CN108123614B - Power module - Google Patents
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- CN108123614B CN108123614B CN201611072511.XA CN201611072511A CN108123614B CN 108123614 B CN108123614 B CN 108123614B CN 201611072511 A CN201611072511 A CN 201611072511A CN 108123614 B CN108123614 B CN 108123614B
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Abstract
The invention provides a power module, which comprises a radiator; the setting is in lining board unit on two at least sides of radiator, the lining board unit has the lining board and fixed the setting is in power semiconductor chip on the lining board, wherein, the lining board contact sets up on the side of radiator, through setting up the lining board on two at least sides of radiator, has reduced the thermal resistance between power semiconductor chip and the radiator, has improved this power module's radiating efficiency, simultaneously, all is provided with lining board unit on two at least sides of radiator, helps reducing power module's volume and weight.
Description
Technical Field
The invention relates to the technical field of power electronics, in particular to a power module for rail transit.
Background
The power semiconductor device is widely applied to the fields of rail transit, industrial frequency conversion and the like, but the standard packaging power semiconductor device only has the function of a switching tube and is not high in integration level. The converter module, which is one of the core components of the converter, is composed of a standard packaged power semiconductor device, a heat sink, a low-inductance bus bar, a gate driver, a structural member, and the like, and has many imperfect points in the aspects of power density, intellectualization, convenient application, and the like due to the limitations of the structural form, the device layout, and the device function.
Disclosure of Invention
The present invention is directed to a power module, which solves some or all of the above-mentioned problems of the prior art. The power module is high in integration level and good in heat dissipation effect.
According to an aspect of the present invention, there is provided a power module including:
a heat sink having a heat-dissipating structure,
a backing plate unit arranged on at least two sides of the heat sink, the backing plate unit having a backing plate and a power semiconductor chip fixedly arranged on the backing plate,
wherein the lining plate is arranged on the side surface of the radiator in a contact way.
In one embodiment, the backing units are disposed on first and second sides of the heat sink with the first and second sides being distributed in opposition.
In one embodiment, a direct current positive copper bar and an alternating current copper bar are arranged on the lining board unit of one of the first side surface and the second side surface of the radiator, a direct current negative copper bar and an alternating current copper bar are arranged on the lining board unit of the other radiator, the direct current positive copper bar and the alternating current copper bar on the same side are partially overlapped plate-shaped, and the direct current negative copper bar and the alternating current copper bar on the same side are partially overlapped plate-shaped.
In one embodiment, the direct current positive copper bar, the direct current negative copper bar and the alternating current copper bar are provided with pins for being connected with the conducting layer of the lining plate unit, and the direct current positive copper bar close to the lining plate unit or the alternating current copper bar on the same side are provided with avoiding holes for the pins on the direct current positive copper bar far away from the lining plate unit or the alternating current copper bar on the same side to pass through, and meanwhile, the direct current negative copper bar close to the lining plate unit or the alternating current copper bar on the same side are provided with avoiding holes for the pins on the direct current negative copper bar far away from the lining plate unit or the alternating current copper bar on the same side to pass through.
In one embodiment, a direct current positive electrical connector for connecting with a direct current positive copper bar, a direct current negative electrical connector for connecting with a direct current negative copper bar and an alternating current electrical connector for connecting with an alternating current copper bar are arranged at the first end of the heat sink, wherein the direct current positive electrical connector, the direct current negative electrical connector and the alternating current electrical connector are configured as plug-in electrical connectors.
In one embodiment, a coolant inlet and a coolant outlet are provided at the first end of the radiator, and a male-female connector is provided on the coolant inlet and the coolant outlet.
In one embodiment, an end housing is provided at the first end of the heat sink, and a direct current positive electrical connector, a direct current negative electrical connector, an alternating current electrical connector, and a male-female coupler pass through the end housing.
In one embodiment, a first shell is arranged on a first side face of the radiator, the first shell, the end shell and the radiator form a first containing cavity, the direct-current positive copper bar, the alternating-current copper bar and the lining board unit are located in the first containing cavity, a second shell is arranged on a second side face of the radiator, the second shell, the end shell and the radiator form a second containing cavity, and the direct-current negative copper bar, the alternating-current copper bar and the lining board unit are located in the second containing cavity.
In one embodiment, the control circuit boards are disposed on the outer sides of the first and second housings, and the control circuit boards on both sides are electrically connected.
In one embodiment, a third housing and a fourth housing are respectively arranged on the outer sides of the first housing and the second housing, the third housing and the first housing form a third accommodating cavity for accommodating the control circuit board, and the fourth housing and the second housing form a fourth accommodating cavity for accommodating the control circuit board.
In one embodiment, the first containing cavity and the second containing cavity are filled with insulating materials.
In one embodiment, a temperature sensor in signal connection with the control circuit board is also included, and the temperature sensor can be disposed on the backing block.
In one embodiment, the device further comprises a current sensor in signal connection with the control circuit board, wherein the current sensor is close to the alternating current connector.
In one embodiment, the screw rod passes through the third shell and the fourth shell and penetrates through the end shell, and one end of the screw rod extends out of the first end face of the end shell.
According to another aspect of the present invention, there is provided a power module including:
a heat sink having a heat-dissipating structure,
a backing unit having backing plates disposed on first and second sides of the heat sink in contact and power semiconductor chips fixedly disposed on the backing plates,
the direct-current positive copper bar and the alternating-current copper bar are arranged on one lining board unit of the first side surface and the second side surface of the radiator, the direct-current negative copper bar and the alternating-current copper bar are arranged on the other lining board unit, the direct-current positive copper bar, the direct-current negative copper bar and the alternating-current copper bar are all electrically connected with the conducting layer of the lining board unit,
a direct current positive connector arranged at the first end of the radiator and used for being connected with the direct current positive copper bar, a direct current negative connector used for being connected with the direct current negative copper bar and an alternating current connector used for being connected with the alternating current copper bar, wherein the direct current positive connector, the direct current negative connector and the alternating current connector are constructed into a plug-in type electric connector,
a first end shell disposed at the heat sink,
arranging a first shell on a first side surface of the radiator, wherein the first shell, the end shell and the radiator form a first accommodating cavity, the direct-current positive copper bar, the alternating-current copper bar on the first side surface of the radiator and the lining board unit are arranged in the first accommodating cavity, arranging a second shell on a second side surface of the radiator, wherein the second shell, the end shell and the radiator form a second accommodating cavity, and the direct-current negative copper bar, the alternating-current copper bar on the second side surface of the radiator and the lining board unit are arranged in the second accommodating cavity,
control circuit boards disposed outside the first and second housings and electrically connected at both sides,
a current sensor in signal connection with the control circuit board, the current sensor being proximate to the AC electrical connector,
and the temperature sensor is in signal connection with the control circuit board and can be arranged on the lining plate unit.
Compared with the prior art, the power module has the advantages that the lining plate is arranged on the side face of the radiator in a contact mode, so that the thermal resistance between the power semiconductor chip and the radiator is reduced, and the radiating efficiency of the power module is improved. At the same time, the provision of the backing units on at least two sides of the heat sink contributes to a reduction in the volume and weight of the power module.
Drawings
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawing figures, wherein:
fig. 1 shows an exploded view of a power module according to the invention;
fig. 2 shows a perspective view of a power module according to the invention;
in the drawings, like parts are designated with like reference numerals, and the drawings are not drawn to scale.
Detailed Description
The invention will be further explained with reference to the drawings.
Fig. 1 shows an exploded view of a power module 100 according to the invention. As shown in fig. 1, the power module 100 includes a heat sink 1 and a backing unit 2. The backing unit 2 includes a backing 21 and a power semiconductor chip 22 fixedly mounted on the backing 21. On at least two sides of the heat sink 1, backing plate units 2 are provided.
The backing plate 21 of the power module 100 is arranged directly on the heat sink 1, avoiding the use of standard substrates for packaging power semiconductor devices. This arrangement is advantageous in reducing the thermal resistance. At the same time, this arrangement makes the structure of the power module 100 more compact, which helps to reduce the volume and weight of the power module 100. In addition, the lining plate units 2 are arranged on at least two side surfaces of the radiator 1, so that the utilization area of the radiator 1 can be increased, and the power density of the power module can be further improved.
In a preferred embodiment, the backing plate units 2 are arranged on two sides of the heat sink 1, and the two sides are distributed oppositely. It should be noted that, for the convenience of description, the two sides are defined as a "first side" and a "second side".
In order to improve the space utilization of the heat sink 1, the body of the heat sink 1 has a rectangular box shape. In the present application, the upper surface of the heat sink 1 in fig. 1 is taken as a first side surface, and the lower surface is taken as a second side surface. It should be noted again that the backing unit 2 may be disposed on multiple surfaces of the heat sink 1, and the surfaces of the heat sink 1 on which the backing unit 2 is disposed are not limited to the relative distribution.
Preferably, the backing plates 21 may be directly fixed to the first and second sides of the heat sink 1 by welding. The power semiconductor chip 22 may be disposed on the backing plate 21 by soldering. This connection is simple and better transfers the heat generated by the power semiconductor chip 22 to the heat sink 1.
Preferably, the lining panel units 2 are distributed in a matrix on both the first and second side of the heat sink 1. By closely arranging the patch units 2 in this manner, the structure of the power module 100 is optimized, contributing to a reduction in the volume of the power module 100 and an increase in its power density.
The direct-current positive copper bar 37 and the alternating-current copper bar 39 are arranged on the first side face of the radiator 1, and the direct-current positive copper bar 37 and the alternating-current copper bar 39 are arranged on the outer side of the lining plate unit 2 and are in electric energy transmission with the lining plate unit 2. The direct-current positive copper busbar 37 and the alternating-current copper busbar 39 are each configured in a plate shape, and the two are partially overlapped in the up-down direction as shown in fig. 1. An insulating layer (not shown) is provided between the two and on the outermost side. Similarly, a direct current negative copper bar 38 and an alternating current copper bar 39 are arranged on the second side surface of the heat sink 1, and the direct current negative copper bar 38 and the alternating current copper bar 39 are arranged on the outer side of the lining board unit 2 and are in electric energy transmission with the lining board unit 2. The dc negative copper bar 38 and the ac copper bar 39 on the same side are both configured in a plate shape, and are partially overlapped in the up-down direction as shown in fig. 1, and an insulating layer (not shown) is provided between them and on the outermost side. And the negative dc copper bar 38 is remote from the lining panel unit 2 relative to the negative ac copper bar 39. It should be noted that the structural relationship between the direct-current positive copper bar 37 and the alternating-current copper bar 39, and the structural relationship between the direct-current negative copper bar 38 and the alternating-current copper bar 39 can be selected according to actual situations. That is, the relative up-down position relation of the direct current positive copper bar 37 and the alternating current copper bar 39, and the direct current negative copper bar 38 and the alternating current copper bar 39 is not limited in the present application.
In one embodiment, the dc positive copper bars 37, dc negative copper bars 38 and ac copper bars 39 each have pins 41 for connection with the conductive layer of the sheathing unit 2 for electrical transmission. For example, the dc positive copper bar 37 is far away from the lining plate unit 2, while the ac copper bar 39 on the same side is close to the lining plate unit 2, i.e., the dc positive copper bar 37 is above the ac copper bar 39. In order to realize that the pin 41 of the direct current positive copper bar 37 can be contacted with the conductive layer of the lining plate unit 2, an avoiding hole 36 is arranged on the alternating current copper bar 39 and used for the pin 41 of the direct current positive copper bar to pass through. In the second side direction of the heat sink 1, the positions and the connection relations of the dc negative copper bar 38 and the ac copper bar 39 are the same as or similar to the positions and the connection relations of the dc positive copper bar 37 and the ac copper bar 39, which is not described herein again.
A dc positive electrical connector 32 is provided at a first end of the heat sink 1 for connection to a dc positive copper bar 37. Meanwhile, a negative dc electrical connector 33 is provided at a first end of the heat sink 1 to connect with a negative dc copper bar 38. And, set up the alternating current connector 35 used for connecting with alternating current copper bar 39 in the first end of alternating current copper bar 39. The positive dc electrical connector 32, the negative dc electrical connector 33 and the electrical ac connector 35 are each designed as a plug-in electrical connector for quick connection. Preferably, as shown in fig. 1, the dc positive electrical connector 32 includes at least two opposing spring plates 30 spaced apart from each other. In addition, the dc negative electrical connector 33 and the ac electrical connector 35 may also be provided to include at least two elastic pieces 30 arranged oppositely and spaced apart from each other. By configuring the positive dc electrical connector 32, the negative dc electrical connector 33 and the alternating current electrical connector 35 as such a plug-in connection, the power module 100 can be plugged in and out smoothly and easily to the system.
The dc positive connector 32 and the dc positive copper bar 37 may be integrally manufactured or may be a split structure. In the split type manufacturing process, the fixing device can be fixed through welding, riveting or bolts and other connecting modes. Similarly, the dc negative electrical connector 33 and the dc negative copper bar 38 may be integrally manufactured, or may be of a split structure, and are fixed by welding, riveting or bolting. The alternating current connector 35 and the alternating current copper bar 39 can be integrally manufactured or can be in a split structure and are fixed in a welding, riveting or bolt connection mode.
A coolant inlet 13 and a coolant outlet (not shown) are provided at a first end of the heat sink 1 for connection to an external coolant system for dissipating heat from heat generating components such as the backing unit 2 of the power module 100. In addition, a plug-in pipe joint 15 is provided at both the coolant inlet 13 and the coolant outlet. This power module 100 can be easily connected to an external coolant system by this arrangement. In addition, the pluggable pipe joint 15, the direct-current positive connector 32, the direct-current negative connector 33 and the alternating-current connector 35 are arranged at the same end of the radiator 1, electric connection with cooling liquid can be achieved through a blind plugging mode, and installation convenience is greatly improved.
An end housing 70 is provided at a first end of the heat sink 1 for defining the position of the direct current positive electrical connector 32, the direct current negative electrical connector 33, the alternating current electrical connector 35 and the plug-in pipe joint 15. Specifically, the positive dc electrical connector 32, the negative dc electrical connector 33, the alternating current electrical connector 35, and the male/female pipe connector 15 all pass through the end housing 70 to be electrically connected with the outside and the cooling fluid. Preferably, the end housing 70 is made of an insulating material, such as plastic, to provide insulation.
The first housing 73 is provided on the first side of the heat sink 1, and the first housing 73 forms a first accommodation chamber with the end case 70 and the heat sink 1. The direct current positive copper bar 37, and the alternating current copper bar 39 and the lining plate unit 2 located on the first side surface of the heat sink 1 are located in the first accommodating cavity. Similarly, a second housing 71 is provided on the second side of the heat sink 1, and the second housing 71 forms a second accommodation chamber with the end case 70 and the heat sink 1. The negative dc copper bar 38, and the ac copper bar 39 and the backing plate unit 2 on the second side of the heat sink 1 are located in the second accommodating cavity. Insulating materials are poured into the first accommodating cavity and the second accommodating cavity so as to realize reliable insulation. For example, the insulating material may be silicon gel, silicon rubber, epoxy material, or the like. By the arrangement, stable and normal operation of the power module 100 can be ensured, and the service life is prolonged.
In one embodiment, a third housing 75 is disposed outside the first housing 73, and the third housing 75 and the first housing 73 form a third accommodating chamber. A fourth housing 77 is provided outside the second housing 71, and the fourth housing 77 and the second housing 71 form a fourth accommodation chamber. Meanwhile, the third accommodating cavity and the fourth accommodating cavity are both provided with a control circuit board 6. The control circuit board 6 is in signal connection with the lining board unit 2 so as to realize intelligent control functions of driving, monitoring, protecting, diagnosing and the like of the control circuit board 6. The positions of other components of the power module 100 are defined by the connections between the first casing 73, the second casing 71, the third casing 75 and the fourth casing 77, and the functions of supporting and insulating isolation are performed, and at the same time, the normal operation of the power module 100 is ensured, and interference between different components is avoided. In addition, the above arrangement optimizes the overall structure of the power module 100, so that the power module has the advantages of high integration level, small volume, light weight and the like.
Preferably, as shown in fig. 2, the control circuit boards 6 on both sides are electrically connected, and a power interface 61 for supplying a low voltage to the control circuit boards 6 is provided at a second end of one control circuit board 6. An optical fiber interface 62 is disposed at a second end of the control circuit board 6 to realize communication between the control circuit board 6 and an upper control unit. A current sensor interface (not shown) is also provided inside the control circuit board 6. The normal work of the control circuit board 6 can be ensured through the arrangement, and the signal transmission is facilitated, and the interference is reduced. In addition, the arrangement mode is beneficial to optimizing the layout of the power module 100, and the generalization degree is high.
The conductive layer of the backing plate 21 is provided with pins 23. The pins 23 at the first and second sides are connected to the control circuit board 6 through the first and second housings 73 and 71, respectively, upward and downward to realize signal transmission of the control circuit board 6 and the backing unit 2. In order to optimize the structure of the power module 100 and facilitate the arrangement of the pins 23, an auxiliary liner 21' may be further provided. The auxiliary backing plate 21' is electrically connected to the backing plate 21. For example, in fig. 1, in order to optimize the arrangement position of the pins 23, auxiliary liners 21' are provided on the first and second sides of the heat sink 1.
In one embodiment, the screw 11 passes through the third housing 75 and the end housing 70 and extends beyond the first end face of the end housing 70. Since the screw 11 extends out of the first end surface of the end case 70, the screw 11 plays a role of fixing the power module 100 after the power module 100 is mounted in place. Similarly, a screw 11 passing through the other of the fourth housings 77 is provided on the end housing 70, and the two screws 11 are provided on a diagonal line of the same end surface of the end housing 70.
A guide hole 12 is provided on the first end surface of the end housing 70. Preferably, two guide holes 12 are provided on the first end surface of the end housing 70 and are located on the diagonal line. Specifically, two guide holes 12 and two screws 11 are distributed at four corners of the end housing 70. During the installation of the power module 100, the guide holes 12 are first matched with guide pins of an external system for precise guiding and positioning, and then the quick plug-in connection of the electrical and coolant pipelines is smoothly realized due to the plug-in type electrical connectors and the plug-in type tube connectors. In addition, the guide hole 12 also serves to fix the power module 100 after the power module 100 is mounted in place.
In order to collect the temperature signal, a temperature sensor may be further disposed on the backing unit 2, the specific mounting position of the temperature sensor is set according to the actual heating condition of the power semiconductor chip 22, and the control circuit board 6 collects the temperature signal through the pin 23 for intelligent control of driving, monitoring, protecting, diagnosing and the like.
According to actual needs, a current sensor 5 can be arranged near the alternating current connector 35, and the current sensor 5 can be in signal connection with the control circuit board 6. Of course, the position where the current sensor 5 is provided is not limited to this, and may be provided at another position. For example, a current sensor may be disposed on the control circuit board 6, and the control circuit board 6 may collect a current signal through the current sensor, so as to be used for intelligent control such as driving, monitoring, protection, and diagnosis.
In addition, a power semiconductor chip 22 with current measurement and temperature measurement inside can be selected to realize chip-level rapid and accurate monitoring, and the control circuit board 6 collects the signals through insertion and is used for intelligent control of driving, monitoring, protection, diagnosis and the like.
The above is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily make changes or variations within the technical scope of the present invention disclosed, and such changes or variations should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (12)
1. A power module, comprising:
a heat sink having a heat-dissipating structure,
a backing unit having a backing and a power semiconductor chip fixedly disposed on the backing,
wherein the lining plate is arranged on the outer surface of the side surface of the radiator in a contact way,
the lining plate units are arranged on the first side and the second side of the radiator, and the first side and the second side are distributed oppositely,
a direct current positive copper bar and an alternating current copper bar are arranged on the lining plate unit of one of the first side surface and the second side surface of the radiator, a direct current negative copper bar and an alternating current copper bar are arranged on the other lining plate unit, the direct current positive copper bar and the alternating current copper bar on the same side are partially overlapped plate-shaped, the direct current negative copper bar and the alternating current copper bar on the same side are partially overlapped plate-shaped,
the positive copper bar of direct current burden copper bar with exchange the copper bar all have be used for with the pin that the conducting layer of welt unit is connected, and, be close to the welt unit be provided with on the positive copper bar of direct current or the homonymy and dodge the hole and be used for keeping away from the alternating current copper bar on the positive copper bar of direct current or the homonymy of welt unit the pin passes on the alternating current copper bar, simultaneously, be close to the welt unit be provided with on the negative copper bar of direct current or the homonymy and dodge the hole and be used for keeping away from the welt unit be provided with on the alternating current copper bar direct current burden copper bar or the homonymy the pin on the alternating current copper bar.
2. The power module of claim 1, wherein a positive dc electrical connector for connecting to the positive dc copper bar, a negative dc electrical connector for connecting to the negative dc copper bar, and an alternating current electrical connector for connecting to the alternating current copper bar are provided at the first end of the heat sink, wherein the positive dc electrical connector, the negative dc electrical connector, and the alternating current electrical connector are configured as a plug-in electrical connector.
3. The power module of claim 2, wherein a coolant inlet and a coolant outlet are provided at the first end of the heat sink, and wherein a male-female connector is provided on the coolant inlet and the coolant outlet.
4. A power module according to claim 3, characterized in that an end housing is provided at the first end of the heat sink, and the positive dc connector, the negative dc connector, the alternating current connector and the plug-in pipe connection pass through the end housing.
5. The power module of claim 4, wherein a first housing is disposed on a first side of the heat sink and forms a first receiving cavity with the end housing and the heat sink, the positive DC copper bar, the AC copper bar on the first side of the heat sink, and the backing unit are disposed within the first receiving cavity, a second housing is disposed on a second side of the heat sink and forms a second receiving cavity with the end housing and the heat sink, and the negative DC copper bar, the AC copper bar on the second side of the heat sink, and the backing unit are disposed within the second receiving cavity.
6. The power module according to claim 5, wherein a control circuit board is provided on an outer side of each of the first case and the second case, and the control circuit boards on both sides are electrically connected.
7. The power module according to claim 6, wherein a third housing and a fourth housing are provided outside the first housing and the second housing, respectively, the third housing and the first housing forming a third accommodation chamber for accommodating the control circuit board, and the fourth housing and the second housing forming a fourth accommodation chamber for accommodating the control circuit board.
8. The power module of claim 5, wherein an insulating material is poured into the first receiving cavity and the second receiving cavity.
9. The power module of claim 6 further comprising a temperature sensor in signal connection with the control circuit board, the temperature sensor being disposable on the patch unit.
10. The power module of claim 6, further comprising a current sensor in signal connection with the control circuit board, the current sensor being proximate to the AC electrical connector.
11. The power module of claim 7 further comprising a threaded rod passing through each of said third and fourth housings and through said end housing, one end of said threaded rod extending out of said first end face of said end housing.
12. A power module, comprising:
a heat sink having a heat-dissipating structure,
a backing unit having backing plates disposed on first and second sides of the heat sink in contact and power semiconductor chips fixedly disposed on the backing plates,
the direct-current positive copper bar and the alternating-current copper bar are arranged on one lining plate unit of the first side face and the second side face of the radiator, the direct-current negative copper bar and the alternating-current copper bar are arranged on the other lining plate unit, the direct-current positive copper bar, the direct-current negative copper bar and the alternating-current copper bar are all electrically connected with the conducting layer of the lining plate unit, the direct-current positive copper bar and the alternating-current copper bar on the same side are partially overlapped plate-shaped, the direct-current negative copper bar and the alternating-current copper bar on the same side are partially overlapped plate-shaped,
a direct current positive connector arranged at the first end of the radiator and used for being connected with the direct current positive copper bar, a direct current negative connector used for being connected with the direct current negative copper bar and an alternating current connector used for being connected with the alternating current copper bar, wherein the direct current positive connector, the direct current negative connector and the alternating current connector are constructed into a plug-in type electric connector,
an end housing disposed at a first end of the heat sink,
the first shell is arranged on the first side surface of the radiator, the first shell, the end shell and the radiator form a first containing cavity, the direct-current positive copper bar, the alternating-current copper bar and the lining board unit which are positioned on the first side surface of the radiator are positioned in the first containing cavity, the second shell is arranged on the second side surface of the radiator, the second shell, the end shell and the radiator form a second containing cavity, the direct-current negative copper bar, the alternating-current copper bar and the lining board unit which are positioned on the second side surface of the radiator are positioned in the second containing cavity,
control circuit boards disposed outside the first and second housings and electrically connected at both sides,
a current sensor in signal connection with the control circuit board, the current sensor being proximate to the AC electrical connector,
a temperature sensor in signal connection with the control circuit board, the temperature sensor being positionable on the liner plate unit,
the positive copper bar of direct current burden copper bar with exchange the copper bar all have be used for with the pin that the conducting layer of welt unit is connected, and, be close to the welt unit be provided with on the positive copper bar of direct current or the homonymy and dodge the hole and be used for keeping away from the alternating current copper bar on the positive copper bar of direct current or the homonymy of welt unit the pin passes on the alternating current copper bar, simultaneously, be close to the welt unit be provided with on the negative copper bar of direct current or the homonymy and dodge the hole and be used for keeping away from the welt unit be provided with on the alternating current copper bar direct current burden copper bar or the homonymy the pin on the alternating current copper bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072511.XA CN108123614B (en) | 2016-11-28 | 2016-11-28 | Power module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072511.XA CN108123614B (en) | 2016-11-28 | 2016-11-28 | Power module |
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| CN108123614A CN108123614A (en) | 2018-06-05 |
| CN108123614B true CN108123614B (en) | 2020-12-29 |
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| CN201611072511.XA Active CN108123614B (en) | 2016-11-28 | 2016-11-28 | Power module |
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| WO2023092442A1 (en) * | 2021-11-26 | 2023-06-01 | 中车株洲电力机车研究所有限公司 | Integrated power semiconductor apparatus |
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| CN205430072U (en) * | 2016-03-17 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Converter power module |
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| CN105578838B (en) * | 2014-10-16 | 2018-01-05 | 中山大洋电机股份有限公司 | A kind of electric machine controller |
| CN104486901B (en) * | 2014-11-19 | 2016-03-23 | 株洲南车时代电气股份有限公司 | Radiating insulating liner plate, package module comprising this liner plate and preparation method thereof |
| CN104779816B (en) * | 2015-04-07 | 2017-06-23 | 南车株洲电力机车研究所有限公司 | Tunneling machine cutting motor frequency-converter power device |
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| CN201860252U (en) * | 2010-09-17 | 2011-06-08 | 武汉正远铁路电气有限公司 | Power module of high-power traction converter |
| CN102082524A (en) * | 2011-03-07 | 2011-06-01 | 株洲南车时代电气股份有限公司 | Intelligent power device |
| CN103779294A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Power module packaging structure with water-cooled heat sink used for two-sided cooling |
| CN104617413A (en) * | 2015-01-19 | 2015-05-13 | 株洲南车时代电气股份有限公司 | Horizontal overlapping type power terminal |
| CN205430072U (en) * | 2016-03-17 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Converter power module |
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