CN201332092Y - IGBT module open type water-filled radiator - Google Patents
IGBT module open type water-filled radiator Download PDFInfo
- Publication number
- CN201332092Y CN201332092Y CNU2008202285227U CN200820228522U CN201332092Y CN 201332092 Y CN201332092 Y CN 201332092Y CN U2008202285227 U CNU2008202285227 U CN U2008202285227U CN 200820228522 U CN200820228522 U CN 200820228522U CN 201332092 Y CN201332092 Y CN 201332092Y
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- China
- Prior art keywords
- water
- igbt module
- open type
- filled
- pipe joint
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Abstract
The utility model discloses an IGBT module open type water-filled radiator which comprises a water-filled radiating element, a water inlet pipe joint and a water outlet pipe joint, wherein the water-filled radiating element is in an open type flat plate structure; a bypass water flow groove is arranged on the open surface of the water-filled radiating element; the bottom of the water flow groove is provided with a water inlet and a water outlet; the water inlet pipe joint and the water outlet pipe joint are respectively arranged on the water inlet and the water outlet, and are both positioned outside the water-filled radiating element; and a groove used for installing a sealing ring is arranged on the opening surface of the water-filled radiating element and is positioned on the circumambience of the water flow groove. The utility model has the advantages of compact structure, high heat radiation efficiency and convenient production and overhaul, and the volume and the weight of the radiator are possibly reduced.
Description
Technical field
The utility model relates to a kind of water-filled radiator of high-power insulated gate bipolar transistor IGBT module, especially relates to a kind of IGBT module open type water-filled radiator.
Background technology
At present, generally use the insulated gate bipolar transistor IGBT module on the high-power converter, the same with other power electronic device, because switching loss and on-state loss are inevitable, the IGBT module in use can produce a large amount of heats, if untimelyly effectively these heats are shed, the temperature of IGBT module raises will influence the performance of power, overtemperature even can directly cause the thorough damage of IGBT module.
The traditional heat dissipating method of power electronic device generally there are multiple measures such as air-cooled, oil cooling and water-cooled.Shortcomings such as and that air-cooled and oil cooling exists radiating efficiency is low, and the radiator volume is big, and weight is big, wherein oil cooling also exists the leakage pollution problems.Present employing water-cooling pattern, its water cooler generally itself seals, and cooling water comes the cooling power electronic device by the cooling water cooler, and heat exchange efficiency is general, and volume and weight is still bigger, is unfavorable for installing and maintenance when being applied in many IGBT modules parallel connection occasions.
The utility model content
Technical problem to be solved in the utility model is at above-mentioned deficiency of the prior art, provide a kind of IGBT module open type water-filled radiator, its compact conformation, radiating efficiency height, reduced the volume and weight of radiator as much as possible, and be convenient to produce and maintenance.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: water-cooling spare, admitting pipe joint and titting water outlet, it is characterized in that: described water-cooling spare is the open type slab construction, and its open surface is provided with winding type current groove, the bottom of described current groove has water inlet and delivery port, and described admitting pipe joint and titting water outlet are installed on described water inlet and the delivery port respectively and all are positioned at the outside of water-cooling spare; On the open surface of water-cooling spare, and be positioned at the current groove around be provided with the groove that is used to install sealing ring.
Described water inlet and delivery port lay respectively at the two ends of current groove.
Described water-cooling spare is provided with the temperature element installing hole.
Described water-cooling spare is provided with the threaded mounting hole that is used for fixing the IGBT module.
The utility model compared with prior art has the following advantages: because water-cooling spare is taked the open type slab construction, IGBT module heat dissipating face directly contacts with cooling water, so heat exchange more directly fully, the radiating efficiency height, reduced the volume and weight of radiator as much as possible, and be convenient to produce and maintenance.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Fig. 1 is the assembly figure of the utility model water-cooling spare and IGBT module.
Fig. 2 is the structural representation of the utility model water-cooling spare 2.
Fig. 3 is an A-A cutaway view of the present utility model.
Description of reference numerals:
The 1-IGBT module; 2-water-cooling spare; The 3-threaded mounting hole;
The 4-groove; 5-current groove; 6-temperature element installing hole;
The 7-titting water outlet; 8-admitting pipe joint 8.
Embodiment
As Fig. 1, Fig. 2 and shown in Figure 3, the utility model comprises water-cooling spare 2, admitting pipe joint 8 and titting water outlet 7, described water-cooling spare 2 is the open type slab construction, and its open surface is provided with winding type current groove 5, the bottom of current groove 5 has water inlet and delivery port, and admitting pipe joint 8 and titting water outlet 7 are installed on described water inlet and the delivery port respectively and all are positioned at the outside of water-cooling spare 2.The utility model in use, IGBT module 1 is installed on the open surface of water-cooling spare 2, be connected water inlet pipe and outlet pipe respectively on admitting pipe joint 8 and the titting water outlet 7, like this, cooling water is from flow through current groove 5 and discharge from titting water outlet 7 of admitting pipe joint 8, wherein, in current groove 5, cooling water directly contacts the radiating surface of IGBT module 1, and makes 1 cooling of IGBT module, good heat dissipation effect by heat exchange.On the open surface of water-cooling spare 2, and be positioned at current groove 5 around be provided with the groove 4 that is used to install sealing ring, the high strength sealing ring when being installed, IGBT module 1 is set on groove 4, pass through the tight pressing of high strength sealing ring like this between the open surface of the radiating surface of IGBT module 1 and water-cooling spare 2, the high strength sealing ring seals the cooling water of current groove 5 inside, and cooling water is not leaked in circulation.
In the present embodiment, heat exchange is abundant, heat conduction efficiency is high in order to make, and water inlet and delivery port lay respectively at the two ends of current groove 5.One end of water-cooling spare 2 is provided with temperature element installing hole 6, in the course of work of the present utility model, by temperature element installing hole 6 temperature element is installed, so that at work cooling water temperature is monitored.Water-cooling spare 2 is provided with threaded mounting hole 3, and the screw on the threaded mounting hole 3 that IGBT module 1 is passed through is on water-cooling spare 2.
The utility model is applicable to the electronic power convertor that uses the IGBT module, especially the application in the high-power converter that volume and weight is required harsh a plurality of IGBT module parallel connection.
The above; it only is preferred embodiment of the present utility model; be not that the utility model is imposed any restrictions; every according to the utility model technical spirit to any simple modification, change and equivalent structure transformation that above embodiment did, all still belong in the protection range of technical solutions of the utility model.
Claims (4)
1. IGBT module open type water-filled radiator, comprise water-cooling spare (2), admitting pipe joint (8) and titting water outlet (7), it is characterized in that: described water-cooling spare (2) is the open type slab construction, and its open surface is provided with winding type current groove (5), the bottom of described current groove (5) has water inlet and delivery port, and described admitting pipe joint (8) and titting water outlet (7) are installed on described water inlet and the delivery port respectively and all are positioned at the outside of water-cooling spare (2); On the open surface of water-cooling spare (2), and be positioned at current groove (5) around be provided with the groove (4) that is used to install sealing ring.
2. according to the described IGBT module of claim 1 open type water-filled radiator, it is characterized in that: described water inlet and delivery port lay respectively at the two ends of current groove (5).
3. according to claim 1 or 2 described IGBT module open type water-filled radiators, it is characterized in that: described water-cooling spare (2) is provided with temperature element installing hole (6).
4. according to claim 1 or 2 described IGBT module open type water-filled radiators, it is characterized in that: described water-cooling spare (2) is provided with the threaded mounting hole (3) that is used for fixing IGBT module (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202285227U CN201332092Y (en) | 2008-12-29 | 2008-12-29 | IGBT module open type water-filled radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202285227U CN201332092Y (en) | 2008-12-29 | 2008-12-29 | IGBT module open type water-filled radiator |
Publications (1)
Publication Number | Publication Date |
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CN201332092Y true CN201332092Y (en) | 2009-10-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU2008202285227U Expired - Fee Related CN201332092Y (en) | 2008-12-29 | 2008-12-29 | IGBT module open type water-filled radiator |
Country Status (1)
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CN (1) | CN201332092Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102802384A (en) * | 2012-08-30 | 2012-11-28 | 中国北车集团大连机车研究所有限公司 | IGBT (Insulated Gate Bipolar Transistor) water cooling radiator |
CN103001456A (en) * | 2011-09-16 | 2013-03-27 | 富士电机株式会社 | Power conversion device |
CN106373929A (en) * | 2016-10-18 | 2017-02-01 | 池州脉纬散热器有限责任公司 | Copper pipe embedded water-cooled heat sink |
CN109461708A (en) * | 2018-09-28 | 2019-03-12 | 蔚来汽车有限公司 | Water cooled bottom plate for power device |
-
2008
- 2008-12-29 CN CNU2008202285227U patent/CN201332092Y/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103001456A (en) * | 2011-09-16 | 2013-03-27 | 富士电机株式会社 | Power conversion device |
CN103001456B (en) * | 2011-09-16 | 2015-12-16 | 富士电机株式会社 | Power inverter |
CN102802384A (en) * | 2012-08-30 | 2012-11-28 | 中国北车集团大连机车研究所有限公司 | IGBT (Insulated Gate Bipolar Transistor) water cooling radiator |
WO2014032365A1 (en) * | 2012-08-30 | 2014-03-06 | 中国北车集团大连机车研究所有限公司 | Igbt water cooling radiator |
CN106373929A (en) * | 2016-10-18 | 2017-02-01 | 池州脉纬散热器有限责任公司 | Copper pipe embedded water-cooled heat sink |
CN109461708A (en) * | 2018-09-28 | 2019-03-12 | 蔚来汽车有限公司 | Water cooled bottom plate for power device |
CN109461708B (en) * | 2018-09-28 | 2024-04-12 | 蔚来(安徽)控股有限公司 | Water-cooled bottom plate for power device |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 Termination date: 20121229 |