CN102724854A - Integrally molded aluminum needle type water-cooling box - Google Patents

Integrally molded aluminum needle type water-cooling box Download PDF

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Publication number
CN102724854A
CN102724854A CN2012102221762A CN201210222176A CN102724854A CN 102724854 A CN102724854 A CN 102724854A CN 2012102221762 A CN2012102221762 A CN 2012102221762A CN 201210222176 A CN201210222176 A CN 201210222176A CN 102724854 A CN102724854 A CN 102724854A
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CN
China
Prior art keywords
base
type water
body molded
pin type
molded aluminum
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Pending
Application number
CN2012102221762A
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Chinese (zh)
Inventor
周斌
吴斌
张俊武
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HUANGSHAN GUJIE HEAT RADIATING TECHNOLOGY CO., LTD.
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KUNSHAN GUJIE METAL PRODUCTS CO Ltd
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Priority to CN2012102221762A priority Critical patent/CN102724854A/en
Publication of CN102724854A publication Critical patent/CN102724854A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an integrally molded aluminum needle type water-cooling box. The integrally molded aluminum needle type water-cooling box comprises a base, a plurality of cooling columns and a sealing cover plate, wherein the base is rectangular; an accommodating cavity is recessed on the base; the cooling columns are arranged in the accommodating cavity of the base and connected with the base into a whole; the integrally molded aluminum needle type water-cooling box is integrally molded by a forging technology; and the sealing cover plate covers the base and is positioned on the opening side of the accommodating cavity. The cooling columns and the base are integrally molded by the forging technology, so that other media do not exist between a heat generator and the cooling columns; the heat resistance for heat transfer is low; and full heat dissipation is realized, and an obvious heat dissipation effect is achieved.

Description

One-body molded aluminum pin type water-cooled box
Technical field
The present invention relates to radiator, particularly use water-cooled one-body molded aluminum pin type water-cooled box.
Background technology
Current electronic industry development will relate to the problem of heat radiation at this moment rapidly, the electronic equipment of high power density is dispelled the heat, and must use water-filled radiator, just is commonly referred to the water-cooled box.Normally used before water-cooled box all adopts extrusion process or process for machining to obtain pin type thermal column or sheet radiating fin; Usually use alloy aluminum because of the release problems of extrusion process and be raw material; And the conductive coefficient of alloy aluminum is far below fine aluminium; Make under the situation of same size, die casting water-cooled box thermal resistance is bigger.And the heat radiation pillar water-cooled box that obtains with machining mode is unfavorable for applying because of processing cost is too high.
Summary of the invention
According to an aspect of the present invention, one-body molded aluminum pin type water-cooled box is provided, has comprised base, some thermal columns and seal cover board; Base is a cuboid; Be concaved with containing cavity on the base, thermal column is located in the containing cavity of base and is connected as a single entity with base, and is one-body molded by Forging Technology; Seal cover board is covered on the base, and is positioned at the one side of containing cavity opening.Thermal column and base are one-body molded through Forging Technology, and making does not have other medium between pyrotoxin and the thermal column, make the thermal resistance of heat transfer lower.
In some embodiments, the periphery of containing cavity also is provided with a ring groove on the base, is provided with corresponding sealing ring in the ring groove.Thus, can have and make the effect that reaches sealing between seal cover board and the one-body molded aluminum pin type water-cooled box.
In some embodiments, also be provided with the dividing plate that one or more is used for the direction of controlled water flow in the containing cavity.Its beneficial effect is, comes the direction of controlled water flow through dividing plate, makes current flow through whole containing cavity.
In some embodiments, dividing plate is divided into the continuous runner that the stream that supplies water passes through with containing cavity.Thus, can make current be difficult for forming the dead angle through dividing plate, and improve heat transfer efficiency, make heat exchange more abundant.
In some embodiments, base is provided with water inlet and delivery port, and water inlet is located at of runner, and delivery port is located at the other end of runner.Wherein can be one also can be a plurality of for water inlet and delivery port.
In some embodiments, the junction of water inlet and delivery port is equipped with screw thread.Thus, can reach and the convenient effect that is connected of the pipe joint of standard.
In some embodiments, also include screw column, be provided with some screw holes around the base, seal cover board is provided with and the corresponding through hole of screw hole, and seal cover board is fixed on the base through screw column.Thus, can have seal cover board is fixed on the effect on the base.
In some embodiments, thermal column is a cylinder, thermal column and base by same aluminium blank through forging and pressing one-body molded making, the two structure that is formed in one, the aluminium blank material adopts fine aluminium to process.Thus, it is big to have contact area, the effect of rapid heat dissipation.
In some embodiments, said thermal column is a diamond structure, produces flow-disturbing when making current pass through the rhombus thermal column, and thermal resistance is reduced, and improves the heat transfer efficiency that looses.
In some embodiments, it is characterized in that the height of said thermal column is 50: 1 to the maximum with the gap ratio of facing mutually between the thermal column.Thus, can increase radiating effect.
Description of drawings
Fig. 1 is the vertical view of the one-body molded aluminum pin type water-cooled box of an embodiment of the present invention;
Fig. 2 is the end view of one-body molded aluminum pin type water-cooled box shown in Figure 1;
Fig. 3 is the vertical view of the one-body molded aluminum pin type water-cooled box of another execution mode of the present invention.
Embodiment
Below in conjunction with accompanying drawing further detailed explanation is done in invention.
Fig. 1 has schematically shown the one-body molded aluminum pin type water-cooled box according to one embodiment of the present invention.Radiator integral is processed by pure aluminum material, and wherein aluminium content>99.5% selects for use pure aluminum material to make; Be good heat conductivity, help reaching the radiating effect of the best because of fine aluminium, as shown in the figure; This device comprises base 1, some thermal columns 2 and seal cover board 3, and base 1 is a cuboid, is concaved with containing cavity 11 on the base 1; Thermal column 2 is located in the containing cavity 11 of base 1, and seal cover board 3 is covered on the base 1, and is positioned at the one side of containing cavity 11 openings.Because need seal cover board 3 and base 1 sealing be prevented that coolant from overflowing,, be provided with corresponding sealing ring 4 in the ring groove 12 so the periphery of containing cavity 11 also is provided with a ring groove 12 on base 1.So just can make between seal cover board 3 and the one-body molded aluminum pin type water-cooled box and reach the effect of sealing through sealing ring 4.And, make radiating effect reach best in order to make heat exchange more abundant, also be provided with the dividing plate 13 of one or more direction that is used for controlled water flow in the containing cavity 11.This enforcement is selected for use and is provided with a dividing plate 13 and illustrates, through dividing plate 13 can controlled water flow direction, make current flow through whole containing cavity 11.Dividing plate 13 is divided into the continuous runner 14 that the stream that supplies water passes through with containing cavity 11.Thus, can make current be difficult for forming the dead angle through dividing plate 13, and improve heat transfer efficiency, make heat exchange more abundant.Base 1 is provided with water inlet 16 and delivery port 17, and water inlet 16 is located at of runner 14, and delivery port 17 is located at the other end of runner 14.Wherein can be one with delivery port 17 also can be a plurality of for water inlet 16.Cooling water is in water inlet 16 continual feeding runners 14, and current flow along runner 14 then, and in the middle of the process of flow, cooling water cools off thermal column 2, and then discharges from delivery port 17, utilizes cooling water that heat is led out thereby reach.And for ease water pipe is connected water inlet 16 and delivery port 17, so the junction of water inlet 16 and delivery port 17 is equipped with screw thread.Can conveniently connect and dismantle the pipe joint of standard specification like this.And for seal cover board 3 is connected with base 1; So also comprise screw column 5; Around base 1, be provided with a circle screw hole 18; Seal cover board 3 is provided with and screw hole 18 corresponding through holes 31, and screw column 5 is fixed in screw hole 18 and the through hole 31, and seal cover board 3 is fixed on the base 1 through screw column 5.So just reached seal cover board 3 has been fixed on the effect on the base 1.In order to increase the area of thermal column 2, thus thermal column 2 for cylinder designs, and thermal column 2 is through the Forging Technology integrated formed structure with base 1.Because columniform thermal column 2 its area of dissipations are big, rapid heat dissipation, and columniform thermal column 2; Its resistance is little, and also little with regard to change to the resistance of heat exchange medium, exchange velocity is fast; And columniform thermal column 2, the stressed of its each point all is that the stability of thermal column 2 and mechanical strength are all relatively good uniformly; Not yielding, thermal column 2 and base 1 structure that is formed in one has then guaranteed connection stability between thermal column 2 and the base 1.Wherein the height of thermal column 2 is 50: 1 to the maximum with the ratio of the spacing of facing 2 of thermal columns mutually.Because the gap is more little, the quantity of thermal column 2 is just big more, and area of dissipation is also just big more, and radiating effect is just better.
Further see also shown in Figure 3, the another specific embodiment of thermal column 2 of the present invention.In order to increase resistance to current, reduce the speed of current, make heat exchange more abundant, so thermal column 2 be the rhombus column body structure, thermal column 2 and base 1 structure that is formed in one.Because the thermal column of rhombus cylinder 2 its area of dissipations compare less; Resistance ratios to heat exchange medium is bigger, and the flowing velocity of relative heat exchange medium will be slack-off relatively, and rate of heat exchange is slack-off; Make heat exchange more abundant relatively, the so relative effect that has just guaranteed heat radiation.Thermal column 2 and base 1 structure that is formed in one has then guaranteed connection stability between thermal column 2 and the base 1.Wherein the height of thermal column 2 is 50: 1 to the maximum with the ratio of the spacing of facing 2 of thermal columns mutually.Because the gap is more little, the quantity of thermal column 2 is just big more, and area of dissipation is also just big more, and radiating effect is just better.
Above-described only is execution modes more of the present invention.For the person of ordinary skill of the art, under the prerequisite that does not break away from the invention design, can also make some distortion and improvement, these all belong to the protection range of invention.

Claims (10)

1. one-body molded aluminum pin type water-cooled box is characterized in that, comprises base, some thermal columns and seal cover board; Said base is a cuboid; Be concaved with containing cavity on the said base, thermal column is located in the containing cavity of base and is connected as a single entity with base, and is one-body molded by Forging Technology; Said seal cover board is covered on the base, and is positioned at the one side of containing cavity opening.
2. one-body molded aluminum pin type water-cooled box according to claim 1 is characterized in that the periphery of containing cavity also is provided with a ring groove on the said base, is provided with corresponding sealing ring in the said ring groove.
3. one-body molded aluminum pin type water-cooled box according to claim 1 is characterized in that, also is provided with the dividing plate that one or more is used for the direction of controlled water flow in the said containing cavity.
4. one-body molded aluminum pin type water-cooled box according to claim 3 is characterized in that, said dividing plate is divided into the continuous runner that the stream that supplies water passes through with containing cavity.
5. one-body molded aluminum pin type water-cooled box according to claim 4 is characterized in that an end of said base is provided with water inlet and delivery port, and said water inlet is located at of runner, and delivery port is located at the other end of runner.
6. one-body molded aluminum pin type water-cooled box according to claim 5 is characterized in that the junction of said water inlet and delivery port is equipped with screw thread.
7. one-body molded aluminum pin type water-cooled box according to claim 1; It is characterized in that, also include screw column, be provided with some screw holes around the said base; Said seal cover board is provided with and the corresponding through hole of said screw hole, and said seal cover board is fixed on the base through screw column.
8. one-body molded aluminum pin type water-cooled box according to claim 1 is characterized in that said thermal column is a cylinder, thermal column and the base structure that is formed in one, and the two is processed for fine aluminium.
9. one-body molded aluminum pin type water-cooled box according to claim 1 is characterized in that said thermal column is a diamond structure, produces flow-disturbing when making current pass through the rhombus thermal column, and thermal resistance is reduced, and improves the heat transfer efficiency that looses.
10. according to each described one-body molded aluminum pin type water-cooled box of claim 1-9, it is characterized in that the height of said thermal column is 50: 1 to the maximum with the gap ratio of facing mutually between the thermal column.
CN2012102221762A 2012-06-29 2012-06-29 Integrally molded aluminum needle type water-cooling box Pending CN102724854A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108024486A (en) * 2018-01-04 2018-05-11 钦州学院 Minitype radiator and its manufacture method based on dragonfly wing microcosmic surface
CN108235658A (en) * 2018-01-04 2018-06-29 钦州学院 The bionical water cooling plate minitype radiator of imitative dragonfly wing micro-structure surface

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2901804Y (en) * 2006-05-19 2007-05-16 北京四方清能电气电子有限公司 Water cooling heat radiator for high power electronic equipment
CN201015121Y (en) * 2007-02-05 2008-01-30 黄龙 Water-cooling heat radiator of semiconductor refrigeration system
CN201146657Y (en) * 2007-09-25 2008-11-05 张健 Electronic component and radiator for electronic chip
CN201898434U (en) * 2010-11-29 2011-07-13 上海大郡动力控制技术有限公司 Metal water-cooling bottom plate for cooling electric automobile controller

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2901804Y (en) * 2006-05-19 2007-05-16 北京四方清能电气电子有限公司 Water cooling heat radiator for high power electronic equipment
CN201015121Y (en) * 2007-02-05 2008-01-30 黄龙 Water-cooling heat radiator of semiconductor refrigeration system
CN201146657Y (en) * 2007-09-25 2008-11-05 张健 Electronic component and radiator for electronic chip
CN201898434U (en) * 2010-11-29 2011-07-13 上海大郡动力控制技术有限公司 Metal water-cooling bottom plate for cooling electric automobile controller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108024486A (en) * 2018-01-04 2018-05-11 钦州学院 Minitype radiator and its manufacture method based on dragonfly wing microcosmic surface
CN108235658A (en) * 2018-01-04 2018-06-29 钦州学院 The bionical water cooling plate minitype radiator of imitative dragonfly wing micro-structure surface

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Owner name: HUANGSHAN GUJIE COOLING TECHNOLOGY CO., LTD.

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Effective date: 20141009

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Address after: 245061 Anhui Province, Huangshan City Huizhou district north of the City Industrial Park, No. 10 Wenfeng West Road (HuaSu company)

Applicant after: HUANGSHAN GUJIE HEAT RADIATING TECHNOLOGY CO., LTD.

Address before: Suzhou City, Jiangsu province 215000, East Development Zone of Kunshan City, South Road, Ma Tang pathway

Applicant before: Kunshan Gujie Metal Products Co.,Ltd.

C12 Rejection of a patent application after its publication
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Application publication date: 20121010