CN212381608U

CN212381608U - Compact water-cooling plate layout structure

Info

Publication number: CN212381608U
Application number: CN202021397593.7U
Authority: CN
Inventors: 周佳红; 许弟华; 张亮
Original assignee: Shanghai Autowell Power Electronics Co ltd
Current assignee: Shanghai Autowell Power Electronics Co ltd
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2021-01-19
Anticipated expiration: 2030-07-15

Abstract

The utility model discloses a compact water-cooling board layout structure belongs to water-cooling board structure overall arrangement technical field. The device comprises a water cooling plate, an IGBT adapter plate, an IGBT module, a rectifier bridge, an aluminum shell resistor, an absorption capacitor, a positive connecting bus and a negative connecting bus; a water inlet and a water outlet are respectively formed in two sides of one end of the water cooling plate; the plurality of IGBT modules are symmetrically arranged on two sides of the water cooling plate; the water cooling plate is internally provided with a water cooling system channel, the water inlet and the water outlet are respectively connected to the water cooling system channel, the water inlet and the water outlet are provided with threads, and the water inlet and the water outlet are respectively connected with a water inlet pipe and a water outlet pipe in a screwed mode. The upper and lower layout structures of the components such as the IGBT, the rectifier bridge and the aluminum shell resistor are compact, and the structural layout of the components which is symmetrical about the water cooling plate ensures that the temperature radiation is uniform when the heating module operates; the channel of the water cooling system is embedded in the middle of the water cooling plate, and the components on the two sides of the water cooling plate share the same water channel, so that the cooling and heat dissipation efficiency of the water cooling plate is improved, and the design cost of the water channel is reduced.

Description

Compact water-cooling plate layout structure

Technical Field

The utility model relates to a compact water-cooling board layout structure belongs to water-cooling board structure overall arrangement technical field.

Background

The water cooling plate is an important component of a water cooling system and mainly fully exchanges heat generated by heating elements with cooling liquid.

The main module of the high-voltage frequency converter is a power unit, the IGBT (insulated gate bipolar transistor), the rectifier bridge, the resistor and the like are main heating components on the power module, the working characteristic has the characteristic of high heating, the internal junction temperature can be increased by heat, and if the heat can not be released and eliminated in time, the reliability of equipment can be reduced, and the components can be damaged to further cause the equipment to be incapable of operating normally. Therefore, it is necessary to mount these heat generating components on a water-cooled plate to dissipate heat.

At present, under the situation of miniaturization and cost reduction of a high-voltage frequency converter, the utilization rate of main components needs to be improved. The miniaturization of the volume of the power unit makes the heat dissipation problem more prominent, so that the structural layout of each heating element on the water cooling plate is more compact.

Disclosure of Invention

The utility model discloses the technical problem that will solve lies in: the utility model provides a compact water-cooling board layout structure, it has solved among the prior art volume miniaturization of power unit makes the heat dissipation problem more outstanding, needs the structure overall arrangement of each components and parts that generate heat on the water-cooling board more compact problem.

The utility model discloses the technical problem that will solve takes following technical scheme to realize:

a compact water-cooling plate layout structure comprises a water-cooling plate, an IGBT adapter plate, an IGBT module, a rectifier bridge, an aluminum shell resistor, an absorption capacitor, a positive connection busbar and a negative connection busbar;

a water inlet and a water outlet are respectively formed in two sides of one end of the water cooling plate;

the plurality of IGBT modules are symmetrically arranged on two sides of the water cooling plate;

the IGBT adapter plate is fixedly covered on the IGBT modules on the two sides of the water cooling plate, and a plurality of absorption capacitors are fixed on the IGBT adapter plate;

the plurality of rectifier bridges are symmetrically arranged on two sides of the water cooling plate and are positioned on one side of the plurality of IGBT modules;

the aluminum shell resistors are symmetrically arranged on two sides of the water cooling plate and are positioned on one side of the rectifier bridges;

the positive connecting bus bar and the negative connecting bus bar are respectively fixed on the IGBT adapter plates on two sides of the water cooling plate;

the water cooling plate is internally provided with a water cooling system channel, the water inlet and the water outlet are respectively connected to the water cooling system channel, the water inlet and the water outlet are provided with threads, and the water inlet and the water outlet are respectively screwed with a water inlet pipe and a water outlet pipe.

As a preferred example, the water cooling plate is composed of a composite plate, a main plate and a cover plate, wherein the composite plate is fixed on two sides of the main plate respectively, and the cover plate is fixed on the outer side surface of the composite plate.

The utility model has the advantages that:

(1) the upper and lower layout structures of the components such as the IGBT, the rectifier bridge and the aluminum shell resistor are compact, and the structural layout of the components which is symmetrical about the water cooling plate ensures that the temperature radiation is uniform when the heating module operates;

(2) the channel of the water cooling system is embedded in the middle of the water cooling plate, and the components on the two sides of the water cooling plate share the same water channel, so that the cooling and heat dissipation efficiency of the water cooling plate is improved, and the design cost of the water channel is reduced.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic side view of the present invention;

fig. 3 is a schematic top view of the present invention;

FIG. 4 is a perspective view of the water cooling plate;

FIG. 5 is a schematic side perspective view of a water-cooled plate;

FIG. 6 is an enlarged schematic view of the structure at A in FIG. 5;

fig. 7 is a schematic perspective view of the structure of the water-cooling plate mounted on the power unit frame.

In the figure: the water-cooling plate structure 1, power unit frame 2, water-cooling plate 3, composite sheet 31, mainboard 32, apron 33, water inlet 34, delivery port 35, water cooling system passageway 36, inlet tube 37, outlet pipe 38, IGBT adapter plate 4, IGBT module 5, rectifier bridge 6, aluminum hull resistance 7, absorption capacitor 8, female 9 of arranging is arranged in anodal connection, female 10 of arranging is arranged in the negative pole connection.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand and understand, the present invention is further explained by combining the following specific drawings.

In the embodiment shown in fig. 1-7, a compact water-cooling plate layout structure includes a water-cooling plate 3, an IGBT adapter plate 4, an IGBT module 5, a rectifier bridge 6, an aluminum casing resistor 7, an absorption capacitor 8, a positive connection busbar 9, and a negative connection busbar 10;

a water inlet 34 and a water outlet 35 are respectively arranged on two sides of one end of the water cooling plate 3, the water cooling plate 3 adopts a specification of 600 x 800mm, cooling liquid can be introduced into the water inlet 34, the cooling liquid adopts deionized water, the flow rate is 60L/min, the temperature of the inlet water is 40 ℃, and as shown in the embodiment shown in the figure 7, the water cooling plate structure 1 is fixed on the upper part of the space in the power unit frame 2;

the upper parts of two surfaces of the water cooling plate 3 are respectively provided with four IGBT modules 5;

as shown in the embodiment of fig. 3, the IGBT adapter plates 4 are fixedly covered on the IGBT modules 5 on both sides of the water-cooling plate 3, four absorption capacitors 8 are respectively fixed on one side above the IGBT adapter plates 4 on both sides, and the absorption capacitors 8 are used for eliminating peak voltage caused by stray inductance of the connecting busbars, thereby avoiding damage to the IGBT modules 5;

six rectifier bridges 6 are symmetrically arranged on two sides of the water cooling plate 3, and the six rectifier bridges 6 are positioned on the lower sides of the four IGBT modules 5;

two surfaces of the water cooling plate 3 are respectively provided with two symmetrical aluminum shell resistors 7, and the aluminum shell resistors 7 are positioned at the lower sides of the six rectifier bridges 6;

the positive connecting bus bar 9 and the negative connecting bus bar 10 are respectively fixed on the IGBT adapter plates 4 on the two sides of the water cooling plate 3;

as shown in the embodiments of fig. 1 to 4, a water cooling system channel 36 is arranged inside the water cooling plate 3, the water inlet 34 and the water outlet 35 are respectively connected to the water cooling system channel 36, the water inlet 34 and the water outlet 35 are provided with threads, a water inlet pipe 37 and a water outlet pipe 38 are respectively screwed in the water inlet 34 and the water outlet 35, cooling liquid is introduced into the water inlet 34 from the water inlet pipe 37, the cooling liquid circulates in the water cooling system channel 36 inside the water cooling plate 3, heat generated by the heating element is fully exchanged with the cooling liquid, it is ensured that the heat dissipated by the heating surfaces of the components such as the IGBT module 5, the rectifier bridge 6 and the aluminum shell resistor 7 can be completely taken away as much as possible when the components are cooled by the liquid, and damage.

Preferably, as shown in the embodiments of fig. 5 to 6, the water cooling plate 3 is composed of a composite plate 31, a main plate 32 and a cover plate 33, the composite plate 31 is fixed on two sides of the main plate 32, and the cover plate 33 is fixed on the outer side of the composite plate 31, so that the water cooling plate 3 is composed of multiple plates in a composite mode, and the water cooling plate 3 has higher strength and is not easy to damage.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications are intended to be included within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A compact water-cooling plate layout structure is characterized by comprising a water-cooling plate, an IGBT adapter plate, an IGBT module, a rectifier bridge, an aluminum shell resistor, an absorption capacitor, a positive connecting bus and a negative connecting bus;

2. The compact water-cooled board layout structure of claim 1, wherein the water-cooled board is composed of a composite board, a main board and a cover board, the composite board is fixed on two sides of the main board, and the cover board is fixed on the outer side of the composite board.