CN220173674U - Heat dissipation device - Google Patents

Abstract

The utility model discloses a heat dissipation device, which comprises an outer shell, a heat dissipation assembly and a connecting end, wherein an accommodating space is formed in the middle of the outer shell; the heat dissipation assembly is accommodated in the accommodating space and is provided with at least one side plate surface, and at least one side plate surface is used for covering an electronic element or being attached to other devices to be dissipated for heat dissipation; the connecting end is used for being electrically connected with an external device, is installed on the heat dissipation assembly and penetrates through the outer shell body, and is used for being electrically connected with the electronic element or the device to be heat-dissipated. The heat dissipation device is used for solving the problem of enhancing the heat dissipation capacity, in particular to the heat dissipation problem of pluggable equipment.

Description

Heat dissipation device

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device.

Background

Along with the continuous increase of the power consumption of electrical equipment, if the power switch and the inductor of the electrical equipment cannot timely dissipate heat generated by the heat dissipation device, the service life of the device can be influenced, and safety accidents can be possibly caused. In order to solve the heat dissipation problem, a heat dissipation device is generally used as an additional device to be additionally installed outside the electrical equipment, or a power device and other loss heat dissipation devices of the electrical equipment are directly installed on the heat dissipation device, or a fan is additionally installed to dissipate heat in an air cooling mode, but most of heat dissipation methods of the heat dissipation devices have the problem of poor heat dissipation capacity, and the heat dissipation efficiency has limitations, so that high-efficiency heat dissipation cannot be realized, and the heat dissipation requirement of the electrical equipment with higher power is larger, so that the current heat dissipation device cannot meet the gradually-increased heat dissipation requirement.

Disclosure of Invention

The utility model provides a heat dissipating device for enhancing heat dissipating capability.

In order to achieve the above object, the present utility model provides a heat dissipating device comprising:

the middle part of the outer shell is provided with an accommodating space;

the heat dissipation assembly is accommodated in the accommodating space and is provided with at least one side plate surface, and at least one side plate surface is used for covering an electronic element or being attached to other devices to be cooled for heat dissipation; and

the connecting end is used for being electrically connected with an external device, is installed on the heat dissipation assembly and penetrates through the outer shell body, and is used for being electrically connected with the electronic element or the device to be heat-dissipated.

In an embodiment, the heat dissipating assembly includes at least one of a coolant tube, a heat pipe.

In one embodiment, the heat dissipation assembly includes a substrate and a heat dissipation channel formed in a middle portion of the substrate.

In one embodiment, the heat dissipating assembly includes a coolant tube disposed along at least a portion of the spatial extension of the heat dissipating channel.

In one embodiment, the coolant pipes have a plurality of groups, and the plurality of groups of coolant pipes are connected end to end in sequence.

In an embodiment, the coolant tube includes a first cooling segment extending in a first direction and a second cooling segment extending in a second direction, the first cooling segment in communication with the second cooling segment.

In one embodiment, the heat dissipation assembly includes a heat pipe disposed along at least a portion of the spatial extension of the heat dissipation channel.

In an embodiment, the heat pipe extends in the heat dissipation channel along the first direction.

In an embodiment, the heat dissipating assembly further comprises a coolant tube extending in the second direction, the coolant tube being provided with a coolant interface protruding out of the outer housing.

In an embodiment, the heat dissipating device further comprises a heat sink disposed on the outer housing.

Compared with the prior art, the utility model has the following beneficial effects:

the middle part of the outer shell is provided with a containing space, the heat dissipation assembly is accommodated in the containing space, at least one side plate surface of the heat dissipation assembly is used for covering an electronic element or being attached to other devices to be cooled and dissipated, so that the electronic element and the devices to be cooled and dissipated are fully cooled and dissipated, the influence of the heat dissipation on the service life of the devices and even safety accidents are avoided, the heat dissipation effect and the heat dissipation efficiency are effectively optimized, uniform heat dissipation is realized, and the heat dissipation capacity is improved so as to meet the heat dissipation requirement of high-power electrical equipment; the connecting end is used for being connected with external device electricity, and the connecting end is installed and is set up at radiator unit and run through the shell body, avoids appearing connecing the inconvenient problem of electric.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram illustrating an embodiment of a heat dissipating device according to the present utility model;

FIG. 2 is a cross-sectional view of one embodiment in the direction A-A of FIG. 1;

FIG. 3 is a cross-sectional view of another embodiment in the direction A-A of FIG. 1;

FIG. 4 is a cross-sectional view of yet another embodiment in the direction A-A of FIG. 1;

FIG. 5 is a cross-sectional view of yet another embodiment in the direction A-A of FIG. 1;

fig. 6 is a cross-sectional view of yet another embodiment in the direction A-A of fig. 1.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Outer casing	2213	Roundabout pipe section
101	First end	222	Heat pipe
				102	Second end	231	Substrate board
110	Accommodating space	232	Heat dissipation channel
				200	Heat dissipation assembly	300	Cooling liquid interface
210	Side plate surface	310	Liquid inlet
				221	Cooling liquid pipe	320	Liquid outlet
2211	First cooling section	400	Radiator
				2212	Second cooling section

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if all the directional indicators in the embodiments of the present utility model are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, if the specific posture is changed, the directional indicators are correspondingly changed.

If the description of "first", "second", etc. in this disclosure is for descriptive purposes only, it is not to be construed as indicating or implying a relative importance thereof or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. If the description of "a and/or B" is referred to in the present utility model, it means that either scheme a or scheme B is included, or both scheme a and scheme B are included. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The utility model provides a heat dissipation device.

Referring to fig. 1 to 6, the heat dissipating device includes an outer case 100, a heat dissipating assembly 200, and a connection terminal (not shown).

The middle part of the outer shell 100 is provided with an accommodating space 110;

the heat dissipation assembly 200 is accommodated in the accommodating space 110, and the heat dissipation assembly 200 has at least one side plate surface 210, and at least one side plate surface 210 is used for covering an electronic component or attaching to other devices to be heat-dissipated for heat dissipation.

The heat dissipation assembly 200 is disposed in the accommodating space 110 to uniformly dissipate heat. At least one side plate surface 210 of the heat dissipation assembly 200 is used for covering an electronic element or laminating heat dissipation with other heat dissipation devices, and is used for fully cooling and dissipating heat of the covered electronic element or the heat dissipation devices to be subjected to laminating heat dissipation, so that the influence of the heat dissipation on the service life of the devices and even safety accidents caused by insufficient heat dissipation can be avoided, the heat dissipation effect and the heat dissipation efficiency are optimized, uniform heat dissipation is realized, the heat dissipation capacity is improved, and the heat dissipation requirement of high-power electrical equipment is met.

The connection terminal is used for being electrically connected with an external device, and is installed at the heat dissipation assembly and penetrates through the outer shell 100 to be electrically connected with the electronic component or the device to be heat-dissipated.

Optionally, one or more of the connection terminals may be provided at any position of the heat sink assembly 200 and through the outer housing 100 for convenience of power. Through the setting of link, avoid the cable winding that needs to set up in addition the electricity connecting wire and electronic component, wait the inconvenient problem of heat dissipation device connect.

The external device may be an external power supply, a communication device, a control device, or other electrical equipment suitable for practical use. Further, the connection end may be fixedly mounted on the outer casing 100, or detachably mounted on the outer casing 100 by plugging or the like. And the electronic element and the electric interface of the device to be heat-dissipated are electrically connected with the connecting end. Optionally, the connection end is used for electrically connecting with the device to be cooled so as to enable the electronic element and the device to be cooled to be powered on, thereby realizing power on and avoiding the problem of inconvenient power on; further, the connection end can be further used for being connected with a communication end of the device to be cooled and used for realizing signal transmission with other equipment. As a specific example, the connection terminal is used for electrically connecting with a connection terminal of an external device, specifically, one of the connection terminal and the external connection terminal is a male terminal, the other is a female terminal, wherein one of the male terminal and the female terminal is an elastic connection terminal, and the other is a non-elastic conductor, and the two terminals are electrically connected by opposite insertion.

It should be noted that the heat dissipating device of the present utility model may be applied to an electrical device waiting for heat dissipation, where the device waiting for heat dissipation may be one or a combination of more of a server, a power host, and a battery. The heat dissipation device can be used as a part of electric equipment to be dissipated, and can also be directly used as electric equipment with a heat dissipation function. The electrical apparatus includes a plurality of electronic components and other devices to be heat-dissipated, and the electronic components and the devices to be heat-dissipated each include a plurality of devices and other circuit constituent structures for connecting the plurality of devices, so as to ensure the normal operation of the electrical apparatus and the heat dissipating assembly 200.

In one embodiment, the heat dissipating assembly 200 includes at least one of a coolant tube 221, a heat pipe 222.

That is, the heat dissipation assembly 200 may employ only any one or a combination of the coolant pipe 221 and the heat pipe 222, and be installed at any position within the accommodating space 110. The number, combination, installation position, etc. of the coolant pipes 221 and the heat pipes 222 are not limited herein, depending on the actual arrangement. Through cooling liquid pipe 221 liquid cooling heat dissipation and heat pipe 222 heat transfer, when realizing quick high-efficient heat dissipation, reduce the occupation of radiator unit 200 to the space, so, still can conveniently assemble, process, avoid adopting the air cooling device such as fan to lead to the problem that the space requirement is too high, the noise is big, inconvenient processing.

It should be noted that, the heat dissipation assembly 200 may be mounted in the accommodating space 110 in any manner suitable for practical use, such as hanging, sleeving, inserting, clamping, assembling, etc.

Referring to fig. 2 to 6, in an embodiment, the heat dissipation assembly 200 includes a substrate 231 and a heat dissipation channel 232, the heat dissipation channel 232 being formed in a middle portion of the substrate 231.

It will be appreciated that the base plate 231 is configured to form the side plate face 210 of the illustrated heat sink assembly 200.

The setting of the heat dissipation channel 232 makes the whole temperature of the accommodating space 110 uniform, realizes sufficient cooling and heat dissipation, avoids performance loss of electronic elements and other devices to be heat-dissipated attached to the side plate surface 210 of the heat dissipation assembly 200 caused by insufficient heat dissipation and safety accidents caused by poor heat dissipation effect, effectively optimizes heat dissipation effect and heat dissipation efficiency, and improves heat dissipation capacity.

The heat sink assembly 200 includes at least one of a coolant tube 221, a heat pipe 222. Based on the above example, the heat dissipation devices with heat dissipation function such as the coolant tube 221 and the heat pipe 222 may be accommodated in the heat dissipation channel 232, and for convenience of processing and assembly, the positioning structures such as the partition plate and the pad member may be disposed in the heat dissipation channel 232, so that the heat dissipation devices such as the coolant tube 221 and the heat pipe 222 are positioned and installed in the heat dissipation channel 232, and the positional deviation is avoided.

As a specific example, for convenience in material drawing and processing, the substrate 231 may be a substrate structure with good heat dissipation performance, such as an aluminum substrate, and the electronic component or the device to be heat-dissipated may be disposed at any position of the substrate 231 of any side surface 210 of the heat dissipating assembly 200, so that the heat dissipation capability may be effectively improved, the problem of too high device temperature caused by poor heat dissipation performance may be solved, and the influence of too high temperature on the service life of the device may be avoided. Optionally, the substrate 231 may be a monolithic plate or an integrally formed structure formed by combining multiple plates, and the heat dissipation channel 232 is formed in the middle of the substrate 231 and is used for accommodating other heat dissipation devices with heat dissipation functions, such as the coolant tube 221 and the heat pipe 222; the heat dissipation assembly 200 may also include a plurality of substrates 231, where the substrates 231 are sequentially connected and are used to form a combined structure by splicing and enclosing, and the heat dissipation channel 232 is formed in the middle of the combined structure formed by enclosing the substrates 231 and is used to house other heat dissipation devices with heat dissipation functions, such as the coolant tube 221 and the heat pipe 222.

It will be appreciated that, in the present utility model, two directions parallel to the placement plane and disposed perpendicular to each other are respectively taken as a first direction and a second direction, and referring to fig. 1 to 6, an arrow a may be taken as a first direction in the direction shown, and an arrow b may be taken as a second direction in the direction shown, where the first direction and the second direction are perpendicular to each other. In addition, according to practice, the left-to-right direction in the set state shown in fig. 1 is not excluded as the first direction, and the outside-to-inside direction in the set state is taken as the second direction. Alternatively, when a plurality of substrates 231 are provided, one or more substrates 231 are provided on each side plate surface 210 of the illustrated heat dissipation assembly 200 for convenience of processing, and when a plurality of substrates 231 are provided, the plurality of substrates 231 are arranged in the first direction.

Referring to fig. 2-4, in one embodiment, the heat dissipating assembly 200 includes a coolant tube 221, the coolant tube 221 extending along at least a portion of the space of the heat dissipating channel 232.

It is understood that the heat sink assembly 200 includes one or more coolant lines 221. One or more coolant tubes 221 are disposed anywhere within the heat dissipation channel 232 and extend along at least a portion of the space of the heat dissipation channel 232. Alternatively, when a plurality of coolant pipes 221 are provided, the plurality of coolant pipes 221 may be provided to extend in the same or different directions. The position of the coolant pipe 221 may be determined according to the actual position, and is not limited herein.

As a specific example, the coolant pipe 221 is disposed to extend in the heat dissipation channel 232 in the first direction.

Referring to FIG. 2, in one embodiment, the coolant tubes 221 have a plurality of sets, and the plurality of sets of coolant tubes 221 are connected end to end in sequence. The cooling fluid flows along the plurality of groups of cooling fluid pipes 221 to further optimize the heat dissipation performance and enhance the heat dissipation capability.

Optionally, the coolant lines 221 may have multiple sets, each set of coolant lines 221 including one or more coolant lines 221. The plurality of coolant tubes 221 may be in direct communication or may be in communication via tubing. Further, for communication, a connection pipe section, a bypass pipe section 2213, etc. are further provided between the adjacent coolant pipes 221. Taking the roundabout segment 2213 as an example, one or more roundabout segments 2213 are provided, and when one roundabout segment 2213 is provided, the roundabout segment 2213 is communicated between two adjacent coolant pipes 221; when there are multiple bypass pipe segments 2213, any two adjacent bypass pipe segments 2213 are alternately arranged at two ends of the coolant pipes 221, that is, the bypass pipe segments 2213 are connected between any two adjacent coolant pipes 221, so that the multiple coolant pipes 221 of each group are connected to form a bypass curve.

The connection manner between two adjacent sets of coolant pipes refers to the connection manner between the plurality of coolant pipes, and will not be described herein.

Referring to fig. 3 and 4, in an embodiment, the coolant pipe 221 includes a first cooling segment 2211 extending in a first direction and a second cooling segment 2212 extending in a second direction, and the first cooling segment 2211 communicates with the second cooling segment 2212.

The first cooling segments 2211 extend along the first direction, one or more first cooling segments 2211 are provided, and each first cooling segment 2211 may be configured as a pipe segment or may be configured to include a plurality of branch pipe segments. When the plurality of first cooling segments 2211 are provided, the plurality of first cooling segments 2211 may be provided separately or may be communicated with each other.

One or more second cooling segments 2212 are provided, and each second cooling segment 2212 may be configured as a pipe segment or may be configured to include a plurality of branch pipe segments. The second cooling segments 2212 may be connected between all the first cooling segments 2211, or may be connected between any of the plurality of first cooling segments 2211, and are not limited herein according to actual arrangement.

Referring to fig. 3 and 4, as a specific embodiment, the outer case 100 is provided with a first end 101 and a second end 102 opposite to each other along a first direction, two second cooling segments 2212 are shown, and two second cooling segments 2212 are separately provided at the first end and the second end of the first cooling segment 2211, wherein one second cooling segment 2212 is used for being connected to the first end of any part or all of the first cooling segments 2211 in the plurality of first cooling segments 2211, and the other second cooling segment 2212 is used for being connected to the second end of any part or all of the first cooling segments 2211 in the plurality of first cooling segments 2211. Wherein a second cooling segment 2212 connected to a first end of the first cooling segment 2211 is arranged near the first end 101 of the outer housing 100, the second cooling segment 2212 is provided with a cooling liquid interface 300 extending out of the outer housing 100.

Alternatively, the first cooling segment 2211 may be installed at any position within the heat dissipation channel 232, and specifically, the position of the first cooling segment 2211 may be set according to the structure, shape, etc. of the heat dissipation channel 232, which is not limited herein. The second cooling segment 2212 is vice versa and will not be described in detail herein.

Optionally, the cooling liquid interface 300 includes a liquid inlet 310 and a liquid outlet 320, the liquid inlet 310 is used for liquid inlet, the liquid outlet 320 is used for liquid outlet, and the positions of the liquid inlet 310 and the liquid outlet 320 may be specifically set and replaced according to the actual situation, which is not limited herein.

It should be noted that, when the second cooling section 2212 is provided with a plurality of branches, the branches may be specifically performed in the heat dissipation channel 232; alternatively, the portion of the second cooling segment 2212 that exits the outer housing 100 through the coolant port 300 is split. Further, each branch is provided with a liquid inlet end and a liquid outlet end, and the branches are communicated end to end in sequence; the liquid inlet ends (or liquid outlet ends) of the branches can also be connected in parallel.

Of course, the cooling fluid port 300 may be disposed on the first cooling segment 2211 or other components of the cooling fluid tube 221 according to actual needs, and extend out of the outer housing 100 to achieve fluid intake and fluid discharge, and the position of the cooling fluid port 300 may be specifically set according to actual needs, which is not limited herein.

Referring to fig. 5 and 6, in one embodiment, the heat dissipating assembly 200 includes a heat pipe 222, and the heat pipe 222 is disposed along at least a portion of the space of the heat dissipating channel 232.

Optionally, the heat dissipating assembly 200 includes one or more heat pipes 222. One or more heat pipes 222 are disposed within the heat dissipation channel 232 and extend along at least a portion of the space of the heat dissipation channel 232. Alternatively, when a plurality of heat pipes 222 are provided, the plurality of heat pipes 222 may be provided to extend in the same or different directions. The position of the heat pipe 222 may be specifically set according to the structure, shape, etc. of the heat dissipation channel 232, which is not limited herein.

Referring to fig. 4 and 5, as a specific embodiment, the heat pipe 222 is disposed to extend in the heat dissipation channel 232 along the first direction.

It is understood that each heat pipe 222 extends along the first direction, and when a plurality of heat pipes 222 are disposed, the plurality of heat pipes 222 are disposed in parallel with each other at intervals, and the heat pipes 222 extend from the hot end to the cold end to form a heat exchange area as shown by a dotted line at a position of the heat dissipation channel 232 near the first end 101 of the outer housing 100, so that heat dissipation performance can be further optimized and heat dissipation capability can be improved.

Referring to fig. 4, on the basis of the above example, the heat dissipating assembly 200 further includes a coolant pipe 221 extending in the second direction, and the coolant pipe 221 is provided with a coolant port 300 extending out of the outer housing 100.

Specifically, the coolant tube 221 is disposed proximate the first end 101 of the outer housing 100 to further optimize heat dissipation and improve heat dissipation.

Optionally, the cooling liquid interface 300 includes a liquid inlet 310 and a liquid outlet 320, the liquid inlet 310 is used for liquid inlet, and the liquid outlet 320 is used for liquid outlet. The coolant ports 300 of the coolant lines 221 may be disposed at any location of the coolant lines 221 and through the outer housing 100. Specifically, according to the actual situation, the coolant tube 221 is disposed through the first end 101 of the outer housing 100, and the flow direction of the coolant is controlled by adjusting the positions of the liquid inlet 310 and the liquid outlet 320, so as to further improve the heat dissipation efficiency. The positions of the liquid inlet 310 and the liquid outlet 320 may be actually set and replaced, which is not limited herein.

Referring to fig. 1, in an embodiment, the heat dissipating device further includes a heat sink 400, and the heat sink 400 is disposed on the outer case 100.

Optionally, the heat sink 400 may be any heat dissipation device suitable for practical use, such as heat dissipation teeth, heat dissipation fan, etc., to achieve uniform heat dissipation, optimize heat dissipation effect, and improve heat dissipation efficiency.

As a specific example, the outer housing 100 is provided with opposite first and second ends 101 and 102 along the first direction, and the heat sink 400 is provided at the first end 101 of the outer housing 100. When the heat sink 400 adopts heat dissipation teeth, for convenience in processing, a plurality of heat dissipation teeth are provided, and the plurality of heat dissipation teeth are arranged at the first end 101 of the outer housing 100 at intervals along the second direction. For carrying heat away.

It can be appreciated that the heat dissipation teeth can be arranged as heat dissipation fins, so that heat in the accommodating space 110 can be dissipated through the heat dissipation teeth, the heat exchange area between the heat dissipation teeth and air is increased, the heat transfer between the heat dissipation device and the surrounding environment is enhanced, and the heat in the accommodating space 110 is rapidly conducted out through the heat dissipation teeth in a radiation manner, so that the heat dissipation performance can be further optimized, and the heat dissipation efficiency is improved.

The heat dissipating device according to the present utility model may set the shape and size of the side plate surface 210 of the heat dissipating component 200, the flow channel of the internal pipeline of the heat dissipating component 200, etc. according to the shape and size of the accommodating space 110, and the heat dissipating component 200 may include a cooling liquid pipe 221, a heat pipe 222, or a combination of both. The specific arrangement is not limited herein, and may be any practical arrangement.

The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. A heat sink, comprising:

the middle part of the outer shell is provided with an accommodating space;

the heat dissipation assembly is accommodated in the accommodating space and is provided with at least one side plate surface, and at least one side plate surface is used for covering an electronic element or being attached to other devices to be cooled for heat dissipation; and

the connecting end is used for being electrically connected with an external device, is installed on the heat dissipation assembly and penetrates through the outer shell body, and is used for being electrically connected with the electronic element or the device to be heat-dissipated.

2. The heat sink of claim 1, wherein the heat dissipating component comprises at least one of a coolant tube, a heat pipe.

3. The heat dissipating device of claim 1, wherein the heat dissipating assembly comprises a substrate and a heat dissipating channel formed in a middle portion of the substrate.

4. The heat sink of claim 3, wherein the heat dissipating assembly comprises a coolant tube disposed along at least a portion of the spatial extension of the heat dissipating channel.

5. The heat sink of claim 4 wherein there are a plurality of sets of coolant tubes, the plurality of sets of coolant tubes being connected end to end in sequence.

6. The heat sink of claim 4, wherein the coolant tube comprises a first cooling segment extending in a first direction and a second cooling segment extending in a second direction, the first cooling segment in communication with the second cooling segment.

7. A heat sink according to claim 3, wherein the heat dissipating component comprises a heat pipe extending along at least part of the space of the heat dissipating channel.

8. The heat sink of claim 7, wherein the heat pipe extends in the heat dissipation channel along the first direction.

9. The heat sink of claim 7, wherein the heat sink assembly further comprises a coolant tube extending in a second direction, the coolant tube being provided with a coolant port extending out of the outer housing.

10. The heat sink according to any one of claims 1-9, further comprising a heat sink provided on the outer housing.