CN210112533U - Air-cooling and water-cooling integrated radiator - Google Patents

Air-cooling and water-cooling integrated radiator Download PDF

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Publication number
CN210112533U
CN210112533U CN201920720593.7U CN201920720593U CN210112533U CN 210112533 U CN210112533 U CN 210112533U CN 201920720593 U CN201920720593 U CN 201920720593U CN 210112533 U CN210112533 U CN 210112533U
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CN
China
Prior art keywords
water
heat dissipation
cooled
cooling water
cooling
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Expired - Fee Related
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CN201920720593.7U
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Chinese (zh)
Inventor
庄刚
潘植夸
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Shenzhen Huajin Precision Hardware Co
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Shenzhen Huajin Precision Hardware Co
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Priority to CN201920720593.7U priority Critical patent/CN210112533U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses an air-cooled and water-cooled integral type radiator, including heat dissipation body and aluminium end cap, the heat dissipation body is formed by whole section bar die sinking, direct cutting after the demolding, the heat dissipation body includes the heat dissipation base plate and is located the cooling water course in the middle of the heat dissipation base plate and is located the heat dissipation substrate lower surface and downwardly extending's heat radiation fins, the cooling water course is the axial arrangement, two cooling water courses that lean on the outside are provided with water inlet and delivery port respectively, all the other two adjacent cooling water course terminal surfaces are equipped with the waist hole, the aluminium end cap welds in the waist hole, make two adjacent cooling water courses communicate each other. In power electronic equipment, the radiator plays and carries out radiating effect to electronic components, and traditional radiator radiating effect is limited, and the structure is complicated, and the processing cost is high, and the production cycle is long, the utility model provides a but the radiator air-cooled uses simultaneously with the water-cooling, and the radiating effect is better, and the processing cost is low, and production cycle is short, can adapt to the development of power electronics industry better.

Description

Air-cooling and water-cooling integrated radiator
Technical Field
The utility model relates to a power electronics radiator equipment field, especially an air-cooled and water-cooling integral type radiator.
Background
In various industries and power electronic equipment, electronic components often generate more heat during operation, and if the heat cannot be timely dissipated, the electronic components are burnt, so that immeasurable loss is generated. The conventional heat dissipation device generally comprises a heat sink and a heat dissipation fan for providing forced airflow, wherein the heat sink is provided with a plurality of flat fins, an airflow channel for the forced airflow to pass through is formed between each adjacent heat dissipation fins, and the heat dissipation device utilizes the heat exchange between the forced airflow of the airflow channel and the heat dissipation fins to realize the heat dissipation of the heating electronic component. With the rapid development of the industry in China, the performance of power electronic equipment is continuously improved, the power consumption is increased, the heat productivity of electronic components is also continuously increased, and the heat dissipation requirement of a radiator is higher and higher; meanwhile, the number of power electronic devices is increasing, and the demand for radiators is also increasing. However, the conventional heat sink has limited heat dissipation effect, complex structure, high processing cost and long production period, and is not beneficial to the development of the power electronics industry, so that it is important to provide a heat sink with better heat dissipation effect, low processing cost and short production period.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the problems in the prior art and provide an air-cooling and water-cooling integrated radiator, which adopts the combination of air cooling and water cooling to radiate the heat of electronic components, and has better heat radiation effect; meanwhile, the radiator is formed by opening the die by the integral section bar and directly cutting the integral section bar after the die is removed, so that the processing cost is low and the production period is short.
In order to achieve the technical purpose, the utility model discloses a following technical scheme realizes:
an air-cooling and water-cooling integrated radiator comprises a radiating body and an aluminum plug;
the heat dissipation body is formed by opening the die of the integral sectional material and directly cutting the die after demolding;
the heat dissipation body comprises a heat dissipation substrate, a cooling water channel and heat dissipation fins, wherein the cooling water channel is positioned in the middle of the heat dissipation substrate and penetrates through the section of the heat dissipation substrate, and the heat dissipation fins are positioned on the lower surface of the heat dissipation substrate and extend downwards;
the cooling water channels are axially arranged, two cooling water channels close to the outer side are respectively provided with a water inlet and a water outlet, and waist holes are arranged between the end faces of the other two adjacent cooling water channels;
the radial size of the aluminum plug is adapted to the waist hole, the axial depth is smaller than the depth of the waist hole, and the aluminum plug is welded in the waist hole to enable the two adjacent cooling water channels to be communicated with each other.
Preferably, the cooling water channels are arranged in an even number, and the corresponding water inlets and the corresponding water outlets are positioned on the same side of the cross section of the heat dissipation substrate.
Preferably, the cooling water channels are arranged in odd number, and the corresponding water inlets and the corresponding water outlets are respectively positioned on two sides of the section of the heat dissipation substrate.
Preferably, the water inlet and the water outlet are respectively and fixedly connected with a water nozzle joint.
Preferably, the water nozzle joint is made of stainless steel.
Preferably, the heat dissipating body is made of profile aluminum.
Preferably, the heat dissipation body further comprises a fixing plate, and the fixing plate is located outside the heat dissipation fins and provided with mounting holes.
Preferably, the heat dissipation fins are arranged in parallel with each other at a distance of 1 mm.
Preferably, the upper surface of the heat dissipation substrate is provided with a heat generation module mounting hole.
The utility model has the advantages that: when the cooling water channel type heat dissipation substrate is used, the heating module is closely contacted with the upper surface of the heat dissipation substrate, the cooling water channels in the heat dissipation substrate are connected into a channel through the arrangement of the cooling water channels, the waist holes and the aluminum plugs between the two adjacent cooling water channels, cooling water flows in from the water inlet and flows out from the water outlet, and water cooling heat dissipation is carried out on the heating module; meanwhile, the heat dissipation fins have good heat conductivity, the heating module is subjected to air cooling heat dissipation, and the air cooling and the water cooling can be used simultaneously, so that the heat dissipation effect is better; the radiating body is formed by opening the die by the integral sectional material and directly cutting the die after the die is removed, so that the radiating substrate and the radiating fins are integrally connected, the radiating body has better heat conductivity and better air cooling radiating effect, the die opening technology of the sectional material is mature, the processing cost is low, and the production period is short; the aluminum plug is welded in the waist hole, so that the heat dissipation body is not provided with an exposed pipeline, the structure is more compact, the whole volume is smaller, and the trend of miniaturization and microminiaturization of power electronic equipment can be better adapted.
Drawings
Figure 1 is a general schematic diagram of an embodiment of the present invention,
figure 2 is a schematic cross-sectional view of an embodiment of the present invention,
FIG. 3 is a schematic view of a cooling water channel according to an embodiment of the present invention
FIG. 4 is a schematic view of a mounting hole of a heat generating module according to an embodiment of the present invention,
figure 5 is a schematic view of a cooling channel according to another embodiment of the present invention,
wherein: 1-a heat dissipation body, 2-a heat dissipation substrate, 3-a cooling water channel, 31-a water outlet, 32-a water inlet, 4-a heat dissipation fin, 5-a fixing plate, 51-a fixing hole, 6-an aluminum plug, 7-a water nozzle joint, 8-a waist hole and 9-a heating module mounting hole.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1-5, the present embodiment includes a heat dissipating body 1 and an aluminum plug 6, wherein the heat dissipating body 1 is formed by opening a mold from an integral profile, and directly cutting the mold after demolding; the heat dissipation body 1 comprises a heat dissipation substrate 2, a cooling water channel 3 which is positioned in the middle of the heat dissipation substrate 2 and penetrates through the section of the heat dissipation substrate 2, and heat dissipation fins 4 which are positioned on the lower surface of the heat dissipation substrate 2 and extend downwards; the heat dissipation body 1 is formed by opening a whole section bar and directly cutting the section bar after demoulding, so that the heat dissipation substrate 2 and the heat dissipation fins 4 are integrally connected, the heat dissipation substrate has better heat conductivity and better air cooling heat dissipation effect, the section bar opening technology is mature, the processing cost is low, and the production period is short; the cooling water channels 3 are axially arranged, two cooling water channels 3 close to the outer side are respectively provided with a water inlet 32 and a water outlet 31, and waist holes 8 are arranged between the end surfaces of the other two adjacent cooling water channels 3; the radial size of the aluminum plugs 6 is matched with that of the waist holes 8, the axial depth is smaller than that of the waist holes 8, and the aluminum plugs 6 are welded in the waist holes 8 so that the two adjacent cooling water channels 3 are communicated with each other; the cooperation setting of waist hole 8 and aluminium end cap 6 makes cooling water course 3 in the heat dissipation base plate 2 connect into a route, and cooling water flows in from water inlet 32, flows out from delivery port 31, carries out water-cooling heat dissipation to the module that generates heat, and in addition, aluminium end cap 6 welds in waist hole 8 for heat dissipation body 1 does not have exposed pipeline, and the structure is compacter, and whole volume is littleer, can adapt to the trend that power electronic equipment is miniaturized, miniaturized better.
Referring to fig. 3, the cooling water channels 3 are arranged in an even number, and the corresponding water inlets 32 and water outlets 31 are located on the same side of the cross section of the heat dissipating substrate 2, so that the cooling water channels 3 can be connected into a single passage.
Referring to fig. 5, the cooling water channels 3 are provided in odd numbers, and the corresponding water inlets 32 and water outlets 31 are respectively located at both sides of the cross section of the heat-dissipating substrate 2, so that the cooling water channels 3 can be connected into a passage.
Further, the water inlet 32 and the water outlet 31 are fixedly connected with a water nozzle joint 7 respectively, and the water nozzle joint 7 is used for connecting a cooling water pipe.
Furthermore, the water nozzle joint 7 is made of stainless steel, the technology of the stainless steel is mature, the processing period is short, and the water nozzle joint is durable.
Further, the heat dissipation body 1 is made of section aluminum, the section aluminum has a good heat conduction effect, the technology is mature, the processing cost is low, and the production period is short.
Further, the heat dissipation body 1 further comprises a fixing plate 5, the fixing plate 5 is located outside the heat dissipation fins 4, a mounting hole 51 is formed in the fixing plate 5, the heat sink can be fixed on the equipment through the fixing plate 5 and the mounting hole 51, the heat sink is prevented from moving, the heat sink is in better contact with the heating module, and the heat dissipation effect is better.
Further, the heat dissipation fins 4 are arranged in parallel with each other, and the distance between the heat dissipation fins is 1 mm; the heat dissipation fins mainly utilize air convection to perform air cooling heat dissipation, the fins are arranged in parallel, air flowing is facilitated, the more the number of the fins is, the larger the surface area is, the better the heat dissipation effect is, but the more the number of the fins is, the smaller the fin spacing is, the too small spacing affects air convection, and the heat dissipation effect is also reduced, so that the mutual spacing of the heat dissipation fins 4 is set to be 1 mm, and the better heat dissipation effect can be obtained.
Further, the upper surface of the heat dissipation substrate 2 is provided with a heating module mounting hole 9, and the heating module mounting hole 9 is used for fixing the heating module, so that the heating module is in closer contact with the radiator, and the heat dissipation effect is better.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (9)

1. An air-cooling and water-cooling integrated radiator is characterized by comprising a radiating body and an aluminum plug; the heat dissipation body is formed by opening an integral section bar, and directly cutting the integral section bar after demolding; the heat dissipation body comprises a heat dissipation substrate, a cooling water channel positioned in the middle of the heat dissipation substrate and heat dissipation fins which are positioned on the lower surface of the heat dissipation substrate and extend downwards; the cooling water channels are axially arranged, two cooling water channels close to the outer side are respectively provided with a water inlet and a water outlet, and waist holes are arranged between the end faces of the other two adjacent cooling water channels; the radial size of the aluminum plug is adapted to the waist hole, the axial depth is smaller than the depth of the waist hole, and the aluminum plug is welded in the waist hole to enable the two adjacent cooling water channels to be communicated with each other.
2. The integrated air-cooled and water-cooled heat sink as recited in claim 1, wherein the cooling water channels are provided in an even number, and the respective water inlets and outlets are located on a same side of a cross-section of the heat sink base.
3. The integrated air-and water-cooled heat sink as recited in claim 1, wherein the cooling water channels are provided in odd number, and the corresponding water inlets and outlets are respectively located at both sides of the cross-section of the heat-dissipating substrate.
4. The integrated air-cooled and water-cooled heat sink as recited in claim 1, wherein a water faucet is fixedly connected to each of said water inlet and said water outlet.
5. An integrated air and water cooled radiator as claimed in claim 4 wherein said water spigot is made of stainless steel.
6. The integrated air-cooled and water-cooled heat sink as recited in claim 1, wherein the heat sink body is made of aluminum profile.
7. The integrated air-cooled and water-cooled heat sink of claim 1, wherein the heat sink body further comprises a fixing plate disposed outside the heat dissipating fins and having mounting holes formed therein.
8. The integrated air-and water-cooled heat sink of claim 1, wherein the fins are disposed parallel to each other at a distance of 1 mm.
9. The integrated air-cooled and water-cooled heat sink as recited in claim 1, wherein the heat-dissipating substrate has heat-generating module mounting holes formed in an upper surface thereof.
CN201920720593.7U 2019-05-17 2019-05-17 Air-cooling and water-cooling integrated radiator Expired - Fee Related CN210112533U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920720593.7U CN210112533U (en) 2019-05-17 2019-05-17 Air-cooling and water-cooling integrated radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920720593.7U CN210112533U (en) 2019-05-17 2019-05-17 Air-cooling and water-cooling integrated radiator

Publications (1)

Publication Number Publication Date
CN210112533U true CN210112533U (en) 2020-02-21

Family

ID=69561402

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920720593.7U Expired - Fee Related CN210112533U (en) 2019-05-17 2019-05-17 Air-cooling and water-cooling integrated radiator

Country Status (1)

Country Link
CN (1) CN210112533U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200221

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