CN205961660U - Water cooling heat radiation device - Google Patents

Water cooling heat radiation device Download PDF

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Publication number
CN205961660U
CN205961660U CN201620846200.3U CN201620846200U CN205961660U CN 205961660 U CN205961660 U CN 205961660U CN 201620846200 U CN201620846200 U CN 201620846200U CN 205961660 U CN205961660 U CN 205961660U
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CN
China
Prior art keywords
water
groove
cooling heat
heat
coil pipe
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Active
Application number
CN201620846200.3U
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Chinese (zh)
Inventor
邱鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FOSHAN HENG SHUN JIE ELECTRONIC Co Ltd
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FOSHAN HENG SHUN JIE ELECTRONIC Co Ltd
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Priority to CN201620846200.3U priority Critical patent/CN205961660U/en
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  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

The utility model provides a water cooling heat radiation device, the semiconductor chip packaging structure comprises a heat radiation substrate, radiating basal plate's surface is equipped with a plurality of parallel arrangement's of each other first recess, first recess internal fixation has the cold water coiled pipe who is used for letting in the coolant liquid, specifically, the cross -section of first recess is oval, the both sides edge of every first recess respectively to its self inboard be formed with compress tightly in the chamfer on cold water coiled pipe surface. This water cooling heat radiation device has that simple structure, preparation are convenient, insulating properties is gone with by the radiating effect, especially is fit for being used for the heat abstractor as air conditioner circuit board.

Description

A kind of water-cooling heat radiating device
Technical field
This utility model is related to heat abstractor;A kind of specifically related to water-cooled heat abstractor.
Background technology
Heat abstractor on the circuit board of traditional central air-conditioning, usually air-cooled heat abstractor, such as fin slices radiator, Fan etc., such heat-diffusing efficiency of heat abstractor is not high.Also have using water-cooled heat abstractor, general water cooled heat radiating Device is to be cast with some water-cooling channels in heat dissipation tank, then utilizes bend pipe to connect water-cooling channel head and the tail and forms coiled radiating Device;Or directly by water-cooled Coil welding on heat sink.Traditional water-cooling type radiator makes work complexity, is formed by welding Solder joint easily at high temperature under high pressure produce spark, cause potential safety hazard.
Content of the invention
The purpose of this utility model is to overcome the shortcoming of prior art, provides a kind of water-cooling heat radiating device, need not weld Molding, structure is simple, easy to make, has good radiating and insulating properties.This utility model adopts the following technical scheme that:
A kind of water-cooling heat radiating device, including heat-radiating substrate, the surface of described heat-radiating substrate is provided with some and parallel to each other sets The first groove put, is fixed with the water-cooled coil pipe for being passed through coolant in described first groove;Especially:Described first groove Section be ellipse, the both sides of the edge of each the first groove are formed with to inside its own respectively and are pressed in described water-cooled coil pipe The chamfering on surface.
Water-cooling heat radiating device of the present utility model, is that water-cooled coil pipe is inlaid on the heat-radiating substrate with the first groove, Then pass through instrument and its both sides of the edge that are pressed into of the first groove are formed the chamfering extruding to water-cooled coil surface, make aqueous cold plate Pipe is fixed on heat-radiating substrate surface, need not weld.
Described water-cooled coil pipe is preferably copper pipe.
It is formed with the second groove between described the first adjacent two-by-two groove.Described second groove is used for facilitating operated pressing tool The outside of the first groove apply pressure make the both sides of the edge of the first groove to its own in side compression form chamfering so that solid Determine water-cooled coil pipe.Further, the section of described second groove is trapezoidal, and its notch end is trapezoidal thicker end.I.e. second is recessed Two lateral incline of groove are the lateral surface of the first groove, and inclined plane is easy to the first groove and is extruded formation ellipse.
Preferably, described heat-radiating substrate is made for temperature-resistant material, and temperature that it is high temperature resistant is 600 DEG C~800 DEG C.
Preferably, the surface of the surface of described heat-radiating substrate and water-cooled coil pipe is all coated with high-temperature insulating paint.Described The high temperature resistant temperature of resistant to elevated temperatures insullac is 120 DEG C.
Preferably, the bottom of described heat-radiating substrate is additionally provided with base, and described base is used for installing heater element.
Preferably, one end of described water-cooled coil pipe forms coolant inlet outside extending heat-radiating substrate, water-cooled coil pipe The other end forms cooling liquid outlet outside also extending heat-radiating substrate.Described coolant inlet and cooling liquid outlet are away from radiating base Plate, extends the circulation passage of coolant, is conducive to strengthening radiating effect.
Water-cooling heat radiating device of the present utility model, has that structure is simple, easy to make, radiating effect and a good insulation preformance, It is especially suitable for the heat abstractor as air conditioning circuit board.
Brief description
Fig. 1 is the water-cooling heat radiating device front view in embodiment;
Fig. 2 is the water-cooling heat radiating device axonometric chart in embodiment;
Fig. 3 is the A-A sectional view of Fig. 1;
Fig. 4 is the profile of heat-radiating substrate in embodiment;
Reference:1- heat-radiating substrate;11- first groove;111- chamfering;12- second groove;2- base;3- aqueous cold plate Pipe;31- coolant inlet;32- cooling liquid outlet.
Specific embodiment
Below in conjunction with accompanying drawing, further water-cooling heat radiating device of the present utility model is elaborated:
As Fig. 1, a kind of water-cooling heat radiating device, form by heat-radiating substrate 1 with for the water-cooled coil pipe 3 of the coolant that circulates.
As shown in Figure 1, Figure 3 and Figure 4, the surface of described heat-radiating substrate 1 is provided with some the first grooves 11 being disposed in parallel relation to one another, The section of described first groove 11 is ellipse, and described water-cooled coil pipe 3 is affixed in the first groove 11.Described adjacent two-by-two The first groove 11 between be formed with the second groove 12, the section of described second groove 12 is trapezoidal, and its notch end is trapezoidal Thicker end.I.e. two lateral incline of the second groove 12 are the lateral surface of the first groove 11.During installation, water-cooled coil pipe 3 is placed in In one groove 11, using instrument in two lateral incline effects of the second groove 12, make the both sides of the edge of the first groove 11 to it certainly Extrude and formed chamfering 111 inside body, water-cooled coil pipe 3 is fixed in the first groove 11 chamfering 111.
The bottom of heat-radiating substrate 1 is additionally provided with base 2 as described in Figure 2, and base 2 is used for installing heater element.
Described water-cooled coil pipe 3 is copper pipe.
Described heat-radiating substrate 1 is made for temperature-resistant material, and temperature that it is high temperature resistant is 600 DEG C~800 DEG C.
The surface of the surface of described heat-radiating substrate 1 and water-cooled coil pipe 3 is all coated with high-temperature insulating paint.Described high temperature resistant Insullac high temperature resistant temperature be 120 DEG C.Described base 2 is used for installing the side of heater element without sprayed insulation paint.
One end of described water-cooled coil pipe 3 extends and forms coolant inlet 31 outside heat-radiating substrate 1, water-cooled coil pipe another End forms cooling liquid outlet 32 outside also extending heat-radiating substrate 1.Coolant inlet 31 and cooling liquid outlet 32 are away from radiating base Plate 1, extends the circulation passage of coolant, is conducive to strengthening radiating effect.

Claims (8)

1. a kind of water-cooling heat radiating device, including heat-radiating substrate, the surface of described heat-radiating substrate is provided with some and is disposed in parallel relation to one another The first groove, be fixed with the water-cooled coil pipe for being passed through coolant in described first groove;It is characterized in that:Described first is recessed The section of groove is ellipse, and the both sides of the edge of each the first groove are formed with to inside its own respectively and are pressed in described aqueous cold plate The chamfering of pipe surface.
2. as claimed in claim 1 a kind of water-cooling heat radiating device it is characterised in that:Described water-cooled coil pipe is copper pipe.
3. as claimed in claim 1 a kind of water-cooling heat radiating device it is characterised in that:Between described the first adjacent two-by-two groove It is formed with the second groove.
4. as claimed in claim 3 a kind of water-cooling heat radiating device it is characterised in that:The section of described second groove is trapezoidal, Its notch end is trapezoidal thicker end.
5. as claimed in claim 1 a kind of water-cooling heat radiating device it is characterised in that:Described heat-radiating substrate is made up of temperature-resistant material , temperature that it is high temperature resistant is 600 DEG C~800 DEG C.
6. as claimed in claim 1 a kind of water-cooling heat radiating device it is characterised in that:The surface of described heat-radiating substrate and water-cooled The surface of coil pipe is all coated with high-temperature insulating paint.
7. as claimed in claim 1 a kind of water-cooling heat radiating device it is characterised in that:The bottom of described heat-radiating substrate is additionally provided with bottom Seat.
8. as claimed in claim 1 a kind of water-cooling heat radiating device it is characterised in that:One end of described water-cooled coil pipe extends scattered Form coolant inlet, the other end of water-cooled coil pipe forms cooling liquid outlet outside also extending heat-radiating substrate outside hot substrate.
CN201620846200.3U 2016-08-05 2016-08-05 Water cooling heat radiation device Active CN205961660U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620846200.3U CN205961660U (en) 2016-08-05 2016-08-05 Water cooling heat radiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620846200.3U CN205961660U (en) 2016-08-05 2016-08-05 Water cooling heat radiation device

Publications (1)

Publication Number Publication Date
CN205961660U true CN205961660U (en) 2017-02-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620846200.3U Active CN205961660U (en) 2016-08-05 2016-08-05 Water cooling heat radiation device

Country Status (1)

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CN (1) CN205961660U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657226B (en) * 2017-12-29 2019-04-21 奇鋐科技股份有限公司 Two-phase fluid heat transfer structure
TWI740233B (en) * 2019-10-12 2021-09-21 新煒科技有限公司 Heat dissipation substrate and light emitting device having the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657226B (en) * 2017-12-29 2019-04-21 奇鋐科技股份有限公司 Two-phase fluid heat transfer structure
TWI740233B (en) * 2019-10-12 2021-09-21 新煒科技有限公司 Heat dissipation substrate and light emitting device having the same

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