JP2012123924A - Lighting unit and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin-shaped lighting unit which is excellent in light-emitting characteristics and heat generation efficiency in a light-emitting device using light-emitting elements.SOLUTION: The lighting unit includes a circuit board, the light-emitting elements mounted on one surface of the circuit board, and electrode pins arranged in direct extention from the other surface of the circuit board for supplying power from the outside to the light-emitting elements. Heat generated from the light-emitting elements is efficiently radiated from an exposed surface of the circuit board by making at least a part of the other surface of the circuit board exposed to the outside while it is served as a case of the lighting unit.

Description

  The present invention relates to an illumination unit including a semiconductor light emitting element such as an LED (light emitting diode), and an illumination device using the illumination unit.

  In recent years, LEDs having high brightness and a semi-permanent lifetime have been used for lighting fixtures. However, an illumination unit that is attached to this lighting fixture and that turns on the illumination light source by power supply from the outside and that requires high-intensity light emission increases the heat generation of the LED as the LED of the light source becomes higher in luminance. In addition to adversely affecting the light emission efficiency and life of the LED itself, the heat generation also deteriorates the components of the lighting unit, thus causing problems in light emission characteristics and durability.

  In addition, as lighting fixtures using LEDs are used in various lighting fields, thin lighting units have been required. For this reason, various structures have been proposed in which the heat generated by the LED is actively dissipated to improve the heat dissipating characteristics and to reduce the thickness (for example, Patent Document 1). In describing the background art, the lighting apparatus disclosed in Patent Document 1 will be described with reference to FIGS. FIG. 8 is a cross-sectional view showing components of a conventional lighting unit, and FIG. 9 is an exploded perspective view showing a state when the conventional lighting unit is loaded into the socket body of the lamp socket.

  The lighting unit 100 shown in FIG. 8 includes a plurality of LEDs 124 and a metal lamp device body 131 (housing) to which a base 130 including a pair of electrode pins 128 and a metal protrusion 129 is attached. The circuit board 120 on which various electronic components 126 are mounted is inserted and thermally coupled, so that heat generated by the LED 124 can be transmitted to the lamp device main body 131. The pair of electrode pins 128 described above is fixed to the lamp device main body 131 through an insulating bush 127, and is connected to a wiring pattern (not shown) on the circuit board 120 by soldering or the like by wiring 125. Yes. In the illumination unit 100, a light emitting surface cover case 133 is provided on the light emission side of the LED 124 of the circuit board 120 to protect electronic components including the LED 124.

  The base 130 has a shape applied to an IEC standard GX53 base, and the electrode pins 128 of the base 130 are attached to mounting holes 204a provided in the socket body 204 of the lamp socket 200 shown in FIG. The LED 124 can be supplied with electric power from the external power supply on the lamp socket side via the electrode pins 128. Further, the L-shaped recess 135 formed on the side wall of the projection 129 of the lighting unit 100 rotates and engages with a locking projection (not shown) formed in the mounting hole 202 of the socket main body 204, so that the electrode The lighting unit 100 is fixed to the lamp socket 200 together with the pin 128. In addition, the inside of the protrusion 129 of the base 130 is hollow, and the electronic component 126 mounted on the circuit board 120 is accommodated therein.

  In this way, when the conventional lighting unit 100 is loaded into the lamp socket 200, it is electrically connected to the external power source. Further, the heat generated by the LED 124 is transmitted to the metallic lamp device body 131 by heat conduction, and is conducted from the lamp device body 131 in contact with the surrounding air by convection and heat radiation.

JP 2010-129488 A (page 4-5, FIGS. 1 to 2)

  However, the lighting unit 100 shown in FIG. 8 includes electronic components 126 and LEDs 124 on both sides of the circuit board 120, respectively, and a hollow area exists between the light emitting surface cover case 133 and the circuit board 120, thereby blocking air. There is a layer. Then, since the conventional lighting unit 100 has a configuration having an air blocking layer, when the light source is turned on for a long time, heat generated in the LED and the electronic component is not conducted to the light emitting surface cover case 133. The LED 124 hardly radiates heat from the light irradiation side.

  The electronic component 126 is housed in a hollow area inside the protrusion 129. The heat generated by the electronic component attaches to the socket body 204 or the socket body 204 via the circuit board 120 and the lamp device body 131. It is conveyed to the top board and lamp case. This heat conduction route is a heat conduction route through a contact portion between the outer extending portion of the circuit board 120 and the inner edge portion of the lamp device main body 131. However, there is a limit to lowering the thermal resistance of this part, and sufficient heat dissipation cannot be performed with the temperature of the heat generating part lowered.

  Further, in terms of reducing the thickness of the illumination unit, the conventional configuration requires an inner space for accommodating the light emitting surface cover case 133 and the circuit board 120. Therefore, in this structure, the thickness of the illumination unit 100 is reduced. There is a limit in that.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination unit that has excellent heat dissipation characteristics and can be thinned, and an illumination device including the illumination unit. It is to be.

  As a means for solving the above problems, the illumination unit of the present invention is characterized by a circuit board, a light emitting element mounted on one side of the circuit board, and a direct extension from the other side of the circuit board. And an electrode pin for supplying electric power from the outside to the light emitting element, and at least a part of the other surface of the circuit board is also exposed as a lighting unit casing.

  Under the above configuration, at least a part of the other surface of the circuit board is exposed also as a housing, so that convection from the exposed surface and heat conduction by heat radiation are performed. And since the circuit board itself functions as a heat sink, it is better that a surface treatment is performed to increase the emissivity.

  Moreover, since the structure which attaches to a lamp socket in the state which exposed circuit board itself is taken, the effect which can make a lighting unit thin can also be acquired.

  In addition, the lighting device of the present invention is the other surface of the circuit board when the lighting unit having the above-described configuration is loaded in the lamp socket, the surface exposed as the lighting unit housing, and the lamp socket. It is preferable to thermally join the surface of the ring-shaped heat dissipation member.

  Under the above configuration, heat is conducted from the circuit board of the lighting unit to the socket body, and heat radiation is also performed from the lamp socket. The heat dissipation area is expanded and the heat transfer by convection and heat radiation is significantly improved.

As described above, since at least a part of the other surface of the circuit board is exposed as a housing, heat generated in the light emitting element is efficiently radiated from the exposed surface. In other words,
Since the circuit board itself functions as a heat radiating plate, an effect of significantly increasing the heat radiation efficiency as compared with the conventional configuration is obtained.

  In addition, the configuration of the present invention makes it possible to configure an illumination unit without a housing corresponding to the lamp device main body and a light emitting surface cover case as in the conventional configuration, and the illumination unit can be made extremely thin. An effect is also obtained.

It is the perspective view seen from the socket attachment surface side of the illumination unit which concerns on 1st Example of this invention. It is sectional drawing of the AA cutting line in FIG. It is the perspective view seen from the lower surface side (illumination light emission surface side) of the illumination unit shown in FIG. It is principal part sectional drawing of the illuminating device which attached the illumination unit shown in FIG. 1 to the lamp socket. It is principal part sectional drawing of the illuminating device which concerns on 2nd Example of this invention. It is principal part sectional drawing of the illumination unit which concerns on 3rd Example of this invention. It is principal part sectional drawing of the illuminating device which attached the illumination unit in FIG. 6 to the lamp socket. It is sectional drawing which shows the structure of the conventional illumination unit. It is the perspective view which showed the state which loads the conventional illumination unit in a socket main body.

[First embodiment]
[Description of Illumination Unit Configuration] FIG.
A first embodiment for carrying out the present invention will be described below with reference to FIG. FIG. 1 is a perspective view of the lighting unit 10 according to the first embodiment, viewed from the socket mounting surface side.

  In FIG. 1, 10 represents an illumination unit, and 20 represents a circuit board. The circuit board 20 is configured by using the metal core substrate 21 as a main component, and a base 30 corresponding to the base 130 and the protrusion 129 in the above-described conventional example (FIG. 8) is provided at the center of the metal core substrate 21. And the protrusion part 29 is provided. The metal core substrate 21 is a substrate in which an LED (not shown) is directly mounted on the back surface side in the drawing, and also serves as a housing of the illumination unit 10 and directly from the metal core substrate 21 exposed on the surface. The heat generated in can be dissipated.

  In addition, a pair of electrode pins 28 are directly fixed to the metal core substrate 21 via the insulating sleeve 27 on both sides of the projecting portion 29 constituting the base 30, and correspond to the base of the GX 53. It protrudes from the surface of the unit 10.

The protrusion 29 and the pair of electrode pins 28 of the first embodiment have a shape adapted to a base of GX53 standardized by IEC (International Electrotechnical Commission), similarly to the conventional example shown in FIG. Therefore, when the protrusion 29 and the electrode pin 28 are attached to an attachment hole provided in the socket body described later, an L-shaped recess 35 formed on the side wall of the protrusion 29 and a locking protrusion formed in the attachment hole, And the electrode pin 28 jointly fix the lighting unit 10 to the lamp socket, and receives power from the external power supply on the lamp socket side to the electrode pin 28 to supply power to the LED.
[Description of Internal Configuration of Lighting Unit 10] FIGS.
Next, the internal configuration of the illumination unit 10 will be described with reference to FIGS. 2 and 3. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 3 is a perspective view of the illumination unit 10 shown in FIG.

  As shown in FIGS. 2 and 3, the circuit board 20 has a metal core substrate 21 made of a metal having excellent thermal conductivity such as aluminum as a core member, and at least a surface on which a circuit pattern is formed has an insulating layer 22 and its surface. Has wiring patterns 23a and 23b arranged in necessary portions. As shown in the figure, the insulating layer 22 may be formed only on one surface of the metal core substrate 20, or the opposite surface may be covered with the insulating layer 22 in the same manner.

  An LED block 25 in which a plurality of LEDs 24 are arranged is mounted at the center of the lower surface side (hereinafter referred to as the illumination light emitting surface side) of the circuit board 20. Further, various electronic components 26 for driving the LED 24 are disposed around the LED 24, and the LED 24 and the various electronic components 26 are electrically connected by the wiring pattern 23a. In addition, a circuit formed of an insulating layer 22 and a wiring pattern 23b is formed in the cavity area of the protrusion 29 provided in the center of the circuit board 20 on the upper surface side (hereinafter referred to as the socket mounting surface side). Various electronic components 26 constituting the power supply circuit are mounted and connected to the wiring pattern 23a on the illumination light emitting side through a through hole of the circuit board 20 (not shown).

  Further, as described above, a pair of electrode pins 28 are directly fixed to the metal core substrate 21 via the insulating sleeve 27 on both sides of the projecting portion 29 constituting the base 30, and the lower end portion of the circuit substrate 20 Connected to the wiring pattern 23a, the LED 24 can be supplied with power for light emission. In addition, on the upper surface side of the metal core substrate 21, the upper surface other than the portion where the pair of electrode pins 28 and the protrusions 29 are provided is exposed. That is, the exposed surface 21a is a surface on which the base of the metal core substrate 21 is exposed.

  Further, as shown in FIGS. 2 and 3, the illumination light exit surface side of the circuit board 20 is covered with a first coating film 31 made of a transparent resin with a plurality of LEDs 24 arranged in the center. Thus, the LED block 25 is configured. At this time, the first coating film 31 looks yellow when a pseudo white LED in which a blue LED and a yellow phosphor are combined is used. Various electronic components 26 mounted around the LED block 25 are covered with a second coating film 32 made of white resin, and further, the upper part of the LED block 25 and the second coating film 32 are covered. The transparent third coating film 33 is provided on the upper surface of the circuit board 20, that is, on the entire lower surface side of the circuit board 20.

According to the configuration shown in FIG. 3, the LED block 25 is seen through the first coating film 31 and the third coating film 33 in the center of the circuit board 20 on the illumination light emitting side. However, the various electronic components 26 arranged around them are covered with a second coating film 32 (a hatched portion) made of white resin, so that the electronic components 26 appear as indicated by broken lines. Disappear. The operation of the second coating film 32 made of white resin will be described later.
[Contrast of Lighting Unit and Conventional Lighting Unit] FIGS. 1-2, 8
Next, the operation when the configuration of the present embodiment is implemented will be described by comparing the illumination unit 10 (FIGS. 1 and 2) of the present embodiment with the conventional illumination unit 100 (FIG. 8).

  In the conventional configuration (FIG. 8: lighting unit 100), the heat generated by the LED 124 is transmitted to the circuit board 120 by heat conduction, and further transferred from the surface of the circuit board 120 to the lamp device main body 131. Here, the heat of the circuit board 120 is considered to be convection to the air in the closed internal space in the lamp device main body 131. However, in a steady state, the temperature difference between the air of the circuit board 120 and the internal space is small, and due to convection. There is little heat transfer. Similarly, since there is little temperature difference with the wall surface of the internal space, there is almost no heat transfer by heat radiation. The main heat transfer is transmitted from the circuit board 120 to the lamp device main body 131 from the first heat transfer route through which heat is transferred by convection and heat radiation toward the outside through the device casing, and the lamp device main body 131. The second heat transfer route is a heat transfer from the cap 130 to the outside by convection and heat conduction.

  Here, as described above, the first heat transfer route radiating heat from the surface of the circuit board 120 is convection and heat radiation to the closed internal space, and the temperature raising member is directly exposed to the outside. Therefore, the heated air is convectively transferred to the lamp device main body 131 on the inner wall surface. The heat transfer coefficient of this heat transfer route is extremely low.

  In addition, the second heat transfer route that is radiated to the outside from the lamp device main body 131 and the base 130 through the lamp device main body 131 can be radiated to the outside from the top of the base 130, and therefore, compared to the first heat transfer route. Although a certain heat radiation effect can be obtained, since the lamp device main body 131 itself that transfers heat from the circuit board 120 as a heat source to the base 130 uses a thin metal with a small thickness, the thermal resistance is large, and the circuit board 120 This heat generation cannot be sufficiently transmitted to the base 130, and it is difficult to obtain high heat dissipation efficiency.

  On the other hand, as shown in FIG. 2, the lighting unit 10 according to the present embodiment uses a thick metal core substrate 21 as a core member of the circuit board 20, and a protrusion 29 as a base 30 is formed on the metal core substrate 21. Since the circuit board 20 is exposed directly to the central portion and the entire periphery of the protrusion 29 also serves as the illumination unit housing, heat is directly radiated from the wide surface of the exposed metal core substrate 21 to the outside. And extremely high heat dissipation efficiency can be obtained. In addition, heat conduction from the metal core substrate 21 corresponding to the second heat dissipation route in the conventional configuration to the outside through the protrusion 29 is also conducted directly from the metal core substrate 21 having high heat dissipation efficiency to the protrusion 29. High heat dissipation efficiency can be obtained. Further, in the lighting unit 10, the heat transmitted through the metal core substrate 21 is positively transmitted to the outside through the first or second coating films 31 and 32 and the third coating film 33. Can be dissipated.

Also, in terms of the thickness of the illumination unit 10, in the conventional illumination unit 100 shown in FIG. 8, the lamp device main body 131 and the illumination light emitting surface side on the socket mounting surface side with respect to the circuit board 120. , There are members that increase the thickness of the apparatus, such as the presence of the light emitting surface cover case 133. On the other hand, in the illumination unit 10 in this embodiment, the circuit board 20 also functions as an illumination unit housing, and a protective third covering film 33 is provided on the illumination light emitting surface side of the light emitting surface cover case. Since it also serves as a function, the overall thickness of the lighting unit 10 can be significantly reduced compared to the conventional lighting unit 100.
[Description of Configuration of Lighting Device] FIG.
Next, the lighting device with the lighting unit 10 attached to the lamp socket will be described with reference to FIG. FIG. 4 is a cross-sectional view of a main part showing a state in which the illumination unit 10 is attached to the lamp socket.

  In FIG. 4, a lamp socket 50 is composed of a socket body 51 made of an insulating member and a lamp cover 52 (or top plate) made of a metal material such as aluminum having a high thermal conductivity, and the socket body 51 and the lamp cover. 52 is integrally joined.

  The socket body 51 has a ring shape having a mounting hole 51a for attaching the projection 29 of the base 30 and a pair of mounting holes 51b that engage with a pair of electrode pins 28 provided on the circuit board 20 at the ring portion. It has a shape that can be adapted to the base of GX53.

The socket body 51 has an external power supply unit (not shown) inside the mounting hole 51b. When the electrode pin 28 is inserted into the mounting hole 51b and the circuit board 20 is turned slightly, the electrode pin 28 is The power can be supplied to the electrode pin 28 from the socket body 51 side by contacting the power supply portion in the mounting hole 51b. At this time, as shown in FIG. 1, the engagement between the L-shaped recess 40 formed on the side wall of the protrusion 29 and a locking protrusion (not shown) provided in the mounting hole 51 a of the socket body 51 is performed. The lighting unit 10 is fixed to the socket body 51 side and is supplied with lighting power.
[Description of Action of Lighting Unit] FIG.
Next, the light emission operation and the heat transfer mechanism of the illumination unit 10 will be described with reference to FIG. In FIG. 4, an arrow line Pm represents outgoing light, and an arrow line Pn represents reflected light. An arrow line To represents a heat transfer direction indicating a heat flow.

  As shown in FIG. 4, when the lighting unit 10 is attached to the socket body 51, power is supplied from the socket body 51 to the lighting unit 10 via the electrode pins 28. At this time, the LED 24 of the LED block 25 emits light, and the emitted light toward the illumination light exit surface side passes through the two transparent coating layers of the first coating film 31 and the third coating film 33 and exits. It is emitted as incident light Pm. Further, the emitted light emitted from the LED block 25 to the side is reflected by the second coating film 32 made of a white resin covering various electronic components 26 and emitted as reflected light Pn.

  As described above, the light emitted from the LED block 25, including the reflected light Pn, is utilized as much light as possible to the illumination light exit surface side as effectively as possible. Here, the function of the second coating film 32 made of a white resin covering various electronic components 26 will be described. If the various electronic components 26 are exposed without providing the second coating film 32 made of white resin, a part of the radiated light emitted from the LED block 25 is exposed. However, since the various electronic components 26 are different in shape and color, the reflection direction and light absorption are different for each component, and the amount of reflected light is reduced, resulting in a deterioration in luminous efficiency. On the other hand, the second coating film 32 made of white resin has high reflection efficiency and the reflection direction can be controlled in a desired direction, so that the utilization efficiency of the reflected light Pn can be increased.

  At this time, the heat generated by the light emission of the LED 24 in the LED block 25 is transmitted to the metal core substrate 21 directly under the LED 24 by heat transfer, and further, this heat spreads over the entire surface of the metal core substrate 21 having high thermal conductivity. Then, heat is transferred to the outside from the wide exposed surface 21a that also functions as a lighting unit housing and is exposed on the surface. At this time, the exposed surface 21 a on the socket mounting surface side of the circuit board 20 is directly exposed to the outside air inside the lamp socket 50. For this reason, heat dissipation from the metal core substrate 21 is positively promoted by convection to the air and mainly heat radiation to the lamp socket 50. Further, since the third coating film 33 is directly exposed to the outside air on the illumination light emitting surface side of the circuit board 20, heat radiation from the third coating film 33 is also actively performed. .

  Furthermore, the protrusion 29 directly connected to the metal core substrate 21 is brought into contact with the metal lamp cover 52 at its top, so that the lamp cover 52 having a large area can be used as a heat radiating device to perform efficient heat dissipation. Can do.

Note that the metal core substrate 21 and the protrusions 29 constituting the lighting unit 10 of the present embodiment use a metal such as aluminum material, copper, or copper alloy material with high thermal conductivity in order to have high heat dissipation characteristics. good. In addition, the coating film materials such as the first coating film 31, the second coating film 32, and the third coating film 33 used on the illumination light emitting surface side are designed to be thin in order to improve heat conduction. It is good to do. Furthermore, it is preferable to use a material having high thermal conductivity and high emissivity. For example, glass with high thermal conductivity, silicon resin or polycarbonate resin with high emissivity, and the like are suitable.
[Second Embodiment]
[Description of Configuration of Lighting Device] FIG.
Next, the structure of the illumination device according to the second embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view of the main part showing a state in which the lighting unit 10 is attached to the lamp socket. The basic configuration is the same as that of the lighting device of the first embodiment shown in FIG. In addition, overlapping explanation is omitted.

  The difference between the illumination device of the second embodiment shown in FIG. 5 and the illumination device of the first embodiment shown in FIG. 4 is only the configuration on the lamp socket side. That is, the lamp socket 50 of the first embodiment is constituted by the socket body 51 made of an insulating member and the lamp cover (top plate) 52 having excellent thermal conductivity, but the lamp socket 60 of the second embodiment is A metal heat radiating member 61 made of an aluminum material having high thermal conductivity is provided on the outer periphery of the socket main body 51 by an insulating member, and heat generated in the LED 24 is efficiently transmitted to the lamp cover 52 via the heat radiating member 61. It is in the point which is trying to be done. The socket body 51, the heat radiating member 61, and the lamp cover 52 are integrally joined.

In the configuration of the lighting device of the second embodiment, when the lighting unit 10 is loaded in the lamp socket 60, the exposed surface 21a of the circuit board 20 that also has the housing function of the lighting unit 10 is the lamp of the lamp socket 60. The heat dissipating member 61 made of a metal material and having a high thermal conductivity is provided integrally with the cover 52. The heat generated by the light emission of the LEDs 24 in the LED block 25 of the lighting unit 10 spreads over the entire surface of the metal core substrate 21. The heat is transmitted to the lamp cover 52 through the heat radiating member 61 having high thermal conductivity, and is radiated from the wide surface of the lamp cover 52 to the outside by convection and heat radiation. In response to the above action, the lighting device of the present embodiment can obtain an extremely high heat dissipation effect. Since other configurations and operations are the same as those in the first embodiment, detailed description thereof is omitted here.
[Third embodiment]
[Description of Illumination Unit Configuration] FIG.
Next, the configuration of the illumination unit of the third embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view of a main part of an illumination unit according to the third embodiment of the present invention. The basic configuration of the illumination unit in the third embodiment shown in FIG. 6 is the same as that of the illumination unit 10 in the first embodiment shown in FIG. A duplicate description will be omitted.

  As shown in FIG. 6, the illumination unit 40 of the third embodiment differs from the illumination unit 10 of the first embodiment shown in FIG. 2 in that it protrudes on the upper surface side of the circuit board 20, that is, on the socket mounting surface side. The part 29 does not exist. Accordingly, in FIG. 2, the wiring pattern 23 b and the electronic component 26 provided inside the protrusion 29 of the illumination unit 10 do not exist on the exposed surface 21 a side of the circuit board 20, and these electronic components 26 are The circuit board 20 is mounted on the side of the wiring pattern 23 a provided on the illumination light emitting surface side, and is covered with the second coating film 32.

  Thus, since the socket mounting surface side of the lighting unit 40 of the present embodiment has a shape in which only the pair of electrode pins 28 protrudes from the circuit board 20, the IEC standard GU10 and GU12 are used. Applicable lighting unit shape.

In the lighting unit 10 shown in FIG. 2, the third coating film 33 is a transparent film. However, in the lighting unit 40 of this embodiment shown in FIG. 6, the third coating film 41 is used. Is replaced with a transparent film, and is composed of a milky white light diffusing film in which a light diffusing agent 41b is dispersed in a transparent resin 41a. Here, the light diffusing agent 41b includes silica (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), zirconium oxide (ZrO ₂ ), titanium oxide (TiO ₂ ), calcium carbonate (CaCO ₃ ), and zinc oxide (ZnO). ) Etc. can be used.

In this way, by using the third coating film 41 of the light diffusion film to cover the first and second coating films 31 and 32, the light emitted from the LED 24 is sufficiently diffused. The brightness of the illumination becomes uniform and the brightness can be improved.
[Description of Configuration of Lighting Device] FIG.
Next, the configuration of the illumination device of the third embodiment will be described with reference to FIG. FIG. 7 is a cross-sectional view of the main part showing a state in which the lighting unit 40 is attached to the lamp socket, and the basic configuration is the same as that of the lighting device of the second embodiment shown in FIG. A duplicate description will be omitted. The difference between the illumination device of the third embodiment shown in FIG. 7 and the illumination device of the second embodiment shown in FIG. 5 is the configuration of the illumination unit and the arrangement of the heat dissipating members. Since other matters are the same, only the differences will be described below.

  The illumination unit 10 of the second embodiment shown in FIG. 5 has a projection 29 at the center of the circuit board 20, and there is a space for housing the projection 29 between the socket body 51 by the insulating member of the lamp socket 60. However, the projection unit 29 does not exist in the illumination unit 40 of the present embodiment shown in FIGS. 6 and 7. Therefore, in this embodiment, not only the ring-shaped heat radiating member provided outside the socket main body 51 of the ring-shaped lamp socket 70 but also the disk-shaped heat radiating member 61 is provided inside thereof.

  In the illumination unit 40, when the pair of electrode pins 28 of the circuit board 20 are attached to the socket body 51 of the lamp socket 70, the exposed surface 21 a of the circuit board 20 is located on the outer periphery of the socket body 51. The ring-shaped heat radiation member 61 provided is in contact with the disk-shaped heat radiation member 61 provided on the inner peripheral portion of the socket body 51.

  For this reason, the heat generated by the light emission of the LED 24 in the illumination unit 40 spreads over the entire surface of the metal core substrate 21. This heat is transmitted to the lamp cover 52 via the ring-shaped heat radiation member 61 having a high thermal conductivity and a large area and heat capacity, and the disk-shaped heat radiation member 61, and from the wide surface of the lamp cover 52 to the outside. Heat is dissipated by convection and heat radiation. For this reason, an extremely high heat dissipation effect can be obtained.

  Moreover, in this illumination unit 40, since the milky white light-diffusion film which disperse | distributed the light-diffusion agent 41b to the transparent resin 41a is used as the 3rd coating film 41, the emitted light from LED24 is in a film. It diffuses sufficiently, the brightness of the illumination becomes uniform, and the brightness can be improved.

10, 40 Lighting unit 20 Circuit board 21 Metal core board 21a Exposed surface 22 Insulating layers 23a, 23b Wiring pattern 24 LED
25 LED block 26 Electronic component 27 Insulating sleeve 28 Electrode pin 29 Protrusion part 30 Base 31 Band 1 coating film 32 Second coating film 33, 41 Third coating film 41a Transparent resin 41b Light diffusing agent 50, 60, 70 Lamp socket 51 Socket body 51a, 51b Mounting hole 52 Lamp cover 61 Heat dissipation member

Claims (4)

A circuit board;
A light emitting device mounted on one surface of the circuit board;
An electrode pin provided to extend directly from the other surface of the circuit board for supplying electric power from the outside to the light emitting element,
At least a part of the other surface of the circuit board is also exposed as a lighting unit housing. An electronic component for driving the light emitting element is disposed along with the light emitting element on one surface of the circuit board,
The electronic component is coated with a white resin,
The lighting unit according to claim 1, wherein one surface of the circuit board including the light emitting element and the white resin is coated with a transparent resin or a milky white resin. When the lighting unit according to claim 1 or 2 is loaded in a lamp socket, the other surface of the circuit board exposed as the lighting unit housing is directly exposed to air. A lighting device characterized by the above. When the lighting unit according to claim 1 or 2 is loaded in a lamp socket, the other surface of the circuit board, the surface exposed to serve also as the lighting unit housing, and the annular heat dissipation member of the lamp socket A lighting device, wherein the surface is thermally bonded.

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