CN108766946B - Liquid cooling heat abstractor and motor controller - Google Patents
Liquid cooling heat abstractor and motor controller Download PDFInfo
- Publication number
- CN108766946B CN108766946B CN201810820454.1A CN201810820454A CN108766946B CN 108766946 B CN108766946 B CN 108766946B CN 201810820454 A CN201810820454 A CN 201810820454A CN 108766946 B CN108766946 B CN 108766946B
- Authority
- CN
- China
- Prior art keywords
- liquid
- cooling
- flow
- power module
- liquid collecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 151
- 238000001816 cooling Methods 0.000 title claims abstract description 85
- 239000000110 cooling liquid Substances 0.000 claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- 238000009434 installation Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 239000002826 coolant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000002076 thermal analysis method Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention provides a liquid cooling heat dissipation device and a motor controller, wherein the liquid cooling heat dissipation plate comprises a first liquid collecting part, a second liquid collecting part and a plurality of liquid cooling plates; the plurality of liquid cooling plates are arranged at intervals, and one surface of each liquid cooling plate forms a power module mounting surface; each liquid cooling plate is internally provided with a cooling liquid channel, the first liquid collecting part is internally provided with a first liquid collecting cavity, the second liquid collecting part is internally provided with a second liquid collecting cavity, and the first liquid collecting cavity is communicated with the second liquid collecting cavity through the cooling liquid channels in the liquid cooling plates. According to the invention, the power module is radiated through the plurality of independent liquid cooling plates, so that the radiating efficiency of the power module can be greatly improved, and the heat dissipation temperature equalizing effect is improved.
Description
Technical Field
The invention relates to the field of controller heat dissipation, in particular to a liquid cooling heat dissipation device and a motor controller.
Background
As a mature heat dissipation technology, the liquid cooling heat dissipation method has been widely used in industrial approaches, such as motors and controllers. Because the heat dissipation speed of the liquid is far greater than that of air, the heat dissipation efficiency of the liquid cooling radiator is far greater than that of the air cooling radiator, and meanwhile, the noise aspect can be well controlled.
In the motor controller, a plurality of power modules are generally arranged on the surface of a heat dissipation plate in a tiled manner, heat is transferred to a cooling liquid through the heat dissipation plate, and finally, heat is taken away through convective heat transfer. In addition, in order to increase the power density, as shown in fig. 1, a plurality of power modules may be arranged in an upright manner at both sides of the heat dissipation plate 11, and heat is transferred to the cooling liquid through the heat dissipation plate 11, and finally, heat is taken away by convection.
However, in the multi-module heat dissipation structure installed in a flat-type or upright-type manner, the temperature difference between the front and rear modules caused by the accumulated temperature of the cooling liquid is problematic, and particularly, the uneven temperature phenomenon caused by the accumulated temperature is particularly obvious at high power and low flow.
As shown in fig. 2, a schematic view of straight-tooth fins in a conventional heat dissipation plate is shown, and in this structure, a plurality of heat dissipation fins 22 are disposed on the back surface of the power module mounting surface of the heat dissipation plate 21, and heat dissipation is assisted by a plate-fin structure. As shown in fig. 3, in order to improve heat exchange efficiency, pin fin (pinfin) 32 may be used on the back surface of the power module mounting surface of the heat dissipation plate 31, and turbulence may be enhanced by a special pin fin structure, so as to improve convective heat exchange effect.
However, the heat dissipation capability of the structure of the heat dissipation fin portion is generally weak, and when the power density of the module is increased, a high temperature rise is most likely to occur, which ultimately leads to overheating of the power module. Referring to fig. 4, a thermal analysis schematic diagram of the vertical radiator (with straight-tooth fins) with multiple power modules is shown, where the power module with the lowest temperature is 108.1 ℃ and the power module with the highest temperature is 125.9 ℃ and the temperature difference between the power modules is 17.8 ℃ when the power modules are working normally. As shown in fig. 5, even if pin fins are replaced in the heat sink, the power module with the lowest temperature is 105.9 ℃, and the power module with the highest temperature is 116.2 ℃, i.e. the temperature difference between the power modules is still 10.3 ℃.
Disclosure of Invention
The invention aims to solve the technical problems of uneven heat dissipation and weak heat dissipation capacity of the liquid cooling radiator, and provides a novel liquid cooling radiator and a motor controller.
The technical scheme of the invention for solving the technical problems is that the liquid cooling heat dissipation device comprises a first liquid collecting part, a second liquid collecting part and a plurality of liquid cooling plates; the plurality of liquid cooling plates are arranged at intervals, and one surface of each liquid cooling plate forms a power module mounting surface; each liquid cooling plate is internally provided with a cooling liquid channel, the first liquid collecting part is internally provided with a first liquid collecting cavity, the second liquid collecting part is internally provided with a second liquid collecting cavity, and the first liquid collecting cavity is communicated with the second liquid collecting cavity through the cooling liquid channels in the liquid cooling plates.
In the liquid cooling heat dissipation device of the invention, each liquid cooling plate is internally provided with a first flow passage and a second flow passage which are overlapped, the first flow passage and the second flow passage are communicated to form the cooling liquid passage, and the flow direction of the cooling liquid in the first flow passage is opposite to the flow direction of the cooling liquid in the second flow passage.
In the liquid cooling heat dissipation device, the first flow channel is arranged close to the power module mounting surface, and the second flow channel is arranged far away from the power module mounting surface.
In the liquid cooling heat dissipation device of the invention, each liquid cooling plate is internally provided with an arc-shaped flow passage, and the first flow passage and the second flow passage are communicated through the arc-shaped flow passages.
In the liquid cooling heat dissipation device of the invention, the first liquid collecting part is provided with a cooling liquid inlet, and the first liquid collecting cavity is connected with the cooling liquid inlet; the second liquid collecting part is provided with a cooling liquid outlet, and the second liquid collecting cavity is connected with the cooling liquid outlet; the outlet of the first runner is communicated with the second liquid collecting cavity, the inlet of the second runner is communicated with the first liquid collecting cavity, and the outlet of the second runner is communicated with the inlet of the first runner.
In the liquid cooling heat dissipation device of the present invention, the plurality of liquid cooling plates are arranged in parallel, and the first liquid collecting portion and the second liquid collecting portion are located at the same end of the liquid cooling plates.
In the liquid cooling heat dissipation device of the invention, the liquid cooling heat dissipation device comprises two liquid cooling plates, and the power module mounting surfaces on the two liquid cooling plates are respectively positioned on the outer side surfaces of the two liquid cooling plates.
In the liquid cooling heat dissipation device of the present invention, the first flow channel includes a plurality of independent first sub-flow channels, the second flow channel includes a plurality of independent second sub-flow channels, and each of the first sub-flow channels is respectively communicated with a corresponding second sub-flow channel.
In the liquid cooling heat dissipation device of the present invention, the plurality of first sub-flow channels are arranged along a direction parallel to the mounting surface of the power module, and the directions of the cooling liquid in the plurality of first sub-flow channels are the same; the plurality of second sub-flow passages are arranged along the direction parallel to the mounting surface of the power module, and the flow directions of the cooling liquid in the plurality of second sub-flow passages are the same.
The invention also provides a motor controller which comprises a plurality of power modules and the liquid cooling heat dissipation device, wherein the power modules are respectively fixed on the power module installation surface of the liquid cooling plate through insulating heat conducting plates.
According to the liquid cooling heat dissipation device and the motor controller, the plurality of independent liquid cooling plates are used for dissipating heat of the power module, so that the heat dissipation efficiency of the power module can be greatly improved, and meanwhile, the heat dissipation temperature equalizing effect is improved.
Drawings
FIG. 1 is a schematic diagram of a prior art multi-power module upright heat sink;
FIG. 2 is a schematic view of a straight-tooth fin structure in a conventional radiator;
FIG. 3 is a schematic view of a pin fin structure in a prior art heat sink;
FIG. 4 is a schematic diagram of a thermal analysis of a prior art multi-power module upright heat sink employing straight-tooth fins;
FIG. 5 is a schematic diagram of a thermal analysis of a prior art multi-power module stand-up heat sink employing pin fins;
FIG. 6 is a schematic diagram of an embodiment of a liquid-cooled heat sink according to the present invention;
FIG. 7 is a top view of an embodiment of a liquid-cooled heat sink according to the present invention;
FIG. 8 is a schematic diagram of a cross-section of a liquid cooling plate in an embodiment of a liquid cooling radiator according to the invention;
fig. 9 is a schematic diagram of thermal analysis of an embodiment of a liquid-cooled heat sink according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Fig. 6 is a schematic diagram of an embodiment of a liquid-cooled heat sink according to the present invention, which can be applied to a motor controller and dissipate heat from a power module (e.g., a semiconductor switching tube in an inverter). The liquid cooling heat dissipation device in this embodiment includes a first liquid collecting portion 63, a second liquid collecting portion 64, and two liquid cooling plates 61 (in practical application, there may be more liquid cooling plates 61), and the two liquid cooling plates 61 are disposed at intervals (i.e. a certain distance is provided between the two liquid cooling plates 61). Each liquid cooling plate 61 is flat (strip or plate), and one surface of each liquid cooling plate 61 forms a power module mounting surface, and a plurality of power modules 7 can be attached to each power module mounting surface. Each liquid cooling plate 61 has a cooling liquid channel therein, the first liquid collecting portion 63 has a first liquid collecting cavity therein, the second liquid collecting portion 64 has a second liquid collecting cavity therein, and the cooling liquid channel of each liquid cooling plate 61 communicates with the first liquid collecting cavity and the second liquid collecting cavity, respectively.
When the above liquid cooling heat dissipation device is used to dissipate heat of the power module 7, the power module 7 may be fixed (e.g. welded, crimped, etc.) to the power module mounting surface of the liquid cooling plate 61 by an insulating heat conducting plate, and the first liquid collecting cavity and the second liquid collecting cavity may be connected to an external cooling liquid circulation channel, so that the external cooling liquid flows in from the first liquid collecting cavity, flows through the cooling liquid channels in the two liquid cooling plates 61, then enters the second liquid collecting cavity, and returns to the external cooling liquid circulation channel from the second liquid collecting cavity.
The above-mentioned liquid cooling heat dissipation device dissipates heat to a plurality of power modules 7 (for example, 8 power modules shown in fig. 6) through two independent liquid cooling plates 61, and can greatly improve the heat dissipation efficiency of the power modules 7 and improve the heat dissipation temperature equalizing effect.
Preferably, in connection with fig. 8, each of the liquid cooling plates 61 has a first flow channel 611 and a second flow channel 612 disposed in a stacked manner, the first flow channel 611 and the second flow channel 612 are communicated to form a cooling liquid channel, and the flow direction of the cooling liquid in the first flow channel 611 is opposite to the flow direction of the cooling liquid in the second flow channel 612. Through the structure, the plurality of power modules 7 on the mounting surface of each power module are directly cooled or indirectly cooled by two cooling liquids with opposite flow directions, so that the temperature equalizing effect of each power module 7 is greatly improved.
In particular, in each liquid cooling plate, the first flow channel 611 and the second flow channel 612 are disposed perpendicular to the power module mounting surface, and the first flow channel 611 is disposed close to the power module mounting surface and the second flow channel is disposed away from the power module mounting surface, as shown in fig. 7 (i.e., the first flow channel 611 is located on one side of the power module mounting surface of the liquid cooling plate 61 and the second flow channel 612 is located on the opposite side of the power module mounting surface). The cooling liquid in the first flow channel 611 can exchange heat with the cooling liquid in the second flow channel 612, so that the temperature uniformity is achieved.
In order to ensure the flow velocity of the cooling liquid in the first flow channel 611 and the second flow channel 612, the liquid cooling plate 61 may have an arc-shaped flow channel therein, and the first flow channel 611 and the second flow channel 612 may be communicated through the arc-shaped flow channel.
A cooling liquid inlet may be provided on the first liquid collecting portion 63, and a first liquid collecting cavity in the first liquid collecting portion 63 is connected to the cooling liquid inlet; a cooling liquid outlet can be arranged on the second liquid collecting part 64, and a second liquid collecting cavity in the second liquid collecting part 64 is connected with the cooling liquid outlet; the outlet of the first flow channel is communicated with the second liquid collecting cavity, the inlet of the second flow channel is communicated with the first liquid collecting cavity, and the outlet of the second flow channel is communicated with the inlet of the first flow channel. In this way, an internal coolant circulation flow path between the coolant inlet of the first liquid collecting portion 63 and the coolant outlet of the second liquid collecting portion 64 is formed in the liquid-cooled radiator, and the coolant flowing in from the coolant inlet flows through the first liquid collecting chamber, the second flow path 612, the first flow path 611, and the second liquid collecting chamber in this order, and flows out from the coolant outlet.
During the flow of the cooling liquid, the temperature of the cooling liquid in the second flow passage 612 is lower, the cooling liquid can absorb the heat of the cooling liquid in the first flow passage 611, and the closer to the first liquid collecting cavity, the more heat is absorbed (the closer to the first liquid collecting cavity, the lower the temperature of the cooling liquid in the second flow passage is); the cooling fluid in the first flow channel 611 absorbs heat from the power module 7 on the power module mounting surface. Specifically, when the power module 7 is operated, the temperature of the cooling liquid in the first flow channel 611 gradually increases from left to right and the temperature of the cooling liquid in the second flow channel 612 gradually increases from right to left with respect to the liquid cooling plate 61 located above in fig. 7 due to heat generation of the power module 7, and the cold and hot fluid flows across the first flow channel 611 and the second flow channel 612 to be uniform in temperature.
As shown in fig. 8, to reduce the convection in the first flow channel 611 and the second flow channel 612 and improve the heat dissipation efficiency, the first flow channel 611 may include a plurality of independent first sub-flow channels, and similarly, the second flow channel 612 may include a plurality of independent second sub-flow channels, and each of the first sub-flow channels is respectively communicated with a corresponding second sub-flow channel. The plurality of first sub-flow passages are arranged along the direction parallel to the mounting surface of the power module, and the flow directions of the cooling liquid in the plurality of first sub-flow passages are the same; the plurality of second sub-flow passages are arranged along the direction parallel to the mounting surface of the power module, and the flow directions of the cooling liquid in the plurality of second sub-flow passages are the same.
As shown in fig. 9, the results of thermal analysis of the liquid-cooled radiator of the present example were obtained under the same conditions (loss, cooling parameters, number of power modules) as those of fig. 4 and 5. As can be seen from the figure, the lowest temperature power module is 107.4 ℃, the highest temperature power module is 111.4 ℃, the hot spot temperature rise is reduced by 14.5 ℃ compared with the multi-power module vertical radiator with straight-tooth fins, the hot spot temperature rise is reduced by 4.8 ℃ compared with the multi-power module vertical radiator with pin fins, and the temperature difference between the power modules 7 is only 4 ℃.
In the above-described liquid-cooled heat sink, the two liquid-cooled plates 61 may be disposed in parallel, and the first liquid-collecting portion 63 and the second liquid-collecting portion 64 may be located at the same end of the liquid-cooled plates 61. This structure is convenient installs the motor controller with liquid cooling radiator to be convenient for it is connected with outside coolant liquid pipeline.
In order to improve the overall heat dissipation efficiency of the liquid-cooled radiator, the power module mounting surfaces on the two liquid-cooled plates 61 are respectively located on the outer side surfaces of the two liquid-cooled plates 61, as shown in fig. 7. This structure facilitates not only heat dissipation but also installation of the power module 7 (e.g. in connection with an external coolant circulation system).
The invention also provides a motor controller which controls the motor speed by varying the current frequency. The motor controller comprises a plurality of power modules and the liquid cooling heat dissipation device, and the power modules are respectively fixed (e.g. welded) on the power module installation surface of the liquid cooling plate through the insulating heat conducting plate.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (7)
1. The liquid cooling heat dissipating device is characterized by comprising a first liquid collecting part, a second liquid collecting part and a plurality of liquid cooling plates; the plurality of liquid cooling plates are arranged at intervals, and one surface of each liquid cooling plate forms a power module mounting surface; each liquid cooling plate is internally provided with a cooling liquid channel, the first liquid collecting part is internally provided with a first liquid collecting cavity, the second liquid collecting part is internally provided with a second liquid collecting cavity, and the first liquid collecting cavity is communicated with the second liquid collecting cavity through the cooling liquid channels in the liquid cooling plates;
each liquid cooling plate is internally provided with a first flow passage and a second flow passage which are overlapped along the direction vertical to the mounting surface of the power module, the first flow passage and the second flow passage are communicated to form the cooling liquid passage, the flow direction of cooling liquid in the first flow passage is opposite to the flow direction of cooling liquid in the second flow passage, and the cooling liquid in the first flow passage and the cooling liquid in the second flow passage are subjected to heat exchange to achieve uniform temperature;
the first flow channel comprises a plurality of independent first sub-flow channels, the second flow channel comprises a plurality of independent second sub-flow channels, and each first sub-flow channel is communicated with a corresponding second sub-flow channel respectively;
the plurality of first sub-flow passages are arranged along the direction parallel to the power module mounting surface, and the flow directions of the cooling liquid in the plurality of first sub-flow passages are the same; the plurality of second sub-flow passages are arranged along the direction parallel to the mounting surface of the power module, and the flow directions of the cooling liquid in the plurality of second sub-flow passages are the same.
2. The liquid cooled heat sink of claim 1 wherein the first flow passage is disposed proximate the power module mounting surface and the second flow passage is disposed remote from the power module mounting surface.
3. The liquid-cooled heat sink of claim 2 wherein each of the liquid-cooled plates has an arcuate flow passage therein and the first and second flow passages communicate through the arcuate flow passages.
4. The liquid-cooled heat sink of claim 2 wherein the first liquid-collecting portion has a cooling liquid inlet and the first liquid-collecting chamber is connected to the cooling liquid inlet; the second liquid collecting part is provided with a cooling liquid outlet, and the second liquid collecting cavity is connected with the cooling liquid outlet; the outlet of the first runner is communicated with the second liquid collecting cavity, the inlet of the second runner is communicated with the first liquid collecting cavity, and the outlet of the second runner is communicated with the inlet of the first runner.
5. The liquid cooling heat sink of claim 4 wherein the plurality of liquid cooling plates are arranged in parallel and the first liquid collecting portion and the second liquid collecting portion are located at the same end of the liquid cooling plates.
6. The liquid cooling heat sink of claim 5 wherein the liquid cooling heat sink comprises two liquid cooling plates and the power module mounting surfaces on the two liquid cooling plates are located on the outer sides of the two liquid cooling plates, respectively.
7. A motor controller comprising a plurality of power modules and the liquid cooling heat dissipation device according to any one of claims 1 to 6, wherein the plurality of power modules are respectively fixed on a power module installation surface of the liquid cooling plate through an insulating heat conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810820454.1A CN108766946B (en) | 2018-07-24 | 2018-07-24 | Liquid cooling heat abstractor and motor controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810820454.1A CN108766946B (en) | 2018-07-24 | 2018-07-24 | Liquid cooling heat abstractor and motor controller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108766946A CN108766946A (en) | 2018-11-06 |
| CN108766946B true CN108766946B (en) | 2024-03-19 |
Family
ID=63970882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810820454.1A Active CN108766946B (en) | 2018-07-24 | 2018-07-24 | Liquid cooling heat abstractor and motor controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108766946B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208460748U (en) * | 2018-07-24 | 2019-02-01 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
| CN111757656B (en) * | 2020-08-10 | 2021-07-06 | 西安电子科技大学 | Conformal countercurrent liquid cooling radiator |
| CN113079678A (en) * | 2021-03-29 | 2021-07-06 | 阳光电源股份有限公司 | Liquid cooling heat abstractor and power module |
| CN112951781A (en) * | 2021-04-01 | 2021-06-11 | 中创杜菲(北京)汽车科技有限公司 | Power semiconductor module cooling device and power semiconductor module |
| CN115360154B (en) * | 2022-10-19 | 2023-03-24 | 宁波均胜智能汽车技术研究院有限公司 | Modularization heat abstractor and on-vehicle domain controller |
| CN115666086B (en) * | 2022-10-29 | 2023-10-13 | 深圳市瀚强科技股份有限公司 | Heat abstractor, electronic equipment and consumer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009192177A (en) * | 2008-02-15 | 2009-08-27 | Toyota Industries Corp | Ebullient cooling device |
| CN206640923U (en) * | 2017-03-06 | 2017-11-14 | 苏州汇川技术有限公司 | Radiator and the electric vehicle controller with radiator |
| CN107484387A (en) * | 2017-07-17 | 2017-12-15 | 华为技术有限公司 | A kind of immersion liquid cooling apparatus, blade server and rack-mount server |
| CN207011178U (en) * | 2017-05-17 | 2018-02-13 | 苏州汇川联合动力系统有限公司 | Liquid cooling heat radiator and electric machine controller |
| CN208460748U (en) * | 2018-07-24 | 2019-02-01 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9927181B2 (en) * | 2009-12-15 | 2018-03-27 | Rouchon Industries, Inc. | Radiator with integrated pump for actively cooling electronic devices |
-
2018
- 2018-07-24 CN CN201810820454.1A patent/CN108766946B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009192177A (en) * | 2008-02-15 | 2009-08-27 | Toyota Industries Corp | Ebullient cooling device |
| CN206640923U (en) * | 2017-03-06 | 2017-11-14 | 苏州汇川技术有限公司 | Radiator and the electric vehicle controller with radiator |
| CN207011178U (en) * | 2017-05-17 | 2018-02-13 | 苏州汇川联合动力系统有限公司 | Liquid cooling heat radiator and electric machine controller |
| CN107484387A (en) * | 2017-07-17 | 2017-12-15 | 华为技术有限公司 | A kind of immersion liquid cooling apparatus, blade server and rack-mount server |
| CN208460748U (en) * | 2018-07-24 | 2019-02-01 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108766946A (en) | 2018-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108766946B (en) | Liquid cooling heat abstractor and motor controller | |
| US8472193B2 (en) | Semiconductor device | |
| WO2019154083A1 (en) | Liquid cooling pipeline and power supply apparatus | |
| CN112885798B (en) | Integrated phase change heat transfer element liquid cooling heat radiation module for server | |
| CN108807313B (en) | Microelectronic device heat dissipation device | |
| CN109982544B (en) | Liquid cooling radiator | |
| CN112414164A (en) | Multi-runner type efficient radiating water-cooling radiator | |
| WO2018209828A1 (en) | Liquid cooling heat dissipation device and motor controller | |
| CN105514064A (en) | Heat sink | |
| CN108925124B (en) | Module immersion type cooling body and frequency converter | |
| WO2020019579A1 (en) | Liquid cooling heat radiating apparatus and motor controller | |
| CN114071955A (en) | Cooling device and electronic equipment comprising same | |
| CN114828598A (en) | Liquid cooling radiator, electric drive controller and car | |
| CN113783085A (en) | Built-in circulating passive cooling module and method for air-cooled low-power solid laser of all-in-one machine | |
| CN110848821B (en) | Heat radiation member, heat radiator and air conditioner | |
| CN109037833B (en) | Energy-saving battery radiator for electric automobile | |
| CN113035805A (en) | Liquid cooling plate and power module | |
| CN110678043A (en) | Liquid cooling radiator and motor controller | |
| CN219876264U (en) | Board card structure and chassis | |
| CN215773958U (en) | Motor controller and vehicle | |
| AU2021102059A4 (en) | A laser module | |
| CN213340362U (en) | New energy automobile semiconductor device liquid cooling radiator | |
| CN217239229U (en) | Cooling device for power transformer | |
| CN219205104U (en) | Heat dissipation water course structure and equipment | |
| CN218731226U (en) | Water-cooling plate with refrigeration function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215000 52 tianedang Road, Yuexi Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215000 52 tianedang Road, Yuexi Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |