CN103294078A - Modularized temperature control device - Google Patents
Modularized temperature control device Download PDFInfo
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- CN103294078A CN103294078A CN2012100414027A CN201210041402A CN103294078A CN 103294078 A CN103294078 A CN 103294078A CN 2012100414027 A CN2012100414027 A CN 2012100414027A CN 201210041402 A CN201210041402 A CN 201210041402A CN 103294078 A CN103294078 A CN 103294078A
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Abstract
The invention provides a modularized temperature control device which comprises a medium drive pump, a temperature control unit and a plurality of medium cooling modules which are connected with one another in sequence, wherein the medium drive pump is provided with an electric pump control unit. Each medium cooling module comprises a medium cooling substrate module upper board, a medium cooling substrate module lower board and fast connection joints, wherein the medium cooling substrate module upper board and the medium cooling substrate module lower board are connected with each other, and the fast connection joints are arranged on the side face of the medium cooling substrate module lower board. The medium cooling substrate module lower board is provided with a square double helix inner cavity, four fluid ports are formed in the periphery of the square double helix inner cavity, and the fluid ports are connected with the fast connection joints. According to the modularized temperature control device, the design idea is based on modularization, a heat exchange interface in a measurement system is designed to be a modularized medium cooling substrate, fast installation and configuration are facilitated, a structure style which meets the requirements of a work condition is combined by basic modules, the structure style meets the engineering requirements of multi-system cooling in a photoetching machine.
Description
Technical field
The present invention relates to SIC (semiconductor integrated circuit) and make the field, and be particularly related to a kind of modularization temperature control equipment that is applied to litho machine.
Background technology
Control to the temperature field is significant problem in the optical, mechanical and electronic integration equipment.Especially for the precision optical machinery device, reach nano level litho machine as accuracy requirement, just the temperature controlled importance of important spare part in entire equipment and the equipment is seemed especially outstanding.
In the inner world of litho machine, except main substrate and measurement support, also arranged to the most important thing is measuring system.These measuring equipments that are positioned at the inner world are referred to as measuring system in complete machine.Wherein, mainly carry the mask platform interferometer system at the measurement rack upper surface; Be furnished with projection objective and off-axis alignment system at the main substrate upper surface; Hang more measuring system in the main substrate bottom surface, comprising: leveling and focusing system, work stage interferometer system, null pick-up and chip transmission secondary prealignment CCD etc., as shown in Figure 1.These measuring systems all are the equipment of ray machine electricity one usually, become the main thermal source of litho machine inside, are the heat radiation and the thermostatically controlled problem that solve these measuring systems and support frame, and each litho machine manufacturer has proposed different solutions.
Prior art has proposed a kind of cooling scheme at lithographic equipment main substrate and projection objective.In this scheme, cooling line directly is configured in the main substrate structure channel, and chilled water is entered by an end, flows in pipeline behind the abundant absorption heat, flows out from an other end, forms a circulating cooling system like this.The main substrate material is selected Al-alloy products simultaneously, replaces the lower invar of thermal expansivity, reduces manufacturing cost significantly.Yet this mode adopts the whole cooling of main substrate, system complex, and cost is higher, and is in the widespread use of engineering field.
Prior art has also proposed a kind of temperature control scheme that the part of object lens supporting flexible piece is cooled off, it is a kind of water jacket circuit system, the chilled water stable by the pump actuation temperature circulates, chilled water is by the flexible pipe flexible block back-up block structure of flowing through, carry out heat interchange, constitute close loop control circuit by the temperature control unit adjusting again.Flexible block is the support projection objective system, is subjected to the off-design center that the variation of ambient temperature field and interference objective will trace, the cooling of flexible block is conducive to keep the stability of the vertical installation position of objective system.The local small size of sampling cools off, and system is simple, the structure dexterity, and cost is lower.
In addition, prior art also discloses a kind of attemperating unit of projection lens of lithography machine water jacket, and this kind device mainly is made up of projection objective temperature control unit, recirculated water control module, flow distributing and collecting plate, variable valve, water jacket, temperature sensor and water pipe.Wherein water jacket is to be made of double helix winding water jacket and cooling water recirculation system.Temperature control unit receives the temperature feedback signal by temperature sensor, advances the opening degree of handling definite each flow control valve in back, thereby reaches the purpose of closed-loop control projection objective temperature.Wherein, double helix winding water jacket has been realized the even cooling to three-dimensional object lens.
Prior art has also disclosed a kind of semiconductor cooler, and its type of cooling employing circulating fluid is flowed through and had the structure of snakelike inner chamber, reaches the purpose of cooling adjacent zeros parts, thereby avoids the power semiconductor thermal value excessive.Yet the runner that adopts the tendency of snakelike layout can cause the unevenness of cold-boundary temperature, and its inflow segment temperature is low, flows out section temperature height.
Summary of the invention
The present invention proposes a kind of modularization temperature control equipment, based on idea of modular, heat exchange interface in the measuring system is designed to modularization medium cooling base, be convenient to fast install and dispose, be assembled into by basic module and meet the required version of operating mode, be fit to the engineering demand of multisystem cooling in the litho machine.
In order to achieve the above object, the present invention proposes a kind of modularization temperature control equipment, comprises the media drive electric pump with electric pump control module, temperature control unit and a plurality of medium refrigerating module that connect successively, and described medium refrigerating module comprises:
Interconnective medium cooling base module upper plate and medium cooling base module lower plate;
Fast connecting joint is arranged at the side of described medium cooling base module lower plate,
Wherein, described medium cooling base module lower plate has cubic double helical form inner chamber, has four stream sockets around it and is used for connecting described fast connecting joint.
Further, described modularization temperature control equipment comprises that also manifold is connected in described a plurality of medium refrigerating module.
Further, described modularization temperature control equipment also comprises the obstruction head, is used for connecting the no stream socket of described refrigerating module.
Further, described fast connecting joint comprises the connection male and is connected female.
Further, described connection male be connected female and adopt plug-in type to connect, and have sealing function.
Further, described cubic double helical form inner chamber is arc transition in 90 degree corners.
Further, the number of turns of described cubic double helical form inner chamber is the even number circle, and MEDIA FLOW is gone into runner and medium flows out runner equal in length in unit area.
Further, described MEDIA FLOW is gone into runner and medium and is flowed out runner and replace overlapping and keeping parallelism, and its MEDIA FLOW is on the contrary.
Further, described medium is water.
Further, the connected mode of described a plurality of medium refrigerating modules is series, parallel or mixes connection.
The modularization temperature control equipment that the present invention proposes, it is as follows to play beneficial effect:
1) reduces thermal source to the thermal deformation that produces because of temperature variation that mounting bracket causes, adopt the mode to hot source point, the local cooling of face.And then with main substrate and measurement support that the low cost structure steel replace invar (low thermal coefficient of expansion material) to make, reduce manufacturing cost with this; Mode with the part cooling replaces the whole cooling of main substrate simultaneously, reduces Cooling System Design and operating cost with this.
2) adopt modular design, be convenient to installation and removal, simple in structure, flexible configuration is fit to the demand according to the change of actual tests and corresponding configuration.According to the difference of operating mode, can adopt series, parallel and mix the connected mode that joins between each module.Rapid-acting coupling is used in connection between the module simultaneously, joint merge module body, and the gap that reaches between the module is little.
3) modularization medium cooling base double helix square structure is with traditional snakelike heat exchanger plate, and under the identical condition of the pressure loss, the homogeneity in its temperature field can improve 30%-40%.Thermal source will effectively be reduced to the interference of inner world environments in stabilized uniform exothermic temperature field.
4) the double helix square structure is because medium (as: water) inflow runner remains parallel with medium outflow runner, its MEDIA FLOW is on the contrary, can offset and reduce MEDIA FLOW to a certain extent and go into runner and medium and flow out the physical shock that the cooling panel is produced, thereby reduce the interference to structural vibration that produces because of the fluid cooling.
Description of drawings
Figure 1 shows that cooling base installation and arrangement synoptic diagram.
Figure 2 shows that the modularization attemperating unit series design structural representation of preferred embodiment of the present invention.
Figure 3 shows that the modularization attemperating unit project organization synoptic diagram in parallel of preferred embodiment of the present invention.
The modularization attemperating unit that Figure 4 shows that preferred embodiment of the present invention mixes connection (series-multiple connection) project organization synoptic diagram.
Figure 5 shows that the medium cooling module structure synoptic diagram of preferred embodiment of the present invention.
Figure 6 shows that the cooling base module lower plate structural representation of preferred embodiment of the present invention.
Figure 7 shows that the medium refrigerating module inner chamber vertical view of preferred embodiment of the present invention.
Figure 8 shows that two medium refrigerating module connection diagrams of preferred embodiment of the present invention.
The a plurality of medium refrigerating modules that the Figure 9 shows that preferred embodiment of the present invention synoptic diagram that is connected.
Embodiment
In order more to understand technology contents of the present invention, especially exemplified by specific embodiment and cooperate appended graphic being described as follows.
Temperature control system provides temperature control solution can for variant parts, as the temperature control of litho machine internal measurement system, object lens flexible supporting block, main substrate, measurement support, planar motor, light source electrical control cubicles etc.Wherein be primarily aimed at the measuring system that is installed in the inner world of framework and carry out the cold control of medium (as: water), wherein, mainly carry the mask platform interferometer system at the measurement rack upper surface; Be furnished with projection objective and off-axis alignment system at the main substrate upper surface; Hang more measuring system in the main substrate bottom surface, comprising: leveling and focusing system, work stage interferometer system, null pick-up and chip transmission secondary prealignment CCD etc.Because the difference of each design of measuring system, the generation of its heat also produces different difference, and this species diversity has caused many difficulties and diversity for the design radiating surface.
Figure 1 shows that cooling base installation and arrangement synoptic diagram, it has two kinds of mounting meanss: first kind of mode is installed in the measurement rack upper surface with the medium cooling base, and the medium cooling base is positioned at top measuring system (thermal source) and measures between the support.The second way is installed in the main substrate lower surface with the medium cooling base, and the medium cooling base is between top measuring system (thermal source) and main substrate.By medium circulation system and temperature control system, can control the temperature of sensor when work, controlled surface temperature is remained in the optimum range, thereby eliminate owing to the influence of temperature variation to sensor accuracy of detection and the distortion of installation frame microscale dimensions.
In litho machine, cooling system is generally taked temperature control unit (Temperature Control Unit, TCU) unified medium (as: water) mode that supplies.Provide the MEDIA FLOW of certain pressure, flow velocity and flow by driving electric pump, through the processing of temperature control unit, the temperature of MEDIA FLOW is accurately controlled value at a certain needs.The principle of work of closed circuit such as Fig. 2 are respectively three kinds of different connected modes between the module to shown in Figure 4, and Fig. 2 is that series connection control between the module, Fig. 3 connect control for Parallel Control, Fig. 4 between the module for mixing between the module.
Please refer to Fig. 2 to Fig. 6, the present invention proposes a kind of modularization temperature control equipment, comprise the media drive electric pump 10 with electric pump control module 11, temperature control unit 20 and a plurality of medium refrigerating module 31,32,33 that connect successively, described medium refrigerating module comprises: interconnective medium cooling base module upper plate 100 and medium cooling base module lower plate 200; Fast connecting joint 400, be arranged at the side of described medium cooling base module lower plate 200, wherein, described medium cooling base module lower plate 200 has cubic double helical form inner chamber 300, have four stream sockets around it and be used for connecting described fast connecting joint 400, described modularization temperature control equipment comprises that also manifold 41,42 is connected in described a plurality of medium refrigerating module 31,32,33.
Each refrigerating module 31,32,33 all drives electric pump 10 by one in the loop pressure source is provided, temperature by the medium in 20 pairs of loops of temperature control unit is monitored in real time, reaches control model to the loop medium temperature closed loop by regulating pressure or flow.
Fig. 5 and Fig. 6 have illustrated installation and the hermetically-sealed construction of medium refrigerating module.Medium cooling base module upper plate 100 be a thin plate as cover plate, medium cooling base module lower plate 200 is the main body of module runner, heat eliminating medium flows into and flows out inner chamber from the lower plate side direction.Arrange two entrances and two outlets respectively around the lower plate, indicate with mark A and B that wherein A is that medium inlet, B are media outlet.
As shown in Figure 7, the architectural feature that has reflected the modularization cooled interior, heat eliminating medium flows into beginning by side entrance, MEDIA FLOW is gone into runner 1, inner chamber through having screw type flows into the modular structure center gradually, and the medium through screw type medium outflow runner 2 flows out module centers gradually then, side outlet around arriving, heat eliminating medium carries out flowing out the module runner again after the sufficient heat interchange, and heat eliminating medium is by constantly circulation of temperature control unit control.The four directions spiral flow channel is arc transition in 90 degree corners, with the loss of less pressure.The number of turns of spiral flow channel depends on the pressure head of runner and the area that remains to be dispelled the heat, and is generally even number 2,4 or 6 circles etc., and MEDIA FLOW is gone into runner and medium, and to flow out flow channel length length in unit area equal substantially.
Medium cooling base double helix square structure is with traditional snakelike heat exchanger plate, under the identical condition of the pressure loss, the homogeneity in its temperature field can improve 30%-40%, and traditional serpentine flow path can cause the obviously phenomenon of inequality of medium inflow side and medium outflow side temperature.
Simultaneously, the double helix square structure is because its MEDIA FLOW is gone into runner and medium flows out runner and remain parallel, it flows to opposite, can offset and reduce medium inflow and medium to a certain extent flows out, the physical shock to the generation of cooling panel that produces, thus the interference to structural vibration that produces because of the fluid cooling reduced.
Design has a circle seal groove around runner, and O-ring seal 3 is housed in the groove, closes up the back at upper and lower plates and realizes butt-end packing.The bolt that also is provided with the sealing upper and lower plates around the periphery ten of medium cooling base connects 4, and cooling but module whole be installed in the installation threaded hole 5 of desired location.
As shown in Figure 8, be two basic medium refrigerating module series connection use-cases, adopt fast interface to connect between the basic module that needs connect, jointing is made up of a male 410 and female 420, male 410 can directly be inserted female 420, and joint has sealing function.All the other positions that need not to configure entrance stop up 500 with its sealing by standard.
As shown in Figure 9, when a plurality of medium refrigerating modules are assembled, can select any one A mouth to be connected with the B mouth, improve the dirigibility of flow direction connection and the diversity of assembling form.Can select reasonable connection way between a plurality of basic modules, different according to the demand of heat radiation cooling requirement and operating mode, the modularization cooling base can carry out the combination configuration of varying number, area and geometric configuration.
Though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (10)
1. a modularization temperature control equipment comprises the media drive electric pump with electric pump control module, temperature control unit and a plurality of medium refrigerating module that connect successively, it is characterized in that described medium refrigerating module comprises:
Interconnective medium cooling base module upper plate and medium cooling base module lower plate;
Fast connecting joint is arranged at the side of described medium cooling base module lower plate,
Wherein, described medium cooling base module lower plate has cubic double helical form inner chamber, has four stream sockets around it and is used for connecting described fast connecting joint.
2. modularization temperature control equipment according to claim 1 is characterized in that, comprises that also manifold is connected in described a plurality of medium refrigerating module.
3. modularization temperature control equipment according to claim 1 is characterized in that, also comprises the obstruction head, is used for connecting the no stream socket of described refrigerating module.
4. modularization temperature control equipment according to claim 1 is characterized in that, described fast connecting joint comprises and connects male and be connected female.
5. modularization temperature control equipment according to claim 4 is characterized in that, described connection male be connected female and adopt plug-in type to connect, and have sealing function.
6. modularization temperature control equipment according to claim 1 is characterized in that, described cubic double helical form inner chamber is arc transition in 90 degree corners.
7. modularization temperature control equipment according to claim 1 is characterized in that, the number of turns of described cubic double helical form inner chamber is the even number circle, and MEDIA FLOW is gone into runner and medium flows out runner equal in length in unit area.
8. modularization temperature control equipment according to claim 7 is characterized in that, described MEDIA FLOW is gone into runner and medium and flowed out runner and replace overlapping and keeping parallelism, and its MEDIA FLOW is on the contrary.
9. modularization temperature control equipment according to claim 1 is characterized in that, described medium is water.
10. modularization temperature control equipment according to claim 1 is characterized in that, the connected mode of described a plurality of medium refrigerating modules is series, parallel or mixes connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210041402.7A CN103294078B (en) | 2012-02-22 | 2012-02-22 | Modularized temperature control device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210041402.7A CN103294078B (en) | 2012-02-22 | 2012-02-22 | Modularized temperature control device |
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| CN103294078A true CN103294078A (en) | 2013-09-11 |
| CN103294078B CN103294078B (en) | 2015-06-17 |
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| CN201210041402.7A Active CN103294078B (en) | 2012-02-22 | 2012-02-22 | Modularized temperature control device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104571197A (en) * | 2013-10-29 | 2015-04-29 | 杨泰和 | Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof |
| CN111111576A (en) * | 2019-12-30 | 2020-05-08 | 广西师范大学 | Integrated chemical equipment |
| CN115167572A (en) * | 2022-06-30 | 2022-10-11 | 浙江工业大学 | Integrated micro temperature control device and preparation method thereof |
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| CN1447055A (en) * | 2003-04-10 | 2003-10-08 | 中海油田服务股份有限公司 | Fluid quick connector |
| CN2842735Y (en) * | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | Flatboard type water-cooling radiator of insulating-grid two-pole transistor |
| CN201163626Y (en) * | 2008-01-11 | 2008-12-10 | 林于纮 | Chip fast-cooling device |
| CN201368617Y (en) * | 2009-01-23 | 2009-12-23 | 上海微电子装备有限公司 | Thermal electrical refrigerator and heat dissipation device thereof |
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2012
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010003901A1 (en) * | 1999-08-18 | 2001-06-21 | Hooman Bolandi | Integrated bake and chill plate |
| CN1447055A (en) * | 2003-04-10 | 2003-10-08 | 中海油田服务股份有限公司 | Fluid quick connector |
| CN2842735Y (en) * | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | Flatboard type water-cooling radiator of insulating-grid two-pole transistor |
| CN201163626Y (en) * | 2008-01-11 | 2008-12-10 | 林于纮 | Chip fast-cooling device |
| CN201368617Y (en) * | 2009-01-23 | 2009-12-23 | 上海微电子装备有限公司 | Thermal electrical refrigerator and heat dissipation device thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104571197A (en) * | 2013-10-29 | 2015-04-29 | 杨泰和 | Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof |
| CN104571197B (en) * | 2013-10-29 | 2022-05-03 | 杨泰和 | Temperature control system with attached temperature equalizer and heat transfer fluid |
| CN111111576A (en) * | 2019-12-30 | 2020-05-08 | 广西师范大学 | Integrated chemical equipment |
| CN115167572A (en) * | 2022-06-30 | 2022-10-11 | 浙江工业大学 | Integrated micro temperature control device and preparation method thereof |
| CN115167572B (en) * | 2022-06-30 | 2024-03-22 | 浙江工业大学 | Integrated micro-temperature controller and preparation method thereof |
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| CN103294078B (en) | 2015-06-17 |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |