CN101581406B - Thermotube type high-power LED lamp - Google Patents
Thermotube type high-power LED lamp Download PDFInfo
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- CN101581406B CN101581406B CN2009100436946A CN200910043694A CN101581406B CN 101581406 B CN101581406 B CN 101581406B CN 2009100436946 A CN2009100436946 A CN 2009100436946A CN 200910043694 A CN200910043694 A CN 200910043694A CN 101581406 B CN101581406 B CN 101581406B
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Abstract
The invention discloses a thermotube type high-power LED lamp comprising an LED panel and an outer housing, wherein, the LED panel is a thermotube type heating panel of the LED lamp, the thermotube type heating panel adopts the structure that the parison inflation process is used for producing a metal base panel into a flat panel heat tube, and one side of the outer surface of the flat panel heat tube is smooth, and the other side is evenly provided with a plurality of concave structures; and a copper foil circuit of the high-power LED lamp is directly produced on one smooth face of the thermotube type heating panel, and the side face of the thermotube type heating panel is provided with a pipeline communicated with a thermotube radiator on the outer housing. The thermotube type high-powerLED lamp has the outstanding advantages of lighter weight, lower thermoresistance, superhigh heat-sinking capability, lower cost and better temperature uniformity of the base panel, and the LED lamp of which the power is 500 W or more can be produced.
Description
Technical field
The present invention relates to a kind of LED lamp, particularly a kind of thermotube type high-power LED lamp.
Background technology
The wall lamp of present high-power LED lighting fixture such as street lamp, stage illumination, lighting lamp, effect lamp, city lighting etc. all is to be combined into module by tens of LED power devices to up to a hundred 1-5W to constitute.For single led, if concentrating in the small-sized chip, heat can not effectively shed, can cause chip temperature to raise, the non-uniform Distribution, chip light emitting efficient and the fluorescent material that cause thermal stress swash penetrates decrease in efficiency, causes producing serious light decay.In order to guarantee the life-span of device, the junction temperature that generally requires PN junction is below 100 ℃.Along with the temperature rising of PN junction, red shift also will take place in the emission wavelength of white light LED part.Research data shows: under 100 ℃ temperature, wavelength can red shift 4～9nm, thereby causes YAG fluorescent material absorptivity to descend, and total luminous intensity can reduce, white light colourity variation.Near room temperature, 1 ℃ of the every rising of temperature, the luminous intensity of LED can correspondingly reduce about 1%.When a plurality of great power LED dense arrangement were formed white lumination system, the dissipation problem of heat was more serious.Therefore solve heat dissipation problem and become the prerequisite that power-type LED is used.At present, the luminous efficiency of large-power light-emitting diodes (LED) only can reach 10%～30%, 70%～90% power conversion and become heat.With the white light LEDs is example, when 1 watt electrical power is converted into luminous energy fully, is equivalent to the illuminance of 300lm, but most effective LED also has only about 100lm/W in fact at present.Just all the other injecting electric powers of 70% all have been transformed into Joule heat.In order to guarantee the life-span of device, generally require junction temperature below 100 ℃.Studies show that: when temperature surpasses 100 ℃, it is soaring that the crash rate of device will be index law, 2 ℃ of the every risings of component temperature, reliability decrease 10%.So it is significant to LED to dispel the heat.With the street lamp of lighting a 300W is example, will produce the Joule heat about 200W.If these heats can not dissipate effectively, will produce the fatal influence of two aspects: reduce the luminous efficiency of high-power LED street lamp, shorten the service life of module to entire module.Because the working life of LED presents exponential reduction with the temperature increase, accurately measuring and effectively reduce temperature rise is one of key issue that needs to be resolved hurrily in the present high-power LED illumination technical research.So, electronic devices and components are realized that effective temperature measurement control measure are to improve the key of high-power LED street lamp functional reliability.
In recent years, about the problem of the system-level heat radiation of present great power LED module, existing in the world a lot of relevant reports.The method that generally adopts both at home and abroad is to take away the heat dissipation problem that the method for heat attempts to solve LED by changing LED baseplate material, encapsulating structure and other aids at present.Yet the mass density and the price of metal_based material make that module integral body is heavier on the one hand, cause cost to be difficult to reduce; On the other hand because its limited thermal conductivity, under needs dissipate the extreme harsh conditions of especially big thermal power density, heat-sinking capability is not enough far away, influence light efficiency, life-span and the reliability of device, (5W, 7W) also dare not use in the high density assembling to cause that the high-power LED single tube has been arranged at present, makes the general power of high-power LED lighting fixture do not quite (about 500W).How effectively with in the light fixture particularly the heat in the exigent outdoor high-power LED lighting fixture of air-proof condition distribute, become the bottleneck of present high-power LED illumination technical development.
Summary of the invention
In order to solve the existing above-mentioned technical problem that exists the high-powered LED lamp heat radiation to exist, the invention provides a kind of thermotube type high-power LED lamp of good heat dissipation effect.
The technical scheme that the present invention solves the problems of the technologies described above is: comprise led board, shell, it is characterized in that: led board is the heat pipe-type heat sink of LED lamp, the one side of heat pipe-type heat sink directly prepares the copper foil circuit of adorning high-powered LED lamp, described heat pipe-type heat sink is that with the inflation moulding process metal substrate to be made outer surface one side bright and clean smooth, another side evenly is provided with the flat plate heat tube of many sunk structures, sunk structure fuses the upper and lower plates of metal substrate, described sunk structure isolates, thereby the inner chamber of heat pipe-type heat sink is interconnected, the described inner chamber perfusion working medium of heat pipe-type heat sink, the side of heat pipe-type heat sink have heat pipe to be connected with heat-pipe radiator on the shell
In the above-mentioned thermotube type high-power LED lamp, described shell comprises heat pipe and radiating fin.
Technique effect of the present invention is: the present invention is with the installation base plate of heat pipe-type heat sink as the LED lamp, the LED lamp is installed circuit and directly is made on the heat pipe-type heat sink, so just eliminated the thermal contact resistance between LED lamp and heat pipe, improved radiating effect greatly, and heat pipe-type heat sink and light fixture heat pipe type shell are connected as a single entity, it is lighter that light fixture has weight, thermal resistance is littler, heat-sinking capability is superpower, cost is lower, the better outstanding advantage of substrate temperature uniformity, easilier satisfy dissimilar light fitting shape requirements, provide a kind of thermal structure of excellence for developing long-life high-power LED lamp, can break through the heat radiation bottleneck that high-power LED module is used at one stroke, significantly promote the general power level of high-power LED lighting fixture, expand its range of application.
The present invention is further illustrated below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the structure chart of the heat pipe-type heat sink of the embodiment of the invention 1.
Fig. 2 is that the A-A of Fig. 1 is to cutaway view.
Fig. 3 is the structure chart of heat pipe-type heat sink in the embodiment of the invention 2.
Fig. 4 is the outer casing construction drawing of the embodiment of the invention 1.
Fig. 5 is the outer casing construction drawing of the embodiment of the invention 2.
Fig. 6 is a structure chart of the present invention.
The specific embodiment
Referring to Fig. 1,2, the heat pipe-type cooling plate structure figure of Fig. 1,2 embodiment of the invention 1.Wherein substrate 1 is a metal substrate, generally can make of aluminium sheet, it is bright and clean smooth with the inflation moulding process metal substrate 1 to be made the outer surface one side, another side evenly is provided with the flat plate heat tube of many sunk structures, sunk structure 2 on the substrate 1 fuses the upper and lower plates of metal substrate, can improve the bearing strength of heat pipe-type heat sink like this, substrate generation deformation when preventing that cavity pressure raises under certain temperature rise, because these depressions isolate, the inner chamber 4 of heat pipe-type heat sink is interconnected, so when heat pipe is worked, has very low thermal resistance, substrate 1 a bright and clean smooth side aluminium base circuit board technology routinely prepares the upside-down mounting soldered circuit board of high-powered LED lamp, and LED lamp 4,3rd, the heat pipe of heat pipe-type heat sink are installed.
Referring to Fig. 3, the heat pipe-type cooling plate structure figure of Fig. 3 embodiment of the invention 2.In the present embodiment, heat pipe 3 direct hot pressing are bonded on the substrate 1, and the another side of substrate 1 aluminium base circuit board technology routinely prepares the upside-down mounting soldered circuit board of high-powered LED lamp, and LED lamp 4 is installed.
Referring to Fig. 4, Fig. 4 is the outer casing construction drawing of the embodiment of the invention 1.Mode with die casting forms one with heat pipe 9 and shell 6, and the two-port 7,8 of heat pipe 9 links to each other with the heat pipe of substrate.
Referring to Fig. 5, Fig. 5 is the outer casing construction drawing of the embodiment of the invention 2.Mode with heat pressure adhesive is bonded in heat pipe 9 on the shell 6, and heat pipe 9 places near top as far as possible.
Referring to Fig. 6, Fig. 6 is a structure chart of the present invention.Substrate 1 engages with shell 6 among the figure, and the heat pipe 3 of substrate 1 links to each other with heat pipe 9 on the shell, and heat pipe 9 places near top as far as possible.
Among the present invention, when the LED lamp was lighted, the heat pipe-type heat sink was heated, and heat pipe starts, and liquid refrigerant flashes to gaseous state and shifts fast to the low shell radiator of temperature by pipeline, and heat release is flowed back in the heat pipe chamber of substrate after being condensed into liquid on radiator.Because the thermal resistance of entire heat dissipation system is little, the temperature difference of substrate and shell radiator is very little, this phase transformation mass-and heat-transfer mode can be taken away the heat that the heating of LED lamp produces effectively, be easy to accomplish the LED lamp general power of substrate more than the 500W and make on the whole module temperature everywhere very even, do not have that conventional heat dissipating method produces by the thermograde of substrate center to the edge, can guarantee that each great power LED all works in the temperature range of safety.
Claims (2)
1. thermotube type high-power LED lamp, comprise led board, shell, it is characterized in that: led board is the heat pipe-type heat sink of LED lamp, the one side of heat pipe-type heat sink directly prepares the copper foil circuit of adorning high-powered LED lamp, described heat pipe-type heat sink is that with the inflation moulding process metal substrate to be made outer surface one side bright and clean smooth, another side evenly is provided with the flat plate heat tube of many sunk structures, sunk structure fuses the upper and lower plates of metal substrate, described sunk structure isolates, thereby the inner chamber of heat pipe-type heat sink is interconnected, the described inner chamber perfusion working medium of heat pipe-type heat sink, the side of heat pipe-type heat sink have heat pipe to be connected with heat-pipe radiator on the shell.
2. thermotube type high-power LED lamp according to claim 1 is characterized in that: described shell comprises heat pipe and radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100436946A CN101581406B (en) | 2009-06-16 | 2009-06-16 | Thermotube type high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100436946A CN101581406B (en) | 2009-06-16 | 2009-06-16 | Thermotube type high-power LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101581406A CN101581406A (en) | 2009-11-18 |
| CN101581406B true CN101581406B (en) | 2011-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100436946A Expired - Fee Related CN101581406B (en) | 2009-06-16 | 2009-06-16 | Thermotube type high-power LED lamp |
Country Status (1)
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| CN (1) | CN101581406B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141237B (en) * | 2010-02-01 | 2012-09-26 | 李忠孝 | LED streetlamp with liquid cooling and cooling system of LED streetlamp |
| CN102155662A (en) * | 2011-04-12 | 2011-08-17 | 常州市森奈电子科技有限公司 | Radiating device of LED (light emitting diode) lighting fixture |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2372785Y (en) * | 1999-05-28 | 2000-04-05 | 郭清松 | Radiator for electrical equipment |
| CN201043702Y (en) * | 2007-06-05 | 2008-04-02 | 郑玉萍 | High-power LED road lamp |
-
2009
- 2009-06-16 CN CN2009100436946A patent/CN101581406B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2372785Y (en) * | 1999-05-28 | 2000-04-05 | 郭清松 | Radiator for electrical equipment |
| CN201043702Y (en) * | 2007-06-05 | 2008-04-02 | 郑玉萍 | High-power LED road lamp |
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| Publication number | Publication date |
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| CN101581406A (en) | 2009-11-18 |
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Granted publication date: 20110406 Termination date: 20190616 |
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