CN202419582U - Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp - Google Patents

Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp Download PDF

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Publication number
CN202419582U
CN202419582U CN2011204629885U CN201120462988U CN202419582U CN 202419582 U CN202419582 U CN 202419582U CN 2011204629885 U CN2011204629885 U CN 2011204629885U CN 201120462988 U CN201120462988 U CN 201120462988U CN 202419582 U CN202419582 U CN 202419582U
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led
matrix
fin
circuit board
cooling
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Expired - Fee Related
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CN2011204629885U
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Chinese (zh)
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王振辉
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Abstract

The utility model relates to LED (Light-Emitting Diode) illumination, in particular to a strong-cooling LED (Light-Emitting Diode) circuit board and an LED lamp. The strong-cooling LED circuit board comprises an LED luminous body which consists of a PN junction and a LED base, as well as a cooling main body, the cooling main body consists of a basal body and a cooling fin which are of an integral structure, an insulating layer is arranged on the basal body, the PN junction is connected with the insulating layer side of the basal body through the LED base, the insulating layer is provided with a conductive line, the PN junction is electrically connected with the conductive line, the cooling fin is arranged on the side surface of the basal body, which is adjacent to the side face on which the LED base is arranged. The LED lamp consists of a mounting rack and a plurality of strong-cooling LED circuit boards. According to the utility model, the problem of the existing LED circuit board that the cooling effect is poor as the substrate and the radiator are bonded by heat-conducting glue and the cooling fin is unreasonably designed in position can be solved.

Description

Strengthen cooling LED circuit board and LED lamp
Technical field
The utility model relates to LED illumination, relate in particular to a kind of reinforcement cooling LED circuit board with and use.
Background technology
LED is as solid state light emitter of new generation, have the life-span long, energy-efficient, volume is little, environmental protection and advantage such as sturdy and durable, show with lighting field in be widely used.
The core of LED is a PN junction, and injected electrons and hole directly convert electric energy into luminous energy at the PN junction compound tense, so but the luminous energy of the conversion that is not can be mapped to outside the LED; Also have part can convert heat energy into, this heat energy has huge side effect, if can not efficiently radiates heat; The LED internal temperature is raise, and the luminous efficiency of the high more then LED of temperature is low more, and the LED light decay accelerates; The life-span of LED is shortened dramatically, can lose efficacy immediately when serious.
The version of the circuit board when existing LED is used to throw light on is: LED is installed in formation LED luminous plaque on the metal substrate with the mode of paster, then the LED luminous plaque is fitted on the radiator through heat-conducting glue, through radiator heat is lost in the air.
Though substrate can overcome between substrate and the radiator because the gapped not smooth problem of heat transmission that causes with the heat radiation glue-line between the radiator; But the thermal conductivity factor of heat-conducting glue is about 8w/mk; Substrate and radiator thermal conductivity factor are that (substrate is generally aluminum or aluminum alloy and is made about 200w/mk; The metal of using other also can be than the height of heat-conducting glue), so the existence of heat conduction glue-line, can have a strong impact on radiating effect.
Be CN101082411A at the Chinese patent publication number, open day be December 5 in 2007 day, be called disclose in the patent documentation of " LED lamp " a kind of with the lamp of LED as light source; This lamp comprises the LED lamp body, the substrate and the radiator of LED lamp body is installed; Between substrate and radiator, be provided with heat melting device and cooling piece, the former surface from LED lamp body one side of radiator is provided with radiated rib.The means of this patent are to improve radiating effect through increase fill container and cooling piece between substrate and radiator; But the connection character in fact between substrate and the container is the same with existing substrate with the connection character of radiator; If the heat of substrate can not be delivered on the fill container with keeping clear, the thermal component that then subsequent design is many does not have thermolysis more yet.
In addition, in order to improve the radiating effect of radiator, can as the version in the above-mentioned patent, on radiator, increase the area of dissipation that radiated rib increases radiator.
As number being ZL2010206691763 at Chinese patent; Name be called disclose in the patent documentation of " a kind of pendent lamp " with installing plate a kind of with the lamp of LED as light source; This lamp comprises led light source (LED luminous plaque) and housing (radiator); The led light source horizontal is covered with lampshade on the led light source on the lower surface of lamp housing, the upper surface of housing is provided with vent rib.
Be 101922638A at the Chinese patent publication number, open day be December 22 in 2010 day, be called disclose in the patent documentation of " LED fluorescent lamp " another kind of with the lamp of LED as light source; This lamp comprises pedestal (radiator); Be fixed with lampshade and light source substrate on the pedestal, lampshade covers on outside the light source substrate, and light source substrate is provided with a plurality of LED; Wherein light source substrate and the LED on it constitute the LED luminous plaque, on the surface away from light source substrate one side of pedestal, are provided with vent rib.
But the radiated rib in the existing LED module concerns all as disclosed set-up mode in the above-mentioned light fixture with the position of LED luminous plaque: vent rib and LED luminous plaque are positioned on two opposite sides of radiator.
There is following deficiency in the mode that this kind is provided with vent rib: radiator know from experience the air influence the vent rib region flowability, cause radiating effect poor.
The utility model content
The utility model provides a kind of reinforcement cooling LED circuit board and application thereof of good heat dissipation effect, has solved existing led circuit plate because substrate bonds and the not good problem of the unreasonable radiating effect that causes of radiated rib Position Design through heat-conducting glue with radiator.
Above technical problem solves through following technical proposal: a kind of reinforcement cooling LED circuit board, comprise the LED illuminator, and said LED illuminator comprises PN junction and LED base; Also comprise the heat radiation main body; Said heat radiation main body comprises matrix and radiated rib, and said matrix and said radiated rib are structure as a whole, and said matrix is provided with insulating barrier; Said PN junction is connected through the side that is provided with insulating barrier of said LED base with said matrix; Said insulating barrier is provided with the conducting wire, and said PN junction is connected electrically on the said conducting wire, and said radiated rib is positioned on the adjacent side, the side that is provided with the LED base of said matrix.The heat that the LED illuminator is produced also passes to radiated rib when directly losing through the heat radiation main body, is scattered and disappeared by radiated rib.The heat radiation main body plays substrate and the effect of radiator in the existing circuit board simultaneously, will not carry out the heat-conducting glue that heat conduction caused through heat-conducting glue and influence the problem that the substrate heat is derived thereby do not exist, feasible dispel the heat unobstructed.To be arranged on the position on the main body be position adjacent relation but not relative position relation for radiated rib and LED illuminator in addition, and main body can not influence the circulation of the air of radiated rib periphery, helps scattering and disappearing of heat.
As preferably, said insulating barrier is provided with through hole, said LED base be located in the said through hole and soldering on said matrix.If do not offer through hole; Then the heat dissipation path of LED is base, conducting wire layer, insulating barrier, matrix; But the thermal conductivity factor of insulating barrier is lower, and insulating barrier can influence shedding of PN junction heat, and radiating effect is relatively poor; And make the direct soldering of base on matrix through through hole is set, can further improve radiating effect.
As preferably, said matrix is the tabular structure of polygon, and said radiated rib is arranged on the side at thickness direction place of said matrix, and said radiated rib is positioned on the same plane with said matrix.Convenient when strengthening the assembling of cooling LED circuit board for the tabular light fixture through a plurality of.The thickness that helps lamp is made thinlyyer.
As preferably, said matrix is circular platy structure, and said radiated rib is distributed on the periphery of said matrix.Be convenient to the layout of radiated rib.
As preferably; Said radiated rib comprises some first fins, some second fins and some the 3rd fins; Said first fin and second fin all are connected on the said matrix, and said the 3rd fin is connected on said first fin, and said second fin and the 3rd fin are between first fin; All be distributed with said second fin and the 3rd fin between the first adjacent fin, second fin and the 3rd fin between two first adjacent fins parallel.The arrangement of radiated rib is reasonable, good heat dissipation effect.
As preferably, the side away from said LED illuminator place side of said matrix is provided with vent rib.Increase area of dissipation, to improve radiating effect.
As preferably; The side that the same said LED base of said matrix is connected is provided with light-passing board; Said light-passing board is provided with several to the cup away from said matrix direction convexity; Said cup is structure as a whole with said light-passing board, and the quantity of said cup equates that with the quantity of said LED illuminator said cup covers on the said LED illuminator correspondingly.Diffuser is set, and can prevent that electrode from producing exposes and security incident occurs, and security is good.The light that cup can make the LED illuminator penetrated is set is scattered, reduce dazzling sense of discomfort that human eye caused.
A kind of LED lamp; Comprise installing rack and several reinforcement cooling LED circuit boards, said reinforcement cooling LED circuit board comprises heat radiation main body and some LED illuminators, and said LED illuminator comprises PN junction and LED base; Said heat radiation main body comprises matrix and radiated rib; Said heat radiation matrix is provided with insulating barrier, and said PN junction is connected through the side that is provided with insulating barrier of said LED base with said matrix, and said insulating barrier is provided with the conducting wire; Said PN junction is connected electrically on the said conducting wire; Said radiated rib is positioned on the adjacent side, the side that is provided with the LED base of said matrix, and the side that the same said LED base of said matrix is connected is provided with light-passing board, and said installing rack is fixed together with said matrix.Lamp has several to strengthen the assembling of cooling LED circuit boards to form, between different reinforcement cooling LED circuit boards, can form and quicken the troposphere, utilize hot cellular effect to quicken to dispel the heat, and the raising radiating effect fully guarantees the lumen depreciation of LED lamp.
The utlity model has following advantage; Because the LED illuminator is set directly on the heat radiation main body, radiated rib and LED illuminator are positioned on the adjacent face of matrix, and main body can not influence the circulation of radiated rib ambient air; So good heat dissipation effect has been simplified the processing step when making; In preferred version, solve the problem that aluminium sheet can not soldering through related process, make the LED pedestal can pass insulating barrier and directly soldering on matrix, further improved radiating effect.
Description of drawings
Fig. 1 is for strengthening the elevational schematic view of cooling LED circuit board embodiment one.
Fig. 2 is A-A cross-sectional schematic of Fig. 1.
Fig. 3 is for strengthening A-A cross-sectional schematic of cooling LED circuit board embodiment two.
Fig. 4 is for strengthening A-A cross-sectional schematic of cooling LED circuit board embodiment three.
Fig. 5 is for strengthening the elevational schematic view of cooling LED circuit board embodiment four.
Fig. 6 is for strengthening the elevational schematic view of cooling LED circuit board embodiment five.
Fig. 7 is the sketch map with LED lamp of the reinforcement cooling LED circuit board among the embodiment two.
Among the figure: heat radiation main body 1, matrix 11, radiated rib 12, vent rib 13, LED illuminator 2, PN junction 21, LED base 22; Leading foot 23, silica gel 24, gold thread 25, light-passing board 3, cup 31, insulating barrier 4; Through hole 41, conducting wire 5, solder mask 6, zinc layer 7, nickel dam 8, copper layer 9; Tin layer 10, installing rack 101, fairlead 1011 is strengthened cooling LED circuit board 102, and install adjustment arm 103 is decided arm 1031; Swing arm 1032, screwed hole 1033, thread head 1034, power supply 104, power supply output line 105, power input line 106.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described.
Embodiment one, and referring to Fig. 1, a kind of reinforcement cooling LED circuit board comprises heat radiation main body 1 and a plurality of LED illuminators 2.
Heat radiation main body 1 is made by aluminium alloy.
Heat radiation main body 1 comprises matrix 11 and Duo Gen radiated rib 12.Matrix 11 is the tabular structure of quadrangle.Radiated rib 12 is distributed on four sides all around of matrix 11.Matrix 11 is structure as a whole with radiated rib 12.
LED illuminator 2 is arranged on the downside of matrix.
The downside of matrix 11 is provided with light-passing board 3.Light-passing board 3 is provided with a plurality of cups 31 to lower convexity.
Cup 31 is structure as a whole with light-passing board 3.The quantity of cup 31 equates with the quantity of LED illuminator 2.LED illuminator 2 is covered by cup 31 correspondingly.
Referring to Fig. 2, the downside of matrix 11 is provided with insulating barrier 4.
Insulating barrier 4 is provided with conducting wire 5.Conducting wire 5 forms for copper.
LED illuminator 2 comprises PN junction 21 and LED base 22.
LED base 22 is welded on the conducting wire 5.
The two poles of the earth of PN junction 21 are welded on respectively on two leading foots 23 through gold thread 25.Two leading foots 23 are welded on the conducting wire 5.
Silica gel 24 is solid on LED base 22 with an end glue of PN junction 21, gold thread 25 and two leading foots 23.
It between two parts that same two leading foots 23 of conducting wire 5 are connected not conducting.
It between the part that two parts that same two leading foots 23 of conducting wire 5 are connected are connected with the same LED base 22 of conducting wire 5 not conducting.
The part that LED illuminator 2 protrudes from matrix 11 is contained in the cup 31.The periphery sealing paste of light-passing board 3 is combined on the matrix 11.
PN junction 21 in the different LED illuminators 2 is connected in series through conducting wire 5 electricity.
On insulating barrier 4, also be provided with solder mask 6.Solder mask 6 covers conducting wire 5.Need exposing outside solder mask 6 of conducting wire 5 with the position that leading foot 23 connects.
Radiated rib 12 is positioned on the same plane with matrix 11.
Embodiment two, referring to Fig. 3, with the difference of embodiment one are:
Heat radiation main body 1 forms for aluminum.
On insulating barrier 4, be provided with through hole 41.Through hole 41 is cut to conducting wire 5 two parts that are positioned at through hole 41 both sides.Through hole 41 extend into the inside of matrix 11.
Set gradually zinc layer 7, nickel dam 8, copper layer 9 and tin layer 10 at the position corresponding to through hole 41 of matrix 41.
LED base 22 is located in through hole 41 interior also solderings on tin layer 10.
LED base 22, zinc layer 7, nickel dam 8, copper layer 9 and tin layer 10 5 are with being isolated between the conducting wire 5.
Two leading foots 23 of LED illuminator 2 are connected conducting wire 5 and are positioned on two parts of through hole 41 both sides.
The preparation method of the reinforcement cooling LED circuit board in the present embodiment is:
The first step squeezes out the aluminium section bar of making heat radiation main body 1 with aluminium.
In second step, aluminium section bar is made heat radiation main body 1 according to the preseting length severing.
In the 3rd step, on the downside of heat radiation main body 1, coat insulating cement and form insulating barrier 4.
The 4th step, on insulation glue-line 4, apply copper and form the copper layer, through etching method the copper layer is formed conducting wire 5.On insulation glue-line 4, be coated with the solder mask 6 that covers conducting wire 5 again.Need exposing outside solder mask 6 of conducting wire 5 with the position that leading foot 23 connects.
In the 5th step, get out through hole 41.Through hole 41 forms two parts that are positioned at through hole 41 both sides with conducting wire 5 cut-outs.Through hole 41 pierces in the matrix 11.
In the 6th step, the method for passing through heavy zinc at the position corresponding to through hole 41 of matrix 11 forms zinc layer 7.
In the 7th step, on zinc layer 7, form nickel dam 8 through electric plating method.
In the 8th step, on nickel dam 8, form copper layer 9 through electric plating method.
In the 9th step, the method through spray tin on copper layer 9 forms tin layer 10.
In the tenth step, LED pedestal 23 is worn in the through hole 41 and mode through soldering links together with matrix 11;
The 11 step, with the end that exposes silica gel 25 of two leading foots 23 respectively with conducting wire 5 by through hole 41 cut off and two part solderings that are positioned at through hole 41 both sides of forming together.
Embodiment three, referring to Fig. 4, with the difference of embodiment one are: on the upper side of matrix 11, be provided with vent rib 13.Can certainly on the basis of embodiment two on the upper side of matrix 11 to vent rib 13.
Embodiment four, and referring to Fig. 5, with the difference of embodiment two be: matrix 11 is circular platy structure.On all sides of matrix 11, be provided with four first fins 121.Article four, first fin 12 is along the circumferentially evenly distribution of matrix 11.First fin 12 is along the radially extension of matrix 11.Between the first adjacent rib 121, all be provided with second fin 122 and the 3rd fin 123.Second fin 122 is connected on the matrix 11.The 3rd fin 123 is connected on first fin 121.Second fin 122 and the 3rd fin 123 between two first adjacent fins parallel.First fin 121, second fin 122 and the 3rd fin 123 constitute radiated ribs 12.The free end that the free end of second fin 122 and the 3rd fin 123 is positioned at first fin 121 is on the quadrangle on summit.
Embodiment five, referring to Fig. 6, are that first fin 121 has six with the difference of embodiment four.The free end that the free end of second fin 122 and the 3rd fin 123 is positioned at first fin 121 is on the regular hexagon on summit.
Referring to Fig. 5, a kind of LED lamp comprises that installing rack 101, three strengthen cooling LED circuit board 102 and install adjustment arm 103.
Strengthening cooling LED circuit board 102 is circuit board produced among the embodiment two, does not do repeat specification at this.
Installing rack 101 is a frame structure.Installing rack 101 inside are provided with fairlead 1011.Strengthening cooling LED circuit board 102 links together with installing rack 101 through the mode of radiated rib 12 with welding.
Install adjustment arm 103 comprises decides arm 1031 and swing arm 1032.Decide arm 1031 and be provided with screwed hole 1033, swing arm 1032 is provided with thread head 1034, and the two is threaded through thread head 1034 mate with threaded holes 1033 and is in the same place to decide arm 1031 and swing arm 1032.
Swing arm 1032 is structure as a whole with installing rack 101.Be provided with power supply 104 in the swing arm 1032.
Strengthening cooling LED circuit board 102 is electrically connected with power supply 104 through power supply output line 105.
Three are strengthened cooling LED circuit board 102 is that electricity is connected in parallel on the power supply 104.
During use; Decide the place that arm 1031 is fixed on needs to install lamp; Carry electricity to give power supply 104 through power input line 106; It is luminous that power supply 104 drives the LED illuminator of strengthening on the cooling LED circuit boards 102 2, through make swing arm 1032 with respect to decide arm 1031 rotate the lamp of adjusting the utility model direction of illumination, improve the convenience when throwing light on.

Claims (8)

1. strengthen the cooling LED circuit board for one kind, comprise the LED illuminator, said LED illuminator comprises PN junction and LED base; It is characterized in that, also comprise the heat radiation main body, said heat radiation main body comprises matrix and radiated rib; Said matrix and said radiated rib are structure as a whole; Said matrix is provided with insulating barrier, and said PN junction is connected through the side that is provided with insulating barrier of said LED base with said matrix, and said insulating barrier is provided with the conducting wire; Said PN junction is connected electrically on the said conducting wire, and said radiated rib is positioned on the adjacent side, the side that is provided with the LED base of said matrix.
2. reinforcement cooling LED circuit board according to claim 1 is characterized in that said insulating barrier is provided with through hole, and said LED base is located in the interior also soldering of said through hole on said matrix.
3. reinforcement cooling LED circuit board according to claim 1 and 2; It is characterized in that; Said matrix is the tabular structure of polygon, and said radiated rib is arranged on the side at thickness direction place of said matrix, and said radiated rib is positioned on the same plane with said matrix.
4. reinforcement cooling LED circuit board according to claim 1 and 2 is characterized in that said matrix is circular platy structure, and said radiated rib is distributed on the periphery of said matrix.
5. reinforcement cooling LED circuit board according to claim 4; It is characterized in that; Said radiated rib comprises some first fins, some second fins and some the 3rd fins; Said first fin and second fin all are connected on the said matrix, and said the 3rd fin is connected on said first fin, and said second fin and the 3rd fin are between first fin; All be distributed with said second fin and the 3rd fin between the first adjacent fin, second fin and the 3rd fin between two first adjacent fins parallel.
6. reinforcement cooling LED circuit board according to claim 1 and 2 is characterized in that, the side away from said LED illuminator place side of said matrix is provided with vent rib.
7. reinforcement cooling LED circuit board according to claim 1 and 2; It is characterized in that; The side that the same said LED base of said matrix is connected is provided with light-passing board, and said light-passing board is provided with several to the cup away from said matrix direction convexity, and said cup is structure as a whole with said light-passing board; The quantity of said cup equates that with the quantity of said LED illuminator said cup covers on the said LED illuminator correspondingly.
8. a LED lamp is characterized in that, comprises installing rack and several reinforcement cooling LED circuit boards; Said reinforcement cooling LED circuit board comprises heat radiation main body and some LED illuminators; Said LED illuminator comprises PN junction and LED base, and said heat radiation main body comprises matrix and radiated rib, and said heat radiation matrix is provided with insulating barrier; Said PN junction is connected through the side that is provided with insulating barrier of said LED base with said matrix; Said insulating barrier is provided with the conducting wire, and said PN junction is connected electrically on the said conducting wire, and said radiated rib is positioned on the adjacent side, the side that is provided with the LED base of said matrix; The side that the same said LED base of said matrix is connected is provided with light-passing board, and said installing rack is fixed together with said matrix.
CN2011204629885U 2011-11-21 2011-11-21 Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp Expired - Fee Related CN202419582U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204629885U CN202419582U (en) 2011-11-21 2011-11-21 Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204629885U CN202419582U (en) 2011-11-21 2011-11-21 Strong-cooling LED (Light-Emitting Diode) circuit board and LED lamp

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CN202419582U true CN202419582U (en) 2012-09-05

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102519027A (en) * 2011-11-21 2012-06-27 王振辉 Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof
RU196224U1 (en) * 2019-08-02 2020-02-21 Юрий Борисович Соколов Light-emitting structure for an uninsulated driver
RU2772424C2 (en) * 2020-06-26 2022-05-19 Юрий Борисович Соколов Powerful led cluster with increased electrical insulation
EP4187145A1 (en) 2021-11-25 2023-05-31 Yuri Borisovich Sokolov Led cluster

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102519027A (en) * 2011-11-21 2012-06-27 王振辉 Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof
RU196224U1 (en) * 2019-08-02 2020-02-21 Юрий Борисович Соколов Light-emitting structure for an uninsulated driver
RU2772424C2 (en) * 2020-06-26 2022-05-19 Юрий Борисович Соколов Powerful led cluster with increased electrical insulation
EP4187145A1 (en) 2021-11-25 2023-05-31 Yuri Borisovich Sokolov Led cluster

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120905

Termination date: 20191121

CF01 Termination of patent right due to non-payment of annual fee