JP2014146568A - Lamp and illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp including a prompt heat reducing property from an LED module and a sufficient heat radiation property, and also, capable of suppressing a heat load of a lighting circuit unit due to the heat from the LED, and an illumination device using the lamp.SOLUTION: A lamp has a configuration in which a semiconductor light-emitting element 171 is lit by a lighting circuit unit 150, and heat of the semiconductor light-emitting element 171 at the time of lighting is radiated by a heat sink 130. The heat sink 130 has: a cylinder part 131 having internal space 133; and a plurality of fins 132 erected radially from an outer peripheral surface 131d of the cylinder part 131 with a cylindrical axis X being the center. The lighting circuit unit 150 is arranged on one end side in the cylindrical axis X direction, and the semiconductor light-emitting element 171 is arranged on the other end side in the cylindrical axis X direction. At an end part of the one end side of the cylinder part 131, a communication passage 131c is formed for communicating the internal space 133 of the cylinder part 131 and an outside part, and at an end part of the other end side of the cylinder part 131, the communication passage 131c is not formed.

Description

  The present invention relates to a lamp that uses a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source, and an illumination device equipped with such a lamp.

In recent years, LED lamps using LEDs as light sources are rapidly spreading from the viewpoint of energy saving. The LED generates heat when it is turned on, but if the temperature of the LED is excessively increased by this heat, the light emission efficiency is lowered and the life is shortened.
Therefore, in order to prevent an excessive temperature rise of the LED during lighting, a heat sink made of a material having high thermal conductivity such as a metal is disposed between the mounting board and the lighting circuit to suppress the temperature rise of the LED module. The structure to be adopted is adopted. Various measures have been taken to further enhance the heat dissipation effect of the heat sink.

  For example, Patent Document 1 discloses a lighting device having a configuration in which heat generated from an LED is released into the outside air by a plurality of radiating fins 22 radiating from an outer peripheral surface of a fixed cylinder 23. The fixed cylinder 23 and the plurality of heat radiating fins 22 are integrally formed with the heat radiating plate 21 on which the light source module 1 is mounted to constitute the heat radiating part 2, and the heat radiating part 2 serves as a heat sink.

  Similarly, in Patent Document 2, between a substrate 14 (mounting substrate) on which a semiconductor light emitting element 11 (LED) is disposed and a lighting device 12 (lighting circuit unit) for lighting the semiconductor light emitting element 11, An illuminating device 10 including a main body 13 having a plurality of heat dissipating fins 13d on the outer periphery and having good thermal conductivity is disclosed. The main body 13 plays a role as a heat sink in addition to a role as a housing that defines the outer shape of the light bulb shaped lamp.

JP 2009-4130 A JP 2010-225570 A

  In recent years, there has been a demand for higher brightness in LED lamps. Since the high-intensity LED lamp also generates a large amount of heat from the LED when it is turned on, it is more important to prevent an excessive temperature rise of the LED module due to the generated heat. In addition, it is also important to suppress an increase in the thermal load received by the lighting circuit unit when heat from the LED is transmitted to the lighting circuit unit.

  However, in the configuration of Patent Document 1, the drive circuit unit 3 (lighting circuit unit) is housed inside the heat radiating unit 2 (heat sink) so as to substantially occupy the internal space of the fixed cylinder 23. Therefore, in addition to the drive circuit unit 3 being disposed in the vicinity of the light source module 1 (LED module), most of the drive circuit unit 3 is in the heat dissipation unit 2 warmed by the heat transmitted from the light source module 1. Since it is covered, the influence of the heat from the light source module 1 received by the drive circuit unit 3 is large.

Furthermore, in the configuration of Patent Document 1, in order to ensure a large heat dissipation property of the heat radiating fins 22, the space between the adjacent heat radiating fins is deepened to increase the surface area of the heat radiating fins 22. As a result, the heat capacity of the heat radiating unit 2 is reduced, so that heat extraction from the light source module 1 is reduced, and the temperature rise of the light source module 1 may not be quickly suppressed.
In the configuration of Patent Document 2, the space between adjacent radiating fins is relatively shallow, and accordingly, the heat capacity of the main body 13 can be ensured to be large. However, since the surface area of the heat dissipating fins 13d is reduced accordingly, the effect of improving the heat dissipating property by the heat dissipating fins is reduced. In the configuration of Patent Document 2, the lighting device 12 is housed inside the main body 13 on the base member 17 side. However, since the effect of improving heat dissipation by the heat radiating fin is small, heat is not sufficiently dissipated while the heat from the semiconductor light emitting element 11 is transmitted to the lighting device 12 through the main body 13, and the thermal load received by the lighting device can be sufficiently suppressed. Can not.

  In view of the above-described problems, the present invention has a structure that can quickly heat the LED module and sufficiently dissipate heat and can suppress the thermal load of the lighting circuit unit due to the heat from the LED. An object is to provide a lamp and a lighting device.

  In order to achieve the above object, a lamp according to an aspect of the present invention is a lamp having a structure in which a semiconductor light emitting element is lit by a lighting circuit unit, and heat of the semiconductor light emitting element during lighting is radiated by a heat sink, The heat sink includes a cylindrical portion having an internal space, and a plurality of fins standing radially from the outer peripheral surface of the cylindrical portion around the cylindrical axis, and the lighting circuit unit is in the cylindrical axial direction. The semiconductor light emitting element is disposed on the one end side, and is disposed on the other end side in the cylinder axis direction. The end portion on the one end side of the cylinder portion communicates with the internal space of the cylinder portion and the outside. A passage is formed, and the communication passage is not formed at an end of the cylindrical portion on the other end side.

  According to another aspect, the communication path includes a pair of adjacent fins among the plurality of fins and a pair of adjacent fins on the opposite side across the pair of adjacent fins and the cylindrical shaft. Each of the first space existing between the pair of adjacent fins and the second space existing between the pair of adjacent fins on the opposite side are both the internal space and the communication path. The structure characterized by connecting via may be sufficient.

In another aspect, the cylindrical portion may have a configuration in which an outer diameter on the other end side is larger than an outer diameter on the one end side.
Moreover, in another aspect, the said cylindrical part may be the structure characterized by having a part which an outer diameter expands gradually toward the said other end side from the said one end side.
In another aspect, the cylindrical portion has a shape in which an outer peripheral edge in a cross section including the cylindrical shaft of a portion where the outer diameter expands protrudes to the side away from the cylindrical shaft. It may be configured to.

In another aspect, the outer peripheral edge may have a curved shape protruding to the side away from the cylindrical axis.
In another aspect, the outer peripheral edge may have a polygonal line shape protruding to the side away from the cylindrical axis.
In another aspect, the outer peripheral edge may have a shape constituted by a curve and a straight line protruding to the side away from the cylindrical axis.

In another aspect, the cylindrical portion may have a configuration in which an outer peripheral edge in a cross section including the cylindrical axis of a portion where the outer diameter is expanded is a straight line.
Further, in another aspect, the cylindrical portion has a curved shape in which an outer peripheral edge in a cross section including the cylindrical shaft of a portion where the outer diameter expands is recessed toward the side approaching the cylindrical shaft. It may be a characteristic configuration.

Moreover, in another aspect, the said cylindrical part may be the structure characterized by the said diameter expansion of the said outer diameter being stepwise.
In another aspect, the plurality of fins stand up among an outer end surface that is an end surface opposite to the tube axis of the plurality of fins and the outer peripheral surface at the end portion on the other end side of the tube portion. The portion not provided may be configured to be covered with an electrically insulating material.

Moreover, in another aspect, the outer end surface and both side surfaces which are the end surfaces on the opposite side to the cylindrical axis of the plurality of fins, and the portion where the plurality of fins are not erected on the outer peripheral surface of the cylindrical portion; May be configured to be covered with an electrically insulating material.
A lighting device according to one embodiment of the present invention includes a lighting fixture that receives mounting of the lamp and lights the lamp.

  According to the configuration of the lamp according to one aspect of the present invention, the cylindrical portion has the defective region, and the first space and the second space have the defective region at the other end where the lighting circuit unit of the heat sink is disposed. Therefore, air can flow between the first space and the second space at the other end. Thereby, since the heat dissipation of a heat sink can be improved in the other end part by which the lighting circuit unit is distribute | arranged, the excessive temperature rise of a lighting circuit unit can be suppressed more effectively. In addition, at the one end where the semiconductor light emitting element of the heat sink is disposed, the cylindrical portion does not have a defect region, so that the heat capacity at the one end can be increased as compared with the case where the defect region is provided. Thereby, the heat generated in the semiconductor light emitting element can be quickly drawn to the heat sink side, and an excessive temperature rise of the semiconductor light emitting element can be suppressed.

1 is a partially cutaway external perspective view of a lamp 100 according to Embodiment 1. FIG. (A) is a side view of the lamp | ramp 100 which concerns on Embodiment 1, (b) is a bottom view. It is arrow sectional drawing which shows the cross section which cut | disconnected the lamp | ramp 100 by the AA line in FIG.2 (b). 2 is an exploded perspective view of the lamp 100. FIG. FIG. 5 is an exploded perspective view illustrating a case 120 and a lighting circuit unit 150 of the lamp 100 that are vertically inverted from the state of FIG. 4. FIG. 5 is a perspective view showing a heat sink 130 of the lamp 100 in an upside down state from the state of FIG. 4. FIG. 3 is a partially cutaway perspective view showing a state where an LED module 170 is mounted on a heat sink 130. It is arrow sectional drawing which shows the cross section which cut | disconnected the lamp | ramp 100 by the BB line in Fig.2 (a). 3 is a side sectional view showing a first heat radiation path in the lamp 100. FIG. 4 is a side sectional view showing a second heat radiation path in the lamp 100. FIG. 4 is a side sectional view showing a third heat dissipation path in the lamp 100. FIG. It is a partially cutaway perspective view showing a state where the LED module 170 is mounted on the heat sink 230 according to the second embodiment. It is a partially notched side view which shows schematic structure of the illuminating device 301 which concerns on Embodiment 3. FIG. (A) is the principal part expanded side sectional view of the heat sink 330 concerning the modification 19, and its periphery. FIG. 10B is an enlarged side cross-sectional view of the main part of the heat sink 430 and its periphery according to Modification 20; (A) is the principal part expanded side sectional view of the heat sink 530 which concerns on the modification 21, and its periphery. FIG. 10B is an enlarged side cross-sectional view of a main part of and around the heat sink 630 according to Modification 22; (A) is a principal part expanded side sectional view of the heat sink 730 which concerns on the modification 23, and its periphery. FIG. 10B is an enlarged side cross-sectional view of the main part of and around the heat sink 830 according to Modification 24. It is the principal part expanded side sectional view of the heat sink 930 which concerns on the modification 25, and its periphery.

EMBODIMENT OF THE INVENTION The form for implementing this invention is demonstrated in detail with reference to drawings below. Each figure is a schematic diagram, and the shapes, dimensions, ratios, and the like of core components such as parts shown in the drawings are not necessarily illustrated strictly.
Embodiment 1
[1. overall structure]
FIG. 1 is a partially cutaway perspective view showing a schematic configuration of a lamp 100 according to the first embodiment. FIG. 2A is a side view of the lamp 100, and FIG. 3 is a cross-sectional view of the lamp 100 taken along the line AA in FIG. 2 is an exploded perspective view of the lamp 100. FIG.

  The lamp 100 mainly includes a base 110 for receiving power from a lighting fixture (see FIG. 9) side, an LED module 170 having an LED 171 that is a semiconductor light emitting element, and a lighting circuit that receives power from the base 110 and lights the LED 171. A unit 150, a case 120 for housing the lighting circuit unit 150, and a heat sink 130 for releasing heat during LED emission are provided.

In addition to the above configuration, the lamp 100 includes a globe 140 that covers the LED 171. The lamp 100 may have a so-called D shape without the globe 140.
Along the central axis of the lamp 100 (hereinafter referred to as “lamp axis”, denoted by a symbol J) indicated by a one-dot chain line in FIG. The direction of 140 is the “lamp tip” direction.

In FIG. 3, the wiring between the lighting circuit unit 40 and the base 60 is not shown. Further, in FIG. 4, illustration of various wirings is omitted.
[2. Configuration of each part]
(1) Base The base 110 has a function as a mounting means for mounting the lamp 100 on a lighting fixture and a function as a power receiving means for receiving power from a socket of the lighting fixture. The base 110 is of the same type as the base used for general light bulbs. The base 110 in the present embodiment is made of a conductive metal material and is an Edison type (screw-in type). The base 110 includes a shell part 111, an eyelet part 113, and an insulating part 112 for ensuring insulation between the shell part 111 and the eyelet part 113. For the base 110, for example, so-called E26 can be used.

(2) LED Module The LED module 170 includes a mounting substrate 172, a plurality of LEDs 171 and a plurality of sealing bodies.
The mounting substrate 172 includes an insulating plate, a wiring pattern (not shown) for mounting a plurality of LEDs in a predetermined connection form, and a connection terminal 172a for connecting the wiring pattern and the lighting circuit unit 150. A central through hole 172 b for routing the wiring member 180 connected to the connection terminal 172 a to the lighting circuit unit 150 and a screw 192 for fixing the mounting board 172 to the heat sink 130 are passed through the center of the mounting board 21. Through-holes 172c (two in this embodiment) are formed.

Examples of the predetermined connection form include series connection, parallel connection, and series-parallel connection. In the present embodiment, the connection terminal 172a is made of a metal thin film such as an aluminum sheet, and the lead wires of the wiring member 180 are connected by soldering or the like.
The LED 171 emits a predetermined light color. Examples of the predetermined light color include blue light and ultraviolet light. The plurality of LEDs 171 are mounted on the mounting substrate 172 in a predetermined form. In the present embodiment, 24 LEDs 171 are mounted in an annular shape on the mounting substrate 172 in plan view.

  As the insulating plate of the mounting substrate 172, for example, a ceramic substrate or a heat conductive resin is used. A wiring pattern layer made of an aluminum thin film or the like is formed on the insulating plate, and the mounting substrate 172 has a two-layer structure. An LED 171 is mounted on the upper surface of the mounting substrate 172. In the present embodiment, a disk-shaped ceramic (for example, alumina) substrate is used for the insulating plate of the mounting substrate 172.

The sealing body is for sealing the LED 171. As the sealing body, for example, a resin material can be used. In addition, when converting the wavelength of the light emitted from LED171, it can implement by mixing a wavelength conversion material in a resin material. As the resin material, for example, silicone resin, epoxy resin, fluorine resin, silicone-epoxy hybrid resin, urea resin, or the like can be used. As the phosphor, for example, YAG phosphor, Y ₃ Al ₅ O ₁₂ : Ce that develops yellow color, silicate phosphor that activates Eu ²⁺ , Sr ₂ SiO ₄ : Eu, or the like can be used. In the present embodiment, the LED 171 emits blue light. Moreover, in this embodiment, the wavelength conversion member (phosphor) which converts the wavelength of blue light into yellow light is mixed in the resin material (for example, silicone resin) which is a sealing body. Part of the blue light emitted from the LED is converted into yellow light by wavelength conversion, and the rest is emitted outside the sealing body without wavelength conversion. When these blue light and yellow light are mixed, white light is emitted from the LED 171.

  Note that the LED 171 may be sealed after being mounted on the mounting substrate 172, or may be mounted on the mounting substrate 172 after being sealed with a sealing body. Here, the LED 171 is a surface mount device (SMD) type and is integrated with a sealing body. For this reason, in FIG. 1, FIG. 3, FIG. 4 and FIG. 7, what actually appears is a sealing body, but the LED as SMD is represented by reference numeral “171”.

(3) Lighting Circuit Unit The lighting circuit unit 150 includes a circuit board 151 and various electronic components 152. The lighting circuit unit 150 includes a rectifier circuit that rectifies commercial power (AC) received through the base 110, a smoothing circuit that smoothes the rectified DC power, and the like. The smoothed DC power is converted into a predetermined voltage by a step-up / step-down circuit if necessary. The rectifier circuit is constituted by a diode bridge, and the smoothing circuit is constituted by a capacitor. These electronic components 152 are mounted on the circuit board 151. In FIGS. 3 to 5, only some of the electronic components are denoted by reference numerals in order to make the drawings easy to see.

The circuit board 151 includes an insulating plate and a wiring pattern and connection terminals formed thereon. Here, the insulating plate has a disk shape as a whole.
The lighting circuit unit 150 is accommodated in the case 120 at a position closer to the base 110 than the heat sink 130. The choke coil, the electrolytic capacitor, the resistor, and the like are mounted on the main surface of the circuit board 151 on the base 110 side on the base 110 side, and the IC and the like are mounted on the main surface on the lamp front direction side. An electronic component having a relatively high heat resistance may be mounted on the main surface on the lamp front end side, and an electronic component having a relatively low heat resistance may be mounted on the main surface on the lamp base end direction side. Furthermore, all the electronic components may be mounted on the main surface on the lamp proximal direction side.

(4) Case FIG. 5 is an exploded perspective view showing the case 120 of the lamp 100 according to the first embodiment in a state where the case 120 is turned upside down from the state shown in FIG.
The case 120 includes a cylindrical case main body 121, a case lid 123 that closes the distal end side opening 121 f of the case main body 121, and a truncated cone-shaped case cover 122 that covers the case main body 121.

The case body 121 is made of an insulating resin material (for example, polybutylene terephthalate (PBT)), and has a cylindrical shape as a whole. The case main body 121 includes a base coupling portion 121a to which the base 110 is coupled, a housing portion 121b for housing the lighting circuit unit 150, and a flange portion 121c.
The case lid 123 is made of an insulating resin material (for example, PBT), and as shown in FIG. 3, the disk portion 123b positioned on the lamp base end side and the main surface of the disk portion 123b on the lamp front end side. And a small-diameter cylindrical portion 123a erected on the lamp front end side at the center portion. A central through hole 123b1 penetrating in the thickness direction is formed in the central portion of the disc portion 123b, and communicates with the in-cylinder space of the small diameter cylindrical portion 123a. A contact wall portion 123c is formed on the main surface of the disc portion 123b on the lamp proximal direction side so as to surround the center through hole 123b1.

  The small diameter cylindrical portion 123a passes through the internal space 133 of the heat sink 130 and is inserted into the central through hole 135c. A wiring member 180 that electrically connects the lighting circuit unit 150 and the LED module 170 is inserted into the small-diameter cylindrical portion 123a. Therefore, the wiring member 180 is not visually recognized from the outside of the heat sink 130 through the communication path 131c in the cylindrical portion 131 of the heat sink 130 described later.

(4-1) Mounting The case main body 121 and the case lid 123 have an end portion (end surface) on the lamp front end side of the case main body 121 and a surface on the lamp base end side of the disc portion 123b of the case cover 123. Combined together. When the case main body 121 and the case lid 123 are fixed to the heat sink 130 with screws 191, the common screw 191 is inserted into the through hole 121 d of the case main body 121 and the through hole 123 d of the case lid 123 and fastened. Alignment is performed.

The contact wall portion 123c of the case lid 123 functions as a guide means when the case lid 123 is attached to the case main body 121.
Further, the abutting wall portion 123c functions as a regulating unit that regulates the movement of the circuit board 151 of the lighting circuit unit 150 housed in the case main body 121 toward the lamp front end side.
(4-2) Attaching the Base The base coupling portion 121a, which is the end on the base side of the case body 121, is inserted into the end portion 111a, which is the end opposite to the eyelet portion in the shell portion 111 of the base 110. The case body 121 and the base 110 are combined. The connection between the two can be made stronger by, for example, an adhesive, a screw, caulking, and a combination thereof.

(4-3) Storage and Fixing of Lighting Circuit Unit The lighting circuit unit 150 is stored in an internal space formed by coupling the case main body 121 and the case lid 123. The portion that forms this space is the accommodating portion 121b. The lighting circuit unit 150 is configured so that the circuit board 151 is on the lamp front end side, the electronic component 152 is on the lamp base end side, and the side convex portion 121g of the case main body 121 is positioned in the notch 151a of the circuit board 151. 121 is inserted into the accommodating portion 121b. When the lighting circuit unit 150 is inserted into the housing portion 121b, the side edge portion on the lamp base end side of the circuit board 151 contacts the stepped portion 121e. Thereby, the movement of the circuit board 151 to the lamp base end side is restricted by the stepped portion 121e. In this state, the case main body 121 and the case lid 123 are coupled as described above. Thereby, the lighting circuit unit 150 is accommodated in the case 120.

At this time, the circuit board 151 is sandwiched between the stepped portion 121e and the contact wall portion 123c, thereby restricting the movement of the lighting circuit unit 150 in the lamp axis J direction.
Further, since the side convex portion 121g of the case main body 121 is positioned in the notch 151a, the rotation of the lighting circuit unit 150 around the lamp axis J is restricted.

In this way, rattling in the case 120 of the lighting circuit unit 150 is prevented.
As described above, in the lamp 100 of the present embodiment, the case 120 has a bottomed cylindrical shape, and the opening side is coupled to the heat sink. In such a form, the wiring member 180 that electrically connects the lighting circuit unit 150 and the LED module 170 is led out from the central through hole 172b of the mounting substrate 172 and the central through hole 135c of the heat sink 130, and the case lid 123 The small diameter cylindrical portion 123a is inserted. By sealing the central through-hole 135c serving as the lead-out port with silicone resin or the like, the airtightness of the case 120 can be secured, and the lighting circuit unit 150 can be more reliably protected.

(5) Heat Sink FIG. 6 is a perspective view showing a state where the heat sink 130 of the lamp 100 according to the first embodiment is turned upside down from the state shown in FIGS. 1 to 4. FIG. 7 is a partially cutaway perspective view showing a state where the LED module 170 is mounted on the heat sink 130. FIG. 8 is a cross-sectional view taken along line BB in FIG. 2A, and is a cross section taken along a plane orthogonal to the lamp axis J.

  The heat sink 130 mainly has a function of releasing heat generated from the LED 171 when it is turned on. As shown in FIGS. 1 to 4 and FIGS. 6 to 8, the heat sink 130 includes a cylindrical portion 131 with a bottom and a cylindrical axis X (a central axis of the heat sink 130) of the cylindrical portion 131 from the outer peripheral surface of the cylindrical portion 131. And a plurality of fins 132 erected radially from the center. In the state where the heat sink 130 is assembled with other components to form the lamp 100, the cylinder axis X substantially coincides with the lamp axis J. Therefore, for example, it can be said that the plurality of fins 132 are erected radially from the outer peripheral surface of the cylindrical portion 131 around the lamp axis J.

  The cylindrical portion 131 is a bottomed cylindrical member having an internal space 133 inside. The outer diameter is constant in the base end side cylinder part 131a which is a part in the base end side end part 134 of the cylinder part 131. FIG. The diameter-expanded tube portion 131b, which is a portion closer to the lamp front end than the base end-side tube portion 131a of the tube portion 131, has a shape in which the outer diameter gradually increases from the lamp base end toward the tip end portion 135. It has become. In the heat sink 130 of the first embodiment, the outer peripheral edge 131b1 of the enlarged-diameter cylindrical portion 131b is a curve protruding in a direction away from the cylindrical axis X (lamp axis J) in a cross section by a plane including the lamp axis J. When the lamp 100 is mounted on a lighting fixture and used, it is often used with the globe 140 facing downward. It is difficult for dust to collect in a portion between the portion 131 and the fin 132.

  The inner peripheral surface of the cylindrical portion 131 has a substantially constant inner diameter from the proximal end portion 134 to the distal end portion 135 side. The portion corresponding to the bottom of the cylindrical portion 131 of the distal end side end portion 135 is a disc-shaped distal end side end portion 135, and the distal end side end portion 135 and the cylindrical portion 131 are integrally formed, The side end portion 135 can also be regarded as the bottom portion of the cylindrical portion 131. An annular insertion groove 135a in which the opening side end portion 142a of the globe 140 is inserted and fixed is continuously formed in the peripheral portion of the main surface of the front end side portion 135 on the lamp front end side. On the main surface of the front end side portion 135 on the front end side of the lamp, a portion inside the insertion groove 135a is a board mounting area 135b on which the LED module 170 is mounted. A central through hole 135c penetrating in the thickness direction is formed at the center of the front end portion 135. Further, the front end portion 135 is formed with screw holes 135d (two in this embodiment) for mounting the LED module 170 using screws 192. The central through hole 135c and the screw hole 135d are formed at positions corresponding to the central through hole 172b and the through hole 172c of the mounting substrate 172, respectively. Then, the LED module 170 is mounted on the board mounting region 135b so that the central through hole 172b and the central through hole 135c are aligned (overlapped), and the through hole 172c and the screw hole 135d are respectively aligned. In this state, the screw 192 inserted through the through hole 172c of the LED module 170 is screwed into the screw hole 135d of the heat sink 130, and the LED module 170 is mounted on the board mounting region 135b of the heat sink 130.

  As shown in FIGS. 6 and 8, the heat sink 130 includes a cylindrical tube portion 131 and a plurality of erected from the outer peripheral surface of the tube portion 131 radially about the tube axis X (lamp axis J). Fins 132 are provided. As shown in FIGS. 3, 6, and 7, the plurality of fins 132 are provided with a case 120 in which the lighting circuit unit 150 is housed from the front end portion 135 on the front end side of the lamp where the LED module 170 is disposed. It extends to the lamp base end side. In the present embodiment, the heat sink 130 includes 20 fins 132, but the number of fins is not limited to this.

  Further, as shown in FIG. 8, a communication path 131 c that connects the internal space 133 and the outside of the cylinder portion 131 is formed in the base end side cylinder portion 131 a of the cylinder portion 131. In the heat sink 130, the cylindrical portion 131 is not formed in the portion where the fin 132 of the proximal end side cylindrical portion 131 a is not erected between the adjacent fins 132, and the defective region where the cylindrical portion is not formed is a communication path. 131c. And the internal space 133 of the heat sink 130 and the exterior of the cylinder part 131 are connected by the communication path 131c. In the present embodiment, the communication path 131c is formed between the adjacent fins, that is, 20 communication paths 131c are formed.

The heat sink 130 is made of, for example, a metal material (for example, aluminum) having excellent thermal conductivity, and can be formed using aluminum die casting, pressing, deep drawing, or the like.
As a means for coupling the heat sink 130 and the case 120, screw coupling is used here. A screw hole 136 is provided in the fin 132 at the proximal end portion 134. As shown in FIG. 3, the heat sink 130 and the case 120 are coupled by screwing a screw 191 inserted through the through hole 121 d of the case body 121 and the through hole 123 d of the case lid 123 into the screw hole 136 of the heat sink 130. Is done.

(6) Globe The globe 140 has a dome shape and has a function of protecting the LED module 170. For this reason, the globe 140 is attached to the heat sink 130 so as to cover the LED module 170. The globe 140 is made of a translucent material. Examples of the translucent material that can be used include a glass material and a resin material. In the present embodiment, a glass material is used for the globe 140.

  As shown in FIG. 4, the globe 140 includes a hollow spherical part 141 and a cylindrical part 142 connected to the spherical part 141. An opening is present at the end of the cylindrical portion 142 opposite to the spherical portion 141, and the end on the side where the opening is present is the opening-side end 142a. The opening-side end 142a of the globe 140 is inserted into the insertion groove 135a of the heat sink 130 and fixed by an adhesive (not shown), so that the globe 140 is attached to the heat sink 130.

[3. Heat dissipation characteristics]
The lamp 100 is roughly divided into three types of heat dissipation paths. Hereinafter, three types of heat dissipation paths will be described with reference to the drawings.
(1) First Heat Dissipation Path FIG. 9 is a sectional side view showing a first heat dissipation path in the lamp 100. As shown in FIG. 9, in the lamp 100, the heat from the LED 171 is conducted to the front end portion 135 via the mounting substrate 172. Then, heat is further conducted from the distal end portion 135 to the remaining portion of the cylindrical portion 131 and the fins 132, and radiated outward from the outer peripheral surface of the cylindrical portion 131 and the surfaces of the fins 132.

  Here, as described above, the cylindrical portion 131 has a shape in which the outer diameter gradually increases toward the distal end portion 135. Therefore, the heat sink 130 has a larger volume on the lamp front end side than the lamp base end side, and a heat capacity larger on the lamp front end side than the lamp base end side. By increasing the heat capacity at the front end side of the lamp to which the LED module 170 is mounted, heat extraction from the LED module 170 to the heat sink 130 can be increased.

The mounting board 172 of the LED module 170 is mounted in contact with the board mounting area 135b of the front end portion 135, and heat conduction from the mounting board 172 to the heat sink 130 is performed quickly. Further, since the contact area between the mounting substrate 172 and the substrate mounting region is large, a large amount of heat can be efficiently conducted from the mounting substrate 172 to the heat sink 130.
Here, like the conventional LED lamp, when the height of the fin at the lamp tip side of the heat sink 130 is increased to improve the heat dissipation effect by the fin, the fin is not increased without increasing the size of the lamp. In order to increase the height of the tube, the outer shape of the cylindrical portion must be reduced. Then, the volume of the lamp front end portion of the heat sink is reduced, and the heat capacity is also reduced. Compared with heat radiation (thermal conduction) by contact, heat radiation by radiation from the fin surface is less efficient, heat radiation by air convection around the fin is less efficient, and the speed of heat radiation is lower. Therefore, in the conventional configuration in which the heat capacity of the lamp tip side portion of the heat sink is small, heat tends to be trapped in the lamp tip side portion of the heat sink, and the temperature rise of the LED module cannot be sufficiently suppressed.

In that respect, according to the configuration of the lamp 100 according to the present embodiment, the heat capacity of the tip end portion 135, which is the portion of the heat sink 130 on the side where the LED module 170 is disposed, is large. Therefore, the temperature rise of the LED module 170 can be efficiently suppressed.
Further, when the communication path is provided on the lamp tip side of the heat sink, the heat capacity of the heat sink on the lamp tip side is reduced by that amount. Therefore, for the same reason as described above, heat tends to be trapped in the lamp tip side portion of the heat sink, and the temperature rise of the LED module cannot be sufficiently suppressed. Also from this point, according to the configuration of the lamp 100 according to the present embodiment having the communication path only on the lamp base end side, the temperature increase of the LED module 170 can be efficiently suppressed.

  It can also be said that the cylindrical portion 131 has a shape in which the outer diameter gradually decreases toward the proximal end portion 134. As a result, the radial distance from the outer peripheral surface of the cylindrical portion 131 to the outer peripheral edge of the fin 132 (the lamp axis J) in the radial direction from the outer peripheral surface of the cylindrical portion 131 to the proximal end side of the lamp (hereinafter referred to as the fin) 132 is referred to as “height”) and the surface area of the fin 132 is increased. Therefore, the surface area of the heat sink 130 is larger on the lamp base end side than on the lamp front end side, and the radiation efficiency of heat toward the outside is also large. Thereby, the heat from the LED module 170 conducted to the lamp front end side of the heat sink 130 is conducted to the lamp base end side of the heat sink 130, where it is efficiently dissipated.

  In addition, since the heat radiation efficiency is large on the lamp base end side of the heat sink 130, the temperature lowering effect or the temperature rise suppressing effect on the lamp base end side of the heat sink 130 is increased. As a result, the temperature difference between the lamp front end side and the lamp base end side of the heat sink 130 is increased, heat diffusion from the lamp front end side to the lamp base end side is performed efficiently, and the heat sink 130 is less likely to accumulate heat.

(2) Second Heat Dissipation Path FIG. 10 is a side sectional view showing a second heat dissipation path in the lamp 100. As shown in FIG. 10, in the lamp 100, the heat from the LED 171 is conducted to the tip end portion 135 via the mounting substrate 172. Then, heat conduction is further performed from the distal end side end portion 135 to the remaining portion of the cylindrical portion 131 and the fins 132. From there, heat is further transferred from the inner surface of the cylindrical portion 131 to the air existing in the internal space 133. Then, the air in the internal space 133 is heated, and the heated air is discharged to the outside of the cylindrical portion 131 from the communication path 131 c provided in the proximal end side cylindrical portion 131 a of the cylindrical portion 131.

Usually, since the lamp 100 is used with the lamp base end side facing upward, in the internal space 133, the heated air moves upward in the internal space 133 and reaches the vicinity of the communication path 131c. Is discharged to the outside from the communication path 131c.
Here, as described above, the cylindrical portion 131 has a shape that gradually increases in diameter toward the distal end portion 135. On the other hand, the height of the fin 132 from the cylindrical portion 131 increases toward the lamp base end side, and the fin 132 has a certain height in the base end side cylindrical portion 131a. Further, the space between the adjacent fins 132 becomes narrower as it approaches the tube axis X (lamp axis J). Thus, the user's finger is difficult to reach directly to the communication path 131c, so that the user's finger is less likely to directly touch the heated air discharged from the communication path 131c.

  In addition, the heat from the LED 171 heats the air in the internal space 133, and a part of the heated air is not transferred to the case 120, and is transferred from the communication path 131 c of the cylindrical portion 131 to the outside of the cylindrical portion 131. And released. Thereby, it can suppress that the heat | fever from LED171 is conducted to the lighting circuit unit 150 accommodated in case 120. FIG. Therefore, the temperature rise of the lighting circuit unit 150 due to the heat from the LED 171 can be suppressed.

  Further, according to the configuration of the lamp 100 according to the present embodiment, the heat sink 130 includes a plurality of communication paths 131 c at the proximal end portion 134. In the lamp 100, a communication path 131c is formed in a base end side cylindrical portion 131a corresponding to a portion between the adjacent fins 132 in the base end side end portion 134. Therefore, according to the configuration of the lamp 100, the following effects can be further obtained.

  As shown in FIG. 8, the heat sink 130 forms a first space (for example, the first space 137A in FIG. 8) existing between adjacent fins 132 (for example, the fins 132A and 132B in FIG. 8). Have. Then, between the adjacent fins 132 (in this case, fins 132A and 132B) and the fins 132 on the opposite side across the ramp axis J (cylinder axis X) (in this case, the fins 132C and 132D in FIG. 8). And a second space (in this case, the second space 137B in FIG. 8).

The first space 137A and the second space 137B are both in communication with the internal space 133. As a result, the first space 137A and the second space 137B communicate with each other via the internal space 133.
Note that the first space and the second space here are “137A” and “137B” in FIG. 8 for the sake of explanation, but the space between any other adjacent fins is also the first space, the first space. There are two spaces.

When the heat sink 130 and the case 120 are coupled, the small-diameter cylindrical portion 123a of the case lid 123 is inserted into the internal space 133, and the end of the small-diameter cylindrical portion 123a on the lamp front end side is inserted into the central through hole 135c. It is combined in the state. At this time, the tube axis of the small-diameter tube portion 123a and the lamp shaft J substantially coincide with each other.
Moreover, as shown in FIG. 8, the internal space 133 is larger than the outer diameter of the small diameter cylindrical portion 123a. For this reason, even if the heat sink 130 and the case 120 are coupled and the small diameter cylindrical portion 123a is inserted into the internal space 133, the end of the fin 132 on the side close to the lamp shaft J and the small diameter cylindrical portion 123a There is a gap between them. Therefore, even when the heat sink 130 and the case 120 are coupled, the first space 137A and the second space 137B communicate with each other through the internal space 133.

  The first space 137 </ b> A and the second space 137 </ b> B communicate with each other through the internal space 133, thereby obtaining the following effects. That is, outside air can flow from the first space 137A through the internal space 133 to the second space 137B, convection of air around the fin 132 is promoted, and the heat dissipation effect from the surface of the fin 132 is improved. In addition, the outside air flows from the first space 137A through the internal space 133 to the second space 137B, thereby promoting the discharge of the heated air in the internal space 133 to the outside through the communication path 131c. In addition, cold outside air is easily taken into the internal space 133 through the communication path 131c. Accordingly, it is possible to suppress the heat from being accumulated in the internal space 133, and it is possible to promote the convection of air in the internal space 133 and promote the heat radiation by the second heat radiation path.

(3) Third Heat Dissipation Path FIG. 11 is a side sectional view showing a third heat dissipation path in the lamp 100. As shown in FIG. 11, in the lamp 100, the heat from the LED 171 is conducted to the tip end portion 135 via the mounting substrate 172. Further, heat conduction is further performed from the tip end portion 135 to the remaining portion of the tube portion 131 and the portion of the fin 132 on the lamp tip side. From there, heat is further transferred to the lamp base end side of the cylindrical portion 131 and the fins 132. Then, heat conduction is performed from the proximal end portion 134 of the heat sink 130 to the case cover 122, the case lid 123, and the case main body 121 of the case 120. Then, the heat is further conducted to the base 110 and then radiated to the lighting fixture side.

In the third heat dissipation path, heat from the LED 171 is conducted to the case 120. Therefore, the lighting circuit unit 150 accommodated in the case 120 is affected by the heat from the LED 171.
However, as described in the description of the first heat radiation path, the heat sink 130 has a large surface area of the fins 132 on the lamp base end side, and has a large heat radiation efficiency toward the outside. Thereby, since most of the heat conducted from the LED 171 to the heat sink 130 is radiated to the outside at the lamp base end before being transmitted to the case 120, the influence of the heat from the LED 171 received by the lighting circuit unit 150 is reduced. Can do.

  Further, as described in the description of the second heat radiation path, the heat sink 130 has the communication path 131 c at the proximal end portion 134. A part of the air heated in the internal space 133 of the heat sink 130 is discharged to the outside from the communication path 131 c without transferring heat to the case 120. Thereby, the influence of the heat from LED171 which the lighting circuit unit 150 receives can be reduced.

  Further, in the lamp 100, the outer shape of the tube portion 131 is reduced from the lamp front end side toward the lamp rear end side, and the area of the lamp base end side end surface of the tube portion 131 is reduced. Furthermore, a communication path 131c is formed in a portion between the adjacent fins 132 of the base end side cylinder portion 131a. Thereby, the contact area between the heat sink 130 and the case 120 is reduced, and heat is not easily transmitted from the heat sink 130 to the case 12.

(4) Summary of Heat Dissipation Effect As described above, according to the configuration of the lamp 100 according to the first embodiment which is an aspect of the present invention, the heat generated in the LED 171 is transferred to the heat sink 130 via the mounting substrate 172. The temperature rise of the LED 171 can be suppressed by quickly conducting to the front end portion 135.

  In addition, since the height of the fin 132 is higher on the lamp base end side than on the lamp front end side, the surface area of the fin 132 increases on the lamp base end side, and heat radiation to the outside of the heat sink 130 on the lamp base end side. Efficiency is increasing. Therefore, before the heat from the LED 171 conducted to the distal end portion 135 is conducted to the lamp proximal side and further from there to the case 120, the heat is generated in the lamp proximal side portion of the heat sink 130. Most of it is released to the outside. Thereby, the heat conduction from the heat sink 130 to the case 120 can be suppressed, and the influence (heat load) of the heat from the LED 171 received by the lighting circuit unit 150 can be suppressed.

  Further, at the proximal end portion 134, the cylindrical portion 131 has a communication path 131c. Then, a part of the air in the internal space 133 heated by the heat from the LED 171 transmitted through the distal end portion 135 is discharged to the outside from the communication path 131 c without transferring heat to the case 120. . Thereby, the influence of the heat from LED171 which the lighting circuit unit 150 receives can be suppressed.

As described above, according to the configuration of the lamp 100 according to the first embodiment, the thermal load of the lighting circuit unit 150 due to the heat from the LED 171 is suppressed, and the thermal load from the LED module 170 is sufficient. can do.
<< Embodiment 2 >>
As described above, the lamp 100 according to the first embodiment which is an aspect of the present invention has been described. However, the exemplified lamp 100 may be modified as follows, and the present invention is as described in the above-described embodiment. Of course, it is not limited to the lamp 100.

In the heat sink 130 of the lamp 100 according to the first embodiment, the entire portion of the proximal end side cylinder portion 131a where the fins 132 are not erected is the communication path 131c, but is not limited thereto. Below, the fin of the lamp | ramp which concerns on Embodiment 2 is demonstrated.
In addition, in order to avoid duplication of description, in description of Embodiment 2, the same component as Embodiment 1 is attached | subjected with the same code | symbol, and the description is abbreviate | omitted. Hereinafter, the same applies to each modification.

FIG. 12 is a partially cutaway perspective view showing a state in which the LED module 170 is mounted on the heat sink 230 of the lamp according to the second embodiment. The lamp according to the second embodiment has the same basic configuration as the lamp 100 according to the first embodiment except that the heat sink is different.
Similarly to the heat sink 130 according to the first embodiment, the heat sink 230 includes a bottomed cylindrical tube portion 231 and a plurality of fins 232 erected radially from the outer peripheral surface of the tube portion 231 around the lamp axis J. Have.

  As shown in FIG. 12, in the cylindrical portion 231, the entire portion between the fins where the fins 232 of the proximal end side cylindrical portion 231 a are not erected is not a communication path. A communication passage 231c, which is a through-hole penetrating in the thickness direction, is formed in the proximal end side cylinder portion 231a in the portion between the fins. In the present embodiment, two communication passages 231c are formed in the base end side cylinder portion 231a in each fin portion.

  The configuration of the heat sink 230 is the same as that of the heat sink 130 in the first embodiment except for the communication path and the base end side cylinder portion, and includes fins 232, internal space 233, base end side end 234, front end side end 235, and insertion. The groove 235a, the substrate mounting region 235b, the central through hole 235c, and the screw hole 235d are the fin 132, the internal space 133, the proximal end portion 134, the distal end portion 135, the insertion groove 135a, and the substrate mounting region 135b in the heat sink 130, respectively. These are the same as the central through hole 135c and the screw hole 135d. Although not shown in FIG. 12, a pair of screw holes (corresponding to the screw holes 136 of the heat sink 130) for connecting the case 120 are paired on the base end side end surface of the base end side end portion 234. Is formed.

  Also in the heat sink 230 in the present embodiment, the internal space 233 communicates with the outside of the cylindrical portion 231 through the communication path 231c. Therefore, a part of the heated air in the internal space 233 is discharged to the outside from the communication path 231 c and does not transfer heat to the case 120. Thereby, also by the structure of the heat sink 230 in this embodiment, the influence of the heat | fever from LED171 which the lighting circuit unit 150 receives similarly to the heat sink 130 in Embodiment 1 can be suppressed.

In addition, the heat sink 230 has a configuration in which the heat capacity on the lamp front end side is large and the fin area on the lamp rear end side is large, similarly to the heat sink 130 according to the first embodiment. Therefore, the heat sink 230 of the second embodiment also has a rapid heat drawing property and sufficient heat dissipation from the LED module 170 as well as the heat sink 130, and reduces the heat load of the lighting circuit unit 150 due to the heat from the LED 171. Can be suppressed.
<< Embodiment 3 >>
As described above, in Embodiment 1 and Embodiment 2, an LED lamp has been described as one aspect of the present invention. However, as another aspect of the present invention, the present invention can also be realized as an illumination device using the LED.

In the third embodiment, a case where the lamp 100 according to the first embodiment is mounted on a lighting fixture (for example, a downlight type in the present embodiment) will be described.
FIG. 13 is a partially broken side view schematically showing a schematic configuration of the lighting apparatus 301 according to the third embodiment.
The lighting device 301 is used by being mounted on a ceiling 303, for example.

As shown in FIG. 13, the lighting device 301 includes a lamp 100 and a lighting fixture 305 that is mounted on and off the lamp 100.
The lighting fixture 305 includes, for example, a fixture main body 307 attached to the ceiling 303 and a cover 309 attached to the fixture main body 307 and covering the lamp 100. The cover 309 is an opening type here, and has a reflection film 313 on the inner surface that reflects the light emitted from the lamp 100 in a predetermined direction (here, the lower side in the drawing). The appliance main body 307 includes a socket 311 to which a base 110 of the lamp 100 is attached (screwed), and power is supplied to the lamp 100 through the socket 311.

The lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 309 but may have a closed-type cover, or a posture in which the LED lamp faces sideways (lamp axis). Or a lighting fixture that is lit in a tilting posture (a posture in which the lamp axis is tilted with respect to the central axis of the lighting fixture).
In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that is suspended from the ceiling by an electric cable of a lighting fixture.

Furthermore, here, the lighting fixture lights up one LED lamp to be mounted, but a plurality of, for example, three LED lamps may be mounted.
≪Modification≫
As mentioned above, although the structure of this invention was demonstrated based on Embodiment 1, 2, 3, this invention is not restricted to said each embodiment. For example, the following modifications can be implemented.
1. Case (1-1) Form In the first embodiment, the case is composed of the case main body and the case lid. However, if the lighting circuit unit can be accommodated in a sealed state (to prevent intrusion of water or the like) in the case, Other forms may be used.

(Modification 1) As another form, it is good also as a structure which inserts and assembles a lighting circuit unit from the opening of the lamp | ramp proximal end side of a case, after fastening and assembling a case and a heat sink with a screw | thread. In that case, the circuit board may be fixed inside the case by using an engaging structure such as a claw member or an adhesive.
(Modification 2) A configuration in which the lighting circuit unit is inserted with the main surface of the circuit board along the lamp axis J may be employed.

(Modification 3) It is also possible to form the case with only the cylindrical case body without providing the case lid, and to close the opening on the side opposite to the base side of the case with the end of the heat sink on the lamp base end side.
(1-2) Material In the first embodiment, the resin material is used as the case material, but other materials may be used.

(Modification 4) For example, when the temperature of the lighting circuit unit becomes high during lighting, the case may be provided with a heat sink function. In this case, for example, the case can be formed by using a resin material or a metal material containing a filler / fiber having high thermal conductivity.
(Modification 5) When the case has a heat sink function, for example, a plurality of fins may be provided on the outer peripheral surface of the case.

(Modification 6) When it is necessary to ensure insulation between the case and the lighting circuit unit and between the case and the base, it can be carried out by performing an insulation process such as applying an insulating material to the inner surface of the case. .
2. Heat Sink (2-1) Fin In the first embodiment, the fin is provided in parallel with the cylinder axis X (lamp axis J) over the entire width between the proximal end and the distal end of the heat sink. However, it is not limited to this.

(Modification 7) For example, the fin may be provided so as to exist in a partial region between the base end side end portion and the tip end side end portion of the heat sink.
(Modification 8) In the first embodiment, fins are arranged in parallel with the cylinder axis X (lamp axis J), but they may be arranged so as to be inclined with respect to the cylinder axis X, or from the base portion side to the case side. It may be arranged in the shape of a screw that turns around the tube axis X while moving to.

(Modification 9) Adjacent fins may extend in parallel from the distal end side end portion to the proximal end side portion, or intersect in the middle of extending from the distal end side end portion to the proximal end side end portion. It may be stretched.
(2-2) Material (Modification 10) In Embodiment 1, aluminum is used as the material of the heat sink. However, other metal materials such as steel, titanium, and copper may be used, and ceramic materials, resin materials, etc. May be used.

(Modification 11) A double structure in which the heat sink is made of a metal material and a resin material is applied to the surface of the metal material may be used.
(Modification 12) A double structure in which the heat sink is made of a resin material and the surface thereof is subjected to metal plating or the like may be used.
(Modification 13) When a resin is used as the material of the heat sink, the thermal conductivity of the material may be increased by filling a filler such as a metal or metal oxide.

(Modification 14) In the case of Modification 13, for the purpose of further enhancing the safety of the user, a resin coating for ensuring insulation is applied to at least the outer peripheral surface of the heat sink, or an outer shell made of an insulating member such as a resin. The member may be fitted outside the heat sink.
Here, in the heat sink 130, the parts that are likely to be touched by the user when replacing the lamp are the outer end surface 132 a that is the end surface opposite to the tube axis X of the fin 132 and the tube portion 131 on the lamp front end side. This is a portion where the fin 132 of the outer peripheral surface 131d is not erected. Accordingly, when the surface of the heat sink is covered with an insulating material such as a resin as in the modification 11 and the modification 14, at least the outer end surface 132a of the fin 132 and the outer peripheral surface 131d of the tube portion 131 on the lamp front end side are insulative. As long as it is covered with a material having a property, it can contribute to the safety of the user.

(Modification 15) Further, in addition to the outer end surface 132a of the fin 132 and the portion of the outer peripheral surface 131d of the cylindrical portion 131 on the lamp front end side where the fin 132 is not erected, other than the both side surfaces 132b of the fin 132 and the lamp front end side Of the outer peripheral surface 131d of the cylindrical portion 131, a portion where the fins 132 are not erected may be covered with an electrically insulating material.
According to the configuration of this modification, when a small child's finger is inserted into the space between the adjacent fins 132 and the fins 132, or a foreign object such as a pin is fully inserted into the space between the adjacent fins 132 and the fins 132. Even if it is inserted, both sides 132b of the fin 132 and the entire portion of the outer peripheral surface 131d of the cylindrical portion 131 where the fin 132 is not erected are covered with an insulating material, so that the user can be surely connected. Can contribute to safety.

In the lamp 100 of Embodiment 1, the lighting circuit unit 150 is accommodated in a case 120 made of a resin material. Therefore, even when the heat sink 130 is made of a conductive resin material or metal material, the space distance and the creepage distance between the heat sink 130 and the electric circuit of the lighting circuit unit 150 are secured sufficiently. be able to.
(2-3) Communication path In Embodiment 1, although the communication path 131c was formed in the part between each adjacent fin of the base end side cylinder part 131a, it is not restricted to this.

(Modification 16) For example, the communication path 131c may be formed only in some of the adjacent fins, such as every other one or every two. From the viewpoint of promoting the air flow, a plurality of communication paths are preferably formed, and more preferably formed at positions opposite to each other across the lamp shaft J.
In the second embodiment, two communication paths 231c are formed in each adjacent fin portion of the base end side cylinder portion 231a. However, it is not limited to this.

(Modification 17) For example, one or three or more communication paths 231c may be formed in each fin portion. Further, for example, the communication path 231c may be formed only in some of the adjacent fins such as every other or every other two fins. However, it is preferable that a plurality of inter-fin portions where the communication path 231c is formed exist. Further, it is more preferable that the lamp shafts J are formed at positions opposite to each other with the lamp shaft J interposed therebetween.
(2-4) Cylinder Part In Embodiments 1 and 2, the cylinder part is composed of a proximal end cylinder part and a diameter-expanded cylinder part, but is not limited thereto.

(Modification 18) The cylinder part may not have the proximal end side cylinder part but only the diameter-enlarged cylinder part. That is, there may be a shape in which the diameter of the cylindrical portion gradually increases from the end portion on the lamp proximal end side toward the end portion on the lamp distal end side without a constant portion.
(Modification 19) Like the heat sink 330 shown in FIG. 14A, the outer peripheral edge 331b1 of the enlarged diameter cylindrical portion 331b is a broken line in the cross section of the cylindrical portion 331 by a plane including the lamp axis J (cylinder axis X). May be.

  (Modification 20) Like the heat sink 430 shown in FIG. 14 (b), the outer peripheral edge 431b1 of the enlarged diameter cylindrical portion 431b is a straight line in the cross section of the cylindrical portion 431 by a plane including the lamp axis J (cylinder axis X). Further, it may have a shape constituted by a curve protruding to the side away from the lamp axis J (cylinder axis X). In this modification, the lamp base end side of the outer peripheral edge 431b1 is a straight line, and the lamp front end side is a curve.

(Modification 21) Further, like the heat sink 530 shown in FIG. 15A, in the cross section of the cylindrical portion 531 by a plane including the lamp axis J (cylinder axis X), the lamp base end side of the outer peripheral edge 531b1 is a curve. The lamp tip side may be a straight line.
(Modification 22) Like the heat sink 630 shown in FIG. 15B, the outer peripheral edge 631b1 of the enlarged diameter cylindrical portion 631b is a straight line in the cross section of the cylindrical portion 631 by a plane including the lamp axis J (cylinder axis X). May be.

(Modification 23) Like the heat sink 730 shown in FIG. 16A, the outer peripheral edge 731b1 of the enlarged-diameter cylindrical portion 731b is a cylindrical axis in the cross section of the cylindrical portion 731 including a plane including the lamp axis J (cylinder axis X). A curved shape that is recessed toward X (lamp axis J) may be used.
(Modification 24) Like the heat sink 830 shown in FIG. 16B, in the cross section of the cylinder portion 831 by a plane including the lamp axis J (cylinder axis X), the diameter-expanded cylinder portion 831b is expanded in steps. May be. In the heat sink 830, the diameter expansion of the diameter-expanded cylindrical portion 831b is in two stages (the diameter is expanded at two locations), but is not limited thereto. It may be one stage (one diameter expansion) or three stages or more (three or more diameter expansions).

(Modification 25) Like the heat sink 930 shown in FIG. 17, the outer peripheral edge 931 b 1 of the enlarged-diameter cylindrical portion 931 b in the cross section of the cylindrical portion 931 by a plane including the lamp axis J (cylinder axis X) is The curved shape may be a combination of a curve that is recessed toward the side close to the axis J) and a curve that protrudes away from the tube axis X (lamp axis J).
(Modification 26) In the heat sink 930 according to Modification 24, the lamp base end side is a curve recessed into the side approaching the cylinder axis X (lamp axis J), and the lamp front end side is the cylinder axis X (lamp axis J). However, the present invention is not limited to this. The lamp base end side may be a curve that protrudes away from the tube axis X (lamp axis J), and the lamp front end side may be a curve that is recessed toward the tube axis X (lamp axis J). Further, the combination of the curves is not limited to two, and the shape of the outer peripheral edge may be a shape in which three or more curves are combined.

  (Modification 27) Further, the diameter expansion of the diameter-expanded cylinder portion may be a diameter expansion method in which the above modifications are combined. For example, even if the diameter-expanded cylinder portion is expanded in multiple stages, the diameter of each step is a straight line in a direction perpendicular to the cylinder axis X (lamp axis J) as shown in FIG. Alternatively, it may be a straight line oblique to the cylinder axis X (lamp axis J) as shown in FIG. Furthermore, the aspect which combined the aspect of the diameter expansion shown in FIG. 3 and FIGS.

14 to 17, fins 332, 432, 532, 632, 732, 832, 932 are different in height from the outer peripheral surface of the cylindrical portion because the shape of the cylindrical portion is different from that of the first embodiment. Except for this, the basic configuration is the same as that of the fin 132 in the heat sink 130 of the first embodiment. The communication paths 331c, 431c, 531c, 631c, 731c, 831c, and 931c all correspond to the communication path 131c in the heat sink 130 of the first embodiment, and the basic configuration is the same.
3. LED Module (3-1) Light Emitting Element In Embodiment 1, the semiconductor light emitting element is an LED, but is not limited thereto.

(Modification 28) The semiconductor light emitting element may be, for example, an LD (laser diode) or an EL element (electric luminescence element).
(Modification 29) Further, although the LED is a surface mount type SMD, it may be mounted on the mounting substrate in a bare chip state or a shell type. Further, the plurality of LEDs may be a mixture of a bare chip type and a surface mount type.
(3-2) Mounting Board In the first embodiment, the mounting board has a disk shape in plan view, but is not limited thereto.

(Modification 30) The mounting board may have another shape, for example, a polygon such as a triangle or a quadrangle, an ellipse, or a ring.
(Modification 31) Further, the number of mounting boards is not limited to one, and a plurality of mounting boards may be used in combination.
(Modification 32) In the first embodiment, the connection terminal 172a is made of a metal thin film and connected to the lead wire of the wiring member 180 by soldering. However, the shape of the connection terminal and the connection method between the connection terminal and the wiring member are not limited to this. For example, a connector type terminal may be used as the connection terminal, and the connector connected to the connector connected to the end of the wiring member may be used.
(3-3) Sealing body (Modification 33) In Embodiment 1, the sealing body seals the LEDs individually (the number of LEDs and the number of sealing bodies are the same). However, the sealing body may be configured such that a plurality of bare chip type LEDs are mounted on a mounting substrate, and all the LEDs or the plurality of LEDs are sealed with one sealing body.
(3-4) Arrangement of LEDs (Modification 34) In Embodiment 1, a plurality of LEDs are arranged in a single row (single shape) on the same circumference, but this is not a limitation. For example, in a plan view, it may be a polygonal ring shape, a matrix shape, a row shape, or other arrangements.
(3-5) Others (Modification 35) The LED module emits white light by using an LED that emits blue light and phosphor particles that convert the wavelength of the blue light. Not limited to. For example, a combination of an ultraviolet light emitting semiconductor light emitting element and each color phosphor particle emitting light in three primary colors (red, green, and blue) may be used.

(Modification 36) Further, as a wavelength conversion material, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment is used. May be.
(Modification 37) Further, when light having a different color temperature such as a light bulb color is emitted from the LED, or when light of a color different from white, for example, red light is emitted from the LED, the light is emitted from the LED. A wavelength conversion member that converts the wavelength of the emitted light (for example, blue light) into red light may be mixed in the sealing body resin.
4). Base (Modification 38) Although the Edison type base is used in the first embodiment, other types, for example, a pin type (specifically, G type such as GY, GX, etc.) may be used. .

(Modification 39) In the first embodiment, the base 110 is attached (joined) to the case 120 by being screwed into the base coupling portion 121a of the case main body 121 using the female screw of the shell portion 111. However, it may be joined to the case by other methods. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
5. Glove (Modification 40) In Embodiment 1, the glove has a dome shape, but other types, for example, A type, G type, R type, etc., may be used, and the shape of the bulb may be completely different. It may be a simple shape.

(Modification 41) In each of the above embodiments, the inner surface of the globe has not been particularly described. For example, a diffusion process (for example, a process using silica or a white pigment) that diffuses light emitted from the LED module is performed. It may be. Moreover, the globe should just be comprised with the translucent material, for example, transparency and opaqueness are not related in particular.
(Modification 42) In the first embodiment, the glove is integrated (manufactured as one), but may be a combination (joined) of a plurality of members, for example.
6). LED Lamp (Modification 43) In the embodiment, the LED lamp that stores the circuit unit in the case (so-called light bulb type LED lamp) has been described as the LED lamp. However, the circuit unit is stored in the case. It can also be applied to LED lamps that do not have LED lamps, such as LED lamps that replace compact bulbs. Further, it may be an LED lamp that has not been conventionally used, for example, an LED lamp that is directly incorporated in a lighting fixture.
<Supplement>
As described above, the embodiments and modifications as one aspect of the present invention have been described. The configuration and effects of one embodiment of the present invention can be summarized as follows.

  A lamp according to an aspect of the present invention is a lamp having a structure in which a semiconductor light emitting element is lit by a lighting circuit unit, and heat of the semiconductor light emitting element during lighting is radiated by a heat sink, and the heat sink has an internal space. A cylindrical portion, and a plurality of fins erected radially from the outer peripheral surface of the cylindrical portion around the cylindrical axis, and the lighting circuit unit is disposed on one end side in the cylindrical axis direction, and the semiconductor The light emitting element is disposed on the other end side in the cylinder axis direction, and an end portion on the one end side of the cylinder portion is formed with a communication path that communicates the internal space of the cylinder portion with the outside. The communicating path is not formed at the end of the cylindrical portion on the other end side.

  According to the above configuration, at the other end where the lighting circuit unit of the heat sink is arranged, the cylindrical portion has a defective region, and the first space and the second space communicate with the in-cylinder space via the defective region. Therefore, air can flow between the first space and the second space at the other end. Thereby, since the heat dissipation of a heat sink can be improved in the other end part by which the lighting circuit unit is distribute | arranged, the excessive temperature rise of a lighting circuit unit can be suppressed more effectively. In addition, at the one end where the semiconductor light emitting element of the heat sink is disposed, the cylindrical portion does not have a defect region, so that the heat capacity at the one end can be increased as compared with the case where the defect region is provided. Thereby, the heat generated in the semiconductor light emitting element can be quickly drawn to the heat sink side, and an excessive temperature rise of the semiconductor light emitting element can be suppressed.

  In the lamp according to another aspect of the present invention, the communication path is adjacent between a pair of adjacent fins among the plurality of fins, and on the opposite side across the pair of adjacent fins and the cylindrical shaft. The first space formed between the pair of adjacent fins and the second space existing between the pair of adjacent fins on the opposite side are both formed in the internal space. And may communicate with each other via the communication path.

Thereby, air can flow between the first space and the second space, the convection of the air around the lamp is promoted, and the heat dissipation effect can be further enhanced.
In the lamp according to another aspect of the present invention, the tube portion may have an outer diameter on the other end side larger than an outer diameter on the one end side.
Thereby, since the volume of the cylinder part can be increased and the heat capacity can be increased at the other end part, the heat from the semiconductor light emitting element can be quickly and efficiently conducted to the other end part of the heat sink.

In the lamp according to another aspect of the present invention, the cylindrical portion may include a portion whose outer diameter gradually increases from the one end side toward the other end side.
Thereby, since the external appearance shape of a cylinder part has a smooth curved surface, it can contribute to aesthetics.
In the lamp according to another aspect of the present invention, the cylindrical portion has a shape in which an outer peripheral edge in a cross section including the cylindrical shaft of a portion where the outer diameter expands protrudes away from the cylindrical shaft. May be.

Thereby, when the lamp is mounted on the lighting fixture and used, the inclination of the outer peripheral surface of the cylindrical portion on the other end side near the opening of the lighting fixture becomes steeper, so that the cylinder between the fins It is possible to make it difficult to collect dust on the outer peripheral surface of the part.
In the lamp according to another aspect of the present invention, the outer peripheral edge may have a curved shape that protrudes away from the tube axis.

This also makes it difficult for dust to collect on the outer peripheral surface of the cylindrical portion.
In the lamp according to another aspect of the present invention, the outer peripheral edge may have a polygonal line shape protruding to the side away from the tube axis.
This also makes it difficult for dust to collect on the outer peripheral surface of the cylindrical portion.
In the lamp according to another aspect of the present invention, the outer peripheral edge may have a shape constituted by a curve and a straight line protruding to the side away from the tube axis.

This also makes it difficult for dust to collect on the outer peripheral surface of the cylindrical portion.
In the lamp according to another aspect of the present invention, the cylindrical portion may have a straight outer peripheral edge in a cross section including the cylindrical axis at a portion where the outer diameter increases.
Thereby, manufacture of a heat sink can be performed easily.
In the lamp according to another aspect of the present invention, the cylindrical portion has a curved shape in which an outer peripheral edge in a cross section including the cylindrical axis of the portion where the outer diameter expands is recessed toward the side closer to the cylindrical axis. It may be.

Thereby, the surface area of a fin can be enlarged and the heat dissipation from the fin surface can be improved.
In the lamp according to another aspect of the present invention, the cylindrical portion may have a stepwise increase in the diameter of the outer diameter.
Thereby, the heat capacity from the semiconductor light emitting element can be increased by increasing the heat capacity of the other end of the heat sink. In addition, by increasing the fin surface area on one end of the heat sink and dissipating more heat from the semiconductor light emitting element in front of the lighting circuit unit, the heat transmitted to the lighting circuit unit is reduced and received by the lighting circuit unit. Thermal load can be suppressed.

In the lamp according to another aspect of the present invention, the outer end surface of the plurality of fins on the side opposite to the tube axis and the outer peripheral surface of the end portion on the other end side of the tube portion are the The portion where the plurality of fins are not erected may be covered with an electrically insulating material.
Thereby, the heat sink portion that is likely to be touched by the user when replacing the lamp or the like can be covered with the electrically insulating material, thereby improving the safety of the user.

In the lamp according to another aspect of the present invention, the plurality of fins are erected among an outer end surface and both side surfaces which are end surfaces opposite to the tube axis of the plurality of fins, and an outer peripheral surface of the tube portion. The part which is not made may be covered with an electrically insulating material.
As a result, even if a small child inserts a finger or inserts a foreign object such as a pin into the back between adjacent fins, the part is covered with an electrically insulating material. Therefore, user safety can be further increased.

One embodiment of the present invention can also be realized as a lighting device including the lamp.
Each of the embodiments described above shows a preferred specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, steps, order of steps, and the like shown in the embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the embodiment, steps that are not described in the independent claims indicating the highest concept of the present invention are described as optional constituent elements constituting a more preferable form.

  In addition, for easy understanding of the invention, the scales of the components shown in the above-described embodiments may be different from actual ones. The present invention is not limited by the description of each of the above embodiments, and can be appropriately changed without departing from the gist of the present invention. For example, a lamp or a lighting device obtained by appropriately combining the partial configuration of the lamp according to the first and second embodiments or the lighting device according to the third embodiment and the configuration according to each of the above modifications may be used.

  Furthermore, in the lighting device, there are members such as circuit parts and lead wires on the substrate, but various modes can be implemented based on ordinary knowledge in the technical field of the lighting device and the like regarding the electrical wiring and the electric circuit. The description of the present invention is omitted because it is not directly relevant. Each figure shown above is a schematic diagram, and is not necessarily illustrated strictly.

DESCRIPTION OF SYMBOLS 100 Lamp 130 Heat sink 131 Cylinder part 131b Diameter expansion cylinder part 131b1 Outer periphery 131c Communication path 131d Outer peripheral surface 132 Fin 132a Outer end surface 132b Side surface 133 Internal space 134 Base end side end (end part of one end side)
135 Tip side end (end on the other end)
137A First space 137B Second space 150 Lighting circuit unit 171 LED (semiconductor light emitting element)
301 Lighting device 305 Lighting fixture J Lamp axis X Tube axis

Claims (14)

A lamp having a structure in which a semiconductor light emitting element is turned on by a lighting circuit unit, and heat of the semiconductor light emitting element at the time of lighting is radiated by a heat sink,
The heat sink has a cylindrical portion having an internal space, and a plurality of fins erected radially from the outer peripheral surface of the cylindrical portion around the cylindrical axis,
The lighting circuit unit is disposed on one end side in the cylinder axis direction,
The semiconductor light emitting element is disposed on the other end side in the cylindrical axis direction,
A communication path that connects the internal space of the cylinder part to the outside is formed at an end of the cylinder part on the one end side, and the communication path is provided at an end of the cylinder part on the other end side. A lamp characterized in that is not formed. The communication path is formed between a pair of adjacent fins among the plurality of fins, and between a pair of adjacent fins on the opposite side across the pair of adjacent fins and the cylindrical shaft,
The first space existing between the pair of adjacent fins and the second space existing between the pair of adjacent fins on the opposite side are both in communication with the internal space via the communication path. The lamp according to claim 1. The lamp according to claim 1, wherein the cylindrical portion has an outer diameter on the other end side larger than an outer diameter on the one end side. The lamp according to claim 3, wherein the cylindrical portion has a portion whose outer diameter gradually increases from the one end side toward the other end side. The said cylinder part is a shape where the outer periphery in the cross section containing the said cylinder axis of the part to which the said outer diameter expands protrudes in the side away from the said cylinder axis. lamp. The lamp according to claim 5, wherein the outer peripheral edge has a curved shape protruding toward the side away from the tube axis. The lamp according to claim 5, wherein the outer peripheral edge has a polygonal line shape protruding toward a side away from the tube axis. The lamp according to claim 5, wherein the outer peripheral edge has a shape constituted by a curve and a straight line protruding toward the side away from the tube axis. 5. The lamp according to claim 4, wherein the cylindrical portion has a straight outer peripheral edge in a cross section including the cylindrical axis at a portion where the outer diameter expands. The cylindrical portion has a curved shape in which an outer peripheral edge in a cross section including the cylindrical axis of a portion where the outer diameter expands is recessed toward the side closer to the cylindrical axis. The lamp described. The lamp according to claim 4, wherein the cylindrical portion has a stepwise increase in the diameter of the outer diameter. The outer end surface that is the end surface opposite to the cylindrical axis of the plurality of fins, and the portion of the outer peripheral surface at the other end side of the cylindrical portion where the plurality of fins are not erected, The lamp according to any one of claims 1 to 11, wherein the lamp is coated with an electrically insulating material. The outer end surface and both side surfaces which are the end surfaces opposite to the tube axis of the plurality of fins, and the portion of the outer peripheral surface of the tube portion where the plurality of fins are not erected are electrically insulating materials The lamp according to any one of claims 1 to 11, wherein the lamp is coated with the lamp. An illumination device comprising: the lamp according to any one of claims 1 to 13; and a lighting device that receives the mounting of the lamp and lights the lamp.

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