TW201341709A - Bulb-shaped lamp and lighting device - Google Patents

Abstract

A bulb-shaped lamp (1) that has a globe (10) and a base (30) and is provided with the following: a metal support post (40) provided so as to extend towards the interior of the globe (10); and an LED module (20) located inside the globe (10) and affixed to the support post (40). The LED module (20) has a light-transmitting mount (21) and an LED chip (22) mounted thereon. The support post (40) has an affixing surface (42a) to which the mount (21) of the LED module (20) is affixed. The LED module (20) and the support post (40) are disposed such that, in a planar view, the aforementioned affixing surface (42a) and the LED chip (22) do not overlap.

Description

Light bulb shaped luminaire and lighting device

The present invention relates to a light bulb shaped illuminator and a lighting device, for example, to a light bulb shaped LED luminaire using a light emitting diode (LED) and an illuminating device using the same.

LED light-emitting devices such as LEDs are expected to be small, high-efficiency, and long-lived. They are expected as new light sources in various lamps such as fluorescent lamps and white heat bulbs, and LED lamps (LED lamps) are used. Research and development are also continuing.

Regarding LED lamps, there are bulb-shaped LED lamps (bulb-shaped LED lamps) that replace white-hot bulbs, or straight-tube LED lamps (straight-tube LED lamps) that replace straight-tube fluorescent lamps. The above-mentioned incandescent light bulb uses a bulb-shaped fluorescent lamp or a filament coil having a light-emitting tube in a glass bulb.

For example, in Patent Document 1, a conventional light bulb shaped LED lamp is disclosed. Fig. 13 is a cross-sectional view showing a conventional light bulb shaped LED lamp disclosed in Patent Document 1.

As shown in FIG. 13, the conventional light bulb-shaped LED lamp 100 has a hemispherical bulb, that is, a translucent lampshade 110, a cap 130, and a metal frame, that is, a peripheral member 190.

The peripheral member 190 includes: a peripheral portion 191 exposed to the outside, integrally formed around the periphery The disk-shaped light source mounting portion 192 of the portion 191 and the concave portion 193 formed inside the peripheral portion 191. An LED module 120 composed of a plurality of LEDs mounted on the base is mounted on the upper surface of the light source mounting portion 192. An insulating member 160 formed along the inner surface of the recess 193 is provided, and a lighting circuit 180 for lighting the LED is housed inside the insulating member 160.

According to the conventional light bulb-shaped LED lamp 100 having the above configuration, the peripheral member 190 (metal frame) integrally formed by the light source mounting portion 192 and the peripheral portion 191 is used, and the peripheral member 190 functions as an LED. The generated heat discharges the function of external heat dissipation. Thereby, the heat generated by the LED can be efficiently conducted from the light source mounting portion 192 to the peripheral portion 191. As a result, since the temperature rise of the LED is suppressed, the decrease in the light output of the LED can be suppressed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-313717

However, in the conventional light bulb-shaped LED lamp 100 shown in FIG. 13, since the LED module 120 is provided on the disk-shaped light source mounting portion 192, the light toward the base 130 side is shielded by the peripheral member 190. Therefore, in the conventional light bulb-shaped LED lamp 100, the light is filled in a different manner from the white heat bulb. That is to say, with the configuration of the conventional light bulb-shaped LED lamp 100, it is difficult to obtain the same light distribution characteristics as the white heat bulb, and it is difficult to realize a wide light distribution angle.

Here, as shown in FIG. 14, in order to make the light of the LED module 220 reach the side of the base 230 as much as possible, one considers the bulb-shaped LED lamp 200 constructed as follows: using the same shape as the bulb (bulb) of the incandescent bulb The LED ball 210 defines the LED mounting substrate of the LED module 220 as a light-transmitting substrate, and holds the LED module 220 on the pillar 240. At this time, compared with the conventional light bulb-shaped LED lamp 100 shown in FIG. 13, the light amount can be increased by increasing the amount of light of the LED module 220 toward the base side.

Further, in the bulb-shaped LED lamp 200 shown in FIG. 14, in order to dissipate the heat generated by the LED module 220, the pillar 240 of the LED module 220 is fixed to use a metal product. Therefore, among the light emitted from the LED module 220, the light that has passed through the light-transmitting substrate toward the base is absorbed by the metal pillar 240. Therefore, in the light bulb-shaped LED lamp 200 shown in FIG. 14, there is a problem that the extraction efficiency of light in the direction of the lamp head side (back surface) of the LED module 220 is low.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a light bulb shaped lamp and an illumination device which can improve the efficiency of extracting light from the LED module toward the base.

In order to solve the above problems, an embodiment of the light bulb shaped lamp of the present invention is a light bulb shaped lamp having a lamp ball and a lamp cap. The light bulb shaped lamp is characterized by comprising: a metal pillar facing the lamp ball. The square is extended and disposed; and the light emitting module is disposed in the light ball and fixed to the pillar. The light-emitting module has a light-transmitting base and a light-emitting element mounted on the base. The pillar has a fixing surface fixed to the base of the light emitting module. The light-emitting module and the pillar are disposed such that the fixing surface does not overlap the light-emitting element in plan view.

Further, in an embodiment of the light bulb shaped lamp of the present invention, the light emitting module further has a package member for encapsulating the light emitting element. The package member includes: a wavelength conversion material for converting a wavelength of light emitted by the light emitting element; and a resin containing the wavelength conversion material. The package member is formed so as not to overlap the fixing surface in a plan view.

Further, in an embodiment of the light bulb shaped lamp of the present invention, the light emitting module may be formed in a strip shape in plan view. The pillar has a main shaft portion and a fixing portion, and the fixing portion is between the main shaft portion and the light emitting module, and has the fixing surface. The length of the fixing surface in the longitudinal direction of the light emitting module is longer than the length of the main shaft portion in the longitudinal direction of the light emitting module. The length of the fixing surface in the short side direction of the light emitting module is shorter than the length of the main shaft portion in the short side direction of the light emitting module.

Furthermore, in an embodiment of the light bulb shaped lamp of the present invention, the side surface of the fixing portion may include a flat surface connected to the light emitting module and parallel to the pillar. a shaft; and a curved surface that is coupled to the lower portion of the flat surface and that is curved away from the axis of the pillar toward the side of the base.

Further, in an embodiment of the light bulb shaped lamp according to the present invention, the side surface of the fixing portion may include an inclined surface which is inclined toward the axis of the support from the side closer to the base.

Further, in an embodiment of the light bulb shaped lamp of the present invention, the base may be a ceramic substrate composed of Al ₂ O ₃ , AlN or MgO.

Further, in an embodiment of the light bulb shaped lamp of the present invention, the pillar may be composed of aluminum.

Furthermore, in an embodiment of the light bulb shaped lamp of the present invention, the method further includes: a lead wire for supplying power to the light emitting element, and an insulating case for accommodating the lighting circuit for lighting the light emitting element .

Moreover, an aspect of the illumination device of the present invention is characterized in that the illumination device includes any of the above-described light bulb-shaped lamps.

According to the present invention, it is possible to realize a light bulb shaped lamp and an illumination device capable of improving the efficiency of extracting light from the light-emitting module toward the lamp head side.

1‧‧‧Light bulb shaped lamps

2‧‧‧Lighting device

3‧‧‧Lighting appliances

4‧‧‧ Appliance body

4a‧‧‧ slots

5‧‧‧shade

10‧‧‧light ball

11‧‧‧ openings

20‧‧‧LED module

21‧‧‧Abutment

21a, 21b, 51‧‧‧through holes

22‧‧‧Light Emitter Wafer

22a‧‧‧Sapphire substrate

22b‧‧‧ nitride semiconductor layer

22c‧‧‧cathode electrode

22d‧‧‧Anode electrode

22e, 22f‧‧‧ wire lap joint

23‧‧‧Package components

24‧‧‧Metal wiring

25‧‧‧ Gold wire

26‧‧‧ wafer bonding materials

30‧‧‧ lamp holder

40, 40A, 40B, 40C, 40D‧‧‧ pillars

41‧‧‧Spindle Department

42, 42A, 42B, 42C, 42D‧‧‧ fixed parts

42B1‧‧‧Cylinder

42B2‧‧‧French table

42a‧‧‧Fixed surface

42b‧‧‧Protruding

42c‧‧‧Flat surface

42d‧‧‧Curved surface

50‧‧‧Support desk

60‧‧‧Resin shell

61‧‧‧1st housing part

62‧‧‧2nd housing part

70‧‧‧ lead

80‧‧‧Lighting circuit

100,200‧‧‧Light bulb shaped LED lamps

110‧‧‧shade

120, 220‧‧‧LED modules

130, 230‧‧‧ lamp holder

160‧‧‧Insulating components

180‧‧‧Lighting circuit

190‧‧‧ Peripheral components

191‧‧‧ surrounding parts

192‧‧‧Light source installation

193‧‧‧ recess

210‧‧‧light ball

240‧‧‧ pillar

A-A’, B-B’, C-C’‧‧‧ hatching

Length of W1‧‧‧Fixed surface 42a

W2‧‧‧ Length of the fixed surface 42a

‧‧‧diameter of the main shaft portion 41

Fig. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view of a light bulb shaped lamp according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing a light bulb shaped lamp according to an embodiment of the present invention.

4(a) is a plan view of an LED module in a light bulb shaped lamp according to an embodiment of the present invention, and FIG. 4(b) is cut along line A-A' of FIG. 4(a). A cross-sectional view of the above LED module.

Fig. 5 is an enlarged cross-sectional view showing the periphery of a light-emitting diode wafer in an LED module of a light bulb shaped lamp according to an embodiment of the present invention.

Fig. 6 is a perspective view showing the configuration of a pillar and a support stand in a light bulb shaped lamp according to an embodiment of the present invention.

Fig. 7 is a view showing a configuration of a pillar and a support stand in a light bulb shaped lamp according to an embodiment of the present invention: (a) is a plan view, (b) is a front view, and (c) is a side view. .

8(a) to 8(c) are diagrams for explaining the connection relationship between the LED module and the pillar in the light bulb shaped lamp according to the embodiment of the present invention.

Fig. 9 is a view showing a state at the time of lighting of a light bulb shaped lamp according to an embodiment of the present invention.

Fig. 10 is a view for explaining the relationship between the length of the fixing portion and the light beam in the light bulb shaped lamp according to the embodiment of the present invention.

FIG. 11A is a view showing a configuration of an LED module and a pillar in a light bulb shaped lamp according to a first modification of the present invention.

FIG. 11B is a view showing a configuration of an LED module and a pillar in a light bulb shaped lamp according to a second modification of the present invention.

Fig. 11C is a view showing the configuration of an LED module and a pillar in a light bulb shaped lamp according to a third modification of the present invention.

Fig. 11D is a view showing the configuration of an LED module and a pillar in a light bulb shaped lamp according to a fourth modification of the present invention.

Fig. 12 is a schematic cross-sectional view showing a lighting device according to the present invention.

Fig. 13 is a cross-sectional view showing a conventional light bulb shaped LED lamp disclosed in Patent Document 1.

Fig. 14 is a cross-sectional view showing the configuration of an example of a bulb-shaped LED lamp.

Hereinafter, a light bulb shaped lamp and an illumination device according to an embodiment of the present invention will be described with reference to the drawings. Further, each of the embodiments described below is a suitable specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements in the following embodiments are not intended to limit the scope of the present invention. Therefore, among the constituent elements of the following embodiments, the constituent elements which are not described in the independent request item indicating the most general concept of the present invention are not necessarily required to achieve the object of the present invention, but are preferably constituted as a constituent. The form is explained. Moreover, the drawings are schematic and are not strictly illustrated.

(The whole structure of the bulb-shaped lamp)

First, the overall configuration of the light bulb shaped lamp 1 of the present embodiment will be described with reference to Figs. 1 to 3 .

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view of a light bulb shaped luminaire in accordance with an embodiment of the present invention. Further, Fig. 2 is an exploded perspective view of a light bulb shaped lamp according to an embodiment of the present invention. 3 is a cross-sectional view of a light bulb shaped lamp in accordance with an embodiment of the present invention.

As shown in FIG. 1 to FIG. 3, the light bulb shaped lamp 1 according to an embodiment of the present invention is a bulb-shaped LED lamp which is a substitute for a bulb-shaped fluorescent lamp or a white heat bulb, and has a light-transmitting lamp. The ball 10, an LED module 20 as a light source, a base 30 for receiving electric power, and a pillar 40 made of metal. Further, the light bulb shaped lamp 1 of the present embodiment includes a support base 50, a resin case 60, a lead wire 70, and a lighting circuit 80. In the light bulb shaped lamp 1 of the present embodiment, the lamp ball 10, the resin case 60 (the first case portion 61), and the base 30 are formed with a peripheral device.

Hereinafter, each constituent element of the light bulb shaped lamp 1 according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3.

(light ball)

As shown in FIG. 1 to FIG. 3, the light ball 10 houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp. In this embodiment, the light ball 10 is quartz transparent to visible light. (silica) glass bulb (transparent bulb) made of glass. Therefore, the LED module 20 housed in the bulb 10 can be viewed from the outside of the bulb 10 for confirmation.

In the present embodiment, the shape of the bulb 10 is closed at one end in a spherical shape, and at the other end, it has a shape having an opening portion 11. In other words, the shape of the bulb 10 is such that a part of the hollow ball is narrowed toward the center portion away from the ball, and the opening portion 11 is formed at a position away from the center portion of the ball. As the bulb 10 of such a shape, a glass bulb of the same shape as the incandescent bulb can be generally used. For example, as the light ball 10, a glass bulb such as an A shape, a G shape, or an E shape can be used.

Moreover, the light ball 10 is not necessarily transparent to visible light, and the light ball 10 can also have a light diffusing function. For example, a white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate or a white pigment to the entire inner surface of the bulb 10 or the outer surface. Moreover, the bulb 10 is not necessarily made of quartz glass. For example, a bulb 10 made of a resin material such as acrylic can also be used.

(LED module)

The LED module 20 is a light-emitting module having a light-emitting element and is housed in the light bulb 10. The LED module 20 is preferably disposed at a center position of a spherical shape formed by the bulb 10 (for example, the inside of the bulb 10 having a large inner diameter). As described above, by arranging the LED module 20 at the center of the bulb 10, the light distribution characteristic of the bulb-shaped lamp 1 becomes a light distribution characteristic similar to that of a conventional incandescent bulb using a conventional filament coil.

Further, the LED module 20 is held in the hollow of the bulb 10 by the support 40, and emits light by supplying electric power from the lead 70.

Here, each constituent element of the LED module 20 according to the embodiment of the present invention will be described with reference to FIG. 4. 4(a) is a plan view of an LED module in a bulb-shaped lamp according to an embodiment of the present invention, and FIG. 4(b) is the LED module cut along line A-A' of FIG. 4(a). Sectional view.

As shown in FIGS. 4( a ) and 4 ( b ), the LED module 20 includes a translucent base 21 , a light emitting diode (LED) wafer 22 , a package member 23 , and a metal wiring 24 . . In the embodiment, the LED module 20 is a COB (Chip On Board) structure in which a bare die is mounted on the direct abutment 21. Hereinafter, each constituent element of the LED module 20 will be described in detail.

First, the base 21 will be described. In the present embodiment, the base 21 is an LED mounting substrate for mounting the light-emitting diode wafer 22, and is configured to have a light transmissive property for visible light.

Further, the base 21 is preferably made of a member having a high transmittance. Thereby, the light of the light-emitting diode wafer 22 is transmitted through the inside of the base 21, and is also emitted from the surface (back surface) on which the light-emitting diode wafer 22 is not mounted. Therefore, even when the light-emitting diode wafer 22 is attached only to one surface (surface) of the base 21, light is emitted from the other surface (back surface), and light distribution characteristics similar to those of the incandescent light bulb can be obtained. In the present embodiment, the base 21 is made of a ceramic substrate made of vaporized aluminum (Al 2 O 3 ) having a transmittance of 90% or more. Further, the base 21 may be a ceramic substrate made of AlN or MgO. Further, the base 21 is a rectangular substrate having a long strip shape in plan view (when viewed from the top of the bulb 10). Thereby, the LED module 20 has a long shape in plan view.

Further, the base 21 is provided with through holes 21a and 21b. The through hole 21a is provided to fit the base 21 and the stay 40. In the present embodiment, the through hole 21a is formed in a rectangular shape in plan view at a position deviated from the center of the base 21 in the longitudinal direction. On the other hand, the through holes 21b are provided in order to electrically connect the two leads 70, and in the present embodiment, they are provided at both end portions of the base 21 in the longitudinal direction.

Next, the light-emitting diode wafer 22 will be described. The light-emitting diode wafer 22 is an example of a semiconductor light-emitting element and is a bare wafer that emits visible light in a single color. In the present embodiment, a blue light-emitting diode wafer that emits blue light when energized is used. In the present embodiment, the light-emitting diode wafer 22 is mounted only on one surface (surface) of the base 21, and a plurality of (for example, twelve) light-emitting diode wafers 22 are arranged in a row of element rows, linearly 4 column configuration.

Moreover, although a plurality of light-emitting diode wafers 22 are mounted in this embodiment, the light-emitting diodes The number of the polar wafers 22 can also be appropriately changed in accordance with the use of the bulb-shaped lamps. For example, in the case of replacing the small bulb, the number of the light-emitting diode chips 22 mounted on the base 21 may be one. Further, in the present embodiment, the plurality of light-emitting diode chips 22 are mounted in four rows on the base 21, but may be one column or may be a plurality of columns other than four columns. However, the present invention is suitable for an LED module for outputting a large number of light-emitting diode chips 22.

Here, the light-emitting diode wafer 22 used in the present embodiment will be described with reference to FIG. 5. Fig. 5 is an enlarged cross-sectional view showing the periphery of a light-emitting diode wafer in an LED module of a light bulb shaped lamp according to an embodiment of the present invention.

As shown in FIG. 5, the light-emitting diode wafer 22 includes a sapphire substrate 22a, and a plurality of nitride semiconductor layers 22b which are stacked on the sapphire substrate 22a and which are composed of mutually different compositions.

A cathode electrode 22c and an anode electrode 22d are provided at an end portion of the upper surface of the nitride semiconductor layer 22b. Further, wire bonding portions 22e and 22f are provided above the cathode electrode 22c and the anode electrode 22d.

The cathode electrode 22c of the light-emitting diode wafer 22 and the anode electrode 22d of the other side of the light-emitting diode wafer 22 adjacent to each other in the light-emitting diode wafer 22 are via the wire overlapping portions 22e and 22f, by gold The wires 25 are electrically connected in series. Each of the light-emitting diode wafers 22 is mounted on the base 21 by a translucent wafer bonding material 26 so that the surface on the side of the sapphire substrate 22a faces the mounting of the base 21. As the wafer bonding material 26, a ruthenium resin or the like containing a filler composed of an oxidized metal can be used. By using a light-transmitting material in the wafer bonding material 26, the surface from the sapphire substrate 22a side of the light-emitting diode wafer 22 and the light emitted from the side surface of the light-emitting diode wafer 22 can be reduced. Shadow generation caused by the wafer bonding material 26 is prevented.

Returning to Fig. 4, next, the package member 23 will be described. The package member 23 is formed linearly to package a plurality of the plurality of light-emitting diode chips 22 together. In the present embodiment, since the light-emitting diode wafers 22 are mounted in four rows, four package members 23 are formed. Also, seal Since the package member 23 includes a phosphor as a light wavelength conversion material, it can function as a wavelength conversion layer that can wavelength-convert light from the light-emitting diode wafer 22. As the sealing member 23, a resin containing a phosphor which is obtained by dispersing a predetermined phosphor particle (not shown) and a light diffusing material (not shown) in the resin may be used.

In the case of the phosphor particles, when the light-emitting diode wafer 22 is a blue light-emitting diode wafer that emits blue light, for example, YAG-based yellow phosphor particles can be used to obtain white light. Thereby, a part of the blue light emitted from the light-emitting diode wafer 22 is converted into yellow light by the wavelength of the yellow phosphor particles included in the package member 23. Then, the blue light is not absorbed by the yellow phosphor particles, and the yellow light converted by the wavelength of the yellow phosphor particles is diffused and mixed in the package member 23, and is emitted from the package member 23 into white light. . Further, as the light diffusing material, particles such as silica are used. Further, in the present embodiment, since the light-transmitting base 21 is used, the white light emitted from the package member 23 is transmitted through the inside of the base 21 and also emitted from the back surface of the base 21.

The package member 23 thus constituted can be formed, for example, by coating and hardening a uncured paste-like package member 23 containing a wavelength conversion material in a dispenser.

Further, the sealing member 23 does not necessarily have to be formed of a enamel resin, and may be formed of an inorganic material such as a low melting point glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin. Further, in order to wavelength-convert the light toward the back side of the base 21, the second wavelength conversion material may be formed between the light-emitting diode wafer 22 and the base 21 or the back surface of the base 21 as a second wavelength conversion material. A sintered body film (phosphor film) composed of an inorganic binder (adhesive) such as phosphor particles and glass. In this manner, white light from both surfaces of the base 21 can be released by further forming a phosphor film (second wavelength conversion material).

Next, the metal wiring 24 will be described. The metal wiring 24 is a wiring composed of a metal such as Ag formed on the LED mounting surface (surface), and supplies electric power supplied from the lead 70 to the LED module 20 to each of the light-emitting diode wafers 22. Each of the light-emitting diode chips 22 is electrically connected to the metal wiring 24 via a gold wire 25 .

Moreover, the metal wiring 24 formed around the through hole 21b serves as a power supply portion. The front end portions of the two lead wires 70 penetrate the through holes 21b, and are electrically and physically connected to the metal wires 24 by soldering.

(light head)

As shown in FIGS. 1 to 3, the base 30 is a power receiving unit that receives power for lighting the LEDs of the LED module 20 from the outside, and is mounted, for example, in a slot of the lighting fixture. Where the light bulb shaped luminaire 1 is illuminated, the base 30 receives power from the slot of the luminaire. In the present embodiment, the base 30 receives AC power by two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead.

The base 30 has an E-shape, and a spiral fitting portion for a slot for screwing the illuminating device to the illuminating device is formed on the outer peripheral surface thereof. Further, on the inner circumferential surface of the base 30, a spiral fitting portion for causing the screw to be tightly fitted to the resin case 60 is formed. Further, the base 30 is in the shape of a bottomed cylinder made of metal.

Although the type of the cap 30 is not particularly limited, for example, a spiral type Edison type (E type) can be used, such as an E26 shape or an E17 shape.

(pillar)

As shown in FIGS. 1 to 3, the pillar 40 is a metal trunk that is provided to extend from the vicinity of the opening portion 11 of the bulb 10 toward the inside of the bulb 10.

The pillar 40 functions as a holding member that holds the LED module 20, one end of the pillar 40 is connected to the LED module 20, and the other end of the pillar 40 is connected to the support base 50.

Further, the pillar 40 is made of a metal material and functions as a heat releasing member for discharging heat generated by the LED module 20. In the present embodiment, the pillar 40 is made of aluminum having a thermal conductivity of 237 [W/m‧K]. As described above, since the pillars 40 are made of a metal material, the heat of the LED module 20 is efficiently conducted to the pillars 40 via the bases 21 . Thereby, the heat of the LED module 20 can be transmitted to the base 30 side. As a result, light emission due to temperature rise can be suppressed The luminous efficiency of the diode wafer 22 is lowered and the life is shortened. The detailed configuration of the pillar 40 will be described later.

(support desk)

The support table (support plate) 50 is a support member for supporting the support 40, and is connected to the open end of the opening portion 11 of the bulb 10a as shown in FIG. Further, the support table 50 is also configured to close the opening portion 11 of the bulb 10. In the present embodiment, the support table 50 is fixed to the resin case 60.

The support base 50 is made of a metal material, and in the present embodiment, it is made of aluminum similarly to the support 40. Thereby, heat transferred to the LED module 20 of the pillar 40 can be efficiently conducted to the support table 50. As a result, it is possible to suppress a decrease in luminous efficiency and a shortened life of the light-emitting diode wafer 22 due to an increase in temperature.

Further, in the present embodiment, the support table 50 is constituted by a disk-shaped member having a step portion. The opening end of the opening portion 11 of the bulb 10 abuts against the step portion, thereby closing the opening portion 11 of the bulb 10. Further, in the step portion, the support end 50 and the resin case 60 and the opening end of the opening portion 11 of the bulb 10 are fixed by an adhesive.

(resin housing)

The resin case 60 insulates the post 40 from the base 30 and serves as an insulating case (circuit holder) for holding the lighting circuit 80. As shown in FIGS. 2 and 3, the resin case 60 is composed of a first case portion 61 having a large diameter cylindrical shape and a second case portion 62 having a small diameter cylindrical shape. Since the outer surface of the first case portion 61 is exposed to the outside air, the heat transmitted to the resin case 60 is mainly discharged by the first case portion 61. The second case portion 62 is configured such that its outer peripheral surface is in contact with the inner peripheral surface of the base 30. In the present embodiment, the outer peripheral surface of the second case portion 62 is formed with a screw tightly fitted to the base 30. Joint department. The resin case 60 can be formed, for example, of polybutylene terephthalate (PBT).

(lead)

The two lead wires 70 supply power for lighting the LED module 20 from the lighting circuit 80 to the LEDs. The wires used in the module 20 are used. As shown in FIG. 3, one end of each lead 70 is electrically connected to the power supply portion of the LED module 20, and the other end of each lead 70 is electrically connected to the power output portion of the lighting circuit 80.

(lighting circuit)

The lighting circuit 80 is a circuit unit for lighting the LED module 20 (light emitting diode wafer 22), and is housed in the resin case 60 as shown in FIG. Specifically, the lighting circuit 80 includes a plurality of circuit components and a circuit substrate on which the circuit components are mounted. In the present embodiment, the lighting circuit 80 converts the AC power supplied from the lamp cap 30 into DC power, and supplies the DC power to the LED module 20 (the LED chip 22) via the two leads 70.

Further, the light bulb shaped lamp 1 does not necessarily have to have the lighting circuit 80. For example, when direct DC power is supplied from a lighting fixture or a battery, the light bulb shaped lamp 1 may not have the lighting circuit 80. Further, the lighting circuit 80 is not limited to the smoothing circuit, and a dimming circuit, a boosting circuit, or the like may be appropriately selected or combined.

As described above, the light bulb shaped lamp 1 is constructed. Next, the detailed configuration of the support 40 and the support base 50 in the light bulb shaped lamp 1 of the present embodiment will be described with reference to Figs. 6 and 7 . Fig. 6 is a perspective view showing the configuration of a pillar and a support stand in a light bulb shaped lamp according to an embodiment of the present invention. Fig. 7 (a) is a plan view showing the configuration of the support post and the support base, and Fig. 7 (b) is a front view showing the configuration of the support post and the support base; (c) of Fig. 7 is a view showing the support post and the above Side view of the composition of the support station.

As shown in FIGS. 6 and 7, the support 40 is composed of a main shaft portion (first trunk portion) 41 and a fixed portion (second trunk portion) 42. In the present embodiment, the main shaft portion 41 and the fixing portion 42 are integrally formed.

The main shaft portion 41 is a cylindrical member having a constant sectional area. The end on one side of the main shaft portion 41 is connected to the fixing portion 42, and the other end portion of the main shaft portion 41 is connected to the support base 50.

The fixing portion 42 is fastened between the main shaft portion 41 and the LED module 20, and is connected to the main shaft portion 41. At the same time, it is connected to the LED module 20.

Further, the fixing portion 42 has a fixing surface 42a that is fixed to the base 21 of the LED module 20. The fixing surface 42a is a contact surface between the fixing portion 42 (pillar 40) and the back surface (LED module 20) of the base 21.

Further, the fixing portion 42 has a protruding portion 42b for fitting into the through hole 21a provided in the base 21 of the LED module 20. The protruding portion 42b is provided to protrude from the fixing surface 42a. The protruding portion 42b functions as a position restricting portion that restricts the position of the LED module 20. In other words, the protrusion 42b is configured to determine the arrangement direction of the LED module 20. In the present embodiment, the shape of the protrusion 42b is such that the longitudinal direction coincides with the longitudinal direction of the base 21 and the short side direction A rectangle that coincides with the width direction of the base 21 .

In the present embodiment, as shown in FIG. 7(a), the length W1 of the fixing surface 42a in the longitudinal direction of the LED module 20 is longer than the length of the main shaft portion 41 in the longitudinal direction of the LED module 20. The diameter of the portion 41 Longer, and the length W2 of the fixing surface 42a in the short side direction of the LED module 20 is longer than the length of the main shaft portion 41 in the short side direction of the LED module 20 (the diameter of the main shaft portion 41) )Shorter. For example, it can be determined as: W1=15mm, W2=4.5mm, = 8mm.

Thereby, even if the cross-sectional area of the portion of the pillar 40 directly under the LED module 20 is reduced in order to suppress the light shielding by the pillar 40, the decrease in the envelope volume of the pillar 40 can be suppressed. That is, even if the length W2 of the fixing surface 42a is shortened in order to suppress the blocking of the light of the LED module 20 by the support 40, the contact area with the LED module 20 can be ensured by increasing the length W1 of the fixing surface 42a. . Thereby, it is possible to suppress a decrease in the heat radiation effect of the LED module 20.

Further, in the present embodiment, as shown in FIG. 7(c), in the present embodiment, the two sides in the short-side direction of the LED module of the fixing portion 42 are connected to the flat surface 42c of the LED module 20. And a curved surface 42d connected to the flat surface 42c.

The flat surface 42c is a surface on the side of the LED module 20 on the side surface of the fixing portion 42, that is, a surface parallel to the axis of the support 40 (the axis of the main shaft portion 41). That is, the distance between the flat surface 42c and the axis of the strut 40 Keep it towards the side of the lamp head. By providing the flat surface 42c in the portion directly under the LED module 20 in the fixing portion 42, it is possible to suppress the light from the side of the pillar 40 (the side of the base 30) among the light emitted from the LED module 20 by the support 40 (fixed portion) 42) Structure reflection.

The curved surface 42d is a surface (a surface on the side of the main shaft portion 41) on the side opposite to the LED module 20 side of the one side surface of the fixing portion 42, and is a surface that is curved away from the axis of the support 40 toward the base side (lower side). . That is, the distance between the curved surface 42d and the axis of the strut 40 gradually increases as it goes toward the base of the lamp. As described above, by providing the curved surface 42d in the portion of the fixing portion 42 that is away from the LED module 20, the envelope volume of the pillar 40 (fixing portion 42) can be increased compared to the case where the fixing portion is formed only by the flat surface. Moreover, by providing the curved surface 42d, the light of the LED module 20 can be dropped on the base of the lamp, so that the light of the LED module 20 can be reduced and reflected by the pillar 40 to be incident on the LED module 20.

In this way, since the side surface of the fixing portion 42 is composed of the flat surface 42c and the curved surface 42d, the light radiation of the LED module 20 due to the support of the pillar 40 is suppressed, and the heat radiation effect of the LED module 20 can be maintained. In the present embodiment, the flat surface 42c is set to be about 0.7 mm in the axial direction length L1 of the strut 40, the curved surface 42d is set to be about 5.4 mm in the axial direction length L2 of the strut 40, and the radius of curvature R of the curved surface 42d is set to be 10mm.

Further, by appropriately changing the radius of curvature R of the curved surface 42d, the direction of the reflected light reflected by the fixed portion 42 can be adjusted as desired. Thereby, since the light toward the base 30 side among the light emitted from the LED module 20 can be adjusted, desired light distribution characteristics can be achieved. In particular, by reflecting it from the side of the bulb 10 to the direction of the base side, a wide light distribution angle can be achieved. Moreover, if the length L (L1+L2) of the fixing portion 42 in the axial direction of the strut 40 is increased to such an extent that the light of the LED module 20 is not incident, the curved surface 42d is not provided.

The pillar 40 thus constructed is fixed to the upper surface of the support table 50. Specifically, the main shaft portion 41 of the support post 40 and the upper surface of the support base 50 are attached or fixed by screws or the like. Further, the support base 50 is provided with a through hole 51 through which the lead wire 70 is passed.

Next, the connection relationship between the LED module 20 and the support 40 in the light bulb shaped lamp 1 of the present embodiment will be described in detail using FIG. Fig. 8 is a view for explaining a connection relationship between LED modules and pillars in a light bulb shaped lamp according to an embodiment of the present invention. In Fig. 8, (a) is a plan view of the LED module fixed in the state of the pillar, (b) is a sectional view taken along line BB' of (a), and (c) is a section along (a) Cross-sectional view of the C-C' line cut. Moreover, in FIG. 8, the metal wiring 24 is not illustrated.

As shown in FIG. 8( a ), the LED module 20 and the pillar 40 are arranged such that the fixing surface 42 a of the fixing portion 42 of the pillar 40 does not overlap with the LED wafer 22 in plan view. In the present embodiment, the fixing surface 42a of the fixing portion 42 is configured not to overlap with the sealing member 23 as the light-emitting portion of the LED module 20. That is, the support 40 is disposed such that the fixing surface 42a of the fixing portion 42 is not positioned below the light-emitting diode wafer 22 and the package member 23. In other words, the support 40 is disposed such that the fixing surface 42a of the fixing portion 42 overlaps with the non-light emitting portion of the LED module 20.

Further, as shown in FIGS. 8(b) and 8(c), the LED module 20 is disposed such that the surface of the base 21 (the surface on which the package member 23 is formed) faces the top of the bulb 10. In the present embodiment, the LED module 20 is such that the back surface of the base 21 (the surface on which the package member 23 is not formed) is in surface contact with the fixing surface 42a of the fixing portion 42 of the support 40, and the base 21 is directly fixed to the support. 40. Further, the protruding portion 42b of the stay 40 is fitted to the through hole 21b of the base 21, whereby the position of the LED module 20 is restricted and the posture of the LED module 20 is fixed.

Further, although not shown, an adhesive is applied between the back surface of the base 21 and the fixing surface 42a of the fixing portion 42, whereby the support 40 and the base 21 are fixed. As the adhesive, for example, an adhesive made of enamel resin can be used. However, in order to efficiently conduct the LED module 20 to the support 40, it is preferable to use an adhesive having a high thermal conductivity. For example, the thermal conductivity can be improved by dispersing metal fine particles or the like in the resin.

Next, the effect of the light bulb shaped lamp 1 of the present embodiment will be described with reference to FIG. Fig. 9 is a view showing a state at the time of lighting of a light bulb shaped lamp according to an embodiment of the present invention.

As shown in FIG. 9, when the bulb-shaped lamp 1 is lit, the LED chip 22 of the LED module 20 emits light, and the LED module 20 radiates light to the surroundings. Specifically, the light emitted from the light-emitting diode wafer 22 is radiated toward the upper side, the side, and the lower side of the light-emitting diode wafer 22, and the package member 23 becomes white light, and the LED module 20 is centered on the whole. Radiation around. Among them, a part of the light emitted from the back side of the base 21 is reflected by the support 40 and shielded. That is to say, shadows are generated by the pillars 40.

In the present embodiment, the fixing surface 42a of the fixing portion 42 of the stay 40 does not overlap the light-emitting diode wafer 22 in a plan view (when viewed from the top of the bulb 10 toward the base 30). That is, the pillar 40 is not present directly under the LED module 20 in which the light output is the strongest. Thereby, since the light of the LED module 20 can be suppressed from being shielded by the support 40, the light extraction efficiency of the LED module 20 toward the base can be improved.

In particular, in the present embodiment, the fixing surface 42a of the pillar 40 does not overlap with the sealing member 23 as the light-emitting portion in plan view. Thereby, since the light of the LED module 20 can be further blocked by the support 40, the light extraction efficiency of the LED module 20 toward the base can be further improved.

Further, in the present embodiment, the side surface directly below the LED module 20 of the fixing portion 42 is a flat surface 42c, and the side surface continuing to the lower portion of the flat surface 42c of the fixing portion 42 is a curved surface 42d. Thereby, while the light shielding of the LED module 20 by the support 40 is suppressed by the flat surface 42c, the envelope volume can be ensured by the curved surface 42d, and the heat release effect of the LED module 20 can be ensured.

Furthermore, by providing the curved surface 42d, it is possible to reduce the light reflected by the LED module 20 from being reflected by the pillar 40 and being incident on the LED module 20 again. In other words, when the fixing portion 42 does not have the curved surface 42d and is composed only of the flat surface 42c, the height difference between the fixed portion 42 and the main shaft portion 41 and the base portion 21 is generated, and The surface of the step (the exposed upper surface of the main shaft portion 41) causes the light of the LED module 20 to be reflected and is again incident on the LED module 20. On the other hand, as in the present embodiment, since the curved surface 42d is provided, the light of the LED module 20 is reflected by the curved surface 42d, and falls under the pillar 40, so that it can be suppressed. Re-incident of the light of the LED module 20 caused by the reflection of the pillars 40. Thereby, color deviation or the like due to re-injection of light can be suppressed.

Here, in the light bulb shaped lamp 1 according to the embodiment of the present invention, the relationship between the length L of the fixing portion 42 and the light beam will be described with reference to FIG. Fig. 10 is a view for explaining the relationship between the length of the fixing portion and the light beam in the light bulb shaped lamp according to the embodiment of the present invention. Further, in Fig. 10, the length L of the fixing portion on the horizontal axis is the axial length L (L1 + L2) of the strut 40 of the fixing portion 42 in Fig. 7 (c). Further, the light beam on the vertical axis indicates the light beam toward the base of the LED module 20, and is set to 100% when L=0.

As shown in Fig. 10, it is understood that when the length L of the fixing portion 42 is increased, the light beam is increased as compared with the case where L = 0 (when there is no fixing portion). On the other hand, it is also understood that if the length L of the fixing portion 42 exceeds 6 mm, the light beam will not increase (slowly increase). Therefore, in order to increase the light beam, it is preferable that the pillar 40 is not present within a predetermined range directly under the LED module 20. As shown in FIG. 10, it is preferably configured to be within 6 mm below the base 21. There is no strut 40.

(Modification)

Next, a modification of the light bulb shaped lamp of the above embodiment will be described below with reference to the drawings. The difference between the light bulb shaped lamp of each modification described below and the light bulb shaped lamp 1 of the above-described embodiment is that the shape of the fixing portion of the pillar is different. Further, since the other configurations are the same as those of the above-described embodiment, detailed descriptions thereof will be omitted.

(Modification 1)

First, a modification 1 of the present invention will be described using FIG. 11A. Fig. 11A is a view showing the configuration of an LED module and a pillar in a light bulb shaped lamp according to a first modification of the present invention.

As shown in Fig. 11A, in the light bulb-shaped lamp according to the first modification of the present invention, the fixing portion 42A of the stay 40A has a conical trapezoidal shape and becomes an inclined surface (push-out tapered surface) of the fixing portion 42A. It is inclined so as to be away from the axis of the strut 40A toward the side of the cap side. That is, the fixing portion 42A The distance between the surface and the axis of the strut 40A gradually increases toward the base of the lamp.

In the present modification, since the pillar 40A is not present under the light-emitting diode wafer 22 and the package member 23, the light extraction efficiency of the LED module 20 toward the base can be made in the same manner as described above. improve.

However, in the present modification, since the area of the fixing surface 42a of the fixing portion 42A is smaller than the area of the fixing surface 42a of the fixing portion 42 in the above-described embodiment, the LED is compared with the above-described embodiment. The heat release of the module 20 is slightly lowered.

(Modification 2)

Next, a second modification of the present invention will be described using FIG. 11B. Fig. 11B is a view showing the configuration of an LED module and a pillar in a light bulb shaped lamp according to a second modification of the present invention.

As shown in Fig. 11B, in the light bulb shaped lamp according to the second modification of the present invention, the fixing portion 42B of the stay 40B is composed of a cylindrical portion 42B1 and a truncated cone portion 42B2. The diameter of the cylindrical portion 42B1 is the same as the diameter of the upper surface of the truncated cone portion 42B2, and is smaller than the diameter of the lower surface of the truncated cone portion 42B2. Further, the diameter of the lower surface of the truncated cone portion 42B2 is the same as the diameter of the main shaft portion 41. Further, the side surface of the truncated cone portion is an inclined surface (push-out tapered surface) that is inclined away from the axis of the strut 40B.

In the present modification, the pillar 40B is not present under the LED wafer 22 and the package member 23, so that the light extraction efficiency of the LED module 20 toward the base can be improved. Further, in the present modification, since the portion of the support 40B that is fixed to the LED module 20 is the cylindrical portion 42B1 having a small diameter, the light of the LED module 20 toward the base can be taken out compared with the modification 1. Efficiency is further improved.

However, in the present modification, as in the first modification, the area of the fixing surface 42a of the fixing portion 42B is also smaller than the area of the fixing surface 42a of the fixing portion 42 in the above-described embodiment. In the present modification, the heat dissipation of the LED module 20 may be slightly lower than that of the above embodiment. Micro drop.

(Modification 3)

Next, a modification 3 of the present invention will be described using FIG. 11C. Fig. 11C is a view showing the configuration of an LED module and a pillar in a light bulb shaped lamp according to a third modification of the present invention.

As shown in Fig. 11C, in the light bulb shaped lamp according to the third modification of the present invention, the fixing portion 42C of the stay 40C is entirely composed of a cylindrical member having a small diameter. Moreover, in the present modification, the diameter of the fixing portion 42C is the same as the diameter of the cylindrical portion 42B1 in the second modification.

In the present modification, the pillar 40C is not present under the LED wafer 22 and the package member 23, so that the light extraction efficiency of the LED module 20 toward the base can be improved. Further, in the present modification, since the entire fixing portion 42C of the support post 40C has a small diameter, the light extraction efficiency of the LED module 20 toward the base can be further improved as compared with the second modification.

However, in the present modification, since the volume of the fixing portion 42C is smaller than that of the modifications 1 and 2, the heat dissipation property of the LED module 20 is slightly lowered as compared with the modifications 1 and 2.

(Modification 4)

Next, a modification 4 of the present invention will be described using FIG. 11D. Fig. 11D is a view showing the configuration of an LED module and a pillar in a light bulb shaped lamp according to a fourth modification of the present invention.

As shown in FIG. 11D, in the light bulb shaped lamp according to the fourth modification of the present invention, the length of the LED module 20 of the fixing portion 42D in the longitudinal direction is longer than the diameter of the main shaft portion 41. In other words, in the modification, in the first modification, the fixing portion is formed to extend in the longitudinal direction of the LED module 20.

In the present modification, since the support 40D is not present under the light-emitting diode wafer 22 and the package member 23, the light extraction efficiency of the LED module 20 toward the base can be improved. Further, in the present modification, since the fixing portion 42D is extended, and due to the surface of the fixing surface 42a Since the product becomes large, it is possible to suppress the deterioration of heat dissipation as in the first to third modifications.

In the present modification, as in the first embodiment, while suppressing the light of the LED module 20 due to the support 40D, the heat radiation effect of the LED module 20 can be maintained.

Although the light bulb shaped lamp of the present invention has been described above based on the embodiment and the modifications, the present invention is not limited to the embodiments and modifications.

For example, in the above-described embodiments and modifications, the LED module 20 is configured by emitting white light by a blue LED and a yellow phosphor, but is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used, and white light may be emitted by combining it with a blue LED.

Further, as the light-emitting diode wafer 22, an LED that emits a color other than blue may be used. For example, when a light-emitting diode wafer in which ultraviolet light is emitted is used as the light-emitting diode wafer 22, it is also possible to use, as the phosphor particles, a combination of phosphor particles of three colors (red, green, and blue). Further, a wavelength conversion material other than the phosphor particles may be used. For example, a wavelength conversion material may be used, and a semiconductor, a metal complex, an organic dye, a pigment, or the like may be used, and light having a certain wavelength may be absorbed and emitted and absorbed. The material of the light material of different wavelengths of light.

Further, in the above-described embodiments and modifications, although the LED is exemplified as the light-emitting element, a semiconductor light-emitting element such as a semiconductor laser or an EL such as an organic EL (Electro Luminescence) or an inorganic EL may be used. Components, and other solid state light emitting components.

Further, in the above-described embodiments and modifications, the LED module 20 is configured to have a COB type in which a light-emitting diode wafer is directly mounted on the base 21, but the present invention is not limited thereto. For example, an LED module in which a plurality of SMD type LED elements are mounted on a substrate by using a package type, that is, a surface mount type (SMD) LED element, can be used. In the above package type, a light-emitting diode wafer is mounted in a resin-molded container (hole), and a resin containing a phosphor is sealed in a recess of the container.

Moreover, the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp. For example, as shown in FIG. 12, the lighting device 2 according to the present invention may be configured to include the above-described light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 3 to which the light bulb shaped lamp 1 is attached. At this time, the lighting fixture 3 is an article for turning off and lighting the light bulb shaped lamp 1, and includes, for example, an instrument body 4 attached to the ceiling and a lamp cover 5 covering the light bulb shaped lamp 1. The appliance body 4 has a slot 4a for supplying power to the bulb-shaped lamp 1 while the lamp cap 30 of the bulb-shaped lamp 1 is mounted. Further, a translucent plate may be provided in the opening of the globe 5.

Other embodiments of the present invention can be applied to the embodiments and modifications without departing from the spirit and scope of the invention. The form constructed in combination is also included in the scope of the present invention.

[The possibility of industrial utilization]

The present invention can be used as a light bulb-shaped lamp such as a white heat bulb, and can be widely used in lighting devices and the like.

20‧‧‧LED module

21‧‧‧Abutment

22‧‧‧Light Emitter Wafer

23‧‧‧Package components

40‧‧‧ pillar

41‧‧‧Spindle Department

42‧‧‧ Fixed Department

42a‧‧‧Fixed surface

42b‧‧‧Protruding

B-B’, C-C’‧‧‧ hatching

Claims (9)

A light bulb shaped lamp having a lamp ball and a lamp cap, the bulb type lamp comprising: a metal pillar extending toward the inner side of the lamp ball; and a light emitting module disposed in the lamp ball and fixed to the pillar; The light-emitting module has a light-transmitting base and a light-emitting component mounted on the base; the pillar has a fixed surface fixed to the base of the light-emitting module; the light-emitting module and the pillar are The fixing surface is disposed so as not to overlap the light-emitting element in plan view. The light bulb-shaped lamp of claim 1, wherein the light-emitting module further comprises a package member for encapsulating the light-emitting component; the package member comprises: a wavelength conversion material for converting light emitted by the light-emitting component a wavelength; and a resin containing the wavelength conversion material; the package member is formed so as not to overlap the fixing surface in a plan view. The light bulb-shaped lamp of claim 1 or 2, wherein the light-emitting module has an elongated shape in a plan view; the pillar has a main shaft portion and a fixing portion, and the fixing portion is at the main shaft portion and the light-emitting mold Between the groups, the fixing surface; the length of the fixing surface in the longitudinal direction of the light emitting module is longer than the length of the main shaft portion in the longitudinal direction of the light emitting module; the fixing surface is in the light emitting mode The length of the short side direction of the group is shorter than the length of the main shaft portion in the short side direction of the light emitting module. The light bulb shaped lamp of claim 3, wherein the side of the fixing portion comprises: a flat surface connected to the light emitting module and parallel to the axis of the pillar; and a curved surface, the connection Behind the flat surface, and bend away from the axis of the pillar toward the side of the lamp cap. The light bulb shaped lamp of claim 3, wherein the side surface of the fixing portion includes an inclined surface which is inclined so as to be closer to the axis of the pillar toward the base of the lamp. The light bulb shaped lamp of claim 1, wherein the base is a ceramic substrate composed of Al ₂ O ₃ , AlN or MgO. The light bulb shaped lamp of claim 1, wherein the pillar is made of aluminum. The light bulb shaped lamp according to claim 1, further comprising: a lead wire for supplying electric power to the light emitting element, and an insulating case for accommodating a lighting circuit for lighting the light emitting element. A lighting device comprising the light bulb shaped luminaire of claim 1.