CN201167452Y - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN201167452Y CN201167452Y CNU2008200329841U CN200820032984U CN201167452Y CN 201167452 Y CN201167452 Y CN 201167452Y CN U2008200329841 U CNU2008200329841 U CN U2008200329841U CN 200820032984 U CN200820032984 U CN 200820032984U CN 201167452 Y CN201167452 Y CN 201167452Y
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- CN
- China
- Prior art keywords
- heat
- exchange
- exchanger plates
- radiating device
- heat exchanger
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- Expired - Fee Related
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model relates to a heat radiating device, which comprises a cover plate, a water inlet opening, a water outlet opening and a heat exchange core body arranged in a box body. The heat radiating device is characterized in that the heat exchange core body is composed of N heat-exchange plates, at least more than two holes are arranged on each heat exchange plate, and each heat-exchange plate communicates with the water inlet opening and the water outlet opening to form a fluid channel; the heat-exchange plates are sequentially overlapped in a stagger manner, and close matching is adopted between layers; by adopting the different structures of the odd number of layers of the heat exchange plates and the even number of layers of the heat exchange plates, the heat-exchange area is enlarged, and the heat dissipation rate is greatly improved; the heat-exchange plates are molded by adopting the commonly used blanking process, so that the processing is convenient and the cost is low. The heat radiating device has the advantages that the volume is small, and the heat exchange rate can reach 200 watts/square centimeters, and is three to five times the heat exchange rate of the commonly used heat radiating device; the heat radiating device can be widely applied in the fields of various electronics and electric circuits, and is particularly suitable for the occasions with smaller spatial location.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates to a kind of rate of heat dissipation height, heat abstractor that volume is little specifically, is used for the heat radiation of various electronic devices and electronic circuit.
Background technology
Along with the continuous development of electronic technology, the heat radiation requirement of integrated circuit is increased day by day.The power consumption of existing integrated circuits has met or exceeded 100 watts/square centimeter, and the maximum heat-sinking capability of air-cooled radiator commonly used is 75 watts/square centimeter, is difficult to meet the demands.Traditional water-filled radiator dispels the heat by tank mostly, and this heat dissipation water tank adopts Milling Process to form, and its manufacturing cost height is subjected to mach the influence simultaneously, and heat dispersion is lower.Recently, a kind of minitype radiator that adopts photoetching process processing is arranged, perfect heat-dissipating, but processing cost height, its application is restricted.
Summary of the invention
The technical problems to be solved in the utility model provides a kind of rate of heat dissipation height, volume is little, cost is low heat abstractor.
For solving the problems of the technologies described above, heat abstractor of the present utility model comprises cover plate, water inlet, delivery port, is arranged on the heat exchanging core in the casing, its improvement is: described heat exchanging core is made up of N heat exchanger plates, each heat exchanger plates was provided with at least two with last hole, each heat exchanger plates is connected with water inlet, delivery port, forms the fluid passage.
As a kind of improvement of the present utility model, described heat exchanger plates is alternately stack successively, is tight fit between layer and the layer.
As another kind of improvement the of the present utility model, the both sides of described odd-level heat exchanger plates are provided with porose A, hole B, and the intermediate portion is provided with several holes, and described hole A is connected with water inlet, described hole B is connected with delivery port.
As further improvement of the utility model, the both sides of described even level heat exchanger plates are provided with porose D, hole H, and described hole D is connected with water inlet, described hole H is connected with delivery port.
Adopt after such structure, the heat that electronic device produces conducts to heat exchanging core by casing, conduct to coolant by each heat exchanger plates again, as water or oil, along the fluid passage on the heat exchanger plates, carry out heat exchange fully, the work calories of electronic circuit is discharged, reach the requirement of heat radiation.Adopt the heat exchanging core of the heat exchanger plates formation that alternately superposes successively, dwindled the volume of heat abstractor greatly.The utility model has effectively overcome other defective that radiator heat-dissipation rate is lower, volume is bigger, and its heat exchange is abundant, and rate of heat dissipation significantly improves.Through test of many times, be coolant with water, the heat exchanger plates that the sheet copper stamping-out of employing thickness 0.5mm forms, the heat abstractor that constitutes of stack alternately successively is when inlet water temperature is 35 ℃, during flow velocity 0.2 meter per second, its rate of heat dissipation can reach 200 watts/square centimeter, is 3～5 times of common heat sink.Heat exchanger plates adopts the common stamping technological forming, is convenient to processing, and is with low cost.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described in further detail:
Fig. 1 is the structural representation of a kind of heat abstractor of the utility model.
Fig. 2 is the cutaway view of Fig. 1.
Fig. 3 is the structural representation of a kind of odd-level heat exchanger plates of the utility model.
Fig. 4 is the structural representation of a kind of even level heat exchanger plates of the utility model.
Embodiment
By Fig. 1 Fig. 2 as can be seen, a kind of heat abstractor of the present utility model comprises cover plate 1, water inlet 2, delivery port 3, is arranged on the heat exchanging core 4 in the casing 5, its improvement is: described heat exchanging core 4 by N heat exchanger plates 401,402,403,404 ... 4N forms, each heat exchanger plates was provided with at least two with last hole, each heat exchanger plates is connected with water inlet 2, delivery port 3, forms the fluid passage;
Referring to Fig. 1 and Fig. 2, described heat exchanger plates 401,402,403,404 ... the staggered successively stack of 4N is a tight fit between layer and the layer.
In order to increase heat exchange area, improve rate of heat dissipation, the heat exchanger plates of the utility model heat abstractor is divided into odd-level heat exchanger plates and even level heat exchanger plates, described odd-level heat exchanger plates 401,403,405 ... and even level heat exchanger plates 402,404,406 ... structure inequality.
Illustrate by Fig. 3, described odd-level heat exchanger plates 401,403,405 ... both sides porose A, hole B are set, the intermediate portion be provided with several holes C1, C2, C3 ..., described hole A is connected with water inlet 2, described hole B is connected with delivery port 3.
Referring to Fig. 4, described even level heat exchanger plates 402,404,406 ... both sides porose D, hole H are set, described hole D is connected with water inlet 2, described hole H is connected with delivery port 3.
According to the different needs of user, described water inlet 2, delivery port 3 can be arranged on the cover plate 1, also can be arranged on the casing 5.
Claims (5)
1, a kind of heat abstractor, comprise cover plate (1), water inlet (2), delivery port (3), be arranged on the heat exchanging core (4) in the casing (5), it is characterized in that: described heat exchanging core (4) by N heat exchanger plates (401,402,403,404 ... 4N) form, each heat exchanger plates was provided with at least two with last hole, each heat exchanger plates is connected with water inlet (2), delivery port (3), goes into the fluid passage.
2, heat abstractor according to claim 1 is characterized in that: described heat exchanger plates (401,402,403,404 ... 4N) alternately stack successively is a tight fit between layer and the layer.
3, heat abstractor according to claim 1 and 2, it is characterized in that: described odd-level heat exchanger plates (401,403,405 ...) both sides porose A, hole B are set, the intermediate portion be provided with several holes C1, C2, C3 ..., described hole A is connected with water inlet (2), described hole B is connected with delivery port (3).
4, heat abstractor according to claim 1 and 2, it is characterized in that: described even level heat exchanger plates (402,404,406 ...) both sides porose D, hole H are set, described hole D is connected with water inlet (2), described hole H is connected with delivery port (3).
5, heat abstractor according to claim 1 is characterized in that: described water inlet (2), delivery port (3) can be arranged on the cover plate (1), also can be arranged on the casing (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200329841U CN201167452Y (en) | 2008-03-17 | 2008-03-17 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200329841U CN201167452Y (en) | 2008-03-17 | 2008-03-17 | Radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201167452Y true CN201167452Y (en) | 2008-12-17 |
Family
ID=40192845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200329841U Expired - Fee Related CN201167452Y (en) | 2008-03-17 | 2008-03-17 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201167452Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016026469A1 (en) * | 2014-08-22 | 2016-02-25 | 南京南瑞继保电气有限公司 | Converter valve assembly cooling system |
| CN106123656A (en) * | 2016-08-05 | 2016-11-16 | 中国核动力研究设计院 | Grade separation type microchannel high-efficiency compact heat exchanger |
-
2008
- 2008-03-17 CN CNU2008200329841U patent/CN201167452Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016026469A1 (en) * | 2014-08-22 | 2016-02-25 | 南京南瑞继保电气有限公司 | Converter valve assembly cooling system |
| CN106123656A (en) * | 2016-08-05 | 2016-11-16 | 中国核动力研究设计院 | Grade separation type microchannel high-efficiency compact heat exchanger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20100317 |