CN201146657Y

CN201146657Y - Electronic component and radiator for electronic chip

Info

Publication number: CN201146657Y
Application number: CN 200720172082
Authority: CN
Inventors: 张健
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-09-25
Filing date: 2007-09-25
Publication date: 2008-11-05
Anticipated expiration: 2017-09-25

Abstract

The utility model provides a heat radiator used for electronic components and electronic chips, which comprises a baseplate. The baseplate is provided with one to hundreds of radiating columns or radiating fins; the baseplate is integrated with the radiating columns or the radiating fins as a whole. The heat radiator solves the problem of low radiating efficiency of the existing heat radiator used for electronic components and electronic chips and can greatly increase the radiating efficiency. The heat radiator is mainly used for heat radiation of power-type LED lamps and can also be used for heat radiation of other electronic components and electronic chips.

Description

Electronic component and electronic chip radiator

Technical field

The utility model relates to radiator, relates in particular to a kind of electronic component and electronic chip radiator.

Background technology

For electronic chip and electronic component such as single light-emitting diode (abbreviating LED as), can not effectively shed if heat concentrates in the small-sized chip or element is interior, then can cause chip or component temperature to raise, cause the non-uniform Distribution of thermal stress, LED luminous efficiency and fluorescent material scattering efficiency descend, have report to work as temperature and surpass certain value, it is soaring that the failure rate of element will be index law, 2 ℃ of reliability decrease 10% of the every rising of component temperature.Power-type LED about 15% input power can only be converted into luminous energy and all the other 85% have changed into heat energy.

When a plurality of LED dense arrangement were formed the daylight illumination system, the dissipation problem of heat was more serious.Therefore solve heat dissipation problem and become the prerequisite that power-type LED is used.If use the radiator on LED to be material at present with aluminium, aluminium flake or aluminium block be heat sink contact the bottom LED directly, perhaps with heat-conducting glue bonding, its radiating efficiency is not high, and power-type LED can only be converted into about 15% input power luminous energy and all the other 85% have changed into heat energy.

Summary of the invention

The purpose of this utility model is to provide high electronic component of a kind of radiating efficiency and electronic chip radiator at existing electronic component and the electronic chip not high problem of radiator heat-dissipation efficient.

The purpose of this utility model is achieved in that the utility model comprises substrate, is provided with one to hundreds of thermal columns or fin on described substrate, the integral body that described substrate and thermal column or fin are formed in one.

Technique effect of the present utility model is: the utility model stretches out many thermal columns or fin on substrate, and area of dissipation can be multiplied; In addition, thermal column or fin and matrix are integral form, need not to use welding or heat-conducting glue, can reduce interface resistance, improve radiating efficiency greatly, improve the interface contact.The utility model be mainly used in power type LED lamp heat radiation, substrate can be directly contact with the LED bottom, also can use heat-conducting glue that substrate and LED is bonding.The utility model also can be used for the heat radiation of other electron component and electronic chip.

Description of drawings

Fig. 1 is the Facad structure figure of embodiment one.

Fig. 2 is the A-A cutaway view of Fig. 1.

Fig. 3 is the sectional structure chart of embodiment two.

Fig. 4 is the Facad structure figure of embodiment three.

Fig. 5 is the bottom surface structure chart of embodiment four.

Fig. 6 is the B-B cutaway view of Fig. 5.

Embodiment

Referring to Fig. 1 and Fig. 2, embodiment one comprises substrate 1, is extended with 35 tubular thermal columns 2 on the end face of substrate 1, thermal column 2 is and is arranged in parallel, substrate 1 and the integral body that thermal column 2 is formed in one adopt fine copper to make, and substrate 1 is provided with the breach 3 that usefulness is installed for hexagon and in both sides.When mounted, the bottom surface of substrate 1 directly contacts with the LED bottom, also can use heat-conducting glue that substrate 1 is bonding with LED, to improve the interface contact.

Referring to Fig. 3, embodiment two is that with embodiment one difference the thermal column 4 of embodiment two is a cone shape.

The shape of thermal column of the present utility model also can be cuboid, cube shaped or other long strip type; Be arranged in parallel except being, thermal column also can be arranged.

Referring to Fig. 4, embodiment three comprises substrate 6, is extended with seven tabular fin 5 on the end face of substrate 6, fin 5 is staggered and arranges, substrate 6 and the integral body that fin 5 is formed in one adopt fine copper to make, and substrate 6 is provided with the breach 7 that usefulness is installed for hexagon and in both sides.

Fin of the present utility model also can be wedge-like; Fin can be and is arranged in parallel.

Referring to Fig. 5 and Fig. 6, embodiment four is provided with thermal column 13 at the end face of substrate 12, be bonded with an insulating barrier 9 in the bottom surface of substrate 12, on insulating barrier 9, be bonded with two wiring copper sheets 10, in use, the bottom of LED is passed mesopore 11 and the bottom surface of substrate 12 on the insulating barrier 9 and is directly contacted or use conducting resinl or LED and substrate 12 welding and dispel the heat, and two lead-in wires and the wiring copper sheet 10 of LED weld together.Substrate 12 is identical with embodiment one with the structure of thermal column 13 among the embodiment four, does not repeat them here.

Also circular, the square or rectangular of the shape of substrate in the utility model; On substrate, also establish mounting structures such as screw hole; Substrate and the thermal column or the fin of one also can be made by copper alloy or aluminium alloy with it.

The quantity of thermal column or fin is one to hundreds of in the utility model.

Claims

1. electronic component and electronic chip radiator is characterized in that: comprise substrate, be provided with one to hundreds of thermal columns or fin on described substrate, the integral body that described substrate and thermal column or fin are formed in one.

2. electronic component according to claim 1 and electronic chip radiator is characterized in that: described fin is and is arranged in parallel or is staggered.

3. electronic component according to claim 2 and electronic chip radiator is characterized in that: described fin is tabular or wedge-like.

4. electronic component according to claim 1 and electronic chip radiator is characterized in that: described thermal column is arranged or is arranged in parallel.

5. electronic component according to claim 4 and electronic chip radiator is characterized in that: described thermal column be shaped as cylinder, cone, cuboid or cube shaped.

6. according to described electronic component of the arbitrary claim of claim 1 to 5 and electronic chip radiator, it is characterized in that: on described substrate, be provided with insulating barrier, and the copper sheet that the welding electric wire is used is set on insulating barrier.

7. according to described electronic component of the arbitrary claim of claim 1 to 5 and electronic chip radiator, it is characterized in that: on described substrate, be provided with breach or screw hole that usefulness is installed.

8. according to described electronic component of the arbitrary claim of claim 1 to 5 and electronic chip radiator, it is characterized in that: described substrate be shaped as circle, hexagon, square or rectangular.

9. according to described electronic component of the arbitrary claim of claim 1 to 5 and electronic chip radiator, it is characterized in that: described substrate and the thermal column of one or fin are made by fine copper or copper alloy or aluminium alloy with it.