CN201773834U - Cooling mechanism of integrated power module - Google Patents
Cooling mechanism of integrated power module Download PDFInfo
- Publication number
- CN201773834U CN201773834U CN2010202900327U CN201020290032U CN201773834U CN 201773834 U CN201773834 U CN 201773834U CN 2010202900327 U CN2010202900327 U CN 2010202900327U CN 201020290032 U CN201020290032 U CN 201020290032U CN 201773834 U CN201773834 U CN 201773834U
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- Prior art keywords
- power module
- integrated power
- base plate
- radiating substrate
- heat
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Abstract
The utility model discloses a cooling mechanism of an integrated power module, comprising an integrated power module and a bottom plate. At least one hollow chamber is arranged on the bottom plate; a long open hole is arranged on top of the hollow chamber; the open hole is sealed by a radiating substrate at the bottom of the integrated power module and the radiating substrate is connected with the bottom plate; the bottom plate is connected with a water feeding pipe and a water discharging pipe; and the water feeding pipe and the water discharging pipe are communicated with the hollow chamber. In the utility model, the radiating substrate at the bottom of the integrated power module is directly contacted with the cold water in the hollow chamber, the heat of the radiating substrate is brought away by the water flow, therefore, the heat dissipation is quick, the radiating effect is good, and the cooling mechanism has simple structure and low manufacturing cost.
Description
Technical field:
The utility model relates to a kind of cooling body of integrated power module.
Background technology:
Be applied in the integrated power module on the motor, film name is the integrated power module IPM that has the IGBT switch, because the electric current that passes through is bigger, heating is severe, if can not in time heat be drained, temperature rise is too high, is easy to burn electronic element, so generally heat-radiating substrate is set, utilizes heat-radiating substrate to contact and rapidly heat is taken away with cooler in the bottom of integrated power electronic element.
Traditional cooler has two kinds of air-cooled and water-cooleds, the cooling effect of water-cooled is better, heat-radiating substrate does not directly contact with water in the existing water-cooling pattern, it adopts power model-controller box aluminium sheet-coolant, be across one deck aluminium sheet between power model and the coolant, cause cooling effect undesirable, and the water route complex structure, manufacturing cost increased.
Summary of the invention:
The purpose of this utility model provides a kind of good heat dissipation effect, and is simple in structure, and cost is lower, needs the cooling body of the lower integrated power module of hydraulic pressure.
The purpose of this utility model is to be achieved by following technical scheme.
A kind of cooling body of integrated power module, comprise integrated power module and base plate, it is characterized in that: a cavity is set on the base plate at least, the top of cavity is provided with the long opening that opens wide, the heat-radiating substrate of integrated power module bottom blocks opening and couples together with the base plate installation, base plate connects a water inlet pipe and outlet pipe, and water inlet pipe and outlet pipe are communicated with cavity.
Above-mentioned described around the opening, on the plate top surface groove is set, nested sealing strip on the groove, sealing strip closely contacts with the heat-radiating substrate of integrated power module bottom.
Above-mentioned described groove and sealing strip all are ring-types.
Above-mentioned described heat-radiating substrate edge is provided with some installing holes, heat-radiating substrate is blocked opening and install with the base plate top by screw to be connected.
Above-mentioned described base plate is provided with 3 cavitys, and the water channel by two side bottoms between the adjacent cavities is communicated with.
The utility model beneficial effect compared with prior art is: 1) cavity is set on the base plate at least, the top of cavity is provided with the long opening that opens wide, the heat-radiating substrate of integrated power module bottom blocks opening and couples together with the base plate installation, the heat-radiating substrate of integrated power module bottom directly contacts with the cold water of cavity the inside, the heat of heat-radiating substrate is taken away rapid heat dissipation, good heat dissipation effect by current, simple in structure, low cost of manufacture.2) around the opening, on the plate top surface groove is set, nested sealing strip on the groove, sealing strip closely contacts good airproof performance with the heat-radiating substrate of integrated power module bottom; 3) base plate is provided with 3 cavitys, and the water channel by two side bottoms between the adjacent cavities is communicated with, and is simple in structure, can cool off the polylith integrated power module simultaneously, and current are smooth and easy, good heat dissipation effect; 4) cavity inside is provided with any other radiator structure, and it is low that the hydraulic pressure of water supply is required relatively, and current are smooth and easy, good heat dissipation effect.
Description of drawings:
Fig. 1 is a stereogram of the present utility model.
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the B partial enlarged drawing of Fig. 2;
Fig. 4 is the C-C cutaway view of Fig. 1.
Fig. 5 is an exploded view of the present utility model.
Fig. 6 is the stereogram of base plate of the present utility model.
Fig. 7 is the stereogram of integrated power module of the present utility model.
Embodiment:
Also in conjunction with the accompanying drawings the utility model is described in further detail below by specific embodiment.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the cooling body of a kind of integrated power module of the present utility model, comprise integrated power module 1 and base plate 2, a cavity 21 is set on the base plate 2 at least, the top of cavity 21 is provided with the long opening 22 that opens wide, the heat-radiating substrate 11 of integrated power module 1 bottom blocks opening 22 and couples together with base plate 2 installations, base plate 2 connects a water inlet pipe 3 and outlet pipe 4, water inlet pipe 3 and outlet pipe 4 are communicated with cavity 21, and base plate 2 is provided with inlet opening 24 and apopore 25 cooperates with water inlet pipe 3 and outlet pipe 4 installations respectively.Around the opening 22, on base plate 2 end faces groove 23 is set, nested sealing strip 5 on the groove 23, sealing strip 5 closely contacts with the heat-radiating substrate 11 of integrated power module 1 bottom, and anti-sealing leaks.Groove 23 and sealing strip 5 all are ring-types, and heat-radiating substrate 11 edges are provided with some installing holes 111, heat-radiating substrate 11 are blocked opening 22 and install with base plate 2 tops by screw 6 to be connected.Base plate 2 is provided with 3 cavitys 21, and the water channel 26 by two side bottoms between the adjacent cavities 21 is communicated with.
Operation principle of the present utility model is: the heat-radiating substrate 11 of integrated power module 1 bottom blocks opening 22 and couples together with base plate 2 installations, the heat-radiating substrate 11 of integrated power module 1 bottom directly contacts with the cold water of cavity 21 the insides, by current the heat of heat-radiating substrate 11 is taken away, rapid heat dissipation, good heat dissipation effect, simple in structure, low cost of manufacture, around opening 22, on base plate 2 end faces groove 23 is set, nested sealing strip 5 on the groove 23, sealing strip 5 closely contacts good airproof performance with the heat-radiating substrate 11 of integrated power module 1 bottom, base plate 2 is provided with 3 cavitys 21, water channel 26 by two side bottoms between the adjacent cavities 21 is communicated with, and is simple in structure, can cool off the polylith integrated power module simultaneously, current are smooth and easy, good heat dissipation effect.
Claims (5)
1. the cooling body of an integrated power module, comprise integrated power module and base plate, it is characterized in that: a cavity is set on the base plate at least, the top of cavity is provided with the long opening that opens wide, the heat-radiating substrate of integrated power module bottom blocks opening and couples together with the base plate installation, base plate connects a water inlet pipe and outlet pipe, and water inlet pipe and outlet pipe are communicated with cavity.
2. the cooling body of a kind of integrated power module according to claim 1 is characterized in that: around the opening, on the plate top surface groove is set, and nested sealing strip on the groove, sealing strip closely contacts with the heat-radiating substrate of integrated power module bottom.
3. the cooling body of a kind of integrated power module according to claim 1 and 2, it is characterized in that: groove and sealing strip all are ring-types.
4. the cooling body of a kind of integrated power module according to claim 1 and 2, it is characterized in that: the heat-radiating substrate edge is provided with some installing holes, heat-radiating substrate is blocked opening and install with the base plate top by screw to be connected.
5. the cooling body of a kind of integrated power module according to claim 1 and 2, it is characterized in that: base plate is provided with 3 cavitys, and the water channel by two side bottoms between the adjacent cavities is communicated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202900327U CN201773834U (en) | 2010-08-05 | 2010-08-05 | Cooling mechanism of integrated power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202900327U CN201773834U (en) | 2010-08-05 | 2010-08-05 | Cooling mechanism of integrated power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201773834U true CN201773834U (en) | 2011-03-23 |
Family
ID=43753677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202900327U Expired - Lifetime CN201773834U (en) | 2010-08-05 | 2010-08-05 | Cooling mechanism of integrated power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201773834U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025135A (en) * | 2012-12-29 | 2013-04-03 | 重庆华伟联龙科技有限公司 | Water-cooled variable-frequency voltage stabilizer |
| CN104701278A (en) * | 2013-12-10 | 2015-06-10 | 江苏宏微科技股份有限公司 | Heat radiating mechanism of universal-type power module |
| CN106847769A (en) * | 2015-12-04 | 2017-06-13 | 南车株洲电力机车研究所有限公司 | For the radiator of power model |
| CN109429466A (en) * | 2017-08-21 | 2019-03-05 | 大石祖耀 | A kind of radiator for charging unit |
-
2010
- 2010-08-05 CN CN2010202900327U patent/CN201773834U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025135A (en) * | 2012-12-29 | 2013-04-03 | 重庆华伟联龙科技有限公司 | Water-cooled variable-frequency voltage stabilizer |
| CN104701278A (en) * | 2013-12-10 | 2015-06-10 | 江苏宏微科技股份有限公司 | Heat radiating mechanism of universal-type power module |
| WO2015085682A1 (en) * | 2013-12-10 | 2015-06-18 | 江苏宏微科技股份有限公司 | Heat dissipation mechanism for general power module |
| CN104701278B (en) * | 2013-12-10 | 2017-12-05 | 江苏宏微科技股份有限公司 | The cooling mechanism of common type of power module |
| CN106847769A (en) * | 2015-12-04 | 2017-06-13 | 南车株洲电力机车研究所有限公司 | For the radiator of power model |
| CN106847769B (en) * | 2015-12-04 | 2019-03-22 | 南车株洲电力机车研究所有限公司 | Radiator for power module |
| CN109429466A (en) * | 2017-08-21 | 2019-03-05 | 大石祖耀 | A kind of radiator for charging unit |
| CN109429466B (en) * | 2017-08-21 | 2020-10-16 | 大石祖耀 | Heat dissipation device for charging device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Broad-Ocean EV Technology Co., Ltd. Assignor: Zhongshan Broad-Ocean Motor Co., Ltd. Contract record no.: 2012990000370 Denomination of utility model: Cooling mechanism of integrated power module Granted publication date: 20110323 License type: Exclusive License Record date: 20120531 |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110323 |
|
| CX01 | Expiry of patent term |