CN219108102U

CN219108102U - Radiating assembly and charging module

Info

Publication number: CN219108102U
Application number: CN202320041623.8U
Authority: CN
Inventors: 徐毅鸿; 陈可璜; 邵志勇
Original assignee: Xiamen Hongfa Automotive Electronics Co Ltd
Current assignee: Xiamen Hongfa Automotive Electronics Co Ltd
Priority date: 2023-01-06
Filing date: 2023-01-06
Publication date: 2023-05-30
Anticipated expiration: 2033-01-06

Abstract

The utility model discloses a heat radiation assembly and a charging module, which comprises a circuit board, a heat radiation member and a plurality of high-power components, wherein the heat radiation member is provided with a heat radiation top wall and heat radiation side walls positioned at the periphery of the heat radiation top wall, the heat radiation member is arranged on the circuit board, the high-power components are fixedly arranged on the heat radiation side walls, a heat conduction adhesive tape is tightly attached between the high-power components and the heat radiation side walls, and the high-power components transmit heat to the outside through the heat conduction adhesive tape, the heat radiation side walls and the heat radiation top wall in sequence. The utility model can ensure that the high-power components, the heat-conducting adhesive tape and the heat-radiating side wall can be tightly attached, reduce the impedance of heat conduction of the high-power components, and has reasonable overall assembly layout mode, so that the heat of the high-power components can be quickly transferred to the outside through the heat-conducting adhesive tape, the heat-radiating side wall and the heat-radiating top wall in sequence, thereby improving the heat-conducting and heat-radiating effects, avoiding circuit faults caused by damage of the high-power components due to overhigh temperature and eliminating potential safety hazards.

Description

Radiating assembly and charging module

Technical Field

The utility model relates to the technical field of heat dissipation of charging modules, in particular to a heat dissipation assembly and a charging module.

Background

In the charging module in the prior art, high-power components such as MOS (metal oxide semiconductor) tubes and the like in the charging module are directly arranged on a heat radiating piece, and due to the lack of an isolation heat conducting component and poor rationality of assembly layout, the high-power components generate larger heat in operation and cannot conduct heat conduction and heat radiation rapidly, so that the high-power components are damaged due to overhigh temperature, and finally, circuit faults are caused, so that the high potential safety hazard exists.

Disclosure of Invention

The present utility model is directed to a heat dissipating assembly, which solves the above-mentioned problems.

In order to achieve the above purpose, the technical scheme of the utility model is as follows: the utility model provides a radiating component, includes circuit board, radiating part and a plurality of high-power components and parts, and the radiating part has the roof of dispelling the heat and is located the roof of dispelling the heat lateral wall all around, and the radiating part setting is on the circuit board, and high-power components and parts are fixed to be set up on the lateral wall of dispelling the heat, closely laminate between high-power components and the lateral wall of dispelling the heat and be provided with the heat conduction adhesive tape, and high-power components and parts pass through heat conduction adhesive tape, heat dissipation lateral wall, heat dissipation roof in proper order and transmit to outside.

In one embodiment, the top wall of the heat sink is provided with a heat conductive silicone pad.

In one embodiment, the high-frequency transformer, the PFC inductor and the resonant inductor are arranged on the circuit board and are positioned in the heat dissipation piece.

In one embodiment, the heat sink is a housing having a plurality of slots formed therein, and the high frequency transformer, PFC inductor, and resonant inductor are disposed within the slots.

In one embodiment, the heat dissipation part is rectangular, the plurality of groove cavities are distributed along the length direction of the heat dissipation part, and the high-frequency transformer, the PFC inductor and the resonant inductor are respectively arranged in the groove cavities in a one-to-one correspondence mode.

In one embodiment, the heat dissipation side walls on two sides of the length direction of the heat dissipation piece are plane side walls, the high-power components and the heat conduction adhesive tape are attached to the plane side wall surface, and the high-power components are fixedly arranged on the plane side walls.

In one embodiment, the high-power component comprises an MOS tube, and the MOS tube is locked and pressed on the plane side walls on two sides of the heat dissipation piece through screws.

In one embodiment, a thermally conductive potting adhesive is injected into the cavity of the heat sink.

In one embodiment, the high-frequency transformer, the PFC inductor, the resonant inductor and the heat dissipation member are fixedly connected into a whole structure through heat conduction pouring sealant.

In one embodiment, the circuit board further comprises a shell, the shell and the integral structure are arranged in a split mode, and the integral structure is fixedly installed in the shell through the circuit board.

The utility model also provides a charging module, which comprises a control protection device, wherein the control protection device comprises any one of the heat dissipation assemblies.

In one embodiment, the device further comprises a direct current charging gun head and a national standard three-plug 16A power line which are respectively and electrically connected with the control protection device.

The utility model has the following beneficial effects:

the heat-conducting adhesive tape can reduce the heat conduction impedance of the high-power components, and the whole assembly layout mode is reasonable, so that the heat of the high-power components can be quickly transferred to the outside through the heat-conducting adhesive tape, the heat-radiating side wall and the heat-radiating top wall in sequence, the heat-conducting heat-radiating effect is improved, the damage of the high-power components caused by overhigh temperature is avoided, the circuit fault is finally caused, and the potential safety hazard is eliminated.

Drawings

FIG. 1 is an exploded schematic view (one) of embodiment 1 of the present utility model;

FIG. 2 is an exploded view of example 1 of the present utility model;

FIG. 3 is an exploded view of embodiment 1 of the present utility model with the housing removed;

fig. 4 is a schematic structural view of a heat sink according to embodiment 1 of the present utility model;

fig. 5 is an exploded schematic view of a charging module of embodiment 2 of the present utility model.

The drawings are marked: the high-frequency power supply comprises a circuit board 1, a heat radiating piece 2, a heat radiating top wall 21, a heat radiating side wall 22, a groove cavity 23, a heat conducting adhesive tape 3, a heat conducting silica gel pad 4, a MOS tube 5, a screw 6, a heat conducting pouring sealant 7, a high-frequency transformer 8, a PFC inductor 9, a resonance inductor 10, an upper shell 11, a lower shell 12, a control protection device 13, a direct-current charging gun head 14 and a power supply line 15.

Detailed Description

For further illustration of the various embodiments, the utility model is provided with the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments and together with the description, serve to explain the principles of the embodiments. With reference to these matters, one of ordinary skill in the art will understand other possible embodiments and advantages of the present utility model. The components in the figures are not drawn to scale and like reference numerals are generally used to designate like components.

Example 1

Referring to fig. 1-4, as an embodiment of the present utility model, a heat dissipation assembly is provided, which includes a housing, a circuit board 1 disposed in the housing, a heat dissipation member 2, a plurality of high-power components and a heat-conducting silica gel pad 4, wherein the heat dissipation member 2 has a heat dissipation top wall 21 and heat dissipation side walls 22 disposed around the heat dissipation top wall 21, the heat-conducting silica gel pad 4 is attached to the heat dissipation top wall 21, the heat dissipation member 2 is disposed on the circuit board 1, the high-power components include MOS tubes 5, the MOS tubes 5 are fixedly disposed on the heat dissipation side walls 22, a heat-conducting adhesive tape 3 is disposed between the MOS tubes 5 and the heat dissipation side walls 22 in a close-fitting manner, and the MOS tubes 5 transfer heat to the outside sequentially through the heat-conducting adhesive tape 3, the heat dissipation side walls 22, the heat dissipation top wall 21, the heat-conducting silica gel pad 4, and the housing.

Above-mentioned technical scheme can closely laminate between MOS pipe 5, heat conduction adhesive tape 3, the radiating member 2, reduce the impedance of MOS pipe 5 heat conduction, and whole assembly layout mode is reasonable, make the heat of MOS pipe 5 pass through heat conduction adhesive tape 3 in proper order, heat dissipation lateral wall 22, heat dissipation roof 21, heat conduction silica gel pad 4, the shell transmits outside fast, improve heat conduction radiating effect, avoid the MOS pipe to take place to damage because of the high temperature, finally lead to circuit failure, eliminated the potential safety hazard.

In this embodiment, the high-power component includes the MOS transistor 5, but of course, other high-power components, such as a thyristor SCR, a bipolar power transistor IGBT, etc., may be used, and it should be specifically noted that the high-power component generally refers to an electronic component with a voltage level of 1200V or more, a current of 300A or more, and a relatively large output power. This is a well known technical knowledge to the person skilled in the art and will not be described in detail.

Wherein, the heat conduction adhesive tape 3 is a heat conduction adhesive tape, which is thin and has small heat conduction impedance and good heat conduction effect.

In this embodiment, the heat-conducting silica gel pad 4 is attached to the heat-dissipating top wall 21, so that heat can be transferred to the outside through the heat-dissipating top wall 21 and the heat-conducting silica gel pad 4 in a large area, and the heat-dissipating effect is improved. Further, in order to improve the heat transfer effect, the heat dissipation top wall 21 is a planar top wall, and the heat-conducting silica gel pad 4 is flatly attached to the planar top wall.

In this embodiment, the radiating member 2 is a cover body with a rectangular shape, the radiating side walls 22 on two sides of the length direction of the radiating member 2 are planar side walls, the MOS tube 5, the heat conducting adhesive tape 3 and the planar side wall surface of the radiating member 2 are attached, the MOS tube 5 is fixedly arranged on the planar side walls on two sides of the radiating member 2, and the arrangement ensures that the MOS tube 5, the heat conducting adhesive tape 3 and the radiating side walls 22 can be attached and fixed more tightly, so as to further ensure the radiating effect.

The MOS tube 5 is locked and pressed on the plane side walls on two sides of the heat dissipation piece 2 through the screw 6, so that the attaching stability among the MOS tube 5, the heat conduction adhesive tape 3 and the heat dissipation side walls 22 is further improved.

In this embodiment, the heat dissipation assembly further includes a high-frequency transformer 8, a PFC inductor 9, and a resonant inductor 10 (interference source) disposed on the circuit board 1, and the high-frequency transformer 8, the PFC inductor 9, and the resonant inductor 10 are disposed in the heat dissipation member 2, so that heat generated by the high-frequency transformer 8, the PFC inductor 9, and the resonant inductor 10 can be quickly transferred to the outside through the heat dissipation member 2.

Specifically, a plurality of groove cavities 23 are formed in the heat dissipation part 2, the groove cavities 23 are distributed along the length direction of the heat dissipation part 2, the high-frequency transformer 8, the PFC inductor 9 and the resonant inductor 10 are arranged in the groove cavities 23 in a one-to-one correspondence mode, the arrangement can fully utilize the inner space of the heat dissipation part 2, and meanwhile mutual interference among the high-frequency transformer 8, the PFC inductor 9 and the resonant inductor 10 can be avoided. Of course, it is also possible that the high-frequency transformer 8, PFC inductor 9, and resonant inductor 10 are disposed in the same slot 23, but the electromagnetic elements are prone to mutual interference, which affects product performance.

Further, because the heating value of the high-frequency transformer 8, the PFC inductor 9 and the resonant inductor 10 is larger and the weight is heavier, in order to improve the heat dissipation speed and share the assembly weight, in this embodiment, the heat conducting pouring sealant 7 is injected into the groove cavity 23 of the heat dissipation member 2, so that the high-frequency transformer 8, the PFC inductor 9 and the resonant inductor 10 can quickly conduct heat to the heat dissipation member 2 through the heat conducting pouring sealant 7, the heat dissipation efficiency is improved, and the high-frequency transformer 8, the PFC inductor 9, the resonant inductor 10 and the heat dissipation member 2 are fixedly connected into an integral structure through the heat conducting pouring sealant 7, so that excessive gravity of the high-frequency transformer 8, the PFC inductor 9 and the resonant inductor 10 can be prevented from being applied to the circuit board 1, the vibration resistance is enhanced, and the reliability under the vibration test condition is ensured.

In this embodiment, shell and overall structure are split type setting, and overall structure passes through circuit board 1 fixed mounting in the shell, and on the one hand the processing of being convenient for, dismouting maintenance, on the other hand can make MOS pipe 5 lock and pay fixed operation more simplifying on overall structure.

Specifically, the shell includes upper casing 11 and lower casing 12 of upper and lower assembly, overall structure passes through circuit board 1 fixed mounting on casing 12 down, wherein, be provided with the screw that corresponds each other on circuit board 1, lower casing 12, realize on casing 12 down with circuit board 1 fixed mounting through screw 6 and screw cooperation, and the outer roof of radiator 2 is towards the interior roof one side of upper casing 11, make MOS pipe 5, high frequency transformer 8, PFC inductance 9, resonant inductor 10 produced heat give radiator 2 through heat conduction adhesive tape 3 or heat conduction pouring sealant 7 quick comprehensive conduction, again by radiator 2 conduction for upper casing 11, final heat is through upper casing 11 surface large tracts of land and air convection heat dissipation.

Example 2

Referring to fig. 5, the present utility model further provides a charging module, which includes a control protection device 13, a dc charging gun head 14 and a national standard three-plug 16A power cord 15, wherein the dc charging gun head 14 and the national standard three-plug 16A power cord are respectively electrically connected with the control protection device 13, and the control protection device 13 includes the heat dissipation assembly described in the foregoing embodiment 1, so as to ensure that the charging module of the present utility model can maintain a good heat dissipation effect when in use.

While the utility model has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A heat dissipating assembly, characterized in that: the heat dissipation device comprises a circuit board, a heat dissipation piece and a plurality of high-power components, wherein the heat dissipation piece is provided with a heat dissipation top wall and heat dissipation side walls positioned around the heat dissipation top wall, the heat dissipation piece is arranged on the circuit board, the high-power components are fixedly arranged on the heat dissipation side walls, a heat conduction adhesive tape is tightly attached between the high-power components and the heat dissipation side walls, and the high-power components transfer heat to the outside through the heat conduction adhesive tape, the heat dissipation side walls and the heat dissipation top wall in sequence.

2. The heat dissipating assembly of claim 1, wherein: the top wall of the heat dissipation piece is provided with a heat conduction silica gel pad in an attaching mode.

3. The heat dissipating assembly of claim 1, wherein: the high-frequency transformer, the PFC inductor and the resonant inductor are arranged on the circuit board and are positioned in the radiating piece.

4. A heat sink assembly as in claim 3, wherein: the radiating piece is a cover body, a plurality of groove cavities are formed in the cover body, and the high-frequency transformer, the PFC inductor and the resonant inductor are arranged in the groove cavities.

5. The heat dissipating assembly of claim 4, wherein: the radiating piece is rectangular, and a plurality of slot cavities are arranged along the length direction of the radiating piece, and the high-frequency transformer, the PFC inductor and the resonant inductor are respectively arranged in the slot cavities in a one-to-one correspondence mode.

6. The heat dissipating assembly of claim 5, wherein: the radiating side walls on two sides of the radiating piece in the length direction are plane side walls, the high-power components and the heat conducting adhesive tape are attached to the plane side wall surface, and the high-power components are fixedly arranged on the plane side walls.

7. The heat dissipating assembly of claim 6, wherein: the high-power component comprises an MOS tube, and the MOS tube is locked and pressed on the plane side walls on two sides of the heat dissipation piece through screws.

8. The heat dissipating assembly of claim 4, wherein: and heat conduction pouring sealant is injected into the groove cavity of the heat dissipation piece.

9. The heat sink assembly as recited in claim 8 wherein: the high-frequency transformer, the PFC inductor, the resonant inductor and the radiating piece are fixedly connected into an integral structure through heat conduction pouring sealant.

10. The heat sink assembly as recited in claim 9 wherein: still include the shell, shell and overall structure are split type setting, and overall structure passes through circuit board fixed mounting in the shell.

11. A charging module, characterized in that: comprising a control and protection device comprising a heat dissipating assembly according to any of the preceding claims 1-10.

12. The charging module of claim 11, wherein: the direct current charging gun head and the national standard three-plug 16A power line are respectively and electrically connected with the control protection device.