CN219108102U - Radiating assembly and charging module - Google Patents

Abstract

The utility model discloses a heat dissipation component and a charging module, which comprise a circuit board, a heat dissipation part and a plurality of high-power components. The heat dissipation part has a heat dissipation top wall and heat dissipation side walls located around the heat dissipation top wall. On the top, high-power components are fixed on the heat dissipation side wall, and a heat-conducting adhesive tape is closely attached between the high-power components and the heat-dissipating side wall. The wall passes to the outside. The utility model can ensure that high-power components, heat-conducting adhesive tapes, and heat-dissipating side walls can be closely bonded, reduce the impedance of heat conduction of high-power components, and the overall assembly layout is reasonable, so that the heat of high-power components can pass through the heat-conducting adhesive tape in sequence , The heat dissipation side wall and the heat dissipation top wall are quickly transferred to the outside, improving the heat conduction and heat dissipation effect, avoiding damage to high-power components due to excessive temperature, resulting in circuit failure, and eliminating potential safety hazards.

Description

A heat dissipation component and a charging module

technical field

The utility model relates to the technical field of heat dissipation of a charging module, in particular to a heat dissipation component and a charging module.

Background technique

In the charging module in the prior art, the internal MOS tube and other high-power components are directly installed on the heat sink. Due to the lack of isolated heat-conducting parts and the poor rationality of the assembly layout, the high-power components generate more power during work. The large amount of heat cannot conduct heat conduction and heat dissipation quickly, resulting in damage to high-power components due to excessive temperature, and eventually leads to circuit failure, which poses a large safety hazard.

Utility model content

The utility model aims to provide a heat dissipation assembly to solve the above-mentioned existing technical problems.

In order to achieve the above object, the technical solution of the present invention is: a heat dissipation assembly, including a circuit board, a heat dissipation piece and a plurality of high-power components, the heat dissipation piece has a heat dissipation top wall and heat dissipation side walls located around the heat dissipation top wall, and the heat dissipation The components are set on the circuit board, and the high-power components are fixed on the heat dissipation side wall. The high-power components and the heat dissipation side wall are closely fitted with heat-conducting tape. The high-power components pass heat through the heat-conducting tape, heat dissipation The side wall and the heat dissipation top wall are transmitted to the outside.

In one embodiment, a heat-conducting silicone pad is attached to the top wall of the heat sink.

In one embodiment, it further includes a high-frequency transformer, a PFC inductor, and a resonant inductor arranged on the circuit board, and the high-frequency transformer, the PFC inductor, and the resonant inductor are located in the heat sink.

In one embodiment, the heat dissipation element is a cover body, in which a plurality of cavities are formed, and the high-frequency transformer, PFC inductor, and resonant inductor are arranged in the cavities.

In one embodiment, the heat sink has a long rectangular shape, and multiple slots are arranged along the length direction of the heat sink, and the high-frequency transformer, PFC inductor, and resonant inductor are arranged in the slots in a one-to-one correspondence.

In one embodiment, the heat dissipation sidewalls on both sides in the length direction of the heat sink are plane sidewalls, and the high-power components and heat-conducting adhesive tape are attached to the plane sidewalls, and the high-power components are fixedly arranged on the plane sidewalls.

In one embodiment, the high-power component includes a MOS tube, and the MOS tube is locked and pressed on the plane side walls on both sides of the heat sink by screws.

In one embodiment, a thermally conductive potting compound is injected into the cavity of the heat sink.

In one embodiment, the high-frequency transformer, the PFC inductor, the resonant inductor and the heat sink are fixedly connected to form an integral structure through a heat-conducting potting glue.

In one embodiment, a housing is also included, and the housing and the overall structure are arranged separately, and the overall structure is fixedly installed in the housing through a circuit board.

The utility model also provides a charging module, including a control and protection device, which includes any one of the heat dissipation components described above.

In one embodiment, it also includes a DC charging gun head and a national standard three-plug 16A power cord electrically connected to the control protection device.

The utility model has the following beneficial effects:

The utility model comprises a circuit board, a radiator and a plurality of high-power components. The radiator has a heat dissipation top wall and heat dissipation side walls located around the top wall. The radiator is arranged on the circuit board, and the high-power components are fixed on the radiator. On the side wall, a heat-conducting adhesive tape is closely attached between the high-power components and the heat-dissipating side wall. The high-power components transfer heat to the outside through the heat-conducting adhesive tape, the heat-dissipating side wall, and the heat-dissipating top wall in sequence. The heat-conducting adhesive tape of this scheme It can reduce the heat conduction impedance of high-power components, and the overall assembly layout is reasonable, so that the heat of high-power components can be quickly transferred to the outside through the heat-conducting tape, heat-dissipating side walls, and heat-dissipating top walls in sequence, improving the effect of heat conduction and heat dissipation, and avoiding large Power components are damaged due to excessive temperature, which eventually leads to circuit failure and eliminates potential safety hazards.

Description of drawings

Fig. 1 is the exploded schematic view (one) of embodiment 1 of the present utility model;

Fig. 2 is the exploded schematic diagram (two) of embodiment 1 of the present utility model;

Fig. 3 is an exploded schematic diagram of embodiment 1 of the present invention after removing the housing;

Fig. 4 is a schematic structural view of the radiator of Embodiment 1 of the present utility model;

Fig. 5 is an exploded schematic view of the charging module of Embodiment 2 of the present invention.

Drawings: 1 circuit board, 2 heat sink, 21 heat sink top wall, 22 heat sink side wall, 23 cavity, 3 heat conduction tape, 4 heat conduction silicone pad, 5 MOS tube, 6 screw, 7 heat conduction potting glue, 8 high frequency Transformer, 9PFC inductor, 10 resonant inductor, 11 upper shell, 12 lower shell, 13 control protection device, 14 DC charging gun head, 15 power cord.

Detailed ways

In order to further illustrate various embodiments, the utility model provides accompanying drawings. These drawings are part of the disclosure content of the present invention, which are mainly used to illustrate the embodiments, and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementations and advantages of the present utility model. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.

Example 1

Referring to Figures 1-4, as an embodiment of the present invention, a heat dissipation assembly is provided, including a housing and a circuit board 1 arranged in the housing, a heat sink 2, a plurality of high-power components and a heat-conducting silicone pad 4, The heat sink 2 has a heat sink top wall 21 and a heat sink side wall 22 located around the heat sink top wall 21. The heat conduction silicone pad 4 is attached to the heat sink top wall 21. The heat sink 2 is arranged on the circuit board 1. The high-power components include MOS The tube 5 and the MOS tube 5 are fixedly arranged on the heat dissipation side wall 22, and the heat conduction tape 3 is closely attached between the MOS tube 5 and the heat dissipation side wall 22, and the MOS tube 5 passes heat through the heat conduction tape 3 and the heat dissipation side wall 22 in sequence , heat dissipation top wall 21, heat conduction silica gel pad 4, and the shell is transmitted to the outside.

In the above technical solution, the MOS tube 5 , the thermally conductive tape 3 , and the heat sink 2 can be closely bonded to each other, reducing the heat conduction impedance of the MOS tube 5 , and the overall assembly layout is reasonable, so that the heat of the MOS tube 5 can pass through the thermally conductive tape 3 in sequence. , heat dissipation side wall 22, heat dissipation top wall 21, heat conduction silica gel pad 4, the shell is quickly transferred to the outside, improves the heat conduction and heat dissipation effect, and avoids damage to the MOS tube due to excessive temperature, which eventually leads to circuit failure and eliminates potential safety hazards.

In this embodiment, the high-power components include MOS transistors 5. Of course, they can also be other high-power components, such as thyristor SCR, bipolar power transistor IGBT, etc. It should be noted that high-power components are generally Refers to electronic components with a voltage level above 1200V, a current above 300A, and a relatively large output power. This is technical knowledge known to those skilled in the art and will not be described in detail.

Wherein, the heat-conducting adhesive tape 3 is a heat-conducting silicon adhesive cloth, which is thin, has small heat conduction resistance, and has good heat-conducting effect.

In this embodiment, the heat-conducting silica gel pad 4 is attached to the heat-dissipating top wall 21 , so that heat can be transferred to the outside through a large area through the heat-dissipating top wall 21 and the heat-conducting silica gel pad 4 , thereby improving the heat dissipation effect. Further, in order to improve the heat transfer effect, the heat dissipation top wall 21 is a flat top wall, and the heat-conducting silicone pad 4 is flatly attached to the flat top wall.

In this embodiment, the heat dissipation element 2 is a long rectangular cover body, the heat dissipation side walls 22 on both sides of the length direction of the heat dissipation element 2 are plane side walls, and the MOS tube 5, the thermal conductive adhesive tape 3 and the plane side wall surface of the heat dissipation element 2 Surface bonding, the MOS tube 5 is fixedly arranged on the plane side walls on both sides of the heat sink 2. This setting ensures that the MOS tube 5, the thermal conductive tape 3 and the heat dissipation side wall 22 can be closely fitted and fixed to further ensure heat dissipation. Effect.

Wherein, the MOS tube 5 is locked and pressed on the plane side walls on both sides of the heat sink 2 by the screw 6 to further improve the lamination stability between the MOS tube 5 , the thermal conductive tape 3 and the heat dissipation side wall 22 .

In this embodiment, the cooling assembly also includes a high-frequency transformer 8, a PFC inductor 9, and a resonant inductor 10 (interference source) arranged on the circuit board 1, and the high-frequency transformer 8, PFC inductor 9, and resonant inductor 10 are located on the heat sink 2 In this setting, the heat generated by the high-frequency transformer 8 , the PFC inductor 9 , and the resonant inductor 10 can be quickly transferred to the outside through the heat sink 2 .

Specifically, a plurality of groove cavities 23 are formed in the heat sink 2, and the plurality of groove cavities 23 are arranged along the length direction of the heat sink 2, and the high-frequency transformer 8, the PFC inductor 9, and the resonant inductor 10 are respectively arranged in the groove cavities one by one. 23 , this setting can not only make full use of the internal space of the heat sink 2 , but also avoid mutual interference between the high frequency transformer 8 , the PFC inductor 9 , and the resonant inductor 10 . Certainly, it is also possible to arrange the high-frequency transformer 8 , the PFC inductor 9 , and the resonant inductor 10 in the same cavity 23 , but the above-mentioned electromagnetic components tend to interfere with each other and affect product performance.

Furthermore, since the high-frequency transformer 8, the PFC inductor 9, and the resonant inductor 10 have a large heat generation and a heavy weight, in order to improve the heat dissipation speed and share the assembly weight, in this embodiment, the cavity 23 of the heat sink 2 The heat-conducting potting glue 7 is injected inside, so that the high-frequency transformer 8, PFC inductor 9, and resonant inductor 10 can quickly conduct heat to the heat sink 2 through the heat-conducting potting glue 7, improving heat dissipation efficiency, and the high-frequency transformer 8, PFC inductor 9. The resonant inductor 10 and the heat sink 2 are fixedly connected to form an integral structure through the heat-conducting potting glue 7, which can avoid the excessive gravity of the high-frequency transformer 8, the PFC inductor 9, and the resonant inductor 10 from being applied to the circuit board 1, thereby enhancing Anti-vibration ability to ensure reliability under vibration test conditions.

In this embodiment, the housing and the overall structure are set separately, and the overall structure is fixedly installed in the housing through the circuit board 1. On the one hand, it is convenient for processing, disassembly and maintenance. The locking and fixing operation is more simplified.

Specifically, the casing includes an upper casing 11 and a lower casing 12 assembled up and down, and the overall structure is fixedly mounted on the lower casing 12 through the circuit board 1, wherein the circuit board 1 and the lower casing 12 are provided with screw holes corresponding to each other. The circuit board 1 is fixedly installed on the lower casing 12 by the cooperation of the screw 6 and the screw hole, and the outer top wall of the heat sink 2 faces the inner top wall side of the upper casing 11, so that the MOS tube 5 and the high-frequency transformer 8 , PFC inductor 9, and resonant inductor 10 are quickly and comprehensively conducted to heat sink 2 through heat-conducting adhesive tape 3 or heat-conducting potting glue 7, and then conducted to upper shell 11 by heat sink 2, and finally the heat passes through the surface of upper shell 11 Large area and air convection heat dissipation.

Example 2

Referring to Figure 5, the utility model also provides a charging module, including a control protection device 13, a DC charging gun head 14 electrically connected to the control protection device 13 and a national standard three-plug 16A power cord 15, and the control protection device 13 includes The heat dissipation assembly described in Embodiment 1 ensures that the charging module of the present invention can maintain a good heat dissipation effect during use.

Although the present utility model has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that, without departing from the spirit and scope of the present utility model defined by the appended claims, changes in form and details have been made to the present utility model. Various changes made by the utility model all fall into the protection scope of the utility model.

Claims (12)

1. A heat dissipating assembly, characterized in that: the heat dissipation device comprises a circuit board, a heat dissipation piece and a plurality of high-power components, wherein the heat dissipation piece is provided with a heat dissipation top wall and heat dissipation side walls positioned around the heat dissipation top wall, the heat dissipation piece is arranged on the circuit board, the high-power components are fixedly arranged on the heat dissipation side walls, a heat conduction adhesive tape is tightly attached between the high-power components and the heat dissipation side walls, and the high-power components transfer heat to the outside through the heat conduction adhesive tape, the heat dissipation side walls and the heat dissipation top wall in sequence.

2. The heat dissipating assembly of claim 1, wherein: the top wall of the heat dissipation piece is provided with a heat conduction silica gel pad in an attaching mode.

3. The heat dissipating assembly of claim 1, wherein: the high-frequency transformer, the PFC inductor and the resonant inductor are arranged on the circuit board and are positioned in the radiating piece.

4. A heat sink assembly as in claim 3, wherein: the radiating piece is a cover body, a plurality of groove cavities are formed in the cover body, and the high-frequency transformer, the PFC inductor and the resonant inductor are arranged in the groove cavities.

5. The heat dissipating assembly of claim 4, wherein: the radiating piece is rectangular, and a plurality of slot cavities are arranged along the length direction of the radiating piece, and the high-frequency transformer, the PFC inductor and the resonant inductor are respectively arranged in the slot cavities in a one-to-one correspondence mode.

6. The heat dissipating assembly of claim 5, wherein: the radiating side walls on two sides of the radiating piece in the length direction are plane side walls, the high-power components and the heat conducting adhesive tape are attached to the plane side wall surface, and the high-power components are fixedly arranged on the plane side walls.

7. The heat dissipating assembly of claim 6, wherein: the high-power component comprises an MOS tube, and the MOS tube is locked and pressed on the plane side walls on two sides of the heat dissipation piece through screws.

8. The heat dissipating assembly of claim 4, wherein: and heat conduction pouring sealant is injected into the groove cavity of the heat dissipation piece.

9. The heat sink assembly as recited in claim 8 wherein: the high-frequency transformer, the PFC inductor, the resonant inductor and the radiating piece are fixedly connected into an integral structure through heat conduction pouring sealant.

10. The heat sink assembly as recited in claim 9 wherein: still include the shell, shell and overall structure are split type setting, and overall structure passes through circuit board fixed mounting in the shell.

11. A charging module, characterized in that: comprising a control and protection device comprising a heat dissipating assembly according to any of the preceding claims 1-10.

12. The charging module of claim 11, wherein: the direct current charging gun head and the national standard three-plug 16A power line are respectively and electrically connected with the control protection device.

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