JP5363687B1 - Lamp and lighting device - Google Patents

Abstract

  The lamp is a lamp in which a semiconductor light-emitting element is provided in a casing made up of a globe and a case, and a heat-conductive film is partly composed of a heat conduction region during light emission from the semiconductor light-emitting element. In contact with the other part of the inner surface of the globe.

Description

  The present invention relates to a lamp and a lighting device using a semiconductor light emitting element as a light source.

  In recent years, from the viewpoint of energy saving, a lamp that uses an LED, which is one of semiconductor light emitting elements, as a light source (hereinafter, referred to as an LED lamp) has been proposed as a light bulb shaped lamp that can replace an incandescent light bulb.

  In this LED lamp, a large number of LEDs are mounted on a mounting board, the mounting board is mounted on the other end of the case having a base at one end, and a circuit unit for emitting (lighting) the LED is housed inside the case. There is one having a structure formed (Patent Document 1).

  The LED generates heat during light emission, and if the temperature of the LED rises excessively, the life of the LED is shortened or the light emission efficiency is lowered. For this reason, in the conventional LED lamp, in order to suppress an excessive temperature rise of the LED during light emission, the case is made larger and made of a material having good heat dissipation characteristics, and the case has a heat sink function. ing.

JP 2006-313717 A

  The LED lamp having the above-described configuration actively releases the heat of the LED during lighting (light emission) from the case, and is not dissipated using a glove.

  An object of this invention is to provide the lamp | ramp and the illuminating device which can be thermally radiated actively from the said glove | globe using a glove | globe.

  A lamp according to one embodiment of the present invention is a lamp in which a semiconductor light-emitting element is provided in a casing made of a globe and a case, and a heat-conductive film is a part of which emits light from the semiconductor light-emitting element. It is characterized in that it is in contact with the heat conduction region inside and the other part is in contact with the inner surface of the globe.

  An illuminating device according to one embodiment of the present invention is a lighting device including a lamp and a lighting fixture that is lit by mounting the lamp, and the lamp is a lamp including the above-described configuration. Yes.

  According to the said structure, the heat | fever during light emission of a semiconductor light-emitting element can be actively conducted to a globe with a film, and a globe can be utilized effectively as a heat radiating member.

It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. It is sectional drawing of an LED lamp. (A) is a top view which shows the structure of a LED module, (b) is an AA 'arrow sectional drawing in (a), (c) is a BB' arrow in (a). It is sectional drawing. It is the perspective view which shows the mode of the heat exchanger plate in a case, (a) is the figure which looked at the heat exchanger plate from the upper side, (b) is the figure which looked at the heat exchanger plate from the lower side. It is a figure explaining manufacture of a stem. It is a figure explaining the assembly process of a lamp. It is a figure explaining the assembly process of a lamp. It is a perspective view of the LED lamp which concerns on 2nd Embodiment. It is front sectional drawing of an LED lamp. It is a disassembled perspective view of an LED lamp. It is the schematic of the illuminating device which concerns on 3rd Embodiment. FIG. 6 is a cross-sectional view of a main part of a lamp according to a first modification. It is principal part sectional drawing of the lamp | ramp which concerns on the modification 2. FIG. FIG. 11 is a cross-sectional view of a main part of a lamp according to Modification 3. FIG. 11 is a cross-sectional view of a main part of a lamp according to modification example 4; It is sectional drawing of the lamp | ramp which concerns on the modification 5. FIG. It is a disassembled perspective view of the glove which concerns on the modification 6. FIG.

  The materials and numerical values used in the embodiments of the invention are merely preferred examples, and the present invention is not limited to these forms. In addition, changes can be made as appropriate without departing from the scope of the technical idea of the present invention. Further, combinations with other embodiments are possible as long as no contradiction occurs. Furthermore, the scale of the members in each drawing is different from the actual one.

  One aspect of the present invention is a lamp in which a semiconductor light emitting element is provided in a housing composed of a globe and a case, and a film having a good thermal conductivity is partially heated by light emitted from the semiconductor light emitting element. The other conductive region is in contact with the inner surface of the globe.

  Further, according to one aspect of the invention, the opening of the globe may be closed by a base, and the semiconductor light emitting element and the film may be accommodated in the closed space. One or more conductive members that are thermally coupled to the semiconductor light emitting element to conduct heat during light emission of the semiconductor light emitting element to the base are accommodated in the formed space. It may be formed on the conductive member.

  According to another aspect of the invention, the one or more conductive members include a mounting substrate on which the semiconductor light emitting element is mounted, and a support that supports the mounting substrate by extending from the base to a central portion in the globe. Or the conductive region may be formed on the mounting substrate. Further, the film is in a band shape, and the space in the housing is provided in a saddle state. The film may be made of a transparent film material containing a copper net.

  The good thermal conductivity here means that the thermal conductivity is superior to the gas in contact with the film when the film is accommodated.

<< First Embodiment >>
1. Overall Configuration FIG. 1 is a perspective view showing the structure of an LED lamp 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the LED lamp 1.

  As shown in FIG. 1, the LED lamp 1 includes a bulb 3 in which a fluid having higher thermal conductivity than air is enclosed, a case 5 attached to one end of the bulb 3, and a base provided in the case 5. 7, a rod-shaped member 9 that extends through the bulb 3 to the inside, and an LED module 11 provided at the end of the rod-shaped member 9 inside the bulb 3, and is emitted from the LED module 11 during lighting. A heat conductive film (which is an example of a highly heat conductive film of the present invention) 13 that conducts heat to the valve 3 side is provided in the valve 3.

  The LED lamp 1 stores a circuit unit 15 for receiving power through the base 7 and causing the LED module 11 to emit light in the case 5, and has an overall shape similar to a conventional incandescent bulb.

Hereinafter, each part which comprises the LED lamp 1 is demonstrated. In the present specification, the direction in which the lamp axis X (see FIG. 2) of the LED lamp 1 extends is the lower side, and the side with the globe is the upper side.
2. Configuration of Each Part (1) LED Module FIG. 3 is a diagram showing the structure of the LED module 11. (A) is a top view of the LED module 11, (b) is AA 'arrow sectional drawing in (a) of the figure, (c) is BB in (a) of the figure. FIG.

  As shown in FIGS. 1 to 3, particularly FIG. 3, the LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.

  As shown in FIG. 3A, the mounting substrate 21 has a rectangular shape in plan view and is made of a translucent material such as glass or alumina so that light emitted downward from the LED 23 can be transmitted. It is configured.

  The mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 15. , 27c.

  The conductive path 27 is also made of a transparent electrode such as ITO so that light from the LED 23 can be transmitted.

  As shown in FIG. 3B, the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.

  The LED 23 is mounted on the mounting substrate 21 in a so-called chip form. As shown in FIG. 3B, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 1.

  The sealing body 25 is made of a translucent material such as a silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.

  The sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23. A wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.

In the present embodiment, the LED 23 emits blue light as an emission color, and the wavelength conversion material converts the blue light into yellow light. Thereby, the LED module 11 will emit the white light mixed by the blue light emitted from LED23, and the yellow light wavelength-converted by the wavelength conversion material.
(2) Valve As shown in FIG. 2, the valve 3 includes a globe 35 having an opening, and a stem (in the present invention) that airtightly closes the opening of the globe 35 in a state in which the LED module 11 is stored in the approximate center of the globe 35. 37), and helium (He) gas having a higher thermal conductivity than air is enclosed therein. Thereby, the heat | fever of the LED module 11 in lighting can be efficiently transmitted to the globe 35. The glove 35 and the case 5 constitute the housing of the present invention.

  The globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 2, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and a lower end opening of the cylindrical portion 35 b is sealed with a stem 37. ing.

  The stem 37 is a so-called flare type, and is made of a glass material that is a translucent material. The stem 37 is provided with an exhaust pipe 39 used for exhausting the bulb 3 and the like, as well as lead wires 67 and 69 for supplying power to the LED module 11 and a support for supporting the LED module 11. Each of the functioning rod-like members 9 is sealed.

The joining of the stem 37 and the globe 35 is performed by heating the part to be joined and melting the glass material at the part. In the bulb 3, the LED module 11, the lead wires 67 and 69, a part of the rod-shaped member 9, and the heat conductive film 13 are accommodated.
(3) Bar-shaped member The bar-shaped member 9 penetrates the valve 3 when the middle portion thereof is sealed to the stem 37 in a state of extending in the vertical direction and the stem 37 is attached to the globe 35. The rod-shaped member 9 is made of a metal material, for example, a jumet material.

  There are a plurality of rod-like members 9 (here, four), and the LED module 11 is supported at the end located in the bulb 3. The rod-shaped member 9 is an example of the support member of the present invention.

  The LED module 11 is supported by joining the end portions of the four rod-shaped members 9 to portions close to the four corners of the LED module 11 having a rectangular shape in plan view. As shown in FIG. 3C, the rod-shaped member 9 is joined by the adhesive 43 in a state where the end of the rod-shaped member 9 is inserted into the concave portion 41 of the mounting substrate 21 of the LED module 11.

The lower end of the rod-shaped member 9 is thermally connected to the heat transfer plate 17 that contacts the case 5. As a result, the heat of the LED module 11 being lit is taken out of the bulb 3 through the rod-like member 9, and the taken-out heat is positively transferred from the heat transfer plate 17 to the case 5, the base 7 and the socket of the lighting device. Dissipate heat (heat transfer).
(4) Case The case 5 has a cylindrical shape made of a resin material, for example, polybutylene terephthalate (PBT). The half on the globe 35 side in the central axis direction is the large diameter portion 5a, and the half on the base 7 side is the small diameter portion 5b. It has become each.

  The large-diameter portion 5 a is mounted so as to be fitted to the lower end portion of the valve 3, and the small-diameter portion 5 b is provided by a base 7. A male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.

  On the outer periphery of the small diameter portion 5 b of the case 5, a fixing groove 5 c for fixing the lead wire 65 connected to the base 7 is formed in parallel with the central axis of the case 5. Inside the case 5, fixing means (locking means) 59 for fixing the circuit board 55 of the circuit unit 15 is provided. The fixing method will be described when the circuit unit 15 is described.

The case 5 has a function of releasing heat generated during lighting of the circuit unit 15 housed in the case 5 to the outside. Heat dissipation is performed by heat conduction from the case 5 to the outside air, convection by the outside air, radiation, or the like.
(5) Heat Transfer Plate FIG. 4 is a perspective view showing the state of the heat transfer plate in the case, (a) is a view of the heat transfer plate from above, and (b) is the heat transfer plate below. It is the figure seen from the side.

  In FIG. 4, the case, the valve, and the like are not shown.

  The LED lamp 1 according to the present embodiment employs a structure that actively releases the heat of the LED module 11 that is lit from the case 5. Specifically, the outer end of the bulb 3 in the rod-shaped member 9 and the case 5 are thermally connected via the heat transfer plate 17.

  The heat transfer plate 17 is made of a material having excellent thermal conductivity, here, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 5 a of the case 5. As shown in the drawing, the heat transfer plate 17 has two lead wires 67 and 69 for connecting the LED module 11 and the circuit unit 15 on a virtual circumference centering on the through hole 46 for the exhaust pipe 39. Each of the through holes 45 and the four through holes 47 for the rod-shaped member 9 are provided at an equal pitch.

  The lead wires 67 and 69 pass through the through-hole 45 as they are, and the rod-like member 9 is fixed to the lower surface of the heat transfer plate 17 with an adhesive 49 with its lower end portion slightly protruding from the through-hole 47. The adhesive 49 has a thermal conductivity equal to or higher than that of the case 5.

  The heat transfer plate 17 has a small diameter portion 15 a on the upper side and a large diameter portion 15 b on the lower side. The outer peripheral surface of the small diameter portion 15 a is the inner peripheral surface of the stem 37, and the outer peripheral surface of the large diameter portion 15 b is the case 5. Each is fixed to the inner peripheral surface via an adhesive 51 (which may be either inorganic or organic).

  The adhesive 51 has a thermal conductivity equal to or higher than that of the case 5. As a result, a heat conduction path that positively transfers heat from the LED module 11 to the case 5 via the rod-shaped member 9 and the heat transfer plate 17 is established.

In addition, when using the same resin material as the material of the case 5, the thermal conductivity of the adhesives 49 and 51 naturally has a thermal conductivity equivalent to that of the case 5, and is lower than the thermal conductivity of the case 5 ( For example, when a resin material is used, the thermal conductivity can be made equal to or higher than that of the case 5 by mixing, for example, a metal filler.
(6) Circuit Unit The circuit unit 15 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55, and receives the power through the base 7 by the various electronic components 57 and 58. A rectifier circuit that rectifies power (alternating current) and a smoothing circuit that smoothes the rectified DC power are configured. The circuit unit 15 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69, respectively.

  The rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 58 on the lower surface side of the circuit board 55, and the main body of the capacitor 58 is located inside the base 7.

  The circuit board 55 is fixed by the locking means 59 inside the case 5. Specifically, the peripheral portion of the lower surface of the circuit board 55 contacts the stepped portion 59a inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 59b. A plurality of (for example, four) locking portions 59b are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 59a. .

When mounting the circuit board 55, the circuit unit 15 is inserted from the large diameter part 5a side of the case 5, and when the lower surface (surface on the base 7 side) of the circuit board 55 reaches the locking part 59b, the circuit board 55 is inserted. Is further pushed to pass through the locking portion 59b. As a result, the circuit board 55 is locked by the locking portion 59 b and the circuit unit 15 is mounted on the case 5.
(7) Base The base 7 has a function of electrically connecting the LED lamp 1 to a commercial power source in addition to the function of attaching the LED lamp 1 to a lighting fixture. The base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.

  One lead wire 65 connected to the circuit unit 15 is folded back to the outer peripheral surface side at the lower end of the small diameter portion 5b of the case 5 and fitted into the fixing groove 5c of the case 5 to the shell portion 71. By being covered, the shell portion 71 is connected. The other lead wire 63 is connected to the eyelet part 75 by soldering.

The base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
(8) Thermal Conductive Film The thermal conductive film 13 is provided in a casing made up of the globe 35 and the case 5, specifically, in a state of concealing the space in the valve 3. The heat conductive film 13 is in contact with a member 35 (excluding a gas such as helium gas in the bulb 3) through which heat generated during the lighting of the LED 23 is conducted, and the globe 35. The member through which the heat is conducted includes the LED module 11 (more precisely, the mounting substrate 21), the rod-like member 9, the lead wires 67, 69, and the like. In the first embodiment, the LED module 11 It is.

  Here, the heat conductive film 13 has an annular shape as a whole when viewed from a direction perpendicular to the lamp axis and perpendicular to the long side of the rectangular LED module 11 (FIG. 2). ing. In addition, what is necessary is just to make the cyclic | annular form here as a whole, and a dome shape (shape where a part of cyclic | annular form was removed) is included in the cyclic | annular concept.

  The heat conductive film 13 has flexibility. For this reason, the heat conductive film 13 is in contact with the inner peripheral surface of the globe 35 by contacting and deforming the inner peripheral surface of the globe 35.

  The heat conductive film 13 has a belt shape, and both ends are fixed to the main surface of the mounting substrate 21 of the LED module 11 on the side where the LED 23 is mounted using an adhesive. More specifically, it is fixed between two rows of sealing bodies 25 on the mounting substrate 21.

  The heat conductive film 13 is formed from a resin material having good heat conductivity. When the heat conductive film 13 is disposed on the light emission line of the LED module 11 (in FIG. 2, the LED module 11 is located above), the heat conductive film 13 is made of a light-transmitting material. Is preferred.

  Conversely, when the heat conductive film 13 is not disposed on the light emission line of the LED module 11 (for example, below the LED module 11 in FIG. 2), the heat conductive film 13 is made of a light-transmitting material. It does not have to be configured. In addition, when the LED module 11 is mounted, it is preferable that the LED module 11 is made of a distant material when there is a possibility of contact with the conduction path.

Specific materials for the heat conductive film 13 include a transparent film with a copper net. In particular, when better conductivity is required, an epoxy resin having a mesogenic skeleton, a resin material containing a ceramic having good thermal conductivity, or the like can be used.
3. Manufacturing Method A manufacturing method of the LED lamp 1 according to the first embodiment will be described mainly based on FIGS.

FIG. 5 is a diagram illustrating the manufacture of the stem, and FIGS. 6 and 7 are diagrams illustrating the assembly process of the lamp.
(1) About Manufacture of Stem On the stem 37, an exhaust pipe 39, a pair of lead wires 67 and 69, and four rod-like members 9 are attached in an airtight manner. Here, a manufacturing method of the mount 93 in which these are integrated will be described.

  First, as shown in FIG. 5A, a flare pipe 81 having a diverging shape, a thin pipe 83 for the exhaust pipe 39, two metal wires 85 for the lead wires 67 and 69, and a metal bar for the rod-like member 9 are used. 87, the upper end of the thin tube 83 is arranged in the upper part of the flare tube 81, and the two metal wires 85 and the four metal rods 87 are inserted from one end of the flare tube 81, so that the flare tube 81 is extended from both ends. The positional relationship among the thin tube 83, the metal wire 85, and the metal rod 87 is on a virtual circumference centered on the thin tube 83, and the two metal wires 85 face each other with the thin tube 83 in between, and one set of two wires The two metal wires 85 in each set face each other with the narrow tube 83 interposed therebetween (see FIG. 4).

  While maintaining this positional relationship, the upper part of the flare tube 81 is heated by the burner 89. By heating, the upper part of the melted flare tube 81 and the upper end portion of the thin tube 83 are deformed and melted, and the melted glass material wraps around between the two metal wires 85 and the four metal rods 87, and the flare tube 81. The upper opening 81a is closed. As a result, as shown in FIG. 5B, the stem 37 in which the flare tube 81 and the thin tube 83 are welded is completed, and the metal wire 85 and the metal rod 87 are sealed to the stem 37.

Next, as shown in FIG. 5B, the portion of the stem 37 located above the narrow tube 83 is heated by a burner 89, and when the heated portion starts to melt, air is blown from the lower end opening of the narrow tube 83. . Eventually, air blows out from the melted portion, and an exhaust port 91 communicating with the narrow tube 83 is formed in the stem 37 as shown in FIG. Thereby, the mount 93 for holding the LED module 11 is completed.
(2) Assembling the lamp Next, the assembling of the LED lamp 1 will be described with reference to FIGS. 6 and 7.

  As shown in FIG. 6A, the mount 93 and the LED module 11 are prepared, and the four metal rods 87 are inserted into the recesses 41 (see FIG. 3C) of the mounting substrate 21. The front end portion 87 and the mounting substrate 21 are fixed by the adhesive 43. Thereby, the LED module 11 is supported by the metal rod 87.

  Next, the two metal wires 85 are passed through the through holes 29 of the mounting substrate 21, and the tip portions of the metal wires 85 and the terminal patterns 27 b and 27 c (see FIG. 3A) are fixed with the solder 31.

  As shown in FIG. 6B, a film (13) for the belt-like heat conductive film 13 is prepared, and each end is thermally conducted between the two rows of the sealing bodies 25 of the mounting substrate 21 of the LED module 11. It adheres with a highly adhesive. As a result, the metal wire 85 is connected to the LED module 11 and the heat conductive film 13 is attached to the mount 93 with the LED module 11 as shown in FIG. The mount 93 with the LED module 11 to which the heat conductive film 13 is attached is referred to as a mount 93 with a high conductivity LED module.

  Next, as shown in FIG. 6C, the LED module 11 of the mount 93 with a high conductivity LED module is inserted from the opening of the globe 35 into the heat conduction film 13 side, and the heat conduction film 13 is inserted into the globe. 35 is brought into contact with the inner surface. Then, the LED module 11 (mount 93 with a highly conductive LED module) is further inserted into the globe 35 so that the peripheral edge of the stem 37 and the opening end of the globe 35 are brought together. At this time, since the heat conductive film 13 has flexibility, it deforms as the LED module 11 is inserted, and the contact area with the globe 35 increases.

  With the peripheral edge of the stem 37 and the opening end of the globe 35 attached together, the attached portion is heated by the burner 89 to weld the stem 37 and the globe 35 together. As a result, the valve 3 is completed, the exhaust pipe 39 is used to seal the exhaust gas and helium gas in the valve 3, and the exhaust pipe 39 is then chipped off.

  Subsequently, as shown in FIG. 7A, the exhaust pipe 39 extending from the lower end of the valve 3, the two metal wires 85, and the four metal rods 87 are connected to the metal plate 95 for the heat transfer plate 17. The metal plate 95 is brought close to the valve 3 through the corresponding through holes 95a, 95b, and 95c, and the inner peripheral surface of the lower end portion of the valve 3 and the outer peripheral edge of the small diameter portion of the metal plate 95 are fixed by the adhesive 51. .

  7B, the circuit unit 15 is stored in the case 5 and the two metal wires 85 are connected to the circuit board 55, and then the case 5 is attached to the lower end portion of the valve 3 with the adhesive 51. It adheres with. Note that the metal rod 87 and the metal plate 95 are connected to the case 5 and the metal plate 95 so that the heat of the LED module 11 (not lit yet) can be transferred to the case 5. 17

Next, the base 7 is screwed onto the small diameter portion 5 b of the case 5, and the metal wire connected to the circuit unit 15 is connected to the base 7. Thus, the LED lamp 1 as shown in FIG. 7C is completed. The metal wire 85 and the like are electrically connected to the circuit unit 15 and the LED module 11 to become lead wires 67 and 69 and the like.
4). Heat Dissipation Characteristics The heat generated in the LED 23 is transmitted to the globe 35 through a plurality of paths.

  The first path is a path that is transmitted from the LED module 11 to the globe 35 via the heat conductive film 13. The second path is a path that travels from the LED module 11 to the globe 35 via the helium gas in the bulb 3. The third path is a path that is transmitted from the LED module 11 to the globe 35 via the rod-shaped member 9 and the stem 37.

  The heat conducted from the above path to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation. In particular, in the first path, since the heat conductive film 13 is fixed to the mounting substrate 21 close to the LED 23, the amount of heat conducted to the heat conductive film 13 increases, and the temperature rise of the LED 23 can be suppressed.

  The heat conducted to the heat conducting film 13 is conducted to the low temperature globe 35 side. At that time, heat is conducted from the heat conducting film 13 to the helium gas contacting the heat conducting film 13, and heat conduction from the LED module 11 to the heat conducting film 13 can be promoted.

  In addition, since the heat from the LED 23 is conducted to the globe 35 through the helium gas having excellent thermal conductivity, the heat transfer action is greatly improved as compared with the structure in which the heat of the LED 23 is conducted through the air in the globe. Can be made.

  Furthermore, since the LED module 11 is disposed at substantially the center of the spherical portion 35 a of the globe 35, it becomes easy to transfer heat evenly to the helium gas in the bulb 3. In addition, since the globe 35 has a size and shape similar to the glass bulb of an incandescent bulb, the envelope area of the globe 35 is increased, and the heat dissipation characteristics from the globe 35 to the atmosphere can be enhanced.

  On the other hand, the rod-shaped member 9, the heat transfer plate 17, and the case 5 are connected by adhesives 49 and 51 having excellent thermal conductivity (heat from the LED module 11 is positively conducted to the case 5). . For this reason, the heat of the LED 23 is transmitted from the LED module 11 to the case 5 and the base 7 via the rod-shaped member 9 and the heat transfer plate 17 (this is the fourth path). The heat of the case 5 is released to the atmosphere by conduction, convection, or radiation, and further transmitted to the base 7. The heat transferred to the base 7 is transferred from the socket to the lighting fixture side.

Thus, high heat dissipation characteristics can be obtained by having a plurality of heat paths for radiating heat. For example, even when the temperature of the bulb 3 rises due to the heat transmitted through the first to third paths described above and the heat beyond that cannot be radiated, the heat remaining in the LED module 11 is used for the fourth path. Then, it can be transmitted through the rod-shaped member 9 to the case 5 and the base 7 which are members other than the valve 3 and are not yet at a high temperature.
<Second Embodiment>
A second embodiment for carrying out the present invention will be described in detail with reference to the drawings.
1. Overall Configuration FIG. 8 is a perspective view of an LED lamp according to the second embodiment, FIG. 9 is a front sectional view of the LED lamp, and FIG. 10 is an exploded perspective view of the LED lamp.

  An LED lamp (an example of the lamp of the present invention) 100 has an LED module 105 provided with an LED 103 (see an enlarged view of FIG. 9) as a light source in a globe 107. A case 109 is attached to the end of the globe 107 on the opening side. The glove 107 and the case 109 constitute the casing of the present invention.

  The case 109 has a cylindrical shape. A base 111 is attached to one end of the case 109 (the lower side in FIG. 8). Further, the opening on the other end side of the case 109 is closed by the base 113.

  The case 109 and the base 113 constitute a container. An LED module 105 and a heat conductive film 119 attached to the LED module 105 and in contact with the globe 107 are accommodated in the container.

A circuit unit 115 is stored inside the case 109. An extension member 117 that extends into the globe 107 is attached to the base 113. The LED module 105 is attached to the extending end of the extending member 117. In addition, the extending | stretching member 117 is accommodated in a container and is an example of the supporting member of this invention.
2. Component Configuration (1) LED Module The LED module 105 includes a mounting substrate 121, an LED 103, and a sealing body 123.

  The mounting substrate 121 is again made of a light-transmitting material and has a rectangular shape in plan view. The mounting substrate 121 has a conductive path including a connection pattern and a terminal pattern. The conductive path is made of ITO, which is a light-transmitting material.

  As shown in the enlarged view of FIG. 9, the LEDs 103 are arranged in four rows in a straight line along the longitudinal direction of the rectangular mounting substrate 121 at intervals (for example, at equal intervals), and sealed. The body 123 covers a plurality of LEDs 103 arranged in a row in units of two rows.

The mounting substrate 121 has a through hole at or around a portion where the lead wires 149 and 151 electrically connected to the circuit unit 115 are connected to the conductive path, and other than the lead wires 149 and 151 passing through the through hole. The end is connected to the terminal pattern of the conductive path by solder 124 or the like.
(2) Globe Globe 107 is a so-called A type having a shape similar to a general incandescent light bulb (light bulb having a filament). As in the first embodiment, the globe 107 has a spherical portion 107a and a cylindrical portion 107b, and is made of a translucent material. The cylindrical portion 107b is reduced in diameter as it is away from the spherical portion 107a. An opening is present at the end of the cylindrical portion 107b opposite to the spherical portion 107a, and this end is referred to as an opening-side end 107c.
(3) Case The case 109 has the same shape as the portion near the cap side of the bulb of the incandescent bulb. Similar to the first embodiment, the case 109 has a large diameter portion 109a and a small diameter portion 109b, and a step 109c is formed between the large diameter portion 109a and the small diameter portion 109b. In the case 109, the end portion of the large diameter portion 109a is closed by the base 113 as described above. The globe 107 is fixed to the large diameter portion 109 a of the case 109 and the base 113.

  A base 111 is attached to the small diameter portion 109 b of the case 109. The base 111 is an Edison type. For this reason, the outer periphery of the small diameter portion 109 b is a male screw, and this male screw portion is screwed into the base 111. As a result, the base 111 and the case 109 are coupled.

  Further, a groove 109d extending in parallel with the direction in which the central axis of the case 109 extends is formed in the small diameter portion 109b of the case 109 (see FIG. 10). The groove 109d fixes a lead wire 133 that connects a later-described base 111 and the circuit unit 115 (regulates the movement of the lead wire 133).

The case 109 has a sealed space inside because the opening on the upper end side is closed by the above-described base 113 and the opening on the lower end side is closed by the base 111. A circuit unit 115 is accommodated in this space. The mounting method of the circuit unit 115 is the same as that of the first embodiment, and the locking means 147 for locking and mounting the circuit unit 115 is provided in the case 109.
(4) Base The base 111 is for receiving power from the socket of the lighting fixture when the LED lamp 100 is attached to the lighting fixture and turned on. The base 111 includes a shell portion 127, an insulating material 129, and an eyelet portion 131 as in the first embodiment.

The shell portion 127 is connected to the circuit unit 115 via the lead wire 133, and the eyelet portion 131 is connected to the circuit unit 115 via the lead wire 135. The lead wire 133 is covered with the shell portion 127 in a state where the lead wire 133 is drawn out from the inside of the small-diameter portion 109 b of the case 109 to the outside through the opening at the lower end and fitted into the groove 109 d of the case 109. As a result, the lead wire 133 is sandwiched between the outer periphery of the case 109 and the inner periphery of the shell portion 127, and the lead wire 133 and the base 111 are electrically connected.
(5) Base The base 113 is inserted into the large diameter portion 109 a of the case 109. Since the base 113 is inserted into the case 109, the base 113 has an outer surface (circumferential surface) corresponding to the inner surface of the large-diameter portion 109 a of the case 109. Here, the inner peripheral surface of the case 109 corresponds to the outer peripheral surface of the base 113, and the shape of the inner peripheral surface of the cross section of the large-diameter portion 109a is circular. The surface shape is a circular disk.

  The base 113 has a small-diameter portion 113a and a large-diameter portion 113b having a larger diameter than the small-diameter portion 113a. The outer peripheral surface of the large-diameter portion 113 b corresponds (contacts) with the inner peripheral surface of the large-diameter portion 109 a of the case 109. When the base 113 is inserted into the case 109, a groove 137 along the inner peripheral surface of the case 109 is formed between the small diameter portion 113 a and the inner peripheral surface of the case 109.

  As shown in FIG. 9, the opening-side end 107 c of the globe 107 is inserted into the groove 137 and is fixed by an adhesive 139. The base 113 is joined to the case 109 and the globe 107 by an adhesive 139 while being inserted into the large-diameter portion 109 a of the case 109.

The base 113 has a function of closing the opening of the large-diameter portion 109 a of the case 109, and a function of transmitting heat generated when the circuit unit 115 housed inside the LED 103 emits light to the case 109. Further, it has a function of transmitting heat generated in the LED 103 during lighting and conducted from the extending member 117 to the globe 107 and the case 109. For this reason, the base 113 is comprised with the material with favorable heat conductivity. Specifically, it is a metal, a resin, or the like.
(6) Circuit Unit The circuit unit 115 includes a circuit board 141 and various electronic components 143 and 145 mounted on the circuit board 141, as in the first embodiment. As in the first embodiment, the circuit board 141 is fixed inside the case 109 using a locking structure. Also in this embodiment, the rectifier circuit is constituted by a diode bridge 145 and the smoothing circuit is constituted by a capacitor 143.
(7) Stretching member The stretching member 117 supports the LED module 105 at the center position of the globe 107. The extending member 117 has a rod shape, an upper end portion is coupled to the LED module 105, and a lower end portion is attached to the base 113. That is, the extending member 117 is provided on the base 113 in a state of extending from the base 113 to the inside of the globe 107.

  For example, an engagement structure is used for the connection between the upper end portion of the extending member 117 and the LED module 105. As shown in FIG. 10, a protrusion 117 a is formed on the upper surface of the extending member 117, and a hole 121 a is formed in the approximate center of the mounting substrate 121 of the LED module 105. The shape of the convex part 117a and the shape of the hole part 121a correspond to each other, and the convex part 117a on the upper surface of the extending member 117 is inserted (fitted) into the hole part 121a of the LED module 105 so that they are coupled. .

  The bonding between the lower end portion of the stretching member 117 and the base 113 uses, for example, an adhesive structure. The lower surface of the extending member 117 is flat. The flat lower surface of the extending member 117 is fixed (coupled) to the flat upper surface of the base 113 with an adhesive (not shown).

  The extending member 117 has a function of supporting the LED module 105 with the base 113 and a function of transmitting heat generated in the LED 103 during light emission to the base 113. This heat transfer function can be implemented by using a material having high thermal conductivity. As such a material, there is a metal material. For example, when the material is made of aluminum, the weight of the extending member 117 can be reduced.

  The LED module 105 can emit light to the rear by configuring the mounting substrate 121 with a translucent material. For this reason, the extending | stretching member 117 has a shape as close to a rod as possible so as not to block light emitted backward from the LED 103 (LED module 105).

  That is, the intermediate region of the extending member 117 is a cylindrical portion 117b having a circular cross section. The upper region of the extending member 117 is a flat portion 117 c that is flat in the short direction (thickness is thin in the short direction) of the rectangular mounting substrate 121. The lower region of the extending member 117 is a conical portion 117d having a truncated cone shape whose diameter increases as the base 113 is approached. Thereby, the light emitted backward from the LED 103 and reaching the lower end of the extending member 117 is easily reflected.

  The extending member 117 is made of a light-transmitting material (for example, a glass material so as not to block light behind the LED 103. The extending member 117 is formed on the back surface of the mounting substrate 121 of the LED module 105. The LED module 105 is supported in contact with a part of the LED module 105. Thus, the LED module 105 can emit light from a wide area on the back surface of the mounting substrate 121.

The extending member 117 is formed with through holes 153 and 155 through which lead wires 149 and 151 for electrically connecting the circuit unit 115 and the LED module 105 are inserted. Through holes 157 and 159 for inserting 149 and 151 are formed.
(8) Thermal Conductive Film The thermal conductive film 119 contacts the member 107 and the globe 107 through which heat generated while the LED 103 is lit is conducted. The member through which the heat is conducted includes the LED module 105 (more precisely, the mounting substrate 121), the extending member 117, the lead wires 149, 151, and the like. Here, the member is the LED module 105. It is.

  Here, the heat conductive film 119 has an annular shape as a whole when viewed in a direction perpendicular to the lamp axis and perpendicular to the long side of the rectangular LED module 105 (FIG. 9). ing. The heat conductive film 119 has flexibility and contacts the inner peripheral surface of the globe 107 by being deformed.

Both ends of the heat conductive film 119 are fixed to the main surface of the mounting substrate 121 of the LED module 105 on the side opposite to the main surface on which the LED 103 is mounted using an adhesive. The heat conductive film 119 has a notch in a portion corresponding to the lead wires 149 and 151. In addition, the heat conductive film 119 is comprised with the material which has high heat conductivity, insulation, and translucency similarly to 1st Embodiment.
3. Heat Dissipation Characteristics A confirmation test was conducted on the effect of using a heat conductive film.

  In the test, the LED lamp 100 shown in FIGS. 8 to 9 and the LED lamp from which the heat conductive film was removed were actually turned on, and the junction temperature (Tj) of the LED 103 was measured.

  The LED module 105 of the lamp used for the test is one in which 48 LEDs 103 are mounted and connected in 12 rows and 4 rows, and the input power is 7 [W]. The junction temperature is measured after 1 hour from lighting.

The heat conductive film 119 has a width of 5 [mm] and a thickness of 0.5 [mm], a contact area with the LED module 105 is 125 [mm ² ], and a contact area with the globe 107 is 380 [mm ^2]. ].

In the LED lamp 100 including the heat conductive film 119, the junction temperature is 120 [° C.], whereas in the LED lamp not including the heat conductive film 119, the junction temperature is 125 [° C.]. That is, it was confirmed that the junction temperature was lowered by about 5 [° C.] by providing the heat conductive film 119.
<Third Embodiment>
In the first and second embodiments, the LED lamps 1 and 101 have been described in particular, but the present invention can also be applied to an illumination device using the LED lamp. 3rd Embodiment demonstrates the case where the LED lamp 1 which concerns on 1st Embodiment is mounted | worn with a lighting fixture (it is a downlight type).

  FIG. 11 is a schematic diagram of a lighting apparatus according to the third embodiment.

  The lighting device 201 is used by being mounted on the ceiling 202, for example.

  As shown in FIG. 11, the lighting device 201 includes an LED lamp 1 (for example, the LED lamp 1 described in the first embodiment) 1 and a lighting fixture 203 that is mounted on and off the LED lamp 1. With.

  The lighting fixture 203 includes, for example, a fixture main body 205 attached to the ceiling 202 and a cover 207 attached to the fixture main body 205 and covering the LED lamp 1. The cover 207 is an opening type here, and has a reflection film 211 on its inner surface that reflects light emitted from the LED lamp 1 in a predetermined direction (here, downward).

  The appliance main body 205 includes a socket 209 to which the base 7 of the LED lamp 1 is attached (screwed), and power is supplied to the LED lamp 1 through the socket 209.

  In the present embodiment, since the arrangement position of the LED 23 (LED module 11) of the LED lamp 1 mounted on the lighting fixture 203 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 1 and the emission center in the incandescent bulb. Are close to each other.

  Note that the lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 207 but may have a closing-type cover, or a posture in which the LED lamp faces sideways ( The lighting fixture may be turned on in a posture in which the central axis of the lamp is horizontal) or in an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).

  In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall. Alternatively, a hanging type that is suspended from the ceiling by an electric cable of a lighting fixture may be used.

Furthermore, although the lighting fixture is lighting one LED lamp 1 to be mounted here, a plurality of, for example, three LED lamps may be mounted.
<Modification>
As mentioned above, although the structure of this invention was demonstrated based on the 1st-3rd embodiment, this invention is not limited to the said embodiment etc. For example, the following modifications can be given.
1. Thermal Conductive Film In the first and second embodiments, one thermal conductive film is disposed on the LED mounting surface side of the LED module, but can transmit heat during light emission of the LED to the globe. If possible, they may be arranged at other positions or a plurality of them.

  Hereinafter, the modification about arrangement | positioning and the number of heat conductive films is demonstrated.

12-15 is principal part sectional drawing of the lamp | ramp which concerns on a modification.
(1) Modification 1
FIG. 12 is a cross-sectional view of a main part of a lamp according to the first modification.

  The lamp 301 accommodates the LED module 307, the support member 309, and the heat conductive film 311 in a container 305 including a globe 303 and a base. The support member 309 extends from the base to the center of the globe 303.

  The LED module 307 is supported by a cylindrical support member 309. The LED module 307 includes LEDs on the main surface (front surface) opposite to the supported side. The lead wires 313 and 315 that electrically connect the circuit unit and the LED module 307 pass through the hollow portion in the support member 309.

  The heat conductive film 311 is arranged between the main surface (back surface) opposite to the main surface on which the LEDs in the LED module 307 are mounted and the globe 303. The heat conductive film 311 is configured in a belt-like annular shape, and is fixed to the back surface of the LED module 307.

There are two heat conductive films 311 here, and the support member 309 is arranged so as to sandwich the rectangular LED module 307 from the short direction. A heat conductive film 311 in FIG. 12 is a heat conductive film 311 disposed in the back of the support member 309. Each heat conductive film 311 is in contact with the inner surface of the globe 303 at two locations (two regions), as shown in FIG.
(2) Modification 2
FIG. 13 is a cross-sectional view of a main part of a lamp according to the second modification.

  The lamp 351 houses the LED module 357, the support member 359, and the heat conductive film 361 in a container 355 including a globe 353 and a base. FIG. 13 is a view seen from a direction orthogonal to the short side of the rectangular LED module 357.

  The LED module 357 is supported by a cylindrical support member 359. The LED module 357 includes LEDs on the main surface (front surface) opposite to the supported side. The support member 359 extends from the base to the center of the globe 353. Note that the lead wires 363 and 365 that electrically connect the circuit unit and the LED module 357 pass through the hollow portion in the support member 359.

  The heat conductive film 361 has a strip shape, and its end is attached to the main surface (back surface) opposite to the main surface on which the LED is mounted in the LED module 357, and the intermediate portion is arranged on the front side of the LED module 357. Has been. That is, in a state before being attached to the LED module 357, the belt-shaped intermediate portion is arranged on the front side of the LED module 357 along the longitudinal direction of the LED module 357, and both ends are attached to the back surface of the LED module 357. ing.

The two heat conductive films 361 here are arranged along the two rows of sealing bodies 367 of the LED modules 357 (so as to be parallel to the sealing bodies 367). In addition, the edge part of the heat conductive film 361 is located in the back side of the LED mounting area in the mounting substrate 369.
(3) Modification 3
FIG. 14 is a cross-sectional view of a main part of a lamp according to the third modification.

  The lamp 401 accommodates the LED module 409, the support member 411, and the heat conductive film 413 in a container 407 including a globe 403 and a base 405. The support member 411 extends from the base 405 to the center of the globe 403.

  The LED module 409 is supported by a cylindrical support member 411. The LED module 409 includes LEDs on the main surface (front surface) opposite to the supported side. Note that the lead wires 415 and 417 that electrically connect the circuit unit and the LED module 409 pass through the hollow portion in the support member 411.

  The heat conductive film 413 is disposed between the LED module 409, the support member 411, and the globe 403. The heat conductive film 413 is configured in a belt-like annular shape, and is fixed to the back surface of the LED module 307 and the support member 411.

There are two heat conductive films 413 here, and the support member 411 is arranged so as to be sandwiched from the longitudinal direction of the rectangular LED module 409. In FIG. 14, heat conductive films 413 are arranged on the left and right sides of the support member 411. As shown in FIG. 14, each heat conductive film 413 is in contact with the inner surface of the globe 403 at one place (one region).
(4) Modification 4
FIG. 15 is a cross-sectional view of a main part of a lamp according to the fourth modification.

  The lamp 451 accommodates the LED module 459, the support member 461, and the heat conductive film 463 in a container 457 including a globe 453 and a base 455. The support member 461 extends from the base 455 to the center of the globe 453.

  The LED module 459 is supported by a cylindrical support member 461. The LED module 459 includes LEDs on the main surface (front surface) opposite to the supported side. Note that the lead wires 465 and 467 that electrically connect the circuit unit and the LED module 459 pass through the hollow portion in the support member 461.

The heat conductive film 463 contacts the inner surface of the globe 453 and also contacts the surface of the base 455 to which the support member 461 is attached. Here, the base 455 protrudes to the inner side of the globe 453 than the bases in the first to third modifications. Here, the heat conductive film 463 is configured in a belt-like annular shape, and is fixed to the base 455 and the globe 453.
(5) Others The arrangement position of the heat conductive film and the like may be arranged at a position where the above-described embodiment and modification examples 1 to 4 are appropriately combined, and the number is also appropriately combined with the embodiment and modification examples 1 to 4. It is good also as a number. Furthermore, the width of the heat conductive film may be determined in consideration of the contact area with the globe and the amount of heat transfer.

Moreover, the heat conductive film may not be cyclic | annular, for example, it may comprise in strip | belt shape, and may be provided so that one end may be contacted with heat conductive members, such as an LED module, and the other end may be contacted with a glove. In this case, a plurality of heat conductive films may be used, or heat conductive films may be stacked.
2. LED module (1) LED
In the said embodiment and modification, although the LED element was utilized as a light source, you may utilize surface mount type or a shell type LED, for example. In this case, the LED element is resin-sealed, and the LED module has a mounting substrate and LEDs.

  In the embodiment and the modification described above, the emission color of the LED is blue light, and the phosphor particles are described as an example of converting blue light into yellow light, but other combinations may be used. As an example of other combinations, when emitting white light, the LED emission color is ultraviolet light, and phosphor particles are converted into red light, particles converted into green light, and particles converted into blue light. Can be used.

Furthermore, the light emission color of the LED may be mixed into white light by using three types of LED elements of red light emission, green light emission, and blue light emission. Needless to say, the light color emitted from the LED module is not limited to white, and various LEDs (including elements and surface mount types) and phosphor particles can be used depending on the application.
(2) Mounting Board In the embodiment and the modification described above, the mounting board having a rectangular shape in plan view has been described as an example, but the shape in plan view of the board is not particularly limited. As other shapes, the shape in plan view includes a disk shape, an elliptical shape, a polygonal shape such as a triangle or a pentagon, and the like.

  Moreover, in the said embodiment and modification, although demonstrated as an example the thin board (thickness of a side surface is small compared with the area of an upper surface), you may utilize a thick board, for example, block shape May be used.

  In addition, the mounting board | substrate in this specification points out what has the pattern which mounts LED (an element and a surface mounting type are included) and is electrically connected with LED irrespective of a shape, thickness, and a form. . Therefore, the board may be in the above-described block shape, and the LED may be directly mounted on the base in the embodiment (in this case, the base may be used as a mounting board, and the base is mounted). In addition, the mounting substrate and the extending member can be integrated into the mounting substrate (in this case, the base is also the supporting member).

In the embodiment, the mounting substrate is made of a translucent material, but may be made of a material other than the translucent material when it is not necessary to extract light backward.
(3) Mounting position In the LED modules in the above-described embodiments and modifications, the mounting substrate is made of a light-transmitting material so that the rear side is irradiated, but the light is irradiated rearward by other methods. May be.

As another method, the mounting substrate may be made of a material that is not a light-transmitting material, and the LEDs may be mounted on both the front and back surfaces of the mounting substrate. Further, the mounting substrate is made of a material that is not a light-transmitting material, and the mounting substrate is formed in a spherical shape, a cubic shape, or the like (for example, six insulating plates are three-dimensionally bonded to form a cube). You may mount LED (a shell and SMD are included) on the surface.
(4) Semiconductor light emitting element In the said embodiment and modification, although LED was used as a semiconductor light emitting element, you may use semiconductor light emitting elements other than LED. Examples of other light-emitting elements include LD and EL light-emitting elements (including organic and inorganic), and these may be used in combination, including LEDs.
3. In the above embodiment, the LED and the heat conductive film are housed in a container in which the globe is closed by a stem or a base. However, the LED and the heat conductive film are contained in a housing made up of a globe and a case. The heat conductive film is not limited to be housed in the container as long as it can contact the globe and conduct the heat of the LED during lighting to the globe.

  Hereinafter, Modification 5 in which the LED and the heat conductive film are housed in a casing made up of a globe and a case will be described.

  FIG. 16 is a cross-sectional view of a lamp according to Modification 5.

  The lamp 500 accommodates a base 509, an LED module 511, a circuit unit 513, a circuit holder 515, and a heat conductive film 517 in a housing 507 including a globe 503 and a case 505. A base 519 is attached to one end of the housing 507, that is, the end of the case 505 opposite to the globe 503.

A base 509 is attached to the other end of the cylindrical case 505, and an LED module 511 is attached to the main surface of the base 509 opposite to the base 519. For example, an adhesive is used to attach the base 509 to the case 505. The heat conductive film 517 is attached to the base 509. Here, it is fixed by a screw 521. Note that the heat conductive film may be sandwiched between the LED module 511 and the base 509.
4). Globe (1) shape In the above-described embodiments and modifications, an A-type glove is used. However, other types, for example, B, G, and R types, may be used. The shape may be completely different from the glove shape.
(2) Structure In the embodiment and the modification described above, the glove has a monolithic structure, but for example, a glove that is divided into a plurality of parts is individually manufactured and joined together. It may be one glove. At this time, it is not necessary to configure all of them with the same material, and for example, a combination of a resin and a glass may be used. In addition, if a glove is made into the combined structure, an LED module larger than the opening of a glove can also be utilized.

  Hereinafter, a globe having a divided structure will be described as a sixth modification.

  FIG. 17 is an exploded perspective view of a glove according to Modification 6.

  The globe 551 according to the modified example 6 has a shape close to the globe 503 of the lamp 500 according to the modified example 5, but has a shape that is longer than the globe 503.

  The globe 551 includes a frame 553 and a plurality of globe pieces 555. Here, the number of globe pieces 555 is four, and is represented by reference numerals “555a”, “555b”, “555c”, and “555d”.

  The frame 553 is made of a translucent material, for example, a translucent resin. As shown in FIG. 17, the frame 553 has four legs 553a, 553b, 553c, and 553d.

  The four legs 553a, 553b, 553c, and 553d are joined at the top 553e. When the frame 553 is viewed from above, the four legs 553a, 553b, 553c, and 553d extend in the radial direction from the center of the virtual circle at equal intervals in the circumferential direction. The central portion of the virtual circle corresponds to the top portion 553e.

  Each foot 553a, 553b, 553c, and 553d extends in a curved shape having a predetermined width along the inner peripheral surface of the globe 551. The widths of the foot portions 553a, 553b, 553c, and 553d are placed on the foot portions 553a, 553b, 553c, and 553d in a state where the adjacent glove pieces 555a, 555b, 555c, and 555d are abutted with each other when the gloves 551 are assembled. It is a dimension that can be placed.

  Each of the globe pieces 555a, 555b, 555c, and 555d has a shape that is divided into four equal parts in the circumferential direction when the globe 551 is viewed from above.

  When assembling the glove pieces 555a, 555b, 555c, and 555d and the frame 553, the butted portions of the glove pieces 555a, 555b, 555c, and 555d are positioned on the foot portions 553a, 553b, 553c, and 553d of the frame 553. The glove pieces 555a, 555b, 555c, and 555d are placed on the foot portions 553a, 553b, 553c, and 553d.

  The glove pieces 555a, 555b, 555c, and 555d are joined to the frame 553 by an adhesive (not shown) disposed on the legs 553a, 553b, 553c, and 553d of the frame 553. In the split structure globe 551, the heat conductive film is in contact with at least one of the globe pieces 555a, 555b, 555c, and 555d and the foot portions 553a, 553b, 553c, and 553d of the frame 553.

Further, the globe may be transparent so that the inside can be seen, or may be translucent so that the inside cannot be seen. Translucency can be carried out, for example, by applying a diffusion layer mainly composed of calcium carbonate, silica, white pigment, or the like on the inner surface, or applying a treatment (for example, blasting) to roughen the inner surface.
(2) Size In the above-described embodiment and modification examples, the ratio of the globe in the entire lamp length is not particularly described. The glove ratio here is the total length of the glove with respect to the total length of the lamp, and the total length of the glove is the length of the portion of the glove that is exposed to the outside air in the lamp axis direction.

The ratio of the globe in the entire lamp length is preferably 0.54 or more. If it is smaller than 0.54, the area of the glove exposed to the outside air becomes small, and sufficient heat dissipation characteristics cannot be obtained. Further, when the globe is reduced, the distance between the LED module and the circuit unit is reduced, and the influence of the heat that the circuit unit receives from the LED module during lighting is increased.
5. Case In the above-described embodiments and modifications, the case is made of a resin material, but can be made of other materials. When using a metal material as another material, it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating layer to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).

In the said embodiment and modification, although it did not demonstrate in particular about the surface of a case, for example, you may provide a radiation fin and may perform the process for improving a radiation rate.
6). In the above-described embodiment and modification, an Edison type base is used, but other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used.

Moreover, in the said embodiment and the modification, the nozzle | cap | die was mounted | worn (joined) to the case by screwing in the screw part of a case using the internal thread of a shell part, However, it joins with a case by another method. May be. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
7). Base In the second embodiment and the fifth modification, the base is joined to the case by an adhesive while being inserted into the case, but may be fixed to the case by other methods. Other methods include a method in which the large-diameter portion of the base is slightly larger than the opening of the case and press-fit into the case, and a method in which the opening side of the case is crimped after the base is inserted into the case.
8). Lamps The lamps according to the first and second embodiments include a circuit unit for turning on the semiconductor light emitting element by converting the electric power received through the base, but the lamp according to the present invention includes a circuit unit. May be a type of lamp that does not include

1 LED lamp 3 Globe 5 Case 7 Base 9 Bar-shaped member (supporting member)
11 LED module 13 Thermal conductive film 37 Stem (base)

Claims (6)

A lamp in which a semiconductor light emitting element is provided in a housing made up of a globe and a case,
The opening of the glove is blocked by a base,
One or more conductive members that are thermally coupled to the semiconductor light emitting element and conduct heat emitted from the semiconductor light emitting element to the base in the closed space, the semiconductor light emitting element, A thermally conductive film, and
A part of the film is in contact with a heat conduction region during light emission from the semiconductor light emitting element, and the other part is in contact with an inner surface of the globe,
The lamp is characterized in that the conductive region is formed in the one or more conductive members . The one or more conductive members include a mounting substrate on which the semiconductor light emitting element is mounted, and a support member that extends from the base to a central portion in the globe and supports the mounting substrate. The lamp according to claim 1 . The lamp according to claim 2 , wherein the conduction region is formed in the mounting substrate. The film is a strip lamp according to any one of claims 1 to 3, it is characterized in that provided between front Kisora in wandering state. The lamp according to any one of claims 1 to 4 , wherein the film is made of a transparent film material containing a copper net. In an illuminating device comprising a lamp and a lighting fixture that is lit by mounting the lamp,
The said lamp | ramp is a lamp | ramp of any one of Claims 1-5 . The illuminating device characterized by the above-mentioned.

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