JP6141060B2 - Lighting lamp and lighting equipment - Google Patents

Description

  The present invention relates to an illumination lamp using a solid light emitting element as a light source and a lighting fixture using the same.

  In an illumination lamp using a solid light-emitting element such as an LED as a light source, various heat dissipation techniques have been conventionally proposed in order to release heat generated from the light source. Patent Document 1 discloses an LED lighting device that includes “a plurality of LED chips and a conductive support member on which the plurality of LED chips are directly mounted”.

  Patent Document 2 discloses that “a substrate 3, a plurality of LED element units 1 </ b> A to 2 </ b> C (see FIG. 5) provided on the substrate 3, LED control circuits 20 of these LED element units 1 </ b> A to 2 </ b> C, A straight tubular cylinder 5 having a slit 5 a in the upper part, a base 6 located at both ends thereof, a connector 7 located between the cylindrical body 5 and the base 6 and connecting both members, and an upper part of the substrate 3 Disclosed is a fluorescent lamp type LED illuminating tube, which is comprised of a heat sink 8 positioned.

  Further, Patent Document 3 states that “a substrate provided with a plurality of LED elements on the surface, a glass tube that stores the substrate that has a cylindrical shape and bridges two spaced apart inner surfaces thereof, the substrate, and the substrate An LED lamp comprising an adhesive that joins a glass tube is disclosed.

  Furthermore, Patent Document 4 states that “a tubular body provided with a plurality of heat radiation holes, a circuit board provided inside the tubular body, and a circuit board that is evenly arranged on the circuit board and electrically connected to the circuit board. A plurality of LED lamps connected to each other, two power adapters that are respectively inserted into both ends of the tube and electrically connected to the circuit board, and disposed on the tube, An LED lamp tube is disclosed that includes a protective cover having a plate provided with a plurality of perforations provided so as to correspond to the heat dissipation holes, wherein the diameter of the perforations is smaller than the diameter of the heat dissipation holes. .

  Patent Document 5 states that “a circuit board in which LED elements are fixedly arranged at regular intervals, a plurality of AC power supply terminals and a plurality of DC power supply terminals are provided, and the circuit board is attached and fixed to the lower part thereof. An upper cover having a coupling hole formed so that the plurality of AC power supply terminals and the plurality of DC power supply terminals are exposed to the outside, and the AC supplied through the plurality of AC power supply terminals and the plurality of DC power supply terminals. A power source is converted into a DC power source, output to the LED element, senses the temperature in the device, and outputs a temperature adjustment signal, and is coupled to a side end portion of the LED drive device by a coupling member, A temperature adjustment unit that generates heat or absorbs heat according to a temperature adjustment signal of the LED drive device and adjusts the ambient temperature of the LED drive device by raising or lowering the temperature, and is provided above the circuit board. A diffusion cover that is coupled to the upper cover and diffuses the light emitted from the LED element, and is coupled to both ends of the coupled diffusion cover and the upper cover to connect a commercial power source to the AC power supply terminal And an electric connection portion provided with an AC power supply line to be supplied to the electric connection portion, and a pair of terminal pins coupled to the upper portion of the electric connection portion and electrically connected to the electric connection portion. A fluorescent lamp type LED lamp is disclosed that includes a terminal part for separating the connection part from the external environment, and the LED driving device is detachably coupled to the upper cover.

JP 2010-153761 A (Claim 1, FIG. 2) JP 2010-212043 A (paragraph 0053, FIG. 4, FIG. 5) Japanese Patent Laying-Open No. 2011-138881 (Claim 1, FIG. 3) Japanese Patent No. 4737462 (Claim 1, FIG. 1, FIG. 3) JP 2010-040696 A (Claim 1, FIG. 1)

  As in Patent Document 1 and Patent Document 2, a heat dissipation technique using a heat sink has already been adopted in many illumination lamp products. Also, as in Patent Document 3, an illumination lamp that releases heat generated from a light source without using a heat sink has been proposed.

  In such an illumination lamp, the light emitting portion provided with the light source protects the light source, and transmits, diffuses or reflects light emitted from the light source, and the outer tube made of a glass material or a resin material. (Valve) is included. However, since these glass materials or resin materials generally have a low thermal conductivity K (W / m · K), they do not contribute much to the release of heat generated from the light source of the illumination lamp. On the other hand, in order to improve the light distribution characteristics of the illumination lamp, it is necessary to increase the component ratio (area) of the light-transmitting glass material or resin material in the outer tube portion. For this reason, if the glass material or the resin material in the outer tube portion is increased in order to improve the light distribution characteristics of the illumination lamp, the heat dissipation is deteriorated.

  In order to solve this problem, in Patent Document 4, a hole is provided in an outer tube (bulb) of an illumination lamp, and heat is released from the hole. However, this conventional technique has problems in airtightness and water resistance. There is.

  In addition, Patent Document 5 performs temperature adjustment of the ambient temperature of the LED driving device in the illumination lamp. However, since the structure is complicated, there is a problem in terms of mass productivity and cost.

  The present invention has been made against the background of the above problems, and provides an illumination lamp capable of efficiently dissipating heat while using an existing outer tube (bulb) and a lighting fixture using the same. is there.

An illumination lamp according to the present invention includes a light emitting unit, a cylindrical tube that has a light emitting unit disposed therein and transmits light emitted from the light emitting unit, and a pair of caps that are fitted to both ends of the tube. has, in the cylinder tube, possess a group tube, a metal layer formed to cover at least a part of the group tube, a metal layer is formed so as to cover the inner wall of the base pipe A pair of inner wall metal layer, an outer wall metal layer formed so as to cover at least part of the outer wall in the circumferential direction of the base tube, and a pair formed so as to cover at least part of the circumferential direction of both end faces of the base tube An end metal layer, and an inner wall metal layer, an outer wall metal layer, and an end metal layer are integrally formed .

  According to the present invention, since the metal layer is formed on at least a part of the base tube constituting the tube so as to cover the base tube, the thermal conductivity K of the tube increases. For this reason, in the illumination lamp, the heat generated from the light source can be efficiently released.

1 is a perspective view showing an illumination lamp 1 according to Embodiment 1. FIG. (A) is the circumferential direction sectional drawing of the illumination lamp 1 which concerns on Embodiment 1, (b) is an axial direction sectional view of this illumination lamp 1 similarly. (A) is a figure which shows the thermal radiation path | route of the illumination lamp which does not have a metal layer, (b) is a figure which shows the thermal radiation path | route of the illumination lamp 1 which concerns on Embodiment 1. FIG. (A) is the circumferential direction sectional drawing of the illumination lamp 1a which concerns on Embodiment 2, (b) is an axial direction sectional view of this illumination lamp 1a similarly. (A) is the circumferential direction sectional drawing of the illumination lamp 1b which concerns on Embodiment 3, (b) is an axial direction sectional view of this illumination lamp 1b similarly. (A) is the circumferential direction sectional drawing of the illumination lamp 1c which concerns on Embodiment 4, (b) is an axial direction sectional view of this illumination lamp 1c similarly. (A) is the circumferential direction sectional drawing of the illumination lamp 1d which concerns on Embodiment 5, (b) is an axial direction sectional view of this illumination lamp 1d similarly. It is a perspective view which shows the illumination lamp 1e which concerns on Embodiment 6. FIG. (A) is the circumferential direction sectional drawing of the illumination lamp 1e which concerns on Embodiment 6, (b) is an axial direction sectional view of this illumination lamp 1e similarly. (A) is a figure which shows the thermal radiation path | route of the illumination lamp which does not have a metal layer, (b) is a figure which shows the thermal radiation path | route of the illumination lamp 1 which concerns on Embodiment 1, (c) is Embodiment 6. FIG. It is a figure which shows the thermal radiation path | route of the illumination lamp 1e which concerns. (A) is the circumferential sectional view of the illumination lamp 1f according to Embodiment 7, and (b) is an axial sectional view of the illumination lamp 1f. (A) is the circumferential direction sectional drawing of the illumination lamp 1g which concerns on Embodiment 8, (b) is an axial direction sectional view of this illumination lamp 1g similarly. (A) is the circumferential direction sectional drawing of the illumination lamp 1h which concerns on Embodiment 9, (b) is an axial direction sectional view of this illumination lamp 1h similarly. (A) is the circumferential sectional view of the illumination lamp 1i according to Embodiment 10, and (b) is an axial sectional view of the illumination lamp 1i. It is an axial sectional view showing a base of an illumination lamp 1i according to the tenth embodiment.

  Hereinafter, embodiments of an illumination lamp according to the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below. Moreover, in the following drawings including FIG. 1, the relationship of the size of each component may be different from the actual one. Further, in the following description, terms for indicating directions (for example, “up”, “down”, “right”, “left”, “front”, “back”, etc.) are used as appropriate for easy understanding. This is for explanation and these terms do not limit the present invention.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an illumination lamp 1 according to Embodiment 1. FIG. 2 (a) is a circumferential sectional view of the illumination lamp 1, and FIG. It is an axial sectional view. Based on these FIG.1 and FIG.2, the illumination lamp 1 is demonstrated. As shown in FIGS. 1 and 2 (a), the illumination lamp 1 includes a light emitting unit 10 in a cylindrical tube 2, for example. The light emitting unit 10 includes, for example, an LED 11, a substrate 12 on which the LED 11 is mounted and extending in the axial direction of the tube 2, and an adhesive member 13, and heat generated from the light emitting unit 10 is applied to the substrate 12. A heat sink 7 extending in the axial direction of the tube 2 is bonded as a heat transfer portion for transmitting. A plurality of LEDs 11 mounted on the substrate 12 are installed in parallel to the axial direction of the tube 2 as shown in FIG. The heat sink 7 is arranged between the substrate 12 and the tube 2. The portion of the heat sink 7 that is bonded to the substrate 12 is flat, and the portion of the heat sink 7 that is in contact with the tube 2 is arcuate along the inner wall of the tube 2. The shape of 7 is not limited to this. The heat sink 7 is bonded to the substrate 12 using an adhesive member 13 such as an adhesive or an adhesive tape. In the present embodiment, the cylindrical tube 2 is a cylindrical tube, but the present invention is not limited to this and may be another cylindrical tube such as a square tube.

  The cylindrical tube 2 in which the light emitting unit 10 and the heat sink 7 are disposed is a base tube 3 made of, for example, glass or resin, and an inner wall that is a metal layer formed to cover the inner wall of the base tube 3. And a metal layer 4. Since the material of the base tube 3 is glass or resin, the light emitted from the light emitting unit 10 is transmitted. The inner wall metal layer 4 is a transparent metal layer made of, for example, indium tin oxide, zinc oxide, tin oxide, or titanium oxide, and also transmits light emitted from the light emitting unit 10. That is, the cylindrical tube 2 composed of the base tube 3 and the inner wall metal layer 4 transmits light emitted from the light emitting unit 10 disposed therein. When the base tube 3 is made of resin, the resin material can be acrylic or polycarbonate, for example.

  Further, the inner wall metal layer 4 is formed by using a printing tube, a magnetron sputtering method, an electron beam vapor deposition method, a reactive vapor deposition method, a sol-gel method, a PLD (Pulsed Laser Deposition), a CVD (Chemical Vapor Deposition), etc. 3 is formed in a thin film shape on the inner wall. In addition, the range of the inner wall which forms the inner wall metal layer 4, and the thickness of the inner wall metal layer 4 are determined according to specifications, such as a light distribution characteristic required for the illumination lamp 1, or a heat dissipation characteristic.

  The inner wall metal layer 4 formed on the inner wall of the base tube 3 is in contact with the heat sink 7, and heat released from the substrate 12 is transferred to the inner wall metal layer 4 through the heat sink 7. To the base tube 3. The heat sink 7 and the inner wall metal layer 4 are bonded and fixed using an adhesive member (not shown) such as an adhesive or an adhesive tape.

  A pair of caps is provided at both ends of the tube 2 composed of the base tube 3 and the inner wall metal layer 4. A base provided at one end of the tube 2 is a power supply base 20a for power supply, for example, a power supply base 21a that is a base housing fitted to cover one end of the tube 2, and this It is composed of two power supply terminals 22a having an L-shaped cross section provided on the surface of the power supply base casing 21a opposite to the tube 2. The two power supply terminals 22a are provided on the power supply base casing 21a so that the L-shaped bent portions face each other. The base provided at the other end of the tube 2 is an earth base 20b for grounding. For example, an earth base housing that is a base housing fitted to cover the other end of the tube 2 21b and a ground terminal 22b provided on the surface opposite to the tube 2 of the ground cap casing 21b. The power supply base 20a and the ground base 20b may be fixed to the heat sink 7 using screws.

  Next, the operation of the illumination lamp 1 according to the first embodiment will be described. FIG. 3A is a diagram showing a heat dissipation path of an illumination lamp that does not have a metal layer, and FIG. 3B is a diagram showing a heat dissipation path of the illumination lamp 1 according to the first embodiment. In order to explain the operation of the illumination lamp 1 of the present embodiment in an easy-to-understand manner, the illumination lamp 1 of the present embodiment (FIG. 3B) and the illumination lamp without a metal layer (FIG. 3A) Will be described. When a lighting fixture equipped with an LED illumination lamp is installed on the ceiling and this illumination lamp is used as a ceiling lamp, as shown in FIGS. 3 (a) and 3 (b), as shown in FIGS. The part 10 is arranged on the ceiling side (appliance side) and the light irradiation direction 31 is directed indoors.

  In the case of an illumination lamp having no metal layer, as shown in FIG. 3A, the heat generated from the light emitting unit 10 is first transmitted to the heat sink 7 bonded to the substrate 12. The heat transmitted to the heat sink 7 is transmitted to the base tube 3 in contact with the heat sink 7, and then released to the outside of the base tube 3. Since the material of the base tube 3 is generally glass or resin, its thermal conductivity K (W / m · K) is extremely lower than that of metal. For this reason, since the heat transmitted from the heat sink 7 to the base tube 3 is difficult to be transmitted to the base tube 3 itself, the heat is often released as it is without being transmitted in the circumferential direction of the base tube 3. Therefore, in the illumination lamp shown in FIG. 3A, heat concentrates on the ceiling side portion of the base tube 3. In the conventional illumination lamp in which the metal layer is not formed on the base tube 3, the case temperature of the LED 11 is Tca, the tube wall outer wall temperature of the portion on the ceiling side is Tv1a, and the tube tube outer wall temperature on the light irradiation side (outgoing side) is Tv2a. Then, Tca≈65 ° C., Tv1a≈55 ° C., and Tv2a≈35 ° C., respectively.

  On the other hand, in the illumination lamp 1 of the present embodiment, as shown in FIG. 3B, after the heat generated from the light emitting unit 10 is transmitted to the heat sink 7, the heat transmitted to the heat sink 7 is the basis. Before being transmitted to the tube 3, it is transmitted to the inner wall metal layer 4. Since the inner wall metal layer 4 has a higher thermal conductivity K (W / m · K) than the base tube 3 made of glass or resin, the heat transferred from the heat sink 7 to the inner wall metal layer 4 is directly applied to the base tube 3. In addition to being transmitted, it is transmitted in the circumferential direction to the inner wall metal layer 4 itself, and then transmitted to the base tube 3 and released to the outside of the tube. As described above, in the present embodiment, heat is easily transmitted to a portion far from the ceiling in the base tube 3, and as a result, in the base tube 3, the concentration of heat on the ceiling side portion is suppressed. . In the present embodiment, assuming that the case temperature of the LED 11 is Tcb, the tube tube outer wall temperature of the portion on the ceiling side is Tv1b, and the tube tube outer wall temperature of the light irradiation side (outgoing side) is Tv2b, Tcb <Tca, Tv1b ≦ Tv1a and Tv2b ≧ Tv2a.

  In this way, by forming a thin metal film as the inner wall metal layer 4 on the inner wall of the base tube 3 made of glass or resin, the thermal conductivity K (W / m · K) of the cylindrical tube 2 is increased. In addition to enhancing the cooling effect of the LED 11 as the light source, the cooling efficiency of the heat sink 7 can be enhanced. For this reason, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can be lowered | hung, operation quality improves. Further, since heat is transferred to the inner wall metal layer 4 in the circumferential direction, the heat distribution of the illumination lamp 1 can be made uniform. For this reason, the thermal deformation of the tube 2 of the illumination lamp 1 can be suppressed. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is the light source can be lowered, a reduction in the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is allowed to some extent, and the capacity of the heat sink 7 can be reduced. Is possible. For this reason, the manufacturing cost of the illumination lamp 1 can be reduced and the weight of the illumination lamp 1 can be reduced.

Embodiment 2. FIG.
Next, the illumination lamp 1a according to Embodiment 2 will be described. 4A is a circumferential sectional view of the illumination lamp 1a according to Embodiment 2, and FIG. 4B is an axial sectional view of the illumination lamp 1a. In the present embodiment, the material of the base tube 3a of the illumination lamp 1a is made of resin, and the rail 8 that is a projection for holding the heat sink 7a is formed on the base tube 3a. 1 and different. In the second embodiment, the description of the parts common to the first embodiment will be omitted, and the difference from the first embodiment will be mainly described.

  The rail 8 is provided so that the inner wall of the base tube 3a protrudes in the tube in the vicinity of the intersections Ha and Hb between the flat portion and the arc portion of the heat sink 7 of the illumination lamp 1 according to Embodiment 1 shown in FIG. (FIGS. 4A and 4B) and extends in the axial direction of the tube 2a. And the inner wall metal layer 4a of the part which touches the rail 8 is also protruded in the pipe | tube inner direction so that the rail 8 protruded in the pipe | tube inner direction may be followed. These two rails 8 can hold the heat sink 7a in the cylindrical tube 2a by sandwiching the heat sink 7a. In addition, the shape of the heat sink 7a and the rail 8 shown to FIG. 4 (a), (b) shows an example of this invention, and is not restricted to these shapes.

  In the present embodiment, since the metal is formed in a thin film as the inner wall metal layer 4a on the inner wall of the base tube 3a made of resin, the thermal conductivity K (W / m · K) of the cylindrical tube 2a is increased. In addition to enhancing the cooling effect of the LED 11 as the light source, the cooling efficiency of the heat sink 7a can be enhanced. For this reason, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can be lowered | hung, operation quality improves. Moreover, since heat is transmitted to the inner wall metal layer 4a itself in the circumferential direction, the heat distribution of the illumination lamp 1a can be made uniform. For this reason, the thermal deformation of the tube 2a of the illumination lamp 1a can be suppressed. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is the light source can be lowered, a reduction in the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is allowed to some extent, and the capacity of the heat sink 7a can be reduced. Is possible. For this reason, the manufacturing cost of the illumination lamp 1a can be reduced and the weight of the illumination lamp 1a can be reduced.

  In the present embodiment, in addition to the above effects, since the material of the base tube 3a is made of resin, it is possible to design the inner wall shape of the base tube 3a in forming the base tube 3a rather than making the base tube 3a glass. The degree increases. For this reason, since it becomes possible to form the rail 8 in the base tube 3a, the rail 8 holds the heat sink 7a when the light emitting portion 10 to which the heat sink 7a is bonded is disposed in the tube 2a. Thus, the light emitting unit 10 can be disposed in the tube 2a. The heat sink 7a and the base tube 3a may be bonded and fixed using an adhesive member such as an adhesive or an adhesive tape. Thereby, since the heat sink 7a is held in the tube 2a by both the rail 8 and the adhesive member, the force for holding the heat sink 7a can be improved.

Embodiment 3 FIG.
Next, the illumination lamp 1b according to Embodiment 3 will be described. FIG. 5A is a circumferential sectional view of the illumination lamp 1b according to Embodiment 3, and FIG. 5B is an axial sectional view of the illumination lamp 1b. The present embodiment is different from the first embodiment in that the material of the base tube 3b of the illumination lamp 1b is resin, and the light emitting unit 10 is fixed to the inner wall metal layer 4b without providing the heat sink 7. In the third embodiment, description of parts common to the first embodiment will be omitted, and description will be made focusing on differences from the first embodiment.

  As shown in FIGS. 5A and 5B, in the present embodiment, a base tube flat portion 9a for installing the light emitting unit 10 is formed on a part of the inner wall of the base tube 3b in the circumferential direction. The base tube flat portion 9a extends in the axial direction of the tube 2b. Along the base tube flat portion 9a, the portion of the inner wall metal layer 4b in contact with the base tube flat portion 9a is also a flat inner wall metal layer flat portion 9b. On the inner wall metal layer flat portion 9b, the substrate 12 of the light emitting unit 10 is fixed using an adhesive member 13.

  In the present embodiment, by forming a thin film of metal as the inner wall metal layer 4b on the inner wall of the base tube 3b made of resin, the thermal conductivity K (W / m · K) of the cylindrical tube 2b is increased. And the cooling effect of LED11 which is a light source can be heightened. For this reason, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can be lowered | hung, operation quality improves. Moreover, since heat is transmitted to the inner wall metal layer 4b in the circumferential direction, the heat distribution of the illumination lamp 1b can be made uniform. For this reason, the thermal deformation of the tube 2b of the illumination lamp 1b can be suppressed. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be lowered, a reduction in the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is allowed to some extent. For this reason, the manufacturing cost of the illumination lamp 1b can be reduced and the weight of the illumination lamp 1b can be reduced.

  In the present embodiment, in addition to the above effects, since the material of the base tube 3b is resin as in the second embodiment, the inner wall shape design in the molding of the base tube 3b is made rather than the glass of the base tube 3b. Increased freedom. For this reason, since it becomes possible to form the base tube flat part 9a in the base tube 3b, the inner wall metal layer 4b also becomes flat, the light emitting part 10 installed on the inner wall metal layer flat part 9b, and the inner wall metal layer 4b. And the heat transfer performance is improved. Furthermore, since the heat sink 7 is unnecessary, the assembling work can be simplified and made efficient. As a result, a high quality illumination lamp 1b can be stably manufactured.

Embodiment 4 FIG.
Next, the illumination lamp 1c according to Embodiment 4 will be described. 6A is a circumferential sectional view of the illumination lamp 1c according to Embodiment 4, and FIG. 6B is an axial sectional view of the illumination lamp 1c. The present embodiment is different from the first embodiment in that the light emitting unit 10 is directly fixed to the inner wall metal layer 4 without providing the heat sink 7. In the fourth embodiment, the description of the parts common to the first embodiment will be omitted, and the difference from the first embodiment will be mainly described.

  As shown in FIGS. 6A and 6B, in the present embodiment, the inner tube metal layer 4 is directly formed without providing the base tube flat portion 9a and the inner wall metal layer flat portion 9b as in the third embodiment. The light emitting unit 10 is fixed to the base. The substrate 12 and the inner wall metal layer 4 in the light emitting unit 10 are fixed by an adhesive member 13, and the adhesive member 13 slightly flows, so that the space between the flat substrate 12 and the arc-shaped inner wall metal layer 4 is between. The substrate 12 and the inner wall metal layer 4 are bonded and fixed while filling the gap.

  In the present embodiment, by forming a metal as an inner wall metal layer 4 on the inner wall of the base tube 3 made of glass or resin, the thermal conductivity K (W / m · K) of the tube 2 is increased. Therefore, the cooling effect of LED11 which is a light source can be improved. For this reason, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can be lowered | hung, operation quality improves. Moreover, since heat is transmitted to the inner wall metal layer 4 in the circumferential direction, the heat distribution of the illumination lamp 1c can be made uniform. For this reason, the thermal deformation of the tube 2 of the illumination lamp 1c can be suppressed. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be lowered, a reduction in the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is allowed to some extent. For this reason, the manufacturing cost of the illumination lamp 1c can be reduced and the weight of the illumination lamp 1c can be reduced.

  In the present embodiment, in addition to the above effects, the light emitting unit 10 is directly fixed to the inner wall metal layer 4, so that a complicated configuration such as installation of the heat sink 7 or formation of the base tube flat portion 9 a is not required. The cooling performance of the LED 11 and the heat distribution uniformity of the illumination lamp 1c can be improved.

Embodiment 5. FIG.
Next, an illumination lamp 1d according to Embodiment 5 will be described. FIG. 7A is a circumferential sectional view of the illumination lamp 1d according to Embodiment 5, and FIG. 7B is an axial sectional view of the illumination lamp 1d. The present embodiment is different from the fourth embodiment in that a heat conductive adhesive member 14 is used as an adhesive member for fixing the substrate 12 and the inner wall metal layer 4 in the light emitting unit 10a. In the fifth embodiment, the description of the parts common to the first and fourth embodiments is omitted, and the difference from the first and fourth embodiments will be mainly described.

  As shown in FIGS. 7A and 7B, in the present embodiment, the substrate 12 and the inner wall metal layer 4 in the light emitting portion 10a are fixed using a heat conductive adhesive member 14. The heat conductive adhesive member 14 is made of, for example, solder, silver paste, ACF (Anisotropic Conductive Film), conductive plating, or the like. And the inner wall metal layer 4 are fixed.

  In the present embodiment, by forming a metal as an inner wall metal layer 4 on the inner wall of the base tube 3 made of glass or resin, the thermal conductivity K (W / m · K) of the tube 2 is increased. Therefore, the cooling effect of LED11 which is a light source can be improved. For this reason, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can be lowered | hung, operation quality improves. Moreover, since heat is transmitted to the inner wall metal layer 4 in the circumferential direction, the heat distribution of the illumination lamp 1d can be made uniform. For this reason, the thermal deformation of the tube 2 of the illumination lamp 1d can be suppressed. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be lowered, a reduction in the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is allowed to some extent. For this reason, the manufacturing cost of the illumination lamp 1d can be reduced, and the weight of the illumination lamp 1d can be reduced.

  In the present embodiment, in addition to the above effects, the heat conductive adhesive member 14 is used to fix the substrate 12 and the inner wall metal layer 4 in the light emitting unit 10a, and therefore the illumination lamp 1c according to the fourth embodiment. In addition, the cooling effect of the LED 11 that is a light source can be further improved, and the uniformity of the heat distribution of the illumination lamp 1d can be further improved.

Embodiment 6 FIG.
Next, an illumination lamp 1e according to Embodiment 6 will be described. FIG. 8 is a perspective view showing an illumination lamp 1e according to Embodiment 6, FIG. 9A is a circumferential sectional view of the illumination lamp 1e, and FIG. 9B is an axial direction of the illumination lamp 1e. It is sectional drawing. In the present embodiment, the outer wall metal layer 5 that is a metal layer formed so as to cover a part of the outer wall of the base tube 3 in the circumferential direction, and a part of the circumferential direction of both ends of the base tube 3 are covered. The pair of end metal layers 6, which are formed metal layers, are different from the first embodiment in that they are formed integrally with the inner wall metal layer 4. In the sixth embodiment, the description of the parts common to the first embodiment will be omitted, and the difference from the first embodiment will be mainly described.

  As shown in FIG. 8, FIG. 9A and FIG. 9B, in the circumferential section of the base tube 3, the intersection H1a between the center point O of the base tube 3 and the flat portion and arc portion of the heat sink 7 is obtained. , H1b, the points where the extension lines of the two line segments intersect with the outer wall of the base tube 3 are referred to as A1a and A1b, respectively. An outer wall metal layer 5 is formed on the outer wall portion of the base tube 3 from A1a to A1b. Further, at both ends of the base tube 3, similarly to the outer wall metal layer 5, end metal layers 6 are formed on end surface portions of the base tube 3 from A1a to A1b. The outer wall metal layer 5 and the end metal layer 6 are formed integrally with the inner wall metal layer 4. In addition, the shape of the heat sink 7 of this Embodiment shows an example of this invention, and is not limited to this. Further, the inner wall, the outer wall, and both ends of the base tube 3, the range of the portion where the inner wall metal layer 4, the outer wall metal layer 5, and the end metal layer 6 are formed, and the inner wall metal layer 4, the outer wall metal layer 5, and the end portions. The thickness of the metal layer 6 is determined according to specifications such as light distribution characteristics or heat dissipation characteristics required for the illumination lamp 1e.

  Next, the operation of the illumination lamp 1e according to the sixth embodiment will be described. FIG. 10A is a diagram showing a heat dissipation path of an illumination lamp without a metal layer, FIG. 10B is a diagram showing a heat dissipation path of the illumination lamp 1 according to Embodiment 1, and FIG. FIG. 10 is a diagram illustrating a heat dissipation path of the illumination lamp 1e according to the sixth embodiment. In order to explain the operation of the illumination lamp 1e of the present embodiment in an easy-to-understand manner, the illumination lamp 1e of the present embodiment (FIG. 10C), the illumination lamp without a metal layer (FIG. 10A), and The illumination lamp 1 according to Embodiment 1 (FIG. 10B) will be compared and described. As described above, when a lighting fixture having an LED illumination lamp is installed on the ceiling and this illumination lamp is used as a ceiling lamp, in order to illuminate the room, FIGS. 10A, 10B, and 10C are used. As shown, the light emitting unit 10 including the LED 11 is arranged on the ceiling side (appliance side), and the light irradiation direction 31 is directed indoors. 10 (a) and 10 (b) are the same as FIGS. 3 (a) and 3 (b), respectively, the description thereof is omitted for FIGS. 10 (a) and 10 (b).

  Since the illumination lamp 1 according to Embodiment 1 has the inner wall metal layer 4 formed on the base tube 3, as described above, the thermal conductivity is better than the illumination lamp having no metal layer. That is, Tcb <Tca, Tv1b ≦ Tv1a, and Tv2b ≧ Tv2a. In the present embodiment, an end metal layer 6 and an outer wall metal layer 5 are provided in addition to the inner wall metal layer 4, and the inner wall metal layer 4, the end metal layer 6 and the outer wall metal layer 5 are integrally formed. Has been. As shown in FIG. 10C, the heat generated from the light emitting unit 10 and transmitted to the heat sink 7 is first transmitted to the inner wall metal layer 4. After that, heat is transmitted in the circumferential direction of the inner wall metal layer 4, transmitted from the inner wall metal layer 4 to the base tube 3, and transmitted through the inner wall metal layer 4 in the axial direction of the tubular tube 2 c and passed through the end metal layer 6. It is divided into those passing through and transmitted to the outer wall metal layer 5. As described above, in the present embodiment, since the inner wall metal layer 4, the end metal layer 6 and the outer wall metal layer 5 are formed, the heat dissipation path is increased, so that the illumination lamp 1 according to the first embodiment is more effective. Furthermore, the concentration of heat around the light emitting unit 10 and the ceiling side portion of the base tube 3 is alleviated. In this embodiment, assuming that the case temperature of the LED 11 is Tcc, the tube tube outer wall temperature of the portion on the ceiling side is Tv1c, and the tube tube outer wall temperature of the light irradiation side (outgoing side) is Tv2c, Tcc <Tcb <Tca, Tv1c ≦ Tv1b ≦ Tv1a and Tv2c ≧ Tv2b ≧ Tv2a.

  Thus, in the present embodiment, since the end metal layer 6 and the outer wall metal layer 5 are formed in addition to the inner wall metal layer 4, the thermal conductivity K (W / m · K) of the tube 2c. However, it increases further than the tube 2 of the illumination lamp 1 which concerns on Embodiment 1. FIG. For this reason, while further improving the cooling effect of LED11, the cooling efficiency of the heat sink 7 can further be improved. Thereby, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can further be lowered | hung, operation quality further improves. Moreover, since the heat distribution of the illumination lamp 1e is made more uniform than that of the illumination lamp 1 according to Embodiment 1, the effect of suppressing thermal deformation of the tube 2c of the illumination lamp 1e is improved. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be further reduced as compared with the illumination lamp 1 according to Embodiment 1, the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is reduced. The heat sink 7 can be further reduced in capacity. For this reason, the manufacturing cost of the illumination lamp 1e can be further reduced and the illumination lamp 1e can be further reduced in weight.

Embodiment 7 FIG.
Next, an illumination lamp 1f according to Embodiment 7 will be described. FIG. 11A is a circumferential sectional view of the illumination lamp 1f according to Embodiment 7, and FIG. 11B is an axial sectional view of the illumination lamp 1f. In the present embodiment, the material of the base tube 3a of the illumination lamp 1f is made of resin, and the rail 8 that is a protrusion for holding the heat sink 7a is formed on the base tube 3a. 6 and different. Further, in the circumferential cross section of the base tube 3a, two line segments extending from the center point O of the base tube 3a and the circumferential end points H2a and H2b in the arc portion of the heat sink 7a are the base tube 3a. Assuming that the points intersecting the outer wall are A2a and A2b, the outer wall metal layer 5a is formed on the outer wall portion of the base tube 3a from A2a to A2b. Also at both ends of the base tube 3a, the end metal layer 6a is formed on the end surface portion of the base tube 3a from A2a to A2b, similarly to the outer wall metal layer 5a. The outer wall metal layer 5a and the end metal layer 6a are formed integrally with the inner wall metal layer 4a. That is, in this embodiment, the end lamp metal layer 6a and the outer wall metal layer 5a are further formed on the illumination lamp 1a according to the second embodiment.

  In the present embodiment, since the end metal layer 6a and the outer wall metal layer 5a are formed in addition to the inner wall metal layer 4a, the thermal conductivity K (W / m · K) of the cylindrical tube 2d is It further increases as compared with the tube 2 of the illumination lamp 1 according to the first embodiment. For this reason, while further improving the cooling effect of LED11, the cooling efficiency of the heat sink 7a can further be improved. Thereby, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can further be lowered | hung, operation quality further improves. In addition, since the heat distribution of the illumination lamp 1f is made more uniform than that of the illumination lamp 1 according to Embodiment 1, the effect of suppressing thermal deformation of the tube 2d of the illumination lamp 1f is improved. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be further reduced as compared with the illumination lamp 1 according to Embodiment 1, the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is reduced. And further reducing the capacity of the heat sink 7a. For this reason, the manufacturing cost of the illumination lamp 1f can be further reduced and the illumination lamp 1f can be further reduced in weight.

  In the present embodiment, in addition to the above effects, since the material of the base tube 3a is made of resin, it is possible to design the inner wall shape of the base tube 3a in forming the base tube 3a rather than making the base tube 3a glass. The degree increases. For this reason, since it becomes possible to form the rail 8 in the base tube 3a, the rail 8 holds the heat sink 7a when the light emitting portion 10 to which the heat sink 7a is bonded is disposed in the tube 2a. Thus, the light emitting unit 10 can be disposed in the tube 2a. The heat sink 7a and the base tube 3a may be bonded and fixed using an adhesive member such as an adhesive or an adhesive tape. Thereby, since the heat sink 7a is held in the tube 2a by both the rail 8 and the adhesive member, the force for holding the heat sink 7a can be improved.

Embodiment 8 FIG.
Next, an illumination lamp 1g according to Embodiment 8 will be described. FIG. 12A is a circumferential sectional view of the illumination lamp 1g according to Embodiment 8, and FIG. 12B is an axial sectional view of the illumination lamp 1g. The present embodiment is different from the sixth embodiment in that the material of the base tube 3b of the illumination lamp 1g is resin, and the light emitting unit 10 is fixed to the inner wall metal layer 4b without providing the heat sink 7. Further, in the circumferential cross section of the base tube 3b, two line segments connecting the center point O of the base tube 3b and both end points H3a, H3b of the inner wall metal layer flat portion 9b are the outer walls of the base tube 3b. Assuming that the points intersecting with A3a and A3b are respectively, the outer wall metal layer 5b is formed on the outer wall portion of the base tube 3b from A3a to A3b. Also, at both ends of the base tube 3b, end metal layers 6b are formed on the end surfaces of the base tube 3b from A3a to A3b, similarly to the outer wall metal layer 5b. The outer wall metal layer 5b and the end metal layer 6b are formed integrally with the inner wall metal layer 4b. That is, in this embodiment, the end lamp metal layer 6b and the outer wall metal layer 5b are further formed on the illumination lamp 1b according to the third embodiment.

  In the present embodiment, since the end metal layer 6b and the outer wall metal layer 5b are formed in addition to the inner wall metal layer 4b, the thermal conductivity K (W / m · K) of the cylindrical tube 2e is reduced. It further increases as compared with the tube 2 of the illumination lamp 1 according to the first embodiment. For this reason, the cooling effect of LED11 can further be improved. Thereby, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can further be lowered | hung, operation quality further improves. In addition, since the heat distribution of the illumination lamp 1g is made more uniform than that of the illumination lamp 1 according to Embodiment 1, the effect of suppressing thermal deformation of the tube 2e of the illumination lamp 1g is improved. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be further reduced as compared with the illumination lamp 1 according to Embodiment 1, the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is reduced. Is further allowed. For this reason, the manufacturing cost of the illumination lamp 1g can be further reduced and the illumination lamp 1g can be further reduced in weight.

  In the present embodiment, in addition to the above effects, since the material of the base tube 3b is resin as in the seventh embodiment, the design of the inner wall shape in the molding of the base tube 3b is made rather than the glass of the base tube 3b. Increased freedom. For this reason, since it becomes possible to form the base tube flat part 9a in the base tube 3b, the inner wall metal layer 4b also becomes flat, the light emitting part 10 installed on the inner wall metal layer flat part 9b, and the inner wall metal layer 4b. And the heat transfer performance is improved. Furthermore, since the heat sink 7 is unnecessary, the assembling work can be simplified and made efficient. As a result, a high quality illumination lamp 1g can be stably manufactured.

Embodiment 9 FIG.
Next, an illumination lamp 1h according to Embodiment 9 will be described. FIG. 13A is a circumferential sectional view of the illumination lamp 1h according to Embodiment 9, and FIG. 13B is an axial sectional view of the illumination lamp 1h. The present embodiment is different from the sixth embodiment in that the light emitting unit 10 is directly fixed to the inner wall metal layer 4 without providing the heat sink 7. In addition, in the circumferential cross section of the base tube 3, two line segments extending from the center point O of the base tube 3 and both end points H4a and H4b of the adhesive member 13 intersect the outer wall of the base tube 3. If the points are A4a and A4b, an outer wall metal layer 5c is formed on the outer wall portion of the base tube 3 from A4a to A4b. Further, at both ends of the base tube 3, similarly to the outer wall metal layer 5c, end metal layers 6c are formed on end surface portions of the base tube 3 from A4a to A4b. The outer wall metal layer 5 c and the end metal layer 6 c are formed integrally with the inner wall metal layer 4. That is, in this embodiment, the end lamp metal layer 6c and the outer wall metal layer 5c are further formed on the illumination lamp 1c according to the fourth embodiment.

  In the present embodiment, since the end metal layer 6c and the outer wall metal layer 5c are formed in addition to the inner wall metal layer 4, the thermal conductivity K (W / m · K) of the cylindrical tube 2f is It further increases as compared with the tube 2 of the illumination lamp 1 according to the first embodiment. For this reason, the cooling effect of LED11 can further be improved. Thereby, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can further be lowered | hung, operation quality further improves. In addition, since the heat distribution of the illumination lamp 1h is made more uniform than that of the illumination lamp 1 according to Embodiment 1, the effect of suppressing thermal deformation of the tube 2f of the illumination lamp 1h is improved. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be further reduced as compared with the illumination lamp 1 according to Embodiment 1, the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is reduced. Is further allowed. For this reason, the manufacturing cost of the illumination lamp 1h can be further reduced, and the illumination lamp 1h can be further reduced in weight.

  In the present embodiment, in addition to the above effects, the light emitting unit 10 is directly fixed to the inner wall metal layer 4, so that a complicated configuration such as installation of the heat sink 7 or formation of the base tube flat portion 9 a is not required. The cooling performance of the LED 11 and the heat distribution uniformity of the illumination lamp 1h can be improved.

Embodiment 10 FIG.
Next, an illumination lamp 1i according to Embodiment 10 will be described. FIG. 14A is a circumferential sectional view of the illumination lamp 1i according to Embodiment 10, and FIG. 14B is an axial sectional view of the illumination lamp 1i. The present embodiment is different from the ninth embodiment in that the adhesive member for fixing the substrate 12 and the inner wall metal layer 4 in the light emitting unit 10a is a heat conductive adhesive member 14. Further, in the circumferential cross section of the base tube 3, two lines extending from the center point O of the base tube 3 and both end points H <b> 5 a and H <b> 5 b of the heat conductive adhesive member 14 are the outer walls of the base tube 3. Assuming that the points crossing each other are A5a and A5b, an outer wall metal layer 5c is formed on the outer wall portion of the base tube 3 from A5a to A5b. Further, at both ends of the base tube 3, similarly to the outer wall metal layer 5c, end metal layers 6c are formed on end surface portions of the base tube 3 from A5a to A5b. The outer wall metal layer 5 c and the end metal layer 6 c are formed integrally with the inner wall metal layer 4.

  In the present embodiment, since the end metal layer 6c and the outer wall metal layer 5c are formed in addition to the inner wall metal layer 4, the thermal conductivity K (W / m · K) of the cylindrical tube 2g is It further increases as compared with the tube 2 of the illumination lamp 1 according to the first embodiment. For this reason, the cooling effect of LED11 can further be improved. Thereby, since the operating temperature of LED11 and the drive circuit (not shown) of LED11 can further be lowered | hung, operation quality further improves. Further, since the heat distribution of the illumination lamp 1i is made more uniform than that of the illumination lamp 1 according to Embodiment 1, the effect of suppressing thermal deformation of the tube 2g of the illumination lamp 1i is improved. Furthermore, since the temperature in the vicinity of the light emitting unit 10 including the LED 11 that is a light source can be further reduced as compared with the illumination lamp 1 according to Embodiment 1, the heat resistance performance of the electronic components used in the LED 11 and the drive circuit is reduced. Is further allowed. For this reason, the manufacturing cost of the illumination lamp 1i can be further reduced, and the illumination lamp 1i can be further reduced in weight.

  In the present embodiment, in addition to the above effects, the heat conductive adhesive member 14 is used to fix the substrate 12 and the inner wall metal layer 4 in the light emitting unit 10a, so the illumination lamp 1h according to the ninth embodiment. In addition, the cooling effect of the LED 11 that is the light source can be further improved, and the uniformity of the heat distribution of the illumination lamp 1i can be improved.

  FIG. 15 is an axial sectional view showing a base of the illumination lamp 1i according to the tenth embodiment. As shown in FIG. 15, the power supply base case 21a and the ground base case 21b are fitted to both ends of the cylindrical tube 2g in a state where the power supply base case 21a and the ground base case 21b are in contact with the pair of end metal layers 6c. The power supply base case 21 a and the ground base case 21 b are bonded and fixed to the base tube 3 or the outer wall metal layer 5 c by an adhesive member 23. At this time, in order to further improve the heat dissipation performance of the cylindrical tube 2g, the power supply base casing 21a and the ground base casing 21b are preferably made of metal on the entire surface or the whole. When insulation is required for the power supply cap casing 21a and the ground cap casing 21b, the power supply cap casing 21a and the ground cap casing 21b are preferably a resin having thermal conductivity. As a result, the power supply base 20a and the ground base 20b promote the cooling of the LED 11 and the LED drive circuit, which are light sources, and the uniform heat distribution of the illumination lamp 1i.

Embodiment 11 FIG.
Next, the lighting fixture which concerns on Embodiment 11 provided with the illumination lamp of this invention is demonstrated. The illumination lamp of the present invention can be installed on a ceiling and used as an illumination device for a ceiling, or can be installed on a desk while being covered with an acrylic cover, for example, and used as an illumination device that illuminates the desk. In addition, the lighting fixture provided with the illumination lamp of this invention is not limited to these uses, It can also be set as another lighting fixture.

  1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i Illumination lamp, 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g Tubular tube, 3, 3a, 3b Base tube, 4, 4a, 4b inner wall metal layer, 5, 5a, 5b, 5c outer wall metal layer, 6, 6a, 6b, 6c end metal layer, 7, 7a heat sink, 8 rail, 9a base tube flat part, 9b inner wall metal layer flat part DESCRIPTION OF SYMBOLS 10,10a Light emission part, 11 LED, 12 board | substrate, 13 adhesive member, 14 thermally conductive adhesive member, 20a power supply base, 20b ground base, 21a power supply base case, 21b ground base case, 22a power supply terminal, 22b ground Terminal, 23 Adhesive member, 31 Irradiation direction.

Claims (10)

A light emitting unit;
A cylindrical tube that is disposed inside and transmits light emitted from the light emitting unit; and
A pair of caps fitted to both ends of the tube,
The tube is
A base tube,
Have a, a metal layer formed to cover at least a part of the group pipe,
The metal layer is
An inner wall metal layer formed to cover the inner wall of the base tube;
An outer wall metal layer formed to cover at least a part of the outer wall in the circumferential direction of the base tube;
A pair of end metal layers formed so as to cover at least part of the circumferential direction of both end faces of the base tube,
The illumination lamp , wherein the inner wall metal layer, the outer wall metal layer, and the end metal layer are integrally formed . The material of the base pipe, according to claim 1 Symbol placement illumination lamp characterized in that it comprises a glass or resin. The illumination lamp according to claim 1 or 2 , wherein the metal layer is made of indium tin oxide, zinc oxide, tin oxide, or titanium oxide. The metal layer, printing, sputtering, vapor deposition, sol-gel method, one of the claims 1 to 3, characterized in that it is formed by using a pulsed laser deposition method or a chemical vapor deposition An illumination lamp according to claim 1. The light emitting unit
LED,
A board on which the LED is mounted,
The heat transfer part which transfers the heat which generate | occur | produces from the said light emission part to the said metal layer is interposed between the said board | substrate and the said metal layer. The any one of Claims 1-4 characterized by the above-mentioned. The illumination lamp described in. The light emitting unit
LED,
A board on which the LED is mounted,
Between the substrate and the metal layer, a heat transfer unit that transfers heat generated from the light emitting unit to the metal layer is interposed,
The heat transfer part is formed with a flat part on which the substrate is placed and an arc part in contact with the tube,
The outer wall metal layer and the end metal layer are regions sandwiched between two line segments connecting the center point of the cylindrical tube and the intersection of the flat portion and the arc portion of the heat transfer portion. The illumination lamp according to claim 1 , wherein the illumination lamp is formed as follows. The illumination lamp according to claim 5 or 6 , wherein a protrusion for holding the heat transfer portion is formed on the base tube. The illumination lamp according to any one of claims 1 to 7 , wherein a flat portion on which the light emitting portion is placed is formed inside the base tube. The pair of bases has a pair of base cases covering both ends of the cylindrical tube,
The illumination lamp according to any one of claims 1 to 8 , wherein a material of a surface of the base casing includes a metal or a resin having thermal conductivity. An illumination fixture comprising the illumination lamp according to any one of claims 1 to 9 .

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