WO2023092442A1

WO2023092442A1 - Integrated power semiconductor apparatus

Info

Publication number: WO2023092442A1
Application number: PCT/CN2021/133435
Authority: WO
Inventors: 金肩舸; 杨进锋; 袁勇; 王晓元; 朱武; 窦泽春; 陈燕平; 马龙昌; 宋郭蒙; 王雄; 杨乐乐; 彭勇殿; 常桂钦; 董国忠
Original assignee: 中车株洲电力机车研究所有限公司
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2023-06-01
Also published as: DE112021007145T5

Abstract

An integrated power semiconductor apparatus, comprising: a power unit, which is provided with a liner plate chip; a control unit, which is provided with a control circuit board; and an interconnection unit, which is provided with an insulating housing, a direct-current positive copper busbar, a direct-current negative copper busbar, a signal terminal and an alternating-current copper busbar, wherein the direct-current positive copper busbar and the direct-current negative copper busbar are arranged in a vertically stacked manner, and extend to a direct-current side so as to form a quick pluggable interface. By means of the integrated power semiconductor apparatus provided in the present invention, the function of a converter module is realized in terms of the packaging of a device, and a low-inductance quick pluggable electrical direct connection between a direct-current external interface and a liner plate chip is realized, thereby simplifying materials, and improving the transmission efficiency and reliability; the area of copper busbars and the stacking area of a direct-current positive copper busbar and a direct-current negative copper busbar are ensured; and the current-carrying capacity and the low-inductance performance can be effectively improved, and the power density and the application convenience can also be effectively improved. A main circuit and a signal circuit are integrated, thereby simplifying a connection process, and improving the production efficiency and the yield.

Description

An integrated power semiconductor device

technical field

The present invention relates to the technical field of semiconductors, and more specifically, to an integrated power semiconductor device.

Background technique

In high-voltage and high-power applications such as rail transit, industrial frequency conversion, and power grids, conventional power semiconductor devices only package a single semiconductor switch with a single function. When applying, multiple devices need to be installed on the radiator, and then the control circuit board, busbar , wire harnesses, connectors, various structural parts and other components can only have the function of the converter module after complex assembly. In this technology mode, there is a separation of technical fields between the semiconductor device and the converter module, which makes it difficult to be closely integrated, and cannot achieve high power density, convenience, and intelligent application effects.

In the prior art, there are a few high-voltage semiconductor modules with integrated characteristics. Generally, the power density of these semiconductor modules is not high enough. etc. There are many problems.

Contents of the invention

In view of this, the purpose of the present invention is to provide an integrated power semiconductor device, which can realize the function of the converter module at the device packaging level, and has a high degree of integration and a small occupied volume. Under the same power, multiple semiconductor devices combined Compared with the conventional converter module, the power density of the power module is significantly improved, and it has the characteristics of low inductance and good current sharing. Realized low-inductance quick plug-in electrical direct connection between the DC external interface and the liner chip, simplified materials, improved transmission efficiency and reliability; integrated main circuit and signal circuit, easy assembly, simplified connection process, and improved production efficiency ,Yield. Easy production assembly and quick plug-in applications.

In order to achieve the above object, the present invention provides the following technical solutions:

An integrated power semiconductor device comprising:

a power unit provided with a liner chip;

a control unit provided with a control circuit board;

An interconnection unit, which is arranged between the power unit and the control unit, and the interconnection unit is provided with an insulating shell, a DC positive copper bar, a DC negative copper bar, a signal terminal, and at least one AC copper bar;

The DC positive copper bar and the DC negative copper bar are stacked on top and bottom, and extend to the DC side to form a quick plug-in interface; the AC copper bar faces the side opposite to the quick plug-in interface extending to the AC interface to avoid overlapping with the DC positive copper bar and the DC negative copper bar;

One end of the signal terminal is connected to the control circuit board, the other end is connected to the liner chip, and the DC positive copper bar, the DC negative copper bar and the AC copper bar are all connected to the liner chip;

The DC positive copper bar, the DC negative copper bar, the signal terminals and the AC copper bar are all fixed on the insulating shell.

Preferably, the AC copper bar includes a first AC copper bar and a second AC copper bar, and both the first AC copper bar and the second AC copper bar are facing a side opposite to the quick plug-in interface. The side extends to the AC interface; the first AC copper bar and the second AC copper bar are connected to the liner chip; the first AC copper bar and the second AC copper bar are fixed on the The insulating case described above.

Preferably, the number of the AC copper bar is one.

Preferably, the DC positive copper bar is provided with a DC positive pin, the DC negative copper bar is provided with a DC negative pin, the AC copper bar is provided with an AC pin, and the signal terminal and the liner chip One end of the connection is provided with terminal pins;

The DC positive pin, the DC negative pin, the AC pin and the terminal pins are all connected to the liner chip through the same connection method.

Preferably, the DC positive pins, the DC negative pins, the AC pins and the terminal pins are alternately distributed.

Preferably, the signal terminal and the control circuit board are screwed or inserted, or abutted by an elastic member.

Preferably, the AC copper bar, the liner chip, the DC positive copper bar, the DC negative copper bar, and the signal terminals are arranged symmetrically with respect to the middle section in the length direction.

Preferably, the closely laminated area between the DC positive copper bar and the DC negative copper bar is provided with insulating plates or filled with insulating glue.

Preferably, the DC positive copper bar, the DC negative copper bar and the signal terminals are all injection-molded in the insulating shell;

The AC copper bar is packaged in the insulating shell by injection molding or detachably and fixedly connected to the insulating shell through a connector.

Preferably, the insulating shell is integrally injection-molded with a Japanese-shaped insulating frame at the quick plug-in interface, and the DC positive copper bar and the DC negative copper bar are respectively located at the upper opening of the insulating frame. In the font structure and in the lower part of the font structure.

Preferably, positioning pins are integrally injection-molded on both sides of the quick plug-in interface.

Preferably, both sides of the communication interface are integrally injection-molded with handles.

Preferably, the power unit is provided with a heat sink, and the liner chip is welded on the upper surface of the heat sink.

Preferably, the liner chip is provided with a temperature sensor, one end of the signal terminal is connected to the control circuit board, and the other end is connected to the temperature sensor.

Preferably, the radiator is provided with two blind-insert quick water connectors and a cooling channel, wherein one of the blind-insert quick water connectors is arranged at the entrance of the cooling channel, and the other blind-insert quick water connector The quick water connector is arranged at the outlet of the cooling channel.

Preferably, the control circuit board is provided with an electrical signal interface and an optical signal interface.

Preferably, the control unit is provided with a control box and a top cover, the control circuit board is arranged in the control box, and ventilation holes are provided on the side of the control box and the top cover.

In the process of using the integrated power semiconductor device provided by the present invention, the DC positive copper bar, the DC negative copper bar, and the AC copper bar are connected to the liner chip of the single-phase bridge circuit, and one end of the signal terminal is connected to the control circuit board. The other end is connected to the liner chip; and the corresponding control is carried out through the built-in control circuit board; a radiator is integrated inside to dissipate heat from the liner chip; the converter module function can be realized at the device packaging level. Under the same power, the volume of power components combined with multiple devices can be reduced by more than 50% compared with conventional converter modules, that is, the power density of power components combined with multiple devices can be increased by more than 50% compared with conventional converter modules, achieving high integration, High power density.

In addition, because the DC positive copper bar and the DC negative copper bar are stacked up and down, and extend to the DC side to form a quick plug-in interface, a low-inductance quick-plug electrical direct connection between the external interface and the liner chip is realized. It is not only convenient to use, but also has good low-sensitivity performance.

In the process of assembly, the direct connection method of the main circuit board chip to the interface does not need to set a low-sensitivity busbar, which can significantly reduce the volume weight and cost of the integrated power semiconductor device; reduce the low-sensitivity busbar assembly and transfer process, The production process of the low-inductance busbar itself improves the production efficiency and solves the reliability problems caused by the transfer; it can also eliminate the large number of packaged components, pollution, and multi-material characteristic differences caused by the introduction of the low-inductance busbar. The problem of low reliability, improve product performance.

In addition, the signal terminals and the main circuit copper bars are integrated in the insulating shell, and are connected to the liner chip by the same process, which solves the problems of one-by-one assembly, positioning, and welding, which bring many processes, many tooling, low production efficiency, and difficult to guarantee accuracy. problem, the protection signal terminal is not easily deformed and easy to assemble.

In addition, the AC copper bar extends to the side opposite to the quick plug-in interface to avoid overlapping with the DC positive copper bar and DC negative copper bar; avoiding the need for communication between the AC copper bar and the DC positive copper bar and DC negative copper bar. The operation of opening the avoidance hole ensures the area of the copper bar and the stacked area of the DC positive copper bar and the DC negative copper bar, which can effectively improve the current carrying capacity and further ensure the low inductance performance.

In terms of interface and internal layout, an integrated fully enclosed "day"-shaped outer frame is adopted to ensure the insulation capacity of the quick plug-in interface, increase the width of the copper bar, and realize the compatibility of the interface with high voltage and large current carrying capacity.

The setting of the blind plug-in fast interface integrating water and electricity on the DC side is convenient for application. The positioning pin and the shell are integrally injection molded, with high positioning accuracy, ensuring the application effect of the blind plug-in quick interface integrating water and electricity.

The integrated handle structure of the shell is convenient for plug-in installation and transportation, and saves space.

The symmetrical setting of the middle section in the length direction improves the flow sharing performance.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

Fig. 1 is the main circuit diagram of the specific embodiment 1 of the integrated power semiconductor device provided by the present invention;

Fig. 2 is the structural representation of the AC side of the specific embodiment one of the integrated power semiconductor device provided by the present invention;

FIG. 3 is a schematic structural view of the DC side of Embodiment 1 of the integrated power semiconductor device provided by the present invention;

FIG. 4 is a schematic exploded view of Embodiment 1 of the integrated power semiconductor device provided by the present invention;

FIG. 5 is a schematic cross-sectional structure diagram of Embodiment 1 of the integrated power semiconductor device provided by the present invention;

FIG. 6 is a main circuit diagram of Embodiment 2 of the integrated power semiconductor device provided by the present invention;

Fig. 7 is a schematic structural diagram of the AC side of the second embodiment of the integrated power semiconductor device provided by the present invention;

Fig. 8 is a schematic structural diagram of the DC side of the second embodiment of the integrated power semiconductor device provided by the present invention;

FIG. 9 is a schematic exploded view of Embodiment 2 of the integrated power semiconductor device provided by the present invention;

FIG. 10 is a schematic cross-sectional structure diagram of Embodiment 2 of the integrated power semiconductor device provided by the present invention.

In Figure 1-10:

1 is the radiator, 10 is the blind plug type quick water connector, 2 is the liner chip, 20 is the temperature sensor, 3 is the insulating shell, 30 is the main body of the shell, 300 is the insulating frame, 301 is the insulating plate, 302 is the positioning pin , 303 is the handle, 31 is the DC positive copper bar, 310 is the DC positive pin, 32 is the DC negative copper bar, 320 is the DC negative pin, 33 is the AC copper bar, 330 is the AC pin, 34 is the signal terminal, 340 is the terminal pin, 341 is the terminal head, 35 is the first AC copper bar, 350 is the first AC pin, 36 is the second AC copper bar, 360 is the second AC pin, 4 is the control box, 5 is the The control circuit board, 50 is an electrical signal interface, 51 is an optical signal interface, and 6 is a top cover.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The core of the present invention is to provide an integrated power semiconductor device, which can realize the function of the converter module at the device packaging level, and has a high degree of integration and a small volume. Compared with conventional converter modules, the power density is improved, and it has the characteristics of low inductance and good current sharing. Simplify materials, improve transmission efficiency and reliability; realize the integration of main circuit and signal circuit, facilitate assembly, simplify connection process, improve production efficiency and yield. Easy production assembly and quick plug-in applications.

The integrated power semiconductor device provided by the present invention applies control to the liner chip through the control circuit board, so that it can be frequently switched in four states: on, on, off, and blocked; Connected to the outside, the electric energy can be converted between the DC positive pole, the DC negative pole and the AC pole. After a single or multiple integrated power semiconductor devices are combined, through a certain control method, functions such as rectification, inverter, and chopping can be completed. The heat loss generated during the energy conversion process can be taken away by the radiator to ensure that the junction temperature of the power semiconductor chip is within a safe range. The present invention is a main circuit of a single-phase bridge or a two-phase bridge or other structures. The power semiconductor chip included in the liner chip can be an IGBT, or a power semiconductor chip such as a MOSFET or a diode, depending on the actual situation.

Please refer to Figure 1 to Figure 10.

This specific embodiment discloses an integrated power semiconductor device, including:

A power unit, which is provided with a liner chip 2 and a radiator 1;

A control unit, which is provided with a control box 4 and a top cover 6, and a control circuit board 5 is provided in the control box 4;

The interconnection unit is arranged between the power unit and the control unit, and the interconnection unit is provided with an insulating shell 3 , a DC positive copper bar 31 , a DC negative copper bar 32 , a signal terminal 34 and at least one AC copper bar 33 .

The DC positive copper bar 31 and the DC negative copper bar 32 are stacked up and down and extended to the DC interface on the DC side. This DC interface is a DC fast electrical interface; the AC copper bar 33 extends to the side opposite to the DC interface to AC interface to avoid overlapping with DC positive copper bar 31 and DC negative copper bar 32;

One end of the signal terminal 34 is connected to the control circuit board 5, the other end is connected to the liner chip 2, and the DC positive copper bar 31, the DC negative copper bar 32 and the AC copper bar 33 are all connected to the liner chip 2;

The DC positive copper bar 31 , the DC negative copper bar 32 , the signal terminal 34 and the AC copper bar 33 are all fixed on the insulating shell 3 .

Under the control of the control unit, the power unit realizes the energy conversion function; the interconnection unit provides a channel for signal transmission between the power unit and the control unit, and provides a path for energy circulation between the power unit and the external electrical system, and at the same time, it also has a packaging shell And handle 303 functions.

Preferably, in order to control the heat dissipation of the circuit board 5 , ventilation holes can be provided on the side of the control box 4 and the top cover 6 .

The control circuit board 5 is arranged in the control box 4, and realizes the control, detection, protection and diagnosis of the power unit through the signal terminal 34; The signal interface 51 is connected with an external control power supply and performs signal communication with the outside.

Further, a temperature sensor 20 can be set on the liner chip 2, one end of the signal terminal 34 is connected to the control circuit board 5, and the other end is connected to the temperature sensor 20 for detecting the temperature of the liner chip 2, thereby avoiding excessive junction temperature and causing to the protective effect.

In the process of using the integrated power semiconductor device provided by this specific embodiment, the DC positive copper bar 31, the DC negative copper bar 32, and the AC copper bar 33 are connected to the main circuit, and one end of the signal terminal 34 is connected to the control circuit board 5 , the other end is connected to the liner chip 2; and the DC positive copper bar 31, the DC negative copper bar 32 and the AC copper bar 33 are all connected to the liner chip 2; the corresponding control is carried out through the control circuit board 5 to make it work in different states ; Internally integrated with a radiator 1 and a pair of liner chips 2 for self-dissipation; the function of the converter module can be realized at the device packaging level.

In addition, during the assembly process, because the DC positive copper bar 31 and the DC negative copper bar 32 are stacked up and down and extended to the DC side to form a quick plug-in interface; the connection between the external interface and the liner chip 2 is realized. Low inductance quick plug-in electrical direct connection; AC copper bar 33 extends to the other side opposite to the quick plug-in interface to avoid overlapping with DC positive copper bar 31 and DC negative copper bar 32; avoids AC copper bar The operation of opening avoidance holes between the DC positive copper bar 31 and the DC negative copper bar 32 ensures the area of the copper bar and the lamination area of the DC positive copper bar 31 and the DC negative copper bar 32, which can effectively improve the current carrying capacity. And achieve low sensitivity performance.

In addition, the integrated power semiconductor device provided by this specific embodiment does not need to be equipped with low-sensitivity busbars, which can significantly reduce the volume weight and cost of the device, reduce the low-sensitivity busbar assembly and transfer process and the production process of the low-sensitivity busbar itself, Improve production efficiency while solving the reliability problems caused by the transfer; it can also eliminate the problems of large number of packaged components, pollution, multi-material characteristic differences, and low reliability caused by the introduction of low-sensitivity busbars, and improve product performance. .

In a specific embodiment, as shown in Figure 1, the main circuit is a single-phase bridge circuit, and the AC place is an AC copper bar 33, that is, the AC copper bar 33 is connected to the single-phase bridge circuit, and the two ends of the single-phase bridge circuit are respectively DC+ and DC- are connected, that is, both ends of the single-phase bridge circuit are respectively connected with a DC positive copper bar 31 and a DC negative copper bar 32. Of course, the main circuit can also be a two-phase bridge circuit, or other structural forms, The details are determined according to the actual situation.

In another specific embodiment, the AC copper bar includes a first AC copper bar 35 and a second AC copper bar 36, and both the first AC copper bar 35 and the second AC copper bar 36 face to the side opposite to the quick plug-in interface. One side extends to the AC interface; the first AC copper bar 35 and the second AC copper bar 36 are connected to the liner chip; the first AC copper bar 35 and the second AC copper bar 36 are fixed in the insulating shell; as shown in Figure 6 As shown, it is the main circuit of the two-phase bridge, the two bridge arms are symmetrically designed, and share the DC positive copper bar and the DC negative copper bar, which can be controlled independently or work synchronously; AC (A) in Figure 6 is the first The AC copper bar 35, that is, the first AC copper bar 35 is connected to the A-phase circuit, and the AC (B) is the second AC copper bar 36, that is, the second AC copper bar 36 is connected to the B-phase circuit, and the A and B two-phase circuits DC+ and DC- are respectively connected to both ends of the two-phase circuit, that is, both ends of the A and B two-phase circuits are respectively connected to a DC positive copper bar 31 and a DC negative copper bar 32 .

When the main circuit is a two-phase bridge circuit, the DC positive copper bar 31 and the DC negative copper bar 32 are connected to the two-phase circuits, the first AC copper bar 35 is connected to one of the phase circuits, and the second AC copper bar 36 is connected to one of the two-phase circuits. The other phase circuit is connected, one end of the signal terminal 35 is connected to the control circuit board 5, and the other end is connected to the liner chip 2; and the DC positive copper bar 31, the DC negative copper bar 32, the first AC copper bar 35 and the second AC The copper bars 36 are all connected to the liner chip 2; the corresponding control is carried out through the control circuit board 5 to make it work in different states, and any one-phase circuit can be controlled independently, or two-phase circuits can be controlled separately or in parallel; the internal integration has The radiator 1 dissipates heat on the liner chip 2 by itself; the function of the two-phase bridge module is realized at the device packaging level.

On the basis of the foregoing embodiments, the DC positive copper bar 31 can be provided with a DC positive pin 310, the DC negative copper bar 32 can be provided with a DC negative pin 320, the AC copper bar 33 can be provided with an AC pin 330, and the signal terminal 34 The end connected to the liner chip 2 is provided with a terminal pin 340 ; the DC positive pin 310 , the DC negative pin 320 , the AC pin 330 and the terminal pin 340 are all connected to the liner chip 2 through the same connection method. When the AC copper bar 33 includes the first AC copper bar 35 and the second AC copper bar 36, the first AC copper bar 35 can be provided with the first AC pin 350, and the second AC copper bar 36 can be provided with the second AC pin 350. Pin 360 , DC positive pin 310 , DC negative pin 320 , first AC pin 350 , second AC pin 360 and terminal pin 340 are all connected to the liner chip 2 through the same connection method. The integration of the main circuit and the signal circuit is realized, the assembly is convenient, the connection process is simplified, and the production efficiency and yield rate are improved.

In this specific embodiment, the DC positive pin 310, the DC negative pin 320, the AC pin 330 and the terminal pin 340 are all connected to the liner chip 2 by welding; when the AC copper bar 33 includes the first AC copper When the row 35 and the second AC copper row 36, the DC positive pin 310, the DC negative pin 320, the first AC pin 350, the second AC pin 360 and the terminal pin 340 are all connected to the liner by welding. The chip 2 is connected; it can also be connected in other ways that meet the requirements, which will not be repeated here. The DC positive pin 310 , the DC negative pin 320 , the AC pin 330 , and the terminal pin 340 can all be set as bent pins, or other forms that meet the requirements, which will not be repeated here.

During the connection process, the DC positive pin 310, the DC negative pin 320, the AC pin 330, and the terminal pin 340 can be connected to the liner chip 2 in a unified manner. When the AC copper bar 33 includes the first AC copper bar 35 and the second AC copper bar 36, the DC positive pin 310, the DC negative pin 320, the first AC pin 350, the second AC pin 360 and the terminal pin 340 are uniformly connected to the liner chip 2, which can In the same process, the DC positive pin 310, the DC negative pin 320, the AC pin 330 and the terminal pin 340 are connected to the liner chip 2, which has obvious advantages in production efficiency; compared with using pins or other forms of terminals Compared with the way that the head 341 is soldered on the circuit board or bonding wire, the process of this solution is simple, and it can realize more reliable and efficient direct connection of signals.

Preferably, the DC positive pin 310, the DC negative pin 320, the AC pin 330 and the terminal pin 340 can be alternately distributed; when the AC copper bar 33 includes the first AC copper bar 35 and the second AC copper bar 36, The DC positive pin 310, the DC negative pin 320, the first AC pin 350, the second AC pin 360, and the terminal pin 340 are alternately distributed; to avoid interference and to facilitate the electrical connection with the liner chip 2 .

It should be noted that the positional relationship between the DC positive copper bar 31 and the DC negative copper bar 32 in this application document can be interchanged according to the design of the inner liner chip 2 .

One end of the signal terminal 34 connected to the control circuit board 5 is provided with a terminal head 341, and the terminal head 341 and the control circuit board 5 can be threaded, plugged, or contacted by an elastic member, depending on the actual situation. The situation is OK.

On the basis of the above embodiments, as shown in Figure 4, the AC copper bar 33, the liner chip 2, the DC positive copper bar 31, the DC negative copper bar 32 and the signal terminals 34 can be arranged symmetrically about the middle section in the length direction , to ensure good current sharing performance; as shown in Figure 9, the first AC copper bar 350 and the second AC copper bar 360 can be arranged symmetrically with respect to the middle section in the length direction; the liner chip 2, the DC positive copper bar 31, Both the DC negative copper bar 32 and the signal terminal 35 are arranged symmetrically with respect to the middle section in the length direction to ensure good current sharing performance, and due to the symmetrical structure design of the two-phase circuit, the functions and performance of the two are the same, and they can be interchanged when the circuit is connected , the ease of use and compatibility will be better.

As shown in Figure 5 and Figure 10, the closely laminated area between the DC positive copper bar 31 and the DC negative copper bar 32 is provided with an insulating plate 301 or filled with insulating glue. In the actual design process, the insulating shell 3 and the heat dissipation Insulating glue is poured into the cavity formed between the device 1 and the cavity formed between the insulating shell 3 and the control box 4, and the DC positive copper bar 31, the DC negative copper bar 32, and the AC copper bar 33 signal terminals in the insulating shell 3 34 through the insulating shell and pouring insulating glue to achieve high voltage insulation.

Preferably, as shown in Fig. 5 and Fig. 10, the insulating plate 301 is a part of the insulating shell 3, and the insulating plate 301 and the insulating shell 3 have an integrated structure. The insulating plate 301 can be selected to be retained or Cancellation will be determined according to the actual situation.

On the basis of the above-mentioned embodiments, the DC positive copper bar 31, the DC negative copper bar 32 and the signal terminals 34 can all be injection molded and wrapped in the insulating shell 3; the AC copper bar 33 can be injection molded and wrapped in the insulating shell 3, or through The connector is detachably and fixedly connected to the insulating shell 3 .

The setting method of injection molding package can improve the position accuracy of the DC positive copper bar 31, the DC negative copper bar 32 and the signal terminal 34, and reduce the error. Injection-molded package, good structural strength, not easy to deform, can improve connection reliability.

As shown in Figure 3 and Figure 8, the insulating shell 3 is integrally injection-molded with a Japanese-shaped insulating frame 300 at the quick plug-in interface, and the DC positive copper bar 31 and the DC negative copper bar 32 are respectively located on the upper part of the insulating frame 300 The inside of the square-shaped structure and the bottom of the square-shaped structure ensure the insulation of the two to the outside and each other; and there is no gap between the insulating frame 300 and the main body 30 of the shell, which can reduce the DC positive copper bar 31 and the DC negative copper bar. 32 and the insulation distance between the two to the outside, so that the width of the DC positive copper bar 31 and the DC negative copper bar 32 can be increased, and the current carrying capacity and low inductance performance can be improved.

As shown in Figure 3 and Figure 8, the two sides of the quick plug-in interface are integrally injection-molded with positioning pins 302. During the assembly process, the positioning pins 302 cooperate with the corresponding pin holes on other devices; compared with copper bars or The low-inductance busbar and shell assembly scheme, the DC positive copper bar 31, the DC negative copper bar 32 and the positioning pin 302 have high precision, small error, and good consistency. For quick plug-in connections, this method can provide more precise guidance and positioning to avoid failure or damage to external systems.

As shown in FIG. 4 and FIG. 9 , handles 303 are integrally injection-molded on both sides of the AC interface, which is convenient for plug-in application and handling. The handle 303 is injection-molded for the insulating shell 3, without additional separate assembly, which greatly utilizes the space, improves the power density and has good structural strength.

On the basis of the above embodiments, the liner chip 2 can be directly welded to the upper surface of the heat sink 1, without the need for a common semiconductor device substrate, the thermal resistance between the liner chip 2 and the heat sink 1 can be reduced, and there is It is beneficial to reduce the junction temperature of the substrate chip 2, and reduce the weight and volume.

The radiator 1 is provided with two blind-insert quick water connectors 10 and a cooling channel, wherein one blind-insert quick water connector 10 is arranged at the entrance of the cooling channel, and the other blind-insert quick water connector 10 is arranged in the cooling channel At the outlet of the channel, to take away the heat generated by the power unit and reduce the junction temperature of the substrate chip 2.

The blind plug-in quick water connector 10 in this application is combined with the quick plug-in interface and the positioning pin 302 to form a blind plug-in water and electricity integrated quick connection, so that the present invention can realize rapid connection of water and electricity at the same time, which is convenient for application.

In the integrated power semiconductor device provided by the present invention, under the same power, the volume of multiple power components combined with the device can be reduced by more than 50% compared with conventional converter modules, that is, the power density of the power components combined with multiple devices can be compared with conventional converter modules. Increased by more than 50%, achieving high integration, high power density, low inductance, and good current sharing characteristics.

Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same and similar parts between the various embodiments can be referred to each other. Any combination of all the embodiments provided by the present invention is within the protection scope of the present invention, and will not be repeated here.

The integrated power semiconductor device provided by the present invention has been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present invention, and the descriptions of the above embodiments are only used to help understand the method and core idea of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

An integrated power semiconductor device, characterized in that it comprises:

A power unit, which is provided with a liner chip (2);

A control unit, which is provided with a control circuit board (5);

An interconnection unit, which is arranged between the power unit and the control unit, and the interconnection unit is provided with an insulating shell (3), a DC positive copper bar (31), a DC negative copper bar (32), a signal terminal ( 34) and at least one AC copper bar (33);

The DC positive copper bar (31) and the DC negative copper bar (32) are stacked up and down, and extend to the DC side to form a quick plug-in interface; the AC copper bar (33) is connected to the The opposite side of the quick plug-in interface extends to the AC interface, so as to avoid overlapping with the DC positive copper bar (31) and the DC negative copper bar (32);

One end of the signal terminal (34) is connected to the control circuit board (5), the other end is connected to the liner chip (2), the DC positive copper bar (31), the DC negative copper bar ( 32) and the AC copper bar (33) are both connected to the liner chip (2);

The DC positive copper bar (31), the DC negative copper bar (32), the signal terminal (34) and the AC copper bar (33) are all fixed on the insulating shell (3).
The integrated power semiconductor device according to claim 1, wherein the AC copper bar comprises a first AC copper bar (35) and a second AC copper bar (36), and the first AC copper bar ( 35) and the second AC copper bar (36) extend to the side opposite to the quick plug-in interface to the AC interface; the first AC copper bar (35) and the second AC copper bar (36) are all connected to the liner chip; the first AC copper bar (35) and the second AC copper bar (36) are both fixed in the insulating shell.
The integrated power semiconductor device according to claim 1, characterized in that there is one AC copper bar (33).
The integrated power semiconductor device according to claim 2 or 3, characterized in that, the DC positive copper bar (31) is provided with a DC positive pin (310), and the DC negative copper bar (32) is provided with a DC pin (310). Negative pin (320), the AC copper bar (33) is provided with an AC pin (330), and one end of the signal terminal (34) connected to the liner chip (2) is provided with a terminal pin (340 );

The DC positive pin (310), the DC negative pin (320), the AC pin (330) and the terminal pin (340) are all connected to the liner chip ( 2) connect.
The integrated power semiconductor device according to claim 4, characterized in that, the DC positive pin (310), the DC negative pin (320), the AC pin (330) and the terminal lead The feet (340) are distributed in a staggered manner.
The integrated power semiconductor device according to claim 4, characterized in that, the signal terminal (34) and the control circuit board (5) are screwed or plugged, or contacted by an elastic member.
The integrated power semiconductor device according to claim 2 or 3, characterized in that, the AC copper bar (33), the liner chip (2), the DC positive copper bar (31), the DC Both the negative copper bar (32) and the signal terminal (34) are arranged symmetrically with respect to the middle section in the length direction.
The integrated power semiconductor device according to any one of claims 1-3, characterized in that, the tightly stacked area between the DC positive copper bar (31) and the DC negative copper bar (32) is provided with The insulating plate (301) may be filled with insulating glue.
The integrated power semiconductor device according to claim 2 or 3, characterized in that, the DC positive copper bar (31), the DC negative copper bar (32) and the signal terminals (34) are all injection molded and wrapped in Inside the insulating shell (3);

The AC copper bar (33) is packaged in the insulating casing (3) by injection molding or detachably and fixedly connected to the insulating casing (3) through a connector.
The integrated power semiconductor device according to claim 9, characterized in that, the insulating housing (3) is integrally injection-molded with a Japanese-shaped insulating frame (300) at the quick plug-in interface, and the DC The positive copper bar (31) and the DC negative copper bar (32) are respectively located in the upper and lower opening-shaped structures of the insulating frame (300).
The integrated power semiconductor device according to claim 9, characterized in that positioning pins (302) are integrally injection-molded on both sides of the quick plug-in interface.
The integrated power semiconductor device according to claim 9, characterized in that handles (303) are integrally injection-molded on both sides of the AC interface.
The integrated power semiconductor device according to claim 2 or 3, characterized in that, the power unit is provided with a radiator (1), and the substrate chip (2) is welded on the radiator (1) surface.
The integrated power semiconductor device according to claim 13, characterized in that, the substrate chip (2) is provided with a temperature sensor (20), and one end of the signal terminal (34) is connected to the control circuit board (5 ) connection, and the other end is connected with the temperature sensor (20).
The integrated power semiconductor device according to claim 13, characterized in that, the radiator (1) is provided with two blind-insert quick water connectors (10) and cooling channels, one of the blind-insert quick water connectors (10) A water connector (10) is arranged at the inlet of the cooling channel, and another blind plug-in quick water connector (10) is arranged at the outlet of the cooling channel.
The integrated power semiconductor device according to claim 2 or 3, characterized in that the control circuit board (5) is provided with an electrical signal interface (50) and an optical signal interface (51).
The integrated power semiconductor device according to claim 16, wherein the control unit is provided with a control box (4) and a top cover (6), and the control circuit board (5) is provided in the control box ( 4), the side of the control box (4) and the top cover (6) are provided with ventilation holes.