CN107818961B - A kind of intelligent power module for track vehicle - Google Patents
A kind of intelligent power module for track vehicle Download PDFInfo
- Publication number
- CN107818961B CN107818961B CN201611072561.8A CN201611072561A CN107818961B CN 107818961 B CN107818961 B CN 107818961B CN 201611072561 A CN201611072561 A CN 201611072561A CN 107818961 B CN107818961 B CN 107818961B
- Authority
- CN
- China
- Prior art keywords
- liner plate
- accommodating chamber
- direct current
- radiator
- power module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention proposes a kind of intelligent power module for track vehicle, which includes radiator, has the coolant inlet being connected to the inner cavity of the radiator and cooling liquid outlet；The one side of housing unit, the housing unit and the radiator forms accommodating chamber；Liner plate unit in the accommodating chamber is set, the power semiconductor chip that the liner plate unit has liner plate and is fixed on the liner plate, wherein, the liner plate contact is arranged on the surface of the radiator, by the way that liner plate is set up directly on a side surface of radiator, the thermal resistance between power semiconductor chip and radiator is reduced, the radiating efficiency of the power module is improved, while helping to reduce the volume and weight of power module.
Description
Technical field
The present invention relates to power electronics fields, and in particular to a kind of intelligent power mould for track vehicle
Block.
Background technique
Power semiconductor is widely used in field of track traffic, but standard-package power semiconductor devices only has out
The function of pipe is closed, and integrated level is not high.As the unsteady flow module of one of current transformer core component, then by standard-package power half
Conductor device, radiator, low-inductance bus, gate driver and structural member etc. constitute, due to by structural form, device layout and
The limitation of device function, power density, intelligence and it is convenient in terms of there is also many incomplete places.
Summary of the invention
For some or all of of the above-mentioned technical problem in the presence of the prior art, the invention proposes one kind to be used for
The intelligent power module of track vehicle.The intelligent power module integrated level is high, and good heat dissipation effect.
According to an aspect of the invention, it is proposed that a kind of intelligent power module for track vehicle, comprising:
Radiator has the coolant inlet being connected to the inner cavity of the radiator and cooling liquid outlet,
The one side of housing unit, the housing unit and the radiator forms accommodating chamber,
Liner plate unit in the accommodating chamber is set, and the liner plate unit has liner plate and is fixed at the lining
Power semiconductor chip on plate,
Wherein, the liner plate contact is arranged on the surface of the radiator.
It in one embodiment, further include the low sense mother for being arranged in accommodating chamber and being located at the outside of the liner plate unit
Row, low-inductance bus includes exchange layer, direct current positive layer and the direct current negative layer of stacked distribution.
In one embodiment, the low-inductance bus is configured to frame-shaped construction, and passes through bonding line and the liner plate unit
Conductive layer electrical connection.
In one embodiment, setting is being located at the direct current except the first end of the accommodating chamber just in the direct current positive layer
Electric connector, setting is located at the direct current negative electricity connector except the first end of the accommodating chamber in the direct current negative layer, in institute
State the AC power connector being provided with except the second end of the accommodating chamber on exchange layer, wherein the direct current is just electrically connected
It connects device and the direct current negative electricity connector is formed as plug-in connector.
In one embodiment, direct current electrical connector and direct current negative electricity connector include at least two relative type motor intervals
The elastic slice of setting.
In one embodiment, partition is set in the accommodating chamber, the accommodating chamber is divided into the first accommodating chamber and second
Accommodating chamber, is arranged control circuit board in first accommodating chamber, and the liner plate unit is arranged with the low-inductance bus described
In second accommodating chamber, and the control circuit board is configured to connect with the liner plate cell signal.
In one embodiment, contact pin is set on the conductive layer of the liner plate, and the contact pin passes through the partition and institute
State the connection of control circuit partitioned signal.
In one embodiment, the AC power connector being provided on exchange layer except the second end positioned at accommodating chamber,
Current sensor is set on the AC power connector, and the current sensor is connect with the control circuit partitioned signal.
In one embodiment, guide pin is set in the first end face of radiator.
In one embodiment, at least two threaded holes are set in the second end face of the radiator.
It in one embodiment, further include the temperature sensor being connect with control circuit partitioned signal, temperature sensor can be set
It sets on liner plate unit.
It according to another aspect of the present invention, further include a kind of intelligent power module for track vehicle, comprising:
Radiator has the coolant inlet being connected to the inner cavity of the radiator and cooling liquid outlet,
The one side of housing unit, the housing unit and the radiator forms accommodating chamber,
Liner plate unit in the accommodating chamber is set, and the liner plate unit has liner plate and is fixed at the lining
Power semiconductor chip on plate,
Wherein, the liner plate contact is arranged on the surface of the radiator,
It is arranged in the accommodating chamber and is located at the low-inductance bus in the outside of the liner plate unit, the low-inductance bus includes
Exchange layer, direct current positive layer and the direct current negative layer of stacked distribution, the low-inductance bus is configured to frame-shaped construction, and passes through bonding line
It is electrically connected with the conductive layer of the liner plate unit,
Setting is located at the direct current electrical connector except the first end of the accommodating chamber in the direct current positive layer, described
Setting is located at the direct current negative electricity connector except the first end of the accommodating chamber in direct current negative layer, is provided on the exchange layer
AC power connector except the second end of the accommodating chamber, wherein the direct current electrical connector and the direct current are negative
Electric connector is formed as plug-in connector, wherein the direct current electrical connector and the direct current negative electricity connector include to
Few two spaced elastic slices of relative type motor,
Partition is set in the accommodating chamber, the accommodating chamber is divided into the first accommodating chamber and the second accommodating chamber, described the
Control circuit board is set in one accommodating chamber, the liner plate unit and the low-inductance bus are arranged in second accommodating chamber, and
And the control circuit board is configured to connect with the liner plate cell signal,
The AC power connector being provided on the exchange layer except the second end of the accommodating chamber, in the friendship
Current sensor is set on galvanic electricity connector, the current sensor is connect with the control circuit partitioned signal,
It further include the temperature sensor being connect with the control circuit partitioned signal, the temperature sensor can be arranged in described
On liner plate unit.
Compared with the prior art, the advantages of the present invention are as follows drop by the way that liner plate to be arranged on a side surface of radiator
Low thermal resistance between power semiconductor chip and radiator, improves the radiating efficiency of the intelligent power module.Meanwhile it is logical
Cross the volume and weight for facilitating to reduce power module on the side surface that liner plate is arranged in radiator.
Detailed description of the invention
The preferred embodiment of the present invention is described in detail below in conjunction with attached drawing, in figure:
Fig. 1 shows the explosive view of intelligent power module according to the present invention；
Fig. 2 shows the main view of low-inductance bus according to the present invention；
Fig. 3 shows the sectional view of intelligent power module according to the present invention；
In the accompanying drawings, identical component uses identical appended drawing reference, and the attached drawing is not drawn according to the actual ratio.
Specific embodiment
Below in conjunction with attached drawing, the present invention will be further described.
Fig. 1 shows the explosive view of intelligent power module 100 according to the present invention.As shown in Figure 1, intelligent power mould
Block 100 includes radiator 1, housing unit 7 and liner plate unit 2.Wherein, housing unit 7 is arranged on the one side of radiator 1 simultaneously
Accommodating chamber 71 is formed with radiator 1.Liner plate unit 2 is arranged in accommodating chamber 71, and liner plate unit 2 is with liner plate 21 and admittedly
Power semiconductor chip 22 on liner plate 21 is set calmly.And the liner plate 21 of liner plate unit 2 is set up directly on being somebody's turn to do for radiator 1
On side surface.
The liner plate 21 of the intelligent power module 100 is set up directly on radiator 1, and avoids using standard-package power
The substrate of semiconductor devices.Thermal resistance is advantageously reduced by this set, meanwhile, this arrangement makes intelligent power mould
The more compact structure of block 100 facilitates the volume and weight for reducing intelligent power module 100.It should be noted that in this Shen
Please in, be illustrated on the upper surface that radiator 1 is arranged in liner plate 21 as shown in Figure 1, and in order to express easily,
The upper surface for being provided with the surface of liner plate 21 i.e. the radiator 1 in Fig. 1 is known as " first side ".
Preferably, liner plate 21 can be directly anchored in the first side of radiator 1 by the way of welding.And power half
Conductor chip 22 can also be arranged on liner plate 21 by welding.This connection structure is simple, and preferably by power semiconductor
In the heat transfer to radiator 1 that chip 22 generates.Radiator 1 is it is so structured that rectangular.But 1 side of being not limited to of radiator
Shape, for example, other arbitrary shapes can be designed as according to specific space requirement.
Preferably, liner plate unit 2 is distributed on radiator 1 in matrix form.Make liner plate unit 2 close in this way
Arrangement, the structure of Intelligent Optimal power module 100 help to reduce the volume of intelligent power module 100 and improve its function
Rate density.
In one embodiment, low-inductance bus 3 is set in the periphery of liner plate unit 2.And the setting of low-inductance bus 3 is being held
It receives in chamber 71, is transmitted with realizing with the electric energy of liner plate unit 2.Preferably, low-inductance bus 3 is the laminated construction of frame, and passes through
Bonding line 25 is electrically connected with the conductive layer of liner plate unit 2.And in order to optimize the connection relationship of liner plate unit 2 Yu low-inductance bus 3, letter
Change structure, each needs of liner plate unit 2 are neighbouring with low-inductance bus 3, and at most three sides of liner plate unit 2 and low-inductance bus 3 are adjacent
Closely.It is, low-inductance bus 3 as shown in Figure 1 is configured to frame-shaped construction, and row's liner plate unit 2 is set in frame shape.
Specifically, low-inductance bus 3 includes direct current positive layer (not shown), direct current negative layer (not shown) and exchanges layer
Insulating layer (not shown) is arranged in (not shown) between adjacent layer and on outermost layer.It is direct current positive layer, straight
Stream negative layer and the structural relation exchanged between each layer of layer can select according to the actual situation.It is, the application and unlimited
Determine direct current positive layer, direct current negative layer and the overlying relation for exchanging layer.And the low-inductance bus 3 with this structure helps to realize
Ultra-thin low sense mutual contact mode, can obtain good low inductance and insulation performance, while can reduce the height of low-inductance bus 3, from
And reduce the volume of intelligent power module 100.
Setting is located at the direct current electrical connector 33 except the first end of accommodating chamber 71 in direct current positive layer, in direct current negative layer
Upper setting is located at the direct current negative electricity connector 32 except the first end of accommodating chamber 71.Direct current electrical connector 33 and direct current negative electricity connect
It connects device 32 and is formed as plug-in connector 31, as shown in Figure 3." first end " described herein is consistent with left end shown in Fig. 1.
Preferably, as shown in Figure 1, direct current electrical connector 33 includes the spaced elastic slice 39 of at least two relative type motors, meanwhile, direct current
Negative electricity connector 32 also includes the spaced elastic slice 39 of at least two relative type motors, also, two of direct current electrical connector 33
Elastic slice 39 is corresponding with two elastic slices 39 of direct current negative electricity connector 32 to be arranged to form plug-in connector 31.It needs explanatorily
It is the insulating part 34 extended between direct current electrical connector 33 and direct current negative electricity connector 32 with insulating layer.By this
Plug-in connector 31, which is arranged, can smoothly realize that intelligent power module 100 is connect with the quick plug-in of system.
Exchange layer extends to second end to form exchange interface 35.Shown in " second end " described herein and Fig. 1
Right end is consistent, that is, opposite with " first end ".Preferably, exchange interface 35 is it is so structured that elastic slice shape.Selectively, it is handing over
Current sensor 5 is set at stream interface 35, what this current sensor 5 can be connect with 6 signal of control circuit board.It is being provided with electricity
In the case where flow sensor 5, it can realize and be connect with external circuit by the way that the switching copper bar 37 connecting with exchange interface 35 is arranged.
Switching copper bar 37 is configured to the second end bending plate outstanding by current sensor 5.
Direct current electrical connector 33 can be integrated manufacture with direct current positive layer, or split type structure, and pass through weldering
It connects, rivet or the connection types such as bolt are fixed.Similarly, direct current negative electricity connector 32 can be integrated system with direct current negative layer
It makes, or split type structure, and fixed by connection types such as welding, riveting or bolts.Exchange interface 35 with exchange
Layer can be integration manufacture, or split type structure, and fixed by connection types such as welding, riveting or bolts.
Intelligent power module 100 further includes having control circuit board 6.Control circuit board 6 is connect with 2 signal of liner plate unit,
With intelligentized control methods functions such as driving, monitoring, protection and the diagnosis of realizing control circuit board 6.Preferably, in control circuit board 6
Second end be arranged power interface 61, for for control circuit board 6 supply low-voltage.It is arranged in the second end of control circuit board 6
There is optical fiber interface 62, to realize the communication of control circuit board 6 Yu top level control unit.It is also set in the second end of control circuit board 6
It is equipped with current sensor interface 63, to realize the connection of control circuit board 6 Yu current sensor 5.It can guarantee by above-mentioned setting
The normal work of control circuit board 6, and be conducive to signal transmission, reduce interference.In addition, above-mentioned set-up mode facilitates intelligence
Change the optimization layout of power module 100, generalization degree is high.
In order to guarantee the normal work of intelligent power module 100, the interference between different components is avoided, in accommodating chamber
Partition 72 is set in 71, accommodating chamber 71 is divided for the first accommodating chamber 73 and the second accommodating chamber 74.The setting of control circuit board 6 is the
In one accommodating chamber.And liner plate unit 2 and low-inductance bus 3 are arranged in the second accommodating chamber 74.It is provided with by above-mentioned conducive to each portion
Signal isolation between part, reduces and interferes with each other.Meanwhile intelligent power module 100 is optimized by the way that housing unit 7 is arranged
Overall structure, make it have the advantages that integrated level is high, small in size, light-weight.And in order to manufacture conveniently, housing unit 7
It can be structured as split type structure, for example, housing unit 7 may include first shell 75 and second shell 76.First shell 75 is frame-shaped
Structure, and be fastened on radiator 1.And partition 72 is configured to box like structure.The opening direction second of the partition 72 of box like structure
76 direction of shell, and be arranged at the upper opening of first shell 75 to form the second accommodating chamber 74.And second shell 76 is configured to board-like knot
Structure, lid close the opening in partition 72 to form the first accommodating chamber 73.Certainly, second shell 76 also can be structured as box structure,
Open Side Down, and the opening of partition 72 is arranged in form the first accommodating chamber 73 in ground.
It should be noted that contact pin 23 is arranged on the conductive layer of liner plate 21.Contact pin 23 passes through partition 72 and control circuit
Plate 6 connects, to realize that the signal of control circuit board 6 and liner plate unit 2 transmits.
Insulating materials is injected in the second accommodating chamber 74, liner plate unit 2, low-inductance bus 3 and contact pin 23 etc. are packaged in
Inside it.For example, insulating materials can be silica gel, silicon rubber or epoxy material etc..It can guarantee intelligent function by this set
Stablizing for rate module 100 works normally, and prolongs the service life.
In one embodiment, guide pin 11 is set in the first end face of radiator 1.In installation intelligent power module
During 100, guide pin 11 is used to be oriented to and position for intelligent power module 100.During the installation process, guide pin 11 is gone back
Play the role of cushion impact forces.In addition, the guide pin 11 also acts after intelligent power module 100 is installed in place
The effect of fixed intelligent power module 100.Preferably, two guide pins 11 can be set in the first end face of radiator 1, and
And two guide pins 11 are arranged at two angles of the same side of rectangular radiator 1.
The coolant inlet 13 and cooling liquid outlet 14 of radiator 1 are arranged at the second end of radiator 1.Meanwhile it dissipating
At least two threaded holes are set in the second end face of hot device 1, to facilitate intelligent power module 100 to be connected and fixed in extraneous.
In order to carry out the acquisition of temperature signal, temperature sensor, specific installation position are also provided on liner plate unit 2
It sets the practical heat condition according to power semiconductor chip 22 and sets, control circuit board 6 is by contact pin 23 to above-mentioned temperature
Signal is acquired, to be used to the intelligentized control methods such as drive, monitor, protect and diagnose.
According to actual needs, current sensor is optionally set in control circuit board 6, and control circuit board 6 can be with
Current signal acquisition is carried out by above-mentioned current sensor, to be used to drive, monitor, protect and diagnose etc. intelligent control
System.
In addition, the internal power semiconductor chip 22 measured with current measurement and temperature can be selected, also to realize chip
The fast and accurately monitoring of grade, control circuit board 6 is acquired above-mentioned signal by contact pin, for driving, monitoring, protect
And the intelligentized control methods such as diagnosis.
The above is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, any this field
Technical staff in technical scope disclosed by the invention, can be easy to carry out and be altered or varied, and this be altered or varied all
It is covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the protection scope of claims
It is quasi-.
Claims (11)
1. a kind of intelligent power module for track vehicle characterized by comprising
Radiator has the coolant inlet being connected to the inner cavity of the radiator and cooling liquid outlet,
The one side of housing unit, the housing unit and the radiator forms accommodating chamber,
Liner plate unit in the accommodating chamber is set, and the liner plate unit has liner plate and is fixed on the liner plate
Power semiconductor chip,
Wherein, the liner plate contact is arranged on the surface of the radiator,
It further include the low-inductance bus for being arranged in the accommodating chamber and being located at the outside of the liner plate unit,
The low-inductance bus is configured to frame-shaped construction, and is electrically connected by bonding line with the conductive layer of the liner plate unit.
2. power module according to claim 1, which is characterized in that the low-inductance bus includes the exchange of stacked distribution
Layer, direct current positive layer and direct current negative layer.
3. power module according to claim 2, which is characterized in that setting is located at the receiving in the direct current positive layer
Direct current electrical connector except the first end of chamber, setting is located at except the first end of the accommodating chamber in the direct current negative layer
Direct current negative electricity connector, it is described exchange layer on be provided with except the second end of the accommodating chamber exchange electrical connection
Device, wherein the direct current electrical connector and the direct current negative electricity connector are formed as plug-in connector.
4. power module according to claim 3, which is characterized in that the direct current electrical connector and the direct current negative electricity
Connector includes the spaced elastic slice of at least two relative type motors.
5. power module according to claim 2, which is characterized in that partition is arranged in the accommodating chamber by the receiving
Chamber is divided into the first accommodating chamber and the second accommodating chamber, is arranged control circuit board in first accommodating chamber, the liner plate unit with
The low-inductance bus is arranged in second accommodating chamber, and the control circuit board is configured to believe with the liner plate unit
Number connection.
6. power module according to claim 5, which is characterized in that contact pin, institute are arranged on the conductive layer of the liner plate
Contact pin is stated to connect across the partition with the control circuit partitioned signal.
7. power module according to claim 5, which is characterized in that be provided on the exchange layer positioned at the receiving
Current sensor, the current sense is arranged in AC power connector except the second end of chamber on the AC power connector
Device is connect with the control circuit partitioned signal.
8. according to claim 1 to power module described in any one of 7, which is characterized in that in the first end of the radiator
Guide pin is set on face.
9. power module according to claim 1, which is characterized in that be arranged at least in the second end face of the radiator
Two threaded holes.
10. power module according to claim 5, which is characterized in that further include being connect with the control circuit partitioned signal
Temperature sensor, the temperature sensor can be arranged on the liner plate unit.
11. a kind of intelligent power module for track vehicle characterized by comprising
Radiator has the coolant inlet being connected to the inner cavity of the radiator and cooling liquid outlet,
The one side of housing unit, the housing unit and the radiator forms accommodating chamber,
Liner plate unit in the accommodating chamber is set, and the liner plate unit has liner plate and is fixed on the liner plate
Power semiconductor chip,
Wherein, the liner plate contact is arranged on the surface of the radiator,
It is arranged in the accommodating chamber and is located at the low-inductance bus in the outside of the liner plate unit, the low-inductance bus includes stacking
Exchange layer, direct current positive layer and the direct current negative layer of formula distribution, the low-inductance bus is configured to frame-shaped construction, and passes through bonding line and institute
The conductive layer electrical connection of liner plate unit is stated,
Setting is located at the direct current electrical connector except the first end of the accommodating chamber in the direct current positive layer, in the direct current
Setting is located at the direct current negative electricity connector except the first end of the accommodating chamber in negative layer, is provided with and is located on the exchange layer
AC power connector except the second end of the accommodating chamber, wherein the direct current electrical connector and the direct current negative electricity connect
It connects device and is formed as plug-in connector, wherein the direct current electrical connector and the direct current negative electricity connector include at least two
A spaced elastic slice of relative type motor,
Partition is set in the accommodating chamber, the accommodating chamber is divided into the first accommodating chamber and the second accommodating chamber, holds described first
It receives and control circuit board is set in chamber, the liner plate unit and the low-inductance bus are arranged in second accommodating chamber, and institute
Control circuit board is stated to be configured to connect with the liner plate cell signal,
The AC power connector being provided on the exchange layer except the second end of the accommodating chamber, in the alternating current
Current sensor is set on connector, the current sensor is connect with the control circuit partitioned signal,
It further include the temperature sensor being connect with the control circuit partitioned signal, the liner plate can be arranged in the temperature sensor
On unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610822643 | 2016-09-14 | ||
| CN2016108226433 | 2016-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107818961A CN107818961A (en) | 2018-03-20 |
| CN107818961B true CN107818961B (en) | 2019-11-29 |
Family
ID=61601525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611072561.8A Active CN107818961B (en) | 2016-09-14 | 2016-11-28 | A kind of intelligent power module for track vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107818961B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201860252U (en) * | 2010-09-17 | 2011-06-08 | 武汉正远铁路电气有限公司 | Power module of high-power traction converter |
| CN103779294A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Power module packaging structure with water-cooled heat sink used for two-sided cooling |
| CN205430072U (en) * | 2016-03-17 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Converter power module |
-
2016
- 2016-11-28 CN CN201611072561.8A patent/CN107818961B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201860252U (en) * | 2010-09-17 | 2011-06-08 | 武汉正远铁路电气有限公司 | Power module of high-power traction converter |
| CN103779294A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Power module packaging structure with water-cooled heat sink used for two-sided cooling |
| CN205430072U (en) * | 2016-03-17 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Converter power module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107818961A (en) | 2018-03-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108270048A (en) | The water-cooled cells module of electric vehicle | |
| CN102624205B (en) | Power module of converter | |
| CN101110555A (en) | Power converter | |
| CN107644857A (en) | The signal pins layout of more device power modules | |
| JP5103318B2 (en) | Power converter for vehicle, metal base for power module and power module | |
| CN113140824B (en) | Battery module, battery system and vehicle | |
| CN106329951A (en) | Power cabinet of wind power converter | |
| CN204834792U (en) | Power battery cooling plate and power battery module | |
| KR20200092926A (en) | Power semiconductor use device | |
| CN206948169U (en) | A kind of frequency converter and its power cell | |
| CN105916357A (en) | Power supply heat dissipation device based on cold plate and method thereof | |
| CN104036966A (en) | Water-cooling super-capacitor module, tank body thereof and vehicle | |
| CN216145746U (en) | Battery pack circuit breaking unit device and battery pack | |
| CN107818961B (en) | A kind of intelligent power module for track vehicle | |
| CN208835986U (en) | A kind of power device of generic encapsulation | |
| CN108122871B (en) | A kind of H bridge arm two-side radiation power module | |
| CN209169222U (en) | Battery component, battery modules and unmanned plane | |
| CN108122866B (en) | A kind of integrated power module | |
| CN213585212U (en) | Water-cooling heat dissipation structure of high-power-density vehicle-mounted charger | |
| CN108122865B (en) | A kind of H bridge arm power module for track vehicle | |
| CN107818960B (en) | A kind of power semiconductor modular for track vehicle | |
| CN201805315U (en) | Cooling system and motor controller including same | |
| CN104702126A (en) | Inverter for electric vehicle | |
| CN206293579U (en) | The radiator and heat abstractor of a kind of battery of electric vehicle | |
| CN108123614A (en) | A kind of power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |