EP4187145A1 - Led cluster - Google Patents
Led cluster Download PDFInfo
- Publication number
- EP4187145A1 EP4187145A1 EP21210445.9A EP21210445A EP4187145A1 EP 4187145 A1 EP4187145 A1 EP 4187145A1 EP 21210445 A EP21210445 A EP 21210445A EP 4187145 A1 EP4187145 A1 EP 4187145A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- led
- printed circuit
- circuit board
- led cluster
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/1005—Outdoor lighting of working places, building sites or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/105—Outdoor lighting of arenas or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/109—Outdoor lighting of gardens
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/40—Lighting for industrial, commercial, recreational or military use
- F21W2131/402—Lighting for industrial, commercial, recreational or military use for working places
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/40—Lighting for industrial, commercial, recreational or military use
- F21W2131/407—Lighting for industrial, commercial, recreational or military use for indoor arenas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the solution relates to LED lighting devices for indoor and outdoor lighting, such as parks, squares, pedestrian and cycle paths, parking lots, industrial facilities and residential complex.
- optically transparent lenses of large size with a diameter of up to 110 mm and more are used, which make it possible to create emitters based on LEDs or COB-LEDs with the power up to or more than 100 W.
- a bulky power supply (driver) is needed, which is usually located outside of these emitters, the connection of which requires additional structures and connection devices, expensive connectors, especially for street lights with IP67.
- driver designs are known with small dimensions and without bulky transformers and filters, and which can be located on a printed circuit board with fully automated SMT component installation without manual labor application (the so-called AC-direct drivers).
- a lighting device contains a hollow glass body, a printed circuit board of LEDs, a lens covering the LED board and a printed circuit board of the driver, the components of which are mounted on the printed circuit board so that the hinged elements are located in the cavity of the glass body ( patent EP2959209 , IPC F21K 9/233, published on 12.09.2018).
- a lighting device contains a cooling radiator 1, an insulation layer 4 on a cooling radiator 1, a printed circuit board 5 located on an insulation layer 4, LEDs 24 mounted on a high metal base 22 passing through a hole 41 in a printed circuit board 5 and having thermal contact with a radiator 1 cooling and a lens 31 of the optical system.
- the composition and thermal properties of the insulating layer 4 are not disclosed in this solution ( CN 202419582 U , IPC F21V29 / 00, published on 05.09.2012).
- An optical module includes a radiator 1 in the form of a plate with a surface equipped with a dielectric layer 7 and a hole for a sealed current lead 8, a printed circuit board 7 with LEDs mounted on the dielectric layer 7 of the radiator 1 and with the possibility of heat exchange, an optical system having a lens 4, equipped by means of fastening to the surface of the radiator 1 ( RU 166981, the applicant-author is Yu.B. Sokolov, IPC F21S2/00, published on 20.12.2016 ).
- a light-emitting structure containing a cooling radiator, an aluminum printed circuit board 1 mounted on the radiator with the possibility of heat exchange, an optical system including a group of LEDs 8 and a lens 6 fixed on the mounting surface of the printed circuit board 1, while both sides of the board 1 are provided with an insulating film 9, excluding electrical contact with the elements of the light-emitting structure ( RU 196224, the applicant is Sokolov Yu.B., IPC F21K9/00, published on 21.02.2020 ).
- the disadvantage of the known solutions is the limited heat sink, which prevents the creation of light-emitting structures with a power of the order of around 100 W and having relatively small dimensions.
- the goal of the submitted solution is to create a compact high-power multi-purpose LED cluster, which can be used in lighting devices for various purposes.
- the AC-direct driver sometimes it is called the sequential one
- all cluster manufacturing operations can be automated.
- the cluster has double isolation from the network, exceeding the requirements of all world standards.
- the technical result of the invention is an improvement in heat dissipation and a relative reduction in the size of lighting devices while increasing the safety of their use.
- the submitted solution can be characterized by the following features: An LED cluster incorporating a metal plate radiator; dielectric layer on the surface of a flat radiator; a printed circuit board, on the mounting surface of which light-emitting diodes are mounted, a lens for converting light-emitting diodes; driver components.
- the LED printed circuit board is located above the dielectric layer of the plate radiator, while a cavity is formed between the LED printed circuit board and the plate radiator, in which the driver components are located, as well as a heat sink that has thermal contact with the LED board and the thermally conductive dielectric layer of the plate radiator.
- the driver components can be mounted on the back of an LED printed circuit board or on an optional board mounted on the dielectric surface of the plate radiator.
- the shape and location of the heat sink in the space under the LED printed circuit board is selected depending on the thermal conductivity of the heat sink material, the size and layout of the driver elements.
- Figure 1 shows one of the cluster designs with a double-sided printed circuit board 1.2 with light emitting diodes 9 on the mounting side and driver components on the back of the board.
- An insulating layer is fixed on the flat cooling radiator 11, which contains a polyimide film 3 with a high breakdown voltage > (100 kV/mm) with a thickness of 40 ⁇ m or more, on which the 2.1 heatsink is installed, made of extruded aluminum of a round profile, for transferring heat from an LED printed circuit board 1.1 to a flat cooling radiator 11, which has a surface sufficient for heat exchange, while the heat sink 2.1 profile can have any form that is most convenient in each case.
- the heatsink 2.1 At the end of the heatsink 2.1 there is a double-sided printed circuit board with LEDs 9 on the upper mounting surface.
- the lens 4 is fixed to the board 1.2 by means of a shaped ring 5 made of silicone, and the whole structure is fixed to a flat cooling radiator 11 by means of a flange 6 and self-tapping screws or rivets (not shown).
- Holes 7 serve for pouring a sealing heat-conducting compound (liquid is poured into one hole, and air comes out of the other).
- Figure 2 shows a similar cluster design, with heat transfer from the LED board 1.1 to the 11 flat cooling radiator 11 through the aluminum heatsink 2.1.
- the additional lower printed circuit board 1.2 with driver components 8 is in the form of a ring that encloses the round aluminum profile of the heatsink 2.1 and is located on a flat cooling radiator 11.
- the heatsink 2.1 and the additional lower printed circuit board 1.2 of the driver are insulated with a polyimide film 3 from the plate heatsink 11.
- Flange 6, lens 4 and silicone ring 5 are fixed to the flat cooling radiator 11 using self-tapping screws or rivets with screws (not shown).
- holes 7 are intended for pouring the compound.
- Figure 3 shows the design of a cluster with two printed circuit boards: the upper one 1.1 with LEDs and the lower one 1.2 with the driver.
- the heat transfer from the LEDs' board 1.1 is carried out by an aluminum heat sink 2.2 with an aluminum hollow ring profile, and the lower driver board 1.2 and the heat sink 2.2 are located on a polyimide film 3 of a plate radiator 11.
- the above versions of the device have double electrical isolation of the entire internal circuitry from the plate radiator 11.
- the first insulation level is prepreg on printed circuit boards, which, depending on the type of boards, has a value of up to 5 kV
- the second insulation level is a polyimide film that insulates the plate radiator from all electronic components, which has a breakdown voltage of ⁇ 4 kV at a thickness of 40 microns.
- the holes 7 in the radiator 11 are used for pouring of a heat-conducting electrically insulating compound, which improves heat transfer and insulates the holes for entering the wires of the electrical network.
- Figure 4 shows a combined version with a double-sided board 1.2, containing LEDs on the upper mounting surface, and the driver components mounted on the back side the and heat sink 2 are located in the cavity 10 of the LED cluster.
- the version shown in Figure 3 is preferred because it uses the entire space under the printed circuit board 1 for driver and heat sink components, and provides efficient cooling of the LEDs and reliable electrical insulation.
Abstract
Description
- The solution relates to LED lighting devices for indoor and outdoor lighting, such as parks, squares, pedestrian and cycle paths, parking lots, industrial facilities and residential complex.
- Currently, to create direct radiation, optically transparent lenses of large size with a diameter of up to 110 mm and more are used, which make it possible to create emitters based on LEDs or COB-LEDs with the power up to or more than 100 W. For such emitters, a bulky power supply (driver) is needed, which is usually located outside of these emitters, the connection of which requires additional structures and connection devices, expensive connectors, especially for street lights with IP67.
- On the other hand, driver designs are known with small dimensions and without bulky transformers and filters, and which can be located on a printed circuit board with fully automated SMT component installation without manual labor application (the so-called AC-direct drivers).
- However, the presence of a significant number of components and, especially, the presence of electrolytic capacitors, floating over the board, does not allow these power supplies (drivers) to be placed in the under-lens space together with the LEDs.
- A lighting device is known that contains a hollow glass body, a printed circuit board of LEDs, a lens covering the LED board and a printed circuit board of the driver, the components of which are mounted on the printed circuit board so that the hinged elements are located in the cavity of the glass body (
patent EP2959209 , IPC F21K 9/233, published on 12.09.2018). - A lighting device is known that contains a cooling radiator 1, an
insulation layer 4 on a cooling radiator 1, a printedcircuit board 5 located on aninsulation layer 4, LEDs 24 mounted on a high metal base 22 passing through a hole 41 in a printedcircuit board 5 and having thermal contact with a radiator 1 cooling and a lens 31 of the optical system. The composition and thermal properties of theinsulating layer 4 are not disclosed in this solution (CN 202419582 U , IPC F21V29 / 00, published on 05.09.2012). - An optical module is known that includes a radiator 1 in the form of a plate with a surface equipped with a
dielectric layer 7 and a hole for a sealedcurrent lead 8, a printedcircuit board 7 with LEDs mounted on thedielectric layer 7 of the radiator 1 and with the possibility of heat exchange, an optical system having alens 4, equipped by means of fastening to the surface of the radiator 1 (RU 166981, the applicant-author is Yu.B. Sokolov, IPC F21S2/00, published on 20.12.2016 - Also known is a light-emitting structure containing a cooling radiator, an aluminum printed circuit board 1 mounted on the radiator with the possibility of heat exchange, an optical system including a group of
LEDs 8 and alens 6 fixed on the mounting surface of the printed circuit board 1, while both sides of the board 1 are provided with aninsulating film 9, excluding electrical contact with the elements of the light-emitting structure (RU 196224, the applicant is Sokolov Yu.B., IPC F21K9/00, published on 21.02.2020 - The disadvantage of the known solutions is the limited heat sink, which prevents the creation of light-emitting structures with a power of the order of around 100 W and having relatively small dimensions.
- The closest one to the claimed is the solution disclosed by the applicant of this invention in patent
RU 166981 - The goal of the submitted solution is to create a compact high-power multi-purpose LED cluster, which can be used in lighting devices for various purposes. In the case of using the AC-direct driver (sometimes it is called the sequential one), all cluster manufacturing operations can be automated. At the same time, in spite of the galvanic connection of all under-lens circuit technology, including LEDs and a driver, the cluster has double isolation from the network, exceeding the requirements of all world standards.
- The technical result of the invention is an improvement in heat dissipation and a relative reduction in the size of lighting devices while increasing the safety of their use.
- Within the framework of this solution, options for constructing an LED cluster combined by a single inventive concept are proposed, in which a group of LEDs (or a group of COBs) and driver components are mounted on a printed circuit board, separated from the cooling radiator. In all versions, the heat from the LEDs and the driver is transferred through a volumetric heat sink, which is thermally connected to the cooling radiator.
- The submitted solution can be characterized by the following features:
An LED cluster incorporating a metal plate radiator; dielectric layer on the surface of a flat radiator; a printed circuit board, on the mounting surface of which light-emitting diodes are mounted, a lens for converting light-emitting diodes; driver components. The LED printed circuit board is located above the dielectric layer of the plate radiator, while a cavity is formed between the LED printed circuit board and the plate radiator, in which the driver components are located, as well as a heat sink that has thermal contact with the LED board and the thermally conductive dielectric layer of the plate radiator. The driver components can be mounted on the back of an LED printed circuit board or on an optional board mounted on the dielectric surface of the plate radiator. The shape and location of the heat sink in the space under the LED printed circuit board is selected depending on the thermal conductivity of the heat sink material, the size and layout of the driver elements. - In graphic illustrations, the structural elements are indicated as follows:
- 1.1 - an LED printed circuit board,
- 1.2 - a driver printed circuit board,
- 2.1 - a heat sink made of solid aluminum round profile,
- 2.2 - a heat sink made of an aluminum hollow ring profile,
- 3 - a heat-conducting dielectric layer,
- 4 - a lens,
- 5 - a silicone ring,
- 6 - a mounting flange,
- 7 - technological holes for compound,
- 8 - driver circuit component,
- 9 - light emitting diodes (LEDs),
- 10 - a cavity between the LED board 1 and the
radiator 11, - 11 - a flat cooling radiator.
-
Figure 1 shows one of the cluster designs with a double-sided printed circuit board 1.2 withlight emitting diodes 9 on the mounting side and driver components on the back of the board. An insulating layer is fixed on theflat cooling radiator 11, which contains apolyimide film 3 with a high breakdown voltage > (100 kV/mm) with a thickness of 40 µm or more, on which the 2.1 heatsink is installed, made of extruded aluminum of a round profile, for transferring heat from an LED printed circuit board 1.1 to aflat cooling radiator 11, which has a surface sufficient for heat exchange, while the heat sink 2.1 profile can have any form that is most convenient in each case. - At the end of the heatsink 2.1 there is a double-sided printed circuit board with
LEDs 9 on the upper mounting surface. Thelens 4 is fixed to the board 1.2 by means of ashaped ring 5 made of silicone, and the whole structure is fixed to aflat cooling radiator 11 by means of aflange 6 and self-tapping screws or rivets (not shown).Holes 7 serve for pouring a sealing heat-conducting compound (liquid is poured into one hole, and air comes out of the other). -
Figure 2 shows a similar cluster design, with heat transfer from the LED board 1.1 to the 11flat cooling radiator 11 through the aluminum heatsink 2.1. The additional lower printed circuit board 1.2 withdriver components 8 is in the form of a ring that encloses the round aluminum profile of the heatsink 2.1 and is located on aflat cooling radiator 11. The heatsink 2.1 and the additional lower printed circuit board 1.2 of the driver are insulated with apolyimide film 3 from theplate heatsink 11.Flange 6,lens 4 andsilicone ring 5 are fixed to theflat cooling radiator 11 using self-tapping screws or rivets with screws (not shown). As in the first version,holes 7 are intended for pouring the compound. -
Figure 3 shows the design of a cluster with two printed circuit boards: the upper one 1.1 with LEDs and the lower one 1.2 with the driver. In this case, the heat transfer from the LEDs' board 1.1 is carried out by an aluminum heat sink 2.2 with an aluminum hollow ring profile, and the lower driver board 1.2 and the heat sink 2.2 are located on apolyimide film 3 of aplate radiator 11. - The above versions of the device have double electrical isolation of the entire internal circuitry from the
plate radiator 11. The first insulation level is prepreg on printed circuit boards, which, depending on the type of boards, has a value of up to 5 kV, and the second insulation level is a polyimide film that insulates the plate radiator from all electronic components, which has a breakdown voltage of ∼ 4 kV at a thickness of 40 microns. - The
holes 7 in theradiator 11 are used for pouring of a heat-conducting electrically insulating compound, which improves heat transfer and insulates the holes for entering the wires of the electrical network. -
Figure 4 shows a combined version with a double-sided board 1.2, containing LEDs on the upper mounting surface, and the driver components mounted on the back side the and heat sink 2 are located in thecavity 10 of the LED cluster. The heat sink 2.2 in the form of an aluminum ring, as in the previously considered versions, is located on apolyimide film 3 of the plate radiator 12. - The version shown in
Figure 3 is preferred because it uses the entire space under the printed circuit board 1 for driver and heat sink components, and provides efficient cooling of the LEDs and reliable electrical insulation.
Claims (6)
- A LED cluster includinga flat cooling radiator;a dielectric layer on the surface of the flat cooling radiator;a printed circuit board on the mounting surface of which light emitting diodes are mounted;a lens for converting radiation from light-emitting diodes;driver components,wherein the LED cluster has a cavity, located between printed circuit board light emitting diodes and the surface of the cooling radiator,this cavity contains the driver components, as well as a heatsink for transferring heat from the LED board to the flat cooling heatsink.
- The LED cluster of claim 1, wherein the dielectric layer of the flat cooling radiator contains a polyimide film having a breakdown voltage of at least ∼ 4 kV.
- The LED cluster of claim 1, wherein the driver components are mounted on the back of the LED printed circuit board.
- The LED cluster of claim 1, wherein the driver components are mounted on an additional board installed on the dielectric layer of the flat cooling radiator.
- The LED cluster of claim 1, wherein the heat sink has an aluminum round profile.
- The LED cluster of claim 1, wherein the heat sink has an aluminum hollow round profile.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21210445.9A EP4187145A1 (en) | 2021-11-25 | 2021-11-25 | Led cluster |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21210445.9A EP4187145A1 (en) | 2021-11-25 | 2021-11-25 | Led cluster |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4187145A1 true EP4187145A1 (en) | 2023-05-31 |
Family
ID=78789831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21210445.9A Pending EP4187145A1 (en) | 2021-11-25 | 2021-11-25 | Led cluster |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP4187145A1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012123924A (en) * | 2010-12-06 | 2012-06-28 | Citizen Holdings Co Ltd | Lighting unit and lighting device |
CN202419582U (en) | 2011-11-21 | 2012-09-05 | 王振辉 | Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp |
US20150330617A1 (en) * | 2012-04-19 | 2015-11-19 | Osram Gmbh | Led module |
EP2959209A1 (en) | 2013-02-19 | 2015-12-30 | Koninklijke Philips N.V. | Lighting device with improved thermal properties |
RU166981U1 (en) | 2016-04-04 | 2016-12-20 | Юрий Борисович Соколов | DOUBLE ELECTRIC INSULATION LED MODULE FOR LIGHTING DEVICES |
RU196224U1 (en) | 2019-08-02 | 2020-02-21 | Юрий Борисович Соколов | Light-emitting structure for an uninsulated driver |
-
2021
- 2021-11-25 EP EP21210445.9A patent/EP4187145A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012123924A (en) * | 2010-12-06 | 2012-06-28 | Citizen Holdings Co Ltd | Lighting unit and lighting device |
CN202419582U (en) | 2011-11-21 | 2012-09-05 | 王振辉 | Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp |
US20150330617A1 (en) * | 2012-04-19 | 2015-11-19 | Osram Gmbh | Led module |
EP2959209A1 (en) | 2013-02-19 | 2015-12-30 | Koninklijke Philips N.V. | Lighting device with improved thermal properties |
RU166981U1 (en) | 2016-04-04 | 2016-12-20 | Юрий Борисович Соколов | DOUBLE ELECTRIC INSULATION LED MODULE FOR LIGHTING DEVICES |
RU196224U1 (en) | 2019-08-02 | 2020-02-21 | Юрий Борисович Соколов | Light-emitting structure for an uninsulated driver |
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