CN201425207Y - Luminescent diode lighting device - Google Patents
Luminescent diode lighting device Download PDFInfo
- Publication number
- CN201425207Y CN201425207Y CN2009201577650U CN200920157765U CN201425207Y CN 201425207 Y CN201425207 Y CN 201425207Y CN 2009201577650 U CN2009201577650 U CN 2009201577650U CN 200920157765 U CN200920157765 U CN 200920157765U CN 201425207 Y CN201425207 Y CN 201425207Y
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- light emitting
- emitting diode
- illuminating apparatus
- temperature
- protuberance
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Abstract
The utility model discloses a luminescent diode lighting device. The luminescent diode lighting device comprises a temperature equilibration plate, a circuit board and at least one luminescent diode,wherein the temperature equilibration plate comprises a metal hollow shell, a capillary tissue clung to the inner wall of the metal hollow shell, and working liquid filled in the metal hollow shell, at least one convex area is formed on one surface of the temperature equilibration plate, and a heat conducting tin layer is formed on the convex area. The circuit board is provided with at least one through hole for the convex part to penetrate through correspondingly. The luminescent diode is correspondingly arranged on the convex area in a contacted mode, and each luminescent diode is provided with two electricity conducting pins which are respectively and electrically connected with the circuit board. The luminescent diode device of the utility model rapidly transfers heat dissipated from the luminescent diode to the temperature equilibration plate and rapidly conducts the heat through the temperature equilibration plate by the aid of the convex area which is directly contacted with theluminescent diode.
Description
Technical field
The utility model relates to a kind of lighting device, refers to a kind of lighting device of light emitting diode especially.
Background technology
(Light Emitting Diode LED) has advantages such as power saving and life-span be long to light emitting diode, adds that brightness constantly improves, and therefore is widely used in electronic installation and indoor or outdoors lighting.
Be used in the lighting of indoor or outdoors, the high-power light emitting diodes (HighBrightness Light-Emitting Diode) that use more, and two or more light emitting diode combined are become the light emitting diode lamp module, to increase its range of exposures and illuminance.Yet, when illuminance improves, improved the heat that it produced unavoidablely, add that the more general incandescent lamp bulb of the heat resistance of light emitting diode is poor, especially High Power LED, the high temperature heat source that itself produces accumulates heat around not only causing light emitting diode easily, causes the reduction of luminous efficiency, more may influence the life-span of light emitting diode, and cause the lamp circuit substrate overheated and light fixture is impaired.Therefore, need the heat of high temperature that light emitting diode produces to be removed, so that light emitting diode can be luminous under lower temperature by radiating module.Therefore how the high heat of light emitting diode generation is discharged in real time and promptly, avoided influencing the efficient and the life-span of light emitting diode, become a major issue of the anxious desire solution of industry personage of each lighting at present.
Yet, known led lamp is in the design of radiator structure, be arranged at a majority light-emitting diode on the circuit board earlier mostly, again with circuit board and the radiating module combination that includes members such as radiating fin, heat pipe and heat-radiating substrate, with thermal conductance from, thereby make that the volume of whole light fixture is bigger, and, the heat of light-emitting diode need just can arrive through circuit board could produce the heat conduction on the heat-radiating substrate of radiating module, consequently radiating efficiency is not good slowly because of its heat-transfer rate.
The utility model content
In view of this, main purpose of the present utility model is to provide a kind of thermal source face with light emitting diode directly to be covered on temperature-uniforming plate so that the light emitting diode illuminating apparatus of the rapid diversion heat of energy.
For achieving the above object, the light emitting diode illuminating apparatus that the utility model provides includes temperature-uniforming plate, circuit board and at least one light emitting diode;
This temperature-uniforming plate comprises the metal hollow housing, is attached at the capillary structure of this hollow metal inner walls, and fills in the hydraulic fluid of this hollow metal enclosure interior, and a surface of this temperature-uniforming plate is formed with at least one protuberance in addition;
This circuit board has at least one perforation, runs through for this protuberance correspondence;
This light emitting diode correspondence is arranged on this protuberance contiguously; Light emitting diode has two conductive connecting pins that are electrically connected to this circuit board respectively.
The end face of this protuberance is provided with heat conduction tin layer, in order to assist the heat energy diversion.
This circuit board includes insulating barrier and is positioned at insulating barrier top conductive layer, and wherein this conductive layer can be divided into the copper foil layer that is arranged at this insulating barrier top again, and the conduction tin layer that is positioned at this copper foil layer top.
These light emitting diodes are the surface adhesive type light emitting diode, each light emitting diode includes LED crystal particle, pedestal, provide in this pedestal and contact the heating column of this LED crystal particle and this protuberance respectively, and two conductive connecting pins that are electrically connected to the conductive layer of this circuit board, in addition, be to be electrically connected between these light emitting diodes in the mode of connecting.
The utility model directly is contacted with the heating column of light emitting diode by the protuberance that is formed at this temperature-uniforming plate, makes the heat energy that is produced by LED crystal particle can conduct to temperature-uniforming plate fast, and by this temperature-uniforming plate with this heat energy diversion.In addition, because the volume of temperature-uniforming plate itself is little than radiating fin, heat pipe, radiating effect is better again, therefore can reach problem that reduces these lumination of light emitting diode efficient decay and the effect that prolongs the service life of these light emitting diodes.
Description of drawings
Fig. 1 is the schematic perspective view of light emitting diode illuminating apparatus of the present utility model;
Fig. 2 is the three-dimensional exploded view of light emitting diode illuminating apparatus of the present utility model;
Fig. 3 is the sectional view of light emitting diode illuminating apparatus of the present utility model;
Fig. 4 is the A part enlarged detail of Fig. 3.
Description of reference numerals
10 temperature-uniforming plates, 26 conductive layers
12 protuberances, 262 copper foil layers
14 capillary structures, 264 conduction tin layers
16 hydraulic fluids, 30 light emitting diodes
18 heat conduction tin layers, 32 conductive connecting pin
20 circuit boards, 34 LED crystal particles
22 perforation, 36 pedestals
24 insulating barriers, 38 heating columns
The specific embodiment
Cooperate and consult Fig. 1, this figure is the schematic perspective view of light emitting diode illuminating apparatus of the present utility model.This light emitting diode illuminating apparatus comprises: temperature-uniforming plate 10, circuit board 20, and at least one light emitting diode 30.
Cooperate and consult Fig. 2 and Fig. 3, it is respectively the three-dimensional exploded view and the sectional view of light emitting diode illuminating apparatus of the present utility model.Wherein this temperature-uniforming plate 10 includes the hollow metal housing, is attached at the capillary structure 14 of this hollow metal inner walls, and fill in hydraulic fluid 16 in this hollow metal enclosure interior, be formed with at least one protuberance 12 on a surface of this temperature-uniforming plate 10 in addition.In the present embodiment, this temperature-uniforming plate 10 uses circular shells, and when reality was implemented, that 10 of this temperature-uniforming plates can be was square, polygon or other are irregularly shaped.
This circuit board 20 has at least one perforation 22, and confession protuberance 12 correspondences stretch through this perforation 22 and go out.This circuit board 20 includes insulating barrier 24 and the conductive layer 26 that is positioned at insulating barrier 24 tops, and wherein this conductive layer 26 can be divided into the copper foil layer 262 that is arranged at these insulating barrier 24 tops again, and the conduction tin layer 264 that is positioned at these copper foil layer 262 tops.
Cooperate and consult Fig. 4, this light emitting diode 30 is the surface adhesive type light emitting diode, and correspondence is arranged on this protuberance 12 contiguously.Each light emitting diode 30 comprises two conductive connecting pins 32, LED crystal particle 34, the pedestal 36 that is electrically connected to circuit board 20 respectively, and provides in pedestal 36 and contact LED crystal particle 34 respectively and the heating column 38 of protuberance 12.Wherein LED crystal particle 34 is positioned on the pedestal 36, and the bottom of this light emitting diode 30 is coated with thin tin, can combine with heat conduction tin layer 18 mode with direct heating soldering of protuberance 12; The bottom surface of these two conductive connecting pins 32 scribbles tin cream, and the corresponding respectively conduction tin layer 264 that is connected to this circuit board 20 can pass through the mode combination of heating soldering, and these light emitting diodes 30 is to be electrically connected mutually with series system.The end face of protuberance 12 also can be provided with heat conduction tin layer 18, heating column 38 is smooth in the heat conduction tin layer 18 of protuberance 12, make heat conduction tin layer 18 between protuberance 12 and heating column 38, be passed to temperature-uniforming plate 10 in order to the heat energy that LED crystal particle 34 is sent via the protuberance 12 that is contacted with heating column 38, so heat conduction tin layer 18 is in order to assist the heat energy diversion.
During practical operation, when this light emitting diode illuminating apparatus was activated, these light emitting diodes 30 can be lighted, and the LED crystal particle 34 that is positioned at these light emitting diode 30 inside begins to produce heat energy immediately.The heat energy that is produced by LED crystal particle 34 conducts to heating column 38 via pedestal 36, conduct to this heat conduction tin layer 18 on protuberance 12 tops via heating column 38, conduct to a side of temperature-uniforming plate 10 by being formed at protuberance 12 on the temperature-uniforming plate 10 again, form high temperature side, wherein this high temperature side is a side that is equiped with light emitting diode 30.
When this temperature-uniforming plate 10 received the heat energy that is produced by these LED crystal particles 34, the hydraulic fluid 16 of these temperature-uniforming plate 10 inside can produce vaporization phenomenon because of absorbing heat energy, and this hydraulic fluid 16 can be vaporizated into gaseous state.This gas that has heat energy can be passed to the opposite side of this temperature-uniforming plate 10 via convection action, forms low temperature side.Because the temperature of this low temperature side is lower than this high temperature side, so this gas that has heat energy just begins to condense and becomes hydraulic fluid 16 again, and flows back to this high temperature side via this capillary structure 14 that is positioned at these temperature-uniforming plate 10 inwalls.This temperature-uniforming plate 10 promptly is the heat energy diversion that will be produced by LED crystal particle 34 by the vaporization that so moves in endless cycles, coagulation.
In addition, because temperature-uniforming plate 10 belongs to the passive heat radiation element, just do not need to expend the effect that the energy can reach heat radiation, add that 10 of temperature-uniforming plates are as slab construction, the more known heat pipe of its heat-conducting area is big, therefore can be faster with heat energy by the pyrotoxin diversion.
Comprehensive the above, the utility model is by these protuberances 12 that are formed at this temperature-uniforming plate 10, directly be contacted with the heating column 38 of these light emitting diodes 30, make the heat energy that is produced by these LED crystal particles 34 conduct to this temperature-uniforming plate 10 apace, and by this temperature-uniforming plate 10 with this heat diversion, heat compared to known light-emitting diode need pass through the mode that circuit board just can arrive radiating module, and it is more efficient to dispel the heat.In addition, because the volume of temperature-uniforming plate 10 itself is little than radiating fin, heat pipe, radiating effect is better again, therefore can reach the problem that reduces these light emitting diode 30 luminous efficiencies decay, and prolongs the service life of these light emitting diodes 30.
The above only is preferred embodiment of the present utility model, can not limit the scope that the utility model is implemented, and promptly every equalization of doing according to claim of the present utility model changes and modifies, and all should belong in the claimed scope of the present utility model.
Claims (7)
1. light emitting diode illuminating apparatus is characterized in that it includes:
Temperature-uniforming plate, this temperature-uniforming plate includes the metal hollow housing, is attached at the capillary structure of the inwall of described metal hollow housing, and fill in, and be formed with at least one protuberance on a surface of described temperature-uniforming plate in the hydraulic fluid of described metal hollow housing inside;
Circuit board, it has at least one perforation that runs through for described protuberance correspondence; And
At least one light emitting diode, this light emitting diode correspondence is arranged on the described protuberance contiguously, and described light emitting diode has two conductive connecting pins that are electrically connected to described circuit board respectively.
2. light emitting diode illuminating apparatus as claimed in claim 1, it is characterized in that, described light emitting diode includes pedestal, is positioned at the LED crystal particle on the described pedestal, and provides in described pedestal and contact the heating column of described LED crystal particle and described protuberance respectively.
3. light emitting diode illuminating apparatus as claimed in claim 2 is characterized in that, the end face of described protuberance also is provided with heat conduction tin layer, and this heat conduction tin layer is between described protuberance and described heating column.
4. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that, the conductive layer that described circuit board includes insulating barrier and is positioned at described insulating barrier top.
5. light emitting diode illuminating apparatus as claimed in claim 4 is characterized in that, described conductive layer includes copper foil layer that is arranged at described insulating barrier top and the conduction tin layer that is positioned at described copper foil layer top.
6. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that, described light emitting diode is the surface adhesive type light emitting diode.
7. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that, the electric connection mode of described each light emitting diode is series connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201577650U CN201425207Y (en) | 2009-06-02 | 2009-06-02 | Luminescent diode lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201577650U CN201425207Y (en) | 2009-06-02 | 2009-06-02 | Luminescent diode lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201425207Y true CN201425207Y (en) | 2010-03-17 |
Family
ID=42024656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201577650U Expired - Fee Related CN201425207Y (en) | 2009-06-02 | 2009-06-02 | Luminescent diode lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201425207Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102644867A (en) * | 2012-03-13 | 2012-08-22 | 广东奥其斯科技有限公司 | Thermoelectric separation power type light-emitting diode bulb with high integration and high lighting effect |
| CN102931331A (en) * | 2011-08-08 | 2013-02-13 | 乐利士实业股份有限公司 | Light-emitting device with heat pipe |
| CN103035813A (en) * | 2011-10-09 | 2013-04-10 | 官淑燕 | Circuit substrate for high-temperature component, light-emitting diode (LED) assembly with circuit substrate and manufacturing method thereof |
| CN103123054A (en) * | 2011-11-21 | 2013-05-29 | 海洋王照明科技股份有限公司 | Light-emitting diode (LED) component and LED lamp |
| CN103900060A (en) * | 2014-04-28 | 2014-07-02 | 江苏达伦电子股份有限公司 | LED heat dissipation structure |
| CN104832891A (en) * | 2010-11-23 | 2015-08-12 | 马士科技有限公司 | Heat conducting lamp base and LED lamp comprising heat conducting lamp base |
-
2009
- 2009-06-02 CN CN2009201577650U patent/CN201425207Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104832891A (en) * | 2010-11-23 | 2015-08-12 | 马士科技有限公司 | Heat conducting lamp base and LED lamp comprising heat conducting lamp base |
| CN102931331A (en) * | 2011-08-08 | 2013-02-13 | 乐利士实业股份有限公司 | Light-emitting device with heat pipe |
| CN103035813A (en) * | 2011-10-09 | 2013-04-10 | 官淑燕 | Circuit substrate for high-temperature component, light-emitting diode (LED) assembly with circuit substrate and manufacturing method thereof |
| CN103035813B (en) * | 2011-10-09 | 2015-10-28 | 官淑燕 | The LED component of high-temperature components circuit substrate and this substrate of tool and method for making thereof |
| CN103123054A (en) * | 2011-11-21 | 2013-05-29 | 海洋王照明科技股份有限公司 | Light-emitting diode (LED) component and LED lamp |
| CN102644867A (en) * | 2012-03-13 | 2012-08-22 | 广东奥其斯科技有限公司 | Thermoelectric separation power type light-emitting diode bulb with high integration and high lighting effect |
| CN103900060A (en) * | 2014-04-28 | 2014-07-02 | 江苏达伦电子股份有限公司 | LED heat dissipation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100317 Termination date: 20110602 |