WO2013014822A1 - Lamp and lighting device - Google Patents

Lamp and lighting device Download PDF

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Publication number
WO2013014822A1
WO2013014822A1 PCT/JP2012/000991 JP2012000991W WO2013014822A1 WO 2013014822 A1 WO2013014822 A1 WO 2013014822A1 JP 2012000991 W JP2012000991 W JP 2012000991W WO 2013014822 A1 WO2013014822 A1 WO 2013014822A1
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WO
WIPO (PCT)
Prior art keywords
rod
case
lamp
led
led module
Prior art date
Application number
PCT/JP2012/000991
Other languages
French (fr)
Japanese (ja)
Inventor
亨 岡崎
次弘 松田
利雄 森
直紀 田上
考志 大村
裕之 宮宅
堀内　誠
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2012524943A priority Critical patent/JP5074639B1/en
Publication of WO2013014822A1 publication Critical patent/WO2013014822A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp and a lighting device using a light emitting element such as a light emitting diode (LED) as a light source.
  • a light emitting element such as a light emitting diode (LED)
  • an LED lamp a lamp using high-efficiency long-life LED (hereinafter referred to as an LED lamp) has been proposed as a bulb-shaped lamp replacing a incandescent lamp.
  • a mounting substrate on which a large number of LEDs are mounted is attached to an end portion of the case, and a circuit unit for emitting the light of the LED is housed in the case (Patent Document 1).
  • While the electronic components that make up the circuit unit include components that are susceptible to heat load, the LEDs generate heat when they emit light. Electronic components that are weak to heat load may become unstable in operation or have a short life due to the heat at the time of LED light emission.
  • Non-patent Document 2 a heat dissipation groove is provided on the surface of the case (Patent Document 2), or the case is made of metal which is a good thermal conductive material, and the heat of the LED is conducted to the base and the heat is accumulated in the case (See Non-patent Document 1 (page 12)).
  • JP 2006-313717 A JP, 2010-003580, A
  • the calorific value of the LED increases with the increase in luminance, and the case is enlarged in order to release and transfer the heat.
  • the increase in size of the case leads to the increase in size of the LED lamp and can not be applied to existing lighting devices.
  • An object of the present invention is to provide a lamp of a new configuration that can cope with high brightness without causing an increase in size of the lamp.
  • a light emitting element as a light source is supported by a support member inside the glove, and a case with a cap attached is attached to the end of the glove
  • the glove comprises a container with a lid member closing an opening on the end side, and a fluid having a thermal conductivity higher than air is enclosed in the container, the support
  • the member is composed of a plurality of rod-like members, and one or more of the rod-like members are led out from the container, and the leading end thereof is thermally joined to at least one of the case or the base. It is characterized by
  • the fluid having a thermal conductivity higher than that of air is sealed in the valve, the heat generated from the light emitting element can be conducted to the valve by the fluid. As a result, the heat at the time of light emission can be dissipated to the outside using the bulb.
  • the leading end of the rod-like member leading out from the valve is connected to at least one of the case or the base, the heat which could not be transmitted to the valve through the fluid from the rod-like member outside the valve It can be transmitted to at least one side.
  • FIG. 1 It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. It is sectional drawing of a LED lamp.
  • A is a plan view showing the structure of the LED module
  • (b) is a cross-sectional view taken along the line AA 'in (a)
  • (c) is a view taken along the line BB' in (a)
  • FIG. It is a perspective view which shows the mode of the heat exchanger plate in a case, (a) is the figure which looked at the heat exchanger plate from the upper side, (b) is the figure which looked at the heat exchanger plate from the lower side. It is a figure explaining manufacture of a stem. It is a figure explaining the assembly process of a lamp
  • FIG. 1 It is a figure explaining the assembly process of a lamp
  • A is a figure explaining the fixing method concerning Example 1
  • an upper figure is a perspective view of the state before fixing a rod-shaped member, and a lower figure is equivalent to the CC 'line of the upper figure after fixing.
  • B is a figure explaining the fixing method concerning Example 2
  • an upper figure is a perspective view of the state before fixing a rod-shaped member
  • the following figure is a perspective view in the state after fixing
  • 6 is a cross-sectional view taken along the line DD 'in the upper view.
  • (A) is a figure explaining the supporting method concerning Example 3, (a-1), (a-2) is a perspective view which shows a supporting state, (a-3) is (a-1), It is an EE 'line arrow sectional view of (a-2), (b) is a figure explaining the support method concerning Example 4, (b-1), (b-2) is a support state. It is a perspective view which shows, (b-3) is the FF 'line arrow directional cross-sectional view of (b-1) and (b-2).
  • the upper view in (a) is a perspective view for explaining the form of the rod-like member according to example 5, the lower view is a cross-sectional view taken along the line GG 'in the upper view, and the upper view in (b) is an example 6 It is a perspective view explaining the form of the rod-shaped member which concerns on (a), and the lower figure is a HH 'arrow arrow sectional view of an upper figure.
  • (A) is a perspective view explaining the supporting method of the LED module in Example 5,
  • (b) is an II 'arrow directional cross-sectional view of (a),
  • (c) is J of (a) It is a -J 'arrow sectional view. It is sectional drawing of a LED lamp. It is the schematic of the illuminating device which concerns on this invention.
  • FIG. 1 is a perspective view showing the structure of the LED lamp 1 according to the first embodiment.
  • FIG. 2 is a cross-sectional view of the LED lamp 1.
  • the LED lamp 1 includes a valve 3 in which a fluid having a higher thermal conductivity than air is enclosed, a case 5 mounted at one end of the valve 3, and a base provided on the case 5. 7, a rod-shaped member 9 extending through the bulb 3 into the case 5, and an LED module 11 provided at the inner end of the bulb 3 of the rod-shaped member 9.
  • the case 5 inner end of the rod-shaped member 9 is the case I am in contact with 5.
  • the LED lamp 1 stores a circuit unit 13 for receiving power through the base 7 to cause the LED module 11 to emit light in a case 5 and has an overall shape similar to a conventional incandescent bulb.
  • FIG. 3 is a view showing the structure of the LED module 11.
  • (A) is a plan view of the LED module 11,
  • (b) is a sectional view taken along the line AA 'in (a) of the same figure,
  • (c) is a BB in (a) of the same figure It is a line arrow sectional view.
  • the LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 covering the plurality of LEDs 23, as shown in FIGS. Prepare.
  • the mounting substrate 21 has a rectangular shape in plan view, and is made of, for example, a light transmitting material such as glass or alumina so that the light emitted downward from the LED 23 can be transmitted. It is configured.
  • the mounting substrate 21 has a connection pattern 27 a for connecting a plurality of LEDs 23 (series connection or / and parallel connection) and a terminal pattern 27 b for connection to lead wires 67 and 69 connected to the circuit unit 13. , And 27c.
  • the conductive path 27 also uses a transparent electrode such as ITO so that the light from the LED 23 can be transmitted.
  • the lead wires 67 and 69 are connected by solder 31 to the terminal patterns 27b and 27c at the tip end portions of the mounting substrate 21 which pass through the through holes 29 from the lower side to the upper side.
  • the LEDs 23 are mounted on the mounting substrate 21 in the form of so-called chips. As shown in FIG. 3, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). The number, arrangement, and the like of the LEDs 23 are appropriately determined according to the luminance and the like required of the LED lamp 1.
  • the sealing body 25 is made of, for example, a translucent material such as a silicone resin, covers the LEDs 23 arranged in two rows in row units, and prevents the entry of air and moisture into the LEDs 23.
  • the sealing body 25 has a wavelength conversion function when the wavelength of the light emitted from the LED 23 needs to be converted.
  • the wavelength conversion function can be implemented, for example, by mixing a wavelength conversion material such as phosphor particles into the light transmitting material.
  • the LED 23 emits blue light
  • the wavelength conversion material converts blue light into yellow light
  • the LED module 11 emits white light mixed with blue light emitted from the LED 23 and yellow light wavelength-converted by the wavelength conversion material.
  • the bulb 3 has a glove 35 having an opening, and a stem 37 that closes the opening of the glove 35 in an airtight manner in a state where the LED module 11 is stored substantially in the center of the glove 35.
  • Helium (He) gas which has a higher thermal conductivity than air, is enclosed. Thereby, the heat of the LED module 11 at the time of lighting can be efficiently transmitted to the globe 35.
  • the glove 35 is a so-called A type, and is made of a glass material which is a translucent material. As shown in FIG. 2, the globe 35 has a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and the lower end opening of the cylindrical portion 35 b is sealed by the stem 37. ing.
  • the stem 37 is a so-called flare type, and is made of a glass material which is a translucent material.
  • the stem 37 is provided with an exhaust pipe 39 used for exhausting the inside of the valve 3 and as a support for supporting the LED module 11 and lead wires 67 and 69 for supplying power to the LED module 11.
  • the rod-like members 9 that function are respectively sealed.
  • Bonding of the stem 37 and the globe 35 is performed by heating the bonding target site of the two and melting the glass material of the site.
  • Bar member 9 (support member) The rod-like member 9 is sealed at its middle portion to the stem 37 in a state of extending in the vertical direction, and the stem 37 is attached to the globe 35 so as to penetrate the valve 3.
  • the rod-like member 9 is made of a metal material, for example, a dumet material.
  • the rod-like members 9 are plural (here, four), and the end portion located in the bulb 2 supports the LED module 11.
  • the support of the LED module 11 is performed by bonding the end portions of the four rod-like members 9 to a portion close to the four corners of the LED module 11 having a rectangular shape in a plan view. Bonding of the rod-like member 9 is performed by the adhesive 43 in a state where the end of the rod-like member 9 is inserted into the recess 41 of the mounting substrate 21 of the LED module 11, as shown in FIG.
  • the lower end portion of the rod-like member 9 is thermally connected to the heat transfer plate 15 in contact with the case 5.
  • the heat of the LED module 11 at the time of lighting is taken out of the bulb 3 through the rod member 9, and the taken out heat is dissipated from the heat transfer plate 15 to the case 5, the base 7, and the socket of the lighting device heat.
  • the case 5 has a cylindrical shape made of a resin material such as polybutylene terephthalate (PBT), and the half on the globe 35 in the central axis direction is the large diameter portion 5a and the half on the mouth ring 7 is the small diameter portion 5b. There is.
  • PBT polybutylene terephthalate
  • the large diameter portion 5 a is mounted in a state of being externally fitted to the lower end portion of the valve 3, and the small diameter portion 5 b is flanged by a base 7.
  • a male screw is formed on the outer periphery of the small diameter portion 5b, and is screwed with the female screw of the Edison type mouthpiece 7.
  • FIG. 4 is a perspective view showing the heat transfer plate in the case, in which (a) is a view of the heat transfer plate from above, and (b) is a view of the heat transfer plate from below.
  • the heat transfer plate 15 is made of a material having excellent thermal conductivity, in this case, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 5 a of the case 5. As shown in the figure, the heat transfer plate 15 includes two lead wires 67 and 69 for connecting the LED module 11 and the circuit unit 13 on the circumference centered on the through hole 46 for the exhaust pipe 39. The through holes 45 and the four through holes 47 for the rod-like member 9 are provided at an equal pitch.
  • the lead wires 67 and 69 pass through the through holes 45 as they are, and the rod-like member 9 is fixed to the lower surface of the heat transfer plate 15 with the adhesive 49 in a state where the lower end portion protrudes slightly from the through holes 47.
  • the heat transfer plate 15 has a small diameter portion 15a on the upper side and a large diameter portion 15b on the lower side, the outer peripheral surface of the small diameter portion 15a is on the inner peripheral surface of the stem 37, and the outer peripheral surface of the large diameter portion 15b is on the case 5 It adheres to the inner peripheral surface via an adhesive (either inorganic type or organic type) 51. Thus, a heat conduction path from the LED module 11 to the case 5 via the rod-like member 9 and the heat transfer plate 15 is established.
  • the circuit unit 13 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55, and the commercial power (AC) received through the base 11 by the various electronic components 57 and 58 is A rectifying circuit for rectifying and a smoothing circuit for smoothing rectified DC power are configured.
  • the rectifying circuit is constituted by the diode bridge 57 on the upper surface side of the circuit board 55, the smoothing circuit is constituted by the capacitor 58 on the lower surface side of the circuit board 55, and the main body of the capacitor 58 is positioned inside the base.
  • the circuit board 55 is fixed by the locking means 59 inside the case 5. Specifically, the peripheral edge portion of the lower surface of the circuit board 55 abuts on the step portion 59a inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 59b.
  • a plurality of (for example, four) locking portions 59b are formed at intervals (for example, equally spaced) in the circumferential direction, and the locking portions 59b protrude toward the central axis of the case 5 as they approach the step portion 59a. .
  • the circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69.
  • Base 7 The base 7 has a function of attaching the LED lamp 1 to the luminaire, and also has a function of electrically connecting to a commercial power source.
  • the base 7 is an Edison type used for incandescent light bulbs, and has a cylindrical shell portion 71 having a screw-like peripheral wall, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.
  • One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the opening end of the lower end of the small diameter portion 5 b of the case 5 and fitted to the fixing groove 5 c of the case 5 to the shell portion 71 It is connected to the shell part 71 by being covered.
  • the other lead wire 63 is connected to the eyelet portion 75 by soldering.
  • the cap 7 is attached to the case 5 with the upper end portion of the shell portion 71 caulked in a state where the shell portion 71 is screwed to the small diameter portion 5 b of the case 5.
  • FIG. 5 is a view for explaining the manufacture of the stem
  • FIGS. 6 and 7 are views for explaining the process of assembling the lamp.
  • the flared tube 81, the narrow tube 83 for the exhaust tube 39, the two metal wires 85 for the lead wires 67 and 69, and the metal rod for the rod member 9 as shown in FIG. Prepare the tube 87, place the upper end of the capillary tube 83 at the upper part in the flared tube 81, and insert two metal wires 85 and four metal rods 87 from one end of the flared tube 81.
  • the upper portion of the flared tube 81 is heated by the burner 89.
  • the upper portion of the melted flared tube 81 and the upper end portion of the thin tube 83 are deformed and melted, and the melted glass material wraps between the two metal wires 85 and the four metal rods 87, and the flared tube 81
  • the opening 81a at the top of is closed.
  • the stem 37 in which the flared tube 81 and the thin tube 83 are welded is completed and the metal wire 85 and the metal rod 87 are sealed to the stem 37.
  • the mount 93 and the LED module 11 are prepared, and the four metal rods 87 are inserted into the recess 41 of the mounting substrate 21 (see FIG. 3C).
  • the tip end portion 87 is fixed to the mounting substrate 21 by the adhesive 43.
  • the LED module 11 is supported by the metal rod 87.
  • the LED module 11 of the mount 93 with the LED module 11 is inserted into the globe 35, the periphery of the stem 37 and the open end of the globe 35 are abutted together, and the abutment portion is heated by the burner 89 And the glove 35 are welded.
  • the valve 3 is completed, and after exhaust gas / helium gas is enclosed in the valve 3 using the exhaust pipe 39, the exhaust pipe 39 is chip-off sealed.
  • the capillary 83 serves as an exhaust pipe 39 when the inside of the valve 3 is evacuated or the like.
  • the exhaust pipe 39 extending from the lower end of the valve 3, the two metal wires 85, and the four metal rods 87 are used as the metal plate 95 for the heat transfer plate 15.
  • the metal plate 95 is passed through the corresponding through holes 95a, 95b, 95c, and the metal plate 95 is brought close to the valve 3 to fix the inner peripheral surface of the lower end of the valve 3 and the outer periphery of the small diameter portion of the metal plate 95 with the adhesive 51.
  • the circuit unit 13 is stored in the case 5, and after the two metal wires 85 are connected to the circuit board 55, the case 5 is fixed to the lower end portion of the valve 3 with the adhesive 51.
  • the case 5 and the metal plate 95 are connected and the heat of the LED module 11 (not lit yet) can be transmitted to the case 5, the metal rod 87 and the metal plate 95 are the heat transfer plate 9 and the heat transfer plate It will be 15.
  • the LED lamp 1 is completed.
  • the metal wires 85 and the like are electrically connected to the circuit unit 13 and the LED module 11 to form lead wires 67 and 69 and the like. 4.
  • the LED module 11 is provided in the bulb 37 at a position corresponding to the light source (filament) position of the incandescent lamp. Thereby, the light emission center of LED lamp 1 can be closely approached to the light emission center of the conventional incandescent lamp.
  • the LED module 11 is configured using the translucent mounting substrate 21, the light emitted downward from the LED 23 passes through the mounting substrate 21 and is emitted from the bulb 3 to the outside.
  • the support member for the LED module 11 is constituted by the four rod-like members 9, so that the light emitted obliquely downward from the LED 23 can be less blocked by the rod-like members 9. 5.
  • Heat Dissipation Characteristic The LED lamp 1 according to the present embodiment releases the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths. (1) Heat generated by the LED 23 The heat generated by the LED 23 is transmitted from the LED module 11 to the globe 35 via the helium gas in the bulb 3 (this is the first path), and further, the rod shape from the LED module 11 It is transmitted to the glove 35 via the member 9 and the stem 37 (second path). The heat conducted to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection and radiation.
  • the heat transfer function can be significantly improved over the structure in which the heat of the LED 23 is conducted through the air in the globe. it can.
  • the LED module 11 is disposed approximately at the center of the spherical portion 35 a of the globe 35, heat can be easily conducted evenly to helium in the bulb 3, and the size of the globe 35 resembles the glass bulb 3 of the incandescent bulb Since the shape is adopted, the envelope area of the glove 35 is increased, and the heat radiation characteristic from the glove 35 to the atmosphere can be enhanced.
  • the heat of the LED 23 is transmitted from the LED module 11 to the case 5 and the base 7 via the rod-like member 9 and the heat transfer plate 15 (a third path).
  • the heat of the case 5 is released to the atmosphere by conduction, convection, and radiation, and is further transmitted to the base 7.
  • the heat transmitted to the base 7 is transmitted from the socket to the lighting apparatus side.
  • the heat remaining in the LED module 11 is a member other than the bulb 3 and still high temperature It can transmit to the case 5 and the nozzle
  • FIG. (2) The heat generated from the heat circuit unit 13 generated in the circuit unit 13 is transferred to the case 5 by heat transfer, convection and radiation. Part of the heat transferred to the case 5 is released from the case 5 to the outside by heat transfer, convection and radiation, and the remaining heat is transferred from the base 7 to the socket on the lighting apparatus side.
  • the size and shape of the globe 35 are matched to those of an incandescent lamp, and the LED module 11 is provided substantially at the center of the globe 35, so the distance between the LED module 11 and the circuit unit 13 becomes large.
  • the thermal load that the unit 13 receives from the LED 23 can be reduced.
  • the heat storage amount of the case 5 is reduced, so that the amount of heat transferred from the LED 23 through the rod-like member 9 can be increased, and the luminance of the LED lamp 1 can be increased. 6.
  • the fixing method of a LED module and a rod-shaped member The rod-shaped member, the LED module, and the other example in a fixing method are demonstrated.
  • FIG. 8 is a figure explaining the fixing method based on Example 1,
  • the upper figure is a perspective view of the state before fixing a rod-shaped member
  • the lower figure is CC 'of the upper figure after fixing. It is an arrow sectional view in the position equivalent to a line
  • (b) is a figure explaining the fixing method concerning Example 2
  • an upper figure is a perspective view in the state before fixing a rod-shaped member
  • a lower figure is a figure.
  • FIG. 10 is a cross-sectional view taken along the line DD ′ in the upper view, after being fixed.
  • Example 1 In the fixing method of Example 1, as shown in (a) of FIG. 8, with the end portion 103 of the rod-like member 101 inserted through the through hole 107 of the LED module 105, the tip 103 of the rod-like member 101 is LED module 105 Is fixed by an adhesive 109 or the like.
  • the through holes 107 for the rod-like member 9 can also be formed simultaneously, and the solder 31 for connecting the lead wires 67 and 69 is used. It can also be used as an adhesive for fixing the rod-like member 9.
  • Example 2 In the fixing method of Example 2, as shown in (b) of FIG. 8, the tip end portion 113 of the rod-like member 111 is fixed to the LED module 115 by the pin 119 inserted through the through hole 117 of the LED module 115 from the upper side. Also in the case of this example, when forming the through holes 29 for the lead wires 67 and 69, the through holes 117 for the pins 119 can also be formed at the same time.
  • the end 113 of the rod-like member 111 is larger than the diameter of the through hole 117, and the end surface supports the LED module 115 from the lower side. 7. Support Method of LED Module Another example of the support method of the LED module by the rod-like member will be described.
  • FIG. 9 is a figure explaining the supporting method concerning Example 3, (a-1), (a-2) is a perspective view which shows a supporting state, (a-3) is (a-). 1) and (a-2) are cross-sectional views taken along the line EE 'of (a-2), (b) is a view for explaining a supporting method according to Example 4, (b-1) and (b-2) are It is a perspective view which shows a support state, (b-3) is the FF 'line arrow directional cross-sectional view of (b-1) and (b-2).
  • Example 3 In the supporting method of Example 3, as shown in FIG. 9A, the end of the rod-like member 121 is joined to the holding member 125 for holding the end of the LED module 123, whereby the rod-like member 121 is an LED module It supports 123.
  • the gripping members 125 are provided at the ends of the short side of the LED module 123 having a rectangular shape in plan view, and one may be provided at each end as in the example of (a-1), (a There may be a plurality (two in this case) on each side as in the example of -2).
  • the holding member 125 is made of metal or resin material, has a U-shaped cross section, and a pair of contact parts 127a and 127b that contact the upper and lower surfaces of the LED module 123, and a pair of contact parts 127a, And a connecting portion 127c connecting the end portions of 127b.
  • the distance between the pair of contact portions 127a and 127b decreases as the distance from the connecting portion 127c increases, and when the LED module 123 is attached to the LED module 123, the distance between the pair of contact portions 127a and 127b Spreads.
  • the fixing means 135 is provided at an end of the short side of the LED module 11 having a rectangular shape in plan view, and one fixing means may be provided at each end as in the example of (b-1), There may be a plurality (two in this case) on each side as in the example of -2).
  • the fixing means 135 is a screw that is a connector that connects the contact member 137 and the LED module 131 with the contact member 137 having a pair of contact parts 137a and 137b that contact the upper and lower surfaces of the end of the LED module 131. And 139.
  • a through hole for the screw 139 is formed in the upper contact portion 137a, and a screw hole for the screw 139 is formed in the lower contact portion 137b.
  • the contact member 137 includes, in addition to the contact portions 137a and 137b, a connection portion 137c connecting the end portions with each other, and has a U-shaped cross section.
  • the connector uses the screw 139 in this example, a rivet, a pin or the like can be used, and an adhesive can also be used.
  • the bonding between the fixing means 135 and the rod-like member 131 uses an adhesive as in the third embodiment, but welding can also be performed when the contact member 137 is metal. 8. Aspect of rod-shaped member 9 and supporting method Another aspect of the rod-shaped member 9 and a supporting method will be described.
  • FIG. 10 is a view showing the form of a rod-like member, in which (a) shows the rod-like member according to Example 5, and (b) shows the rod-like member according to Example 6.
  • the upper view in (a) of FIG. 10 is a perspective view for explaining the form of the rod-like member according to Example 5, and the lower view is a cross-sectional view taken along line GG ′ of the upper view.
  • the LED module shown in FIG. 10 is also a schematic diagram, and illustration of the LED 23, the sealing body 25, the conductive path 27, the through holes 29 for the lead wires 67 and 69, and the like is omitted.
  • the rod-shaped members 201 and 211 constitute one of the two rod-shaped members 9 in the embodiment, and the first straight portions 201 a and 211 a at the center and the second straight portions 201 b on both sides of the first straight portions 201 a and 211 a.
  • 201c, 211b, and 211c, and the second straight portions 201b, 201c, 211b, and 211c have a "U" shape which is bent downward with respect to the first straight portions 201a and 211a. That is, the second straight lines 201b, 201c, 211b, and 211c correspond to the single rod-like members 9 in the embodiment.
  • Example 5 there are two U-shaped rod-like members 201, and as shown in FIG. 10A, these two first straight portions 201a are disposed in parallel, and the LED module 203 is placed thereon. It is fixed. In this case, the heat of the LEDs 23 can be efficiently dissipated to the outside of the bulb 3 by arranging the first straight portions 201 a in accordance with the plurality of LEDs 23 arranged in one row of the LED modules 203.
  • Example 6 there are two U-shaped rod-like members 211, and as shown in FIG. 10B, these two first straight portions 211a are in a cross shape corresponding to the diagonal of the LED module 213.
  • the LED module 213 is fixed on this.
  • the temperature of the central portion of the mounting area of the LED is the highest, and the heat of the LEDs can be reduced by crossing the first straight portion 211a in the central portion of the mounting area. It can be efficiently led out of the valve 3.
  • FIG. 11 is a perspective view explaining the supporting method of the LED module in Example 5, (b) is an II 'arrow directional cross-sectional view of (a), (c) is (a) ) Is a cross-sectional view taken along the line JJ 'of FIG.
  • the rod member 201 is attached to the LED module 203 through the attachment member 227 with the first straight portion 201 a.
  • the mounting member 227 has a receiving portion 221 for receiving the first linear portion 201 a from below, and contact portions 223 and 225 disposed on both sides of the receiving portion 221 and in contact with the lower surface of the LED module 203.
  • the mounting member 227 is fixed to the LED module 203 by a connecting member 229 such as a screw or a rivet.
  • the lower end of the rod-like member 9 is thermally connected to the case 5 via the heat transfer plate 15, but the lower end of the rod-like member may be connected to the base And may be connected to the case and the base.
  • FIG. 12 is a cross-sectional view of the LED lamp 301. As shown in FIG. 12
  • the LED lamp 301 includes a valve 303, a case 305, a base 307, a rod member 309, the LED module 11, and a circuit unit 311, as shown in the figure.
  • the rod member 309 penetrates the valve 303 to be inside the case 305. , And is connected to the resin material 313 filled in the die 307.
  • the valve 303 is composed of a globe 321 and a stem 323 for sealing the opening of the globe 321 in an airtight manner, and helium gas is enclosed after being evacuated through an exhaust pipe 325 provided at the top of the globe 321.
  • the circuit unit 315 includes a circuit board 325 and electronic components 327 and 329 mounted substantially at the center of the top surface of the circuit board 325.
  • the circuit board 325 is fixed to the case 305 by the engagement means 59.
  • the capacitor 329 which is an electronic component is located above the diode bridge 327 which is an electronic component.
  • the circuit board 325 is on a circumference centered on the electronic components 327 and 329 in plan view, and at equal intervals, through holes for the lead wires 67 and 69 and the rod member 309 (45 in FIG. 4). , 47) are formed.
  • the lead wires 67 and 69 are soldered to the lower surface of the mounting substrate 325 after passing through the through holes, and the rod member 309 extends as it is and reaches the inside of the resin material 313.
  • the lead wire 331 connected to the circuit unit 315 is led out from the inside of the case 305 through the case 305 and the base 307 and is led out to the outside, and the leading end is connected to the shell portion 335 by the solder 333.
  • the LED lamp has been described, but the present invention is also applicable to a lighting device using the LED lamp.
  • the case is enlarged because the case is a heat dissipation member.
  • the arrangement position of the LED is farther from the base than the filament position in the incandescent lamp. That is, the arrangement position (distance from the base) of the LED in the entire LED lamp is different from the position (distance from the base) of the filament in the entire incandescent lamp.
  • Such an LED lamp is a luminaire equipped with an incandescent lamp and has a reflecting mirror, for example, a downlight, problems such as the generation of an annular shadow on the surface to be illuminated occur. That is, when the light source position is different from that of the conventional incandescent lamp, problems occur in the light distribution characteristic and the like.
  • FIG. 13 is a schematic view of a lighting device according to the present invention.
  • the lighting device 401 is attached to, for example, the ceiling 402 and used.
  • the lighting device 401 is an LED lamp (for example, the LED lamp 1 described in the first embodiment), and a lighting fixture 403 for mounting the LED lamp 1 and lighting / extinguishing the light. Equipped with
  • the lighting fixture 403 includes, for example, a fixture body 405 attached to the ceiling 402, and a cover 407 attached to the fixture body 405 and covering the LED lamp 1.
  • the cover 407 is an aperture type here, and has a reflective film 411 on its inner surface that reflects the light emitted from the LED lamp 1 in a predetermined direction (here, the lower side).
  • the fixture body 405 includes a socket 409 to which the base 7 of the LED lamp 1 is attached (screwed), and power is supplied to the LED lamp 1 via the socket 409.
  • the lighting fixture here is an example, and for example, the lighting fixture may have a closed cover without the open cover 407, or the posture in which the LED lamp faces sideways ( The lighting apparatus may be lighted in such a manner that the central axis of the lamp is horizontal or inclined (the central axis of the lamp is inclined with respect to the central axis of the lighting apparatus).
  • the lighting device is a direct attachment type in which the lighting fixture is mounted in contact with the ceiling or wall, but it is an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or wall It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
  • the lighting fixture here lights one attached LED lamp, a plurality of, for example, three LED lamps may be attached.
  • the configuration of the present invention has been described above based on the first to third embodiments, but the present invention is not limited to the above embodiments.
  • it may be an LED lamp or a lighting apparatus formed by combining the partial configuration of the LED lamp or the lighting apparatus according to the first to third embodiments and the configuration according to the following modification.
  • the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the lighting device without departing from the scope of the technical idea of the present invention. 1.
  • the gloves 35 and 321 and the stems 37 and 323 are made of glass material, and the rod-like members 9 and 309 are made of dumet material (good adhesion) compatible with the glass material. Other materials may be used as long as they can maintain their properties.
  • the glove and the stem can be made of a resin material
  • the rod-like member can be made of a metal material.
  • a resin material for example, when a thermoplastic material is used, it can be carried out by heating and melting the joint portion between the glove and the stem, and when a thermosetting resin is used, it can be carried out by using an adhesive.
  • the gas tightness may be enhanced by using a gas barrier resin.
  • the bulbs 3 and 303 are shaped as A type, but may be shaped like other types, for example, G type, R type, etc., and have a shape completely different from the shape of a light bulb etc. Also good.
  • the stems 37 and 323 may be of the flare type, for example, other types such as a disc-shaped button type.
  • the helium gas is sealed in the valve 3 303.
  • another type of gas having a thermal conductivity higher than that of air may be sealed.
  • Other gases include neon and the like.
  • Rod members In the embodiment, four rod members 9 and 309 are provided, but may be other than four. However, three or more are preferable to stably support the LED module.
  • the cross-sectional shape of the rod-like member has not been particularly described, a circular shape is preferable in consideration of sealing to the stem.
  • the rod members 9 and 309 are formed of the dumet material in consideration of the sealing property with the stems 37 and 323.
  • the dumet material is used only for the sealing part with the stem and the other parts are different.
  • it may be composed of a material such as a nickel iron wire. In this case, it is necessary to join members made of a plurality of materials by welding or the like to form rod-like members of a predetermined length.
  • the rod-like member has the bending portion at a plurality of places in the portion disposed in the valve, but may have a single linear shape without providing the bending portion, or may have a curved shape.
  • the light-emitting element is the LED 23. However, for example, it may be an LD (laser diode) or an EL element (electric luminescence element).
  • the LED 23 is mounted on the mounting substrate in a chip type
  • the LED may be mounted on a mounting substrate in a surface mounting type (so-called SMD) or a shell type, for example.
  • the plurality of LEDs may be a mixture of chip type and surface mount type.
  • the mounting substrate may have another shape, for example, a polygon such as a square or a pentagon (including a regular polygon), an oval, a circle, a ring, or the like.
  • a polygon such as a square or a pentagon (including a regular polygon), an oval, a circle, a ring, or the like.
  • the number of mounting substrates is not limited to one, and may be two or more.
  • the LED 23 is mounted on the surface of the mounting substrate 21. However, the LED may be mounted on the back surface.
  • the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit, but two rows may be coated together. Alternatively, one constant number of LED groups may be covered with one sealing body, or all the LEDs may be covered with one sealing body.
  • the plurality of LEDs 23 are arranged in two rows, but may be arranged on four sides of a square in plan view. , And may be disposed on the circumference of an ellipse (including a circle).
  • the LED module 11 emits white light by using the LED 23 that emits blue light and phosphor particles that wavelength-converts blue light to yellow light, for example, ultraviolet light emission
  • the semiconductor light emitting device of the present invention may be combined with phosphor particles of each color that emits light of three primary colors (red, green and blue).
  • the wavelength conversion material a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
  • the case 5 305 is made of a resin material, but may be made of another material.
  • a metal material as another material, it is necessary to ensure the insulation with a nozzle.
  • the insulation with the base can be ensured, for example, by applying an insulating film to the small diameter portion of the case or insulating the small diameter portion, and the glove side of the case is made of a metal material. It is also possible to secure the sides by resin materials (two or more members are joined).
  • the surface of the case 5 305 is not particularly described in the above embodiment, for example, a radiation fin may be provided, or a process for improving the emissivity may be performed. 6.
  • the Edison-type base 7, 307 is used, but another type, for example, a pin type (specifically, a G-type such as GY or GX) is used. good.
  • the base 7, 307 is attached (joined) to the case 5, 305 by screwing the screw of the case 5, 305 using the female screw of the shell portion. It may be joined with the case by other methods. Other methods include adhesive bonding, caulking bonding, press-in bonding, and the like, and two or more of these methods may be combined.
  • the lamp according to the present invention can be suitably used, for example, as a bulb-shaped LED lamp replacing a incandescent lamp.

Abstract

A lamp (1) includes a LED module (11) that is supported by supporting members inside a globe (35) and a case (5) that includes a base (7) and is attached at an end part of the globe (35), wherein the globe (35) together with a stem (37) that blocks off an opening of the globe (35) constitute a bulb (3), and a fluid having a coefficient of thermal conductivity higher than the air is sealed inside the bulb (3). The supporting members are composed of a plurality of rod-like members (9), one or more of the rod-like members (9) is drawn out to the exterior of the bulb (3), and a distal end of the drawn out part is thermally joined to the case (5).

Description

ランプ及び照明装置Lamp and lighting device
　本発明は、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）等の発光素子を光源とするランプ及び照明装置に関する。 The present invention relates to a lamp and a lighting device using a light emitting element such as a light emitting diode (LED) as a light source.
　近年、省エネルギーの観点から、白熱電球に代替する電球形ランプとして、高効率・長寿命なＬＥＤを利用するランプ（以下、ＬＥＤランプと記載する。）が提案されている。 In recent years, from the viewpoint of energy saving, a lamp using high-efficiency long-life LED (hereinafter referred to as an LED lamp) has been proposed as a bulb-shaped lamp replacing a incandescent lamp.
　ＬＥＤランプは、例えば、多数のＬＥＤを実装する実装基板がケースの端部に装着され、ＬＥＤを発光させるための回路ユニットをケース内に収納している（特許文献１）。 In the LED lamp, for example, a mounting substrate on which a large number of LEDs are mounted is attached to an end portion of the case, and a circuit unit for emitting the light of the LED is housed in the case (Patent Document 1).
　回路ユニットを構成する電子部品に熱負荷に弱い部品が含まれる一方、ＬＥＤは発光時に熱を発生する。熱負荷に弱い電子部品は、ＬＥＤ発光時の熱により、動作が不安定になったり、寿命が短くなったりするおそれがある。 While the electronic components that make up the circuit unit include components that are susceptible to heat load, the LEDs generate heat when they emit light. Electronic components that are weak to heat load may become unstable in operation or have a short life due to the heat at the time of LED light emission.
　このようなことから、回路ユニットへの熱負荷を抑制するために、ＬＥＤ発光時の熱をＬＥＤランプの外部へ放熱させるための種々の技術が提案されている。具体的には、ケースの表面に放熱溝を設けたり（特許文献２）、ケースを良熱伝導材料である金属で形成することによりＬＥＤの熱を口金へと伝導してケース内に熱が蓄積しないようにしたり（非特許文献１（第１２頁）参照）等している。 From such a thing, in order to suppress the thermal load to a circuit unit, the various techniques for radiating the heat | fever at the time of LED light emission to the exterior of a LED lamp are proposed. Specifically, a heat dissipation groove is provided on the surface of the case (Patent Document 2), or the case is made of metal which is a good thermal conductive material, and the heat of the LED is conducted to the base and the heat is accumulated in the case (See Non-patent Document 1 (page 12)).
特開２００６－３１３７１７号公報JP 2006-313717 A 特開２０１０－００３５８０号公報JP, 2010-003580, A
　近年のＬＥＤランプへの高輝度化の要望が強くなっており、上記技術ではこの要望に答えることができない。つまり、高輝度化に伴ってＬＥＤの発熱量が増大し、この熱を放出・伝熱するために、ケースが大型化するのである。ケースの大型化はＬＥＤランプの大型化につながり、既存の照明装置に適用できない。 In recent years, the demand for high luminance to the LED lamp has become strong, and the above technology can not meet this demand. That is, the calorific value of the LED increases with the increase in luminance, and the case is enlarged in order to release and transfer the heat. The increase in size of the case leads to the increase in size of the LED lamp and can not be applied to existing lighting devices.
　本発明は、ランプの大型化を招くことなく、高輝度化に対応し得る新規構成のランプを提供することを目的とする。 An object of the present invention is to provide a lamp of a new configuration that can cope with high brightness without causing an increase in size of the lamp.
　上記の目的を達成するため、本発明に係るランプは、光源としての発光素子がグローブ内部で支持部材により支持されていると共に、口金が装着されているケースが前記グローブの端部側に装着されてなるランプであって、前記グローブは、端部側にある開口を塞ぐ蓋部材とで容器を構成し、当該容器内に空気よりも高い熱伝導率を有する流体が封入されており、前記支持部材は、複数本の棒状部材から構成され、１本以上の前記棒状部材が前記容器から外部へと導出されて、その導出先端部が前記ケース又は口金の少なくとも一方に熱的に接合されていることを特徴としている。 In order to achieve the above object, in the lamp according to the present invention, a light emitting element as a light source is supported by a support member inside the glove, and a case with a cap attached is attached to the end of the glove The glove comprises a container with a lid member closing an opening on the end side, and a fluid having a thermal conductivity higher than air is enclosed in the container, the support The member is composed of a plurality of rod-like members, and one or more of the rod-like members are led out from the container, and the leading end thereof is thermally joined to at least one of the case or the base. It is characterized by
　上記の構成によれば、空気よりも高い熱伝導率を有する流体がバルブ内に封入されているので、発光素子から発生した熱を流体によりバルブへ伝導させることができる。この結果、バルブを利用して発光時の熱を外部へと放熱することができる。 According to the above configuration, since the fluid having a thermal conductivity higher than that of air is sealed in the valve, the heat generated from the light emitting element can be conducted to the valve by the fluid. As a result, the heat at the time of light emission can be dissipated to the outside using the bulb.
　また、バルブから導出する棒状部材の導出先端がケース又は口金の少なくとも一方に接続されているため、流体を介してバルブへと伝えることができなかった熱を棒状部材からバルブ外のケース又は口金の少なくとも一方に伝えることができる。 In addition, since the leading end of the rod-like member leading out from the valve is connected to at least one of the case or the base, the heat which could not be transmitted to the valve through the fluid from the rod-like member outside the valve It can be transmitted to at least one side.
第１の実施形態に係るＬＥＤランプの構造を示す斜視図である。It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. ＬＥＤランプの断面図である。It is sectional drawing of a LED lamp. （ａ）はＬＥＤモジュールの構造を示す平面図であり、（ｂ）は（ａ）におけるＡ－Ａ’線矢視断面図であり、（ｃ）は（ａ）におけるＢ－Ｂ’線矢視断面図である。(A) is a plan view showing the structure of the LED module, (b) is a cross-sectional view taken along the line AA 'in (a), (c) is a view taken along the line BB' in (a) FIG. ケース内の伝熱板の様子を示す斜視図であり、（ａ）は伝熱板を上側からみた図であり、（ｂ）は伝熱板を下側からみた図である。It is a perspective view which shows the mode of the heat exchanger plate in a case, (a) is the figure which looked at the heat exchanger plate from the upper side, (b) is the figure which looked at the heat exchanger plate from the lower side. ステムの製造を説明する図である。It is a figure explaining manufacture of a stem. ランプの組み立て工程を説明する図である。It is a figure explaining the assembly process of a lamp | ramp. ランプの組み立て工程を説明する図である。It is a figure explaining the assembly process of a lamp | ramp. （ａ）は例１に係る固定方法を説明する図であり、上図は棒状部材を固定する前の状態の斜視図であり、下図が固定後における、上図のＣ－Ｃ’線に相当する位置での矢視断面図であり、（ｂ）は例２に係る固定方法を説明する図であり、上図は棒状部材を固定する前の状態の斜視図であり、下図が固定後における、上図のＤ－Ｄ’線に相当する位置での矢視断面図である。(A) is a figure explaining the fixing method concerning Example 1, an upper figure is a perspective view of the state before fixing a rod-shaped member, and a lower figure is equivalent to the CC 'line of the upper figure after fixing. (B) is a figure explaining the fixing method concerning Example 2, an upper figure is a perspective view of the state before fixing a rod-shaped member, The following figure is a perspective view in the state after fixing, 6 is a cross-sectional view taken along the line DD 'in the upper view. （ａ）は例３に係る支持方法を説明する図であり、（ａ－１）、（ａ－２）は支持状態を示す斜視図であり、（ａ－３）は（ａ－１）、（ａ－２）のＥ－Ｅ’線矢視断面図であり、（ｂ）は例４に係る支持方法を説明する図であり、（ｂ－１）、（ｂ－２）は支持状態を示す斜視図であり、（ｂ－３）は（ｂ－１）、（ｂ－２）のＦ－Ｆ’線矢視断面図である。(A) is a figure explaining the supporting method concerning Example 3, (a-1), (a-2) is a perspective view which shows a supporting state, (a-3) is (a-1), It is an EE 'line arrow sectional view of (a-2), (b) is a figure explaining the support method concerning Example 4, (b-1), (b-2) is a support state. It is a perspective view which shows, (b-3) is the FF 'line arrow directional cross-sectional view of (b-1) and (b-2). （ａ）における上図は例５に係る棒状部材の形態を説明する斜視図であり、下図は、上図のＧ－Ｇ’線矢視断面図であり、（ｂ）における上図は例６に係る棒状部材の形態を説明する斜視図であり、下図は、上図のＨ－Ｈ’線矢視断面図である。The upper view in (a) is a perspective view for explaining the form of the rod-like member according to example 5, the lower view is a cross-sectional view taken along the line GG 'in the upper view, and the upper view in (b) is an example 6 It is a perspective view explaining the form of the rod-shaped member which concerns on (a), and the lower figure is a HH 'arrow arrow sectional view of an upper figure. （ａ）は、例５におけるＬＥＤモジュールの支持方法を説明する斜視図であり、（ｂ）は（ａ）のＩ－Ｉ’線矢視断面図であり、（ｃ）は（ａ）のＪ－Ｊ’線矢視断面図である。(A) is a perspective view explaining the supporting method of the LED module in Example 5, (b) is an II 'arrow directional cross-sectional view of (a), (c) is J of (a) It is a -J 'arrow sectional view. ＬＥＤランプの断面図である。It is sectional drawing of a LED lamp. 本発明に係る照明装置の概略図である。It is the schematic of the illuminating device which concerns on this invention.
　≪第１の実施形態≫
１．全体構成
　図１は、第１の実施形態に係るＬＥＤランプ１の構造を示す斜視図である。図２は、ＬＥＤランプ１の断面図である。 First Embodiment
1. Overall Configuration FIG. 1 is a perspective view showing the structure of the LED lamp 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the LED lamp 1.
　ＬＥＤランプ１は、図１に示すように、空気よりも熱伝導性の高い流体が内部に封入されたバルブ３と、バルブ３の一端に装着されたケース５と、ケース５に設けられた口金７と、バルブ３を貫通してケース５内へ延出する棒状部材９と、棒状部材９のバルブ３内側端に設けられたＬＥＤモジュール１１とを備え、棒状部材９のケース５内側端がケース５に接触している。 As shown in FIG. 1, the LED lamp 1 includes a valve 3 in which a fluid having a higher thermal conductivity than air is enclosed, a case 5 mounted at one end of the valve 3, and a base provided on the case 5. 7, a rod-shaped member 9 extending through the bulb 3 into the case 5, and an LED module 11 provided at the inner end of the bulb 3 of the rod-shaped member 9. The case 5 inner end of the rod-shaped member 9 is the case I am in contact with 5.
　ＬＥＤランプ１は、口金７を介して受電してＬＥＤモジュール１１を発光させるための回路ユニット１３をケース５内に格納し、全体形状が従来の白熱電球に似た形状をしている。 The LED lamp 1 stores a circuit unit 13 for receiving power through the base 7 to cause the LED module 11 to emit light in a case 5 and has an overall shape similar to a conventional incandescent bulb.
　以下、ＬＥＤランプ１を構成する各部分について説明する。なお、本明細書では、ＬＥＤランプ１のランプ軸Ｘ（図２参照）の延伸する方向であって、口金７がある側を下側、グローブがある側を上側とする。
２．各部構成
（１）ＬＥＤモジュール１１
　図３は、ＬＥＤモジュール１１の構造を示す図である。（ａ）はＬＥＤモジュール１１の平面図であり、（ｂ）は同図の（ａ）におけるＡ－Ａ’線矢視断面図であり、（ｃ）は同図の（ａ）におけるＢ－Ｂ’線矢視断面図である。 Hereinafter, each part which comprises the LED lamp 1 is demonstrated. In the present specification, the direction in which the lamp axis X (see FIG. 2) of the LED lamp 1 extends is the side with the base 7 on the lower side, and the side with the globe on the upper side.
2. Component configuration (1) LED module 11
FIG. 3 is a view showing the structure of the LED module 11. (A) is a plan view of the LED module 11, (b) is a sectional view taken along the line AA 'in (a) of the same figure, (c) is a BB in (a) of the same figure It is a line arrow sectional view.
　ＬＥＤモジュール１１は、図１～図３、特に図３に示すように、実装基板２１と、実装基板２１の上面に実装された複数のＬＥＤ２３と、複数のＬＥＤ２３を被覆する封止体２５とを備える。 The LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 covering the plurality of LEDs 23, as shown in FIGS. Prepare.
　実装基板２１は、図３の（ａ）に示すように、平面視形状が矩形状をし、ＬＥＤ２３から下方に発せられた光が透過するように、例えばガラスやアルミナ等の透光性材料により構成されている。 As shown in FIG. 3A, the mounting substrate 21 has a rectangular shape in plan view, and is made of, for example, a light transmitting material such as glass or alumina so that the light emitted downward from the LED 23 can be transmitted. It is configured.
　実装基板２１は、複数のＬＥＤ２３を接続する（直列接続又は／及び並列接続である。）ための接続パターン２７ａと、回路ユニット１３に接続されたリード線６７，６９と接続するための端子パターン２７ｂ，２７ｃとからなる導電路２７を有する。 The mounting substrate 21 has a connection pattern 27 a for connecting a plurality of LEDs 23 (series connection or / and parallel connection) and a terminal pattern 27 b for connection to lead wires 67 and 69 connected to the circuit unit 13. , And 27c.
　なお、導電路２７も、ＬＥＤ２３からの光が透過するように、例えばＩＴＯ等の透明電極が用いられている。 The conductive path 27 also uses a transparent electrode such as ITO so that the light from the LED 23 can be transmitted.
　リード線６７，６９は、図３の（ｂ）に示すように、実装基板２１の貫通孔２９を下側から上側へと挿通する先端部が端子パターン２７ｂ，２７ｃに半田３１により接続される。 As shown in FIG. 3B, the lead wires 67 and 69 are connected by solder 31 to the terminal patterns 27b and 27c at the tip end portions of the mounting substrate 21 which pass through the through holes 29 from the lower side to the upper side.
　ＬＥＤ２３は、所謂、チップの形態で実装基板２１に実装されている。複数のＬＥＤ２３は、図３で示すように、間隔（例えば、等間隔である。）をおいて、実装基板２１の長手方向と平行に２列状に配置されている。なお、ＬＥＤ２３の個数、配列等は、ＬＥＤランプ１に要求される輝度等により適宜決定される。 The LEDs 23 are mounted on the mounting substrate 21 in the form of so-called chips. As shown in FIG. 3, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). The number, arrangement, and the like of the LEDs 23 are appropriately determined according to the luminance and the like required of the LED lamp 1.
　封止体２５は、例えばシリコーン樹脂等の透光性材料からなり、２列状に配されたＬＥＤ２３を列単位で被覆し、ＬＥＤ２３への空気・水分の侵入を防止している。 The sealing body 25 is made of, for example, a translucent material such as a silicone resin, covers the LEDs 23 arranged in two rows in row units, and prevents the entry of air and moisture into the LEDs 23.
　封止体２５は、ＬＥＤ２３から発せられた光の波長を変換する必要がある場合は波長変換機能を有する。波長変換機能は、例えば、蛍光体粒子等の波長変換材料を透光性材料に混入することで実施できる。 The sealing body 25 has a wavelength conversion function when the wavelength of the light emitted from the LED 23 needs to be converted. The wavelength conversion function can be implemented, for example, by mixing a wavelength conversion material such as phosphor particles into the light transmitting material.
　本実施形態では、ＬＥＤ２３は青色光を発光色とするものであり、波長変換材料は青色光を黄色光に変換する。これにより、ＬＥＤモジュール１１は、ＬＥＤ２３から発せられた青色光と、波長変換材料により波長変換された黄色光とにより混色された白色光を出射することとなる。
（２）バルブ３
　バルブ３は、図２に示すように、開口を有するグローブ３５と、ＬＥＤモジュール１１をグローブ３５の略中央に格納する状態でグローブ３５の開口を気密状に塞ぐステム３７とを有し、内部に空気よりも熱伝導率の高いヘリウム（Ｈｅ）ガスが封入されている。これにより、点灯時のＬＥＤモジュール１１の熱を効率良くグローブ３５に伝えることができる。 In the present embodiment, the LED 23 emits blue light, and the wavelength conversion material converts blue light into yellow light. Accordingly, the LED module 11 emits white light mixed with blue light emitted from the LED 23 and yellow light wavelength-converted by the wavelength conversion material.
(2) Valve 3
As shown in FIG. 2, the bulb 3 has a glove 35 having an opening, and a stem 37 that closes the opening of the glove 35 in an airtight manner in a state where the LED module 11 is stored substantially in the center of the glove 35. Helium (He) gas, which has a higher thermal conductivity than air, is enclosed. Thereby, the heat of the LED module 11 at the time of lighting can be efficiently transmitted to the globe 35.
　グローブ３５は、所謂、Ａタイプであり、透光性材料であるガラス材料により構成されている。グローブ３５は、図２に示すように、中空状の球状部３５ａと、球状部３５ａから下方に延伸する筒状部３５ｂとを有し、筒状部３５ｂの下端開口がステム３７により封止されている。 The glove 35 is a so-called A type, and is made of a glass material which is a translucent material. As shown in FIG. 2, the globe 35 has a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and the lower end opening of the cylindrical portion 35 b is sealed by the stem 37. ing.
　ステム３７は、所謂、フレアタイプであり、透光性材料であるガラス材料で構成されている。ステム３７には、バルブ３内を排気等に利用された排気管３９が設けられている他、ＬＥＤモジュール１１への電力供給用のリード線６７，６９と、ＬＥＤモジュール１１を支持する支持体として機能する棒状部材９とがそれぞれ封着されている。 The stem 37 is a so-called flare type, and is made of a glass material which is a translucent material. The stem 37 is provided with an exhaust pipe 39 used for exhausting the inside of the valve 3 and as a support for supporting the LED module 11 and lead wires 67 and 69 for supplying power to the LED module 11. The rod-like members 9 that function are respectively sealed.
　ステム３７とグローブ３５との接合は、両者の接合予定部位を加熱して、当該部位のガラス材料を溶融させることで行われる。
（３）棒状部材９（支持部材）
　棒状部材９は、上下方向に延伸する状態でその中間部がステム３７に封着され、ステム３７がグローブ３５に装着されることでバルブ３を貫通する。棒状部材９は、金属材料、例えばジュメット材料により構成されている。 Bonding of the stem 37 and the globe 35 is performed by heating the bonding target site of the two and melting the glass material of the site.
(3) Bar member 9 (support member)
The rod-like member 9 is sealed at its middle portion to the stem 37 in a state of extending in the vertical direction, and the stem 37 is attached to the globe 35 so as to penetrate the valve 3. The rod-like member 9 is made of a metal material, for example, a dumet material.
　棒状部材９は、複数本（ここでは４本である。）あり、バルブ２内に位置する端部ではＬＥＤモジュール１１を支持する。 The rod-like members 9 are plural (here, four), and the end portion located in the bulb 2 supports the LED module 11.
　ＬＥＤモジュール１１の支持は、４本の棒状部材９の端部が平面視矩形状のＬＥＤモジュール１１の４角に近い部分に接合されることで行われる。棒状部材９の接合は、図３の（ｃ）に示すように、棒状部材９の端部がＬＥＤモジュール１１の実装基板２１の凹部４１に挿入された状態で接着剤４３により行われる。 The support of the LED module 11 is performed by bonding the end portions of the four rod-like members 9 to a portion close to the four corners of the LED module 11 having a rectangular shape in a plan view. Bonding of the rod-like member 9 is performed by the adhesive 43 in a state where the end of the rod-like member 9 is inserted into the recess 41 of the mounting substrate 21 of the LED module 11, as shown in FIG.
　棒状部材９の下端部は、ケース５と接触する伝熱板１５に熱的に接続されている。これにより、点灯時のＬＥＤモジュール１１の熱を、棒状部材９を介してバルブ３外へと取り出し、取り出した熱を伝熱板１５からケース５、口金７、照明装置のソケットへと放熱（伝熱）する。
（４）ケース５
　ケース５は、樹脂材料、例えばポリブチレンテレフタレート（ＰＢＴ）により構成された筒状をし、中心軸方向のグローブ３５側半分が大径部５ａに、口金７側半分が小径部５ｂにそれぞれなっている。 The lower end portion of the rod-like member 9 is thermally connected to the heat transfer plate 15 in contact with the case 5. As a result, the heat of the LED module 11 at the time of lighting is taken out of the bulb 3 through the rod member 9, and the taken out heat is dissipated from the heat transfer plate 15 to the case 5, the base 7, and the socket of the lighting device heat.
(4) Case 5
The case 5 has a cylindrical shape made of a resin material such as polybutylene terephthalate (PBT), and the half on the globe 35 in the central axis direction is the large diameter portion 5a and the half on the mouth ring 7 is the small diameter portion 5b. There is.
　大径部５ａはバルブ３の下端部に対して外嵌する状態で装着され、小径部５ｂは口金７により套設されている。小径部５ｂの外周には雄ネジが形成され、エジソンタイプの口金７の雌ネジと螺合する。 The large diameter portion 5 a is mounted in a state of being externally fitted to the lower end portion of the valve 3, and the small diameter portion 5 b is flanged by a base 7. A male screw is formed on the outer periphery of the small diameter portion 5b, and is screwed with the female screw of the Edison type mouthpiece 7.
　ケース５の小径部５ｂの外周には、口金７と接続するリード線６５を固定するための固定溝５ｃがケース５の中心軸と平行に形成され、ケース５の内部には、回路ユニット１３の回路基板５５を固定するための固定手段（係止手段）５９が設けられている。固定方法については、回路ユニット１３の説明の際に行う。
（５）伝熱板１５
　図４は、ケース内の伝熱板の様子を示す斜視図であり、（ａ）は伝熱板を上側からみた図であり、（ｂ）は伝熱板を下側からみた図である。 In the outer periphery of the small diameter portion 5b of the case 5, a fixing groove 5c for fixing a lead wire 65 connected to the base 7 is formed in parallel with the central axis of the case 5. Fixing means (locking means) 59 for fixing the circuit board 55 is provided. The fixing method will be performed when the circuit unit 13 is described.
(5) Heat transfer plate 15
FIG. 4 is a perspective view showing the heat transfer plate in the case, in which (a) is a view of the heat transfer plate from above, and (b) is a view of the heat transfer plate from below.
　なお、図４では、ケース、バルブ等の図示を省略している。 In addition, illustration of a case, a valve, etc. is abbreviate | omitted in FIG.
　伝熱板１５は、熱伝導性の優れた材料、ここでは、アルミニウム材料が用いられ、ケース５の大径部５ａの内周形状に対応した円板状をしている。伝熱板１５は、同図に示すように、排気管３９用の貫通孔４６を中心した円周上に、ＬＥＤモジュール１１と回路ユニット１３とを接続するリード線６７，６９用の２個の貫通孔４５と棒状部材９用の４個の貫通孔４７とを等ピッチで有する。 The heat transfer plate 15 is made of a material having excellent thermal conductivity, in this case, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 5 a of the case 5. As shown in the figure, the heat transfer plate 15 includes two lead wires 67 and 69 for connecting the LED module 11 and the circuit unit 13 on the circumference centered on the through hole 46 for the exhaust pipe 39. The through holes 45 and the four through holes 47 for the rod-like member 9 are provided at an equal pitch.
　リード線６７，６９は貫通孔４５をそのまま通過し、棒状部材９は、その下端部が貫通孔４７から少し突出した状態で伝熱板１５の下面に接着剤４９で固着される。 The lead wires 67 and 69 pass through the through holes 45 as they are, and the rod-like member 9 is fixed to the lower surface of the heat transfer plate 15 with the adhesive 49 in a state where the lower end portion protrudes slightly from the through holes 47.
　伝熱板１５は、上側に小径部１５ａと下側に大径部１５ｂとを有し、小径部１５ａの外周面がステム３７の内周面に、大径部１５ｂの外周面がケース５の内周面にそれぞれ接着剤（無機系・有機系どちらでも良い。）５１を介して固着されている。これにより、ＬＥＤモジュール１１から棒状部材９、伝熱板１５を経由したケース５への熱伝導路が確立される。
（６）回路ユニット１３
　回路ユニット１３は、回路基板５５と、当該回路基板５５に実装された各種の電子部品５７，５８とを備え、各種電子部品５７，５８によって、口金１１を介して受電した商業電力（交流）を整流する整流回路と、整流された直流電力を平滑化する平滑回路とが構成される。 The heat transfer plate 15 has a small diameter portion 15a on the upper side and a large diameter portion 15b on the lower side, the outer peripheral surface of the small diameter portion 15a is on the inner peripheral surface of the stem 37, and the outer peripheral surface of the large diameter portion 15b is on the case 5 It adheres to the inner peripheral surface via an adhesive (either inorganic type or organic type) 51. Thus, a heat conduction path from the LED module 11 to the case 5 via the rod-like member 9 and the heat transfer plate 15 is established.
(6) Circuit unit 13
The circuit unit 13 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55, and the commercial power (AC) received through the base 11 by the various electronic components 57 and 58 is A rectifying circuit for rectifying and a smoothing circuit for smoothing rectified DC power are configured.
　整流回路は回路基板５５の上面側のダイオードブリッジ５７により、平滑回路は回路基板５５の下面側のコンデンサ５８によりそれぞれ構成され、コンデンサ５８の本体部が口金７の内部に位置する。 The rectifying circuit is constituted by the diode bridge 57 on the upper surface side of the circuit board 55, the smoothing circuit is constituted by the capacitor 58 on the lower surface side of the circuit board 55, and the main body of the capacitor 58 is positioned inside the base.
　回路基板５５は、ケース５の内部の係止手段５９により固定される。具体的には、ケース５の内部の段差部５９ａに回路基板５５の下面の周縁部分が当接し、係止部５９ｂにより回路基板の５５の上面が係止されている。係止部５９ｂは、周方向に間隔（例えば、等間隔である。）をおいて複数個（例えば４個である。）形成され、段差部５９ａに近づくに従ってケース５の中心軸側に張り出す。 The circuit board 55 is fixed by the locking means 59 inside the case 5. Specifically, the peripheral edge portion of the lower surface of the circuit board 55 abuts on the step portion 59a inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 59b. A plurality of (for example, four) locking portions 59b are formed at intervals (for example, equally spaced) in the circumferential direction, and the locking portions 59b protrude toward the central axis of the case 5 as they approach the step portion 59a. .
　回路ユニット１３は、口金７とはリード線６３，６５で、ＬＥＤモジュール１１とはリード線６７，６９で接続されている。
（７）口金７
　口金７は、ＬＥＤランプ１の照明器具への取付機能を有する他、商業電源と電気的に接続する機能を有する。口金７は、白熱電球で利用されているエジソンタイプであり、筒状であって周壁がネジ状をしたシェル部７１と、シェル部７１に絶縁材料７３を介して装着されたアイレット部７５とからなる。 The circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69.
(7) Base 7
The base 7 has a function of attaching the LED lamp 1 to the luminaire, and also has a function of electrically connecting to a commercial power source. The base 7 is an Edison type used for incandescent light bulbs, and has a cylindrical shell portion 71 having a screw-like peripheral wall, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.
　回路ユニット１３と接続する一方のリード線６５は、ケース５の小径部５ｂの下端の開口端で外周面側へと折り返されて、ケース５の固定溝５ｃに嵌められた状態でシェル部７１に覆われることで、シェル部７１に接続される。他方のリード線６３は、半田付けによりアイレット部７５に接続される。 One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the opening end of the lower end of the small diameter portion 5 b of the case 5 and fitted to the fixing groove 5 c of the case 5 to the shell portion 71 It is connected to the shell part 71 by being covered. The other lead wire 63 is connected to the eyelet portion 75 by soldering.
　口金７は、シェル部７１がケース５の小径部５ｂに螺合する状態で、シェル部７１の上端部がカシメられて、ケース５に取り付けられる。
３．製造方法
　本実施形態に係るＬＥＤランプ１の製造方法について、主に、図５～７に基づいて説明する。 The cap 7 is attached to the case 5 with the upper end portion of the shell portion 71 caulked in a state where the shell portion 71 is screwed to the small diameter portion 5 b of the case 5.
3. Manufacturing Method A method of manufacturing the LED lamp 1 according to the present embodiment will be mainly described with reference to FIGS.
　図５は、ステムの製造を説明する図であり、図６及び図７は、ランプの組み立て工程を説明する図である。
（１）ステム３７の製造について
　ステム３７には、排気管３９と一対のリード線６７，６９と４本の棒状部材９が気密状に取着されている。ここでは、これらが一体になったマウント９３の製造方法について説明する。 FIG. 5 is a view for explaining the manufacture of the stem, and FIGS. 6 and 7 are views for explaining the process of assembling the lamp.
(1) Production of stem 37 In the stem 37, the exhaust pipe 39, a pair of lead wires 67 and 69, and four rod-like members 9 are airtightly attached. Here, a method of manufacturing the mount 93 in which these are integrated will be described.
　まず、図５の（ａ）に示すように、末広がり状をしたフレア管８１、排気管３９用の細管８３、リード線６７，６９用の２本の金属線８５、棒状部材９用の金属棒８７を準備し、細管８３の上端をフレア管８１内の上部に配置し、２本の金属線８５と４本の金属棒８７とをフレア管８１の一方の端部から挿入させて、フレア管８１の両端から延出させる。細管８３、金属線８５及び金属棒８７の位置関係は、細管８３を中心とする円周上であって、２本の金属線８５が細管８３を挟んで対向し、２本を１組した各組の２本の金属棒８５が細管８３を挟んで対向する（図４参照）。 First, as shown in FIG. 5A, the flared tube 81, the narrow tube 83 for the exhaust tube 39, the two metal wires 85 for the lead wires 67 and 69, and the metal rod for the rod member 9 as shown in FIG. Prepare the tube 87, place the upper end of the capillary tube 83 at the upper part in the flared tube 81, and insert two metal wires 85 and four metal rods 87 from one end of the flared tube 81. Extend from both ends of 81 The positional relationship between the thin tube 83, the metal wire 85 and the metal rod 87 is on the circumference centered on the thin tube 83, and two metal wires 85 face each other across the thin tube 83, and each pair of two sets A pair of two metal rods 85 face each other across the thin tube 83 (see FIG. 4).
　この位置関係を維持した状態で、フレア管８１の上部をバーナー８９で加熱する。加熱により、溶融したフレア管８１の上部と細管８３の上端部とが変形・溶融し、２本の金属線８５と４本の金属棒８７との間に溶融したガラス材料が回り込み、フレア管８１の上部の開口８１ａが塞がれる。これにより、図５の（ｂ）に示すように、フレア管８１と細管８３とが溶着したステム３７が完成すると共に金属線８５と金属棒８７とがステム３７に封着される。 While maintaining this positional relationship, the upper portion of the flared tube 81 is heated by the burner 89. By heating, the upper portion of the melted flared tube 81 and the upper end portion of the thin tube 83 are deformed and melted, and the melted glass material wraps between the two metal wires 85 and the four metal rods 87, and the flared tube 81 The opening 81a at the top of is closed. Thereby, as shown in FIG. 5B, the stem 37 in which the flared tube 81 and the thin tube 83 are welded is completed and the metal wire 85 and the metal rod 87 are sealed to the stem 37.
　次に、ステム３７における細管８３の上方に位置する部分を、図５の（ｂ）に示すように、バーナー８９で加熱し、加熱部分が溶融し始めると、細管８３の下端開口から空気を吹き込む。やがて、溶融した部分から空気が噴出し、図５の（ｃ）に示すように、細管８３に連通する排気口９１がステム３７に形成される。これにより、ＬＥＤモジュール１１を保持するためのマウント９３が完成する。
（２）ＬＥＤランプ１の組み立て
　次に、ＬＥＤランプ１の組み立てについて図６及び図７を用いて説明する。 Next, as shown in FIG. 5B, the portion of the stem 37 located above the thin tube 83 is heated by the burner 89, and when the heated portion begins to melt, air is blown from the lower end opening of the thin tube 83. . Eventually, air is jetted from the melted portion, and as shown in FIG. 5C, an exhaust port 91 communicating with the thin tube 83 is formed in the stem 37. Thereby, the mount 93 for holding the LED module 11 is completed.
(2) Assembly of LED Lamp 1 Next, assembly of the LED lamp 1 will be described using FIGS. 6 and 7.
　図６の（ａ）のように、マウント９３とＬＥＤモジュール１１を準備し、４本の金属棒８７を実装基板２１の凹部４１(図３の（ｃ）参照）へと挿入した状態で金属棒８７の先端部と実装基板２１とを接着剤４３により固着する。これによりＬＥＤモジュール１１が金属棒８７に支持される。 As shown in FIG. 6A, the mount 93 and the LED module 11 are prepared, and the four metal rods 87 are inserted into the recess 41 of the mounting substrate 21 (see FIG. 3C). The tip end portion 87 is fixed to the mounting substrate 21 by the adhesive 43. Thus, the LED module 11 is supported by the metal rod 87.
　次に、２本の金属線８５を実装基板２１の貫通孔２９に通し、金属線８５の先端部と端子パターン２７ｂ，２７ｃ（図３の（ａ）参照）とを半田３１で固定する。これにより、金属線８５がＬＥＤモジュール１１に接続されると共に、図６に示すようにＬＥＤモジュール１１付マウント９３が完成する。 Next, two metal wires 85 are passed through the through holes 29 of the mounting substrate 21, and the tips of the metal wires 85 and the terminal patterns 27 b and 27 c (see FIG. 3A) are fixed with solder 31. As a result, the metal wire 85 is connected to the LED module 11, and the mount 93 with the LED module 11 is completed as shown in FIG.
　次に、ＬＥＤモジュール１１付マウント９３のＬＥＤモジュール１１をグローブ３５内に挿入させ、ステム３７の周縁部とグローブ３５の開口端部とを付き合せ、付き合せ部位をバーナー８９で加熱してステム３７とグローブ３５とを溶着する。これによりバルブ３が完成し、排気管３９を利用してバルブ３内の排気・ヘリウムガスの封入を行った後、排気管３９をチップ・オフ封止する。なお、細管８３は、バルブ３内を真空等する際に排気管３９となる。 Next, the LED module 11 of the mount 93 with the LED module 11 is inserted into the globe 35, the periphery of the stem 37 and the open end of the globe 35 are abutted together, and the abutment portion is heated by the burner 89 And the glove 35 are welded. As a result, the valve 3 is completed, and after exhaust gas / helium gas is enclosed in the valve 3 using the exhaust pipe 39, the exhaust pipe 39 is chip-off sealed. The capillary 83 serves as an exhaust pipe 39 when the inside of the valve 3 is evacuated or the like.
　続いて、図７の（ａ）に示すように、バルブ３の下端から延出する排気管３９と２本の金属線８５と４本の金属棒８７とを伝熱板１５用の金属板９５の対応する貫通孔９５ａ，９５ｂ，９５ｃに通し、金属板９５をバルブ３に近づけて、バルブ３の下端部の内周面と金属板９５の小径部の外周とを接着剤５１で固着する。 Subsequently, as shown in FIG. 7A, the exhaust pipe 39 extending from the lower end of the valve 3, the two metal wires 85, and the four metal rods 87 are used as the metal plate 95 for the heat transfer plate 15. The metal plate 95 is passed through the corresponding through holes 95a, 95b, 95c, and the metal plate 95 is brought close to the valve 3 to fix the inner peripheral surface of the lower end of the valve 3 and the outer periphery of the small diameter portion of the metal plate 95 with the adhesive 51.
　そして、回路ユニット１３をケース５に格納し、２本の金属線８５を回路基板５５に接続した後、ケース５をバルブ３の下端部に接着剤５１にて固着する。なお、金属棒８７、金属板９５は、ケース５と金属板９５とが接続されて、ＬＥＤモジュール１１（まだ点灯されない）の熱をケース５に伝達できる状態になると、棒状部材９、伝熱板１５となる。 Then, the circuit unit 13 is stored in the case 5, and after the two metal wires 85 are connected to the circuit board 55, the case 5 is fixed to the lower end portion of the valve 3 with the adhesive 51. When the case 5 and the metal plate 95 are connected and the heat of the LED module 11 (not lit yet) can be transmitted to the case 5, the metal rod 87 and the metal plate 95 are the heat transfer plate 9 and the heat transfer plate It will be 15.
　次に、ケース５の小径部５ｂに口金７を螺着して、回路ユニット１３に接続されている金属線を口金７に接続する。これで、ＬＥＤランプ１が完成する。なお、金属線８５等は、回路ユニット１３やＬＥＤモジュール１１と電気的に接続されてリード線６７，６９等になる。
４．配光特性
　本実施形態に係るＬＥＤランプ１では、バルブ３７内であって、白熱電球の光源（フィラメント）位置に対応した位置にＬＥＤモジュール１１を設けている。これにより、ＬＥＤランプ１の発光中心を従来の白熱電球の発光中心に近づけることができる。 Next, the base 7 is screwed onto the small diameter portion 5 b of the case 5, and the metal wire connected to the circuit unit 13 is connected to the base 7. Thus, the LED lamp 1 is completed. The metal wires 85 and the like are electrically connected to the circuit unit 13 and the LED module 11 to form lead wires 67 and 69 and the like.
4. Light Distribution Characteristics In the LED lamp 1 according to this embodiment, the LED module 11 is provided in the bulb 37 at a position corresponding to the light source (filament) position of the incandescent lamp. Thereby, the light emission center of LED lamp 1 can be closely approached to the light emission center of the conventional incandescent lamp.
　また、ＬＥＤモジュール１１は透光性の実装基板２１を用いて構成されているため、ＬＥＤ２３から下方に発せられた光は実装基板２１を通過してバルブ３から外部へと出射される。 Further, since the LED module 11 is configured using the translucent mounting substrate 21, the light emitted downward from the LED 23 passes through the mounting substrate 21 and is emitted from the bulb 3 to the outside.
　ＬＥＤモジュール１１用の支持部材は、４本の棒状部材９により構成されているので、ＬＥＤ２３から斜め下方へと発せられた光が棒状部材９により遮られるのを少なくできる。
５．放熱特性
　本実施形態に係るＬＥＤランプ１は、点灯時に発生するＬＥＤ２３の熱と回路ユニット１３の熱を複数経路から放出している。
（１）ＬＥＤ２３で発生した熱
　ＬＥＤ２３で発生した熱は、ＬＥＤモジュール１１からバルブ３内のヘリウムガスを経由してグローブ３５に伝わり（第１の経路である。）、さらに、ＬＥＤモジュール１１から棒状部材９、ステム３７を経由してグローブ３５に伝わる（第２の経路である。）。グローブ３５に伝導された熱は、グローブ３５の外面から伝導・対流・輻射により大気へと放出される。 The support member for the LED module 11 is constituted by the four rod-like members 9, so that the light emitted obliquely downward from the LED 23 can be less blocked by the rod-like members 9.
5. Heat Dissipation Characteristic The LED lamp 1 according to the present embodiment releases the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
(1) Heat generated by the LED 23 The heat generated by the LED 23 is transmitted from the LED module 11 to the globe 35 via the helium gas in the bulb 3 (this is the first path), and further, the rod shape from the LED module 11 It is transmitted to the glove 35 via the member 9 and the stem 37 (second path). The heat conducted to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection and radiation.
　特に、熱伝導性の優れたヘリウムガスを介して熱をグローブ３５に伝導させる構造としているため、ＬＥＤ２３の熱をグローブ内の空気を介して伝える構造よりも伝熱作用を大幅に向上させることができる。 In particular, since the heat is conducted to the globe 35 through the helium gas having excellent thermal conductivity, the heat transfer function can be significantly improved over the structure in which the heat of the LED 23 is conducted through the air in the globe. it can.
　また、ＬＥＤモジュール１１をグローブ３５の球状部３５ａの略中央に配置しているため、バルブ３内のヘリウムに均等に熱を伝え易くなり、グローブ３５を白熱電球のガラスバルブ３に似た大きさ・形状としているため、グローブ３５の包絡面積が大きくなり、グローブ３５から大気へと放熱特性を高めることができる。 In addition, since the LED module 11 is disposed approximately at the center of the spherical portion 35 a of the globe 35, heat can be easily conducted evenly to helium in the bulb 3, and the size of the globe 35 resembles the glass bulb 3 of the incandescent bulb Since the shape is adopted, the envelope area of the glove 35 is increased, and the heat radiation characteristic from the glove 35 to the atmosphere can be enhanced.
　一方、ＬＥＤ２３の熱は、ＬＥＤモジュール１１から棒状部材９、伝熱板１５を経由してケース５や口金７に伝わる（第３の経路である）。ケース５の熱は、伝導・対流・輻射により大気へと放出されたり、さらに口金７へと伝わったりする。口金７へと伝わった熱は、ソケットから照明器具側へと伝わる。 On the other hand, the heat of the LED 23 is transmitted from the LED module 11 to the case 5 and the base 7 via the rod-like member 9 and the heat transfer plate 15 (a third path). The heat of the case 5 is released to the atmosphere by conduction, convection, and radiation, and is further transmitted to the base 7. The heat transmitted to the base 7 is transmitted from the socket to the lighting apparatus side.
　このように、放熱するための熱の経路を複数有することで高い放熱特性を得ることができる。例えば、第１及び第２の経路を伝わった熱によりバルブ３の温度が上昇し、それ以上の放熱できないような場合でも、ＬＥＤモジュール１１に残る熱を、バルブ３以外の部材であってまだ高温となっていないケース５や口金７に棒状部材９を介して伝えることができる。
（２）回路ユニット１３で発生した熱
　回路ユニット１３から発生した熱は、伝熱、対流、輻射によりケース５に伝わる。ケース５に伝わった熱の一部がケース５から外部へと伝熱・対流・輻射により放出し、残りの熱が口金７から照明器具側のソケットへと伝わる。 As described above, high heat dissipation characteristics can be obtained by providing a plurality of heat paths for heat dissipation. For example, even if the temperature of the bulb 3 is increased by the heat transmitted through the first and second paths and the heat can not be dissipated further, the heat remaining in the LED module 11 is a member other than the bulb 3 and still high temperature It can transmit to the case 5 and the nozzle | cap | die 7 which do not become through the rod-shaped member 9. FIG.
(2) The heat generated from the heat circuit unit 13 generated in the circuit unit 13 is transferred to the case 5 by heat transfer, convection and radiation. Part of the heat transferred to the case 5 is released from the case 5 to the outside by heat transfer, convection and radiation, and the remaining heat is transferred from the base 7 to the socket on the lighting apparatus side.
　ＬＥＤランプ１では、グローブ３５の大きさ・形状を白熱電球に合わせ、グローブ３５の略中央にＬＥＤモジュール１１を備えているため、ＬＥＤモジュール１１と回路ユニット１３との間の距離が大きくなり、回路ユニット１３がＬＥＤ２３から受ける熱負荷を削減することができる。その分、ケース５の蓄熱量が少なくなり、ＬＥＤ２３から棒状部材９を介して伝わる熱量を多くでき、ＬＥＤランプ１の高輝度化に対応可能となる。
６．ＬＥＤモジュールと棒状部材との固定方法
　棒状部材とＬＥＤモジュールと固定方法における他の例について説明する。 In the LED lamp 1, the size and shape of the globe 35 are matched to those of an incandescent lamp, and the LED module 11 is provided substantially at the center of the globe 35, so the distance between the LED module 11 and the circuit unit 13 becomes large. The thermal load that the unit 13 receives from the LED 23 can be reduced. As a result, the heat storage amount of the case 5 is reduced, so that the amount of heat transferred from the LED 23 through the rod-like member 9 can be increased, and the luminance of the LED lamp 1 can be increased.
6. The fixing method of a LED module and a rod-shaped member The rod-shaped member, the LED module, and the other example in a fixing method are demonstrated.
　図８の（ａ）は例１に係る固定方法を説明する図であり、上図は棒状部材を固定する前の状態の斜視図であり、下図が固定後における、上図のＣ－Ｃ’線に相当する位置での矢視断面図であり、（ｂ）は例２に係る固定方法を説明する図であり、上図は棒状部材を固定する前の状態の斜視図であり、下図が固定後における、上図のＤ－Ｄ’線に相当する位置での矢視断面図である。 (A) of FIG. 8 is a figure explaining the fixing method based on Example 1, The upper figure is a perspective view of the state before fixing a rod-shaped member, The lower figure is CC 'of the upper figure after fixing. It is an arrow sectional view in the position equivalent to a line, (b) is a figure explaining the fixing method concerning Example 2, an upper figure is a perspective view in the state before fixing a rod-shaped member, a lower figure is a figure. FIG. 10 is a cross-sectional view taken along the line DD ′ in the upper view, after being fixed.
　なお、図８から図１１に示すＬＥＤモジュールは、略図であり、ＬＥＤ２３、封止体２５、導電路、リード線６７，６９用の貫通孔２９，２９等の図示は省略している。
（１）例１
　例１の固定方法は、図８の（ａ）に示すように、棒状部材１０１の端部１０３をＬＥＤモジュール１０５の貫通孔１０７に挿通させた状態で、棒状部材１０１の先端１０３をＬＥＤモジュール１０５に接着剤１０９等で固着している。 The LED modules shown in FIGS. 8 to 11 are schematic, and the illustration of the LED 23, the sealing body 25, the conductive path, the through holes 29 and 29 for the lead wires 67 and 69, and the like is omitted.
(1) Example 1
In the fixing method of Example 1, as shown in (a) of FIG. 8, with the end portion 103 of the rod-like member 101 inserted through the through hole 107 of the LED module 105, the tip 103 of the rod-like member 101 is LED module 105 Is fixed by an adhesive 109 or the like.
　本例の場合、リード線６７，６９用の貫通孔２９を形成する際に、棒状部材９用の貫通孔１０７も同時に形成することができ、リード線６７，６９を接続するための半田３１を棒状部材９の固着用の接着剤として利用することもできる。 In the case of this example, when forming the through holes 29 for the lead wires 67 and 69, the through holes 107 for the rod-like member 9 can also be formed simultaneously, and the solder 31 for connecting the lead wires 67 and 69 is used. It can also be used as an adhesive for fixing the rod-like member 9.
　なお、本例では、棒状部材９の端部１０３は、先端だけが貫通孔１０７に合わせて細くなっており、太い部分でＬＥＤモジュール１１を下側から棒状部材９で支持する。
（２）例２
　例２の固定方法は、図８の（ｂ）に示すように、棒状部材１１１の先端部１１３がＬＥＤモジュール１１５の貫通孔１１７を上側から挿通するピン１１９によりＬＥＤモジュール１１５に固定される。本例の場合も、リード線６７，６９用の貫通孔２９を形成する際に、ピン１１９用の貫通孔１１７も同時に形成することができる。 In this example, only the tip end of the end portion 103 of the rod-shaped member 9 is narrowed in accordance with the through hole 107, and the LED module 11 is supported by the rod-shaped member 9 from the lower side in a thick portion.
(2) Example 2
In the fixing method of Example 2, as shown in (b) of FIG. 8, the tip end portion 113 of the rod-like member 111 is fixed to the LED module 115 by the pin 119 inserted through the through hole 117 of the LED module 115 from the upper side. Also in the case of this example, when forming the through holes 29 for the lead wires 67 and 69, the through holes 117 for the pins 119 can also be formed at the same time.
　なお、棒状部材１１１の端部１１３は、貫通孔１１７の径より大きくなっており、端面でＬＥＤモジュール１１５を下側から支持する。
７．ＬＥＤモジュールの支持方法
　棒状部材によるＬＥＤモジュールの支持方法における他の例について説明する。 The end 113 of the rod-like member 111 is larger than the diameter of the through hole 117, and the end surface supports the LED module 115 from the lower side.
7. Support Method of LED Module Another example of the support method of the LED module by the rod-like member will be described.
　図９の（ａ）は例３に係る支持方法を説明する図であり、（ａ－１）、（ａ－２）は支持状態を示す斜視図であり、（ａ－３）は（ａ－１）、（ａ－２）のＥ－Ｅ’線矢視断面図であり、（ｂ）は例４に係る支持方法を説明する図であり、（ｂ－１）、（ｂ－２）は支持状態を示す斜視図であり、（ｂ－３）は（ｂ－１）、（ｂ－２）のＦ－Ｆ’線矢視断面図である。
（１）例３
　例３の支持方法は、図９の（ａ）に示すように、棒状部材１２１の端部がＬＥＤモジュール１２３の端部を把持する把持部材１２５に接合されることで、棒状部材１２１がＬＥＤモジュール１２３を支持している。 (A) of FIG. 9 is a figure explaining the supporting method concerning Example 3, (a-1), (a-2) is a perspective view which shows a supporting state, (a-3) is (a-). 1) and (a-2) are cross-sectional views taken along the line EE 'of (a-2), (b) is a view for explaining a supporting method according to Example 4, (b-1) and (b-2) are It is a perspective view which shows a support state, (b-3) is the FF 'line arrow directional cross-sectional view of (b-1) and (b-2).
(1) Example 3
In the supporting method of Example 3, as shown in FIG. 9A, the end of the rod-like member 121 is joined to the holding member 125 for holding the end of the LED module 123, whereby the rod-like member 121 is an LED module It supports 123.
　把持部材１２５は、平面視矩形状のＬＥＤモジュール１２３の短辺側の端部に設けられており、（ａ－１）の例のように各端部に１個あっても良いし、（ａ－２）の例のように各辺に複数個（ここでは２個である。）あっても良い。 The gripping members 125 are provided at the ends of the short side of the LED module 123 having a rectangular shape in plan view, and one may be provided at each end as in the example of (a-1), (a There may be a plurality (two in this case) on each side as in the example of -2).
　なお、（ａ－１）に示す把持部材を符号「１２５ａ」で示し、（ａ－２）に示す把持部材を符号「１２５ｂ」で示し、把持部材１２５ａ，１２５ｂを区別せずに説明する際には、符号「１２５」で示す。 In addition, when showing the holding member shown to (a-1) by code | symbol "125a", the holding member shown to (a-2) by code | symbol "125b", and demonstrating without grasping holding members 125a and 125b, it demonstrates. Is indicated by the code "125".
　把持部材１２５は、金属や樹脂材料から構成され、断面形状が「Ｕ」字状をし、ＬＥＤモジュール１２３の上下面に当接する一対の当接部１２７ａ，１２７ｂと、一対の当接部１２７ａ，１２７ｂの端部を連結する連結部１２７ｃとを有する。 The holding member 125 is made of metal or resin material, has a U-shaped cross section, and a pair of contact parts 127a and 127b that contact the upper and lower surfaces of the LED module 123, and a pair of contact parts 127a, And a connecting portion 127c connecting the end portions of 127b.
　一対の当接部１２７ａ，１２７ｂの間隔は、ＬＥＤモジュール１２３を把持しない状態では、連結部１２７ｃから離れるに従って狭くなっており、ＬＥＤモジュール１２３に装着する際に一対の当接部１２７ａ，１２７ｂの間隔が広がる。 When the LED module 123 is not gripped, the distance between the pair of contact portions 127a and 127b decreases as the distance from the connecting portion 127c increases, and when the LED module 123 is attached to the LED module 123, the distance between the pair of contact portions 127a and 127b Spreads.
　把持部材１２５と棒状部材１２１との接合は、本例では接着剤を利用している（図示省略）が、把持部材１２５が金属の場合は溶接することもできる。
（２）例４
　例４の支持方法は、図９の（ｂ）に示すように、棒状部材１３１の端部がＬＥＤモジュール１３３の端部を固定する固定手段１３５に接合されることで支持している。 Bonding between the gripping member 125 and the rod-like member 121 uses an adhesive (not shown) in this example, but welding can also be performed when the gripping member 125 is metal.
(2) Example 4
In the supporting method of Example 4, as shown in (b) of FIG. 9, the end of the rod-like member 131 is supported by being joined to the fixing means 135 for fixing the end of the LED module 133.
　固定手段１３５は、平面視矩形状のＬＥＤモジュール１１の短辺側の端部に設けられており、（ｂ－１）の例のように各端部に１個あっても良いし、（ｂ－２）の例のように各辺に複数個（ここでは２個である。）あっても良い。 The fixing means 135 is provided at an end of the short side of the LED module 11 having a rectangular shape in plan view, and one fixing means may be provided at each end as in the example of (b-1), There may be a plurality (two in this case) on each side as in the example of -2).
　固定手段１３５は、ＬＥＤモジュール１３１の端部の上下面に当接する一対の当接部１３７ａ，１３７ｂを有する当接部材１３７と、当接部材１３７とＬＥＤモジュール１３１とを結合する連結具であるネジ１３９とを備える。 The fixing means 135 is a screw that is a connector that connects the contact member 137 and the LED module 131 with the contact member 137 having a pair of contact parts 137a and 137b that contact the upper and lower surfaces of the end of the LED module 131. And 139.
　上側の当接部１３７ａにはネジ１３９用の貫通孔が、下側の当接部１３７ｂにはネジ１３９用のネジ孔がそれぞれ形成されている。当接部材１３７は、当接部１３７ａ，１３７ｂの他、これら端部同士を連結する連結部１３７ｃを備え、断面形状が「Ｕ」字状をしている。 A through hole for the screw 139 is formed in the upper contact portion 137a, and a screw hole for the screw 139 is formed in the lower contact portion 137b. The contact member 137 includes, in addition to the contact portions 137a and 137b, a connection portion 137c connecting the end portions with each other, and has a U-shaped cross section.
　連結具は、本例ではネジ１３９を利用しているが、リベット、ピン等を利用することができる他、接着剤も利用することもできる。 Although the connector uses the screw 139 in this example, a rivet, a pin or the like can be used, and an adhesive can also be used.
　なお、固定手段１３５と棒状部材１３１との接合は、例３と同様に接着剤を利用しているが、当接部材１３７が金属の場合は溶接することもできる。
８．棒状部材９の態様と支持方法
　棒状部材９の他の形態と支持方法について説明する。 The bonding between the fixing means 135 and the rod-like member 131 uses an adhesive as in the third embodiment, but welding can also be performed when the contact member 137 is metal.
8. Aspect of rod-shaped member 9 and supporting method Another aspect of the rod-shaped member 9 and a supporting method will be described.
　図１０は棒状部材の形態を示す図であり、（ａ）は例５に係る棒状部材を、（ｂ）は例６に係る棒状部材をそれぞれ示す。 FIG. 10 is a view showing the form of a rod-like member, in which (a) shows the rod-like member according to Example 5, and (b) shows the rod-like member according to Example 6.
　図１０の（ａ）における上図は例５に係る棒状部材の形態を説明する斜視図であり、下図は、上図のＧ－Ｇ’線矢視断面図であり、（ｂ）における上図は例６に係る棒状部材の形態を説明する斜視図であり、下図は、上図のＨ－Ｈ’線矢視断面図である。 The upper view in (a) of FIG. 10 is a perspective view for explaining the form of the rod-like member according to Example 5, and the lower view is a cross-sectional view taken along line GG ′ of the upper view. Is a perspective view for explaining the form of the rod-like member according to Example 6, and the lower view is a cross-sectional view taken along the line HH 'of the upper view.
　なお、図１０に示すＬＥＤモジュールも略図であり、ＬＥＤ２３、封止体２５、導電路２７、リード線６７，６９用の貫通孔２９等の図示は省略している。 The LED module shown in FIG. 10 is also a schematic diagram, and illustration of the LED 23, the sealing body 25, the conductive path 27, the through holes 29 for the lead wires 67 and 69, and the like is omitted.
　棒状部材２０１，２１１は、実施形態での２本の棒状部材９を１本で構成し、中央の第１直線部２０１ａ，２１１ａと、第１直線部２０１ａ，２１１ａの両側の第２直線部２０１ｂ，２０１ｃ，２１１ｂ，２１１ｃとを有し、第２直線部２０１ｂ，２０１ｃ，２１１ｂ，２１１ｃが第１直線部２０１ａ，２１１ａに対して下方に折り曲げられた「Ｕ」字状をしている。つまり、第２直線２０１ｂ，２０１ｃ，２１１ｂ，２１１ｃが実施形態における１本の棒状部材９のそれぞれに相当する。 The rod-shaped members 201 and 211 constitute one of the two rod-shaped members 9 in the embodiment, and the first straight portions 201 a and 211 a at the center and the second straight portions 201 b on both sides of the first straight portions 201 a and 211 a. , 201c, 211b, and 211c, and the second straight portions 201b, 201c, 211b, and 211c have a "U" shape which is bent downward with respect to the first straight portions 201a and 211a. That is, the second straight lines 201b, 201c, 211b, and 211c correspond to the single rod-like members 9 in the embodiment.
　例５では、Ｕ字状の棒状部材２０１が２本あり、図１０の（ａ）に示すように、これらの２本の第１直線部２０１ａが平行に配され、この上にＬＥＤモジュール２０３が固定される。この場合、ＬＥＤモジュール２０３の１列状に配された複数のＬＥＤ２３に合わせて第１直線部２０１ａを配置すると、ＬＥＤ２３の熱を効率的にバルブ３外に導出することができる。 In Example 5, there are two U-shaped rod-like members 201, and as shown in FIG. 10A, these two first straight portions 201a are disposed in parallel, and the LED module 203 is placed thereon. It is fixed. In this case, the heat of the LEDs 23 can be efficiently dissipated to the outside of the bulb 3 by arranging the first straight portions 201 a in accordance with the plurality of LEDs 23 arranged in one row of the LED modules 203.
　例６では、Ｕ字状の棒状部材２１１が２本あり、図１０の（ｂ）に示すように、これらの２本の第１直線部２１１ａがＬＥＤモジュール２１３の対角線に対応してクロス状に配され、この上にＬＥＤモジュール２１３が固定される。 In Example 6, there are two U-shaped rod-like members 211, and as shown in FIG. 10B, these two first straight portions 211a are in a cross shape corresponding to the diagonal of the LED module 213. The LED module 213 is fixed on this.
　この場合、複数のＬＥＤがマトリクス状に配されている場合、ＬＥＤの実装領域の中央部分の温度がもっとも高くなり、実装領域の中央部分で第１直線部２１１ａを交差させると、ＬＥＤの熱を効率的にバルブ３外に導出することができる。 In this case, when the plurality of LEDs are arranged in a matrix, the temperature of the central portion of the mounting area of the LED is the highest, and the heat of the LEDs can be reduced by crossing the first straight portion 211a in the central portion of the mounting area. It can be efficiently led out of the valve 3.
　図１１の（ａ）は、例５におけるＬＥＤモジュールの支持方法を説明する斜視図であり、（ｂ）は（ａ）のＩ－Ｉ’線矢視断面図であり、（ｃ）は（ａ）のＪ－Ｊ’線矢視断面図である。 (A) of FIG. 11 is a perspective view explaining the supporting method of the LED module in Example 5, (b) is an II 'arrow directional cross-sectional view of (a), (c) is (a) ) Is a cross-sectional view taken along the line JJ 'of FIG.
　棒状部材２０１は、第１直線部２０１ａが取付部材２２７を介してＬＥＤモジュール２０３に取り付けられる。取付部材２２７は、第１直線部２０１ａを下方から受ける受部２２１と、受け部２２１の両側に配され且つＬＥＤモジュール２０３の下面と当接する当接部２２３，２２５とを有する。なお、取付部材２２７は、ネジ、リベット等の連結部材２２９でＬＥＤモジュール２０３に固定される。 The rod member 201 is attached to the LED module 203 through the attachment member 227 with the first straight portion 201 a. The mounting member 227 has a receiving portion 221 for receiving the first linear portion 201 a from below, and contact portions 223 and 225 disposed on both sides of the receiving portion 221 and in contact with the lower surface of the LED module 203. The mounting member 227 is fixed to the LED module 203 by a connecting member 229 such as a screw or a rivet.
　≪第２の実施形態≫
　第１の実施形態に係るＬＥＤランプ１では、棒状部材９の下端が伝熱板１５を介してケース５に熱的に接続されていたが、棒状部材の下端は、口金に接続されても良いし、ケースと口金とに接続されても良い。 Second Embodiment
In the LED lamp 1 according to the first embodiment, the lower end of the rod-like member 9 is thermally connected to the case 5 via the heat transfer plate 15, but the lower end of the rod-like member may be connected to the base And may be connected to the case and the base.
　第２の実施形態では、棒状部材の下端を口金に接続したＬＥＤランプ３０１について説明する。 In the second embodiment, an LED lamp 301 in which the lower end of a rod-like member is connected to a base will be described.
　図１２は、ＬＥＤランプ３０１の断面図である。 FIG. 12 is a cross-sectional view of the LED lamp 301. As shown in FIG.
　ＬＥＤランプ３０１は、同図に示すように、バルブ３０３、ケース３０５、口金３０７、棒状部材３０９、ＬＥＤモジュール１１及び回路ユニット３１１とを備え、棒状部材３０９は、バルブ３０３を貫通してケース３０５内を通って口金３０７へと延伸し、口金３０７内に充填された樹脂材料３１３に接続されている。 The LED lamp 301 includes a valve 303, a case 305, a base 307, a rod member 309, the LED module 11, and a circuit unit 311, as shown in the figure. The rod member 309 penetrates the valve 303 to be inside the case 305. , And is connected to the resin material 313 filled in the die 307.
　バルブ３０３は、グローブ３２１と、グローブ３２１の開口を気密状に塞ぐステム３２３とからなり、グローブ３２１の頂部に設けられた排気管３２５を介して真空排気された後ヘリウムガスが封入されている。 The valve 303 is composed of a globe 321 and a stem 323 for sealing the opening of the globe 321 in an airtight manner, and helium gas is enclosed after being evacuated through an exhaust pipe 325 provided at the top of the globe 321.
　ステム３２３には、ＬＥＤモジュール１１と回路ユニット３１１間のリード線６７，６９と、４本の棒状部材３０９とが、当該ステム３２３を上下方向に貫通する状態で封着されている。 In the stem 323, lead wires 67 and 69 between the LED module 11 and the circuit unit 311 and four rod-like members 309 are sealed in a state of penetrating the stem 323 in the vertical direction.
　回路ユニット３１５は、回路基板３２５と、回路基板３２５の上面の略中央に実装された電子部品３２７，３２９とを備え、回路基板３２５が係合手段５９によりケース３０５に固定されている。なお、電子部品であるコンデンサ３２９は、電子部品であるダイオードブリッジ３２７の上方に位置している。 The circuit unit 315 includes a circuit board 325 and electronic components 327 and 329 mounted substantially at the center of the top surface of the circuit board 325. The circuit board 325 is fixed to the case 305 by the engagement means 59. The capacitor 329 which is an electronic component is located above the diode bridge 327 which is an electronic component.
　回路基板３２５は、平面視したときに、電子部品３２７，３２９を中心とする円周上であって等間隔を置いて、リード線６７，６９や棒状部材３０９用の貫通孔（図４における４５，４７を参照）が複数形成されている。リード線６７，６９は前記貫通孔を通過したところで実装基板３２５の下面に半田付けされ、棒状部材３０９はそのまま延伸して樹脂材料３１３内にまで達している。 The circuit board 325 is on a circumference centered on the electronic components 327 and 329 in plan view, and at equal intervals, through holes for the lead wires 67 and 69 and the rod member 309 (45 in FIG. 4). , 47) are formed. The lead wires 67 and 69 are soldered to the lower surface of the mounting substrate 325 after passing through the through holes, and the rod member 309 extends as it is and reaches the inside of the resin material 313.
　回路ユニット３１５と接続するリード線３３１は、ケース３０５の内側から、ケース３０５と口金３０７とを貫通して外側へ導出され、導出先端が半田３３３によりシェル部３３５に接続されている。 The lead wire 331 connected to the circuit unit 315 is led out from the inside of the case 305 through the case 305 and the base 307 and is led out to the outside, and the leading end is connected to the shell portion 335 by the solder 333.
　≪第３の実施形態≫
　実施形態等では、特に、ＬＥＤランプについて説明したが、本発明は、上記ＬＥＤランプを利用した照明装置にも適用できる。 Third Embodiment
In the embodiments and the like, in particular, the LED lamp has been described, but the present invention is also applicable to a lighting device using the LED lamp.
　背景技術で説明したＬＥＤランプは、ケースを放熱部材としているため、ケースが大型化している。この場合、ＬＥＤの配置位置が、白熱電球におけるフィラメント位置よりも口金から遠くなる。つまり、ＬＥＤランプ全体におけるＬＥＤの配置位置（口金から距離）が、白熱電球全体におけるフィラメントの位置（口金からの距離）と異なることになる。 In the LED lamp described in the background art, the case is enlarged because the case is a heat dissipation member. In this case, the arrangement position of the LED is farther from the base than the filament position in the incandescent lamp. That is, the arrangement position (distance from the base) of the LED in the entire LED lamp is different from the position (distance from the base) of the filament in the entire incandescent lamp.
　このようなＬＥＤランプを、白熱電球が装着されていた照明器具であって反射鏡を有するもの、例えばダウンライトに使用すると、被照射面に円環状の影が発生する等の問題が生じる。つまり、従来の白熱電球と光源位置が相違することにより、配光特性等に不具合が生じるのである。 When such an LED lamp is a luminaire equipped with an incandescent lamp and has a reflecting mirror, for example, a downlight, problems such as the generation of an annular shadow on the surface to be illuminated occur. That is, when the light source position is different from that of the conventional incandescent lamp, problems occur in the light distribution characteristic and the like.
　本変形例では、第１の実施形態に係るＬＥＤランプ１を照明器具（ダウンライトタイプである。）に装着する場合について説明する。 In this modification, the case where the LED lamp 1 according to the first embodiment is attached to a luminaire (which is a downlight type) will be described.
　図１３は、本発明に係る照明装置の概略図である。 FIG. 13 is a schematic view of a lighting device according to the present invention.
　照明装置４０１は、例えば、天井４０２に装着されて使用される。 The lighting device 401 is attached to, for example, the ceiling 402 and used.
　照明装置４０１は、図１１に示すように、ＬＥＤランプ（例えば、第１の実施形態で説明したＬＥＤランプ１である。）と、ＬＥＤランプ１を装着して点灯・消灯をさせる照明器具４０３とを備える。 As shown in FIG. 11, the lighting device 401 is an LED lamp (for example, the LED lamp 1 described in the first embodiment), and a lighting fixture 403 for mounting the LED lamp 1 and lighting / extinguishing the light. Equipped with
　照明器具４０３は、例えば、天井４０２に取着される器具本体４０５と、器具本体４０５に装着され且つＬＥＤランプ１を覆うカバー４０７とを備える。カバー４０７は、ここでは開口型であり、ＬＥＤランプ１から出射された光を所定方向（ここでは下方である。）に反射させる反射膜４１１を内面に有している。 The lighting fixture 403 includes, for example, a fixture body 405 attached to the ceiling 402, and a cover 407 attached to the fixture body 405 and covering the LED lamp 1. The cover 407 is an aperture type here, and has a reflective film 411 on its inner surface that reflects the light emitted from the LED lamp 1 in a predetermined direction (here, the lower side).
　器具本体４０５には、ＬＥＤランプ１の口金７が取着（螺着）されるソケット４０９を備え、このソケット４０９を介してＬＥＤランプ１に給電される。 The fixture body 405 includes a socket 409 to which the base 7 of the LED lamp 1 is attached (screwed), and power is supplied to the LED lamp 1 via the socket 409.
　本実施形態では、照明器具４０３に装着されるＬＥＤランプ１のＬＥＤ２３（ＬＥＤモジュール１１）の配置位置が白熱電球のフィラメントの配置位置に近いため、ＬＥＤランプ１における発光中心と、白熱電球における発光中心とが近いものとなる。 In this embodiment, since the arrangement position of the LED 23 (LED module 11) of the LED lamp 1 mounted on the lighting fixture 403 is close to the arrangement position of the filament of the incandescent lamp, the emission center of the LED lamp 1 and the emission center of the incandescent lamp It will be close.
　このため、白熱電球が装着されていた照明器具（４０３）にＬＥＤランプ１を装着しても、ランプとしての発光中心の位置が似ているため、被照射面に円環状の影が発生する等の問題が生じ難くなる。 For this reason, even if the LED lamp 1 is attached to the lighting fixture (403) to which the incandescent lamp has been attached, since the positions of the light emission centers as the lamps are similar, an annular shadow is generated on the irradiated surface, etc. Problems are less likely to occur.
　なお、ここでの照明器具は、一例であり、例えば、開口型のカバー４０７を有さずに、閉塞型のカバーを有するものであっても良いし、ＬＥＤランプが横を向くような姿勢（ランプの中心軸が水平となるような姿勢）や傾斜する姿勢（ランプの中心軸が照明器具の中心軸に対して傾斜する姿勢）で点灯させるような照明器具でも良い。 Note that the lighting fixture here is an example, and for example, the lighting fixture may have a closed cover without the open cover 407, or the posture in which the LED lamp faces sideways ( The lighting apparatus may be lighted in such a manner that the central axis of the lamp is horizontal or inclined (the central axis of the lamp is inclined with respect to the central axis of the lighting apparatus).
　また、照明装置は、天井や壁に接触する状態で照明器具が装着される直付タイプであったが、天井や壁に埋め込まれた状態で照明器具が装着される埋込タイプであっても良いし、照明器具の電気ケーブルにより天井から吊り下げられる吊下タイプ等であっても良い。 In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in contact with the ceiling or wall, but it is an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or wall It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
　さらに、ここでは、照明器具は、装着される１つのＬＥＤランプを点灯させているが、複数、例えば、３個のＬＥＤランプが装着されるようにものであっても良い。 Furthermore, although the lighting fixture here lights one attached LED lamp, a plurality of, for example, three LED lamps may be attached.
　≪変形例≫
　以上、本発明の構成を、第１～第３の実施形態に基づいて説明したが、本発明は上記実施形態に限られない。例えば、第１～第３の実施形態に係るＬＥＤランプや照明装置の部分的な構成および下記の変形例に係る構成を、適宜組み合わせてなるＬＥＤランプや照明装置であっても良い。 «Modification»
The configuration of the present invention has been described above based on the first to third embodiments, but the present invention is not limited to the above embodiments. For example, it may be an LED lamp or a lighting apparatus formed by combining the partial configuration of the LED lamp or the lighting apparatus according to the first to third embodiments and the configuration according to the following modification.
　また、上記実施形態に記載した材料、数値等は好ましいものを例示しているだけであり、それに限定されることはない。さらに、本発明の技術的思想の範囲を逸脱しない範囲で、ＬＥＤランプや照明装置の構成に適宜変更を加えることは可能である。
１．バルブ
　実施形態では、グローブ３５，３２１とステム３７，３２３とをガラス材料で構成し、棒状部材９，３０９をガラス材料と相性の良い（密着性の良い）ジュメット材料で構成したが、バルブの機密性を保持することができれば、他の材料を用いても良い。 In addition, the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the lighting device without departing from the scope of the technical idea of the present invention.
1. In the embodiment, the gloves 35 and 321 and the stems 37 and 323 are made of glass material, and the rod- like members 9 and 309 are made of dumet material (good adhesion) compatible with the glass material. Other materials may be used as long as they can maintain their properties.
　他の材料としては、グローブとステムとを樹脂材料で構成し、棒状部材を金属材料により構成することもできる。樹脂材料の場合、例えば、熱可塑性材料を用いると、グローブとステムとの接合部分を加熱溶融させることで実施できるし、熱硬化性樹脂を用いると、接着剤を利用することで実施でき、さらに、ガスバリアー用の樹脂を用いて気密性を高めても良い。 As another material, the glove and the stem can be made of a resin material, and the rod-like member can be made of a metal material. In the case of a resin material, for example, when a thermoplastic material is used, it can be carried out by heating and melting the joint portion between the glove and the stem, and when a thermosetting resin is used, it can be carried out by using an adhesive. The gas tightness may be enhanced by using a gas barrier resin.
　実施形態では、バルブ３，３０３をＡタイプの形状としたが、他のタイプ、例えばＧタイプ、Ｒタイプ等の形状であっても良いし、電球等の形状と全く異なるような形状であっても良い。さらに、ステム３７，３２３をフレアタイプとしてが、例えば、円盤状をしたボタンタイプ等の他のタイプであっても良い。 In the embodiment, the bulbs 3 and 303 are shaped as A type, but may be shaped like other types, for example, G type, R type, etc., and have a shape completely different from the shape of a light bulb etc. Also good. Furthermore, the stems 37 and 323 may be of the flare type, for example, other types such as a disc-shaped button type.
　実施形態では、バルブ３，３０３内にヘリウムガスが封入されていたが、空気よりも熱伝導率が高い他の種類のガスを封入しても良い。他のガスとしてはネオン等がある。
２．棒状部材
　実施形態では、棒状部材９，３０９を４本設けたが、４本以外でも良い。ただし、ＬＥＤモジュールを安定して支持するには３本以上あるのが好ましい。棒状部材の断面形状について特に説明しなかったが、ステムへの封着を考慮すると円形状が好ましい。 In the embodiment, the helium gas is sealed in the valve 3 303. However, another type of gas having a thermal conductivity higher than that of air may be sealed. Other gases include neon and the like.
2. Rod members In the embodiment, four rod members 9 and 309 are provided, but may be other than four. However, three or more are preferable to stably support the LED module. Although the cross-sectional shape of the rod-like member has not been particularly described, a circular shape is preferable in consideration of sealing to the stem.
　実施形態では、ステム３７，３２３との封着性を考慮してジュメット材料で棒状部材９，３０９を構成したが、例えば、ステムとの封着部分にのみジュメット材料を用い、他の部分を別の材料、例えばニッケル鉄線等の材料で構成しても良い。この場合、複数の材料からなる部材を溶接等で接合して所定の長さの棒状部材にする必要がある。 In the embodiment, the rod members 9 and 309 are formed of the dumet material in consideration of the sealing property with the stems 37 and 323. For example, the dumet material is used only for the sealing part with the stem and the other parts are different. For example, it may be composed of a material such as a nickel iron wire. In this case, it is necessary to join members made of a plurality of materials by welding or the like to form rod-like members of a predetermined length.
　実施形態では、棒状部材は、バルブ内に配された部分では複数箇所に屈曲部を有していたが、屈曲部を設けずに１直線状としても良いし、湾曲状としても良い。
３．バルブとケースの結合
　第１の実施形態では、バルブ３とケース５とが接着剤５１により固着されている。このため、点灯時にバルブ３の熱がバルブ３からケース５にも伝わるような構成となっている。しかしながら、バルブ内に熱伝導率の高い流体を封入すると、バルブの温度が上がり、その熱がケースに伝わりケースの温度が上昇するおそれもある。このような場合、ケース内の回路ユニットへの熱負荷を削減するために、バルブとグローブとの間に熱伝導率の低い材料を介在させて、両者を接合しても良い。この際、バルブから導出される棒状部材の先端は、口金に熱的に接続するのが好ましい。
４．ＬＥＤモジュール
（１）発光素子
　実施形態等では、発光素子はＬＥＤ２３であったが、例えば、ＬＤ（レーザダイオード）であっても良く、ＥＬ素子（エレクトリックルミネッセンス素子）であっても良い。 In the embodiment, the rod-like member has the bending portion at a plurality of places in the portion disposed in the valve, but may have a single linear shape without providing the bending portion, or may have a curved shape.
3. Coupling of Valve and Case In the first embodiment, the valve 3 and the case 5 are fixed by the adhesive 51. Therefore, the heat of the valve 3 is transmitted to the case 5 from the valve 3 at the time of lighting. However, if a fluid having a high thermal conductivity is sealed in the valve, the temperature of the valve may increase, the heat may be transmitted to the case, and the temperature of the case may increase. In such a case, in order to reduce the thermal load on the circuit unit in the case, a material having a low thermal conductivity may be interposed between the valve and the globe to bond the two. At this time, it is preferable that the tip of the rod-like member drawn out of the valve be thermally connected to the base.
4. LED Module (1) Light-Emitting Element In the embodiment and the like, the light-emitting element is the LED 23. However, for example, it may be an LD (laser diode) or an EL element (electric luminescence element).
　また、ＬＥＤ２３はチップタイプで実装基板に実装されていたが、ＬＥＤは例えば、表面実装タイプ（いわゆる、ＳＭＤである。）や砲弾タイプで実装基板に実装されても良い。さらに、複数のＬＥＤは、チップタイプと表面実装タイプとの混合であっても良い。
（２）実装基板
　第１及び第２の実施形態での実装基板２１は平面視において矩形状をしている。 In addition, although the LED 23 is mounted on the mounting substrate in a chip type, the LED may be mounted on a mounting substrate in a surface mounting type (so-called SMD) or a shell type, for example. Furthermore, the plurality of LEDs may be a mixture of chip type and surface mount type.
(2) Mounting Board The mounting board 21 in the first and second embodiments has a rectangular shape in plan view.
　しかしながら、実装基板は、他の形状を例えば、正方形状、５角形等の多角形（正多角形状を含む。）、楕円形状、円形状、環状等であっても良い。 However, the mounting substrate may have another shape, for example, a polygon such as a square or a pentagon (including a regular polygon), an oval, a circle, a ring, or the like.
　また、実装基板数も１個の限定するものでなく、２以上の複数個であっても良い。さらに、実施形態では、実装基板２１の表面にＬＥＤ２３を実装していたが、裏面にもＬＥＤを実装するようにしても良い。
（３）封止体
　第１及び第２の実施形態では、封止体２５は２列状に配されたＬＥＤ２３を列単位で被覆していたが、２列分をまとめて被覆しても良いし、複数の一定数のＬＥＤ群に対して１つの封止体で被覆しても良いし、すべてのＬＥＤに対して１つの封止体で被覆しても良い。
（４）ＬＥＤの配置
　第１及び第２実施形態では、複数のＬＥＤ２３は２列状に配されていたが、平面視において、四角形の４辺上に位置するように配されていても良いし、楕円（円を含む）の円周上に位置するように配されていても良い。さらには、マトリクス状に配されても良い。
（５）その他
　ＬＥＤモジュール１１は、青色光を出射するＬＥＤ２３と、青色光を黄色光に波長変換する蛍光体粒子とを利用することで白色光を出射するようにしていたが、例えば、紫外線発光の半導体発光素子と三原色（赤色、緑色、青色）に発光する各色蛍光体粒子とを組み合わせたものでも良い。 Also, the number of mounting substrates is not limited to one, and may be two or more. Furthermore, in the embodiment, the LED 23 is mounted on the surface of the mounting substrate 21. However, the LED may be mounted on the back surface.
(3) Sealing Body In the first and second embodiments, the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit, but two rows may be coated together. Alternatively, one constant number of LED groups may be covered with one sealing body, or all the LEDs may be covered with one sealing body.
(4) Arrangement of LEDs In the first and second embodiments, the plurality of LEDs 23 are arranged in two rows, but may be arranged on four sides of a square in plan view. , And may be disposed on the circumference of an ellipse (including a circle). Furthermore, they may be arranged in a matrix.
(5) Others Although the LED module 11 emits white light by using the LED 23 that emits blue light and phosphor particles that wavelength-converts blue light to yellow light, for example, ultraviolet light emission The semiconductor light emitting device of the present invention may be combined with phosphor particles of each color that emits light of three primary colors (red, green and blue).
　さらに、波長変換材料として半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を利用しても良い。
５．ケース
　第１及び第２の実施形態等では、ケース５，３０５は樹脂材料により構成していたが、他の材料で構成することもできる。他の材料として、金属材料を利用する場合、口金との絶縁性を確保する必要がある。口金との絶縁性は、例えば、ケースの小径部に絶縁膜を塗布したり、小径部に対して絶縁処理をしたりすることで確保できる他、ケースのグローブ側を金属材料により、ケースの口金側を樹脂材料によりそれぞれ構成（２以上部材を結合する。）することでも確保できる。 Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
5. Case In the first and second embodiments, the case 5 305 is made of a resin material, but may be made of another material. When using a metal material as another material, it is necessary to ensure the insulation with a nozzle. The insulation with the base can be ensured, for example, by applying an insulating film to the small diameter portion of the case or insulating the small diameter portion, and the glove side of the case is made of a metal material. It is also possible to secure the sides by resin materials (two or more members are joined).
　上記実施形態では、ケース５，３０５の表面について特に説明しなかったが、例えば、放熱フィンを設けても良いし、輻射率を向上させるための処理を行っても良い。
６．口金
　第１の実施形態等では，エジソンタイプの口金７，３０７を利用したが、他のタイプ、例えば、ピンタイプ（具体的にはＧＹ、ＧＸ等のＧタイプである。）を利用しても良い。 Although the surface of the case 5 305 is not particularly described in the above embodiment, for example, a radiation fin may be provided, or a process for improving the emissivity may be performed.
6. In the first embodiment and the like, the Edison- type base 7, 307 is used, but another type, for example, a pin type (specifically, a G-type such as GY or GX) is used. good.
　また、上記実施形態では、口金７，３０７は、シェル部の雌ネジを利用してケース５，３０５のネジ部に螺合させることで、ケース５，３０５に装着（接合）されていたが、他の方法でケースと接合されても良い。他の方法としては、接着剤による接合、カシメによる接合、圧入による接合等があり、これらの方法を２つ以上組合せても良い。 Furthermore, in the above embodiment, the base 7, 307 is attached (joined) to the case 5, 305 by screwing the screw of the case 5, 305 using the female screw of the shell portion. It may be joined with the case by other methods. Other methods include adhesive bonding, caulking bonding, press-in bonding, and the like, and two or more of these methods may be combined.
　本発明に係るランプは、例えば、白熱電球に代替する電球形ＬＥＤランプとして好適に利用可能である。 The lamp according to the present invention can be suitably used, for example, as a bulb-shaped LED lamp replacing a incandescent lamp.
　　１　　　ＬＥＤランプ
　　３　　　バルブ
　　５　　　ケース
　　７　　　口金
　　９　　　支持部材（棒状部材）
　１１　　　ＬＥＤモジュール
　１３　　　回路ユニット
　１５　　　伝熱板 1 LED lamp 3 bulb 5 case 7 base 9 support member (rod member)
11 LED module 13 circuit unit 15 heat transfer plate

Claims (5)

  1. 　光源としての発光素子がグローブ内部で支持部材により支持されていると共に、口金が装着されているケースが前記グローブの端部側に装着されてなるランプであって、
    　前記グローブは、端部側にある開口を塞ぐ蓋部材とで容器を構成し、当該容器内に空気よりも高い熱伝導率を有する流体が封入されており、
    　前記支持部材は、複数本の棒状部材から構成され、
    　１本以上の前記棒状部材が前記容器から外部へと導出されて、その導出先端部が前記ケース又は口金の少なくとも一方に熱的に接合されている
    　ことを特徴とするランプ。     A lamp in which a light emitting element as a light source is supported by a support member inside the glove, and a case to which a base is attached is attached to the end of the glove,
    The glove constitutes a container with a lid member closing an opening on the end side, and a fluid having a thermal conductivity higher than air is sealed in the container,
    The support member is composed of a plurality of rod-like members,
    A lamp characterized in that one or more of the rod-like members are led out of the container to the outside and the leading end thereof is thermally joined to at least one of the case or the base.
  2. 　前記棒状部材は、金属材料からなる
    　ことを特徴とする請求項１に記載のランプ。     The lamp according to claim 1, wherein the rod-like member is made of a metal material.
  3. 　前記空気よりも高い熱伝導率を有する流体は、ヘリウムガスである
    　ことを特徴とする請求項１又は２に記載のランプ。     The lamp according to claim 1 or 2, wherein the fluid having a thermal conductivity higher than that of air is helium gas.
  4. 　前記蓋部材はガラス材料からなり、前記棒状部材における前記蓋部材との接合部分がジメット材からなる
    　ことを特徴とする請求項１～３のいずれか１項に記載のランプ。     The lamp according to any one of claims 1 to 3, wherein the lid member is made of a glass material, and a bonding portion of the rod-like member to the lid member is made of a dimet material.
  5. 　ランプと、前記ランプを装着して点灯させる照明器具とを備える照明装置において、
    　前記ランプは、請求項１～４のいずれか１項に記載のランプである
    　ことを特徴とする照明装置。     In a lighting device comprising: a lamp; and a lighting fixture for mounting and lighting the lamp,
    The lighting device according to any one of claims 1 to 4, wherein the lamp is a lamp according to any one of claims 1 to 4.
PCT/JP2012/000991 2011-07-22 2012-02-15 Lamp and lighting device WO2013014822A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104565929A (en) * 2014-12-31 2015-04-29 浙江青蓝照明科技有限公司 LED (Light Emitting Diode) filament lamp
WO2016070345A1 (en) * 2014-11-05 2016-05-12 袁志贤 Heat dissipation led lamp emitting light by means of cambered surface
WO2016088948A1 (en) * 2014-12-04 2016-06-09 이성헌 Edison bulb-type led bulb
JP6095838B1 (en) * 2016-09-09 2017-03-15 良治 宮澤 LED lighting fixtures for rotating lanterns

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JPH1176508A (en) * 1997-09-08 1999-03-23 Heiwa Corp Light source unit for game machine
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JP2010541152A (en) * 2007-09-27 2010-12-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light emitting device and method for cooling light emitting device

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JPH1176508A (en) * 1997-09-08 1999-03-23 Heiwa Corp Light source unit for game machine
JP2010541152A (en) * 2007-09-27 2010-12-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light emitting device and method for cooling light emitting device
JP2010245037A (en) * 2009-04-02 2010-10-28 Liquidleds Lighting Corp Light emitting diode bulb

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Publication number Priority date Publication date Assignee Title
WO2016070345A1 (en) * 2014-11-05 2016-05-12 袁志贤 Heat dissipation led lamp emitting light by means of cambered surface
WO2016088948A1 (en) * 2014-12-04 2016-06-09 이성헌 Edison bulb-type led bulb
CN104565929A (en) * 2014-12-31 2015-04-29 浙江青蓝照明科技有限公司 LED (Light Emitting Diode) filament lamp
JP6095838B1 (en) * 2016-09-09 2017-03-15 良治 宮澤 LED lighting fixtures for rotating lanterns

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