CN206149693U - Heat dissipation mechanism and have equipment of heat source - Google Patents
Heat dissipation mechanism and have equipment of heat source Download PDFInfo
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- CN206149693U CN206149693U CN201621048980.3U CN201621048980U CN206149693U CN 206149693 U CN206149693 U CN 206149693U CN 201621048980 U CN201621048980 U CN 201621048980U CN 206149693 U CN206149693 U CN 206149693U
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- dissipating path
- thermal dissipating
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Abstract
The utility model discloses a heat dissipation mechanism and the equipment that has the heat source, heat dissipation mechanism include at least all the way the first heat dissipation route and the second heat dissipation route of going the same way at least, the 2nd configure path is followed along a configure path, second heat dissipation route to first heat dissipation route, wherein, first route and second route set up side by side, and the heat transfer orientation of first heat dissipation route between two positions and second heat dissipation route is in heat transfer opposite direction between two positions. The during operation, first heat dissipation route is inequality in the temperature of its self at least two positions department, and second heat dissipation route is also inequality in the temperature of its self at least two positions department, a higher position neighbouring set up lower with first heat dissipation route moderate temperature of second heat dissipation route moderate temperature. In this way, the utility model discloses can balance the temperature of whole equipment, make the difference in temperature between the heat source reduce.
Description
Technical field
The utility model is related to Electronic cooling field, more particularly to a kind of cooling mechanism and setting with thermal source
It is standby.
Background technology
Some electronic equipments more serious fuel factor of meeting producing ratio in running, so being generally required for taking certain
Cooling provision, so as to ensure the stable operation of equipment.Cooling provision includes：Liquid cooling, gas cooling and conduction cooling.Mesh
Before, widely used is the method for liquid cooling.
The method commonly used in liquid cooling is that it has the disadvantage using the cooling of unidirectional water route, the loop that unidirectional water route cools down compared with
It is long, and need the number of heat source of cooling numerous, first thermal source started from inlet to last thermal source, between the two
Temperature Difference Ratio is larger.This will substantially reduce the power output of equipment and greatly shortens the service life of equipment.
Utility model content
The utility model provides a kind of cooling mechanism and the equipment with thermal source, is capable of the temperature of active balance whole equipment
And reduce the temperature difference between thermal source.
The utility model adopt a technical scheme be：A kind of cooling mechanism is provided, including,
At least the first thermal dissipating path all the way, first thermal dissipating path is arranged along first path；
At least the second thermal dissipating path all the way, second thermal dissipating path is arranged along the second path；
Wherein, first thermal dissipating path heat transfer direction between the two positions exists with second thermal dissipating path
Heat transfer between described two positions is in opposite direction.
The first path and the second path are arranged side by side, and first thermal dissipating path and second thermal dissipating path
Heat transfer is in opposite direction.
First thermal dissipating path and second thermal dissipating path equal thermal coupling at each described position.
First thermal dissipating path at each described position with thermal source thermal coupling, second thermal dissipating path is in each institute
Rheme puts place with the thermal source thermal coupling.
First thermal dissipating path and second thermal dissipating path are fluid for radiating heat pipeline.
The cooling mechanism also includes housing, inlet, liquid outlet, and first thermal dissipating path and second radiating are led to
The relatively described housing of road, inlet, liquid outlet is fixed；
First thermal dissipating path and the second thermal dissipating path two ends respectively connect the inlet and liquid outlet, institute
State the second thermal dissipating path to extend from the inlet, first extend up to towards the liquid outlet direction logical with the described first radiating
Road is continued side by side, afterwards the form with first thermal dissipating path side by side and extends to the neighbouring inlet, and the final path that changes is prolonged
Stretch and be connected to the liquid outlet.
Second thermal dissipating path extends from the inlet and extends towards the liquid outlet direction
Until the part with first thermal dissipating path side by side is to adopt Design on thermal insulation.
The thermal source is LASER Light Source, chip or power amplifier, first thermal dissipating path and second thermal dissipating path
It is copper pipe.
To solve above-mentioned technical problem, the utility model additionally provides a kind of equipment with thermal source, including mutual hot coupling
Close thermal source and cooling mechanism, the cooling mechanism includes at least the first thermal dissipating path and at least the second thermal dissipating path all the way all the way；
During work, temperature of first thermal dissipating path at its own at least two position is differed, and described second dissipates
Temperature of the heat passage at its own at least two position is also differed, described in temperature is higher in second thermal dissipating path one
It is positioned adjacent to arrange described in relatively low with temperature in first thermal dissipating path in position.
First thermal dissipating path and second thermal dissipating path are arranged side by side, and first thermal dissipating path and described
The heat transfer of two thermal dissipating paths is in opposite direction.
First thermal dissipating path and second thermal dissipating path equal thermal coupling at each described position；Or described first
Thermal dissipating path at each described position with thermal source thermal coupling, second thermal dissipating path at each described position with the heat
Source thermal coupling.
The beneficial effects of the utility model are：It is different from the situation of prior art, the first radiating that the utility model is adopted
Path is positive and negative with the second thermal dissipating path to be arranged side by side, and both internal heat transfers are in opposite direction and the equal thermal coupling at each position,
The temperature difference between thermal source, the service life of extension device can effectively be reduced.
Description of the drawings
Fig. 1 is the structural representation of the embodiment of the utility model cooling mechanism one；
Fig. 2 is the structural representation of the embodiment of equipment one that the utility model has thermal source；
Fig. 3 is the structural representation of the equipment another embodiment that the utility model has thermal source；
Fig. 4 is the schematic diagram of second embodiment of the utility model cooling mechanism；
Fig. 5 is the schematic diagram of the third embodiment of the utility model cooling mechanism；
Specific embodiment
Uneven to solve the problems, such as unidirectional cooling circuit chilling temperature, the technical scheme that the utility model is adopted is
A kind of cooling mechanism and the equipment with thermal source are provided.
Fig. 1 is referred to, the embodiment of the utility model cooling mechanism one includes：
At least the first thermal dissipating path 101 all the way, the first thermal dissipating path 101 is arranged along first path 103；At least all the way second
Thermal dissipating path 102, the second thermal dissipating path 102 is arranged along the second path 104；First thermal dissipating path 101 and second in the present embodiment
Thermal dissipating path 102 is preferably all the way；Wherein, the first thermal dissipating path 101 heat transfer direction and second between the two positions
The heat transfer between the two positions of thermal dissipating path 102 is in opposite direction.
First thermal dissipating path 101 and the second thermal dissipating path 102 are fluid for radiating heat pipeline, the first thermal dissipating path 101 and
The material of two thermal dissipating path 102 is copper, its pipeline inside confession cooling flow of media, such as cooling water, so as to take away the heat in system
Amount.Go out the flow direction of cooling medium in the path 104 of first path 103 and second in Fig. 1 with the arrow logo of multi-form.The
One path 103 and the second path 104 are arranged side by side, and the heat of everywhere the first thermal dissipating path 101 and the second thermal dissipating path 102 is passed
Pass direction to be contrary.The equal thermal coupling at each position of first thermal dissipating path 101 and the second thermal dissipating path 102.
Above-mentioned cooling mechanism also includes housing 105, inlet 106, liquid outlet 107, and the first thermal dissipating path 101 and second dissipates
Heat passage 102, inlet 106, liquid outlet 107 are fixed with respect to housing 105.
Specifically, inlet 106 and liquid outlet 107 are bolted together on housing 5, the first thermal dissipating path 101 and second
The two ends of thermal dissipating path 102 respectively connect inlet 106 and liquid outlet 107.
First thermal dissipating path 101 extends to liquid outlet 107 from inlet 106 by waveform configuration.Second thermal dissipating path 102 from
Inlet 106 extends, and first extends up to the first thermal dissipating path 101 side by side towards the direction of liquid outlet 107, continues and first afterwards
The form side by side of thermal dissipating path 101 extends to neighbouring inlet 106, and the final path that changes extends and connected to liquid outlet 107.Its
In, the second thermal dissipating path 102 extends from inlet 106 and extends up to and the first thermal dissipating path towards the direction of liquid outlet 107
101 parts 112 side by side are to adopt Design on thermal insulation, and buried technology is preferably adopted in the utility model, and this is not only convenient for pipeline
Arrangement, and it is held essentially constant can cooling medium starting inflow temperature in the second heat dissipation channel 102.
The above-mentioned back side of cooling mechanism housing 105, fixed or contact has thermal source 108,109,110,111, thermal source number, shape
Shape is not limited to the number in the present embodiment, shape.Thermal source 108,109,110,111 can be LASER Light Source, chip or power amplifier
Any one in circuit.
First thermal dissipating path 101 at each position with neighbouring thermal source 108 or 109 or 110 or 111 thermal couplings, second
Thermal dissipating path 102 at each position with the thermal source 108 or 109 or 110 or 111 thermal couplings for closing on.
Specifically, the first thermal dissipating path 101 is arranged along first path 103, the temperature of cooling medium in the first thermal dissipating path 101
Degree constantly rises with the direction of first path 103, and cooling medium is gradually deteriorated by the heat-sinking capability that thermal source is taken away in heat exchange.The
Two thermal dissipating paths 102 along the second path arrange 104, extend from inlet 106 and towards the direction of liquid outlet 107 extend up to
First thermal dissipating path 101 part 112 side by side is using buried technology so that cooling medium starting in the second thermal dissipating path 102
Temperature keeps substantially constant.In second thermal dissipating path 102 in the profiling temperatures of cooling medium and the first thermal dissipating path 101 just
Well conversely, the equal thermal coupling at each position of the first thermal dissipating path 101 and the second thermal dissipating path 102, the second thermal dissipating path 102 is more
The shortcoming of 101 later stage of the first thermal dissipating path cooling performance variation is mended.Two positive and negative path cooperates so that cooling mechanism is cold
But performance enhancement, each heat source temperature is essentially identical.
Fig. 2 is referred to, the embodiment of equipment one that the utility model has thermal source includes above-mentioned cooling mechanism, its thermal dissipating path
It is same as described above with path structure, will not be described here.In the present embodiment, the equipment with thermal source is preferably middle high power laser light
Device product；Thermal source is preferably pump light source；
The said equipment has a housing 209, and the material of the housing 209 is preferably aluminium.Inlet 207 and liquid outlet 208 are logical
Cross and be bolted on housing 209.In the present embodiment inlet 207 be three feed tubes, liquid outlet 208 be three drain pipes, its material
It is of fine quality to elect brass as.First heat dissipation channel is preferably two, and respectively 201,202, the second heat dissipation channel is preferably one 203,
Above-mentioned heat dissipation channel material is preferably red copper.First heat dissipation channel 201 is arranged along first path 204, the edge of the first heat dissipation channel 202
First path 205 is arranged, and the second heat dissipation channel 203 is arranged along the second path.First thermal dissipating path 201 and 202 is parallel to each other.This
The volume of thermal source pump light source 210 is of different sizes in embodiment, and quantity is 17, is randomly dispersed in cooling mechanism lower end.In figure only
Identify one for reference, remaining is thermal source with this structure identical in figure.Pump light source 210 is fixed on the lower end of substrate 209
Face, its tail optical fiber 211 exposes, and connects for other workpieces with laser group.
During work, temperature of first thermal dissipating path 201,202 at its own at least two position is differed, the second radiating
Temperature of the path 203 at its own at least two position is also differed, the relatively low position of temperature in the second thermal dissipating path 203
It is positioned adjacent to arrange with temperature is higher in the first thermal dissipating path 201 and 202 one.First thermal dissipating path 201,202 and second
Thermal dissipating path 203 is arranged side by side, and the first thermal dissipating path 201,202 is in opposite direction with the heat transfer of the second thermal dissipating path 203.
The equal thermal coupling at each position of first thermal dissipating path 201,202 and the second thermal dissipating path 203；First thermal dissipating path 201,202
At each position with the thermal coupling of pump light source 210, the second thermal dissipating path 203 at each position with the hot coupling of pump light source 210
Close.
Cooperated by positive and negative thermal dissipating path, whole panel temperature is balanced, made between each pump light source 210
The temperature difference diminishes.In an application scenarios, pump light source is cooled down using unidirectional water route, first pump light source of inlet and last
One 4 DEG C -6 DEG C of pump light source temperature difference；And adopt the present embodiment provide cooling mechanism, its temperature difference be less than 1 DEG C.Pump light
Source beam quality is improved, and laser instrument service life extends.
Fig. 3 has another embodiment of the equipment of thermal source, wherein inlet 303, liquid outlet 304, first for the utility model
The materials such as heat dissipation channel 301, the second heat dissipation channel 302 can also be the heat sink materials such as aluminium, aluminium alloy, iron；First heat dissipation channel
301st, the second heat dissipation channel 302 is not necessarily in each position and the thermal coupling of thermal source 305.A thermal source 305 is only identified in accompanying drawing 3
For reference, remaining is thermal source with this structure identical in figure.
Refer to Fig. 4-Fig. 5, in some operation environments, thermal dissipating path not necessarily at each position with the hot coupling of thermal source
Close, the also not necessarily equal thermal coupling at each position between thermal dissipating path.
Second cooling mechanism schematic diagram that Fig. 4 is provided for the utility model.401 is the first thermal dissipating path in figure, and 402 are
Second thermal dissipating path, and arrow logo direction represents respectively the medium in the first thermal dissipating path 401 and the second thermal dissipating path 402
Flow direction.403rd, 404,405 it is respectively thermal source.First thermal dissipating path 401 and the second thermal dissipating path 402 are flowing through identical thermal source
Thermal coupling is carried out when 405.
The third cooling mechanism schematic diagram that Fig. 5 is provided for the utility model.Wherein the first thermal dissipating path 501 and second dissipates
Media flow is in opposite direction in heat passage 502, and the first thermal dissipating path 501 and thermal source 503, the thermal coupling of thermal source 504, the second radiating
Path 502 and thermal source 505, the thermal coupling of thermal source 506.First thermal dissipating path 501 and the second thermal dissipating path 502 are respectively in position 507
With 508 at thermal coupling.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is all
It is the equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or directly or indirectly uses
In other related technical fields, it is included in the same manner in scope of patent protection of the present utility model.
Claims (11)
1. a kind of cooling mechanism, it is characterised in that
At least the first thermal dissipating path all the way, first thermal dissipating path is arranged along first path；
At least the second thermal dissipating path all the way, second thermal dissipating path is arranged along the second path；
Wherein, first thermal dissipating path heat transfer direction between the two positions with second thermal dissipating path described
Heat transfer between two positions is in opposite direction.
2. cooling mechanism according to claim 1, it is characterised in that the first path and the second path are arranged side by side,
And first thermal dissipating path is in opposite direction with the heat transfer of second thermal dissipating path.
3. cooling mechanism according to claim 1, it is characterised in that first thermal dissipating path is logical with the described second radiating
Road equal thermal coupling at each described position.
4. cooling mechanism according to claim 1, it is characterised in that first thermal dissipating path is at each described position
With thermal source thermal coupling, second thermal dissipating path at each described position with the thermal source thermal coupling.
5. the cooling mechanism according to any one of Claims 1-4, it is characterised in that
First thermal dissipating path and second thermal dissipating path are fluid for radiating heat pipeline.
6. cooling mechanism according to claim 5, it is characterised in that
Further include housing, inlet, liquid outlet, first thermal dissipating path and second thermal dissipating path, inlet, go out
The relatively described housing of liquid mouth is fixed；
First thermal dissipating path and the second thermal dissipating path two ends respectively connect the inlet and liquid outlet, and described
Two thermal dissipating paths extend from the inlet, first extend up to first thermal dissipating path simultaneously towards the liquid outlet direction
Row, continues afterwards the form with first thermal dissipating path side by side and extends to the neighbouring inlet, and the final path that changes extends simultaneously
It is connected to the liquid outlet.
7. cooling mechanism according to claim 6, it is characterised in that
Second thermal dissipating path extends from the inlet and extends up to and described first towards the liquid outlet direction
Thermal dissipating path part side by side is to adopt Design on thermal insulation.
8. cooling mechanism according to claim 4, it is characterised in that
The thermal source is LASER Light Source, chip or power amplifier, and first thermal dissipating path and second thermal dissipating path are
Copper pipe.
9. a kind of equipment with thermal source, it is characterised in that
Including being thermally coupled to each other thermal source and cooling mechanism, the cooling mechanism includes at least the first thermal dissipating path and at least all the way
The thermal dissipating path of road second；
During work, temperature of first thermal dissipating path at its own at least two position is differed, and second radiating is logical
Temperature of the road at its own at least two position is also differed, position described in temperature is higher in second thermal dissipating path one
Be positioned adjacent to described in temperature is relatively low in first thermal dissipating path one arrange.
10. equipment according to claim 9, it is characterised in that first thermal dissipating path and second thermal dissipating path
It is arranged side by side, and first thermal dissipating path is in opposite direction with the heat transfer of second thermal dissipating path.
11. equipment according to claim 9, it is characterised in that
First thermal dissipating path and second thermal dissipating path equal thermal coupling at each described position；Or
First thermal dissipating path at each described position with thermal source thermal coupling, second thermal dissipating path is in each institute's rheme
Place is put with the thermal source thermal coupling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621048980.3U CN206149693U (en) | 2016-09-09 | 2016-09-09 | Heat dissipation mechanism and have equipment of heat source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621048980.3U CN206149693U (en) | 2016-09-09 | 2016-09-09 | Heat dissipation mechanism and have equipment of heat source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206149693U true CN206149693U (en) | 2017-05-03 |
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ID=58618433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621048980.3U Active CN206149693U (en) | 2016-09-09 | 2016-09-09 | Heat dissipation mechanism and have equipment of heat source |
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| Country | Link |
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| CN (1) | CN206149693U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107809879A (en) * | 2016-09-09 | 2018-03-16 | 深圳联品激光技术有限公司 | A kind of cooling mechanism and the equipment with thermal source |
| CN107993993A (en) * | 2017-12-11 | 2018-05-04 | 成都西华升腾科技有限公司 | A kind of cooling and heat dissipation pipeline of chip |
| CN108601287A (en) * | 2018-02-11 | 2018-09-28 | 北京百度网讯科技有限公司 | Overhead refrigerating method and overhead refrigeration unit |
-
2016
- 2016-09-09 CN CN201621048980.3U patent/CN206149693U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107809879A (en) * | 2016-09-09 | 2018-03-16 | 深圳联品激光技术有限公司 | A kind of cooling mechanism and the equipment with thermal source |
| CN107809879B (en) * | 2016-09-09 | 2020-04-03 | 深圳联品激光技术有限公司 | Heat dissipation mechanism and equipment with heat source |
| CN107993993A (en) * | 2017-12-11 | 2018-05-04 | 成都西华升腾科技有限公司 | A kind of cooling and heat dissipation pipeline of chip |
| CN108601287A (en) * | 2018-02-11 | 2018-09-28 | 北京百度网讯科技有限公司 | Overhead refrigerating method and overhead refrigeration unit |
| CN108601287B (en) * | 2018-02-11 | 2020-08-28 | 北京百度网讯科技有限公司 | Overhead refrigeration method and overhead refrigeration unit |
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