CN201368617Y - Thermal electrical refrigerator and heat dissipation device thereof - Google Patents
Thermal electrical refrigerator and heat dissipation device thereof Download PDFInfo
- Publication number
- CN201368617Y CN201368617Y CNU2009200674206U CN200920067420U CN201368617Y CN 201368617 Y CN201368617 Y CN 201368617Y CN U2009200674206 U CNU2009200674206 U CN U2009200674206U CN 200920067420 U CN200920067420 U CN 200920067420U CN 201368617 Y CN201368617 Y CN 201368617Y
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- heat abstractor
- semiconductor cooler
- radiator
- heat
- boss
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Abstract
The utility model discloses a heat dissipation device of a thermal electrical refrigerator, which comprises a liquid inlet, a liquid outlet, a heat dissipation body and a seal plate. The heat dissipation body and the seal plate form an inner chamber capable of holding liquid cooling medium; at least two lug bosses are formed at the top of the heat dissipation body; and the liquid inlet and the liquid outlet are formed on the end surface of one side of the heat dissipation body. The utility model also discloses a thermal electrical refrigerator which comprises a refrigeration cavity and the heat dissipation device. The heat dissipation device of the utility model has the advantages of simple structure, good pressure resistant and leak tightness, easy assembly and high production efficiency.
Description
Technical field
The utility model belongs to a kind of semiconductor cooler and heat abstractor thereof, is specifically related to a kind of high power semi-conductor refrigerator and heat abstractor thereof.
Background technology
In the heat abstractor of the high power semi-conductor refrigerator of conventional semiconductor manufacturing equipment, have and adopt seal chamber to carry out cooling water circulation heat radiation.See also Chinese patent application CN200620046327.3, above-mentioned patent disclosure a kind of semiconductor cooler, for projection lens of lithography machine recirculated water cooling provides refrigeration work consumption more than 2000 watts.The heat abstractor of the semiconductor chilling plate that described semiconductor cooler adopts forms cavity by assemblies such as heat radiation water cavity, heat sink and sealing rings, dispels the heat by the heat that the cooling piece hot junction is produced that flows of recirculated cooling water at inner chamber.The heat sink of this heat abstractor is provided with in the cooling piece hot junction of correspondence one side and is the boss that four lines two row are arranged, and the opposite side correspondence of heat sink is provided with four groups of radiating fins of four lines.One side of heat radiation water cavity is provided with the tank at four intervals, corresponding respectively radiating fin of accommodating on the heat sink.Be provided with sealing ring in case leak-stopping water at the tank outward flange, and the end face of radiator is provided with a water of radiation import and water of radiation outlet, and water of radiation enters the heat radiation water cavity by import, the tank of flowing through, draw the heat of radiating fin conduction, and the water that will draw heat is discharged by outlet.This heat abstractor heat exchange is direct, can directly the heat in cooling piece hot junction be sent rapidly to dispel the heat, and refrigerating capacity is big, good heat dissipation effect.
This heat abstractor part that still comes with some shortcomings: sealing structure is poor, and under the big operating pressure operating mode in inside (5～6Bar), leak easily, thereby damage semiconductor chilling plate; Cooling piece contacts with cooling fluid for a long time, and cooling medium can infiltrate in the cooling piece, causes short circuit and burns semiconductor chilling plate; Be the high heat-transfer performance of the hot junction veneer that guarantees cooling piece, the requirement on machining accuracy height of heat sink boss surface, thereby the processing technology with sheet-type heat sink of complicated fin requires high, production efficiency is low, the cost height.
The utility model content
In view of this, the purpose of this utility model is to provide a kind of heat abstractor of semiconductor cooler, and described construction for heat radiating device is simple, pressure-resistant stopping property is good, be easy to assembling and production efficiency height.
The technical solution of the utility model is as follows:
A kind of heat abstractor of semiconductor cooler, comprise an inlet and a liquid outlet, also comprise a radiator and a sealing plate, but described radiator and sealing plate constitute the inner chamber of receiving fluids cooling medium, the top of radiator is provided with at least two boss, described inlet and liquid outlet are located at a side end face of radiator, cooling medium enters described radiator by described inlet, through described inner chamber, draw the heat of hot junction face of the semiconductor chilling plate of described lands conduct, and heat is discharged from described liquid outlet by cooling medium.
Further, the bottom of described radiator has groove, and described inner chamber is positioned at the bottom surface of groove.
Further, described sealing plate and radiator pass through welding or bonding connection at described groove.
Further, described groove is a trapezoidal groove, and the cross section is a rectangle.
Further, described boss is to be symmetrically distributed.
Further, the cross section of described boss is a rectangle.
Further, the distance of the end face of the end face of described boss and described inner chamber is 3～5mm.
Further, the trend of described inner chamber is a serpentine configuration, is uniformly distributed between the bottom surface and described sealing plate of described boss.
Further, the cross section of described inner chamber is the U type.
Further, also comprise trapezoidal hole, be located at the both sides of described boss symmetrically.
Further, the quantity of described trapezoidal hole is 12.
Further, the material of described sealing plate and radiator is hard aluminium or aluminium alloy.
Further, described cooling medium is water or acetone.
Further, the flow velocity of described cooling medium, pressure, temperature are adjustable.
Another purpose of the present utility model is to provide a kind of semiconductor cooler, comprises above-mentioned heat abstractor.
The technical solution of the utility model is as follows:
A kind of semiconductor cooler comprises the refrigeration cavity, also comprises described heat abstractor.
Further, described heat abstractor is connected by the bolt mode at the trapezoidal hole place with the refrigeration cavity.
The beneficial effect of heat abstractor of the present utility model is: 1) closed housing of heat radiation adopts welding or bonding mode, and frame for movement is further simplified; 2) resistance to pressure and the sealing of heat abstractor have greatly been improved; 3) place on the main body heat radiation water cavity with the boss that cooling piece hot junction face closely contacts, solved structural member machining deformation problem, also make the machining accuracy of boss surface be easy to be guaranteed simultaneously, thereby effectively improve the heat dispersion of cooling piece hot junction face.
Description of drawings
Fig. 1 is the structural representation of heat abstractor of the present utility model;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is a cavity inner chamber planar structure schematic diagram of the present utility model;
Fig. 4 is that the utility model is applied to the structural representation in the high power semi-conductor refrigerator.
The specific embodiment
As depicted in figs. 1 and 2, the heat abstractor 1 of high power semi-conductor refrigerator of the present utility model comprises a radiator 2 and a sealing plate 3.But described radiator 2 and sealing plate 3 constitute the inner chamber 6 of receiving fluids cooling medium.Radiator 2 and sealing plate 3 are made by the hard aluminium, and certainly, the utility model is not limited to this material, can be aluminium alloy, also can select other heat transfer property good and on-deformable metal or its alloy.One side end face of radiator 2 is provided with the inlet 4 and the liquid outlet 5 that can be connected with pipeline.
As shown in Figure 2, the bottom of radiator 2 has the trapezoidal groove 9 that the cross section is a rectangle, and inner chamber 6 is positioned at the bottom surface of groove 9, as the transport vehicle of cooling medium.Sealing plate 3 passes through welding or bonding connection with the groove 9 of radiator 2, forms sealing.This type of attachment has solved uses bolting and sealing ring sealing in the prior art, the problem that is easy to leak has greatly improved sealing property.Certainly, the utility model is not limited to the trapezoidal groove that the cross section is a rectangle.The purpose of recessing herein is: for sealing plate provides an interface that welds or bond, and sealing plate is embedded this groove.Therefore, groove shapes should be adjusted according to the geometry of sealing plate and the distribution of inner chamber 6.The top of radiator 2 is provided with the rectangular boss 8 of two symmetries, and the hot junction face that is used for semiconductor chilling plate closely contacts.The distance of the end face of the end face of described boss 8 and inner chamber 6 is 3～5mm.The set-up mode of boss 8 of the present utility model has been eliminated in the prior art boss has been placed on the thin plate, and processing is easy to the defective of buckling deformation, makes the high manufacturing accuracy on boss plane require to be easy to be guaranteed.The cross section of the boss 8 of this specific embodiment is a rectangle, contact with the hot junction face (also being rectangle) of semiconductor chilling plate, but the utility model is not limited to this, and the cross section of boss 8 can be arbitrary shape.Certainly, the end face of boss is necessary for the plane, closely contacts with the hot junction face of semiconductor chilling plate guaranteeing.In addition, the quantity of the boss 8 of this specific embodiment is not limited to two, can be for a plurality of, but a plurality of boss should symmetry distribute.Cooling medium enters radiator 2 by described inlet 4, through inner chamber 6, draws the heat of hot junction face of the semiconductor chilling plate of boss 8 conduction, and heat is discharged from liquid outlet 5 by cooling medium.
Fig. 3 is the planar structure schematic diagram of the inner chamber 6 of heat abstractor of the present utility model.Its trend is uniformly distributed between the bottom surface and sealing plate 3 of boss 8 for serpentine configuration, cooling medium is evenly flowed as far as possible, to improve heat dispersion in the bottom surface of boss 8.The cross section of described inner chamber 6 is U types.The boss bilateral symmetry at radiator 2 tops is provided with trapezoidal hole 7, is used for being connected with the external device (ED) (as the refrigeration cavity) of heat abstractor.In this specific embodiment, trapezoidal hole is 12, but the utility model is not limited to this, and the quantity of trapezoidal hole only need guarantee that heat abstractor and outside device firmly are connected reposefully and get final product.
Fig. 4 is applied to structural representation in the high power semi-conductor refrigerator for the utility model.The high power semi-conductor refrigerator comprises two heat abstractors 1 and a refrigeration cavity 11, and the semiconductor chilling plate 10 of multi-disc series connection places between heat abstractor 1 and the refrigeration cavity 11.Heat abstractor 1 is connected by the bolt mode at trapezoidal hole 7 places that opened with refrigeration cavity 11.During the work of high power semi-conductor refrigerator, the cooling medium supply system of heat abstractor 1 outside provides the circulating cooling medium of stable flow velocity, temperature range for heat abstractor 1, flow into the inner chamber 6 of heat abstractor 1 by inlet 4, draw the heat of the hot junction face conduction of semiconductor chilling plate 10 by boss 8, and from liquid outlet 5 outflows, thereby realize heat sinking function.In this cooling medium supply system, can adjust the duty parameter such as flow velocity, pressure, temperature of cooling medium as required, obtain needed radiating efficiency.The heat abstractor of high-power novel semi-conductor refrigerator of the present utility model adopts cooling water as cooling medium usually, but can change the cooling medium with more excellent heat exchange property according to the actual requirements, thereby makes heat abstractor possess higher heat dispersion.For example, cooling medium can be acetone etc.
Heat abstractor of the present utility model can be applicable in the temperature control unit of semiconductor manufacturing facility, as ultraprecise temperature control equipment of litho machine etc.
That more than introduces only is based on preferred embodiment of the present utility model, the heat abstractor of semiconductor cooler of the present utility model is not limited to the mode defined in the above-mentioned preferred embodiment, although the utility model is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement the utility model, and not breaking away from spirit and scope of the present utility model, it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (16)
1, a kind of heat abstractor of semiconductor cooler, comprise an inlet and a liquid outlet, it is characterized in that, also comprise a radiator and a sealing plate, but described radiator and sealing plate constitute the inner chamber of receiving fluids cooling medium, the top of radiator is provided with at least two boss, described inlet and liquid outlet are located at a side end face of radiator, cooling medium enters described radiator by described inlet, through described inner chamber, draw the heat of hot junction face of the semiconductor chilling plate of described lands conduct, and heat is discharged from described liquid outlet by cooling medium.
2, the heat abstractor of semiconductor cooler as claimed in claim 1 is characterized in that, the bottom of described radiator has groove, and described inner chamber is positioned at the bottom surface of groove.
3, the heat abstractor of semiconductor cooler as claimed in claim 2 is characterized in that, described sealing plate and radiator pass through welding or bonding connection at described groove.
As the heat abstractor of claim 2 or 3 described semiconductor coolers, it is characterized in that 4, described groove is a trapezoidal groove, the cross section is a rectangle.
5, the heat abstractor of semiconductor cooler as claimed in claim 1 is characterized in that, described boss is to be symmetrically distributed.
As the heat abstractor of claim 1 or 5 described semiconductor coolers, it is characterized in that 6, the cross section of described boss is a rectangle.
7, the heat abstractor of semiconductor cooler as claimed in claim 6 is characterized in that, the distance of the end face of described boss and the end face of described inner chamber is 3～5mm.
8, the heat abstractor of semiconductor cooler as claimed in claim 1 is characterized in that, the trend of described inner chamber is a serpentine configuration, is uniformly distributed between the bottom surface and described sealing plate of described boss.
9, the heat abstractor of semiconductor cooler as claimed in claim 8 is characterized in that, the cross section of described inner chamber is the U type.
10, the heat abstractor of semiconductor cooler as claimed in claim 1 is characterized in that, also comprises trapezoidal hole, is located at the both sides of described boss symmetrically.
11, the heat abstractor of semiconductor cooler as claimed in claim 10 is characterized in that, the quantity of described trapezoidal hole is 12.
12, the heat abstractor of semiconductor cooler as claimed in claim 1 is characterized in that, the material of described sealing plate and radiator is hard aluminium or aluminium alloy.
13, the heat abstractor of semiconductor cooler as claimed in claim 1 is characterized in that, described cooling medium is water or acetone.
14, the heat abstractor of semiconductor cooler as claimed in claim 13 is characterized in that, the flow velocity of described cooling medium, pressure, temperature are adjustable.
15, a kind of semiconductor cooler comprises the refrigeration cavity, it is characterized in that, also comprises heat abstractor as claimed in claim 1.
16, semiconductor cooler as claimed in claim 15 is characterized in that, described heat abstractor is connected by the bolt mode at the trapezoidal hole place with the refrigeration cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200674206U CN201368617Y (en) | 2009-01-23 | 2009-01-23 | Thermal electrical refrigerator and heat dissipation device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200674206U CN201368617Y (en) | 2009-01-23 | 2009-01-23 | Thermal electrical refrigerator and heat dissipation device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201368617Y true CN201368617Y (en) | 2009-12-23 |
Family
ID=41487509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009200674206U Expired - Lifetime CN201368617Y (en) | 2009-01-23 | 2009-01-23 | Thermal electrical refrigerator and heat dissipation device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201368617Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294078A (en) * | 2012-02-22 | 2013-09-11 | 上海微电子装备有限公司 | Modularized temperature control device |
| CN110254673A (en) * | 2019-06-24 | 2019-09-20 | 中国船舶科学研究中心（中国船舶重工集团公司第七0二研究所） | A kind of abyssopelagic organism side of a ship external heat preserving device |
| CN114670281A (en) * | 2022-03-24 | 2022-06-28 | 重庆三峡学院 | Workpiece cooling device for FRP (fiber reinforced plastic) processing |
-
2009
- 2009-01-23 CN CNU2009200674206U patent/CN201368617Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294078A (en) * | 2012-02-22 | 2013-09-11 | 上海微电子装备有限公司 | Modularized temperature control device |
| CN103294078B (en) * | 2012-02-22 | 2015-06-17 | 上海微电子装备有限公司 | Modularized temperature control device |
| CN110254673A (en) * | 2019-06-24 | 2019-09-20 | 中国船舶科学研究中心（中国船舶重工集团公司第七0二研究所） | A kind of abyssopelagic organism side of a ship external heat preserving device |
| CN114670281A (en) * | 2022-03-24 | 2022-06-28 | 重庆三峡学院 | Workpiece cooling device for FRP (fiber reinforced plastic) processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091223 |