JP5895166B2 - Light emitting module, lamp and lighting device - Google Patents

Description

  The present invention relates to a light emitting module, a lamp, and an illumination device that use a light emitting element such as an LED (Light Emitting Diode) as a light source.

In recent years, from the viewpoint of energy saving, as a light bulb shaped lamp that replaces an incandescent light bulb, a lamp that uses an LED, which is one of semiconductor light emitting elements, as a light source (hereinafter referred to as an LED lamp) has been proposed (for example, Patent Documents 1-2).
As an LED lamp sold by the present applicant, there is a trade name “LDA4LC” (Non-Patent Document 1). This clear light bulb type LED lamp includes a base on which a rod-like member is erected, a globe whose opening is closed by the base, and an LED module as a light emitting module supported in the globe by the rod-like member.

  Fig.12 (a) is sectional drawing which shows the typical structure of an LED module with which the clear light bulb type LED lamp sold by this applicant is equipped. The LED module includes an LED 93 as a light-emitting element, a mounting substrate 91 having translucency and having the LED 93 disposed on one side of two main surfaces, and a wavelength conversion member 95 that converts the wavelength of light emitted from the LED 93. Consists of. For example, when the LED 93 is an element that emits blue light and white light is emitted from the LED lamp, the wavelength conversion member 95 includes phosphor particles that convert blue light into yellow light. With the configuration as described above, it is possible to obtain a light distribution characteristic approximate to an incandescent bulb.

JP 2006-313717 A JP 2010-003580 A

Panasonic Corporation website <URL http://ctlg.panasonic.jp/product/info.do?pg=04&hb=LDA4LC>

  Hereinafter, among the emission directions of the emitted light from the LED 93, the emission direction toward the mounting substrate 91 is defined as the rear, and the emission direction toward the opposite side of the mounting substrate 91 is defined as the front. When the LED module shown in FIG. 12A is used, the light emitted from the LED 93 can be emitted not only to the front side but also to the rear side. However, since the wavelength conversion member is not provided on the rear side of the LED 93, the light emitted to the rear side has a color close to the emission color of the LED 93.

  Therefore, it is conceivable to configure the LED module as follows. FIG. 12B is a cross-sectional view showing a schematic structure of an LED module in which wavelength conversion members are provided on the front side and the rear side of the LED. In the LED module shown in FIG. 12B, the LED 93 is disposed on the front side of the mounting substrate 91 in which the wavelength conversion member 97 is formed over one of the two main surfaces of the mounting substrate 91. According to such a configuration, since the light emitted backward from the LED 93 is also transmitted through the wavelength conversion member, it can be converted to a desired wavelength.

  However, the wavelength conversion function of the wavelength conversion member 97 greatly depends on the thickness of the wavelength conversion member 97, so that the thickness of the wavelength conversion member 97 is uniform over one of the two main surfaces of the mounting substrate 91. It is difficult to form. As a result of the non-uniform thickness of the wavelength conversion member 97, the concentration of the phosphor particles changes depending on the position of the wavelength conversion member. For this reason, in the LED module shown in FIG. 12B, the wavelength conversion function on the rear side changes depending on the position of the wavelength conversion member, and there is a possibility that color unevenness occurs in the emitted light.

  An object of the present invention is to provide a light emitting module in which color unevenness due to nonuniform thickness of a wavelength conversion member does not occur.

  In order to achieve the above object, a light-emitting module according to the present invention includes a light-emitting element, a light-transmitting substrate having the light-emitting element disposed on one side of two main surfaces, and the light-emitting element. Of the emission directions of the emitted light, the emission direction toward the substrate side is defined as the rear side, and the emission direction toward the opposite side of the substrate is defined as the front side. A wavelength conversion member that converts the wavelength of the emitted light of the element, and a recess is formed in at least one of the two main surfaces of the substrate, and the wavelength conversion member on the rear side is filled in the recess It is characterized by that.

  In the light emitting module configured as described above, a recess is formed on at least one of the two main surfaces of the substrate, and the wavelength conversion member provided on the rear side is filled in the recess. According to such a configuration, for example, a substrate having a recess having a depth corresponding to a desired thickness of the wavelength conversion member is prepared, and a material (wavelength conversion material) constituting the wavelength conversion member is poured into the recess. The wavelength conversion member on the rear side can be formed by removing the wavelength conversion material overflowing from the recess along the top surface of the recess. Therefore, as a result of easy control of the thickness of the wavelength conversion member, the thickness of the wavelength conversion member can be formed uniformly, so that color unevenness does not occur.

  As described above, according to the present invention, it is possible to provide a light emitting module that does not cause color unevenness due to uneven thickness of the wavelength conversion member.

It is a perspective view which shows the structure of the LED lamp 100 which concerns on 1st Embodiment. It is A-A 'arrow sectional drawing of the LED lamp 100 shown in FIG. 1 is an exploded perspective view of an LED lamp 100. FIG. 5A is a plan view of the LED module 5 viewed from the front side of the LED lamp 100, and FIG. 4B is a cross-sectional view taken along line B-B ′ in FIG. FIG. 5 is a cross-sectional view taken along line C-C ′ in FIG. It is a figure for demonstrating an example of the manufacturing method of the LED module. It is sectional drawing which shows the structure of the LED module 61 which concerns on 2nd Embodiment. It is the schematic of the illuminating device 201 which concerns on this invention. It is sectional drawing which shows the structure of the LED module which concerns on a modification (1-4). It is sectional drawing which shows the structure of the LED module which concerns on a modification (1-5). It is sectional drawing which shows the structure of the LED module which concerns on a modification (7-1). (A) A sectional view showing a schematic structure of an LED module provided in a clear light bulb type LED lamp sold by the present applicant, and (b) an LED provided with wavelength conversion members on the front side and the rear side of the LED. It is sectional drawing which shows the typical structure of a module.

<< First Embodiment >>
[1. overall structure]
FIG. 1 is a perspective view showing a structure of an LED lamp 100 according to the first embodiment. 2 is a cross-sectional view taken along line AA ′ of the LED lamp 100 shown in FIG. 1, and FIG. 3 is an exploded perspective view of the LED lamp 100. In FIG. 2, the alternate long and short dash line drawn along the vertical direction of the drawing indicates the lamp axis J of the LED lamp 100.

  The LED lamp 100 is the above-described clear light bulb type lamp. As shown in FIGS. 1 to 3, the LED lamp 100 has, as its main configuration, an LED module 5 as a light emitting module in which an LED 3 which is a kind of light emitting element is arranged, a globe 7 covering the LED module 5, and a globe 7. The attached case 9, the base 11 attached to the case 9, and the rod-like member 17 are erected and receive power from the base member 13 as a base that closes the opening of the globe 7 and the base 11 to emit light. The circuit unit 15 is provided. Hereafter, each part in FIGS. 1-3 is demonstrated.

[2. Configuration of each part]
<LED module>
(Constitution)
As shown in FIGS. 1 to 3, the LED module 5 includes a mounting substrate 21, a plurality of LEDs 3, a sealing body 23, and a wavelength conversion member 28.

  The LED 3 is disposed on one of the two main surfaces of the mounting substrate 21. Here, out of the emission directions of the emitted light from the LED 3, the emission direction toward the mounting substrate 21 is defined as the rear, and the emission direction toward the opposite side of the mounting substrate 21 is defined as the front. That is, it can be said that one main surface which is the main surface on the side where the LEDs 3 are arranged in the mounting substrate 21 is the main surface on the front side. In the following description, “the main surface on the front side of the mounting substrate” is simply referred to as “the front surface of the mounting substrate”.

  The mounting substrate 21 is made of a light-transmitting material. Therefore, the light emitted from the LED 3 can be emitted to the front side and the rear side. Examples of materials that can be used as the mounting substrate 21 include glass, alumina, sapphire, and resin. In addition, LED3 in this embodiment uses what makes blue light emission color.

  4 and 5 are diagrams showing the structure of the LED module 5. 4A is a plan view of the LED module 5 viewed from the front side of the LED lamp 100, and FIG. 4B is a cross-sectional view taken along the line B-B 'in FIG. 4A. FIG. 5 is a cross-sectional view taken along line C-C ′ in FIG. In addition, in the cross-sectional views of FIG. 4B and FIG.

  As shown in FIG. 4A, the mounting substrate 21 has a rectangular shape in plan view. Further, the LED 3 is electrically connected (in series connection or / and parallel connection) to the front surface of the mounting substrate 21 which is the main surface on the side where the LED 3 is disposed in the mounting substrate 21, or the circuit unit 15. And a conductive land (not shown) connected to the connection terminal of the LED 3 is formed. In the LED lamp 100, the light emitted from the LED 3 is transmitted through the mounting substrate 21 so that the light is emitted to the rear side. For this reason, in this embodiment, it is desirable that the wiring pattern 22 and the conductive land are also made of a light-transmitting material, and examples of such a light-transmitting material include indium tin oxide (ITO). .

As shown in FIG. 4B, a plurality of LEDs 3 are mounted on the mounting substrate 21, and two rows are linearly formed along the longitudinal direction of the mounting substrate 21 with an interval (for example, an equal interval). Is arranged. The number, arrangement, and the like of the LEDs 3 are appropriately determined depending on the luminance required for the LED lamp 100.
The sealing body 23 as a wavelength conversion member on the front side has a wavelength conversion function for converting the wavelength of light emitted from the LED 3 and a function for preventing air and moisture from entering the LED 3. The sealing body 23 of this embodiment covers the LEDs 3 for one row.

  The sealing body 23 is mainly composed of a translucent material. As the translucent material constituting the sealing body 23, for example, a silicone resin can be used. The sealing body 23 is mixed with phosphor particles that convert blue light into yellow light. Thereby, the white light produced | generated by the color mixture of the blue light radiate | emitted from LED3 and the yellow light wavelength-converted by fluorescent substance particle | grains will be emitted from the LED module 5 (LED lamp 100).

  As shown in FIGS. 4A and 4B, through holes 26 are formed in the mounting substrate 21 around the power supply terminals 22 a and 22 b in the wiring pattern 22. The through hole 26 is for inserting lead wires 49 and 51 (FIGS. 1 to 3) for supplying power from the circuit unit 15 to the LED 3. One end of the lead wires 49 and 51 is connected to the LED module 5 by being connected to the power supply terminals 22a and 22b of the wiring pattern 22 by the solder 24 (FIGS. 1 and 2). The other ends of the lead wires 49 and 51 are connected to the circuit unit 15 as shown in FIG. Further, the through hole 25 provided in the approximate center of the mounting substrate 21 is used for coupling the mounting substrate 21 and the convex portion 17a (FIGS. 2 and 3) of the rod-shaped member 17.

  As shown in FIG. 5, the LED module 5 in the present embodiment further converts the blue light emitted from the LED 3 to the rear side into yellow light, and converts the blue light into a yellow light, and the wavelength conversion member 28 as a wavelength conversion member provided on the rear side. Is provided. The wavelength converting member 28 is formed by filling a concave portion 21b formed on the front surface 21a of the mounting substrate 21, which is the main surface of the mounting substrate 21 on the side where the LEDs 3 are arranged. Similarly to the sealing body 23, the wavelength conversion member 28 is formed by mixing phosphor particles in a translucent material such as silicone resin.

  As shown in FIG. 5, the entire LED 3 overlaps the recess 21 b in a state where the mounting substrate 21 is viewed in plan. Here, in this embodiment, a plurality of LEDs 3 are arranged on the front surface 21 a side of the mounting substrate 21, and a plurality of recesses 21 b are formed so as to correspond to each LED 3 on a one-to-one basis. For this reason, the whole of each LED3 has overlapped with the corresponding recessed part 21b. If only a part of the LED 3 overlaps with the recess 21b, the blue light from the LED 3 in the portion not overlapping with the recess 21b is emitted to the rear side without being converted into yellow light. However, since the entire LED 3 overlaps the recess 21b, the amount of light emitted to the rear side without being converted into yellow light is greatly reduced. In this regard, as illustrated in FIG. 5, it is desirable that the area of the recess 21 b is larger than the area of the LED 3 in a state where the mounting substrate 21 is viewed in plan.

Further, the wiring pattern 22 and the conductive land are formed in a region excluding the concave portion 21 b on the front surface 21 a of the mounting substrate 21. For this reason, even when the wiring pattern 22 and the conductive land are not made of a light-transmitting material, the wiring pattern 22 and the conductive land do not block light emission to the rear side.
(Production method)
FIG. 6 is a diagram for explaining an example of a manufacturing method of the LED module 5.

  First, as shown in FIG. 6A, a mounting substrate 21 having a recess 21b formed on the front surface 21a is prepared. The mounting substrate 21 in which the recesses 21b are formed can be manufactured by molding with a mold, for example. Instead of the conventional mold for forming the mounting substrate, the mounting substrate 21 having the recesses 21b is easily manufactured by molding with a mold in which the protrusions corresponding to the recesses 21b of the mounting substrate 21 are formed. It is possible.

  Next, as shown in FIG. 6B, the material constituting the wavelength conversion member 28 is filled into the recess 21b by a method such as pouring the material constituting the wavelength conversion member 28 into the recess 21b. Thereby, the wavelength conversion member 28 is formed. At this time, as shown in FIG. 6B, the top surface of the wavelength conversion member 28 filled in the recess 21b is removed by a method such as removing the material overflowing from the recess 21b along the top surface of the recess 21b. It is desirable that the front surface 21a of the mounting substrate 21 be flush with the mounting substrate 21. In this manner, if the recess 21b having a depth corresponding to the desired thickness of the wavelength conversion member 28 is formed in FIG. 6A, the thickness of the wavelength conversion member 28 can be easily controlled. As a result, the wavelength conversion member 28 can be formed to have a uniform thickness, so that color unevenness due to non-uniformity in the thickness of the wavelength conversion member 28 does not occur.

  Moreover, in the process performed after the process of forming the wavelength conversion member 28 by making the top surface of the wavelength conversion member 28 filled in the recess 21b and the front surface 21a of the mounting substrate 21 flush with each other. It is possible to remove the restrictions. In particular, it is useful when the step of forming the wiring pattern 22 and the conductive land is performed after the step of forming the wavelength conversion member 28.

  In the case where the wiring pattern 22 and the conductive land are made of copper foil, for example, the copper foil is attached to the entire front surface of the mounting substrate 21, and then unnecessary copper foil is removed by etching. At this time, if unevenness exists on the front surface of the mounting substrate 21 after the wavelength conversion member 28 is formed, it is difficult to affix the copper foil on the entire front surface of the mounting substrate 21. Further, when the wiring pattern 22 and the conductive land are made of ITO, they can be formed based on a sputtering method. In this case, a portion of the front surface of the mounting substrate 21 after the formation of the wavelength conversion member 28 is covered with a metal mask except for the region where the wiring pattern 22 and the conductive land are to be formed, but on the front surface of the mounting substrate 21 after the wavelength conversion member 28 is formed. If there are irregularities, for example, there is a possibility that a portion where the ITO film is not required cannot be sufficiently covered with a metal mask.

  Thus, when the top surface of the wavelength conversion member 28 filled in the recess 21b and the front surface 21a of the mounting substrate 21 are not flush with each other, that is, the front surface of the mounting substrate 21 after the formation of the wavelength conversion member 28 is uneven. In some cases, there are restrictions on the steps performed after the step of forming the wavelength conversion member 28. However, according to the present embodiment, since the top surface of the wavelength conversion member 28 filled in the recess 21b and the front surface 21a of the mounting substrate 21 are flush with each other, the above problem does not occur.

Then, as shown in FIG. 6C, the LED 3 is fixed to the wavelength conversion member 28 by a die attach material (not shown) (for example, a silicone-based adhesive), and a sealing body is provided on the front side of the LED 3. By providing 23, the LED module 5 is completed.
<Glove>
1-3, the globe 7 has the same shape as the globe of the incandescent bulb, that is, the A type. The globe 7 is made of a translucent material. Examples of the translucent material used for the globe 7 include a glass material and a resin material.

As shown in FIG. 2, the globe 7 has a hollow spherical portion 7a and a tubular portion 7b. The cylindrical part 7b is reduced in diameter as it leaves | separates from the spherical part 7a. In addition, an opening exists at the end of the cylindrical portion 7 b opposite to the spherical portion 7 a (the end on the rear side of the globe 7), and this opening is closed by the base member 13.
<Case>
As shown in FIGS. 1 to 3, the case 9 has the same shape as that of the portion of the globe of the incandescent bulb near the base, and is made of a resin material such as polybutylene terephthalate (PBT). The case 9 has a function of releasing heat generated when the circuit unit 15 accommodated therein is turned on to the outside. Heat dissipation is performed by heat conduction from the case 9 to the outside air, convection by the outside air, and radiation.

  As shown in FIG. 2, the case 9 has a large-diameter portion 9a in the front half in the lamp axis J direction and a small-diameter portion 9b in the rear half. Further, a stepped portion 9c is formed between the large diameter portion 9a and the small diameter portion 9b as shown in the enlarged view at the lower left in FIG. The case 9 has a sealed space inside because the front side opening is closed by the base member 13 and the rear side opening is closed by the base 11. The circuit unit 15 is accommodated in this space. The outer periphery of the small-diameter portion 9 b is a male screw, which is screwed into the base 11, thereby connecting the base 11 and the case 9.

As shown in FIG. 3, a groove 9 d that extends parallel to the central axis of the case 9 is formed in the small diameter portion 9 b of the case 9. The groove 9d fixes the lead wire 33 that connects the base 11 and the circuit unit 15 (regulates the movement of the lead wire 33).
The large-diameter portion 9a has a shape that expands in a curve as it moves from the base 11 side to the globe 7 side so that the overall shape of the envelope composed of the globe 7 and the case 9 resembles that of an incandescent bulb. It has become.

<Base>
The base 11 is for receiving electric power from the socket of the lighting fixture. Although the kind of nozzle | cap | die 11 is not specifically limited, Edison type is used in this embodiment. The base 11 includes a shell portion 27 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 31 attached to the shell portion 27 via an insulating material 29.

  The shell portion 27 is connected to the circuit unit 15 via the lead wire 33, and the eyelet portion 31 is connected to the circuit unit 15 via the lead wire 35. The lead wire 33 is covered by the shell portion 27 in a state where the lead wire 33 is drawn out from the inside of the small diameter portion 9b of the case 9 to the outside through the opening at the rear end and is fitted in the groove 9d of the case 9. ing. As a result, the lead wire 35 is sandwiched between the outer periphery of the case 9 and the inner periphery of the shell portion 27, and the lead wire 35 and the base 11 are electrically connected.

<Base member>
The base member 13 is inserted into the large diameter portion 9 a of the case 9. Since the base member 13 is inserted into the case 9, the base member 13 has an outer surface (circumferential surface) corresponding to the inner surface of the large-diameter portion 9 a of the case 9. Here, the inner peripheral surface of the case 9 and the outer peripheral surface of the base member 13 correspond to each other, and the cross-sectional shape of the inner peripheral surface of the large-diameter portion 9a is circular. The shape is a circular disk.

  The base member 13 has a small diameter portion 13a and a large diameter portion 13b having a larger diameter than the small diameter portion 13a. The outer peripheral surface of the large diameter portion 13 b corresponds (contacts) with the inner peripheral surface of the large diameter portion 9 a of the case 9. When the base member 13 is inserted into the case 9, a groove 37 along the inner peripheral surface of the case 9 is formed between the small diameter portion 13 a and the inner peripheral surface of the case 9. As shown in FIG. 2, the opening side end 7 c of the globe 7 is inserted into the groove 37, and the groove 37 is filled with an adhesive 39, whereby the base member 13 and the globe 7, and the case 9 and the globe are filled. 7 are fixed to each other.

  The base member 13 has a function of closing the opening on the rear side of the globe 7 and the opening of the large-diameter portion 9a of the case 9, and also has a function of transmitting heat emitted from the circuit unit 15 to the case 9 during lighting. Furthermore, it has the function to transmit the heat conducted from the rod-like member 17 to the globe 7 and the case 9 among the heat generated in the LED 3. For this reason, it is desirable that the base member 13 is made of a material having good thermal conductivity such as metal or resin.

As shown in FIGS. 1 to 3, a rod-like member 17 is erected on the front side of the base member 13. The rod-shaped member 17 has both a function as a support for the LED module 5 and a function as a heat dissipation member when the LED lamp 100 is turned on.
The rod-shaped member 17 supports the LED module 5 at the center position of the globe 7. The rod-like member 17 has an end portion on the front side coupled to the LED module 5 and an end portion on the rear side attached to the base member 13 with an adhesive.

  As described above, the connection between the front end portion of the rod-shaped member 17 and the LED module 5 uses an engagement structure. A convex portion 17 a (FIGS. 2 and 3) is formed on the front surface of the rod-shaped member 1, and a through hole 25 (FIGS. 3 and 4) is formed in the approximate center of the mounting substrate 21 of the LED module 5. Yes. The shape of the convex portion 17a and the shape of the through hole 25 correspond to each other, and the convex portion 17a and the through hole 25 are penetrated in a state where the convex portion 17a of the rod-shaped member 17 is inserted (fitted) into the through hole 25 of the mounting substrate 21. The rod-shaped member 17 and the LED module 5 are coupled by filling an adhesive between the holes 25.

For example, an adhesive structure is used for the connection between the rear end portion of the rod-shaped member 17 and the base member 13. The rear surface of the rod-shaped member 17 is flat, and the rear surface is fixed to the front surface of the base member 13 with an adhesive (not shown).
As the adhesive, one having high thermal conductivity is desirable. By doing in this way, it can accelerate | stimulate that the heat | fever generate | occur | produced by LED3 is conducted to the base member 13 via the mounting board | substrate 21 and the rod-shaped member 17 of the LED module 5. FIG. Examples of the adhesive having high thermal conductivity include inorganic material-based adhesives such as ceramics and cement, and organic material-based adhesives such as heat-dissipating silicone.

In addition to the adhesive structure, the base member 13 and the rod-shaped member 17 may be integrally formed. By doing in this way, compared with the case where it is set as an adhesion structure, the flow of heat from rod-shaped member 17 to base member 13 can be made smoother.
Specifically, the function as a heat radiating member is (1) a function of conducting heat generated when the LED 3 is turned on and transmitted to the rod-shaped member 17 to the air contained in the globe 7; (2) The heat generated when the LED 3 is turned on and transmitted to the rod-shaped member 17 is conducted to the base member 13.

  With the function (1), in addition to the path for transferring heat directly from the LED module 5 to the air contained in the globe 7, a path for transferring heat to the air via the rod-shaped member 17 can be configured. The heat transferred from the LED module 5 or the rod-shaped member 17 to the air contained in the globe 7 is radiated to the outside of the LED lamp 100 through the globe 7. Due to the function (2), the heat conducted to the base member 13 is transmitted to the globe 7 and the case 9, and heat is released from the globe 7 and the case 9 to the outside of the LED lamp 100. Thus, since the rod-shaped member 17 also has a function as a heat radiating member, a material having good thermal conductivity is desirable as a material constituting the rod-shaped member 17, and specifically, a metal, a resin, or the like is used. is there. If the rod-shaped member 17 is made of, for example, aluminum, the LED lamp 100 can be reduced in weight.

As described above, by configuring the mounting substrate 21 of the LED module 5 with a light-transmitting material, light from the LED module 5 can be emitted backward. For this reason, the rod-shaped member 17 has a shape as close to a rod as possible so as not to block light emitted backward from the LED 3 (LED module 5).
That is, the intermediate region of the rod-shaped member 17 is a cylindrical portion 17b having a circular cross section. The front side region of the rod-shaped member 17 is a flat portion 17 c that is flat in the short direction of the rectangular mounting substrate 21 (thickness is thin in the short direction). The rear side region of the rod-shaped member 17 is a conical portion 17 d (FIG. 3) having a truncated cone shape whose diameter increases as the base member 13 is approached. Accordingly, the flat portion 17c of the rod-shaped member 17 is configured to hold the LED module 5 stably, and to prevent the light emitted backward from the LED 3 from being blocked as much as possible in the cylindrical portion 17b.

As shown in FIG. 2, through holes 53 and 55 through which the lead wires 49 and 51 are inserted are formed in the rear region of the rod-shaped member 17, and the lead wires 49 and 51 are similarly formed in the base member 13. Through-holes 57 and 59 are formed for inserting the.
<Circuit unit>
The circuit unit 15 converts commercial power received via the base 11 into LED3 lighting power. The circuit unit 15 includes a circuit board 41 and various electronic components 43 and 45 mounted on the circuit board 41.

  The circuit configuration of the circuit unit 15 mainly includes a rectifying circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power. In the present embodiment, the rectifier circuit is constituted by a diode bridge 45, and the smoothing circuit is constituted by a capacitor 43. The diode bridge 45 is mounted on the main surface of the circuit board 41 on the globe 7 side. The capacitor 43 is mounted on the main surface of the circuit board 41 on the base 11 side and is located inside the base 11.

The circuit board 41 is fixed inside the case 9 using a locking structure. Specifically, the peripheral edge portion of the back surface of the circuit board 41 abuts on the stepped portion 9c inside the case 9, and the surface of the circuit board 41 is locked by the locking portion 47 on the inner surface of the large diameter portion 9a.
A plurality (for example, four) of the locking portions 47 are formed at intervals (for example, equal intervals) in the circumferential direction. The locking portion 47 has a shape that protrudes toward the center axis side of the case 9 as it approaches the stepped portion 9 c, and the distance between the locking portion 47 and the stepped portion 9 c corresponds to the thickness of the circuit board 41.

  When the circuit board 41 (circuit unit 15) is mounted, the circuit unit 15 is inserted from the large-diameter portion 9a side of the case 9, and the rear surface (surface on the base 11 side) of the circuit board 41 is engaged. When the stop portion 47 is reached, the circuit board 41 is further pushed to pass through the locking portion 47. As a result, the circuit board 41 is locked by the locking portion 47 and the circuit unit 15 is attached to the case 9.

<< Second Embodiment >>
In the first embodiment, the LED 3 is mounted on the front side of the wavelength conversion member 28 via a die attach material. However, the wavelength conversion member 28 may be porous depending on the composition ratio of the translucent material and the phosphor particles constituting the wavelength conversion member 28. When the wavelength conversion member 28 is porous, it may be difficult to stably mount the LED 3 because the die attach material used for mounting the LED 3 soaks into the wavelength conversion member 28. The present embodiment has been made in view of the above problems.

FIG. 7 is a sectional view showing the structure of the LED module 61 according to the second embodiment, and corresponds to the sectional view taken along the line CC ′ in FIG. 4A (FIG. 5). In the following description, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
As shown in FIG. 7, the difference from the LED module 5 according to the first embodiment is that the light-transmitting inorganic material layer 63 is further provided between the LED 3 and the wavelength conversion member 28 provided on the rear side. Is the point where is inserted. The inorganic material layer 63 has a function of preventing penetration of the die attach material. Therefore, it is desirable that the inorganic material layer 63 is a material having excellent sealing properties. Moreover, since it is necessary to permeate | transmit the light which LED3 emitted to the back side, it needs to have translucency. Examples of materials having excellent sealing properties and translucency include glass materials, silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON).

  The LED 3 is fixed to the inorganic material layer 63 with the same die attach material as in the first embodiment. Since the inorganic material layer 63 is interposed between the LED 3 and the wavelength conversion member 28, the die attach material is not directly applied to the wavelength conversion member 28. Therefore, the wavelength conversion member 28 of the die attach material is used. No soaking in. Therefore, the LED 3 can be mounted stably. The film thickness of the inorganic material layer 63 is not particularly limited as long as the thickness does not allow the die attach material to permeate, and is, for example, about several [μm].

When a glass material is used as the material of the inorganic material layer 63, for example, a glass frit is disposed on the front side of the mounting substrate 21 after the wavelength conversion member 28 is formed, and this is baked to easily form the inorganic material layer 63. Can be formed.
For the problem to be solved by the present embodiment, a method of increasing the amount of the die attach material can be considered. However, in the future, when the number of LEDs mounted on the mounting substrate is increased for the purpose of increasing the brightness of the LED lamp, it is expected that it is difficult to cope with such a method. Therefore, this embodiment is particularly useful when the LED lamp has a high brightness.

<< Third Embodiment >>
The present invention can also be applied to a lighting device using an LED lamp including the LED lamp 100 described in the first embodiment and the LED module described in the second embodiment. In the present embodiment, as an example, a case where the LED lamp 100 according to the first embodiment is mounted on a lighting fixture (downlight type) will be described.

FIG. 8 is a schematic view of a lighting device according to the present invention.
The lighting device 201 is used by being mounted on the ceiling 202, for example.
As shown in FIG. 8, the lighting device 201 includes an LED lamp 100 and a lighting fixture 203 that is mounted on and off the LED lamp 100.
The lighting fixture 203 includes, for example, a fixture main body 205 attached to the ceiling 202 and a cover 207 attached to the fixture main body 205 and covering the LED lamp 100. The cover 207 is an opening type here, and has a reflection film 211 on the inner surface that reflects the light emitted from the LED lamp 100 in a predetermined direction (here, the rear).

The appliance main body 205 is provided with a socket 209 to which the base 11 of the LED lamp 100 is attached (screwed), and power is supplied to the LED lamp 100 through the socket 209.
In this embodiment, since the arrangement position of LED3 (LED module 5) of the LED lamp 100 mounted on the lighting fixture 203 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 100 and the emission center in the incandescent bulb. Are close to each other.

For this reason, even if the LED lamp 100 is mounted on a lighting fixture in which an incandescent lamp is mounted, the position of the light emission center as the lamp is similar, and thus there is a problem that an annular shadow is generated on the irradiated surface. It becomes difficult to occur.
Note that the lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 207 but may have a closing-type cover, or a posture in which the LED lamp faces sideways ( The lighting fixture may be turned on in a posture in which the central axis of the lamp is horizontal) or in an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).

In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. Alternatively, a hanging type that is suspended from the ceiling by an electric cable of a lighting fixture may be used.
Furthermore, here, the lighting fixture lights up one LED lamp to be mounted, but a plurality of, for example, three LED lamps may be mounted. In addition, it is also possible to use the LED lamp provided with the LED module demonstrated in 2nd Embodiment as an LED lamp of the illuminating device which concerns on this embodiment.

≪Modifications ・ Others≫
The configuration of the present invention has been described based on the first to third embodiments. However, the present invention is not limited to the above-described embodiments. For example, the following modifications can be given.
(1) LED Module (1-1) Light Emitting Element In the above embodiment, the case where an LED element is used as an LED has been described, but the present invention is not limited thereto. For example, a surface mount type or a shell type LED may be used.

Further, in the above-described embodiment, an embodiment in which an LED is used as the light emitting element has been described. However, the light emitting element is, for example, an LD (laser diode) or an EL element (including an electric luminescence element, organic and inorganic). There may be. Moreover, you may use combining these, including LED.
In the above-described embodiment, the emission color of the LED is blue light, and the phosphor particles are described as an example of converting blue light into yellow light, but other combinations may be used. As an example of other combinations, when emitting white light, the LED emission color is ultraviolet light, and phosphor particles are converted into red light, particles converted into green light, and particles converted into blue light. Can be used.

Furthermore, the light emission color of the LED may be mixed into white light by using three types of LED elements of red light emission, green light emission, and blue light emission. Needless to say, the color of light emitted from the light emitting unit is not limited to white, and various LEDs (including elements and surface mount types) and phosphor particles can be used depending on applications.
(1-2) Mounting Board In the above embodiment, the mounting board having a rectangular shape in plan view has been described as an example, but the shape in plan view of the mounting board is not particularly limited. In addition to the rectangular shape, there are, for example, a circular shape, an annular shape, a triangular shape, a quadrangular shape, and a polygonal shape.

In the above embodiment, a thin plate (having a smaller area on the side surface than the area of the main surface) has been described as an example. However, for example, a thick plate may be used or a block shape May be used.
Note that the mounting substrate in this specification has a pattern for mounting a semiconductor light emitting element (including element and surface mount type) and electrically connecting to the semiconductor light emitting element regardless of the shape, thickness, and form. Pointing. Therefore, the substrate may have a block shape.

(1-3) Sealing Body In the above-described embodiment, the sealing body covers the plurality of LEDs mounted linearly on the mounting substrate, but the present invention is not limited to this. For example, one LED may be covered with one sealing body, or all LEDs may be covered with one sealing body.
(1-4) Wavelength Conversion Member As shown in FIG. 5, in the first embodiment, a plurality of wavelength conversion members are formed so as to correspond to a plurality of LEDs on a one-to-one basis. Is not limited to this.

  FIG. 9 is a cross-sectional view illustrating the structure of an LED module according to Modification (1-4). As in the LED module shown in FIG. 9, a recess 21c may be provided on the front surface of the mounting substrate 21 so as to overlap the entire plurality of LEDs 3 in plan view, and the wavelength conversion member 28A may be formed in the recess 21c. In this way, by forming one wavelength conversion member 28A for the plurality of LEDs 3, it is possible to perform wavelength conversion without leaving the light emitted from the LEDs 3 in an oblique direction.

  In FIGS. 5, 7, and 9, the concave portion is formed on the front surface of the mounting substrate when providing the rear wavelength conversion member, but the present invention is not limited to this. A recess may be formed on the other of the two main surfaces of the mounting substrate, and a rear wavelength conversion member may be provided in the recess. The other of the two main surfaces of the mounting substrate can be said to be the main surface on the rear side of the mounting substrate. In the following description, “the main surface on the rear side of the mounting substrate” is simply referred to as “the rear surface of the mounting substrate”. Also with such a configuration, the film thickness of the wavelength conversion member can be easily controlled.

Further, the same effect can be obtained by providing the wavelength conversion member on the rear side on both the front surface and the rear surface of the mounting substrate. That is, it is only necessary that the wavelength conversion member on the rear side is provided on at least one of the front surface and the rear surface of the mounting substrate.
From the viewpoint of the wavelength conversion function, rather than forming a recess (a wavelength conversion member on the rear side) on the rear surface of the mounting substrate, the front surface of the mounting substrate (the main surface on the side where the LEDs are arranged on the mounting substrate). It is desirable to form. This is because the distance between the LED and the rear wavelength conversion member is shorter when the rear wavelength conversion member is formed on the front surface than when the rear wavelength conversion member is formed on the rear surface. Since the distance between the LED and the wavelength converting member on the rear side is short, it is possible to convert the wavelength of light emitted from the LED to the rear side more efficiently. Further, the second embodiment is applicable when a wavelength conversion member is provided on the front surface of the mounting substrate.

(1-5) Inorganic Material Layer As shown in FIG. 7, in the second embodiment, the inorganic material layer 63 is provided over the entire front side of the mounting substrate 21, but the present invention is not limited to this. .
FIG. 10: is sectional drawing which shows the structure of the LED module which concerns on a modification (1-5). From the viewpoint of preventing penetration of the die attach material into the wavelength conversion member 28, as shown in FIG. 10, it is sufficient that the inorganic material layer 63A is formed at least in a region where the die attach material is applied. In other words, it is only necessary that the inorganic material layer 63 </ b> A is formed only in a region overlapping with the die attach material in a state where the mounting substrate 21 is viewed in plan. By forming the inorganic material layer 63A only in the region overlapping with the die attach material, the material cost required for the inorganic material layer 63A can be reduced.

(2) Globe In the above embodiment, an example using an A type glove has been described, but the present invention is not limited to this. For example, it may be a B type, G type, and R type globe, or a shape that is completely different from the bulb shape of an incandescent bulb or the globe shape of a bulb-type fluorescent LED lamp.

  In the above embodiment, the clear light bulb type LED lamp, that is, the globe is formed of a transparent member that allows the inside to be seen, but the present invention is not limited to this. For example, it may be translucent so that the inside cannot be seen. Examples of the semi-transparent method include a method in which a diffusion layer mainly composed of calcium carbonate, silica, a white pigment, or the like is applied to the inner surface, or a treatment (for example, blasting) that makes the inner surface uneven. .

(3) Case In the above embodiment, the case is made of a resin material. However, the case may be made of another material. When a metal material is used as another material, it is necessary to ensure insulation between the base. Insulation between the base and the base can be ensured by, for example, applying an insulating layer to the outer peripheral surface of the small diameter portion of the case or performing an insulation treatment on the small diameter portion. Furthermore, it can be ensured by forming the globe side of the case from a metal material, and forming the base side of the case from a resin material, and combining the two.

In the above embodiment, the surface of the case is not particularly described. For example, a heat radiating fin may be provided, or a process for improving the emissivity may be performed.
Furthermore, although the case is composed of one member, it can be composed of a plurality of members. For example, a large-diameter member corresponding to the large-diameter portion in the LED lamp 100 according to the first embodiment and a small-diameter member corresponding to the small-diameter portion may be joined with an adhesive. At this time, the large diameter member may be made of metal and the small diameter member may be made of resin.

  In the above embodiment, there is a space inside the case and the circuit unit is stored in the space. However, for example, the space may be filled with a resin material. In this case, by filling the resin having insulating properties and high thermal conductivity, the heat generated in the circuit unit can be efficiently transferred to the case, and the thermal load acting on the circuit unit can be reduced. .

  In the above embodiment, the valve and the case are positioned by placing the rear end of the valve on the stepped portion provided on the inner peripheral surface of the large diameter portion of the case. The invention is not limited to these. For example, it is good also as a structure which does not equip a large diameter part internal peripheral surface with a level | step difference part. In this case, an adhesive or the like is used at a position along the lamp axis J between the top of the globe and the rear end of the eyelet, that is, at a position where the total length of the LED lamp is a predetermined length. Using it, the glove and the case are fixed.

(4) Base As for the shape of the base, Edison type base is used in the above embodiment, but other types, for example, pin type (specifically, G type such as GY, GX, etc.) are used. May be.
Moreover, although the base was attached (joined) to the case by being screwed into the screw portion (small diameter portion) of the case using the female screw of the shell portion, it may be joined to the case by other methods. . Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.

  In addition, more than half of the shell portion is screwed into the screw portion of the small-diameter portion having the cylindrical shape of the case, but the small-diameter portion may be attached to the case shorter than the embodiment. In this case, the electronic component of the circuit unit may be located inside the shell portion. In such a case, an insulating resin may be filled in the shell portion. Thereby, the insulation between the electronic component and the base is ensured, and the heat generated in the electronic component can be efficiently transferred to the base by using a resin having high thermal conductivity.

(5) Base member Although the base member in said embodiment has a small diameter part and a large diameter part, the disk shape from which an outer diameter hardly changes may be sufficient. In this case, a groove into which the opening side end of the globe is inserted is formed on the front surface of the base member, and the opening side end of the glove is inserted into the groove and fixed with an adhesive. It can be attached to the base member.

The base member in the above embodiment is joined to the case by an adhesive while being inserted into the case, but may be fixed to the case by other methods. Other methods include a method in which the large-diameter portion of the base member is slightly larger than the opening of the case and press-fitted into the case, and a method in which the opening side of the case is crimped after the base member is inserted into the case.
The high heat conductive layer only needs to connect the base member and the globe, and can increase the amount of heat transfer from the base member to the globe regardless of the joining method and joining method of the case and the base member.

In the above embodiment and the like, the intermediate region of the rod-shaped member is cylindrical, that is, the shape of the cross section perpendicular to the lamp axis J is circular, but the present invention is not limited to this. For example, it may be a triangle or a polygon more than a quadrangle.
(6) Circuit unit The posture in which the circuit board is fixedly accommodated in the case is not limited to the posture in which the main surface of the circuit board is substantially orthogonal to the lamp axis J. For example, the circuit board may be accommodated in a posture that is substantially parallel to the lamp axis J, or may be accommodated in a posture having a predetermined inclination angle with respect to the lamp axis J.

Further, the circuit board is not limited to a disk shape, and the shape in plan view may be a rectangular shape, a polygonal shape, or an indefinite shape such as a heart shape, or may be formed by a flexible member such as a flexible substrate and bent. It may be accommodated inside the case in a state where it is placed.
Further, the method of fixing the circuit board inside the case is not limited to the locking structure by the locking part, and the circuit board may be fixed inside the case by, for example, screwing or bonding.

Further, the circuit unit may be provided with a circuit for controlling the lighting of the LED based on a wireless signal or the like. Here, “lighting control” includes, for example, lighting, extinguishing, dimming, illumination color change, and the like.
(7) Others (7-1) In the above embodiment, the wavelength conversion member is provided in the concave portion provided on the front surface of the mounting substrate, so that the wavelength of the light emitted to the rear side is converted. However, for the purpose of wavelength conversion of the light emitted to the rear side, the wavelength conversion member need not be shaped to be embedded in the mounting substrate.

  FIG. 11: is sectional drawing which shows the structure of the LED module which concerns on a modification (7-1). As shown in FIG. 11A, a wavelength conversion member 67 is provided on the front surface of the mounting substrate 65. A plurality of wavelength conversion members 67 are provided so as to correspond one-to-one with the plurality of LEDs 3. An inorganic material layer 69 is formed so as to cover the front side of each wavelength conversion member 67. By doing in this way, like the 2nd embodiment, the penetration to the wavelength conversion member 67 of the die attach material used when mounting LED3 can be prevented.

In the LED module shown in FIG. 11A, the entire front side of the mounting substrate 65 is covered with the inorganic material layer 69, but the present invention is not limited to this. It is good also as forming the inorganic material layer 71 only in the area | region which overlaps with a die attach material in planar view like the LED module shown in FIG.11 (b).
(7-2) In the above embodiments and the like, the inside of the base and the case is hollow, but the present invention is not limited to this. For example, the inside of the base or the case may be filled with an insulating material having higher conductivity than air. An example of such a material is a silicone resin. Further, by filling the case with an insulating material or the like, it is possible to suppress vibration during operation of the circuit unit and reduce noise emitted from the LED lamp.

  (7-3) The materials, numerical values, and the like used in the above-described embodiments are merely preferred examples and are not limited to this form. In addition, changes can be made as appropriate without departing from the scope of the technical idea of the present invention. Further, combinations with other embodiments are possible as long as no contradiction occurs. Furthermore, the scale of the members in each drawing is different from the actual one. Note that the symbol “˜” used to indicate a numerical range includes numerical values at both ends.

  The lamp according to the present invention can be suitably used, for example, as a bulb-type LED lamp that replaces an incandescent bulb.

100 LED lamp 3 LED
5, 61 LED module 7, 7A Globe 9 Case 11 Base 13 Base member 15 Circuit unit 17 Bar-shaped member 19 Adhesive 21, 65 Mounting substrate 22 Wiring pattern 23 Sealing body 24 Solder 25 Through-hole 26 Through-hole 27 Shell portion 28, 28A, 67 Wavelength conversion member 29 Insulating material 31 Eyelet portion 33 Lead wire 35 Lead wire 37 Groove 39 Adhesive 41 Circuit board 43 Capacitor 45 Diode bridge 47 Locking portion 49, 51 Lead wire 53, 55, 57, 59 Through hole 58 Adhesive 63, 63A, 69, 71 Inorganic material layer 201 Lighting device 202 Ceiling 203 Lighting fixture 205 Appliance main body 207 Cover 209 Socket 211 Reflective film 91 Mounting substrate 93 LED
95 Wavelength conversion member 97 Wavelength conversion member

Claims (10)

A light emitting element;
A substrate having translucency and having the light emitting element disposed on one side of two main surfaces;
Out of the emission directions of the light emitted from the light emitting element, when the emission direction toward the substrate side is defined as the rear and the emission direction toward the opposite side of the substrate is defined as the front, the front side and the rear side of the light emitting element are defined. A wavelength conversion member that converts the wavelength of the emitted light of the light emitting element,
A recess is formed on the main surface of the one side of the substrate,
The light emitting module, wherein the rear wavelength conversion member is filled in the recess. A light emitting element;
A substrate having translucency and having the light emitting element disposed on one side of two main surfaces;
Out of the emission directions of the light emitted from the light emitting element, when the emission direction toward the substrate side is defined as the rear and the emission direction toward the opposite side of the substrate is defined as the front, the front side and the rear side of the light emitting element are defined. A wavelength conversion member that converts the wavelength of the emitted light of the light emitting element,
A recess is formed in at least one of the two main surfaces of the substrate,
The wavelength conversion member on the rear side is filled in the recess,
The top surface of the wavelength conversion member filled in the recess and the main surface of the substrate are flush with each other.
A light emitting module characterized by that. A light emitting element;
A substrate having translucency and having the light emitting element disposed on one side of two main surfaces;
Out of the emission directions of the light emitted from the light emitting element, when the emission direction toward the substrate side is defined as the rear and the emission direction toward the opposite side of the substrate is defined as the front, the front side and the rear side of the light emitting element are defined. A wavelength conversion member that converts the wavelength of the emitted light of the light emitting element,
A recess is formed in at least one of the two main surfaces of the substrate,
The wavelength conversion member on the rear side is filled in the recess,
A plurality of the light emitting elements are arranged on one side of the two main surfaces of the substrate,
A plurality of the recesses are formed so as to correspond to each light emitting element on a one-to-one basis.
A light emitting module characterized by that. 4. The light emitting module according to claim 3 , wherein each of the light emitting elements overlaps with a corresponding concave portion in a state in which the substrate is viewed in a plan view. In the main surface of the substrate on the side where the light emitting element is disposed, a conductive land connected to the connection terminal of the light emitting element is formed,
The light emitting module according to claim 1 , wherein the conductive land is formed in a region excluding a concave portion on a main surface of the substrate on the side where the light emitting element is disposed. Further, a translucent inorganic material layer is interposed between the light emitting element and the wavelength conversion member provided in the concave portion on the main surface of the substrate on which the light emitting element is disposed. ,
The light emitting module according to claim 1 , wherein the light emitting element is fixed to the inorganic material layer with a die attach material. The light emitting module according to claim 6 , wherein the inorganic material layer is formed only in a region overlapping with the die attach material when the substrate is viewed in plan. The light emitting module according to claim 6 , wherein the inorganic material layer is made of a glass material. A base on which a rod-shaped member is erected;
A glove whose opening is closed by the base;
A light emitting module supported in the globe by the rod-shaped member,
The said light emitting module is a light emitting module of any one of Claims 1-8 . The lamp | ramp characterized by the above-mentioned. In an illuminating device comprising a lamp and a lighting fixture that is lit by mounting the lamp,
The said lamp | ramp is a lamp | ramp of Claim 9. The illuminating device characterized by the above-mentioned.

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