CN108122866B - A kind of integrated power module - Google Patents

Abstract

A kind of integrated power module comprising: radiator layer；Main circuit layer, it includes three-phase bridge arm power semiconductor circuits and at least two groups liner plate, wherein, first group of liner plate and second group of liner plate are arranged in contact respectively in the first side and second side of radiator layer, and the power semiconductor chip in three-phase bridge arm power semiconductor circuits is arranged in group by group on first group of liner plate and second group of liner plate；Control circuit is electrically connected, for controlling the working condition of three-phase bridge arm power semiconductor circuits with three-phase bridge arm power semiconductor circuits.Compared to existing power semiconductor; control circuit has been integrated in inside equipment by the power module; also there is no need to additionally configure control circuit at runtime in this way; so that power module can be realized the intelligentized control methods function such as driving, monitoring, protection, diagnosis, the generalization degree of equipment is improved.

Description

An integrated power module

technical field

The present invention relates to the technical field of power electronics, in particular to an integrated power module.

Background technique

Power semiconductor devices are widely used in rail transit, industrial frequency conversion and other fields, but standard packaged power semiconductor devices only have the function of switching tubes, and the integration is not high. The converter module, one of the core components of the converter, is composed of standard packaged power semiconductor devices, heat sinks, low-inductance busbars, gate drivers and structural components. , there are still many imperfections in power density, intelligence and convenient applications.

SUMMARY OF THE INVENTION

In order to solve the above problems, the present invention provides an integrated power module, which includes:

radiator layer;

The main circuit layer includes a three-phase bridge arm power semiconductor circuit and at least two groups of backing plates, wherein the first group of backing plates and the second group of backing plates are respectively arranged in contact on the first side and the first side of the heat sink layer. On the two sides, the power semiconductor chips in the three-phase bridge arm power semiconductor circuit are arranged in groups on the first group of backing plates and the second group of backing plates;

A control circuit, which is electrically connected to the three-phase bridge arm power semiconductor circuit, is used to control the working state of the three-phase bridge arm power semiconductor circuit.

According to an embodiment of the present invention, the main circuit layer further includes a chopper circuit, which is electrically connected to the control circuit, and the power semiconductor chips in the chopper circuit are arranged in groups on the first group of backing boards and the first group of substrates. The second set of liners.

According to an embodiment of the present invention, the upper arm power semiconductor chip and the lower arm power semiconductor chip in the three-phase bridge arm power semiconductor circuit are respectively disposed on the first group of backing plates and the second group of backing plates.

According to an embodiment of the present invention, the first group of lining plates and the second group of lining plates respectively comprise a plurality of lining plates arranged in a matrix.

According to an embodiment of the present invention, the control circuit includes a first control module and a second control module, wherein the first control module and the second control module are respectively distributed on both sides of the heat sink layer.

According to an embodiment of the present invention, DC positive copper bars and AC copper bars are arranged on one of the first and second lining plates, and DC negative copper bars are arranged on the other lining plates row and AC copper bar, and the DC positive copper bar and the AC copper bar on the same side are in a partially stacked plate shape, and the DC negative copper bar and the AC copper bar on the same side are in a partially stacked plate shape .

According to an embodiment of the present invention, the DC positive copper bar, the DC negative copper bar and the AC copper bar all have pins electrically connected to the conductive layer of the liner, wherein,

The DC positive copper bar close to the backing plate or the AC copper bar on the same side is provided with an escape hole for the pins on the AC copper bar on the same side away from the backing plate or the DC positive copper bar to pass through, and/or, The DC negative copper bar near the backing plate or the AC copper bar on the same side is provided with an escape hole for the pins on the AC copper bar on the same side far away from the backing plate or the DC negative copper bar to pass through.

According to an embodiment of the present invention, the first end of the heat sink layer is provided with a DC positive connector for connecting with the DC positive copper bar, and a DC negative connector for connecting with the DC negative copper bar A connector and an AC connector for connecting with the AC copper bar, wherein the DC positive connector, the DC negative connector and the AC connector are configured as pluggable electrical connectors.

According to an embodiment of the present invention, the power module further includes a current sensor disposed at the AC connector and electrically connected to the control circuit.

According to an embodiment of the present invention, an end shell is provided at the first end of the heat sink layer, and the DC positive connector, the DC negative connector, the AC connector and the plug-in pipe joint pass through the end shell.

According to an embodiment of the present invention, a first casing and a second casing are respectively provided on the first side and the second side of the heat sink layer, wherein,

The first housing, the end shell and the radiator layer form a first accommodating cavity, and the DC positive copper bar and the AC copper bar located on the first side of the radiator layer are located in the first accommodating cavity Inside;

The second housing, the end shell and the radiator layer form a second accommodating cavity, and the DC negative copper bar and the AC copper bar on the second side of the radiator layer are located in the second accommodating cavity Inside.

According to an embodiment of the present invention, insulating material is filled in the first accommodating cavity and/or the second accommodating cavity.

According to an embodiment of the present invention, a third casing and a fourth casing are respectively provided on the outer sides of the first casing and the second casing, and the third casing and the first casing are formed for accommodating the third accommodating cavity of the first control module, the fourth housing and the second shell form a fourth accommodating cavity for accommodating the second control module, the first control module and the second control module electrical connection.

According to an embodiment of the present invention, the first group of backing plates and the second group of backing plates are respectively connected to the first control module and the second control module through pins disposed on the conductive layers thereof, respectively.

According to an embodiment of the present invention, the power module further includes a screw rod passing through the third housing and the fourth housing respectively and passing through the end housing, and one end of the screw rod extends out of the end housing the first end face.

According to an embodiment of the present invention, a cooling liquid inlet and a cooling liquid outlet are provided on the first end face of the radiator layer, and pluggable pipe joints are provided on the cooling liquid inlet and the cooling liquid outlet.

According to an embodiment of the present invention, the power module further includes:

A temperature sensor is arranged on the backing plate and is signally connected with the control circuit.

According to an embodiment of the present invention, a guide hole is provided on the first end surface of the heat sink layer.

Compared with the existing power semiconductors, the power module provided by the present invention integrates the control circuit inside the device, so that no additional control circuit needs to be configured during operation, so that the power module can realize driving, monitoring, protection, Intelligent control functions such as diagnosis improve the generalization degree of the equipment.

At the same time, the power module adopts a water-cooling heat dissipation method without a substrate. Compared with the existing power module, the heat dissipation efficiency is higher, the volume is smaller, and the structure is simpler. In addition, the power module adopts a quick-plug connection method, which makes the disassembly and assembly of the equipment more convenient. For this power module, it can be conveniently combined in parallel according to actual needs.

Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the description, claims and drawings.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings required in the description of the embodiments or the prior art will be briefly introduced below:

1 is an exploded view of a power module according to an embodiment of the present invention;

FIG. 2 is a layered structure diagram of a power module according to an embodiment of the present invention;

3 is a schematic diagram of a circuit structure of a three-phase bridge arm power semiconductor circuit according to an embodiment of the present invention;

FIG. 4 shows a schematic diagram of a circuit structure of a three-phase bridge and a chopper power semiconductor circuit according to an embodiment of the present invention;

5 is a perspective view of a power semiconductor module according to an embodiment of the present invention.

In the drawings, identical parts are given the same reference numerals, which are not drawn to actual scale.

Detailed ways

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and examples, so as to fully understand and implement the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects. It should be noted that, as long as there is no conflict, each embodiment of the present invention and each feature of each embodiment can be combined with each other, and the formed technical solutions all fall within the protection scope of the present invention.

Meanwhile, in the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present invention. It will be apparent, however, to those skilled in the art that the present invention may be practiced without the specific details or in the specific manner described herein.

Aiming at the problems existing in the prior art, the present invention provides a new integrated power module. FIG. 1 and FIG. 2 respectively show an exploded diagram and a layered structure diagram of the power module in this embodiment.

As shown in FIG. 1 and FIG. 2 , in this embodiment, the power module 100 includes: a heat sink layer 1 , a main circuit layer 2 and a control circuit. The main circuit layer 2 includes three-phase bridge arm power semiconductor circuits and at least two groups of backing plates 21 . Wherein, the first group of lining plates 21 a are directly arranged on the first side surface of the heat sink layer 1 , and the second group of lining plates 21 b are directly arranged on the second side surface of the radiator layer 1 . The power semiconductor chips 22 in the three-phase bridge arm power semiconductor circuit are arranged in groups on the first group of backing plates 21a and the second group of backing plates 21b.

In this embodiment, the first group of lining plates 21a and the second group of lining plates 21b respectively include a plurality of lining plates arranged in a matrix. Wherein, each power semiconductor chip is correspondingly fixed on the corresponding backing plate, and forms a backing plate unit with the corresponding backing plate.

The backing plates included in the power module 100 provided by this embodiment are directly disposed on the two surfaces of the heat sink layer 1 , which can effectively avoid using the substrate of a standard packaged power semiconductor device. This arrangement can effectively reduce the thermal resistance between the power semiconductor chip and the heat sink layer, thereby improving the heat dissipation efficiency of the entire power module. At the same time, this arrangement can also make the structure of the power module 100 more compact, which helps to reduce the volume and weight of the entire power module. In addition, in this embodiment, the power semiconductor chips are arranged on both sides of the heat sink layer 1, so this can effectively increase the usable area of the heat sink layer 1, thereby helping to further improve the power density of the power module and reduce the power The volume of the module.

FIG. 3 shows a schematic diagram of the circuit structure of the three-phase bridge arm power semiconductor circuit in this embodiment.

As shown in FIG. 3 , the three-phase bridge arm power semiconductor circuit 301 includes six power semiconductor chips 22 . Wherein, in this embodiment, the power semiconductor chips forming the upper bridge arm of the power semiconductor circuit are preferably arranged on the first set of backing plates 21a, and each power semiconductor chip forming the lower bridge arm of the power semiconductor circuit is preferably arranged on the second set of lining plates 21a. on the lining plate 21b.

In this embodiment, according to actual needs, the main circuit layer may further include a chopper circuit, thereby forming a circuit structure as shown in FIG. 4 . The control terminal of the chopper circuit 302 is connected to the control circuit. In this embodiment, the chopper circuit 302 is composed of two power semiconductor chips, wherein the power semiconductor chips that form the upper bridge arm are preferably arranged on the first group of backing plates On 21a, the power semiconductor chips forming the lower bridge arms are preferably arranged on the second set of backing plates 21b.

It should be noted that, in different embodiments of the present invention, each power semiconductor chip included in the three-phase bridge arm power semiconductor circuit and/or the chopper circuit may be implemented by different chips, and the present invention is not limited thereto. For example, in one embodiment of the present invention, the power semiconductor chip may be implemented using an IGBT chip with a freewheeling diode.

In order to improve the space utilization rate of the radiator layer 1 , in this embodiment, the main body of the radiator layer 1 is preferably in a rectangular box shape, and the first side surface and the second side surface are oppositely arranged. In this embodiment, the upper surface of the heat sink layer 1 in FIG. 1 is taken as the first side surface, and the lower surface is the second side surface as an example for description. It should be noted that the backing plate may be provided on multiple surfaces of the heat sink layer 1, and the surfaces of the heat sink layer 1 provided with the backing plate are not limited to relative distribution.

Preferably, the backing plates (including the first group of backing plates 21a and the second group of backing plates 21b) can be directly fixed on the first side and the second side of the heat sink layer 1 by welding. And the power semiconductor chip 22 in the power semiconductor circuit can also be disposed on the corresponding backing plate by welding. This connection structure is simple, and better transfers the heat generated by the power semiconductor chips 22 to the heat sink layer 1 .

It should be pointed out that, in different embodiments of the present invention, according to actual needs, the lining plate 21 can be fixed on the side surface of the heat sink layer 1 in different reasonable ways, and the present invention is not limited thereto.

In this embodiment, the lining plates are preferably distributed in a matrix on the first side and the second side of the heat sink layer 1 . In this way, the backing plates can be closely arranged, so as to optimize the structure of the power module 100 and help to reduce the volume of the power module 100 and improve its power density.

In this embodiment, each device in the power semiconductor circuit is preferably connected by bonding wires. Of course, in other embodiments of the present invention, each device in the power semiconductor circuit can also be connected in other reasonable ways. The invention is not limited to this.

The DC positive copper bar 37 and the AC copper bar 39 are arranged on the first side of the heat sink layer 1, and the DC positive copper bar 37 and the AC copper bar 39 are arranged on the outer side of the first group of lining plates 21a, and are lined with the first group of lining plates 21a. Power transmission between the boards 21a. Both the DC positive copper bar 37 and the AC copper bar 39 are configured in a plate shape, and the two are partially overlapped in the up-down direction as shown in FIG. 1 . An insulating layer (not shown in the figure) is provided between the two and at the outermost side.

Similarly, the DC negative copper bar 38 and the AC copper bar 39 are arranged on the second side of the heat sink layer 1, and the DC negative copper bar 38 and the AC copper bar 39 are arranged on the outside of the liner unit 2, and are connected with the liner. Power transmission between units 2. Both the DC negative copper bar 38 and the AC copper bar 39 are configured in a plate shape, and they partially overlap in the up-down direction as shown in FIG. An insulating layer (not shown in the figure) is provided between the two and at the outermost side.

In one embodiment, the DC positive copper bar 37 , the DC negative copper bar 38 and the AC copper bar 39 all have pins 36 for connecting with the conductive layer of the corresponding backing plate to realize electrical transmission. For example, the DC positive copper bar 37 is far away from the first group of backing plates 21a, while the AC copper bar 39 is close to the first group of backing plates 21a, that is, the DC positive copper bar 37 is above the AC copper bar 39. In order to realize that the pins 36 of the DC positive copper bar 37 can contact the conductive layer of the first group of backing plates 21a, the AC copper bar 39 is provided with an escape hole 41 for the pins 36 of the DC positive copper bar to pass through.

It should be pointed out that in this embodiment, in the direction of the second side surface of the heat sink layer 1 , the positions and connection relationships of the DC negative copper bar 38 and the AC copper bar 39 are the same as the positions of the DC positive copper bar 37 and the AC copper bar 39 It is the same as or similar to the connection relationship, and will not be repeated here.

At the same time, it should also be noted that the structural relationship between the DC positive copper bar 37 and the AC copper bar 39, and the DC negative copper bar 38 and the AC copper bar 39 can be selected according to the actual situation. That is, the present application does not limit the relative upper and lower positional relationship between the DC positive copper bar 37 and the AC copper bar 39 , and the DC negative copper bar 38 and the AC copper bar 39 .

A DC positive connector 32 is provided at the first end of the heat sink layer 1 , and the DC positive connector 32 is connected to the DC positive copper bar 37 . At the same time, a DC negative connection 33 is provided at the first end of the heat sink layer 1 , and the DC negative connection 33 is connected to the DC negative copper bar 38 . In addition, an AC connector 35 for connecting with the AC copper bar 39 is also provided at the first end of the AC copper bar 39 .

In this embodiment, the DC positive connector 32 , the DC negative connector 33 and the AC connector 35 are preferably configured as plug-in electrical connectors for quick connection. At the same time, preferably, as shown in FIG. 1 , the DC positive connector 32 includes at least three elastic pieces 30 arranged oppositely and spaced apart. In addition, the DC negative connector 33 and the AC connector 35 can also be configured to include at least three elastic pieces 30 arranged oppositely and spaced apart. By configuring the DC positive connector 32 , the DC negative connector 33 and the AC connector 35 as such plug-in connectors, the power module 100 can be quickly and easily connected to the system by quick plugging.

It should be noted that, in different embodiments of the present invention, the DC positive connector 32 and the DC positive copper bar 37 can be either an integrated structure or a split structure. In the split manufacturing process, it can be fixed by welding, riveting or bolting. Similarly, the DC negative connector 33 and the DC negative copper bar 38 may be manufactured in an integrated manner, or may be of a separate structure, and fixed by welding, riveting or bolting. The AC connector 35 and the AC copper bar 39 may be manufactured in an integrated manner, or may be a separate structure, and may be fixed by welding, riveting, or bolting.

At the same time, it should also be pointed out that the AC connector 35 and the AC copper bar 39 shown in FIG. 1 are only a schematic illustration of their arrangement, not the specific structure and quantity of the AC connector 35 and the AC copper bar 39 be limited. In this embodiment, since the circuit included in the main circuit layer is a three-phase bridge arm power semiconductor circuit, the AC connector 35 and the AC copper bar 39 respectively include three sets of interfaces corresponding to the three-phase bridge arms, respectively. Three AC outputs of power semiconductor circuits.

In this embodiment, the radiator layer 1 preferably adopts a water cooling method for heat dissipation. As shown in FIG. 1 , a cooling liquid inlet 13 and a cooling liquid outlet are provided at the first end of the radiator layer 1 for connecting with an external cooling liquid system to dissipate heat from heat-generating components such as power semiconductor chips of the power module 100 . In addition, both the cooling liquid inlet 13 and the cooling liquid outlet are provided with plug-in type pipe joints 15 . With this arrangement, the power module 100 can be easily connected to an external coolant system. In addition, the plug-in type pipe joint 15 and the DC positive connector 32, the DC negative connector 33 and the AC connector 35 are all arranged at the same end of the radiator layer 1, and the connection between electricity and cooling liquid can be realized by blind plugging. Greatly improve the convenience of installation.

As shown in FIG. 1 and FIG. 2 , in this embodiment, an end shell 70 is provided at the first end of the heat sink layer 1 to define the DC positive connector 32 , the DC negative connector 33 , and the AC connector 35 and the position of the plug-in fitting 15. Specifically, the DC positive connector 32 , the DC negative connector 33 , the AC connector 35 and the plug-in type pipe joint 15 all pass through the end shell 70 , so as to be electrically connected to the outside world and the cooling liquid. Preferably, in this embodiment, the end housing 70 is made of insulating material such as plastic to play an insulating role.

A first housing 71 is provided on the first side of the heat sink layer 1 , and the first housing 71 forms a first accommodating cavity with the end shell 70 and the heat sink layer 1 . The DC positive copper bar 37, the AC copper bar 39 on the first side of the heat sink layer 1 and the first group of backing plates 21a are located in the first accommodating cavity.

Similarly, a second casing 73 is provided on the second side surface of the heat sink layer 1 , and the second casing 73 forms a second accommodating cavity with the end shell 70 and the heat sink layer 1 . The DC negative copper bar 38, the AC copper bar 39 on the second side of the heat sink layer 1 and the second group of backing plates 21b are located in the second accommodating cavity.

In this embodiment, the first accommodating cavity and the second accommodating cavity are filled with insulating material, so that reliable insulation of each device in the accommodating cavity can be achieved. For example, the insulating material may be silicone or silicone rubber, or the like. With this arrangement, the stable and normal operation of the power module 100 can be ensured, and the service life can be prolonged.

In one embodiment, a third housing 75 is provided outside the first housing 71 , and the third housing 75 and the first housing 71 form a third accommodating cavity. A fourth casing 77 is provided outside the second casing 73 , and the fourth casing 77 and the second casing 73 form a fourth accommodating cavity. Meanwhile, a control circuit board is arranged in both the third accommodating cavity and the fourth accommodating cavity. The control circuit board includes a first control module (ie a first control board) 6a and a second control module (ie a second control board) 6b. The first control module 6a is electrically connected to the first group of backing plates 21a, so as to realize intelligent control of driving, monitoring, protection and diagnosis of each device/chip on the first group of backing plates 21a. The second control module 6b is electrically connected to the second group of backing plates 21b, so as to realize intelligent control such as driving, monitoring, protection and diagnosis of each device/chip on the second group of backing plates 21b.

In this embodiment, the connections between the first casing 71 , the second casing 73 , the third casing 75 and the fourth casing 77 define the positions of other components of the power module 100 and play a supporting role, and at the same time , to ensure the normal operation of the power module 100 and avoid interference between different components. In addition, the above arrangement optimizes the overall structure of the power module 100, so that it has the advantages of high integration, small size, and light weight.

It can be seen from FIG. 5 that in this embodiment, there is an electrical connection between the first control module 6a and the second control module 6b, and the two cooperate to realize the control of each controlled device/chip in the power module 100 . Wherein, a power interface 61 is provided at the second end of one of the control modules, so as to provide low-voltage power for the control module. And preferably, the second end of the first control module 6a is provided with an optical fiber interface 62, so as to realize the communication between the control module and the upper control unit.

A current sensor interface (not shown in the figure) is also provided inside the control circuit board 6 to realize the connection between the control circuit board 6 and the current sensor 5 . The above setting can ensure the normal operation of the control circuit, facilitate signal transmission, and reduce interference. In addition, the above arrangement is helpful to optimize the layout of the power module 100 and has a high degree of generalization.

It should be noted that pins 23 are provided on the conductive layers of the first group of backing plates 21a and the second group of backing plates 21b. The pins 23 pass upward and downward respectively through the first housing 71 and the second housing 73 to be electrically connected with the corresponding control modules, so as to realize signal transmission between the control modules and the corresponding backing boards.

In this embodiment, in order to optimize the structure of the power module 100 and facilitate the arrangement of components such as the pins 23, an auxiliary backing plate 21' may also be provided. The auxiliary backing plate 21' is electrically connected to the backing plate 21. For example, in FIG. 1, in order to optimize the arrangement position of the pins 23, auxiliary backing plates 21' are provided on the first side and the second side near the second end face of the heat sink layer 1.

In this embodiment, the power module 100 preferably further includes a screw 11 . The screw 11 passes through the third housing 75 , the fourth housing 77 and the end housing 70 and extends beyond the first end face of the end housing 70 .

During the process of installing the power module 100 , the screw 11 is used for guiding and positioning the power module 100 . During the installation process, the screw 11 also plays the role of buffering the impact force. In addition, after the power module 100 is installed in place, the screw 11 also plays a role of fixing the power module 100 . In this embodiment, the two screws for cooperating with the third housing 75 and the fourth housing 77 respectively are preferably arranged on the diagonal line of the same end surface of the end housing 70 .

In this embodiment, a guide hole 12 is provided on the first end surface of the end shell 70 . Preferably, two guide holes 12 are provided on the first end surface of the end shell 70 and are located on a diagonal line. Specifically, two guide holes 12 and two screws 11 are distributed on four corners of the end shell 70 . During the installation process of the power module 100 , the guide holes 12 cooperate with the guide pins of the external system for precise guidance and positioning, and then the quick-plug connection of the electrical and cooling fluid pipelines is successfully realized. In addition, after the power module 100 is installed in place, the guide hole 12 also plays a role of fixing the power module 100 .

In order to collect temperature signals, a temperature sensor 8 may also be provided on the liner. In different embodiments of the present invention, the specific installation position of the temperature sensor is set according to the actual heating condition of the power semiconductor chip 22, and the control module can collect the temperature signal generated by the above-mentioned temperature sensor by inserting it for driving, Intelligent control of monitoring, protection and diagnosis.

According to actual needs, the power module 100 can also be provided with a current sensor 5 at the AC connector 35, and the current sensor 5 can be signal-connected to the control circuit. Of course, the installation position of the current sensor 5 is not limited to this, and may be installed at other positions. For example, in other embodiments of the present invention, the current sensor may also be on the control circuit board, and the control circuit board may collect current signals through the above current sensor for intelligent control such as driving, monitoring, protection, and diagnosis.

In addition, the power module 100 can also select a power semiconductor chip 22 with internal current measurement and temperature measurement, so as to realize fast and accurate monitoring at the chip level. The control circuit board collects the above-mentioned signals through corresponding plugs, and is used for intelligent control such as driving, monitoring, protection and diagnosis.

It is to be understood that the disclosed embodiments of the present invention are not limited to the specific structures or process steps disclosed herein, but should extend to equivalents of these features as understood by those of ordinary skill in the relevant art. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not meant to be limiting.

Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrases "one embodiment" or "an embodiment" in various places throughout the specification are not necessarily all referring to the same embodiment.

While the above examples serve to illustrate the principles of the invention in one or more applications, it will be apparent to those skilled in the art that the invention can be made in form, usage, and implementation without departing from the principles and spirit of the invention. Various modifications can be made to the details without creative labor. Accordingly, the invention is defined by the appended claims.

Claims (16)

1. a kind of integrated power module, which is characterized in that the power module includes:

Radiator layer；

Main circuit layer comprising three-phase bridge arm power semiconductor circuits and at least two groups liner plate, wherein first group of liner plate and second Group liner plate is arranged in contact respectively in the first side and second side of the radiator layer, the three-phase bridge arm power half Power semiconductor chip in conductor circuit is arranged in group by group on first group of liner plate and second group of liner plate；

Control circuit is electrically connected with the three-phase bridge arm power semiconductor circuits, for controlling the three-phase bridge arm power half The working condition of conductor circuit；

The control circuit includes the first control module and the second control module, in the first side of the radiator layer and second It is respectively arranged with first shell and second shell on side, is respectively arranged on the outside of the first shell and second shell Three shells and the 4th shell, the third shell and first shell form the third for accommodating first control module and accommodate Chamber, the 4th shell and second shell form the 4th accommodating chamber for accommodating second control module, first control Molding block and the electrical connection of the second control module.

2. power module as described in claim 1, which is characterized in that the main circuit layer further includes chopper circuit, with institute State control circuit electrical connection, first group of liner plate and the is arranged in the power semiconductor chip in the chopper circuit group by group On two groups of liner plates.

3. power module as described in claim 1, which is characterized in that the upper bridge in the three-phase bridge arm power semiconductor circuits Arm power semiconductor chip and lower bridge arm power semiconductor chip are separately positioned on first group of liner plate and second group of liner plate.

4. power module according to any one of claims 1 to 3, which is characterized in that first group of liner plate and second group Liner plate separately includes the liner plate of multiple matrix form arrangements.

5. power module according to any one of claims 1 to 3, which is characterized in that first group of liner plate and second group It is provided with the positive copper bar of direct current and AC copper-line on one group of liner plate in liner plate, the negative copper bar of direct current and friendship are provided on another group of liner plate Copper bar is flowed, and the positive copper bar of the direct current and the AC copper-line of the same side are the plate of part stacked setting, the negative copper of direct current The AC copper-line of row and the same side is the plate of part stacked setting.

6. power module as claimed in claim 5, which is characterized in that the positive copper bar of the direct current, the negative copper bar of direct current and exchange Copper bar all has the pin being electrically connected with the conductive layer of liner plate, wherein

The friendship for the same side far from liner plate is provided on the positive copper bar of the direct current of liner plate or the AC copper-line of same side The avoid holes that pin on stream copper bar or the positive copper bar of direct current passes through, and/or, the negative copper bar of the direct current or same side close to liner plate AC copper-line on be provided with AC copper-line or the evacuation that passes through of the pin on the negative copper bar of direct current for the same side far from liner plate Hole.

7. power module as claimed in claim 5, which is characterized in that the first end of the radiator layer be provided with for The direct current electrical connector of the positive copper bar connection of the direct current, the direct current negative electricity connector for being connect with the negative copper bar of the direct current and AC power connector for being connect with the AC copper-line, wherein the direct current electrical connector, direct current negative electricity connector and AC power connector is configured to plug-in electric connection.

8. power module as claimed in claim 7, which is characterized in that the power module further includes current sensor, is set It sets at the AC power connector, and is electrically connected to the control circuit.

9. power module as claimed in claim 7 or 8, which is characterized in that the first end of the radiator layer is provided with end Shell, and the direct current electrical connector, direct current negative electricity connector, AC power connector and plug-in pipe fitting pass through the end Shell.

10. power module as claimed in claim 9, which is characterized in that the first shell and the end housing and radiator layer Form the first accommodating chamber, the positive copper bar of the direct current and the AC copper-line in the first side of the radiator layer are located at institute It states in the first accommodating chamber；

The second shell and the end housing and radiator layer form the second accommodating chamber, the negative copper bar of the direct current and are located at described AC copper-line in the second side of radiator layer is located in second accommodating chamber.

11. power module as claimed in claim 10, which is characterized in that in first accommodating chamber and/or the second accommodating chamber Inside it is perfused with insulating materials.

12. power module as claimed in claim 10, which is characterized in that first group of liner plate and second group of liner plate lead to respectively The contact pin being arranged on its conductive layer is crossed to be correspondingly connected with first control module and the second control module.

13. power module as claimed in claim 12, which is characterized in that the power module further includes respectively by described the Three shells and the 4th shell and the screw rod for passing through the end housing, the first end of the end housing is extended in one end of the screw rod Face.

14. power module according to any one of claims 1 to 3, which is characterized in that in the first end of the radiator layer Face is provided with coolant inlet and cooling liquid outlet, and plug-in pipe is provided in the coolant inlet and cooling liquid outlet and is connect Head.

15. power module according to any one of claims 1 to 3, which is characterized in that the power module further include:

Temperature sensor, setting are connect on the liner plate, and with the control circuit signal.

16. power module according to any one of claims 1 to 3, which is characterized in that the first end face of the radiator layer On be provided with pilot hole.