CN219677255U - Electronic component integrating three-dimensional vapor cavity and liquid cooling heat dissipation - Google Patents
Electronic component integrating three-dimensional vapor cavity and liquid cooling heat dissipation Download PDFInfo
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- CN219677255U CN219677255U CN202321019993.8U CN202321019993U CN219677255U CN 219677255 U CN219677255 U CN 219677255U CN 202321019993 U CN202321019993 U CN 202321019993U CN 219677255 U CN219677255 U CN 219677255U
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- 239000007788 liquid Substances 0.000 title claims abstract description 66
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 238000001816 cooling Methods 0.000 title claims abstract description 59
- 239000000110 cooling liquid Substances 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 2
- 239000012809 cooling fluid Substances 0.000 claims 3
- 238000012423 maintenance Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 10
- 238000009434 installation Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
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- 230000005514 two-phase flow Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The electronic component comprises a circuit board and a liquid cooling heat dissipation module, wherein the circuit board is provided with a first heat source and a second heat source, the liquid cooling heat dissipation module is arranged on the circuit board and comprises a three-dimensional steam cavity element and a half-open shell, the three-dimensional steam cavity element comprises an upper cover and a lower cover, the lower cover is provided with a first area and a second area relative to the upper cover, when the upper cover is jointed with the first area of the lower cover, a first airtight air cavity is formed, the first lower surface of the first area is used for contacting the first heat source, the second lower surface of the second area is used for contacting the second heat source, the half-open shell is connected with the lower cover and forms a liquid cooling cavity, and the liquid cooling cavity is used for accommodating the upper cover and the second upper surface; therefore, the utility model has simple structure, convenient operation and maintenance and can effectively improve the heat dissipation efficiency.
Description
Technical Field
The present utility model relates to an electronic assembly with integrated three-dimensional vapor chamber and liquid cooling, and more particularly to an electronic assembly with integrated three-dimensional vapor chamber and liquid cooling.
Background
The current electronic products are increasingly demanded, and in order to meet the demands of consumers and respond to the trend of big data, the performance requirements of the wafers are also higher and higher, for example, the power of single wafers in an automobile, such as an automatic driving function, a data center server, etc., is up to 500W or 700W, and even in the future, the design demands of high-power wafer products with power exceeding 1000W are met. In general, the faster the calculation speed of a wafer, the more powerful the performance thereof, but at the same time, the Thermal Design Power (TDP) and the heat generation amount of the wafer are also greatly increased. If the heat of the wafer cannot be effectively dissipated, the wafer can be overtemperature, so that the wafer is subjected to frequency-reducing work and even burnt.
Vapor Chamber (VC) is a commonly used structure for solving the problem of heat dissipation of wafers at present, and is generally in a flat plate shape and can be used for solving the problem of two-dimensional heat diffusion. Along with the increasing power of the wafer, the flat vapor cavity temperature-equalizing plate element cannot meet the heat dissipation requirement, and then a three-dimensional vapor cavity temperature-equalizing plate element structure is generated, so that the heat absorption area and the condensation area of two-phase flow circulation are respectively positioned on different planes, and the function of three-dimensional heat dissipation is increased.
However, the circuit board (Printed circuit board, PCB) of the conventional electronic device includes the secondary heat source such as passive components and memory in addition to the main heat source such as high power Central Processing Unit (CPU) and Graphics Processing Unit (GPU). However, the heat dissipation devices required by the conventional main heat source and the secondary heat source are not necessarily the same, wherein two-dimensional VC, three-dimensional VC or aluminum extruded heat dissipation fins are all conventional heat dissipation devices. When the conventional electronic component is selected and arranged with respect to the heat dissipating devices corresponding to the main heat source and the sub heat source, the required number of the heat dissipating devices with different heat dissipating efficiencies is required to be arranged and installed, which often results in an increase in the installation cost, installation complexity and time of the heat dissipating devices on the conventional electronic component. Therefore, in order to solve the problems of the prior art, an improvement from the heat dissipation module is needed to reduce the cost, the installation time and the complexity of the heat dissipation device required by the prior electronic component.
Disclosure of Invention
Accordingly, the present utility model is directed to an electronic assembly integrating a three-dimensional vapor chamber and liquid cooling, which can solve the above-mentioned conventional problems, has a simple structure, is convenient to operate and maintain, and can effectively improve the heat dissipation efficiency.
In order to achieve the above purpose, the present utility model discloses an electronic assembly integrating a three-dimensional vapor chamber and liquid cooling heat dissipation, which is characterized by comprising:
a circuit board provided with a first heat source and a second heat source; and
the liquid cooling heat radiation module is arranged on the circuit board and comprises:
a three-dimensional vapor chamber element comprising an upper cover and a lower cover, wherein the lower cover has a first area and a second area relative to the upper cover, the first area has a first lower surface, the second area has a second lower surface and a second upper surface, and after the upper cover is jointed with the first area of the lower cover, a first airtight air chamber is formed, the first lower surface of the first area contacts the first heat source, and the second lower surface of the second area contacts the second heat source;
a half open shell connected to the lower cover and forming a liquid cooling cavity for accommodating the upper cover and the second upper surface of the second region; and
a cooling liquid is arranged in the liquid cooling cavity.
Wherein, the lower cover is provided with a second heat source, and the lower cover is provided with a second area and a second heat source.
The semi-open shell is provided with a first input port and a first output port for respectively inputting and outputting the cooling liquid into and from the liquid cooling cavity.
The half-open shell comprises a first half-open shell and a second half-open shell, wherein the first half-open shell is arranged on the first area of the lower cover to form a first liquid cooling cavity for accommodating the upper cover, and the second half-open shell is arranged on the second area of the lower cover to form a second liquid cooling cavity for accommodating the second upper surface of the second area.
The first half-open shell is provided with a second input port and a second output port for respectively inputting and outputting the cooling liquid into the first liquid cooling cavity, the second half-open shell is provided with a third input port and a third output port for respectively inputting and outputting the cooling liquid into the second liquid cooling cavity, and a communication pipe is arranged between the second input port and the third output port.
The upper cover comprises a substrate and a pipe body, wherein the substrate is provided with a substrate cavity, an opening and an upper outer surface, the pipe body is provided with a pipe body cavity, the pipe body is arranged on the upper outer surface and positioned above the opening and protrudes outwards from the upper outer surface, and when the upper cover is connected with the first area of the lower cover, the pipe body cavity and the substrate cavity form the first airtight air cavity.
The temperature equalizing plate comprises a flat plate corresponding to a second area of the lower cover, wherein the second area is provided with a lower cover cavity, so that when the flat plate is jointed with the second area of the lower cover, the lower cover cavity forms a second airtight air cavity.
The second area of the lower cover is provided with a third outer surface and a first groove, the first groove is arranged on the third outer surface and communicated with the cavity of the lower cover to accommodate the flat plate, and the second outer surface of the flat plate contacts the second heat source.
The second area of the lower cover is provided with a fourth upper outer surface, a fourth lower outer surface and a second groove, the second groove is arranged on the fourth upper outer surface and communicated with the lower cover cavity to accommodate the flat plate, and the fourth lower outer surface of the second area is contacted with the second heat source.
The pipe body is provided with a top end, and the top end is provided with a sprue sealing structure formed by a sprue which is arranged at the top end in advance and used for sealing the sprue after a working fluid is injected into the sealed air cavity through the sprue.
In summary, the electronic component integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation provided by the utility model is formed by introducing the three-dimensional vapor chamber module into the liquid cooling heat dissipation to integrate the three-dimensional vapor chamber module on the electronic component. Compared with the prior art, the utility model can more effectively take away the heat energy on the heat source through the cooling liquid input into the liquid cooling heat dissipation module. In addition, the three-dimensional vapor cavity element in the liquid cooling heat dissipation module further comprises a first area and a second area, wherein the first area is used for conducting heat dissipation of a first heat source (a main heat source), and the second area is also used for conducting heat dissipation of a second heat source (a secondary heat source) at the same time, so that a plurality of heat dissipation devices with different heat dissipation efficiencies are not required to be arranged respectively for conducting heat dissipation of the first heat source (the main heat source) and the second heat source (the secondary heat source). Compared with the prior art, the utility model provides the electronic component integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation, which has the advantages of lower setting cost, simple installation, shorter installation time and improved heat dissipation efficiency.
Drawings
Fig. 1 shows a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and liquid-cooled heat dissipation in accordance with an embodiment of the present utility model.
Fig. 2A is a top view of the heat sink fin shown in fig. 1.
Fig. 2B is a side view of the heat sink fin shown in fig. 1.
Fig. 3 shows a cross-sectional view of an electronic assembly incorporating a three-dimensional vapor chamber and liquid cooled heat dissipation in accordance with another embodiment of the utility model.
Fig. 4 shows a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and a liquid-cooled heat sink in accordance with another embodiment of the present utility model.
Fig. 5 is an enlarged view of a portion of the second region according to fig. 4.
Fig. 6 shows a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and a liquid-cooled heat sink in accordance with another embodiment of the present utility model.
Fig. 7 is an enlarged view of a portion of the second region according to fig. 6.
Fig. 8 shows a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and a liquid-cooled heat sink in accordance with another embodiment of the present utility model.
Fig. 9 is an enlarged view of a portion of the three-dimensional vapor chamber element shown in fig. 1.
Detailed Description
In order that the advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It should be noted that these embodiments are merely representative embodiments of the present utility model, and the specific methods, devices, conditions, materials, etc. are not meant to limit the present utility model or the corresponding embodiments. In the drawings, each element is shown in a relative position and is not drawn to actual scale, and the step numbers of the present utility model merely distinguish between different steps and do not represent the sequence of steps.
Referring to fig. 1, fig. 1 is a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and liquid-cooled heat dissipation according to an embodiment of the utility model. As shown in fig. 1, the present utility model provides an electronic assembly 1 integrating a three-dimensional vapor chamber and liquid cooling, which includes a circuit board 10 and a liquid cooling module 20. The circuit board 10 is provided with a first heat source 12 and a second heat source 13. The liquid cooling module 20 is disposed on the circuit board 10, and includes a three-dimensional vapor chamber element 21, a semi-open housing 22, and a cooling liquid 23. The three-dimensional vapor chamber element 21 includes an upper cover 211 and a lower cover 212, the lower cover 212 has a first area a and a second area B opposite to the upper cover 211, the first area a has a first lower surface 2121, the second area B has a second lower surface 2122 and a second upper surface 2123, the first closed air chamber 213 is formed when the upper cover 211 is joined to the first area a of the lower cover 212, the first lower surface 2121 of the first area a is used for contacting the first heat source 12, and the second lower surface 2122 of the second area B is used for contacting the second heat source 13. The semi-open housing 22 is disposed on the lower cover 212 and forms a liquid cooling cavity 221, and the liquid cooling cavity 221 is configured to accommodate the upper cover 211 and the second upper surface 2123 of the second region B. The cooling liquid 23 is disposed in the liquid cooling chamber 221. In practice, the upper cover 211 and the lower cover 212 may be bonded by heating to a melting point using solder paste. In this embodiment, the semi-open housing 22 may be milled to a housing profile using a computer numerical control (Computer Numerical Control, CNC) processor or integrally formed using a mold, but the method is not limited thereto. In addition, the semi-open housing 22 may be adhered to the side surface (not labeled) of the lower cover by using a heat-conductive adhesive, so that the cooling liquid 23 is not oozed out due to the gaps between the semi-open housing 22 and the side surface of the lower cover when being disposed in the liquid cooling cavity 221, thereby damaging the circuit board 10. It should be noted that the bottom plate 11 shown in fig. 1 is disposed under the circuit board 10 and is engaged with the semi-open housing 22 by using screws, but the utility model is not limited thereto, and the bottom plate 11 may be used as required.
In the embodiment of the present utility model, the semi-open housing 22 has a first input port 222 and a first output port 223, so that the cooling liquid 23 is input into the liquid cooling cavity 221 from the first input port 222, and then the cooling liquid 23 is discharged from the first output port 223 for heat exchange. In practice, when the circuit board 10 is operated, the first heat source 12 and the second heat source 13 generate heat energy due to the operation, and the first lower surface 2121 and the second lower surface 2122 of the first area a are used as heat absorbing contacts to absorb the heat energy from the first heat source 12 and the second heat source 13, and then absorb the heat energy through the liquid phase working fluid (not shown) in the porous capillary structure (not shown) in the three-dimensional vapor chamber element 21, and then the liquid phase working fluid is transformed into the gas phase working fluid (not shown) due to the phase change after absorbing the heat energy. Further, the heat energy in the gas-phase working fluid is conducted to the upper cover 211 (condensation end) in the first closed air cavity 213, and then is dissipated through the welded heat dissipation fins 240 and 241. In addition, the cooling liquid 23 flows from the first outlet 223 to sequentially remove the heat energy at the second heat source 13 and the heat energy at the first heat source 12, so that the electronic component 1 integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation of the present utility model dissipates heat more efficiently than the prior art. In practice, the cooling liquid may be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerant, but not limited thereto, and the cooling liquid may be other fluids with heat absorption and heat removal functions. It should be noted that, in practice, the first heat source is a main heat source (such as a high-power cpu chip, a graphic chip, an AI chip, an IGBT chip, etc.), the second heat source 13 is a secondary heat source (such as a passive component, a memory) with lower power, and the temperature of the secondary heat source is lower due to consideration of actual heat generation, so the first input port 222 of the integrated three-dimensional vapor chamber and liquid cooling heat dissipation electronic component 1 of the present utility model is disposed near the second region B of the second heat source 13, so as to prevent that when the first input port 222 is disposed near the first region a, when the temperature of the heat carried away by the cooling liquid 23 in the first region a is far higher than that of the second heat source 13, the second region cannot effectively dissipate heat, and the temperature of the second heat source 13 is more likely to be raised, so that the second heat source 13 burns down.
Since fig. 1 does not clearly show the heat dissipation fins 241 in the electronic component 1 integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation of the present utility model, the following detailed description is given with reference to fig. 2A and 2B. Referring to fig. 1, 2A and 2B together, fig. 2A is a top view of the heat sink fin shown in fig. 1. Fig. 2B is a side view of the heat sink fin shown in fig. 1. As shown in fig. 2A, the direction of laying the heat dissipation fins 241 is parallel to the flow direction of the cooling liquid 23, so that the cooling liquid 23 can have more contact with the surface area of the heat dissipation fins 241 when flowing in, and the heat energy on the heat dissipation fins 241 can be more effectively taken away. It should be noted that, as shown in fig. 2B, the heat dissipation fins 241 are 8 pieces and made of copper, but in practice, the thickness, the spacing, the number of pieces, the length and the material of the heat dissipation fins 241 are not limited thereto.
Referring to fig. 3, fig. 3 is a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and liquid-cooled heat dissipation according to another embodiment of the utility model. As shown in fig. 3, in the electronic component 2 integrating a three-dimensional vapor chamber and liquid cooling heat dissipation according to another embodiment of the utility model, the half-open housing includes a first half-open housing 224 and a second half-open housing 225, the first half-open housing 224 is disposed on a first area a of the lower cover 212 to form a first liquid cooling chamber 2241 for accommodating the upper cover 211, and the second half-open housing 225 is disposed on a second area B of the lower cover 212 to form a second liquid cooling chamber 2251 for accommodating a second upper surface 2123 of the second area B. The first half-open housing 224 has a second input port 2242 and a second output port 2243 for inputting and outputting the cooling liquid 23 into and out of the first liquid cooling chamber 2241, and the second half-open housing 225 has a third input port 2252 and a third output port 2253 for inputting and outputting the cooling liquid 23 into and out of the second liquid cooling chamber 2251, respectively, and a communication pipe 2254 is provided between the second input port 2242 and the third output port 2253. In practice, the first half open housing 224 and the second half open housing 225 may be formed into the shape of the half open housing by CNC machining or casting, but the method is not limited thereto. In addition, the height of the heat dissipation fins 241 can be adjusted according to practical requirements.
The electronic component integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation of the utility model further comprises a temperature equalizing plate, wherein the temperature equalizing plate Wen Banxing is formed in the second area of the lower cover and can also be used for contacting the second heat source. The method for setting the temperature equalization plate will be further described below.
Referring to fig. 4 and 5, fig. 4 is a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and liquid cooling according to another embodiment of the utility model. Fig. 5 is an enlarged view of a portion of the second region according to fig. 4. As shown in fig. 4, the temperature equalizing plate of the electronic component 3 with integrated three-dimensional vapor chamber and liquid cooling heat dissipation according to the present utility model includes a flat plate 302, and the flat plate 302 is opposite to the second area B' of the lower cover 212. As shown in fig. 5, the second region B 'has a lower cap cavity 214, and when the flat plate 302 is joined to the second region B' of the lower cap 212, the lower cap cavity 214 forms a second closed air chamber 215. In addition, referring further to fig. 5, the plate 302 has a second outer surface 3021, the second region B' of the lower cover 212 has a third outer surface 2124 and a first groove 2125, the first groove 2125 is disposed on the third outer surface 2124 and communicates with the lower cover cavity 214 for accommodating the plate 302, and the second outer surface 3021 of the plate 302 is for contacting the second heat source 13. It is noted that in this embodiment, the second outer surface 3021 of the plate 302 is coplanar with the lower surface 2129 of the lower cover 212.
Referring to fig. 6 and 7, fig. 6 is a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and liquid cooling according to another embodiment of the utility model. Fig. 7 is an enlarged view of a portion of the second region according to fig. 6. As shown in fig. 6 and 7, the second region B' of the lower cover 212 has a fourth upper outer surface 2126, a fourth lower outer surface 2127, and a second recess 2128, the second recess 2128 being disposed on the fourth upper outer surface 2126 and communicating with the lower cover cavity 214 for receiving the flat plate 302. When the plate 302 is joined to the second region B ', the lower cover cavity 214 forms a second closed air cavity 215, and the fourth lower outer surface 2127 of the second region B' is configured to contact the second heat source 13.
Referring to fig. 8, fig. 8 is a cross-sectional view of an electronic assembly integrating a three-dimensional vapor chamber and liquid-cooled heat dissipation according to another embodiment of the utility model. As shown in fig. 8, the second region B' of the electronic component 5 integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation according to the present utility model includes the flat plate 302, and the bottom surface groove 216 of the bottom cover 212 can be machined for the number and the height of the second heat sources 13 through CNC, so that the second heat sources 13 with different heights can be adhered to the bottom surface groove 216 of the bottom cover 212, and heat conduction can be performed efficiently.
In summary, the electronic component with integrated three-dimensional vapor chamber and liquid cooling heat dissipation according to the present utility model can be cross-combined to change the semi-open housing according to different requirements, for example, the electronic components 3, 4, 5 with integrated three-dimensional vapor chamber and liquid cooling heat dissipation according to the embodiment of the present utility model can use the first semi-open housing 224 and the second semi-open housing 225, and the first semi-open housing 224 and the second semi-open housing 225 are connected to the lower cover to form the liquid cooling cavity. The processing method of the first half open housing 224 and the second half open housing 225 is substantially the same as that of the corresponding units of the foregoing embodiments, and thus will not be repeated here. In addition, the heat dissipation fins 240 in the present utility model are all shown as 3 sheets, but not limited thereto, and may be adjusted according to the respective requirements.
Referring to fig. 9, fig. 9 is an enlarged view of a portion of the three-dimensional vapor chamber element shown in fig. 1. As shown in fig. 9, the upper cover 211 comprises a base plate 2110 and a tube 2120, the base plate 2110 has a base plate cavity 2111, an opening and an upper outer surface 2112, the tube 2120 has a tube cavity 2121, and the tube 2120 is disposed on the upper outer surface 2112 and protrudes outward from the upper outer surface. When the upper cover 211 is joined to the first region a of the lower cover 212, the tube cavity 2121 and the substrate cavity 2111 form a first closed air cavity 213. In practice, the tube 2120 may be formed integrally by continuously stamping and stretching the length of the upper cover 211 from a metal plate, and the shape of the tube 2120 may be, but is not limited to, a cylinder, a rectangular cylinder, an elliptic cylinder, and a conical body.
Referring to fig. 9, in the three-dimensional vapor chamber element 21 of the present utility model, the tube 2120 further has a top end 2112, and the top end 2112 has a sprue sealing structure 2123, wherein the sprue sealing structure 2123 is formed by a sprue pre-arranged at the top end 2122, and sealing the sprue after injecting the working fluid into the closed air chamber through the sprue. In practical applications, the liquid injection port may be sealed by welding or the like. In addition, in the present embodiment, the nozzle sealing structure 2123 and the liquid nozzle of the three-dimensional vapor chamber element 21 are both located at the top end 2112 of the tube 2120, but the application is not limited thereto, and the nozzle sealing structure 2123 and the liquid nozzle may be disposed at any position on the tube 312.
The three-dimensional vapor chamber element of the present utility model contains a working fluid (not shown) disposed in the first closed air chamber 213 and the second closed air chamber 215. In practice, the working fluid may be one of water, acetone, ammonia, methanol, tetrachloroethane, and hydrofluorocarbon chemical refrigerants.
In summary, the electronic component integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation provided by the utility model is formed by introducing the three-dimensional vapor chamber module into the liquid cooling heat dissipation to integrate the three-dimensional vapor chamber module on the electronic component. Compared with the prior art, the utility model can more effectively take away the heat energy on the heat source through the cooling liquid input into the liquid cooling heat dissipation module. In addition, the three-dimensional vapor cavity element in the liquid cooling heat dissipation module further comprises a first area and a second area, wherein the first area is used for conducting heat dissipation of a first heat source (a main heat source), and the second area is also used for conducting heat dissipation of a second heat source (a secondary heat source) at the same time, so that a plurality of heat dissipation devices with different heat dissipation efficiencies are not required to be arranged respectively for conducting heat dissipation of the first heat source (the main heat source) and the second heat source (the secondary heat source). Compared with the prior art, the utility model provides the electronic component integrating the three-dimensional vapor chamber and the liquid cooling heat dissipation, which has the advantages of lower setting cost, simple installation, shorter installation time and improved heat dissipation efficiency.
From the foregoing detailed description of the preferred embodiments, it is intended to more clearly describe the nature and spirit of the utility model, but not to limit the scope of the utility model by the above disclosed preferred embodiments. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the utility model as defined by the appended claims. The scope of the utility model as claimed should therefore be accorded the broadest interpretation based upon the foregoing description so as to encompass all such modifications and equivalent arrangements.
Claims (10)
1. An electronic component integrating a three-dimensional vapor chamber and liquid cooling heat dissipation is characterized by comprising:
a circuit board provided with a first heat source and a second heat source; and
the liquid cooling heat radiation module is arranged on the circuit board and comprises:
a three-dimensional vapor chamber element comprising an upper cover and a lower cover, wherein the lower cover has a first area and a second area relative to the upper cover, the first area has a first lower surface, the second area has a second lower surface and a second upper surface, and after the upper cover is jointed with the first area of the lower cover, a first airtight air chamber is formed, the first lower surface of the first area contacts the first heat source, and the second lower surface of the second area contacts the second heat source;
a half open shell connected to the lower cover and forming a liquid cooling cavity for accommodating the upper cover and the second upper surface of the second region; and
a cooling liquid is arranged in the liquid cooling cavity.
2. The electronic assembly of claim 1, further comprising a temperature equalization plate formed in the second region of the lower cover and having a temperature equalization plate lower surface contacting the second heat source.
3. The electronic assembly of claim 1, wherein the semi-open housing has a first input port and a first output port for inputting and outputting the cooling fluid to and from the liquid cooling chamber, respectively.
4. The electronic assembly of claim 1, wherein the semi-open housing comprises a first semi-open housing and a second semi-open housing, the first semi-open housing is disposed on the first region of the lower cover to form a first liquid-cooled cavity for accommodating the upper cover, and the second semi-open housing is disposed on the second region of the lower cover to form a second liquid-cooled cavity for accommodating the second upper surface of the second region.
5. The electronic module of claim 4, wherein the first half-open housing has a second input port and a second output port for respectively inputting and outputting the cooling fluid to and from the first liquid cooling cavity, the second half-open housing has a third input port and a third output port for respectively inputting and outputting the cooling fluid to and from the second liquid cooling cavity, and a communication pipe is disposed between the second input port and the third output port.
6. The electronic assembly of claim 1, wherein the upper cover comprises a substrate and a tube, the substrate having a substrate cavity, an opening, and an upper outer surface, the tube having a tube cavity, the tube being disposed on the upper outer surface and over the opening and protruding outward from the upper outer surface such that the tube cavity and the substrate cavity form the first closed air cavity when the upper cover is coupled to the first region of the lower cover.
7. The electronic assembly of claim 2, wherein the cold plate comprises a plate opposite a second region of the lower cover, the second region having a lower cover cavity such that the lower cover cavity forms a second closed air cavity when the plate is coupled to the second region of the lower cover.
8. The electronic assembly of claim 7, wherein the plate has a second outer surface, the second region of the lower cover has a third outer surface and a first recess disposed on the third outer surface and in communication with the lower cover cavity for receiving the plate, and the second outer surface of the plate contacts the second heat source.
9. The electronic assembly of claim 7, wherein the second region of the lower cover has a fourth upper outer surface, a fourth lower outer surface, and a second recess disposed on the fourth upper outer surface and in communication with the lower cover cavity for receiving the flat plate, and the fourth lower outer surface of the second region contacts the second heat source.
10. The electronic module of claim 6, wherein the tube further comprises a top end having a nozzle sealing structure formed by a liquid nozzle pre-arranged on the top end and sealing the liquid nozzle after a working fluid is injected into the closed air cavity through the liquid nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024093695A1 (en) * | 2022-10-31 | 2024-05-10 | 广州力及热管理科技有限公司 | Liquid-cooling heat dissipation module embedded with three-dimensional vapor chamber element |
| WO2024099056A1 (en) * | 2022-11-08 | 2024-05-16 | 广州力及热管理科技有限公司 | Integrated circuit element having heat dissipation package |
| WO2024120038A1 (en) * | 2022-12-09 | 2024-06-13 | 广州力及热管理科技有限公司 | Three-dimensional vapor chamber element |
-
2023
- 2023-05-04 CN CN202321019993.8U patent/CN219677255U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024093695A1 (en) * | 2022-10-31 | 2024-05-10 | 广州力及热管理科技有限公司 | Liquid-cooling heat dissipation module embedded with three-dimensional vapor chamber element |
| WO2024099056A1 (en) * | 2022-11-08 | 2024-05-16 | 广州力及热管理科技有限公司 | Integrated circuit element having heat dissipation package |
| WO2024120038A1 (en) * | 2022-12-09 | 2024-06-13 | 广州力及热管理科技有限公司 | Three-dimensional vapor chamber element |
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