WO2013014821A1

WO2013014821A1 - Light source for lighting, and lighting device

Info

Publication number: WO2013014821A1
Application number: PCT/JP2012/000832
Authority: WO
Inventors: 龍海瀬戸本; 次弘松田; 三貴　政弘; 隆在植本
Original assignee: パナソニック株式会社
Priority date: 2011-07-22
Filing date: 2012-02-08
Publication date: 2013-01-31
Also published as: JP5129413B1; JPWO2013014821A1; JP5491601B2; JP2013048106A

Abstract

A light source (1) for lighting, which is equipped with a hollow globe (10) comprising a light-permeable member and receives an wireless signal from the outside to control the lighting of a semiconductor light-emitting element, wherein the semiconductor light-emitting element is supported by a support member (40) in the inside of the globe (10) and an antenna (90) that receives the wireless signal is arranged in the globe (10).

Description

Lighting light source and lighting device

The present invention relates to an illumination light source and an illumination device using a semiconductor light emitting element, and more particularly to an illumination light source and an illumination device that receive and control an illumination from an external wireless signal.

In recent years, a light bulb-shaped illumination light source using a semiconductor light emitting element such as a light emitting diode (LED) has been widely used as a substitute for an incandescent light bulb. Further, there is a light source for illumination provided with a function of receiving and controlling a wireless signal from the outside (for example, Patent Document 1).

JP, 2011-9717, A

By the way, although such an illumination light source is provided with an antenna for transmitting and receiving a wireless signal in the illumination light source, it is desirable that the antenna be disposed at a position where the wireless signal can be transmitted and received with high sensitivity. In particular, when used as a light source of a luminaire embedded in an opening provided in a ceiling, that is, a so-called luminaire for downlights, the illumination light source itself is located in a recessed area in the opening provided in the ceiling Accordingly, transmission and reception of radio waves of the wireless signal is hindered by the ceiling or the like, and the wireless signal is less likely to reach the illumination light source in the opening. In such a case, it is desirable to be able to more reliably execute transmission and reception of wireless signals. At the same time, it is desirable that the light distribution characteristics of the illumination light source be as good as possible.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide an illumination light source and an illumination device that can transmit and receive a wireless signal more reliably and realize excellent light distribution characteristics. Do.

In order to achieve the above object, a light source for illumination according to the present invention is a light source for illumination that includes a hollow globe made of a translucent member, and receives a wireless signal from the outside to control lighting of a semiconductor light emitting element. The semiconductor light emitting device is supported by a support member inside the glove, and an antenna for receiving the wireless signal is disposed in the glove.

In addition, a lighting device according to the present invention is characterized by including the light source for illumination.

According to the configuration of the illumination light source according to the present invention, since the light emitting portion as the light source is supported by the support member in the inside of the glove, the arrangement position of the light source is closer to the light source position of the incandescent lamp Since good light distribution characteristics closer to the light characteristics can be obtained, and the light source for illumination is arranged inside the glove that is relatively exposed to the outside when the light source is mounted on the illumination device, it is possible to obtain wireless Transmission and reception of signals are less likely to be inhibited, and radio signals can be transmitted and received more reliably.

As described above, according to the present invention, it is possible to provide an illumination light source that can perform parent signal reception of a wireless signal more reliably, and realize excellent light distribution characteristics.

It is an external appearance perspective view which shows the structure of the light source for illumination which concerns on 1st Embodiment. It is a disassembled perspective view of the light source for illumination which concerns on 1st Embodiment. It is arrow sectional drawing which followed the A-A 'line | wire shown in FIG. 1 of the light source for illumination which concerns on 1st Embodiment. It is a figure which shows schematic structure of the light emission part which concerns on 1st Embodiment, (a) is a top view, (b) is the arrow sectional view along the BB 'line shown to (a) It is. It is sectional drawing which shows the structure by which the light emission part which concerns on 1st Embodiment is supported by a supporting member. It is a top view of a circuit unit, (a) is a top view seen from the surface side of a circuit board, (b) is a top view seen from the back side. It is a circuit diagram showing the circuit composition of a circuit unit. It is sectional drawing which shows the general | schematic structure of the light source for illumination which concerns on 2nd Embodiment. It is a figure which shows schematic structure of the light emission part of the light source for illumination which concerns on 3rd Embodiment, (a) is an external appearance perspective view of the light source for illumination, (b) is a top view of a light emission part. It is a figure which shows schematic structure of the light emission part of the light source for illumination which concerns on 4th Embodiment, (a) is an external appearance perspective view of the light source for illumination, (b) is a top view of a light emission part. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 1. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 2. FIG. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 3. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 4. FIG. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 5. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 6. FIG. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 7. FIG. FIG. 18 is a cross-sectional view showing a schematic configuration of a lighting light source according to Modification 7. It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 8. FIG. FIG. 18 is a cross-sectional view showing a schematic configuration of a lighting light source according to Modified Example 8; It is an external appearance perspective view which shows schematic structure of the light source for illumination which concerns on the modification 9. FIG. FIG. 21 is a cross-sectional view showing a schematic configuration of a lighting light source according to Modification 13. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 14. FIG. FIG. 21 is an exploded perspective view of a lighting light source according to Modification 14. It is arrow sectional drawing along the C-C 'line | wire shown in FIG. 23 of the light source for illumination which concerns on the modification 14. As shown in FIG. It is arrow sectional drawing along the D-D 'line | wire shown in FIG. 23 of the light source for illumination which concerns on the modification 14. As shown in FIG. It is a figure for demonstrating the manufacturing method of the light source for illumination which concerns on modification 14, Comprising: It is a figure explaining the manufacturing method of the stem before glove sealing. (A) and (b) are arrow sectional views along a line corresponding to the line DD 'in FIG. 23, (a) shows a state before flare formation, (b) shows after flare formation A state is shown, and (a ') and (b') are arrow sectional drawing along the EE 'line in (a) and (b), respectively. FIG. 28 is a continuation of FIG. 27 illustrating the method of forming joints in the flare. (A), (b) and (c) are arrow sectional views along the line corresponding to the DD 'line in FIG. 23, and (a'), (b ') and (c') are It is arrow sectional drawing which followed the EE 'line in (a), (b), and (c), respectively. It is a figure which shows the continuation of FIG. 28, Comprising: It is a figure which shows the method of forming an exhaust port. (A), (b) is an arrow sectional view along a line corresponding to the line DD 'in FIG. 23, (a'), (b ') are respectively in (a), (b) It is an arrow sectional view along an EE 'line. It is a figure which shows the continuation of FIG. 29, Comprising: (a), (b), (c) is a figure which shows the process of attaching a light emission part to a flare, and (d) is a glove by a drop seal method. It is a figure which shows a sealing process. It is a figure which shows the continuation of FIG. 30, Comprising: (a) is a figure which shows the glove sealing process by a drop seal system, (b), (c) discards the air in a glove and is a process of filling with helium. FIG. FIG. 32 is a view showing the continuation of FIG. 31 and (a) is a view showing a process of sealing the exhaust pipe, (b) and (c) showing a process of attaching a circuit unit, a housing and a cap FIG. It is a figure which shows the glove sealing process by a butt seal system. It is sectional drawing of the light source for illumination which concerns on the modification 15. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 16. As shown in FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 17. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 18. FIG. FIG. 21 is a partial cross-sectional view showing a schematic configuration of a lighting light source according to Modification 19. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on modification 20. FIG. FIG. 21 is a partial cross-sectional view showing a schematic configuration of an illumination light source according to Modification 21. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on modification 22. FIG. It is sectional drawing of the light source for illumination which concerns on the modification 23. FIG. It is sectional drawing of the light source for illumination which concerns on the modification 24. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 25. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 26. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 28. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 29. FIG. It is a partially broken side view which shows schematic structure of the light source for illumination which concerns on the modification 30. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 31. FIG. It is a figure which shows the main manufacturing processes about the manufacturing method of the light source for illumination which concerns on the modification 32. FIG. It is a partially broken perspective view which shows schematic structure of the light source for illumination which concerns on the modification 33. FIG. It is sectional drawing which shows schematic structure of the light source for illumination which concerns on the modification 33. FIG. It is a figure which shows the main manufacturing processes about the manufacturing method of the light source for illumination which concerns on the modification 33. FIG. It is a figure which shows the main manufacturing processes about the manufacturing method of the light source for illumination which concerns on the modification 33. FIG. It is a figure which shows schematic structure of the illuminating device which concerns on the modification 57. FIG.

The mode for carrying out the present invention will be described in detail below with reference to the drawings. Each figure is a schematic view, and shapes, dimensions, ratios, etc. of core components such as parts shown in the drawings are not necessarily strictly illustrated.

First Embodiment
First, the overall configuration of the illumination light source according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3.

[1. overall structure]
FIG. 1 is an external perspective view showing a schematic configuration of the illumination light source 1 according to the first embodiment. FIG. 2 is an exploded perspective view of the illumination light source 1. FIG. 3 is a cross-sectional view of the illumination light source 1 taken along the line AA ′ shown in FIG. In FIG. 3, the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J1 of the illumination light source 1. In the drawing, the illumination light source 1 emits light above the drawing along the lamp axis J1. It is the main emission direction of light. The main emission direction of the light emitted from the illumination light source 1 is "upper", and the direction opposite to the main emission direction is "downward". Hereinafter, in each embodiment and each modification, it is the same, unless there is particular notice.

As shown in FIGS. 1 to 3, the illumination light source 1 according to the first embodiment of the present invention is a bulb-type lamp that substitutes for an incandescent bulb, and uses an LED as a semiconductor light emitting element as a light source. It is an LED lamp. The illumination light source 1 includes, as its main components, a translucent globe 10, a light emitting unit 20 including a semiconductor light emitting element 22 (see FIG. 4) which is a light source, and a cap 30 for receiving power from the outside. And a support member 40 for supporting the light emitting unit 20 in the glove 10. A case 60 is attached to the opening side end 11 a which is an end of the glove 10 on the opening 11 side. The case 60 has a tubular shape. A base 30 is attached to one end of the case 60 (the lower end in FIGS. 1 to 3). The opening on the other end side (upper side in FIGS. 1 to 3) of the case 60 is closed by the base 50. A circuit unit 80 is stored inside the case 60. A support member 40 is provided upright on the base 50 in the direction of extension into the glove 10, and the light emitting unit 20 is attached to the end of the support member 40 in the extension direction.

[2. Configuration of each part]
Hereinafter, each component of the illumination light source 1 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 to 7.

(2-1. Glove)
The globe 10 has a shape similar to that of an incandescent bulb (also referred to as a glass bulb). The globe 10 is here a so-called A-type, which is similar in shape to a general incandescent bulb (bulb with a filament).

As shown in FIGS. 1 to 3, the glove 10 is composed of a hollow spherical portion 10a and a cylindrical portion 10b. The cylindrical part 10b is diameter-reduced as it leaves | separates from the spherical part 10a. In addition, the opening 11 exists in the edge part on the opposite side to the spherical part 10a in the cylindrical part 10b, and let this edge part be the opening side edge part 11a.

The glove 10 is made of a translucent material. Examples of translucent materials include glass materials and resin materials such as acrylics. Here, the glove 10 is made of, for example, a glass material.

The shape of the glove 10 does not have to be A-shaped. For example, the shape of the glove 10 may be G-shaped or E-shaped or the like. The glove 10 does not necessarily have to be transparent to visible light, and may be subjected to a diffusion treatment, for example, by applying silica to form a milky white diffusion film. In addition, it may be colored in red, yellow or the like, or a pattern or picture may be applied. Furthermore, a reflective film or the like may be provided on the base side of the light source as in the case of a reflex light bulb. In addition, by forming the thickness of the plurality of portions of the globe 10 unevenly, the light from the light emitting unit 20 can hit the uneven portion of the thickness, and the glittering feeling of light can be enhanced.

(2-2. Light emitting unit)
FIG. 4 (a) is a plan view of the light emitting unit 20 in the illumination light source 1, and FIG. 4 (b) is a cross-sectional view of the light emitting unit 20 along the line BB 'in FIG. 4 (a). is there. The light emitting unit 20 includes a mounting substrate 21 and a plurality of semiconductor light emitting elements 22 mounted on a front surface which is a main surface on the upper side of the mounting substrate 21. In the present embodiment, the semiconductor light emitting element 22 is an LED element, and the light emitting unit 20 includes, in addition to the mounting substrate 21 and the semiconductor light emitting element 22, a sealing body 23 that covers the semiconductor light emitting element 22.

In the present embodiment, although the case where the semiconductor light emitting element 22 is an LED will be described as an example, the semiconductor light emitting element 22 may be, for example, an LD (laser diode), and an EL element (electric luminescence element). It may be

In the present embodiment, the mounting substrate 21 is made of a translucent material. As a result, of the light emitted from the semiconductor light emitting element 22 mounted on the surface of the mounting substrate 21, the light emitted downward is transmitted through the mounting substrate 21 and emitted from the globe 10 to the outside. As a translucent material used for the mounting substrate 21, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a translucent resin substrate or the like is used.

Further, in the present embodiment, the mounting substrate 21 has a rectangular shape in a plan view, and as the material, for example, glass, alumina or the like is used. Note that, on the mounting substrate 21, a wiring pattern 27 for electrically connecting the semiconductor light emitting elements 22 (series connection or / and parallel connection) or connecting with the circuit unit 80 is formed. There is. A part of the wiring pattern 27 is shown in FIG. 4 (a). In consideration of utilization of light emitted downward from the semiconductor light emitting element 22, the wiring pattern 27 is also preferably made of a translucent material, and even if ITO or the like is used as such a translucent material. Good.

As shown in FIGS. 4A and 4B, the plurality of semiconductor light emitting elements 22 are mounted linearly along the longitudinal direction of the rectangular mounting substrate 21 at intervals (for example, at equal intervals). It is mounted on the surface of the substrate 21. In the present embodiment, two rows in which ten semiconductor light emitting elements 22 are arranged at substantially equal intervals are arranged.

The number, the arrangement, and the like of the semiconductor light emitting devices 22 arranged in one column are not limited to the above, and are appropriately determined according to the luminance and the like required for the illumination light source 1. That is, the number of semiconductor light emitting elements 22 arranged in one row is not limited to 10, and can be appropriately changed according to the application. Further, the number of rows in which the semiconductor light emitting elements 22 are arranged on the mounting substrate 21 is not limited to two, and may be one, or three or more rows.

The sealing body 23 is mainly made of a translucent material. The sealing body 23 has a function of preventing air and moisture from entering the semiconductor light emitting element 22. Here, the semiconductor light emitting elements 22 constituting the line are covered in row units in which the plurality of semiconductor light emitting elements 22 are linearly arranged.

In the case where the sealing body 23 needs to convert the wavelength of light emitted from the semiconductor light emitting element 22 into a predetermined wavelength, in addition to the above-described intrusion prevention function of air or the like, the light from the semiconductor light emitting element 22 It also has a wavelength conversion function to convert the wavelength of The wavelength conversion function can be implemented, for example, by mixing a wavelength conversion material that converts the wavelength of a predetermined light into the translucent material.

As a translucent material, silicone resin can be utilized, for example. Moreover, when giving a wavelength conversion function, fluorescent substance particle can be utilized as a wavelength conversion material, for example.

In the present embodiment, the semiconductor light emitting element 22 emits blue light, and phosphor particles that convert blue light into yellow light are used as a wavelength conversion material. As a result, white light mixed with blue light emitted from the semiconductor light emitting element 22 and yellow light wavelength-converted by the phosphor particles is emitted from the light emitting unit 20 (light source for illumination 1).

As shown in FIGS. 4A and 4B, semiconductor light emission from

lead wires

71 and 72 described later, one end of which is electrically connected to the circuit unit 80, at both ends in the longitudinal direction of the rectangular mounting substrate 21.

Feeding terminals

24a and 24b for receiving supply of power for causing the element 22 to emit light are formed.

In addition, second through holes 26 penetrating the mounting substrate 21 and the

feeding terminals

24 a and 24 b are provided in the portions of the mounting substrate 21 where the

feeding terminals

24 a and 24 b are formed. Although not shown in FIGS. 4A and 4B, one end of each of the

lead wires

71 and 72 is inserted into each of the second through holes 26, and a conductive bonding member 73 made of solder or the like is used. Thus, the feed terminal 24 a and the lead wire 71 are electrically connected, and the feed terminal 24 b and the lead wire 72 are electrically connected.

Next, the first through holes 25 will be described. The first through hole 25 is provided so as to penetrate the mounting substrate 21 and is configured to be fitted with a convex portion 43 of the support member 40 described later, and the top view shape of the first through hole 25 is , And the top view shape of the convex portion 43. Specifically, for example, as shown in FIG. 4A, the shape of the first through hole 25 in the longitudinal direction coincides with the longitudinal direction of the mounting substrate 21 and the width direction of the mounting substrate 21 as shown in FIG. It is a rectangle coinciding with the width direction.

The first through holes 25 are provided substantially at the center of the mounting substrate 21. That is, the first through hole 25 is provided at the central portion in the longitudinal direction and the lateral direction of the mounting substrate 21, and is provided between the two sealing bodies 23 in the present embodiment.

(2-3. Case)
Referring back to FIGS. 1 to 3, the case 60 has the same shape as the portion close to the base 30 of the bulb of the incandescent lamp. In the present embodiment, the case 60 has the large diameter portion 61 in the glove 10 side half in the central axis direction and the small diameter portion 62 in the mouth ring half, and between the large diameter portion 61 and the small diameter portion 62 There is a step 63.

The end of the large diameter portion 61 of the case 60 is closed by the base 50 as described above. The groove 54 between the large diameter portion 61 of the case 60 and the base 50 is filled with an adhesive 55 such as a resin, and the opening side end 11a of the glove 10 is inserted therein to solidify the adhesive. 10 are fixed relative to the base 50 and the case 60.

A base 30 is screwed to the small diameter portion 62 of the case 60. In the present embodiment, the base 30 is an Edison type. Therefore, the outer periphery of the small diameter portion 62 is a male screw, and is screwed into the base 30. Thus, the base 30 and the case 60 are screwed together. Details will be described later.

Further, the small diameter portion 62 of the case 60 is formed with a groove 64 extending in parallel with the direction in which the central axis of the case 60 extends. The groove 64 is for fixing a lead wire 75 for connecting a base 30, which will be described later, and the circuit unit 80 (for restricting the movement of the lead wire 75).

The case 60 is made of a resin material such as polybutylene terephthalate (PBT). In addition, in order to adjust the thermal conductivity of case 60, you may use what mixed glass fiber etc. in the resin material, for example.

As described above, the case 60 has the large diameter portion similar to the incandescent lamp as a whole in a state where the glove 10 is attached to the upper side end and the cap 30 is attached to the lower side end. The shape of the curve 61 is expanded in a curved shape as it moves from the base 30 side to the glove 10 side.

The case 60 has a function of releasing the heat generated at the time of lighting of the circuit unit 80 housed inside to the outside. Heat dissipation is performed by heat conduction from the case 60 to the outside air, convection of the outside air, radiation, and the like.

The case 60 has an opening at the upper end thereof closed by the base 50 as described above, and an opening at the lower end thereof closed by the base 30 to have a substantially sealed space inside. The circuit unit 80 is accommodated in this space. The method of storing the circuit unit 80 will be described later in detail.

(2-4. Base)
The base 30 is for receiving power from the socket of the lighting fixture 1 when the lighting light source 1 is mounted on the lighting fixture and turned on.

The type of the base 30 is not particularly limited, but in the present embodiment, an Edison type is used. The base 30 is cylindrical and has a shell portion 33 whose peripheral wall is screw-shaped, and an eyelet portion 35 attached to the shell portion 33 via an insulating member 34.

The shell portion 33 is connected to the circuit unit 80 through the lead wire 75, and the eyelet portion 35 is connected to the circuit unit 80 through the lead wire 74. The lead wire 75 is covered with the shell portion 33 in a state of being drawn out from the inside of the small diameter portion 62 of the case 60 through the opening at the lower end and being fitted in the groove 64 of the case 60. As a result, the lead wire 75 is sandwiched between the outer periphery of the case 60 and the inner periphery of the shell portion 33, and the lead wire 75 is fixed to the cap 30, and the lead wire 75 and the cap 30 are electrically connected. Connected

(2-5. Base)
The base 50 is inserted into the large diameter portion 61 of the case 60. Since the base 50 is inserted into the case 60, the base 50 has an outer surface (circumferential surface) corresponding to the inner surface of the large diameter portion 61 of the case 60. Here, the inner peripheral surface of case 60 corresponds to the outer peripheral surface of base 50, and since the cross-sectional shape of the inner peripheral surface of large diameter portion 61 is circular, base 50 also has a cross section. It has a disk-like shape that is circular in shape.

The base 50 has a small diameter portion 50a and a large diameter portion 50b having a larger diameter than the small diameter portion 50a. The outer peripheral surface of the large diameter portion 50 b corresponds to (is in contact with) the inner peripheral surface of the large diameter portion 61 of the case 60. When the base 50 is inserted into the case 60, a groove 54 along the inner peripheral surface of the case 60 is formed between the small diameter portion 50 a and the inner peripheral surface of the case 60.

As shown in FIG. 3, the opening side end 11 a of the glove 10 is inserted into the groove 54 and fixed by an adhesive 55.

Here, the base 50 is joined to the case 60 and the glove 10 by the adhesive 55 while being inserted into the large diameter portion 61 of the case 60.

The base 50 has a function of closing the upper side opening of the large diameter portion 61 of the case 60 as described above. Further, heat is generated in the semiconductor light emitting element 22 when the semiconductor light emitting element 22 emits light, but the heat of the semiconductor light emitting element 22 transmitted from the mounting substrate 21 to the support 50 and transmitted to the base 50 is The base 50 further has a function of transmitting to the glove 10 and the case 60. For this reason, the base 50 is made of a material having good thermal conductivity. Specifically, for example, metal such as aluminum, resin, ceramic or the like.

(2-6. Support member)
The support member 40 supports the light emitting unit 20 at a central position inside the glove 10. Here, the central position is a position corresponding to the light source (filament) position in the incandescent lamp, and is, for example, substantially the same position as the position where the filament is disposed in the incandescent lamp. The support member 40 has a bar-like shape, and the upper end is coupled to the light emitting unit 20 and the lower end is attached to the base 50. That is, the support member 40 is erected on the base 50 in a state of extending from the base 50 to the inside of the glove 10.

The connection between the upper end portion of the support member 40 and the light emitting unit 20 uses, for example, an engagement structure. A protrusion 43 is formed substantially at the center of the upper surface 41 of the support member 40. A first through hole 25 is formed substantially at the center of the mounting substrate 21 of the light emitting unit 20. That is, the first through hole 25 is provided at the central portion in the longitudinal direction and the lateral direction of the mounting substrate 21, and is provided between the two sealing bodies 23 in the present embodiment. The shape of the convex portion 43 and the shape of the first through hole 25 correspond to each other, and the convex portion 43 of the upper surface 41 of the support member 40 is inserted into the first through hole 25 of the mounting substrate 21 of the light emitting unit 20 The mounting substrate 21 is placed on the upper surface 41 of the support member 40 so as to fit.

In addition, the light emitting unit 20 is disposed with the surface on which the plurality of semiconductor light emitting elements 22 are mounted facing the top of the globe 10. That is, the semiconductor light emitting element 22 is planarly disposed with its main emission oblique direction directed to the upper side of the illumination light source 1.

Here, how the light emitting unit 20 is arranged on the support member 40 will be described with reference to FIG. FIG. 5: is a principal part expanded sectional view of the light emission part 20 and the supporting member 40 of the light source 1 for illumination which concerns on this embodiment. FIG. 5 shows a state before the power supply terminals 24a (24b) and the lead wires 71 (72) (not shown) are connected by soldering.

As shown in FIG. 5, the light emitting unit 20 is placed on the upper surface 41 of the support member 40 so that the first through holes 25 of the light emitting unit 20 are fitted to the convex portions 43 of the support member 40. At this time, the attitude of the light emitting unit 20 is regulated by the convex portion 43, and the direction of the light emitting unit 20 is determined according to the convex portion 43. As described above, in the present embodiment, the light emitting unit 20 and the support member 40 are coupled by fitting the first through hole 25 to the convex portion 43, and the light emitting unit 20 is fixedly supported by the support member 40. Be done. In addition to this, when the light emitting unit 20 is fixed to the support member 40 by fitting the first through hole 25 to the convex portion 43, the alignment between the light emitting unit 20 and the support member 40 can be easily performed. Can.

The bonding between the lower end of the support member 40 and the base 50 uses, for example, an adhesive structure. The lower surface of the support member 40 is flat. The flat lower surface of the support member 40 is fixed (bonded) to the flat upper surface of the base 50 by an adhesive (not shown).

The support member 40 has a function of supporting the light emitting unit 20 inside the globe 10 and also has a function of transferring the heat generated in the semiconductor light emitting element 22 to the base 50 at the time of light emission. This heat transfer function can be implemented by using a material with high thermal conductivity. Examples of the material having high thermal conductivity include metals and ceramics. In the present embodiment, the support member 40 is made of, for example, aluminum.

The light emitting unit 20 can emit the light from the light emitting unit 20 downward as well by forming the mounting substrate 21 with a translucent material. For this reason, the support member 40 has a shape close to a rod-like shape as much as possible so as not to block the light emitted downward from the semiconductor light emitting element 22 (the light emitting unit 20).

That is, the middle region of the support member 40 is a cylindrical portion 47 having a circular cross section. The upper region of the support member 40 is a flat portion 48 having a flat shape (thin in the width direction) in the width direction of the rectangular mounting substrate 21. The lower region of the support member 40 is a frusto-conical cone 42 which increases in diameter as it approaches the base 50. As a result, the light emitted downward from the semiconductor light emitting element 22 and reaching the lower end of the support member 40 is easily reflected.

The support member 40 may be made of a translucent material (for example, a glass material) so as not to block the light emitted downward from the semiconductor light emitting element 22, or light is reflected on the surface of the support member 40. It may be processed to enhance its properties.

In addition, through

holes

44 and 45 for inserting the

lead wires

71 and 72 for electrically connecting the circuit unit 80 and the light emitting unit 20 are formed in the support member 40, and the lead 50 is also formed on the base 50. Through

holes

51 and 52 for inserting the

wires

71 and 72 respectively are formed.

The through holes 44, 45, and 51, 52 may be formed at different positions instead of being provided at substantially symmetrical positions with respect to the central axis of the support member 40 as shown in FIG. Instead of forming one lead wire for each of the

lead wires

71 and 72, a through hole having a size through which the two

lead wires

71 and 72 can be inserted is one each for the conical portion 42 and the base 50. It may be formed.

Further, though not visible in FIG. 1 as a shade, the support member 40 is provided with a through hole for inserting the antenna wire 91 at the back side of the conical portion 42 in FIG.

The length of the support member 40 is, for example, 20 to 40 mm, and the diameter of the cylindrical portion 47 of the support member 40 is, for example, 5 to 30 mm.

The longitudinal direction and the lateral direction of the mounting substrate 21 are 5 to 30 mm in a substrate diagonal direction, and the thickness is, for example, 1 to 1.6 mm.

(2-7. Antenna)
The antenna 90 is for transmitting and receiving radio signals from the outside, and is connected to the circuit unit 80 through the antenna wire 91. In the present embodiment, as shown in FIGS. 1 to 3, the antenna 90 is a helical antenna, and is helically wound around the support member 40. One end of an antenna wire 91 is attached to the end of the antenna 90 on the base 30 side, and the other end of the antenna wire 91 is connected to the antenna terminal 89 e of the circuit unit 80.

The antenna 90 is, for example, one used in the 2.4 GHz band, but is not limited to this, and an antenna adapted to a desired band to be used may be used. The length of the antenna 90 (the length in the vertical direction in a state of being attached to the support member 40) is, for example, 20 to 31.25 [mm], but the size and design of the support member 40, the

lead wire

71 , 72, and the wiring method of the antenna wire 91, as long as desired radio signal transmission / reception performance is satisfied, it may be changed as appropriate.
For example, when using in the 900 MHz band, it may be, for example, 80 to 83.3 [mm].

The directivity of the antenna 90 is preferably nondirectional. Alternatively, the antenna 90 and the antenna wire 91 may be integrally formed using a single metal wire.

The antenna 90 is helically wound around the support member 40 in the glove 10 as described above. According to such a configuration, for example, when the illumination light source 1 is used as a light source of a downlight illumination fixture (see FIG. 55), as compared to the case where the antenna 90 is housed in the case 60 Even if the antenna 90 is disposed in the glove, the antenna 90 is less susceptible to interference with wireless signal transmission and reception by a ceiling or the like, and wireless signal transmission and reception can be performed more reliably.

In the present embodiment, since the support member 40 is made of conductive aluminum, the support member 40 can also be used as an antenna. In this case, since the diameter of the support member 40 is larger than that of the helical antenna 90, the width of the frequency of radio waves that can be transmitted and received can be increased. Hereinafter, in the case where a conductive member such as aluminum is used as the support member, the support member may similarly function as an antenna in each embodiment and each modification.

(2-8. Circuit unit)
The circuit unit 80 transmits and receives a wireless signal from the outside, and controls the lighting of the semiconductor light emitting element 22 based on the wireless signal. The “lighting control” here includes, for example, lighting, extinguishing, light control, illumination color change, and the like.

The circuit unit 80 includes a circuit board 81 and various electronic components mounted on the circuit board 81, which will be described later in detail.

The circuit board 81 has a disk shape, and is fixedly accommodated in the case 60 with the main surface thereof being substantially orthogonal to the lamp axis J1.

The circuit board 81 is fixed to the inside of the case 60 using a locking structure. Specifically, the peripheral portion of the back surface (surface on the base 30 side) of the circuit board 81 is in contact with the step portion 63 inside the case 60, and the circuit board 81 is formed by the locking portion 65 provided on the inner surface of the large diameter portion 61. The surface of the base 50 (surface on the base 50 side) is locked.

The plurality of (for example, four) locking portions 65 are formed at intervals (for example, at equal intervals) in the circumferential direction. The locking portion 65 protrudes toward the central axis of the case 60 as it gets closer to the step portion 63, and the distance between the locking portion 65 and the step portion 63 corresponds to the thickness of the circuit board 81.

When mounting the circuit board 81, the circuit unit 80 is inserted from the upper side (large diameter portion 61 side) of the case 60, and when the back surface of the circuit board 81 reaches the locking portion 65, the circuit board 81 is further It is pushed downward to pass the locking portion 65. Thereby, the circuit board 81 is locked by the locking portion 65, and the circuit unit 80 is fixed to the case 60.

As shown in FIG. 3, the circuit unit 80 and the base 30 are electrically connected by

lead wires

74 and 75.

Further, although not shown, a wiring pattern is formed on the circuit board 81 by patterning, for example, a copper foil or the like, and a part of the wiring pattern is a signal transmission path to the antenna 90 described later. It has become.

Subsequently, the circuit configuration of the circuit unit 80 will be described below with reference to FIGS. 6 (a) and 6 (b) and FIG.

FIG. 6 (a) is a plan view of the circuit board 81 as viewed from the surface 81a side which is the upper side main surface thereof, and FIG. 6 (b) is a back surface which is the lower side main surface thereof. It is the top view seen from the 81b side. As shown in FIGS. 6A and 6B, the circuit unit 80 includes a circuit board 81, a rectifier circuit 85 disposed on the circuit board 81, a smoothing capacitor 86, a wireless control unit 820, and a light emitting element. The control unit 87, the wireless control unit power supply 84, the oscillator 83 for generating a clock signal for controlling the wireless control unit 820, the light emitting element control unit 87, etc., and other various electronic components 88 etc. .

In the present embodiment, electronic components of the SMD (Surface Mount Device) type are mounted on the surface 81 a side of the circuit board 81, and electronic components of the type mounted by lead wires are mounted on the back surface 81 b side. The

lead wires

71 and 72 are respectively connected to

output terminals

89c and 89d provided on the back surface 81b, and the antenna wire 91 is connected to an antenna terminal 89e provided on the back surface 81b. The

lead wires

74 and 75 are respectively connected to input

terminals

89a and 89b provided on the back surface 81b. The

lead wires

71 and 72 and the antenna wire 91 are wired from the

output terminals

89c and 89d and the antenna terminal 89e to the front surface 81a side through the notch 81c provided in the circuit board 81.

In the present embodiment, SMD type electronic components mounted on the front surface 81a are the oscillator 83, the wireless control unit power supply 84, the light emitting element control unit 87, etc., and are mounted by lead wires mounted on the back surface 81b. Type electronic components are the rectifier circuit 85, the smoothing capacitor 86, the wireless control unit 820, and the like.

FIG. 7 is a circuit diagram showing a circuit configuration of the circuit unit 80 according to the first embodiment.

As shown in FIGS. 1 to 3, the illumination light source 1 includes a light emitting unit 20, and a circuit unit 80 that transmits and receives a radio signal and controls lighting of a semiconductor light emitting element 22 (here, LED) based on the radio signal. And.

The light emitting unit 20 is, for example, two parallel connected series connected bodies in which ten LEDs are connected in series. The light emitting unit 20 receives supply of power from the AC power supply 19 via the switching circuit 810, and turns on the LED.

The circuit unit 80 mainly includes a rectifier circuit 85, a smoothing capacitor 86 (C1), a switching circuit 810, a control circuit 871, a wireless control unit 820, a wireless control unit power supply 84, and a lighting control signal detection unit 830. . The input side of the circuit unit 80 is connected to an AC power supply 19 via

input terminals

89a and 89b, and the output side is connected to the light emitting unit 20 via

output terminals

89c and 89d.

The outline of the function of the circuit unit 80 is as follows: AC power supplied from the AC power supply 19 by the lighting circuit including the rectifier circuit 85, the smoothing capacitor 86 (C1), the switching circuit 810, the control circuit 871, and the lighting control signal detector 830 The conversion to power for lighting the semiconductor light emitting element 22 and the output of the converted power to the semiconductor light emitting element 22 are performed. The wireless signal circuit including the antenna 90, the wireless control unit 820, and the wireless control unit power supply 84 performs transmission and reception of a wireless signal, conversion of the wireless signal into an electrical signal, and input and output of the electrical signal.

The rectifier circuit 85 full-wave rectifies the AC voltage supplied from the AC power supply 19, and the smoothing capacitor 86 (C1) smoothes it to a DC current.

The switching circuit 810 is a so-called step-down DC-DC converter that converts DC power supplied from the smoothing capacitor 86 (C1) into power for lighting the semiconductor light emitting element 22, and includes a switching element 811 and a diode D1. , An inductor L1, and a capacitor C2. By the power supply from the switching circuit 810, the light emitting unit 20 is lit.

The DC-DC converter includes single forward, flyback, push-pull, half bridge, full bridge, mag amp, step-down chopper, step-up chopper, and step-up / step-down chopper. Although the step-down chopper method is adopted in the present embodiment, any other method may be adopted.

The control circuit 871 is connected to the control terminal 811 g of the switching element 811. The control circuit 871 performs on / off control of the switching element 811 by giving a signal to the control terminal 811g, and steps down the DC voltage supplied from the smoothing capacitor 86 (C1) to a desired voltage. In the present embodiment, a field effect transistor (FET: Field Effect Transistor) is used as the switching element 811. The control terminal 811g corresponds to the gate of the FET, and the signal supplied to the control terminal 811g corresponds to the gate voltage.

The antenna 90 adopts a standard corresponding to a radio signal to be used. The wireless signal includes an instruction to turn on the lighting light source 1, but the frequency of the signal used as the wireless signal is not particularly limited. For example, it is possible to use radio signals in the universally available 2.4 [GHz] frequency band used in communication devices conforming to the IEEE (Institute of Electrical and Electronics Engineers) 802.15.4 standard. . In addition, there are frequency bands by region, and 433.05-434.79 [MHz], 863-870 [MHz] in Europe, 426-429 [MHz] in Japan, 915-956 [MHz], 260-470 in the US Use bands such as [MHz] and 902 to 928 [MHz] are secured separately. IEEE 802.15.4 is a name of a short distance wireless network standard called PAN (Personal Area Network) or W (Wireless) PAN.

The wireless communication using the wireless signal in the frequency band as described above has a short wavelength as compared with the conventional infrared communication. Therefore, good communication can be performed even when the line of sight between the transmitter side and the transceiver side (the antenna unit side) of the wireless signal is bad.

Furthermore, in the above-mentioned standard, mutual communication can be performed between the illumination light sources belonging to the group having the same address and being paired with the transmitter of the wireless signal without passing through the transmitter. Therefore, even if the transmitter can not transmit or receive a wireless signal, the illumination light source in the same group can transmit the same command as the wireless signal from the transmitter to the illumination light source that has not transmitted or received. As a result, the illumination light sources in the group paired with the transmitter are completely controlled. Such a function is effective, for example, when it is desired to uniformly control the lighting light sources provided over a very wide range, as in the case where the lighting control of a bulky lighting apparatus such as a chandelier is performed.

The wireless control unit 820 generates a lighting control signal for controlling power supply to the semiconductor light emitting device 22 based on the wireless signal transmitted and received by the antenna 90, and outputs the lighting control signal to the control circuit 871 of the light emitting device control unit 87. As the wireless control unit 820, for example, NXP JN 5142 or JN 5148 can be used. The wireless control unit 820 receives supply of power from the wireless control unit power supply 84.

The wireless signal transmitted and received by the antenna 90 is input to the first pin of the wireless control unit 820. The wireless signal input to the first pin of the wireless control unit 820 is amplified in the wireless control unit 820 and then converted to an electrical signal, and finally output from the fourth pin as a lighting control signal. Also, the second pin of the wireless control unit 820 is the ground terminal of the antenna 90, the third pin is the ground terminal, the fifth pin is the VDD input terminal, the sixth pin is a high voltage input terminal, and the seventh and eighth pins are inductors. It is an input / output terminal of L2.

The lighting control signal detection unit 830 detects the level of the lighting control signal output from the wireless control unit 820, and outputs a signal corresponding to the detected level to the third pin of the light emitting element control unit 87.

It is also possible to use an LED driver (corresponding to the light emitting element control unit 87) in which the control circuit 871 and the switching element 811 are sealed in one package. As such an LED driver, for example, MIP 551 of Panasonic Corporation or SSL 2108 of NXP Corporation can be used.

The first pin of the light emitting element control unit 87 is a power input terminal. The second pin of the light emitting element control unit 87 is a VDD supply terminal, and is used for operating voltages of the wireless control unit 820 and peripheral elements. A signal corresponding to the level detected by the lighting control signal detection unit 830 is input to the third pin of the light emitting element control unit 87. The light emitting element control unit 87 is configured to reduce the LED current of the internal oscillation circuit as the level decreases.

The fourth pin of the light emitting element control unit 87 is connected to the source of the switching element 811 and the ground. The fifth pin and the sixth pin of the light emitting element control unit 87 are a source and a drain of the switching element 811 respectively.

[3. Light distribution characteristics]
In the illumination light source 1 according to the present embodiment, the light emitting unit 20 is provided in the globe 10 at a position (for example, substantially the same position) corresponding to the light source (filament) position of the incandescent lamp. As a result, even if the illumination light source 1 is mounted on a conventional lighting device for an incandescent lamp, the light emitting unit 20 will be disposed at the position of the filament, and the light distribution characteristic similar to that when the incandescent lamp is mounted You can get it.

Further, since the light emitting unit 20 is configured using the light transmitting mounting substrate 21, light emitted downward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and is emitted from the globe 10 to the outside. .

Furthermore, by making the shape of the support member 40 supporting the semiconductor light emitting element 22 into an elongated rod shape, the ratio of the light emitted downward from the semiconductor light emitting element 22 by the support member 40 can be reduced. it can.

By making the support member 40 of a translucent material, the light reaching the support member 40 passes as it is, and the light reaching the inner surface of the glove 10 is transmitted through the glove 10 and emitted to the outside .

[4. Summary of the First Embodiment]
As described above, according to the configuration of the illumination light source 1 according to the first embodiment, the light emitting unit 20 having the semiconductor light emitting element 22 as the light source is supported by the support member 40 at the central position in the glove 10. This makes it possible to obtain good light distribution characteristics close to the light distribution characteristics of the incandescent lamp.

Furthermore, since the antenna 90 is attached to the support member 40 and the illumination light source 1 is mounted on the illumination device, the antenna 90 is positioned inside the relatively exposed globe 10, Compared to the case where the antenna is housed inside the case 60, the transmission and reception of the wireless signal is less likely to be disturbed, and the transmission and reception of the wireless signal can be performed more reliably.

In addition, since a translucent member is used for the mounting substrate 21 on which the semiconductor light emitting device 22 is mounted, light emitted downward from the semiconductor light emitting device 22 is transmitted through the mounting substrate 21 and the globe 10 is formed. , And further transmit through the glove 10 and are emitted to the outside. As a result, the amount of light emitted to the lower side of the illumination light source 1 can be increased, and better light distribution characteristics can be obtained.

In addition, by making the support member 40 into an elongated rod-like shape, the ratio of the light emitted downward from the semiconductor light emitting element 22 by the support member 40 can be reduced. As a result, the amount of light emitted to the lower side of the illumination light source 1 can be increased, and better light distribution characteristics can be obtained.

Second Embodiment
In the first embodiment, the configuration in which the antenna 90, which is a helical antenna, is helically wound and attached around the support member 40 has been described as an example.

However, the manner in which the antenna is provided to the support member 40 is not limited to this. In the second embodiment, a configuration in which a rod antenna is provided to the support member 40 will be described. In addition, in order to avoid duplication of description, about a component same as 1st and 2nd embodiment, a same sign is attached | subjected and the description is abbreviate | omitted. The same applies to each embodiment and each modification below.

FIG. 8 is a cross-sectional view of the illumination light source 100 according to the second embodiment, taken along the straight line corresponding to the line A-A 'in FIG.

In the illumination light source 100 according to the second embodiment, the support member 140 has a hollow structure having a space 140 a inside, and a rod antenna (long cylindrical shape) is formed inside the space 140 a ( A communication hole 146 in which an antenna 190 which is a pole antenna) is accommodated, and an antenna wire 91 connected to the lower end of the antenna 190 communicates from the space 140a of the support member 140 to the lower end surface of the support member 140; It differs from the illumination light source 1 according to the first embodiment in that it is inserted into the through hole 153 provided in the pedestal 150.

The antenna 190 is, for example, one used in the 2.4 GHz band, but is not limited thereto, and an antenna adapted to a desired band to be used may be used. The length of the antenna 190 is, for example, 20 to 31.25 mm, and the diameter is 1 to 30 mm. However, the size and design of the support member 140, the

lead wires

71 and 72, and the antenna The wiring method of the line 91 may be appropriately changed as long as the desired radio signal transmission / reception performance is satisfied.

The directivity of the antenna 190 is preferably nondirectional.

The light emitting unit 20 is attached to the upper end portion of the support member 140, and the light emitting unit 20 and the circuit board 81 are electrically connected by

lead wires

71 and 72. The lead wire 71 is inserted through the through hole 144 provided in the conical portion 142 of the support member 140 and the through hole 151 provided in the base 150. The lead wire 72 is inserted through the through hole 145 provided in the conical portion 142 of the support member 140 and the through hole 152 provided in the base 150. The through

holes

144, 145 and 151, 152 are for passing the

lead wires

71, 72, and the through holes having a size through which the two

lead wires

71, 72 can be inserted are the conical portion 142 and the base Each of the pedestals 150 may be formed one by one. Also, as shown in FIG. 8, it may be formed at another position other than the position across the support member 440.

As described above, also in the configuration of the illumination light source 100 according to the second embodiment, the antenna 190 is disposed inside the glove 10 in a state of being housed inside the support member. As compared with the case of being housed in the housing, the transmission and reception of the wireless signal is less likely to be inhibited, and the transmission and reception of the wireless signal can be performed more reliably. Further, in the present embodiment, the antenna 190 is housed inside the support member 140 Because of this, the support member 140 is composed of a non-conductive member. Examples of the nonconductive member include glass and ceramic, but in the present embodiment, glass is used. Thereby, the light emitted from the semiconductor light emitting element 22 of the light emitting unit 20 to the lower side of the mounting substrate 21 passes through the support member 140, reaches the lower side of the globe 10, and exits from there. Because of this, better light distribution characteristics can be realized.

When the support member 140 is made of a nonconductive member such as glass or ceramic, the support member 140 may be integrally formed in a state in which the antenna 190 is included. In such a case, the antenna 190 is closely accommodated in the support member 140 without providing a space 140 a as a gap between the support member 140 and the antenna 190 in the inside of the support member 140. It is also good. The same applies to

modifications

2, 4 and 6 to be described later.

Third Embodiment
In the first embodiment, a configuration in which the antenna 90 which is a helical antenna is helically wound and attached around the support member 40 will be described. In the second embodiment, a rod antenna is used. The configuration in which a certain antenna 190 is housed inside the support member 140 has been described.

However, the aspect in which the antenna is provided inside the glove 10 is not limited to these.

Fig.9 (a) is an external appearance perspective view which shows schematic structure of the light source 200 for illumination which concerns on 3rd Embodiment. FIG. 9 (b) is a plan view of the light emitting unit 220 in the illumination light source 200.

In the illumination light source 200 according to the present embodiment, an antenna 290 is formed on the surface of the mounting substrate 21 of the light emitting unit 220. The antenna 290 is a PCB antenna (print antenna), and is formed in a rectangular wave shape on a mounting substrate using an aluminum thin film or the like. As shown in FIG. 9B, in the present embodiment, the antenna 290 is at one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25 and a central portion in the lateral direction of the mounting substrate 21, That is, it is provided between the two sealing bodies 23. At the end closer to the feed terminal 24b of the antenna 290, an antenna terminal 292 to which one end of the antenna wire 91 is connected is formed, and at the center of the antenna terminal 292, the mounting substrate 21 and the antenna terminal 292 are provided. A through hole 293 penetrating is formed. Although not shown in FIG. 9B, one end of the antenna wire 91 opposite to the side connected to the circuit unit 80 is inserted into the through hole 293, and the conductive bonding member 73 made of solder or the like is used. The antenna terminal 292 and the antenna wire 91 are connected. The antenna wire 91 is inserted through the through hole 246 formed in the conical portion 242 of the support member 240 and the insertion hole (not shown) formed in the base 250, and is connected to the circuit unit 80 (see FIG. 3).

The antenna 290 is, for example, one used in the 2.4 GHz band, but is not limited thereto, and an antenna adapted to a desired band to be used may be used. The length of the antenna 290 (the length in the longitudinal direction of the mounting substrate 21) is, for example, about 20 to 31.25 [mm], but the size of the mounting substrate 21, the arrangement of the semiconductor light emitting elements 22, the sealing body The configuration may be changed as appropriate as long as the desired wireless signal transmission / reception performance is satisfied, depending on the arrangement mode of 23 and the position on the mounting substrate 21 where the antenna 290 is formed.

Further, the directivity of the antenna 90 is preferably nondirectional.

The supporting member 240 is different from the supporting member 40 in the illumination light source 1 according to the first embodiment in that the supporting member 240 is formed of a translucent member such as glass, but is the same as the supporting member 40. It has a shape. In the support member 240 shown in FIG. 9A, the through hole 246 for inserting the antenna wire 91 is drawn on the front side in the drawing, but in the support member 40 shown in FIG. It is not shown in FIG. 1 as it is formed and can not be seen behind the cone 42.

Further, the through

holes

244 and 245 may be formed at other positions instead of being provided at substantially symmetrical positions with respect to the central axis of the support member 240 as shown in FIG. Instead of being formed one by one for each of 72, one through hole having a size that allows the two

lead wires

71 and 72 to be inserted may be formed in the conical portion 242.

As described above, also in the configuration of the illumination light source 200 according to the third embodiment, the same effects as those of the first and second embodiments can be obtained. That is, the antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 as a PCB antenna, and is disposed inside the globe 10. As a result, when the illumination light source 200 is attached to the illumination device, the antenna 290 is positioned inside the relatively exposed globe 10, so the antenna is housed inside the case 60 and In comparison, transmission and reception of radio signals are less likely to be inhibited, and radio signals can be transmitted and received more reliably.

In addition, the light emitting portion 220 having the semiconductor light emitting element 22 as a light source is supported by the support member 240 at a central position in the globe 10, thereby obtaining good light distribution characteristics close to the light distribution characteristics of the incandescent lamp. be able to.

In addition, since a translucent member is used for the mounting substrate 21 on which the semiconductor light emitting device 22 is mounted, light emitted downward from the semiconductor light emitting device 22 is transmitted through the mounting substrate 21 and the globe 10 is formed. , And further transmit through the glove 10 and are emitted to the outside. As a result, the amount of light emitted to the lower side of the illumination light source 200 can be increased, and better light distribution characteristics can be obtained.

In addition, since the support member 240 is configured using a translucent member, light emitted downward from the semiconductor light emitting element 22 passes through the support member 340 without being blocked by the support member 240. Then, it reaches the glove 10 and is emitted to the outside from there. As a result, the amount of light emitted to the lower side of the illumination light source 200 can be increased, and better light distribution characteristics can be obtained.

In the present embodiment, the antenna 290 is formed on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but is not limited to this. For example, the antennas 290 may be provided on both end sides in the longitudinal direction of the mounting substrate 21 from the first through holes 25. In this case, one pair of antennas 290 may be respectively provided on the one end side and the other end side, and the antennas 290 on both ends may be integrally formed. Further, the antenna 290 is not limited to the surface of the mounting substrate 21, and may be formed on the back surface of the mounting substrate 21 or may be formed on the side surface of the mounting substrate 21. In the case where one antenna 290 is provided on each end, the antenna terminal 292 may be provided on each longitudinal end and the antenna wire 91 may be connected to each. In this case, two antenna wires 91 respectively connected to both antenna terminals 292 may be integrated into one and connected to the circuit unit 80.

Fourth Embodiment
In the illumination light source 200 according to the third embodiment, the configuration in which the PCB antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 has been described, but the antenna provided on the mounting substrate 21 is limited to the PCB antenna. I can not.

FIG. 10A is an external perspective view showing a schematic configuration of the illumination light source 300 according to the fourth embodiment. FIG. 10B is a plan view of the light emitting unit 320 in the illumination light source 300.

The illumination light source 300 according to the present embodiment has the antenna 390 formed on the surface of the mounting substrate 21 of the light emitting unit 320, and the antenna 390 is a chip antenna that is an SMD in the third embodiment. It differs from the illumination light source 200 according to FIG.

Further, as shown in FIG. 10B, in the present embodiment, the antenna 390 is at one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25 and the center of the mounting substrate 21 in the lateral direction. That is, it is provided between the two sealing bodies 23. An antenna terminal 392 to which one end of the antenna wire 91 is connected is formed on the surface of the mounting substrate 21. The antenna 390 is connected to the antenna terminal 392 by solder or the like. A through hole 393 is formed in the central portion of the antenna terminal 392 so as to penetrate the mounting substrate 21 and the antenna terminal 392. Although not shown in FIG. 10B, one end of the through hole 393 on the opposite side of the side connected to the circuit unit 80 of the antenna wire 91 is inserted, and the conductive bonding member 73 made of solder or the like is used. The antenna terminal 392 and the antenna wire 91 are connected.

The antenna 290 is, for example, one used in the 2.4 GHz band, but is not limited thereto, and an antenna adapted to a desired band to be used may be used. As the antenna 390, for example, AN048 manufactured by Texas Instruments may be used. In this case, the size of the antenna 390 is 2 mm in length (corresponding to the width direction of the mounting substrate 21) and in width (mounting substrate 21 corresponding to the longitudinal direction) 7 mm, height (corresponding to the vertical direction) 3 mm.

The chip antenna used for the antenna 390 is not limited to the above, and the size is the size of the mounting substrate 21, the arrangement of the semiconductor light emitting elements 22, the arrangement of the sealing body 23, and the antenna 290 Depending on the position on the mounting substrate 21 to be processed, as long as the desired radio signal transmission / reception performance is satisfied, it may be changed as appropriate.

Further, the directivity of the antenna 90 is preferably nondirectional.

As described above, also in the configuration of the illumination light source 300 according to the fourth embodiment, the same effects as those of the first, second, and third embodiments can be obtained. That is, the antenna 390 is mounted on the mounting substrate 21 of the light emitting unit 320 as a chip antenna and disposed inside the glove 10. As a result, when the illumination light source 300 is attached to the illumination device, the antenna 390 is positioned inside the relatively exposed globe 10, so that the antenna is housed inside the case 60. In comparison, transmission and reception of radio signals are less likely to be inhibited, and radio signals can be transmitted and received more reliably.

In addition, the light emitting unit 320 having the semiconductor light emitting element 22 as a light source is supported by the support member 240 at a central position in the glove 10, thereby obtaining good light distribution characteristics close to the light distribution characteristics of the incandescent lamp. be able to.

In addition, since a translucent member is used for the mounting substrate 21 on which the semiconductor light emitting device 22 is mounted, light emitted downward from the semiconductor light emitting device 22 is transmitted through the mounting substrate 21 and the globe 10 is formed. , And further transmit through the glove 10 and are emitted to the outside. As a result, the amount of light emitted to the lower side of the illumination light source 300 can be increased, and better light distribution characteristics can be obtained.

In addition, since the support member 240 is configured using a translucent member, light emitted downward from the semiconductor light emitting element 22 passes through the support member 240 without being blocked by the support member 240. Then, it reaches the glove 10 and is emitted to the outside from there. As a result, the amount of light emitted to the lower side of the illumination light source 300 can be increased, and better light distribution characteristics can be obtained.

In the present embodiment, the antenna 390 is mounted on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but the present invention is not limited to this. For example, the antennas 390 may be provided on both end sides in the longitudinal direction of the mounting substrate 21 from the first through holes 25. In addition, the antenna 390 is mounted on the back surface of the mounting substrate 21 without being limited to the front surface of the mounting substrate 21. In the case where one antenna 390 is provided on each end, the antenna terminal 392 may be provided on each longitudinal end, and the antenna wire 91 may be connected to each. In this case, two antenna wires 91 respectively connected to both antenna terminals 392 may be integrated into one and connected to the circuit unit 80.

In addition, the through

holes

244 and 245 may be formed at different positions instead of being provided at substantially symmetrical positions with respect to the central axis of the support member 240 as shown in FIG. Instead of being formed one by one for each of 72, one through hole having a size that allows the two

lead wires

71 and 72 to be inserted may be formed in the conical portion 242.

«Modification»
The configuration of the present invention has been described above based on the first, second, third, and fourth embodiments, but the present invention is not limited to the above embodiments, and the following modifications may be implemented. it can. In addition, in order to avoid duplication of description, about a component same as 1st, 2nd, 3rd, and 4th embodiment, a same sign is attached | subjected and the description is abbreviate | omitted.

(Modification 1)
In the first embodiment, the mounting substrate 21 of the light emitting unit 20 has a rectangular shape in plan view, but the present invention is not limited to this.

FIG. 11 is an external perspective view showing a schematic configuration of the illumination light source 400 according to the first modification. The illumination light source 400 includes, as its main components, a globe 10, a light emitting unit 420, a support member 440, a base 450, a case 60, a base 30, an antenna 90 which is a helical antenna,

lead wires

71 and 72, and the like. Although not shown in FIG. 11, a circuit unit 80 (see FIG. 3) is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by an antenna wire 91 (see FIG. 3). There is.

In the illumination light source 400, the mounting substrate 421 of the light emitting unit 420 has a disk shape, and a plurality of semiconductor light emitting elements 422 are mounted in a ring shape on the surface of the disk mounting substrate 421. The sealing body 423 is formed in an annular shape so as to cover all the semiconductor light emitting elements 422. The mounting substrate 421 is configured using a translucent member. As the translucent member, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a translucent resin substrate, or the like is used. Here, the plurality of semiconductor light emitting devices 422 have the same configuration as the semiconductor light emitting device 22 described in the first embodiment, but different configurations, for example, emission color, output (luminance) are different. It may be something.

The sealing body 423 is made of a translucent material. Since the semiconductor light emitting device 422 emits light of the same color as the semiconductor light emitting device 22 of the first embodiment, the wavelength of light from the semiconductor light emitting device 422 is converted to a desired (yellow) as in the first embodiment. A wavelength conversion material is mixed in the translucent material. Note that the sealing body 423 has an annular shape when viewed in plan, but may be formed, for example, in a dome shape (circular shape when viewed in plan).

The base 450 has a disk shape like the base 50 of the first embodiment. The base 450 has a support member 440 erected at the center of the surface in plan view, and a lead wire electrically connecting the circuit unit (80) and the light emitting unit 420 at a position across the support member 440. The through

holes

451 and 452 through which the

holes

71 and 72 are inserted are provided.

Since the

lead wires

71 and 72 are inserted through the through

holes

451 and 452 provided in the base 450, the support member 440 is not provided with the through holes for inserting the

lead wires

71 and 72, and the antenna wire Only through holes (not shown) for inserting (91) are formed. However, the through holes for the antenna wires may be provided in the base 450 instead of being provided in the support member 440. The support member 440 has the same basic configuration as the support member 40 of the illumination light source 1 according to the first embodiment except that the through holes for the lead wires are not provided, and the support members A member similar to 40 (in this case, aluminum) is used to form a similar elongated rod-like shape.

The through

holes

451 and 452 are for passing the

lead wires

71 and 72, and one through hole having a size through which the two

lead wires

71 and 72 can be inserted may be formed. It may be formed at another position other than the position across the member 440.

The end portions of the

lead wires

71 and 72 on the side of the light emitting unit 420 are inserted from the bottom to the top through the through holes provided in the mounting substrate 421 and fixed by the conductive bonding member 73 such as solder on the upper surface of the mounting substrate 421 And electrically connected with the wiring pattern.

The same effect as the illumination light source 1 according to the first embodiment can be obtained also by the configuration of the illumination light source 400 according to the first modification. That is, the light emitting unit 420 is supported by the support member 440 at the center position in the glove 10, whereby good light distribution characteristics close to the light distribution characteristics of the incandescent lamp can be obtained, and the antenna 90 is a support member. Because it is attached to the 440 and disposed inside the glove 10, transmission and reception of radio signals are less likely to be impeded as compared with the case where the antenna is housed inside the case 60, and transmission and reception of radio signals are made more reliable. It can be carried out.

Furthermore, a light transmitting member is used for the mounting substrate 421, and light emitted downward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 421 and emitted to the lower side of the globe 10. In the elongated rod-like shape, the ratio of the light emitted downward from the semiconductor light emitting element 22 by the support member 440 can be reduced, whereby the light source 400 for illumination is directed downward. The amount of light emitted can be increased to obtain better light distribution characteristics.

In the present modification, the mounting substrate 421 has a disk-like shape (the shape in a plan view is circular), but is not limited thereto. The shape in a plan view is a polygon such as a hexagon or an octagon, or a heart It may be indeterminate form such as shape.

(Modification 2)
The illumination light source 400 according to the modification 1 is an example in which the light emitting unit 420 having the disk-shaped mounting substrate 421 is applied to the configuration instead of the light emitting unit 20 of the illumination light source 1 according to the first embodiment. The

However, the light emitting unit 420 of the first modification is not limited to the above, and may be applied to the illumination light source 100 according to the second embodiment.

FIG. 12 is a partially cutaway perspective view showing a schematic configuration of the illumination light source 500 according to the second modification. The illumination light source 500 includes, as its main components, a globe 10, a light emitting unit 420, a support member 540, a base 550, a case 60, a base 30, an antenna 190 which is a rod antenna,

lead wires

71 and 72, and the like. In FIG. 12, a part of the case 60 and the part other than the base 30 are shown as cross-sectional views. Further, the circuit unit 80 is accommodated inside the case 60, and in FIG. 12, only a part of the circuit unit 80 is visible from the notch portion of the case 60.

In the illumination light source 500 according to the second modification, an antenna 190, which is a rod antenna (pole antenna) having a long rod-like (cylindrical) shape, is accommodated in a space 540a inside the support member 540. A communication hole 546 communicating the bottom surface of the space 540 a with the lower end surface of the support member 540 is formed at the lower end portion of the support member 540. A through hole 553 is formed at a position facing the communication hole 546 of the base 550. The antenna wire 91 is connected to the lower end portion of the antenna 190, and the antenna wire 91 is inserted into the communication hole 546 and the through hole 553 and connected to the circuit unit 80.

The base 550 is disk-shaped like the base 150 of the second embodiment. The base 550 has a support member 540 erected at the center of its surface in plan view, and the lead wire 71 electrically connects the circuit unit 80 and the light emitting unit 420 at a position across the support member 540, The through

holes

551 and 552 through which the holes 72 are inserted are provided.

Since the

lead wires

71 and 72 are inserted through the through

holes

551 and 552 provided in the base 550, the support member 540 is not provided with the through holes for inserting the

lead wires

71 and 72, and the antenna wire Only the communication hole 546 for inserting 91 is formed. The supporting member 540 has the same basic configuration as the supporting member 140 except that the through hole is not provided, except for the supporting member 140 of the illumination light source 100 according to the second embodiment. A member similar to the member 140 (in this case, glass) is used to form a similar elongated rod-like shape.

The through

holes

551 and 552 are for passing the

lead wires

71 and 72, and one through hole having a size through which the two

lead wires

71 and 72 can be inserted may be formed. Instead of sandwiching the support member 540 as shown at 12, it may be formed at another location.

Also by the configuration of the illumination light source 500 according to the second modification, the same effect as the illumination light source 100 according to the second embodiment can be obtained. That is, the light emitting unit 420 is supported by the support member 540 at the center position in the glove 10, whereby good light distribution characteristics close to the light distribution characteristics of the incandescent lamp can be obtained, and the antenna 190 is a support member. Because the antenna is housed inside the glove 10 in a state housed inside the 540, transmission and reception of wireless signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 60, and transmission and reception of wireless signals are made more It can be done surely.

Furthermore, as in the first modification, a translucent member is used for the mounting substrate 421, and light emitted downward from the semiconductor light emitting element 22 passes through the mounting substrate 421 and is emitted to the lower side of the globe 10. In addition, by making the support member 440 into an elongated rod-like shape, the ratio of the light emitted downward from the semiconductor light emitting element 22 by the support member 440 can be reduced, thereby making it possible for illumination By increasing the amount of light emitted to the lower side of the light source 400, better light distribution characteristics can be obtained.

(Modification 3)
In each of the illumination light sources according to the first to third embodiments and the modified examples 1 and 2, the light emitting unit formed by mounting the semiconductor light emitting element 22 as a light source on a single plate-like mounting substrate The configuration provided has been described. However, the structure of the light emitting unit is not limited to these, and may be configured to include the light emitting unit having a more three-dimensional structure.

FIG. 13 is an external perspective view showing a schematic configuration of the illumination light source 600 according to the third modification. The illumination light source 600 includes, as its main components, a glove 10, a light emitting unit 620, a support member 440, a base 450, a case 60, a base 30, an antenna 90 which is a helical antenna,

lead wires

71 and 72, and the like. Although not shown in FIG. 13, the circuit unit 80 (see FIG. 3) is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by the antenna wire 91 (see FIG. 3). There is.

In the illumination light source 600, the light emitting unit 620 is configured in a rectangular parallelepiped shape by combining six square mounting substrates 621 on which a plurality of SMD type semiconductor light emitting elements 622 are mounted. The respective mounting substrates 621 are fixed to each other using an adhesive or the like, whereby the rectangular parallelepiped-like shape is maintained. The light emitting unit 620 is supported inside the glove 10 by the support member 440 in such a manner that one of the corners of the rectangular parallelepiped pierces the support member 440. An adhesive or the like is used for the bonding portion between the mounting substrate 621 of the light emitting unit 620 and the support member 440, whereby the light emitting unit 620 is fixedly supported by the support member 440. The fixing method of the light emitting unit 620 to the support member 440 is not limited to the adhesive, and an engagement structure, a stopper, or the like may be used.

The semiconductor light emitting device 622 is obtained by packaging a light emitting device corresponding to the semiconductor light emitting device 22 and a sealing body covering the same as one chip. The luminescent color of the light emitting element, the material configuration of the sealing body, and the wavelength conversion characteristic are the same as those of the semiconductor light emitting element 22 and the sealing body 23, respectively.

Although SMD type semiconductor light emitting device 622 is used in this modification, the present invention is not limited to this, and like the semiconductor light emitting device 22 in the first to fourth embodiments and the first and second modifications, a mounting substrate is used. What formed the sealing body 23 on the semiconductor light emitting element of the type directly formed on it may be used.

One end of each of the

lead wires

71 and 72 is connected to a different mounting substrate 621, and the other end is connected to the circuit unit 80 housed in the case 60 through the through

holes

451 and 452 of the base 450, respectively. There is.

Although not shown in FIG. 13, each mounting substrate 621 is electrically connected by a lead wire inside the light emitting unit 620, whereby each mounting substrate 621 is electrically connected to the circuit unit 80. ing.

The illumination light source 600 according to the third modification has the same basic configuration as the illumination light source 400 according to the first modification shown in FIG. 11 except that the light emitting unit 620 having a rectangular parallelepiped structure is used. is there.

Also in the illumination light source 600 according to the present modification, since the antenna 90 is attached to the support member 440 and disposed inside the glove 10, compared with the case where the antenna is housed inside the case 60, wireless Transmission and reception of signals are less likely to be inhibited, and radio signals can be transmitted and received more reliably.

In addition, the light emitting unit 620 is three-dimensionally configured to have a rectangular parallelepiped shape, and the mounting boards 621 are attached at different angles with respect to the lamp axis. Therefore, the main emission directions of the light of the semiconductor light emitting elements 622 mounted on the respective mounting substrates 621 are different. Furthermore, since the light emitting portion 620 is supported by the support member 440 at a central position in the glove 10, the light emitted from the semiconductor light emitting element 622 is emitted in substantially all directions, and good light distribution characteristics can be obtained. .

In the present modification, as described above, the light emitting unit 620 has a three-dimensional structure, and the light emitted from the semiconductor light emitting element 622 is emitted in substantially all directions. The submount substrate of the element 622 is not particularly assumed to be made of a translucent member, but a translucent member may be used for both substrates. In that case, it is preferable to use a translucent member for both substrates.

(Modification 4)
In the third modification, the configuration in the case where the light emitting unit 620 having a three-dimensional structure is applied to the illumination light source 400 according to the first modification has been described.

However, the light emitting unit 620 of the third modification is not limited to the above, and may be applied to the illumination light source 500 according to the second modification.

FIG. 14 is a partially cutaway perspective view showing a schematic configuration of a lighting light source 700 according to the fourth modification. The illumination light source 700 includes, as its main components, a globe 10, a light emitting unit 620, a support member 540, a base 550, a case 60, a base 30, an antenna 190 which is a rod antenna,

lead wires

71 and 72, and the like. In FIG. 14, the light emitting unit 620, a part of the case 60, and the part other than the base 30 are shown as cross-sectional views. Further, the circuit unit 80 is accommodated inside the case 60, and in FIG. 14, only a part of the circuit unit 80 is visible from the notch portion of the case 60. The antenna 190 and the circuit unit 80 are connected by an antenna wire 91.

The illumination light source 700 according to the fourth modification has the same basic configuration as the illumination light source 500 according to the second modification shown in FIG. 12 except that the light emitting unit 620 having a rectangular parallelepiped structure is used. is there.

Further, as can be understood from the fact that the same reference numerals are used, the light emitting unit 620 of the illumination light source 700 according to the present modification is the same as the light emitting unit 620 of the illumination light source 600 according to the modification 3 shown in FIG. It has composition.

Also in the illumination light source 700 according to this modification, the same effect as the illumination light source 600 of the third modification can be obtained. That is, since the antenna 190 is disposed inside the glove 10 in a state of being housed inside the support member 540, transmission and reception of wireless signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 60. The transmission and reception of wireless signals can be performed more reliably.

In addition, since light emitted from the light emitting portion 620 supported at the center position in the glove 10 and having a rectangular solid-like shape is emitted in substantially all directions, it is possible to obtain good light distribution characteristics.

Also in this modification, the mounting substrate 621 and the submount substrate of the semiconductor light emitting element 622 may be made of a translucent member, in which case the mounting substrate 621 and the semiconductor light emitting element 622 Preferably, translucent members are used for both of the submount substrates.

(Modification 5)
The three-dimensional shape of the light emitting part capable of obtaining good light distribution characteristics is not limited to the cube-like shape as shown in the third and fourth modifications.

FIG. 15 is an external perspective view showing a schematic configuration of an illumination light source 900 according to the fifth modification. The illumination light source 900 includes a globe 10, a light emitting unit 920, a support member 440, a base 450, a case 60, a base 30, an antenna 90 which is a helical antenna,

lead wires

71 and 72, and the like as its main components. Although not shown in FIG. 15, the circuit unit 80 (see FIG. 3) is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by the antenna wire 91 (see FIG. 3). There is.

In the illumination light source 900, the light emitting unit 920 is configured in a triangular pyramid shape by combining four triangular mounting substrates 921 on which a plurality of SMD type semiconductor light emitting elements 622 are mounted. The respective mounting substrates 921 are fixed to each other using an adhesive or the like, whereby the triangular pyramid-like shape is maintained. The light emitting unit 920 is supported inside the glove 10 by the support member 440 in such a manner that one of the corners of the triangular pyramid is stuck in the support member 440. An adhesive or the like is used for the bonding portion between the mounting substrate 921 of the light emitting unit 920 and the support member 440, whereby the light emitting unit 620 is fixedly supported by the support member 440. The fixing method of the light emitting unit 920 to the support member 440 is not limited to the adhesive, and an engagement structure, a stopper, or the like may be used.

One end of each of the

lead wires

71 and 72 is connected to a different mounting substrate 921 and the other end is connected to the circuit unit 80 housed in the case 60 through the through

holes

451 and 452 of the base 450, respectively. There is.

Although not shown in FIG. 15, each mounting substrate 921 is electrically connected by a lead wire inside the light emitting portion 920, whereby each mounting substrate 921 is electrically connected to the circuit unit 80. ing.

The illumination light source 900 according to the fifth modification is the same as the third modification shown in FIG. 13 except that a light emitting part 920 having a triangular pyramidal structure is used instead of the light emitting part 620 having a rectangular parallelepiped structure. The basic configuration is the same as that of the illumination light source 600.

Also in the illumination light source 900 according to the present modification, the antenna 190 is disposed inside the glove 10 in a state of being housed inside the support member 540, compared with the case where the antenna is housed inside the case 60. As a result, transmission and reception of wireless signals are less likely to be inhibited, and transmission and reception of wireless signals can be performed more reliably.

In addition, the light emitting unit 920 is three-dimensionally configured to have a triangular pyramidal shape, and the light of the semiconductor light emitting element 622 mounted on one of the mounting substrates 921 as shown in FIG. Supported by the support member 440 such that the main emission direction of the light source is upward (parallel to the lamp axis) and the main emission direction of the light of the semiconductor light emitting element 22 on another mounting substrate 921 is obliquely below the illumination light source 900. ing. Furthermore, since the light emitting portion 620 is supported by the support member 440 at a central position in the glove 10, the light emitted from the semiconductor light emitting element 622 is emitted in substantially all directions, and good light distribution characteristics can be obtained. .

Also in this modification, as described above, the light emitting portion 920 has a three-dimensional structure, and the light emitted from the semiconductor light emitting element 622 is emitted in substantially all directions. The submount substrate of the element 622 is not particularly assumed to be made of a translucent member, but a translucent member may be used for both. In that case, it is preferable to use a translucent member for both substrates.

(Modification 6)
The light emitting unit 920 in the fifth modification can also be applied to the illumination light source 700 according to the fourth modification.

FIG. 16 is a partially cutaway perspective view showing a schematic configuration of the illumination light source 1000 according to the sixth modification. The illumination light source 1000 includes, as its main components, a globe 10, a light emitting unit 920, a support member 540, a base 550, a case 60, a base 30, an antenna 190 which is a rod antenna,

lead wires

71 and 72, and the like. In FIG. 16, the light emitting unit 920, a part of the case 60, and the part other than the base 30 are shown as cross-sectional views. Further, the circuit unit 80 is accommodated inside the case 60, and in FIG. 16, only a part of the circuit unit 80 is visible from the notch portion of the case 60. The antenna 190 and the circuit unit 80 are connected by an antenna wire 91.

The illumination light source 1000 according to the sixth modification has the same basic configuration as the illumination light source 700 according to the fourth modification shown in FIG. 14 except that the light emitting unit 920 having a triangular pyramidal structure is used. It is.

Further, as can be understood from the fact that the same reference numerals are used, the light emitting unit 920 of the illumination light source 1000 according to the present modification is the same as the light emitting unit 920 of the illumination light source 900 according to the modification 5 shown in FIG. It has composition.

Also in the illumination light source 1000 according to the present modification, the same effect as the illumination light source 900 of the fifth modification can be obtained. That is, since the antenna 190 is attached to the support member 540 and disposed inside the glove 10, transmission and reception of wireless signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 60, and wireless Signal transmission and reception can be performed more reliably.

In addition, light emitted from the light emitting portion 920 supported at the center position in the glove 10 and having a triangular pyramid-like shape is emitted in substantially all directions, so that good light distribution characteristics can be obtained.

Also in this modification, the mounting substrate 921 and the submount substrate of the semiconductor light emitting element 622 may be made of a translucent member, in which case the mounting substrate 921 and the semiconductor light emitting element 622 are Preferably, translucent members are used for both of the submount substrates.

(Modification 7)
The configuration in which the semiconductor light emitting device is supported in the glove is not limited to the configuration in which the light emitting unit including the semiconductor light emitting device is supported by the rod-like support member as in the above embodiments and the modifications. For example, the following modifications can be considered.

FIG. 17 is an external perspective view showing a schematic configuration of the illumination light source 1100 according to the seventh modification, and FIG. 18 is a cross-sectional view of a plane of the illumination light source 1100 including the lamp axis J3.

As shown in FIGS. 17 and 18, the illumination light source 1100 includes, as main components, a globe 1110, a light emitting unit 1120,

support members

1140b and 1140c, a base 1150, a case 1160, a base 30, and an antenna 190 as a rod antenna. , Lead

wires

71, 72 and the like. A circuit unit 80 is accommodated in the case 1160. The antenna 190 and the circuit unit 80 are connected by an antenna wire 91.

In the illumination light source 1100 according to the seventh modification, a mounting substrate 1121a having an annular shape on which a plurality of SMD type semiconductor light emitting elements 1122 are mounted in an annular shape is mounted on the peripheral portion of the upper surface of the base 1150. A cylindrical support member 1140 b is placed inside the annular ring of the semiconductor light emitting element 1122 mounted on the mounting substrate 1121 a. A plurality of semiconductor light emitting elements 1122 are mounted in an annular shape, and a mounting substrate 1121 b having an annular shape with an outer diameter slightly smaller than the outer diameter of the support member 1140 b is mounted on the upper surface of the support member 1140 b. Further, a cylindrical support member 1140c is mounted inside the annular ring of the semiconductor light emitting element 1122 mounted on the mounting substrate 1121b, the semiconductor light emitting element 1122 is mounted, and the outer diameter of the support member 1140c is larger than the outer diameter A mounting substrate 1121c having a slightly smaller diameter disk shape is mounted on the upper surface of the support member 1140c. The mounting substrate 1121 a is fixed on the base 1150 with an adhesive or the like. The mounting substrate 1121 b is fixed on the support member 1140 b by an adhesive or the like. The mounting substrate 1121 c is also fixed on the support member 1140 c by an adhesive or the like. In addition, fixation of said each mounting substrate is not restricted to an adhesive agent, You may carry out by engagement, screwing, etc.

A recess is formed on the upper surface of the support member 1140b with a size to which the mounting substrate 1121b just fits, and a top surface of the support member 1140c has a recess with a size to which the mounting substrate 1121c just fits. Thus, positioning can be easily performed when mounting the mounting

substrates

1121 b and 1121 c on the

support members

1140 b and 1140 c, respectively.

The mounting substrate 1121 a and the mounting substrate 1121 b are electrically connected by two lead wires 76 inside the cylinder of the support member 1140 b. The mounting substrate 1121 b and the mounting substrate 1121 c are electrically connected by two lead wires 77 inside the cylinder of the support member 1140 c. One end of each of the two lead wires 78 is connected to the mounting substrate 1121a inside the cylinder of the support member 1140b. The lead wires 78 are respectively inserted into the through

holes

1151 and 1152 provided in the base 1150, and the other ends of the lead wires 78 are connected to the circuit unit 80. As a result, the mounting

boards

1121 a, 1121 b and 1121 c are electrically connected to the circuit unit 80.

The SMD type semiconductor light emitting device 1122 is different from the SMD type semiconductor light emitting device 622 in the modified examples 3 to 6 in the shape of the package (622 is square or rectangular when viewed in plan, but 1121 is The basic configuration is the same except that it is circular in plan view).

A concave portion 1154 is formed at a central portion of the base 1150 and at a position corresponding to the inner side of the annular ring of the mounting substrate 1121a, and the lower end of the antenna 190 is fitted to the concave portion 1154 to thereby mount the antenna 190. It is fixedly held in the space 1140 a formed by the

support members

1140 b and 1140 c, the mounting

substrates

1121 a, 1121 b and 1121 c, and the base 1150. One end of the antenna wire 91 is connected to the lower end of the antenna 190, and the antenna wire 91 is in communication with the recess 1154 and is inserted into the communication hole 1153 provided in the base 1150. It is connected to the circuit unit 80.

The antenna 190 may be more stably fixed to the base 1150 by applying an adhesive or the like between the base 1150 and the antenna 190. Furthermore, instead of the fitting and the adhesive, the antenna 190 may be fixedly held to the base 1150 by an engagement structure, screwing, or the like.

The light emitting unit 1120 of the illumination light source 1100 according to the seventh modification has a step structure like a wedding cake, so to speak, and is emitted from the semiconductor light emitting element 1122 mounted on the mounting substrate on the lower side. The light is blocked by the support member on the upper side and the mounting substrate disposed in the main emission direction, so if the heights of the

support members

1140 b and 1140 c are too high, good light distribution characteristics can not be obtained. Therefore, in the illumination light source 1100, a globe 1110 having a shorter length in the vertical direction is used in place of the globe shaped to simulate a bulb of an incandescent lamp. Along with this, a case 1160 in which the length in the vertical direction is longer is used. The basic configuration of the glove 1110 and the case 1160 is basically the same as that of the glove 10 and the case 60 in the illumination light source 1 except that the lengths in the vertical direction are different (that is, the shapes are different) as described above. It is the same.

Also according to the configuration of the illumination light source 1100 according to the present modification, the antenna 190 is disposed inside the glove 1110 in a state of being housed in the space 1140 a, compared to the case where the antenna is housed inside the case 60. As a result, transmission and reception of wireless signals are less likely to be inhibited, and transmission and reception of wireless signals can be performed more reliably.

The light distribution characteristics are also mounted on the mounting

substrates

1121 b and 1121 c by using light transmitting members for the

support members

1140 b and 1140 c, the mounting

substrates

1121 b and 1121 c, and the submount substrate of the semiconductor light emitting element 1122. Of the light emitted from the semiconductor light emitting element 1122, the light emitted downward is transmitted through the submount substrate, each support member, and each mounting substrate, reaches the lower side of the globe 1110, and is transmitted to the outside from there. Since the light is emitted, it is possible to obtain a somewhat better light distribution characteristic.

In this modification, although antenna 190 which is a rod antenna was arranged in glove 1110 in the state where it was stored in space 1140a, it is not restricted to this. For example, a helical antenna may be spirally wound and attached to the outer peripheral surface of the cylinder of the

support members

1140 b and 1140 c.

(Modification 8)
FIG. 19 is an external perspective view showing a schematic configuration of the illumination light source 1200 according to the eighth modification, and FIG. 20 is a cross-sectional view of a plane of the illumination light source 1200 including the lamp axis J4.

As shown in FIGS. 19 and 20, the illumination light source 1200 includes, as main components, a globe 10, a light emitting unit 1220, a base 1250, a case 60, a base 30, an antenna 190 which is a rod antenna, and lead

wires

71 and 72. Etc. A circuit unit 80 is accommodated in the case 60. The antenna 190 and the circuit unit 80 are connected by an antenna wire 91.

In the illumination light source 1200 according to the eighth modification, a rectangular mounting substrate 1221 on which a plurality of (eight in the case of this modification) semiconductor light emitting elements 1222 which are shell-type LEDs are mounted in a row has its longitudinal direction up and down A light emitting unit 1220 configured to form a hollow polygonal prism (an octagonal prism in the case of the present modification) like a plurality in combination in a manner that matches the direction is provided. The lower end portion of each mounting substrate 1221 constituting the polygonal pillar is fixed to the base 1250 by being fitted into a recessed portion 1255 provided on the upper surface of the base 1250. The upper end of the polygonal prism is covered with a disc-shaped lid portion 1243.

One end of the lead wire 71 is connected to one of the plurality of mounting substrates 1221 and one end of the lead wire 72 is connected to the other one. The

lead wires

71 and 72 are respectively inserted into the through

holes

1251 and 1252 provided in the base 1250, and the other ends of the

lead wires

71 and 72 are connected to the circuit unit 80. The mounting boards 1221 other than the mounting board to which the

lead wires

71 and 72 are connected are connected by the lead wires (not shown) between adjacent mounting boards, whereby each mounting board 1221 electrically connects with the circuit unit 80. Connected.

A recess 1254 is formed in the center of the upper surface of the base 1250, and the lower end of the antenna 190 is fitted to the recess 1254, whereby the antenna 190 is fixed to the base 1250. It is held in the inner space 1221a. One end of an antenna wire 91 is connected to the lower end of the antenna 190, and the antenna wire 91 is in communication with the recess 1254 and is inserted into a communication hole 1253 provided in the base 1250. It is connected to the circuit unit 80.

The antenna 190 may be more stably fixed to the base 1250 by applying an adhesive or the like between the base 1250 and the antenna 190. Furthermore, instead of the fitting and the adhesive, the antenna 190 may be fixedly held to the base 1250 by an engagement structure, screwing, or the like.

In the illumination light source 1200 according to the eighth modification, the mounting substrate 1221 also serves as a support member for supporting the semiconductor light emitting element 1222 as a light source inside the glove.

Even with the configuration of the illumination light source 1200 according to the present modification, the antenna 190 is disposed inside the glove 10 in a state of being housed in the space 1221 a, so compared to the case where the antenna is housed inside the case 60. As a result, transmission and reception of wireless signals are less likely to be inhibited, and transmission and reception of wireless signals can be performed more reliably.

In addition, since the semiconductor light emitting element 1222 mounted on the upper side of each mounting substrate 1221 is at a position close to the center position inside the globe 10, it is possible to obtain good light distribution characteristics to some extent.

In this modification, although antenna 190 which is a rod antenna was arranged in glove 10 in the state where it was stored in space 1221a, it is not restricted to this. For example, a helical antenna may be spirally wound and attached to the outer peripheral surface of the polygonal prism of the mounting substrate 1221 in a manner avoiding the semiconductor light emitting element 22. In this case, since the antenna is made of a conductor such as metal, it is preferable that the wiring be formed on the inner surface (the side forming the inner side of the polygonal prism) of each mounting substrate 1221.

(Modification 9)
Although the whole of the rod antenna is accommodated in the inside of the support member in each of the embodiments and the modifications, the present invention is not limited to this. For example, the following modification can be considered.

FIG. 21 is an external perspective view showing a schematic configuration of a lighting light source 1300 according to the ninth modification. In the illumination light source 1300, a concave portion 1349 in which one end of each of two rod antennas 1390 is provided in the conical portion of the support member 1340 (in FIG. 21, only one located on the front side of the drawing is shown). And the remaining part extends outward from the support member 1340.

Even with the configuration of the illumination light source 1300 according to the present modification, since the antenna 1390 is disposed inside the glove 10 in a state of being attached to the support member 1340, comparison with the case where the antenna is housed inside the case 60 As a result, transmission and reception of wireless signals are less likely to be inhibited, and transmission and reception of wireless signals can be performed more reliably.

In addition, since the light emitting unit 20 is supported at the central position inside the glove 10 by the support member 1340, good light distribution characteristics can be obtained.

In the illumination light source 1300 according to the present modification, although the example in which the antenna 1390 is applied to the illumination light source 1 according to the first embodiment has been described, the present invention is not limited thereto. For example, the illumination light source according to the second, third, and fourth embodiments or the above-described and the following modifications may be configured to include the antenna 1390.

(Modification 10)
In each of the embodiments and the modifications described above, the case where a helical antenna or a rod antenna is used as an antenna has been described as an example, but the antenna to be used is not limited to these. For example, in addition to the above, an antenna of a size that can be stored in the glove 10, such as a single type, a dipole type, a loop type, a diversity type or a film antenna may be used. When a diversity antenna is used, a plurality of diversity antennas may be provided to combine and use the signals received by each. Furthermore, the position at which the antenna is disposed is not limited to the peripheral surface and the inside of the support member and on the mounting substrate of the light emitting portion, as long as the light distribution characteristics such as the base and the inner surface of the globe are not adversely affected. It may be placed at any position inside the glove. In the case of using a film antenna configured using a translucent member, it can be attached to the inside of the glove, and in particular, the film on the inner surface of the region exposed to the outside most when attached to the lighting device of the glove. By attaching the antenna, the transmission and reception of the wireless signal is the least likely to be disturbed, so the effect of the present invention that the transmission and reception of the wireless signal can be reliably performed can be most expected.

(Modification 11)
Although the shape of the antenna 190 in the said 2nd Embodiment and

modification

2, 4, 6, 7, 8, 9 was cylindrical, it is not restricted to this. For example, it may be a polygonal prism such as a quadrangular prism (rectangular parallelepiped) or a hexagonal prism, or it may be a columnar body having an irregular cross section (for example, a heart shape). Further, the size of the diameter of the antenna 190 does not have to be constant over the entire width in the longitudinal direction, and the diameter may be reduced from one end to the other, or from one end to the other The shape may be such that the increase and decrease of the diameter is repeated once or a plurality of times as it goes. Furthermore, the antenna 190 does not have to be configured as a single rod-like member, and a plurality of parts may be combined to form a rod-like shape, or a metal wire or the like may be wound around the rod-like member. (A helical antenna may be helically wound).

(Modification 12)
The antenna 290 (PCB antenna) in the third embodiment and the antenna 390 (chip antenna) in the fourth embodiment have the disk-like mounting substrate 421 in the first and second modifications and the mounting substrate in the third and fourth variations. 621, the mounting substrate 921 in the fifth and sixth modifications, the mounting

substrates

1121 a, 1121 b and 1121 c in the seventh modification, and the mounting substrate 1221 in the eighth modification.

(Modification 13)
In each of the above embodiments and modifications, a part of the heat generated in the light emitting portion is transmitted to the base through the support member, further transmitted from the base to the case, and then to the base and the lighting device from the base The heat is dissipated to the ceiling and the like. At that time, the heat transferred to the case is conducted from there to the circuit board 81 to increase the thermal load of the circuit unit 80. Furthermore, since the circuit unit 80 is accommodated in the substantially sealed narrow space inside the case, heat is easily accumulated when the air inside the case is warmed by the heat transmitted to the case, and in addition, the circuit Since the heat generated by the electronic component itself of the unit 80 is also less likely to be dissipated, the heat load applied to the circuit unit 80 is further increased.

Among the electronic components that make up the circuit unit 80, the life may be greatly influenced by the influence of heat. Therefore, in order to secure the long life of the circuit unit, it is important to suppress the heat load on the circuit unit 80.

FIG. 22 is a cross-sectional view showing a schematic configuration of the illumination light source 1400 according to the modification 13.

The illumination light source 1400 includes, as main components, a globe 1410, a light emitting unit 20, a support member 40, a base 50, a case 60, a base 30, an antenna 90 which is a helical antenna,

lead wires

71 and 72, and the like. Further, the circuit unit 80 is accommodated in the case 60, and the antenna 90 and the circuit unit 80 are connected by the antenna wire 91.

The globe 1410 has the globe 10 of the illumination light source 1 according to the first embodiment in that the length in the vertical direction of the opening end 1410 c is longer than the thickness (length in the vertical direction) of the base 1450. Except for the difference, the basic configuration is the same as the glove 10.

The base 1450 has no step on its peripheral edge, and the diameter is substantially equal over the entire width in the vertical direction, and the diameter corresponds to the inner diameter of the open end 1410 c of the glove 1410 (ie, The basic configuration is the same as that of the base 50 except that it is slightly smaller than the inner diameter of the opening end 1410 c but substantially equal.

The diameter of the opening side end 1410c of the globe 1410 is set to be slightly smaller than the diameter of the cylindrical portion 1410b, and a step 1410d is formed at the joint portion of both. The outer diameter of the opening side end 1410 c corresponds to the inner diameter of the upper end side opening of the large diameter portion 61 of the case 60.

The base 1450 is fixed to the open end 1410 c by the adhesive 56 in a state of being inserted into the open end 1410 c of the glove 1410.

The open end 1410 c of the glove 1410 is fixed to the large diameter portion 61 by the adhesive 57 in a state of being inserted into the upper end opening of the large diameter portion 61 of the case 60. At this time, the upper end surface of the large diameter portion 61 abuts on the step 1410 d and the downward movement of the glove 1410 is locked.

For the adhesive 56, an adhesive having high thermal conductivity is used, and for the adhesive 57, an adhesive having low thermal conductivity is used. As the low thermal conductive adhesive, for example, a silicone resin adhesive, an epoxy resin adhesive or the like may be used. As an adhesive having high thermal conductivity, for example, fine particles having high thermal conductivity such as metal powder (for example, aluminum filler) are mixed into a silicone resin adhesive, an epoxy resin adhesive, etc. to enhance thermal conductivity. You may use what.

According to the configuration of the illumination light source 1400 according to the present modification, the heat from the light emitting unit 20 conducted along the support member 40 to the base 1450 is transmitted through the adhesive 56 having high thermal conductivity to the heat of the globe 1410. It is easy to transmit to the open end 1410 c. And since the adhesive 57 interposed between the open end 1410 c and the large diameter portion 61 of the case 60 is an adhesive with low thermal conductivity, the heat transmitted to the open end 1410 c is transmitted from there. It is difficult to transmit to case 60. As a result, the heat conduction from the case 60 to the circuit unit 80 is suppressed, and furthermore, the air inside the case 60 in which the circuit unit 80 is accommodated is less likely to be warmed, so the heat load received by the circuit unit 80 is suppressed. be able to.

Further, similarly to the illumination light source 1 according to the first embodiment, the light emitting unit 20 is supported inside the glove 1410 by the support member 40, and the antenna 90 is spirally wound around the support member and taken out. Since it is worn, the effect that the transmission and reception of the wireless signal can be performed more reliably and the effect that a good light distribution characteristic is obtained can be expected as well.

(Modification 14)
In addition to the circuit for lighting the semiconductor light emitting element, the illumination light source having the function of receiving and controlling the radio signal for lighting includes a circuit for transmitting and receiving the radio signal, and these circuits are configured. The electronic components that are included include components that are susceptible to heat load. In particular, a driver (wireless control unit) that controls a wireless signal is susceptible to heat.

However, in the configuration in which the heat from the LED light emitting module is conducted to the base and the heat is dissipated from the base, the casing located between the LED light emitting module and the base when the heat from the LED light emitting module is transferred to the base Because the heat is transferred, the temperature of the housing and the internal space of the housing rises, and the heat load on the circuit unit housed inside the housing increases.

Furthermore, in recent years, development of brighter illumination light sources has been promoted, and with the increase in the brightness of illumination light sources, the amount of heat emitted from the LED increases, and the problem of increased thermal load on the circuit unit increases. There is. In addition, LEDs have a long life, and circuits (electronic parts) for lighting such LEDs are also required to have a long life.

Therefore, it is also possible to implement the following modification.

The entire configuration of the illumination light source according to the modification 14 of the present invention will be described with reference to FIGS. 23 to 26.

[1. overall structure]
FIG. 23 is an external perspective view showing a schematic configuration of the illumination light source 1500 according to the modification 14. FIG. 24 is an exploded perspective view of the illumination light source 1500. FIG. 25 is an arrow sectional view of the illumination light source 1500 taken along the line CC ′ shown in FIG. FIG. 26 is a cross-sectional view of the illumination light source 1500 taken along the line DD ′ shown in FIG. In FIG. 25 and FIG. 26, the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J5 of the illumination light source 1500.

As shown in FIGS. 23 to 26, the illumination light source 1500 according to the modification 14 of the present invention is a bulb-type lamp replacing an incandescent bulb, and is an LED lamp using an LED as a semiconductor light emitting element as a light source. It is. The illumination light source 1500 includes, as its main components, a translucent globe 1510, a light emitting unit 20 including a semiconductor light emitting element 22 (see FIG. 5) which is a light source, and a cap 30 for receiving power from the outside. And a support member 1540 for supporting the light emitting unit 20 in the glove 1510. The open end of the glove 1510 is integrally connected to the stem 1550, and a case 1560, which is a housing, is attached to the end. The case 1560 has a tubular shape. A base 30 is attached to one end of the case 1560 (the end on the rear side in FIGS. 23 to 27). The opening on the other end side (the front side in FIGS. 23 to 27) of the case 1560 is closed by a stem 1550. A circuit unit 80 is stored inside the case 1560. A support member 1540 is attached to the stem 1550 in the direction of extension into the glove 1510. A convex portion 1553a is formed on the upper end of the joint portion 1553 of the stem 1550, and the support member 1540 is attached to the joint portion 1553 by engaging with a concave portion 1544 formed on the lower end of the support member 1540. So to speak, the stem 1550 is a base on which the support member 1540 is erected. The light emitting unit 20 is attached to the tip of the support member 1540 in the extending direction (upper side). In addition, what integrated the glove and the stem may be called a valve.

[2. Configuration of each part]
Hereinafter, each component of the illumination light source 1500 according to the modification 14 of the present invention will be described in detail with reference to FIGS. 23 to 26.

(2-1. Glove)
The globe 1510 has a shape similar to a bulb (also referred to as a glass bulb) of an incandescent bulb (a bulb having a filament), and is a so-called A type.

As shown in FIG. 24, the globe 1510 is composed of a hollow spherical portion 1510a and a cylindrical portion 1510b. The cylindrical portion 1510 b reduces in diameter as it is separated from the spherical portion 1510 a in the lamp axial direction. An opening is present at the end of the cylindrical portion 1510 b opposite to the spherical portion 1510 a, and the opening is closed by the stem 1550. In addition, let the edge part by which this opening exists be an opening side edge part.

The globe 1510 is made of a translucent material. Examples of translucent materials include glass materials and resin materials such as acrylics. Here, the glove 1510 is made of, for example, a glass material.

(2-2. Case)
The case 1560 has the same shape as the portion close to the base 30 of the bulb of the incandescent lamp. In the present embodiment, the case 1560 has the large diameter portion 1561 in the glove 1510 side half in the direction of the central axis (lamp axis J5), and the small diameter portion 1562 in the mouthpiece half, and the large diameter portion 1561 and the small diameter portion 1562 There is a step 63 between them.

A stepped portion 1566 is annularly provided in the circumferential direction on the front side (upper end side) inner circumferential surface of the large diameter portion 1561 of the case 1560, and a stem 1550 integrally connected with the glove 1510 is attached to the case 1560 The lower end portion 1551b1 of the flange portion 1551b of the stem 1550 is placed on the step 1566, and the large diameter upper end portion of the cylindrical portion 1510b of the flange portion 1551b and the globe 1510 and the large diameter portion 1561 of the case 1560 An adhesive 1556 such as a resin is filled in a space between the inner peripheral surface of the 1561a and the like, and the integrated glove 1510 and stem 1550 and the case 1560 are fixed to each other. Thus, the upper end side opening of the case 1560 is closed by the stem 1550 as described above.

A base 30 is screwed to the small diameter portion 1562 of the case 1560. In the present modification, the base 30 is an Edison type. Therefore, the outer periphery of the small diameter portion 1562 is a male screw, and is screwed into the base 30. Thus, the base 30 and the case 1560 are screwed together.

Further, in the small diameter portion 1562 of the case 1560, a groove 1564 is formed which extends in parallel with the direction in which the central axis of the case 1560 extends. The groove 1564 is for fixing the lead 75 connecting the base 30 and the circuit unit 80 (for restricting the movement of the lead 75).

The case 1560 is made of a resin material such as polybutylene terephthalate (PBT). In addition, in order to adjust the heat conductivity of case 1560, you may use what mixed glass fiber etc. in the resin material, for example.

As described above, the case 1560 has the shape of the large diameter portion 1561 similar to an incandescent lamp as a whole in a state where the glove 1510 is attached to the upper end and the cap 30 is attached to the lower end. The diameter increases in a curved manner as it moves from the base 30 side to the globe 1510 side.

The case 1560 has a function of releasing the heat generated by the circuit unit 80 housed inside the case 1560 when the lighting light source 1500 is lit, to the outside. Heat is released by heat conduction from the case 1560 to the outside air, convection of the outside air, radiation, and the like.

The case 1560 has the opening at the upper end side thereof closed by the stem 1550 as described above and the opening at the lower end side closed by the base 30 to have a substantially sealed space inside. The circuit unit 80 is accommodated in this space.

(2-3. Stem)
The stem 1550 is integrally connected to the glove 1510 and inserted into the large diameter portion 1561 of the case 1560. The stem 1550 comprises a dome-shaped flare 1551, an exhaust pipe 1552, and a joint 1553. The exhaust pipe 1552, which will be described in detail later, is a thin tube for evacuating the air inside the glove 1510 and for filling the filling fluid 12 instead. The joint portion 1553 is provided on the top of the dome of the flare 1551 and has a convex portion 1553a at its upper end for attaching a support member 1540 described later.

The stem 1550 has an outer diameter corresponding to the inner surface of the large diameter portion 1561 of the case 1560 because the stem 1550 is inserted into the inside of the case 1560. Here, the inner peripheral surface of case 1560 corresponds to the outer diameter of stem 1550, and the cross-sectional shape of the inner peripheral surface of large diameter portion 1561 is circular, so the lower end of the dome of flare 1551 Also in plan view, the shape is circular.

The flare 1551 is composed of a flare head 1551a (see FIG. 27) including the top of the dome and a flange portion 1551b (see FIG. 27) extending in the form of a ridge below the flare head 1551a (see FIG. 27). When the stem 1550 is inserted into the large diameter portion 1561 of the case 1560, the lower end of the collar portion 1551b abuts on the upper surface of the step portion 1566 provided on the inner circumferential surface of the large diameter portion 1561. Thereby, positioning of the stem 1550 can be easily performed.

Here, as described above, the stem 1550 is joined to the case 1560 by the adhesive 1556 in a state of being inserted into the large diameter portion 1561 of the case 1560.

In addition,

lead wires

71 and 72 and an antenna wire 91 described later are sealed to the stem 1550.

(2-4. Support member)
The support member 1540 supports the light emitting unit 20 at a central position inside the glove 1510. Here, the central position is a position corresponding to the light source (filament) position in the incandescent lamp, and is, for example, substantially the same position as the position where the filament is disposed in the incandescent lamp. The support member 1540 has a rod-like shape, and the upper end is coupled to the light emitting unit 20 and the lower end is attached to the joint 1553 of the stem 1550. That is, the support member 1540 is provided on the stem 1550 in a state of extending from the stem 1550 into the inside of the glove 1510.

The connection between the upper end portion of the support member 1540 and the light emitting unit 20 uses, for example, an engagement structure. A protrusion 1543 is formed substantially at the center of the upper surface 1541 of the support member 1540. A first through hole 25 is formed substantially at the center of the mounting substrate 21 of the light emitting unit 20. That is, the first through hole 25 is provided at the central portion in the longitudinal direction and the lateral direction of the mounting substrate 21, and is provided between the two sealing bodies 23 in the present embodiment. The shape of the convex portion 1543 and the shape of the first through hole 25 correspond to each other, and the convex portion 1543 of the upper surface 1541 of the support member 1540 is inserted into the first through hole 25 of the mounting substrate 21 of the light emitting unit 20 The mounting substrate 21 is placed on the upper surface 1541 of the support member 1540 so as to fit.

The connection between the support member 1540 and the light emitting unit 20 is not limited to the engagement structure, and an adhesive or the like may be used, for example.

In addition, the light emitting unit 20 is disposed such that the surface on which the plurality of semiconductor light emitting elements 22 are mounted is directed to the top of the globe 1510. That is, the semiconductor light emitting element 22 is planarly disposed with its main oblique direction facing the front of the illumination light source 1500.

A recess 1544 (see FIG. 25) is formed at the lower end of the support member 1540, and the support member 1540 is attached (coupled) to the stem 1550 by fitting the protrusion 1553a of the joint portion 1553 to the recess 1544. ing. The connection between the support member 1540 and the stem 1550 is not limited to the above fitting, and an adhesive or the like may be used. In the case of using an adhesive, the joint portion 1553 can be omitted. That is, an adhesive may be used to attach the support member directly to the top of the flare 1551.

As a material for forming the support member 1540, a material having high thermal conductivity (heat dissipation) is used. Examples of the material having high thermal conductivity include metals and ceramics. In the present embodiment, the support member 1540 is made of, for example, aluminum. Details will be described later.

The light emitting unit 20 can emit light from the light emitting unit 20 to the rear by forming the mounting substrate 21 with a light transmitting material. For this reason, the support member 1540 has a shape close to a rod shape as much as possible so as not to block the light emitted rearward from the semiconductor light emitting element 22 (light emitting unit 20).

That is, the rear side region of the support member 1540 is a cylindrical portion 1547 having a circular cross section. The front side region of the support member 1540 is a flat portion 48 having a flat shape (thin in the width direction) in the width direction of the rectangular mounting substrate 21.

The support member 1540 may be made of a translucent material (for example, a glass material) so as not to block the light emitted backward from the semiconductor light emitting element 22, or light is reflected on the surface of the support member 1540. It may be processed to enhance its properties.

The length of the support member 1540 is, for example, 20 to 40 mm, and the diameter of the cylindrical portion 1547 of the support member 1540 is, for example, 5 to 30 mm.

[3. Heat dissipation and heat load]
As described above, among the electronic components that constitute the circuit unit 80, components that are vulnerable to heat load are included, and in particular, the wireless control unit 820 that controls wireless signals is susceptible to heat. When the heat generated in the semiconductor light emitting element 22 of the light emitting unit 20 is transferred to the case 1560, the temperature in the case 1560 is raised to increase the thermal load received by the wireless control unit 820. Therefore, the proportion of the heat transmitted to the globe 1510 among the heat generated in the semiconductor light emitting element 22 is increased to dissipate heat from the globe 1510, thereby reducing the proportion of the heat transmitted from the semiconductor light emitting element 22 to the case 1560 It is possible to suppress an increase in heat load received by the control unit 820.

As shown in FIGS. 23, 26 and 27, the inside of the glove 1510 is filled with the filling fluid 12. The filling fluid 12 functions as a medium and a heat conduction path for thermally conducting the heat generated in the semiconductor light emitting element 22 of the light emitting unit 20 to the globe 1510. As the fluid to be used as the filling fluid 12, there are a gas and a liquid, and in either case, a fluid having a heat conductivity higher than that of air and light transmissivity is used. In the present embodiment, the filling fluid 12 is a gas, specifically, for example, helium (He) gas. The advantages of using helium gas include inertness, low cost, and no concern about depletion.

Further, the volume and filling ratio of helium gas enclosed in the globe 1510 (the ratio of the volume of helium gas to the volume inside the glove 1510) are not particularly limited. Even when the inside of the globe 1510 closed by the stem 1550 is not completely filled with helium gas, the heat transfer from the light emitting unit 20 to the globe 1510 as compared to the case where the helium gas is not enclosed in the glove 1510 at all. It is possible to promote

The gas used as the filling fluid 12 is not limited to helium gas, and neon (Ne) gas may be used as a gas having thermal conductivity higher than that of air, and oxygen is present in the glove 1510. Otherwise, hydrogen (H) gas may be used. Specific examples of the liquid used for the filling fluid 12 include water and silicone oil. When water is used,

lead wires

71 and 72, antenna wire 91,

feed terminals

24a and 24b on the mounting substrate 21, wiring pattern 27, and conductivity are provided to prevent problems due to deterioration due to rust or occurrence of short circuit. Of the members disposed inside the globe 1510, such as the bonding member 73, the antenna 90, the support member 1540, those which may be corroded by water and those which may cause an electrical failure are all coated with resin or the like. You should keep it in mind.

Further, the support member 1540 has a function of supporting the light emitting unit 20 inside the globe 1510, and the heat generated in the semiconductor light emitting element 22 with the filling fluid 12 at the time of transferring the heat to the globe 1510 via the filling fluid 12. It also functions to increase the heat transfer efficiency by increasing the contact area (envelope volume). That is, part of the heat generated in the semiconductor light emitting element 22 at the time of light emission is transmitted to the support member 1540 via the mounting substrate 21, but at this time, the light emitting unit 20 directly to the globe 1510 via the filling fluid. In addition to heat transfer, heat transfer from support member 1540 to glove 1510 via fill fluid 12. Therefore, when a material with high heat dissipation (high thermal conductivity) is used for the support member 1540, the heat generated in the semiconductor light emitting element 22 can be conducted to the globe 1510 more efficiently. Examples of the material having high thermal conductivity include metals and ceramics. In the present embodiment, the support member 1540 is made of, for example, aluminum.

As described above, since the illumination light source 1500 according to this embodiment is filled with the filling fluid 12 having a thermal conductivity higher than that of air in the glove 1510, the air is sealed in the glove in the related art. The heat generated in the semiconductor light emitting element 22 is easily transmitted to the globe 1510 as compared with the illumination light source of the above. As a result, of the heat generated in the semiconductor light emitting element 22, the rate of heat radiation from the globe 1510 can be increased to reduce the rate of heat transferred from the support member 1540 to the case 1560, thereby reducing the case 1560 internal space The thermal load received by the circuit unit 80, in particular, the thermal load received by the wireless control unit 820, can be suppressed by suppressing the temperature rise of the circuit unit 80. And, the long life of the wireless control unit can be realized, and good quality can be stably secured over a long period of time.

Note that when an adhesive with low thermal conductivity is used as the adhesive 1556, thermal conduction to the case 1560 can be suppressed more efficiently.

[4. Light distribution characteristics]
Also in the illumination light source 1500 according to this modification, the light emitting unit 20 is provided in the globe 1510 at a position (for example, substantially the same position) corresponding to the light source (filament) position of the incandescent lamp. As a result, even when the illumination light source 1500 is attached to a conventional lighting device for an incandescent lamp, the light emitting unit 20 is disposed at the position of the filament, and characteristics similar to the light distribution characteristics when the incandescent lamp is attached You can get it.

In addition, since the light emitting unit 20 is configured using the light transmitting mounting substrate 21, light emitted rearward from the semiconductor light emitting element 22 passes through the mounting substrate 21 and is emitted from the globe 1510 to the outside. .

Furthermore, by making the shape of the support member 1540 supporting the semiconductor light emitting device 22 into a long and thin rod shape, the ratio of the light emitted backward from the semiconductor light emitting device 22 by the support member 1540 can be reduced. it can.

By forming the supporting member 1540 with a translucent material, the light reaching the supporting member 1540 passes as it is, and the light reaching the inner surface of the globe 1510 is transmitted through the globe 1510 and emitted to the outside. .

[5. Manufacturing method of light source for illumination]
A method of manufacturing the illumination light source 1500 will be described based on FIGS.

(5-1. Flare formation process)
First, a method of forming a flare will be described below with reference to FIGS.

FIG. 27 is a view for explaining the process of forming the flare 1551 in the manufacturing process of the illumination light source 1500, wherein (a) and (a ′) show the state before forming the flare, (b) ) And (b ′) are diagrams showing a state after forming a flare. (A) and (b) are arrow sectional views along a line corresponding to the line DD ′ in FIG. 23, and (a ′) and (b ′) are (a) and (b) respectively. Is a sectional view taken along the line EE ′ in FIG.

As shown in FIGS. 27B and 27B, the flare 1551 is made of, for example, glass in the present embodiment, and the

lead wires

71 and 72 and the antenna wire 91 are sealed to the flare 1551, for example. The exhaust pipe 1552 is fused. The flare 1551 includes a flare head 1551a in which the

lead wires

71 and 72 are sealed, and a lower side from the flare head 1551a (in the case where it is finally assembled as the illumination light source 1500. Hereinafter, the method of manufacturing the illumination light source In the description, the “upper” and the “lower” indicate the “upper” and the “lower” in the case of being assembled as the illumination light source 1500, respectively.

As shown in FIGS. 27 (a) and 27 (a '), the flare 1551 is formed by processing a flared tube 1551', and the straight portion 1551'a of the flared tube 1551 'is heated by the burner 9 A part of the glass is melted, and as shown in FIGS. 27B and 27B, it is combined with the upper end portion of the glass capillary 1552 to form a flare head 1551a. Further, the flared portion 1551 ′ b becomes a collar portion 1551 b without melting and deformation. A part of the flange portion 1551 b is melt-bonded to the lower end portion of the cylindrical portion 1510 b of the globe 1510 in the glove sealing step.

The thin tube 1552 ′ is processed into an exhaust pipe 1552. An exhaust pipe 1552 is used to exhaust the air inside the glove 1510 and to fill the inside of the glove 1510 with the filling fluid 12. The upper end portion of the thin tube 1552 ′ is fused to the flare head 1551 a of the flare 1551. On the other hand, the lower end portion of the thin tube 1552 ′ is sealed after filling the filling fluid 12 in the globe 1510. Details of these will be described later.

(5-2. Joint formation process)
Next, a process of forming a joint for attaching (connecting) the support member 1540 to the flare 1551 will be described.

FIG. 28 is a view showing a process subsequent to FIG. 27, wherein (a) and (a ′) show the state before forming the joint portion, and (c) and (c ′) are forming the joint portion It is a figure which shows the state of the back, and (b), (b ') is a figure which shows the state in the middle. (A), (b) and (c) are arrow sectional views along the line corresponding to the line DD 'in FIG. 23, and (a'), (b ') and (c') These are arrow sectional views along the EE 'line in (a), (b) and (c) respectively.

As shown in FIGS. 28 (a) and 28 (a '), first, the lower end surface of the joint member 1553' is heated by the burner 9 to be softened. The joint member 1553 'is here made of, for example, glass. Then, the lower end portion of the softened joint member 1553 'is placed on the top of the flare head 1551a of the flare 1551, as shown in FIGS. 28 (b) and 28 (b'). Then, the periphery of the contact portion between the lower end of the joint member 1553 'and the flare head 1551a is heated and melted by the burner 9, and the lower end of the joint member 1553' and the flare head 1551a are integrated, as shown in FIG. As shown in (c ′), the joint portion 1553 integrated with the flare 1551 is formed.

When mounting the joint member 1553 'on the flare head 1551a, the lower end portion of the joint member 1553' is heated and softened by the burner 9, whereby the lower end portion of the joint member 1553 'becomes the shape of the flare head 1551a. As it can be deformed together, the joint member 1553 'becomes more stable when placed, and it becomes difficult to form a gap between the lower end face of the joint member 1553' and the flare head 1551a, so it is melted and integrated There is an effect that air bubbles are less likely to be generated inside.

The joint member 1553 'is formed of a joint base 1553'b having a cylindrical shape and a convex portion 1553'a provided thereon. The convex portion 1553'a has a quadrangular prism shape having a rectangular shape in plan view, and the length of the diagonal of the rectangle is set smaller than the diameter of the cylinder of the joint base 1553'b . The joint member 1553 'is previously formed in a predetermined shape.

(5-3. Exhaust hole formation process)
Subsequently, a process of forming an exhaust hole in the flare 1551 and the thin tube 1552 will be described.

FIG. 29 is a view showing a process subsequent to FIG. 28, wherein (a) and (a ′) show the state before forming the exhaust hole, and (b) and (b ′) show the formation of the exhaust hole It is a figure which shows the state of the back. (A) and (b) are arrow sectional views along a line corresponding to the line DD ′ in FIG. 23, and (a ′) and (b ′) are (a) and (b) respectively. Is a sectional view taken along the line EE ′ in FIG. In FIG. 29 (b ′), the periphery of the exhaust hole 1552 a is not made to be a cross section in order to show the exhaust hole 1552 a in an easily understandable manner.

As shown in FIGS. 29A and 29A, after the joint portion 1553 is formed, the periphery of the upper end portion of the thin tube 1552 ′ sealed by the flare 1551 is heated by the burner 9 from the outside of the flare 1551. . At this time, air is fed into the exhaust pipe 1552 from the lower end side of the exhaust pipe 1552, and the pressure is high. Therefore, when the periphery of the upper end portion of the thin tube 1552 'is heated and softened by the burner 9, the air pressure inside the thin tube 1552' seals the upper end portion of the thin tube 1552 'as shown in FIGS. The attachment is broken to form the exhaust hole 1552a, and the exhaust pipe 1552 is formed. Then, the stem 1550 including the flare 1551, the exhaust pipe 1552, and the joint portion 1553 and the

lead wires

71 and 72 and the antenna wire 91 sealed together is formed by the process described above.

(5-4. Mount formation process)
Subsequently, a process of forming a mount will be described. In addition, a mount represents integrally the state in which the stem 1550, the supporting member 1540, and the light emission part 20 were assembled | attached.

FIG. 30 is a diagram showing a process subsequent to FIG. As shown in FIG. 30A, a concave portion 1544 formed at the lower end of the support member 1540 is fitted to the convex portion 1553a of the joint portion 1553 to bond (attach) the support member 1540 to the joint portion 1553. At this time, as shown in FIG. 30A, the support member 1540 may be attached to the joint portion 1553 together with the antenna 90 in a state of being wound around the support member 1540, or the support member 1540 may be jointed. After bonding to 1553, the antenna 90 may be wound around and attached to the support member 1540, or the antenna 90 wound in a coil shape may be attached to the support member 1540 so as to cover it. Then, the lower end portion of the antenna 90 and the upper end portion of the antenna wire 91 are connected by the connector 92, and the state shown in FIG. 30B is obtained.

The recess 1544 formed at the lower end of the support member 1540 has a shape corresponding to the convex portion 1553a. That is, similarly to the convex portion 1553a, the shape in plan view has a rectangular shape, and the lengths and angles of the sides and diagonals thereof coincide with the convex portion 1553a. As described above, by forming the recess 1544 in a shape that matches the convex portion 1553a, when the support member 1540 is attached to the joint portion 1553, the concave portion 1544 and the convex portion 1553a are fitted, so the support member 1540 is formed. Does not easily disengage from the joint 1553. Further, by forming the convex portion 1553a and the concave portion 1544 in a plan view in a rectangular shape, positioning (positioning in the rotational direction about the lamp axis J5) when attaching the support member 1540 is facilitated, and the

lead wire

71 , 72 and the

feed terminals

24a and 24b, respectively, which facilitates work.

The method of attaching the support member 1540 to the stem 1550 is not limited to the above-mentioned fitting, and may be attached using adhesion, an engagement structure, screwing, or the like.

In addition, the plan view shape of the convex portion 1553a and the concave portion 1544 is not limited to a rectangle, and may be a triangle or a polygon having five or more sides. In this case, if the polygon is not a regular polygon, the support member 1540 can be more easily positioned.

Furthermore, the plan view shape may be, for example, an irregular shape such as a heart shape instead of a polygon, or a protrusion or a recess may be formed on a part of the circumference of a circle to facilitate positioning. It may have a provided shape.

Next, the mounting substrate 21 of the light emitting unit 20 is placed on the upper surface 1541 of the support member 1540 by the same method as described above, and the

lead wires

71 and 72 are connected to the

feed terminals

24a and 24b, respectively.

By the steps described above, the mount 13 is formed as shown in FIG.

(5-5. Glove sealing process: Drop seal method)
Subsequently, a drop seal method will be described as a representative method of sealing the globe 1510 to the stem 1550.

As shown in FIG. 30 (d), the mount 13 is inserted into the glove member 1510 'from the opening provided at the lower end of the glove member 1510'. At this time, a cylindrical tubular portion 1510'b is provided at the lower end portion of the glove member 1510 ', and the inner diameter of the tubular portion 1510'b is slightly larger than the outer diameter of the peripheral portion of the collar portion 1551b. It is set large. Thus, the mount 13 can be smoothly inserted into the glove member 1510 '. Further, the mount 13 is inserted into the glove member 1510 'so that the peripheral portion of the flange portion 1551b is located near the middle in the vertical direction of the cylindrical portion 1510'b. And as shown in FIG.30 (d), the peripheral part periphery of the collar part 1551b is heated by the burner 9 over the perimeter from the outer side of cylindrical part 1510'b, and the collar part 1551b and the member 1510 'for gloves are made. And fusion. At this time, as shown in FIG. 31 (a), the extra portion 1510'c of the cylindrical portion 1510'b is dropped and separated by its own weight, forming a globe 1510 integrally fused to the stem 1550. Be done.

(5-6. Filling fluid sealing process)
Subsequently, a process of sealing the filling fluid 12 inside the globe 1510 will be described.

As shown in FIG. 31 (b), the air inside the glove 1510 is exhausted from the exhaust pipe 1552 through the exhaust hole 1552a, and as shown in FIG. 31 (c), the air is filled from the exhaust pipe 1552 through the exhaust hole 1552a. Fill with fluid 12 (in this case helium (He)). Then, as shown in FIG. 32A, the exhaust pipe 1552 is heated by the burner 9 and sealed. Thus, the inside of the glove 1510 is closed. That is, although the exhaust pipe 1552 communicates with the inside of the glove 1510 through the exhaust hole 1552a, the space inside the glove 1510 is outside since the sealed end 1552b closes the outside. It is a closed space. As a result, the filling fluid 12 filled in the inside of the glove 1510 does not leak to the outside, and air and moisture do not enter from the outside, so the heat dissipation effect by the filling fluid 12 is sustained over a long period of time be able to.

Note that the position sealed in the exhaust pipe 1552, that is, the position where the sealed end 1552b is formed is below the exhaust hole 1552a, and when assembled as the illumination light source 1500, the circuit board inside the case 1560 The position is not particularly limited as long as the position does not abut on 81.

After sealing the filling fluid 12 inside the globe 1510 according to the above process, as shown in FIG. 32 (b), the circuit unit 80, the case 1560, and the base 30 are further assembled and shown in FIG. 32 (c) The illumination light source 1500 is completed.

(5-7. Glove sealing process: butt seal method)
As a representative method of sealing the glove 1510 to the stem 1550, there is a butt seal method in addition to the above drop seal method. Therefore, the butt seal method will be described below.

In the state shown in FIG. 30C, in the butt seal method, first, as shown in FIG. 33A, the open end of the glove 1510 is heated by the burner 9 to be softened and the opening is narrowed. Process Then, the mount 13 is inserted into the inside of the glove 1510 from the opening of the softened and narrowed glove 1510, and the open end of the softened and narrowed glove 1510 is brought into contact with the ridge portion 1551 b of the stem 1550. Subsequently, as shown in FIG. 33 (b), the ridge portion 1551b and the globe 1510 in the vicinity thereof are heated by the burner 9, and as shown in FIG. 33 (c), the ridge portion 1551b and the globe 1510 are melted. Put it on. Thereafter, in the same manner as in FIGS. 32B and 32C, the circuit unit 80, the case 1560, and the base 30 are further assembled to complete the illumination light source.

In general, when glass is processed for lead, the lead in the glass is precipitated as an oxide and the processed portion becomes black. Therefore, the flare formed of lead-containing glass has a dark color. Therefore, in the case of using a transparent material for the glove 1510, the flare 1551 can be seen from the outside, which may impair the beauty. In such a case, it is preferable to use lead-free glass for the flare 1551. Further, in order to make the flare 1551 difficult to see from the outside, a diffusion process may be performed by forming a milky white diffusion film on the inner surface of the cylindrical portion 1510 b of the globe 1510 or a reflection film may be provided.

[6. Summary of Modification 14]
As described above, according to the configuration of the illumination light source 1500 according to the modification 14, the light emitting unit 20 including the semiconductor light emitting element 22 is supported inside the globe 1510 by the support member 1540, and the air inside the globe 1510. A filling fluid 12 having a higher thermal conductivity is sealed. Thereby, the ratio of the heat generated in the semiconductor light emitting element 22 to the heat conducted from the globe 1510 is increased compared to the conventional LED lamp in which the air is sealed inside the globe. Can. As a result, the rate of heat conducted to the case 1560 side, which is a housing, is reduced to suppress the temperature rise of the case 1560 itself and the inside of the case 1560, and the circuit unit 80 housed inside the case 1560, in particular, the circuit unit 80 The heat load on the wireless control unit 820, which is one of the constituent electronic components, can be suppressed. As a result, the long-term stable operation of the wireless control unit 820 and the other electronic components can be ensured, and the longevity of the illumination light source 1500 can be realized.

In addition, the light emitting unit 20 having the semiconductor light emitting element 22 as a light source is supported by the support member 1540 at a central position in the globe 1510, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent lamp. Can.

Furthermore, the antenna 90 is attached to the support member 1540, and when the illumination light source 1500 is attached to the illumination device, the antenna 90 is positioned inside the relatively exposed globe 1510. Compared to the case where the antenna is housed inside the case 1560, the transmission and reception of the wireless signal is less likely to be inhibited, and the wireless signal can be more reliably transmitted and received.

In addition, since a light transmitting member is used for the mounting substrate 21 on which the semiconductor light emitting device 22 is mounted, light emitted rearward from the semiconductor light emitting device 22 is transmitted through the mounting substrate 21 and the globe 1510 The light is further transmitted through the globe 1510 and emitted to the outside. As a result, the amount of light emitted to the rear side of the illumination light source 1500 can be increased, and better light distribution characteristics can be obtained.

In addition, by making the support member 1540 into an elongated rod-like shape, the ratio of the light emitted backward from the semiconductor light emitting element 22 by the support member 1540 can be reduced. As a result, the amount of light emitted to the rear side of the illumination light source 1500 can be increased, and better light distribution characteristics can be obtained.

Furthermore, in the present modification, since the light emitting unit 20 is disposed in the globe 1510 and the globe 1510 has the same size as the incandescent bulb, the entire shape of the illumination light source 1500 is a shape similar to the incandescent bulb. ing. Thereby, the mounting compatibility rate of the illumination light source 1500 to the conventional lighting fixture using the incandescent lamp can be made approximately 100 [%].

(Modification 15)
In the modification 14, the configuration in which the antenna 90 which is a helical antenna is spirally wound and attached around the support member 1540 is described as an example.

However, the manner in which the antenna is provided to the support member 1540 is not limited to this. In the modification 15, a configuration in which a rod antenna is provided to a support member 1540 will be described.

FIG. 34 is an arrow sectional view along a straight line corresponding to the C-C ′ straight line of FIG. 23 of the illumination light source 1500 according to the modification 15.

In the illumination light source 1600 according to the present modification, an antenna 1690, which is a rod antenna (pole antenna) having a long rod-like (cylindrical) shape, is housed inside the support member 1640, and the lower end portion of the antenna 1690 is Is a metal wire, which penetrates the support member 1640 and is led out from the circumferential surface of the cylindrical portion 1647 and is connected to the antenna wire 91 via the connector 92 (see FIG. 26). This is different from the illumination light source 1500 according to the modification 14. The other configuration is the same as the basic configuration of the illumination light source 1500 according to the modification 14. Also in the illumination light source 1600, the filling fluid 12 is sealed inside the globe 1510.

Further, in the present modification, since the antenna 1690 is accommodated inside the support member 1640, the support member 1640 is formed of a nonconductive member. Examples of the nonconductive member include glass and ceramic, but in the present modification, glass is used. By forming support member 1640 using glass, antenna 1690 is accommodated inside support member 1640, and a metal wire at the lower end of antenna 1690 is easily derived from the circumferential surface of cylindrical portion 1647 to the outside. It can be integrally formed. Furthermore, light emitted from the semiconductor light emitting element 22 of the light emitting unit 20 to the rear side of the mounting substrate 21 passes through the support member 1640 to reach the rear side of the globe 1510 and is emitted therefrom to the outside. Because of this, better light distribution characteristics can be realized.

The antenna 1690 is, for example, used in the 2.4 GHz band, but is not limited to this, and an antenna adapted to the desired band to be used may be used. The length of the antenna 1690 is, for example, 20 to 31.25 mm, and the diameter is 1 to 30 mm, but the size and design of the support member 1640, the

lead wires

Note that the directivity of the antenna 1690 is preferably omnidirectional.

The light emitting unit 20 is attached to the upper end portion of the support member 1640, and the light emitting unit 20 and the circuit board 81 are electrically connected by

lead wires

71 and 72.

As described above, also in the configuration of the illumination light source 1600 according to the modification 15, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is supplied to the globe via the filling fluid 12. The heat is conducted to 1510 and dissipated from the globe 1510 to reduce the rate of heat transferred to the case 1560 side, thereby suppressing the temperature rise inside the case 1560 and suppressing the heat load to the wireless control unit 820 housed inside the case 1560 can do.

In addition, since the antenna 1690 is disposed inside the glove 1510 in a state of being housed inside the support member, transmission and reception of radio signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 1560 As a result, in the present modification, since the support member 1640 is made of glass, from the semiconductor light emitting element 22 of the light emitting unit 20 to the rear side of the mounting substrate 21. Since the emitted light can be transmitted through the support member 1640 to reach the rear side of the globe 1510 and emitted therefrom to the outside, better light distribution characteristics can be realized.

(Modification 16)
In the modification 14, a configuration in which the antenna 90, which is a helical antenna, is helically wound and attached around the support member 1540 will be described. In the modification 15, the antenna 1690, which is a rod antenna, is The structure accommodated inside the support member 1640 has been described.

However, the aspect in which the antenna is provided inside the glove 1510 is not limited to these.

FIG. 35 is an external perspective view showing a schematic configuration of a lighting light source 1700 according to Modification 16. As shown in FIG.

In the illumination light source 1700 according to the present modification, an antenna 290 is formed on the surface of the mounting substrate 21 of the light emitting unit 220. The antenna 290 is a PCB antenna (print antenna), and is formed in a rectangular wave shape on a mounting substrate using an aluminum thin film or the like.

Also in the illumination light source 1700 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

As described above, also in the configuration of the illumination light source 1700 according to this modification, the same effect as the illumination light source 1500 according to modification 14 and the illumination light source 1600 according to modification 15 can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat transmitted to the case 1560 side The rate can be reduced to suppress the temperature rise inside the case 1560, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, the antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 as a PCB antenna and disposed inside the globe 1510. As a result, when the illumination light source 1700 is attached to the illumination device, the antenna 290 is positioned inside the relatively exposed globe 1510, so that the antenna is housed inside the case 1560. In comparison, transmission and reception of radio signals are less likely to be inhibited, and radio signals can be transmitted and received more reliably.

Furthermore, the light emitting unit 220 having the semiconductor light emitting element 22 as a light source is supported by the support member 240 at a central position in the globe 1510, thereby obtaining a good light distribution characteristic close to the light distribution characteristic of the incandescent lamp. Can.

In addition, since a light transmitting member is used for the mounting substrate 21 on which the semiconductor light emitting device 22 is mounted, light emitted rearward from the semiconductor light emitting device 22 is transmitted through the mounting substrate 21 and the globe 1510 The light is further transmitted through the globe 1510 and emitted to the outside. As a result, the amount of light emitted to the rear side of the illumination light source 1700 can be increased, and better light distribution characteristics can be obtained.

In this modification, the support member 1540 has the same configuration as the support member 1540 in the illumination light source 1500 according to the modification 14. In this embodiment, the support member 1540 is made of aluminum, but the support member 1540 is translucent. May be used. In that case, although the heat dissipation from the support member 1540 is reduced as compared to the case of aluminum, light emitted backward from the semiconductor light emitting element 22 is transmitted through the support member 340 without being blocked by the support member 240. Since the light reaches the globe 1510 and is emitted to the outside from there, the amount of light emitted to the rear side of the illumination light source 1700 can be increased to obtain better light distribution characteristics.

Further, in the present modification, the antenna 290 is formed on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but the present invention is not limited to this. For example, the antennas 290 may be provided on both end sides in the longitudinal direction of the mounting substrate 21 from the first through holes 25. In this case, one pair of antennas 290 may be respectively provided on the one end side and the other end side, and the antennas 290 on both ends may be integrally formed. Further, the antenna 290 is not limited to the surface of the mounting substrate 21, and may be formed on the back surface of the mounting substrate 21 or may be formed on the side surface of the mounting substrate 21. In the case where one antenna 290 is provided on each end, the antenna terminal 292 may be provided on each longitudinal end and the antenna wire 91 may be connected to each. In this case, two antenna wires 91 respectively connected to both antenna terminals 292 may be integrated into one and connected to the circuit unit 80.

(Modification 17)
In the illumination light source 1700 according to the modification 16, the configuration in which the PCB antenna 290 is formed on the mounting substrate 21 of the light emitting unit 220 has been described, but the antenna provided on the mounting substrate 21 is not limited to the PCB antenna .

FIG. 36 is an external perspective view showing a schematic configuration of a lighting light source 1800 according to Modification 17. As shown in FIG.

The illumination light source 1800 according to the present modification has the antenna 390 formed on the surface of the mounting substrate 21 of the light emitting unit 320, and the antenna 390 is a chip antenna that is an SMD, according to the modification 16. It differs from the illumination light source 1700.

Also in the illumination light source 1800 according to the present modification, the filling fluid 12 is sealed inside the globe 1510.

As described above, also in the configuration of the illumination light source 1800 according to the present modification, the same effects as those of the illumination light source 1500 according to modification 14 and the illumination light sources according to the above-described modifications can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat transmitted to the case 1560 side The rate can be reduced to suppress the temperature rise inside the case 1560, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, the antenna 390 is mounted on the mounting substrate 21 of the light emitting unit 320 as a chip antenna, and is disposed inside the globe 1510. As a result, when the illumination light source 1800 is attached to the illumination device, the antenna 390 is positioned inside the relatively exposed globe 1510, so that the antenna is housed inside the case 1560. In comparison, transmission and reception of radio signals are less likely to be inhibited, and radio signals can be transmitted and received more reliably.

Furthermore, the light emitting unit 320 having the semiconductor light emitting element 22 as a light source is supported by the support member 240 at a central position in the globe 1510, thereby obtaining good light distribution characteristics close to the light distribution characteristics of the incandescent lamp. Can.

In addition, since a light transmitting member is used for the mounting substrate 21 on which the semiconductor light emitting device 22 is mounted, light emitted rearward from the semiconductor light emitting device 22 is transmitted through the mounting substrate 21 and the globe 1510 The light is further transmitted through the globe 1510 and emitted to the outside. As a result, the amount of light emitted to the rear side of the illumination light source 1800 can be increased, and better light distribution characteristics can be obtained.

In this modification, the support member 1540 has the same configuration as the support member 1540 in the illumination light source 1500 according to the modification 14. In this embodiment, the support member 1540 is made of aluminum, but the support member 1540 is translucent. May be used. In that case, although the heat dissipation from the support member 1540 is reduced as compared to the case of aluminum, light emitted backward from the semiconductor light emitting element 22 is transmitted through the support member 240 without being blocked by the support member 240. It reaches the glove 1510, from where it is emitted to the outside. As a result, the amount of light emitted to the rear side of the illumination light source 1800 can be increased, and better light distribution characteristics can be obtained.

Further, in the present modification, the antenna 390 is mounted on one end side in the longitudinal direction of the mounting substrate 21 from the first through hole 25, but the present invention is not limited to this. For example, the antennas 390 may be provided on both end sides in the longitudinal direction of the mounting substrate 21 from the first through holes 25. In addition, the antenna 390 is mounted on the back surface of the mounting substrate 21 without being limited to the front surface of the mounting substrate 21. In the case where one antenna 390 is provided on each end, the antenna terminal 392 may be provided on each longitudinal end, and the antenna wire 91 may be connected to each. In this case, two antenna wires 91 respectively connected to both antenna terminals 392 may be integrated into one and connected to the circuit unit 80.

(Modification 18)
In the modification 14 and the modifications, the mounting substrate 21 of the light emitting unit has a rectangular shape in a plan view, but the present invention is not limited to this.

FIG. 37 is an external perspective view showing a schematic configuration of a lighting light source 1900 according to the modification 18. As shown in FIG. The illumination light source 1900 includes a globe 1510, a light emitting unit 420, a support member 1540, a stem 1550, a case 1560, a base 30, an antenna 90 which is a helical antenna,

lead wires

71 and 72, and the like as its main components. Although not shown in FIG. 37, circuit unit 80 (see FIG. 25) is accommodated in case 1560, and antenna 90 and circuit unit 80 are connected by antenna wire 91 (see FIG. 25). There is.

In the illumination light source 1900, the mounting substrate 421 of the light emitting unit 420 has a disk shape, and a plurality of semiconductor light emitting elements 422 are mounted in a ring shape on the surface of the disk mounting substrate 421. The sealing body 423 is formed in an annular shape so as to cover all the semiconductor light emitting elements 422. The mounting substrate 421 is configured using a translucent member. As the translucent member, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a translucent resin substrate, or the like is used. Here, the plurality of semiconductor light emitting devices 422 have the same configuration as the semiconductor light emitting device 22 described in the first embodiment, but different configurations, for example, emission color, output (luminance) are different. It may be something.

The sealing body 423 is made of a translucent material. Since the semiconductor light emitting device 422 emits light of the same color as the semiconductor light emitting device 22 of the modification 14, as in the modification 14, the wavelength conversion material for converting the wavelength of light from the semiconductor light emitting device 422 into a desired (yellow) is It is mixed in the said translucent material. Note that the sealing body 423 has an annular shape when viewed in plan, but may be formed, for example, in a dome shape (circular shape when viewed in plan).

The end portions of the

lead wires

Also in the illumination light source 1900 according to the present modification, the filling fluid 12 is sealed inside the globe 1510.

Also with the configuration of the illumination light source 1900 according to the present modification, the same effects as those of the illumination light source can be obtained in modification 14 and the above-described modifications. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat transmitted to the case 1560 side The rate can be reduced to suppress the temperature rise inside the case 1560, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, the light emitting unit 420 is supported by the support member 440 at a central position in the globe 1510, whereby good light distribution characteristics close to the light distribution characteristics of the incandescent lamp can be obtained, and the antenna 90 is supported. Since it is attached to the member 440 and disposed inside the glove 1510, transmission and reception of radio signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 1560, and transmission and reception of radio signals are more assured Can be done.

Furthermore, a translucent member is used for the mounting substrate 421, and light emitted backward from the semiconductor light emitting element 22 is transmitted through the mounting substrate 421 and emitted to the rear side of the globe 1510. In the elongated rod-like shape, the ratio of the light emitted backward from the semiconductor light emitting element 22 by the support member 440 can be reduced, whereby the light source 1900 for illumination is The amount of light emitted can be increased to obtain better light distribution characteristics.

Further, in the present modification, the mounting substrate 421 has a disk shape (a shape in a plan view is circular), but the present invention is not limited to this. A polygon such as a hexagon or an octagon in plan view or a heart It may be indeterminate form such as shape.

(Modification 19)
The illumination light source 1900 according to the modification 18 is an example in which the light emitting unit 420 having the disk-shaped mounting substrate 421 is applied to the configuration instead of the light emitting unit 20 of the illumination light source 1500 according to modification 14.

However, the light emitting unit 420 of the modification 18 is not limited to the above, and may be applied to the illumination light source 1600 according to the modification 15.

FIG. 38 is a partially cutaway appearance perspective view showing a schematic configuration of a lighting light source 2000 according to Modification 19. As shown in FIG. The illumination light source 2000 includes a globe 1510, a light emitting unit 420, a support member 1640, a stem 1550, a case 1560, a base 30, an antenna 1690 which is a rod antenna, and lead

wires

71 and 72 as main components. In FIG. 38, a part of the case 1560 and the part other than the base 30 are shown as cross-sectional views. Further, the circuit unit 80 is accommodated inside the case 1560, and in the figure, only a part of the circuit unit 80 can be seen from the notch portion of the case 1560.

In the illumination light source 2000 according to the nineteenth modification, the support member 1640 has the same configuration as is apparent from the same reference numerals as the support member 1640 for the illumination light source according to the fifteenth modification. An antenna 1690, which is a rod antenna (pole antenna) having a long rod-like (cylindrical) shape, is accommodated inside.

Also in the illumination light source 2000 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

As described above, also in the configuration of the illumination light source 2000 according to the present modification, the same effects as those of the illumination light sources according to the modification 14 and the above-described modifications can be obtained. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 22 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat transmitted to the case 1560 side The rate can be reduced to suppress the temperature rise inside the case 1560, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, the light emitting unit 420 is supported by the support member 1640 at a central position in the globe 1510, whereby good light distribution characteristics close to the light distribution characteristics of the incandescent lamp can be obtained, and the antenna 1690 is supported. Since it is disposed inside the glove 1510 in a state of being housed inside the member 1640, transmission and reception of radio signals are less likely to be impeded compared to the case where the antenna is housed inside the case 1560, and transmission and reception of radio signals It can be done more reliably.

(Modification 20)
In each of the illumination light sources according to the modification 14 and the modifications, the configuration including the light emitting unit in which the semiconductor light emitting element 22 as the light source is mounted on a single plate-like mounting substrate has been described. However, the structure of the light emitting unit is not limited to these, and may be configured to include the light emitting unit having a more three-dimensional structure.

FIG. 39 is an external perspective view showing a schematic configuration of a lighting light source 2100 according to the modification 20. As shown in FIG. The illumination light source 2100 includes, as its main components, a globe 1510, a light emitting unit 620, a support member 1540, a stem 1550, a case 1560, a base 30, an antenna 90 which is a helical antenna,

lead wires

71 and 72, and the like. Although not shown in the figure, the circuit unit 80 (see FIG. 25) is accommodated in the case 1560, and the antenna 90 and the circuit unit 80 are connected by the antenna wire 91 (see FIG. 25). There is.

In the illumination light source 2100, the light emitting unit 620 is formed into a regular dodecahedron-like shape by combining 12 regular pentagonal mounting substrates 621 on which a plurality of SMD type (surface mounting type) semiconductor light emitting devices 622 are mounted. ing. The respective mounting substrates 621 are fixed to one another using an adhesive or the like, whereby the regular dodecahedron-like shape is maintained. A through hole is provided in the mounting substrate 621 forming one surface of the regular dodecahedron of the light emitting unit 620, and the convex portion 1543 provided on the upper surface 1541 of the support member 1540 is fitted to the through hole. The light emitting unit 620 is supported inside the glove 1510 by the support member 440. In addition, joining with the light emission part 620 and the supporting member 1540 is not restricted to the said fitting, You may use an adhesive agent, an engaging structure, a screw, another stop etc.

Although SMD type semiconductor light emitting element 622 is used in this modification, the present invention is not limited to this, and as in semiconductor light emitting element 22 in the first embodiment, it is of a type formed directly on the mounting substrate. What formed the sealing body 23 on the semiconductor light emitting element may be used.

One ends of the

lead wires

71 and 72 are connected to different mounting boards 621, and the other ends are connected to the circuit unit 80 housed in the case 1560.

Although not shown in FIG. 39, each mounting substrate 621 is electrically connected by a lead wire inside the light emitting portion 620, whereby each mounting substrate 621 is electrically connected to the circuit unit 80. ing.

The illumination light source 2100 according to the modification 20 is basically the same as the illumination light source 1500 according to the modification 14 shown in FIG. 23 except that a light emitting unit 620 having a regular dodecahedron-like structure is used. Also in the illumination light source 2100 according to the present modification, the filling fluid 12 is sealed inside the globe 1510.

Also with the configuration of the illumination light source 2100 according to the present modification, it is possible to obtain the same effect as the illumination light source according to the modification 14 and each of the above modifications. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 622 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat transmitted to the case 1560 side The rate can be reduced to suppress the temperature rise inside the case 1560, and the heat load on the wireless control unit 820 housed inside the case 1560 can be suppressed.

In addition, since the antenna 90 is attached to the support member 1540 and disposed inside the glove 1510, transmission and reception of wireless signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 1560, Transmission and reception of wireless signals can be performed more reliably.

The light emitting unit 620 is three-dimensionally configured to have a regular dodecahedron shape, and the mounting boards 621 are attached at different angles with respect to the lamp axis. Therefore, the main emission directions of the light of the semiconductor light emitting elements 622 mounted on the respective mounting substrates 621 are different. Furthermore, since the light emitting portion 620 is supported by the support member 440 at a central position in the globe 1510, the light emitted from the semiconductor light emitting element 622 is emitted in substantially all directions, and good light distribution characteristics can be obtained. .

(Modification 21)
In the modification 20, the configuration in the case where the light emitting unit 620 having a three-dimensional structure is applied to the illumination light source 1500 according to the modification 14 has been described.

However, the light emitting unit 620 of the modification 20 is not limited to the above, and can be applied to the illumination light source 1600 according to the modification 15.

FIG. 40 is a partially cutaway external perspective view showing a schematic configuration of a lighting light source 2200 according to the modification 21. As shown in FIG. The illumination light source 2200 includes, as its main components, a globe 1510, a light emitting unit 620, a support member 1640, a stem 1550, a case 1560, a base 30, an antenna 1690 which is a rod antenna,

lead wires

71 and 72, and the like. In the figure, the light emitting part 620, a part of the case 1560, and the part other than the base 30 are shown as cross-sectional views. Further, the circuit unit 80 is accommodated inside the case 1560, and in the figure, only a part of the circuit unit 80 can be seen from the notch portion of the case 1560. The antenna 1690 and the circuit unit 80 are connected by an antenna wire 91.

The illumination light source 2200 according to the present modification is basically the same as the illumination light source 1600 according to modification 15 shown in FIG. 34 except that the light emitting portion 620 having a regular dodecahedron-like structure is used. It is the same.

Further, as can be understood from the fact that the same reference numerals are used, the light emitting unit 620 of the illumination light source 2200 according to the present modification is the same as the light emitting unit 620 of the illumination light source 2100 according to the modification 20 shown in FIG. Also in the illumination light source 2200 according to this modification, the filling fluid 12 is sealed inside the globe 1510.

Also with the configuration of the illumination light source 2200 according to the present modification, it is possible to obtain the same effect as the illumination light source according to the modification 14 and each of the above modifications. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 622 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat is transmitted to the case 1560 side. The temperature load inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed in the case 1560 can be suppressed.

In addition, since the antenna 1690 is disposed inside the glove 1510 in a state of being housed inside the support member 540, transmission and reception of radio signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 1560 Thus, the wireless signal can be transmitted and received more reliably.

In addition, since light emitted from the light emitting unit 620 supported at the center position in the globe 1510 and having a rectangular solid-like shape is emitted in substantially all directions, good light distribution characteristics can be obtained.

Although the SMD type semiconductor light emitting element 622 is used also in this modification, the present invention is not limited to this, and as in the semiconductor light emitting element 22 in the first embodiment, the type is formed directly on the mounting substrate. What formed the sealing body 23 on the semiconductor light emitting element may be used.

(Modification 22)
Although the whole rod antenna is accommodated in the inside of a support member in the above-mentioned

modifications

15, 21, and 23, it is not restricted to this. For example, the following modification can be considered.

FIG. 41 is an external perspective view showing a schematic configuration of a lighting light source 2300 according to the modification 22. As shown in FIG. In the illumination light source 2300, concave portions 2349 (in FIG. 41, only one located on the front side of the drawing is shown) in which one end of each of two rod antennas 1390 is provided in the cylindrical portion 947 of the support member 2340. And the remaining part extends outward from the cylindrical portion 947 of the support member 2340.

Also in the illumination light source 2300 according to the present modification, the filling fluid 12 is sealed inside the globe 1510.

Also with the configuration of the illumination light source 2300 according to the present modification, it is possible to obtain the same effect as the illumination light source according to the modification 14 and each of the above modifications. That is, since the filling fluid 12 is sealed inside the globe 1510, the heat from the semiconductor light emitting element 622 is conducted to the globe 1510 via the filling fluid 12 to dissipate heat from the globe 1510, and the heat is transmitted to the case 1560 side. The temperature load inside the case 1560 can be suppressed, and the heat load on the wireless control unit 820 housed in the case 1560 can be suppressed.

In addition, since the antenna 1390 is disposed inside the glove 1510 in a state of being attached to the support member 2340, transmission and reception of wireless signals are less likely to be inhibited compared to the case where the antenna is housed inside the case 1560 Thus, the wireless signal can be transmitted and received more reliably.

In addition, since the light emitting unit 20 is supported at the center position inside the glove 1510 by the support member 2340, good light distribution characteristics can be obtained.

Although the case where the antenna 1390 in the illumination light source 2300 according to the present modification is applied instead of the antenna 90 in the illumination light source 1500 according to the modification 14 has been described as an example, the present invention is not limited thereto. For example, the antenna 1390 may be applied instead of the antenna of the illumination light source according to each modification, or the antenna 1390 may be provided in addition to the antenna of the illumination light source according to modification 14 and each modification. Good.

(Modification 23)
In the illumination light source according to the modification 14 and the modifications, the case where the stem 1550 integrated with the globe 1510 is fixed to the case 1560 using the adhesive 1556 has been described. However, the fixing of the stem (and the glove) to the case is not limited to this.

FIG. 42 is a cross-sectional view showing a schematic configuration of the illumination light source 2400 according to the modification 23. In the illumination light source 2400, the joint portion between the lower end of the cylindrical portion 2410b of the globe 2410 and the lower end 2451b1 of the flange 2451b of the flare 2451 has a cylindrical shape with a constant diameter. An adhesive tape 2457 is attached between the joint portion and the inner peripheral surface of the large-diameter upper end portion 1561a of the large-diameter portion 1561 of the case 1560, whereby the glove 2410 and the stem 2450 integrated together form the case 1560. Bonded to and fixed.

In order to suppress the conduction of heat generated in the semiconductor light emitting element 22 from the globe 2410 and the stem 2450 to the case 1560, the adhesive tape 2457 may be made of a material having heat insulation.

(Modification 24)
Furthermore, it is also possible to consider the following modifications. FIG. 43 is a cross-sectional view showing a schematic configuration of the illumination light source 2500 according to the modification 24. As shown in FIG. In the illumination light source 2500, the globe 2510 and the stem 2550 are not integrated but are separated. A support groove 2567 is formed on the inner peripheral surface on the upper end side of the large diameter portion 2561 of the case 2560. The inner diameter of the groove of the support groove substantially matches the outer diameter of the lower end 2551b1 of the flange 2551b of the flare 2551, and the lower end 2551b1 is placed so as to fit in the groove of the support groove 2567 and further outside The lower end portion of the cylindrical portion 2510 b of the glove 2510 is placed so as to fit in the groove of the support groove portion 2567. The adhesive 2558 is applied to the gap between the flange portion 2551b and the cylindrical portion 2510b, and the adhesive 2559 is applied to the gap between the cylindrical portion 2510b and the large diameter upper end portion 2561a of the case 2560. Thus, the stem 2550, the glove 2510 and the case 2560 are adhesively fixed to each other.

At this time, by using an adhesive having low gas permeability as the

adhesives

2558 and 2559, and applying the adhesive without break along the entire circumference in the circumferential direction around the lamp axis, the inside of the glove 2510 is obtained. The sealing property of the fluid 12 can be secured, and the heat radiation effect by the filling fluid 12 can be maintained continuously.

Furthermore, an adhesive with high thermal conductivity may be used as the adhesive 2558, and an adhesive with low thermal conductivity may be used as the adhesive 2559. Thereby, the heat from the semiconductor light emitting element 22 transferred to the collar portion 2551b of the stem 2550 through the support member 1540 is transferred from the collar portion 2551b to the cylindrical portion 2510b of the glove 2510 through the adhesive 2558. Although it is easy, it is difficult to transfer from the cylindrical portion 2510b to the large diameter upper end portion 2561a of the case 2560 through the adhesive 2559, so most of the heat from the semiconductor light emitting element 22 transferred to the collar portion 2551b is on the glove 2510 side. It can be conducted to and dissipated therefrom, and the heat conduction to the case 2560 can be suppressed more effectively. Then, the heat load on the wireless control unit 820 (and the circuit unit 80) can be more effectively suppressed.

Note that an adhesive tape 2457 may be used as the adhesive 2559. Also in this case, the thermal load on the wireless control unit 820 (and the circuit unit 80) can be more effectively suppressed by using the heat insulating adhesive tape.

(Modification 25)
Like the illumination light source 2600 according to the modification 25 shown in FIG. 44, the functional layer 2614 can also be formed on the inner peripheral surface of the globe 2610 below the light emitting unit 220. The functional layer 2614 is made of a metal thin film, and specifically, formed by, for example, aluminum evaporation. The illumination light source 2600 uses a PCB antenna as the antenna 290. When the illumination light source 2600 includes the functional layer 2614, the directivity of the antenna can be further improved.

(Modification 26)
As in the illumination light source 2700 according to the modification 26 shown in FIG. 45, even when a chip antenna which is a small SMD is used as the antenna 390, the inner peripheral surface of the globe 2610 is lower than the light emitting portion 320 The functional layer 2614 may be formed on Also in this case, the directivity of the antenna can be further improved.

(Modification 27)
A connection terminal for external antenna connection may be provided to make an external antenna available. For example, a quick connection terminal can be used as the connection terminal of the external antenna. In addition, the external antenna connection terminal may be provided, for example, in a case or a glove, since it needs to be provided at a site exposed to the outside when the illumination light source is attached to the illumination device. When provided in the glove, it may be provided below the light emitting portion so as not to block the emitted light.

(Modification 28)
As in the illumination light source 2800 according to the modification 28 shown in FIG. 46, the upper end of the support member 2840 is an adhesive on the information side in the glove 10 (the side opposite to the base 30 in the glove 10). 15 may be fixed to the glove 10. With such a configuration, the heat generated by the light emitting unit 20 can be conducted to the upper side of the globe 10. In the illumination light source 2800, the semiconductor light emitting element 22 is mounted on the back surface that is the main surface on the lower side (die 30 side) of the mounting substrate 21. The mounting substrate 21 is made of a light transmitting material. Therefore, the light emitted from the semiconductor light emitting element 22 can be emitted not only to the lower side of the illumination light source 2800 but also to the upper side through the mounting substrate 21. Examples of the material that can be used as the mounting substrate 21 include glass, alumina, sapphire, resin, and the like.

The illumination light source 2800 is provided with two rod antennas 1390. Each of the antennas 1390 is provided in such a manner that one end thereof is fitted into the recess 2853 of the base 2850 and the other end thereof protrudes into the inside of the glove 10. Although not shown, a through hole is provided at the central portion of the recess 2853, and the antenna wire 91 connected to one end of the antenna 1390 passes through the through hole, and the other end is a circuit. It is connected to the unit 80.

(Modification 29)
Like the illumination light source 2900 according to the modified example 29 shown in FIG. 47, the first light emitting unit 2920a and the second light emitting unit 2920b are provided with light emitting units 2920 configured to have two steps parallel to each other and spaced from each other. It is also good. The first light emitting portion 2920a is supported in the air inside the glove 10 by the first stem portion 2943a of the support member 2940, and the second light emitting portion 2920b is substantially on the upper side of the first light emitting portion 2920a by the second stem portion 2943b. They are held in parallel at predetermined intervals.

The first light emitting unit 2920 a is electrically connected to the circuit unit (not shown) by the lead wire 2971, and the second light emitting unit 2920 b is electrically connected to the first light emitting unit 2920 a by the lead wire 2972. There is.

One end of each of two rod antennas 1390 is fixed to the first stem portion 2943b, and the other end of the antenna 1390 is substantially parallel to the first light emitting portion 2920a and the second light emitting portion 2920b in a direction away from each other. Is growing.

As the first light emitting unit 2920a and the second light emitting unit 2920b, a mounting substrate having a flat plate-like rectangular shape was used. However, the present invention is not limited to this, and a plurality of mounting substrates such as pentagons and octagons or flat mounting substrates having different shapes may be used in combination. The mounting substrate may be translucent or opaque, but it is preferable to use a translucent mounting substrate because the brightness in the irradiation direction (the opposite side of the base) can be improved. In this case, the base (not shown) used for the translucent LED module is preferably made of a material having a high light transmittance (for example, 90% or more). In addition, the light emission color of the light emitting unit to be used may be made different.

(Modification 30)
Like the illumination light source 3000 according to the modification 30 shown in FIG. 48, the light emitting unit 3020 may be supported in the air in the glove by two

lead wires

71 and 72 having rigidity instead of the support member. In the illumination light source 3000, a stem 3040 protrudes inside the glove, and a helical antenna 90 is attached on the circumferential surface of the stem 3040.

A heat sink 3070 is fixed to the back surface of the mounting substrate 3021 of the light emitting unit 3020 by a thermally conductive adhesive or the like. The heat dissipating member 3070 has a flat plate-like first heat dissipating member portion 3071 fixed to the back surface of the mounting substrate 3021, and a cylindrical second heat dissipating member provided to extend downward from the central portion of the first heat dissipating member portion 3071. It consists of body part 3072 and. The shape of the second heat radiating portion 3072 is, for example, a cylinder having a diameter of 5 mm and a height of 40 mm.

Further, the inside of the glove 3010 is filled with the filling fluid 12.

(Modification 31)
As in the illumination light source 3100 according to the modification 31 shown in FIG.

Feed lines

3172 and 3173 are provided on the inner wall of the globe 1510, and power is supplied to the piezo fan 3171 via the

feed lines

3172 and 3173. As in the illumination light source 3100, it is considered that a further decrease in the temperature of the light emitting unit 20 can be expected by promoting the convection of the filling fluid 12 such as helium gas in the globe 1510 by providing the piezo fan 3171 in the globe 1510. .

The

feed lines

3172 and 3173 may be made of metal, but in consideration of the light distribution characteristic of the lamp, it is preferable to use a transparent conductive material such as ITO.

Further, in the present modification, the piezo fan 3171 is provided in the vicinity of the top of the inner wall of the globe 1510. Thus, the convection of the filling fluid 12 can be efficiently caused by the piezo fan 3171.

Further, in the present modification, the lower end of the support member 3140 is fixed to the top of the stem 3150 by an adhesive 3153.

(Modification 32)
FIG. 50 is a diagram showing a main part of the manufacturing process of the method of manufacturing the illumination light source 3200 according to the present modification.

As shown in FIG. 50C, the illumination light source 3200 includes a glove 3210 in which the filling fluid 12 is enclosed, a case 1560 attached to the lower end of the glove 3210, and a base 30 provided on the case 1560. Rod-

like members

3271c and 3271d and

antennas

3290a and 3290b extending through the stem 3250 into the glove 3210; and light-emitting portions 3220 provided on the inner ends of the rod-like members and antenna of the rod 3210. The rod-

like members

3271 c and 3271 d and the

antennas

3290 a and 3290 b are made of a rigid metal material, for example, a dumet material. The light emitting unit 3220 is air-supported inside the glove 3210 by the rod-

like members

3271 c and 3271 d and the

antennas

3290 a and 3290 b. The

antennas

3290a and 3290b have the same basic configuration as the rod-

like members

3271c and 3271d, such as the material and the shape, but also have the function as an antenna. The bar-

like members

3271 c and 3271 d and the case 1560 inner ends of the

antennas

3290 a and 3290 b are in contact with the heat transfer plate 3274.

The illumination light source 3200 stores a circuit unit 80 for receiving light through the base 30 to cause the light emitting unit 3220 to emit light in a case 1560, and has an overall shape similar to a conventional incandescent lamp.

Next, main steps of a method of manufacturing the illumination light source 3200 will be described. The stem 3250 is formed by the same method as the stem 1550 of the illumination light source 1500 according to the modification 14.

As shown in FIG. 50 (a), an exhaust pipe 3252 extending downward through the stem 3250, two

lead wires

71, 72, and four rod-

like members

3271a, 3271b, 3271c, 3271d are flat plates. Pass the heat transfer plate 3274 through the corresponding through

holes

3274a, 3274b, 3274c of the heat transfer plate 3274 made of the upper metal, bring the heat transfer plate 3274 close to the globe 3210, and the inner peripheral surface of the lower end of the stem 3250 and the outer periphery of the heat transfer plate 3274 Is fixed with an adhesive.

Then, the circuit unit 80 is housed in the case 1560, and after the

lead wires

71, 72 and the antenna wires 91 respectively connected to the lower ends of the

rod members

3271a, 3271b are connected to the circuit board 81, the case 1560 is integrated. The lower ends of the glove 3210 and stem 3250 are fixed with an adhesive. When the antenna wire 91 is connected to the circuit board 81, the rod-

like members

3271a and 3271b become

antennas

3290a and 3290b, respectively. When the case 1560 and the heat transfer plate 3274 are connected, the

antennas

3290a and 3290b and the rod-

like members

3271c and 3271d heat the heat of the light emitting unit 3220 (not yet lit in the state shown in FIG. 50B). It can be transmitted to the

Next, the base 30 is screwed into the case 1560, and the

lead wires

74 and 75 connected to the circuit unit 80 are connected to the base 30. Thus, the illumination light source 3200 is completed.

According to the configuration of the illumination light source 3200 according to this modification, the heat from the light emitting unit 3220 is transmitted to the heat transfer plate 3274 via the rod-

like members

3271a and 3271b and the

antennas

3290a and 3290b, and from there the case 1560 and the die Heat transfer to 30 can enhance the heat radiation effect.

(Modification 33)
FIG. 51 is a partially broken perspective view showing a schematic configuration of a lighting light source 3300 according to the present modification. FIG. 52 is a cross-sectional view of the illumination light source 3300. In the illumination light source 3300, a cylindrical portion 3312 is provided inside the globe 3310, and the support member 140, the light emitting portion 20, and the

lead wires

71 and 72 are accommodated inside the cylindrical portion 3312. The cylindrical portion 3312 has a bottomed cylindrical shape, and the opening is closed by the stem 3350. A translucent heat conductive resin 3313 is filled in a first region S1 which is a space surrounded by the inner wall of the cylindrical portion 3312 and the upper surface of the stem 3350. Further, the second region S2, which is a space surrounded by the inner wall of the globe 3310 and the outer wall of the cylindrical portion 3312, is filled with the filling fluid 12 such as helium gas.

About the manufacturing method of the light source 3300 for illumination which concerns on this modification, the main processes are demonstrated based on FIG. 53 and FIG.

First, as shown in FIG. 53A, a bottomed cylindrical cylindrical member 3312 'formed of a translucent material is inserted into the inside of a glove member 3310' which is a base of the glove 3310. As shown in FIG. In the cylindrical member 3312 ', an exhaust pipe 3314a communicating with an exhaust port 3314 formed in a side wall is welded.

Next, in a state where the cylindrical member 3312 'is disposed inside the glove member 3310', the inside of the outer peripheral portion of the opening end 3311 of the cylindrical member 3312 'and the opening end of the glove member 3310' The cylindrical member 3312 'and the glove member 3310' are welded by heating the portion where the peripheral portion abuts each other, and as shown in FIG. 53 (b), the cylindrical portion 3312 is formed inside the glove 3310. Is formed. Here, the inside of the cylindrical portion 3312 corresponds to the first region S1, and the region surrounded by the inner wall of the glove 3310 and the outer wall of the cylindrical portion 3312 corresponds to the second region S2.

Thereafter, after the air existing in the second area S2 is exhausted to the outside through the exhaust pipe 3314a (see FIG. 53 (b)), the filling fluid 12 is filled in the second area S2 through the exhaust pipe 3314a (this modification) , For example, helium gas) is sealed (see FIG. 53 (c)). At this time, the pressure of the helium gas filled in the second region S2 is substantially the same as the atmospheric pressure, or slightly higher than the atmospheric pressure.

Next, the exhaust pipe 3314a is sealed by heating a part of the exhaust pipe 3314a to form the thin tube portion 3314b (see FIG. 54A).

Subsequently, as shown in FIG. 54 (b), a structure composed of the light emitting unit 20, the stem 3350 and the support member 140 is inserted into the first region S 1, and the stem 3350 is the open end of the cylindrical portion 3312. The stem 3350 is made by pouring an adhesive made of a heat conductive resin such as silicone resin between the circumferential surface of the stem 3350 and the inner wall of the open end 3311 of the cylindrical portion 3312 in a state of being fitted to the portion 3311. Is fixed to the lower end of the glove 3310.

After that, a thermally conductive resin such as a silicone resin is sealed in the first region S1 from the through hole 3350a formed in a part of the stem 3350 (see FIG. 54 (c)).

The other end of each of the

lead wires

71 and 72 opposite to the one end connected to the

feed terminals

24 a and 24 b of the light emitting unit 20 is connected to the power output unit of the circuit unit 80. Thereafter, wires such as lead wires are attached to attach the case 60 and the base 30, and the assembly of the illumination light source 3300 is completed.

According to the configuration of the illumination light source 3300 according to the present modification, the heat generated in the light emitting unit 20 is conducted to the peripheral wall of the cylindrical portion 3312 via the heat conductive resin 3313 and then filled in the second region S2. Conducts to helium gas. Then, the heat conducted to the helium gas is conducted to the globe 3310 and is released from the outer surface of the globe 3310 to the outside. As described above, the heat generated by the light emitting unit 20 is easily released to the outside through the helium gas and the globe 3310, so that the temperature rise of the light emitting unit even if the power supplied to the light emitting unit is increased to improve the luminance. Can be sufficiently suppressed.

(Modification 34)
In the modified examples 3 to 6, 20, and 21, the polyhedral-shaped light emitting unit is supported inside the glove by the support member, but the present invention is not limited thereto. For example, the polyhedron-shaped light emitting unit may be directly attached to the base or stem. In this case, the mounting substrate constituting the polyhedron shape also serves as the support member, and the antenna is accommodated inside the polyhedron.

(Modification 35)
In the light emitting units in the third to sixth modification examples, 20, and 21, a plurality of mounting substrates are combined to form a polyhedron or a polygonal prism, and the inside of the polyhedron or the polygonal prism is hollow. It is not restricted to this. For example, the mounting substrate may be attached to the outer peripheral surface of a polyhedron-shaped or polygon-pillar-shaped core formed of a nonconductive member to form a polyhedron- or polygon-pillar-shaped light emitting portion. In such a case, a wire for electrically connecting each mounting substrate may be formed inside the core.

(Modification 36)
The circuit unit 80 is not limited to the configuration described in each of the embodiments and the modifications, and the following modifications can be implemented. For example, the attitude in which the circuit board 81 is fixedly accommodated in the case is not limited to the attitude in which the main surface of the circuit board 81 is substantially orthogonal to the lamp axis. For example, the circuit board 81 may be accommodated in a posture substantially parallel to the lamp axis, or may be accommodated in a posture having a predetermined inclination angle with respect to the lamp axis.

Further, the circuit board 81 is not limited to a disk shape, and may have an irregular shape such as a rectangular shape, a polygonal shape, or a heart shape in plan view, and is formed of a flexible member such as a flexible substrate. It may be housed inside the case in a bent state.

Further, the method of fixing the circuit board 81 inside the case is not limited to the locking structure by the locking portion, and for example, the circuit board may be fixed inside the case by screwing, bonding or the like.

(Modification 37)
In each of the above-described embodiments and modifications, the emission color of the LED as the semiconductor light emitting element 22 is blue light, and the phosphor particles convert blue light into yellow light as an example, It may be a combination. As another example of the combination, in the case of emitting white light, three types of particles are used: phosphor particles, particles to be converted to red light, particles to be converted to green light, and particles to be converted to blue light. Can be used.

Furthermore, the light emission color of the LED may be mixed to be white light using three types of LED elements of red light emission, green light emission and blue light emission. Needless to say, the color of light emitted from the light emitting part is not limited to white, and various LEDs (including elements and surface mounting types) and phosphor particles can be used depending on the application.

(Modification 38)
In each of the embodiments and the modifications described above, the mounting substrate having a rectangular or circular plan view shape has been described as an example, but the plan view shape of the substrate is not particularly limited to the above shape.

In each embodiment and each modification, a thin plate (a smaller side area compared to the upper surface area) has been described as an example, but a thick plate may be used, for example. You may use a block-like thing.

The mounting substrate in the present specification has a pattern for mounting a semiconductor light emitting element (including an element and a surface mounting type) and electrically connecting to the semiconductor light emitting element regardless of the shape, thickness, and form. Point to Therefore, the substrate may have a block shape.

Moreover, in each embodiment and each modification, although the mounting board was comprised with the translucent material, when it is not necessary to take out light below, you may comprise with materials other than the translucent material .

(Modification 39)
Although the light emitting unit in each of the above-described embodiments and each modification has the mounting substrate made of a translucent material and emits light to the rear, the light may be emitted to the rear by another method. Also good.

As another method, the mounting substrate may be made of a material that is not a translucent material, and the semiconductor light emitting element may be mounted on both the front and back surfaces of the mounting substrate. In addition, light may be irradiated to the rear by using a reflecting member, a half mirror, or the like.

(Modification 40)
In the modified examples 3 to 6, 20 and 21, the light emitting part has a polyhedral shape, but the present invention is not limited to this, and a semiconductor light emitting element (bullet can be used on the surface of a mounting substrate or core having a spherical or irregular three-dimensional structure). And SMD may be implemented.

(Modification 41)
Although the case where LED was used as a semiconductor light-emitting element was demonstrated in said each embodiment and each modification, it is not restricted to this, You may use light-emitting elements other than LED. Other light emitting elements include, for example, LD (laser diode) and EL (electric luminescence) light emitting elements (including organic and inorganic) and the like, and LEDs may be used in combination.

(Modification 42)
Although the glove of A type and R type was utilized in each above-mentioned embodiment and each modification, it is not restricted to this. For example, it may be of B or G type, or may be completely different in shape from the bulb shape of the incandescent lamp or the globe shape of the compact fluorescent lamp.

Also, the glove may be transparent so that the inside can be seen, or semitransparent so that the inside can not be seen. As a method of making it semitransparent, for example, there is a method of applying a diffusion layer containing calcium carbonate, silica, a white pigment or the like as a main component to the inner surface, or applying a treatment (for example, blasting) to make the inner surface uneven. .

Moreover, although the glove was comprised with the glass material, it can also be comprised with another material. As another material, a translucent resin, ceramic or the like may be used.

(Modification 43)
In each of the embodiments and the modifications described above, the case is made of a resin material, but may be made of another material. In the case of using a metal material as another material, it is necessary to secure insulation between the metal cap and the base. The insulation between the base and the base can be ensured, for example, by applying an insulating layer to the outer peripheral surface of the small diameter portion of the case or performing an insulation treatment on the small diameter portion. Furthermore, the glove side of the case may be made of a metal material, and the die side of the case may be made of a resin material, which can be secured by combining the two.

In each of the embodiments and the modifications described above, the surface of the case is not particularly described. However, for example, a radiation fin may be provided, or a process for improving the emissivity may be performed.

Furthermore, although the case was comprised from one member, it can also be comprised with several members. For example, a large diameter member corresponding to the large diameter portion 1561 in the illumination light source 1500 according to the modification 14 and a small diameter member corresponding to the small diameter portion 1562 may be joined with an adhesive. At this time, the large diameter member may be made of metal and the small diameter member may be made of resin.

Moreover, in each embodiment and each modification, there is a space inside the case, and the circuit unit 80 is stored inside the space, but for example, the space may be filled with a resin material. In this case, by filling the resin having the insulating property and the high thermal conductivity, the heat generated in the circuit unit 80 can be efficiently transferred by the case, and the heat load acting on the circuit unit 80 is reduced. Can.

(Modification 44)
In each of the embodiments and the modifications described above, the case where an Edison-type base is used as the base 30 has been described, but other types, for example, a pin type (specifically, G-type such as GY or GX). ) May be used.

Further, although the base 30 is attached (joined) to the case by screwing it to the screw portion (small diameter portion) of the case using the female screw of the shell portion 33, it is joined to the case by another method Also good. Other methods include adhesive bonding, caulking bonding, press-in bonding, and the like, and two or more of these methods may be combined.

In addition, although half or more of the shell portion 33 is screwed to the screw portion of the cylindrical small diameter portion of the case, the small diameter portion may be attached to the case shorter than the embodiment. In this case, the electronic components of the circuit unit 80 may be located inside the shell portion 33. In such a case, the shell 33 may be filled with an insulating resin. Thus, the insulation between the electronic component and the die is secured, and by using the resin having high thermal conductivity, the heat generated in the electronic component can be efficiently transferred by the die.

(Modification 45)
In each of the above-mentioned embodiments and each modification, although a pedestal, a stem, and a support member were constituted by another member, it is not limited to this. For example, the support member may be integrally formed with the base or may be integrally formed with the stem.

(Modification 46)
As in the modification 45, when the base and the support member, and the stem and the support member are integrally formed, the base (or the base) is arranged such that the

lead wires

71 and 72 are wired through the inside of the support member. It may be integrally molded with the stem) and the support member. In this case, the

feed terminals

24a and 24b may be provided at the center of the mounting substrate.

When the antenna is housed inside the support member, the antenna and the antenna wire are mounted on the base so that the antenna wire connected to the antenna housed inside the support member is routed through the inside of the support member. It may be integrally molded with (or the stem) and the support member. Furthermore, the

lead wires

71 and 72, the antenna, and the antenna wire may be integrally formed with the base (or stem) and the support member.

(Modification 47)
In the above-described modifications 14 to 32, an exhaust hole and an exhaust pipe for exhausting the inside of the globe closed by the stem and enclosing helium gas in the manufacturing process are formed in the stem (in the modification 33) Is formed on the tubular portion 3312). However, the present invention is not limited thereto, and may be formed, for example, in a glove.

(Modification 48)
A high thermal conductivity layer may be provided on the inner wall of the glove in order to increase the thermal conductivity from the light emitting portion to the glove to promote heat dissipation from the glove. If it demonstrates concretely, the highly heat-conductive layer comprised with the material whose heat conductivity is higher than the material which comprises the glove may be formed in the inner wall front of a glove. As a result, heat can be more efficiently transferred between the air or the filling fluid 12 and the glove, and as a result, the heat conductivity from the light emitting portion to the glove can be enhanced. The high thermal conductivity layer is made of a translucent resin material, a metal material or the like. Examples of the light-transmitting metal material include indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO2), antimony-doped tin oxide (ATO), zinc oxide (ZnO), and the like.

(Modification 49)
In the illumination light source 2500 (see FIG. 43) according to the modification 24, the large diameter portion 2561 may not be provided with the step portion 1566 and the support groove portion 2567 on the inner peripheral surface. In this case, an adhesive or the like is used at a position along the lamp axis between the top of the glove and the lowermost end of the eyelet, that is, at a position where the total length of the illumination light source is a predetermined length. The glove and the case are fixed.

(Modification 50)
In the modifications 14 to 24 and 30 to 32, the stem is formed of the glass material, but the present invention is not limited thereto. For example, the stem may be formed of a resin material.

In order to tightly seal the inside of the globe closed by the stem, it is necessary to join the globe and the stem formed of a resin material, but for example, an adhesive can be used. It is possible to seal the inside of the glove closed with the stem by covering the glove and the stem with a sealing film other than the method using an adhesive. The sealing film may be covered from the outside or the inside of the glove.

Furthermore, when the resin material constituting the glove and the stem is a thermoplastic material, it is possible to adopt the same molding method (FIGS. 27 to 33) as in the case of the glass material.

(Modification 51)
Although the phosphor particles are mixed in the sealed body in each of the embodiments and the modifications described above, for example, a phosphor layer containing the phosphor particles may be formed on the inner surface of the glove, and further, Aside from the sealing body, a wavelength conversion member such as a fluorescent plate containing phosphor particles in the light emission direction of the semiconductor light emitting device may be provided. Here, as the temperature of the phosphor particles becomes high, the wavelength conversion efficiency decreases. Therefore, by forming the phosphor layer on the inner surface of the globe, the semiconductor light emitting device is less susceptible to the heat during light emission of the semiconductor light emitting device than when the phosphor particles are mixed in the sealing body sealing the semiconductor light emitting device. The decrease in wavelength conversion efficiency of the phosphor particles can be suppressed.

(Modification 52)
In each of the above embodiments and modified examples 9 to 17, 22 to 28, and 30 to 33, one sealing body covers one row of a plurality of semiconductor light emitting elements linearly mounted on a mounting substrate. However, the present invention is not limited to this. For example, one semiconductor light emitting element may be covered with one sealing body, or all of the semiconductor light emitting elements may be covered with one sealing body as in the first, second, eighteenth, nineteenth, and twenty ninth modifications. May be

(Modification 53)
In each of the above-mentioned modifications, the stem has a so-called dome shape, but the present invention is not limited to this. For example, a button stem or a shape with a depressed center may be used.

(Modification 54)
In each of the embodiments and the modifications described above, when the antenna is not accommodated inside the support member, the support member can be formed of a conductive member such as metal. In this case, the support member itself may function as an antenna. When the support member itself functions as an antenna, the diameter of the support member is larger than that of the helical antenna and the rod antenna, so that the width of the frequency of radio waves that can be transmitted and received becomes wider.

(Modification 55)
In each of the embodiments and the modifications described above, the support member has a rod-like shape, but the present invention is not limited to this. For example, it may be conical or trapezoidal. Further, the support member is not limited to a single member, and a plurality of members may be combined to constitute one support member. Furthermore, the number of support members is not limited to one. For example, a plurality of support members may support the light emitting unit.

(Modification 56)
In the second embodiment and

modifications

2, 4, 6, 7, 8, 15, 19, 21, and 33 described above, the case where the entire rod antenna is accommodated in the inside of the support member or the inside of the light emitting portion is described. However, it is not limited to this. For example, a part of the antenna may be configured to be exposed to the inside of the glove through the support member and the light emitting unit. In this case, it is preferable to expose the antenna in a direction approaching the area of the globe that is most exposed to the outside when the illumination light source is attached to the illumination device. By doing so, the exposed portion of the antenna is located at a position more exposed to the outside, so transmission and reception of wireless signals are less likely to be disturbed, and transmission and reception of wireless signals are more reliable. Can be done. For example, when mounted on the lighting apparatus 2 in the modification 14, it is preferable to expose the antenna in a direction approaching the top of the glove. That is, it is preferable to extend the rod antenna as it is along the lamp axis to expose the antenna so as to penetrate the mounting member of the support member and the light emitting unit.

(Modification 57)
As mentioned above, although the light source for illumination which concerns on this invention was demonstrated based on embodiment and its modification, this invention is not limited to these embodiment and modification.

For example, the present invention can also be realized as an illumination device provided with such an illumination light source. Hereinafter, the case where the light source 1 for illumination which concerns on 1st Embodiment is used is demonstrated to an example about the illuminating device which concerns on this modification.

FIG. 55 is a schematic view of a lighting device according to the present modification.

The lighting device 2 is mounted on, for example, a ceiling 3 and used.

As shown in FIG. 55, the illumination device 2 includes the illumination light source 1 and the illumination fixture 7 to which the illumination light source 1 is attached and which is turned on / off.

The lighting fixture 7 includes, for example, a fixture body 4 attached to the ceiling 3 and a lamp cover 5 attached to the fixture body 4 and covering the illumination light source 1. The lamp cover 5 is an aperture type here, and has a reflective film 8 on its inner surface that reflects the light emitted from the illumination light source 1 in a predetermined direction (here, the lower side).

The fixture body 4 is provided with a socket 6 to which the base 30 of the illumination light source 1 is attached (screwed), and power is supplied to the illumination light source 1 through the socket 6.

In this modification, since the arrangement position of the semiconductor light emitting element 22 (light emitting unit 20) of the illumination light source 1 mounted on the lighting apparatus 7 is close to the arrangement position of the filament of the incandescent lamp, It becomes close to the light emission center in the incandescent lamp.

For this reason, even if the illumination light source 1 is attached to the lighting fixture to which the incandescent lamp has been attached, since the position of the light emission center as the lamp approximates, an annular shadow is generated on the illuminated surface, etc. Problems are less likely to occur.

In addition, the lighting fixture here is an example, for example, may not have the lamp cover 5 of opening type, but may have a lamp cover of closing type, and the light source for illumination faces sideways. The lighting apparatus may be mounted and lighted in a proper posture (a posture in which the lamp axis is horizontal) or an inclined posture (a posture in which the lamp axis is inclined with respect to the central axis of the lighting device).

Further, in the present modification, the lighting device 2 is a direct attachment type in which the lighting device 7 is mounted in contact with the ceiling or wall, but the lighting device is mounted in a state embedded in the ceiling or wall It may be an embedded type, or it may be a suspended type that is suspended from a ceiling by an electric cable of a lighting fixture.

Furthermore, although the lighting fixture here lights one illumination light source to be attached, a plurality of (for example, three) illumination light sources may be attached and turned on. .

Moreover, in this modification, although the case where the light source 1 for illumination which concerns on 1st Embodiment was mounted | worn with the illuminating device 2 was demonstrated to the example, it is not restricted to this, It concerns on said each embodiment and each modification. Any illumination light source may be attached to the illumination device 2.

(Modification 58)
In the illuminating device 2 which concerns on the modification 57, although the case where the light source 1 for illumination which concerns on 1st Embodiment was mounted | worn with the lighting fixture 7 was demonstrated to the example, it is not restricted to this, Each said embodiment and each deformation | transformation Any illumination light source according to the example may be a lighting device mounted on the lighting fixture 7.

The light source for illumination and the illumination device according to the present invention have been described above with reference to the drawings based on the above embodiments and modifications. In addition, you may be an illumination light source which combines suitably the partial structure of the light source for illumination which concerns on said each embodiment, and the structure which concerns on each said modification. Further, the scale of members in each drawing is different from the actual one. Further, in the present application, the symbol “to” used to indicate a numerical range includes the numerical values at both ends thereof. Materials, numerical values, and the like described in the description in each of the above-described embodiments and the respective modifications merely exemplify preferable materials, and the present invention is not limited thereto. Further, the dimensions and ratios of the respective members in the respective drawings are given as an example, and do not necessarily coincide with the dimensions and ratios of the existing illumination light source. Furthermore, it is possible to appropriately change the configuration of the illumination light source without departing from the scope of the technical idea of the present invention.

Moreover, as for the directivity of the antenna described in each said embodiment and each modification, it is desirable that it is non-directivity.

The present invention can be widely used in general for lighting that transmits and receives wireless signals.

1, 100, 200, 300, 400, 500, 500, 600, 700, 900, 1000, 1100, 1200, 1300 illumination light source 2 illumination device 4 appliance main body 5 lamp cover 6 socket 7

illumination fixture

10, 1110

glove

20, 220, 320, 420, 620, 920, 1120, 1220

Light emitting units

21, 421, 621, 921, 1211, 1121a, 1121b, 1121c, 1221

Mounting substrates

22, 422, 622, 1122, 1222 Semiconductor

light emitting elements

23, 42 Seals 30

caps

40, 140, 240, 340, 440, 540, 1140b, 1140c, 1340

Support members

50, 150, 250, 450, 550, 1150, 1250 Base 50a Large diameter portion 50b

Small diameter portion

60, 1160 Case 61 Large diameter portion 62

small Diameter part

71, 72, 74, 75, 76, 77, 78 Lead wire 80 Circuit unit 81 Circuit board 81a Front surface 81b Back surface 83 Resonator 84 Power supply for wireless control unit 85 Clear flow circuit 86 Smoothing capacitor 87 Light emitting element control unit 88

Electronic parts

89a,

89b input terminal

89c,

89d output terminal

89e, 292, 392

antenna terminal

90, 190, 290, 390, 1390 antenna 91 antenna wire

Claims

An illumination light source including a hollow globe made of a translucent member, and receiving a wireless signal from the outside to control lighting of the semiconductor light emitting element,
The semiconductor light emitting device is supported by a support member inside the globe,
An antenna for receiving the wireless signal is disposed in the glove.
The illumination light source according to claim 1, wherein the antenna is attached to an outer surface of the support member.
The support member comprises a non-conductive member
The illumination light source according to claim 1, wherein the antenna is accommodated inside the support member.
The illumination light source according to claim 2, wherein the antenna is a helical antenna, and at least a part of the antenna is attached by being spirally wound around the support member.
The illumination light source according to claim 3, wherein the antenna is an antenna having a rod-like appearance, and the whole is accommodated inside the support member.
The antenna is an antenna having a rod-like appearance, a part of which is fixed to the outer surface of the support member, and a remaining part of the antenna projects outside the support member. The illumination light source according to claim 2.
It further has a cap for receiving power from the outside for emitting light from the semiconductor light emitting element,
The glove has an opening on the base side,
The supporting member is erected on the base in a direction extending from the base provided to close the opening of the glove to the inside of the glove,
The illumination light source according to any one of claims 1 to 6, wherein the semiconductor light emitting element is attached to an end of the support member in the extending direction.
The illumination light source according to any one of claims 1 to 7, wherein the semiconductor light emitting element is mounted on a mounting substrate.
The said mounting substrate consists of a member which has translucency. The light source for illuminations of Claim 8 characterized by the above-mentioned.
The illumination light source according to claim 9, wherein the support member is made of a translucent member.
The illumination light source according to any one of claims 8 to 10, wherein the antenna is disposed at a position avoiding a portion where the semiconductor light emitting element is mounted on the mounting substrate.
The illumination light source according to claim 11, wherein the antenna is formed on the mounting substrate in the form of a printed wiring.
The illumination light source according to claim 11, wherein the antenna is an SMD.
A plurality of mounting substrates are combined to form a polyhedron;
The light source for illumination according to any one of claims 8 to 13, wherein the semiconductor light emitting element is mounted on the outer surface of the polyhedron.
The illumination light source according to any one of claims 8 to 14, wherein the mounting substrate doubles as the support member.
The mounting substrate on which the semiconductor light emitting element is mounted is further attached to a region other than the region where the support member is provided on the upper surface of the base. The illumination light source according to item 1.
The support member has a layer structure of two or more layers in the extending direction,
17. The semiconductor light emitting device according to claim 8, wherein the semiconductor light emitting device is further attached to a layer other than the endmost layer in the extending direction among the layers constituting the layer structure. The illumination light source as described.
The light source for illumination according to claim 1, wherein a fluid having a light transmitting property and a thermal conductivity higher than that of air is enclosed in the glove.
The light source for illumination according to claim 18, wherein the light-transmissive fluid having a thermal conductivity higher than that of air is a gas.
The light source for illumination according to claim 18, wherein the light-transmissive fluid having a thermal conductivity higher than that of air is helium gas.
The base is formed integrally with the glove, thereby sealing a fluid having a light-transmitting property and a thermal conductivity higher than that of air in the glove. The illumination light source according to 18.
An illumination device comprising the illumination light source according to any one of claims 1 to 21.