CN108122866B - A kind of integrated power module - Google Patents
A kind of integrated power module Download PDFInfo
- Publication number
- CN108122866B CN108122866B CN201611072548.2A CN201611072548A CN108122866B CN 108122866 B CN108122866 B CN 108122866B CN 201611072548 A CN201611072548 A CN 201611072548A CN 108122866 B CN108122866 B CN 108122866B
- Authority
- CN
- China
- Prior art keywords
- liner plate
- group
- direct current
- power module
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of integrated power module comprising: radiator layer；Main circuit layer, it includes three-phase bridge arm power semiconductor circuits and at least two groups liner plate, wherein, first group of liner plate and second group of liner plate are arranged in contact respectively in the first side and second side of radiator layer, and the power semiconductor chip in three-phase bridge arm power semiconductor circuits is arranged in group by group on first group of liner plate and second group of liner plate；Control circuit is electrically connected, for controlling the working condition of three-phase bridge arm power semiconductor circuits with three-phase bridge arm power semiconductor circuits.Compared to existing power semiconductor; control circuit has been integrated in inside equipment by the power module; also there is no need to additionally configure control circuit at runtime in this way; so that power module can be realized the intelligentized control methods function such as driving, monitoring, protection, diagnosis, the generalization degree of equipment is improved.
Description
Technical field
The present invention relates to power electronics fields, specifically, being related to a kind of integrated power module.
Background technique
Power semiconductor is widely used in the fields such as rail traffic, industrial frequency conversion, but standard-package power semiconductor
Device only has the function of switching tube, and integrated level is not high.As the unsteady flow module of one of current transformer core component, then by marking
Quasi- encapsulation power semiconductor, radiator, low-inductance bus, gate driver and structural member etc. are constituted, due to by construction shape
The limitation of formula, device layout and device function, power density, intelligence and it is convenient in terms of there is also many not perfect
Place.
Summary of the invention
To solve the above problems, the present invention provides a kind of integrated power modules comprising:
Radiator layer；
Main circuit layer comprising three-phase bridge arm power semiconductor circuits and at least two groups liner plate, wherein first group of liner plate and
Second group of liner plate is arranged in contact respectively in the first side and second side of the radiator layer, the three-phase bridge arm function
Power semiconductor chip in rate semiconductor circuit is arranged in group by group on first group of liner plate and second group of liner plate；
Control circuit is electrically connected with the three-phase bridge arm power semiconductor circuits, for controlling the three-phase bridge arm function
The working condition of rate semiconductor circuit.
According to one embodiment of present invention, the main circuit layer further includes chopper circuit, with the control circuit electricity
It connects, the power semiconductor chip in the chopper circuit is arranged in group by group on first group of liner plate and second group of liner plate.
According to one embodiment of present invention, the upper bridge arm power semiconductor in the three-phase bridge arm power semiconductor circuits
Chip and lower bridge arm power semiconductor chip are separately positioned on first group of liner plate and second group of liner plate.
According to one embodiment of present invention, first group of liner plate and second group of liner plate separately include multiple matrix form rows
The liner plate of cloth.
According to one embodiment of present invention, the control circuit includes the first control module and the second control module,
In, first control module and the second control module are respectively distributed to the two sides of the radiator layer.
According to one embodiment of present invention, it is provided on one group of liner plate in first group of liner plate and second group of liner plate
The positive copper bar of direct current and AC copper-line are provided with the negative copper bar of direct current and AC copper-line, and the direct current cupric on another group of liner plate
Row is the plate of part stacked setting with the AC copper-line of the same side, and the AC copper-line of the negative copper bar of the direct current and the same side is portion
Divide the plate of stacked setting.
According to one embodiment of present invention, the positive copper bar of the direct current, the negative copper bar of direct current and AC copper-line all have with
The pin of the conductive layer electrical connection of liner plate, wherein
It is provided on the positive copper bar of the direct current of liner plate or the AC copper-line of same side for the same side far from liner plate
AC copper-line or the positive copper bar of direct current on the avoid holes that pass through of pin, and/or, close to the negative copper bar of the direct current or phase of liner plate
What the AC copper-line or the pin on the negative copper bar of direct current that same side of the confession far from liner plate is provided on ipsilateral AC copper-line passed through
Avoid holes.
According to one embodiment of present invention, the first end of the radiator layer be provided with for the direct current cupric
Arrange connection direct current electrical connector, the direct current negative electricity connector for connect with the direct current negative copper bar and be used for and the friendship
Flow the AC power connector of copper bar connection, wherein the direct current electrical connector, direct current negative electricity connector and AC power connector
It is configured to plug-in electric connection.
According to one embodiment of present invention, the power module further includes current sensor, is arranged in the exchange
At electric connector, and it is electrically connected to the control circuit.
According to one embodiment of present invention, the first end of the radiator layer is provided with end housing, and the direct current
Electrical connector, direct current negative electricity connector, AC power connector and plug-in pipe fitting pass through the end housing.
According to one embodiment of present invention, it is respectively arranged in the first side and second side of the radiator layer
First shell and second shell, wherein
The first shell and the end housing and radiator layer form the first accommodating chamber, the positive copper bar of the direct current and are located at
AC copper-line in the first side of the radiator layer is located in first accommodating chamber；
The second shell and the end housing and radiator layer form the second accommodating chamber, the negative copper bar of the direct current and are located at
AC copper-line in the second side of the radiator layer is located in second accommodating chamber.
According to one embodiment of present invention, insulation material is perfused in first accommodating chamber and/or the second accommodating chamber
Material.
According to one embodiment of present invention, third shell is respectively arranged on the outside of the first shell and second shell
Body and the 4th shell, the third shell and first shell form the third accommodating chamber for accommodating first control module,
4th shell and second shell form the 4th accommodating chamber for accommodating second control module, the first control mould
Block and the electrical connection of the second control module.
According to one embodiment of present invention, first group of liner plate and second group of liner plate pass through setting in its conduction respectively
Contact pin on layer is correspondingly connected with first control module and the second control module.
According to one embodiment of present invention, the power module further includes respectively by the third shell and described
Four shells and the screw rod for passing through the end housing, the first end face of the end housing is extended in one end of the screw rod.
According to one embodiment of present invention, the first end face of the radiator layer is provided with coolant inlet and cooling
Liquid outlet, is provided with plug-in pipe fitting in the coolant inlet and cooling liquid outlet.
According to one embodiment of present invention, the power module further include:
Temperature sensor, setting are connect on the liner plate, and with the control circuit signal.
According to one embodiment of present invention, pilot hole is provided in the first end face of the radiator layer.
Compared to existing power semiconductor, control circuit has been integrated in equipment by power module provided by the present invention
Portion, so at runtime also there is no need to additionally configure control circuit so that power module can be realized driving, monitoring,
The intelligentized control methods functions such as protection, diagnosis, improve the generalization degree of equipment.
Meanwhile the power module uses the water cooling method without substrate, compared to existing power module, heat dissipation
It is more efficient, and volume is smaller, structure is simpler.In addition, this power module uses the connection type of quick plug-in,
The dismounting for also allowing for equipment in this way is more convenient.For this power module, carry out with can be convenient according to actual needs
Parallel combination.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention can be by specification, right
Specifically noted structure is achieved and obtained in claim and attached drawing.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is required attached drawing in technical description to do simple introduction:
Fig. 1 is the explosive view of power module according to an embodiment of the invention；
Fig. 2 is the hierarchical diagram of power module according to an embodiment of the invention；
Fig. 3 is the electrical block diagram of three-phase bridge arm power semiconductor circuits according to an embodiment of the invention；
Fig. 4 shows three-phase bridge according to an embodiment of the invention and the circuit structure of chopped power semiconductor circuit shows
It is intended to；
Fig. 5 is the perspective view of power semiconductor modular according to an embodiment of the invention.
In the accompanying drawings, identical component uses identical appended drawing reference, and the attached drawing is not drawn according to the actual ratio.
Specific embodiment
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, how to apply to the present invention whereby
Technological means solves technical problem, and the realization process for reaching technical effect can fully understand and implement.It needs to illustrate
As long as not constituting conflict, each feature in each embodiment and each embodiment in the present invention can be combined with each other,
It is within the scope of the present invention to be formed by technical solution.
Meanwhile in the following description, for illustrative purposes and numerous specific details are set forth, to provide to of the invention real
Apply the thorough understanding of example.It will be apparent, however, to one skilled in the art, that the present invention can not have to tool here
Body details or described ad hoc fashion are implemented.
For the problems of in the prior art, the present invention provides a kind of new integrated power modules.Fig. 1 and figure
2 respectively illustrate the explosive view and hierarchical diagram of the power module in the present embodiment.
As depicted in figs. 1 and 2, in the present embodiment, power module 100 includes: radiator layer 1, main circuit layer 2 and control electricity
Road.Wherein, main circuit layer 2 includes three-phase bridge arm power semiconductor circuits and at least two groups liner plate 21.Wherein, first group of liner plate
It is arranged in the first side of radiator layer 1 to 21a direct contact type, is arranged in second group of liner plate 21b direct contact type and dissipates
In the second side of hot device layer 1.Power semiconductor chip 22 in three-phase bridge arm power semiconductor circuits is arranged in group by group
On one group of liner plate 21a and second group of liner plate 21b.
In the present embodiment, first group of liner plate 21a and second group of liner plate 21b separately include the liner plate that multiple matrix forms are arranged.
Wherein, each power semiconductor chip correspondence is fixed on corresponding liner plate, and forms liner plate unit with corresponding liner plate.
The liner plate that the power module 100 of the provided offer of the present embodiment is included is set up directly on two of radiator layer 1
On surface, in this way it is possible to prevente effectively from the substrate of the power semiconductor using standard packaging.This setup can have
Effect reduces the thermal resistance between power semiconductor chip and radiator layer, to improve the radiating efficiency of entire power module.Meanwhile
This setup can also make the structure of power module 100 more compact, facilitate the volume for reducing entire power module
And weight.Further, since power semiconductor chip is the two sides that radiator layer 1 is arranged in, therefore in this way may be used in the present embodiment
To effectively increase the utilization area of radiator layer 1, to help to further increase the power density of power module and reduce function
The volume of rate module.
Fig. 3 shows the electrical block diagram of three-phase bridge arm power semiconductor circuits in the present embodiment.
As shown in figure 3, three-phase bridge arm power semiconductor circuits 301 include six power semiconductor chips 22.Wherein, this reality
It applies in example, the power semiconductor chip for forming the upper bridge arm of power semiconductor circuits is preferably provided on first group of liner plate 21a,
The each power semiconductor chip for forming the lower bridge arm of power semiconductor circuits is preferably provided on second group of liner plate 21b.
In the present embodiment, according to actual needs, main circuit layer can also include chopper circuit, to be formed as shown in Figure 4
Circuit structure.Wherein, the control terminal of chopper circuit 302 connects to the control circuit, and in the present embodiment, chopper circuit 302 is by two
A power semiconductor chip is constituted, wherein the power semiconductor chip of bridge arm is preferably located on first group of liner plate 21a in formation
On, the power semiconductor chip for forming lower bridge arm is preferably provided on second group of liner plate 21b.
It should be pointed out that in different embodiments of the invention, three-phase bridge arm power semiconductor circuits and/or copped wave electricity
Each power semiconductor chip included in road can realize that the invention is not limited thereto using different chips.For example, In
In one embodiment of the present of invention, power semiconductor chip can be realized using the igbt chip with freewheeling diode.
In order to improve the space utilization rate of radiator layer 1, in the present embodiment, the main body of radiator layer 1 is preferably rectangular
It is box-like, also, first side and the setting of second side relative type motor.In the present embodiment, with the upper table of the radiator layer 1 in Fig. 1
Face is first side, and lower surface be second side for be illustrated.It should be noted that liner plate may be provided at radiator layer
On 1 multiple surfaces, and the surface for being provided with the radiator layer 1 of liner plate is also not necessarily limited to relative type motor distribution.
Preferably, liner plate (including first group of liner plate 21a and second group of liner plate 21b) can be directly solid by the way of welding
It is scheduled in the first side and second side of radiator layer 1.And the power semiconductor chip 22 in power semiconductor circuits can also
To be arranged on corresponding liner plate by welding.This connection structure is simple, and preferably by power semiconductor chip
In 22 heat transfers to radiator layer 1 generated.
It should be pointed out that in different embodiments of the invention, according to actual needs, liner plate 21 can be by different
Rational method is fixed on the side of radiator layer 1, and the invention is not limited thereto.
In the present embodiment, liner plate is preferably in matrix form distribution in the first side and second side of radiator layer 1.It is this
Mode enables to liner plate close-packed arrays, to optimize the structure of power module 100, facilitates the body for reducing power module 100
It accumulates and improves its power density.
In the present embodiment, each device in power semiconductor circuits is preferably attached by bonding line, certainly, In
In other embodiments of the invention, each device in power semiconductor circuits can also be connected by other reasonable manners
It connects, the invention is not limited thereto.
The positive copper bar 37 of direct current and AC copper-line 39, and the positive copper bar 37 of direct current are set in the first side of radiator layer 1
The outside of first group of liner plate 21a is set with AC copper-line 39, and electric energy transmits between first group of liner plate 21a.Direct current cupric
Row 37 and AC copper-line 39 are configured to plate, and the two partly overlaps in up and down direction as shown in Figure 1.Therebetween with
And insulating layer (not shown) is arranged in outermost.
Similarly, the negative copper bar 38 of direct current and AC copper-line 39 are set in the second side of radiator layer 1, and direct current is negative
The outside of liner plate unit 2 is arranged in copper bar 38 and AC copper-line 39, and electric energy transmits between liner plate unit 2.The negative copper bar of direct current
38 and AC copper-line 39 be configured to plate, the two partly overlaps in up and down direction as shown in Figure 1, and the negative copper bar of direct current
38 relative to AC copper-line 39 far from liner plate unit 2.Therebetween and insulating layer (not shown) is arranged in outermost.
In one embodiment, the positive copper bar 37 of direct current, the negative copper bar 38 of direct current and AC copper-line 39 all have pin 36, are used for
It connect with the conductive layer of corresponding liner plate to realize electrical transmission.For example, the positive copper bar 37 of direct current is far from first group of liner plate 21a, and exchange
Copper bar 39 is close to first group of liner plate 21a, it is, the positive copper bar 37 of direct current is on AC copper-line 39.In order to realize direct current cupric
The pin 36 of row 37 can be provided with avoid holes 41, on AC copper-line 39 with the conductive layer contact of first group of liner plate 21a to be used for
The pin 36 of the positive copper bar of direct current passes through.
It should be pointed out that in the present embodiment, on the second side direction of radiator layer 1, the negative copper bar 38 of direct current and friendship
The position of stream copper bar 39 and connection relationship and the position and connection relationship of the positive copper bar 37 of direct current and AC copper-line 39 are identical or approximate,
Details are not described herein.
It is also desirable to explanation, the positive copper bar 37 of direct current and AC copper-line 39, the negative copper bar 38 of direct current and AC copper-line 39
Between structural relation can select according to the actual situation.It is, the application do not limit the positive copper bar 37 of direct current with exchange
Copper bar 39, the opposite overlying relation of direct current negative copper bar 38 and AC copper-line 39.
In the first end of radiator layer 1, direct current electrical connector 32, direct current electrical connector 32 and the positive copper bar of direct current are set
37 connections.Meanwhile 33 are connected in the first end of radiator layer 1 setting direct current negative electricity, direct current negative electricity connects 33 and the negative copper bar of direct current
38 connections.Also, the AC power connector 35 for connecting with AC copper-line 39 is additionally provided in the first end of AC copper-line 39.
In the present embodiment, direct current electrical connector 32, direct current negative electricity connector 33 and AC power connector 35 are preferably
It is configured to plug-in electric connection, for quickly connecting.It is preferred that as shown in Figure 1, direct current electrical connector 32 includes
The spaced elastic slice 30 of at least three relative type motors.In addition, direct current negative electricity connector 33 and AC power connector 35 similarly may be used
To be set as including the spaced elastic slice 30 of at least three relative type motors.By the way that direct current electrical connector 32, direct current negative electricity are connected
Connect device 33 and AC power connector 35 be configured to this plug-in connector can by power module 100 smoothly and simply with system
Fast insert-pull connection.
It should be pointed out that in different embodiments of the invention, direct current electrical connector 32 and the positive copper bar 37 of direct current were both
It can be integrated, or split type structure.In split type manufacturing process, can by welding, riveting or
The connection types such as bolt are fixed.Similarly, direct current negative electricity connector 33 both can be integrated manufacture with the negative copper bar 38 of direct current,
It can be split type structure, and fixed by connection types such as welding, riveting or bolts.AC power connector 35 with exchange copper
Row 39 can be integration manufacture, or split type structure, and fixed by connection types such as welding, riveting or bolts.
It is also desirable to which, it is noted that AC power connector shown in FIG. 1 35 and AC copper-line 39 are only schematically
Illustrate its arrangement mode, is not to be defined to AC power connector 35 and the specific structure and quantity of AC copper-line 39.
In the present embodiment, since the circuit that main circuit layer includes is three-phase bridge arm power semiconductor circuits, AC power connector 35
Three group interfaces are accordingly respectively included with AC copper-line 39, this three group interface corresponds respectively to three-phase bridge arm power semiconductor circuits
Three ac output ends.
In the present embodiment, radiator layer 1 is preferably by the way of water-cooling.As shown in Figure 1, in radiator layer 1
First end is provided with coolant inlet 13 and cooling liquid outlet, to be used to connect with external coolant system, to power module 100
The heat generating components heat dissipation such as power semiconductor chip.Also, plug is provided in coolant inlet 13 and cooling liquid outlet
Formula pipe fitting 15.Easily this power module 100 can be connect with external coolant system by this set.In addition,
This plug-in pipe fitting 15 is arranged at scattered with direct current electrical connector 32, direct current negative electricity connector 33 and AC power connector 35
The same end of hot device layer 1 can be realized by blindmate form and electrically be connect with coolant liquid, greatly improve installation convenience.
As depicted in figs. 1 and 2, in the present embodiment, the first end of radiator layer 1 is provided with end housing 70, for limiting
The position of direct current electrical connector 32, direct current negative electricity connector 33, AC power connector 35 and plug-in pipe fitting 15.Specifically
Ground, direct current electrical connector 32, direct current negative electricity connector 33, AC power connector 35 and plug-in pipe fitting 15 both pass through end housing
70, to electrically be connect with coolant liquid with the external world.Preferably, in the present embodiment, end housing 70 by the insulating materials such as plastics be made with
Play insulating effect.
First shell 71, and first shell 71 and end housing 70 and radiator are set in the first side of radiator layer 1
Layer 1 forms the first accommodating chamber.The positive copper bar 37 of direct current, and the AC copper-line 39 in the first side of radiator layer 1 and
One group of liner plate 21a is located in the first accommodating chamber.
Similarly, second shell 73 is set in the second side of radiator layer 1, and second shell 73 and end housing 70 and
Radiator layer 1 forms the second accommodating chamber.The negative copper bar 38 of direct current, and the AC copper-line in the second side of radiator layer 1
39 and second group of liner plate 21b is located in the second accommodating chamber.
In the present embodiment, it is perfused with insulating materials in the first accommodating chamber and the second accommodating chamber, can also be realized in this way
The reliable insulation of each device in accommodating chamber.For example, insulating materials can be silica gel or silicon rubber etc..It can be protected by this set
It demonstrate,proves stablizing for power module 100 to work normally, prolong the service life.
In one embodiment, third shell 75, third shell 75 and first shell are set in the outside of first shell 71
71 form third accommodating chamber.In the outside of second shell 73, the 4th shell 77, the 4th shell 77 and the formation of second shell 73 are set
4th accommodating chamber.Meanwhile control circuit board is provided in third accommodating chamber and the 4th accommodating chamber.Wherein, control circuit board
Including the first control module (i.e. the first control panel) 6a and the second control module (i.e. the second control panel) 6b.First control module 6a
It is electrically connected with first group of liner plate 21a, to realize driving, monitoring, the protection to each devices/chips on first group of liner plate 21a
With diagnosis etc. intelligentized control methods.Second control module 6b is electrically connected with second group of liner plate 21b, to realize to second group of liner plate
The intelligentized control methods such as driving, monitoring, protection and the diagnosis of the upper each devices/chips of 21b.
In the present embodiment, the connection between first shell 71, second shell 73, third shell 75 and the 4th shell 77 is limited
The positions of other components of power module 100, and supporting role is played, meanwhile, guarantee the normal work of power module 100
Make, avoids the interference between different components.In addition, above-mentioned setting optimizes the overall structure of power module 100, make it have
The advantages that integrated level is high, small in size, light-weight.
In conjunction with Fig. 5 as can be seen that in the present embodiment, exists between the first control module 6a and the second control module 6b and be electrically connected
It connects, the two ordinatedly realizes the control to controlled devices/chips each in power module 100.Wherein, a control mould wherein
The second end of block is provided with power interface 61, for providing low-tension supply for control module.And preferably, the first control mould
The second end of block 6a is provided with optical fiber interface 62, to realize the communication of control module Yu top level control unit.
It is additionally provided with current sensor interface (not shown) in the inside of control circuit board 6, to realize control circuit
The connection of plate 6 and current sensor 5.It can guarantee the normal work of control circuit by above-mentioned setting, and be conducive to signal biography
It is defeated, reduce interference.In addition, above-mentioned set-up mode facilitates the optimization layout of power module 100, generalization degree is high.
It should be noted that being provided with contact pin 23 on the conductive layer of first group of liner plate 21a and second group of liner plate 21b.
Contact pin 23 is each passed through first shell 71 and second shell 73 up and down and is electrically connected with corresponding control module, thus real
Signal between existing control module and corresponding liner plate transmits.
In the present embodiment, in order to optimize the structure of power module 100, facilitates the setting of the components such as contact pin 23, can also set
Set auxiliary liner plate 21 '.The auxiliary liner plate 21 ' is electrically connected with liner plate 21.For example, in Fig. 1, in order to optimize the laying position of contact pin 23
It sets, auxiliary liner plate 21 ' is provided in the first side and second side close to the second end face of radiator layer 1.
In the present embodiment, power module 100 also includes preferably screw rod 11.Screw rod 11 passes through third shell the 75, the 4th
Shell 77 and end housing 70 simultaneously extend to except the first end face of end housing 70.
During installation power module 100, which is used to be oriented to and position for power module 100.It is installing
In the process, screw rod 11 also acts the effect of cushion impact forces.In addition, the screw rod 11 is also after power module 100 is installed in place
Play the role of rigid power module 100.In the present embodiment, it is respectively used to cooperate with third shell 75 and the 4th shell 77
Two screw rods being arranged are preferably provided on the diagonal line of same end face of end housing 70.
In the present embodiment, pilot hole 12 is provided in the first end face of end housing 70.Preferably, in the first end of end housing 70
Two pilot holes 12 are set on face, and are located on diagonal line.Specifically, two pilot holes 12 and two screw rods 11 are distributed in end housing
On 70 four angles.In 100 installation process of power module, first with pilot hole 12 and the guide pin of extraneous system, carry out
Accurate guiding and positioning, and then smoothly realize and electrically connect with the quick plug-in of coolant line.In addition, in power module
After 100 are installed in place, which also acts the effect of rigid power module 100.
In order to carry out the acquisition of temperature signal, temperature sensor 8 is also provided on liner plate.It is real in difference of the invention
It applies in example, the specific installation site of temperature sensor is set according to the practical heat condition of power semiconductor chip 22, control
Module can be acquired by the temperature signal that contact pin generates above-mentioned temperature sensor, for driving, monitoring, protect
And the intelligentized control methods such as diagnosis.
According to actual needs, current sensor 5 can also be arranged in power module 100 at AC power connector 35, this electricity
Flow sensor 5 can be connect with control circuit signal.Certainly, the setting position of current sensor 5 is without being limited thereto, also can be set
In other positions.For example, in other embodiments of the invention, current sensor can also control electricity in control circuit board
Road plate can carry out current signal acquisition by above-mentioned current sensor, to be used to the intelligence such as drive, monitor, protect and diagnose
Energyization control.
In addition, the internal power semiconductor chip 22 measured with current measurement and temperature also can be selected in power module 100,
To realize the fast and accurately monitoring of chip-scale.Control circuit board is acquired above-mentioned signal by respective pins, for driving
The intelligentized control methods such as dynamic, monitoring, protection and diagnosis.
It should be understood that disclosed embodiment of this invention is not limited to specific structure disclosed herein or processing step
Suddenly, the equivalent substitute for these features that those of ordinary skill in the related art are understood should be extended to.It should also be understood that
It is that term as used herein is used only for the purpose of describing specific embodiments, and is not intended to limit.
" one embodiment " or " embodiment " mentioned in specification means the special characteristic described in conjunction with the embodiments, structure
Or characteristic is included at least one embodiment of the present invention.Therefore, the phrase " reality that specification various places throughout occurs
Apply example " or " embodiment " the same embodiment might not be referred both to.
Although above-mentioned example is used to illustrate principle of the present invention in one or more application, for the technology of this field
For personnel, without departing from the principles and ideas of the present invention, hence it is evident that can in form, the details of usage and implementation
It is upper that various modifications may be made and does not have to make the creative labor.Therefore, the present invention is defined by the appended claims.
Claims (16)
1. a kind of integrated power module, which is characterized in that the power module includes:
Radiator layer；
Main circuit layer comprising three-phase bridge arm power semiconductor circuits and at least two groups liner plate, wherein first group of liner plate and second
Group liner plate is arranged in contact respectively in the first side and second side of the radiator layer, the three-phase bridge arm power half
Power semiconductor chip in conductor circuit is arranged in group by group on first group of liner plate and second group of liner plate；
Control circuit is electrically connected with the three-phase bridge arm power semiconductor circuits, for controlling the three-phase bridge arm power half
The working condition of conductor circuit；
The control circuit includes the first control module and the second control module, in the first side of the radiator layer and second
It is respectively arranged with first shell and second shell on side, is respectively arranged on the outside of the first shell and second shell
Three shells and the 4th shell, the third shell and first shell form the third for accommodating first control module and accommodate
Chamber, the 4th shell and second shell form the 4th accommodating chamber for accommodating second control module, first control
Molding block and the electrical connection of the second control module.
2. power module as described in claim 1, which is characterized in that the main circuit layer further includes chopper circuit, with institute
State control circuit electrical connection, first group of liner plate and the is arranged in the power semiconductor chip in the chopper circuit group by group
On two groups of liner plates.
3. power module as described in claim 1, which is characterized in that the upper bridge in the three-phase bridge arm power semiconductor circuits
Arm power semiconductor chip and lower bridge arm power semiconductor chip are separately positioned on first group of liner plate and second group of liner plate.
4. power module according to any one of claims 1 to 3, which is characterized in that first group of liner plate and second group
Liner plate separately includes the liner plate of multiple matrix form arrangements.
5. power module according to any one of claims 1 to 3, which is characterized in that first group of liner plate and second group
It is provided with the positive copper bar of direct current and AC copper-line on one group of liner plate in liner plate, the negative copper bar of direct current and friendship are provided on another group of liner plate
Copper bar is flowed, and the positive copper bar of the direct current and the AC copper-line of the same side are the plate of part stacked setting, the negative copper of direct current
The AC copper-line of row and the same side is the plate of part stacked setting.
6. power module as claimed in claim 5, which is characterized in that the positive copper bar of the direct current, the negative copper bar of direct current and exchange
Copper bar all has the pin being electrically connected with the conductive layer of liner plate, wherein
The friendship for the same side far from liner plate is provided on the positive copper bar of the direct current of liner plate or the AC copper-line of same side
The avoid holes that pin on stream copper bar or the positive copper bar of direct current passes through, and/or, the negative copper bar of the direct current or same side close to liner plate
AC copper-line on be provided with AC copper-line or the evacuation that passes through of the pin on the negative copper bar of direct current for the same side far from liner plate
Hole.
7. power module as claimed in claim 5, which is characterized in that the first end of the radiator layer be provided with for
The direct current electrical connector of the positive copper bar connection of the direct current, the direct current negative electricity connector for being connect with the negative copper bar of the direct current and
AC power connector for being connect with the AC copper-line, wherein the direct current electrical connector, direct current negative electricity connector and
AC power connector is configured to plug-in electric connection.
8. power module as claimed in claim 7, which is characterized in that the power module further includes current sensor, is set
It sets at the AC power connector, and is electrically connected to the control circuit.
9. power module as claimed in claim 7 or 8, which is characterized in that the first end of the radiator layer is provided with end
Shell, and the direct current electrical connector, direct current negative electricity connector, AC power connector and plug-in pipe fitting pass through the end
Shell.
10. power module as claimed in claim 9, which is characterized in that the first shell and the end housing and radiator layer
Form the first accommodating chamber, the positive copper bar of the direct current and the AC copper-line in the first side of the radiator layer are located at institute
It states in the first accommodating chamber；
The second shell and the end housing and radiator layer form the second accommodating chamber, the negative copper bar of the direct current and are located at described
AC copper-line in the second side of radiator layer is located in second accommodating chamber.
11. power module as claimed in claim 10, which is characterized in that in first accommodating chamber and/or the second accommodating chamber
Inside it is perfused with insulating materials.
12. power module as claimed in claim 10, which is characterized in that first group of liner plate and second group of liner plate lead to respectively
The contact pin being arranged on its conductive layer is crossed to be correspondingly connected with first control module and the second control module.
13. power module as claimed in claim 12, which is characterized in that the power module further includes respectively by described the
Three shells and the 4th shell and the screw rod for passing through the end housing, the first end of the end housing is extended in one end of the screw rod
Face.
14. power module according to any one of claims 1 to 3, which is characterized in that in the first end of the radiator layer
Face is provided with coolant inlet and cooling liquid outlet, and plug-in pipe is provided in the coolant inlet and cooling liquid outlet and is connect
Head.
15. power module according to any one of claims 1 to 3, which is characterized in that the power module further include:
Temperature sensor, setting are connect on the liner plate, and with the control circuit signal.
16. power module according to any one of claims 1 to 3, which is characterized in that the first end face of the radiator layer
On be provided with pilot hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072548.2A CN108122866B (en) | 2016-11-28 | 2016-11-28 | A kind of integrated power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072548.2A CN108122866B (en) | 2016-11-28 | 2016-11-28 | A kind of integrated power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108122866A CN108122866A (en) | 2018-06-05 |
| CN108122866B true CN108122866B (en) | 2019-11-29 |
Family
ID=62226631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611072548.2A Active CN108122866B (en) | 2016-11-28 | 2016-11-28 | A kind of integrated power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108122866B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023092442A1 (en) * | 2021-11-26 | 2023-06-01 | 中车株洲电力机车研究所有限公司 | Integrated power semiconductor apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061775B2 (en) * | 2002-01-16 | 2006-06-13 | Rockwell Automation Technologies, Inc. | Power converter having improved EMI shielding |
| DE102008061468A1 (en) * | 2008-12-10 | 2010-06-17 | Siemens Aktiengesellschaft | Power converter module with cooled busbar |
| CN105578838B (en) * | 2014-10-16 | 2018-01-05 | 中山大洋电机股份有限公司 | A kind of electric machine controller |
| CN104486901B (en) * | 2014-11-19 | 2016-03-23 | 株洲南车时代电气股份有限公司 | Radiating insulating liner plate, package module comprising this liner plate and preparation method thereof |
| CN205430072U (en) * | 2016-03-17 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Converter power module |
| CN205725420U (en) * | 2016-03-28 | 2016-11-23 | 上海中电罗莱电气股份有限公司 | Rolling stock power model and the current transformer of rolling stock |
-
2016
- 2016-11-28 CN CN201611072548.2A patent/CN108122866B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108122866A (en) | 2018-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8107241B2 (en) | Electric power conversion apparatus including cooling units | |
| CN111800986B (en) | Motor controller based on discrete device | |
| KR20040083480A (en) | Compact fluid cooled power converter supporting multiple circuit boards | |
| CN207098959U (en) | Water cooling substrate and the integrated auxiliary power module of commutation inversion | |
| JP2012064609A (en) | Semiconductor power module and power converter | |
| CN108122871B (en) | A kind of H bridge arm two-side radiation power module | |
| JP2023505595A (en) | Cooling device for semiconductor switch elements, power inverter device, and assembly comprising power inverter device and electric machine | |
| CN107786070B (en) | Intelligent power module, motor controller and vehicle | |
| CN108122866B (en) | A kind of integrated power module | |
| CN110165907A (en) | A kind of multi-functional high-density power unit applied to vehicle-mounted energy storage type guide rail electric car | |
| WO2022218249A1 (en) | Integrated vehicle inverter assembly, and vehicle | |
| CN108122865B (en) | A kind of H bridge arm power module for track vehicle | |
| CN108123614B (en) | Power module | |
| CN115084822A (en) | Phased array antenna assembly | |
| CN108123613A (en) | A kind of power module for track vehicle | |
| CN204497998U (en) | Electric vehicle drives thick film circuit inversion module | |
| CN107818961B (en) | A kind of intelligent power module for track vehicle | |
| CN115622474B (en) | Sealed water-cooling motor controller | |
| CN220711877U (en) | IGBT hydrogen production power supply unit structure | |
| CN217643158U (en) | Silicon carbide DC/DC power module | |
| CN219019296U (en) | Novel power management terminal | |
| WO2009104558A1 (en) | Optical interconnection device | |
| CN212463791U (en) | Self-adaptive silicon chain voltage regulating device | |
| CN220306422U (en) | Energy storage device and power supply system | |
| CN212381608U (en) | Compact water-cooling plate layout structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |