WO2013084407A1

WO2013084407A1 - Lamp and illuminating apparatus

Info

Publication number: WO2013084407A1
Application number: PCT/JP2012/007106
Authority: WO
Inventors: 次弘松田; 利雄森; 亨岡崎; 美奈子赤井; 直紀田上; 考志大村; 三貴　政弘; 隆在植本
Original assignee: パナソニック株式会社
Priority date: 2011-12-06
Filing date: 2012-11-06
Publication date: 2013-06-13
Also published as: JPWO2013084407A1; TW201335531A

Abstract

An LED lamp (100) is provided with: an LED module (5), which is provided with an LED; a globe (7), which covers the LED module (5); a case (9), which is mounted on the rear side of the globe (7); a ferrule (11), which is attached to an rear-side opening end portion of the case (9); a cover member (13), which covers a rear-side opening of the globe (7); a circuit unit (15), which receives power from the ferrule (11) and makes the LED emit light; and a supporting member (17), which supports the LED module (5) to the inside of the globe (7). The volume of a container (14) formed by covering the opening of the globe (7) with the cover member (13) is 250 [cm³] or less.

Description

Lamp and lighting device

The present invention relates to a lamp and a lighting device using a semiconductor light emitting element such as a light emitting diode (LED) as a light source.

In recent years, from the viewpoint of energy saving, a lamp using high-efficiency long-life LED (hereinafter referred to as an LED lamp) has been proposed as a bulb-shaped lamp replacing a incandescent lamp.

In the LED lamp, for example, a mounting substrate on which a large number of LEDs are mounted is attached to the end of the case, and a glove covering the LEDs is attached to the end of the case (Patent Documents 1 and 2).

The LED generates heat when it emits light. If the heat causes the LED to be excessively heated, the luminous efficiency of the LED may be reduced or the life of the LED may be shortened.

From such a thing, various measures are taken in order to prevent the excessive temperature rise of LED at the time of light emission. In Patent Document 2, a heat dissipation groove is provided on the surface of the case so that the heat transmitted from the mounting substrate to the case at the time of light emission is dissipated efficiently. In Non-Patent Document 1, the case is formed of a metal which is a good thermal conductive material so that the heat of the LED at the time of light emission is transmitted from the case to the base so that the heat is not accumulated in the case.

JP 2006-313717 A JP, 2010-003580, A

In recent years, the demand for high luminance to the LED lamp has become strong, and the above technology can not meet this demand. That is, the calorific value of the LED increases with the increase in luminance, and the case is enlarged in order to release and transfer the heat. The increase in size of the case leads to the increase in size of the LED lamp and can not be applied to existing lighting devices.

An object of the present invention is to provide a lamp and a lighting device of a novel configuration which can cope with high brightness without causing the enlargement of the lamp.

In order to achieve the above object, a lamp according to the present invention is a lamp in which a semiconductor light emitting element as a light source is supported by a support member in a container in which a glove opening is closed by a lid member. A lamp characterized in that a fluid having a higher thermal conductivity than air is enclosed inside, and the volume of the container is 250 cm ³ or less.

The term "volume" as used herein refers to the amount by which fluid at 1 atm can enter the container in which the semiconductor light emitting device and the support member are stored. Specifically, the volume of the semiconductor light emitting element and the support member is subtracted from the volume of the container (based on the inner surface).

In addition, in “the semiconductor light emitting device is supported by the support member”, when the semiconductor light emitting device is directly mounted on and supported by the support member, the semiconductor light emitting device is supported via another member (for example, mounting substrate) Including the case supported by

In order to achieve the above object, a lighting device according to the present invention includes a lamp and a lighting fixture for mounting and lighting the lamp, and the lamp has the above configuration.

According to the above configuration, since the fluid having a thermal conductivity higher than that of air is sealed in the container, the heat generated from the light emitting element can be conducted to the container by the fluid. As a result, the heat radiation characteristics can be improved without increasing the size of the lamp, and high brightness can be coped with. In particular, since the volume in the container is set to 250 [cm ³ ], the temperature rise of the light emitting element can be efficiently suppressed.

The surface area of the support member in contact with the fluid is 18 cm ² or more, or the fluid is helium gas, and the support member is in contact with the fluid. Is made of a metal material.

It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. FIG. 2 is a cross-sectional view of the LED lamp shown in FIG. It is a B-B 'arrow directional cross-sectional view of a LED lamp. It is a figure which shows the structure of a LED module. It is an analysis result which shows the relationship between the volume of a container, and the temperature (it is junction temperature) of LED at the time of lighting. It is a figure explaining the container used for analysis. It is a figure explaining the support member used for analysis. It is a figure which shows the analysis result of the temperature distribution of the lamp | ramp at the time of lighting. It is a perspective view which shows the structure of the LED lamp which concerns on 2nd Embodiment. It is the D-D 'arrow directional cross-sectional view of the LED lamp shown in FIG. It is a perspective view which shows the structure of the LED lamp which concerns on 3rd Embodiment. FIG. 12 is a cross-sectional view of the LED lamp shown in FIG. It is the F-F 'arrow directional cross-sectional view of the LED lamp shown in FIG. It is the schematic of the illuminating device which concerns on 4th Embodiment.

First Embodiment
1. Overall Configuration FIG. 1 is a perspective view showing the structure of the LED lamp 100 according to the first embodiment. FIG. 2 is a cross-sectional view of the LED lamp 100 shown in FIG. 1 taken along the line AA ′, and FIG. 3 is a cross-sectional view of the LED lamp 100 taken along the line BB ′. In FIG. 3, a partial cross-sectional view of the LED lamp 100 is shown.

In FIGS. 2 and 3, the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J of the LED lamp 100, and the upper side of the drawing is expressed as “forward” or “upper” in front of the LED lamp 100. In some cases, the lower side of the drawing is the rear of the LED lamp 100 (sometimes referred to as “lower” or “lower”). Here, the “lamp axis” refers to an imaginary line passing through the center of the globe 7 when the globe 7 is viewed in plan from the front side, and the center of the mouthpiece 11 when viewed in plan from the rear side.

As shown in FIGS. 1 to 3, the LED lamp 100 mainly includes an LED module 5 including the LED, a globe 7 covering the LED module 5, a case 9 attached to the rear side of the globe 7, and a case 9 The cap 11 attached to the open end of the rear side, the stem (corresponding to the “lid member” of the present invention) 13 for closing the rear end opening of the globe 7, and the cap 11 And a support member 17 for supporting the LED module 5 inside the globe 7. Here, what the opening of the glove 7 is closed by the stem (lid member) 13 is the container 14, and the volume of the container 14 is 250 [cm ³ ] or less.

Each part in FIGS. 1 to 3 will be described below.
2. Configuration of Each Part (1) LED Module FIG. 4 is a view showing a structure of the LED module 5. 4 (a) is a plan view of the LED module 5 as viewed from the front side of the LED lamp 100, and FIG. 4 (b) is a cross-sectional view taken along the line CC 'in FIG. 4 (a).

As shown in FIGS. 1, 2 and 4, the LED module 5 includes a mounting substrate 21, a plurality of LEDs 3 mounted on the front surface of the mounting substrate 21, and a sealing body 23 that covers the LEDs 3.

As shown in FIG. 4A, the mounting substrate 21 has a rectangular shape in plan view. The mounting substrate 21 has a wiring pattern 22 for electrically connecting a plurality of LEDs 3 (series connection or / and parallel connection) or connecting with the circuit unit 15 on the surface of the substrate body There is.

A material having translucency is used as a material of the substrate body of the mounting substrate 21 and the wiring pattern 22. Thus, the light emitted from the LED 3 can be emitted not only to the front side of the LED lamp 100 but also to the rear side through the mounting substrate 21.

Examples of the material of the substrate main body of the mounting substrate 21 include glass, alumina, sapphire, resin and the like, and examples of the material of the wiring pattern 22 include ITO and the like.

A plurality of LEDs 3 are mounted on the mounting substrate at predetermined intervals in the state of a bare chip, and here, the LEDs 3 are linearly arranged in two rows along the longitudinal direction of the mounting substrate 21. The number, arrangement, and the like of the LEDs 3 are appropriately determined according to the luminance and the like required for the LED lamp 100.

The sealing body 23 also has a function of preventing the entry of air and moisture into the LED 3 and a wavelength conversion function of converting the wavelength of light from the LED 3 here. The sealing body 23 covers one row of LEDs 3.

The sealing body 23 is mainly made of a translucent material. Here, as the translucent material of the sealing body 23, for example, a silicone resin can be used. Also, for example, when the LED 3 emits blue light, blue light emitted from the LED 3 and fluorescence are mixed, for example, by mixing a translucent material with phosphor particles that convert blue light into yellow light as a wavelength conversion material. White light mixed with yellow light wavelength-converted by body particles is emitted from the LED module 5 (LED lamp 100).

As shown in FIGS. 4A and 4B, the mounting substrate 21 supplies power to the through holes 26 for inserting the lead wires 49 and 51 (FIGS. 1 and 2) for supplying power from the circuit unit 15 to the LED 3. It has on the surrounding surface (periphery) of

terminal

22a, 22b.

The connection between the mounting substrate 21 (the LED module 5) and the

lead wires

49, 51 is made by connecting one end of each of the

lead wires

49, 51 to the

feed terminals

22a, 22b of the wiring pattern 22 by the solder 24. The other ends of the

lead wires

49 and 51 are connected to the circuit unit 15 as shown in FIG.

The mounting substrate 21 has a through hole 25 used for coupling with the convex portion 17 a (FIGS. 2 and 3) of the support member 17 substantially at the center.

In the LED lamp 100 according to the present embodiment, the LED module 5 is provided in the globe 7 at a position (for example, substantially the same position) corresponding to the light source (filament) position of the incandescent lamp. As a result, it is possible to obtain characteristics similar to the light distribution characteristics when the incandescent lamp is attached.
(2) Glove The globe 7 returns to FIGS. 1 to 3 and is of the same type as the bulb of the incandescent bulb, that is, the A type. The globe 7 is made of a translucent material. As a translucent material which can be used, there exist a glass material, a resin material, etc., for example, and the glass material is utilized in this embodiment.

As shown in FIG. 2, the glove 7 has a hollow spherical portion 7a and a cylindrical portion 7b. The diameter of the cylindrical portion 7b decreases as it separates from the spherical portion 7a, and the end opposite to the spherical portion 7a (the end on the rear side of the glove 7) opens.
(3) Case As shown in FIGS. 1 to 3, the case 9 has the same shape as the portion close to the base of the bulb of the incandescent lamp. The case 9 is made of, for example, a metal material, a resin material or the like, and is made of a resin material (for example, polybutylene terephthalate (PBT)) in this case.

The case 9 has a function of storing the circuit unit 15 inside, a function of releasing heat generated from the circuit unit 15 to the outside at the time of lighting, a heat of the LED module 5 at the time of light emission transmitted via the stem 13 It has a releasing function. Heat dissipation is performed by heat conduction from the case 9 to the outside air and the base 11, convection by the outside air, and radiation.

As shown in FIG. 2, the case 9 has a large diameter portion 9a in the front half in the lamp axis J direction and a small diameter portion 9b in the rear half. Further, between the large diameter portion 9a and the small diameter portion 9b, a stepped portion 9c is formed as shown in the enlarged view on the lower left in FIG.

As shown in FIG. 2, the large diameter portion 9a of the case 9 is joined to the lower end so as to cover the lower end of the container 14 in which the glove 7 and the stem 13 are integrated. The bonding is here fixed using an adhesive 57. As the adhesive 57, for example, an organic adhesive such as a resin or an inorganic adhesive can be used.

In the large diameter portion 9 a of the case 9, a stepped portion 9 e is formed in order to hold the lower end portion of the container 14 in a stable state.

An Edison-type mouthpiece 11 is attached to the small diameter portion 9 b of the case 9, that is, the opening end of the case 9 opposite to the glove 7. As shown in FIG. 2, the outer periphery of the small diameter portion 9 b is a male screw, and by screwing this screw portion into the mouthpiece 11, the mouthpiece 11 and the case 9 are coupled.

Further, in the small diameter portion 9 b of the case 9, a groove 9 d extending in parallel with the central axis of the case 9 is formed. The groove 9 d is for fixing a lead 33 connecting the base 11 described later and the circuit unit 15 (for restricting the movement of the lead 33).
(4) Base The base 11 is for receiving power from the socket of the lighting apparatus. The type of the base 11 is not particularly limited, but in the present embodiment, an Edison type is used. As shown in FIG. 2, the base 11 includes a shell 27 having a cylindrical shape and a screw-like peripheral wall, and an eyelet 31 attached to the shell 27 via an insulating material 29.

The electrical connection between the base 11 and the circuit unit 15 is made by the shell 27 via the lead wire 33 and the eyelet 31 via the lead wire 35. The lead wire 33 is covered with the shell portion 27 in a state of being drawn out from the inside of the small diameter portion 9 b of the case 9 through the opening at the lower end and fitting into the groove 9 d of the case 9. As a result, the lead wire 35 is sandwiched between the outer periphery of the case 9 and the inner periphery of the shell portion 27, and the lead wire 35 and the base 11 are electrically connected.
(5) Stem As in the case of the globe 7, the stem 13 is made of a translucent material (for example, a glass material), and constitutes the container 14 with the globe 7. That is, in a state where the outer peripheral portion of the stem is in contact with the periphery of the opening of the globe 7, the contact portion is heated, melted and welded, and the stem 13 and the globe 7 are integrated to configure the container 14. In addition, the code | symbol of the fuse | melted and welded part is shown in figure as "13b."

Inside the container 14, a fluid having a higher thermal conductivity than air is enclosed. Thereby, it becomes possible to efficiently conduct the heat generated at the time of lighting of the LED 3 from the LED module 5 to the globe 7.

Here, helium (He) gas is used as the fluid. The advantages of using helium gas include inertness, low cost, corrosiveness to other members, and extremely low reducibility.

The stem 13 is a so-called flare stem, and as shown in FIG. 3, the exhaust pipe 59 is provided in an airtight manner. The exhaust pipe 59 is used to evacuate the inside of the container 14 or seal helium.

Note that the exhaust pipe 59 in FIG. 3 has an opening 61 at one end in the container 14 and is located outside the container 14 to seal the inside of the container 14 after sealing the helium gas. The end is shown in a burnt-out (chip-off sealed) state.
Further, the stem 13 is sealed in a state in which a pair of

lead wires

49 and 51 pass through. As a result, the

lead wires

49, 51 and the exhaust pipe 59 extend from the container 14 and the container 14 is held airtight.
(6) Circuit Unit The circuit unit 15 converts commercial power received via the base 11 into LED 3 lighting power. The circuit unit 15 is comprised from the circuit board 41 and the various

electronic components

43 and 45 mounted in the circuit board 41, as shown in FIG.

The circuit configuration of the circuit unit 15 mainly includes a rectifier circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power. In the present embodiment, the rectifier circuit is constituted by the diode bridge 45, and the smoothing circuit is constituted by the capacitor 43. The diode bridge 45 is mounted on the main surface of the circuit board 41 on the globe 7 side. The capacitor 43 is mounted on the main surface of the circuit board 41 on the base 11 side, and is located inside the base 11.

The circuit board 41 is fixed to the inside of the case 9 using a locking structure. Specifically, as shown in the enlarged view on the lower left in FIG. 2, the peripheral portion of the back surface of the circuit board 41 abuts against the step 9c inside the case 9, and the locking portion 47 on the inner surface of the large diameter portion 9a. The surface of the circuit board 41 is locked.

A plurality of (for example, four) locking portions 47 are formed at intervals (for example, at equal intervals) in the circumferential direction. The locking portion 47 protrudes toward the central axis of the case 9 as it gets closer to the stepped portion 9 c, and the distance between the locking portion 47 and the stepped portion 9 c corresponds to the thickness of the circuit board 41.

When the circuit board 41 (circuit unit 15) is mounted, the circuit unit 15 is inserted from the large diameter portion 9a side of the case 9, and the lower surface (the surface on the base 11 side) of the circuit substrate 41 is the locking portion 47. When the circuit board 41 is reached, the circuit board 41 is further pushed to pass the locking portion 47. Thus, the circuit board 41 is locked by the locking portion 47, and the circuit unit 15 is mounted on the case 9.
(7) Support Member The support member 17 supports the LED module 5 in the container 14 as shown in FIGS. The support member 17 has a function as a support for the LED module 5 and a function as a heat dissipation member when the LED lamp 100 emits light.

The support member 17 has, for example, a rod-like shape, and the upper end is coupled to the LED module 5, and the lower end is attached to the stem 13 by an adhesive 19.

An intermediate region of the support member 17 is a cylindrical portion 17 b having a circular cross section. The upper region of the support member 17 is a flat portion 17 c having a flat (thin in the width direction) shape in the width direction of the rectangular mounting substrate 21.

As a result, in the flat portion 17c of the support member 17, the LED module 5 is held stably, and in the cylindrical portion 17b, the light emitted backward from the LED 3 is not blocked as much as possible.

The support member 17 is made of, for example, a metal material or a resin material. When the support member 17 is made of, for example, aluminum, the heat from the LED module 5 can also be transmitted, and the weight reduction of the LED lamp 100 can be achieved.

The adhesive 19 desirably has high thermal conductivity. By doing so, it is possible to promote the conduction of the heat generated in the LED 3 to the stem 13 via the mounting substrate 21 of the LED module 5 and the support member 17. The heat conducted to the stem 13 is conducted to the globe 7 and is released from the globe 7 to the outside of the LED lamp 100. Examples of the adhesive having high thermal conductivity include adhesives of inorganic materials such as ceramics and cement, and adhesives of organic materials such as heat dissipating silicone.

The connection between the support member 17 and the LED module 5 utilizes an engagement structure or an adhesive. Specifically, a convex portion 17 a is formed on the upper surface of the support member 17, and the convex portion 17 a is inserted (fitted) into the through hole 25 (FIG. 3) substantially at the center of the mounting substrate 21 of the LED module 5. By filling the space between the convex portion 17 a and the through hole 25 with the adhesive in the above state, the support member 17 and the LED module 5 are coupled.

The function as a heat dissipating member is achieved by conducting the heat transferred to the support member 17 to the helium gas or air contained in the glove 7, which is the heat generated when the LED 3 is lit.

Incidentally, by using the adhesive 19 for joining the support member 17 and the stem 13, for fixing when the lower end surface of the support member 17 and the stem head 13 b (FIGS. 2 and 3) of the stem 13 are not flat. Can also respond.
3. Regarding Volume of Container FIG. 5 is an analysis result showing the relationship between the volume of the container and the temperature of the LED at the time of lighting (which is the junction temperature). FIG. 6 is a view for explaining a container used for analysis, and FIG. 7 is a view for explaining a support member used for analysis. FIG. 8 is a diagram showing an analysis result of the temperature distribution of the lamp at the time of lighting. Note that FIG. 8 shows the temperature difference between the maximum temperature and the room temperature in ten steps, and since the region of the maximum temperature is small, nine steps are shown in the figure.

The sizes of the containers used for the analysis test are five types of 104 [cm ³ ], 181 [cm ³ ], 252 [cm ³ ], 335 [cm ³ ], and 426 [cm ³ ]. Here, the volume is obtained by subtracting the volumes of the LED module and the support member from the volume of the container constituted by the globe and the stem.

As for the shape of the container, as shown in FIG. 6, the container 151 having a volume of 104 [cm ³ ] is an A type close to the shape of an incandescent lamp, and the container 153 having a volume of 426 [cm ³ ] close to a ball As the volume increases, the shape of the container approaches from the A type to the G type.

The stem (lid member) 155 constituting each container is a so-called button stem having a disk shape regardless of the volume of the container as shown in FIG. The size of the stem 155 is the same in all the containers.

The containers (151, 153, etc.) differ in the size and shape of the glove, but as shown in FIG. 6, the size and shape of the stem 155 blocking the opening of the

gloves

157, 159 are the same, and the volume increases According to, the shape of the glove (157, 159) approaches the spherical shape of G-type from the A-type ladder shape.

Further, as shown in FIG. 7, there are three types of shapes of the support member used for analysis: X type (163), Y type (165), and Z type (167).

The X-type support member 163 has a cylindrical shape, and has a stepped shape as if a large diameter portion 163a near the stem 155 and a small diameter portion 163b near the LED module 169 are combined. The Y-type support member 165 has a tapered cylindrical shape in which the outer diameter decreases with distance from the stem 155. The Z-type support member 167 has a cylindrical shape and is shaped like a combination of a cylindrical portion 167 a closer to the stem 155 and a truncated cone portion 167 b closer to the LED module 169.

The surface area (area in contact with helium) of the support member used for the analysis is 16.7 cm ^{2 for} the X type (163), 18.5 cm ^{2 for} the Y type (165), and Z type ( 167) There are three types of 24.1 [cm ² ].

In each type of

support member

163, 165, 167, the diameter D1 of the lower surface (the stem side) is equal, and the diameter D2 of the upper surface (the opposite side to the stem) is also equal. That is, the areas of the lower and upper surfaces of all types of

support members

163, 165 and 167 are equal. This is to make the amount of heat transferred from the LED module 169 to the

support members

163, 165 and 167 equal to the amount of heat transferred from the

support members

163, 165 and 167 to the stem 155 (container) in each type. The height H1 is also equal.

The LED modules 169 used for the analysis are all the same, and as shown in FIG. 6, the case 171 and the cap 173 joined to the container (151, 153, etc.) are all analyzed with the same thing.

The junction temperature of the LED drops as the volume of the container increases in each type of

support member

163, 165, 167, and hardly decreases when the volume of the container exceeds 252 cm ^{3 in} each type. That is, if the volume is less than 252 cm ³ , for example, 250 cm ³ or less, the junction temperature of the LED can be effectively reduced.

The reason for this is that only the gas (helium gas or air) in the vicinity of the LED module 5 and the support member 17 contributes to lowering the junction temperature of the LED, and even if a container having a certain volume or more is provided, It is considered that the gas located away from the LED module 5 hardly contributes to the drop of the junction temperature.

Further, the junction temperatures of the LEDs are lower in the order of the X type, the Y type, and the Z type in the

support members

163, 165, and 167. This order is the order in which the surface area of the

support members

163, 165 and 167 is increased. That is, it can be seen that the junction temperature of the LED decreases as the surface area of the support member increases. The reason is that the heat transfer from the support member to the helium gas is performed from the surface of the support member to the surrounding helium gas.

Further, as shown in FIG. 8, the temperature distribution of the helium gas in the container is the highest in the A region around the LED module 169 which is a heat source, and then the LED module 169 and the small diameter portion 163 of the support member 163 The region B which is the whole is high, and the temperature of the helium gas is lowered as the region B is left. Region B included the LED module 169 and the upper half of the support member 163 while region C included the entire support member 163.

That is, the heat generated in the LED module 169 is transferred to the helium gas around the LED module 169 to increase the temperature of the A region, and is transferred to substantially the entire support member 163. Therefore, the temperature in the B region including the upper portion of the support member 163 is high, and the temperature also in the C region including the entire support member 163 is high.

The heat transfer from the support member 169 to the helium gas is performed from the entire surface of the support member 169, and the temperatures in the D and E regions are also high, but most of the heat of the LED module is transferred in the H and I regions. Not. In particular, at the position away from the LED module 169 at the upper side (opposite the support member), the difference with the ambient temperature around the lamp is small, and it can be seen that the heat of the LED module is not conducted.

From the above temperature distribution, heat conduction to the helium gas is actively performed within 10 cm from this outer surface of the LED module 169 and the support member 163 (this area is the A area to the E area), Preferably, the distance between the LED module 169 and the container, and the distance between the support member 163 and the container are at least 10 mm or more.

Furthermore, the heat from the LED module 169 is mostly transmitted outside the radius ("K" in the figure) of the LED module 169 and the support member 163 centered on the position with the highest temperature ("K" in the figure). Not. For this reason, it is preferable that helium gas be present inside the radius 40 [mm] centering on the position of the highest temperature among the LED module 169 and the support member 163.

Second Embodiment
FIG. 9 is a perspective view showing the structure of the LED lamp 200 according to the second embodiment. FIG. 10 is a cross-sectional view taken along line DD ′ of the LED lamp 200 shown in FIG. In FIGS. 9 and 10, the same components as those of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The LED lamp 200 according to this embodiment differs from the LED lamp 100 according to the first embodiment in the configuration of the LED module 81, the support member 83, and the stem 85. In addition, the container 86 is comprised by the globe 7 and the stem 85, and the volume of the container 86 is 250 [cm < ³ >] or less.

Specifically, as shown in FIG. 10, the support member 83 is a hollow member, and the

lead wires

49 and 51 are inserted into the support member 83. As shown in FIGS. 9 and 10, the support member 83 has a hollow structure in which the external shape of the support member 17 in the first embodiment is left unchanged. Therefore, the support member 83 has a cylindrical portion 83 b and a flat portion 83 c as the support member 17 in the first embodiment.

As the

lead wires

49 and 51 are inserted into the support member 83, the positions of the stems 85 through which the

lead wires

49 and 51 are inserted are closer to the lamp axis J side. Further, as the

lead wires

49 and 51 are accommodated inside the support member 83, the position of the solder 87 connecting the

lead wires

49 and 51 and the mounting substrate 91 of the LED module 81 is closer to the lamp axis J side. The structure is

As shown in FIG. 10, since the stem 85 and the globe 7 are integrally formed, the interface between the stem 85 and the globe 7 is joined (sealed) in an airtight manner.

An adhesive 89 is used to fix the support member 83 and the LED module 81. As the adhesive 89, for example, those mentioned for the above-mentioned adhesive 19 can be used.

In the present embodiment, the

lead wires

49 and 51 are accommodated inside the support member 83. Therefore, compared with the first embodiment, of the light emitted from the LED module 81, the light emitted toward the rear is not blocked more.

Third Embodiment
FIG. 11 is a perspective view showing the structure of the LED lamp 300 according to the third embodiment. FIG. 12 is a cross-sectional view of the LED lamp 300 shown in FIG. In FIGS. 11 and 12, the same components as those in the first and second embodiments are designated by the same reference numerals, and the description thereof will be omitted.

The LED lamp 300 according to the present embodiment differs from the LED lamp 100 according to the first embodiment in the configuration of a stem (the “lid member” of the present invention) 111. In addition, the container 112 is comprised by the globe 7 and the stem 111, and the volume of the container 112 is 250 [cm < ³ >] or less.

Specifically, the stem 111 has a dome shape, and has a recess 111 a in the vicinity of the intersection with the lamp axis J. The support member 17 and the stem 111 are fixed by the adhesive 19 in the recess 111 a.

With such a configuration, the LED module 5 is stably supported inside the globe 7 as compared to the case where the support member 17 is fixed to the convex stem head 13 b as in the first embodiment. It is possible.

Note that, as shown in FIGS. 11 and 12, the stem 111 and the globe 7 are integrally formed, so the interface between the stem 111 and the globe 7 is joined in an airtight manner.
Fourth Embodiment
In the embodiments and the like, in particular, the LED lamp has been described, but the present invention is also applicable to a lighting device using the LED lamp.

In the fourth embodiment, a case where the LED lamp 100 according to the first embodiment is attached to a luminaire (which is a downlight type) will be described.

FIG. 14 is a schematic view of a lighting device according to a fourth embodiment.

The lighting device 401 is attached to, for example, the ceiling 402 and used.

As illustrated in FIG. 14, the lighting device 401 is an LED lamp (for example, the LED lamp 1 described in the first embodiment) 100 and a lighting fixture 403 for mounting the LED lamp 100 and lighting / extinguishing. And

The lighting fixture 403 includes, for example, a fixture body 405 attached to the ceiling 402, and a cover 407 attached to the fixture body 405 and covering the LED lamp 100. The cover 407 is an aperture type here, and has a reflective film 411 on its inner surface that reflects the light emitted from the LED lamp 100 in a predetermined direction (here, the lower side).

The fixture body 405 includes a socket 409 to which the base 11 of the LED lamp 100 is attached (screwed), and power is supplied to the LED lamp 100 via the socket 409.

In this embodiment, since the arrangement position of the LED 3 (LED module 5) of the LED lamp 100 mounted on the lighting fixture 403 is close to the arrangement position of the filament of the incandescent lamp, the emission center of the LED lamp 100 and the emission center of the incandescent lamp It will be close.

For this reason, even if the LED lamp 100 is attached to the lighting fixture (403) to which the incandescent lamp has been attached, the position of the light emission center as the lamp is similar, so that light distribution characteristics similar to the incandescent lamp can be obtained.

Note that the lighting fixture here is an example, and for example, the lighting fixture may have a closed cover without the open cover 407, or the posture in which the LED lamp faces sideways ( The lighting apparatus may be lighted in such a manner that the central axis of the lamp is horizontal or inclined (the central axis of the lamp is inclined with respect to the central axis of the lighting apparatus).

In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in contact with the ceiling or wall, but it is an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or wall It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.

Furthermore, although the lighting fixture here lights one attached LED lamp, a plurality of, for example, three LED lamps may be attached.

«Modification»
The configuration of the present invention has been described above based on the first to fourth embodiments, but the present invention is not limited to the above embodiments. For example, the LED lamp according to the first to fourth embodiments and the partial configuration of the illumination device and the configuration according to the following modification may be combined as appropriate.

In addition, the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the lighting device without departing from the scope of the technical idea of the present invention.
1. Container In the embodiment, the

container

14, 84, 112 is constituted by the glove 7 and the lid member (stem) 13, 83, 111, and the glove and the lid member are constituted by the glass material. Other materials may be used as long as they can hold.

Another material is a resin material. In this case, for example, when a thermoplastic material is used, it can be carried out by heating and melting the joint portion between the glove and the stem, and when a thermosetting resin is used, it can be carried out by using an adhesive. Further, the gas tightness can be further enhanced by using a gas barrier resin.
(1) Glove In the embodiment, the globe 7 (

containers

14, 84, 112) has an A-type shape, but may have another type, for example, a G-type or R-type, or a light bulb etc. The shape may be completely different from the shape.

In the embodiment, the inner surface of the glove is not particularly described. However, for example, a diffusion process (for example, a process with silica, a white pigment, or the like) may be performed to diffuse the light emitted from the LED module 5. Also, the glove may be made of a translucent material, and, for example, transparency and opacity are not particularly relevant.

In the embodiment, the glove 7 is integral (made as one piece), but may be, for example, a combination (joined) of a plurality of members.
(2) Lid member In the embodiment, the lid members (stems) 13, 83, 111 are flared, but may be other types such as a disk-shaped button type. Also, a reflection process (for example, a process by application of a reflective film) that reflects light from the LED module to the globe tip side (the opposite side to the opening) with respect to the surface of the stem located inside the container May be applied.
(3) Bonding of Glove and Lid Member In the embodiment, the glove and the lid member are made of a glass material, and the bonding portions of the both are heated and melted for bonding. In this case, the bonding method may be a so-called drop seal method or a so-called butt seal method.
2. In the fluid embodiment, helium gas is sealed as a fluid in the container 14, but other types of gas (gas) having a thermal conductivity higher than that of air may be sealed. Other gases include hydrogen, nitrogen, neon and the like.

In addition to the gas, a liquid can also be used as the fluid. Examples of the liquid having a thermal conductivity higher than that of air include silicone oil and water. When using hydrogen gas, it is necessary to prevent oxygen from being contained in the valve. Moreover, when using water, in order to prevent the deterioration by rust, it is necessary to

coat lead wire

49, 51 with resin etc.
3. LED Module (1) Light-Emitting Element In the embodiment, the light-emitting element is the LED 3. However, for example, it may be an LD (laser diode) or an EL element (electric luminescence element).

The LED 3 is mounted on the mounting substrate 21 in a bare chip state, but the LED may be mounted on the mounting substrate in a surface mounting type (so-called SMD) or a shell type, for example. Furthermore, the plurality of LEDs may be a mixture of chip type and surface mount type.
(2) Mounting Board The mounting board 21 in the embodiment has a rectangular shape in plan view. However, the mounting substrate may have another shape, for example, a polygon such as a square or a pentagon (including a regular polygon), an oval, a circle, a ring, or the like.

Also, the number of mounting substrates is not limited to one, and may be two or more. Furthermore, in the embodiment, the LED 3 is mounted on the surface of the mounting substrate 21. However, the LED may be mounted on the back surface.
(3) Sealing Body In the embodiment, the sealing body 23 covers the LEDs 3 arranged in two rows in a row unit, but two rows may be coated collectively, or a plurality of constant numbers The LED group may be coated with one sealing body, or all the LEDs may be coated with one sealing body.
(4) Arrangement of LEDs In the embodiment, the plurality of LEDs 3 are arranged in two rows, but in plan view, the LEDs 3 may be arranged on four sides of a square, or an ellipse (circle It may be disposed on the circumference of (including). Furthermore, they may be arranged in a matrix, or may be arranged otherwise.
(5) Others Although the LED module 5 is configured to emit white light by using the LED 3 that emits blue light and phosphor particles that convert blue light to yellow light, for example, ultraviolet light The semiconductor light emitting device of the present invention may be combined with phosphor particles of each color that emits light of three primary colors (red, green and blue).

Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
4. Case In the embodiment and the like, the case 9 is made of a resin material, but may be made of another material. When using a metal material as another material, it is necessary to ensure the insulation with a nozzle. The insulation with the base can be ensured, for example, by applying an insulating film to the small diameter portion of the case or insulating the small diameter portion, and the glove side of the case is made of a metal material. It is also possible to secure the sides by resin materials (two or more members are joined).

In the above embodiment, the surface of the case 9 is not particularly described. However, for example, a radiation fin may be provided, or a process for improving the emissivity may be performed.
5. Bonding of Container and Case In the first embodiment, the container 14 and the case 9 are fixed by the adhesive 57. Therefore, the heat of the container 14 is transmitted to the case 9 at the time of lighting. However, when a fluid having a high thermal conductivity is sealed in the container, the temperature of the container may be increased, the heat may be transmitted to the case, and the temperature of the case may be increased. In such a case, in order to reduce the thermal load on the circuit unit in the case, a material having a low thermal conductivity may be interposed between the container and the case, and the two may be joined.
6. In the embodiment, although the Edison type cap 11 is used, other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used.

Moreover, in the said embodiment, although the nozzle | cap | die 11 was attached to (joined) the case 9 by screwing to the screw part of the case 9 using the internal thread of a shell part, with the case by other methods It may be joined. Other methods include adhesive bonding, caulking bonding, press-in bonding, and the like, and two or more of these methods may be combined.
7. Lamp In the embodiment, a lamp for storing a circuit unit in a case (so-called bulb type lamp) has been described as a lamp, but a lamp not containing a circuit unit in the case, for example, a compact bulb is substituted It is also applicable to such lamps. Furthermore, it may be a non-conventional lamp, for example, a lamp directly incorporated into a luminaire.

1 LED lamp 3 LED
5 LED module 7 globe 9 case 11 base 13 stem (lid member)
14 container 17 support member

Claims

A lamp in which a semiconductor light emitting element as a light source is supported by a support member in a container in which a globe opening is closed by a lid member,
A fluid having a higher thermal conductivity than air is enclosed in the container,
Lamps, wherein the volume of the container is 250 cm 3 or less.
The lamp according to claim 1, wherein a surface area of a portion of the support member in contact with the fluid is 18 cm 2 or more.
The lamp according to claim 1, wherein the fluid is helium gas.
The lamp according to any one of claims 1 to 3, wherein a portion of the support member in contact with the fluid is made of a metal material.
In a lighting device comprising: a lamp; and a lighting fixture for mounting and lighting the lamp,
The lighting device according to any one of claims 1 to 4, wherein the lamp is a lamp according to any one of claims 1 to 4.