JP2013026050A - Lamp and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new lamp with an excellent heat radiation structure capable of coping with increase of calorific value accompanying higher luminance of the lamp.SOLUTION: In the lamp 100 wherein an LED module 5 is supported with a support member 17 in a globe 7, an opening of the globe 7 is blocked with a stem 13 where the support member 17 is installed, and a fluid having heat conductivity higher than that of air is enclosed in the globe 7 blocked with the stem 13.

Description

  The present invention relates to a lamp and an illumination device that use a light emitting element such as an LED (Light Emitting Diode) as a light source.

In recent years, from the viewpoint of energy saving, as a light bulb shaped lamp that replaces an incandescent light bulb, a lamp that uses an LED, which is one of semiconductor light emitting elements, as a light source (hereinafter referred to as an LED lamp) has been proposed (Patent Literature). 1-3).
In this LED lamp, a large number of LEDs are mounted on a mounting board, the mounting board is attached to the other end of the case having a base at one end, and a circuit unit for emitting (lighting) the LED is housed inside the case. There is a thing which has the structure which becomes (patent document 4).

The electronic components that make up the circuit unit include components that are vulnerable to thermal loads, but these electronic components may become unstable in operation or have a short life due to heat generated during LED emission. .
For this reason, in order to suppress the heat load on the circuit unit, measures are taken to dissipate the heat generated during LED emission to the outside of the LED lamp. For example, a heat radiating groove is provided on the surface of the case (Patent Document 5), or the case is formed of a metal that is a heat-conductive material so that heat at the time of LED light emission is conducted to the base so that heat does not accumulate in the case Or the like (see Non-Patent Document 1 (page 12)) has been devised.

Japanese Patent No. 4135485 Japanese Patent No. 4290887 US Pat. No. 6,793,374 JP 2006-313717 A JP 2010-003580 A

Published “Lamp General Catalog 2010”: Panasonic Corporation Lighting Co., Ltd.

Various techniques for dissipating heat generated during LED emission to the outside of the lamp, including Patent Document 1, have been proposed. However, with the recent increase in the amount of heat generated by the LED due to the higher brightness of the LED lamp, there is a demand for more efficiently dissipating heat during LED emission.
An object of the present invention is to provide a lamp having a novel structure having an excellent heat dissipation structure that can cope with an increase in the amount of heat generated with the increase in brightness of the lamp.

  In order to achieve the above object, a lamp according to the present invention is a lamp in which a light emitting element as a light source is supported by a support member in a globe, and the support member is erected at the opening of the globe. A fluid having higher thermal conductivity than air is sealed in the globe closed by the base and closed by the base.

According to said structure, the fluid which has heat conductivity higher than air is enclosed in the globe obstruct | occluded with the base. Therefore, the heat generated from the light emitting element can be conducted to the globe through a fluid having higher thermal conductivity than air. As a result, it is possible to efficiently dissipate the heat generated from the light emitting element to the outside by effectively using the globe.
As described above, according to the present invention, it is possible to provide a lamp having a novel configuration having an excellent heat dissipation structure that can cope with an increase in the amount of heat generated as the lamp brightness increases.

It is a perspective view which shows the structure of the LED lamp 100 which concerns on 1st Embodiment. It is A-A 'arrow sectional drawing of the LED lamp 100 shown in FIG. FIG. 2 is a cross-sectional view taken along line B-B ′ of the LED lamp 100 shown in FIG. 1. (A) The top view which shows the structure of the LED module 5, (b) It is sectional drawing which shows the structure of the LED module 5. It is a figure for demonstrating an example of the manufacturing method of the LED lamp 100 which concerns on 1st Embodiment. It is a figure for demonstrating an example of the manufacturing method of the LED lamp 100 which concerns on 1st Embodiment. It is a figure for demonstrating an example of the manufacturing method of the LED lamp 100 which concerns on 1st Embodiment. It is a figure for demonstrating an example of the manufacturing method of the LED lamp 100 which concerns on 1st Embodiment. It is a figure for demonstrating the modification of the manufacturing method of the LED lamp 100 which concerns on 1st Embodiment. It is a perspective view which shows the structure of the LED lamp 200 which concerns on 2nd Embodiment. It is E-E 'arrow sectional drawing of the LED lamp 200 shown in FIG. It is a perspective view which shows the structure of the LED lamp 300 which concerns on 3rd Embodiment. FIG. 13 is a cross-sectional view of the LED lamp 300 shown in FIG. FIG. 13 is a cross-sectional view taken along line G-G ′ of the LED lamp 300 shown in FIG. 12. It is a perspective view which shows the structure of the LED lamp 400 which concerns on 4th Embodiment. FIG. 16 is a cross-sectional view taken along line H-H ′ of the LED lamp 400 illustrated in FIG. 15. FIG. 53 is a cross-sectional view taken along the line I-I ′ of the LED lamp 400 shown in FIG. 52. It is a perspective view which shows the structure of the LED lamp 500 which concerns on 5th Embodiment. FIG. 19 is a cross-sectional view taken along line K-K ′ of the LED lamp 500 illustrated in FIG. 18. It is a perspective view which shows the structure of the LED lamp 600 which concerns on 6th Embodiment. FIG. 21 is a cross-sectional view taken along line L-L ′ of the LED lamp 600 shown in FIG. 20. It is a perspective view which shows the structure of the LED lamp 700 which concerns on 7th Embodiment. FIG. 23 is a cross-sectional view taken along line M-M ′ of the LED lamp 700 shown in FIG. 22. It is sectional drawing which shows the structure of the LED lamp 800 which concerns on 8th Embodiment. It is the schematic of the illuminating device 201 which concerns on this invention. (A) Partial sectional view showing the structure of the LED lamp 900A according to the first example of modification (1), and (b) Part of the structure of the LED lamp 900B according to the second example of modification (1). It is sectional drawing. It is a partially broken perspective view which shows the structure of the LED lamp 1000 which concerns on a modification (2). It is sectional drawing which shows the structure of the LED lamp 1100 which concerns on a modification (3). It is sectional drawing which shows the structure of the LED lamp 1200 which concerns on a modification (4). It is a figure for demonstrating an example of the formation method of the sealing film which covers a glove | globe and a stem. It is a perspective view which shows the structure of the LED lamp 1300 which concerns on the 1st example of a modification (12). FIG. 32 is a cross-sectional view taken along line N-N ′ of the LED lamp 1300 shown in FIG. 31. It is a perspective view which shows the structure of the LED lamp 1400 which concerns on the 2nd example of a modification (12). FIG. 34 is a cross-sectional view taken along line O-O ′ of the LED lamp 1400 shown in FIG. 33. It is a perspective view which shows the structure of the LED lamp 1500 which concerns on the 3rd example of a modification (12). It is sectional drawing which shows the structure of the LED lamp 1600 which concerns on the 4th example of a modification (12).

<< First Embodiment >>
[1. overall structure]
FIG. 1 is a perspective view showing a structure of an LED lamp 100 according to the first embodiment. 2 is a cross-sectional view taken along line AA ′ of the LED lamp 100 shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB ′ of the LED lamp 100. 3 is a partial cross-sectional view of the LED lamp 100.

  2 and 3, the alternate long and short dash line drawn along the vertical direction of the drawing indicates the lamp axis J of the LED lamp 100, and the upper side of the drawing is expressed in front of the LED lamp 100 ("up" or "up"). In other words, the lower side of the drawing is behind the LED lamp 100 (may be expressed as “down” or “down”). Here, the “lamp axis” refers to a virtual line passing through the center of the globe 7 when the globe 7 is viewed from the front side and the center of the base 11 when the base 11 is viewed from the rear side.

  As shown in FIGS. 1 to 3, the LED lamp 100 includes, as main components, an LED module 5 including LEDs, a globe 7 that covers the LED module 5, a case 9 attached to the rear side of the globe 7, and a case 9. A base 11 attached to the opening end of the rear side, a stem (base) 13 for closing the rear side opening of the globe 7, a circuit unit 15 for receiving power from the base 11 and emitting LEDs, and an LED module 5 The support member 17 which supports the inside of the globe 7 is provided. Hereafter, each part in FIGS. 1-3 is demonstrated.

[2. Configuration of each part]
<LED module>
As shown in FIGS. 1 and 2, the LED module 5 includes a mounting substrate 21, a plurality of LEDs 3 mounted on a front surface of the mounting substrate 21, and a sealing body 23 that covers the LEDs 3.
The LED 3 is mounted on the front surface of the mounting substrate 21. The mounting substrate 21 is made of a light-transmitting material. Therefore, the light emitted from the LED 3 can be emitted not only to the front side of the LED lamp 100 but also to the rear side through the mounting substrate 21. Examples of materials that can be used as the mounting substrate 21 include glass, alumina, sapphire, and resin. In addition, LED3 in this embodiment uses what makes blue light emission color.

FIG. 4 is a diagram showing the structure of the LED module 5. 4A is a plan view of the LED module 5 viewed from the front side of the LED lamp 100, and FIG. 4B is a cross-sectional view taken along the line CC ′ in FIG. 4A.
As shown in FIG. 4A, the mounting substrate 21 has a rectangular shape in plan view. In addition, a wiring pattern 22 for electrically connecting the LEDs 3 (in series connection and / or parallel connection) or connecting to the circuit unit 15 is formed. In the LED lamp 100, the light emitted from the LED 3 is transmitted through the mounting substrate 21 so that the light is emitted to the rear side. For this reason, in the present embodiment, the wiring pattern 22 also needs to be made of a light-transmitting material. Examples of such a light-transmitting material include ITO.

As shown in FIG. 4B, a plurality of LEDs 3 are mounted on the mounting substrate 21, and two rows are linearly formed along the longitudinal direction of the mounting substrate 21 with an interval (for example, an equal interval). Is arranged. The number, arrangement, and the like of the LEDs 3 are appropriately determined depending on the luminance required for the LED lamp 100.
The sealing body 23 has a function of preventing the intrusion of air and moisture into the LED 3 and a wavelength conversion function of converting the wavelength of light from the LED 3. The sealing body 23 in the present embodiment has one row. Minute LED3 is covered.

  The sealing body 23 is mainly composed of a translucent material. As the translucent material constituting the sealing body 23, for example, a silicone resin can be used. The sealing body 23 is mixed with phosphor particles that convert blue light into yellow light. Thereby, white light mixed with blue light emitted from the LED 3 and yellow light wavelength-converted by the phosphor particles is emitted from the LED module 5 (LED lamp 100).

  As shown in FIGS. 4A and 4B, through holes 26 are formed in the mounting substrate 21 around the power supply terminals 22 a and 22 b in the wiring pattern 22. The through hole 26 is for inserting lead wires 49 and 51 (FIGS. 1 and 2) for supplying power from the circuit unit 15 to the LED 3. One end of each of the lead wires 49 and 51 is connected to the LED module 5 by being connected to the power supply terminals 22 a and 22 b of the wiring pattern 22 by the solder 24. The other ends of the lead wires 49 and 51 are connected to the circuit unit 15 as shown in FIG. Further, the through hole 25 provided in the approximate center of the mounting substrate 21 is used for coupling the mounting substrate 21 and the convex portion 17a (FIGS. 2 and 3) of the support member 17.

  In the LED lamp 100 according to the present embodiment, the LED module 5 is provided in the globe 7 at a position (for example, substantially the same position) corresponding to the position of the light source (filament) of the incandescent bulb. Thus, even if the LED lamp 100 is mounted on a conventional lighting fixture with a reflector for an incandescent lamp, the LED module 5 is arranged at the focal position of the reflector, and the light distribution characteristics when the incandescent lamp is mounted. And close characteristics can be obtained.

<Glove>
1-3, the globe 7 has the same shape as the bulb of the incandescent bulb, that is, the A type. The globe 7 is made of a translucent material. Examples of the translucent material used for the globe 7 include a glass material and a resin material. The globe 7 in the present embodiment is made of a glass material.

  As shown in FIG. 2, the globe 7 has a hollow spherical portion 7a and a tubular portion 7b. The cylindrical portion 7b is reduced in diameter as it is away from the spherical portion 7a. Further, the globe 7 occupies more than half of the total length along the lamp axis J of the LED lamp 100. Therefore, the envelope volume is the largest among the components constituting the LED lamp 100. Note that an opening exists at the end of the cylindrical portion 7b opposite to the spherical portion 7a (the end on the rear side of the globe 7), and this opening is formed by the end 13a of the stem 13 opposite to the globe 7 side. It is blocked.

<Case>
As shown in FIGS. 1 to 3, the case 9 has the same shape as that of the portion close to the cap side of the bulb of the incandescent bulb, and is made of a resin material such as polybutylene terephthalate (PBT). The case 9 has a function of releasing heat generated when the circuit unit 15 accommodated therein is turned on to the outside. Heat dissipation is performed by heat conduction from the case 9 to the outside air, convection by the outside air, and radiation.

As shown in FIG. 2, the case 9 has a large-diameter portion 9a in the front half in the lamp axis J direction and a small-diameter portion 9b in the rear half. Further, a stepped portion 9c is formed between the large diameter portion 9a and the small diameter portion 9b as shown in the enlarged view at the lower left in FIG.
As shown in FIG. 2, the large diameter portion 9 a of the case 9 covers the end portion 13 a of the stem 13. In the large diameter portion 9a of the case 9, a step portion 9e is formed in order to stably hold the end portion 13a of the stem 13. The stem 13 formed integrally with the globe 7 and the large diameter portion 9 a of the case 9 are fixed with an adhesive 57. As the adhesive 57, for example, an organic adhesive such as a resin or an inorganic adhesive can be used.

Although not particularly shown, an adhesive may be further applied to the interface between the end portion 13a of the stem 13 and the step portion 9e. By doing in this way, it is possible to make it difficult for the stem 13 and the case 9 to come off.
An Edison-type base 11 is attached to the small diameter portion 9 b of the case 9, that is, the opening end on the opposite side to the globe 7 in the case 9. The outer periphery of the small-diameter portion 9 b is a male screw, and the base 11 and the case 9 are coupled by being screwed into the base 11.

Further, a groove extending in parallel with the central axis of the case 9 is formed in the small diameter portion 9b of the case 9 (not shown in FIG. 2, corresponding to the groove 9d in FIG. 8B). This groove fixes a lead wire 33 that connects the base 11 and the circuit unit 15 described later (regulates the movement of the lead wire 33).
The large-diameter portion 9a has a shape that expands in a curve as it moves from the base 11 side to the globe 7 side so that the overall shape of the envelope composed of the globe 7 and the case 9 is similar to the incandescent bulb. It has become.

<Base>
The base 11 is for receiving electric power from the socket of the lighting fixture. Although the kind of nozzle | cap | die 11 is not specifically limited, Edison type is used in this embodiment. The base 11 includes a shell portion 27 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 31 attached to the shell portion 27 via an insulating material 29.

  The shell portion 27 is connected to the circuit unit 15 via the lead wire 33, and the eyelet portion 31 is connected to the circuit unit 15 via the lead wire 35. The lead wire 33 is drawn out from the inside of the small-diameter portion 9b of the case 9 to the outside via the opening at the lower end, and is not shown in FIG. 2 (not shown in FIG. 2). And is covered with the shell portion 27. As a result, the lead wire 35 is sandwiched between the outer periphery of the case 9 and the inner periphery of the shell portion 27, and the lead wire 35 and the base 11 are electrically connected.

<Stem>
As shown in FIGS. 1 to 3, a stem 13 that closes an opening on the rear side of the globe 7 is attached to an end portion on the rear side of the globe 7. The stem 13 in the present embodiment is made of the same translucent material as the globe 7, and the globe 7 and the stem 13 are integrally formed as will be described later. That is, the stem 13 in this embodiment is formed of a glass material. Hereinafter, the envelope composed of the globe 7 and the stem 13 is simply referred to as a valve.

  In the bulb, that is, in the globe 7 closed by the stem 13 (a space formed by the globe 7 and the stem 13 closing the opening thereof), a fluid having higher thermal conductivity than air is enclosed. . In this embodiment, helium (He) gas is enclosed. Advantages of using helium gas include inertness, low cost, corrosiveness to other members, and extremely low reducibility. Further, as described above, since the globe 7 and the stem 13 are integrally formed in this embodiment, the inside of the valve can be tightly sealed.

  By enclosing helium gas having higher thermal conductivity than air into the bulb, it is possible to efficiently conduct the heat generated when the LED 3 is turned on to the globe 7. The globe 7 is a member having a large envelope volume among the members constituting the LED lamp 100. Therefore, by conducting heat to the globe 7, it is possible to effectively use the globe 7 to efficiently dissipate the heat generated when the LED 3 emits light to the outside of the LED lamp 100.

In addition to helium gas, those that can be used as a fluid having higher thermal conductivity than air include gases such as neon (Ne) gas and hydrogen (H ₂ ) gas, and liquids such as water and silicone oil. Is mentioned. When hydrogen gas is used, it is necessary to prevent oxygen from being contained in the valve. When water is used, the lead wires 49 and 51 must be coated with a resin or the like in order to prevent deterioration due to rust.

As shown in FIGS. 1 and 3, the stem 13 is provided with an exhaust port 61. As will be described later, the helium gas is sealed through the exhaust port 61 and an exhaust pipe continuous therewith. The exhaust pipe sealing part 59 shown in FIG. 3 is the remaining part of the exhaust pipe whose end has been burned out in order to seal the inside of the valve after sealing helium gas.
The stem 13 has a function of blocking the opening of the globe 7 and a function of conducting heat generated when the LED 3 is lit to the globe 7. Details of this will be described later.

As shown in FIG. 2, the lead wires 49 and 51 are inserted into the stem 13 so that the stem 13 and the lead wires 49 and 51 are integrated. This integration is described later. This is done in the forming process.
<Circuit unit>
The circuit unit 15 converts commercial power received via the base 11 into LED3 lighting power. The circuit unit 15 includes a circuit board 41 and various electronic components 43 and 45 mounted on the circuit board 41.

  The circuit configuration of the circuit unit 15 mainly includes a rectifying circuit that rectifies commercial power (AC) and a smoothing circuit that smoothes the rectified DC power. In the present embodiment, the rectifier circuit is constituted by a diode bridge 45, and the smoothing circuit is constituted by a capacitor 43. The diode bridge 45 is mounted on the main surface of the circuit board 41 on the globe 7 side. The capacitor 43 is mounted on the main surface of the circuit board 41 on the base 11 side and is located inside the base 11.

The circuit board 41 is fixed inside the case 9 using a locking structure. Specifically, the peripheral edge portion of the back surface of the circuit board 41 abuts on the stepped portion 9c inside the case 9, and the surface of the circuit board 41 is locked by the locking portion 47 on the inner surface of the large diameter portion 9a.
A plurality (for example, four) of the locking portions 47 are formed at intervals (for example, equal intervals) in the circumferential direction. The locking portion 47 has a shape that protrudes toward the central axis side of the case 9 as it approaches the stepped portion 9 c, and the distance between the locking portion 47 and the stepped portion 9 c corresponds to the thickness of the circuit board 41.

When the circuit board 41 (circuit unit 15) is mounted, the circuit unit 15 is inserted from the large-diameter portion 9a side of the case 9, and the lower surface (surface on the base 11 side) of the circuit board 41 is the locking portion 47. When the circuit board 41 is reached, the circuit board 41 is further pushed to pass through the locking portion 47. As a result, the circuit board 41 is locked by the locking portion 47 and the circuit unit 15 is attached to the case 9.
<Supporting member>
As shown in FIGS. 1 to 3, a support member 17 is provided on the top of the stem 13 on the front side. The support member 17 has both a function as a support for the LED module 5 and a function as a heat dissipation member when the LED lamp 100 emits light.

The support member 17 supports the LED module 5 at the center position of the globe 7. The support member 17 has a rod shape, an upper end portion is coupled to the LED module 5, and a lower end portion is attached to the stem 13 by an adhesive 19. That is, the entire support member 17 in the present embodiment is an extending portion that extends from the portion attached to the stem 13 to the inside of the globe 7.
As the adhesive 19, an adhesive having high thermal conductivity is desirable. By doing in this way, it is possible to accelerate | stimulate conducting the heat | fever which generate | occur | produced by LED3 to the stem 13 via the mounting board | substrate 21 and the supporting member 17 of the LED module 5. FIG. The heat conducted to the stem 13 is stored in the globe 7 and released from the globe 7 to the outside of the LED lamp 100. Examples of the adhesive having high thermal conductivity include inorganic material-based adhesives such as ceramics and cement, and organic material-based adhesives such as heat-dissipating silicone.

  As described above, the coupling between the upper end portion of the support member 17 and the LED module 5 uses an engagement structure. A convex portion 17a is formed on the upper surface of the support member 17, and the through hole 25 (FIG. 3) is formed in the approximate center of the mounting substrate 21 of the LED module 5 as described above. The shape of the convex portion 17a and the shape of the through hole 25 correspond to each other, and the convex portion 17a and the through hole 25 are penetrated in a state where the convex portion 17a of the support member 17 is inserted (fitted) into the through hole 25 of the mounting substrate 21. The support member 17 and the LED module 5 are coupled by filling an adhesive between the holes 25.

Specifically, the function as the heat radiating member is (1) a function of conducting heat generated when the LED 3 is turned on and conducting the heat transmitted to the support member 17 to the helium gas or air contained in the globe 7, (2) The heat generated when the LED 3 is turned on and the heat transmitted to the support member 17 is conducted to the stem 13.
By the function (1), in addition to the path for transferring heat from the LED module 5 directly to the helium gas and air contained in the globe 7, a path for transferring heat to the helium gas and air via the support member 17 is configured. Is possible. (2) Due to the latter function, heat conducted to the stem 13 is transmitted to the globe 7 and the case 9, and heat is radiated from the globe 7 and the case 9. As described above, since the support member 17 also has a function as a heat radiating member, the material constituting the support member 17 is preferably a material having good thermal conductivity, and specifically, a metal, a resin, or the like. is there. If the support member 17 is made of, for example, aluminum, the LED lamp 100 can be reduced in weight.

  As described above, the support member 17 is attached to the stem 13 with the adhesive 19. As a result, as in this embodiment, even if the material constituting the support member 17 and the material constituting the stem 13 are different, the support member 17 can be fixed to the stem 13 with good adhesion. . Further, as in the present embodiment, it is possible to cope with the fixation when both the lower end surface of the support member 17 and the stem head 13b (FIGS. 2 and 3) of the stem 13 are not flat surfaces.

Furthermore, the use of the adhesive facilitates positioning when the support member 17 is fixed to the stem 13 in the manufacturing process of the LED lamp 100. As a result, the support member 17 can be fixed to the stem 13 so that the light emission center of the LED module 5 can be accurately positioned on the lamp axis J.
As described above, in this embodiment, the mounting substrate 21 of the LED module 5 is made of a translucent material, so that the light from the LED module 5 can be emitted backward. For this reason, the support member 17 of this embodiment has a shape as close to a rod as possible so as not to block light emitted backward from the LED 3 (LED module 5).

  That is, the intermediate region of the support member 17 is a cylindrical portion 17b having a circular cross section. The upper region of the support member 17 is a flat portion 17 c that is flat in the short direction (thickness is thin in the short direction) of the rectangular mounting substrate 21. As a result, the flat portion 17c of the support member 17 is configured to stably hold the LED module 5 while the cylindrical portion 17b does not block light emitted backward from the LED 3 as much as possible.

[3. Production method]
An example of the manufacturing method of the LED lamp 100 according to the present embodiment will be described based on FIGS. 5 to 8 with reference to FIGS.
FIG. 5 is a cross-sectional view showing a method of forming the stem 13 having the exhaust port 61 (FIG. 3) and the exhaust pipe continuous therewith while the lead wires 49 and 51 are inserted. 5 (a) ′ to (c) ′ correspond to a cross-sectional view taken along line BB ′ in FIG. 5 (a) is a cross-sectional view taken along line DD ′ in FIG. 5 (a) ′, and FIG. 5 (b) is a cross-sectional view taken along line DD ′ in FIG. 5 (b) ′. FIG. 5C corresponds to a cross-sectional view taken along line DD ′ in FIG.

First, as shown in FIGS. 5A and 5A ′, the two lead wires 49 and 51 are inserted inside the flare tube 69 that is the basis of the stem 13 (FIGS. 2 and 3). Further, as shown in FIG. 5 (a) ′, the narrow tube 67 is disposed so as to be located slightly on the wall surface side from the central axis of the flare tube 69 (corresponding to the lamp axis J after completion of the LED lamp 100). .
Next, as shown in FIGS. 5A and 5A ′, the upper end of the flare tube 69 (the front side of the LED lamp 100) is heated and melted by the burner 65. Thereby, the upper part of the melted flare tube 69 is welded to the upper end of the thin tube 67. As a result, as shown in FIGS. 5B and 5B ′, the flared member 71 is obtained in which the lead wires 49 and 51 are inserted and the upper end portion of the thin tube 67 is welded.

  Subsequently, the portion of the flare-like member 71 where the thin tube 67 is welded is heated by the burner 65 (FIGS. 5B and 5B '). A predetermined internal pressure is applied to the thin tube 67 by blowing air from the thin tube 67 to the portion of the flare-like member 71 where the thin tube 67 is welded. Then, pressure is applied to the portion of the flare-like member 71 where the thin tube 67 is welded, thereby forming the exhaust port 61 (FIGS. 5C and 5C '). At the same time, an exhaust pipe 63 continuing to the exhaust port 61 is also formed. The gas blown into the narrow tube 67 is not limited to air but may be nitrogen gas or the like.

Through the above steps, the lead wires 49 and 51 are inserted, and the stem 13 having the exhaust port 61 and the exhaust pipe 63 continuous thereto is completed.
6 to 8 are schematic perspective views showing each manufacturing process until the LED lamp 100 is completed by attaching the globe 7, the case 9, and the base 11 to the stem 13 through which the lead wires 49 and 51 are inserted. It is.

First, as shown in FIG. 6 (a), the lead wires 49, 51 are set at a predetermined angle in advance so that the tips 49a, 51a of the lead wires 49, 51 can be inserted into the through holes 26 (FIG. 4) of the mounting substrate 21. Bend it. Next, the adhesive 19 is applied to the stem head 13b of the stem 13, and the support member 17 is fixed to the stem 13 (FIG. 6B).
Next, the LED module 5 is attached to the tip of the support member 17 (FIG. 6C). Here, the protrusion 17a formed at the tip of the support member 17 is inserted into the through hole 25 (FIG. 4) formed in the mounting substrate 21. Furthermore, the tips 49a and 51a of the lead wires 49 and 51 are inserted through the through holes 26 (FIG. 4) formed in the mounting substrate 21. Solder 24 is applied to the periphery of the tips 49 a and 51 a and the through hole 26 with the tips 49 a and 51 a of the lead wires 49 and 51 being inserted through the through hole 26. Thus, one end of each of the lead wires 49 and 51 is connected to the power supply terminals 22a and 22b (FIG. 4) of the wiring pattern 22 of the mounting substrate 21, respectively.

The mount 55 is completed through the above steps (FIG. 6C). Here, the “mount” refers to a structure including the stem 13, the adhesive 19, the support member 17, the lead wires 49 and 51, and the LED module 5.
Subsequently, a glass globe member 73 that is the basis of the globe 7 is placed on the outside of the mount 55. Thereafter, as shown in FIG. 6 (d), the lower end portion of the stem 13 is brought into contact with the cylindrical portion 73 a of the globe member 73 (the portion that becomes the cylindrical portion 7 b (FIG. 1) of the globe 7). The part is heated with a burner 65. Then, as shown to Fig.7 (a), while the cylindrical part 73a of the member 73 for globes and the lower end part of the stem 13 are welded, it is lower than the part welded with the stem 13 in the cylindrical part 73a. Portion 73b (lower end portion 73b) is cut off. As a result, a globe 7 and a valve (a globe 7 whose opening is blocked by the stem 13) are formed (FIG. 7A).

Next, as shown in FIG. 7B, impurity gas such as air existing in the inside 75 of the valve is exhausted through the exhaust pipe 63 and the exhaust port 61. At this time, it is not necessary to exhaust all the impurity gas such as air existing in the interior 75 of the valve, and some impurity gas may remain in the interior 75 of the valve.
Then, as shown in FIG. 7C, helium gas is sealed in the inside 75 of the valve via the exhaust pipe 63 and the exhaust port 61. At this time, the pressure of the helium gas filled in the inside 75 of the valve is substantially the same as the atmospheric pressure or slightly higher than the atmospheric pressure.

Next, as shown in FIG. 8A, the exhaust pipe 63 is sealed by heating a part of the exhaust pipe 63 with a burner 65. Then, as shown in FIG. 8B, the exhaust pipe sealing portion 59 is formed, and the inside 75 of the valve is sealed.
Subsequently, as shown in FIG. 8B, the other end of each of the lead wires 49 and 51 (the end of the mounting substrate 21 opposite to the one end connected to the power supply terminals 22a and 22b (FIG. 4)). Connect to the power output unit of the circuit unit 15. One end of the lead wire 33 is disposed in the groove 9 d of the small diameter portion 9 b in the case 9, and the other end of the lead wire 33 is connected to the power input portion of the circuit unit 15. Further, one end of the lead wire 35 is connected to the eyelet portion 31 of the base 11, and the other end of the lead wire 35 is connected to the power input portion of the circuit unit 15.

Then, the base 11 is screwed to the small diameter portion 9 b of the case 9 and the globe 7 is fitted inside the large diameter portion 9 a of the case 9. Thereafter, the large-diameter portion 9a and the globe 7 are fixed with an adhesive (corresponding to the adhesive 57 in FIGS. 2 and 3), thereby completing the assembly of the LED lamp 100 (FIG. 8 (c)).
6 (d) and 8 (a), when the distance between the heating part and the LED module 5 is short in the burner 65, specifically, when the distance between the two is within 2 to 3 [cm]. In order to reduce the heat load on the LED module 5 due to the heat of the burner 65, it is desirable to provide a heat shield.

<Modification>
As for the method of joining the stem and the glove member, the so-called drop seal method has been described in FIGS. In the present embodiment, the stem and the glove member can be joined not only by the drop seal method but also by a so-called butt seal method.

FIG. 9 is a schematic perspective view showing a process of joining the stem and the glove member based on the butt seal method.
First, as shown in FIG. 9A, a glove member 73A is prepared. The glove member 73A used in the butt seal method has a shorter length corresponding to the cylindrical portion 73a than the glove member 73 used in the drop seal method. Next, the rear end 77 of the prepared glove member 73 </ b> A is melted by the burner 65.

Then, as shown in FIG. 9B, the globe member 73 </ b> A whose end 77 is melted is joined to the stem 13 of the mount 55. Further, the end portion 77 joined to the stem 13 is further melted by the burner 65, and the stem 13 and the end portion 77 are welded. Thereby, the globe 7A (valve) whose opening is closed by the stem 13 is formed (FIG. 9C).
[4. Light distribution characteristics]
In the LED lamp 100 according to the present embodiment, the LED module 5 is provided in the globe 7 at a position (for example, substantially the same position) corresponding to the position of the light source (filament) of the incandescent bulb. Thus, even if the LED lamp 100 is mounted on a conventional lighting fixture with a reflector for an incandescent lamp, the LED module 5 is arranged at the focal position of the reflector, and the light distribution characteristics when the incandescent lamp is mounted. And close characteristics can be obtained.

In addition, since the LED module 5 is configured using the light-transmissive mounting substrate 21, the light emitted backward from the LED 3 passes through the mounting substrate 21 and is emitted from the globe 7 to the outside.
By making the supporting member 17 supporting the LED module 5 into a long and narrow bar shape, it is possible to reduce the light emitted backward from the LED 3 from being blocked by the supporting member 17.

By configuring the support member 17 with a translucent material, the light reaching the support member 17 passes through as it is, and the light reaching the inner surface of the globe is emitted to the outside.
[5. Heat dissipation path]
The LED lamp 100 according to the present embodiment emits heat during light emission from a plurality of paths. The heat at the time of light emission here includes heat generated from the LED 3 and heat generated from the circuit unit 15.

(1) Heat generated in LED When heat generated in LED 3 is radiated to the outside of LED lamp 100 by conduction, there are three possible heat dissipation paths as follows.
(A) The first is a path that conducts from the LED 3 to the globe 7 via the helium gas contained in the bulb. Since helium gas has higher thermal conductivity than air, heat can be efficiently conducted to the globe 7 as compared with the case where helium gas is not contained in the globe 7. The heat accumulated in the globe 7 is released from the outer surface of the globe 7 to the outside of the LED lamp.

  (B) The second is a path that conducts to the globe 7 via the mounting substrate 21 of the LED module 5, the support member 17, and helium gas. Since the LED lamp 100 includes the support member 17, it is possible to conduct heat conduction from the support member 17 to the helium gas as well as a path from the LED module 5 to the helium gas directly. When the support member 17 is formed of a material having good thermal conductivity such as a metal material, it is possible to further increase the amount of heat conducted to the globe 7 through this path.

  (C) The third is a path that is transmitted to the mounting substrate 21, the support member 17, and the stem 13 of the LED module 5. Part of the heat transferred to the stem 13 is transferred to the case 9. However, in the present embodiment, since the stem 13 is formed integrally with the globe 7, the heat transferred to the stem 13 is easily conducted to the globe 7. It has a structure. Part of the heat transmitted to the case 9 is released from the case 9 to the outside by heat transfer, convection, and radiation, and the remaining heat is transferred from the base 11 to the socket on the lighting fixture side. Note that by selecting an adhesive 19 having a high thermal conductivity, it is possible to increase the heat radiation amount through this path.

Furthermore, in any of the above cases (a), (b), and (c), in the LED lamp 100 according to the present embodiment, the globe 7 has a size and shape similar to a bulb of an incandescent bulb. For this reason, the envelope volume of the globe 7 becomes large, and more heat of the globe 7 can be released.
(2) Heat generated in the circuit unit The heat generated from the circuit unit 15 is transferred to the case 9 by heat transfer, convection, and radiation. Part of the heat transferred to the case 9 is released from the case 9 to the outside by heat transfer, convection, and radiation, and the remaining heat is transferred from the base 11 to the socket on the lighting fixture side.

(3) Thermal load on the circuit unit In the LED lamp 100 according to the present embodiment, the globe 7 has a size and shape similar to a bulb of an incandescent bulb, and the LED module 5 is provided at a substantially central position of the globe 7. For this reason, the distance between the LED module 5 and the circuit unit 15 becomes large, and the thermal load that the circuit unit 15 receives from the LED 3 can be reduced. Thereby, for example, the size of the case 9 can be reduced, and conversely, the globe 7 can be enlarged.

In the LED lamp 100 according to the present embodiment, the globe 7 has a size and shape similar to a bulb of an incandescent bulb, and the LED module 5 is provided at a substantially central position of the globe 7. For this reason, the distance between the LED module 5 and the case 9 is increased, and the amount of heat received from the LED 3 and accumulated in the case 9 can be reduced.
(4) Comparison with Patent Documents 1 to 3 As described above, in the present embodiment, the globe having a large envelope volume is effectively used to release the heat at the time of LED emission to the outside of the LED lamp. Yes.

Here, in Patent Documents 1 to 3, a case for accommodating a circuit for lighting an LED, which exists between the LED and the base (“Light Emitting Diode Support” in Patent Document 1, and in Patent Documents 2 and 3) The structure which releases the heat | fever at the time of LED light emission to a nozzle | cap | die via a "gear column" or "gear column") is disclosed.
However, when trying to increase the brightness of the LED lamps disclosed in Patent Documents 1 to 3, there is a problem that the case becomes large. Specifically, in order to improve the luminance of the lamp, it is necessary to increase the input current to the LED. In such a case, however, the amount of heat generated from the LED increases, and the temperature of the case itself increases. As a result, the heat load on the circuit stored in the case increases. In order to efficiently dissipate this heat, it is necessary to enlarge the case to increase the envelope volume or to provide heat dissipating fins. Therefore, depending on the configurations described in Patent Documents 1 to 3, it is difficult to improve the brightness without increasing the size of the case.

  On the other hand, the LED lamp 100 of the present embodiment is configured to actively dissipate heat from a glove having a larger envelope volume than the case. Therefore, even when the LED has a high brightness, the thermal load on the circuit unit stored in the case can be suppressed, so that the problem of increasing the size of the case does not occur. Furthermore, in the LED lamp 100 of this embodiment, the case is formed of a resin material. Therefore, it is possible to reduce the weight of the LED lamp as compared with the case where the case is made of metal as in Patent Documents 1 to 3.

[6. LED position]
In this embodiment, the position of the LED 3 in the globe 7 is made to correspond to the filament position of the incandescent bulb. More specifically, the globe 7 has a shape (A type) close to an incandescent bulb, and has a spherical portion 7a and a cylindrical portion 7b. LED3 (LED module 5) is arrange | positioned in the center position of the spherical part 7a, when the globe 7 is A type corresponding to an incandescent lamp.

This position is the center position of the spherical portion 7a with the globe 7 as a reference. This position is the distance from the tip of the base 11 (the end of the eyelet part 31) from the tip of the base in the incandescent bulb to the filament. Is approximately equal to the distance.
[7. Others]
In the present embodiment, since the LED module 5 is stored in the globe 7 and the globe 7 has the same size as the incandescent bulb, the overall shape of the LED lamp 100 is similar to the incandescent bulb. Thereby, the fitting compatibility rate of the LED lamp 100 to the conventional lighting fixture which utilized the incandescent lamp can be made into about 100 [%].

<< Second Embodiment >>
FIG. 10 is a perspective view showing the structure of the LED lamp 200 according to the second embodiment. FIG. 11 is a cross-sectional view of the LED lamp 200 shown in FIG. 10 and 11, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.
The LED lamp 200 according to this embodiment differs from the LED lamp 100 according to the first embodiment in the configuration of a support member 83, a stem 85, and an LED module 81.

  Specifically, as shown in FIG. 11, the support member 83 is a hollow member, and the lead wires 49 and 51 are inserted into the support member 83. As shown in FIG. 11, the support member 83 has a hollow structure with the appearance of the support member 17 in the first embodiment as it is. Therefore, the support member 83 has the columnar part 83b and the flat part 83c similarly to the support member 17 in the first embodiment.

As the lead wires 49 and 51 are inserted into the support member 83, the position where the lead wires 49 and 51 are inserted in the stem 85 is closer to the lamp shaft J side. Further, as the lead wires 49 and 51 are accommodated in the support member 83, the position of the solder 87 connecting the lead wires 49 and 51 and the mounting substrate 91 is shifted to the lamp shaft J side. Yes.
As shown in FIG. 11, since the stem 85 and the globe 7 are integrally formed, the interface between the stem 85 and the globe 7 is tightly sealed.

An adhesive 89 is used for fixing the support member 83 and the LED module 81. As the adhesive 89, for example, those mentioned in the adhesive 19 can be used.
In the present embodiment, the lead wires 49 and 51 are accommodated inside the support member 83. Therefore, compared to the first embodiment, the light emitted from the LED module 81 is configured not to block the light emitted backward.

<< Third Embodiment >>
FIG. 12 is a perspective view showing a structure of an LED lamp 300 according to the third embodiment. 13 is a sectional view taken along line FF ′ of the LED lamp 300 shown in FIG. 12, and FIG. 14 is a sectional view taken along line GG ′ of the LED lamp 300 shown in FIG. 12-14, the same code | symbol is attached | subjected to the structure similar to 1st, 2nd embodiment, and description is abbreviate | omitted.

The LED lamp 300 according to this embodiment differs from the LED lamp 200 according to the second embodiment in the configuration of the support member 99 and the stem 101.
The support member 99 of the present embodiment has a cylindrical portion 99b and a flat portion 99c, like the support member 83 of the second embodiment. However, in the support member 99 of the present embodiment, the lower region thereof is a leg portion 99d having a truncated cone shape whose diameter increases as it approaches the stem 101. As shown in FIGS. 13 and 14, the leg 99 d of the support member 99 covers the stem head (top of the base) 101 b of the stem 101. Further, the leg 99 d of the support member 99 is fixed to the stem head 101 b with an adhesive 103.

With such a configuration, the adhesion between the support member 99 and the stem 101 can be improved, so that the LED module 81 can be stably supported. As a result, for example, the light emission center of the LED module can be prevented from deviating from the lamp axis J when the LED lamp is used or transported.
Furthermore, since the support member 99 has the leg portion 99d, it is possible to easily reflect the light emitted backward from the LED module 81 and reaching the lower end portion of the support member 99.

Further, with the provision of the leg portion 99d of the support member 99 so as to cover the stem head 101b of the stem 101, the exhaust port 61 and the exhaust pipe sealing portion 59 in the stem 101 are provided as shown in FIGS. The structure is close to the side opposite to the lamp shaft J.
13 and 14, since the stem 101 and the globe 7 are integrally formed, the interface between the stem 101 and the globe 7 is tightly sealed.

<< Fourth Embodiment >>
FIG. 15 is a perspective view showing the structure of an LED lamp 400 according to the fourth embodiment. 16 is a cross-sectional view taken along line HH ′ of the LED lamp 400 shown in FIG. 15, and FIG. 17 is a cross-sectional view taken along line II ′ of the LED lamp 400 shown in FIG. 15. 15 to 17, the same reference numerals are given to the same configurations as those in the first to third embodiments, and description thereof will be omitted.

  The LED lamp 400 according to this embodiment is different from the LED lamp 100 according to the first embodiment in the configuration of the stem 111. Specifically, the stem 111 has a dome shape, and has a recess 111a in the vicinity of intersecting the lamp axis J. In this recess 111 a, the support member 17 and the stem 111 are fixed by the adhesive 19. With such a configuration, it is possible to stably support the LED module in the globe as compared to the case where the support member is fixed to the convex stem head as in the first embodiment. is there.

As shown in FIGS. 16 and 17, since the stem 111 and the globe 7 are integrally formed, the interface between the stem 111 and the globe 7 is tightly sealed.
<< Fifth Embodiment >>
FIG. 18 is a perspective view showing the structure of an LED lamp 500 according to the fifth embodiment. 19 is a cross-sectional view of the LED lamp 500 shown in FIG. 18 and 19, the same reference numerals are given to the same components as those in the first to fourth embodiments, and the description thereof will be omitted.

The LED lamp 500 according to this embodiment is different from the LED lamp 100 according to the first embodiment in the configuration of the stem 115.
Specifically, as shown in FIG. 19, the stem 115 in this embodiment includes a disk-shaped disk part 115a and a columnar columnar part 115b positioned at the center of the disk part 115a. Further, since the peripheral edge portion of the disc portion 115a in the stem 115 and the globe 7 are integrally formed, the interface between the stem 115 and the globe 7 is tightly sealed.

  In the manufacturing process of the LED lamp 500, the exhaust port 119 for exhausting the bulb and filling the helium gas is formed in the vicinity of a portion intersecting the lamp axis J on the front end surface of the cylindrical portion 115b as shown in FIG. ing. Similarly, an exhaust pipe that performs exhaust and helium gas sealing and an exhaust pipe sealing portion 117 that is the remainder are formed along the substantially lamp axis J inside the cylindrical portion 115b.

  The support member 17 and the stem 115 are fixed to each other by the adhesive 19 on the front end surface of the cylindrical portion 115b. When the adhesive is used, the support member 17 and the stem 115 can be stably fixed without being affected by unevenness in the cylindrical portion 115b due to the presence of the exhaust port 119. Further, by using a material having high thermal conductivity as the adhesive 19, it is possible to efficiently transmit the heat at the time of LED light emission to the stem 115 and the globe 7 through the support member 17.

Furthermore, the stem 115 in the present embodiment is lighter in weight because the glass material constituting the stem is less than the stems according to the first to fourth embodiments. Therefore, according to the configuration of the present embodiment, it is possible to reduce the weight of the LED lamp.
In FIGS. 18 and 19, the exhaust port 119 and the exhaust pipe sealing portion 117 are formed in the cylindrical portion 115 b. However, the present invention is not limited to this. It can also be set as the structure by which the exhaust port and the exhaust pipe sealing part are formed in the disc part 115a.

<< Sixth Embodiment >>
FIG. 20 is a perspective view showing the structure of an LED lamp 600 according to the sixth embodiment. 21 is a cross-sectional view taken along line LL ′ of the LED lamp 600 shown in FIG. 20 and 21, the same reference numerals are given to the same components as those in the first to fifth embodiments, and the description thereof will be omitted.

The LED lamp 600 according to the present embodiment is different from the LED lamp 100 according to the first embodiment in the configuration of the stem 147.
Specifically, as shown in FIG. 21, the stem 147 in the present embodiment includes a thin portion 147 a that is continuous with the end of the globe 7, and a thick portion 147 b that is located on the lamp shaft J side with respect to the thin portion 147 a. Have Moreover, since the peripheral part of the thin part 147a in the stem 147 and the globe 7 are integrally formed, the interface between the stem 147 and the globe 7 is tightly sealed.

  In the manufacturing process of the LED lamp 600, the exhaust port 151 for exhausting the bulb and filling the helium gas is formed in the vicinity of the portion intersecting the lamp axis J on the front end face of the thick portion 147b, as shown in FIG. Has been. Further, the exhaust pipe that performs exhaust and helium gas sealing is formed along the ramp axis J inside the thick part 147b, and the exhaust pipe sealing part 149 that is the remaining part of the exhaust pipe has a thick wall. It is formed on the rear side of the portion 147b and along the lamp axis J.

  The support member 17 and the stem 147 are fixed to each other with the adhesive 19 on the front end face of the thick portion 147b. When the adhesive is used, the support member 17 and the stem 147 can be stably fixed without being affected by the unevenness in the thick portion 147b due to the presence of the exhaust port 151. Further, by using a material having high thermal conductivity as the adhesive 19, it is possible to efficiently transmit heat at the time of LED light emission to the stem 147 and the globe 7 through the support member 17.

  The stem 115 in the present embodiment is lighter in weight than the stems according to the first to fifth embodiments because there are few glass materials constituting the stem. Therefore, according to the configuration of the present embodiment, it is possible to reduce the weight of the LED lamp. Furthermore, since the stem 147 of this embodiment has a smaller thickness along the lamp axis J direction than the stems according to the first to fifth embodiments, the distance between the stem 147 and the LED module 5 is long. Therefore, it is possible to reduce the thermal load received by the LED module 5 due to the heat of the burner 65 in the steps shown in FIGS. 6D and 8A in the LED lamp manufacturing process.

In FIGS. 20 and 21, the exhaust port 151 and the exhaust pipe sealing part 149 are formed in the thick part 147 b. However, these may be formed in the thin part 147 a.
<< Seventh Embodiment >>
In the first to sixth embodiments, the stem (base) and the support member are configured as separate members, but the present invention is not limited to this. For example, as shown in FIG. 22, the stem 123 and the support member 125 may be integrally formed.

FIG. 22 is a perspective view showing the structure of the LED lamp 700 according to this embodiment. FIG. 23 is a cross-sectional view taken along line MM ′ of the LED lamp 700 shown in FIG. 22 and 23, the same reference numerals are given to the same components as those in the first to sixth embodiments, and the description thereof will be omitted.
The characteristic part of the LED lamp 700 according to the present embodiment is that the stem 123 and the support member 125 are integrally formed as described above. That is, in the LED lamp 700 according to this embodiment, the support member 125 is formed of the same material as the stem 123, that is, a glass material. In the present embodiment, the LED module 133 is directly attached to the front end face of the support member 125 made of a glass material.

  As shown in FIG. 23, since the stem 123 and the globe 7 are also integrally formed, the interface between the stem 123 and the globe 7 is tightly sealed. Further, in the manufacturing process of the LED lamp 700, the exhaust port 131 for exhausting the bulb and enclosing the helium gas is formed at the front end portion of the support member 125 as shown in FIG. Further, an exhaust pipe for performing exhaust and helium gas sealing is formed along the lamp axis J inside the support member 125, and the exhaust pipe sealing portion 129, which is the remainder of the exhaust pipe, The rear side is formed along the lamp axis J.

  As shown in FIGS. 22 and 23, the support member 125 and the mounting substrate 135 of the LED module 133 are fixed by an adhesive 121. As the adhesive 121, for example, those mentioned in the adhesive 19 can be used. When the adhesive is used, the support member 125 and the LED module 133 can be stably fixed without being affected by unevenness at the front end portion of the support member 125 due to the presence of the exhaust port 131. In addition, by using a material having high thermal conductivity as the adhesive 121, it is possible to efficiently transmit heat at the time of LED light emission to the support member 125, the stem 123, and the globe 7.

Further, in the present embodiment, since the stem 123 and the support member 125 are integrally formed, the number of parts constituting the LED lamp is small as compared with the first to sixth embodiments. Therefore, it is possible to reduce the number of manufacturing steps when manufacturing the LED lamp.
When the stem 123 and the support member 125 are integrally formed as in the present embodiment, the lead wires 49 and 51 are integrated with the stem and the support member so that the lead wires 49 and 51 are wired through the inside of the support member. It may be molded. In this case, the power supply terminals 22a and 22b may be provided at the center of the mounting board.

<< Eighth Embodiment >>
The LED lamps in the first to seventh embodiments are intended to replace the general incandescent bulb, but the LED lamp according to the present invention can also be applied to other bulbs. In the present embodiment, a description will be given of an LED lamp 800 adapted to a bulb, for example, a so-called reflex bulb having an aluminum vapor deposition layer in a bulb.

FIG. 24 is a sectional view showing the structure of an LED lamp 800 according to the eighth embodiment. In FIG. 24, the same components as those in the first to seventh embodiments are denoted by the same reference numerals, and description thereof is omitted.
The LED lamp 800 according to this embodiment is different from the LED lamp 100 according to the first embodiment in the configuration of the globe 105.

The globe 105 has a hollow shape. The globe 105 has a shape that swells the bottom of the flask. That is, the globe 105 is a so-called R type.
The globe 105 has a flask-like part 105b and a cylindrical part 105c. The globe 105 is formed integrally with the stem 13, and an end portion 13 a of the stem 13 opposite to the globe 105 side is covered with a large diameter portion 9 a of the case 9. 24, the end portion 13a of the stem 13 is fixed to the opening of the large diameter portion 9a of the case 9 with an adhesive 141 as shown in the lower right enlarged view.

The globe 105 has a reflective layer 127 on its inner surface. The reflective layer 127 has a function of reflecting light emitted backward from the LED module 5 in a predetermined direction (for example, forward). The reflective layer 127 can be obtained, for example, by vacuum-depositing a metal material such as aluminum, or by applying a white paint.
Similarly to the first embodiment, helium gas is sealed in the valve in this embodiment. Therefore, in this embodiment, it is possible to obtain the same effect as that described in the first embodiment with the reflex bulb.

In the present embodiment, an example in which the LED lamp 100 according to the first embodiment is applied to a reflex bulb has been described. Of course, the LED lamps according to the second to seventh embodiments are not limited to the first embodiment, and may be applied to a reflex bulb. In this case, an effect equivalent to that described in the second to seventh embodiments can be obtained with the reflex bulb.
<< Ninth Embodiment >>
The present invention can also be applied to an illumination device using the LED lamps 100 to 800 described in the first to eighth embodiments.

  Since the LED lamp described in the background art uses a case as a heat dissipation member, the case is enlarged. In this case, the LED arrangement position is farther from the base than the filament position in the incandescent bulb. That is, the LED arrangement position (distance from the base) in the entire LED lamp is different from the filament position (distance from the base) in the entire incandescent lamp.

When such an LED lamp is used in a lighting fixture having an incandescent bulb and having a reflecting mirror, for example, a downlight, a problem such as an annular shadow occurs on the irradiated surface. That is, when the light source position is different from that of the conventional incandescent bulb, a problem occurs in the light distribution characteristics and the like.
In the present embodiment, as an example, a case where the LED lamp 100 according to the first embodiment is mounted on a lighting fixture (downlight type) will be described.

FIG. 25 is a schematic view of a lighting device according to the present invention.
The lighting device 201 is used by being mounted on the ceiling 202, for example.
As shown in FIG. 25, the lighting device 201 includes an LED lamp (for example, the LED lamp 100 described in the first embodiment), and a lighting fixture 203 that is mounted with the LED lamp 100 to be turned on / off. Is provided.

The lighting fixture 203 includes, for example, a fixture main body 205 attached to the ceiling 202 and a cover 207 attached to the fixture main body 205 and covering the LED lamp 100. The cover 207 is an open type here, and has a reflection film 211 on its inner surface that reflects light emitted from the LED lamp 100 in a predetermined direction (here, downward).
The appliance main body 205 is provided with a socket 209 to which the base 11 of the LED lamp 100 is attached (screwed), and power is supplied to the LED lamp 100 through the socket 209.

In this embodiment, since the arrangement position of LED3 (LED module 5) of the LED lamp 100 mounted on the lighting fixture 203 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 100 and the emission center in the incandescent bulb. Are close to each other.
For this reason, even if the LED lamp 100 is mounted on a lighting fixture in which an incandescent lamp is mounted, the position of the light emission center as the lamp is similar, and thus there is a problem that an annular shadow is generated on the irradiated surface. It becomes difficult to occur.

Note that the lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 207 but may have a closing-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).
In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.

Furthermore, although the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.
In addition, it is also possible to use the LED lamp which concerns on the modification mentioned later as an LED lamp of the illuminating device concerning this embodiment.
≪Modifications ・ Others≫
Although the configuration of the present invention has been described based on the first to ninth embodiments, the present invention is not limited to the above-described embodiments and the like. For example, the following modifications can be given.

(1) In the above-described embodiment, the exhaust in the valve, the exhaust port for sealing the helium gas, and the exhaust pipe are formed in the stem in the manufacturing process. However, this invention is not limited to this, For example, it is good also as being formed in the glove.
FIG. 26A is a partial cross-sectional view showing the structure of the LED lamp 900A according to the first example of the present modification. In the LED lamp 900 </ b> A, an exhaust pipe and an exhaust pipe sealing part 137 that is the remaining part of the exhaust pipe are formed in the cylindrical part 143 b of the globe 143. FIG. 26B is a partial cross-sectional view showing the structure of the LED lamp 900B according to the second example of the present modification. In the LED lamp 900 </ b> B, the exhaust port and the exhaust pipe sealing part 139 which is the remaining part of the exhaust pipe are formed in the spherical part 145 a of the globe 145.

Even with such a configuration, it is possible to tightly seal the inside of the valve after helium filling.
(2) FIG. 27 is a partially broken perspective view showing the structure of the LED lamp 1000 according to this modification. In the LED lamp 1000, two modifications are added to the LED lamp 100 according to the first embodiment.

  The first variation is the shape of the LED module. In the LED lamp 100 (FIG. 1) according to the first embodiment, the shape of the mounting substrate 21 of the LED module 5 is rectangular. On the other hand, in the LED lamp 1000 according to this modification, the mounting substrate 311 of the LED module 303 has a disk shape. In the LED module 303 of this modification, a plurality of LEDs are mounted in an annular shape on the mounting substrate 311, and accordingly, the sealing body 313 covering the LEDs is also in an annular shape in plan view. . Here, the plurality of LEDs have the same configuration as the LED 3 described in the first embodiment, but may have different configurations, for example, different emission colors and outputs (luminance).

The sealing body 313 is made of a translucent material. Since the LED emits light of the same color as that of the first embodiment, a conversion material that converts the wavelength of light from the LED to a desired (yellow) color is mixed in the translucent material as in the first embodiment. Yes. In addition, although the sealing body 313 is carrying out the annular | circular shape by planar view, for example, a dome shape (circular shape) may be sufficient.
Further, the end portions of the lead wires 49 and 51 on the LED module 303 side are inserted through the through holes of the mounting substrate 311 from the bottom to the top, and are fixed by the solder 24 on the upper surface of the mounting substrate 311 and electrically wired. Connected with pattern.

The second variation is a high thermal conductive layer provided on the inner wall of the globe. More specifically, in the LED lamp 1000 according to the present modification, the high thermal conductive layer 315 made of the material constituting the globe 7 and the material having higher thermal conductivity than the helium gas is provided on the inner wall front surface of the globe 305. Is formed. The high thermal conductive layer 315 is made of a light-transmitting resin material, metal material, or the like. Examples of the light-transmitting metal material include indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO ₂ ), antimony-doped tin oxide (ATO), and zinc oxide (ZnO).

  [5. Heat Dissipation Path] (1) As described in (1-1), there are three paths through which heat generated by the LED is dissipated by conduction. That is, (a) a path from the LED to the globe via the helium gas, (b) a path from the LED to the mounting substrate, a support member, and a helium gas to the globe, (c) the LED to the mounting substrate, support It is a path that conducts to the globe through the member and stem. As described above, the heat dissipation paths (a) to (c) include a path conducted from the helium gas or the stem to the globe.

In this modification, a high thermal conductive layer 315 is formed on the inner wall of the globe 305. Thereby, it is possible to efficiently transfer heat between the helium gas and the globe 305 or between the stem and the globe 305. As a result, heat dissipation from the globe 305 can be promoted.
In FIG. 27, the high thermal conductive layer 315 is formed on the entire inner wall of the globe 305. However, the present invention is not limited to this, and may be formed only on a part of the inner wall.

(3) FIG. 28 is a cross-sectional view showing the structure of an LED lamp 1100 according to this modification. The difference from the LED lamp 100 according to the first embodiment is that a low thermal conductive layer 321 is formed between the end portion 13a of the stem 13 and the large diameter portion 9a of the case 9 (in FIG. 28). (Expanded figure on the lower right)
Specifically, the low thermal conductive layer 321 is formed of a material having lower thermal conductivity than the material constituting the case 9. The low thermal conductive layer 321 in this modification also serves as an adhesive that fixes the end portion 13 a of the stem 13 and the large-diameter portion 9 a of the case 9. That is, the low thermal conductive layer 321 in this modification is an adhesive having low thermal conductivity. Examples of the adhesive having low thermal conductivity include an epoxy adhesive and an acrylic adhesive.

  Since the low thermal conductive layer 321 is interposed between the end portion 13 a of the stem 13 and the large diameter portion 9 a of the case 9, the heat conducted from the LED to the stem 13 via the support member 17 is transferred to the case 9. It is possible to suppress transmission. By suppressing the heat transfer to the case 9, the temperature rise inside the case 9 can be suppressed. As a result, it is possible to reduce the thermal load on the circuit unit 15 stored in the case 9.

The low heat conductive layer 321 does not necessarily have to play the role of an adhesive, and the above effect can be obtained as long as the low heat conductive layer 321 is made of a material having a lower thermal conductivity than the material constituting the case 9. Can do. In the case where the low thermal conductive layer 321 does not have a role as an adhesive, materials that can be used for the low thermal conductive layer 321 include an epoxy resin and an acrylic resin.
(4) FIG. 29 is a cross-sectional view showing the structure of an LED lamp 1200 according to this modification. The difference from the LED lamp 100 according to the first embodiment is that the globe 325 is formed of a resin material, and the globe 325 and the stem 13 are not integrally molded.

The globe 325 is formed of a translucent resin material such as silicone resin. The globe 325 and the globe 7 in the first embodiment differ only in the materials used, and the shape of the globe 325 is substantially the same as the globe 7 in the first embodiment. That is, it has a spherical portion 325a and a cylindrical portion 325b.
The lower end portion 325c of the globe 325 and the end portion 13a of the stem 13 are fixed with an adhesive 327, whereby the inside of the bulb is tightly sealed. As the adhesive 327, for example, those mentioned for the adhesive 19 can be used.

Further, the low thermal conductive layer 321 described in the modification (3) is interposed between the lower end portion 325 c of the globe 325 and the large diameter portion 9 a of the case 9. Therefore, also in the LED lamp 1200 according to this modification, the same effect as that described in Modification (3) can be obtained.
Since the globe 325 is formed of a resin material, the weight of the LED lamp can be reduced. Furthermore, it is possible to improve the impact resistance of the glove.

(5) In the above embodiments and modifications, the stem is formed of a glass material, but the present invention is not limited to this. For example, the stem may be formed of a resin material.
In order to tightly seal the inside of the bulb, it is necessary to join the glove and a stem formed of a resin material. For this, for example, an adhesive as in Modification (4) can be used. . Besides the method using an adhesive, the inside of the bulb can be sealed by covering the globe and the stem with a sealing film.

FIG. 30 is a diagram for explaining an example of a method of forming a sealing film that covers the globe and the stem. Here, both the globe and the stem are made of a resin material.
First, as shown in FIG. 30A, a globe 325 made of a resin material is placed so as to cover the mount 331. The mount 331 here is obtained by changing the stem 13 in the mount 55 shown in FIG. 6C to a stem 333 formed of a resin material.

Next, as shown in FIG. 30B, a sealing film material 337 is sprayed over the entire structure formed by covering the globe 325 on the mount 331 with a nozzle 335. As the sealing film material 337, for example, a DLC (Diamond Like Carbon) coating material or the like is dispersed in a solvent.
And the sealing film 339 which consists of a DLC coating material etc. can be formed by evaporating and drying the solvent contained in the sealing film material 337 (FIG.30 (c)). Although not particularly shown, this is followed by the process of exhausting the impurity gas in the globe 325 (in the valve) closed by the stem 333 and filling the helium gas. Subsequent processes are the same as those described in the first embodiment.

In FIG. 30, the sealing film is formed by spraying the sealing film material 337 with the nozzle 335, but this is merely an example. As another method, for example, a method of immersing a structure formed by covering the mount 331 with the globe 325 in a bath containing the sealing film material 337 and then removing the structure from the bath and evaporating and drying the solvent can be considered. It is done.
FIG. 30 shows a method of forming the sealing film 339 on the outside of the structure formed by covering the mount 331 with the globe 325, but inside the globe 325 closed by the stem 333 (inside the valve). It is also possible to form a sealing film. In this case, the sealing film can be formed inside the globe 325 by injecting the sealing film material from the exhaust pipe for exhausting the impurity gas and the helium gas and the exhaust port.

Furthermore, when the resin material constituting the globe 325 and the stem 333 is a thermoplastic material, it is possible to adopt the same molding method (FIGS. 6, 7, and 9) as in the case of a glass material.
(6) LED Module (6-1) Light Emitting Element In the above embodiment and the modification, the case where the LED element is used as the LED has been described, but the present invention is not limited thereto. For example, surface mount type or shell type LEDs may be used.

Moreover, in said embodiment and modification, although the form using LED as a light emitting element was demonstrated, a light emitting element contains LD (laser diode) and EL element (electric luminescence element, organic, and inorganic), for example. Or the like. Moreover, you may use combining these, including LED.
In the above embodiment and the modification, the emission color of the LED is blue light, and the phosphor particles are described as an example of converting blue light into yellow light, but other combinations may be used. As an example of other combinations, when emitting white light, the LED emission color is ultraviolet light, and phosphor particles are converted into red light, particles converted into green light, and particles converted into blue light. Can be used.

Furthermore, the light emission color of the LED may be mixed with white light by using three types of LED elements of red light emission, green light emission, and blue light emission. Needless to say, the color of light emitted from the light emitting unit is not limited to white, and various LEDs (including elements and surface mount types) and phosphor particles can be used depending on the application.
(6-2) Mounting substrate In the embodiment and the modification, the mounting substrate on which the LED is mounted is a translucent substrate, and the LED is mounted only on one surface of the mounting substrate. It is not limited to. For example, even when the mounting substrate is a non-transparent substrate and the LEDs are mounted on both sides of the mounting substrate, the light from the LEDs can be emitted to the rear side. Further, when a non-transparent substrate is used as the mounting substrate, for example, an existing insulating substrate such as a resin substrate, a ceramic substrate, or a metal base substrate made of a resin plate and a metal plate can be used. Note that even when it is not necessary to extract light backward, the mounting substrate can be a non-light-transmitting substrate.

Moreover, in the said embodiment and the modification, although the planar view shape demonstrated as an example the mounting board | substrate with the rectangular shape or the circular shape, the planar view shape of the mounting board | substrate is not specifically limited.
Furthermore, in each embodiment and each modified example, a thin plate (having a smaller side surface area than the upper surface area) has been described as an example. For example, a thick plate may be used, You may use a block-shaped thing.

Note that the mounting substrate in this specification has a pattern for mounting a semiconductor light emitting element (including element and surface mount type) and electrically connecting to the semiconductor light emitting element regardless of the shape, thickness, and form. Pointing. Therefore, the substrate may have a block shape.
(6-3) Sealing Body In the above embodiment, the sealing body covers the plurality of LEDs mounted linearly on the mounting substrate, but the present invention is not limited to this. For example, one LED may be covered with one sealing body, or all LEDs may be covered with one sealing body as in Modification (2) (FIG. 27).

  Further, in the above-described embodiments and modifications, the phosphor particles are mixed in the sealing body. For example, a phosphor layer containing the phosphor particles may be formed on the inner surface of the globe. In addition to the sealing body, a wavelength conversion member such as a fluorescent plate containing phosphor particles may be provided in the light emission direction of the LED. Here, when the temperature of the phosphor particles becomes high, the wavelength conversion efficiency decreases. Therefore, by forming the phosphor layer on the inner surface of the globe, the phosphor particles are less affected by heat at the time of LED emission than when the phosphor particles are mixed in the sealed body sealing the LED. The decrease in the wavelength conversion efficiency can be suppressed.

(7) Globe Although an example in which an A type glove is used in each of the first to seventh embodiments and an R type glove is used in the eighth embodiment, the present invention is not limited thereto. For example, a B or G type globe, or a bulb shape of an incandescent bulb or a globe shape different from that of a bulb-type fluorescent LED lamp may be used.

Further, the globe may be transparent so that the inside can be seen, or may be translucent so that the inside cannot be seen. Examples of the semi-transparent method include a method in which a diffusion layer mainly composed of calcium carbonate, silica, a white pigment, or the like is applied to the inner surface, or a treatment (for example, blasting) that makes the inner surface uneven. .
Further, although the globe is made of glass material, it can be made of other materials. As other materials, a translucent resin, ceramic, or the like may be used.

(8) Case In the above-described embodiments and modifications, the case is made of a resin material, but can be made of other materials. When a metal material is used as another material, it is necessary to ensure insulation between the base. Insulation between the base and the base can be ensured by, for example, applying an insulating layer to the outer peripheral surface of the small diameter portion of the case or performing an insulation treatment on the small diameter portion. Furthermore, it can be ensured by forming the globe side of the case from a metal material, and forming the base side of the case from a resin material, and combining the two.

Moreover, in each said embodiment and each modification, although it did not demonstrate in particular about the surface of a case, for example, you may provide a radiation fin and may perform the process for improving a radiation rate.
Furthermore, although the case is composed of one member, it can be composed of a plurality of members. For example, a large-diameter member corresponding to the large-diameter portion in the LED lamp 100 according to the first embodiment and a small-diameter member corresponding to the small-diameter portion may be joined with an adhesive. At this time, the large diameter member may be made of metal and the small diameter member may be made of resin.

  In each embodiment and each modification, there is a space inside the case, and the circuit unit is stored in the space. For example, the space may be filled with a resin material. In this case, by filling the resin having insulating properties and high thermal conductivity, the heat generated in the circuit unit can be efficiently transferred to the case, and the thermal load acting on the circuit unit can be reduced. .

  In the above embodiment, the valve and the case are positioned by placing the lower end portion on the rear side of the valve on the stepped portion provided on the inner peripheral surface of the large diameter portion of the case. Is not limited to these. For example, it is good also as a structure which does not equip a large diameter part internal peripheral surface with a level | step-difference part. In this case, an adhesive or the like is used at a position along the lamp axis J between the top of the globe and the bottom end of the eyelet, that is, at a position where the total length of the LED lamp is a predetermined length. The glove and the case are fixed.

(9) Base As for the shape of the base, Edison type base is used in the above-described embodiments and modifications, but other types, for example, pin type (specifically, G type such as GY, GX, etc.) .) May be used.
Further, the base is attached (joined) to the case by screwing into the screw portion (small diameter portion) of the case using the female screw of the shell portion, but may be joined to the case by other methods. . Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.

  Further, more than half of the shell portion is screwed into the screw portion of the small-diameter portion having the cylindrical shape of the case, but the small-diameter portion may be attached to the case shorter than the embodiment. In this case, the electronic component of the circuit unit may be located inside the shell portion. In such a case, an insulating resin may be filled in the shell portion. Thereby, the insulation between the electronic component and the base is ensured, and the heat generated in the electronic component can be efficiently transferred to the base by using a resin having high thermal conductivity.

(10) Stem The shape of the stem may be other than that described in the above embodiment. For example, a polyhedron such as a rectangular parallelepiped or a cube is conceivable.
(11) Circuit unit The posture in which the circuit board is fixedly accommodated in the case is not limited to the posture in which the main surface of the circuit board is substantially orthogonal to the lamp axis J. For example, the circuit board may be accommodated in a posture that is substantially parallel to the lamp axis J, or may be accommodated in a posture having a predetermined inclination angle with respect to the lamp axis J.

Further, the circuit board is not limited to a disk shape, and the shape in plan view may be a rectangular shape, a polygonal shape, or an indefinite shape such as a heart shape, or may be formed by a flexible member such as a flexible substrate and bent. It may be accommodated inside the case in a state where it is placed.
Further, the method of fixing the circuit board inside the case is not limited to the locking structure by the locking part, and the circuit board may be fixed inside the case by, for example, screwing or bonding.

Further, the circuit unit may be provided with a circuit for controlling the lighting of the LED based on a wireless signal or the like. Here, “lighting control” includes, for example, lighting, extinguishing, dimming, illumination color change, and the like.
(12) Support member In the above-described embodiment and the like, the intermediate region of the support member is cylindrical, that is, the cross-sectional shape perpendicular to the lamp axis J is circular, but the present invention is not limited to this. For example, it may be a triangle or a polygon more than a quadrangle.

Moreover, in said embodiment etc., although the supporting member was rod-shaped, this invention is not limited to this.
FIG. 31 is a perspective view showing a structure of an LED lamp 1300 according to a first example of the modification (12), and FIG. 32 is a cross-sectional view taken along line NN ′ of the LED lamp 1300 shown in FIG. . The support member 341 in this modification has a truncated cone shape when the LED lamp 1300 is viewed with the globe disposed on the upper side and the base disposed on the lower side. As shown in FIG. 32, a recess 341 a is formed at the rear end of the support member 341, and the recess 341 a covers the stem head of the stem 101. An adhesive 343 is filled between the concave portion 341a and the stem head of the stem 101, so that the stem 101 and the support member 341 can be stably fixed. The support member 341 is formed with a through hole 345 for inserting the lead wires 49 and 51.

Further, the surface of the support member 341 is a reflective film made of, for example, a metal film. By doing in this way, it is possible to reflect the light which permeate | transmitted the mounting board | substrate 91 and was radiate | emitted to the back side among the lights from the LED module 81. FIG. As a result, the loss of the emitted light from the LED module 81 due to the presence of the support member can be suppressed.
33 is a perspective view showing a structure of an LED lamp 1400 according to a second example of the modification (12), and FIG. 34 is a cross-sectional view taken along the line OO ′ of the LED lamp 1400 shown in FIG. . The support member 347 in the present modification has an inverted truncated cone shape when the LED lamp 1400 is viewed with the globe disposed on the upper side and the base disposed on the lower side. As shown in FIG. 34, the support member 347 is provided with a through hole 349 along the lamp axis J, and lead wires 49 and 51 are inserted into the through hole 349.

With such a configuration, the contact area between the mounting substrate 91 of the LED module 81 and the support member can be increased, so that heat can be more efficiently transferred from the support member 347 to the stem 85 and the globe 7. be able to. Further, since the contact area between the support member 347 and the mounting substrate 91 is large, the LED module 81 can be stably supported.
FIG. 35 is a perspective view showing a structure of an LED lamp 1500 according to a third example of the modification (12). The support member 353 according to this embodiment has a shape in which a constriction is given to an intermediate region in the support member 347 shown in FIGS. With such a configuration, it is possible to reduce the weight of the support member while maintaining the same heat dissipation as that of the LED lamp 1400 shown in FIGS.

  FIG. 36 is a cross-sectional view showing the structure of an LED lamp 1600 according to a fourth example of the modification (12), and is a cross-sectional view along the short axis direction of the rectangular mounting board 21 (FIGS. 3, 14, 17 and the like). The same cross section as that shown in FIG. The support member 355 in this modification has a shape that avoids the region where the sealing body 23 is formed on the mounting substrate 21. By doing in this way, the loss of the light radiate | emitted from the surface of the back side in the mounting substrate 21 can be reduced.

31 to 36 show a configuration in which both of the lead wires 49 and 51 are accommodated in the support member, the present invention is not limited to this. For example, as shown in FIG. 1, the lead wires 49 and 51 may be arranged outside the support member.
(13) Location of exhaust pipe and exhaust port Regarding the exhaust port and exhaust pipe used in the manufacturing process of the LED lamp, the positions where these are provided are not limited to the positions described in the above embodiment and modification (1). It can be changed as appropriate. For example, it may be near the stem head 13b in the first embodiment (FIG. 1).

(14) Others (14-1) Although an adhesive is used for joining the stem and the support member, the present invention is not limited to this. For example, a fitting structure, an engaging structure, or the like can be used. In this case, between the steps shown in FIGS. 6A and 6B, the stem head 13b is melted with a burner to form a leg portion and a fitting structure on the support member 17 on the stem head 13b. Can be realized.

  (14-2) In the above embodiments and the like, the inside of the base and the case is hollow, but the present invention is not limited to this. For example, the inside of the base or the case may be filled with an insulating material having higher conductivity than air. An example of such a material is a silicone resin. Further, by filling the case with an insulating material or the like, it is possible to suppress vibration during operation of the circuit unit and reduce noise emitted from the LED lamp.

  (14-3) The materials, numerical values, and the like used in the above embodiment are merely preferred examples, and are not limited to this form. In addition, changes can be made as appropriate without departing from the scope of the technical idea of the present invention. Further, combinations with other embodiments are possible as long as no contradiction occurs. Furthermore, the scale of the members in each drawing is different from the actual one. Note that the symbol “˜” used to indicate a numerical range includes numerical values at both ends.

  The lamp according to the present invention can be suitably used, for example, as a bulb-type LED lamp that replaces an incandescent bulb.

100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600 LED lamp 3 LED
5, 81, 133, 303 LED module 7, 7A, 105, 143, 145, 305, 325 Globe 9 Case 11 Base 13, 85, 101, 111, 115, 123, 147, 333 Stem 15 Circuit unit 17, 83, 99, 125, 341, 347, 353, 355 Support member 19, 57, 89, 103, 121, 141, 327, 343 Adhesive 21, 91, 135, 311 Mounting substrate 22 Wiring pattern 23, 313 Sealed body 24, 87 Solder 25, 26, 345, 349 Through hole 27 Shell part 29 Insulating material 31 Eyelet part 33, 35, 49, 51 Lead wire 41 Circuit board 43 Capacitor 45 Diode bridge 47 Locking part 55, 331 Mount 59, 117, 129 137, 139, 151 Exhaust pipe sealing part 61, 119, 131, 149 Exhaust port 63 Exhaust pipe 65 Burner 67 Narrow tube 69 Flare pipe 71 Flare member 73, 73A Globe member 75 Inside of valve 77 End 127 Reflective layer 201 Lighting device 202 Ceiling 203 Lighting fixture 205 Appliance body 207 Cover 209 Socket 211 Reflective film 315 High thermal conductive layer 321 Low thermal conductive layer 335 Nozzle 337 Sealing film material 339 Sealing film

Claims (10)

A light-emitting element as a light source is supported by a support member in the globe,
The opening of the globe is closed by a base on which the support member is erected,
A lamp having a higher thermal conductivity than air is enclosed in the globe closed by the base. The lamp according to claim 1, wherein the support member is made of a metal material. The lamp according to claim 2, wherein the support member is fixed to the base with an adhesive. The lamp according to claim 1, wherein the fluid having higher thermal conductivity than air is helium gas. The support member has an extending portion extending from the portion attached to the base to the inside of the globe,
The lamp according to claim 1, wherein the light-emitting element is located on the extending end side of the extending portion. The light emitting element is mounted on a mounting substrate made of a material having translucency,
The lamp according to claim 5, wherein the mounting substrate is attached to an extending end of the extending portion. The support member has a leg portion covering the top of the base,
The lamp according to claim 1, wherein a leg portion of the support member is fixed to a top portion of the base with an adhesive. A cylindrical case is attached so as to cover at least the end opposite to the globe in the base,
In the case, a base is attached to the opening end opposite to the globe,
The lamp according to claim 1, wherein a circuit unit for receiving power from the base and causing the light emitting element to emit light is stored inside the case. The lamp according to claim 8, wherein a member having a lower thermal conductivity than a material constituting the case is further interposed between the base and the case. In an illuminating device comprising a lamp and a lighting fixture that is lit by mounting the lamp,
The said lamp | ramp is a lamp | ramp of any one of Claims 1-9. The illuminating device characterized by the above-mentioned.

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