CN218676787U - Solid electrolyte capacitor with heat radiation structure - Google Patents
Solid electrolyte capacitor with heat radiation structure Download PDFInfo
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- CN218676787U CN218676787U CN202222737427.2U CN202222737427U CN218676787U CN 218676787 U CN218676787 U CN 218676787U CN 202222737427 U CN202222737427 U CN 202222737427U CN 218676787 U CN218676787 U CN 218676787U
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- inner core
- heat
- aluminum shell
- shrouding
- heat conducting
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- 239000003990 capacitor Substances 0.000 title claims abstract description 29
- 239000007784 solid electrolyte Substances 0.000 title claims description 5
- 230000005855 radiation Effects 0.000 title abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000005057 refrigeration Methods 0.000 claims abstract description 3
- 238000009434 installation Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a solid-state electrolytic capacitor with heat radiation structure, establish the aluminum shell outside the inner core including inner core and cover, the aluminum shell leaves the interval with between the inner core, is equipped with the conducting strip group in the interval, and the conducting strip group encircles in the outside of inner core and hugs closely with the inner core lateral wall, and the aluminum shell upper end is equipped with the last shrouding with aluminum shell matched with, goes up the shrouding upper end and is equipped with the fan box, goes up the shrouding lower extreme and is equipped with the semiconductor refrigerator, and the semiconductor refrigerator system cold junction meets with conducting strip group. The utility model discloses with traditional condenser difference be, the conducting strip group sets up between inner core and aluminum hull, and the semiconductor cooler refrigeration end of installing on conducting strip group and the last shrouding meets, can dispel the heat fast to the inner core, and the fan box can produce the air current that upwards flows around the inner core through the tuber pipe, and the air current is when flowing. The heat conducting fin group can be matched to take away redundant heat outside the inner core, uniformity of the heat conducting fin group in heat dissipation is guaranteed, and heat dissipation efficiency is high.
Description
Technical Field
The utility model relates to a condenser technical field especially relates to a solid-state electrolyte capacitor with heat radiation structure.
Background
With the continuous development of electronic information technology, the capacitor industry is increasing, and the capacitor is the device with the highest utilization rate in electronic equipment, and because the capacitor generates heat easily in the use process, the normal use of the capacitor will be influenced by the heat generated by the capacitor, and therefore, a heat dissipation structure needs to be arranged to ensure the safe operation of the capacitor.
The utility model discloses a utility model patent of application number CN202021920387.X discloses a solid state electrolytic capacitor with heat radiation structure, including mainboard, solid state electrolytic capacitor body, heat radiation fins, servo motor and second pivot, the top of mainboard is provided with the heat dissipation box, and the inside of heat dissipation box is provided with solid state electrolytic capacitor body, and servo motor is installed through the bottom plate to one side of heat dissipation box, and the second pivot is all installed through the bearing to the inner wall of heat dissipation box, and second pivot outer wall all is provided with the heat radiation fins who contacts with solid state electrolytic capacitor body. The capacitor is cooled through the movable heat dissipation fins arranged outside the capacitor body, the heat dissipation fins conduct heat on the capacitor to the surrounding air in a heat conduction mode, but because the capacitor is mostly arranged in a narrow space, the air flows slowly, and the natural heat dissipation mode is conducted through the air conduction, so that the defect of low heat dissipation efficiency exists. Therefore, the present invention provides a solid electrolytic capacitor with a heat dissipation structure to solve the problems in the prior art.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, the utility model provides a solid-state electrolyte capacitor with heat radiation structure for solve current solid-state electrolyte capacitor, because the condenser is installed in narrow and small space more, air flow velocity on every side is slow, carries out natural radiating mode through the air conduction, has the not high shortcoming of radiating efficiency.
The utility model has the advantages that: the heat conducting fin group is arranged between the inner core and the aluminum shell, the heat conducting fin group is connected with the refrigerating end of the semiconductor refrigerator arranged on the upper sealing plate, the inner core can be rapidly cooled, the fan box can generate upward flowing air flow around the inner core through the air pipe, and the air flow is generated when the air flow flows. The heat conducting fin group can be matched to take away redundant heat outside the inner core, so that the uniformity of the heat conducting fin group in heat dissipation is ensured, and the heat dissipation efficiency is high.
Drawings
Fig. 1 is a structural diagram of the present invention.
Fig. 2 is a structural view of the aluminum case of the present invention.
Fig. 3 is a structural view of the inner core of the present invention.
Fig. 4 is a cross-sectional view of the connection rubber sleeve of the present invention.
Wherein: 1. an aluminum housing; 2. a fan box; 3. a lower sealing plate; 4. a wiring terminal; 5. connecting a rubber sleeve; 6. air holes are formed; 7. a negative pressure fan; 8. an air duct; 9. an upper sealing plate; 10. a rubber ferrule; 11. an inner core; 12. a heat conductive sheet; 13. a semiconductor refrigerator; 14. a heat conducting plate; 15. a conical spring.
Detailed Description
In order to deepen the understanding of the present invention, the following embodiments will be combined to make the present invention do further details, and the present embodiment is only used for explaining the present invention, and does not constitute the limitation of the protection scope of the present invention.
Referring to fig. 1, 2, 3 and 4, the present embodiment provides a solid electrolytic capacitor with a heat dissipation structure, including an inner core 11 and an aluminum outer shell 1 covering the inner core 11, where a gap is left between the aluminum outer shell 1 and the inner core 11;
a heat conducting fin group is arranged in the interval, surrounds the outer side of the inner core 11 and is tightly attached to the outer side wall of the inner core 11;
the upper end of the aluminum shell 1 is provided with an upper sealing plate 9 matched with the aluminum shell 1, the upper end of the upper sealing plate 9 is provided with a fan box 2, the lower end of the upper sealing plate 9 is provided with a semiconductor refrigerator 13, the refrigerating end of the semiconductor refrigerator 13 is connected with a heat conducting plate group, the heating end of the semiconductor refrigerator 13 extends into the fan box 2 and corresponds to a negative pressure fan 7 arranged at the upper end of the fan box 2, the two sides of the fan box 2 are provided with air pipes 8, the upper ports of the air pipes 8 are communicated with the negative pressure fan 7 through the fan box 2, and the lower ports of the air pipes 8 penetrate through the upper sealing plate 9 and are communicated with the space. Semiconductor refrigerator 13 is a miniature refrigerator, and its cold junction is located the lower extreme of last shrouding 9, and during the assembly, semiconductor refrigerator 13 cold junction can meet with the heat conduction piece group, and the heat conduction piece group is through heat-conduction's mode, dispels the heat fast to inner core 11.
In addition, when the semiconductor refrigerator 13 works, the negative pressure fan 7 arranged at the upper end of the fan box 2 can radiate heat of the semiconductor refrigerator 13 and the hot end to a certain degree through air flow so as to further improve the refrigerating capacity of the semiconductor refrigerator 13. Because the fan box 2 is communicated with the inner cavity of the aluminum shell 1 through the air pipe 8, when the negative pressure fan 7 works, the negative pressure fan 7 can generate airflow flowing upwards in the aluminum shell 1 through the air pipe 8, the airflow flows around the inner core 11, the excessive heat outside the inner core 11 can be taken away by matching with the heat conducting plate group, and the uniformity of heat dissipation of the heat conducting plate group is improved.
Specifically, the heat conducting plate group comprises a heat conducting plate 14 and a plurality of heat conducting plates 12, the heat conducting plate 14 is arranged at the upper end of the inner core 11 and is connected with the upper end surface of the inner core 11, the upper end surface of the heat conducting plate 14 is connected with the lower end of the semiconductor refrigerator 13, each heat conducting plate 12 surrounds the outer side of the inner core 11 and is connected with the outer side wall of the inner core 11, and the upper ends of the heat conducting plates 12 extend to the upper end of the inner core 11 and are fixedly connected with the heat conducting plate 14; the heat conducting sheet 12 and the heat conducting plate 14 are devices for dissipating heat of electronic components which are easy to generate heat in an electric appliance, and are mainly made of aluminum alloy, wherein the heat conducting sheet 12 is in a strip shape, and the heat conducting plate 14 is in a plate shape. In order to make the heat-conducting plate 12 and the heat-conducting plate 14 radiate heat better, the surfaces of the heat-conducting plate 12 and the heat-conducting plate 14, which are in contact with the inner core 11, are coated with a layer of heat-conducting silicone grease, so that the heat emitted by the components is more effectively conducted to the heat-conducting plate 12 and the heat-conducting plate 14, and then radiated to the surrounding air through the radiating fins.
Specifically, the lower end of the aluminum shell 1 is provided with an installation sleeve, the installation sleeve is sleeved on the outer side of the wiring terminal 4 arranged at the lower end of the inner core 11, and the installation sleeve is detachably connected with the aluminum shell 1. The lower extreme at aluminium shell 1 is installed to the installation cover, and back in aluminium shell 1 is installed to inner core 11, fixes through the installation cover, and the installation cover can protect binding post 4 that the inner core 11 lower extreme set up when fixed.
When the negative pressure fan 7 is started, negative pressure is generated in the fan box 2, airflow around the inner core 11 is sucked into the fan box 2 under the action of the air pipe 8, in order to enable the airflow in the aluminum shell 1 to flow circularly, powerful heat dissipation is performed on the inner core 11 and the heat conducting fins 12 around the outer side of the inner core 11, a plurality of air holes 6 are formed in the outer side of the aluminum shell 1, and the air holes 6 are respectively arranged on the lower half part of the aluminum shell 1 and communicated with the intervals. The advantage of this arrangement is that the air flow can enter the aluminum shell 1 from the lower half of the aluminum shell 1 and flow upward along the outer side wall of the core 11. The inner core 11 and the heat-conducting fins 12 surrounding the outer side of the inner core 11 are more uniformly radiated.
More specifically, the installation cover includes shrouding 3 down, and 3 upper ends of shrouding are equipped with rubber cutting ferrule 10 down, and rubber cutting ferrule 10 lateral wall meets with 1 inside wall of aluminum shell, and rubber cutting ferrule 10 inside wall meets with 11 lateral walls of inner core, and 3 lower extremes of shrouding are equipped with and allow binding post 4 to penetrate and carry out spacing connection gum cover 5 to binding post 4 down. During the assembly, the rubber cutting ferrule 10 that 3 upper ends of lower shrouding set up can block into the lower port of aluminium shell 1, and the lateral wall of rubber cutting ferrule 10 can be hugged closely with the inside wall of aluminium shell 1, and the inside wall of rubber cutting ferrule 10 can be hugged closely with the lateral wall of inner core 11, through the damping friction of two fitting piece contact surfaces, installs fixedly inner core 11 in the aluminium shell 1.
In a preferred embodiment, the connection rubber sleeve 5 is a conical cover made of rubber, a conical spring 15 is arranged in the conical cover, and the conical spring 15 surrounds the connection terminal 4 and is fixedly connected with the inner side wall of the conical cover. Binding post 4 is worn out from connecting gum cover 5 that 3 lower extremes of shrouding set up down, it can provide buffering and protection to binding post 4 to connect gum cover 5, nevertheless because it is the rubber material to connect gum cover 5, when connecting 5 outer walls of gum cover and receiving the extrusion, still can appear the deformation of certain degree, receive the damage for avoiding binding post 4, be provided with conical spring 15 in connecting gum cover 5, conical spring 15 encircles it can support connecting gum cover 5 in binding post 4's the outside, in order to improve the compressive capacity who connects gum cover 5, and then provide further protection to binding post 4.
This solid-state electrolyte capacitor with heat radiation structure, it is with traditional unloading pipeline difference to some extent, inner core 11 cover is established in aluminium shell 1, be equipped with the heat conduction piece group in the interval that leaves between aluminium shell 1 and the inner core 11, the heat conduction piece group is connected with the semiconductor refrigerator 13 refrigeration end of installing on last shrouding 9, can be through heat-conduction mode, dispel the heat fast to inner core 11, for the circulation of air around making inner core 11, it is equipped with two tuber pipes 8 to go up shrouding 9 upper end, tuber pipe 8 penetrates between aluminium shell 1 and the inner core 11 and communicates with negative-pressure air fan 7 of fan box 2 upper end, fan box 2 can produce the air current that upwards flows around inner core 11 through tuber pipe 8, the air current can cooperate the heat conduction piece group to take away the outside unnecessary heat of inner core 11 when flowing, homogeneity when guaranteeing the heat conduction piece group to dispel the heat, improve the radiating effect.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A solid electrolyte capacitor with a heat dissipation structure comprises an inner core (11) and an aluminum shell (1) sleeved outside the inner core (11), and is characterized in that a gap is reserved between the aluminum shell (1) and the inner core (11);
a heat conducting fin group is arranged in the interval, surrounds the outer side of the inner core (11) and is tightly attached to the outer side wall of the inner core (11);
the aluminum shell (1) upper end is equipped with last shrouding (9) with aluminum shell (1) matched with, go up shrouding (9) upper end and be equipped with fan box (2), it is equipped with semiconductor refrigerator (13) to go up shrouding (9) lower extreme, semiconductor refrigerator (13) refrigeration end meets with the conducting strip group, semiconductor refrigerator (13) generate heat the end extend to in fan box (2) and correspond with negative-pressure air fan (7) of establishing in fan box (2) upper end, fan box (2) both sides are equipped with tuber pipe (8), tuber pipe (8) upper port passes through fan box (2) and negative-pressure air fan (7) intercommunication, tuber pipe (8) lower port passes last shrouding (9) and interval intercommunication.
2. A solid electrolytic capacitor having a heat dissipating structure according to claim 1, wherein: the heat conducting plate group comprises a heat conducting plate (14) and a plurality of heat conducting plates (12), the heat conducting plate (14) is arranged at the upper end of the inner core (11) and is connected with the upper end face of the inner core (11), the upper end face of the heat conducting plate (14) is connected with the lower end of the semiconductor refrigerator (13), each heat conducting plate (12) surrounds the outer side wall of the inner core (11) and is connected with the outer side wall of the inner core (11), and the upper ends of the heat conducting plates (12) extend to the upper end of the inner core (11) and are fixedly connected with the heat conducting plate (14).
3. A solid electrolytic capacitor having a heat dissipating structure according to claim 1, wherein: the aluminum shell (1) lower extreme is equipped with the installation cover, the installation ways is established in the outside of binding post (4) that inner core (11) lower extreme set up, the installation cover can be dismantled with aluminum shell (1) and be connected.
4. A solid electrolytic capacitor having a heat dissipating structure according to claim 1, wherein: a plurality of air holes (6) are formed in the outer side of the aluminum shell (1), and the air holes (6) are respectively arranged on the lower half part of the aluminum shell (1) and communicated with the intervals.
5. A solid electrolyte capacitor having a heat dissipation structure as recited in claim 3, wherein: the installation cover is including shrouding (3) down, shrouding (3) upper end is equipped with rubber cutting ferrule (10) down, rubber cutting ferrule (10) lateral wall meets with aluminum hull (1) inside wall, rubber cutting ferrule (10) inside wall meets with inner core (11) lateral wall, shrouding (3) lower extreme is equipped with and allows binding post (4) to penetrate and carry out spacing connection gum cover (5) to binding post (4) down.
6. A solid electrolyte capacitor having a heat dissipation structure as recited in claim 5, wherein: connect gum cover (5) for the toper cover body of rubber material, the toper is covered the internal tapered spring (15) that is equipped with, tapered spring (15) encircle outside binding post (4) and with the inside wall fixed connection that the toper was covered the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222737427.2U CN218676787U (en) | 2022-10-18 | 2022-10-18 | Solid electrolyte capacitor with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222737427.2U CN218676787U (en) | 2022-10-18 | 2022-10-18 | Solid electrolyte capacitor with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218676787U true CN218676787U (en) | 2023-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222737427.2U Active CN218676787U (en) | 2022-10-18 | 2022-10-18 | Solid electrolyte capacitor with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218676787U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118675895A (en) * | 2024-08-23 | 2024-09-20 | 成都深地领航能源科技有限公司 | Packaging technology for reducing static leakage current |
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2022
- 2022-10-18 CN CN202222737427.2U patent/CN218676787U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118675895A (en) * | 2024-08-23 | 2024-09-20 | 成都深地领航能源科技有限公司 | Packaging technology for reducing static leakage current |
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