CN210954612U - Laser of laser direct-writing exposure machine and laser direct-writing exposure machine - Google Patents
Laser of laser direct-writing exposure machine and laser direct-writing exposure machine Download PDFInfo
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- CN210954612U CN210954612U CN201922247648.XU CN201922247648U CN210954612U CN 210954612 U CN210954612 U CN 210954612U CN 201922247648 U CN201922247648 U CN 201922247648U CN 210954612 U CN210954612 U CN 210954612U
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Abstract
The utility model discloses a laser instrument and laser direct write exposure machine of laser direct write exposure machine belongs to laser direct write exposure machine technical field. By providing the water cooling device of the waterless pipe joint, the problem of shutdown caused by water leakage risk in the existing laser is solved; furthermore, the laser diodes are arranged into an upper layer and a lower layer, so that the layout is compact, and the volume of the laser is reduced; furthermore, the outlet direction of the optical fiber is set to be parallel to the plugging direction of the laser diode, so that the bending radius of the optical fiber during installation is increased, and the risk of breakage caused by hardening of the optical fiber after electrification is reduced; meanwhile, the arrangement facilitates the installation of optical fibers and improves the installation efficiency.
Description
Technical Field
The utility model relates to a laser instrument and laser direct write exposure machine of laser direct write exposure machine belongs to laser direct write exposure machine technical field.
Background
Laser direct writing is a process of performing variable dose exposure on a resist material on a substrate surface by using a laser beam with variable intensity, and a laser plays a crucial role in the exposure process as an energy source in a laser direct writing exposure machine.
The Laser is usually enclosed in a housing, and since a large amount of heat is emitted in a Laser working state, if the heat dissipation is not good, the service life of the Laser is reduced or the Laser is damaged, so that the heat dissipation is a priority in Laser Direct Image (LDI).
An existing laser usually adopts a water cooling mode for heat dissipation, for example, a water cooling circulation device is arranged in an invention patent with an authorization publication number of CN 106019859B and an invention name of 'a high-power ultraviolet semiconductor laser of a laser direct writing exposure machine', and the water cooling circulation device is arranged in the laser, because of the complexity of an internal cooling circuit, the water cooling circulation device needs to be internally provided with a large number of joints such as an upper right-angle quick joint, a lower straight-through quick joint, an upper straight-through quick joint and the like, so that the risk of joint water leakage inevitably exists, once water leakage occurs, the laser is stopped, and a new laser needs to be replaced for a long time, and production is influenced.
In addition, the size of the laser is directly related to the space it occupies in the LDI device, and if the laser size is too large, it is not conducive to ease of production or transportation.
In addition, the optical fiber is adopted in the laser direct writing equipment to complete the transmission of laser, the optical fiber is flexible after being newly manufactured, but the optical fiber is hardened and becomes brittle after being electrified for a period of time, so that severe bending (such as bending of more than 80 degrees) needs to be avoided as much as possible during installation so as to ensure that the optical fiber can be disassembled and assembled for reuse when the laser diode is locally replaced or replaced when the service life is up to 8000-1000 hours.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a laser instrument and laser direct writing exposure machine of laser direct writing exposure machine.
The utility model provides a pair of laser direct writing exposure machine, including laser diode, control module and casing, laser direct writing exposure machine's laser instrument still includes: the laser diode fixing module comprises a double-layer laser diode fixing module, wherein the laser diodes are arranged on the double-layer laser diode fixing module in two layers, a cooling pipe is arranged between the two layers of the double-layer laser diode fixing module, and the plugging direction of the laser diodes is consistent with the direction of an optical fiber outlet;
the laser diode, the control module, the double-layer laser diode fixing module and the cooling pipe are all arranged inside the shell.
In one embodiment, the control module comprises an upper-layer radiating piece, a lower-layer radiating piece and a control board card, wherein the control board card is arranged between the upper-layer radiating piece and the lower-layer radiating piece, and a cooling pipe is arranged at the side edge between the upper-layer radiating piece and the lower-layer radiating piece; the cooling pipe that side department set up between the upper and lower layer radiating piece and the cooling pipe that sets up between the double-deck fixed module of laser diode structure as an organic whole, the cooling pipe is used for right the control integrated circuit board with laser diode dispels the heat.
In one embodiment, the double-layer laser diode fixing module is arranged on one side of the control module; the cooling pipe passes through two opposite side edges of the control module, passes through the double-layer laser diode fixing modules simultaneously, and is located between the double-layer laser diode fixing modules.
In one embodiment, the double-layer laser diode fixing module comprises a fixing seat and a cushion block, and the upper layer and the lower layer of laser diodes are fixed together by pressing the cooling pipe through the fixing seat.
In one embodiment, the cooling tube is a water cooled tube.
In one embodiment, the cooling tube is a copper tube.
In one embodiment, the laser of the laser direct write exposure machine further comprises: and the air cooling device is arranged at the control module.
In one embodiment, the air cooling device is a fan.
In one embodiment, the laser of the laser direct write exposure machine further comprises: and the temperature sensor is connected with the control board card and is used for monitoring the temperature of the laser diode in real time.
The application also provides a laser direct-writing exposure machine, the laser of laser direct-writing exposure machine is the laser of above-mentioned laser direct-writing exposure machine.
The application also provides a laser direct-writing exposure machine, the laser direct-writing exposure machine has the laser of above-mentioned laser direct-writing exposure machine.
The utility model has the advantages that:
the utility model provides a laser of laser direct writing exposure machine, through having simplified laser internal structure and overall arrangement, reduced the joint figure in the cooling circuit, set up the joint that must set up outside the laser simultaneously, provide a water cooling plant of no water pipe joint in the laser inside, solved the problem that has the risk of leaking and lead to shutting down in the existing laser; furthermore, the laser diodes are arranged into an upper layer and a lower layer, so that the layout is compact, and the volume of the laser is reduced; furthermore, the outlet direction of the optical fiber is set to be parallel to the plugging direction of the laser diode, so that the bending radius of the optical fiber during installation is increased, and the risk of breakage caused by hardening of the optical fiber after electrification is reduced; meanwhile, the arrangement facilitates the installation of optical fibers and improves the installation efficiency.
Drawings
Fig. 1 is a schematic view of a laser direct writing exposure machine provided by the present invention;
FIG. 2 is a schematic view of the diode layout on top and bottom layers;
FIG. 3 is a schematic diagram of the connection relationship between the upper and lower layer diodes and the diode fixing module;
the device comprises a shell 1, an optical fiber 2, a laser diode 3, a laser diode 4, a double-layer laser diode fixing module, a bottom board card heat dissipation piece 5, a fan 6, an upper board card heat dissipation piece 7, a control board card 8, a cooling pipe 9, a fixing seat I10, a fixing seat I11, a lower layer laser diode array 12, a cushion block 13, a fixing seat II 13, a fixing seat III 14, an upper layer laser diode array 15, a fixing seat IV 16, a water inlet end temperature sensor mounting position 17 and a water outlet end temperature sensor mounting position 18.
Detailed Description
The following is a detailed description of the present invention.
Example 1
Referring to fig. 1 to 3, fig. 1 is a schematic diagram of a laser direct writing exposure machine according to the present invention; FIG. 2 is a schematic view of the diode layout on top and bottom layers; fig. 3 is a schematic diagram of the connection relationship between the upper and lower layer laser diodes and the double layer laser diode fixing module.
The laser of the laser direct writing exposure machine comprises a shell 1, an optical fiber 2, a laser diode 3, a laser diode 4, a double-layer laser diode fixing module, a lower-layer radiating piece 5, a fan 6, an upper-layer radiating piece 7, a control board card 8, a cooling pipe 9, a fixing seat I10, a lower-layer laser diode array 11, a cushion block 12, a fixing seat II 13, a fixing seat III 14, an upper-layer laser diode array 15, a fixing seat IV 16, a water inlet end temperature sensor mounting position 17 and a water outlet end temperature sensor mounting position 18.
All the components are packaged in a shell 1, as can be seen from reference to fig. 3, a plurality of laser diodes 3 are arranged in an upper-layer structure and a lower-layer structure and are double-layer laser diodes, a cooling pipe 9 is arranged between the two layers of the double-layer laser diodes, and the plugging direction of the laser diodes is consistent with the outlet direction of the optical fiber 2.
The control module comprises an upper-layer radiating piece 7, a lower-layer radiating piece 5 and a control board card 8, wherein the control board card 8 is arranged between the upper-layer radiating piece 7 and the lower-layer radiating piece 5, and a cooling pipe 9 is arranged at the side edge between the upper-layer radiating piece 7 and the lower-layer radiating piece 5; the cooling tube 9 that the side department that upper heat dissipation piece 7 and lower floor between the heat dissipation piece 5 set up and the cooling tube 9 that sets up between the double-deck fixed module of laser diode structure as an organic whole, cooling tube 9 is used for right the control integrated circuit board with laser diode dispels the heat.
The double-layer laser diode fixing module is arranged on one side of the control module; the cooling pipe 9 passes through two opposite side edges of the control module, passes through the double-layer laser diode fixing modules simultaneously, and is positioned between the double-layer laser diode fixing modules.
As shown in fig. 1, the cooling tube 9 is in the shape of an "Contraband" reverse in the housing 1 and surrounds three sides of the control module, wherein two sides are opposite and the other side is arranged between the two layers of laser diode fixing modules.
The cooling pipe 9 is a water cooling pipe and is made of copper.
The laser of the laser direct writing exposure machine further comprises: and the air cooling device is arranged at the control module. The air cooling device is a fan 6.
The air cooling device is a fan.
The laser of the laser direct writing exposure machine further comprises: and the temperature sensor is connected with the control panel card through a data line and is used for monitoring the temperature of the laser diode in real time. The temperature sensors comprise two temperature sensors, wherein one temperature sensor is arranged at the mounting position 17 of the water inlet end temperature sensor and is used for acquiring the temperature of the laser diode at the position in real time, and the other temperature sensor is arranged at the mounting position 18 of the water outlet end temperature sensor and is used for acquiring the temperature of the laser diode at the position in real time. The temperature of the laser diodes at the water inlet end and the water outlet end is respectively obtained through two temperature sensors, and whether the temperature of the whole laser diode is too high or not is judged according to the temperature of the laser diodes at the water inlet end and the water outlet end; for example, the set temperature is 30 ℃, and when one of the temperatures exceeds 30 ℃, it is determined that the laser temperature is too high, and the water flow is increased to reduce the temperature (the set temperature of 30 ℃ is an example, and does not represent the set temperature in actual use, and may be a temperature range in actual use).
The double-layer laser diode fixing module comprises four fixing seats and two cushion blocks 12, an upper layer of laser diodes and a lower layer of laser diodes are fixed together by compressing a cooling pipe through the fixing seats, and the four fixing seats are a first fixing seat 10, a second fixing seat 13, a third fixing seat 14 and a fourth fixing seat 16 respectively. As shown in fig. 2, the laser diodes are fixed in the double-layer laser diode fixing module, and are arranged in an upper layer and a lower layer, namely an upper layer laser diode array 15 and a lower layer laser diode array 11; the upper layer laser diode array 15 is fixed on the upper layer through a third fixing seat 14, a cushion block 12 and a fourth fixing seat 16; the lower laser diode array 11 is fixed on the lower layer through a first fixing seat 10, a cushion block 12 and a second fixing seat 13.
The utility model discloses the theory of operation:
water enters from the water inlet of the cooling pipe 9, firstly passes through one side of the control module, then passes through the laser diode region, takes away heat generated by the upper layer of laser diode and the lower layer of laser diode, then reaches the other side of the control module, namely the region where the control board card 8 is located, the heat generated by the chip of the control board card 8 is contacted with the cooling pipe 9 through the upper heat dissipation part 7 and the lower heat dissipation part 5, the heat is taken away, and meanwhile, heat generated by a part of the board card is dissipated through the fan 6.
Referring to fig. 1, it can be known that the outlet direction of the optical fiber 2 is parallel to the plugging direction of the laser diode 3, and compared with the arrangement mode in which the outlet direction of the optical fiber is perpendicular to the plugging direction of the laser diode in the existing laser, the bending radius of the optical fiber 2 during installation is increased, and the risk of breakage caused by hardening after the optical fiber 2 is energized is reduced; meanwhile, the arrangement facilitates the installation of optical fibers and improves the efficiency.
The control board card 8 is cooled in a heat dissipation mode through the combination of the copper pipe 9 and the fan 6, and the heat dissipation efficiency is improved.
The upper layer and the lower layer of laser diodes are fixed together by pressing the copper pipe 9 through the fixing seat, so that a large amount of heat generated by the upper layer of laser diode array 15 and the lower layer of laser diode array 11 is taken away through the copper pipe 9. Ensuring that each laser diode works at a proper temperature, such as 20-30 ℃; meanwhile, a temperature sensor monitors the temperature of the laser diode in real time and feeds the temperature back to the control module, and the control module adjusts the flow rate of water in the copper pipe 9 according to the temperature of the laser diode so as to ensure that the working temperature of the laser diode is kept at 20-30 ℃.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a laser instrument of laser direct write exposure machine, includes laser diode, control module and casing, its characterized in that, laser instrument of laser direct write exposure machine still includes: the laser diode fixing module comprises a double-layer laser diode fixing module, wherein the laser diodes are arranged on the double-layer laser diode fixing module in two layers, a cooling pipe is arranged between the two layers of the double-layer laser diode fixing module, and the plugging direction of the laser diodes is consistent with the direction of an optical fiber outlet;
the laser diode, the control module, the double-layer laser diode fixing module and the cooling pipe are all arranged inside the shell.
2. The laser of the laser direct-write exposure machine according to claim 1, wherein the control module comprises upper and lower heat dissipation members and a control board card, the control board card is disposed between the upper and lower heat dissipation members, and a cooling pipe is disposed at a side edge between the upper and lower heat dissipation members; the cooling pipe that side department set up between the upper and lower layer radiating piece and the cooling pipe that sets up between the double-deck fixed module of laser diode structure as an organic whole, the cooling pipe is used for right the control integrated circuit board with laser diode dispels the heat.
3. The laser of the laser direct write exposure machine according to claim 2, wherein the double-layer laser diode fixing module is disposed at one side of the control module; the cooling pipe passes through two opposite side edges of the control module, passes through the double-layer laser diode fixing modules simultaneously, and is located between the double-layer laser diode fixing modules.
4. The laser of the laser direct-write exposure machine according to claim 3, wherein the double-layer laser diode fixing module comprises a fixing seat and a cushion block, and the upper layer and the lower layer of laser diodes are fixed together by pressing the cooling pipe through the fixing seat.
5. The laser of the laser direct write exposure machine according to claim 4, wherein the cooling tube is a water-cooled tube.
6. The laser of the laser direct write exposure machine according to claim 5, wherein the cooling pipe is a copper pipe.
7. The laser of the laser direct write exposure machine according to claim 6, characterized in that the laser of the laser direct write exposure machine further comprises: and the air cooling device is arranged at the control module.
8. The laser of the laser direct write exposure machine according to claim 7, wherein the air cooling device is a fan.
9. The laser of the laser direct write exposure machine according to claim 4, characterized in that the laser of the laser direct write exposure machine further comprises: and the temperature sensor is connected with the control board card and is used for monitoring the temperature of the laser diode in real time.
10. A laser direct write exposure machine, characterized in that the laser of the laser direct write exposure machine is the laser of the laser direct write exposure machine according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922247648.XU CN210954612U (en) | 2019-12-13 | 2019-12-13 | Laser of laser direct-writing exposure machine and laser direct-writing exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922247648.XU CN210954612U (en) | 2019-12-13 | 2019-12-13 | Laser of laser direct-writing exposure machine and laser direct-writing exposure machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210954612U true CN210954612U (en) | 2020-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922247648.XU Active CN210954612U (en) | 2019-12-13 | 2019-12-13 | Laser of laser direct-writing exposure machine and laser direct-writing exposure machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210954612U (en) |
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2019
- 2019-12-13 CN CN201922247648.XU patent/CN210954612U/en active Active
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