CN213026888U - Laser source device - Google Patents
Laser source device Download PDFInfo
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- CN213026888U CN213026888U CN202021886881.9U CN202021886881U CN213026888U CN 213026888 U CN213026888 U CN 213026888U CN 202021886881 U CN202021886881 U CN 202021886881U CN 213026888 U CN213026888 U CN 213026888U
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- coupling module
- fiber coupling
- water
- circuit board
- laser
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Abstract
The utility model provides a laser source device, its includes casing, water-cooling board, fiber coupling module and connection fiber coupling module's laser driver circuit board, the water-cooling board includes an at least installation fiber coupling module installation area and the installation of fiber coupling module laser driver circuit board's circuit board installation area, water-cooling board integrated into one piece is equipped with water inlet and delivery port water-cooling inboard, the water inlet with through the pipe connection between the delivery port. The mode that the laser source device adopted water-cooling board integral type processing, simple structure, and realize the required machining precision of heat dissipation very easily, reduced the processing cost, improved the radiating efficiency, simultaneously, adopt integral type processing mode, do not need welding or quick connector to connect each heat conduction piece, do not have the inside risk of leaking the damage photoelectric component of box, increased laser instrument life.
Description
Technical Field
The invention relates to a laser source device, in particular to a semiconductor laser source device which is compact in spatial arrangement and has a better heat dissipation effect.
Background
The semiconductor laser is a common laser light source, has the advantages of small volume, light weight, low power consumption, high efficiency and the like, and is widely applied to the fields of laser ranging, laser communication, direct-write exposure and the like. However, the laser performance is greatly affected by temperature, and therefore, for a semiconductor laser, heat dissipation is particularly important for the application thereof.
The traditional semiconductor laser usually forms a U-shaped cooling water channel by bending a red copper pipe, and the U-shaped cooling water channel is clamped between two radiating blocks to radiate the semiconductor laser; however, because the tolerance of the outer diameter of the copper tube is difficult to control, the copper tube clamped between the two radiating blocks cannot be completely attached to the radiating blocks, and complete and good contact radiating cannot be realized even if the gaps are filled with the heat-conducting silicone grease; and the copper tube and the water cooler are connected by welding joints, the welding process is complex, and the risk of water leakage exists due to poor welding.
Chinese patent CN106025788A provides a circulating water cooling device for semiconductor laser, which includes an upper heat conducting copper block and a lower heat conducting copper block, wherein the upper heat conducting copper block and the lower heat conducting copper block are connected to the water inlet pipe and the water outlet pipe through a direct quick coupling, the upper heat conducting copper block and the lower heat conducting copper block include a base and an upper cover, the base is provided with a lower notch, the bottom of the upper cover is provided with an upper notch, and the optical fiber coupling module for semiconductor laser is accommodated through the upper notch and the lower notch. This kind of mode can be better solve the not good problem of U type copper tubing heat dissipation, but because need directly process the design of notch according to fiber coupling module appearance on the copper billet, need very high to the appearance of each fiber coupling module and the whole dimensional tolerance control requirement of cooling copper billet, if fiber coupling module overall dimension is not unified, fiber coupling module and cooling copper billet size are unequal, it is not good to appear certain fiber coupling module contact heat dissipation, and leads to the laser pipe to damage, consequently, the circulating water cooling device processing degree of difficulty is big, and the processing cost is high. Meanwhile, the optical fiber coupling module is integrally installed and fixed, so that poor heat dissipation is caused, and the semiconductor laser is damaged. In order to realize the installation of the multi-coupling module, the laser box body is internally provided with each heat conducting block by welding or quick connectors, and the risk of damaging the photoelectric element device caused by water leakage inside the laser box body exists. In addition, the space arrangement is not tight enough, and when more optical fiber coupling modules need to be arranged, the laser box body needs larger overall dimension, which is not beneficial to the overall installation of the laser on the miniaturized equipment.
Disclosure of Invention
The invention aims to solve the technical problem of providing a heat dissipation device which is good in heat dissipation effect and small in processing difficulty.
In order to solve the above problems, the present invention provides a laser source device, which includes a housing, an optical fiber coupling module, a laser driving circuit board connected to the optical fiber coupling module, and a water cooling plate, wherein the water cooling plate includes at least an optical fiber coupling module mounting region for mounting the optical fiber coupling module and a circuit board mounting region for mounting the laser driving circuit board, the water cooling plate is integrally formed and provided with a water inlet and a water outlet, and the water inlet and the water outlet are connected through a pipeline inside the water cooling plate.
Furthermore, the pipelines inside the water cooling plate are distributed in the internal area corresponding to the optical fiber coupling module and the laser driving circuit board mounting area.
Furthermore, the circuit board mounting region is located in the middle, and the fiber coupling module mounting regions are located on two sides of the circuit board mounting region.
Further, the circuit board mounting region is located at a middle position, and the fiber coupling module mounting region is disposed around the circuit board mounting region.
Further, the fiber coupling module mounting region includes at least two fiber coupling module mounting stages having different heights.
Further, the mounting table adjacent to the mounting area of the circuit board is higher than the mounting table adjacent to the edge of the water cooling plate.
Further, the fiber coupling module mounting area and the circuit board mounting area are located on two opposite sides of the water cooling plate.
Further, the optical fiber coupling module is square.
Furthermore, the optical fiber of the optical fiber coupling module extends out from one side close to the edge of the water-cooling plate.
Further, the laser driving circuit board comprises a plurality of driving units, and each driving unit corresponds to one group of laser sources.
Compared with the prior art, the utility model discloses a mode that the laser source device adopted water-cooling board integral type processing, simple structure, and realize the required machining precision of heat dissipation very easily, reduced the processing cost, improved the radiating efficiency, simultaneously, adopt integral type processing mode, do not need welding or quick connector to connect each heat conduction piece, the risk that does not have the inside damage photoelectric components and parts that leaks of box can not appear, has increased laser instrument life.
Drawings
Fig. 1 is a schematic diagram of a laser source device.
Fig. 2 is a schematic diagram of the internal structure of the laser source device.
Fig. 3 is a schematic diagram of a water-cooled plate of a laser source device.
Fig. 4 is a side view of the internal structure of the laser source device.
Fig. 5 is a schematic diagram of a laser driver circuit board and a laser source.
Fig. 6 is a schematic diagram of another embodiment of a laser source device.
Detailed Description
In order that the objects, aspects and advantages of the invention will become more apparent, the invention will be described by way of example only, and in connection with the accompanying drawings.
As shown in fig. 1 to 5, the laser source device includes a housing 1, a water-cooling plate 2 disposed in the housing 1, an optical fiber coupling module 3, and a laser driving circuit board 4, where the optical fiber coupling module 3 and the laser driving circuit board 4 are disposed on the water-cooling plate 2, and heat is dissipated through the water-cooling plate 2.
The water cooling plate 2 comprises at least one mounting surface for mounting the optical fiber coupling module 3 and the laser driving circuit board 4. And configuring the number of the optical fiber coupling modules 3 according to the power of the light source required by the laser source device, and determining the number and the structure of the mounting surfaces of the water cooling plate 2 according to the number of the optical fiber coupling modules 3.
As shown in fig. 1 to 5, when a greater number of optical fiber coupling modules 3 need to be installed, the water cooling plate 2 includes two parallel opposite installation surfaces, where the installation surfaces include a circuit board installation region 21 located in the middle and optical fiber coupling module installation regions 22 located at two sides of the circuit board installation region 21, each of the optical fiber coupling module installation regions 22 includes two installation stages of the optical fiber coupling modules with different heights, a first installation stage 221 is adjacent to the circuit board installation region, a second installation stage 222 is adjacent to an edge, a gap is provided between the first installation stage 221 and the second installation stage 222, and the first installation stage 221 is higher than the second installation stage 222. The first installation table 221 and the second installation table 222 are set to have different heights, that is, a high-low step-shaped design is adopted, so that the space can be effectively utilized, the optical fiber cannot be bent, so that a large turning radius is needed when the optical fiber is bent, and if the distance between the front row and the rear row is increased without adopting high-low layering treatment, the width of the laser source device is increased.
The water-cooling plate 2 is perpendicular to one side of the installation surface and is provided with a water inlet 23 and a water outlet 24, the water inlet 23 is connected with the water outlet 24 through a pipeline inside the water-cooling plate, the arrangement forms of the pipeline are various, the optical fiber coupling module and the laser driving circuit board installation areas (22 and 21) are covered, and heat generated by the optical fiber coupling module 3 and the laser driving circuit board 4 is dissipated.
The optical fiber coupling module 3 is designed in a square shape and is fixedly installed in the optical fiber coupling module installation area 22. The square design can increase the contact area of the fiber coupling module 3 and the water cooling plate 2. The laser source of the optical fiber coupling module 3 is connected with the laser driving circuit board 4, and the laser driving circuit board 4 controls the on and off of the laser source. The laser source can adopt a single-waveband laser source or can adopt laser sources with different wavebands to form a multiband mixed laser source. The optical fibers of the fiber coupling module 3 near the edge protrude from the side adjacent to the edge. The optical fibers of the fiber coupling modules mounted on the first mounting stage 221 adjacent to the circuit board mounting region 21 protrude from the region between the first mounting stage 221 and the second mounting stage 222. Preferably, the laser driving circuit board 4 has a plurality of driving units, each driving unit controls a group of laser sources, and controls the on and off of the laser sources by controlling the on and off of the driving units, so as to control the output power of the laser sources of the laser source device and the wavelength band of the used laser sources.
The shell 1 is provided with a water inlet pipe joint 11 and a water outlet pipe joint 12 which are connected with a water inlet 23 and a water outlet 24 of the water cooling plate 2. A first optical fiber interface 13 and a second optical fiber interface 14 are arranged on the other opposite side of the housing 1 corresponding to the optical fiber coupling modules respectively located on the two opposite sides of the circuit board, and the first optical fiber interface 13 and the second optical fiber interface 14 are correspondingly arranged at the two ends of the housing. As shown in fig. 6, only one optical fiber interface 15 may be provided.
The present invention is not limited to the above embodiments, and the number of the fiber coupling module mounting platforms may be increased or decreased as required; the second mounting table of the fiber coupling module is higher than the first mounting table; the side, mounted on the second mounting table, of the optical fiber coupling module optical fiber faces the first mounting table; the mounting surface can be arranged on one side of the water cooling plate; the optical fiber coupling module is annularly arranged around the laser driving circuit board and can be surrounded on three sides or four sides; and other alternatives.
The laser source device of the utility model adopts the mode of water cooling plate integrated processing, has simple structure, can easily realize the processing precision required by heat dissipation, reduces the processing cost, improves the heat dissipation efficiency, simultaneously adopts the integrated processing mode, does not need welding or quick connector to connect each heat conducting block, has no risk of damaging photoelectric components due to water leakage in the box body, and prolongs the service life of the laser; meanwhile, the compact layout of the laser coupling modules in a sectional and hierarchical manner enables more laser coupling modules to be installed in the limited laser box body size, so that higher total power output is provided; meanwhile, the laser coupling module can be set for a single wave band or can be set for a mixture of multiple wave bands; the configuration of one or more optical fibers of the laser can be realized according to the design requirement.
Claims (10)
1. A laser source device, it includes casing, fiber coupling module and connects the laser driver circuit board of fiber coupling module, its characterized in that: it still includes the water-cooling board, the water-cooling board includes an at least installation the fiber coupling module installation area and the installation of fiber coupling module the circuit board installation area of laser drive circuit board, water-cooling board integrated into one piece is equipped with water inlet and delivery port inside the water-cooling board, the water inlet with through the pipe connection between the delivery port.
2. The laser source device according to claim 1, wherein: and the pipelines inside the water cooling plate are distributed in the internal areas corresponding to the optical fiber coupling module and the laser driving circuit board mounting area.
3. The laser source device according to claim 1, wherein: the optical fiber coupling module mounting areas are located on two sides of the circuit board mounting area.
4. The laser source device according to claim 1, wherein: the circuit board mounting region is located in the middle, and the optical fiber coupling module mounting region is arranged around the circuit board mounting region.
5. Laser source device according to any of claims 1-4, characterized in that: the optical fiber coupling module mounting area comprises at least two optical fiber coupling module mounting platforms with different heights.
6. The laser source device according to claim 4, wherein: the mounting platform adjacent to the circuit board mounting area is higher than the mounting platform adjacent to the edge of the water cooling plate.
7. The laser source device according to claim 1, wherein: the optical fiber coupling module mounting area and the circuit board mounting area are located on opposite sides of the water cooling plate.
8. The laser source device according to claim 1, wherein: the optical fiber coupling module is square.
9. The laser source device according to claim 1, wherein: and the optical fiber of the optical fiber coupling module extends out from one side of the edge of the water-cooling plate.
10. The laser source device according to claim 1, wherein: the laser driving circuit board comprises a plurality of driving units, and each driving unit corresponds to one group of laser sources.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021798159X | 2020-08-25 | ||
| CN202021798159 | 2020-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213026888U true CN213026888U (en) | 2021-04-20 |
Family
ID=75473989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021886881.9U Active CN213026888U (en) | 2020-08-25 | 2020-09-02 | Laser source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213026888U (en) |
-
2020
- 2020-09-02 CN CN202021886881.9U patent/CN213026888U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province Patentee after: Yuanzhuo Micro Nano Technology (Suzhou) Co.,Ltd. Address before: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province Patentee before: ADVANCED MICRO OPTICS.INC |