CN114828598A

CN114828598A - Liquid cooling radiator, electric drive controller and car

Info

Publication number: CN114828598A
Application number: CN202210647961.6A
Authority: CN
Inventors: 王少波
Original assignee: Midea Group Co Ltd; Guangdong Midea White Goods Technology Innovation Center Co Ltd
Current assignee: Midea Group Co Ltd; Guangdong Midea White Goods Technology Innovation Center Co Ltd
Priority date: 2022-06-08
Filing date: 2022-06-08
Publication date: 2022-07-29

Abstract

The application discloses liquid cooling radiator, electric drive controller and car belongs to heat dissipation technical field. The liquid cooling radiator comprises a first liquid cooling radiating module, a second liquid cooling radiating module, a liquid inlet flow channel and a liquid outlet flow channel. The first end of the first liquid-cooling heat dissipation module and the first end of the second liquid-cooling heat dissipation module are respectively communicated with the liquid inlet flow channel; the second end of the first liquid-cooling heat dissipation module and the second end of the second liquid-cooling heat dissipation module are respectively communicated with the liquid outlet flow channel; the first liquid cooling heat dissipation module is used for being attached to a first electronic device and dissipating heat of the first electronic device, and the second liquid cooling heat dissipation module is used for being attached to a second electronic device and dissipating heat of the second electronic device. By adopting the scheme, the cooling liquid entering each liquid cooling heat dissipation module has relatively low temperature, so that each liquid cooling heat dissipation module is effectively ensured to have good heat dissipation effect, and the stability of the operation of the electronic device is favorably ensured.

Description

Liquid cooling radiator, electric drive controller and car

Technical Field

The application relates to the technical field of heat dissipation, in particular to a liquid cooling radiator, an electric drive controller and an automobile.

Background

With the development of industrial intelligence, the number of electronic devices in electronic equipment (such as equipment for manufacturing, electronic products meeting living needs, etc.) is increasing, and these electronic devices are also developing towards high power and high density, which causes the electronic devices to generate larger amount of heat during operation. For electronic devices that generate a large amount of heat during operation, heat sinks are typically configured to control their temperature within a reasonable range.

At present, the better radiator of radiating effect is the liquid cooling radiator, and the coolant liquid flows through the liquid cooling radiator, through promoting self temperature, takes away the heat that electron device produced. In the same equipment, a plurality of liquid cooling radiators corresponding to a plurality of electronic devices are communicated in a serial connection mode.

Generally, the lower the temperature of the cooling fluid flowing through the liquid-cooled heat sink, the better the resulting heat dissipation. The scheme of connecting a plurality of liquid cooling radiators in series is adopted, when cooling liquid flows through the first liquid cooling radiator, the temperature of the cooling liquid is the lowest, the heat dissipation effect is the best, when the cooling liquid flows through the next liquid cooling radiator, the temperature of the cooling liquid is increased, the heat dissipation effect is reduced, and the like, the heat dissipation effect of each liquid cooling radiator is continuously weakened from front to back according to the serial connection sequence, and the normal operation of an electronic device is influenced when the heat dissipation effect is serious.

Disclosure of Invention

The embodiment of the application provides a liquid cooling radiator, an electric drive controller and an automobile, and can solve the problem that the radiating effect of the liquid cooling radiator in the related technology is continuously weakened, and finally the electronic device cannot normally work. The technical scheme is as follows:

in a first aspect, a liquid-cooled radiator is provided, which includes a first liquid-cooled heat dissipation module, a second liquid-cooled heat dissipation module, a liquid inlet flow channel and a liquid outlet flow channel;

the first end of the first liquid-cooling heat dissipation module and the first end of the second liquid-cooling heat dissipation module are respectively communicated with the liquid inlet flow channel; the second end of the first liquid-cooling heat dissipation module and the second end of the second liquid-cooling heat dissipation module are respectively communicated with the liquid outlet flow channel;

the first liquid cooling heat dissipation module is used for being attached to a first electronic device and dissipating heat of the first electronic device, and the second liquid cooling heat dissipation module is used for being attached to a second electronic device and dissipating heat of the second electronic device.

In one possible implementation manner, the first liquid-cooled heat dissipation module includes a plurality of first heat dissipation channels, and each first heat dissipation channel has a first liquid inlet and a first liquid outlet;

the second liquid cooling heat dissipation module comprises a plurality of second heat dissipation channels, and each second heat dissipation channel is provided with a second liquid inlet and a second liquid outlet;

each first liquid inlet and each second liquid inlet are respectively communicated with the liquid inlet flow channel, and each first liquid outlet and each second liquid outlet are respectively communicated with the liquid outlet flow channel.

In a possible implementation manner, the liquid inlet flow channel is provided with a plurality of liquid inlets, and each liquid inlet is respectively communicated with the first liquid inlet or the second liquid inlet;

the liquid outlet flow passage is provided with a plurality of liquid outlets, and each liquid outlet is respectively communicated with the first liquid outlet or the second liquid inlet.

In a possible implementation manner, the first liquid-cooled heat dissipation module includes a first liquid-cooled heat dissipation body and a first heat conduction cover plate, a first side of the first liquid-cooled heat dissipation body has a first opening, the first heat conduction cover plate is hermetically connected with the first opening, and the first heat conduction cover plate is used for being attached to a heating surface of the first electronic device.

In one possible implementation, the second side of the second liquid-cooled heat dissipation module has a second opening for sealing connection with a heat-generating surface of a second electronic device.

In one possible implementation manner, the liquid inlet flow channel comprises a liquid inlet three-way pipe, a first sub liquid inlet flow channel and a second sub liquid inlet flow channel;

the first sub liquid inlet flow channel is respectively communicated with a first pipe orifice of the liquid inlet three-way pipe and a first end of the first liquid cooling heat dissipation module;

the second sub liquid inlet flow channel is respectively communicated with a second pipe orifice of the liquid inlet three-way pipe and a first end of the second liquid cooling heat dissipation module.

In one possible implementation manner, the first liquid-cooled heat dissipation module has a plurality of first fluid disturbing bodies, and the second liquid-cooled heat dissipation module has a plurality of second fluid disturbing bodies.

In a second aspect, an electrically driven controller is provided that includes a first electronic device, a second electronic device, and the liquid-cooled heat sink of the first aspect and possible implementations.

In one possible implementation manner, the first electronic device is a power module, and the second electronic device is a capacitor.

In a third aspect, a vehicle is provided that includes the electric drive controller of the second aspect and possible implementations.

The technical scheme provided by the embodiment of the application has the following beneficial effects:

according to the scheme provided in the embodiment of the application, the liquid cooling radiator comprises a first liquid cooling radiating module and a second liquid cooling radiating module which are connected in parallel, wherein the first liquid cooling radiating module is used for radiating a first electronic device, and the second liquid cooling radiating module is used for radiating a second electronic device. By adopting the scheme, the cooling liquid entering each liquid cooling radiating module is not subjected to overheating exchange in other liquid cooling radiating modules, and has relatively low temperature, so that each liquid cooling radiating module is effectively ensured to have good radiating effect, and the stability of the operation of an electronic device is favorably ensured.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a heat dissipation channel according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a heat dissipation channel according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a liquid-cooled heat sink according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a liquid inlet channel according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of an electric drive controller according to an embodiment of the present application.

Description of the figures

A. A first electronic device; B. a second electronic device;

1. a first liquid-cooled heat dissipation module; 2. a second liquid cooling heat dissipation module; 3. a liquid inlet flow channel; 4. a liquid outlet flow passage;

11. a first heat dissipation flow channel; 12. a first liquid-cooled heat dissipation body; 13. a first heat-conducting cover plate; 21. a second heat dissipation channel; 22. a second liquid cooling heat dissipation body; 23. a second heat conducting cover plate; 31. a liquid inlet; 32. a liquid inlet three-way pipe; 33. a first sub liquid inlet flow channel; 34. a second sub liquid inlet flow channel; 41. a liquid outlet;

111. a first liquid inlet; 112. a first liquid outlet; 113. a first fluid-disturbing body; 121. a first opening; 211. a second liquid inlet; 212. a second liquid outlet; 213. a second fluid-disturbing body; 221. a second opening; 321. a first nozzle; 322. a second orifice; 323. a third nozzle; 331. a first liquid inlet hole; 341. a second liquid inlet hole.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Electronic devices have become an essential part of people in production and life, such as smart phones, notebook computers, electric drive controllers in new energy vehicles, motor controllers in industrial production, and the like. With the advance of the technology level, the number of electronic devices in electronic equipment is increasing, and the electronic devices are also moving towards high power and high density, which causes the electronic devices to generate larger amount of heat during operation. For these electronic devices that generate relatively large amount of heat during operation, technicians generally configure their heat sinks during product design to control their temperatures within a reasonable range, thereby ensuring efficient operation of the electronic devices.

Currently, the commonly used radiators include air-cooled radiators, heat pipe radiators, liquid-cooled radiators, semiconductor refrigeration radiators, compressor refrigeration radiators, and the like. The liquid cooling radiator has the advantages of good radiating effect, simple structure and the like, and is widely applied to electronic equipment.

In the same electronic device, a plurality of liquid cooling radiators corresponding to a plurality of electronic devices are generally communicated in a series connection mode, and cooling liquid sequentially flows through each liquid cooling radiator. It is known that the lower the temperature of the coolant, the better the heat dissipation effect produced when the same coolant is used. This just makes, when the technical staff adopted the scheme of establishing ties a plurality of liquid cooling radiators to dispel the heat for electronic equipment, when the coolant liquid flows through first liquid cooling radiator, the temperature of coolant liquid is the lowest, and the radiating effect is the best, when flowing through next liquid cooling radiator, the temperature of coolant liquid risees, and the radiating effect reduces, so on, according to the series sequence from front to back, the radiating effect of each liquid cooling radiator constantly weakens, can influence electronic device's normal operating even, influence electronic device's life simultaneously, can lead to whole electronic equipment to normally work when serious.

In view of the above problems, an embodiment of the present application provides a liquid cooling radiator, which can effectively ensure that each liquid cooling heat dissipation module in the liquid cooling radiator has a good heat dissipation effect, can achieve uniform heat dissipation, is favorable for ensuring stable operation of an electronic device, and is favorable for prolonging the service life of the electronic device. The specific scheme is as follows:

the embodiment of the application provides a liquid cooling radiator, this liquid cooling radiator includes first liquid cooling radiating module 1, second liquid cooling radiating module 2, inlet flow path 3 and outlet flow path 4, corresponding structure is as shown in fig. 1, the first end of first liquid cooling radiating module 1, the first end of second liquid cooling radiating module 2 is linked together with inlet flow path 3 respectively, the second end of first liquid cooling radiating module 1, the second end of second liquid cooling radiating module 2 is linked together with outlet flow path 4 respectively, promptly in this liquid cooling radiator, first liquid cooling radiating module 1 and second liquid cooling radiating module 2 are parallelly connected. The first liquid cooling heat dissipation module 1 is used for being attached to a first electronic device A and dissipating heat of the first electronic device A; the second liquid cooling heat dissipation module 2 is used for being attached to a second electronic device B to dissipate heat of the second electronic device B.

Next, the embodiments of the present application will explain each component of the liquid-cooled heat sink in detail:

first liquid cooling heat dissipation module 1

The first liquid cooling module 1 may include a first liquid cooling body 12 and a first heat conducting cover plate 13, the corresponding structure is as shown in fig. 2, a first side of the first liquid cooling body 12 has a first opening 121, the first heat conducting cover plate 13 is hermetically connected to the first opening 121, and the first heat conducting cover plate 13 is used for being attached to a heat generating surface of the first electronic device a. In this case, the first electronic device a may first transfer heat to the first heat conducting cover plate 13, and then, the first heat conducting cover plate 13 transfers heat to the cooling liquid in the first liquid-cooled heat dissipation module 1. First heat conduction apron 13 and first opening 121 sealing connection can guarantee first liquid cooling radiating module 1's leakproofness, effectively prevent that the coolant liquid from revealing to, reduce the probability that the coolant liquid gets into first electron device A and leads to first electron device A to damage. The first heat conducting cover plate 13 and the first opening 121 may be sealed by welding, riveting, bonding, or the like, and a sealing member may be further disposed between the first heat conducting cover plate 13 and the first opening 121, and the sealing member is respectively connected to the first heat conducting cover plate 13 and the first opening 121 in a sealing manner.

Alternatively, the first liquid-cooled heat dissipating module 1 may include the first liquid-cooled heat dissipating body 12 instead of the first heat conductive cover plate 13, and the corresponding structure is as shown in fig. 3. The first side of the first liquid cooling heat dissipation body 12 is provided with a first opening 121, the first opening 121 is used for being attached to the heating surface of the first electronic device a, under the condition, the heating surface of the first electronic device a can be directly contacted with the cooling liquid, namely, the cooling liquid can directly take away the heat of the first electronic device a, and the heat dissipation efficiency can be improved.

First heat dissipation channel 11 of first liquid cooling heat dissipation module 1

In order to improve the heat dissipation efficiency, the first liquid-cooled heat dissipation module 1 provided in this embodiment of the application may include a plurality of first heat dissipation channels 11, and the corresponding structure is as shown in fig. 4, each first heat dissipation channel 11 has a first liquid inlet 111 and a first liquid outlet 112, each first liquid inlet 111 is respectively communicated with the liquid inlet flow channel 3, each first liquid outlet 112 is respectively communicated with the liquid outlet flow channel 3, that is, in the first liquid-cooled heat dissipation module 1, the plurality of first heat dissipation channels 11 are connected in parallel.

A skilled person can set the width of each first heat dissipation channel 11 according to the size of the first electronic device a to determine the cross-sectional area of each first heat dissipation channel 11, and generally, the smaller the cross-sectional area of the first heat dissipation channel 11 is, the faster the flow rate of the first heat dissipation channel 11 is, in a case where the liquid inlet amount is constant. The sectional areas of the plurality of first heat dissipation channels 11 may be the same, and at this time, the flow velocity and the flow rate of the cooling liquid in each first heat dissipation channel 11 are the same, so that the heat dissipation of the first electronic device a may be uniform. The sectional areas of the first heat dissipation channels 11 can be different, at the moment, the flow velocity and the flow of the cooling liquid in each first heat dissipation channel 11 are different, and the flow velocity and the flow of the cooling liquid can be distributed in a differentiated mode in the first liquid cooling heat dissipation module 1.

Alternatively, the sectional area of the first heat dissipation channel 11 may be in a positive correlation or a negative correlation with the distance from the first heat dissipation channel 11 to the liquid inlet port of the liquid inlet flow channel 3.

For the first heat dissipation channel 11 of the first liquid cooling heat dissipation module 1, the following two possible arrangements are given:

in the first mode, the first heat dissipation channel 11 belongs to the same first liquid cooling heat dissipation body 12

The first liquid-cooled heat dissipating body 12 of the first liquid-cooled heat dissipating module 1 may include a bottom plate and a plurality of partition plates, each partition plate is vertically fixed on the bottom plate, and each partition plate is parallel to each other, a channel formed between two adjacent partition plates is referred to as a first heat dissipating channel 11, and the corresponding structure is shown in fig. 4. The opening of each first heat dissipation channel 11 opposite to the bottom plate forms a first opening 121 of the first liquid-cooling heat dissipation module 1

In this case, the first liquid-cooled heat dissipating body 12 may include a first heat conducting cover 13, and the first heat conducting cover 13 may be hermetically connected to the opening of each first heat dissipating passage 11 and attached to the heat generating surface of the first electronic device a. The first liquid-cooled heat dissipating body 12 may also include a plurality of first heat conducting cover plates 13, each first heat conducting cover plate 13 may be hermetically connected to an opening of one first heat dissipating channel 11, and all the first heat conducting cover plates 13 are attached to the heat generating surface of the first electronic device a. The first liquid-cooled heat sink body 12 may not include the first heat conductive cover 13, and the first opening 121 is attached to the heat generating surface of the first electronic device a.

Second, the first heat dissipation channel 11 belongs to different first liquid cooling heat dissipation bodies 12

The first liquid-cooled heat dissipation module 1 may include a plurality of mutually independent and separated first heat dissipation channels 11, and the corresponding structure is shown in fig. 5. For each first heat dissipation channel 11, the first heat dissipation channel 11 includes a bottom plate and two side plates parallel to each other, and the two side plates are fixed on two opposite sides of the bottom plate. The side plates of two adjacent first heat dissipation channels 11 can contact each other to ensure the overall stability of the first liquid cooling heat dissipation module 1. The openings of each first heat dissipation channel 11 and the bottom plate are in the same plane, so as to form the first opening 121 of the first liquid-cooled heat dissipation module 1.

In this case, the first liquid-cooled heat dissipation module 1 may include a first heat conductive cover 13, and the first heat conductive cover 13 may be hermetically connected to the opening of each first heat dissipation channel 11 and attached to the heat generating surface of the first electronic device a. The first liquid-cooled heat dissipating body 12 may include a plurality of first heat conducting cover plates 13, each of the first heat conducting cover plates 13 may be hermetically connected to an opening of one of the first heat dissipating channels 11, and all the first heat conducting cover plates 13 are attached to the heat generating surface of the first electronic device a. The first liquid-cooled heat sink body 12 may not include the first heat conductive cover 13, and the first opening 121 is attached to the heat generating surface of the first electronic device a.

Optionally, when the second mode is adopted to provide the first heat dissipation channel 11, the first heat dissipation channel 11 is detachably connected to the liquid inlet channel 3 and the liquid outlet channel 4. By adopting the scheme, a plurality of liquid inlets 31 can be preset on the liquid inlet flow channel 3, and each liquid inlet orifice 31 is respectively communicated with the first liquid inlet 111; a plurality of liquid outlets 41 may be preset on the liquid outlet flow passage 4, and each liquid outlet 41 is respectively communicated with the first liquid outlet 112. Thus, the technician can set the number of the first heat dissipation channels 11 according to the size of the first electronic device a, so that the first liquid-cooling heat dissipation module 1 can be applied to various types of first electronic devices a.

The first fluid-disturbing body 113 of the first liquid-cooled heat-dissipating module 1

In order to further enhance the heat dissipation effect of the first liquid-cooling heat dissipation module 1, a plurality of first fluid-disturbing bodies 113 may be disposed in the first liquid-cooling heat dissipation module 1, and the first fluid-disturbing bodies 113 may be located at the bottom of each first heat dissipation channel 11 (the corresponding structure is shown in fig. 6), may also be located at two sides of each first heat dissipation channel 11, and may also be located on the first heat conduction cover plate 13, which is not limited herein. The cross-sectional shape of the first fluid 113 may be circular, triangular, "S" shaped, and the like. The cross-sectional shape and the number of the first fluid disturbing bodies 113 for each of the first heat dissipation channels 11 are not limited herein.

Second liquid cooling heat dissipation module 2

The second side of the second liquid-cooled heat dissipation module 2 has a second opening 221, and the second opening 221 is used for being in sealing connection with the heat emitting surface of the second electronic device B, and the corresponding structure is shown in fig. 3. Optionally, the second liquid cooling heat dissipation module 1 may include a second liquid cooling heat dissipation body 22 and a second heat conduction cover plate 23, and the corresponding structure is as shown in fig. 2, a second side of the second liquid cooling heat dissipation body 22 has a second opening 221, the second heat conduction cover plate 13 is hermetically connected to the second opening 221, and the second heat conduction cover plate 23 may be configured to be attached to the heat generation surface of the second electronic device B.

In order to improve the heat dissipation efficiency, the second liquid-cooling heat dissipation module 2 provided in the embodiment of the present application may include a plurality of second heat dissipation channels 21, and the corresponding structure is as shown in fig. 4, each second heat dissipation channel 21 has a second liquid inlet 211 and a second liquid outlet 212, each second liquid inlet 211 is respectively communicated with the liquid inlet flow channel 3, each second liquid outlet 212 is respectively communicated with the liquid outlet flow channel 3, that is, in the second liquid-cooling heat dissipation module 2, the plurality of second heat dissipation channels 21 are connected in parallel. The second heat dissipation channel 21 has the same structure as the first heat dissipation channel 11, and will not be described herein.

The sectional areas of the plurality of second heat dissipation channels 21 may be the same, and at this time, the flow velocity and the flow rate of the cooling liquid in each second heat dissipation channel 21 are the same, so that the heat dissipation of the second electronic device B is uniform. The sectional areas of the second heat dissipation channels 21 may be different, and at this time, the flow velocity and the flow rate of the cooling liquid in each second heat dissipation channel 21 are different, so that the differential distribution of the flow velocity and the flow rate of the cooling liquid in the second liquid cooling heat dissipation module 2 can be realized.

Alternatively, when the cross-sectional area of each of the second heat dissipation passages 21 is the same and the cross-sectional area of each of the first heat dissipation passages 11 is the same, the cross-sectional area of the second heat dissipation passage 21 may be the same as the cross-sectional area of the first heat dissipation passage 11, and the cross-sectional area of the second heat dissipation passage 21 may also be different from the cross-sectional area of the first heat dissipation passage 11, which is not limited herein.

Alternatively, when the first heat dissipation channel 11 and the second heat dissipation channel 12 are distributed as shown in fig. 4, the sectional area of each heat dissipation channel may be in a positive correlation or a negative correlation with the distance from the heat dissipation channel to the liquid inlet of the liquid inlet channel 3, and is not limited herein.

In order to further enhance the heat dissipation effect of the first liquid-cooled heat dissipation module 1, a plurality of second fluid-disturbing bodies 213 may be disposed in the second liquid-cooled heat dissipation module 2, and the second fluid-disturbing bodies 213 may be located at the bottom of each second heat dissipation channel 21 (the corresponding structure is shown in fig. 6), may also be located at two sides of each second heat dissipation channel 21, and may also be located at the top of each second heat dissipation channel 21, which is not limited herein. The cross-sectional shape of second fluid-disturbing body 213 may be circular, triangular, "S" -shaped, etc. The sectional shape and the number of the second fluid-disturbing bodies 213 are not limited herein for each of the second heat-dissipating passages 21.

Alternatively, the cross-sectional shape and number of the first fluid-cooling heat dissipation module 1 may be the same as or different from the cross-sectional shape and number of the second fluid-disturbing bodies 213, and are not limited herein.

Liquid inlet flow passage 3

In the embodiment of the present application, for the liquid inlet flow channel 3, the following two possible structures are given:

structure one

The liquid inlet channel 3 may be a tubular body, one end of the liquid inlet channel 3 is open, the other end is closed, and the sidewall of the liquid inlet channel 3 is provided with a plurality of liquid inlets 31, each liquid inlet 31 is respectively communicated with the first liquid inlet 111 of the first heat dissipation channel 11 (i.e. the first end of the first liquid-cooled heat dissipation module 1) or the second liquid inlet 211 of the second heat dissipation channel 21 (i.e. the first end of the second liquid-cooled heat dissipation module 2), and the corresponding structure is as shown in fig. 7. The cooling liquid flows in from the opening at one end of the liquid inlet flow channel 3, and flows into the first liquid cooling heat dissipation module 1 and the second liquid cooling heat dissipation module 2 through the liquid inlet 31, so that the first electronic device a and the second electronic device B are cooled.

Structure two

The liquid inlet channel 3 may comprise a liquid inlet tee 32, a first sub liquid inlet channel 33 and a second sub liquid inlet channel 34, and the corresponding structure is shown in fig. 8. The first sub liquid inlet flow passage 33 is respectively communicated with a first pipe orifice 321 of the liquid inlet three-way pipe 32 and a first end of the first liquid cooling heat dissipation module 1; the second sub liquid inlet flow channel 34 is respectively communicated with a second pipe orifice 322 of the liquid inlet three-way pipe 32 and a first end of the second liquid cooling and heat dissipating module 2.

The cooling liquid flows in from the third pipe orifice 323 of the liquid inlet three-way pipe 32, flows into the first sub liquid inlet flow passage 33 and the second sub liquid inlet flow passage 34 through the liquid inlet three-way pipe 32, then the cooling liquid in the first sub liquid inlet flow passage 33 flows into the first liquid cooling heat dissipation module 1 to dissipate heat of the first electronic device a, and the cooling liquid in the second sub liquid inlet flow passage 34 flows into the second liquid cooling heat dissipation module 2 to dissipate heat of the second electronic device B.

When the scheme of the first structure is adopted (as shown in fig. 7), the first liquid-cooling heat dissipation module 1 is closer to the inlet of the cooling liquid, and when the first electronic device a generates large heat, the heat is transferred to the liquid inlet flow channel 3 through the first liquid-cooling heat dissipation body 12, so that the temperature of the local pipe wall of the liquid inlet flow channel 3 is increased. In this case, when the cooling liquid flows to the second liquid-cooled heat dissipation module 2 in the liquid inlet flow channel 3, the cooling liquid passes through the local pipe wall, and at this time, the cooling liquid dissipates heat for the local pipe wall, that is, absorbs the temperature of the local pipe wall, so that the temperature of the cooling liquid is increased, and the heat dissipation effect of the liquid-cooled heat dissipater on the second electronic device B is lower than that of the first electronic device a. And adopt the scheme of above-mentioned second structure, can reduce the first electron device A and generate heat and lead to the local pipe wall temperature rising probability of feed liquor runner 3 to, reduce the probability of the uneven condition of above-mentioned radiating effect, be favorable to improving the stability of liquid cooling radiator.

Alternatively, the distance that the cooling liquid flows from the third pipe orifice 323 of the liquid inlet three-way pipe 32 to the first end of the first liquid-cooled heat dissipation module 1 is equal to the distance that the cooling liquid flows from the third pipe orifice 323 of the liquid inlet three-way pipe 32 to the first end of the second liquid-cooled heat dissipation module 2, and the length of the first sub liquid inlet flow passage 33 is equal to the length of the second sub liquid inlet flow passage 34. The structure of the inlet channel 3 is only described here by way of example and is not limited thereto.

Alternatively, as shown in fig. 8, the first sub-inlet channel 33 has a plurality of first inlet holes 331, each first inlet hole 331 is respectively communicated with the first inlet 111 of the first heat dissipation channel 11 (i.e. the first end of the first liquid-cooled heat dissipation module 1), the second sub-inlet channel 34 has a plurality of second inlet holes 341, and each second inlet hole 341 is respectively communicated with the second inlet 211 of the second heat dissipation channel 21 (i.e. the first end of the second liquid-cooled heat dissipation module 2). The cooling liquid flows into the first liquid-cooled heat dissipation module 1 through the first liquid inlet hole 331 and flows into the second liquid-cooled heat dissipation module 2 through the second liquid inlet hole 341, thereby dissipating heat from the first electronic device a and the second electronic device B.

Liquid outlet flow passage 4

The liquid outlet flow passage 4 may include a liquid outlet three-way pipe, a first sub liquid outlet flow passage and a second sub liquid inlet flow passage, and the liquid outlet flow passage may also be a tubular body. The structure of the liquid outlet flow passage 4 is similar to that of the liquid inlet flow passage 3, and the description thereof is omitted.

The outlet flow passage 4 may have a plurality of outlet ports 41, and each outlet port 41 is respectively communicated with the first outlet port 112 or the second inlet port 212. The cooling liquid in the first liquid cooling heat dissipation module 1 and the cooling liquid in the second liquid cooling heat dissipation module 2 flow into the liquid outlet channel 4 through the liquid outlet 41, and finally flow out through the liquid outlet channel 4.

Based on the same technical concept, the embodiment of the application also provides an electric drive controller, which comprises a first electronic device A, a second electronic device B and the liquid cooling radiator. The first electronic device a may be a capacitor, such as a thin film capacitor, and the second electronic device B may be a power module, such as an IGBT (Insulated Gate Bipolar Transistor) power module, a SiC (Silicon Carbide, inorganic non-metallic material) power module, and the like.

In the electric drive controller, the capacitor (i.e., the first electronic device a) may be attached to the first heat conducting cover plate 13 of the first liquid-cooled heat dissipation module 1, the first heat conducting cover plate 13 may be hermetically connected to the first opening (121) of the first liquid-cooled heat dissipation module 1, and the corresponding structure is as shown in fig. 9. The capacitor transmits heat generated during working to the first heat-conducting cover plate 13, and the first heat-conducting cover plate 13 transmits the heat to the cooling liquid in the first liquid-cooling heat-radiating module 1, so that heat dissipation and cooling of the capacitor are realized.

Optionally, the capacitor may be hermetically connected to the first opening (121) of the first liquid-cooled heat dissipation module 1, so that the capacitor is in contact with the cooling liquid, thereby enhancing the heat dissipation effect.

In the electric drive controller, the power module (i.e., the second electronic component B) can be hermetically connected to the second opening (221) of the second liquid-cooled heat dissipation module 2, and the corresponding structure is shown in fig. 9, so that the power module is in contact with the cooling liquid.

Optionally, the power module may be attached to the second heat conducting cover plate 23 of the second liquid cooling heat dissipation module 2, and the second heat conducting cover plate 23 may be hermetically connected to the second opening (221) of the second liquid cooling heat dissipation module 2. The power module transfers heat generated by the power module during working to the second heat-conducting cover plate 23, and the second heat-conducting cover plate 23 transfers the heat to the cooling liquid in the second liquid-cooling heat-dissipation module 2, so that heat dissipation and cooling of the power module are realized.

By adopting the scheme, the cooling liquid entering the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module has relatively low temperature, so that the liquid cooling heat dissipation module is effectively ensured to have good heat dissipation effect on the power module and the capacitor, and the stable operation of the electric drive controller is favorably ensured.

Based on the same technical concept, the embodiment of the application also provides a vehicle, and the vehicle comprises the electric drive controller.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A liquid cooling radiator is characterized by comprising a first liquid cooling radiating module (1), a second liquid cooling radiating module (2), a liquid inlet flow channel (3) and a liquid outlet flow channel (4);

the first end of the first liquid-cooling radiating module (1) and the first end of the second liquid-cooling radiating module (2) are respectively communicated with the liquid inlet flow channel (3); the second end of the first liquid cooling heat dissipation module (1) and the second end of the second liquid cooling heat dissipation module (2) are respectively communicated with the liquid outlet flow channel (4);

the first liquid cooling heat dissipation module (1) is used for being attached to a first electronic device (A) and dissipating heat of the first electronic device (A), and the second liquid cooling heat dissipation module (2) is used for being attached to a second electronic device (B) and dissipating heat of the second electronic device (B).

2. The liquid-cooled heat sink of claim 1, wherein the first liquid-cooled heat sink module (1) comprises a plurality of first heat dissipation channels (11), each first heat dissipation channel (11) having a first liquid inlet (111) and a first liquid outlet (112);

the second liquid cooling and heat dissipation module (2) comprises a plurality of second heat dissipation channels (21), and each second heat dissipation channel (21) is provided with a second liquid inlet (211) and a second liquid outlet (212);

each first liquid inlet (111) and each second liquid inlet (211) are respectively communicated with the liquid inlet flow channel (3), and each first liquid outlet (112) and each second liquid outlet (212) are respectively communicated with the liquid outlet flow channel (3).

3. The liquid-cooled heat sink of claim 2, wherein the inlet channel (3) has a plurality of inlets (31), each inlet (31) being in communication with the first inlet (111) or the second inlet (211), respectively;

the liquid outlet flow passage (4) is provided with a plurality of liquid outlets (41), and each liquid outlet (41) is respectively communicated with the first liquid outlet (112) or the second liquid inlet (212).

4. The liquid-cooled heat sink of claim 1, wherein the first liquid-cooled heat sink module (1) comprises a first liquid-cooled heat sink body (12) and a first heat conducting cover plate (13), wherein a first side of the first liquid-cooled heat sink body (12) has a first opening (121), the first heat conducting cover plate (13) is hermetically connected with the first opening (121), and the first heat conducting cover plate (13) is configured to be attached to a heat generating surface of the first electronic device (a).

5. A liquid-cooled heat sink according to claim 1, characterised in that the second side of the second liquid-cooled heat sink module (2) has a second opening (221), said second opening (221) being adapted for sealing connection with a heat generating surface of a second electronic device (B).

6. The liquid-cooled heat sink of claim 1, wherein the inlet channel (3) comprises an inlet tee (32), a first sub-inlet channel (33) and a second sub-inlet channel (34);

the first sub liquid inlet flow channel (33) is respectively communicated with a first pipe orifice (321) of the liquid inlet three-way pipe (32) and a first end of the first liquid cooling heat dissipation module (1);

the second sub liquid inlet flow channel (34) is respectively communicated with a second pipe orifice (322) of the liquid inlet three-way pipe (32) and a first end of the second liquid cooling and heat dissipating module (2).

7. A liquid-cooled heat sink according to any of claims 1-6, characterised in that the first liquid-cooled heat dissipation module (1) has a plurality of first fluid-disturbing bodies (113) and the second liquid-cooled heat dissipation module (2) has a plurality of second fluid-disturbing bodies (213).

8. An electrically driven controller, characterized in that it comprises a first electronic device (a), a second electronic device (B) and a liquid-cooled heat sink according to any of claims 1-8.

9. An electric drive controller according to claim 8, characterized in that the first electronic component (a) is a power module and the second electronic component (B) is a capacitor.

10. A motor vehicle, characterized in that it comprises an electric drive controller according to claim 8 or 9.