, whereby each mounting board 621 is electrically connected to the circuit unit 80. ing.

The illumination light source 2100 according to the modification 20 is basically the same as the illumination light source 1500 according to the modification 14 shown in FIG. 23 except that the light emitting unit 620 having a regular dodecahedron-like structure is used. In the illumination light source 2100 according to this modification, the filling fluid 12 is sealed inside the globe 1510.
Also with the configuration of the illumination light source 2100 according to this modification, the same effects as those of the modification 14 and the illumination light source according to each of the modifications described above can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, heat from the semiconductor light emitting element 622 is conducted to the globe 1510 through the filling fluid 12 to be dissipated from the globe 1510, and the heat transmitted to the case 1560 side. By reducing the ratio, the temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, since the antenna 90 is attached to the support member 1540 and disposed inside the globe 1510, compared with the case where the antenna is housed inside the case 1560, transmission / reception of radio signals is less likely to be hindered, Wireless signal transmission / reception can be performed more reliably.
The light emitting unit 620 is three-dimensionally configured to have a regular dodecahedron-like shape, and each mounting substrate 621 is attached at a different angle with respect to the lamp axis. Therefore, the main light emission directions of the semiconductor light emitting elements 622 mounted on the respective mounting substrates 621 are different. Furthermore, since the light emitting unit 620 is supported at the center position in the globe 1510 by the support member 440, the light emitted from the semiconductor light emitting element 622 is emitted in almost all directions, and good light distribution characteristics can be obtained. .

  In the present modification, the light emitting unit 620 has a three-dimensional structure as described above, and the light emitted from the semiconductor light emitting element 622 is emitted in almost all directions. The submount substrate of the element 622 is not particularly assumed to be formed of a light transmissive member, but a light transmissive member may be used for both substrates. In that case, a light-transmitting member is preferably used for both substrates.

(Modification 21)
In the modification 20, the configuration in the case where the light emitting unit 620 having a three-dimensional structure is applied to the illumination light source 1500 according to the modification 14 has been described.
However, the light emitting unit 620 of the modification 20 is not limited to the above, and can be applied to the illumination light source 1600 according to the modification 15.

  FIG. 40 is a partially cutaway external perspective view showing a schematic configuration of an illumination light source 2200 according to Modification 21. FIG. The illumination light source 2200 includes a globe 1510, a light emitting unit 620, a support member 1640, a stem 1550, a case 1560, a base 30, an antenna 1690 that is a rod antenna, lead wires 71 and 72, and the like as main components. In the drawing, the light emitting portion 620, a part of the case 1560, and portions other than the base 30 are shown as cross-sectional views. In addition, the circuit unit 80 is accommodated inside the case 1560, and only a part of the circuit unit 80 can be seen from the notch portion of the case 1560 in the same drawing. The antenna 1690 and the circuit unit 80 are connected by an antenna line 91.

The basic configuration of the illumination light source 2200 according to the present modification is the same as that of the illumination light source 1600 according to the modification 15 shown in FIG. 34 except that the light emitting unit 620 having a regular dodecahedron-like structure is used. The same.
Further, as can be seen from the fact that the same reference numerals are used, the light emitting unit 620 of the illumination light source 2200 according to the present modification is the same as the light emission unit 620 of the illumination light source 2100 according to the modification 20 shown in FIG. Also in the illumination light source 2200 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

  Also with the configuration of the illumination light source 2200 according to this modification, the same effects as those of the modification 14 and the illumination light source according to each of the modifications described above can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, heat from the semiconductor light emitting element 622 is conducted to the globe 1510 through the filling fluid 12 to be radiated from the globe 1510, and heat transmitted to the case 1560 side. , The temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, since the antenna 1690 is disposed inside the globe 1510 while being accommodated in the support member 540, transmission / reception of radio signals is less likely to be hindered than in the case where the antenna is accommodated inside the case 1560. Thus, transmission / reception of radio signals can be performed more reliably.
In addition, light emitted from the light emitting unit 620 that is supported at the center position in the globe 1510 and has a rectangular parallelepiped shape is emitted in almost all directions, so that good light distribution characteristics can be obtained.

Also in this modification, the mounting substrate 621 and the submount substrate of the semiconductor light emitting element 622 may be formed of a light-transmitting member. In this case, the mounting substrate 621 and the semiconductor light emitting element 622 are not formed. It is preferable that a translucent member is used for both of the submount substrates.
In this modification, the SMD type semiconductor light emitting element 622 is used, but the present invention is not limited to this, and the type of semiconductor light emitting element 22 formed directly on the mounting substrate is not limited to this. You may use what formed the sealing body 23 on the semiconductor light-emitting device.

(Modification 22)
In the said modification 15, 21, 23, the whole rod antenna was accommodated in the inside of a supporting member, However, It is not restricted to this. For example, the following modifications can be considered.
FIG. 41 is an external perspective view showing a schematic configuration of an illumination light source 2300 according to Modification 22. In the illumination light source 2300, one end of each of the two rod antennas 1390 is shown as a recess 2349 provided in the cylindrical portion 947 of the support member 2340 (in FIG. 41, only one located on the front side of the drawing is shown). ) And the remaining portion extends outward from the cylindrical portion 947 of the support member 2340.

Also in the illumination light source 2300 according to this modification, the filling fluid 12 is sealed inside the globe 1510.
Also with the configuration of the illumination light source 2300 according to this modification, the same effects as those of the modification 14 and the illumination light source according to each of the modifications described above can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, heat from the semiconductor light emitting element 622 is conducted to the globe 1510 through the filling fluid 12 to be radiated from the globe 1510, and heat transmitted to the case 1560 side. , The temperature rise inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, since the antenna 1390 is attached to the support member 2340 and disposed inside the globe 1510, transmission and reception of wireless signals are less likely to be hindered compared to the case where the antenna is housed inside the case 1560. Thus, transmission / reception of radio signals can be performed more reliably.
Further, since the light emitting unit 20 is supported at the center position inside the globe 1510 by the support member 2340, good light distribution characteristics can be obtained.

  In addition, although the case where the antenna 1390 in the illumination light source 2300 according to the present modification is applied instead of the antenna 90 in the illumination light source 1500 according to the modification 14 is described as an example, the present invention is not limited thereto. For example, the antenna 1390 may be applied instead of the illumination light source antenna according to each modification, or the antenna 1390 may be provided in addition to the illumination light source antenna according to the modification 14 and each modification. Good.

(Modification 23)
In the modification 14 and the illumination light source according to each modification, the case where the stem 1550 integrated with the globe 1510 is fixed to the case 1560 using the adhesive 1556 has been described. However, the fixation between the stem (and the glove) and the case is not limited to this.

  FIG. 42 is a cross-sectional view showing a schematic configuration of an illumination light source 2400 according to Modification 23. As shown in FIG. In the illumination light source 2400, the joint portion between the lower end portion of the cylindrical portion 2410b of the globe 2410 and the flange lower end portion 2451b1 of the flange portion 2451b of the flare 2451 has a cylindrical shape with a constant diameter. An adhesive tape 2457 is affixed between the joint portion and the inner peripheral surface of the large-diameter upper end portion 1561a of the large-diameter portion 1561 of the case 1560, whereby the integrated glove 2410 and stem 2450 are connected to the case 1560. It is adhered and fixed to.

In order to suppress conduction of heat generated in the semiconductor light emitting element 22 from the globe 2410 and the stem 2450 to the case 1560, the adhesive tape 2457 may have heat insulation.
(Modification 24)
Furthermore, the following modifications can be considered. FIG. 43 is a cross-sectional view illustrating a schematic configuration of an illumination light source 2500 according to Modification Example 24. As illustrated in FIG. In the illumination light source 2500, the globe 2510 and the stem 2550 are not integrated, but are separated. A support groove portion 2567 is formed on the inner peripheral surface of the upper end side of the large diameter portion 2561 of the case 2560. The inner diameter of the groove of the support groove portion is substantially the same as the outer diameter of the flange lower end portion 2551b1 of the flange portion 2551b of the flare 2551, and the flange lower end portion 2551b1 is placed so as to fit into the groove of the support groove portion 2567, and further outside The bottom part of the cylindrical part 2510b of the globe 2510 is placed so as to fit into the groove of the support groove part 2567. Adhesive 2558 is applied to the gap between the flange portion 2551b and the cylindrical portion 2510b, and the adhesive 2559 is applied to the gap between the cylindrical portion 2510b and the large diameter upper end portion 2561a of the case 2560. Thus, the stem 2550, the globe 2510, and the case 2560 are bonded and fixed to each other.

At this time, an adhesive having low gas permeability is used for the adhesives 2558 and 2559, and the adhesive is applied continuously over the entire circumference in the circumferential direction around the lamp shaft, whereby the inside of the globe 2510 is obtained. The heat dissipation effect of the filling fluid 12 can be maintained continuously.
Further, an adhesive with high thermal conductivity may be used for the adhesive 2558, and an adhesive with low thermal conductivity may be used for the adhesive 2559. Thereby, the heat from the semiconductor light emitting element 22 transmitted to the flange portion 2551b of the stem 2550 via the support member 1540 is transmitted from the flange portion 2551b to the cylindrical portion 2510b of the globe 2510 via the adhesive 2558. Although it is easy to transfer from the cylindrical portion 2510b to the large-diameter upper end portion 2561a of the case 2560 through the adhesive 2559, most of the heat from the semiconductor light emitting element 22 transmitted to the flange portion 2551b is on the globe 2510 side. The heat conduction to the case 2560 and the heat conduction to the case 2560 can be more effectively suppressed. And the thermal load to the radio | wireless control part 820 (and circuit unit 80) can be suppressed more effectively.

Note that an adhesive tape 2457 may be used as the adhesive 2559. Also in this case, the heat load on the wireless control unit 820 (and the circuit unit 80) can be more effectively suppressed by using the heat insulating adhesive tape.
(Modification 25)
As in the illumination light source 2600 according to Modification Example 25 shown in FIG. 44, the functional layer 2614 can be formed on the inner peripheral surface of the globe 2610 below the light emitting unit 220. The functional layer 2614 is made of a metal thin film, and specifically, for example, is formed by aluminum vapor deposition. The illumination light source 2600 uses a PCB antenna as the antenna 290. When the illumination light source 2600 includes the functional layer 2614, the directivity of the antenna can be further improved.

(Modification 26)
Even in the case where a chip antenna that is a small SMD is used as the antenna 390 as in the illumination light source 2700 according to the modified example 26 illustrated in FIG. 45, on the inner peripheral surface of the globe 2610, on the lower side than the light emitting unit 320. A functional layer 2614 may be formed. Even in this case, the directivity of the antenna can be further improved.

(Modification 27)
A connection terminal for connecting an external antenna may be provided so that the external antenna can be used. As the connection terminal of the external antenna, for example, a quick connection terminal or the like can be used. Moreover, since the external antenna connection terminal needs to be provided in the site | part exposed outside when the light source for illumination is mounted | worn with a lighting fixture, you may provide in a case or a glove, for example. When provided on the globe, it may be provided below the light emitting portion so as not to block the emitted light.

(Modification 28)
As in the illumination light source 2800 according to the modified example 28 shown in FIG. 46, the upper end of the support member 2840 is on the information side in the globe 10 (on the side opposite to the base 30 in the globe 10). 15 may be fixed to the globe 10. With such a configuration, heat generated in the light emitting unit 20 can be conducted to the upper side of the globe 10. In the illumination light source 2800, the semiconductor light emitting element 22 is mounted on the back surface which is the main surface on the lower side (the base 30 side) of the mounting substrate 21. The mounting substrate 21 is made of a light-transmitting material. Therefore, the light emitted from the semiconductor light emitting element 22 can be emitted not only to the lower side of the illumination light source 2800 but also to the upper side through the mounting substrate 21. Examples of materials that can be used as the mounting substrate 21 include glass, alumina, sapphire, and resin.

  The illumination light source 2800 includes two rod antennas 1390. The antennas 1390 are provided in such a manner that one end side is fitted in the recess 2853 of the base 2850 and the other end side protrudes into the globe 10. Although not shown, a through hole is provided in each central portion of the recess 2853, and the antenna wires 91 respectively connected to one end of the antenna 1390 are passed through the through hole, and each other end is a circuit. It is connected to the unit 80.

(Modification 29)
As in the illumination light source 2900 according to the modified example 29 shown in FIG. 47, the first light emitting unit 2920a and the second light emitting unit 2920b include a light emitting unit 2920 that is configured in two stages at intervals in parallel to each other. Also good. The first light emitting part 2920a is supported in the air inside the globe 10 by the first stem part 2944a of the support member 2940, and the second light emitting part 2920b is substantially above the first light emitting part 2920a by the second stem part 2944b. They are held in parallel at predetermined intervals.

The first light emitting unit 2920a is electrically connected to a circuit unit (not shown) by a lead wire 2971, and the second light emitting unit 2920b is electrically connected to the first light emitting unit 2920a by a lead wire 2972. Yes.
One end of each of the two rod antennas 1390 is fixed to the first stem portion 2943b, and the other end of the antenna 1390 is substantially parallel to the first light emitting portion 2920a and the second light emitting portion 2920b in a direction away from each other. Is growing.

  As the first light emitting unit 2920a and the second light emitting unit 2920b, a mounting substrate having a flat rectangular shape was used. However, the present invention is not limited to this, and a plurality of mounting substrates such as pentagons and octagons and flat mounting substrates having different shapes may be used. The mounting substrate may be light-transmitting or non-light-transmitting, but it is preferable to use a light-transmitting mounting substrate because the brightness in the irradiation direction (opposite the base) can be improved. In this case, it is preferable that the base (not shown) used for the translucent LED module is made of a material having a high translucency (for example, 90% or more). Further, the light emission color of the light emitting unit to be used may be different.

(Modification 30)
As in the illumination light source 3000 according to the modified example 30 shown in FIG. 48, the light emitting unit 3020 may be supported in the air in the globe by the two lead wires 71 and 72 having rigidity instead of the support member. In the illumination light source 3000, the stem 3040 protrudes into the globe, and the helical antenna 90 is attached to the peripheral surface of the stem 3040.

  A heat radiator 3070 is fixed to the back surface of the mounting substrate 3021 of the light emitting unit 3020 with a thermally conductive adhesive or the like. The heat radiator 3070 includes a flat plate-like first heat radiator portion 3071 fixed to the back surface of the mounting substrate 3021 and a columnar second heat radiator erected in a direction extending downward from the central portion of the first heat radiator portion 3071. A body part 3072. The shape of the second radiator 3072 is, for example, a cylinder having a diameter of 5 [mm] and a height of 40 [mm].

The globe 3010 is filled with the filling fluid 12.
(Modification 31)
A piezo fan 3171 may be provided inside the globe 1510 as in the illumination light source 3100 according to the modification 31 shown in FIG. Feed lines 3172 and 3173 are provided on the inner wall of the globe 1510, and power is supplied to the piezo fan 3171 via the feed lines 3172 and 3173. Like the illumination light source 3100, it is considered that a further decrease in the temperature of the light emitting unit 20 can be expected by providing a piezo fan 3171 in the globe 1510 to promote convection of the filling fluid 12 such as helium gas in the globe 1510. .

The power supply lines 3172 and 3173 may be formed of metal, but in consideration of the light distribution characteristics of the lamp, it is preferable that the power supply lines 3172 and 3173 are formed of a transparent conductive material such as ITO.
In this modification, the piezo fan 3171 is provided near the top of the inner wall of the globe 1510. In this way, convection of the filling fluid 12 can be efficiently caused by the piezo fan 3171.

In the present modification, the lower end of the support member 3140 is fixed to the top of the stem 3150 with an adhesive 3153.
(Modification 32)
FIG. 50 is a diagram showing a main part of the manufacturing process of the method for manufacturing the illumination light source 3200 according to this modification.

  As shown in FIG. 50C, the illumination light source 3200 includes a globe 3210 in which the filling fluid 12 is enclosed, a case 1560 attached to the lower end of the globe 3210, and a base 30 provided in the case 1560. , Rod-shaped members 3271c and 3271d and antennas 3290a and 3290b extending through the stem 3250 and extending into the globe 3210, and a light-emitting portion 3220 provided at the inner ends of the rod-shaped members and the antenna 3210. The rod-shaped members 3271c and 3271d and the antennas 3290a and 3290b are made of a rigid metal material, for example, a jumet material. The light emitting unit 3220 is supported in the air inside the globe 3210 by rod-like members 3271c and 3271d and antennas 3290a and 3290b. The antennas 3290a and 3290b have the same basic configuration as the rod-shaped members 3271c and 3271d, such as materials and shapes, but also function as antennas. The case 1560 inner ends of the rod-shaped members 3271c and 3271d and the antennas 3290a and 3290b are in contact with the heat transfer plate 3274.

The illumination light source 3200 stores a circuit unit 80 for receiving power through the base 30 and causing the light emitting unit 3220 to emit light in the case 1560, and has an overall shape similar to that of a conventional incandescent bulb.
Next, main steps of the method for manufacturing the illumination light source 3200 will be described. The stem 3250 is formed by the same method as the stem 1550 of the illumination light source 1500 according to the modified example 14.

  As shown in FIG. 50 (a), an exhaust pipe 3252 that penetrates the stem 3250 and extends downward, two lead wires 71 and 72, and four rod-like members 3271a, 3271b, 3271c, and 3271d are flat plates. Through the corresponding through holes 3274a, 3274b, 3274c of the heat transfer plate 3274 made of the upper metal, the heat transfer plate 3274 is brought close to the globe 3210, and the inner peripheral surface of the lower end portion of the stem 3250 and the outer periphery of the heat transfer plate 3274 Is fixed with an adhesive.

  Then, the circuit unit 80 is stored in the case 1560, and the lead wires 71 and 72 and the antenna wire 91 connected to the lower ends of the rod-like members 3271a and 3271b are connected to the circuit board 81, and then the case 1560 is integrated. The glove 3210 and the stem 3250 are fixed to the lower end portions with an adhesive. The rod-shaped members 3271a and 3271b become antennas 3290a and 3290b, respectively, when the antenna wire 91 is connected to the circuit board 81. When the case 1560 and the heat transfer plate 3274 are connected to the antennas 3290a and 3290b and the rod-shaped members 3271c and 3271d, the case 1560 heats the light emitting unit 3220 (which is not yet lit in the state shown in FIG. 50B). It becomes a state that can be transmitted to.

Next, the base 30 is screwed onto the case 1560, and the lead wires 74 and 75 connected to the circuit unit 80 are connected to the base 30. Thus, the illumination light source 3200 is completed.
According to the configuration of the illumination light source 3200 according to this modification, the heat from the light emitting unit 3220 is transmitted to the heat transfer plate 3274 via the rod-shaped members 3271a and 3271b and the antennas 3290a and 3290b, and further from there, the case 1560 and the base By transferring heat to 30, the heat dissipation effect can be enhanced.

(Modification 33)
FIG. 51 is a partially broken perspective view showing a schematic configuration of an illumination light source 3300 according to this modification. FIG. 52 is a cross-sectional view of the illumination light source 3300. The illumination light source 3300 includes a cylindrical portion 3312 inside the globe 3310, and the support member 140, the light emitting unit 20, and the lead wires 71 and 72 are accommodated inside the cylindrical portion 3312. The cylindrical portion 3312 has a bottomed cylindrical shape, and the opening is closed by the stem 3350. A first region S1, which is a space surrounded by the inner wall of the cylindrical portion 3312 and the upper surface of the stem 3350, is filled with a light-transmitting heat conductive resin 3313. The second region S2, which is a space surrounded by the inner wall of the globe 3310 and the outer wall of the cylindrical portion 3312, is filled with a filling fluid 12 such as helium gas.

The main steps of the method for manufacturing the illumination light source 3300 according to this modification will be described with reference to FIGS.
First, as shown in FIG. 53A, a cylindrical member 3312 ′ having a bottomed cylindrical shape made of a translucent material is inserted inside a glove member 3310 ′ that is a base of the globe 3310. The cylindrical member 3312 ′ is welded with an exhaust pipe 3314a communicating with an exhaust port 3314 formed in the side wall.

  Next, in a state where the cylindrical member 3312 ′ is disposed inside the glove member 3310 ′, the inner side of the outer peripheral portion of the opening side end portion 3311 of the cylindrical member 3312 ′ and the opening side end portion of the glove member 3310 ′. The cylindrical member 3312 ′ and the glove member 3310 ′ are welded by heating the portions where the peripheral portions are in contact with each other, and as shown in FIG. 53 (b), the cylindrical portion 3312 is formed inside the glove 3310. Is formed. Here, the inside of the cylindrical portion 3312 corresponds to the first region S1, and the region surrounded by the inner wall of the globe 3310 and the outer wall of the cylindrical portion 3312 corresponds to the second region S2.

  Thereafter, after the air existing in the second region S2 is exhausted to the outside via the exhaust pipe 3314a (see FIG. 53B), the filling fluid 12 (this modified example) is supplied to the second region S2 via the exhaust pipe 3314a. Is filled with, for example, helium gas (see FIG. 53C). At this time, the pressure of the helium gas filled in the second region S2 is substantially the same as the atmospheric pressure or slightly higher than the atmospheric pressure.

Next, the exhaust pipe 3314a is sealed by heating a part of the exhaust pipe 3314a, thereby forming a narrow tube portion 3314b (see FIG. 54A).
Subsequently, as shown in FIG. 54 (b), a structure composed of the light emitting unit 20, the stem 3350, and the support member 140 is inserted into the first region S1, and the stem 3350 is the opening side end of the cylindrical portion 3312. By fitting an adhesive made of a heat conductive resin such as silicone resin between the peripheral surface of the stem 3350 and the inner wall of the opening-side end portion 3311 of the cylindrical portion 3312 in a state of being fitted to the portion 3311, the stem 3350 Is fixed to the lower end of the globe 3310.

Thereafter, a heat conductive resin such as a silicone resin is sealed in the first region S1 from a through hole 3350a formed in a part of the stem 3350 (see FIG. 54C).
Then, the other end of each of the lead wires 71 and 72 opposite to the one end connected to the power supply terminals 24 a and 24 b of the light emitting unit 20 is connected to the power output unit of the circuit unit 80. Thereafter, wiring such as lead wires is performed, the case 60 and the base 30 are attached, and the assembly of the illumination light source 3300 is completed.

  According to the configuration of the illumination light source 3300 according to this modification, the heat generated in the light emitting unit 20 is conducted to the peripheral wall of the cylindrical portion 3312 via the heat conductive resin 3313 and then filled in the second region S2. Conducts to helium gas. Then, the heat conducted to the helium gas is conducted to the globe 3310 and released from the outer surface of the globe 3310 to the outside. As described above, since heat generated in the light emitting unit 20 is easily released to the outside through the helium gas and the globe 3310, the temperature of the light emitting unit is increased even if the power supplied to the light emitting unit is increased to improve the luminance. Can be sufficiently suppressed.

(Modification 34)
In the modified examples 3 to 6, 20, and 21, the polyhedron-shaped light-emitting portion is supported inside the globe by the support member. For example, the polyhedral light emitting section may be directly attached to the base or stem. In this case, the mounting substrate constituting the polyhedron shape also serves as a support member, and the antenna is accommodated inside the polyhedron.

(Modification 35)
Although the light emitting part in the modified examples 3 to 6, 20, and 21 has been described in the case where a plurality of mounting substrates are combined to form a polyhedron or a polygonal column, and the inside of the polyhedron or the polygonal column is hollow, It is not limited to this. For example, a mounting substrate may be attached on the outer peripheral surface of a polyhedral or polygonal columnar core made of a non-conductive member to form a polyhedral or polygonal column-shaped light emitting portion. In such a case, a wiring for electrically connecting each mounting board may be formed inside the core.

(Modification 36)
The circuit unit 80 is not limited to the configuration described in the above embodiments and modifications, and the following modifications can be implemented. For example, the posture in which the circuit board 81 is fixedly accommodated in the case is not limited to the posture in which the main surface of the circuit board 81 is substantially orthogonal to the lamp axis. For example, the circuit board 81 may be accommodated in a posture that is substantially parallel to the lamp axis, or may be accommodated in a posture having a predetermined inclination angle with respect to the lamp axis.

Further, the circuit board 81 is not limited to a disk shape, and the planar view shape may be a rectangular shape, a polygonal shape, or an indeterminate shape such as a heart shape, or may be formed of a flexible member such as a flexible substrate, It may be accommodated inside the case in a bent state.
Further, the method of fixing the circuit board 81 inside the case is not limited to the locking structure by the locking portion, and the circuit board may be fixed inside the case by, for example, screwing or bonding.

(Modification 37)
In each of the above embodiments and modifications, the light emission color of the LED as the semiconductor light emitting element 22 is blue light, and the phosphor particles are described as an example of converting blue light into yellow light. A combination may be used. As an example of other combinations, when emitting white light, the LED emission color is ultraviolet light, and phosphor particles are converted into red light, particles converted into green light, and particles converted into blue light. Can be used.

Furthermore, the light emission color of the LED may be mixed with white light by using three types of LED elements of red light emission, green light emission, and blue light emission. Needless to say, the color of light emitted from the light emitting unit is not limited to white, and various LEDs (including elements and surface mount types) and phosphor particles can be used depending on the application.
(Modification 38)
In each of the above-described embodiments and modifications, the mounting substrate having a rectangular or circular plan view shape has been described as an example, but the plan view shape of the substrate is not particularly limited to the above shape.

Moreover, in each embodiment and each modification, it demonstrated taking the case of the thin board (thickness of a side surface is small compared with the area of an upper surface), but you may utilize a thick board, for example, You may use a block-shaped thing.
Note that the mounting substrate in this specification has a pattern for mounting a semiconductor light emitting element (including element and surface mount type) and electrically connecting to the semiconductor light emitting element regardless of the shape, thickness, and form. Pointing. Therefore, the substrate may have a block shape.

In each embodiment and each modification, the mounting substrate is made of a translucent material. However, when it is not necessary to extract light downward, it may be made of a material other than the translucent material. .
(Modification 39)
In the light emitting unit in each of the above embodiments and each modified example, the mounting substrate is made of a light-transmitting material and radiates light backward, but the light is radiated backward by other methods. Also good.

As another method, the mounting substrate may be made of a material that is not a light-transmitting material, and the semiconductor light emitting elements may be mounted on both the front and back surfaces of the mounting substrate. Moreover, you may make it irradiate light back using a reflective member, a half mirror, etc. FIG.
(Modification 40)
In the modified examples 3 to 6, 20, and 21, the light emitting portion has a polyhedral shape. However, the light emitting portion is not limited to this, and a semiconductor light emitting element (cannonball) is formed on the surface of a mounting substrate or core having a spherical or irregular three-dimensional structure. Or SMD).

(Modification 41)
In each said embodiment and each modification, although the case where LED was used as a semiconductor light emitting element was demonstrated, it is not restricted to this, You may use light emitting elements other than LED. Examples of other light emitting elements include LD (laser diode) and EL (electric luminescence) light emitting elements (including organic and inorganic), and these may be used in combination, including LEDs.

(Modification 42)
In each said embodiment and each modification, although the A type and R type glove were utilized, it is not restricted to this. For example, B and G types may be used, and the shape may be completely different from the bulb shape of an incandescent bulb or the globe shape of a bulb-type fluorescent lamp.
Further, the globe may be transparent so that the inside can be seen, or may be translucent so that the inside cannot be seen. Examples of the semi-transparent method include a method in which a diffusion layer mainly composed of calcium carbonate, silica, a white pigment, or the like is applied to the inner surface, or a treatment (for example, blasting) that makes the inner surface uneven. .

Further, although the globe is made of glass material, it can be made of other materials. As other materials, a translucent resin, ceramic, or the like may be used.
(Modification 43)
In each said embodiment and each modification, although the case was comprised with the resin material, it can also comprise with another material. When a metal material is used as another material, it is necessary to ensure insulation between the base. Insulation between the base and the base can be ensured by, for example, applying an insulating layer to the outer peripheral surface of the small diameter portion of the case or performing an insulation treatment on the small diameter portion. Furthermore, it can be ensured by forming the globe side of the case from a metal material, and forming the base side of the case from a resin material, and combining the two.

Moreover, in each said embodiment and each modification, although it did not demonstrate in particular about the surface of a case, for example, you may provide a radiation fin and may perform the process for improving a radiation rate.
Furthermore, although the case is composed of one member, it can be composed of a plurality of members. For example, a large-diameter member corresponding to the large-diameter portion 1561 and a small-diameter member corresponding to the small-diameter portion 1562 in the illumination light source 1500 according to the modification 14 may be joined by an adhesive. At this time, the large diameter member may be made of metal and the small diameter member may be made of resin.

  In each embodiment and each modification, there is a space inside the case and the circuit unit 80 is stored in the space. For example, the space may be filled with a resin material. In this case, by filling the resin having insulating properties and high thermal conductivity, the heat generated in the circuit unit 80 can be efficiently transferred to the case, and the heat load acting on the circuit unit 80 can be reduced. Can do.

(Modification 44)
In each of the above-described embodiments and modifications, the case where an Edison type base is used as the base 30 has been described, but other types, for example, pin types (specifically, G types such as GY and GX) are available. ) May be used.
The base 30 is attached (joined) to the case by being screwed into the screw portion (small diameter portion) of the case using the female screw of the shell portion 33, but is joined to the case by other methods. Also good. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.

  Further, more than half of the shell portion 33 is screwed into the screw portion of the small diameter portion having a cylindrical shape of the case, but the small diameter portion may be attached to a case shorter than the embodiment. In this case, the electronic component of the circuit unit 80 may be located inside the shell portion 33. In such a case, the shell portion 33 may be filled with an insulating resin. Thereby, the insulation between the electronic component and the base is ensured, and the heat generated in the electronic component can be efficiently transferred to the base by using a resin having high thermal conductivity.

(Modification 45)
In each said embodiment and each modification, although the base, the stem, and the supporting member were comprised by another member, it is not limited to this. For example, the support member may be formed integrally with the base, or may be formed integrally with the stem.
(Modification 46)
When the base and the support member, and the stem and the support member are integrally formed as in the modified example 45, the base (or the lead wires 71 and 72 are routed through the inside of the support member (or (Stem) and the support member may be integrally formed. In this case, the power supply terminals 24a and 24b may be provided at the center of the mounting board.

  Further, when the antenna is housed in the support member, the antenna and the antenna wire are mounted on the base so that the antenna wire connected to the antenna housed in the support member is routed through the support member. (Or the stem) and the support member may be integrally formed. Furthermore, the lead wires 71 and 72, the antenna, and the antenna wire may be integrally formed together with the base (or stem) and the support member.

(Modification 47)
In the above-described modified examples 14 to 32, the exhaust hole and the exhaust pipe for sealing the exhaust gas and the helium gas enclosed in the stem in the manufacturing process are formed in the stem (in the modified example 33). Is formed in the cylindrical portion 3312). However, this invention is not limited to this, For example, you may form in a glove.

(Modification 48)
In order to increase the thermal conductivity from the light emitting part to the globe and promote heat dissipation from the globe, a high thermal conductive layer may be provided on the inner wall of the globe. If it demonstrates concretely, the high heat conductive layer comprised with the material whose heat conductivity is higher than the material which comprises the globe may be formed in the inner wall front surface of the globe. Thereby, the heat transfer between the air or the filling fluid 12 and the globe is performed more efficiently, and as a result, the thermal conductivity from the light emitting unit to the globe can be enhanced. The high thermal conductive layer is made of a translucent resin material, metal material, or the like. Examples of the light-transmitting metal material include indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO 2), antimony-doped tin oxide (ATO), and zinc oxide (ZnO).

(Modification 49)
The illumination light source 2500 (see FIG. 43) according to Modification 24 may have a configuration in which the step portion 1566 and the support groove portion 2567 are not provided on the inner peripheral surface of the large diameter portion 2561. In this case, an adhesive or the like is used at a position along the lamp axis between the top of the globe and the bottom end of the eyelet, that is, at a position where the total length of the illumination light source is a predetermined length. The glove and the case are fixed.

(Modification 50)
In the modified examples 14 to 24 and 30 to 32, the stem is formed of a glass material, but the present invention is not limited to this. For example, the stem may be formed of a resin material.
In order to tightly seal the inside of the globe closed by the stem, it is necessary to join the globe and the stem formed of a resin material. For this, for example, an adhesive can be used. In addition to the method using an adhesive, it is possible to seal the inside of the globe closed by the stem by covering the globe and the stem with a sealing film. The sealing film may be covered from the outside of the globe or from the inside.

Furthermore, when the resin material which comprises a glove | globe and a stem is a thermoplastic material, it is also possible to employ | adopt the shaping | molding method (FIGS. 27-33) similar to the case of a glass material.
(Modification 51)
In each of the above-described embodiments and modifications, the phosphor particles are mixed in the sealing body. For example, a phosphor layer containing the phosphor particles may be formed on the inner surface of the globe. In addition to the sealing body, a wavelength conversion member such as a fluorescent plate containing phosphor particles may be provided in the light emission direction of the semiconductor light emitting device. Here, when the temperature of the phosphor particles becomes high, the wavelength conversion efficiency decreases. Accordingly, by forming the phosphor layer on the inner surface of the globe, it is less susceptible to the influence of heat during light emission of the semiconductor light emitting device than when phosphor particles are mixed in the encapsulant in which the semiconductor light emitting device is sealed. The decrease in wavelength conversion efficiency of the phosphor particles can be suppressed.

(Modification 52)
In each of the above-described embodiments and Modifications 9 to 17, 22 to 28, and 30 to 33, one sealing body covers one row of a plurality of semiconductor light emitting elements mounted linearly on the mounting substrate. However, the present invention is not limited to this. For example, one semiconductor light emitting element may be covered with one sealing body, or all the semiconductor light emitting elements may be covered with one sealing body as in Modifications 1, 2, 18, 19, and 29. May be.

(Modification 53)
In each of the above modifications, the stem has a so-called dome shape, but is not limited thereto. For example, a button stem or a shape with a depressed center may be used.
(Modification 54)
In each of the above embodiments and modifications, when the antenna is not housed in the support member, the support member can be formed of a conductive member such as metal. In this case, the support member itself may function as an antenna. When the support member itself functions as an antenna, since the support member has a larger diameter than the helical antenna or the rod antenna, there is an effect that the frequency range of radio waves that can be transmitted and received becomes wider.

(Modification 55)
In each said embodiment and each modification, although the supporting member had the rod-shaped shape, it is not limited to this. For example, it may be conical or trapezoidal. Further, the support member is not limited to a single member, and a plurality of members may be combined to constitute one support member. Furthermore, the number of support members is not limited to one. For example, a configuration in which a plurality of support members support the light emitting unit may be employed.

(Modification 56)
In the second embodiment and modified examples 2, 4, 6, 7, 8, 15, 19, 21, and 33, the case where the entire rod antenna is housed inside the support member or inside the light emitting portion will be described. However, it is not limited to this. For example, a configuration in which a part of the antenna penetrates the support member and the light emitting portion and is exposed inside the globe can be employed. In this case, it is preferable to expose the antenna in a direction approaching the region of the globe that is most exposed to the outside when the illumination light source is attached to the illumination device. By doing so, since the exposed part of the antenna is located at a more exposed part to the outside, the transmission / reception of the radio signal is less likely to be inhibited, and the transmission / reception of the radio signal is more reliably performed. Can be done. For example, when mounted on the lighting device 2 in the modified example 14, it is preferable to expose the antenna in a direction approaching the top of the globe. That is, it is preferable to extend the rod antenna as it is along the lamp axis to expose the antenna so as to penetrate the support member and the mounting substrate of the light emitting unit.

(Modification 57)
Although the illumination light source according to the present invention has been described based on the embodiments and the modifications thereof, the present invention is not limited to these embodiments and modifications.
For example, the present invention can also be realized as an illumination device including such an illumination light source. Hereinafter, the illumination device according to the present modification will be described using the illumination light source 1 according to the first embodiment as an example.

FIG. 55 is a schematic view of a lighting device according to this modification.
The lighting device 2 is used by being mounted on the ceiling 3, for example.
As shown in FIG. 55, the illumination device 2 includes an illumination light source 1 and an illumination fixture 7 that is turned on / off by attaching the illumination light source 1.
The lighting fixture 7 includes, for example, a fixture main body 4 attached to the ceiling 3 and a lamp cover 5 attached to the fixture main body 4 and covering the illumination light source 1. The lamp cover 5 is an open type here, and has a reflection film 8 on the inner surface for reflecting the light emitted from the illumination light source 1 in a predetermined direction (here, downward).

The instrument body 4 includes a socket 6 to which a base 30 of the illumination light source 1 is attached (screwed), and power is supplied to the illumination light source 1 through the socket 6.
In this modification, since the arrangement position of the semiconductor light emitting element 22 (light emitting unit 20) of the illumination light source 1 attached to the luminaire 7 is close to the arrangement position of the filament of the incandescent light bulb, The light emission center in the incandescent bulb is close.

For this reason, even if the illumination light source 1 is mounted on a lighting fixture in which an incandescent lamp is mounted, the position of the light emission center as a lamp approximates, so that an annular shadow is generated on the irradiated surface. Problems are less likely to occur.
The lighting fixture here is an example. For example, the lighting fixture may not have the opening type lamp cover 5 but may have a closing type lamp cover, and the illumination light source may face sideways. It may be a lighting fixture that is mounted and lit in a proper posture (a posture in which the lamp axis is horizontal) or an inclined posture (a posture in which the lamp axis is inclined with respect to the central axis of the lighting fixture).

Moreover, in this modification, the illuminating device 2 is a direct attachment type in which the luminaire 7 is attached while being in contact with the ceiling or wall, but the luminaire is attached in a state of being embedded in the ceiling or wall. It may be an embedded type or a suspended type that is suspended from a ceiling by an electric cable of a lighting fixture.
Further, here, the lighting fixture is turned on by one lighting light source to be mounted, but a plurality of (for example, three) lighting light sources may be mounted and turned on. .

Moreover, in this modification, although the case where the illumination light source 1 which concerns on 1st Embodiment was mounted | worn with the illuminating device 2 was demonstrated to the example, it is not restricted to this, It concerns on each said embodiment and each modification. Any illumination light source may be attached to the illumination device 2.
(Modification 58)
In the illuminating device 2 according to the modified example 57, the case where the illumination light source 1 according to the first embodiment is mounted on the luminaire 7 has been described as an example. However, the present invention is not limited to this. Any illumination light source according to the example may be an illumination device mounted on the illumination fixture 7.

  The illumination light source and illumination device according to the present invention have been described above with reference to the drawings based on the above embodiments and modifications. In addition, the light source for illumination formed by combining suitably the partial structure of the light source for illumination which concerns on each said embodiment, and the structure which concerns on each said modification may be sufficient. Moreover, the scale of the member in each drawing differs from an actual thing. In the present application, the sign “˜” used to indicate a numerical range includes numerical values at both ends. The materials, numerical values, and the like described in the description of each of the above embodiments and modifications are merely preferable examples and are not limited thereto. Moreover, the dimension and ratio of each member in each drawing are given as an example, and do not necessarily coincide with the dimension and ratio of an actual illumination light source. Furthermore, it is possible to appropriately change the configuration of the illumination light source without departing from the scope of the technical idea of the present invention.

  The directivity of the antenna described in each of the embodiments and the modifications is preferably omnidirectional.

  The present invention can be widely used in general lighting that transmits and receives wireless signals.

1,100,200,300,400,500,600,700,900,1000,1100,1200,1300 Illumination light source 2 Illumination device 4 Instrument body 5 Lamp cover 6 Socket 7 Illumination instrument 10, 1110 Globe 20, 220, 320, 420, 620, 920, 1120, 1220 Light emitting part 21, 421, 621, 921, 1121a, 1121b, 1121c, 1221 Mounting substrate 22, 422, 622, 1122, 1222 Semiconductor light emitting element 23, 423 Sealing body 30 Base 40, 140, 240, 340, 440, 540, 1140b, 1140c, 1340 Support member 50, 150, 250, 450, 550, 1150, 1250 Base 50a Large diameter portion 50b Small diameter portion 60, 1160 Case 61 Large diameter portion 62 Small diameter part 71, 2, 74, 75, 76, 77, 78 Lead wire 80 Circuit unit 81 Circuit board 81a Front surface 81b Back surface 83 Oscillator 84 Power source for wireless control unit 85 Clear current circuit 86 Smoothing capacitor 87 Light emitting element control unit 88 Electronic component 89a, 89b Input Terminal 89c, 89d Output terminal 89e, 292, 392 Antenna terminal 90, 190, 290, 390, 1390 Antenna 91 Antenna wire

Claims (15)

A light source for illumination comprising a hollow globe made of a translucent member, receiving a radio signal from the outside and controlling the lighting of the semiconductor light emitting element,
The semiconductor light emitting element is supported by a support member inside the globe,
A helical antenna for receiving the radio signal is attached to the outer surface of the support member;
At least a part of the helical antenna is spirally wound around the support member. Illuminating light source. The illumination light source according to claim 1, wherein the support member is made of a non-conductive member. A base that receives power from the outside for causing the semiconductor light emitting element to emit light;
The glove has an opening on the base side,
The support member is erected on the base in a direction extending from the base provided to close the opening of the globe to the inside of the globe,
The illumination light source according to claim 1, wherein the semiconductor light emitting element is attached to an end of the support member in the extending direction. The light source for illumination according to any one of claims 1 to 3, wherein the semiconductor light emitting element is mounted on a mounting substrate. The light source for illumination according to claim 4, wherein the mounting substrate is made of a member having translucency. The illumination light source according to claim 5, wherein the support member is made of a translucent member. A plurality of the mounting boards are combined to form a polyhedron,
The illumination light source according to any one of claims 4 to 6, wherein the semiconductor light emitting element is mounted on an outer surface of the polyhedron. The illumination light source according to claim 4, wherein the mounting substrate also serves as the support member. The mounting substrate on which the semiconductor light emitting element is mounted is further attached to a region other than the region where the support member is provided on the upper surface of the base. The light source for illumination according to item 1. The support member has a layer structure of two or more layers in the extending direction,
10. The semiconductor light-emitting element is further attached to a layer other than the outermost layer in the extending direction among the layers constituting the layer structure. 10. The light source for illumination as described. The illumination light source according to claim 1, wherein a fluid having translucency and higher thermal conductivity than air is enclosed in the globe. The light source for illumination according to claim 11, wherein the fluid having translucency and thermal conductivity higher than air is a gas. The light source for illumination according to claim 11, wherein the fluid having translucency and higher thermal conductivity than air is helium gas. The base is formed integrally with the globe to seal the light-transmitting fluid having higher heat conductivity than air into the globe. 11. The illumination light source according to 11. An illumination device comprising the illumination light source according to any one of claims 1 to 14.

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