WO2013099074A1 - Lamp and lighting apparatus using same - Google Patents

Lamp and lighting apparatus using same Download PDF

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Publication number
WO2013099074A1
WO2013099074A1 PCT/JP2012/006761 JP2012006761W WO2013099074A1 WO 2013099074 A1 WO2013099074 A1 WO 2013099074A1 JP 2012006761 W JP2012006761 W JP 2012006761W WO 2013099074 A1 WO2013099074 A1 WO 2013099074A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
support member
lamp
globe
light
Prior art date
Application number
PCT/JP2012/006761
Other languages
French (fr)
Japanese (ja)
Inventor
次弘 松田
三貴　政弘
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013509333A priority Critical patent/JPWO2013099074A1/en
Publication of WO2013099074A1 publication Critical patent/WO2013099074A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a lamp using a light emitting element, and more particularly to improvement of light distribution characteristics.
  • JP 2006-313717 A Japanese Patent No. 4290887
  • a plurality of (16 in the example of FIG. 11A) are formed on a substrate 1110 made of a translucent material such as glass.
  • a light emitting module 1100 formed by mounting a plurality of LED chips 1120 with a sealing member 1130 containing a wavelength conversion material.
  • light is emitted from the LED chip 1120 through the substrate 1110 and also from the surface (back surface) opposite to the mounting surface of the LED chip 1120 on the substrate 1110.
  • a lamp 1001 in which the light emitting module 1100 is disposed at a substantially central portion of the globe 1010 is provided. Conceivable.
  • the light emitting module 1100 is attached to the tip of the support member 1140.
  • the support member 1140 is fixed to a case 1160 to which a globe 1010 and a base 1130 are attached.
  • the light emitting module 1100 as shown in FIG. 11A exhibits a light distribution characteristic as represented by a one-dot chain line S in FIG. That is, the light distribution characteristics of the light emitting module 1100 are such that the amount of light emitted in the direction along the main surface of the substrate 1110 (light emitted to the region A1 in FIG. 11B) is on the main surface of the substrate 1110. It is smaller than the amount of light emitted in the intersecting direction (for example, the direction formed by an angle with the main surface of 30 ° to 90 °) (light emitted to the region A2 in FIG. 11B). Then, as shown in FIG. 12, the vicinity of the part intersecting with the virtual surface including the main surface of the substrate 1110 on the peripheral wall of the globe 1010 (the portion indicated by hatching in FIG. 12) becomes dark at the time of lighting.
  • the light distribution characteristics of the light emitting module 1100 are such that the amount of light emitted in the direction along the main surface of the substrate 1110 (light emitted
  • the present invention has been made in view of the above reasons, and an object thereof is to provide a lamp capable of improving the light distribution characteristics.
  • a lamp according to the present invention includes a light-emitting module having a substrate made of a light-transmitting material and a light-emitting element mounted on the substrate, a globe made of the light-transmitting material and partially having an opening, A support member extending inward from the opening and having each of the plurality of light emitting modules attached to the tip, and at least two main light emitting directions among the main light emitting directions of the plurality of light emitting modules. Are facing different directions.
  • At least two of the light emitting modules arranged in the globe have different at least two main light emitting directions, and thus at least two of the plurality of light emitting modules are directed to different directions.
  • Light is emitted from each light emitting module in such a manner that the main light emitting direction is directed to at least two places on the peripheral wall of the globe.
  • FIG. 1 is a perspective view of a light bulb shaped lamp according to Embodiment 1.
  • FIG. Sectional drawing of the light bulb shaped lamp concerning Embodiment 1 The light emitting module which concerns on Embodiment 1 is shown, (a) is a perspective view, (b) is a top view.
  • FIG. 1 is a perspective view of a lamp 1 according to the present embodiment
  • FIG. 2 is a cross-sectional view of the lamp 1 according to the present embodiment.
  • an alternate long and short dash line drawn in the vertical direction of the drawing indicates a symmetry axis (hereinafter referred to as “lamp axis”) J1 of the lamp 1.
  • a lamp 1 is a light bulb-shaped LED lamp that replaces an incandescent light bulb, and includes a translucent globe 10 and three light emitting modules 20, 22, 24, a base 30 for receiving power from the outside, a first support member 40, a second support member 50, a case 60, and a power supply device 80.
  • Globe The globe 10 is a light-transmitting hollow member, in which three light emitting modules 20, 22, and 24 are arranged.
  • the globe 10 is made of silica glass that is transparent to visible light.
  • the globe 10 has a shape composed of a hollow spherical portion and a protruding portion protruding outward from a part of the spherical portion, and an opening 11 is formed at the tip of the protruding portion. That is, the shape of the globe 10 is an A shape (JIS C7710) similar to a general incandescent bulb. In addition, the shape of the globe 10 does not necessarily need to be A-shaped. For example, the shape of the globe 10 may be G-shaped. The globe 10 does not necessarily need to be transparent to visible light, and may be subjected to a diffusion treatment, for example, by applying silica to form a milky white diffusion film. The globe 10 is not necessarily made of silica glass, and may be made of a light-transmitting resin such as an acrylic resin.
  • the light emitting modules 20, 22, and 24 include substrates 20a, 22a, and 24a made of a translucent material, and a plurality of (for example, 18) LEDs mounted on the substrates 20a, 22a, and 24a.
  • a chip is provided, and the main light emission direction coincides with the normal direction of the main surface of each of the substrates 20a, 22a, and 24a.
  • the light emitting module 20 receives power supply from the power supply device 80 through the two lead wires 70a and 70b.
  • the light emitting module 22 is supplied with power from the power supply device 80 via two lead wires 72a and 72b
  • the light emitting module 24 is supplied with power from the power supply device 80 via two lead wires 74a and 74b. receive.
  • the configuration of the light emitting module 20 according to the present embodiment will be described in detail with reference to FIGS. 3 (a) and 3 (b). Since the light emitting modules 22 and 24 have the same configuration as the light emitting module 20, the description thereof is omitted here.
  • FIG. 3A is a perspective view of the light emitting module according to the present embodiment
  • FIG. 3B is a plan view.
  • the light emitting module 20 is a COB type (Chip On Board) light emitting module in which an LED chip is directly mounted on a substrate, and emits blue light with the substrate 20a.
  • the LED chip 20b that radiates, the sealing member 20c, and the power supply terminals 20d1 and 20d2 are included.
  • the substrate 20a is formed in a rectangular plate shape, and a plurality of LED chips 20b are mounted on one surface (main surface) side in the thickness direction.
  • the substrate 20a has a first through hole 20e formed at each of both ends in the longitudinal direction, and a second through hole 20f formed at a substantially central portion in the longitudinal direction.
  • the first through hole 20e has a substantially circular shape as viewed from the direction along the thickness direction of the substrate 20a (the normal direction of the main surface) (hereinafter referred to as “plan view”), and the second through hole The hole 20f is rectangular in plan view.
  • the substrate 20a is made of a translucent material having translucency with respect to visible light, such as ceramics (for example, alumina) or glass.
  • the LED chip 20b is made of a GaN-based semiconductor material.
  • a plurality of LED chips 20b (18 in FIGS. 3A and 3B) are mounted on one side of the substrate 20a. And nine LED chips 20b are arranged in two rows as one row.
  • the LED chips 20b adjacent to each other in the longitudinal direction of the substrate 20a are composed of an electrode pad (not shown) disposed between the LED chips 20b and a wire (not shown) electrically connected to the electrode pad. ).
  • an example in which 18 LED chips 20b are mounted on the substrate 20a has been described.
  • the present invention is not limited to this, and the number of LED chips 20b depends on the application of the lamp 1. May be changed as appropriate.
  • the example in which the LED chips 20b are mounted in two rows on the substrate 20a has been described, but the present invention is not limited to this, and for example, one row or a plurality of rows of three or more rows may be used.
  • the sealing member 20c is disposed so as to cover the entire element array composed of a plurality (9 in FIG. 3A and FIG. 3B) of LED chips 20b. Therefore, the longitudinal direction of the sealing member 20c coincides with the column direction of the element column. In the present embodiment, since two element rows are provided, two sealing members 20c are provided. Further, the sealing member 20c contains a phosphor that is a wavelength conversion member, and converts blue light emitted from the LED chip 20b into yellow light. Specifically, the sealing member 20c is formed by dispersing yellow phosphor particles (not shown) and a light diffusing material (not shown) in a translucent silicone resin.
  • the phosphor particles are composed of YAG-based yellow phosphor particles such as (Y, Gd) 3 Al 5 O 12 : Ce 3+ , Y 3 Al 5 O 12 : Ce 3+ .
  • the blue light of the LED chip 20b and the yellow light obtained by converting the blue light by the sealing member 20c are transmitted through the substrate 20a and the other side opposite to the one surface side on which the LED chip 20b is mounted. Also emitted from the surface side.
  • the yellow phosphor particles may be, for example, yellow phosphors such as (Sr, Ba) 2 SiO 4 : Eu 2+ , Sr 3 SiO 5 : Eu 2+ , or (Ba, Sr) 2 SiO. 4 : Eu 2+ , Ba 3 Si 6 O 12 N 2 : Green phosphor such as Eu 2+ and CaAlSiN 3 : Eu 2+ , Sr 2 (Si, Al) 5 (N, O) 8 : Eu 2+ etc.
  • the red phosphor may be used.
  • the sealing member 20c is not necessarily made of a silicone resin, and an organic material such as a fluorine resin, or an inorganic material such as a low-melting glass or a sol-gel glass may be used.
  • an organic material such as a fluorine resin, or an inorganic material such as a low-melting glass or a sol-gel glass may be used.
  • the inorganic material is superior in heat resistance characteristics compared to the organic material, the sealing member 20c made of the inorganic material is advantageous for increasing the luminance.
  • the sealing member 20c may be formed on a surface where the LED chip 20b is not mounted.
  • substrate 20a and LED chip 20b is not mounted is also converted into yellow light. Therefore, the color of light emitted from the side where the LED chip 20b is not mounted can be brought close to the color of light emitted directly from the sealing member 20c.
  • a yellow phosphor may be baked on a portion of the substrate 20a immediately below the LED chip 20b.
  • the blue light emitted from the surface of the substrate 20a where the LED chip 20b is not mounted is also converted into yellow light from the LED chip 20b through the portion immediately below the LED chip 20b.
  • the present invention is not limited to this, and for example, covers all the LED chips 20b on the substrate 20a at once. It may be formed as follows.
  • the power supply terminals 20d1 and 20d2 are terminals for receiving power supply from the power supply device 80 via the lead wires 70a and 70b.
  • the power supply terminals 20d1 and the lead wires 70a is electrically connected, and the power supply terminal 20d2 and the lead wire 70b are electrically connected.
  • metal wirings 20d3 and 20d4 are patterned on the surface side of the substrate 20a on which the LED chip is mounted.
  • the metal wirings 20d3 and 20d4 electrically connect the LED chips 20b disposed at both ends of each element row and the power supply terminals 20d1 and 20d2.
  • As a material of the metal wiring for example, silver (Ag), tungsten (W), copper (Cu), ITO (Tin-doped Indium Oxide), or the like can be used.
  • the metal wirings 20d3 and 20d4 may have their surfaces plated with nickel (Ni) / gold (Au) or the like.
  • the base 30 is, for example, an E26-type base for receiving power from the socket of the lighting fixture when the lamp 1 is attached to the lighting fixture and turned on. As shown in FIG. 2, the base 30 includes a substantially cylindrical shell 31 and an eyelet 33 attached to one side of the shell 31 in the cylinder axis direction via an insulator portion 32.
  • the shell 31 is connected to the power supply device 80 via the power supply line 90a, and the eyelet 33 is connected to the power supply device 80 via the power supply line 90b.
  • a male screw portion is formed on the outer peripheral surface of the shell 31 to be screwed into the socket of the lighting fixture, and a female screw portion is formed on the inner peripheral surface to be screwed into the second case portion 62 of the case 60.
  • the power line 90 a is inserted from the inside of the second case portion 62 of the case 60 into a through hole 62 a that is provided in the peripheral wall, and the tip thereof is disposed inside the cutout portion 31 a provided in the shell 31. It is soldered to the shell 31 in a state.
  • the base 30 does not necessarily have to be an E26 type base, and may be a base having a different size such as an E17 type.
  • the base 30 is not necessarily a screw-type base, and may be a base having a different shape such as a plug-in type.
  • the first support member 40 has a long cylindrical shape, and the opening of the globe 10 is arranged so that its axis coincides with the lamp axis J1.
  • the base portion 40 a extends from the vicinity of the portion 11 toward the inside of the globe 10 and is fixed to the second support member 50.
  • the first support member 40 is made of metal, ceramics, glass, or the like.
  • FIG. 4A shows a view of the first support member 40 and the three light emitting modules 20, 22, and 24 viewed from the direction of the lamp axis J1, and the lamp is shown with the three light emitting modules 20, 22, and 24 removed.
  • a view seen from the direction of the axis J1 is shown in FIG. In FIG. 4A, the power supply terminal is omitted.
  • the first support member 40 is formed with three attachment surfaces 41a, 41b, 41c to which the light emitting modules 20, 22, 24 are attached.
  • the mounting surfaces 41a, 41b, 41c are formed in a rectangular shape, and are present at equal intervals around the lamp axis J1 extending along the longitudinal direction of the first support member 40.
  • the center lines J21, J22, J23 connecting the center positions of the mounting surfaces 41a, 41b, 41c and the lamp axis J1 are viewed from the direction of the lamp axis J1, the angle formed by the center lines J21, J22, the center line J22. , J23 and the angles formed by the center lines J23, J21 are all equal to 120 °.
  • each light emitting module 20,22,24 is a surface on the opposite side to the surface in which LED chip and sealing member 20c, 22c, 24c in the board
  • the main light emitting direction of each light emitting module 20, 22, 24 is the normal line n1, n2, n3 of each mounting surface 41a, 41b, 41c. Match the direction along.
  • each light emitting module 20, 22, 24, that is, the direction along the normal lines n1, n2, n3 of the mounting surfaces 41a, 41b, 41c is the lamp axis J1. It extends radially from the center.
  • the three attachment surfaces 41a, 41b, and 41c at the tip of the first support member 40 are connected to the normal lines n1 and 41b of the attachment surfaces 41a, 41b, and 41, respectively.
  • Protrusions 41a1, 41b1, and 41c1 protruding in the direction along n2 and n3 are provided.
  • Each convex part 41a1, 41b1, 41c1 is formed in a rectangular shape when viewed from the normal direction (direction along the normal lines n1, n2, n3) of each mounting surface 41a, 41b, 41c.
  • the external dimensions viewed from the normal direction (direction along the normal lines n1, n2, and n3) of the mounting surfaces 41a, 41b, and 41c of the respective convex portions 41a1, 41b1, and 41c1 are the respective substrates 20a, 22a
  • the outer dimensions of the second through holes 20f, 22f, and 24f provided in 24a are substantially equal to the external dimensions of the plan view.
  • each convex part 41a1, 41b1, 41c1 is inserted in 2nd through-hole 20f, 22f, 24f, respectively. Thereby, even if force is applied to each board 20a, 22a, 24a in the direction along each attachment surface 41a, 41b, 41c, movement of each board 20a, 22a, 24a is controlled. Further, the positioning of the substrates 20a, 22a, 24a on the mounting surfaces 41a, 41b, 41c is facilitated.
  • the base end portion 40a of the first support member 40 has six insertion holes 40a1, 40a2, 40a3, 40a4, 40a5 for inserting lead wires 70a, 70b, 72a, 72b, 74a, 74b led out from the power supply device 80. 40a6 is formed.
  • Each substrate 20a, 22a, 24a and the first support member 40 are fixed by an adhesive made of silicone resin.
  • an adhesive made of a silicone resin in which metal fine particles are dispersed is used in order to efficiently transfer the heat of the light emitting modules 20, 22, 24 to the first support member 40. Also good.
  • the second support member 50 is formed in a substantially disc shape and is disposed so as to close the opening 11 of the globe 10.
  • the second support member 50 is bonded in a state where the first support member 40 is fixed to the surface of the globe 10 by screws (not shown) and the peripheral surface thereof is in contact with the inner peripheral surface of the case 60. It is fixed to the case 60 with an agent.
  • a stepped portion 50a is formed in the peripheral portion of the second support member 50, and the opening end portion 11a of the globe 10 is disposed in the stepped portion 50a.
  • the adhesive 52 is poured into the region surrounded by the step portion 50 a and the peripheral wall of the case 60 in a state where the opening end portion 11 a of the globe 10 is disposed in the region surrounded by the step portion 50 a and the peripheral wall of the case 60. Accordingly, the globe 10 is fixed to the second support member 50 and the case 60.
  • the second support member 50 is made of metal, ceramics, or the like.
  • the heat transferred from the first support member 40 to the second support member 50 is transmitted to the globe 10 or the case 60 and is released from the outer surface of the globe 10 or the case 60 to the outside air.
  • the second support member 50, the case 60, and the globe 10 are fixed by an adhesive 52 made of silicone resin.
  • an adhesive made of a silicone resin in which metal fine particles are dispersed may be used in order to further enhance the heat transfer from the second support member 50 to the globe 10 and the case 60.
  • Case 60 is formed in a cylindrical shape and located on the globe 10 side, and the case 60 is formed in a cylindrical shape and is continuous with the first case portion 61 on the side opposite to the globe 10 side.
  • the first case member 62 is electrically insulated from the first support member 40 and the base 30, and the power supply device 80 is accommodated therein.
  • the first case portion 61 and the second case portion 62 are made of a synthetic resin such as polybutylene terephthalate (PBT), and are integrally formed by, for example, injection molding.
  • PBT polybutylene terephthalate
  • the first case portion 61 has an inner diameter that is substantially equal to the outer diameter of the second support member 50, and a part of the inner peripheral surface is in contact with the peripheral surface of the second support member 50. And the 2nd support member 50 is fitted and fixed inside the 1st case part 61 by being inserted from the opening by the side of the globe 10 in this 1st case part 61. As shown in FIG. Here, a part of the heat transferred from the second support member 50 to the case 60 is released from the outer peripheral surface of the first case portion 61 to the outside air.
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30.
  • a male screw portion is formed on the outer peripheral surface of the second case portion 62.
  • the second case portion 62 and the base 30 come into contact with each other by screwing the female screw portion formed on the shell 31 of the base 30 into the male screw portion.
  • part of the heat conducted to the case 60 is transmitted from the second case portion 62 to the base 30 and is also released from a socket of a lighting fixture to which the base 30 is attached.
  • the power supply device 80 is for supplying power to the three light emitting modules 20, 22, and 24 and is housed in the case 60.
  • the power supply device 80 includes a plurality of circuit elements and a circuit board on which each circuit element is mounted. This circuit element is a switching element, an inductor, or the like that constitutes a dimmer circuit, a booster circuit, or the like. Further, the power supply device 80 converts AC power received from the base 30 into DC power, and supplies the DC power to the light emitting modules 20, 22, and 24 via the six lead wires 70a, 70b, 72a, 72b, 74a, and 74b. .
  • the lamp 1 is not necessarily provided with the power supply device 80, and is not necessary when DC power is supplied from a socket of a lighting fixture to which the lamp 1 is attached.
  • FIG. 1 A sectional view of the three light emitting modules 20, 22, 24 and the first support member 40 viewed from the direction orthogonal to the lamp axis J1 is shown in FIG. A view seen from the normal direction is shown in FIG.
  • the mounting surface 41a is formed such that an angle ⁇ 1 formed by the direction along the normal line n1 and the direction along the lamp axis J1 is approximately 60 °. Also, with respect to the mounting surfaces 41b and 41c, similarly to the mounting surface 41a, the angle formed by the direction along the normal line (n2 and n3 in FIG. 4A) and the direction along the lamp axis J1 is approximately 60. It is °. That is, the three attachment surfaces 41a, 41b, and 41c are positioned around the lamp axis J1 extending along the longitudinal direction of the first support member 40, and are along the normal lines n1, n2, and n3 and the lamp axis J1.
  • the angles formed with the direction along the line are equal to each other at 60 °.
  • the direction extends radially around the lamp axis J1 (see FIG. 4A). That is, the main light emission directions of the light emitting modules 20, 22, and 24 are different from each other and intersect the lamp axis J ⁇ b> 1 extending along the longitudinal direction of the first support member 40.
  • “intersection” means not only an intersection in the same plane but also a three-dimensional intersection.
  • each of the light emitting modules 20, 22, and 24 such that the main light emission directions of the three light emitting modules 20, 22, and 24 are directed to at least three locations on the peripheral wall of the globe 10. Accordingly, light intensity unevenness on the peripheral wall of the globe 10 is less likely to occur compared to a configuration in which the main light emission directions of the light emitting modules 20, 22, and 24 are the same direction, so that the light distribution characteristics of the lamp 1 can be improved.
  • each light emitting module 20, 22, 24 has a lateral side of the substrates 20a, 22a, 24a (on the main surface of the substrates 20a, 22a, 24a) as compared with the light emitted in the thickness direction of the substrates 20a, 22a, 24a.
  • the amount of light emitted in the direction along the direction is small.
  • the amount of light emitted in the direction orthogonal to the LED chip column direction is greater than the light emitted to the sides of the substrates 20a, 22a, and 24a. Less is.
  • the lamp 1 when viewed from the normal n1 direction of the mounting surface 41a, the lamp 1 extends along the mounting surface 41a and connects the center position of the mounting surface 41a and the lamp axis J1.
  • the angle ⁇ 2 formed by the center line J21 and the imaginary straight line J31 is approximately 45 ° and extends along the mounting surfaces 41b and 41c when viewed from the normal n2 and n3 directions of the mounting surfaces 41b and 41c.
  • the angle formed between the center lines J22 and J23 connecting the center positions of the mounting surfaces 41b and 41c and the lamp axis J1 and the virtual straight lines J32 and J33 is about 45 °.
  • the mounting surfaces 41a, 41b, and 41c when viewed from the direction along the normal lines n1, n2, and n3 of the mounting surfaces 41a, 41b, and 41c, they extend along the mounting surfaces 41a, 41b, and 41c and are centered on the mounting surfaces 41a, 41b, and 41c.
  • the angles formed by the center lines J21, J22, J23 connecting the position and the lamp axis J1 and the virtual straight lines J31, J32, J33 are approximately 45 ° and are equal.
  • the substrates 20a, 22a, and 24a are arranged so that the three virtual straight lines J31, J32, and J33 have a twisted positional relationship.
  • the “positional relationship of torsion” means that the three virtual straight lines J31, J32, and J33 do not intersect with each other in the same plane.
  • two light emitting modules for example, light emitting modules 20 and 22
  • each other in the circumferential direction of the lamp axis J1, it is located on the side of one substrate 22a and in the row direction of the LED chips (the longitudinal direction of the sealing member 22c).
  • the other substrate 20a is disposed on the direction side orthogonal to the light emitting module, the direction orthogonal to the row direction of the plurality of LED chips disposed on the substrate 22a (longitudinal direction of the sealing member 22c), and the light emitting module.
  • the light emitting module 20 is substantially coincident with the main light emitting direction (that is, the direction along the normal line n1 of the mounting surface 41a), so that it is on the side of the substrate 22a from the light emitting module 22 and in the longitudinal direction of the sealing member 22c.
  • the amount of light emitted in the orthogonal direction is supplemented by the amount of light emitted from the light emitting module 20 in the main light emitting direction.
  • the amount of light emitted from the light emitting module 24 to the side of the substrate 24a and in the direction perpendicular to the longitudinal direction of the sealing member 24c is the light emitting direction from the light emitting module 22.
  • the amount of light emitted from the light emitting module 20 to the side of the substrate 20a and in the direction orthogonal to the longitudinal direction of the sealing member 20c is also compensated. This is supplemented by the amount of light emitted from the light emitting module 24 in the main light emitting direction. Therefore, the amount of light unevenness of the light emitted from the entire three light emitting modules 20, 22, 24 to the peripheral wall of the globe 10 is reduced.
  • the lamp 1 has the main light emitting directions (normal lines n1, n2, n3 of the mounting surfaces 41a, 41b, 41c) of the three light emitting modules 20, 22, 24 arranged in the globe 10. ) Are directed in different directions, and intersect with the lamp axis J1 extending along the axial direction of the first support member 40, whereby the three light emitting modules 20, 22, Light is emitted from each of the light emitting modules 20, 22, and 24 so that the main light emission directions of the respective 24 are directed to at least three places on the peripheral wall of the globe 10.
  • FIG. 6 shows a schematic side view, partly broken, of the lighting apparatus according to the present embodiment.
  • the lighting fixture 100 includes the lamp 1 according to the first embodiment and the fixture main body 102 attached to the ceiling material C.
  • the appliance main body 102 includes a holding portion 103 provided with a socket 103 a that holds the lamp 1, and a cover 104 that covers the side of the lamp 1.
  • the ceiling wiring wired on the back of the ceiling is electrically connected to the socket 103a included in the holding unit 103. Then, when the base 30 of the lamp 1 is screwed into the socket 103a, electric power is supplied to the lamp 1 through the socket 103a.
  • the cover 104 has a bowl shape, and has a through hole (not shown) penetrating in the thickness direction of the peripheral wall at the bottom.
  • the globe 10 of the lamp 1 protrudes from the through hole formed in the bottom of the cover 104 to the inside of the cover 104.
  • the light emitted from the outer peripheral surface of the globe 10 of the lamp 1 is reflected by the inner peripheral surface of the cover 104 and emitted to the outside of the lighting fixture 100.
  • FIG. 7 is a perspective view of the lamp 2 according to this modification.
  • the globe 10, the base 30, the second support member 50, the case 60, and the power supply device (not shown) are the same as those in the first embodiment, and thus the description thereof is omitted here.
  • the configuration of the light emitting modules 220 and 222 is the same as the configuration of the light emitting module 20 described in the first embodiment, and thus description thereof is omitted.
  • the first support member 240 has a substantially cylindrical shape and extends from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10 so that the center axis thereof coincides with the lamp axis J1.
  • the base end portion 240 a of the first support member 240 is fixed to the second support member 50.
  • two leg portions 240 c 1 and 240 c 2 protrude from the distal end portion 240 b of the first support member 240 in directions away from each other in a direction orthogonal to the longitudinal direction of the first support member 240.
  • the first support member 240 is made of a material such as metal or ceramics.
  • FIG. 8A A view of the two light emitting modules 220 and 222 and the first support member 240 viewed from the lamp axis J1 direction is shown in FIG. 8A, and the two light emitting modules 220 and 222 are removed and viewed from the lamp axis J1 direction. This figure is shown in FIG. In FIG. 8A, the power supply terminal is omitted.
  • two attachment surfaces 241a and 241b to which the light emitting modules 220 and 222 are attached are formed at the tips of the leg portions 240c1 and 240c2.
  • the attachment surfaces 241a and 241b of the tip end portion 240a of the first support member 240 are formed in an elliptical shape, and are positioned around the lamp axis J1 extending along the longitudinal direction of the first support member 240.
  • the center lines J221 and J222 connecting the center positions of the mounting surfaces 241a and 241b and the lamp axis J1 are viewed from the lamp axis J1 direction, the center lines J221 and J222 are positioned on a straight line. As shown in FIG.
  • each light emitting module 220, 222 has a mounting surface 241a, a surface opposite to the surface on which the LED chips and the sealing members 220c, 222c are provided on the substrates 220a, 222a. It is attached in a state of being in contact with 241b. At this time, the main light emitting direction of each light emitting module 220, 222 (the normal direction of the main surface of the substrates 220a, 222a) coincides with the normal n21, n22 direction of each mounting surface 241a, 241b.
  • each light emitting module 220, 222 that is, the direction along the normal lines n21, n22 of each mounting surface 241a, 241b extends substantially in parallel.
  • the two attachment surfaces 241a and 241b formed at the distal ends of the leg portions 240c1 and 240c2 of the first support member 240 are attached to the attachment surfaces 241a and 241b, respectively.
  • the convex portions 241a1 and 241b1 projecting in the direction along the normal lines n21 and n22 are provided, and the convex portions 241a1 and 241b1 are arranged in the normal direction of the mounting surfaces 241a and 241b (along the normal lines n21 and n22). It is formed in a rectangular shape as viewed from the (direction).
  • the external dimensions viewed from the normal direction (direction along the normal lines n21 and n22) of the mounting surfaces 241a and 241b of the respective convex portions 241a1 and 241b1 are the second penetrations provided in the respective substrates 220a and 222a.
  • the outer dimensions of the holes 220f and 222f in the plan view are substantially equal.
  • each convex part 241a1, 241b1 is inserted in 2nd through-hole 220f, 222f, respectively.
  • the base end portion 240a of the first support member 240 is formed with four insertion holes 240a1, 240a2, 240a3, 240a4 for inserting lead wires 270a, 270b, 272a, 272b led out from the power supply device.
  • each of the substrates 220a and 222a and the first support member 240 are fixed by an adhesive (not shown).
  • FIG. 9A A cross-sectional view of the two light emitting modules 220 and 222 and the first support member 240 according to the present modification viewed from the direction orthogonal to the lamp axis is shown in FIG. 9A and viewed from the normal direction of the mounting surface 241a.
  • FIG. 9A A perspective view is shown in FIG.
  • the mounting surface 241a is formed such that an angle ⁇ 21 formed by the normal line n21 and the lamp axis J1 is approximately 60 °. Also, the angle formed between the normal line n22 and the lamp axis J1 is equal to the mounting surface 241b. Further, as described above, when viewed from the lamp axis J1, the main light emitting direction of each light emitting module 220, 222, that is, the direction along the normal lines n21, n22 of each mounting surface 241a, 241b extends substantially in parallel. is doing. That is, the main light emission directions of the light emitting modules 220 and 222 are different from each other and intersect the lamp axis J1 extending along the axial direction of the first support member 240.
  • each of the light emitting modules 220 and 222 such that the main light emission directions of the two light emitting modules 220 and 222 are directed to at least two places on the peripheral wall of the globe 10. Therefore, compared to a configuration in which the main light emission directions of the light emitting modules 220 and 222 are the same, light intensity unevenness on the peripheral wall of the globe 10 is less likely to be generated, so that the light distribution characteristics of the lamp 2 can be improved.
  • an angle ⁇ 22 formed between a virtual line J231 and a center line J221 extending along the mounting surface 241a and connecting the center position of the mounting surface 241a and the lamp axis J1 is substantially equal. It is 45 °.
  • the angle formed between the center line J222 extending along the attachment surface 241b and connecting the center position of each attachment surface 241b and the lamp axis J1 and the virtual straight line J232 is also approximately 45 °. That is, with respect to the two light emitting modules 220 and 222, the two light emitting modules 220 and 222 are attached to the first support member 240 so that the two virtual straight lines J231 and J232 are in a twisted positional relationship.
  • the example of the lamp 2 including the two light emitting modules 220 and 222 has been described.
  • the number of light emitting modules is not limited to two or three, and four or more light emitting modules are included. It may be provided.
  • lead wires 70a, 70b, 72a, 72b, 74a, and 74b are supported by lead wires 70a, 70b, 72a, 72b, 74a, and 74b.
  • a bundle of lead wires 70a, 70b, 72a, 72b, 74a, and 74b constitutes a long support member that supports the three light emitting modules 320, 322, and 324.
  • the lead wires 70a, 70b, 72a, 72b, 74a, and 74b may be made of a metal wire formed by diffusion-bonding copper to the surface of a metal wire made of an iron nickel alloy, for example.
  • the second support member 350 is made of glass, a part of the lead wires 70a, 70b, 72a, 72b, 74a, 74b is second supported.
  • the second support member 350 can be fixed while being embedded in the member 350.
  • the weight of each light emitting module 320, 322, 324 needs to be within an allowable range determined based on the bending strength of the lead wires 70a, 70b, 72a, 72b, 74a, 74b.
  • the first support members 40 and 240 in the first embodiment and the modified example (1) are not required, so that the cost can be reduced by reducing the number of parts.
  • the main light emitting direction of each of the three light emitting modules 20, 22, 24 arranged in the globe 10 (along the normal lines n1, n2, n3 of the mounting surfaces 41a, 41b, 41c)
  • the present invention is not limited to this.
  • the main light of two light-emitting modules among the three light-emitting modules 20, 22, and 24 is described.
  • the emission directions may be parallel, and the main light emission direction of the two light emitting modules may be different from the main light emission direction of the remaining one light emitting module.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A lamp (1) is provided with: three light emitting modules (20, 22, 24), which respectively have substrates (20a, 22a, 24a) that are composed of a light transmitting material, and LED chips mounted on the substrates (20a, 22a, 24a); a globe (10), which is composed of a light transmitting material, and which has the three light emitting modules (20, 22, 24) disposed therein; and a first supporting member (40), which protrudes toward the inward of the globe (10), and which has the light emitting modules (20, 22, 24) attached to the leading end portion thereof. The main light output directions (directions along normal lines (n1, n2, n3) of attaching surfaces (41a, 41a, 41c)) of the three light emitting modules (20, 22, 24) are in the directions different from each other.

Description

ランプおよびこれを用いた照明器具Lamp and lighting apparatus using the same
　本発明は、発光素子を用いたランプに関し、特に、配光特性の改善に関する。 The present invention relates to a lamp using a light emitting element, and more particularly to improvement of light distribution characteristics.
　従来から、白熱電球またはハロゲン電球に比べて高効率且つ長寿命である、ＬＥＤ（Light Emitting Diode）チップ等の半導体発光素子を用いたランプが提案されている（特許文献１，２参照）。 Conventionally, a lamp using a semiconductor light emitting element such as an LED (Light Emitting Diode) chip, which has higher efficiency and longer life than an incandescent bulb or a halogen bulb has been proposed (see Patent Documents 1 and 2).
特開２００６－３１３７１７号公報JP 2006-313717 A 特許第４２９０８８７号公報Japanese Patent No. 4290887
　ところで、この種のランプには、光源として、例えば、図１１（ａ）に示すように、ガラス等の透光性材料からなる基板１１１０上に複数（図１１（ａ）の例では、１６個）のＬＥＤチップ１１２０を実装し、これら複数のＬＥＤチップ１１２０を、波長変換材料を含有する封止部材１１３０で封止してなる発光モジュール１１００を用いることが考えられる。この発光モジュール１１００は、ＬＥＤチップ１１２０から、基板１１１０を通って基板１１１０におけるＬＥＤチップ１１２０の実装面とは反対側の面（裏面）からも光が放射される。 By the way, in this kind of lamp, as a light source, for example, as shown in FIG. 11A, a plurality of (16 in the example of FIG. 11A) are formed on a substrate 1110 made of a translucent material such as glass. It is conceivable to use a light emitting module 1100 formed by mounting a plurality of LED chips 1120 with a sealing member 1130 containing a wavelength conversion material. In the light emitting module 1100, light is emitted from the LED chip 1120 through the substrate 1110 and also from the surface (back surface) opposite to the mounting surface of the LED chip 1120 on the substrate 1110.
　そして、このような基板１１１０の両面から光が放射される発光モジュール１１００を用いたランプとして、例えば、図１２に示すように、グローブ１０１０の略中央部に発光モジュール１１００が配置されたランプ１００１が考えられる。ここで、発光モジュール１１００は、支持部材１１４０の先端部に取着されている。また、支持部材１１４０は、グローブ１０１０と口金１１３０とが取り付けられたケース１１６０に固定されている。 As a lamp using the light emitting module 1100 that emits light from both surfaces of the substrate 1110, for example, as shown in FIG. 12, a lamp 1001 in which the light emitting module 1100 is disposed at a substantially central portion of the globe 1010 is provided. Conceivable. Here, the light emitting module 1100 is attached to the tip of the support member 1140. The support member 1140 is fixed to a case 1160 to which a globe 1010 and a base 1130 are attached.
　しかしながら、図１１（ａ）に示すような発光モジュール１１００は、図１１（ｂ）の一点鎖線Ｓで表されるような配光特性を示す。即ち、発光モジュール１１００の配光特性は、基板１１１０の主面に沿った方向に放射される光（図１１（ｂ）の領域Ａ１に放射される光）の光量が、基板１１１０の主面に交差する方向（例えば、主面とのなす角度が３０°乃至９０°の方向）に放射される光（図１１（ｂ）の領域Ａ２に放射される光）の光量に比べて小さくなる。すると、図１２に示すように、点灯時において、グローブ１０１０の周壁における基板１１１０の主面を含む仮想面と交わる部位の近傍（図１２中のハッチングで示した部分）が暗くなってしまう。 However, the light emitting module 1100 as shown in FIG. 11A exhibits a light distribution characteristic as represented by a one-dot chain line S in FIG. That is, the light distribution characteristics of the light emitting module 1100 are such that the amount of light emitted in the direction along the main surface of the substrate 1110 (light emitted to the region A1 in FIG. 11B) is on the main surface of the substrate 1110. It is smaller than the amount of light emitted in the intersecting direction (for example, the direction formed by an angle with the main surface of 30 ° to 90 °) (light emitted to the region A2 in FIG. 11B). Then, as shown in FIG. 12, the vicinity of the part intersecting with the virtual surface including the main surface of the substrate 1110 on the peripheral wall of the globe 1010 (the portion indicated by hatching in FIG. 12) becomes dark at the time of lighting.
　このように点灯時において、グローブ１０１０の周壁に暗い部分ができると、ランプ１００１から周囲に放射される光に光量斑ができてしまい、ランプ１００１の配光特性が悪化してしまう。ここにおいて、ランプ１００１から周囲に放射される光の光量斑が少ないほどランプ１００１の配光特性が良いとしている。 Thus, when a dark portion is formed on the peripheral wall of the globe 1010 during lighting, a light amount spot is formed in the light emitted from the lamp 1001 to the surroundings, and the light distribution characteristic of the lamp 1001 is deteriorated. Here, it is assumed that the light distribution characteristic of the lamp 1001 is better as the amount of light emitted from the lamp 1001 to the surroundings is smaller.
　本発明は、上記事由に鑑みてなされたものであり、配光特性の向上を図ることができるランプを提供することを目的とする。 The present invention has been made in view of the above reasons, and an object thereof is to provide a lamp capable of improving the light distribution characteristics.
　本発明に係るランプは、透光性材料からなる基板および当該基板に実装された発光素子を有する複数の発光モジュールと、透光性材料からなり且つ一部に開口部を有するグローブと、グローブの開口部から内方に向かって延出され且つ先端部に複数の発光モジュールそれぞれが取り付けられた支持部材とを備え、複数の発光モジュールそれぞれの主光出射方向のうち、少なくとも２つの主光出射方向が異なる方向を向いている。 A lamp according to the present invention includes a light-emitting module having a substrate made of a light-transmitting material and a light-emitting element mounted on the substrate, a globe made of the light-transmitting material and partially having an opening, A support member extending inward from the opening and having each of the plurality of light emitting modules attached to the tip, and at least two main light emitting directions among the main light emitting directions of the plurality of light emitting modules. Are facing different directions.
　本構成によれば、グローブ内に配置された複数の発光モジュールそれぞれの主光出射方向のうち、少なくとも２つの主光出射方向が異なる方向を向いていることにより、複数の発光モジュールの少なくとも２つの主光出射方向がグローブの周壁における少なくとも２箇所に向く形で各発光モジュールから光が放射される。これにより、発光モジュールの主光出射方向が同一方向である構成に比べて、グローブの周壁における光量斑が生じにくくなるので、ランプの配光特性を向上することができる。 According to this configuration, at least two of the light emitting modules arranged in the globe have different at least two main light emitting directions, and thus at least two of the plurality of light emitting modules are directed to different directions. Light is emitted from each light emitting module in such a manner that the main light emitting direction is directed to at least two places on the peripheral wall of the globe. Thereby, compared to the configuration in which the main light emission direction of the light emitting module is the same direction, light amount unevenness on the peripheral wall of the globe is less likely to be generated, so that the light distribution characteristics of the lamp can be improved.
実施の形態１に係る電球形ランプの斜視図1 is a perspective view of a light bulb shaped lamp according to Embodiment 1. FIG. 実施の形態１に係る電球形ランプの断面図Sectional drawing of the light bulb shaped lamp concerning Embodiment 1 実施の形態１に係る発光モジュールを示し、（ａ）は斜視図、（ｂ）は平面図The light emitting module which concerns on Embodiment 1 is shown, (a) is a perspective view, (b) is a top view. 実施の形態１に係る発光モジュールおよび第１支持部材について、（ａ）はランプ軸方向から見た図、（ｂ）は発光モジュールを取り除いた状態でランプ軸方向から見た図About the light emitting module and 1st supporting member which concern on Embodiment 1, (a) is the figure seen from the lamp | ramp axial direction, (b) is the figure seen from the lamp | ramp axial direction in the state which removed the light emitting module. 実施の形態１に係る発光モジュールおよび第１支持部材について、（ａ）はランプ軸に直交する方向から見た断面図、（ｂ）は取付面の法線方向から見た斜視図About the light emitting module and 1st supporting member which concern on Embodiment 1, (a) is sectional drawing seen from the direction orthogonal to a lamp axis, (b) is the perspective view seen from the normal line direction of the attachment surface 実施の形態２に係る照明器具の一部破断した側面図Side view in which the lighting apparatus according to Embodiment 2 is partially broken 変形例に係るランプの斜視図The perspective view of the lamp | ramp which concerns on a modification 変形例に係る発光モジュールおよび第１支持部材について、（ａ）はランプ軸方向から見た図、（ｂ）は発光モジュールを取り除いた状態でランプ軸方向から見た図About the light emitting module and 1st supporting member which concern on a modification, (a) is the figure seen from the lamp axial direction, (b) is the figure seen from the lamp axial direction in the state which removed the light emitting module. 変形例に係る発光モジュールおよび第１支持部材について、（ａ）はランプ軸に直交する方向から見た断面図、（ｂ）は取付面の法線方向から見た斜視図About the light emitting module and 1st supporting member which concern on a modification, (a) is sectional drawing seen from the direction orthogonal to a lamp axis, (b) is the perspective view seen from the normal line direction of the attachment surface 変形例に係るランプの斜視図The perspective view of the lamp | ramp which concerns on a modification 従来例に係る発光モジュールを示し、（ａ）は斜視図、（ｂ）は、光学特性を説明するための図The light emitting module which concerns on a prior art example is shown, (a) is a perspective view, (b) is a figure for demonstrating an optical characteristic. 従来例に係るランプの光学的特性を説明するための図The figure for demonstrating the optical characteristic of the lamp | ramp which concerns on a prior art example
　＜実施の形態１＞
　＜１＞構成
　図１は、本実施の形態に係るランプ１の斜視図であり、図２は、本実施の形態に係るランプ１の断面図である。なお、図２において、紙面上下方向に沿って描かれた一点鎖線はランプ１の対称軸（以下、「ランプ軸」と称する）Ｊ１を示している。 <Embodiment 1>
<1> Configuration FIG. 1 is a perspective view of a lamp 1 according to the present embodiment, and FIG. 2 is a cross-sectional view of the lamp 1 according to the present embodiment. In FIG. 2, an alternate long and short dash line drawn in the vertical direction of the drawing indicates a symmetry axis (hereinafter referred to as “lamp axis”) J1 of the lamp 1.
　図１および図２に示すように、本実施の形態に係るランプ１は、白熱電球に代替する電球形のＬＥＤランプであって、透光性のグローブ１０と、３つの発光モジュール２０，２２，２４と、外部から電力を受電するための口金３０と、第１支持部材４０と、第２支持部材５０と、ケース６０と、電源装置８０とを備える。 As shown in FIGS. 1 and 2, a lamp 1 according to the present embodiment is a light bulb-shaped LED lamp that replaces an incandescent light bulb, and includes a translucent globe 10 and three light emitting modules 20, 22, 24, a base 30 for receiving power from the outside, a first support member 40, a second support member 50, a case 60, and a power supply device 80.
　＜１－１＞グローブ
　グローブ１０は、透光性を有する中空部材であって、３つの発光モジュール２０，２２，２４が内部に配置されている。このグローブ１０は、可視光に対して透明なシリカガラスから形成されている。 <1-1> Globe The globe 10 is a light-transmitting hollow member, in which three light emitting modules 20, 22, and 24 are arranged. The globe 10 is made of silica glass that is transparent to visible light.
　また、グローブ１０は、中空の球状部と当該球状部の一部から外方に突出する突出部とから構成される形状を有し、突出部の先端部に開口部１１が形成されている。即ち、グローブ１０の形状は、一般的な白熱電球と同様のＡ形（ＪＩＳ　Ｃ７７１０）である。なお、グローブ１０の形状は、必ずしもＡ形である必要はない。例えば、グローブ１０の形状は、Ｇ形であってもよい。また、グローブ１０は、必ずしも可視光に対して透明である必要はなく、例えば、シリカを塗布して乳白色の拡散膜を形成する等によって拡散処理が施されてなるものでもよい。また、グローブ１０は、必ずしもシリカガラス製である必要はなく、アクリル樹脂等の透光性樹脂からなるものでもよい。 Further, the globe 10 has a shape composed of a hollow spherical portion and a protruding portion protruding outward from a part of the spherical portion, and an opening 11 is formed at the tip of the protruding portion. That is, the shape of the globe 10 is an A shape (JIS C7710) similar to a general incandescent bulb. In addition, the shape of the globe 10 does not necessarily need to be A-shaped. For example, the shape of the globe 10 may be G-shaped. The globe 10 does not necessarily need to be transparent to visible light, and may be subjected to a diffusion treatment, for example, by applying silica to form a milky white diffusion film. The globe 10 is not necessarily made of silica glass, and may be made of a light-transmitting resin such as an acrylic resin.
　＜１－２＞発光モジュール
　発光モジュール２０，２２，２４は、透光性材料からなる基板２０ａ，２２ａ，２４ａと、基板２０ａ，２２ａ，２４ａ上に実装された複数（例えば、１８個）のＬＥＤチップを備えており、主光出射方向が各基板２０ａ，２２ａ，２４ａの主面の法線方向と一致している。 <1-2> Light Emitting Module The light emitting modules 20, 22, and 24 include substrates 20a, 22a, and 24a made of a translucent material, and a plurality of (for example, 18) LEDs mounted on the substrates 20a, 22a, and 24a. A chip is provided, and the main light emission direction coincides with the normal direction of the main surface of each of the substrates 20a, 22a, and 24a.
　また、発光モジュール２０は、電源装置８０から２本のリード線７０ａ、７０ｂを介して電力供給を受ける。また、発光モジュール２２は、電源装置８０から２本のリード線７２ａ，７２ｂを介して電力供給を受け、発光モジュール２４は、電源装置８０から２本のリード線７４ａ，７４ｂを介して電力供給を受ける。 Further, the light emitting module 20 receives power supply from the power supply device 80 through the two lead wires 70a and 70b. The light emitting module 22 is supplied with power from the power supply device 80 via two lead wires 72a and 72b, and the light emitting module 24 is supplied with power from the power supply device 80 via two lead wires 74a and 74b. receive.
　次に、本実施の形態に係る発光モジュール２０の構成について、図３（ａ）および（ｂ）を用いて詳述する。なお、発光モジュール２２，２４は、発光モジュール２０と同様の構成であるので、ここでは説明を省略する。 Next, the configuration of the light emitting module 20 according to the present embodiment will be described in detail with reference to FIGS. 3 (a) and 3 (b). Since the light emitting modules 22 and 24 have the same configuration as the light emitting module 20, the description thereof is omitted here.
　図３（ａ）は、本実施の形態に係る発光モジュールの斜視図であり、図３（ｂ）は、平面図である。 FIG. 3A is a perspective view of the light emitting module according to the present embodiment, and FIG. 3B is a plan view.
　図３（ａ）および（ｂ）に示すように、発光モジュール２０は、ＬＥＤチップが基板上に直接実装されたＣＯＢ型（Ｃｈｉｐ　Ｏｎ　Ｂｏａｒｄ）の発光モジュールであって、基板２０ａと、青色光を放射するＬＥＤチップ２０ｂと、封止部材２０ｃと、給電端子２０ｄ１，２０ｄ２とを有する。 As shown in FIGS. 3A and 3B, the light emitting module 20 is a COB type (Chip On Board) light emitting module in which an LED chip is directly mounted on a substrate, and emits blue light with the substrate 20a. The LED chip 20b that radiates, the sealing member 20c, and the power supply terminals 20d1 and 20d2 are included.
　基板２０ａは、矩形板状に形成され且つ厚み方向における一面（主面）側に複数のＬＥＤチップ２０ｂが実装される。また、基板２０ａは、長手方向における両端部それぞれに第１貫通孔２０ｅが形成されるとともに、長手方向における略中央部に第２貫通孔２０ｆが形成されている。ここで、第１貫通孔２０ｅは、基板２０ａの厚み方向に沿った方向（主面の法線方向）から見て（以下、「平面視」と称す。）略円形状であり、第２貫通孔２０ｆは、平面視で矩形状である。この基板２０ａは、セラミックス（例えば、アルミナ）やガラス等の可視光に対して透光性を有する透光性材料からなる。 The substrate 20a is formed in a rectangular plate shape, and a plurality of LED chips 20b are mounted on one surface (main surface) side in the thickness direction. The substrate 20a has a first through hole 20e formed at each of both ends in the longitudinal direction, and a second through hole 20f formed at a substantially central portion in the longitudinal direction. Here, the first through hole 20e has a substantially circular shape as viewed from the direction along the thickness direction of the substrate 20a (the normal direction of the main surface) (hereinafter referred to as “plan view”), and the second through hole The hole 20f is rectangular in plan view. The substrate 20a is made of a translucent material having translucency with respect to visible light, such as ceramics (for example, alumina) or glass.
　ＬＥＤチップ２０ｂは、ＧａＮ系の半導体材料から形成されている。ＬＥＤチップ２０ｂは、基板２０ａの一面側に複数個（図３（ａ）および（ｂ）では、１８個）実装されている。そして、９個のＬＥＤチップ２０ｂを一列として２列配置されている。そして、基板２０ａの長手方向において隣接するＬＥＤチップ２０ｂ同士は、当該ＬＥＤチップ２０ｂの間に配設された電極パッド（図示せず）と当該電極パッドに電気的に接続されたワイヤ（図示せず）を介して電気的に接続されている。なお、本実施の形態では、１８個のＬＥＤチップ２０ｂが基板２０ａ上に実装された例について説明したが、これに限定されるものではなく、ＬＥＤチップ２０ｂの個数は、ランプ１の用途に応じて適宜変更してもよい。また、ＬＥＤチップ２０ｂが、基板２０ａ上に２列に実装されている例について説明したが、これに限定されるものではなく、例えば、１列や３列以上の複数列でもよい。 The LED chip 20b is made of a GaN-based semiconductor material. A plurality of LED chips 20b (18 in FIGS. 3A and 3B) are mounted on one side of the substrate 20a. And nine LED chips 20b are arranged in two rows as one row. The LED chips 20b adjacent to each other in the longitudinal direction of the substrate 20a are composed of an electrode pad (not shown) disposed between the LED chips 20b and a wire (not shown) electrically connected to the electrode pad. ). In the present embodiment, an example in which 18 LED chips 20b are mounted on the substrate 20a has been described. However, the present invention is not limited to this, and the number of LED chips 20b depends on the application of the lamp 1. May be changed as appropriate. Further, the example in which the LED chips 20b are mounted in two rows on the substrate 20a has been described, but the present invention is not limited to this, and for example, one row or a plurality of rows of three or more rows may be used.
　封止部材２０ｃは、複数（図３（ａ）および（ｂ）では９個）のＬＥＤチップ２０ｂからなる素子列全体を覆うように配置されている。従って、封止部材２０ｃの長手方向は、上記素子列の列方向と一致している。本実施の形態では、上記素子列が２列設けられているので、２本の封止部材２０ｃが設けられている。また、封止部材２０ｃは、波長変換部材である蛍光体を含有し、ＬＥＤチップ２０ｂから放射される青色光を黄色光に変換する。具体的には、封止部材２０ｃは、透光性を有するシリコーン樹脂に黄色蛍光体粒子（図示せず）および光拡散材（図示せず）を分散させてなる。この蛍光体粒子としては、（Ｙ，Ｇｄ）3Ａｌ5Ｏ12：Ｃｅ3+、Ｙ3Ａｌ5Ｏ12：Ｃｅ3+、などのＹＡＧ系の黄色蛍光体粒子からなる。これにより、ＬＥＤチップ２０ｂから放射された青色光の一部が、封止部材２０ｃに含有される黄色蛍光体粒子によって黄色光に変換される。そして、黄色蛍光体粒子により変換されなかった青色光と、黄色蛍光体粒子によって変換されてなる黄色光とが混合されて白色光となって封止部材２０ｃの外周面から放射される。また、前述のように、基板２０ａは透光性材料から形成されている。これにより、ＬＥＤチップ２０ｂの青色光と当該青色光が封止部材２０ｃにより変換されてなる黄色光とが、基板２０ａを透過してＬＥＤチップ２０ｂが実装される上記一面側とは反対側の他面側からも放射される。 The sealing member 20c is disposed so as to cover the entire element array composed of a plurality (9 in FIG. 3A and FIG. 3B) of LED chips 20b. Therefore, the longitudinal direction of the sealing member 20c coincides with the column direction of the element column. In the present embodiment, since two element rows are provided, two sealing members 20c are provided. Further, the sealing member 20c contains a phosphor that is a wavelength conversion member, and converts blue light emitted from the LED chip 20b into yellow light. Specifically, the sealing member 20c is formed by dispersing yellow phosphor particles (not shown) and a light diffusing material (not shown) in a translucent silicone resin. The phosphor particles are composed of YAG-based yellow phosphor particles such as (Y, Gd) 3 Al 5 O 12 : Ce 3+ , Y 3 Al 5 O 12 : Ce 3+ . Thereby, a part of blue light radiated | emitted from LED chip 20b is converted into yellow light by the yellow fluorescent substance particle contained in the sealing member 20c. Then, the blue light that has not been converted by the yellow phosphor particles and the yellow light that has been converted by the yellow phosphor particles are mixed to form white light, which is emitted from the outer peripheral surface of the sealing member 20c. Further, as described above, the substrate 20a is formed from a light-transmitting material. Thereby, the blue light of the LED chip 20b and the yellow light obtained by converting the blue light by the sealing member 20c are transmitted through the substrate 20a and the other side opposite to the one surface side on which the LED chip 20b is mounted. Also emitted from the surface side.
　また、光拡散材としては、シリカ等の透光性材料からなる粒子が用いられている。なお、黄色蛍光体粒子としては、例えば、（Ｓｒ，Ｂａ）2ＳｉＯ4：Ｅｕ2+、Ｓｒ3ＳｉＯ5：Ｅｕ2+等の黄色蛍光体でもよいし、或いは、（Ｂａ，Ｓｒ）2ＳｉＯ4：Ｅｕ2+、Ｂａ3Ｓｉ6Ｏ12Ｎ2：Ｅｕ2+などの緑色蛍光体およびＣａＡｌＳｉＮ3：Ｅｕ2+、Ｓｒ2（Ｓｉ，Ａｌ）5（Ｎ，Ｏ）8：Ｅｕ2+などの赤色蛍光体とを用いても構わない。 As the light diffusing material, particles made of a translucent material such as silica are used. The yellow phosphor particles may be, for example, yellow phosphors such as (Sr, Ba) 2 SiO 4 : Eu 2+ , Sr 3 SiO 5 : Eu 2+ , or (Ba, Sr) 2 SiO. 4 : Eu 2+ , Ba 3 Si 6 O 12 N 2 : Green phosphor such as Eu 2+ and CaAlSiN 3 : Eu 2+ , Sr 2 (Si, Al) 5 (N, O) 8 : Eu 2+ etc. The red phosphor may be used.
　また、封止部材２０ｃは、必ずしもシリコーン樹脂によって構成する必要はなく、フッ素系樹脂など有機材のほか、低融点ガラス、ゾルゲルガラス等の無機材を用いてもよい。なお、無機材は有機材に比べて耐熱特性が優れているので、無機材からなる封止部材２０ｃは、高輝度化に有利である。 Further, the sealing member 20c is not necessarily made of a silicone resin, and an organic material such as a fluorine resin, or an inorganic material such as a low-melting glass or a sol-gel glass may be used. In addition, since the inorganic material is superior in heat resistance characteristics compared to the organic material, the sealing member 20c made of the inorganic material is advantageous for increasing the luminance.
　また、封止部材２０ｃは、ＬＥＤチップ２０ｂが実装されていない面にも形成しても構わない。これにより、基板２０ａ内を透過してＬＥＤチップ２０ｂが実装されていない面から放射される青色光も黄色光に変換される。したがって、ＬＥＤチップ２０ｂが実装されていない側から放射される光の色を、封止部材２０ｃから直接放射される光の色に近づけることができる。 Further, the sealing member 20c may be formed on a surface where the LED chip 20b is not mounted. Thereby, the blue light radiated | emitted from the surface which permeate | transmits the board | substrate 20a and LED chip 20b is not mounted is also converted into yellow light. Therefore, the color of light emitted from the side where the LED chip 20b is not mounted can be brought close to the color of light emitted directly from the sealing member 20c.
　或いは、基板２０ａにおけるＬＥＤチップ２０ｂの直下部分に黄色蛍光体を焼付けしたものであってもよい。この場合、ＬＥＤチップ２０ｂから当該ＬＥＤチップ２０ｂの直下部分を通って基板２０ａにおけるＬＥＤチップ２０ｂが実装されていない面から放射される青色光も黄色光に変換される。 Alternatively, a yellow phosphor may be baked on a portion of the substrate 20a immediately below the LED chip 20b. In this case, the blue light emitted from the surface of the substrate 20a where the LED chip 20b is not mounted is also converted into yellow light from the LED chip 20b through the portion immediately below the LED chip 20b.
　なお、封止部材２０ｃは、素子列に従って直線状に２本形成される例について説明したが、これに限定されるものではなく、例えば、基板２０ａ上の全てのＬＥＤチップ２０ｂを一括して覆うように形成されるものでもよい。 In addition, although the example in which two sealing members 20c are formed in a straight line according to the element row has been described, the present invention is not limited to this, and for example, covers all the LED chips 20b on the substrate 20a at once. It may be formed as follows.
　給電端子２０ｄ１、２０ｄ２は、電源装置８０からリード線７０ａ、７０ｂを介して電力供給を受けるための端子である。ここにおいて、第１貫通孔２０ｅそれぞれに、リード線７０ａ、７０ｂそれぞれの先端部を挿通した状態で、半田からなる導電性接合部材を第１貫通孔２０ｅに流し込むことによって、給電端子２０ｄ１とリード線７０ａとが電気的に接続されるとともに給電端子２０ｄ２とリード線７０ｂとが電気的に接続される。 The power supply terminals 20d1 and 20d2 are terminals for receiving power supply from the power supply device 80 via the lead wires 70a and 70b. Here, by feeding a conductive joining member made of solder into the first through hole 20e in a state where the leading ends of the lead wires 70a and 70b are inserted into the first through holes 20e, respectively, the power supply terminals 20d1 and the lead wires 70a is electrically connected, and the power supply terminal 20d2 and the lead wire 70b are electrically connected.
　また、基板２０ａのＬＥＤチップが実装される面側には、金属配線２０ｄ３，２０ｄ４がパターンニングされている。この金属配線２０ｄ３，２０ｄ４は、上記各素子列の両端部に配置されたＬＥＤチップ２０ｂと、給電端子２０ｄ１，２０ｄ２とを電気的に接続する。この金属配線の材料としては、例えば、銀（Ａｇ）、タングステン（Ｗ）、銅（Ｃｕ）またはＩＴＯ（Ｔｉｎ－ｄｏｐｅｄ　Ｉｎｄｉｕｍ　Ｏｘｉｄｅ）等を用いることができる。なお、この金属配線２０ｄ３，２０ｄ４は、その表面にニッケル（Ｎｉ）／金（Ａｕ）等のメッキ処理が施されたものでもよい。 Further, metal wirings 20d3 and 20d4 are patterned on the surface side of the substrate 20a on which the LED chip is mounted. The metal wirings 20d3 and 20d4 electrically connect the LED chips 20b disposed at both ends of each element row and the power supply terminals 20d1 and 20d2. As a material of the metal wiring, for example, silver (Ag), tungsten (W), copper (Cu), ITO (Tin-doped Indium Oxide), or the like can be used. The metal wirings 20d3 and 20d4 may have their surfaces plated with nickel (Ni) / gold (Au) or the like.
　＜１－３＞口金
　口金３０は、例えば、Ｅ２６形の口金であり、ランプ１が照明器具に取着されて点灯された際に、照明器具のソケットから電力を受けるためのものである。図２に示すように、この口金３０は、略円筒状のシェル３１と、シェル３１の筒軸方向における片側に絶縁体部３２を介して装着されたアイレット３３とからなる。 <1-3> Base The base 30 is, for example, an E26-type base for receiving power from the socket of the lighting fixture when the lamp 1 is attached to the lighting fixture and turned on. As shown in FIG. 2, the base 30 includes a substantially cylindrical shell 31 and an eyelet 33 attached to one side of the shell 31 in the cylinder axis direction via an insulator portion 32.
　シェル３１は、電源線９０ａを介して電源装置８０に接続され、アイレット３３は電源線９０ｂを介して電源装置８０に接続されている。シェル３１の外周面には、照明器具のソケットに螺合させるための雄螺子部が形成され、内周面には、ケース６０の第２ケース部６２に螺合させるための雌螺子部が形成されている。なお、電源線９０ａは、ケース６０の第２ケース部６２の内側から周壁に貫設された貫通孔６２ａに挿通され、その先端部がシェル３１に設けられた切欠部３１ａの内側に配置された状態でシェル３１に半田付けされている。これにより、電源線９０ａとシェル３１とが半田を介して電気的に接続される。なお、口金３０は、必ずしもＥ２６形の口金である必要はなく、Ｅ１７形など異なる大きさの口金であってもよい。また、口金３０は、必ずしもネジ込み形の口金である必要はなく、例えば差し込み形など異なる形状の口金であってもよい。 The shell 31 is connected to the power supply device 80 via the power supply line 90a, and the eyelet 33 is connected to the power supply device 80 via the power supply line 90b. A male screw portion is formed on the outer peripheral surface of the shell 31 to be screwed into the socket of the lighting fixture, and a female screw portion is formed on the inner peripheral surface to be screwed into the second case portion 62 of the case 60. Has been. The power line 90 a is inserted from the inside of the second case portion 62 of the case 60 into a through hole 62 a that is provided in the peripheral wall, and the tip thereof is disposed inside the cutout portion 31 a provided in the shell 31. It is soldered to the shell 31 in a state. Thereby, the power supply line 90a and the shell 31 are electrically connected via the solder. The base 30 does not necessarily have to be an E26 type base, and may be a base having a different size such as an E17 type. The base 30 is not necessarily a screw-type base, and may be a base having a different shape such as a plug-in type.
　＜１－４＞第１支持部材
　図１および図２に示すように、第１支持部材４０は、長尺の円柱状であり、その軸がランプ軸Ｊ１と一致するように、グローブ１０の開口部１１の近傍からグローブ１０の内方に向かって延出しており、基端部４０ａが、第２支持部材５０に固定されている。この第１支持部材４０は、金属やセラミックス、ガラス等から形成されている。 <1-4> First Support Member As shown in FIGS. 1 and 2, the first support member 40 has a long cylindrical shape, and the opening of the globe 10 is arranged so that its axis coincides with the lamp axis J1. The base portion 40 a extends from the vicinity of the portion 11 toward the inside of the globe 10 and is fixed to the second support member 50. The first support member 40 is made of metal, ceramics, glass, or the like.
　第１支持部材４０と３つの発光モジュール２０，２２，２４とについて、ランプ軸Ｊ１方向から見た図を図４（ａ）に示し、３つの発光モジュール２０，２２，２４を取り除いた状態でランプ軸Ｊ１方向から見た図を図４（ｂ）に示す。なお、図４（ａ）では、給電端子を省略して図示している。 FIG. 4A shows a view of the first support member 40 and the three light emitting modules 20, 22, and 24 viewed from the direction of the lamp axis J1, and the lamp is shown with the three light emitting modules 20, 22, and 24 removed. A view seen from the direction of the axis J1 is shown in FIG. In FIG. 4A, the power supply terminal is omitted.
　図４（ｂ）に示すように、第１支持部材４０には、発光モジュール２０，２２，２４が取り付けられる３つの取付面４１ａ，４１ｂ，４１ｃが形成されている。この取付面４１ａ，４１ｂ，４１ｃは、矩形状に形成されており、第１支持部材４０の長手方向に沿って延伸するランプ軸Ｊ１周りに等間隔に存在している。そして、各取付面４１ａ，４１ｂ，４１ｃの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２１，Ｊ２２，Ｊ２３を当該ランプ軸Ｊ１方向から見た場合、中心線Ｊ２１，Ｊ２２のなす角度、中心線Ｊ２２，Ｊ２３のなす角度、中心線Ｊ２３，Ｊ２１のなす角度が全て１２０°で等しくなるように位置している。そして、図４（ａ）に示すように、各発光モジュール２０，２２，２４は、基板２０ａ，２２ａ，２４ａにおけるＬＥＤチップや封止部材２０ｃ，２２ｃ，２４ｃが設けられる面とは反対側の面が各取付面４１ａ，４１ｂ，４１ｃに当接した状態で取り付けられる。このとき、各発光モジュール２０，２２，２４の主光出射方向（基板２０ａ，２２ａ，２４ａの主面の法線方向）は、各取付面４１ａ，４１ｂ，４１ｃの法線ｎ１，ｎ２，ｎ３に沿った方向と一致する。また、ランプ軸Ｊ１方向から見て、各発光モジュール２０，２２，２４の主光出射方向、即ち、各取付面４１ａ，４１ｂ，４１ｃの法線ｎ１，ｎ２，ｎ３に沿った方向がランプ軸Ｊ１を中心として放射状に延伸している。 As shown in FIG. 4B, the first support member 40 is formed with three attachment surfaces 41a, 41b, 41c to which the light emitting modules 20, 22, 24 are attached. The mounting surfaces 41a, 41b, 41c are formed in a rectangular shape, and are present at equal intervals around the lamp axis J1 extending along the longitudinal direction of the first support member 40. When the center lines J21, J22, J23 connecting the center positions of the mounting surfaces 41a, 41b, 41c and the lamp axis J1 are viewed from the direction of the lamp axis J1, the angle formed by the center lines J21, J22, the center line J22. , J23 and the angles formed by the center lines J23, J21 are all equal to 120 °. And as shown to Fig.4 (a), each light emitting module 20,22,24 is a surface on the opposite side to the surface in which LED chip and sealing member 20c, 22c, 24c in the board | substrates 20a, 22a, 24a are provided. Are attached in contact with the attachment surfaces 41a, 41b, 41c. At this time, the main light emitting direction of each light emitting module 20, 22, 24 (normal direction of the main surface of the substrates 20a, 22a, 24a) is the normal line n1, n2, n3 of each mounting surface 41a, 41b, 41c. Match the direction along. Further, when viewed from the lamp axis J1 direction, the main light emitting direction of each light emitting module 20, 22, 24, that is, the direction along the normal lines n1, n2, n3 of the mounting surfaces 41a, 41b, 41c is the lamp axis J1. It extends radially from the center.
　また、図４（ａ）および（ｂ）に示すように、第１支持部材４０の先端部の３つの取付面４１ａ，４１ｂ，４１ｃには、各取付面４１ａ，４１ｂ，４１の法線ｎ１，ｎ２，ｎ３に沿った方向に突出する凸部４１ａ１，４１ｂ１，４１ｃ１が設けられている。各凸部４１ａ１，４１ｂ１，４１ｃ１は、各取付面４１ａ，４１ｂ，４１ｃの法線方向（法線ｎ１，ｎ２，ｎ３に沿った方向）から見て矩形状に形成されている。ここで、各凸部４１ａ１，４１ｂ１，４１ｃ１の各取付面４１ａ，４１ｂ，４１ｃの法線方向（法線ｎ１，ｎ２，ｎ３に沿った方向）から見た外形寸法は、各基板２０ａ，２２ａ，２４ａに設けられた第２貫通孔２０ｆ，２２ｆ，２４ｆの平面視形状の外形寸法に略等しくなっている。そして、各凸部４１ａ１，４１ｂ１，４１ｃ１が、第２貫通孔２０ｆ，２２ｆ，２４ｆそれぞれに差し込まれる。これにより、各基板２０ａ，２２ａ，２４ａに対して、各取付面４１ａ，４１ｂ，４１ｃに沿った方向に力が加わっても各基板２０ａ，２２ａ，２４ａの移動が抑止される。また、各取付面４１ａ，４１ｂ，４１ｃにおける各基板２０ａ，２２ａ，２４ａの位置決めも容易になる。 As shown in FIGS. 4A and 4B, the three attachment surfaces 41a, 41b, and 41c at the tip of the first support member 40 are connected to the normal lines n1 and 41b of the attachment surfaces 41a, 41b, and 41, respectively. Protrusions 41a1, 41b1, and 41c1 protruding in the direction along n2 and n3 are provided. Each convex part 41a1, 41b1, 41c1 is formed in a rectangular shape when viewed from the normal direction (direction along the normal lines n1, n2, n3) of each mounting surface 41a, 41b, 41c. Here, the external dimensions viewed from the normal direction (direction along the normal lines n1, n2, and n3) of the mounting surfaces 41a, 41b, and 41c of the respective convex portions 41a1, 41b1, and 41c1 are the respective substrates 20a, 22a, The outer dimensions of the second through holes 20f, 22f, and 24f provided in 24a are substantially equal to the external dimensions of the plan view. And each convex part 41a1, 41b1, 41c1 is inserted in 2nd through- hole 20f, 22f, 24f, respectively. Thereby, even if force is applied to each board 20a, 22a, 24a in the direction along each attachment surface 41a, 41b, 41c, movement of each board 20a, 22a, 24a is controlled. Further, the positioning of the substrates 20a, 22a, 24a on the mounting surfaces 41a, 41b, 41c is facilitated.
　第１支持部材４０の基端部４０ａは、電源装置８０から導出したリード線７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂを挿通するための６つの挿通孔４０ａ１，４０ａ２，４０ａ３，４０ａ４，４０ａ５，４０ａ６が形成されている。 The base end portion 40a of the first support member 40 has six insertion holes 40a1, 40a2, 40a3, 40a4, 40a5 for inserting lead wires 70a, 70b, 72a, 72b, 74a, 74b led out from the power supply device 80. 40a6 is formed.
　各基板２０ａ，２２ａ，２４ａと第１支持部材４０とは、シリコーン樹脂からなる接着剤によって固着されている。なお、この接着剤としては、発光モジュール２０，２２，２４の熱を第１支持部材４０により効率良く伝熱させるために、例えば、金属微粒子が分散されたシリコーン樹脂等からなる接着剤を用いてもよい。 Each substrate 20a, 22a, 24a and the first support member 40 are fixed by an adhesive made of silicone resin. As this adhesive, for example, an adhesive made of a silicone resin in which metal fine particles are dispersed is used in order to efficiently transfer the heat of the light emitting modules 20, 22, 24 to the first support member 40. Also good.
　＜１－５＞第２支持部材
　図１および図２に示すように、第２支持部材５０は、略円板状に形成されグローブ１０の開口部１１を塞ぐように配置されている。そして、第２支持部材５０は、グローブ１０側の面に螺子（図示せず）により第１支持部材４０が固定されるとともに、その周面がケース６０の内周面に当接した状態で接着剤によりケース６０に固着されている。また、第２支持部材５０の周部には、段差部５０ａが形成されており、当該段差部５０ａにはグローブ１０の開口端部１１ａが配置されている。そして、段差部５０ａとケース６０の周壁とで囲まれた領域にグローブ１０の開口端部１１ａを配置した状態で、段差部５０ａとケース６０の周壁とで囲まれた領域に接着剤５２を流し込むことにより、グローブ１０が第２支持部材５０およびケース６０に固着されている。また、第２支持部材５０は、金属やセラミックス等から形成されている。ここにおいて、第１支持部材４０から第２支持部材５０に伝熱した熱は、グローブ１０またはケース６０に伝わり、グローブ１０またはケース６０の外表面から外気に放出される。 <1-5> Second Support Member As shown in FIGS. 1 and 2, the second support member 50 is formed in a substantially disc shape and is disposed so as to close the opening 11 of the globe 10. The second support member 50 is bonded in a state where the first support member 40 is fixed to the surface of the globe 10 by screws (not shown) and the peripheral surface thereof is in contact with the inner peripheral surface of the case 60. It is fixed to the case 60 with an agent. Further, a stepped portion 50a is formed in the peripheral portion of the second support member 50, and the opening end portion 11a of the globe 10 is disposed in the stepped portion 50a. Then, the adhesive 52 is poured into the region surrounded by the step portion 50 a and the peripheral wall of the case 60 in a state where the opening end portion 11 a of the globe 10 is disposed in the region surrounded by the step portion 50 a and the peripheral wall of the case 60. Accordingly, the globe 10 is fixed to the second support member 50 and the case 60. The second support member 50 is made of metal, ceramics, or the like. Here, the heat transferred from the first support member 40 to the second support member 50 is transmitted to the globe 10 or the case 60 and is released from the outer surface of the globe 10 or the case 60 to the outside air.
　また、第２支持部材５０とケース６０とグローブ１０とは、シリコーン樹脂からなる接着剤５２により固着されている。なお、この接着剤としては、第２支持部材５０からグローブ１０およびケース６０への伝熱性をさらに高めるために、金属微粒子を分散させたシリコーン樹脂からなる接着剤を用いてもよい。 Further, the second support member 50, the case 60, and the globe 10 are fixed by an adhesive 52 made of silicone resin. As this adhesive, an adhesive made of a silicone resin in which metal fine particles are dispersed may be used in order to further enhance the heat transfer from the second support member 50 to the globe 10 and the case 60.
　＜１－６＞ケース
　ケース６０は、円筒状に形成され且つグローブ１０側に位置する第１ケース部６１と、円筒状に形成され且つ第１ケース部６１にグローブ１０側とは反対側で連続する第２ケース部６２とからなり、第１支持部材４０と口金３０とを電気的に絶縁するとともに内部に電源装置８０が収納される。この第１ケース部６１および第２ケース部６２は、ポリブチレンテレフタレート（ＰＢＴ）等の合成樹脂からなり、例えば、射出成形によって一体成形される。 <1-6> Case The case 60 is formed in a cylindrical shape and located on the globe 10 side, and the case 60 is formed in a cylindrical shape and is continuous with the first case portion 61 on the side opposite to the globe 10 side. The first case member 62 is electrically insulated from the first support member 40 and the base 30, and the power supply device 80 is accommodated therein. The first case portion 61 and the second case portion 62 are made of a synthetic resin such as polybutylene terephthalate (PBT), and are integrally formed by, for example, injection molding.
　第１ケース部６１は、内径が第２支持部材５０の外径に略等しく、内周面の一部が第２支持部材５０の周面に接触している。そして、第２支持部材５０は、この第１ケース部６１におけるグローブ１０側の開口から挿入されることで第１ケース部６１の内側に嵌合されて固定される。ここにおいて、第２支持部材５０からケース６０に伝熱した熱の一部は、第１ケース部６１の外周面から外気へ放出される。 The first case portion 61 has an inner diameter that is substantially equal to the outer diameter of the second support member 50, and a part of the inner peripheral surface is in contact with the peripheral surface of the second support member 50. And the 2nd support member 50 is fitted and fixed inside the 1st case part 61 by being inserted from the opening by the side of the globe 10 in this 1st case part 61. As shown in FIG. Here, a part of the heat transferred from the second support member 50 to the case 60 is released from the outer peripheral surface of the first case portion 61 to the outside air.
　第２ケース部６２は、外周面が口金３０の内周面と接触するように構成されており、本実施の形態では、第２ケース部６２の外周面には、雄螺子部が形成されており、この雄螺子部に口金３０のシェル３１に形成された雌螺子部が螺合することで、第２ケース部６２と口金３０とが接触する。ここにおいて、ケース６０に伝導した熱の一部は、第２ケース部６２から口金３０に伝達し、口金３０が取着される照明器具のソケット等からも放出される。 The second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30. In the present embodiment, a male screw portion is formed on the outer peripheral surface of the second case portion 62. The second case portion 62 and the base 30 come into contact with each other by screwing the female screw portion formed on the shell 31 of the base 30 into the male screw portion. Here, part of the heat conducted to the case 60 is transmitted from the second case portion 62 to the base 30 and is also released from a socket of a lighting fixture to which the base 30 is attached.
　＜１－７＞電源装置
　図２に示すように、電源装置８０は、３つの発光モジュール２０，２２，２４に電力を供給するためのものであり、ケース６０内に収納されている。この電源装置８０は、複数の回路素子と、各回路素子が実装される回路基板とから構成される。この回路素子は、調光回路や昇圧回路等を構成するスイッチング素子やインダクタ等である。また、電源装置８０は、口金３０から受電した交流電力を直流電力に変換し、６本のリード線７０ａ、７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂを介して発光モジュール２０，２２，２４に供給する。なお、ランプ１には、必ずしも電源装置８０が備えられている必要はなく、ランプ１が取り付けられる照明器具のソケット等から直流電力が供給される場合には、この電源装置８０は不要である。 <1-7> Power Supply Device As shown in FIG. 2, the power supply device 80 is for supplying power to the three light emitting modules 20, 22, and 24 and is housed in the case 60. The power supply device 80 includes a plurality of circuit elements and a circuit board on which each circuit element is mounted. This circuit element is a switching element, an inductor, or the like that constitutes a dimmer circuit, a booster circuit, or the like. Further, the power supply device 80 converts AC power received from the base 30 into DC power, and supplies the DC power to the light emitting modules 20, 22, and 24 via the six lead wires 70a, 70b, 72a, 72b, 74a, and 74b. . The lamp 1 is not necessarily provided with the power supply device 80, and is not necessary when DC power is supplied from a socket of a lighting fixture to which the lamp 1 is attached.
　＜２＞発光モジュールの配置について
　３つの発光モジュール２０，２２，２４および第１支持部材４０について、ランプ軸Ｊ１に直交する方向から見た断面図を図５（ａ）に示し、取付面４１ａの法線方向から見た図を図５（ｂ）に示す。 <2> Arrangement of Light Emitting Module A sectional view of the three light emitting modules 20, 22, 24 and the first support member 40 viewed from the direction orthogonal to the lamp axis J1 is shown in FIG. A view seen from the normal direction is shown in FIG.
　図５（ａ）に示すように、取付面４１ａは、その法線ｎ１に沿った方向とランプ軸Ｊ１に沿った方向とのなす角度θ１が略６０°となるように形成されている。また、取付面４１ｂ，４１ｃについても、取付面４１ａと同様に、その法線（図４（ａ）のｎ２，ｎ３）に沿った方向とランプ軸Ｊ１に沿った方向とのなす角度が略６０°となっている。つまり、３つの取付面４１ａ，４１ｂ，４１ｃは、第１支持部材４０の長手方向に沿って延びるランプ軸Ｊ１周りに位置し、その法線ｎ１，ｎ２，ｎ３に沿った方向とランプ軸Ｊ１に沿った方向とのなす角度が互いに６０°で等しくなっている。そして、前述のように、ランプ軸Ｊ１方向から見て、各発光モジュール２０，２２，２４の主光出射方向、即ち、各取付面４１ａ，４１ｂ，４１ｃの法線ｎ１，ｎ２，ｎ３に沿った方向がランプ軸Ｊ１を中心として放射状に延伸している（図４（ａ）参照）。即ち、各発光モジュール２０，２２，２４の主光出射方向は、互いに異なる方向を向いているとともに、第１支持部材４０の長手方向に沿って延伸するランプ軸Ｊ１に対して交差している。ここで、「交差」とは、同一平面内における交差のみならず、立体的に交差することも含む意味である。 As shown in FIG. 5A, the mounting surface 41a is formed such that an angle θ1 formed by the direction along the normal line n1 and the direction along the lamp axis J1 is approximately 60 °. Also, with respect to the mounting surfaces 41b and 41c, similarly to the mounting surface 41a, the angle formed by the direction along the normal line (n2 and n3 in FIG. 4A) and the direction along the lamp axis J1 is approximately 60. It is °. That is, the three attachment surfaces 41a, 41b, and 41c are positioned around the lamp axis J1 extending along the longitudinal direction of the first support member 40, and are along the normal lines n1, n2, and n3 and the lamp axis J1. The angles formed with the direction along the line are equal to each other at 60 °. As described above, when viewed from the lamp axis J1, the main light emitting direction of each of the light emitting modules 20, 22, and 24, that is, along the normal lines n1, n2, and n3 of the mounting surfaces 41a, 41b, and 41c. The direction extends radially around the lamp axis J1 (see FIG. 4A). That is, the main light emission directions of the light emitting modules 20, 22, and 24 are different from each other and intersect the lamp axis J <b> 1 extending along the longitudinal direction of the first support member 40. Here, “intersection” means not only an intersection in the same plane but also a three-dimensional intersection.
　これにより、３つの発光モジュール２０，２２，２４それぞれの主光出射方向がグローブ１０の周壁における少なくとも３箇所に向く形で各発光モジュール２０，２２，２４から光が放射される。従って、発光モジュール２０，２２，２４の主光出射方向が同一方向である構成に比べて、グローブ１０の周壁における光量斑が生じにくくなるので、ランプ１の配光特性を向上することができる。 Thus, light is emitted from each of the light emitting modules 20, 22, and 24 such that the main light emission directions of the three light emitting modules 20, 22, and 24 are directed to at least three locations on the peripheral wall of the globe 10. Accordingly, light intensity unevenness on the peripheral wall of the globe 10 is less likely to occur compared to a configuration in which the main light emission directions of the light emitting modules 20, 22, and 24 are the same direction, so that the light distribution characteristics of the lamp 1 can be improved.
　また、各発光モジュール２０，２２，２４は、基板２０ａ，２２ａ，２４ａの厚み方向に放射される光に比べて、基板２０ａ，２２ａ，２４ａの側方（基板２０ａ，２２ａ，２４ａの主面に沿った方向）に放射される光の光量が少ない。そして、基板２０ａ，２２ａ，２４ａの側方に放射される光の中でも、特に、ＬＥＤチップの列方向（封止部材２０ｃ，２２ｃ，２４ｃの長手方向）に直交する方向に放射される光の光量が少ない。 In addition, each light emitting module 20, 22, 24 has a lateral side of the substrates 20a, 22a, 24a (on the main surface of the substrates 20a, 22a, 24a) as compared with the light emitted in the thickness direction of the substrates 20a, 22a, 24a. The amount of light emitted in the direction along the direction is small. Of the light emitted to the sides of the substrates 20a, 22a, and 24a, the amount of light emitted in the direction orthogonal to the LED chip column direction (longitudinal direction of the sealing members 20c, 22c, and 24c). Less is.
　そこで、図５（ｂ）に示すように、ランプ１では、取付面４１ａの法線ｎ１方向から見て、取付面４１ａに沿って延伸し且つ取付面４１ａの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２１と、仮想直線Ｊ３１とのなす角度θ２が、略４５°となっており、各取付面４１ｂ，４１ｃの法線ｎ２，ｎ３方向から見て、各取付面４１ｂ，４１ｃに沿って延伸し且つ各取付面４１ｂ，４１ｃの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２２，Ｊ２３と、仮想直線Ｊ３２，Ｊ３３とのなす角度も、略４５°となっている。つまり、各取付面４１ａ，４１ｂ，４１ｃの法線ｎ１，ｎ２，ｎ３に沿った方向から見て、各取付面４１ａ，４１ｂ，４１ｃに沿って延伸し且つ各取付面４１ａ，４１ｂ，４１ｃの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２１，Ｊ２２，Ｊ２３と仮想直線Ｊ３１，Ｊ３２，Ｊ３３とのなす角度が略４５°で等しくなっている。ここにおいて、３つの仮想直線Ｊ３１，Ｊ３２，Ｊ３３が、捩れの位置関係となるように、基板２０ａ，２２ａ，２４ａが配置されていることになる。ここで、「捩れの位置関係」とは、３つの仮想直線Ｊ３１，Ｊ３２，Ｊ３３が互いに同一平面内で交差しないことを意味する。 Therefore, as shown in FIG. 5B, in the lamp 1, when viewed from the normal n1 direction of the mounting surface 41a, the lamp 1 extends along the mounting surface 41a and connects the center position of the mounting surface 41a and the lamp axis J1. The angle θ2 formed by the center line J21 and the imaginary straight line J31 is approximately 45 ° and extends along the mounting surfaces 41b and 41c when viewed from the normal n2 and n3 directions of the mounting surfaces 41b and 41c. In addition, the angle formed between the center lines J22 and J23 connecting the center positions of the mounting surfaces 41b and 41c and the lamp axis J1 and the virtual straight lines J32 and J33 is about 45 °. That is, when viewed from the direction along the normal lines n1, n2, and n3 of the mounting surfaces 41a, 41b, and 41c, they extend along the mounting surfaces 41a, 41b, and 41c and are centered on the mounting surfaces 41a, 41b, and 41c. The angles formed by the center lines J21, J22, J23 connecting the position and the lamp axis J1 and the virtual straight lines J31, J32, J33 are approximately 45 ° and are equal. Here, the substrates 20a, 22a, and 24a are arranged so that the three virtual straight lines J31, J32, and J33 have a twisted positional relationship. Here, the “positional relationship of torsion” means that the three virtual straight lines J31, J32, and J33 do not intersect with each other in the same plane.
　これにより、ランプ軸Ｊ１の周方向で隣接する２つの発光モジュール（例えば、発光モジュール２０，２２）において、一方の基板２２ａの側方であり且つＬＥＤチップの列方向（封止部材２２ｃの長手方向）に直交する方向側に、他方の基板２０ａが配置されており、基板２２ａ上に配設された複数のＬＥＤチップの列方向（封止部材２２ｃの長手方向）に直交する方向と、発光モジュール２０の主光出射方向（即ち、取付面４１ａの法線ｎ１に沿った方向）とが略一致しているので、発光モジュール２２から基板２２ａの側方であり且つ封止部材２２ｃの長手方向に直交する方向に放射される光の光量が、発光モジュール２０から主光出射方向に放射される光の光量によって補われる。また、発光モジュール２２，２４においても、発光モジュール２４から基板２４ａの側方であり且つ封止部材２４ｃの長手方向に直交する方向に放射される光の光量が、発光モジュール２２から主光出射方向に放射される光の光量によって補われ、発光モジュール２０，２４においても、発光モジュール２０から基板２０ａの側方であり且つ封止部材２０ｃの長手方向に直交する方向に放射される光の光量が、発光モジュール２４から主光出射方向に放射される光の光量によって補われる。従って、３つの発光モジュール２０，２２，２４全体からグローブ１０の周壁に放射される光の光量斑が低減される。 Thereby, in two light emitting modules (for example, light emitting modules 20 and 22) adjacent to each other in the circumferential direction of the lamp axis J1, it is located on the side of one substrate 22a and in the row direction of the LED chips (the longitudinal direction of the sealing member 22c). The other substrate 20a is disposed on the direction side orthogonal to the light emitting module, the direction orthogonal to the row direction of the plurality of LED chips disposed on the substrate 22a (longitudinal direction of the sealing member 22c), and the light emitting module. 20 is substantially coincident with the main light emitting direction (that is, the direction along the normal line n1 of the mounting surface 41a), so that it is on the side of the substrate 22a from the light emitting module 22 and in the longitudinal direction of the sealing member 22c. The amount of light emitted in the orthogonal direction is supplemented by the amount of light emitted from the light emitting module 20 in the main light emitting direction. Also in the light emitting modules 22 and 24, the amount of light emitted from the light emitting module 24 to the side of the substrate 24a and in the direction perpendicular to the longitudinal direction of the sealing member 24c is the light emitting direction from the light emitting module 22. In the light emitting modules 20 and 24, the amount of light emitted from the light emitting module 20 to the side of the substrate 20a and in the direction orthogonal to the longitudinal direction of the sealing member 20c is also compensated. This is supplemented by the amount of light emitted from the light emitting module 24 in the main light emitting direction. Therefore, the amount of light unevenness of the light emitted from the entire three light emitting modules 20, 22, 24 to the peripheral wall of the globe 10 is reduced.
　結局、本実施の形態に係るランプ１は、グローブ１０内に配置された３つの発光モジュール２０，２２，２４それぞれの主光出射方向（取付面４１ａ，４１ｂ，４１ｃの法線ｎ１，ｎ２，ｎ３に沿った方向）が、互いに異なる方向を向いているとともに、第１支持部材４０の軸方向に沿って延伸するランプ軸Ｊ１に対して交差していることにより、３つの発光モジュール２０，２２，２４それぞれの主光出射方向がグローブ１０の周壁における少なくとも３箇所に向く形で各発光モジュール２０，２２，２４から光が放射される。これにより、発光モジュールの主光出射方向が同一方向である構成のランプ（例えば、図１２に示すランプ１００１）に比べて、グローブ１０の周壁における光量斑が生じにくくなるので、ランプ１の配光特性を向上することができる。 As a result, the lamp 1 according to the present embodiment has the main light emitting directions (normal lines n1, n2, n3 of the mounting surfaces 41a, 41b, 41c) of the three light emitting modules 20, 22, 24 arranged in the globe 10. ) Are directed in different directions, and intersect with the lamp axis J1 extending along the axial direction of the first support member 40, whereby the three light emitting modules 20, 22, Light is emitted from each of the light emitting modules 20, 22, and 24 so that the main light emission directions of the respective 24 are directed to at least three places on the peripheral wall of the globe 10. As a result, light intensity unevenness on the peripheral wall of the globe 10 is less likely to occur compared to a lamp having a configuration in which the main light emission direction of the light emitting module is the same direction (for example, the lamp 1001 shown in FIG. 12). The characteristics can be improved.
　＜実施の形態２＞
　本実施の形態に係る照明器具の一部破断した概略側面図を図６に示す。 <Embodiment 2>
FIG. 6 shows a schematic side view, partly broken, of the lighting apparatus according to the present embodiment.
　図６に示すように、本実施の形態に係る照明器具１００は、実施の形態１に係るランプ１と、天井材Ｃに取り付けられた器具本体１０２とを備える。 As shown in FIG. 6, the lighting fixture 100 according to the present embodiment includes the lamp 1 according to the first embodiment and the fixture main body 102 attached to the ceiling material C.
　器具本体１０２は、ランプ１を保持するソケット１０３ａが設けられた保持部１０３と、ランプ１の側方を覆うカバー１０４とを備える。 The appliance main body 102 includes a holding portion 103 provided with a socket 103 a that holds the lamp 1, and a cover 104 that covers the side of the lamp 1.
　保持部１０３が備えるソケット１０３ａには、天井裏に配線された天井配線が電気的に接続されている。そして、このソケット１０３ａにランプ１の口金３０が螺着されることにより、ランプ１にソケット１０３ａを介して電力が供給される。 The ceiling wiring wired on the back of the ceiling is electrically connected to the socket 103a included in the holding unit 103. Then, when the base 30 of the lamp 1 is screwed into the socket 103a, electric power is supplied to the lamp 1 through the socket 103a.
　カバー１０４は、椀状であり、底部に周壁の厚み方向に貫通する貫通孔（図示せず）が形成されている。そして、カバー１０４の底部に形成された貫通孔からランプ１のグローブ１０がカバー１０４の内側に突出している。そして、ランプ１のグローブ１０の外周面から放射した光は、カバー１０４の内周面で反射されて照明器具１００の外部へ出射される。 The cover 104 has a bowl shape, and has a through hole (not shown) penetrating in the thickness direction of the peripheral wall at the bottom. The globe 10 of the lamp 1 protrudes from the through hole formed in the bottom of the cover 104 to the inside of the cover 104. The light emitted from the outer peripheral surface of the globe 10 of the lamp 1 is reflected by the inner peripheral surface of the cover 104 and emitted to the outside of the lighting fixture 100.
　＜変形例＞
　（１）実施の形態１では、３つの発光モジュール２０，２２，２４を備えるランプ１の例について説明したが、これに限定されるものではなく、２つの発光モジュールを備えるものであってもよい。 <Modification>
(1) In the first embodiment, the example of the lamp 1 including the three light emitting modules 20, 22, and 24 has been described. However, the embodiment is not limited thereto, and the lamp 1 may include two light emitting modules. .
　本変形例に係るランプ２の斜視図を図７に示す。なお、グローブ１０、口金３０、第２支持部材５０、ケース６０および電源装置（図示せず）は、実施の形態１と同様なのでここでは説明を省略する。また、発光モジュール２２０，２２２の構成は、実施の形態１で説明した発光モジュール２０の構成と同様なので説明を省略する。 7 is a perspective view of the lamp 2 according to this modification. The globe 10, the base 30, the second support member 50, the case 60, and the power supply device (not shown) are the same as those in the first embodiment, and thus the description thereof is omitted here. In addition, the configuration of the light emitting modules 220 and 222 is the same as the configuration of the light emitting module 20 described in the first embodiment, and thus description thereof is omitted.
　第１支持部材２４０は、略円柱状でありその中心軸がランプ軸Ｊ１と一致するようにグローブ１０の開口部１１の近傍からグローブ１０内方に向かって延出している。そして、第１支持部材２４０の基端部２４０ａは、第２支持部材５０に固定されている。また、第１支持部材２４０の先端部２４０ｂには、第１支持部材２４０の長手方向に直交する方向において互いに離れる向きに２つの脚部２４０ｃ１，２４０ｃ２が突出している。また、この第１支持部材２４０は、金属またはセラミックス等の材料から形成されている。 The first support member 240 has a substantially cylindrical shape and extends from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10 so that the center axis thereof coincides with the lamp axis J1. The base end portion 240 a of the first support member 240 is fixed to the second support member 50. In addition, two leg portions 240 c 1 and 240 c 2 protrude from the distal end portion 240 b of the first support member 240 in directions away from each other in a direction orthogonal to the longitudinal direction of the first support member 240. The first support member 240 is made of a material such as metal or ceramics.
　２つの発光モジュール２２０，２２２および第１支持部材２４０について、ランプ軸Ｊ１方向から見た図を図８（ａ）に示し、２つの発光モジュール２２０，２２２を取り除いた状態でランプ軸Ｊ１方向から見た図を図８（ｂ）に示す。なお、図８（ａ）では、給電端子を省略して図示している。 A view of the two light emitting modules 220 and 222 and the first support member 240 viewed from the lamp axis J1 direction is shown in FIG. 8A, and the two light emitting modules 220 and 222 are removed and viewed from the lamp axis J1 direction. This figure is shown in FIG. In FIG. 8A, the power supply terminal is omitted.
　図８（ｂ）に示すように、各脚部２４０ｃ１，２４０ｃ２の先端には、発光モジュール２２０，２２２が取り付けられる２つの取付面２４１ａ，２４１ｂが形成されている。この第１支持部材２４０の先端部２４０ａの取付面２４１ａ，２４１ｂは、楕円形状に形成されており、第１支持部材２４０の長手方向に沿って延びるランプ軸Ｊ１周りに位置している。そして、各取付面２４１ａ，２４１ｂの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２２１，Ｊ２２２をランプ軸Ｊ１方向から見た場合、中心線Ｊ２２１，Ｊ２２２は一直線上に位置している。そして、図８（ａ）に示すように、各発光モジュール２２０，２２２は、基板２２０ａ，２２２ａにおけるＬＥＤチップや封止部材２２０ｃ，２２２ｃが設けられる面とは反対側の面が各取付面２４１ａ，２４１ｂに当接した状態で取り付けられる。このとき、各発光モジュール２２０，２２２の主光出射方向（基板２２０ａ，２２２ａの主面の法線方向）は、各取付面２４１ａ，２４１ｂの法線ｎ２１，ｎ２２方向と一致する。また、ランプ軸Ｊ１方向から見て、各発光モジュール２２０，２２２の主光出射方向、即ち、各取付面２４１ａ，２４１ｂの法線ｎ２１，ｎ２２に沿った方向が略平行に延伸している。 As shown in FIG. 8B, two attachment surfaces 241a and 241b to which the light emitting modules 220 and 222 are attached are formed at the tips of the leg portions 240c1 and 240c2. The attachment surfaces 241a and 241b of the tip end portion 240a of the first support member 240 are formed in an elliptical shape, and are positioned around the lamp axis J1 extending along the longitudinal direction of the first support member 240. When the center lines J221 and J222 connecting the center positions of the mounting surfaces 241a and 241b and the lamp axis J1 are viewed from the lamp axis J1 direction, the center lines J221 and J222 are positioned on a straight line. As shown in FIG. 8A, each light emitting module 220, 222 has a mounting surface 241a, a surface opposite to the surface on which the LED chips and the sealing members 220c, 222c are provided on the substrates 220a, 222a. It is attached in a state of being in contact with 241b. At this time, the main light emitting direction of each light emitting module 220, 222 (the normal direction of the main surface of the substrates 220a, 222a) coincides with the normal n21, n22 direction of each mounting surface 241a, 241b. Further, when viewed from the lamp axis J1 direction, the main light emitting direction of each light emitting module 220, 222, that is, the direction along the normal lines n21, n22 of each mounting surface 241a, 241b extends substantially in parallel.
　また、図８（ａ）および（ｂ）に示すように、第１支持部材２４０の各脚部２４０ｃ１，２４０ｃ２の先端に形成された２つの取付面２４１ａ，２４１ｂには、各取付面２４１ａ，２４１ｂの法線ｎ２１，ｎ２２に沿った方向に突出する凸部２４１ａ１，２４１ｂ１が設けられており、各凸部２４１ａ１，２４１ｂ１は、各取付面２４１ａ，２４１ｂの法線方向（法線ｎ２１，ｎ２２に沿った方向）から見て矩形状に形成されている。ここで、各凸部２４１ａ１，２４１ｂ１の各取付面２４１ａ，２４１ｂの法線方向（法線ｎ２１，ｎ２２に沿った方向）から見た外形寸法は、各基板２２０ａ，２２２ａに設けられた第２貫通孔２２０ｆ，２２２ｆの平面視形状の外形寸法に略等しくなっている。そして、各凸部２４１ａ１，２４１ｂ１が、第２貫通孔２２０ｆ，２２２ｆそれぞれに差し込まれる。これにより、各基板２２０ａ，２２２ａに対して、各取付面２４１ａ，２４１ｂに沿った方向に力が加わった場合における各基板２２０ａ，２２２ａの移動が抑止され、各取付面２４１ａ，２４１ｂにおける各基板２２０ａ，２２２ａの位置決めも容易になる。 Further, as shown in FIGS. 8A and 8B, the two attachment surfaces 241a and 241b formed at the distal ends of the leg portions 240c1 and 240c2 of the first support member 240 are attached to the attachment surfaces 241a and 241b, respectively. The convex portions 241a1 and 241b1 projecting in the direction along the normal lines n21 and n22 are provided, and the convex portions 241a1 and 241b1 are arranged in the normal direction of the mounting surfaces 241a and 241b (along the normal lines n21 and n22). It is formed in a rectangular shape as viewed from the (direction). Here, the external dimensions viewed from the normal direction (direction along the normal lines n21 and n22) of the mounting surfaces 241a and 241b of the respective convex portions 241a1 and 241b1 are the second penetrations provided in the respective substrates 220a and 222a. The outer dimensions of the holes 220f and 222f in the plan view are substantially equal. And each convex part 241a1, 241b1 is inserted in 2nd through- hole 220f, 222f, respectively. As a result, the movement of the substrates 220a and 222a when the force is applied to the substrates 220a and 222a in the direction along the attachment surfaces 241a and 241b is suppressed, and the substrates 220a on the attachment surfaces 241a and 241b are suppressed. , 222a can be easily positioned.
　また、第１支持部材２４０の基端部２４０ａは、電源装置から導出するリード線２７０ａ，２７０ｂ，２７２ａ，２７２ｂを挿通するための４つの挿通孔２４０ａ１，２４０ａ２，２４０ａ３，２４０ａ４が形成されている。また、各基板２２０ａ，２２２ａと第１支持部材２４０とは、接着剤（図示せず）により固着されている。 Further, the base end portion 240a of the first support member 240 is formed with four insertion holes 240a1, 240a2, 240a3, 240a4 for inserting lead wires 270a, 270b, 272a, 272b led out from the power supply device. In addition, each of the substrates 220a and 222a and the first support member 240 are fixed by an adhesive (not shown).
　次に、２つの発光モジュール２２０，２２２の配置について説明する。 Next, the arrangement of the two light emitting modules 220 and 222 will be described.
　本変形例に係る２つの発光モジュール２２０，２２２および第１支持部材２４０について、ランプ軸に直交する方向から見た断面図を図９（ａ）に示し、取付面２４１ａの法線方向から見た斜視図を図９（ｂ）に示す。 A cross-sectional view of the two light emitting modules 220 and 222 and the first support member 240 according to the present modification viewed from the direction orthogonal to the lamp axis is shown in FIG. 9A and viewed from the normal direction of the mounting surface 241a. A perspective view is shown in FIG.
　図９（ａ）に示すように、取付面２４１ａは、その法線ｎ２１とランプ軸Ｊ１とのなす角度θ２１が略６０°となるように形成されている。また、取付面２４１ｂについても、その法線ｎ２２とランプ軸Ｊ１とのなす角度が互いに等しくなっている。また、前述のように、ランプ軸Ｊ１方向から見て、各発光モジュール２２０，２２２の主光出射方向、即ち、各取付面２４１ａ，２４１ｂの法線ｎ２１，ｎ２２に沿った方向が略平行に延伸している。即ち、各発光モジュール２２０，２２２の主光出射方向は、互いに異なる方向を向いているとともに、第１支持部材２４０の軸方向に沿って延伸するランプ軸Ｊ１に対して交差している。 As shown in FIG. 9A, the mounting surface 241a is formed such that an angle θ21 formed by the normal line n21 and the lamp axis J1 is approximately 60 °. Also, the angle formed between the normal line n22 and the lamp axis J1 is equal to the mounting surface 241b. Further, as described above, when viewed from the lamp axis J1, the main light emitting direction of each light emitting module 220, 222, that is, the direction along the normal lines n21, n22 of each mounting surface 241a, 241b extends substantially in parallel. is doing. That is, the main light emission directions of the light emitting modules 220 and 222 are different from each other and intersect the lamp axis J1 extending along the axial direction of the first support member 240.
　これにより、２つの発光モジュール２２０，２２２それぞれの主光出射方向がグローブ１０の周壁における少なくとも２箇所に向く形で各発光モジュール２２０，２２２から光が放射される。従って、発光モジュール２２０，２２２の主光出射方向が同一方向である構成に比べて、グローブ１０の周壁における光量斑が生じにくくなるので、ランプ２の配光特性を向上することができる。 Thus, light is emitted from each of the light emitting modules 220 and 222 such that the main light emission directions of the two light emitting modules 220 and 222 are directed to at least two places on the peripheral wall of the globe 10. Therefore, compared to a configuration in which the main light emission directions of the light emitting modules 220 and 222 are the same, light intensity unevenness on the peripheral wall of the globe 10 is less likely to be generated, so that the light distribution characteristics of the lamp 2 can be improved.
　また、図９（ｂ）に示すように、取付面２４１ａに沿って延伸し且つ取付面２４１ａの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２２１と、仮想直線Ｊ２３１とのなす角度θ２２が、略４５°となっている。そして、取付面２４１ｂに沿って延伸し且つ各取付面２４１ｂの中心位置とランプ軸Ｊ１とを結ぶ中心線Ｊ２２２と、仮想直線Ｊ２３２とのなす角度も略４５°となっている。つまり、２つの発光モジュール２２０，２２２について、２つの仮想直線Ｊ２３１，Ｊ２３２が、捩れの位置関係となるように、２つの発光モジュール２２０，２２２が、第1支持部材２４０に取付けられている。 Also, as shown in FIG. 9B, an angle θ22 formed between a virtual line J231 and a center line J221 extending along the mounting surface 241a and connecting the center position of the mounting surface 241a and the lamp axis J1 is substantially equal. It is 45 °. The angle formed between the center line J222 extending along the attachment surface 241b and connecting the center position of each attachment surface 241b and the lamp axis J1 and the virtual straight line J232 is also approximately 45 °. That is, with respect to the two light emitting modules 220 and 222, the two light emitting modules 220 and 222 are attached to the first support member 240 so that the two virtual straight lines J231 and J232 are in a twisted positional relationship.
　なお、本変形例では、２つの発光モジュール２２０，２２２を備えるランプ２の例について説明したが、発光モジュールの個数は２個、３個に限定されるものではなく、４個以上の発光モジュールを備えるものであってもよい。 In this modification, the example of the lamp 2 including the two light emitting modules 220 and 222 has been described. However, the number of light emitting modules is not limited to two or three, and four or more light emitting modules are included. It may be provided.
　（２）実施の形態１では、第１支持部材４０が１つだけ設けられてなる例について説明したが、これに限定されるものではない。例えば、グローブ１０の内方に向かって延出する複数本の支持部材を備えており、各支持部材の先端部に発光モジュールが取り付けられてなるランプであってもよい。 (2) In the first embodiment, the example in which only one first support member 40 is provided has been described. However, the present invention is not limited to this. For example, a lamp having a plurality of support members extending inward of the globe 10 and having a light emitting module attached to the tip of each support member may be used.
　（３）前述の変形例（２）では、複数本の支持部材を備える例について説明したが、これらの支持部材が、リード線から構成されるものであってもよい。 (3) In the above-described modification (2), an example in which a plurality of support members are provided has been described. However, these support members may be formed of lead wires.
　図１０に示すように、ランプ３では、グローブ１０の内部に配置された３つの発光モジュール３２０，３２２，３２４がリード線７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂにより支持されている。ここにおいて、リード線７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂからなる束が、３つの発光モジュール３２０，３２２，３２４を支持する長尺の支持部材を構成している。このリード線７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂとしては、例えば、鉄ニッケル合金からなる金属線の表面に銅を拡散結合させることにより形成された金属線から構成すればよい。この金属線は、軟質ガラスとの封着性に優れているので、第２支持部材３５０をガラスから形成すれば、リード線７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂの一部を第２支持部材３５０に埋設した状態で第２支持部材３５０に固定することができる。また、各発光モジュール３２０，３２２，３２４の重量は、リード線７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂの曲げ強度に基づいて決まる許容範囲内である必要がある。 As shown in FIG. 10, in the lamp 3, three light emitting modules 320, 322, and 324 arranged inside the globe 10 are supported by lead wires 70a, 70b, 72a, 72b, 74a, and 74b. Here, a bundle of lead wires 70a, 70b, 72a, 72b, 74a, and 74b constitutes a long support member that supports the three light emitting modules 320, 322, and 324. The lead wires 70a, 70b, 72a, 72b, 74a, and 74b may be made of a metal wire formed by diffusion-bonding copper to the surface of a metal wire made of an iron nickel alloy, for example. Since this metal wire is excellent in sealing property with soft glass, if the second support member 350 is made of glass, a part of the lead wires 70a, 70b, 72a, 72b, 74a, 74b is second supported. The second support member 350 can be fixed while being embedded in the member 350. In addition, the weight of each light emitting module 320, 322, 324 needs to be within an allowable range determined based on the bending strength of the lead wires 70a, 70b, 72a, 72b, 74a, 74b.
　本変形例によれば、実施の形態１および変形例（１）における第１支持部材４０，２４０が不要となるので、部品点数の削減によるコスト低減を図ることができる。 According to this modified example, the first support members 40 and 240 in the first embodiment and the modified example (1) are not required, so that the cost can be reduced by reducing the number of parts.
　（４）実施の形態１では、グローブ１０内に配置された３つの発光モジュール２０，２２，２４それぞれの主光出射方向（取付面４１ａ，４１ｂ，４１ｃの法線ｎ１，ｎ２，ｎ３に沿った方向）が、互いに異なる方向を向いているランプ１の例について説明したが、これに限定されるものではなく、例えば、３つの発光モジュール２０，２２，２４のうちの２つの発光モジュールの主光出射方向が平行であり、当該２つの発光モジュールの主光出射方向と残り１つの発光モジュールの主光出射方向とが異なる方向を向いているものであってもよい。 (4) In the first embodiment, the main light emitting direction of each of the three light emitting modules 20, 22, 24 arranged in the globe 10 (along the normal lines n1, n2, n3 of the mounting surfaces 41a, 41b, 41c) However, the present invention is not limited to this. For example, the main light of two light-emitting modules among the three light-emitting modules 20, 22, and 24 is described. The emission directions may be parallel, and the main light emission direction of the two light emitting modules may be different from the main light emission direction of the remaining one light emitting module.
　１，２　ランプ
　１０　グローブ
　１１　開口部
　１１ａ　開口端部
　２０，２２，２４，２２０，２２２　発光モジュール
　２０ａ，２２ａ，２４ａ，２２０ａ，２２２ａ　基板
　２０ｂ　ＬＥＤチップ
　２０ｃ　封止部材
　２０ｄ１，２０ｄ２　給電端子
　２０ｄ３，２０ｄ４　金属配線
　２０ｅ　第１貫通孔
　２０ｆ，２２ｆ，２４ｆ，２２０ｆ，２２２ｆ　第２貫通孔
　３０　口金
　４０，２４０　第１支持部材
　４１ａ、４１ｂ、４１ｃ，２４１ａ，２４１ｂ　取付面
　４１ａ１，４１ｂ１，４１ｃ１，２４１ａ１，２４１ｂ１　凸部
　５０，３５０　第２支持部材
　６０　ケース
　６１　第１ケース部
　６２　第２ケース部
　７０ａ，７０ｂ，７２ａ，７２ｂ，７４ａ，７４ｂ　リード線
　８０　電源装置
　９０ａ，９０ｂ　電源線
　１００　照明器具
　１０３　保持部
　１０３ａ　ソケット
　１０４　カバー
　Ｃ　天井材
　Ｊ１　ランプ軸
　Ｊ２１，Ｊ２２，Ｊ２３，Ｊ２２１，Ｊ２２２　中心線
　Ｊ３１，Ｊ３２，Ｊ３３，Ｊ２３１，Ｊ２３２　仮想直線 1, 2 Lamp 10 Globe 11 Opening 11a Opening end 20, 22, 24, 220, 222 Light emitting module 20a, 22a, 24a, 220a, 222a Substrate 20b LED chip 20c Sealing member 20d1, 20d2 Power supply terminal 20d3, 20d4 Metal Wiring 20e First through hole 20f, 22f, 24f, 220f, 222f Second through hole 30 Base 40, 240 First support member 41a, 41b, 41c, 241a, 241b Mounting surface 41a1, 41b1, 41c1, 241a1, 241b1 Projection 50, 350 Second support member 60 Case 61 First case portion 62 Second case portion 70a, 70b, 72a, 72b, 74a, 74b Lead wire 80 Power supply device 90a, 90b Power supply wire 100 Lighting fixture 103 Holding portion 103a Socket 104 Cap Over C ceiling material J1 lamp axis J21, J22, J23, J221, J222 center line J31, J32, J33, J231, J232 virtual line

Claims (8)

  1. 　透光性材料からなる基板および当該基板に実装された複数の発光素子を有する複数の発光モジュールと、
    　透光性材料からなり且つ一部に開口部を有するグローブと、
    　前記グローブの前記開口部から内方に向かって延出され且つ先端部に前記複数の発光モジュールそれぞれが取り付けられた支持部材とを備え、
    　前記複数の発光モジュールそれぞれの主出射方向のうち、少なくとも２つの主光出射方向が異なる方向を向いている
    　ことを特徴とするランプ。     A plurality of light emitting modules having a substrate made of a light-transmitting material and a plurality of light emitting elements mounted on the substrate;
    A globe made of a translucent material and partially having an opening;
    A support member extending inwardly from the opening of the globe and having each of the plurality of light emitting modules attached to the tip.
    The lamp characterized in that at least two main light emitting directions of the plurality of light emitting modules are directed in different directions.
  2. 　前記支持部材は、柱状であり且つ前記グローブの前記開口部から中心方向に向かって延出されるとともに、先端部に前記複数の発光モジュールそれぞれが取り付けられる複数の取付面が形成されてなり、
    　前記複数の取付面の法線方向のうち、少なくとも２つが互いに交差している
    　ことを特徴とする請求項１記載のランプ。     The support member is columnar and extends toward the center from the opening of the globe, and has a plurality of attachment surfaces to which the plurality of light emitting modules are attached at the tip.
    The lamp according to claim 1, wherein at least two of the normal directions of the plurality of mounting surfaces intersect each other.
  3. 　前記複数の取付面は、前記支持部材の軸周りに分散して存在し且つ各取付面の法線方向と前記支持部材の軸方向とのなす角度が互いに等しい
    　ことを特徴とする請求項２記載のランプ。     The plurality of mounting surfaces are distributed around the axis of the support member, and the angle between the normal direction of each mounting surface and the axial direction of the support member is equal to each other. Lamp.
  4. 　前記複数の発光素子は、前記基板上に列状に配置されてなり、
    　前記基板の前記複数の発光素子が実装される面に沿って前記複数の発光素子の列方向に延伸する仮想直線が、捩れの位置関係となるように、前記複数の発光モジュールが前記複数の取付面それぞれに取り付けされている
    　ことを特徴とする請求項２または請求項３に記載のランプ。     The plurality of light emitting elements are arranged in a row on the substrate,
    The plurality of light emitting modules are attached to the plurality of attachments such that a virtual straight line extending in a column direction of the plurality of light emitting elements along a surface on which the plurality of light emitting elements of the substrate are mounted has a twisted positional relationship. The lamp according to claim 2 or 3, wherein the lamp is attached to each of the surfaces.
  5. 　前記支持部材の軸方向から見たときに、前記複数の取付面が前記支持部材の軸周りに等間隔に存在し、
    　前記複数の取付面それぞれに沿って延伸し且つ前記複数の取付面それぞれの中心位置と前記支持部材の軸とを結ぶ中心線と前記仮想直線とのなす角度が互いに等しい
    　ことを特徴とする請求項４記載のランプ。     When viewed from the axial direction of the support member, the plurality of mounting surfaces exist at equal intervals around the axis of the support member,
    The angle formed by the virtual line and a center line extending along each of the plurality of mounting surfaces and connecting a center position of each of the plurality of mounting surfaces and the axis of the support member is equal to each other. 4. The lamp according to 4.
  6. 　前記基板は、矩形板状に形成され
    　前記複数の発光素子は、前記基板の長手方向に沿って配置されてなる
    　ことを特徴とする請求項４または請求項５記載のランプ。     The lamp according to claim 4, wherein the substrate is formed in a rectangular plate shape, and the plurality of light emitting elements are arranged along a longitudinal direction of the substrate.
  7. 　前記支持部材は、前記グローブの内方に向かって延在し且つ前記複数の発光モジュールそれぞれに電気的に接続された複数のリード線からなる
    　ことを特徴とする請求項１記載のランプ。     The lamp according to claim 1, wherein the support member includes a plurality of lead wires extending inward of the globe and electrically connected to the plurality of light emitting modules.
  8. 　請求項１乃至７のいずれか１項に記載のランプを備える
    　ことを特徴とする照明器具。     A lighting fixture comprising the lamp according to any one of claims 1 to 7.
PCT/JP2012/006761 2011-12-27 2012-10-23 Lamp and lighting apparatus using same WO2013099074A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105179983A (en) * 2015-10-26 2015-12-23 苏州汉克山姆照明科技有限公司 Bulb with showing function
JP2016001543A (en) * 2014-06-11 2016-01-07 三菱電機株式会社 Light-emitting device
US20180172218A1 (en) * 2015-03-18 2018-06-21 Feit Electric Company, Inc. Omnidirectional light emitting diode filament holder
JP2020503655A (en) * 2017-01-05 2020-01-30 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． SSL lamp

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124436A (en) * 2006-11-09 2008-05-29 Cree Inc Expandable led array interconnection
JP3178441U (en) * 2012-06-06 2012-09-13 深▲せん▼市▲衆▼明半導体照明有限公司 LED bulb

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124436A (en) * 2006-11-09 2008-05-29 Cree Inc Expandable led array interconnection
JP3178441U (en) * 2012-06-06 2012-09-13 深▲せん▼市▲衆▼明半導体照明有限公司 LED bulb

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016001543A (en) * 2014-06-11 2016-01-07 三菱電機株式会社 Light-emitting device
US20180172218A1 (en) * 2015-03-18 2018-06-21 Feit Electric Company, Inc. Omnidirectional light emitting diode filament holder
US10724690B2 (en) * 2015-03-18 2020-07-28 Feit Electric Company, Inc. Omnidirectional light emitting diode filament holder
US11143363B2 (en) 2015-03-18 2021-10-12 Feit Electric Company, Inc. Omnidirectional light emitting diode filament holder
US11543084B2 (en) 2015-03-18 2023-01-03 Fleit Electric Company, Inc. Omnidirectional light emitting diode filament holder
US12000544B2 (en) 2015-03-18 2024-06-04 Feit Electric Company, Inc. Omnidirectional light emitting diode filament holder
CN105179983A (en) * 2015-10-26 2015-12-23 苏州汉克山姆照明科技有限公司 Bulb with showing function
JP2020503655A (en) * 2017-01-05 2020-01-30 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． SSL lamp
US10670194B2 (en) 2017-01-05 2020-06-02 Signify Holding B.V. SSL lamp that includes three or more crossed elongated light emitting structures
JP2021132037A (en) * 2017-01-05 2021-09-09 シグニファイ ホールディング ビー ヴィSignify Holding B.V. SSL lamp
JP7071572B2 (en) 2017-01-05 2022-05-19 シグニファイ ホールディング ビー ヴィ SSL lamp

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