CN216413505U

CN216413505U - Quantum cascade laser

Info

Publication number: CN216413505U
Application number: CN202123271910.8U
Authority: CN
Inventors: 史哲; 朱地; 徐安壮; 张焕旭
Original assignee: Suzhou Guande Energy Technology Co ltd
Current assignee: Suzhou Guande Energy Technology Co ltd
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2022-04-29
Anticipated expiration: 2031-12-23

Abstract

The utility model provides a quantum cascade laser, which is characterized by comprising the following components: a laser system; the alignment system is a three-dimensional adjusting frame and is arranged on one side of the laser system; the heat dissipation system is arranged on the other side of the laser system and comprises a first plate provided with a baffle plate assembly and a second plate provided with an inlet, a first outlet and a second outlet, and the first plate and the second plate are assembled together to form a fluid space; and the supporting system is arranged at the bottom of the laser system. Adopt the central diffusion type water-cooling board of single import, two exports, can be effectively right laser system carries out the water-cooling heat dissipation, makes the inside temperature of laser system reduces, improves the continuous operation effect of laser instrument.

Description

Quantum cascade laser

Technical Field

The utility model relates to the technical field of lasers, in particular to a quantum cascade laser.

Background

The wavelength of the quantum cascade laser can cover middle and far infrared bands with application value in the fields of military, communication, gas detection and the like, and has the characteristics of good single-frequency of output wavelength, small size of the laser, long service life, high stability, single mode and the like, so that the quantum cascade laser is widely applied to the fields of sensing detection, pollution monitoring, medical treatment, imaging and communication. Especially in real-time trace gas detection, the quantum cascade laser can greatly reduce the concentration detection limit and the purity requirement, improve the measurement precision and realize high-sensitivity trace gas detection.

For example, CN 109038208A discloses a quantum cascade laser, which is different from the butterfly package design of the conventional quantum cascade laser, and provides a package scheme that greatly reduces the package cost and the assembly difficulty of the quantum cascade laser. However, the laser has a problem of poor heat dissipation in practical use, and therefore, it is necessary to improve the laser to meet practical requirements.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a quantum cascade laser.

In order to achieve the above objects and other objects, the present invention is achieved by the following technical solutions: a quantum cascade laser, comprising: a laser system; the alignment system is a three-dimensional adjusting frame and is arranged on one side of the laser system; the heat dissipation system is arranged on the other side of the laser system and comprises a first plate provided with a baffle plate assembly and a second plate provided with an inlet, a first outlet and a second outlet, and the first plate and the second plate are assembled together to form a fluid space; and the supporting system is arranged at the bottom of the laser system. Adopt the central diffusion type water-cooling board of single import, two exports, can be effectively right laser system carries out the water-cooling heat dissipation, makes the inside temperature of laser system reduces, improves the continuous operation effect of laser instrument.

In one embodiment, the laser system comprises a housing, a collimating lens fixed in the housing, heat dissipation heat sinks, a temperature controller, a chip and a thermistor, wherein the collimating lens is connected with the alignment system through a through hole on one side of the housing, the heat dissipation heat sinks are fixed on the housing through screws, the temperature controller is placed between the two heat dissipation heat sinks, and the chip is connected with the heat dissipation heat sinks through the thermistor fixed on the heat dissipation heat sinks.

In an embodiment, the laser system further includes a first lead interface and a second lead interface fixed on the top of the housing, the first lead interface is connected with the temperature controller and the thermistor, and the laser driver supplies power to the chip through the second lead interface.

In one embodiment, the baffle plate assembly comprises a first baffle plate positioned in the center of the first plate, and a second baffle plate, a third baffle plate, a fourth baffle plate and a fifth baffle plate which are sequentially and outwards surrounded on the upper layer of baffle plate at equal intervals.

In one embodiment, the first, second, third, fourth and fifth retaining plates each comprise two u-shaped plates, which form a rectangle with two open sides, and the open direction of the odd retaining plate is perpendicular to the open direction of the even retaining plate.

In one embodiment, the inlet is disposed at a central position of the second plate and at a central position of the first baffle.

In an embodiment, the first outlet and the second outlet are respectively disposed at two sides of the inlet and are respectively located at two sides of the opening of the fifth baffle.

In an embodiment, the second plate is provided with a square groove, and the square groove is used for accommodating the baffle plate assembly.

In an embodiment, the first plate is further provided with a groove, the second plate is further provided with a convex column, and the first plate and the second plate are tightly connected through the matching of the groove and the convex column.

In one embodiment, the alignment system uses a high precision turnbuckle with an in-plane (XY axis) adjustment range of greater than 4 mm, a vertical axis (Z axis) adjustment range of greater than 1 cm, and a turnbuckle precision of 40 microns.

The utility model has good temperature control and heat dissipation functions, can stably control the output wavelength of the laser, and has the advantages of reduced packaging cost and assembly difficulty, flexible replacement of the tube core of the laser, and convenient, rapid and stable collimation and coupling output of the laser.

Drawings

Fig. 1 is a schematic perspective view of a quantum cascade laser according to the present invention.

Fig. 2 is a schematic structural diagram of a first plate of the heat dissipation system of the present invention.

Fig. 3 is a schematic structural diagram of a second plate of the heat dissipation system of the present invention.

FIG. 4 is a left side view and a cross-sectional view A-A of a quantum cascade laser according to the present invention.

Detailed Description

Please refer to fig. 1 to 4. The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification to understand and read by those skilled in the art, and are not used to limit the practical limit conditions of the present invention, so they have no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the function and the achievable purpose of the present invention. In addition, the terms such as "front", "rear", "upper", "lower", "left", "right", "middle" and "one" used in the present specification are used for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship may be made without substantial technical changes.

As shown in fig. 1, the present invention provides a quantum cascade laser 10, where the laser 10 includes a laser system 1, an alignment system 2, a heat dissipation system 3, and a support system 4, and the alignment system 2, the heat dissipation system 3, and the support system 4 are respectively mounted on the laser system 1. The alignment system 2 is a three-dimensional adjusting frame for aligning the collimating lens, and the alignment system 2 is installed at one side of the laser system 1. The heat dissipation system 3 is mounted on the other side of the laser system 1, the heat dissipation system 3 comprises a first plate 31 provided with a baffle assembly 310 and a second plate 32 provided with an inlet 321, a first outlet 322 and a second outlet 323, the first plate 31 and the second plate 32 are assembled together to form a fluid space. The supporting system 4 is a cylinder and is fixedly mounted at the bottom of the laser system 1 through screws. The heat dissipation system 3 is designed as a center diffusion type water cooling plate, and can effectively perform water cooling heat dissipation on the laser system 1, so that the internal temperature of the laser system 1 is reduced, and the continuous operation effect of the laser 10 is improved.

As shown in fig. 2, the baffle plate assembly 310 includes a first baffle plate 311 located at the center of the first plate 31, and a second baffle plate 312, a third baffle plate 313, a fourth baffle plate 314 and a fifth baffle plate 315 which are sequentially and outwardly surrounding the upper baffle plate at equal intervals, wherein the baffle plate assembly 310 is shown as five layers, but this is not necessary, and the baffle plate assembly 310 may be any single layer of three or more layers. The first, second, third, fourth and

fifth baffles

311, 312, 313, 314, 315 comprise two u-shaped plates, which are combined to form a rectangle with two open sides, and the open direction of the odd-numbered baffles is perpendicular to the open direction of the even-numbered baffles, for example, in fig. 2 the first opening 316 of the first baffle 311 is in the horizontal direction, and the second opening 317 of the second baffle 312 is in the vertical direction. Fluid (e.g., water) flows in the water path formed by the baffle assembly 310.

As shown in fig. 3, the second plate 32 is provided with a square groove 324, and the square groove 324 is used for accommodating the baffle plate assembly 310. Referring to fig. 2 again, the first plate 31 is provided with a groove 318, and the groove 318 and the boss 325 are matched to tightly connect the first plate 31 and the second plate 32.

Referring to fig. 1 and 3, the inlet 321 of the second plate 32 is disposed at the center of the second plate 32, and referring to fig. 2, the inlet 321 is located at the center of the first baffle 31. The first outlet 322 and the second outlet 323 are respectively disposed at both sides of the inlet 321 and at both sides of the opening of the fifth barrier 315. The flow mode of single inlet and double outlets is adopted, so that cold fluid flows from the middle part to two sides, the phenomenon that the temperature is gradually increased along the flow direction due to the single-inlet and single-outlet flow mode in the prior art is improved, the fluid distribution is more uniform, and the heat dissipation performance is more uniform.

As shown in fig. 4, the laser system 1 includes a housing 11, a collimating lens 12 fixed in the housing 11, a heat sink 13, a temperature controller 14, a chip 15, and a thermistor 16. The collimating lens 12 is connected with the alignment system 2 through a through hole on one side of the shell 11, and the alignment system 2 uses a high-precision threaded fastener, so that the in-plane (XY-axis) adjustment range of the alignment system 2 is larger than 4 mm, the vertical axis (Z-axis) adjustment range is larger than 1 cm, and the threaded fastener precision is 40 microns. Further, the collimating lens 12 is a mid-infrared aspheric lens, and can collimate and output the laser emitted by the chip 15 and having a divergence of 40 °, that is, the light-emitting center of the chip 15 is on the central axis of the collimating lens.

The heat sink 13 is fixed on the housing 11 by screws, the temperature controller 14 is a semiconductor Cooler (TEC) and is disposed between the two heat sinks 13, a cold end surface of the temperature controller 14 faces the heat sink 13 above the temperature controller, and a hot end surface of the temperature controller 14 faces the heat sink 13 below the temperature controller. The chip 15 is connected with the heat sink 13 through the thermistor 16 fixed on the heat sink 13, and the chip 15 faces the center of the alignment system 2. The laser system 1 monitors the temperature of the chip 15 in real time through the thermistor 16, the temperature of the chip 15 is adjusted through the temperature controller 14, waste heat generated by the laser system 1 is dissipated through the heat dissipation heat sink 13 at the bottom of the shell 11 and the heat dissipation system 3 fixed on the other side of the shell 11, stable operation of the laser 10 is guaranteed, and output wavelength is locked. Further, the temperature controller 14 can precisely control the temperature of the laser 10 within a range of 10 ℃ to 80 ℃, and the control precision of the temperature change reaches 0.001 ℃.

As shown in fig. 4, the laser system 1 further includes a first lead interface 17 and a second lead interface 18 fixed on the top of the housing 11. The first lead interface 17 is connected to the temperature controller 14 and the thermistor 16, and controls the temperature of the laser 10. The second lead interface 18 is an SMA cable interface, and the laser driver supplies power to and drives the chip 15 through the second lead interface 18.

Further, the joints of the housing 11 and other systems are provided with sealing rubber rings, so that the air tightness of the laser 10 is ensured. The housing 11 is insulated from the support system 4.

In conclusion, the utility model has good temperature control and heat dissipation functions, can stably control the output wavelength of the laser, and in addition, the structure of the utility model also has the advantages of reducing the packaging cost and the assembly difficulty, being capable of flexibly replacing the tube core of the laser and conveniently, quickly and stably carrying out the collimation coupling output of the laser.

Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value. The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A quantum cascade laser, comprising:

a laser system;

the alignment system is a three-dimensional adjusting frame and is arranged on one side of the laser system;

the heat dissipation system is arranged on the other side of the laser system and comprises a first plate provided with a baffle plate assembly and a second plate provided with an inlet, a first outlet and a second outlet, and the first plate and the second plate are assembled together to form a fluid space;

and the supporting system is arranged at the bottom of the laser system.

2. The quantum cascade laser of claim 1, wherein the laser system comprises a housing, a collimating lens fixed in the housing, a heat sink, a temperature controller, a chip and a thermistor, the collimating lens is connected with the alignment system through a through hole on one side of the housing, the heat sink is fixed on the housing through screws, the temperature controller is placed between two heat sinks, and the chip is connected with the heat sinks through the thermistor fixed on the heat sinks.

3. The quantum cascade laser of claim 2, wherein the laser system further comprises a first lead interface and a second lead interface fixed on the top of the housing, the first lead interface is connected with the temperature controller and the thermistor, and the laser driver supplies power to the chip through the second lead interface.

4. The quantum cascade laser of claim 1, wherein the baffle assembly comprises a first baffle located at the center of the first plate, and a second baffle, a third baffle, a fourth baffle and a fifth baffle which are sequentially and outwardly surrounded by the upper baffle at equal intervals.

5. The quantum cascade laser of claim 4, wherein the first, second, third, fourth and fifth baffles comprise two U-shaped plates, the U-shaped plates form a rectangle with two open sides, and the open direction of the odd-number baffle is perpendicular to the open direction of the even-number baffle.

6. The quantum cascade laser of claim 4, wherein the inlet is disposed at a central position of the second plate and at a central position of the first baffle.

7. The quantum cascade laser of claim 6, wherein the first outlet and the second outlet are respectively disposed on two sides of the inlet and respectively located on two sides of the opening of the fifth baffle.

8. The quantum cascade laser of claim 1, wherein the second plate has a square groove formed therein for receiving the baffle assembly.

9. The quantum cascade laser of claim 1, wherein the first plate further comprises a groove, the second plate further comprises a protrusion, and the first plate and the second plate are tightly connected by the engagement of the groove and the protrusion.

10. The quantum cascade laser of claim 1, wherein the alignment system uses a high precision threading, the alignment system having an in-plane XY axis adjustment range of greater than 4 mm, a vertical axis Z axis adjustment range of greater than 1 cm, and a threading precision of 40 microns.