CN104701278A - Heat radiating mechanism of universal-type power module - Google Patents
Heat radiating mechanism of universal-type power module Download PDFInfo
- Publication number
- CN104701278A CN104701278A CN201310667286.4A CN201310667286A CN104701278A CN 104701278 A CN104701278 A CN 104701278A CN 201310667286 A CN201310667286 A CN 201310667286A CN 104701278 A CN104701278 A CN 104701278A
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- China
- Prior art keywords
- base
- heat sink
- power module
- sink body
- keyset
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat radiating mechanism of a universal-type power module. A heat radiating body comprises a base, a top plate and a sealing plate fixed on the inner side between the base and the top plate, the base, the top plate and the sealing plate form a cooling space, at least two partitions are fixed among the base, the top plate and the sealing plate and divide the cooling space into more than two independent cooling cavities, a lower pipe joint communicated with the respective cooling cavity is arranged on the lower portion of the base, an upper pipe joint communicated with the respective cooling cavity is arranged on the upper portion of the top plate, the front portion of each cooling cavity is provided with a mounting face of the heat radiating body, a first power module or/and an adapter plate are hermetically mounted on respectively corresponding mounting faces, and a second power module is hermetically mounted on the adapter plate. The heat radiating mechanism is reasonable and simple, high in universality, flexible and convenient to use, capable of realizing centralized mounting and heat radiating of various power modules, is stable in heat radiating effect and adaptable to development tendency of universalization, centralization and diversification of power modules.
Description
Technical field
The present invention relates to a kind of cooling mechanism of common type of power module, belong to power model technical field.
Background technology
Semi-conductor power module mainly comprises copper base, covers cermet substrate, semiconductor chip and electrode terminal and housing.At semi-conductor power module in the course of the work, the heat that semiconductor chip produces is by copper base and be passed on the radiator of its underpart, is shed by the heat in semiconductor chip.But along with the development of technology, the power of power device is more and more higher, the power consumption of semiconductor chip is also increasing gradually, and often the heat that produces of semiconductor chip is also increasing, therefore needs to be shed by the heat of semiconductor chip in time.Current power model is very little at the installing space of postorder, in addition with the use of power module package diversification of forms and the use of most amount power model, all make the density of power model add whole gradually, this also proposes higher requirement to the external cooling condition of power model.
Conventional finned radiator is adopted at present for power model cooling mechanism is a kind of, radiator is connected to the bottom of copper base, the height of radiator is higher on the one hand, therefore the setting height(from bottom) of power device can be increased, make its volume larger, for the installing space that some are narrow and small, then can not be suitable for.Especially user needs the power model of multiple standard to combine in use, needs design large-size radiator to place multiple power model respectively, not only take up room large, and the radiator of this structure also limit the application of power model.The cooling mechanism of another structure is combined fan and radiator, but the cooling mechanism of this structure is also for independent power model, not only need to take larger space, nor power model generalization, centralization and diversified development trend can be adapted to.
Summary of the invention
The object of this invention is to provide a kind of rational in infrastructure, simple, versatility is good, uses flexibility convenient, eurypalynous power model can be installed concentratedly and dispel the heat, and the cooling mechanism of the stable common type of power module of radiating effect.
The present invention is the technical scheme achieved the above object: a kind of cooling mechanism of common type of power module, it is characterized in that: comprise a heat sink body, described heat sink body comprises base, top board and to be fixed between base and top board and the shrouding being positioned at middle part forms a cooling space, at least two dividing plates are fixed on base, between top board and shrouding, cooling space is separated into two or more independently cooling chamber, base bottom is provided with the lower pipe connection communicated with respective cooling chamber, top board top is provided with the upper pipe joint communicated with respective cooling chamber, the front portion of each cooling chamber has the installed surface of heat sink body, first power model is or/and keyset sealing is arranged on each self-corresponding installed surface, second power model sealing is arranged on keyset.
Heat sink body of the present invention is provided with two or more independently cooling chamber, the each cooling chamber of heat sink body forms an installed surface, therefore the installed surface of two or more solid can be formed on heat sink body, first power model or/keyset are arranged on respective installed surface, and the second power model is arranged on heat sink body by keyset again, therefore can the multiclass power model of different model and size be installed concentratedly on heat sink body, by upper, the coolant of outside passes in each cooling chamber by lower pipe connection, the heat produced at work to the hot block of each power mould is forced to carry out forced heat radiation by coolant, rational in infrastructure, simply, the present invention can not only increase the area of dissipation of power model, improve radiating effect, and radiating effect is stablized.Heat sink body is designed with multiple installed surface by the present invention, the multiclass power model that energy installation dimension is identical or size is not identical on a heat sink body, can multiclass power model solid be arranged on heat sink body, there is good versatility, significantly can save installing space, too increase the quantity of power model combination and the flexibility of combination, user friendly postorder is installed, and can adapt to power model generalization, centralization and diversified development trend.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiments of the invention are described in further detail.
Fig. 1 is the structural representation of the cooling mechanism of common type of power module of the present invention.
Fig. 2 is that the A of Fig. 1 is to structural representation.
Fig. 3 is the structural representation that the cooling mechanism of common type of power module of the present invention opens the first cover plate.
Fig. 4 is the structural representation that the cooling mechanism of common type of power module of the present invention removes the second cover plate and both sides and the first cover plate.
Wherein: the 1-the first power model, 2-heat sink body, 2-1-upper pipe joint, 2-2-upper connecting base, 2-3-top board, 2-4-shrouding, 2-5-leg, 2-6-stream plate, 2-7-dividing plate, 2-8-base, 2-9-front seal groove, 2-10-lower pipe connection, 2-11-installed surface, 2-12-lower connecting base, 3-securing member, the 4-the first cover plate, 5-keyset, 5-1-switching Connection Block, the 6-the second power model, 7-the second cover plate, the 8-the first sealing ring, the 9-the second sealing ring.
Embodiment
See shown in Fig. 1 ~ 4, the cooling mechanism of common type of power module of the present invention, comprise a heat sink body 2.Heat sink body 2 of the present invention comprises base 2-8, top board 2-3 and to be fixed between base 2-8 and top board 2-3 and the shrouding being positioned at middle part forms a cooling space, at least two dividing plate 2-7 are fixed on base 2-8, between top board 2-3 and shrouding 2-4, cooling space is separated into two or more independently cooling chamber, therefore the cooling unit of multiple solid can be formed on a heat sink body 2.Base 2-8 of the present invention, top board 2-3 and shrouding and dividing plate 2-7 can integral manufacturings, or base 2-8, top board 2-3 and shrouding 2-4 and dividing plate 2-7 partial installation, base 2-8 bottom is provided with at least three leg 2-5, and this leg 2-5 can be fixing leg, or is adjustable leg.Base 2-8 bottom of the present invention is provided with the lower pipe connection 2-10 communicated with respective cooling chamber, top board 2-3 top is provided with the upper pipe joint 2-1 communicated with respective cooling chamber, the each cooling unit of the present invention adopts upper water inlet and lower water outlet, and each upper pipe joint 2-1 of heat sink body 2 is connected with each self-corresponding electromagnetically operated valve respectively by pipeline; Each cooling unit of the present invention also can adopt lower water inlet and upper water-out, each lower pipe connection 2-10 of heat sink body 2 is connected with each self-corresponding electromagnetically operated valve respectively by pipeline, each cooling unit is made to have independently magnetic valve controlled feed, visual concrete cooling requirements, the quantity of the electromagnetically operated valve opened.
See shown in Fig. 1 ~ 4, the front portion of each cooling chamber of the present invention has the installed surface 2-11 of heat sink body 2, first power model 1 is or/and keyset 5 sealing is arranged on each self-corresponding installed surface 2-11, second power model 6 sealing is arranged on keyset 5, heat sink body 2 there is no installation first power model 1 or/and keyset 5 other installed surface 2-11 on, also be sealed and installed with the first cover plate 4, the overall appearance of cooling mechanism can be kept on the one hand, on the other hand, also can pass into coolant and indirectly to the first power model 1 or/and the second power model 6 be arranged on keyset 5 cools.Heat sink body 2 of the present invention is the prismatic of more than three limits, and prismatic middle part is through hole, heat sink body 2 is provided with 3 ~ 8 installed surface 2-11, see shown in Fig. 1,2, heat sink body 2 hexagon of the present invention, heat sink body 2 is provided with six installed surface 2-11, multiple power model can be installed concentratedly on this heat sink body 2 and to cool.
See shown in Fig. 2 ~ 4, the present invention be staggered on two dividing plate 2-7 of each cooling chamber be provided with more than three stream plate 2-6, cooling chamber is separated by and forms the flow channel for liquids of bending, by respectively streaming plate 2-6 to extend the time of coolant in each cooling chamber, fully can exchange the heat of power model, and improve radiating efficiency.
See shown in Fig. 1 ~ 3, base 2-8 bottom of the present invention is provided with the lower connecting base 2-12 corresponding with respective cooling chamber, top board 2-3 top is provided with the upper connecting base 2-2 corresponding with respective cooling chamber, seal groove 2-9 before the installed surface 2-11 of heat sink body 2 is provided with first, or first the back side of power model 1 be provided with rear seal groove, before first sealing ring 8 is arranged on first in seal groove 2-9 or rear seal groove, first power model 1 is arranged on upper connecting base 2-2 and lower connecting base 2-12 by securing member 3, the first power model 1 sealing is arranged on the installed surface 2-11 of heat sink body 2.
See 1, shown in 2 and 4, base 2-8 bottom of the present invention is provided with the lower connecting base 2-12 corresponding with respective cooling chamber, top board 2-3 top is provided with the upper connecting base 2-2 corresponding with respective cooling chamber, keyset 5 is provided with at least one window, keyset 5 is respectively equipped with switching Connection Block 5-1 in the both sides of window, seal groove 2-9 before the installed surface 2-11 of heat sink body 2 is provided with first, or the back side on keyset 5 is provided with rear seal groove, first sealing ring 8 is arranged in the first seal groove 2-8, and keyset 5 is arranged on upper connecting base 2-2 and lower connecting base 2-12 by securing member 3.See shown in Fig. 1,2, the keyset 5 of invention is provided with 2 ~ 3 windows, keyset 5 be positioned at window be also provided with second before seal groove, before second sealing ring 9 is arranged on second in seal groove, second power model 6 is or/and the second cover plate 7 is arranged on switching Connection Block 5-1 by securing member 3, convenient keyset 5 sealing is arranged on installed surface 2-11, simultaneously also by the second power model 6 or/and the second cover plate 7 sealing is arranged on keyset 5, different power models can be installed by keyset 5.As shown in Figure 1, keyset 5 of the present invention is provided with two windows, and two the second power model 6 sealings are arranged on keyset 5; Or as shown in Figure 2, two windows one installation second power model 6 on this keyset 5, the window not installing the second power model 6 then seals installation second cover plate 7, first power model 1 second power model 6 and the different multiclass power model of more size to be installed concentratedly on heat sink body 2 and are dispelled the heat by the present invention, mounting means is flexible, can meet the installation of the power model of multi items, be also postorder installation power module leaving space.
Claims (8)
1. the cooling mechanism of a common type of power module, it is characterized in that: comprise a heat sink body (2), described heat sink body (2) comprises base (2-8), top board (2-3) and to be fixed between base (2-8) and top board (2-3) and the shrouding (2-4) being positioned at middle part forms a cooling space, at least two dividing plates (2-7) are fixed on base (2-8), between top board (2-3) and shrouding (2-4), cooling space is separated into two or more independently cooling chamber, base (2-8) bottom is provided with the lower pipe connection (2-10) communicated with respective cooling chamber, top board (2-3) top is provided with the upper pipe joint (2-1) communicated with respective cooling chamber, the front portion of each cooling chamber has the installed surface (2-11) of heat sink body (2), first power model (1) is or/and keyset (5) sealing is arranged on each self-corresponding installed surface (2-11), second power model (6) sealing is arranged on keyset (5).
2. the cooling mechanism of common type of power module according to claim 1, it is characterized in that: described heat sink body (2) there is no installation first power model (1) or/and keyset (5) other installed surface (2-11) on, be also sealed and installed with the first cover plate (4).
3. the cooling mechanism of common type of power module according to claim 1, is characterized in that: two dividing plates (2-7) of described each cooling chamber are staggered be provided with more than three stream plate (2-6), cooling chamber is separated by and forms the flow channel for liquids of bending.
4. the cooling mechanism of common type of power module according to claim 1, it is characterized in that: described base (2-8) bottom is provided with the lower connecting base (2-12) corresponding with respective cooling chamber, top board (2-3) top is provided with the upper connecting base (2-2) corresponding with respective cooling chamber, the installed surface (2-11) of heat sink body (2) is provided with front seal groove, or first the back side of power model (1) be provided with rear seal groove, first sealing ring (8) is arranged in front seal groove (2-9) or rear seal groove, first power model (1) is arranged on upper connecting base (2-2) and lower connecting base (2-12) by securing member (3).
5. the cooling mechanism of common type of power module according to claim 1, it is characterized in that: described base (2-8) bottom is provided with the lower connecting base (2-12) corresponding with respective cooling chamber, top board (2-3) top is provided with the upper connecting base (2-2) corresponding with respective cooling chamber, described keyset (5) is provided with at least one window, keyset (5) is respectively equipped with switching Connection Block (5-1) in the both sides of window, the back side that the installed surface (2-11) of heat sink body (2) is provided with on front seal groove (2-9) or keyset (5) is provided with rear seal groove, first sealing ring (8) is arranged in front seal groove (2-9), keyset (5) is arranged on upper connecting base (2-2) and lower connecting base (2-12) by securing member (3).
6. the cooling mechanism of common type of power module according to claim 4, it is characterized in that: described keyset (5) be positioned at window place be also provided with second before seal groove, before second sealing ring (9) is arranged on second in seal groove, the second power model (6) is or/and the second cover plate (7) is arranged in switching Connection Block (5-1) by securing member (3).
7. the cooling mechanism of common type of power module according to claim 1, is characterized in that: prismatic in more than three limits of described heat sink body (2), and prismatic middle part is through hole, and heat sink body (2) is provided with 3 ~ 8 installed surfaces (2-11).
8. the cooling mechanism of common type of power module according to claim 1, is characterized in that: each lower pipe connection (2-10) or each upper pipe joint (2-1) of described heat sink body (2) are connected with each self-corresponding electromagnetically operated valve respectively by pipeline.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310667286.4A CN104701278B (en) | 2013-12-10 | 2013-12-10 | The cooling mechanism of common type of power module |
| PCT/CN2014/074264 WO2015085682A1 (en) | 2013-12-10 | 2014-03-28 | Heat dissipation mechanism for general power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310667286.4A CN104701278B (en) | 2013-12-10 | 2013-12-10 | The cooling mechanism of common type of power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104701278A true CN104701278A (en) | 2015-06-10 |
| CN104701278B CN104701278B (en) | 2017-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310667286.4A Active CN104701278B (en) | 2013-12-10 | 2013-12-10 | The cooling mechanism of common type of power module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104701278B (en) |
| WO (1) | WO2015085682A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994717A (en) * | 2015-08-08 | 2015-10-21 | 衢州昀睿工业设计有限公司 | Heat radiation device of power switch tube |
| CN106229862A (en) * | 2016-08-12 | 2016-12-14 | 南京亚派科技股份有限公司 | The installation method of power model heat dissipation wind channel in a kind of outdoor rack |
| CN107787160A (en) * | 2016-08-30 | 2018-03-09 | 中车株洲电力机车研究所有限公司 | A kind of electric machine controller water-cooling radiating structure |
| US20220142016A1 (en) * | 2019-03-04 | 2022-05-05 | Audi Ag | Direct cooling of a power converter by using a stamped plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3113440B1 (en) * | 2020-08-14 | 2022-12-30 | Valeo Siemens eAutomotive France | ELECTRICAL DEVICE WITH WATER BOX COOLING AND ELECTRICAL SYSTEM COMPRISING SUCH DEVICE |
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| US20070227697A1 (en) * | 2006-03-30 | 2007-10-04 | Dowa Metaltech Co., Ltd. | Heat radiator |
| CN101363600A (en) * | 2007-08-10 | 2009-02-11 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN201773834U (en) * | 2010-08-05 | 2011-03-23 | 中山大洋电机制造有限公司 | Cooling mechanism of integrated power module |
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN203607388U (en) * | 2013-12-10 | 2014-05-21 | 江苏宏微科技股份有限公司 | Heat radiation mechanism of power modules |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101367021B1 (en) * | 2012-05-23 | 2014-02-24 | 삼성전기주식회사 | Heat dissipation system for power module |
| CN203104252U (en) * | 2013-01-23 | 2013-07-31 | 深圳市汇川技术股份有限公司 | Novel heat radiation structure |
-
2013
- 2013-12-10 CN CN201310667286.4A patent/CN104701278B/en active Active
-
2014
- 2014-03-28 WO PCT/CN2014/074264 patent/WO2015085682A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070227697A1 (en) * | 2006-03-30 | 2007-10-04 | Dowa Metaltech Co., Ltd. | Heat radiator |
| CN101363600A (en) * | 2007-08-10 | 2009-02-11 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN201773834U (en) * | 2010-08-05 | 2011-03-23 | 中山大洋电机制造有限公司 | Cooling mechanism of integrated power module |
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN203607388U (en) * | 2013-12-10 | 2014-05-21 | 江苏宏微科技股份有限公司 | Heat radiation mechanism of power modules |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994717A (en) * | 2015-08-08 | 2015-10-21 | 衢州昀睿工业设计有限公司 | Heat radiation device of power switch tube |
| CN106229862A (en) * | 2016-08-12 | 2016-12-14 | 南京亚派科技股份有限公司 | The installation method of power model heat dissipation wind channel in a kind of outdoor rack |
| CN107787160A (en) * | 2016-08-30 | 2018-03-09 | 中车株洲电力机车研究所有限公司 | A kind of electric machine controller water-cooling radiating structure |
| CN107787160B (en) * | 2016-08-30 | 2020-01-03 | 中车株洲电力机车研究所有限公司 | Water-cooling heat dissipation structure of motor controller |
| US20220142016A1 (en) * | 2019-03-04 | 2022-05-05 | Audi Ag | Direct cooling of a power converter by using a stamped plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104701278B (en) | 2017-12-05 |
| WO2015085682A1 (en) | 2015-06-18 |
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