JP2014146569A - Lamp and illuminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an LED lamp lightweight and to improve heat radiation.SOLUTION: A lamp has a lighting circuit unit 150 light a semiconductor light-emitting element 171 and has a heat sink 130 radiate heat of the semiconductor light-emitting element 171 when lighting. The heat sink 130 has: a cylindrical part 130a which has an internal space 130d, has a part which gradually expands an internal diameter toward one end part in a lamp shaft direction, and forms a communication passage 130c for communicating with the internal space 130d and an outside at least near the other end part of the lamp shaft; and a plurality of fins 130b radially standing around the lamp shaft from an outside surface of the cylindrical part 130a. The semiconductor light-emitting element 171 is mounted on one end part in the lamp shaft direction of the cylindrical part 130a. The lighting circuit unit 150 is housed in a case member 120 worn by the other end part in the lamp shaft direction of the cylindrical part 130a.

Description

  The present invention relates to a lamp and an illumination device that use a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source.

In recent years, from the viewpoint of energy saving, a lamp that uses a highly efficient and long-life LED (hereinafter referred to as an LED lamp) has been proposed as a bulb-type LED lamp that replaces an incandescent bulb.
In general, an LED lamp has a mounting circuit board on which a plurality of LEDs are mounted mounted on the other end of a case having a base at one end, and a lighting circuit unit that receives power from the base and lights the LED is housed in the case. It has the structure which becomes.

The LED generates heat when turned on. When the LED is excessively heated by this heat, the light emission efficiency of the LED is lowered or the life of the LED is shortened. For this reason, various measures are taken to prevent an excessive temperature rise of the LED during light emission.
For example, Patent Document 1 includes a columnar holding pillar made of aluminum in which a plurality of heat dissipating fins are arranged on the outer periphery between a mounting board for mounting an LED and a lighting circuit for lighting the LED. An illuminating device is disclosed in which generated heat is transmitted from a holding column to a radiation fin and released into the outside air.

  Similarly, in Patent Document 2, an illumination including a main body with good thermal conductivity having a plurality of heat dissipating fins on the outer periphery between a mounting substrate on which an LED is mounted and a lighting circuit for lighting the LED. An apparatus is disclosed. FIG. 20 is a side sectional view of the illumination device 10 described in Patent Document 2. According to Patent Document 2, the illumination device 10 includes a semiconductor light emitting element 11 that is an LED, a substrate 14 on which the semiconductor light emitting element 11 is disposed, a lighting device 12 that lights the semiconductor light emitting element 11, and a substrate 14 support portion at one end. 13e has a main body 13 provided with a lighting device 12 at the other end. Moreover, it has a base member 17 and a cover member 18 connected to the lighting device 12 provided on the other end side of the main body 13. The main body 13 is formed of aluminum as a metal having good thermal conductivity and has a substantially circular columnar cross-sectional shape. The outer peripheral surface has a large number of radiating fins 13d protruding radially from one end to the other end. Are integrally formed. And this main body 13 is comprised as a thick cylindrical body with few cavities inside.

JP 2008-293753 A JP 2010-225570 A

  However, in the conventional method, in order to reduce the thermal resistance of the heat transfer path from the mounting board on which the LED is mounted to the heat radiating fin and to ensure good heat dissipation, the volume of the core material constituting the heat sink is increased and the dense The structure made into the structure was taken. As a result, the weight of the lamp is large, the weight load during the manufacturing process and product transportation increases, the packaging material becomes large, and the strength required for the mounting part when mounted on a lighting fixture is high. It was.

  An object of this invention is to provide the lamp | ramp and illuminating device with favorable heat dissipation, aiming at weight reduction in view of the said problem.

  In order to achieve the above object, a lamp according to an aspect of the present invention is a lamp having a structure in which a semiconductor light emitting element is lit by a lighting circuit unit, and heat of the semiconductor light emitting element during lighting is radiated by a heat sink, The heat sink has an internal space, has a portion whose inner diameter gradually increases toward one end in the lamp axis direction, and communicates the internal space with the outside at least in the vicinity of the other end of the lamp shaft. And a plurality of fins erected radially from the outer surface of the cylindrical portion around the lamp axis, and the semiconductor light emitting element includes the lamp of the cylindrical portion The lighting circuit unit is mounted on one end portion in the axial direction, and is housed in a case member attached to the other end portion in the lamp axial direction of the tube portion.

In another aspect, the semiconductor light emitting element is disposed on an outer surface of a lid member fitted into one end portion of the tube portion in the lamp axis direction, so that the lamp portion in the lamp axis direction of the tube portion is disposed. The structure characterized by mounting in one end part may be sufficient.
In another aspect, the heat generated from the semiconductor light emitting element may be discharged from the internal space to the outside through the communication path.

In another aspect, the heat generated from the semiconductor light emitting element is released into the internal space from the surface of the lid portion facing the internal space and the inner surface of the cylindrical portion. May be.
In another aspect, the height of the fin from the tube portion increases toward the other end portion of the tube portion in the ramp axis direction, and is the highest in the vicinity of the communication path. It may be.

In another aspect, the internal space includes a wiring member that connects the lighting circuit and the mounting substrate on which the semiconductor light emitting element is mounted, and a tube that is parallel to the lamp shaft through which the wiring member is inserted. The structure characterized by this may be used.
In another aspect, the tube portion may further include a portion whose inner surface is parallel to the lamp shaft in the vicinity of one end portion in the lamp shaft direction.

In another aspect, the heat sink may further include a plurality of fins that are erected from the inner surface of the cylindrical portion toward the center of the lamp shaft.
A lighting device according to an aspect of the present invention includes a lighting fixture that accepts mounting of the lamp and lights the lamp.

  According to the above configuration, the heat generated from the semiconductor light emitting element is released to the outside of the tube portion from the communication path between the internal space and the outside via the air existing in the internal space of the heat sink, thus reducing the weight of the lamp. Good heat dissipation can be realized.

It is the perspective view seen from diagonally upward which shows the external appearance of the LED lamp 100 which concerns on 1st Embodiment. (A) is a side view of the LED lamp 100 which concerns on 1st Embodiment, (b) is a bottom view. It is sectional drawing which shows the cross section which cut the LED lamp 100 which concerns on 1st Embodiment by the AA line in FIG.2 (b). It is the disassembled perspective view which looked at the LED lamp 100 which concerns on 1st Embodiment from diagonally upward. It is the disassembled perspective view which showed the case member 120 of the LED lamp 100 which concerns on 1st Embodiment in the state upside down from the state of FIG. It is a perspective view of the state which turned the heat sink 130 of the LED lamp 100 which concerns on 1st Embodiment upside down from the state of FIG. It is the perspective view which looked at the heat sink 130, the cover member 160, and the LED module 170 of the LED lamp 100 which concern on 1st Embodiment from diagonally upward in the assembled state. It is a sectional side view which shows the 1st heat dissipation path | route in the LED lamp 100 which concerns on 1st Embodiment. It is a sectional side view which shows the 2nd thermal radiation path | route in the LED lamp 100 which concerns on 1st Embodiment. It is a sectional side view which shows the 3rd heat dissipation path | route in the LED lamp 100 which concerns on 1st Embodiment. It is sectional drawing which shows the cross section which cut the LED lamp 101 which concerns on 2nd Embodiment similarly to the AA line in FIG.2 (b). It is the perspective view which looked at the heat sink 131 of the LED lamp 101 which concerns on 2nd Embodiment, the cover member 160, and the LED module 170 from diagonally upward in the assembled state. It is sectional drawing which shows the cross section which cut the LED lamp 102 which concerns on 3rd Embodiment similarly to the AA line in FIG.2 (b). It is the perspective view which looked at the heat sink 132, the cover member 160, and the LED module 170 of the LED lamp 102 which concern on 3rd Embodiment from diagonally upward in the assembled state. It is sectional drawing which shows the cross section which cut the LED lamp 103 which concerns on 4th Embodiment similarly to the AA line in FIG.2 (b). It is the perspective view which looked at the heat sink 133 of the LED lamp 103 which concerns on 4th Embodiment from diagonally upward. It is sectional drawing which shows the cross section which cut the LED lamp 104 which concerns on 5th Embodiment similarly to the AA line in FIG.2 (b). It is the perspective view which looked at the heat sink 134 and LED module 170 of the LED lamp 104 which concern on 5th Embodiment from diagonally upward in the assembled state. It is the schematic of the illuminating device 301 which concerns on 6th Embodiment. It is a sectional side view of the conventional illuminating device 10 described in patent document 2. FIG.

<< First Embodiment >>
1. Overall Configuration FIG. 1 is a perspective view showing an external appearance of an LED lamp 100 according to the first embodiment, as viewed obliquely from above. Fig.2 (a) is a side view of the LED lamp 100 which concerns on 1st Embodiment, (b) is a bottom view. FIG. 3 is a cross-sectional view showing a cross section of the LED lamp 100 according to the first embodiment taken along line AA in FIG. FIG. 4 is an exploded perspective view of the LED lamp 100 according to the first embodiment viewed obliquely from above.

  The LED lamp 100 mainly includes a base 110 for receiving power from a lighting fixture (see FIG. 19) side, an LED module 170 having an LED 171 that is a semiconductor light emitting element, and a lighting for receiving power from the base 110 and turning on the LED 171. A circuit unit 150, a case member 120 that houses the lighting circuit unit 150, and a heat sink 130 for releasing heat during LED light emission are provided.

In addition to the above configuration, the LED lamp 100 includes a globe 140 that covers the LED 171. The globe 140 in FIG. 1 shows a shape obtained by cutting the globe 140 in a cross section parallel to the paper surface. FIG. 2 shows a state where the globe 140 is seen through. The LED lamp 100 may have a so-called D shape without the globe 140.
Along the central axis (hereinafter referred to as “lamp axial direction”) of the LED lamp 100 shown in FIG. 2A, the direction of the base 110 is “lamp proximal direction”, and the direction of the globe 140 is “lamp distal direction”. " Further, in the heat sink 130, an end portion facing the lamp base end direction in the lamp axis direction is an “end portion on the lamp base end side”, and an end portion facing the lamp tip end direction in the lamp axis direction is “the lamp tip end side”. "End".

  The LED 171 is mounted directly or indirectly on the end portion 130f of the heat sink 130 on the lamp front end side. Here, there are a plurality of LEDs 171 and a module type in which the plurality of LEDs 171 are mounted on the mounting substrate 172. The LED module 170 is mounted on the board mounting portion 160c of the lid member 160 that is fitted into the end portion 130f of the heat sink 130 on the lamp front end side. In addition, let LED module 170 be what mounted several LED171 on the mounting board | substrate 172. FIG.

A case member 120 that houses the lighting circuit unit 150 is attached to an end portion 130 m of the heat sink 130 on the lamp base end side. In other words, the lighting circuit unit 150 is mounted on the lamp base end side 130 m of the heat sink 130 without directly contacting the heat sink 130.
2. Configuration of Each Part (1) Base The base 110 has a function as a mounting means for mounting the LED lamp 100 on a lighting fixture and a function as a power receiving means for receiving power from a socket of the lighting fixture. The base 110 is of the same type as the base used for general light bulbs. The base 110 in the present embodiment is made of a conductive metal material and is an Edison type (screw-in type) in order to ensure insulation between the shell portion 111, the eyelet portion 113, and the shell portion 111 and the eyelet portion 113. Insulating portion 112. For example, so-called E26 can be used.

(2) LED Module The LED module 170 includes a mounting substrate 172, a plurality of LEDs 171 and a plurality of sealing bodies.
The mounting substrate 172 includes an insulating plate, a wiring pattern for mounting a plurality of LEDs in a predetermined connection form, and a connection terminal for connecting the wiring pattern and the lighting circuit unit 150. The predetermined connection form includes, for example, series connection, parallel connection, and series / parallel connection.

  The LED 171 emits a predetermined light color. Examples of the predetermined light color include blue light and ultraviolet light. The plurality of LEDs 171 are mounted on the mounting substrate 172 in a predetermined form. The predetermined form is an annular shape, but may be a polygonal annular shape, a matrix shape, a row shape, or the like, for example. The LED module 170 includes, for example, 24 LEDs 171 in an annular shape in plan view.

The mounting substrate 172 has, for example, a two-layer structure of an insulating layer made of a ceramic substrate or a heat conductive resin and a metal layer made of an aluminum plate or the like. An LED 171 is mounted on the upper surface of the mounting substrate 172. Here, a disk-shaped ceramic (for example, alumina) substrate is used for the mounting substrate 172.
The sealing body is for sealing the LED 171. As the sealing body, for example, a resin material can be used. In addition, when converting the wavelength of the light emitted from LED171, it can implement by mixing a wavelength conversion material in a resin material. As the resin material, for example, silicone resin, epoxy resin, fluorine resin, silicone-epoxy hybrid resin, urea resin, or the like can be used. As the phosphor, for example, YAG phosphor, Y ₃ Al ₅ O ₁₂ : Ce that develops yellow color, silicate phosphor that activates Eu ²⁺ , Sr ₂ SiO ₄ : Eu, or the like can be used. Here, the LED 171 emits blue light, and a phosphor that converts the wavelength of the blue light is mixed in a resin material (eg, silicone resin) that is a sealing body.

  Note that the LED 171 may be sealed after being mounted on the mounting substrate 172, or may be mounted on the mounting substrate 172 after being sealed with a sealing body. Here, the LED is of the surface mount (SMD) type and is integrated with the encapsulant. For this reason, what actually appears in FIGS. 3 and 4 is a sealing body, but an LED as an SMD is denoted by reference numeral “171”.

(3) Lighting circuit unit The lighting circuit unit 150 includes a circuit board 151 and various electronic components 152 and 153. The lighting circuit unit 150 includes a rectifier circuit that rectifies commercial power (AC) received through the base 110 and a smoothing circuit that smoothes the rectified DC power. The smoothed DC power is converted into a predetermined voltage by a step-up / step-down circuit if necessary. The rectifier circuit is constituted by a diode bridge, and the smoothing circuit is constituted by a capacitor. These electronic components 152 and 153 are mounted on the circuit board 151. The electronic components exist other than the reference numerals “152” and “153”, but only the choke coil 152 and the electrolytic capacitor 153 are indicated here for convenience of the drawing.

The circuit board 151 includes an insulating plate, a wiring pattern, and connection terminals. Here, the insulating plate has a circular shape as a whole.
The lighting circuit unit 150 is accommodated in the case member 120 at a position closer to the base 110 than the heat sink 130. The choke coil 152, electrolytic capacitor 153, resistor, and the like are mounted on the surface of the circuit board 151 facing the base 110 on the base 110 side, and an IC or the like is mounted on the surface facing the lamp tip direction. . An electronic component having high heat resistance may be mounted on the surface facing the lamp tip direction.

(4) Case FIG. 5 is an exploded perspective view showing the case member 120 of the LED lamp 100 according to the first embodiment in an upside down state from the state of FIG. 4.
The case member 120 includes a cylindrical case body 121, a case lid 123 that closes the other end opening of the case body 121, and a truncated cone-shaped case cover 122 that covers the case body 121.

The case main body 121 is made of an insulating resin material, has a cylindrical shape as a whole, a base coupling portion 121a for coupling to the base 110, a housing portion 121b for housing the lighting circuit unit 150, and a flange portion 121c.
The case lid 123 is made of an insulating resin material (for example, polybutylene terephthalate (PBT)), and as shown in FIG. 3, a disk portion 123b located on the lamp proximal end side and a small diameter located on the lamp distal end side. And a cylindrical portion 123a. Moreover, it has the contact wall part 123c in which the lighting circuit unit 150 is mounted. The small diameter cylindrical portion 123a passes through the internal space 130d of the heat sink 130 and is inserted into the central hole portion 160e of the lid member 160. Further, the inside of the small diameter cylindrical portion 123a is in a communicating state, and a wiring member 180 that electrically connects the lighting circuit unit 150 and the LED module 170 is inserted into the small diameter cylindrical portion 123a. Therefore, the wiring member 180 that connects the lighting circuit unit 150 and the LED module 170 through the communication path 130c in the cylindrical portion 130a of the heat sink 130 described later is not visually recognized from the outside of the cylindrical portion 130a.

(4-1) Mounting The case main body 121 and the case lid 123 have an end portion (end surface) on the lamp front end side of the case main body 121 and a surface on the lamp base end side of the disc portion 123b of the case cover 123. Combined together. Position alignment between the case main body 121 and the case lid 123 is performed by an alignment means. In this embodiment, when fixing the case main body 121 and the case lid 123 to the heat sink 130 with the screws 191, the common screws 191 are inserted into the holes 121 d of the case main body 121 and the holes 123 d of the case lid 123 and fastened. To align.

The contact wall portion 123c of the case lid 123 functions as a guide means when the case lid 123 is attached to the case main body 121. The abutting wall portion 123c functions as a restricting means that restricts the circuit board 151 of the lighting circuit unit 150 housed in the case body 121 from moving in the direction in which the lamp shaft extends.
(4-2) Attaching the Base The base coupling portion 121a, which is the end on the base side of the case main body 121, is inserted into the end 111a opposite to the eyelet portion in the shell portion 111 of the base 110, and in this state the case main body 121 and the base 110 are combined. The two can be joined by, for example, an adhesive, a screw, caulking, a combination thereof, or the like.
(4-3) Storage and Fixing of Lighting Circuit Unit The lighting circuit unit 150 is stored in an internal space formed by coupling the case main body 121 and the case lid 123. The portion that forms this space is the accommodating portion 121b. The lighting circuit unit 150 is inserted into the case main body 121 in a state where two notches (not shown) of the circuit board 151 are fitted into protruding portions (not shown) of the case main body 121. Thereby, the rotation of the lighting circuit unit 150 around the lamp axis is restricted. The lighting circuit unit 150 is inserted so that the electronic components 152 and 153 side are located on the base 110 side.

  When the lighting circuit unit 150 is inserted into the case main body 121 from the opening on the case lid 123 side, the peripheral edge portion of the circuit board 151 abuts on the stepped portion 121 e on the inner periphery of the case main body 121. Further, in a state where the lighting circuit unit 150 is accommodated in the case member 120, the circuit board 151 and the end surface of the contact wall portion 123c of the case lid 123 are close to each other. Thereby, the movement of the lighting circuit unit 150 in the lamp axis direction is restricted.

  As described above, in the lamp 100 of the present embodiment, the case member 120 has a bottomed cylindrical shape, and the opening side is coupled to the heat sink. In these forms, the wiring member 180 that electrically connects the lighting circuit unit 150 and the LED module 170 is led out from the central hole portion 172a of the mounting substrate 172 and the central hole portion 160e of the lid member 160, and the case lid 123 The small diameter cylindrical portion 123a is inserted. Sealing the central hole portion 160e serving as the outlet port with a silicone resin or the like can ensure the airtightness of the case member 120 and protect the lighting circuit unit 150.

(5) Heat Sink FIG. 6 is a perspective view of a state in which the heat sink 130 of the LED lamp 100 according to the first embodiment is turned upside down from the state of FIGS. 1 to 4. FIG. 7 is a perspective view of the heat sink 130, the lid member 160, and the LED module 170 of the LED lamp 100 according to the first embodiment as seen obliquely from above in an assembled state.

  The heat sink 130 mainly has a function of releasing heat generated from the LED 171 when it is turned on. As shown in FIGS. 2, 6, and 7, the heat sink 130 has an internal space 130d therein and a thin cylindrical portion 130a that gradually increases in diameter toward the end portion 130f on the lamp front end side. The inner surface of the tube portion 130a gradually increases in diameter toward the end portion 130f on the lamp front end side, and the internal space 130d is surrounded by the inner surface of the tube portion 130a. Thus, since the heat sink 130 has a hollow inside of the cylindrical portion 130a, the weight can be reduced as compared with a heat sink having a conventional dense structure.

  Further, as shown in FIGS. 6 and 7, in the heat sink 130, in a cross section (transverse cross section) orthogonal to the lamp axis, the cylindrical portion 130a has a circular shape as a whole, and the cylindrical portion radially about the lamp axis. It has a plurality of fins 130b erected from 130a. As shown in FIGS. 2, 6 and 7, the plurality of fins 130b extend from the end portion 130f on the lamp front end side where the LED module 170 is located toward the case member 120 side. In the present embodiment, there are 20 fins 130b. Further, a communication passage 130c that connects the internal space 130d and the outside of the tube portion 130a is formed in the tube portion 130a in the vicinity of the end portion 130m on the lamp base end side. In the cross section orthogonal to the lamp axis, a plurality of communication passages 130c are arranged for each region where the fins 130b between the adjacent fins 130b and the fins 130b that are erected from the cylindrical portion 130a are not erected. ing. By this communication path, the internal space 130d of the heat sink 130 communicates with the outside of the cylindrical portion 130a. The heat sink 130 is made of, for example, a metal material (for example, aluminum) having excellent thermal conductivity, and can be formed using aluminum die casting, pressing, deep drawing, or the like.

The heat sink 130 and the case lid 123 are coupled in a state where the small diameter cylindrical portion 123 a of the case lid 123 is inserted into the internal space 130 d of the heat sink 130.
Here, the heat sink 130 uses screw coupling as a coupling means for mounting on the case member 120. A screw hole 130e provided on the end surface of the fin 130b on the lamp base end side is provided. As shown in FIG. 3, the heat sink 130 and the case member 120 are coupled to each other by a screw 191 inserted through the hole 121 d of the case body 121 and the hole 123 d of the case lid 123 into the screw hole 130 e in the fin 130 b of the heat sink 130. Is done.

  The outer peripheral portion 160a of the disc-shaped lid member 160 is press-fitted into the end portion 130f on the lamp front end side of the heat sink 130. Thereby, the lid member 160 is inserted into the heat sink 130. As described above, the lid member 160 is not integrated with the heat sink 130 and is formed as a separate part, so that the heat sink 130 can be easily formed using aluminum die casting, pressing, deep drawing, or the like.

  The heat sink 130 can also be made using a resin. In that case, it is preferable to increase the thermal conductivity of the material by filling a filler such as metal or metal oxide. When the resin material is filled with a filler such as metal or metal oxide, there may be a case where sufficient insulation cannot be secured as an insulating material for covering the electric circuit. In the lamp 100 of the present embodiment, the lighting circuit unit 150 is accommodated in a case member 120 made of a resin material. Therefore, even when the heat sink 130 is made of a conductive resin material or metal material, the space distance and the creepage distance between the heat sink 130 and the electric circuit of the lighting circuit unit 150 are secured sufficiently. be able to.

  The lid member 160 is made of, for example, a material having excellent thermal conductivity such as aluminum, and can be formed using an aluminum die cast or a press. The lid member 160 can also be made using a resin. In that case, it is preferable to increase the thermal conductivity of the material by filling a filler such as metal or metal oxide. The board mounting portion 160c located on the surface of the end portion of the lid member 160 on the lamp front end side is a flat surface. The LED module 170 is mounted on the board mounting portion 160c. The mounting of the LED module 170 uses a screw 192 here. That is, the screw 192 inserted through the through hole 172 b of the LED module 170 is screwed into the screw hole 160 d of the lid member 160.

An insertion groove 160b is formed between an end portion 130f on the lamp front end side of the heat sink 130 and a step inside the outer peripheral portion 160a of the lid member 160. The opening side end of the globe 13 is inserted into the insertion groove 160b.
(6) Globe Glove 140 has a function of protecting LED module 170. For this reason, the globe 140 is attached to the heat sink 130 so as to cover the LED module 170. The globe 140 is made of a translucent material. Examples of the translucent material that can be used include a glass material and a resin material. In the present embodiment, the globe 140 is made of a glass material.

  The globe 140 has a dome shape. The globe 140 is mounted so as to cover the lid member 160 fitted into the end portion 130f on the lamp front end side of the lamp shaft method of the heat sink 130. The end of the globe 140 on the opening side is inserted into a groove formed between the insertion groove 160b located on the outer periphery 160a of the lid member 160 and the end 130f of the heat sink 130, and is fixed by an adhesive (not shown). Accordingly, the globe 140 is attached to the heat sink 130.

3. Heat Dissipation Characteristics The LED lamp 100 is roughly divided into three types of heat dissipation paths. Hereinafter, three types of heat dissipation paths will be described with reference to the drawings.
(1) First Heat Dissipation Route FIG. 8 is a side sectional view showing a first heat dissipation route in the LED lamp 100 according to the first embodiment. As shown in FIG. 8, in the LED lamp 100, the heat generated from the LED 171 is conducted from the mounting substrate 172 to the lid member 160, and the inside of the heat sink 130 from the surface facing the internal space 130 d of the lid member 160. Heat is transferred to the air in the space 130d. The air in the internal space 130d is heated, and the heated air is discharged to the outside of the cylindrical portion 130a from the communication passage 130c near the end portion 130m on the lamp base end side of the cylindrical portion 130a. Normally, the LED lamp 100 is used with the lamp base end facing upward, so in the internal space 130d, the heated air moves convectively in the internal space 130d and near the communication path 130c. It is discharged to the outside from the communication path 130c provided above.

  Here, as described above, the tube portion 130a has a shape that gradually increases in diameter toward the end portion 130f on the lamp front end side. On the other hand, the height of the fin 130b from the cylindrical portion 130a increases toward the lamp proximal direction 130m, and the fin 130b has a certain height in the vicinity of the communication path 130c. Therefore, the configuration is such that the user's finger does not directly reach the communication path 130c. Therefore, the user's finger does not directly touch the heated air released in the communication path 130c.

  The heat from the LED 171 heats the air in the internal space 130d, and the heated air is released from the communication path 130c of the cylindrical portion 130a to the outside of the cylindrical portion 130a. Therefore, the heat from the LED 171 is not easily transmitted to the lighting circuit unit 150 accommodated in the case member 120. Therefore, the temperature rise of the lighting circuit unit 150 due to the heat from the LED 171 can be prevented.

(2) Second Heat Dissipation Path FIG. 9 is a side sectional view showing a second heat dissipation path in the LED lamp 100 according to the first embodiment. As shown in FIG. 9, in the LED lamp 100, the heat generated from the LED 171 is thermally conducted from the mounting substrate 172 to the lid member 160. Then, heat is conducted from the lid member 160 to the cylindrical portion 130 a and the fins 130 b of the heat sink 130 through the contact portion 130 l between the lid member 160 and the heat sink 130. Then, heat is transferred from the tube portion 130a and the fins 130b to the outside of the tube portion 130a.

  Thus, the heat generated from the LED 171 is conducted from the lid member 160 to the cylindrical portion 130a of the heat sink 130. Therefore, in the tube portion 130a, the wall surface near the lamp distal end portion 130f is located on the upstream side of the heat dissipating path rather than the wall surface near the lamp proximal end portion 130m, so the temperature becomes higher. The temperature difference from the outside atmosphere increases. As described above, the tube portion 130a has a shape that gradually increases in diameter toward the end portion on the lamp front end side, and the surface area of the tube portion 130a increases toward the end portion on the lamp front end side. . In the tube portion 130a, the area of the outer surface close to the end portion 130f on the lamp front end side where the temperature difference from the external atmosphere is large is made larger than the area of the outer surface close to the end portion 130m on the lamp base end side. Heat transfer to the external atmosphere can be increased.

(3) Third Heat Dissipation Route FIG. 10 is a side sectional view showing a third heat dissipation route in the LED lamp 100 according to the first embodiment. As shown in FIG. 10, in the LED lamp 100, the heat generated from the LED 171 is conducted from the mounting substrate 172 to the lid member 160. Then, heat is conducted from the lid member 160 to the cylindrical portion 130a of the heat sink 130 via the contact portion 130l between the lid member 160 and the heat sink 130, and heat is transferred from the cylindrical portion 130a to the air existing in the internal space 130d of the heat sink 130. Communicated. The air in the internal space 130d is heated, and the heated air is discharged to the outside of the cylindrical portion 130a from the communication path 130c in the end portion 130m on the lamp base end side of the cylindrical portion 130a. Normally, the LED lamp 100 is used with the lamp base end facing upward, so in the internal space 130d, the heated air moves convectively in the internal space 130d and near the communication path 130c. It is discharged to the outside from the communication path 130c provided above.

  Here, similarly to the above (2), in the tube portion 130a, the wall surface near the lamp distal end portion 130f is closer to the upstream side of the heat dissipation path than the wall surface near the lamp proximal end portion 130m. Since it is located, it becomes high temperature, and the temperature difference with the air in the internal space 130d of the cylinder part 130a also increases. Therefore, by making the area of the inner surface near the end portion 130f on the lamp front end side having a large temperature difference from the air in the internal space 130d larger than the area of the inner surface close to the end portion 130m on the lamp base end side, the cylindrical portion 130a. The heat transfer from the air to the air in the internal space 130d can be increased.

  As described above, in the LED lamp 100 according to the first embodiment, the heat generated from the LED 171 is transmitted from the communication path 130c through the air existing in the internal space 130d from the cylindrical portion 130a of the lid member 160 and the heat sink 130. The structure discharged | emitted outside the cylinder part 130a is taken. Therefore, heat dissipation can be improved in a configuration using the heat sink 130 having a cavity inside for weight reduction.

4). Effect As described above, in the LED lamp 100 according to an embodiment of the present invention, the heat sink 130 has the internal space 130d and has a portion whose inner diameter gradually increases toward one end in the lamp axial direction. . Further, a cylindrical portion 130a in which a communication path 130c that communicates the internal space 130d and the outside is formed at least in the vicinity of the other end portion of the lamp shaft, and is erected radially from the outer surface of the cylindrical portion 130a around the lamp shaft. And a plurality of fins 130b. Further, the semiconductor light emitting element 171 is mounted on one end portion of the tube portion 130a in the lamp axis direction, and the lighting circuit unit 150 is housed in a case member 120 attached to the other end portion of the tube portion 130a in the lamp axis direction. It is characterized by being.

  With such a configuration, it is possible to reduce the weight of the LED lamp 100 while maintaining the envelope volume and the external surface area of the heat sink 130. In addition, since the first, second, and third heat dissipation paths described above can be secured, the heat dissipation can be improved in the configuration using the heat sink 130 having a cavity therein for weight reduction. Therefore, it is possible to provide an LED lamp and an illuminating device having good heat dissipation while reducing the weight of the LED lamp.

<< Second Embodiment >>
Although the LED lamp 100 according to the first embodiment has been described above, the illustrated LED lamp 100 can be modified as follows, and the LED lamp 100 according to the present invention as shown in the above-described embodiment. Of course, it is not limited to.
In the first embodiment, as shown in FIGS. 3 and 7, etc., the inner surface of the cylindrical portion 130 a is configured to gradually increase in diameter toward the end portion 130 f on the lamp front end side. However, the inner surface shape of the cylindrical portion 130a is sufficient as long as it forms the internal space 130d. For example, the following configuration may be used.

  FIG. 11 is a cross-sectional view of the LED lamp 101 according to the second embodiment, cut along the line AA in FIG. FIG. 12 is a perspective view of the heat sink 131, the lid member 160, and the LED module 170 of the LED lamp 101 according to the second embodiment as seen from obliquely above in an assembled state. In the LED lamp 101 according to the second embodiment, the heat sink 130 in the LED lamp 100 according to the first embodiment is changed to a heat sink 131 in which a vertical portion 131g is provided on the inner surface of the cylindrical portion 131a facing the internal space 130d. Is. In the heat sink 131, the fin 131b, the communication path 131c, the internal space 131d, the screw hole 131e, the end portion 131f on the lamp shaft front end side, and the end portion 131m on the lamp shaft base end side are the same as the respective portions in the heat sink 130. Description is omitted. The configuration other than the heat sink 131 is the same as that of the LED lamp 100, and the description thereof is omitted.

  As shown in FIGS. 11 and 12, in the heat sink 131, a vertical portion 131g is provided in the vicinity of the end portion 131f on the lamp front end side on the inner surface of the cylindrical portion 131a facing the internal space 130d, and the end of the vertical portion 131g is It is in contact with the lid member 160. Of the inner surface of the cylindrical portion 131a facing the internal space 130d, a region 131h excluding the vertical portion 131g gradually increases in diameter toward the end portion 131f on the lamp front end side, like the heat sink 130 used in the LED lamp 100. It is. With such a configuration, the heat sink 131 can increase the area of the contact portion 131l with the lid member 160 in the vicinity of the end portion 131f on the lamp front end side. In FIG.11 and FIG.12, the said contact part is represented with the dashed-dotted line. As a result, the amount of heat conducted from the lid member 160 to the cylindrical portion 131a of the heat sink 131 can be increased as compared with the LED lamp 100 according to the first embodiment, and the second heat dissipation path and the third The amount of heat that can be released through the heat dissipation path can be increased. With such a configuration, the first, second, and third heat dissipation paths described above can be sufficiently ensured, so that the heat dissipation can be improved while reducing the weight of the LED lamp.

<< Third Embodiment >>
FIG. 13 is a cross-sectional view of the LED lamp 102 according to the third embodiment, taken along the line AA in FIG. FIG. 14 is a perspective view of the heat sink 132, the lid member 160, and the LED module 170 of the LED lamp 101 according to the third embodiment as seen obliquely from above in an assembled state. In the LED lamp 102 according to the third embodiment, the heat sink 130 in the LED lamp 100 according to the first embodiment is changed to a heat sink 132 in which a linear portion 132h is provided on the inner surface of the cylindrical portion 131a facing the internal space 130d. Is. In the heat sink 132, the fin 132b, the communication path 132c, the internal space 132d, the screw hole 132e, the end portion 132f on the lamp shaft distal end side, and the end portion 132m on the lamp shaft proximal end side are the same as the respective portions in the heat sink 130. Description is omitted. The configuration other than the heat sink 132 is the same as that of the LED lamp 100, and a description thereof will be omitted.

  As shown in FIGS. 13 and 14, in the heat sink 132, a linear portion 132h is provided in the vicinity of the end portion 132f on the lamp front end side on the inner surface of the cylindrical portion 132a facing the internal space 130d, and the end of the linear portion 132h is It is in contact with the lid member 160. With such a configuration, the heat sink 132 can increase the area of the contact portion 132l with the lid member 160 in the vicinity of the end portion 132f on the lamp front end side. In FIGS. 13 and 14, the contact portion is indicated by a one-dot chain line. As a result, the amount of heat conducted from the lid member 160 to the cylindrical portion 131a of the heat sink 132 can be increased as compared with the LED lamp 100 according to the first embodiment, and the second heat dissipation path and the third The amount of heat that can be released through the heat dissipation path can be increased. With such a configuration, the first, second, and third heat dissipation paths described above can be sufficiently ensured, so that the heat dissipation can be improved while reducing the weight of the LED lamp.

<< Fourth Embodiment >>
In the first embodiment, as shown in FIGS. 3, 6, 7, etc., the heat sink 130 includes a plurality of fins 130 b erected radially from the outer surface of the cylindrical portion 130 a around the lamp axis. It was set as the structure which has. However, the positions where the fins 130b are disposed need only be positions where heat from the LEDs 171 can be released, and may be configured as follows, for example.

  FIG. 15 is a cross-sectional view of the LED lamp 103 according to the fourth embodiment, taken along the line AA in FIG. FIG. 16 is a perspective view of the heat sink 133 of the LED lamp 103 according to the fourth embodiment as viewed obliquely from above. The LED lamp 103 according to the fourth embodiment includes the heat sink 130 in the LED lamp 100 according to the first embodiment and a plurality of fins 133 i that are erected from the inner surface of the tube portion 133 a toward the lamp axis. The heat sink 133 is changed. In the heat sink 133, the fin 133b, the communication path 133c, the internal space 133d, the screw hole 133e, the end portion 133f on the lamp shaft front end side, and the end portion 133m on the lamp shaft base end side are the same as the respective portions in the heat sink 130. Description is omitted. The configuration other than the heat sink 133 is the same as that of the LED lamp 100, and the description thereof is omitted.

  As shown in FIGS. 15 and 16, the heat sink 133 is provided with a plurality of fins 133 i having wings parallel to the lamp axis from the inner surface of the cylindrical part 133 a facing the internal space 133 d toward the center of the lamp axis. Yes. In addition, the fins 133b erected from the outer surface of the cylindrical portion 133a are also provided in the same manner as in the first embodiment. With such a configuration, the amount of heat transferred from the cylindrical portion 133a of the heat sink 133 to the internal space 133d can be increased as compared with the LED lamp 100 according to the first embodiment, and through the third heat dissipation path. The amount of heat that can be released can be increased. With such a configuration, the first, second, and third heat dissipation paths described above can be sufficiently ensured, so that the heat dissipation can be improved while reducing the weight of the LED lamp.

<< Fifth Embodiment >>
In the first embodiment, as shown in FIGS. 3 and 7 and the like, the LED module 170 is mounted on the board mounting portion 160c of the lid member 160 that is fitted into the end portion 130f of the heat sink 130 on the lamp front end side. Has been. However, the LED module 170 can also be directly attached to the end portion 134f of the heat sink 130 on the lamp front end side, and may have the following configuration, for example.

  FIG. 17 is a cross-sectional view showing a cross section of the LED lamp 104 according to the fifth embodiment, taken along the line AA in FIG. FIG. 18 is a perspective view of the heat sink 134 and the LED module 170 of the LED lamp 104 according to the fifth embodiment viewed obliquely from above in an assembled state. The LED lamp 104 according to the fifth embodiment has no lid member 160 and is provided with a vertical portion 134g on the inner surface of the cylindrical portion 134a facing the internal space 134d, and the vertical portion 134g extends to the mounting substrate 172 of the LED module 170. The heat sink 134 is provided. The LED lamp 104 according to the fifth embodiment is obtained by replacing the heat sink 130 and the lid member 160 in the LED lamp 100 according to the first embodiment with a heat sink 134, and the configuration other than the heat sink 131 is the LED lamp 100. The description is omitted. Further, in the heat sink 134, the fin 134b, the communication path 134c, the internal space 134d, the screw hole 134e, the end portion 134f on the lamp shaft front end side, and the end portion 134m on the lamp shaft base end side are the same as the respective portions in the heat sink 130. Therefore, explanation is omitted.

  As shown in FIGS. 17 and 18, in the heat sink 134, a vertical portion 134g is provided in the vicinity of the end portion 134f on the lamp front end side on the inner surface of the cylindrical portion 134a facing the internal space 134d. The vertical portion 134g extends to the mounting substrate 172 of the LED module 170, and the end of the vertical portion 134g is in contact with the mounting substrate 172. A recessed portion 134k corresponding to the outer diameter of the mounting substrate 172 is provided at the end of the vertical portion 134g. The mounting substrate 172 is loosely inserted into the recessed portion, and is fixed to the recessed portion 134k with an adhesive (not shown). On the other hand, in the inner surface of the cylindrical portion 134a facing the internal space 134d of the heat sink 134, a region 134h excluding the vertical portion 134g is gradually directed toward the end portion 134f on the lamp front end side in the same manner as the heat sink 130 used in the LED lamp 100. It is the structure which expands. Further, an insertion groove 134j is provided in the vicinity of the lamp leading end side 134f of the heat sink 134, and the opening side end of the globe 140 is inserted and bonded.

  In the fifth embodiment, since heat is directly transferred from the LED module 170 to the internal space 134d with the above-described configuration, the amount of heat conducted from the LED module 170 to the internal space 134d is determined by the LED lamp according to the embodiment. It can be increased compared to 100. Therefore, the amount of heat that can be released through the first heat dissipation path can be increased.

  Further, since heat is directly conducted from the LED module 170 to the heat sink 134 via the contact portion 134l, the amount of heat conducted from the LED module 170 to the cylindrical portion 134a of the heat sink 134 is related to the first embodiment. It can be increased compared to the LED lamp 100. Therefore, the amount of heat released through the second heat dissipation path and the third heat dissipation path can be increased. With such a configuration, the first, second, and third heat dissipation paths described above can be sufficiently ensured, so that the heat dissipation can be improved while reducing the weight of the LED lamp.

Moreover, since the cover member 160 can be reduced, the part cost of the cover member 160 and the cost required for assembly can be reduced.
<< Sixth Embodiment >>
In the first to fifth embodiments, the LED lamp has been particularly described. However, the present invention can also be applied to a lighting device using the LED lamp.

In the sixth embodiment, a case will be described in which the LED lamps 100, 101, 102, 103, or 104 according to the first to fifth embodiments are attached to a lighting fixture (downlight type).
FIG. 19 is a schematic diagram of a lighting apparatus according to the sixth embodiment.
The lighting device 301 is used by being mounted on a ceiling 303, for example.

As shown in FIG. 19, the lighting device 301 includes an LED lamp 100 and a lighting fixture 305 that is mounted on and off the LED lamp 100.
The lighting fixture 305 includes, for example, a fixture main body 307 attached to the ceiling 303 and a cover 309 attached to the fixture main body 307 and covering the LED lamp 100. The cover 309 is an open type here, and has a reflective film 313 on the inner surface that reflects the light emitted from the LED lamp 100 in a predetermined direction (here, downward). The appliance body 307 includes a socket 311 to which the base 3 of the LED lamp 100 is attached (screwed), and the LED lamp 100 is supplied with power through the socket 311.

The lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 309 but may have a closed-type cover, or a posture in which the LED lamp faces sideways (LED lamp The lighting fixture may be turned on in a posture in which the central axis of the lamp is horizontal) or in an inclined posture (a posture in which the central axis of the LED lamp is inclined with respect to the central axis of the lighting fixture).
In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that is suspended from the ceiling by an electric cable of a lighting fixture.

Furthermore, here, the lighting fixture lights up one LED lamp to be mounted, but a plurality of, for example, three LED lamps may be mounted.
≪Modification≫
As mentioned above, although the structure of this invention was demonstrated based on 1st thru | or 6th Embodiment, this invention is not limited to the said embodiment. For example, even if it is the LED lamp which combined suitably the partial structure of the LED lamp which concerns on 1st thru | or 5th Embodiment, and the illuminating device which concerns on 6th Embodiment, and the structure which concerns on the following modification. Good.

In addition, the materials, numerical values, and the like described in the above embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the illumination device without departing from the scope of the technical idea of the present invention.
1. Case (1) Form In the first to fifth embodiments, the case body is composed of the case body and the case lid, but the lighting circuit unit is sealed in the case (to prevent intrusion of water or the like). Other forms may be used as long as they can be accommodated.

  As another form, it is good also as a structure which inserts and assembles a lighting circuit unit from the edge part of the lamp | tip front end side of a heat sink, after fastening and assembling a case member and a heat sink with a screw | thread. In that case, the outer diameter of the disc part of the case lid in the case member is made smaller than the inner diameter of the cylindrical part of the heat sink, and after the lighting circuit unit is mounted on the contact part of the case lid, the lighting circuit unit is mounted on the lamp of the heat sink. Insert from the end on the tip side. Then, the lighting circuit unit is inserted into the housing portion of the case body attached to the end of the heat sink on the lamp base end side. A structure in which the case lid regulates the movement in the lamp axis direction can be adopted by fitting the lid member into the end portion of the heat sink on the lamp front end side.

As another form, the case is configured only by the cylindrical case main body without the case lid, and the opening on the side opposite to the base side in the case is closed by the end portion on the lamp base end side of the heat sink. Also good.
(2) Material In the first to fifth embodiments, the resin material is used as the material of the case, but other materials can also be used. For example, when the temperature of the lighting circuit unit becomes high during lighting, the case may have a heat sink function. In this case, for example, the case can be formed by using a resin material or a metal material containing a filler / fiber having high thermal conductivity.

When the case has a heat sink function, for example, a plurality of fins may be provided on the outer peripheral surface of the case.
When it is necessary to ensure insulation between the case and the lighting circuit unit and between the case and the base, it can be carried out by performing an insulation process such as applying an insulating material to the inner surface of the case.
2. Heat Sink (1) Fin In the first to fifth embodiments, the fin is provided in parallel to the central axis of the heat sink over both ends of the heat sink. However, the fins may be provided so as to exist in a partial region between both ends in the central axis direction of the heat sink.

In the first to fifth embodiments, the fins are arranged in parallel with the central axis of the heat sink. However, the fins may be arranged so as to be inclined with respect to the central axis, or may be centered while moving from the base side to the case side. It may be arranged in the form of a screw that turns around an axis.
Further, adjacent fins may be extended in parallel from the base to the case side, or may be extended so as to intersect during the extension from the base to the case side.

(2) Material In the first to fifth embodiments, aluminum is used as the metal material of the heat sink, but other metal materials such as steel, titanium, copper, etc., ceramic materials, resin materials, etc. May be used. Furthermore, it may be a double structure in which the heat sink is made of a metal material and a resin material is applied to the surface of the metal material. Furthermore, a double structure in which the heat sink is made of a resin material and the surface thereof is subjected to metal plating or the like may be used.

3. LED Module (1) Light Emitting Element In the first to fifth embodiments, the semiconductor light emitting element is an LED, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element). May be.

Moreover, although LED was surface mount type SMD, you may mount on a mounting board | substrate by the state of a bare chip, or a shell type. Further, the plurality of LEDs may be a mixture of a bare chip type and a surface mount type.
(2) Mounting Board The mounting board in the first to fifth embodiments has a disk shape in plan view. However, the mounting substrate may have other shapes, for example, a polygon such as a triangle or a quadrangle, an ellipse, or a ring. Further, the number of mounting boards is not limited to one, and may be two or more.

(3) Sealing body In the first to fifth embodiments, the sealing body individually seals LEDs (the number of LEDs and the number of sealing bodies are the same). However, the sealing body may be configured such that a plurality of bare chip type LEDs are mounted on a mounting substrate, and all the LEDs or the plurality of LEDs are sealed with one sealing body.

(4) Arrangement of LEDs In the first to fifth embodiments, a plurality of LEDs are arranged in a single row (single shape) on the same circumference. You may arrange | position so that it may be located on top, may be arranged in matrix form, and other arrangement | positioning may be sufficient.
(5) Others The LED module emits white light by using an LED that emits blue light and phosphor particles that convert the wavelength of the blue light. For example, a semiconductor light emitting device that emits ultraviolet light. And three color phosphor particles that emit light in three primary colors (red, green, and blue) may be used.

Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.
4). Base In the first to fifth embodiments, Edison type bases are used, but other types, for example, pin types (specifically, G types such as GY and GX) are also used. Good.

Moreover, in the said embodiment, although the nozzle | cap | die was mounted | worn (joined) to the case by screwing with the screw part of a case using the internal thread of a shell part, it joined with a case by the other method. Also good. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
5. Globe In the first to fifth embodiments, the globe has a dome shape, but other types, for example, A type, G type, R type, etc., may be used, and it is completely different from the shape of a light bulb or the like. Such a shape may be used.

In the first to fifth embodiments, the inner surface of the globe has not been particularly described. For example, a diffusion process (for example, a process using silica or white pigment) that diffuses light emitted from the LED module is performed. It may be. Moreover, the globe should just be comprised with the translucent material, for example, transparency and opaqueness are not related in particular.
In the first to sixth embodiments, the globe is integrated (manufactured as one), but may be, for example, a combination (joined) of a plurality of members.

6). LED Lamp In the first to fifth embodiments, the LED lamp that stores the circuit unit in the case (so-called bulb type LED lamp) has been described as the LED lamp. However, the circuit unit is stored in the case. It can also be applied to LED lamps that have not been replaced, for example, LED lamps that replace compact bulbs. Further, it may be an LED lamp that has not been conventionally used, for example, an LED lamp that is directly incorporated in a lighting fixture.

≪Summary≫
As described above, a lamp according to an aspect of the present invention is a lamp having a structure in which a semiconductor light emitting element is lit by a lighting circuit unit, and heat of the semiconductor light emitting element during lighting is radiated by a heat sink. The heat sink has an internal space, has a portion whose inner diameter gradually increases toward one end portion in the lamp axis direction, and communicates the internal space and the outside at least in the vicinity of the other end portion of the lamp shaft. A cylindrical portion in which a communication path is formed; and a plurality of fins erected radially from the outer surface of the cylindrical portion around the lamp axis; and the semiconductor light emitting element includes the lamp shaft of the cylindrical portion The lighting circuit unit is mounted in one end portion in the direction, and is housed in a case member attached to the other end portion in the lamp axis direction of the tube portion. With this configuration, heat generated from the semiconductor light emitting element is released to the outside of the cylindrical portion from the communication path between the internal space and the outside via the air existing in the internal space of the heat sink, which is favorable while reducing the weight of the lamp. Heat dissipation can be realized.

  In another aspect, the semiconductor light emitting element is disposed on an outer surface of a lid member fitted into one end portion of the tube portion in the lamp axis direction, so that the lamp portion in the lamp axis direction of the tube portion is disposed. The structure characterized by mounting in one end part may be sufficient. With this configuration, the lid member is not integrated with the heat sink and is formed as a separate part, so that the heat sink can be easily created using aluminum die casting, pressing, deep drawing, or the like.

  In another aspect, the heat generated from the semiconductor light emitting element may be discharged from the internal space to the outside through the communication path. In another aspect, the heat generated from the semiconductor light emitting element is released into the internal space from the surface of the lid portion facing the internal space and the inner surface of the cylindrical portion. May be. With this configuration, it is possible to reduce the weight of the LED lamp while maintaining the envelope volume and the external surface area of the heat sink. In addition, since the first, second, and third heat dissipation paths described above can be secured, heat dissipation can be improved in a configuration using a heat sink having a cavity inside for weight reduction.

  In another aspect, the height of the fin from the tube portion increases toward the other end portion of the tube portion in the ramp axis direction, and is the highest in the vicinity of the communication path. It may be. With this configuration, the user's finger does not reach the communication path directly. Therefore, the user's finger does not directly touch the heated air released in the communication path.

  In another aspect, the internal space includes a wiring member that connects the lighting circuit and the mounting substrate on which the semiconductor light emitting element is mounted, and a tube that is parallel to the lamp shaft through which the wiring member is inserted. The structure characterized by this may be used. With this configuration, the wiring member that connects the lighting circuit unit and the LED module through the communication path in the cylindrical portion of the heat sink is not visually recognized from the outside of the cylindrical portion.

  In another aspect, the tube portion may further include a portion whose inner surface is parallel to the lamp shaft in the vicinity of one end portion in the lamp shaft direction. With this configuration, the amount of heat conducted from the lid member to the cylindrical portion of the heat sink can be increased, and the amount of heat that can be released through the second heat dissipation path and the third heat dissipation path described above can be increased. it can.

In another aspect, the heat sink may further include a plurality of fins that are erected from the inner surface of the cylindrical portion toward the center of the lamp shaft. With this configuration, the amount of heat that can be released through the third heat dissipation path described above can be increased.
A lighting device according to an aspect of the present invention includes a lighting fixture that accepts mounting of the lamp and lights the lamp. With this configuration, it is possible to reduce the weight of the lighting device.

<Supplement>
Each of the embodiments described above shows a preferred specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, steps, order of steps, and the like shown in the embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the embodiment, steps that are not described in the independent claims indicating the highest concept of the present invention are described as optional constituent elements constituting a more preferable form.

In addition, for easy understanding of the invention, the scales of the components shown in the above-described embodiments may be different from actual ones. The present invention is not limited by the description of each of the above embodiments, and can be appropriately changed without departing from the gist of the present invention.
Furthermore, in the lighting device, there are members such as circuit parts and lead wires on the substrate, but various modes can be implemented based on ordinary knowledge in the technical field of the lighting device and the like regarding the electrical wiring and the electric circuit. The description of the present invention is omitted because it is not directly relevant. Each figure shown above is a schematic diagram, and is not necessarily illustrated strictly.

100, 101, 102, 103 LED lamp 110 Base 120 Case (case member)
121 Case body 122 Case cover 123 Case lid 130, 131, 132, 134 Heat sink 140 Globe 150 Lighting circuit unit 151 Circuit board 152, 153 Electronic component 160 Lid member 170 LED module (light emitting module)
171 LED (semiconductor light emitting device)
172 Mounting board 180 Wiring member 301 Lighting device

Claims (9)

A lamp having a structure in which a semiconductor light emitting element is turned on by a lighting circuit unit, and heat of the semiconductor light emitting element at the time of lighting is radiated by a heat sink,
The heat sink is
There is an internal space, a portion having an inner diameter that gradually increases toward one end in the lamp axis direction, and a communication path that communicates the internal space with the outside at least in the vicinity of the other end of the lamp shaft. A formed cylinder part;
A plurality of fins erected radially from the outer surface of the cylindrical portion around the lamp axis;
The semiconductor light emitting element is mounted on one end of the tube portion in the lamp axis direction,
The lamp is characterized in that the lighting circuit unit is housed in a case member attached to the other end portion of the tube portion in the lamp axis direction.   The semiconductor light emitting element is mounted on one end portion of the tube portion in the lamp axis direction by being disposed on an outer surface of a lid member fitted into one end portion of the tube portion in the lamp axis direction. The lamp according to claim 1.   The lamp according to claim 1, wherein heat generated from the semiconductor light emitting device is released from the internal space to the outside through the communication path.   The lamp according to claim 3, wherein heat generated from the semiconductor light emitting element is released to the internal space from a surface of the lid portion facing the internal space and an inner surface of the cylindrical portion.   2. The lamp according to claim 1, wherein a height of the fin from the tube portion increases toward the other end portion of the tube portion in the lamp axis direction and is highest in the vicinity of the communication path.   The internal space includes a wiring member that connects the lighting circuit and a mounting substrate on which the semiconductor light emitting element is mounted, and a tube that is parallel to the lamp shaft through which the wiring member is inserted. The lamp according to any one of 1 to 5.   2. The lamp according to claim 1, wherein the tube portion further includes a portion whose inner surface is parallel to the lamp shaft in the vicinity of one end portion in the lamp shaft direction.   The lamp according to claim 1, wherein the heat sink further includes a plurality of fins erected from the inner surface of the cylindrical portion toward the lamp axis.   An illuminating device comprising: the lamp according to any one of claims 1 to 8; and an illuminating device that receives the mounting of the lamp and lights the lamp.

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