CN2898575Y - High-density and directed-connected LED illuminating module - Google Patents
High-density and directed-connected LED illuminating module Download PDFInfo
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- CN2898575Y CN2898575Y CNU2006201196922U CN200620119692U CN2898575Y CN 2898575 Y CN2898575 Y CN 2898575Y CN U2006201196922 U CNU2006201196922 U CN U2006201196922U CN 200620119692 U CN200620119692 U CN 200620119692U CN 2898575 Y CN2898575 Y CN 2898575Y
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- heat sink
- heat
- conductive layer
- wiring board
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Abstract
The utility model provides a high-density and directed-connected LED illuminating module which comprises a LED illuminating element (1), a front heat radiating board (2), a front insulating heat conduction layer (3), a circuit board (4) and a back insulating heat conduction layer (5), wherein, the LED illuminating element (1) is arranged on the circuit board (4) by the mesh of the front heat radiating board (2), the front insulating heat conduction layer (3) is arranged between the front radiating board (2) and the circuit board (4) while the back insulating heat conduction layer (5) is attached at the bottom of the circuit board (4); a back heat radiating board (6) is added and attached on the back insulating heat conduction layer (5). The two metal boards attached on the front heat radiating board and back heat radiating board are used as the main heat radiating structure, the two metal board are attached on the circuit board by an insulating heat conduction material, the thermal resistance is lowered; the thermal energy from the LED illuminating element can be quickly absorbed and quickly transferred from the LED illuminating element base to the front and back heat radiating board as well as dispersed out by means of the heat radiation and air convection with a favorable heat radiating effect and a high heat radiating efficiency in which the lifecycle of the illuminating module can be effectively guaranteed.
Description
[technical field]
The utility model relates to a kind of led module, particularly a kind of direct insertion LED lighting module.
[background technology]
Traditional LED luminous element packing structure as shown in Figure 1, its two installation feet 11,12 that connect brilliant sources 10 also play the effect of conduction distribute heat both as conductor wire.Generally the LED as the indication purposes is operated in 3.3v/5mA, and illuminating LED single tube general work 3.3v/10～20mA, brightness of illumination is 15000mcd, though its luminous intensity of single LED luminous tube is than higher, but can't reach the intensity of normal lighting, if need reach the brightness that normal lighting needs, need a lot of LED lamps is closely discharged according to the mode of array, as shown in Figure 2.
Though the LED lamp is interpreted as cold light source by people, just can not produce the light emitting source of heat on the ordinary meaning, be different from tradition by high temperature alight source, be in fact under the situation of single use, LED can be by the dissipation of itself, in can air, there be heat to produce so show as with the thermal dissipation of its generation.But in fact illuminating LED since operating current than higher, and large quantities of LED need be put together and put, its heating problem just becomes and can not be ignored, and LED belongs to semiconductor devices, its luminous intensity/life-spans etc. are relatively more responsive to variations in temperature, at high temperature the life-span of LED lamp can sharply descend, and before problem of temperature rise was not effectively solved, the LED lighting can't carry out commercialization.Though industry proposes many solutions, be subjected to restriction in condition, the efficient of heat radiation is not high, can't fundamentally solve the problem of temperature rise, therefore also has suitable distance apart from commercialization.
Radiating principle: the radiating treatment at power device mainly needs to handle two key issues, and one is the size and the surface area of fin, and the heating power and the thermal capacity thereof of this and pyrotoxin are closely bound up, and another is the thermal resistance of handling between pyrotoxin and the fin.Wherein thermal resistance is related to the operating efficiency of entire heat dissipation system, the thermal resistance performance also is divided into two aspects: first is the thermal resistance of fin and air, just be meant the heat exchanger effectiveness of radiator and air, general mode by forced ventilation, can reduce its thermal resistance, do not having condition to carry out the place of forced heat radiation, enlarging the volume of radiator and surface area and be very effective method.Second is the thermal resistance between pyrotoxin and the radiator, and this thermal resistance is one of key of whole system heat radiation, affects the radiating efficiency of whole system.
The temperature of pyrotoxin depends on that the dissipated power of temperature, fin of environment and heating come from the thermal resistance between the fin.Handle the heat dissipation problem of LED lighting device, main task is to reduce pyrotoxin with the thermal resistance between the radiating element.
In LED lighting device as shown in Figure 3, most of heat that LED light-emitting component 1 produces is at first to dissipate away by the very low metal pins of thermal resistance, if can not rapidly heat be gone out by pin, heat will be accumulated in lamp body, can cause temperature constantly to rise.Owing to adopt traditional pcb board 4 as the circuit carrier,, adopt the mode of bottom surface pad welding that LED is fixing in the circuit board according to traditional design concept.Like this, the heat of LED etc. can only carry out the heat conduction by the solder joint on the pad 43, is distributed by insulating radiation glue 9 again.Owing to there is solder joint to exist, can't adopt big sheet heat radiator to dispel the heat in the pcb board bottom surface,, but, not have the practical application meaning because the thermal resistance between pyrotoxin and the fin is too big even big sheet heat radiator can be installed.The pcb board material is generally non-metal insulating material, and thermal resistance is bigger, and because preceding heat sink is subjected to the restriction of LED light-emitting component, and heat sink 2 and dissipating away before conducting heat to by pcb board can only account for the LED caloric value and get a very little part.Therefore, this radiating efficiency is not high, and traditional way also is not suitable for emerging LED lamp illumination needs.
[summary of the invention]
The purpose of this utility model is exactly in order to overcome the above problems, and provides that a kind of efficiently radiates heat, luminescent properties are good, the LED lighting module of long service life.
For achieving the above object, the utility model proposes the direct insertion LED lighting module of a kind of high density, comprise LED light-emitting component 1, preceding heat sink 2, preceding insulating heat-conductive layer 3, wiring board 4 and back insulating heat-conductive layer 5, described LED light-emitting component 1 is installed on the described wiring board 4 by the mesh of heat sink 2 before described, insulating heat-conductive layer 3 is arranged between described preceding heat sink 2 and the wiring board 4 before described, and described back insulating heat-conductive layer 5 is attached at described wiring board 4 bottom surfaces; Also comprise back heat sink 6, be attached at described back insulating heat-conductive layer 5.
Above-mentioned LED lighting module, described preceding heat sink 2, back heat sink 6 are provided with contact-making surface in peripheral region and directly connect.Heat sink 2, back heat sink 6 are the stairstepping and/or the male and fomale(M﹠F) of working in coordination in the contact-making surface of peripheral region before described.Also comprise connector 8, the fastening described preceding heat sink 2 of the peripheral region of its heat sink 2, back heat sink 6 before described, back heat sink 6.
Above-mentioned LED lighting module also comprises heat-conducting connecting 7, and it is anchored on the via hole that connects described preceding heat sink 2, preceding insulating heat-conductive layer 3, wiring board 4 and back insulating heat-conductive layer 5, back heat sink 6.
Above-mentioned LED lighting module, described back heat sink 6 is provided with pin mounting groove 63, and the metal pin of described LED light-emitting component 1 is installed on wherein, insulate and heat conduction by insulating heat-conduction material between the metal pin of described back heat sink 6, LED light-emitting component 1.Heat sink 6 surfaces, described back are provided with radiating groove, are used to strengthen contact area and heat radiation area with air.
Above-mentioned LED lighting module, top, the bottom surface of described wiring board 4 are laid with simultaneously and are used for the conductive layer that is electrically connected with the metal pin of described LED light-emitting component 1, and conductive layer is connected by the conductive layer in the wiring board via hole with the bottom surface conductive layer above this.The metal pin terminal surface of described LED light-emitting component 1 and described wiring board bottom surface are in same plane.
Above-mentioned LED lighting module is filled with metal level 42 between the metal pin of described wiring board 4 via holes and described LED light-emitting component 1, and these metal level two ends join with described preceding insulating heat-conductive layer 3, back insulating heat-conductive layer 5 respectively.
Owing to adopted above scheme, brought following beneficial effect:
Be close to metallic plate as main radiator structure by two of forward and backward heat sinks, two metallic plates pass through insulating heat-conduction material, be adjacent in the circuit board, its thermal resistance is reduced, can fast Absorption conduct the heat that the LED light-emitting component produces, the heat that the LED light-emitting component produces can conduct to forward and backward heat sink from LED light-emitting component pin apace, distribute by heat radiation, cross-ventilation mode, excellent in heat dissipation effect, the radiating efficiency height can effectively guarantee service life of lighting module.
The wiring board of the preceding heat sink and the insulation of afterwards being separated by between the heat sink, thermal resistance is very big, for the thermal resistance between heat sink before reducing and the back heat sink, the connector of using between preceding heat sink and back heat sink connects, heat sink is strengthened connecting before and after can either fixing, reduce the thermal resistance of whole module, preceding heat sink heat can be transmitted to fast the back heat sink again, because the more close pyrotoxin of preceding heat sink, therefore the heat energy that heat sink absorbs before can be more, but be subjected to the restriction of LED light-emitting component, can not be fully modes such as the heat radiation of its absorption or convection current be dissipated away, the heat that heat sink can't dissipate away before this moment can pass through wiring board, connectors etc. are transmitted in the heat sink of back, radiate from the back heat sink then.
Because the bottom surface of wiring board and back heat sink closely couple together both by insulating heat-conduction material, the thermal resistance between wiring board and the back heat sink reduces the efficient height of heat radiation.Modes such as fluting are adopted on back heat sink surface, have improved contact area, the heat radiation area of back heat sink radiating surface and air greatly, and its radiating rate is further improved.Back heat sink is as main radiating element, and the dissipated power that can calculate according to the situation of reality is reasonably chosen the volume of fin, surface area and material etc.
The utility model is provided with conductive layer to the top bottom surface of wiring board, the heat-conducting area of wiring board conductive layer has been multiplied, utilize fully contacting of conductive layer and insulating heat-conductive layer, significantly reduce the thermal resistance of conductive layer, improved pin to forward and backward heat sink heat-transfer rate.
[description of drawings]
Fig. 1 is the encapsulating structure schematic diagram of LED light-emitting component.
Fig. 2 is that the LED light-emitting component of LED lighting module is arranged schematic diagram.
Fig. 3 is the radiator structure schematic diagram of the LED lighting module of prior art.
Fig. 4 is the LED lighting module structural representation of the utility model embodiment one.
Fig. 5 is the LED lighting module structural representation of the utility model embodiment two.
Fig. 6 is the LED lighting module structural representation of the utility model embodiment three.
[specific embodiment]
Also in conjunction with the accompanying drawings the utility model is described in further detail below by specific embodiment.
Embodiment one: please refer to shown in Figure 4ly, this routine LED lighting module comprises: LED light-emitting component 1 is the light-emitting component of traditional cylindrical encapsulation.Next be preceding heat sink 2, adopt the metallic plate of high-efficiency heat conduction, preceding heat sink is embedded into the space between the LED light-emitting component, and preceding heat sink can also antireflection part light except the effect of playing heat radiation, reaches the effect that strengthens lighting effect.The 3rd layer is preceding insulating heat-conductive layer 3, and heat sink directly contacts and short circuit with wiring board 4 before mainly preventing.The 4th layer is multilayer circuit board 4, is used for fixing the effect of LED light-emitting component and conduct electrical power.Layer 5 is a back insulating heat-conductive layer 5, and layer 6 is a back heat sink 6, adopts the metallic plate of high-efficiency heat conduction.Couple together by screw or rivet 7 between the multilayer.
The heat radiation approach: as shown in Figure 4, the heat of LED light-emitting component mainly is to be produced by luminous brilliant source 10, passes along the lower metal pins 11,12 of thermal resistance then, and pin passes after the heat conductive insulating layer, directly to the pcb board in the via hole.Via hole is filled scolding tin, the heat that transmits out from pin from be delivered to respectively here wiring board above and the bottom surface.Above and the metal level 41,44 of bottom surface with heat see through the insulating heat-conductive layer pass to before and after two metallic plates of heat sink, the heat that the mode of metallic plate by convection current and radiation produces to transfer of air LED light-emitting component.
Before heat sink 2 be the metallic plate of a mesh, be used for filling the space between the LED light-emitting component, mainly played two effects, one is heat radiation, the heat that the LED lamp is produced is radiated in the air later on by absorption itself and goes.The another one effect is reflective, will shine the light of aft section, and antireflection part goes back, and can strengthen LED light-emitting component luminous intensity.
In this example, wiring board has also been done improvement: do not adopt wiring board to carry out heat conduction in the traditional method, mainly be that its capacity of heat transmission is too poor, the copper sheet thickness of pcb board has relevant criterion, owing to be subjected to the restriction of standard, the copper sheet of circuit board can not done very thickly, conventional doubling plate thickness is at 1.2-1.6MM, and the insulated paint of green oil and so on is all adopted on the two sides, and the copper sheet of wiring board has only several MIL (1.0mil=25 μ m), being used for transmitting its thermal resistance of heat can be higher, can not effectively transmit heat.The requirement of LED element itself be welding from body 2MM, the pcb board thickness 2MM that this example adopts, the synthetic passage of heat of related groups of vias has good heat-radiation effect, so the high temperature when just not needing to vacate the 2MM pin again and preventing to weld is the brilliant silk destruction of chip.Cancelled the silk-screen above the pcb board with green oil, the via hole of doubling plate is many, and very big effect is also played in the lifting of heat radiation.And take into account the influence of temperature to other components and parts on the wiring board.This routine wiring board is born the heat transmission of a part, utilize wiring board to adopt technologies such as zinc-plated, promote the thickness of copper sheet layer, effectively reduce the thermal resistance of bottom surface conductive layer 44, and to the top conductive layer 41 that also is provided with of wiring board, by the conductive layer in the via hole two sides conductive layer is coupled together, so just can make full use of dual electric layer and carry out heat conduction.
It is also extended to cross the pad via hole simultaneously, and adopts metal filled one-tenth metal level 42 such as scolding tin, has strengthened the contact area of thermal source, makes thermal resistance reduce.The LED light-emitting component is close on the wiring board in welding, uses soldering tin material to be filled in the LED light-emitting component pin pad via hole, plays being electrically connected and the fixedly effect of components and parts simultaneously.It is cut that pin stretches out the wiring board part, and the wiring board bottom surface obtains a more complete plane like this, and like this can arrangement and use large-area back heat sink is as radiator.If do not excise then need to put the insulating heat-conductive sleeve pipe, and on the heat sink of back, stay the hole of more complicated, can increase the cost of back heat sink.
In this example, the heat that makes LED light-emitting component pin dissipate is out derived rapidly by via hole, be close to metallic plate as main radiator structure by two of forward and backward heat sinks, wherein the main effect of preceding heat sink is the heat of fast Absorption from generations such as LED, back heat sink is main radiator, two metallic plates are adjacent in the circuit board by insulating heat-conduction material, make its thermal resistance minimum.
Back heat sink is main radiating element, and the dissipated power that can calculate according to the situation of reality is reasonably chosen the volume of fin, surface area and material etc.Because the bottom surface of wiring board and back heat sink all are planes, both closely can be coupled together the thermal resistance minimum between wiring board and the back heat sink, the efficient height of heat radiation by insulating heat-conduction material.In this example, cone tank 62 is evenly offered on back heat sink surface, has improved the contact area of back heat sink radiating surface and air greatly, and its radiating rate is improved greatly.
Before be separated by between the heat sink wiring board of an insulation of heat sink and back, it has certain thermal resistance because the more close pyrotoxin of preceding heat sink, therefore before the heat energy that absorbs of heat sink can be more.But be subjected to the restriction of LED light-emitting component, preceding heat sink is directly done the front casing of light fixture, can not do too greatly, too complicated, influence attractive in appearancely, so it can not be fully modes such as the heat radiation of its absorption or convection current are dissipated away, dissipated power can not be compared with the back heat sink.The heat that can't dissipate away still turns back in the heat sink of back by wiring board, radiate from the back heat sink then.But because the thermal resistance of wiring board is very big, for the thermal resistance between heat sink before reducing and the back heat sink, between preceding heat sink and back heat sink, connect with heat-conducting connecting metallic screw or rivet 7, heat sink made it be connected to become a module closely before and after both can having fixed, reduce the thermal resistance of whole module, the heat of preceding heat sink can also be led the back heat sink, distribute.
Embodiment two: please refer to shown in Figure 5, in this example, the relevant position of back heat sink offers pin mounting groove 63, the pin one 1,12 of LED light-emitting component inserts in the pin mounting groove 63 of back heat sink by preceding insulating heat-conductive layer 3, back insulating heat-conductive layer 5, and insert insulating heat-conduction material, pin is littler with the thermal resistance of back heat sink, and heat conduction, radiating efficiency are further strengthened.
Embodiment three: please refer to shown in Figure 6, in this example, with preceding heat sink and back heat sink distortion, respectively as the forward and backward shell of light fixture, be treated to stairstepping or uneven at the two notch place that joins 21,61, two plates can be combined closely before and after making, and the contact area of the two increase, and rate of heat exchange can significantly improve.Adopt screw or rivet 8 that front and back two plates are fixed up then, make a complete external form.
In this example, the heat of LED spreads to four limits along preceding heat sink, because preceding heat sink frame is the very big radiator of thermal capacity, preceding heat sink is nearer from thermal source, heat in the past heat sink is directly derived and is gone, the thermal resistance of source of heat release that can more effective minimizing LED lamp, thus promote the efficient of integral heat sink.Therefore heat can be diffused into rapidly in the air by modes such as convection current, realize the heat radiation that efficient is higher.
Claims (10)
1, the direct insertion LED lighting module of a kind of high density, comprise LED light-emitting component (1), preceding heat sink (2), preceding insulating heat-conductive layer (3), wiring board (4) and back insulating heat-conductive layer (5), described LED light-emitting component (1) is installed on the described wiring board (4) by the mesh of heat sink (2) before described, insulating heat-conductive layer (3) is arranged between described preceding heat sink (2) and the wiring board (4) before described, and described back insulating heat-conductive layer (5) is attached at described wiring board (4) bottom surface; It is characterized in that: also comprise back heat sink (6), be attached at described back insulating heat-conductive layer (5).
2, LED lighting module as claimed in claim 1 is characterized in that: heat sink (2), back heat sink (6) are provided with contact-making surface in peripheral region and directly connect before described.
3, LED lighting module as claimed in claim 1, it is characterized in that: also comprise heat-conducting connecting (7), it is anchored on the via hole that connects described preceding heat sink (2), preceding insulating heat-conductive layer (3), wiring board (4) and back insulating heat-conductive layer (5), back heat sink (6) successively.
4, LED lighting module as claimed in claim 2 is characterized in that: heat sink (2), back heat sink (6) are the stairstepping and/or the male and fomale(M﹠F) of working in coordination in the contact-making surface of peripheral region before described.
5, as claim 2 or 4 described LED lighting modules, it is characterized in that: also comprise connector (8), the fastening described preceding heat sink (2) of the peripheral region of its heat sink (2), back heat sink (6) before described, back heat sink (6).
6, LED lighting module as claimed in claim 1, it is characterized in that: described back heat sink (6) is provided with pin mounting groove (63), the metal pin of described LED light-emitting component (1) is installed on wherein, insulate and heat conduction by insulating heat-conduction material between the metal pin of described back heat sink (6), LED light-emitting component (1).
7, LED lighting module as claimed in claim 1 is characterized in that: heat sink (6) surface, described back is provided with radiating groove, is used to strengthen contact area and heat radiation area with air.
8, LED lighting module as claimed in claim 1, it is characterized in that: top, the bottom surface of described wiring board (4) is laid with simultaneously and is used for the conductive layer that is electrically connected with the metal pin of described LED light-emitting component (1), and conductive layer is connected by the conductive layer in the wiring board via hole with the bottom surface conductive layer above this.
9, as claim 1 or 8 described LED lighting modules, it is characterized in that: be filled with metal level (42) between the metal pin of described wiring board (4) via hole and described LED light-emitting component (1), these metal level two ends join with described preceding insulating heat-conductive layer (3), back insulating heat-conductive layer (5) respectively.
10, LED lighting module as claimed in claim 1 is characterized in that: the metal pin terminal surface of described LED light-emitting component (1) and described wiring board bottom surface are in same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201196922U CN2898575Y (en) | 2006-04-28 | 2006-06-07 | High-density and directed-connected LED illuminating module |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200620058648 | 2006-04-28 | ||
| CN200620058648.5 | 2006-04-28 | ||
| CNU2006201196922U CN2898575Y (en) | 2006-04-28 | 2006-06-07 | High-density and directed-connected LED illuminating module |
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| Publication Number | Publication Date |
|---|---|
| CN2898575Y true CN2898575Y (en) | 2007-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201196922U Expired - Fee Related CN2898575Y (en) | 2006-04-28 | 2006-06-07 | High-density and directed-connected LED illuminating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2898575Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012151766A1 (en) * | 2011-05-09 | 2012-11-15 | 深圳市创益五金精密模具有限公司 | Vertical insert led lamp component |
| CN102958285A (en) * | 2011-08-31 | 2013-03-06 | 深圳市大族激光科技股份有限公司 | Installation method and structure of photoelectric device packaged by metal |
| CN103175013A (en) * | 2013-03-05 | 2013-06-26 | 福建省锐驰电子科技有限公司 | Heat dissipation type light emitting diode (LED) light bar |
| WO2017107082A1 (en) * | 2015-12-23 | 2017-06-29 | 苏文藏 | Strongly heat-radiation rotatable led street lamp |
| CN107807317A (en) * | 2016-08-31 | 2018-03-16 | 科大国盾量子技术股份有限公司 | A kind of electronic component test device |
| CN108286699A (en) * | 2017-01-09 | 2018-07-17 | 常州星宇车灯股份有限公司 | A kind of wiring board of included cooling system |
| CN109237363A (en) * | 2018-10-26 | 2019-01-18 | 珠海格力电器股份有限公司 | Lamp plate component and water purifier with it |
| CN111174112A (en) * | 2019-11-25 | 2020-05-19 | 苏州汉瑞森光电科技股份有限公司 | LED module structure |
-
2006
- 2006-06-07 CN CNU2006201196922U patent/CN2898575Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012151766A1 (en) * | 2011-05-09 | 2012-11-15 | 深圳市创益五金精密模具有限公司 | Vertical insert led lamp component |
| CN102958285A (en) * | 2011-08-31 | 2013-03-06 | 深圳市大族激光科技股份有限公司 | Installation method and structure of photoelectric device packaged by metal |
| CN102958285B (en) * | 2011-08-31 | 2014-12-17 | 深圳市大族激光科技股份有限公司 | Installation method and structure of photoelectric device packaged by metal |
| CN103175013A (en) * | 2013-03-05 | 2013-06-26 | 福建省锐驰电子科技有限公司 | Heat dissipation type light emitting diode (LED) light bar |
| WO2017107082A1 (en) * | 2015-12-23 | 2017-06-29 | 苏文藏 | Strongly heat-radiation rotatable led street lamp |
| CN107807317A (en) * | 2016-08-31 | 2018-03-16 | 科大国盾量子技术股份有限公司 | A kind of electronic component test device |
| CN108286699A (en) * | 2017-01-09 | 2018-07-17 | 常州星宇车灯股份有限公司 | A kind of wiring board of included cooling system |
| CN109237363A (en) * | 2018-10-26 | 2019-01-18 | 珠海格力电器股份有限公司 | Lamp plate component and water purifier with it |
| CN111174112A (en) * | 2019-11-25 | 2020-05-19 | 苏州汉瑞森光电科技股份有限公司 | LED module structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070509 |